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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 6. Отображено 6.
23-05-2023 дата публикации

Inter-satellite communication device based on stepping motor and Hall sensor and link establishing method

Номер: CN116155368A
Принадлежит:

The invention relates to an inter-satellite communication device and a link establishing method based on a stepping motor and a Hall sensor in the field of space optical communication, and the inter-satellite communication device comprises a rotary table provided with a pitch axis/azimuth axis stepping motor and a Hall sensor, and the rotary table is provided with a main telescope and a small telescope which are coaxially arranged. And a visible light receiving optical path, a beacon light emitting optical path, a beacon light receiving optical path, a signal light emitting optical path and a signal light receiving optical path are adopted to realize inter-satellite laser communication. On the premise that the precision requirements of main components such as a coarse aiming mechanism, an angle sensor and a position detector are reduced, rapid capturing and stable tracking meeting the requirements are achieved.

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23-06-2023 дата публикации

Scintillator and photoelectric detection chip coupling method, equipment and photoelectric scanning device

Номер: CN116314435A
Принадлежит:

The invention discloses a scintillator and photoelectric detection chip coupling method, equipment and a photoelectric scanning device. The coupling method of the scintillator and the photoelectric detection chip comprises the following steps: acquiring the photoelectric detection chip, and arranging photosensitive glue on the photoelectric detection chip; obtaining a scintillator, and placing the scintillator in a space above the surface, provided with the photosensitive glue, of the photoelectric detection chip; the scintillator is pressed down to make contact with the photoelectric detection chip, meanwhile, the photosensitive glue is horizontally exposed through light in the horizontal propagation direction, the photosensitive glue is cured, and the scintillator and the photoelectric detection chip are coupled. According to the scheme, when the photosensitive adhesive is exposed, the photosensitive adhesive is irradiated by the light in the propagation direction of the plane where the ...

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16-05-2023 дата публикации

Alignment method of wireless laser communication equipment

Номер: CN116131957A
Принадлежит:

The invention discloses an alignment method of wireless laser communication equipment. The method is high in operability and low in implementation cost, and has good practical value for wireless laser communication alignment, especially alignment of multiple sets of equipment.

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25-04-2023 дата публикации

Manufacturing method of packaging body and packaging body

Номер: CN116013792A
Автор: DING PENG, GAN RUN, JIANG JING
Принадлежит:

The invention discloses a manufacturing method of a packaging body and the packaging body. The manufacturing method of the packaging body comprises the following steps: preparing a carrier plate; a carrier plate bonding pad is arranged on the first surface of the carrier plate; mounting a first chip on the first surface of the carrier plate; the first chip is provided with a first surface and a second surface which are opposite to each other, the first surface of the first chip is provided with a first bottom bonding pad, the first bottom bonding pad is in butt joint with the carrier plate bonding pad, and the second surface of the first chip is provided with a first top bonding pad; mounting a second chip on the second surface of the first chip; the first surface of the second chip is provided with a second bottom bonding pad, and the second bottom bonding pad is in butt joint with the first bottom bonding pad. According to the scheme, the electronic packaging performance and density can ...

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05-08-2015 дата публикации

Preparation method for unnatural amino acids

Номер: CN104817476A
Принадлежит:

The invention relates to a preparation and chiral resolution method for unnatural amino acids. The method comprises the following steps: with adamantanecarboxylic acid as a raw material, preparing 3-hydroxy-adamantanecarboxylic acid; carrying out chlorination, oxidation and the like so as to obtain 2-(3-hydroxy-1-adamantyl)glyoxalic acid; reacting 2-(3-hydroxy-1-adamantyl)glyoxalic acid with hydroxylamine hydrochloride so as to obtain 3-hydroxyadamantyl-glyoxalic acid oxime; carrying out reduction with a reducing agent and protection with Boc acid anhydride so as to obtain N-tertbutyloxycarbonyl-3-hydroxyadamantylglycine; and carrying out resolution with organic base so as to obtain two unnatural amino acids, i.e., (S)-N-tertbutyloxycarbonyl-3-hydroxyadamantylglycine and (R)-N-tertbutyloxycarbonyl-3-hydroxyadamantylglycine. Compared with the prior art, the method provided by the invention has the following advantages: improved synthesis technology; mild reaction conditions; small environmental ...

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25-04-2023 дата публикации

Chip packaging method and chip packaging body

Номер: CN116013789A
Принадлежит:

The invention discloses a chip packaging method and a chip packaging body. The chip packaging method comprises the steps of obtaining a ceramic substrate, wherein a plurality of bonding pads are formed on one surface of the ceramic substrate; welding each pin of at least one chip with the corresponding bonding pad; a flow guide piece is fixedly arranged on one side face of the ceramic substrate in an attached mode, and one surface of the flow guide piece is flush with one surface, close to the chip, of the ceramic substrate; and guiding the adhesive to the space between each chip and the ceramic substrate by using the flow guiding piece so as to complete the packaging of the chips. According to the scheme, the phenomena of cavities and incomplete filling can be reduced, so that the binding force between each chip and the ceramic substrate is improved, and the structural stability and reliability between each chip and the ceramic substrate are improved.

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