21-07-2023 дата публикации
Номер: CN116460996A
Принадлежит:
The invention relates to a device for selecting and scribing a CdZnTe single crystal wafer, which comprises a base, a wafer placing platform, a feeding lifting unit, a feeding conveying unit, a first image recognition unit, a first light source unit, a wafer grinding platform, a wafer grinding unit, a transverse conveying unit, a wafer spin-drying unit, a wafer cutting-up unit, a second image recognition unit, a second light source unit, a discharging unit and a thickness measuring unit are installed on the base. The device can replace operators to automatically identify and cut wafers in batches, so that the labor efficiency is effectively improved, and the productivity is liberated; pollution of the wafer to personnel is reduced, and the personnel protection rate is improved; the equipment can stably produce, and the cutting-up quality is improved; and automatic identification is realized, so that the identification precision is improved, and the material waste is reduced.
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