Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 54. Отображено 54.
09-04-2014 дата публикации

Printed circuit board and processing method for the same

Номер: CN103717000A
Автор: XIE ZHANHAO, PENG QINWEI, KONG LINGWEN
Принадлежит:

This invention discloses a printed circuit board and a processing method for the same. The embodiment of the invention forms an inductive winding through a circuit graph and is conducive to the improvement of the mechanization and automation rate of inductor processing in the printed circuit board, the reduction of the scrap rate of products and the promotion of miniaturization and integration of the printed circuit board.

Подробнее
Номер записи: 1
16-05-2012 дата публикации

Induction type printed circuit board and processing technique thereof

Номер: CN0101772264B
Автор: KONG LINGWEN, MIAO HUA, PENG QINWEI, ZHU ZHENGTAO, LINGWEN KONG, HUA MIAO, QINWEI PENG, ZHENGTAO ZHU
Принадлежит:

The invention discloses an induction type printed-circuit board, comprising a substrate and copper foil layers, wherein the copper foil layers cover the upper surface and the lower surface of the substrate, the substrate is combined with the copper foil layers on the upper surface and the lower surface by a medium layer, at least one through hole is arranged on the substrate while a magnetic coreattached with a winding is embedded in the through hole , the size of the through hole is matched with the outer diameter of the magnetic core, and a medium inner container is formed by further filling medium layer in an inner hole of the magnetic core. The invention further discloses a corresponding processing technique of the induction type printed-circuit board. The invention can save the surface space of the circuit board and reduce the processing difficulty.

Подробнее
Номер записи: 2
25-06-2014 дата публикации

Leading wire framework processing method

Номер: CN103887179A
Автор: CHEN CHONG, LIU DEBO, KONG LINGWEN, PENG QINWEI, YANG ZHIGANG
Принадлежит:

The invention discloses a leading wire framework processing method. The leading wire framework processing method comprises steps that: a first face of a carrier material is processed to form a first conductive layer; the first conductive layer is provided with a medium layer; multiple holes are formed on the medium layer through drilling and penetrate through the first conductive layer; a first film is pasted on the medium layer on which the multiple holes are formed through drilling; exposure development processing on the first film is carried out to expose the holes; a conductive substance is filled in the holes; the carrier material is removed; the first conductive layer is processed to form a line graph. The leading wire framework processing method facilitates to improve manufacturing precision of a leading wire framework.

Подробнее
Номер записи: 3
30-04-2015 дата публикации

PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

Номер: US20150115427A1
Автор: Guanhua Li, Jing Jiang, Qinwei Peng, LI GUANHUA, JIANG JING, PENG QINWEI
Принадлежит:

A package structure and a packaging method thereof are provided, in which an inductor is integrated into a substrate so as to save a packaging space and thus improve the integration level and packaging effect of the system. The package structure includes a substrate, wherein a first metal enclosing structure and a second metal enclosing structure are provided on the substrate and are connected through a connecting hole in the substrate so as to form a helical 1. A package structure , comprising a substrate;wherein a first metal enclosing structure and a second metal enclosing structure are provided on the substrate; andthe first metal enclosing structure and the second metal enclosing structure are connected through a connecting hole in the substrate to form a helical coil.2. The package structure according to claim 1 , whereina groove is further provided in the substrate;the first metal enclosing structure is located at the top of the groove, and the second metal enclosing structure is located at the bottom of the groove; andthe helical coil is formed around the groove.3. The package structure according to claim 2 , whereinthe second metal enclosing structure comprises a plurality of metal windings and a plurality of metal bonding parts;the metal windings are provided at the bottom of the groove;the metal bonding parts is formed by extending the metal windings from a side surface of the groove through the connecting hole in the substrate to a surface of the substrate, the metal bonding parts are distributed on both sides of a surface of the groove;the first metal enclosing structure comprises a plurality of metal leads; andthe metal bonding parts on both sides of the surface of the groove are connected by the metal leads, so that a passage is formed between any two connected metal bonding parts.4. The package structure according to claim 3 , whereinthe metal windings provided at the bottom of the groove all are parts of the same helical coil, andtwo ends of each of ...

Подробнее
Номер записи: 4
07-07-2010 дата публикации

Induction type printed circuit board and processing technique thereof

Номер: CN0101772264A
Автор: KONG LINGWEN, MIAO HUA, PENG QINWEI, ZHU ZHENGTAO, LINGWEN KONG, HUA MIAO, QINWEI PENG, ZHENGTAO ZHU
Принадлежит:

The invention discloses an induction type printed-circuit board, comprising a substrate and copper foil layers, wherein the copper foil layers cover the upper surface and the lower surface of the substrate, the substrate is combined with the copper foil layers on the upper surface and the lower surface by a medium layer, at least one through hole is arranged on the substrate while a magnetic core attached with a winding is embedded in the through hole , the size of the through hole is matched with the outer diameter of the magnetic core, and a medium iner container is filled in an inner hole of the magnetic core. The invention further discloses a corresponding processing technique of the induction type printed-circuit board. The invention can save the surface space of the circuit board and reduce the processing difficulty.

Подробнее
Номер записи: 5
25-06-2014 дата публикации

Leading wire framework processing method

Номер: CN103887182A
Автор: LIU DEBO, CHEN CHONG, KONG LINGWEN, PENG QINWEI, YANG ZHIGANG
Принадлежит:

The invention discloses a leading wire framework processing method. The leading wire framework processing method comprises steps that: a first face of a carrier material is processed to form a circuit graph; the first face having the processed circuit graph is provided with a medium layer; multiple holes are formed on the medium layer through drilling and penetrate through the circuit graph; the conductive substance is filled in the multiple holes through electroplating and/or chemical plating to form interlayer interconnection of a leading wire framework. The leading wire framework processing method facilitates to improve making precision of the leading wire framework.

Подробнее
Номер записи: 6
28-04-2010 дата публикации

Circuit board processing method and circuit board

Номер: CN0101699938A
Автор: Kong Lingwen, Peng Qinwei, Yuan Weiqun, Chen Yuchun, Zhang Jiahu
Принадлежит:

The embodiment of the invention relates to a circuit board processing method, and comprises obtaining high frequency materials provided with power amplification slot, and a board which is provided with a high frequency zone, a digital zone, a radio frequency zone, a protective card zone and a power supply zone, and is set type; the high frequency materials are mixed and pressed into the high frequency zone. The embodiment of the invention also provides a circuit board. With the adoption of the circuit board processing method and the circuit board of the embodiment of the invention, the functions of digital, radio frequency, protective card zone, power supply, and power amplifier can be simultaneously integrated on the circuit board, thus effectively reducing the number and area of used circuit boards, simplifying electronic assembly, and lowering cost of circuit boards.

Подробнее
Номер записи: 7
11-05-2011 дата публикации

Method and equipment for processing PCB (Printed Circuit Board)

Номер: CN0102056415A
Автор: HUA MIAO, XIAOLIN GONG, CHENGYONG WANG, QINWEI PENG, MIAO HUA, GONG XIAOLIN, WANG CHENGYONG, PENG QINWEI
Принадлежит:

The invention belongs to the technical field of PCB (printed circuit board) processing, and especially relates to a method and equipment for processing a PCB. The processing method provided by the invention comprises the following step: controlling the temperature of the part to be processed of the PCB below the glass-transition temperature by utilizing a cooling liquid or a cooling solid in the course of mechanically processing the PCB. The processing method of the PCB provided by the invention directly cools the part to be processed of the PCB by utilizing the cooling fluid or the cooling solid in the processing site and controls the temperature of the part to be processed of the PCB below the glass-transition temperature, at the moment, the material is relatively hard and brittle, thereby being convenient for the mechanical processing and being capable of reducing the burr and drilling dirt on the PCB. Because the on-site processing is adopted, the invention can guarantee the cooling ...

Подробнее
Номер записи: 8
29-12-2010 дата публикации

Detection method for interlayer combination of PCB product with metal base

Номер: CN0101929983A
Автор: JING JIANG, HONGBO XIANG, LINGWEN KONG, QINWEI PENG, JIANG JING, XIANG HONGBO, KONG LINGWEN, PENG QINWEI
Принадлежит:

The embodiment of the invention discloses a detection method for the interlayer combination of a PCB product with a metal base. The detection method comprises the following steps of: a, performing transmission mode scanning on the PCB product with the metal base by using ultrasonic scanning equipment; finishing detecting if the PCB product with the metal base has no layered blister phenomenon; and turning to a step b if the PCB product with the metal base has the layered blister phenomenon; and b, performing reflection mode scanning on the PCB product with the metal base by using the ultrasonic scanning equipment; and determining the position of layered blister. In the detection method provided by the embodiment of the invention, the interlayer combination situation of the PCB product with the metal base can be detected accurately and rapidly on the premise of not damaging a sample.

Подробнее
Номер записи: 9
19-05-2010 дата публикации

Process for pressing galvanized PCB boards and multi-layer PCB board

Номер: CN0101711101A
Автор: Kong Lingwen, Lai Hanqi, Peng Qinwei
Принадлежит:

The invention discloses a process for pressing galvanized PCB boards. The process comprises the following steps of: the first pressing step, after sequentially covering a bonding sheet, a copper foil and an elastic pad on a core board assembly to be pressed, pressing the core board assembly under the high-temperature and high-pressure condition, and pressing the bonding sheet into grooves among copper foil lines on the surface of the core board assembly; the copper removing step, after detaching the silica gel pad, removing the overlaid copper foil to expose the cured bonding sheet; and the second pressing step, after covering another bonding sheet on the semi-finished product of which an insulating sheet is removed, pressing the bonding sheet and the core board assembly to be pressed with the bonding sheet under the high-temperature and high-pressure condition. The invention also discloses a corresponding multi-layer PCB board. The invention can effectively prevent the gel shortage problem ...

Подробнее
Номер записи: 10
23-11-2011 дата публикации

Printed circuit board embedded with chip device and manufacturing method thereof

Номер: CN0102256451A
Автор: XIN GU, DEBO LIU, QINWEI PENG, LINGWEN KONG, GU XIN, LIU DEBO, PENG QINWEI, KONG LINGWEN
Принадлежит:

The invention provides a method for manufacturing a printed circuit board embedded with a chip device and a circuit board manufactured by using the method. According to the invention, an implantation method of the chip device is mainly changed; the horizontal implantation in the prior art is replaced by the vertical insertion; during the vertical insertion, the electrode area of the chip device, capable of being conductive with an external circuit, is increased, so that the alignment requirement on an electrode is reduced while a blind hole is processed by laser, therefore, the processing is easier, the qualification rate of products is improved and the production efficiency is higher. According to the manufacturing method disclosed by the invention, the high-quality and high qualification-rate printed circuit board embedded with the chip device can be produced and manufactured rapidly.

Подробнее
Номер записи: 11
09-04-2014 дата публикации

Printed circuit board and processing method for the same

Номер: CN103716999A
Автор: XIE ZHANHAO, PENG QINWEI, KONG LINGWEN
Принадлежит:

This invention discloses a printed circuit board and a processing method for the same. The embodiment of the invention forms an inductive winding through a circuit graph and is conducive to the improvement of the mechanization and automation rate of inductor processing in the printed circuit board, the reduction of the scrap rate of products and the promotion of miniaturization and integration of the printed circuit board.

Подробнее
Номер записи: 12
11-05-2011 дата публикации

Mother board and method for processing mother board

Номер: CN0101674708B
Автор: KONG LINGWEN, PENG QINWEI, XIONG JIA, CUI RONG, LINGWEN KONG, QINWEI PENG, JIA XIONG, RONG CUI
Принадлежит:

The embodiment of the invention relates to a mother board which is formed by lamination of two subboards with through holes; the surface of each through hole is covered with bottom copper needed by forming a circuit; each through hole independently forms a blind hole on the mother board; and each layer of bottom copper is covered with nickel-copper-nickel interlayer, the nickel layer thickness in the nickel-copper-nickel interlayer is not less than 2micron. In addition, the embodiment of the invention also provide a method for processing the mother board; by adopting the embodiment of the invention, the nickel-copper-nickel interlayer can protect the completeness for covering the bottom copper on the surface of the through hole of the subboard, and increase the reliability of hole copper; in addition, as all the blind holes can be plugged by devices independently, the information capacity of a circuit board can be increased greatly under the condition of same layer/thickness of the circuit ...

Подробнее
Номер записи: 13
23-11-2011 дата публикации

Embedded circuit board of passive device and manufacturing method thereof

Номер: CN0102256450A
Автор: WEIQUN YUAN, LINGWEN KONG, QINWEI PENG, YUAN WEIQUN, KONG LINGWEN, PENG QINWEI
Принадлежит:

The invention provides a manufacturing method of an embedded circuit board of a passive device and the embedded circuit board of the passive device manufactured by the method. The method provided by the invention mainly comprises the following steps: drilling before a substrate is laminated; fixing the passive device by utilizing a conducting material arranged in a through hole; and communicating the electrode of the passive device with an external circuit through the conducting material, thereby solving the problems of high positioning accuracy requirements on a hole and the electrode of the passive device, difficulty in manufacturing and high possibility error occurrence when the electrode is led out because the passive device is fixed in the substrate and is drilled after being laminated in the prior art. According to the manufacturing method provided by the invention, the embedded circuit board of the passive device, which has the advantages of high quality and high qualification rate ...

Подробнее
Номер записи: 14
25-06-2014 дата публикации

Leading wire framework processing method

Номер: CN103887180A
Автор: CHEN CHONG, LIU DEBO, KONG LINGWEN, PENG QINWEI, YANG ZHIGANG
Принадлежит:

The invention discloses a leading wire framework processing method. The leading wire framework processing method comprises steps that: a first face of a carrier material is processed to form a first conductive layer; the first conductive layer is provided with a medium layer; the medium layer is provided with a second conductive layer; multiple holes are formed on the second conductive layer through drilling and penetrate through the first conductive layer; a film is pasted on the second conductive layer on which the multiple holes are formed through drilling; exposure development processing on the film is carried out to expose a line graph area and the holes, and the residual film after exposure development processing covers a non-line graph area of the second conductive layer; a conductive substance is filled in the holes, and the conductive substance in the line graph area is thickened; the residual film on the second conductive layer is removed; the conductive substance in the non-line ...

Подробнее
Номер записи: 15
05-05-2010 дата публикации

Microstrip antenna filter structure and preparation method thereof

Номер: CN0101702457A
Автор: LINGWEN KONG, HUA MIAO, QINWEI PENG, ZHENGTAO ZHU, KONG LINGWEN, MIAO HUA, PENG QINWEI, ZHU ZHENGTAO
Принадлежит:

The invention discloses a microstrip antenna filter structure. The structure contains a microstrip antenna arranged on a circuit board and a metal cavity arranged around the microstrip antenna, wherein the circuit board comprises three layers of plates, the plates are combined together through medium layers; the middle-layer plate of the circuit board is provided with a fracture section, the metal cavity is electroplated on the surface of the fracture section to form an enclosed space with the upper surface of the bottom-layer plate of the circuit board, and the microstrip antenna is fixed onthe bottom-layer plate and positioned on the upper surface of the enclosed space. The invention also discloses a preparation method of the microstrip antenna filter structure. By using the microstripantenna filter structure and preparation method thereof of the invention, the shielding and processing effects of the circuit board on the microstrip line can be greatly improved.

Подробнее
Номер записи: 16
03-11-2010 дата публикации

Manufacturing method of sheet printed circuit board and sheet printed circuit board

Номер: CN0101877938A
Автор: ZHANG JIANCHAO, YANG ZHIQIN, LIU JIANHUI, PENG QINWEI, KONG LINGWEN, JIANCHAO ZHANG, ZHIQIN YANG, JIANHUI LIU, QINWEI PENG, LINGWEN KONG
Принадлежит:

The embodiment of the invention relates to a manufacturing method of a sheet printed circuit board. The sheet printed circuit board comprises a medium interlayer provided with a first board surface and a second board surface which are adjacent to each other, wherein the first board surface is provided with a first non-graphic region, and the second board surface is provided with a second non-graphic region. The manufacturing method of the sheet printed circuit board comprises the following steps of: laying a group of first copper strips in the first non-graphic region, and laying a group of second copper strips vertical to the first copper strips in the length direction in the second non-graphic region. The embodiment of the invention also provides the sheet printed circuit board. By adopting the manufacturing method of the sheet printed circuit board and the sheet printed circuit board in the embodiment of the invention, stress generated by the medium interlayer of the sheet printed circuit ...

Подробнее
Номер записи: 17
07-07-2010 дата публикации

Method for fixing magnetic core in PCB (Printed Circuit Board) taphole

Номер: CN0101772275A
Автор: KONG LINGWEN, MIAO HUA, PENG QINWEI, ZHU ZHENGTAO, LINGWEN KONG, HUA MIAO, QINWEI PENG, ZHENGTAO ZHU
Принадлежит:

The invention discloses a method for fixing a magnetic core in a PCB (Printed Circuit Board) taphole. The method comprises the following steps of: (1) material preparation: preparing a core plate; (2) drilling: drilling a through hole and a depth control hole on the core plate, wherein the through hole and the depth control hole form a step hole, and the diameter of the through hole is smaller than that of the depth control hole; (3) magnetic core placement: placing a magnetic core on the step of the step hole of the core plate and filling resin in the magnetic core, wherein the magnetic core is arranged in the depth control hole; and (4) press-fitting: sequentially press-fitting a prepreg and a copper foil on the surface of the core plate. In the method, the magnetic core is directly placed in the step hole of the core plate, i.e. the magnetic core is fixed by utilizing the step of the step hole, the magnetic core is firmly fixed, and resin is conveniently to fill in the magnetic core.

Подробнее
Номер записи: 18
12-01-2011 дата публикации

Mixed pressure circuit board and manufacture method thereof

Номер: CN0101945541A
Автор: HANQI LAI, QINWEI PENG, LINGWEN KONG, LAI HANQI, PENG QINWEI, KONG LINGWEN
Принадлежит:

The invention discloses a mixed pressure circuit board and a manufacture method thereof. The circuit board comprises a mixed pressure polyfluortetraethylene core plate, a polyimide core plate and a bonding layer arranged between the polyfluortetraethylene core plate and the polyimide core plate. The mixed pressure circuit board of the invention can satisfy a device mounting environment with space limitation or flexure requirement.

Подробнее
Номер записи: 19
12-05-2010 дата публикации

Circuit board processing method and circuit board

Номер: CN0101707854A
Автор: GAO WENSHUAI, KONG LINGWEN, LIU YICHAO, PENG QINWEI, SHI GENGCAI, WENSHUAI GAO, LINGWEN KONG, YICHAO LIU, QINWEI PENG, GENGCAI SHI
Принадлежит:

The embodiment of the invention relates to a circuit board processing method, wherein at least two subboards provided with via holes are adhered through a bonding structure provided with conducting material and a cavity; the conducting material is used for connecting the via holes; the cavity is used for the diffusion filling of the conducting material; and the positions of the via holes, the conducting material and the cavity are arranged correspondingly. The embodiment of the invention also provides a circuit board. The adoption of the circuit board processing method and the circuit board can avoid short circuit problem caused by the easy diffusion of overmuch conducting material along the gap between a bonding sheet and subboards, extends the using range of Z-direction connecting and processing method of the circuit board, reduces the hole pitch among the subboards, is beneficial to improving the overall density of the circuit board, and has high yield, low rejection rate and low cost ...

Подробнее
Номер записи: 20
18-04-2012 дата публикации

Mixed pressure circuit board and manufacture method thereof

Номер: CN0101945541B
Автор: LAI HANQI, PENG QINWEI, KONG LINGWEN, HANQI LAI, QINWEI PENG, LINGWEN KONG
Принадлежит:

The invention discloses a mixed pressure circuit board and a manufacture method thereof. The circuit board comprises a mixed pressure polyfluortetraethylene core plate, a polyimide core plate and a bonding layer arranged between the polyfluortetraethylene core plate and the polyimide core plate. The mixed pressure circuit board of the invention can satisfy a device mounting environment with spacelimitation or flexure requirement.

Подробнее
Номер записи: 21
12-02-2014 дата публикации

Method for manufacturing packaging product with metalized side wall

Номер: CN103579010A
Автор: LI GUANHUA, JIANG JING, PENG QINWEI
Принадлежит:

The embodiment of the invention discloses a method for manufacturing a packaging product with the metalized side wall. Metallization is conducted on the side wall after packaging is conducted, metallization can be conducted on the side wall without forming a groove in the process of manufacturing a substrate, and therefore manufacturing of the substrate is simplified. When the packaging process is conducted, due to the fact that the groove has not been formed in the substrate for metallization of the side wall, no special jig is needed when processing is conducted through the vacuum absorption technology, and therefore positioning is very easy to conduct, the packaging process is simplified, the process complexity of the packaging product with the metalized side wall is lowered, production cost is reduced, and work efficiency is improved. When the packaging process is conducted, the groove has not been formed in the substrate, the strength of the substrate is ensured, the problem of substrate ...

Подробнее
Номер записи: 22
12-02-2014 дата публикации

Integrally-arranged capacitor and manufacturing method thereof

Номер: CN103578747A
Автор: CHEN CHONG, LIU DEBO, PENG QINWEI, KONG LINGWEN
Принадлежит:

The invention discloses an integrally-arranged capacitor which comprises a first electrode, a second electrode and a dielectric layer arranged between the first electrode and the second electrode. A first transition layer is arranged between the dielectric layer and the first electrode, a second transition layer is arranged between the dielectric layer and the second electrode, the dielectric layer is made of an inorganic dielectric material, and the first transition layer and the second transition layer are both made of epoxy resin or polyimide. The invention further discloses a corresponding manufacturing method. Due to the fact that the transition layers are arranged between the dielectric layer and the electrodes and an inorganic/organic composite material is not adopted by the transitional layers and the dielectric layer, the link of preparation of the composite material is omitted, the possibility that impurities are mixed with raw materials is reduced, and manufacture of the capacitor ...

Подробнее
Номер записи: 23
03-12-2014 дата публикации

Method of processing laser and laser

Номер: CN104184024A
Автор: LI GUANHUA, JIANG JING, PENG QINWEI, KONG LINGWEN, HUANG MIAN
Принадлежит:

The embodiment of the invention discloses a method of processing a laser and the laser. The method of processing the laser comprises: fixing a light-out light-passing surface of gain crystal on a first plane of a parallel positioning structural member; fixing a light-in light-passing surface of frequency multiplication crystal on a second plane of a parallel positioning structural member; fixing the parallel positioning structural member on heat radiation base materials. The first plane is parallel with the second plane. The parallel positioning structural member is provided with a light through hole penetrating from a first plane to a second plane, and the light ejecting from the light-out light-passing surface of the gain crystal can inject into the light-in light-passing surface of the frequency multiplication crystal through the light through hole. According to the technical scheme provided by the embodiment of the invention, parallelism of the light-passing surface of the gain crystal ...

Подробнее
Номер записи: 24
14-09-2011 дата публикации

Circuit board and processing method thereof

Номер: CN0102186311A
Автор: HUA MIAO, ZHENGTAO ZHU, QINWEI PENG, LINGWEN KONG, MIAO HUA, ZHU ZHENGTAO, PENG QINWEI, KONG LINGWEN
Принадлежит:

The embodiment of the invention relates to a circuit board processing method, comprising the following steps of: fixing a conductive coil on a first core board, arranging the conductive coil between the first core board and a second core board, and for leading the ports of the conductive coil out of the surface of the circuit board, drilling at the position of the ports, and electroplating at thepositions of port leading-out holes to obtain an electroplated layer for leading the ports out of the surface. The embodiment of the invention also provides a corresponding circuit board. Thus, the conductive coil is embedded in the circuit board and is not exposed on the surface of the circuit board, no loss is produced when current is introduced as the conductive coil is not exposed in the air,the electromagnetic properties of PCB (Printed Circuit Board) products are guaranteed, and especially the invention can be widely applied in the power supply industry with high requirement for current density ...

Подробнее
Номер записи: 25
28-04-2010 дата публикации

Method for rolling PCB

Номер: CN0101699939A
Автор: Yuan Weiqun, Zhang Songfeng, Kong Lingwen, Peng Qinwei
Принадлежит:

The invention relates to a method for rolling a PCB, which comprises the following steps: providing laminae of the PCB and providing a rolling element; coating a parting agent at the notching part of the outmost lamina and around the surface of rolling element, and drying the parting agent to form an isolating membrane; laminating the laminae; brushing and cleaning away recessed resin and the insulating membrane; and performing post-treatment processing to manufacture the PCB. In the method, the parting agent is coated on the outer layer of the circuit board and the surface of the rolling element to form the thin isolating membrane and during pressing, the overflowing recessed resin gathers on the insolating membrane to be separated from the circuit board and completely removed from the circuit board easily. The method can completely solve the resin recession problem and reduce the cost of the removal of the recessed resin from the circuit board at the same time.

Подробнее
Номер записи: 26
25-06-2014 дата публикации

Leading wire framework processing method

Номер: CN103887181A
Автор: CHEN CHONG, YANG ZHIGANG, LIU DEBO, KONG LINGWEN, PENG QINWEI
Принадлежит:

The invention provides a leading wire framework processing method. The leading wire framework processing method comprises steps that: a first face of a carrier material is processed to form a first conductive layer; the first conductive layer is provided with a medium layer; the medium layer is provided with a second conductive layer; a plurality of holes are formed on the second conductive layer through drilling and penetrate through the first conductive layer; a conductive substance is filled in the holes; a second film is pasted on the second conductive layer; exposure development processing on the second film is carried out to expose a non-line graph area; the conductive substance in the non-line graph area is etched to form a line graph. The leading wire framework processing method facilitates to improve making precision of a leading wire framework.

Подробнее
Номер записи: 27
24-11-2010 дата публикации

Test method and test apparatus for bonding force of PCB (Printed Circuit Board) embedded metal base

Номер: CN0101893545A
Автор: HONGBO XIANG, JING JIANG, ZHANHAO XIE, LINGWEN KONG, QINWEI PENG, XIANG HONGBO, JIANG JING, XIE ZHANHAO, KONG LINGWEN, PENG QINWEI
Принадлежит:

The invention discloses a method for testing bonding force of a PCB (Printed Circuit Board) embedded metal base, comprising the following steps of: a, preparing a PCB sample, a pressure sensor, a fixture and a universal material test machine; b, installing the pressure sensor; c, arranging the sample; d, starting the universal material test machine and the control software thereof to obtain the test data; and e, obtaining the thrust strength. The invention provides a test method of a three-point bending model to test the bonding force between the embedded metal base and the PCB; by mainly utilizing the load measurement and the displacement recording function of the universal material test machine, the bonding force between the large-size embedded metal base and the PCB is effectively evaluated; thereby, the invention provides a new solution for evaluating and testing the similar boards and the products with the similar structures.

Подробнее
Номер записи: 28
19-05-2010 дата публикации

Method for processing network connection layer of printed circuit board

Номер: CN0101711097A
Автор: Kong Lingwen, Peng Qinwei, Yuan Weiqun
Принадлежит:

The invention provides a method for processing a network connection layer of a printed circuit board. The method is characterized in that: the network connection layer is processed by the following steps of: drilling a hole on the printed circuit board along the thickness direction of the printed circuit board to form a connection hole, performing copper deposition and electroplating of the connection hole to form a metalized hole with a metallic layer, and blocking the metalized hole by dielectric materials; and drilling a truncation hole on a position, close to the metalized hole, of the printed circuit board, wherein the truncation hole crosses the hole wall of the metalized hole, and the hole wall of the metalized hole is longitudinally blocked by the truncation hole to form at least two network connection layers. By the processing method, the connection of a plurality of network circuits is formed in one metalized hole, so that the processing method has the advantages of high integration ...

Подробнее
Номер записи: 29
17-08-2011 дата публикации

Method for fixing magnetic core in PCB (Printed Circuit Board) taphole

Номер: CN0101772275B
Автор: KONG LINGWEN, MIAO HUA, PENG QINWEI, ZHU ZHENGTAO, LINGWEN KONG, HUA MIAO, QINWEI PENG, ZHENGTAO ZHU
Принадлежит:

The invention discloses a method for fixing a magnetic core in a PCB (Printed Circuit Board) taphole. The method comprises the following steps of: (1) material preparation: preparing a core plate; (2) drilling: drilling a through hole and a depth control hole on the core plate, wherein the through hole and the depth control hole form a step hole, and the diameter of the through hole is smaller than that of the depth control hole; (3) magnetic core placement: placing a magnetic core on the step of the step hole of the core plate and filling resin in the magnetic core, wherein the magnetic coreis arranged in the depth control hole; and (4) press-fitting: sequentially press-fitting a prepreg and a copper foil on the surface of the core plate. In the method, the magnetic core is directly placed in the step hole of the core plate, i.e. the magnetic core is fixed by utilizing the step of the step hole, the magnetic core is firmly fixed, and resin is conveniently to fill in the magnetic core.

Подробнее
Номер записи: 30
15-04-2015 дата публикации

Fingerprint sensor encapsulation method and structure

Номер: CN104517862A
Автор: LI GUANHUA, JIANG JING, DING KUNPENG, BAO PINGHUA, PENG QINWEI, KONG LINGWEN
Принадлежит:

The invention discloses a fingerprint sensor encapsulation method. The fingerprint sensor encapsulation method includes the following steps that: a substrate with a groove is manufactured, and at least one metal bar which adjoins or is adjacent to the groove is manufactured on the surface of the substrate; a fingerprint sensor is fixed in the groove, and pins of the fingerprint sensor are connected onto gold finger pads on the surface of the substrate through leads based on lead bonding; lead bonding portions on the surface of the substrate are encapsulated with an insulation material, wherein the lead bonding portions include the gold finger pads, the pins of the fingerprint sensor and the leads. The embodiment of the invention also provides a corresponding fingerprint sensor encapsulation structure. According to the technical scheme of the invention, a metal frame is not required to be installed in a surface-mount manner, and therefore, production process is simplified, and the encapsulation ...

Подробнее
Номер записи: 31
16-11-2011 дата публикации

Manufacturing method of chip embedded type printed circuit board

Номер: CN0102244018A
Автор: XIN GU, DEBO LIU, QINWEI PENG, LINGWEN KONG, GU XIN, LIU DEBO, PENG QINWEI, KONG LINGWEN
Принадлежит:

The invention is applicable to the field of printed circuit boards and provides a manufacturing method of a chip embedded type printed circuit board. The manufacturing method comprises the following steps of: firstly, forming a first metal electrode (namely a metal welding disk) with a height of 0.3 to 0.5 microns on a wafer; secondly, electroplating a second metal electrode (generally a copper electrode) with a height of 60 to 100 microns on the first metal electrode; and finally, embedding a chip into an insertion hole of a core plate, wherein electric connection between the chip and an outer circuit of the printed circuit board is realized through the second metal electrode on the chip instead of a conductive medium formed by laser-processing and electroplating a blind hole; therefore,the limit of the blind hole laser-processing and electroplating capability is broken through and the manufacturing cost of the embedded type circuit board is reduced obviously.

Подробнее
Номер записи: 32
06-04-2011 дата публикации

Method for rolling PCB

Номер: CN0101699939B
Автор: YUAN WEIQUN, ZHANG SONGFENG, KONG LINGWEN, PENG QINWEI, WEIQUN YUAN, SONGFENG ZHANG, LINGWEN KONG, QINWEI PENG
Принадлежит:

The invention relates to a method for rolling a PCB, which comprises the following steps: providing laminae of the PCB and providing a rolling element; coating a parting agent at the notching part of the outmost lamina and around the surface of rolling element, and drying the parting agent to form an isolating membrane; laminating the laminae; brushing and cleaning away recessed resin and the insulating membrane; and performing post-treatment processing to manufacture the PCB. In the method, the parting agent is coated on the outer layer of the circuit board and the surface of the rolling element to form the thin isolating membrane and during pressing, the overflowing recessed resin gathers on the insolating membrane to be separated from the circuit board and completely removed from the circuit board easily. The method can completely solve the resin recession problem and reduce the cost of the removal of the recessed resin from the circuit board at the same time.

Подробнее
Номер записи: 33
16-05-2012 дата публикации

Manufacturing method of sheet printed circuit board and sheet printed circuit board

Номер: CN0101877938B
Автор: ZHANG JIANCHAO, YANG ZHIQIN, LIU JIANHUI, PENG QINWEI, KONG LINGWEN, JIANCHAO ZHANG, ZHIQIN YANG, JIANHUI LIU, QINWEI PENG, LINGWEN KONG
Принадлежит:

The embodiment of the invention relates to a manufacturing method of a sheet printed circuit board. The sheet printed circuit board comprises a medium interlayer provided with a first board surface and a second board surface which are adjacent to each other, wherein the first board surface is provided with a first non-graphic region, and the second board surface is provided with a second non-graphic region. The manufacturing method of the sheet printed circuit board comprises the following steps of: laying a group of first copper strips in the first non-graphic region, and laying a group of second copper strips vertical to the first copper strips in the length direction in the second non-graphic region. The embodiment of the invention also provides the sheet printed circuit board. By adopting the manufacturing method of the sheet printed circuit board and the sheet printed circuit board in the embodiment of the invention, stress generated by the medium interlayer of the sheet printed circuit ...

Подробнее
Номер записи: 34
11-01-2012 дата публикации

Test method for bonding force of PCB (Printed Circuit Board) embedded metal base

Номер: CN0101893545B
Автор: XIANG HONGBO, JIANG JING, XIE ZHANHAO, KONG LINGWEN, PENG QINWEI, HONGBO XIANG, JING JIANG, ZHANHAO XIE, LINGWEN KONG, QINWEI PENG
Принадлежит:

The invention discloses a method for testing bonding force of a PCB (Printed Circuit Board) embedded metal base, comprising the following steps of: a, preparing a PCB sample, a pressure sensor, a fixture and a universal material test machine; b, installing the pressure sensor; c, arranging the sample; d, starting the universal material test machine and the control software thereof to obtain the test data; and e, obtaining the thrust strength. The invention provides a test method of a three-point bending model to test the bonding force between the embedded metal base and the PCB; by mainly utilizing the load measurement and the displacement recording function of the universal material test machine, the bonding force between the large-size embedded metal base and the PCB is effectively evaluated; thereby, the invention provides a new solution for evaluating and testing the similar boards and the products with the similar structures.

Подробнее
Номер записи: 35
10-08-2011 дата публикации

Circuit board processing method and circuit board

Номер: CN0101707854B
Автор: GAO WENSHUAI, KONG LINGWEN, LIU YICHAO, PENG QINWEI, SHI GENGCAI, WENSHUAI GAO, LINGWEN KONG, YICHAO LIU, QINWEI PENG, GENGCAI SHI
Принадлежит:

The embodiment of the invention relates to a circuit board processing method, wherein at least two subboards provided with via holes are adhered through a bonding structure provided with conducting material and a cavity; the conducting material is used for connecting the via holes; the cavity is used for the diffusion filling of the conducting material; and the positions of the via holes, the conducting material and the cavity are arranged correspondingly. The embodiment of the invention also provides a circuit board. The adoption of the circuit board processing method and the circuit board can avoid short circuit problem caused by the easy diffusion of overmuch conducting material along the gap between a bonding sheet and subboards, extends the using range of Z-direction connecting and processing method of the circuit board, reduces the hole pitch among the subboards, is beneficial to improving the overall density of the circuit board, and has high yield, low rejection rate and low cost ...

Подробнее
Номер записи: 36
14-04-2010 дата публикации

Method for processing multilayer printed circuit board

Номер: CN0101695224A
Автор: Kong Lingwen, Peng Qinwei, Miao Hua, Zhu Zhengtao
Принадлежит:

The invention relates to a method for processing a multilayer printed circuit board. The multilayer printed circuit board comprises at least two subsidiary boards. The method comprises the following steps: first, boring holes on the subsidiary boards to form through holes, blind holes and/or wiring holes, implementing copper precipitation and electroplating for the through holes, blind holes and/or wiring holes, overlapping the subsidiary boards to form a multilayer core board body; second, binding a metal sheet on the bottom face of the multilayer core board body, covering the openings of the metal sheet on the through holes, blind holes and/or wiring holes arranged on the bottom face of the multilayer core board body; third, implementing copper precipitation, electroplating and pattern production for the multilayer core board body, externally texturing the metal sheet on the bottom face of the multilayer core board body; fourth, milling a step groove on the top face of the multilayer ...

Подробнее
Номер записи: 37
30-03-2011 дата публикации

Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin

Номер: CN0101500376B
Автор: PENG QINWEI, SHI GENGCAI, KONG LINGWEN, QINWEI PENG, GENGCAI SHI, LINGWEN KONG
Принадлежит:

The invention discloses a method for adopting a double head pressure contact pin to produce a multi-layer plate for a multi-layer dead hole. A backboard is divided into a plurality of sub-plates. When the sub-plates is produced by hole drilling, galvanization, surface treatment and other procedures, the double head pressure contact pin is used for pressing and being connected with an upper sub-plate and a lower sub-plate for purpose of lamination and press so as to finally form a motherboard. The holes at corresponding positions of the upper sub-plate and the lower sub-plate can together forman integral through hole though the double head pressure contact pin. The other holes in which no contact pins are inserted are dead holes. The pressed plates can be used directly without wet treatment. The invention can improve the contraposition, drilling and galvanization of the high multi-layer backboard, solves the problem on the protection of mechanical dead holes, optimizes the backboard production ...

Подробнее
Номер записи: 38
12-12-2007 дата публикации

PCB plate double-face drilling and positioning method

Номер: CN0101085472A
Автор: WU FENGWU, PENG QINWEI, LIANG FEI, FENGWU WU, QINWEI PENG, FEI LIANG
Принадлежит:

The PCB dual surface drilling positioning has at least four positioning holes on the board, positioning pins on the drilling fixture or drilling platform opposite to the positioning holes, with the positioning pins and the holes matching with each other to fix the PCB board when it drills from either positive or negative side of the board.It can use the interference principle of positioning, reduce the deviation of two positioning zero points, with high positioning precision, and increased in drilling efficiency and yield rate.

Подробнее
Номер записи: 39
17-03-2010 дата публикации

Mother board and method for processing mother board

Номер: CN0101674708A
Автор: KONG LINGWEN, PENG QINWEI, XIONG JIA, CUI RONG, LINGWEN KONG, QINWEI PENG, JIA XIONG, RONG CUI
Принадлежит:

The embodiment of the invention relates to a mother board which is formed by lamination of two subboards with through holes; the surface of each through hole is covered with bottom copper needed by forming a circuit; each through hole independently forms a blind hole on the mother board; and each layer of bottom copper is covered with nickel-copper-nickel interlayer. In addition, the embodiment ofthe invention also provide a method for processing the mother board; by adopting the embodiment of the invention, the nickel-copper-nickel interlayer can protect the completeness for covering the bottom copper on the surface of the through hole of the subboard, and increase the reliability of hole copper; in addition, as all the blind holes can be plugged by devices independently, the informationcapacity of a circuit board can be increased greatly under the condition of same layer/thickness of the circuit board.

Подробнее
Номер записи: 40
03-02-2010 дата публикации

Processing method of printing circuit board blind hole

Номер: CN0101640983A
Автор: PENG QINWEI, CUI RONG, XIONG JIA, QINWEI PENG, RONG CUI, JIA XIONG
Принадлежит:

The invention relates to a processing method of a printing circuit board blind hole, comprising the following processing steps: a plurality of through holes are respectively drilled on each daughter board, copper is respectively plated on the inner wall of each through hole and then a circuit and a welding disc are etched on each daughter board; a semi-curing plate is respectively bonded on each daughter board and holes are processed on the semi-curing plate positioned on the top surface of each daughter board; the semi-curing plate positioned on the bottom surface of each daughter board covers the whole bottom surface of the daughter board; a copper foil is respectively bonded on the semi-curing plates on the bottom surface and the top surface of each daughter board, the daughter boards bonded with the semi-curing plate are laminated under high temperature; the copper foil of the semi-curing plate at the position of the bottom surface of each daughter board is removed, a gummosis semi-curing ...

Подробнее
Номер записи: 41
09-11-2011 дата публикации

Method for processing inductor-embedded circuit board

Номер: CN0101795539B
Автор: KONG LINGWEN, MIAO HUA, PENG QINWEI, ZHU ZHENGTAO, LINGWEN KONG, HUA MIAO, QINWEI PENG, ZHENGTAO ZHU
Принадлежит:

The invention discloses a method for processing an inductor-embedded circuit board, which comprises the following steps: 1) preparing materials: preparing a core plate and a first prepreg; 2) drilling holes: drilling a first through hole on the core plate and drilling a second through hole on the first prepreg, wherein the diameter of the second through hole is more than zero and less than or equal to the sum of the diameter of the first through hole and 10mm; 3) placing a magnetic core with an inner hole: placing the magnetic core in the first through hole of the core plate; 4) performing the first pressing: pressing the first prepreg on the first surface of the core plate, wherein the first prepreg contacts the magnetic core, and the inner hole of the magnetic core is communicated with the second through hole; 5) filling: filling resin in the inner hole of the magnetic core; and 6) performing the second pressing: pressing a second prepreg and a copper foil on the second surface of the ...

Подробнее
Номер записи: 42
12-02-2014 дата публикации

Processing method of PCB and PCB

Номер: CN103582297A
Автор: XIE ZHANHAO, PENG QINWEI, KONG LINGWEN
Принадлежит:

The embodiment of the invention discloses a processing method of a PCB and the PCB. The processing method of the PCB comprises the steps that an annular groove containing an inductance core is formed in a first board set, and the annular groove comprises a blind groove part; the inductance core is arranged in the annular groove formed in the first board set; an insulating layer is arranged on a board surface corresponding to an opening of the blind groove part in the first board set or a board surface corresponding to an opening of the annular groove, and a conductive layer is arranged on the insulating layer; a plurality of blind holes and/or through holes with conducting materials are formed inside and outside a ring of the annular groove in the first board set, a circuit pattern is arranged on the conductive layer, so that the conducting materials arranged in the blind holes and/or the through holes and the circuit pattern on the first board set form an inductive winding which surrounds ...

Подробнее
Номер записи: 43
11-06-2014 дата публикации

Manufacturing method for multilayer circuit board and circuit board

Номер: CN103857212A
Автор: DING KUNPENG, HUANG MIAN, KONG LINGWEN, PENG QINWEI
Принадлежит:

The invention discloses a manufacturing method for a multilayer circuit board. The manufacturing method comprises that: an isolation layer is arranged on a line layer of the surface of a lamination plate, and material of the isolation layer is teflon; plate-matching lamination is performed on the lamination plate so that the multilayer circuit board is formed, and the isolation layer is laminated in the multilayer circuit board; a through hole is drilled on the multilayer circuit board, and the through hole penetrates through the isolation layer; and the through hole is copper-plated and electroplated, a first conductive layer is formed on the internal wall, which is arranged above the isolation layer, of the through hole, a second conductive layer is formed on the internal wall, which is arranged below the isolation layer, of the through hole, and the first conductive layer and the second conductive layer are disconnected at the position of the internal wall, which is arranged at the isolation ...

Подробнее
Номер записи: 44
17-06-2015 дата публикации

Film resistor material, film resistor and preparation method of film resistor

Номер: CN104711455A
Автор: FU ZHIZHUN, LIU DEBO, PENG QINWEI
Принадлежит:

The present invention provides a film resistor material, which comprises 50-99.5 wt% of Ni, 0.5-40 wt% of Cu, and 0-40 wt% of M, wherein M is one or a plurality of materials selected from Al, Zn, Ti, V, Mn, Fe, Ta, Mo, Ru, Cr, Si, Pt and C. The present invention further provides a film resistor and a preparation method thereof. The film resistor material of the present invention contains Cu with the high temperature-stability so as to reduce the resistance temperature change coefficient of the film resistor, such that the change amplitude of the resistance value of the film resistor along with the temperature change is low. In addition, the film resistor material contains the Ni, and the Ni-Cu-Cr alloy has characteristics of high temperature-stability, low resistance temperature coefficient, and high sheet resistance value under the same membrane thickness condition.

Подробнее
Номер записи: 45
05-10-2011 дата публикации

Circuit board processing method and circuit board

Номер: CN0101699938B
Автор: KONG LINGWEN, PENG QINWEI, YUAN WEIQUN, CHEN YUCHUN, ZHANG JIAHU, LINGWEN KONG, QINWEI PENG, WEIQUN YUAN, YUCHUN CHEN, JIAHU ZHANG
Принадлежит:

The embodiment of the invention relates to a circuit board processing method, and comprises obtaining high frequency materials provided with power amplification slot, and a board which is provided with a high frequency zone, a digital zone, a radio frequency zone, a protective card zone and a power supply zone, and is set type; the high frequency materials are mixed and pressed into the high frequency zone. The embodiment of the invention also provides a circuit board. With the adoption of the circuit board processing method and the circuit board of the embodiment of the invention, the functions of digital, radio frequency, protective card zone, power supply, and power amplifier can be simultaneously integrated on the circuit board, thus effectively reducing the number and area of used circuit boards, simplifying electronic assembly, and lowering cost of circuit boards.

Подробнее
Номер записи: 46
29-06-2011 дата публикации

Manufacturing process of waveguide slot

Номер: CN0102110866A
Автор: WEIQUN YUAN, LINGWEN KONG, QINWEI PENG, YUAN WEIQUN, KONG LINGWEN, PENG QINWEI
Принадлежит:

The invention provides a manufacturing process of a waveguide slot, which is suitable for the manufacturing field of a PCB board. In the manufacturing process provided by the invention, a tin coating which is disposed outside the bottom of a groove is burn off by laser while a copper coating inside the bottom of the groove is not removed due to the difference between the absorption rates of tine and copper to laser and the difference between the energy requirements for burning tin and copper with laser, so that the laser can be prevented from reaching to a core plate under the copper coating;then the copper coating inside the bottom of the groove is removed by etching, a tin coating disposed outside the side wall of the groove is removed by means of a common process method, a protection player is subsequently coated on a copper coating which is disposed inside the side wall of the groove, so that a waveguide slot of which the side walls are provided with metal layers (a copper coating and ...

Подробнее
Номер записи: 47
23-11-2011 дата публикации

Passive device, passive device-embedded circuit board and manufacturing method

Номер: CN0102254885A
Автор: WEIQUN YUAN, LINGWEN KONG, QINWEI PENG, YUAN WEIQUN, KONG LINGWEN, PENG QINWEI
Принадлежит:

The invention provides a passive device used for manufacturing an embedded circuit board, a method for manufacturing the circuit board by embedding the passive device and a passive device-embedded circuit board manufactured by the method. Two external electrodes of the passive device provided by the invention cover most of areas on the upper and lower surfaces of the passive device respectively. When the passive device is embedded to manufacture the circuit board, the problems of high requirements on the accuracy of alignment between holes and the electrodes of the passive device, difficulties in machining and high error proneness when the passive device is fixed in the substrate and perforated to lead the electrodes out after lamination in the prior art are solved. By the passive device and the manufacturing method provided by the invention, the passive device-embedded circuit board with high quality and percent of pass can be rapidly manufactured.

Подробнее
Номер записи: 48
19-01-2011 дата публикации

Processing method of printing circuit board blind hole

Номер: CN0101640983B
Автор: PENG QINWEI, CUI RONG, XIONG JIA, QINWEI PENG, RONG CUI, JIA XIONG
Принадлежит:

The invention relates to a processing method of a printing circuit board blind hole, comprising the following processing steps: a plurality of through holes are respectively drilled on each daughter board, copper is respectively plated on the inner wall of each through hole and then a circuit and a welding disc are etched on each daughter board; a semi-curing plate is respectively bonded on each daughter board and holes are processed on the semi-curing plate positioned on the top surface of each daughter board; the semi-curing plate positioned on the bottom surface of each daughter board covers the whole bottom surface of the daughter board; a copper foil is respectively bonded on the semi-curing plates on the bottom surface and the top surface of each daughter board, the daughter boards bonded with the semi-curing plate are laminated under high temperature; the copper foil of the semi-curing plate at the position of the bottom surface of each daughter board is removed, a gummosis semi-curing ...

Подробнее
Номер записи: 49
22-10-2014 дата публикации

Embedded circuit board and manufacture method thereof

Номер: CN104113983A
Автор: DING KUNPENG, XIONG YANCHUN, PENG QINWEI, KONG LINGWEN
Принадлежит:

The invention discloses an embedded circuit board manufacture method comprising: fixing electronic components on a first copper foil layer and producing positioning bonding pads used for position identification; laminating an insulating layer and a second copper foil layer on the first copper foil layer in order that the electronic components are embedded between the first copper foil layer and the second copper foil layer; drilling through holes on the positioning bonding pads by identifying the positioning bonding pads in order to form targets; performing positioning with the targets and processing line patterns or via holes on the first copper foil layer and the second copper foil layer, wherein the line patterns or via holes are connected with the bonding pads of the electronic components. The embodiment of the invention also provides a corresponding embedded circuit board. According to the embedded circuit board manufacture method, positional information inside the circuit board, such ...

Подробнее
Номер записи: 50
05-08-2009 дата публикации

Method for producing high multilayered blind hole multilayer board by double head pressing insertion pin

Номер: CN0101500376A
Автор: PENG QINWEI, SHI GENGCAI, KONG LINGWEN, QINWEI PENG, GENGCAI SHI, LINGWEN KONG
Принадлежит:

The invention discloses a method for adopting a double head pressure contact pin to produce a multi-layer plate for a multi-layer dead hole. A backboard is divided into a plurality of sub-plates. When the sub-plates is produced by hole drilling, galvanization, surface treatment and other procedures, the double head pressure contact pin is used for pressing and being connected with an upper sub-plate and a lower sub-plate for purpose of lamination and press so as to finally form a motherboard. The holes at corresponding positions of the upper sub-plate and the lower sub-plate can together form an integral through hole though the double head pressure contact pin. The other holes in which no contact pins are inserted are dead holes. The pressed plates can be used directly without wet treatment. The invention can improve the contraposition, drilling and galvanization of the high multi-layer backboard, solves the problem on the protection of mechanical dead holes, optimizes the backboard production ...

Подробнее
Номер записи: 51
26-05-2010 дата публикации

Micro-strip antenna filter structure and manufacturing method thereof

Номер: CN0101714684A
Автор: LINGWEN KONG, HUA MIAO, QINWEI PENG, ZHENGTAO ZHU, KONG LINGWEN, MIAO HUA, PENG QINWEI, ZHU ZHENGTAO
Принадлежит:

The invention discloses a micro-strip antenna filter structure, which comprises a micro-strip antenna arranged on a circuit board and metal cavities on three surfaces. The circuit board comprises three layers of boards of which each layer is combined through a medium layer; the middle layer of board of the circuit board is provided with a fracture, the metal cavities are embedded into the circuit board from the fracture, the metal cavities and the upper surface of the lower layer of board of the circuit board form a closed space, and the micro-strip antenna is fixed on the upper surface of the lower layer of board and is positioned in the closed space. The micro-strip antenna filter structure is made by the following steps: an opening step, a cavity-burying step, a micro-strip antenna assembling step, a pressing step in which the middle layer of board embedded with the metal cavities and the lower layer of board assembled with the micro-strip antenna are pressed through the medium layer ...

Подробнее
Номер записи: 52
04-08-2010 дата публикации

Method for processing inductor-embedded circuit board

Номер: CN0101795539A
Автор: KONG LINGWEN, MIAO HUA, PENG QINWEI, ZHU ZHENGTAO, LINGWEN KONG, HUA MIAO, QINWEI PENG, ZHENGTAO ZHU
Принадлежит:

The invention discloses a method for processing an inductor-embedded circuit board, which comprises the following steps: 1) preparing materials: preparing a core plate and a first prepreg; 2) drilling holes: drilling a first through hole on the core plate and drilling a second through hole on the first prepreg, wherein the diameter of the second through hole is more than zero and less than or equal to the sum of the diameter of the first through hole and 10mm; 3) placing a magnetic core with an inner hole: placing the magnetic core in the first through hole of the core plate; 4) performing the first pressing: pressing the first prepreg on the first surface of the core plate, wherein the first prepreg contacts the magnetic core, and the inner hole of the magnetic core is communicated with the second through hole; 5) filling: filling resin in the inner hole of the magnetic core; and 6) performing the second pressing: pressing a second prepreg and a copper foil on the second surface of the ...

Подробнее
Номер записи: 53
05-01-2011 дата публикации

Method for detecting reliability of printed circuit board (PCB) product with metal substrate

Номер: CN0101936954A
Автор: JING JIANG, HONGBO XIANG, LINGWEN KONG, QINWEI PENG, JIANG JING, XIANG HONGBO, KONG LINGWEN, PENG QINWEI
Принадлежит:

The embodiment of the invention discloses a method for detecting the reliability of a printed circuit board (PCB) product with a metal substrate, which comprises the following steps of: a, performing transmission-mode scanning on the PCB product with the metal substrate by adopting ultrasonic scanning equipment, finishing the detection if the layering and blistering of the PCB product with the metal substrate are detected, otherwise, entering a step b; b, performing simulation on the reflow soldering test, soldering station test, thermal cycle test and constant-temperature and constant-humidity aging test of the PCB product with the metal substrate; and c, performing the transmission-mode scanning on the PCB product with the metal substrate by adopting the ultrasonic scanning equipment. In the reliability detection method provided by the embodiment of the invention, two failure modes of the PCB product with the metal substrate are taken into full account, test simulation is performed on ...

Подробнее
Номер записи: 54