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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 4. Отображено 4.
12-05-2010 дата публикации

Circuit board processing method and circuit board

Номер: CN0101707854A
Автор: GAO WENSHUAI, KONG LINGWEN, LIU YICHAO, PENG QINWEI, SHI GENGCAI, WENSHUAI GAO, LINGWEN KONG, YICHAO LIU, QINWEI PENG, GENGCAI SHI
Принадлежит:

The embodiment of the invention relates to a circuit board processing method, wherein at least two subboards provided with via holes are adhered through a bonding structure provided with conducting material and a cavity; the conducting material is used for connecting the via holes; the cavity is used for the diffusion filling of the conducting material; and the positions of the via holes, the conducting material and the cavity are arranged correspondingly. The embodiment of the invention also provides a circuit board. The adoption of the circuit board processing method and the circuit board can avoid short circuit problem caused by the easy diffusion of overmuch conducting material along the gap between a bonding sheet and subboards, extends the using range of Z-direction connecting and processing method of the circuit board, reduces the hole pitch among the subboards, is beneficial to improving the overall density of the circuit board, and has high yield, low rejection rate and low cost ...

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Номер записи: 1
10-08-2011 дата публикации

Circuit board processing method and circuit board

Номер: CN0101707854B
Автор: GAO WENSHUAI, KONG LINGWEN, LIU YICHAO, PENG QINWEI, SHI GENGCAI, WENSHUAI GAO, LINGWEN KONG, YICHAO LIU, QINWEI PENG, GENGCAI SHI
Принадлежит:

The embodiment of the invention relates to a circuit board processing method, wherein at least two subboards provided with via holes are adhered through a bonding structure provided with conducting material and a cavity; the conducting material is used for connecting the via holes; the cavity is used for the diffusion filling of the conducting material; and the positions of the via holes, the conducting material and the cavity are arranged correspondingly. The embodiment of the invention also provides a circuit board. The adoption of the circuit board processing method and the circuit board can avoid short circuit problem caused by the easy diffusion of overmuch conducting material along the gap between a bonding sheet and subboards, extends the using range of Z-direction connecting and processing method of the circuit board, reduces the hole pitch among the subboards, is beneficial to improving the overall density of the circuit board, and has high yield, low rejection rate and low cost ...

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Номер записи: 2
30-03-2011 дата публикации

Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin

Номер: CN0101500376B
Автор: PENG QINWEI, SHI GENGCAI, KONG LINGWEN, QINWEI PENG, GENGCAI SHI, LINGWEN KONG
Принадлежит:

The invention discloses a method for adopting a double head pressure contact pin to produce a multi-layer plate for a multi-layer dead hole. A backboard is divided into a plurality of sub-plates. When the sub-plates is produced by hole drilling, galvanization, surface treatment and other procedures, the double head pressure contact pin is used for pressing and being connected with an upper sub-plate and a lower sub-plate for purpose of lamination and press so as to finally form a motherboard. The holes at corresponding positions of the upper sub-plate and the lower sub-plate can together forman integral through hole though the double head pressure contact pin. The other holes in which no contact pins are inserted are dead holes. The pressed plates can be used directly without wet treatment. The invention can improve the contraposition, drilling and galvanization of the high multi-layer backboard, solves the problem on the protection of mechanical dead holes, optimizes the backboard production ...

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Номер записи: 3
05-08-2009 дата публикации

Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin

Номер: CN0101500376A
Автор: PENG QINWEI, SHI GENGCAI, KONG LINGWEN, QINWEI PENG, GENGCAI SHI, LINGWEN KONG
Принадлежит:

The invention discloses a method for adopting a double head pressure contact pin to produce a multi-layer plate for a multi-layer dead hole. A backboard is divided into a plurality of sub-plates. When the sub-plates is produced by hole drilling, galvanization, surface treatment and other procedures, the double head pressure contact pin is used for pressing and being connected with an upper sub-plate and a lower sub-plate for purpose of lamination and press so as to finally form a motherboard. The holes at corresponding positions of the upper sub-plate and the lower sub-plate can together form an integral through hole though the double head pressure contact pin. The other holes in which no contact pins are inserted are dead holes. The pressed plates can be used directly without wet treatment. The invention can improve the contraposition, drilling and galvanization of the high multi-layer backboard, solves the problem on the protection of mechanical dead holes, optimizes the backboard production ...

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Номер записи: 4