Transferable transparent conductive patterns and display stack materials

Touch sensor layer constructions and methods of making such constructions are described. More particularly, touch sensor constructions that utilize patterned conductive layers that may be applied by a sacrificial release liner, eliminating one or more glass and/or film substrate from touch sensor stacks, and methods of making such constructions are described.

PROTECTIVE COATING FOR PRINTED CONDUCTIVE PATTERN ON PATTERNED NANOWIRE TRANSPARENT CONDUCTORS

A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer. 1. A method for making an electronic assembly , comprising:applying a protective layer comprising an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit is electrically connected to a conductive layer on a substrate, and wherein the conductive layer comprises nanowires; andengaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.2. The method of claim 1 , wherein the organosulfur compound is selected from at least one of alkyl thiols and aryl thiols.3. The method of claim 1 , wherein the organosulfur compound is an alkyl thiol.4. The method of claim 1 , wherein the patterned conductive layer is transparent.5. A method claim 1 , comprising:coating a substrate with a conductive layer comprising nanowires;applying a pattern of a conductive interconnect material on the conductive layer to generate on the substrate one or more first regions of exposed conductive layer and one or more second regions of conductive interconnect material;hardening or curing the conductive interconnect material to form a patterned interconnect circuit;applying on at least a portion of the patterned interconnect circuit a protective layer forming composition comprising an organosulfur compound;overcoating the patterned interconnect circuit and the protective layer forming composition with a ...

CONFORMABLE, REMOVABLE FILM-BASED ARTICLE

A conformable, removable film-based article having a patterned, discontinuous upper protective layer. The upper layer may be configured to facilitate enhanced removability of the film from a substrate, such as an automobile's exterior surface, to which it has been applied. 1. A conformable , removable film-based article , comprising:a conformable film having a first major surface and a second major surface;a pressure sensitive adhesive layer on the first major surface of the conformable film; anda discontinuous, patterned protective layer on at least a portion of the second major surface of the conformable film.2. The conformable claim 1 , removable film-based article of claim 1 , wherein the patterned protective layer comprises a pattern that has an average areal coverage that is between 10% and 85% of the surface area of the portion of the conformable film.3. (canceled)4. The conformable claim 1 , removable film-based article of claim 1 , wherein the discontinuous claim 1 , patterned protective layer comprises a plurality of features.5. (canceled)6. The conformable claim 1 , removable film-based article of claim 1 , wherein the discontinuous claim 1 , patterned protective layer comprises hard coat features.713-. (canceled)14. The conformable claim 6 , removable film-based article of claim 6 , wherein the hard coat features comprise a first set of hard coat features applied by a first printing process claim 6 , and a second set of hard coat features that at least partially overlap at least some of the first set of hard coat features claim 6 , and wherein the second set of hard coat features is applied by a second printing process claim 6 , and wherein the first printing process and the second printing process are temporally distinct.15. The conformable claim 14 , removable film-based article of claim 14 , wherein the first printing process and the second printing process are part of the same web handling operation.16. The conformable claim 6 , removable film-based ...

Plasma Treatment of Flexographic Printing Surface

A method of plasma treating a flexographic printing plate and a method of using a plasma-treated flexographic printing plate to transfer a liquid to a printable substrate are disclosed. A method of flexographic printing comprises: transferring the liquid from an anilox roll to a printing surface of the plasma-treated flexographic printing plate and transferring the liquid from the printing surface of the plasma-treated flexographic printing plate to a surface of the substrate. A method of plasma treating the flexographic printing plate comprises exposing at least the printing surface of the flexographic printing plate to a plasma. 1. A method of flexographic printing , the method comprising:transferring a liquid from an anilox roll to a printing surface of a plasma-treated flexographic printing plate,andtransferring the liquid from the printing surface of the plasma-treated flexographic printing plate to a surface of a substrate.2. The method of wherein no more than about 10% by weight of the liquid that was transferred to the printing surface of the plasma-treated flexographic printing plate claim 1 , evaporates during the time that the liquid is resident on the printing surface of the plasma-treated flexographic printing plate.3. The method of wherein no more than about 1% by weight of the liquid that was transferred to the printing surface of the plasma-treated flexographic printing plate claim 1 , evaporates during the time that the liquid is resident on the printing surface of the plasma-treated flexographic printing plate.4. The method of wherein the substrate is a moving substrate.5. The method of wherein the substrate is a continuous substrate.6. The method of wherein the liquid comprises no more than about 20% of volatile materials.7. The method of wherein the liquid comprises no more than about 1% of volatile materials.8. The method of wherein the printing surface of the plasma-treated flexographic printing plate with liquid resident thereon claim 1 , is ...

SYSTEMS AND METHODS FOR SAMPLE CONCENTRATION AND DETECTION

Systems and methods for concentrating a sample and detecting an analyte of interest. The system can include a sample detection container that can include a microcavity. The microcavity can include a top opening, a base, and a longitudinal axis. The container can further include a wall that extends to the microcavity, wherein at least a portion of the wall located adjacent the top opening of the microcavity has a slope that is oriented at an effective angle α with respect to the longitudinal axis of the microcavity. The effective angle α can be greater than 45 degrees and less than 90 degrees, and at least the portion of the wall located adjacent the top opening of the microcavity that is oriented at the effective angle α can have a length of at least 5 times a transverse dimension of the microcavity. 1. A sample detection container adapted to contain and concentrate a sample for detection of an analyte of interest , if present , the container comprising:an open end configured to receive a sample;a closed end that includes a microcavity, the microcavity including a top opening, a base, and a longitudinal axis that is normal with respect to a transverse cross-section of the microcavity, the microcavity configured to provide capillary forces to retain a sample of interest; anda wall that extends to the microcavity, wherein at least a portion of the wall located adjacent the top opening of the microcavity has a slope that is oriented at an effective angle α with respect to the longitudinal axis of the microcavity, wherein the effective angle α is greater than 45 degrees and less than 90 degrees, and wherein at least the portion of the wall located adjacent the top opening of the microcavity that is oriented at the effective angle α has a length of at least 5 times a transverse dimension of the top opening of the microcavity.2. The sample detection container of claim 1 , wherein the longitudinal axis passes through the top opening and the base of the microcavity.3. The ...

Electronic assembly with fiducial marks for precision registration during subsequent processing steps

An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.

PROCESS FOR DEPOSITING DRY POWDER PARTICLES ONTO A SUBSTRATE AND ADHESIVELY BONDING THE PARTICLES TO THE SUBSTRATE

Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to adhesively bond the particles to a pressure-sensitive adhesive surface of the substrate. 1. A method for adhesively bonding flowable dry powder particles to a moving substrate , the method comprising:dispersing flowable dry powder particles onto a major radially inner surface of a hollow, rotating stencil roll,contacting a pressure-sensitive adhesive major surface of a moving substrate with a major radially outer surface of the hollow, rotating stencil roll and temporarily adhesively attaching the pressure-sensitive adhesive major surface of the moving substrate to the major radially outer surface of the hollow, rotating stencil roll;as the substrate rotates with the stencil roll, allowing at least some flowable dry powder particles to pass through at least some apertures in the stencil roll so as to contact the pressure-sensitive adhesive major surface of the moving substrate and to be adhesively bonded thereto; and, allowing at least some flowable dry powder particles that have not adhesively bonded to the pressure-sensitive adhesive surface of the moving substrate to tumble freely along the major radially inner surface of the stencil roll as the stencil roll rotates;and,detaching the pressure-sensitive adhesive surface of the moving substrate from the outer surface of the hollow, rotating stencil roll so as to produce a substrate comprising an array of flowable dry powder particles attached to the pressure-sensitive adhesive major surface thereof.2. The method of wherein the flowable dry powder particles that tumble freely along the major radially inner surface of the stencil roll as the stencil roll rotates claim 1 , form a rolling bank as the stencil roll rotates.3. The method of wherein the stencil roll further comprises at least one particle-contacting member that at least closely abuts the major radially inner surface of the rotating ...

PRINTING PATTERNS VIA DIE CUTTING

Methods, apparatuses and systems for printing an ink pattern on a moving web via die cutting are provided. A die roll including an inked pattern of die blades contacts a substrate to cut or cleave the substrate surface. While the die blades withdraw from the substrate, at least some of the ink transfers from the die blades to the cut substrate to form an ink pattern. 1. A method of printing , comprising:inking one or more die blades on a surface of a die roll by providing an ink material to the die blades;contacting the die blades to a substrate to cleave a surface of the substrate and make one or more notches thereon; andwhile detaching the die blades from the substrate, transferring at least some of the ink material from the die blades of the die roll to the respective notches on the substrate to form an ink pattern thereon.2. The method according to claim 1 , wherein inking the die blades further comprises transferring the ink material from an inking mechanism to the die blades of the die roll.3. The method according to claim 2 , wherein the inking mechanism comprises an inking roll claim 2 , and the ink material is applied onto a surface of the inking roll via an applicator.4. The method according to claim 2 , wherein the inking mechanism comprises an inkjet printing apparatus.5. The method according to claim 1 , wherein contacting the die blades to the substrate further comprises providing an impression roll positioned adjacent to the die roll to form a nip claim 1 , and providing the substrate into the nip.6. The method according to claim 1 , further comprising solidifying the ink material to form a printing pattern on the substrate.7. The method according to claim 1 , further comprising solidifying the ink material to form an electrically insulating pattern.8. The method according to claim 1 , further comprising solidifying the ink material to form an optically opaque pattern.9. The method according to claim 1 , which is a roll-to-roll process.10. A printing ...

Process for depositing dry powder particles onto a substrate and attaching the particles to the substrate

Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to attach the particles to the substrate.

Methods for patterning coatings

A method of forming an article is provided. The method can include providing a substrate comprising a surface. The method can further include forming a solvent soluble layer on or over the surface of the substrate in a pattern, the pattern defining one or more first portions of the surface that are overlaid by the solvent soluble layer, and one or more second portions of the surface that are free of the solvent soluble layer. The method can further include forming a second layer on or over at least one of the first portions and at least one of the second portions, wherein the step of forming the second layer includes buffing an exfoliatable material on or over at least one of the first portions and at least one of the second portions. The method can further include removing the solvent soluble layer by applying a solvent to the substrate.

Electronic devices including solid semiconductor dies

Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.

RELEASE COATING COMPOSITIONS FOR PRESSURE SENSITIVE ADHESIVE ARTICLES AND METHODS

A method of making a release coated article is described comprising: providing a release coating comprising at least 50 wt. % of monomer(s) comprising an ethylenically unsaturated group and a terminal alkyl group with at least 18 (e.g. contiguous) carbon atoms based on the total amount of ethylenically unsaturated components; crosslinking components(s) comprising at least two ethylenically unsaturated groups; and at least one polymerization initiator. The release coating is substantially solventless, comprising no greater than 1 wt. % of non-polymerizable organic solvent. The method further comprises applying the release coating to a major surface of a substrate; and polymerizing the monomer(s) and crosslinking component(s) of the release coating after applying the release coating to the substrate. Also described are release coating compositions. 1. A method of making a release coated article comprising: at least 50 wt. % of monomer(s) comprising an ethylenically unsaturated group and a terminal alkyl group with at least 18 carbon atoms based of the total ethylenically unsaturated components;', 'crosslinking component(s) comprising at least two ethylenically unsaturated groups; and', 'a polymerization initiator;, 'providing a release coating comprising'}wherein the release coating comprises no greater than 1 wt. % of non-polymerizable organic solvent;applying the release coating to a major surface of a substrate;polymerizing the monomer(s) and crosslinking component(s) of the release coating after applying the release coating to the substrate.2. The method of wherein the polymerization initiator is a free-radical initiator.3. The method of wherein the free-radical initiator is a photoinitiator.4. The method of wherein the ethylenically unsaturated monomer(s) comprising a terminal alkyl group with at least 18 carbon atoms is a solid at 25° C.5. The method of wherein the alkyl group with at least 18 carbon atoms is a linear alkyl group.6. The method of wherein the at ...

LIQUID COATING METHOD AND APPARATUS WITH A DEFORMABLE METAL ROLL

Methods and apparatuses for applying liquid coatings are provided. A first roll (), a second roll (), and a nip () formed between the first and second rolls are provided. A coating liquid () is supplied to the nip. The coating liquid is smoothed, via the nip, into a substantially uniform layer () of liquid coating which is transferred to a substrate (). The second roll () includes a thin metal shell () and a resilient layer (), the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the first roll (). 1. A method , comprising:providing a first roll, a second roll, and a nip formed between the first and second rolls;supplying a coating liquid to the nip; andsmoothing the coating liquid, via the nip, into a substantially uniform layer of liquid coating,wherein the first roll comprises a thin metal shell and a resilient layer, the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the second roll, andwherein the layer of liquid coating is transferred to a substrate.2. The method of claim 1 , wherein the layer of liquid coating on the substrate has a thickness no greater than about 5 microns.3. The method of claim 1 , wherein the thin metal shell is configured to be removable from the first roll.4. The method of claim 1 , wherein the first roll further comprises a rigid central core claim 1 , and the resilient layer has substantially uniform thickness about the periphery of the rigid central core.5. The method of claim 1 , wherein the substrate is a web of indefinite length claim 1 , and the method further comprises wrapping the web around one of the first and second rolls.6. The method of claim 1 , further ...

BONDING ELECTRONIC COMPONENTS TO PATTERNED NANOWIRE TRANSPARENT CONDUCTORS

A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer. 1. A method for making an electronic assembly , comprising:applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate; andengaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.2. The method of claim 1 , wherein the conductive adhesive comprises a layer of an adhesive with metal particles therein.3. The method of claim 2 , wherein the metal particles are selected from silver claim 2 , gold claim 2 , copper claim 2 , aluminum claim 2 , and combinations thereof.4. The method of claim 2 , wherein the conductive adhesive comprises an acrylic pressure sensitive adhesive claim 2 , a thermally bonded adhesive claim 2 , or combinations thereof.5. The method of claim 1 , wherein the resist layer has a thickness of about 10 nanometers to about 300 nanometers.6. The method of claim 1 , wherein the resist layer has a thickness of about 40 nanometers to about 200 nanometers.7. The method of claim 1 , wherein the resist layer has a refractive index of about 1.30 to about 2.50.8. The method of any of claim 1 , wherein the conducive adhesive comprises a tape.9. The method of claim 1 , wherein the patterned conductive nanowire layer on the substrate is produced by:coating a substrate with a conductive layer comprising nanowires;applying a pattern on the conductive layer with a resist matrix material to generate on the substrate one or more first regions of exposed conductive layer and one or more second regions of resist matrix material;hardening ...

ELECTRONIC DEVICES COMPRISING A VIA AND METHODS OF FORMING SUCH ELECTRONIC DEVICES

A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface. 1. A composite article , comprising:a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer comprises nanowires, and wherein the conductive layer comprises a conductive surface;a patterned layer on a first region of the conductive surface, wherein the patterned layer comprises a low surface energy material;an overcoat layer on a first portion of a second region of the conductive surface unoccupied by the patterned layer, wherein the overcoat layer is free of conductive particulates;a via in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer; anda conductive material in the via, wherein the conductive material provides an electrical connection to the conductive surface.2. The composite article according to claim 1 , wherein the via is uncovered by the overcoat layer.3. The composite article according to claim 1 , wherein the via is covered by the overcoat layer claim 1 , and wherein the overcoat layer in the via has a thickness of no more than about 250 nm.4. (canceled)5. The composite article according to claim 1 , wherein the substrate is an optical element.6. The composite article according to claim 1 , wherein the conductive material is ...

FLEXIBLE CONDUCTIVE DISPLAY FILM

A display film includes a transparent energy dissipation layer having a glass transition temperature of 27 degrees Celsius or less and a Tan Delta peak value of 0.5 or greater, and a transparent conductor layer disposed on the transparent energy dissipation layer. The conductive display films including transparent conductors and a flexible substrate that can protect a display window and survive folding tests intact while maintaining the desired electric conductive properties. 1. A display film comprising:a transparent energy dissipation layer having a glass transition temperature of 27 degrees Celsius or less and a Tan Delta peak value of 0.5 or greater; anda transparent conductor layer disposed on the transparent energy dissipation layer.2. The display film according to claim 1 , wherein the transparent conductor layer comprises a plurality of nanowires.3. The display film according to claim 1 , wherein the transparent conductor layer comprises a pattern of nanowires.4. The display film according to claim 1 , wherein the transparent conductor layer comprises silver nanowires having a diameter of 100 nanometers or less.5. The display film according to claim 1 , further comprising a second transparent conductor layer disposed on the transparent energy dissipation layer claim 1 , wherein the transparent energy dissipation layer separates the transparent conductor layers.6. The display film according to claim 5 , wherein the second transparent conductor layer comprises a plurality of nanowires forming a pattern.7. The display film according to claim 5 , wherein the second transparent conductor layer comprises silver nanowires having a diameter or lateral distance of 100 nanometers or less.8. The display film according to claim 6 , wherein the second transparent conductor layer pattern comprises linear extending traces that are orthogonal to the transparent conductor layer plurality of nanowires comprising linear extending traces.9. The display film according to claim 1 ...

PATTERNED OVERCOAT LAYER

A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface. 1. A composite article , comprising:a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer comprises a conductive surface;a patterned layer on a first region of the conductive surface, wherein the patterned layer comprises a low surface energy material;an overcoat layer on a first portion of a second region of the conductive surface unoccupied by the patterned layer, wherein the overcoat layer is free of conductive particulates;a via in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer; anda conductive material in the via, wherein the conductive material provides an electrical connection to the conductive surface.2. The composite article according to claim 1 , wherein the via is uncovered by the overcoat layer.3. The composite article according to claim 1 , wherein the via is covered by the overcoat layer claim 1 , and wherein the overcoat layer in the via has a thickness of no more than about 250 nm.4. (canceled)5. The composite article according to claim 1 , wherein the substrate is an optical element.6. The composite article according to claim 1 , wherein the conductive material is selected from conductive adhesives claim 1 , conductive pastes claim 1 , ...

VARIABLE INDEX LIGHT EXTRACTION LAYER AND METHOD OF MAKING THE SAME

Variable index light extraction layers that contain a first region with a first material and a second region including a second material are described, where the first region has a lower effective index of refraction than the second region. Optical films and stacks may use the variable index light extraction layers in front lit or back lit display devices and luminaires. 110-. (canceled)11. A variable index light extraction layer , comprisinga layer having first regions comprising a first substance and second regions comprising a second substance;wherein the first substance is a nanovoided polymeric material;wherein the second substance is not a nanovoided polymeric material;wherein the first region has a lower effective index of refraction than the second region; andwherein the first and second regions of the layer are disposed such that, when optically coupled to a lightguide, the layer selectively extracts light from the lightguide based on the geometric arrangement of the first and second regions.12. The variable index light extraction layer of claim 11 , further comprising a substrate claim 11 , wherein the substrate is disposed on a major surface of the layer.13. The variable index light extraction layer of claim 12 , wherein the substrate comprises a lightguide.14. The variable index light extraction layer of claim 13 , wherein the lightguide comprises an adhesive.15. The variable index light extraction layer of claim 12 , wherein the substrate comprises a reflective scattering element.16. The variable index light extraction layer of claim 12 , wherein the layer further comprises a plurality of optical microstructures disposed on a major surface of the layer opposite the substrate.17. The variable index light extraction layer of claim 16 , wherein the plurality of optical microstructures is formed from the second substance.18. The variable index light extraction layer of claim 16 , wherein the plurality of optical microstructures comprises a diffractive ...

TRANSFERABLE TRANSPARENT CONDUCTIVE PATTERNS AND DISPLAY STACK MATERIALS

Touch sensor layer constructions and methods of making such constructions are described. More particularly, touch sensor constructions that utilize patterned conductive layers that may be applied by a sacrificial release liner, eliminating one or more glass and/or film substrate from touch sensor stacks, and methods of making such constructions are described. 1. A construction , comprising:a first patterned conductive layer comprising rows of conductor extending in a first direction, the first patterned conductive layer capable of being transferred from a sacrificial release liner;an optically clear adhesive positioned on the patterned conductive layer; anda protective layer that is positioned on the opposite side of the first patterned conductive layer from the optically clear adhesive.2. The construction of claim 1 , wherein the protective layer comprises a hardcoat.3. The construction of claim 1 , wherein the hardcoat comprises an alkoxylated multi (meth)acrylate monomer upon which the sacrificial release liner is capable of being attached.4. The construction of claim 1 , further comprising a second patterned conductive layer positioned on the opposite side of the optically clear adhesive from the first patterned conductive layer claim 1 , the second patterned conductive layer comprising rows of conductor extending in a second direction that is orthogonal to the first direction but in a parallel plane to the first direction.5. The construction of claim 4 , wherein the second patterned conductive layer is at least partially embedded within a second protective layer.610-. (canceled)11. The construction of claim 1 , further comprising a glass receptor substrate upon which the opposite side of the optically clear adhesive from the first patterned conductive layer is adhered.12. The construction of claim 1 , wherein the first pattered conductive layer comprises patterned indium tin oxide.13. The construction of claim 1 , wherein the first patterned conductive layer ...

METHOD OF MAKING TRANSPARENT CONDUCTORS ON A SUBSTRATE

A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it. 1. A method of patterning a conductive layer on a substrate , comprising:coating a substrate with a conductive layer wherein the conductive layer comprises nanowires;applying a pattern on the conductive layer with a resist matrix material to generate on the substrate one or more first regions of exposed conductive layer and one or more second regions of resist matrix material, wherein the resist matrix material contains an ultraviolet curable material;hardening or curing the resist matrix material by ultraviolet irradiation;over coating the pattern with a strippable polymer layer;hardening or curing the strippable polymer layer;peeling the strippable polymer layer from the substrate, removing the exposed conductive layer from the substrate in the one or more first regions of the substrate, and thereby forming a patterned conductive layer on the substrate.2. (canceled)3. The method according to claim 1 , wherein over coating the pattern with the strippable polymer layer comprises over coating the one or more first regions and the one or more second regions with a strippable polymer layer-forming liquid claim 1 , optionally wherein the strippable polymer layer-forming liquid exhibits a yield stress.4. The method according to claim 1 , wherein the strippable polymer layer-forming liquid contacts between 50% to ...

ELECTRONIC ASSEMBLY WITH FIDUCIAL MARKS FOR PRECISION REGISTRATION DURING SUBSEQUENT PROCESSING STEPS

An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern. 1. A method , comprising:forming a resist layer overlying a patterned conductive nanowire layer in a first zone on a substrate to form a low contrast first conductive pattern;forming, substantially simultaneously with the first conductive pattern, a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark is in registration with the first conductive pattern;forming, using the fiducial mark as a guide, a second pattern aligned with the first conductive pattern.2. The method of claim 1 , wherein the first conductive pattern has an optical transmission of greater than about 80% optionally wherein the fiducial mark has an optical transmission of about 0% to about 50%.3. (canceled)4. The method of claim 1 , wherein the error in registration between the fiducial mark and the first conductive pattern is less than about 20 microns.5. The method of claim 1 , wherein the first conductive pattern includes features having a dimension less than 200 microns in size.6. The method of claim 1 , wherein the second pattern is conductive.7. The method of claim 6 , wherein the second pattern is aligned with the first conductive pattern and forms an electronic assembly.8. The method of claim 6 , wherein the patterned conductive nanowire layer in the first zone on the substrate is produced by:coating a substrate with a conductive layer comprising nanowires;applying a pattern on the conductive layer with a resist matrix material to generate on the substrate one or more first regions of exposed conductive layer and one or more second regions of resist matrix material;hardening ...

SHAPED ABRASIVE PARTICLES WITH SHARP TIPS

Various embodiments disclosed relate to shaped abrasive particles having sharp tips, methods of making the shaped abrasive particles, methods of abrading a substrate with the shaped abrasive particles, and coated abrasive articles including the shaped abrasive particles. The shaped abrasive particle includes a ceramic, has a polygonal cross-sectional shape along a longitudinal axis of the shaped abrasive particle, and at least one tip of the shaped abrasive particle has a radius of curvature of less than or equal to about 19.2 microns. 1. A shaped abrasive particle comprising:a ceramic; anda polygonal cross-sectional shape along a longitudinal axis of the shaped abrasive particle;wherein at least one tip of the shaped abrasive particle has a radius of curvature of less than or equal to about 19.2 microns.2. The shaped abrasive particle of claim 1 , wherein the radius of curvature of the at least one tip is the radius of the smallest circle that claim 1 , when viewed in a direction orthogonal to a face of the shaped abrasive particle comprising the tip:passes through a point on each of the two sides of the face of the shaped abrasive particle that come together to form the tip at the start of a curve of the tip wherein each of the two sides transition from straight to curved, andencompasses the entire tip.3. The shaped abrasive particle of claim 1 , wherein the at least one tip is a tip on the largest face of the shaped abrasive particle claim 1 , wherein the radius of curvature is the radius of the smallest circle that claim 1 , when viewed in a direction orthogonal to the largest face of the shaped abrasive particle:passes through a point on each of the two sides of the largest face of the shaped abrasive particle that come together to form the tip at the start of a curve of the tip wherein each of the two sides transition from straight to curved, andencompasses the entire tip.4. A plurality of the shaped abrasive particles of claim 1 , wherein the tips of the ...

Overcoated patterned conductive layer and methods

A composite article having a conductive layer on at least a portion of a flexible substrate. Electrical connectivity between various portions of the substrate can be obtained through this conductive layer. The conductive layer comprises a conductive surface, and there is a patterned layer on at least a portion of a first region of the conductive surface. The patterned layer comprises a conductive material having a surface roughness, and is in electrical contact with the conductive surface. An overcoat layer is present on at least a portion of the first region, such that the overcoat layer has a thickness less than the surface roughness, such that the conductive layer within the first region is covered by the overcoat layer, and such that at least a portion of the patterned layer substantially protrudes above the overcoat layer. The protruding portion permits electrical contact with the patterned layer, and via the conductive layer to other parts of the patterned layer and/or electrically conductive connectors to external electronic devices. Methods for forming the composite article are also disclosed. Methods of making such composite articles are also disclosed.

Automatic registration between circuit dies and interconnects

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

METHOD OF MAKING TRANSPARENT CONDUCTORS ON A SUBSTRATE

A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it. 1. A method of patterning a conductive layer on a substrate , comprising:coating a substrate with a conductive layer optionally wherein the conductive layer comprises nanowires;applying a pattern on the conductive layer with a resist matrix material to generate on the substrate one or more first regions of exposed conductive layer and one or more second regions of resist matrix material;hardening or curing the resist matrix material;over coating the pattern with a strippable polymer layer;hardening or curing the strippable polymer layer;peeling the strippable polymer layer from the substrate, removing the exposed conductive layer from the substrate in the one or more first regions of the substrate, and thereby forming a patterned conductive layer on the substrate.2. (canceled)3. The method according to wherein over coating the pattern with the strippable polymer layer comprises over coating the one or more first regions and the one or more second regions with a strippable polymer layer-forming liquid claim 1 , optionally wherein the strippable polymer layer-forming liquid exhibits a yield stress.4. (canceled)5. The method according to claim 3 , wherein the strippable polymer layer-forming liquid is selected from the group consisting of polymer solution claim 3 , monomer claim 3 , monomer solution claim 3 , ...

Method and apparatus for coating on baggy web

Methods and apparatuses for applying coatings on a baggy web are provided. A Mayer rod and a back-up roll engage with each other to form a nip. The back-up roll has a deformable inner layer with a surface thereof covered by a deformable outer layer. The Mayer rod and the flexible web at a contacting area are impressed into the back-up roll with a machine-direction nip width W and a nip engagement depth D, which enables formation of a coating having a substantially uniform thickness.

METHODS OF PASSIVATING ADHESIVES

Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed. 1. A method comprising:providing a release liner having a release surface;printing an ink pattern onto the release surface of the release liner to form a passivation layer, the passivation layer including a pattern of passivation features projecting away from the release surface; andproviding a layer of adhesive onto the release surface of the release liner, the passivation layer being sandwiched between the release liner and the layer of adhesive,wherein the passivation features are at least partially embedded in a major surface of the layer of adhesive such that when the release liner is peeled from the layer of adhesive, the passivation layer remains with the layer of adhesive to form one or more selected areas on the major surface of the layer of adhesive, the one or more selected areas having an adhesive functionality different from the rest of the major surface of the layer of adhesive.2. The method of claim 1 , wherein providing the layer of adhesive comprises laminating a layer of pressure sensitive adhesive (PSA) onto the release surface of the release liner.3. The method of claim 1 , wherein the layer of PSA is disposed on a substrate before the laminating.4. The method of claim 1 , wherein providing the layer of adhesive comprises fluidly coating a layer of adhesive onto the release surface of the release liner.5. The method of claim 1 , wherein the passivation features are embedded in the layer of adhesive. ...

Method of making transparent conductors on a substrate

A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.

Bonding electronic components to patterned nanowire transparent conductors

A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.

Electronic assembly with fiducial marks for precision registration during subsequent processing steps

An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.

Protective coating for printed conductive pattern on patterned nanowire transparent conductors

A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.

Method of making transparent conductors on a substrate

A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.

method of manufacturing transparent conductors on substrate

resumo “método de fabricação de condutores transparentes sobre substrato” a presente invenção refere-se a um método de padronização de uma camada condutiva para formar condutores elétricos transparentes que não requerem desbaste. o método inclui o descolamento de uma camada de polímero removível de um substrato revestido com a camada condutiva para padronizar a camada condutiva. em algumas modalidades, um material de matriz de substância resistente é padronizado sobre a camada condutiva para impedir a remoção da camada condutiva abaixo do material de matriz de substância resistente. em outras modalidades, um forro tendo uma superfície adesiva sensível à pressão é colocado em contato com o material de polímero removível padronizado para remover o material de polímero removível padronizado e a camada condutiva abaixo dele.

Method of making transparent conductors on a substrate

A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.

Curable composition, cured composition, and composite article, and method of making the same

A curable composition comprises a siloxane compound and a tetraalkyl orthotitanate. The siloxane compound comprises m divalent units represented by the formula –SiH(R 1 )O–, n divalent units represented by the formula –Si(R 1 )(OR 2 )O–, and p divalent units represented by the formula –Si(R 1 ) 2 O–, wherein each R 1 independently represents an alkyl group having from 1 to four carbon atoms, each R 2 independently represents H or an alkyl group having from 1 to four carbon atoms, m and n are integers greater than or equal to 1, and p is an integer greater than or equal to 0. An at least partially cured curable composition and composite articles including the same are also disclosed.

Process for depositing dry powder particles onto a substrate and attaching the particles to the substrate

Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to attach the particles to the substrate.

Die coating on air supported shell

Methods and apparatuses for applying coatings on a moving web are provided. A coating die and a back-up roll engage with each other. The back-up roll includes a shell rotatably supported by a pressurized air layer. When a coating material is dispensed from the coating die onto the web to form a liquid coating, the pressure of the air layer is controlled such that the shell translates in space to balance forces from the air layer and the coating bead, while the web is being translated to drive the shell.

Electronic assembly with fiducial marks for precision registration during subsequent processing steps

An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.

Liquid coating method and apparatus with a deformable metal roll

Methods and apparatuses for applying liquid coatings are provided. A first roll (14), a second roll (16), and a nip (146) formed between the first and second rolls are provided. A coating liquid (22) is supplied to the nip. The coating liquid is smoothed, via the nip, into a substantially uniform layer (22a) of liquid coating which is transferred to a substrate (12). The second roll (16) includes a thin metal shell (40) and a resilient layer (30), the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the first roll (14).

Electronic devices including solid semiconductor dies

Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.

Process for depositing dry powder particles onto a substrate and attaching the particles to the substrate

Liquid coating method and apparatus with a deformable metal roll

Methods and apparatuses for applying liquid coatings are provided. A first roll (14), a second roll (16), and a nip (146) formed between the first and second rolls are provided. A coating liquid (22) is supplied to the nip. The coating liquid is smoothed, via the nip, into a substantially uniform layer (22a) of liquid coating which is transferred to a substrate (12). The second roll (16) includes a thin metal shell (40) and a resilient layer (30), the thin metal shell encases the resilient layer therebeneath, and the thin metal shell is capable of deflecting in unison with the resilient layer such that the thin metal shell is elastically deformable at the nip when in contact with the first roll (14).

Flexible conductive display film

A display film includes a transparent energy dissipation layer having a glass transition temperature of 2 7 degrees Celsius or less and a Tan Delta peak value of O.5 or greater, and a transparent conductor layer disposed on the transparent energy dissipation layer. The conductive display films including transparent conductors and a flexible substrate that can protect a display window and survive folding tests intact while maintaining the desired electric conductive properties.

Printing systems including a rigid printing pattern and an inking roll having an elastically deformable surface

A printing system is provided. The printing system (300) includes a printing roll (310) having a rigid printing pattern (312) on a surface thereof configured to receive an ink material (330); and an inking roll (320) positioned adjacent to the printing roll. The inking roll includes an elastically deformable surface and a number of cells (324) disposed on the elastically deformable surface. A method of printing is also provided. The method includes (a) inking at least a portion of a rigid printing pattern (312) on a surface of a printing roll (310) by contacting the rigid printing pattern with an inking roll (320); and (b) contacting the rigid printing pattern with a substrate (350), transferring the ink material from the rigid printing pattern to a surface of the substrate. Printing systems and methods can achieve higher printing feature resolutions than typically achievable via flexographic printing.

Patterned wavelength-selective film

The disclosed patterned wavelength-selective material and process for making the patterned wavelength-selective material uses selectively located barriers to the adhesive regions. A structurally weak wavelength-selective material includes portions that contact the adhesive regions and break to remain in contact with the adhesive. The wavelength-selective material does not contact the adhesive regions covered by the barrier and is removed leaving a wavelength-selective film in a pattern at the adhesive regions.

Process for depositing dry powder particles onto a substrate and attaching the particles to the substrate

Systems and methods for mapping wound features

Systems and methods for mapping wound features of a wound bed and also detecting degradation of electrode or connectivity performances are provided. Electrical measurements are collected from an array of electrodes which apply electrical signals to a periwound tissue outside the wound bed. The electrical measurements are processed to generate an impedance map of the wound bed, which is converted to maps conveying spatial distributions of clinical metrics.

Release coating compositions for pressure sensitive adhesive articles and methods

A method of making a release coated article is described comprising: providing a release coating comprising at least 50 wt.% of monomer(s) comprising an ethylenically unsaturated group and a terminal alkyl group with at least 18 (e.g. contiguous) carbon atoms based on the total amount of ethylenically unsaturated components; crosslinking components(s) comprising at least two ethylenically unsaturated groups; and at least one polymerization initiator. The release coating is substantially solventless, comprising no greater than 1 wt.% of non-polymerizable organic solvent. The method further comprises applying the release coating to a major surface of a substrate; and polymerizing the monomer(s) and crosslinking component(s) of the release coating after applying the release coating to the substrate. Also described are release coating compositions.

Methods and systems for stencil printing

Methods and apparatuses for screen or stencil printing a pattern on a substrate are provided. The substrate (2) has its major surface in contact with a first major surface (112) of a stencil shell (111) having apertures (116). A coating material is disposed onto the second major surface (114) of the stencil shell (111) to flow through the apertures (116) to contact the substrate (2), where the coating material is at least partially cured. The substrate (2) is separated (C) from the first major surface (112) of the stencil shell (111) after the curing (142) and a pattern (42) of the at-least-partially-cured coating material is formed on the substrate (2).

Partículas abrasivas conformadas com pontas afiadas e artigo abrasivo revestido

a presente invenção refere-se, em várias modalidades, a partículas abrasivas conformadas tendo pontas afiadas, a métodos para a produção das partículas abrasivas conformadas, métodos de abrasão de um substrato com as partículas abrasivas conformadas, e artigos abrasivos revestidos incluindo as partículas abrasivas conformadas. a partícula abrasiva conformada inclui uma cerâmica, tem um formato em seção transversal poligonal ao longo de um eixo geométrico longitudinal da partícula abrasiva conformada, e ao menos uma ponta da partícula abrasiva conformada tem um raio de curvatura menor que ou igual a cerca de 19,2 mícrons.

Methods and Systems for Stencil Printing

Methods and apparatuses for screen or stencil printing a pattern on a substrate are provided. The substrate ( 2 ) has its major surface in contact with a first major surface ( 112 ) of a stencil shell ( 111 ) having apertures ( 116 ). A coating material is disposed onto the second major surface ( 114 ) of the stencil shell ( 111 ) to flow through the apertures ( 116 ) to contact the substrate ( 2 ), where the coating material is at least partially cured. The substrate ( 2 ) is separated (C) from the first major surface ( 112 ) of the stencil shell ( 111 ) after the curing ( 142 ) and a pattern ( 42 ) of the at-least-partially-cured coating material is formed on the substrate ( 2 ).

Printing system and method including printing roll having elastically deformable and compressible thick inner layer

A printing system (200) including a printing roll (220) is provided. The printing roll (220) includes an elastically deformable and compressible inner layer (224) and a thin outer shell (222) to cover the inner layer (224). The thin outer shell (222) includes a pattern of raised print features (223) to receive ink material thereon. The inner layer (224) is softer and thicker than the thin outer shell (222), and optionally, the thin outer shell (222) is removable from the inner layer (224). The inner layer (224) of the printing roll (220) has a thickness, a compression force deflection value and an elastically-deformable compressibility such that the raised print features (223) of the printing roll (220) do not slide or deform with respect to the printed web (2) in an amount to generate a substantially visible dot gain.

Die coating on air supported shell

Methods and apparatuses for applying coatings on a moving web are provided. A coating die and a back-up roll engage with each other. The back-up roll includes a shell rotatably supported by a pressurized air layer. When a coating material is dispensed from the coating die onto the web to form a liquid coating, the pressure of the air layer is controlled such that the shell translates in space to balance forces from the air layer and the coating bead, while the web is being translated to drive the shell.

Methods of passivating adhesives

Printing patterns via die cutting

Methods, apparatuses and systems for printing an ink pattern on a moving web via die cutting are provided. A die roll including an inked pattern of die blades contacts a substrate to cut or cleave the substrate surface. While the die blades withdraw from the substrate, at least some of the ink transfers from the die blades to the cut substrate to form an ink pattern.

Methods and systems for stencil printing

Methods and apparatuses for screen or stencil printing a pattern on a substrate are provided. The substrate (2) has its major surface in contact with a first major surface (112) of a stencil shell (111) having apertures (116). A coating material is disposed onto the second major surface (114) of the stencil shell (111) to flow through the apertures (116) to contact the substrate (2), where the coating material is at least partially cured. The substrate (2) is separated (C) from the first major surface (112) of the stencil shell (111) after the curing (142) and a pattern (42) of the at-least-partially-cured coating material is formed on the substrate (2).

Method and apparatus of slot die coating over deformable back-up roll

Flexible electronic devices including internally routed channels

Devices are provided to include a flexible substrate and a rigid circuit component attached to the flexible substrate. The substrate provides electrically conductive traces and vias connected to contact pads at edges of the rigid circuit component to form electrical joints or junctions. The electrical joints or junctions are located and/or shaped to prevent cracks in the traces upon bending or stretching of the device.

Process for depositing dry powder particles onto a substrate and adhesively bonding the particles to the substrate

Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to adhesively bond the particles to a pressure-sensitive adhesive surface of the substrate.

Die coating on air supported shell

Devices with planarized connections to coin cell battery

Devices including planarized connections to a coin cell battery are provided. A ring structure is disposed at a battery area of a substrate to receive a coin cell battery. The substrate further includes a first electrical contact to electrically connect to the ring structure, and a second electrical contact disposed on the battery area, surrounded by the ring structure.

Filter cartridge including patterned functional material

Various embodiments of a filter cartridge are disclosed. The filter cartridge includes a first filter media layer having first and second major surfaces, a second filter media layer having first and second major surfaces, and a plenum disposed between the first and second filter media layers. The filter cartridge further includes functional material disposed on the first major surface of each of the first and second filter media layers within a filter region of the filter cartridge, where the functional material includes active particles disposed on an adhesive layer; and a perimeter seal region that defines at least a portion of a perimeter of the filter cartridge, where at least the first and second filter media layers are connected together in the perimeter seal region. The functional material is not disposed in at least a portion of the perimeter seal region.

Liquid coating method and apparatus with a deformable metal roll

Magnetizable particles forming light controlling structures and methods of making such structures

A method of making an optical film for control of light includes positioning a first mixture on a substrate, wherein the first mixture includes a first plurality of magnetizable particles dispersed in a first resin, assembling the first plurality of magnetizable particles into a desired structure for the control of the light by rotating modulation of at least a first magnetic field relative to the first plurality of magnetizable particles, and vitrifying the first resin while the first plurality of magnetizable particles are in the desired structure.

Automatic registration between circuit dies and interconnects

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

Methods of passivating adhesives

Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed.

Devices including access to an electrically conductive component and methods of making and using same

The present disclosure provides a device including a flexible substrate having an adhesive surface on a first major side as well as an access component that includes a first electrically conductive component and a masking component that covers the first electrically conductive component opposite the adhesive surface of the flexible substrate. The first electrically conductive component is adhesively bonded to the adhesive surface of the flexible substrate. The device also includes a second electrically conductive component electrically connected to the first electrically conductive component and that extends from the first electrically conductive component on the first major side of the flexible substrate through to the second major side of the flexible substrate. Further, the device includes an encapsulating layer that encapsulates the masking component and at least a portion of the first major side of the flexible substrate. The disclosure also provides a method of making the device.

Curable composition, cured composition, and composite article, and method of making the same

A curable composition comprises a siloxane compound and a tetraalkyl orthotitanate. The siloxane compound comprises m divalent units represented by the formula –SiH(R1)O–, n divalent units represented by the formula –Si(R1)(OR2)O–, and p divalent units represented by the formula –Si(R1)2O–, wherein each R1 independently represents an alkyl group having from 1 to four carbon atoms, each R2 independently represents H or an alkyl group having from 1 to four carbon atoms, m and n are integers greater than or equal to 1, and p is an integer greater than or equal to 0. An at least partially cured curable composition and composite articles including the same are also disclosed.

Method and apparatus for coating on baggy web

Roll Coating Using Metered Coating Roll Including Deformable Layers

Methods and apparatuses for roll coating are provided. The roll coating system ( 100 ) includes a coating roll ( 110 ) having a deformable inner layer ( 12 ) with a surface thereof covered by a deformable outer layer ( 14 ), the inner layer being softer than the outer layer. A substrate ( 3 ) is conveyed to the nip ( 12 ) between the coating roll and a back-up roll ( 120 ). A metered coating material is transferred from the coating roll to a patterned surface structure ( 40 ) of the substrate at the nip to form a conformal coating on the patterned structure of the substrate.

Roll coating using metered coating roll including deformable layers

Methods and apparatuses for roll coating are provided. The roll coating system (100) includes a coating roll (110) having a deformable inner layer (12) with a surface thereof covered by a deformable outer layer (14), the inner layer being softer than the outer layer. A substrate (3) is conveyed to the nip (12) between the coating roll and a back-up roll (120). A metered coating material is transferred from the coating roll to a patterned surface structure (40) of the substrate at the nip to form a conformal coating on the patterned structure of the substrate.

A patterned wavelength-selective film

The disclosed patterned wavelength-selective material and process for making the patterned wavelength-selective material uses selectively located barriers to the adhesive regions. A structurally weak wavelength-selective material includes portions that contact the adhesive regions and break to remain in contact with the adhesive. The wavelength-selective material does not contact the adhesive regions covered by the barrier and is removed leaving a wavelength-selective film in a pattern at the adhesive regions.

A patterned wavelength-selective film