Method for preparing ceftizoxime sodium

The invention relates to synthetic ceftizoxime acid and a method for preparing ceftizoxime sodium from the synthetic ceftizoxime acid. The preparation process comprises the following steps: slowly adding a crystallization solvent in a crystallization liquid until the crystallization liquid becomes slightly turbid, stopping adding the solvent, slowly stirring and growing crystals for 0.5 hour, continuously adding the residual solvent, and stirring and growing the crystals for 1 hour after the residual solvent is completely added. The product prepared by the optimized process in the invention has remarkably improved quality although the yield is lowered by 1.0-1.5%; and the product crystallization state is obviously improved and the product quality problem of clarity stability in the period of validity is solved.

BIOSENSOR FOR DETECTING INHIBITORS OF AMMONIA OXIDATION WHICH INHIBITS ERRORS OF ANALYSIS BY CBOD, IMPROVES DETECTION SPECIFICITY AND SENSITIVITY, AND PERFORMS REAL-TIME MONITORING

PURPOSE: A biosensor for detecting inhibitors of ammonia oxidation is provided to inhibit the errors of analysis by CBOD(carbonaceous BOD), improve the detection specificity and sensitivity, and perform the real-time monitoring. CONSTITUTION: The biosensor for detecting inhibitors of ammonia oxidation comprises a DO probe containing a membrane immobilizing microorganisms and measures oxygen uptake rate of the immobilized microorganisms to evaluate ammonia oxidation inhibition, wherein the microorganism is Nitrosomonas europaea; the microorganisms are immobilized into the membrane by performing filtering microorganisms with a 12,000 to 16,000 Dalton of dialysis membrane under vacuum; and the ammonia concentration in the sample to be detected is 50mg N/L. © KIPO 2006 ...

Jet dredging pipe cleaner

The invention discloses a jet dredging pipe cleaner which comprises a pipe cleaner body (1) with the outline in a cylinder shape, an annular pipe cleaner scraping plate (2) is arranged on the periphery of the pipe cleaner body (1), a fluid channel (3) penetrates the pipe cleaner body (1), a jet port (4) is formed in the fluid channel (3) at the position of the tail end of the pipe cleaner body (1), a pressure control valve (5) for controlling on-off of the fluid channel (3) is arranged on the pipe cleaner body (1), is opened when the head end fluid pressure of the pipe cleaner body (1) is higher than a preset value and is closed when the head end fluid pressure of the pipe cleaner body (1) is lower than the preset value. By using the jet dredging pipe cleaner to conduct pipe cleaning operation, risks of subsea pipe blocking in subsea pipe cleaning operation are greatly reduced, and subsea pipe blocking removing cost and blocking removing uncertainties are reduced. The pipe cleaner is simple ...

Construction and application of model for differentiating stem cells into testicular interstitial cells

The invention provides a method for constructing a model of oriented differentiation of embryonic stem (ES) cells into testicular interstitial cells. The method comprises the following steps of: firstly, cotransfecting a steroidogenic factor 1 and a luteinizing hormone receptor plasmid into an ES cell; then inducing the ES cell by a compound or growth factor to directionally differentiate the ES cell into the testicular interstitial cell. In the invention, the construction and the application of the model for in-vitro oriented differentiation of the stem cells into the testicular interstitialcells are demonstrated at the cellular level; a great deal of biology information is discussed initially; the constructed cell model is a substituted model for researching the influencing factor of the secretory regulation function of the testicular interstitial cell and can be used for initially selecting and evaluating the medical effect of the pharmaceutical drug using the testicular interstitial ...

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides and equilong connecting finger patterns on the PCB; (2) screen-printing conductive ink; (3) sticking an anti-plating adhesive tape to the non-gold plating area; (4) utilizing the conductive ink as the gold-plating lead to plate gold on the equilong connecting fingers; (5) tearing off the anti-plating adhesive tape; (6) removing the conductive ink; and (7) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not arranged on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden trouble of reliability of the areas of the connecting fingers in long-term use because the gold-plating leads are not thoroughly removed ...

PIM kinase inhibitors

The invention provides a compound with a structure as shown in a general formula (I), a deuterated substance, a stereoisomer or a pharmaceutically acceptable salt thereof, a pharmaceutical composition containing the compound and application of the compound and the deuterated substance, the stereoisomer or the pharmaceutically acceptable salt. The compound provided by the invention has a good PIM kinase inhibition effect, is a novel, high-activity and low-toxicity ideal PIM inhibitor, can be used for treating and/or preventing diseases such as hematoma such as acute myelogenous leukemia, myelofibrosis and chronic lymphocytic leukemia, solid tumors such as gastric cancer and prostate cancer, and has a wide application prospect.

Method for enrichment culture of nitrifying bacteria by using anaerobic digestion supernatant

The invention discloses a method for enrichment culture of nitrifying bacteria by using anaerobic digestion supernatant, which comprises the following steps of: mixing seed sludge and supernatant subjected to sludge anaerobic digestion according to a volume ratio of 1:7, and adding sodium bicarbonate to make the concentration of sodium bicarbonate in culture solution 0.5g/L; culturing and measuring the concentration of ammonia nitrogen every day; ending enrichment culture of the first generation of nitrifying bacteria when the concentration of ammonia nitrogen in the culture solution is lower than 70mg/L; centrifuging residual culture solution subjected to the first-generation culture for 20 minutes at a rotating speed of 8,000 revolutions per minute by using a high speed centrifuge, and discarding the supernatant, using the residual sludge as the seed sludge for enrichment culture of the second generation of nitrifying bacteria; and performing the enrichment culture of five generations ...

Process for manufacturing local gold-plated board

The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: using a dry film to carry out primary outer layer patterning on a printed circuit board (PCB) and using etchant solution to etch out all the patterns in the board; laying copper conductors at the joint of a gold-plated area and a non-gold-plated area; adopting transient high pulsed voltage to melt part of the copper conductors to ensure the copper conductors to be electrically connected with the gold-plated area; using the dry film to carry out secondary outer layer patterning on the non-gold-plated area of the PCB with the copper conductors to protect the non-gold-plated area; electroplating gold on the gold-plated area of the PCB; and removing the dry film on the non-gold-plated area and tearing off the copper conductors, wherein the patterns in the board are provided with the gold-plated area and the non-gold-plated area. By etching all the patterns in the board once ...

Process for manufacturing whole gold-plated board

The invention discloses a process for manufacturing a whole gold-plated board. The process comprises the following steps: a. making all the patterns in the board and a conductive auxiliary frame on the circuit board once; b. hot-pressing leads for gold plating on auxiliary gold-plated areas so that the leads for gold plating are connected with the auxiliary gold-plated areas; c. adopting the leads for gold plating for conduction to plate gold on gold-plated areas on the circuit board; and d. removing the hot-pressed leads for gold plating and carrying out solder resist on the auxiliary gold-plated areas to ensure the auxiliary gold-plated areas to be solder resist non-conductive areas, wherein the patterns in the board are provided with the gold-plated areas and the auxiliary gold-plated areas; the conductive auxiliary frame is not connected with the patterns in the board; the auxiliary gold-plated areas are connected with the gold-plated areas; and the gold-plated areas are connected with ...

Variable-frequency energy-saving optimization system and optimization method for hydraulic machine

The invention provides a hydraulic machine frequency conversion energy-saving optimization system and optimization method.The hydraulic machine frequency conversion energy-saving optimization system comprises a frequency converter, a metronome and a frequency conversion optimization device, the metronome is electrically connected with the frequency conversion optimization device and used for detecting working beats under different frequencies and transmitting the frequencies and the corresponding working beats to the frequency conversion optimization device, and the frequency conversion optimization device is electrically connected with the metronome; the frequency conversion optimization device is in communication connection with the frequency converter and is used for sending a control instruction to the frequency converter according to the working rhythm and the frequency, and the frequency converter is used for receiving the control instruction and controlling the output frequency.

Method of PCB board processing technology

The invention discloses a method of a PCB board processing technology, which comprises the following steps: drilling a PCB board; electroplating; manufacturing outer-layer graphs; electroplating graphs; carrying out first back drilling on a through hole by a drill bit the diameter of which is the same as that of the drilled through hole; then adopting a drill bit the hole diameter of which is thesame as that of the back drilling hole to carry out second back drilling, wherein the first back drilling depth and the second back drilling depth are both the required specified depth; and etching. The invention carries out back drilling on the through hole at twice, resin dust generated in the drilling process can be discharged via a dust absorption system of a drilling machine in time, and residual copper cuttings and tin cuttings in the through hole can be removed by a etching solution so as to reduce the situations that the back drilling hole is blocked and the processing efficiency and the ...

Crushing apparatus capable of simultaneously performing drying

Provided is a crushing apparatus capable of simultaneously performing drying, said apparatus comprising a drying unit and a crushing unit, the drying unit comprising a heat-carrying tube (16) and a heat source, the crushing unit comprising a crushing chamber (2), a material inlet (15), a material outlet and a crushing tool, the material inlet (15) and the material outlet being respectively arranged above and below the crushing chamber (2), the heat-carrying tube (16) and the crushing tool being arranged within the crushing chamber (2), the heat-carrying tube (16) being hollow, a bottom portion being provided with an opening, heat-carrying gas provided by the heat source entering into the crushing chamber (2) via the heat-carrying tube (16). The crushing apparatus simultaneously performs drying and crushes a material without being additionally provided with a drying chamber, prevents dust produced by the material from polluting the environment during the crushing process, prevents the material from adhering to inner walls of the crushing chamber, and implements high-efficiency material crushing and drying.

Method for superposition positioning of multilayer circuit board

The invention belongs to the field of circuit board manufacturing, and especially relates to a method for superposition positioning of a multilayer circuit board. The method comprises the following steps: preparing internal layer core plates, copper foil and prepregs; arranging positioning holes at the intermediate position of each edge on the internal layer core plates in a penetrating mode; arranging punched holes at positions, which are opposite to the positioning holes, on the copper foil and the prepregs; binding all the internal layer core plates in a binding machine to form one body; through pins arranged on a tool plate, fixing kraft paper, thermal insulation steel plates, the copper foil, the prepregs and the internal core plates which are bound to form one body on the tool plate; and sending the fixed copper foil, the prepregs and the internal layer core plates to a press machine for stitching. According to the invention, each assembly on the multilayer circuit board is positioned ...

Method and device for filtering dust by adopting nuclear track membrane

The invention belongs to the technical field of labor protection methods and devices, and provides a method and a device for filtering dust by adopting a nuclear track membrane. The device for filtering dust by adopting a nuclear track membrane comprises a protection helmet, a head fixing bracket, a nuclear track membrane filter system, an air compression system and a dustproof mask; and the internal part of the protection helm is provided with the head fixing bracket. The invention is characterized in that the aperture of the nuclear track membrane is 0.5-2 mum; the nuclear track membrane filter system is fixed in the head fixing bracket and connected with the air compression system which is fixed outside the protection helmet through a gas-guide tube ; the air compression system compresses clean air filtered by the nuclear track membrane and sprays the clean air into the dustproof mask through an air supply delivery tube; the air pressure in the protection mask is kept in the range of ...

PCB scanning test device

The invention relates to the technical field of PCB testing, in particular to a PCB scanning testing device which comprises a testing seat and a scanning testing assembly, the scanning testing assembly comprises a support, two lifting units, a connecting plate, a sliding unit, a testing plate and a plurality of probes, the support is fixedly connected with the testing seat and located above the testing seat, and the testing seat is fixedly connected with the connecting plate. The two lifting units are sequentially arranged on the support, the connecting plate is arranged between the two lifting units, the sliding unit is arranged on the connecting plate, the testing plate is arranged on the sliding unit, the multiple probes are fixedly connected with the testing plate and sequentially distributed below the testing plate, and a PCB is placed on the testing seat. The connecting plate and the testing plate are driven by the lifting unit to move downwards, the probes move downwards to be in ...

Process for manufacturing local gold-plated board

The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: making all the patterns in the board on a circuit board once; simultaneously manufacturing an outer layer lead and conductive auxiliary edges as the gold-plated leads; sticking protective dry films to non-gold-plated areas and the outer layer lead for protection; using the outer layer lead as the gold-plated lead to plate gold on gold-plated areas; removing the protective dry films on the non-gold-plated areas; and removing the outer layer lead by adopting the laser fixed spot fuse process, wherein the patterns in the board are provided with the gold-plated areas and the non-gold-plated areas; the two ends of the outer layer lead are connected with the conductive auxiliary frame and the gold-plated areas; and the temperature of the laser fixed spot fuse is 1100 DEG C. By etching all the patterns in the board once, manufacturing the outer layer lead as the gold-plated ...

Process for manufacturing whole gold-plated board

The invention discloses a process for manufacturing a whole gold-plated board. The process comprises the following steps: a. making all the patterns in the board and a conductive auxiliary frame on the circuit board once; b. hot-pressing leads for gold plating on auxiliary gold-plated areas so that the leads for gold plating are connected with the auxiliary gold-plated areas; c. adopting the leads for gold plating for conduction to plate gold on gold-plated areas on the circuit board; and d. removing the hot-pressed leads for gold plating and carrying out solder resist on the auxiliary gold-plated areas to ensure the auxiliary gold-plated areas to be solder resist non-conductive areas, wherein the patterns in the board are provided with the gold-plated areas and the auxiliary gold-plated areas; the conductive auxiliary frame is not connected with the patterns in the board; the auxiliary gold-plated areas are connected with the gold-plated areas; and the gold-plated areas are connectedwith ...

Full gold-plated board manufacturing technology

The invention discloses a full gold-plated board manufacturing technology, which comprises the following steps of: a) making all in-board patterns with gold plating areas and outer leads on the surface of a circuit board at one step, wherein all gold plating areas are interconnected through the outer leads; b) attaching protective dry films onto the outer leads to protect the outer leads; c) plating gold on the gold plating areas on the circuit board by taking the outer leads as gold plating conducting wires; d) removing the protective dry films on the outer leads; and e) removing the outer leads. The manufacturing technology disclosed by the invention solves the problems of gold seepage plating, under etching and gold-plated surface collapse. Moreover, by adopting the technology, since the outer leads are made on the surface of the circuit board, all gold plating areas are connected by using the outer leads and the in-board patterns on the outer layer of the circuit board are fully etched ...

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides, equilong connecting finger patterns and leads for gold plating in the board on the PCB; (2) sticking an anti-plating adhesive tape to the non-gold plating area; (3) utilizing the leads for gold plating in the board as the gold-plating leads to plate gold on the equilong connecting fingers; (4) tearing off the anti-plating adhesive tape; (5) fusing the leads for gold plating in the board by a laser fuse method; and (6) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not led out from the tips of the connecting fingers on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden trouble of reliability of the ...

Process for manufacturing local gold-plated board

The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: making all the patterns in the board and a conductive auxiliary frame on the periphery of a circuit board on the circuit board once; screen-printing conductive printing ink; sticking a protective dry film to a non-gold-plated area; adopting the conductive printing ink as the gold-plated leads to plate gold on gold-plated areas on the circuit board; removing the protective dry film on the non-gold-plated area; and removing the conductive printing ink, wherein the patterns in the board are provided with the gold-plated areas and the non-gold-plated areas; and the conductive printing ink ensures the leads in all the gold-plated areas to be electrically conducted with the conductive auxiliary frame. Different from the condition in the prior art that the local gold-plated board is difficult in counterpoint of secondary patterns and poor in gold plating quality, in the invention ...

Novel PIM kinase inhibitor

The invention discloses a PIM kinase inhibitor as shown in a general formula II, a pharmaceutical composition and a preparation method thereof, and application of the PIM kinase inhibitor in preparation of drugs for preventing and/or treating indications related to PIM signal pathways. The compound is an ideal high-activity PIM kinase inhibitor and can be used for treating and/or preventing diseases including autoimmune diseases and tumors, such as inflammatory enteritis, acute myelogenous leukemia, myelofibrosis, chronic lymphocytic leukemia and other hematoma and gastric cancer, prostatic cancer and other solid tumors.

METHOD FOR IMPROVING THE EFFICIENCY IN ANAEROBIC DIGESTION OF EXCESS SLUDGE AND GENERATION OF METHANE BY CRUSHING AND DEPROTEINIZING THE SLUDGE

PURPOSE: A method for improving the efficiency in anaerobic digestion of excess sludge and generation of methane is provided to increase the content of biogas as products of the anaerobic digestion and improve the quality of biogas. CONSTITUTION: Excess sludge is resolved and protein is removed so that the efficiency in anaerobic digestion of the sludge and generation of methane is increased. The resolving of the sludge is performed through ultrasonic treatment at a temperature of 70 to 120 degrees centigrade, for 10 to 120 minutes, in the MLVSS(Mixed Liquor Volatile Suspended Solid) of 1.0×10^5 to 1.4×10^5 kJ/kg. The resolving of the sludge is preformed through alkaline treatment at a pH of 12 to 13. © KIPO 2007 ...

Methods for plugging hole of PCB and manufacturing double-sided PCB

The invention relates to a method for plugging a hole of a PCB, comprising the following steps: providing a daughter board and roughening the surface of the daughter board; stacking: adding a prepreg on the surface of the daughter board, on which a hole is needed to be plugged; laminating: conveying a stacked board to a vacuum press system, pressing the prepreg and the daughter board into a whole at high temperature and pressure; and after-treating to obtain the PCB for controlling deep plug holes. The PCB prepared by the method is suitable for splicing an element on a position of a blind hole, thereby effectively improving the splicing density. After stacked into the prepreg and laminated again, the daughter board for controlling the deep plug holes can be manufactured into a double-sided PCB which is suitable for splicing elements on double sides of the blind hole, thereby further improving the splicing density.

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides and equilong connecting finger patterns on the PCB; (2) sticking a conductive adhesive tape; (3) sticking an anti-plating adhesive tape to the non-gold plating area; (4) utilizing the conductive adhesive tape as the gold-plating lead to plate gold on the equilong connecting fingers; (5) tearing off the anti-plating adhesive tape; (6) tearing off the conductive adhesive tape; and (7) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not arranged on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden trouble of reliability of the areas of the connecting fingers in long-term use because the gold-plating leads ...

Depth control blind hole processing technology

The invention is applicable to the field of PCB manufacture and provides a depth control blind hole processing technology used for drilling a blind hole on a PCB. The technology comprises the steps of determining the circuit layer position where a drilled blind hole should arrive, carrying out mechanical drilling to an upper dielectric layer adjacent to an appointed circuit layer, and using a laser drilling mode to remove the dielectric between the bottom of the mechanically drilled hole and the appointed circuit layer. Through carrying out mechanical drilling to an upper dielectric layer of the appointed circuit layer, the laser drilling is carried out in the mechanically drilled hole, a dielectric layer on the appointed circuit layer is removed, and thus the blind hole just reaches the appointed circuit layer. Through removing the dielectric layer at the bottom of the mechanically drilled hole, the appointed circuit layer under the dielectric layer is not affected, thus the depth of the ...

Knotted fishing net machine pore plate moving device

The invention provides a knotted fishing net machine pore plate moving device. The knotted fishing net machine pore plate moving device comprises a gear and cam combination (1), gears (3, 4 and 6), a main shaft (2), a rotating shaft (5) and a gear and cylindrical cam combination, wherein the main shaft (2) is used for supporting the gear and cam combination (1) and the gear (3) to rotate, and the rotating shaft (5) is used for supporting the gear (4) and the gear (6) to rotate. The knotted fishing net machine pore plate moving device has the advantages that the requirements for movement of a pore plate in three directions are met by three independent mechanisms respectively, each implementation mechanism is formed by simple mechanisms, complex mechanisms are avoided, and therefore design and analysis are convenient; kinematic pairs in the implementation mechanisms comprise the revolute pair, the cylindrical pair and the spherical pair, all the kinematic pairs are surface contact kinematic ...

Offshore oilfield grid study state method

The invention provides an offshore oilfield grid study state method including special large-scale motor start analysis, start and shutdown unit or load-adjusted system power flow distribution analysis and optimal power flow study-state single/multiple step implementation verification analysis, and aims to analysis the effect on system by actual motor starting actually and discrete the starting process of the motor into different static sections to simulate the dynamic motor starting process. The analysis is more accurate, the power vacancy is shared by multiple balancing machines determined by the system, the actual situation is met more accurately through dynamic power flow analysis, the system state can be represented more accurately, an operator can grasp the effect on system by operation previously so as to adjust the actual grid operation more leisurely, and the working environment can be optimized for the operator.

Blind hole machining method

The invention discloses a blind hole machining method. The method comprises the following steps: a blind hole is machined in the outer copper foil of a circuit board through the depth-controlled drilling process, wherein the thickness of the outer copper foil is a, the depth-controlled drilling depth is b, a is greater than 3OZ, and value obtained by subtracting b form a is less than 1OZ; the blind hole is machined continuously through the etching process to make the blind hole run through the outer copper foil; and a dielectric layer under the blind hole is removed through the laser drilling process. According to the technical scheme of the invention, the blind hole is machined to a certain depth through the depth-controlled drilling process, and then the blind hole is machined continuously through the etching process; so the damage of the depth-controlled drilling accuracy difference on the copper foil layer when the thickness of the dielectric layer is less than 4mil can be prevented ...

Mother board and method for processing mother board

The embodiment of the invention relates to a mother board which is formed by lamination of two subboards with through holes; the surface of each through hole is covered with bottom copper needed by forming a circuit; each through hole independently forms a blind hole on the mother board; and each layer of bottom copper is covered with nickel-copper-nickel interlayer, the nickel layer thickness in the nickel-copper-nickel interlayer is not less than 2micron. In addition, the embodiment of the invention also provide a method for processing the mother board; by adopting the embodiment of the invention, the nickel-copper-nickel interlayer can protect the completeness for covering the bottom copper on the surface of the through hole of the subboard, and increase the reliability of hole copper; in addition, as all the blind holes can be plugged by devices independently, the information capacity of a circuit board can be increased greatly under the condition of same layer/thickness of the circuit ...

Liquid collection tank and liquid supply unit for liquid collection tank

A liquid collection tank and a liquid supply unit for the liquid collection tank are provided. The liquid collection tank includes: a tank body having an accommodation space formed therein to accommodate a liquid and having an inlet portion formed on one side and an outlet portion formed on an opposite side; and a liquid supply unit coupled to the inlet portion of the tank to supply the liquid from outside of the tank to the accommodation space, in which the liquid supply unit includes: an inlet pipe portion coupled to the inlet portion to introduce the liquid into the accommodation space; and a diversion portion connected to the inlet duct portion and configured to induce flow of the liquid to suppress generation of bubbles due to falling of the liquid passing through the inlet duct portion.

Energy -conserving disconnected strip device of automatic creeling of drawing frame

The utility model provides an energy -conserving disconnected strip device of automatic creeling of drawing frame, including the detection mechanism and disconnected strip mechanism who links to each other, detection mechanism including circle strip dish (11), locating rack (12), photoelectric support (13) and photoelectric switch (14), disconnected mechanism include outer support (21), interior support (22), fixed axle (23), bearing (24), a first disconnected strip roller (25) and the disconnected strip roller (26) of second. The utility model discloses has following technological effect: utilize characteristics such as photoelectric switch non -contact reliable operation, repeated positioning accuracy height, no mechanical wear, sparkless, shake -proof capability are strong, guarantee the stability of creeling hour circle strip dish fibre exit position. Using the disconnected strip roller of biserial and strengthening a fibre and break effective route, the passive smoothness of fibre ...

Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board

The invention discloses a method for manufacturing a local-thick-copper circuit board and the local-thick-copper circuit board. The problems that an existing copper embedding technology is too high in cost, and an existing local-thick-copper technology is prone to film clamping, over etching or insufficient etching can be solved. The method includes the steps of etching the first face of a metal layer, wherein a non-circuit-pattern part of a thick copper circuit area and a thin copper circuit area are etched to be thinned; pressing an insulating layer on the first face of the metal layer; etching the second face of the metal layer, wherein a non-circuit-pattern part of the thin copper circuit area is etched to be removed to form a thin copper circuit, and the non-circuit-pattern part of the thick copper circuit area is etched to be removed to form a thick copper circuit.

Method of PCB board processing technology

The invention discloses a method of a PCB board processing technology, which comprises the following steps: drilling a PCB board; electroplating the drilled PCB board; manufacturing outer-layer graphs on the electroplated PCB board; electroplating graphs on the PCB board after the outer-layer graphs are formed; carrying out back drilling on the through hole of the PCB board after graph electroplating at least at twice, wherein the first back drilling depth is smaller than required appointed back drilling depth; and etching. The invention carries out back drilling on the through hole for at least at twice, the depth of each time of back drilling is smaller than the required back drilling depth, with so many times of back drilling, the depth of each time of back drilling is shallower, and copper wire and resin powder generated in back drilling can be discharged along with a dust absorption system on a drill bit and a discharge groove on the drill bit so as to reduce or avoid the situation ...

Plant conversion-resisting resisting related protein and its coding gene and application

The present invention discloses one kind of plant resistance related protein and its coding gene and application. The protein has one of the following amino acid residue sequence: 1. SEQ No. 2 in the sequence list; and 2. the amino acid residue sequence of SEQ No. 2 through substitution, deletion and/or addition of one or several amino acid residues and coding plant resistance related protein. The plant resistance gene of the present invention will take important role in breeding plant variety with strengthened resistance.

Multi-layer printed circuit board machining process

The invention discloses a multi-layer printed circuit board machining process, which sequentially comprises the following steps: 1) manufacturing a circuit diagram and frame diagrams on a copper clad board, wherein the frame diagrams comprise a frame diagram I and a frame diagram II, the circuit diagram, the frame diagram I and the frame diagram II are sequentially arranged from the central zone of the copper clad board to the outside, and the copper residual rate of the frame diagram I is smaller than the copper residual rate of the frame diagram II; 2) laminating the copper clad board into a multi-layer circuit board, and milling off the outer edge of the multi-layer circuit board comprising the frame diagram II; 3) manufacturing a through hole, an outer diagram and a solder mask of the multi-layer circuit board; and 4) milling the multi-layer circuit board into the designed finished size. By adopting the machining process of the invention, the machining precision of the PCB is high, ...

Hyperbola rotary type conducting bar device

The utility model provides a hyperbola rotary type conducting bar device, including last conducting bar roller (1), lower conducting bar roller (2), dabber (3), antifriction bearing (4), porous bearings (5) and bearing frame (6), last conducting bar roller (1) and antifriction bearing (4) link to each other, antifriction bearing (4) and dabber (3) link to each other. The utility model discloses has following technological effect: because conducting bar roller rotary motion is accomplished around axial fixity's dabber by fibrous removal drive antifriction bearing and rotates about the hyperbola, the up -and -down motion is only done to the dabber, do not do and rotate the friction resistance that has produced when having significantly reduced the motion, can not take place to block the conducting bar roller because of the bearing frame wearing and tearing in the production process can not effectively move, adopt hyperbola conducting bar roller to make fibre centering shrink motion on the ...

Process for manufacturing whole gold-plated board

The invention discloses a process for manufacturing a whole gold-plated board. The process comprises the following steps: a. manufacturing inner layer leads on the inner layer of a circuit board; b. making all the patterns in the board and a conductive auxiliary frame on the surface of the outer layer of the circuit board once; c. adopting the inner layer leads as the gold-plated leads to plate gold on the gold-plated areas on the circuit board; and d. removing the conductive auxiliary frame to ensure the gold-plated areas to insulate each other, wherein the patterns in the board are providedwith the gold-plated areas; one end of the inner layer leads is electrically conducted with the gold-plated areas and the other end thereof is electrically conducted with the conductive auxiliary frame; and all the gold-plated areas are electrically conducted with the conductive auxiliary frame via the inner layer leads. The process has the following advantages: the problems of seepage plating, incomplete ...

Process for manufacturing local gold-plated board

The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: making all the patterns in the board and a conductive auxiliary frame on the periphery of a circuit board on the circuit board once; screen-printing conductive printing ink; sticking a protective dry film to a non-gold-plated area; adopting the conductive printing ink as the gold-plated leads to plate gold on gold-plated areas on the circuit board; removing the protective dry film on the non-gold-plated area; and removing the conductive printing ink, wherein the patterns in the board are provided with the gold-plated areas and the non-gold-plated areas; and the conductive printing ink ensures the leads in all the gold-plated areas to be electrically conducted with the conductive auxiliary frame. Different from the condition in the prior art that the local gold-plated board is difficult in counterpoint of secondary patterns and poor in gold plating quality, in the invention ...

Thick copper circuit board processing method

The present invention discloses a thick copper circuit board processing method. The objective of the invention is to solve the technical problems of the squeeze of glass fibers by line shoulder dents and protrusions, existence of air bubbles, poor inter-layer combining force, high possibility of de-lamination and board thinning existing in existing thick copper circuit board laminating technologies. The method of the invention includes the following steps that: at the first surface of a thick copper board, a non-circuit pattern area is etched and thinned, so that a groove can be formed; the groove is flatly filled with liquid resin in a coating manner, and the liquid resin is not cured; and a prepreg and a first outer-layer plate are stacked on the first surface of the thick copper board, and the prepreg, the first outer-layer plate and the thick copper board are laminated, so that the liquid resin and the prepreg can be cured in a laminating process.

Preparation method of metallized stepped chute of PCB board

The invention discloses a preparation method of a metallized stepped chute of a PCB board. The preparation method comprises the following steps of: (1) preparing a core board; (2) milling a stepped chute on the core board; (3) forming a rough surface at the step of the stepped chute; and (4) boring and galvanizing the stepped chute to obtain a metallized stepped chute. The surface roughness of base materials at the step of the stepped chute is increased, which causes the wicking phenomenon on the rough surface in the subsequent galvanizing steps, increases the bonding area of the galvanized coating and the base material coating at the step and ensures the bonding force of the galvanized coating, thereby improving the phenomena of bad bonding and delamination and blistering of the base materials at the step in the mechanical processing.

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) manufacturing inner layer leads on the inner layer of a printed circuit board (PCB); (2) manufacturing intra-board patterns, conductive auxiliary sides and equilong connecting finger patterns on the surface of the PCB; (3) carrying out resistance welding on the PCB; (4) sticking an anti-plating adhesive tape to the non-gold plating area; (5) utilizing the inner layer leads as the gold-plating leads to plate gold on the equilong connecting fingers; (6) tearing off the anti-plating adhesive tape; and (7) trimming and chamfering the PCB and milling off the conductive auxiliary sides to ensure the connecting fingers to insulate mutually. The method has the following beneficial effects: in the method, the gold-plating leads are not led out from the tips of the connecting fingers on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden ...

Method and device for filtering dust by adopting nuclear track membrane

The invention belongs to the technical field of labor protection methods and devices, and provides a method and a device for filtering dust by adopting a nuclear track membrane. The device for filtering dust by adopting a nuclear track membrane comprises a protection helmet, a head fixing bracket, a nuclear track membrane filter system, an air compression system and a dustproof mask; and the internal part of the protection helm is provided with the head fixing bracket. The invention is characterized in that the aperture of the nuclear track membrane is 0.5-2 mum; the nuclear track membrane filter system is fixed in the head fixing bracket and connected with the air compression system which is fixed outside the protection helmet through a gas-guide tube ; the air compression system compresses clean air filtered by the nuclear track membrane and sprays the clean air into the dustproof mask through an air supply delivery tube; the air pressure in the protection mask is kept in the range of ...

Printed circuit board

The present disclosure provides a printed circuit board including a substrate assembly and an embedded block. The substrate assembly includes a plurality of substrates stackedly arranged and bonded by a first adhesive layer. The substrate assembly defines a groove. A sidewall of the embedded block is an irregular shape. The embedded block is arranged in the groove by the second adhesive layer. The first adhesive layer and the second adhesive layer of the substrate assembly are mutually independent adhesive layers. In the present disclosure, a bonding force between the embedded block and the substrate assembly is enhanced, to obtaine more stacked circuit board structures.

Methods for plugging hole of PCB and manufacturing double-sided PCB

The invention relates to a method for plugging a hole of a PCB, comprising the following steps: providing a daughter board and roughening the surface of the daughter board; stacking: adding a prepreg on the surface of the daughter board, on which a hole is needed to be plugged; laminating: conveying a stacked board to a vacuum press system, pressing the prepreg and the daughter board into a wholeat high temperature and pressure; and after-treating to obtain the PCB for controlling deep plug holes. The PCB prepared by the method is suitable for splicing an element on a position of a blind hole, thereby effectively improving the splicing density. After stacked into the prepreg and laminated again, the daughter board for controlling the deep plug holes can be manufactured into a double-sided PCB which is suitable for splicing elements on double sides of the blind hole, thereby further improving the splicing density.

Device and method for automatic jet printing of electronic seal and identification

The invention relates to the technical field of ink jet printing, in particular to a device and method for automatic jet printing of an electronic seal and a mark, the device comprises a shell, a first scanner and a scanning binding unit, a jet printing unit is arranged in the shell, and the device comprises a printing support, a paper feeding mechanism, a jet printing mechanism and a bearing mechanism. By arranging the ink-jet stamping machines distributed in an array mode, the situation of ghosting or deviation in the ink jet process is avoided while the stamping speed of the file to be stamped is increased, meanwhile, sealing of nozzles of all the ink-jet stamping machines can be effectively completed, and the sealing efficiency is improved. When each ink-jet stamping machine carries out pre-ink-jet, the ink accumulated at the spray head of the ink-jet stamping machine is received, so that the situation that the ink drips onto a file to be stamped or the ink accumulated at the spray ...

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides and equilong connecting finger patterns on the PCB; (2) screen-printing conductive ink; (3) sticking an anti-plating adhesive tape to the non-gold plating area; (4) utilizing the conductive ink as the gold-plating lead to plate gold on the equilong connecting fingers; (5) tearing off the anti-plating adhesive tape; (6) removing the conductive ink; and (7) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not arranged on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden trouble of reliability of the areas of the connecting fingers in long-term use because the gold-plating leads are not thoroughly removed ...

Application of 2,4-dihydroxy benaophenonel in preparing medicament for treating hepatitis

The invention discloses application of a 2,4-dihydroxy benaophenonel in preparing a medicament for treating hepatitis. Virus b hepatitis, cocaine toxic hepatitis, carbon tetrachloride toxic hepatitis, paracetamol toxic hepatitis and thioacetamide toxic hepatitis can be effectively treated by medicaments with the 2,4-dihydroxy benaophenonel as an active ingredient.

Method for electroplating surface of circuit board

The invention discloses a method for electroplating the surface of a circuit board. The method comprises the following steps: performing etching thickness reduction treatment, namely performing etching thickness reduction treatment on a copper foil layer of a non-line graph region on the surface of the circuit board; arranging an electroplated film, namely covering the non-line graph region and a non-electroplated area in a line graph region on the surface of the circuit board with the electroplated film; performing electroplating, namely performing electroplating on the electroplated area in the line graph region by taking the copper foil layer subjected to the etching thickness reduction treatment as an electroplating wire; removing the electroplated film and forming a line graph, namely removing the electroplated film, and removing the copper foil layer left by etching thickness reduction in the non-line graph region to form the line graph on the surface of the circuit board. According ...

Manufacturing method for circuit board system and circuit board system

The invention discloses a manufacturing method for a circuit board system, which comprises the following steps: laminating a power system inner layer plate, a control system inner layer plate and a connection soft board into a dielectric layer between two layers of thick copper foils; making a first drilling hole to connect the power system inner layer plate and the connection soft board and making a second drilling hole to connect the control system inner layer plate and the connection soft board; respectively making a power system outer layer line and a control system outer layer line on the thick copper foils; removing the thick copper foils and the dielectric layer in the region of the connection soft board to obtain the required circuit board system, wherein the circuit board system comprises a power system circuit board, a control system circuit board and the connection soft board. The embodiment of the invention also provides the corresponding circuit board system. The circuit board ...

Process for manufacturing partially gold-plated board

The invention discloses a process for manufacturing a partially gold-plated board. The process provided by the invention comprises a step of manufacturing all intra-board patterns with gold-plating areas and non-gold-plating areas, an outer lead and a conductive auxiliary frame on the surface of a circuit board at one step, wherein the outer lead conductively connects the gold-plating areas and conductively connects the gold-plating areas with the conductive auxiliary frame. The process further comprises the following steps: sticking dry protective films on the non-gold-plating areas and the outer lead so as to protect the non-gold-plating areas and the outer lead; using the outer lead as a gold-plating wire to plate gold on the gold-plating areas of the circuit board; removing the protective films from the non-gold-plating areas and the outer lead, sticking the dry protective films on the non-gold-plating areas again and uncovering the gold-plating areas and the outer lead so as to protect ...

Preparation method and application of biological membrane for toxicity determination biosensor

The invention relates to a preparation method of a biological membrane for a toxicity determination biosensor. The preparation method comprises the steps of inoculating activated sludge to a culture medium to obtain bacterial liquid; adding polyvinyl alcohol and sodium alginate in distilled water, heating in water bath, and cooling to the room temperature to obtain polyvinyl alcohol gel; centrifuging the bacterial liquid, pouring out supernatant, mixing the precipitate and the polyvinyl alcohol gel, uniformly coating the mixture into a membrane shape by utilizing a glass-surface vessel, drying the membrane-shaped mixture to obtain a membrane, carrying out crosslinking solidification on the membrane in a crosslinking solidification solution which is prepared in advance, and taking out the solidified membrane, thus obtaining the biological membrane for the toxicity determination biosensor. The preparation method is simple and convenient in steps, adopts low-price raw materials of which the ...

Method for preparing cefotaxime

The invention relates to a method for preparing cefotaxime, which comprises the following steps: dissolving 7-ACA and AE- active ester in methylene dichloride, adding triethylamine into the solution with stirring and controlling the reaction temperature to be 20 to 35 DEG C and the reaction time to be 30 to 50 minutes; after the reaction is finished, extracting condensed reaction solution with water, adjusting the pH of water extract to 5.0 to 7.0 with weak acid, filtering the water extract, and subjecting the filtered water extract to adsorption bleaching by alumina; and after bleaching, adding ethanol serving as a crystallization dispersant into the water extract, dripping hydrochloric acid to precipitate crystals, growing crystals, centrifuging the solution, washing the crystals with ethanol, and drying the crystals to obtain the cefotaxime.

Method for processing PCB

The invention discloses a method for processing a PCB, which comprises the following steps: drilling required semi-holes or whole holes in the PCB; drilling slots at positions which are adjacent to the semi-holes or the whole holes and partially cover the whole holes to form slotted semi-holes; redrilling at the original positions of the drilled semi-holes or whole holes by using a drill with thesame diameter as that of each of the holes, and deburring the redrilled holes; and plating the PCB with the drilled slots and semi-holes in a manner of copper precipitation and metalizing the PCB to form metalized slotted semi-holes. By using the method for processing the PCB of the invention, the burrs rolled into the holes during drilling can be broken or extruded to a position where two holes are tangent and where the burrs are cut off by the drill. Therefore, the method has the advantages of high de-burring speed, high efficiency and low labor cost; and the situation of poor plating caused by ...

Pipeline targeted descaling method

The invention discloses a pipeline targeted descaling method. The pipeline targeted descaling method comprises following steps: S1, the position of a segment with dirt is calculated based on a pipeline inlet pressure break point when a positioning spherical pig runs in a pipeline; S2, the segments before and after the segment with dirt are provided with a soft spherical pig respectively for isolation, the two ends of the segment with dirt are blocked so as to form a descaling area, and a descaling agent is delivered to fixed points of the descaling area so as to form a descaling system, wherein the descaling agent comprises a solid retarded acid, a corrosion inhibitor, a penetrant, and a complexing agent; S6, after standing of 0.5 to 1h, full contact and dissolving of the descaling agent with accumulated dirt are realized; and S7, the descaling agent and the soft spherical pigs are removed. According to the pipeline targeted descaling method, the segment with dirt is isolated from the rest ...

Multi-layer printed circuit board machining process

The invention discloses a multi-layer printed circuit board machining process, which sequentially comprises the following steps: 1) manufacturing a circuit diagram and frame diagrams on a copper clad board, wherein the frame diagrams comprise a frame diagram I and a frame diagram II, the circuit diagram, the frame diagram I and the frame diagram II are sequentially arranged from the central zone of the copper clad board to the outside, and the copper residual rate of the frame diagram I is smaller than the copper residual rate of the frame diagram II; 2) laminating the copper clad board into a multi-layer circuit board, and milling off the outer edge of the multi-layer circuit board comprising the frame diagram II; 3) manufacturing a through hole, an outer diagram and a solder mask of themulti-layer circuit board; and 4) milling the multi-layer circuit board into the designed finished size. By adopting the machining process of the invention, the machining precision of the PCB is high, and ...

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides and equilong connecting finger patterns on the PCB; (2) hot-pressing leads for gold plating in the connection areas of the equilong connecting fingers and the intra-board patterns and electrically conducting all the leads with the conductive auxiliary sides; (3) sticking an anti-plating adhesive tape to the non-gold plating area; (4) utilizing the hot-pressed leads as the gold-plating leads to plate gold on the equilong connecting fingers; (5) tearing off the anti-plating adhesive tape; (6) removing the hot-pressed leads for gold plating; and (7) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not arranged at the tips of the connecting fingers ...

Upper bearded needle rotating device of knotted fishing net machine

The invention provides an upper bearded needle rotating device of a knotted fishing net machine. The upper bearded needle rotating device comprises a main shaft (1), a cylindrical cam (2) with a groove, rollers (3, 8), an oscillating follower, small shafts (4-1, 6-1, 7-1), porous supports (6-2, 6-3, 13-1, 24), a slippage part (9) with a groove, a long key (10), shafts (12, 23), a U-shaped plate (14), a plate (17), a rack plate (19) and an upper bearded needle gear body (20). The upper bearded needle rotating device of the knotted fishing net machine has the following effects: 1) the simultaneous rotation of more than 1000 upper bearded needles is realized by utilizing rack and gear devices; 2) the movement of a final execution part is realized by utilizing a manner of connecting a simple transmission device in series and a plurality of movement driving links required by a multichannel device are not needed, so that the cost is saved; 3) the driving part of the whole transmission device ...

Energy management equipment monitoring platform

The invention discloses an energy management equipment monitoring platform, and relates to the technical field of energy management monitoring, the energy management equipment monitoring platform comprises an energy consumption data acquisition module, an energy consumption flow analysis and alarm module and an energy consumption statistics cloud, the energy consumption data acquisition module and the top of an energy management scheduling module are in electric signal connection with the energy management scheduling module, and the energy consumption data acquisition module is in electric signal connection with the energy management scheduling module. And the output end of the energy consumption data acquisition module is in electric signal connection with the input end of the energy consumption statistics cloud. According to the invention, the centralized dynamic monitoring module carries out centralized dynamic monitoring on the energy consumption of water, electricity, natural gas, ...

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides and equilong connecting finger patterns on the PCB; (2) hot-pressing leads for gold plating in the connection areas of the equilong connecting fingers and the intra-board patterns and electrically conducting all the leads with the conductive auxiliary sides; (3) sticking an anti-plating adhesive tape to the non-gold plating area; (4) utilizing the hot-pressed leads as the gold-plating leads to plate gold on the equilong connecting fingers; (5) tearing off the anti-plating adhesive tape; (6) removing the hot-pressed leads for gold plating; and (7) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not arranged at the tips of the connectingfingers ...

Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board

The invention discloses a method for manufacturing a local-thick-copper circuit board and the local-thick-copper circuit board. The method and the local-thick-copper circuit board aim at overcoming the defects existing in the technology for manufacturing the local-thick-copper circuit board through existing local electroplating or existing local etching. The method includes the steps that a thick copper substrate, a first laminated board and a first insulating bonding layer are provided, wherein a first thick copper circuit is arranged on the first face of the thick copper substrate, a first thin copper circuit is arranged on the first face of the first laminated board, and a first through groove matched with the first thick copper circuit is formed in the first insulating bonding layer; the thick copper substrate, the first insulating bonding layer and the first laminated board are pressed to enable the first thick copper circuit to abut against an insulating layer of the first face, provided ...

Process for manufacturing whole gold-plated board

Process for manufacturing local gold-plated board

The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: using a dry film to carry out primary outer layer patterning on a printed circuit board (PCB) and using etchant solution to etch out all the patterns in the board; laying copper conductors at the joint of a gold-plated area and a non-gold-plated area; adopting transient high pulsed voltage to melt part of the copper conductors to ensure the copper conductors to be electrically connected with the gold-plated area; using the dry film to carry out secondary outer layer patterning on the non-gold-plated area of the PCB with the copper conductors to protect the non-gold-plated area; electroplating gold on the gold-plated area of the PCB; and removing the dry film on the non-gold-plated area and tearing off the copper conductors, wherein the patterns in the board are provided with the gold-plated area and the non-gold-plated area. By etching all the patterns in the boardonce ...

Method for preparing ceftizoxime sodium

The invention relates to synthetic ceftizoxime acid and a method for preparing ceftizoxime sodium from the synthetic ceftizoxime acid. The preparation process comprises the following steps: slowly adding a crystallization solvent in a crystallization liquid until the crystallization liquid becomes slightly turbid, stopping adding the solvent, slowly stirring and growing crystals for 0.5 hour, continuously adding the residual solvent, and stirring and growing the crystals for 1 hour after the residual solvent is completely added. The product prepared by the optimized process in the invention has remarkably improved quality although the yield is lowered by 1.0-1.5%; and the product crystallization state is obviously improved and the product quality problem of clarity stability in the periodof validity is solved.

Deformed magnesium alloy

Efficient adsorbent for taking water from air

The invention relates to an adsorbent for taking water from air. The adsorbent consists of the following components in percentage by weight: 40 to 70 percent of montmorillonite, 20 to 50 percent of fiber paper and 1 to 20 percent of active carbon. The water absorption rate of the adsorbent provided by the invention is greatly improved in application of an air water-taking technology, and the cost can be reduced at the same time, so that the air water-taking technology can be put into application with low cost.

Primer group, kit and detection method for rapidly identifying wine fermentation contaminating microorganisms

The invention discloses a primer group, a kit and a detection method for rapidly identifying wine fermentation contaminating microorganisms. The primer group comprises an upstream primer and a downstream primer which are used for amplifying microbial gene sequences, wherein the upstream primer is selected from at least one of nucleotide sequences such as SEQ ID NO.1, SEQ ID NO.2, SEQ ID NO.3, SEQ ID NO.4 and SEQ ID NO.5; the downstream primer is selected from at least one of nucleotide sequences such as SEQ ID NO. 6, SEQ ID NO. 7, SEQ ID NO. 8, SEQ ID NO. 9 and SEQ ID NO. 10. When the primer group disclosed by the invention is used for detecting a wine fermentation sample, all detections can be carried out in one experiment, and common contaminating microorganism types in all wine fermentation can be detected by using fewer primers, so that the detection time is shortened, and the accuracy is high.

Method for enriching floras capable of degrading dimethylformamide

The invention relates to the field of environmental microorganisms, in particular to a method for enriching floras capable of degrading dimethylformamide (DMF). Aiming at the problem of difficult degradation or unideal degradation effect of the DMF in the treatment of industrial wastewater, the invention discloses the method for enriching the floras capable of degrading the dimethylformamide. The method is characterized by comprising the following steps of: adding activated sludge to a culture medium in a domesticating period for domestication, then adding the domesticated activated sludge to a culture solution of the DMF and an enrichment culture medium in the volume ratio of 1:250 for enrichment culture, and then regulating the pH of the solution to 7.00 by using NaOH or H2SO4; and placing the solution in a constant-temperature oscillating tank QW-A under an aerobic condition for oscillating for 5 to 6 days at the constant temperature of 30 DEG C +/-2 DEG C in the oscillating frequency ...

Method for manufacturing local-thick-copper circuit board and local-thick-copper circuit board

The invention discloses a method for manufacturing a local-thick-copper circuit board and the local-thick-copper circuit board. The method and the local-thick-copper circuit board aim at overcoming the defects of film clamping and over etching or insufficient etching of an existing local-thick-copper circuit board manufacturing technology. The method includes the steps that a thick copper substrate, an insulating bonding layer and a metal layer are provided, wherein a thick copper circuit is arranged on one face of the thick copper substrate, and the insulating bonding layer and the metal layer are provided with open grooves matched with the thick copper circuit; the insulating bonding layer and the metal layer are pressed on the face, provided with the thick copper circuit, of the thick copper substrate to enable the thick copper circuit to be contained in the open grooves and enable the top end face of the thick copper circuit and the metal layer to be located on the same layer; a thin ...

Riverway water quality monitoring device

The invention relates to the field of water quality detection equipment, in particular to a riverway water quality monitoring device which comprises a sealing shell and a water quality detector arranged in the sealing shell, a floating plate is installed on the sealing shell, a rotating screw is installed on the floating plate, and a detection probe of the water quality detector is located outside the sealing shell. Wherein a winding rod is rotationally arranged on the sealing shell, a driving piece for driving the winding rod to rotate is arranged on the sealing shell, a connecting rope is wound on the winding rod, one end of the connecting rope is connected with a sampling box, an opening is formed in the top of the sampling box, the detection probe penetrates through the opening, a water pipe is arranged at the top of the sampling box, and a valve is arranged on the water pipe. The probability that the water quality monitoring device sinks to the water bottom is reduced, water quality ...

Preparation method of organic soluble photosensitive chitosan derivative

The invention relates to a preparation method of an organic soluble photosensitive chitosan derivative. The method comprises the following steps that: 2g of chitosan is added into 70ml of triethylamine to be stirred at room temperature, so that the chitosan is uniformly dispersed in the triethylamine; the carbon tetrachloride solution of 10 weight percent of photosensitive chloride monomer is prepared, wherein the amount of the added photosensitive chloride monomer is 0.5 to 8 times of the mole of chitosan on the amino, imino and hydroxyl; chloride monomer solution is slowly dripped into chitosan solution, to be continuously stirred; after all the solution is dripped, the reaction is continued to be carried out for 2 to 6h; after the reaction, filtration is carried out, and powdery solid is prepared; and then 8 weight percent of sodium bicarbonate solution is washed by water for 3 times; the product washed by water is filtered, vacuumized and dried to prepare the chitosan derivative; and ...

Method for gold-plating gold fingers with equal length

The invention relates to a method for gold-plating gold fingers with an equal length, which comprises the following steps of: (1) only manufacturing patterns of the gold fingers with the equal length on a printed circuit board (PCB), preserving a large copper surface, and electrically connecting the patterns of the gold fingers by using the large copper surface; (2) attaching an anti-plating adhesive tape onto the large copper surface to cover a non-gold-plating area except the patterns of the gold fingers; (3) gold-plating the gold fingers with the equal length by using the large copper surface as a gold-plating wire; (4) tearing the anti-plating adhesive tape off; (5) covering a dry protective film on the patterns of the gold fingers and in-board patterns on the PCB to manufacture the in-board patterns; (6) etching and removing a copper layer outside the dry protective film; (7) removing the dry protective film; and (8) performing solder resist, profile modification and chamfering on ...

Overhead device of suspension type is fixed to bi -polar arm

The utility model discloses an overhead device of suspension type is fixed to bi -polar arm, the overhead device of suspension type include overhead fixing base, initiative synchronous rotary mechanism, suspension type reach the standard grade mechanism and slitting unit, overhead fixing base includes a both arms roof beam left side, the both arms roof beam right side, fixing base and bundling machine, the synchronous rotary mechanism of initiative includes a plurality of stepped tooth rollers, tensioning ware and servo motor, all set up the suspension type mechanism that reaches the standardgrade between per two stepped tooth rollers, every suspension type is reached the standard grade the mechanism and is all included lift kits and at least one direct -connected feeding fibre cylinder base, slitting unit includes sliver separator branch and sliver separator, the utility model discloses technical scheme overcomes prior art's shortcoming, parallel input mode in the middle of applied bi ...

Circuit board manufacturing method and circuit board

The invention discloses a circuit board manufacturing method and a circuit board to overcome the defects that since an existing circuit board side face metallization process is adopted, burrs can be easily formed on the side face of a circuit board due to cutting, and the process can not be applied to circuit boards with resin plug holes. The method comprises the steps that side grooves are machined in a circuit substrate, wherein the circuit substrate comprises a circuit board unit, and the side grooves are located on boundary lines of the circuit board unit; the side grooves are filled with metal slurry, and the metal slurry is cured to form metal slurry solid blocks; the circuit substrate and the metal slurry solid blocks are cut along the boundary lines, and then the circuit board unit is obtained, wherein the metal slurry solid blocks are partially embedded in the side face of the circuit board unit.

Method of PCB board processing technology

The invention discloses a method of a PCB board processing technology, which comprises the following steps: drilling a PCB board; electroplating; manufacturing outer-layer graphs; electroplating graphs; carrying out first back drilling on a through hole by a drill bit the diameter of which is the same as that of the drilled through hole; then adopting a drill bit the hole diameter of which is the same as that of the back drilling hole to carry out second back drilling, wherein the first back drilling depth and the second back drilling depth are both the required specified depth; and etching. The invention carries out back drilling on the through hole at twice, resin dust generated in the drilling process can be discharged via a dust absorption system of a drilling machine in time, and residual copper cuttings and tin cuttings in the through hole can be removed by a etching solution so as to reduce the situations that the back drilling hole is blocked and the processing efficiency and the ...

ALK2 kinase inhibitors

The invention discloses an ALK2 kinase inhibitor as shown in a general formula I, a pharmaceutical composition and a preparation method of the ALK2 kinase inhibitor, and application of the ALK2 kinase inhibitor to preparation of drugs for preventing and/or treating indications related to an ALK2 signal channel. The compounds of the present invention are ideal highly active ALK2 kinase inhibitors, and can be used in the treatment and/or prophylaxis of diseases, including anemia, inflammation, tumors, and part of rare diseases, such as progressive calcified fibrodysplasia, diffuse endogenous glioma, iron refractory iron deficiency anemia, inflammatory anemia, myelodysplastic syndrome, multiple myeloma, and the like. The compound can also be combined with a JAK2 inhibitor to treat MPN-related anemia.

CIRCUIT BOARD

The present disclosure provides a circuit board. The circuit board may include a number of stacked core boards each having a top surface. At least part core boards of the number of stacked core boards may include circuit layers at top surfaces thereof. A groove may be defined through the at least part core boards. A conductive material may be received in the groove configured to couple to the circuit layers of at least two core boards. A cross section of the groove may include a length in a first direction and a length in a second direction, and the length in the first direction may be greater than the length in the second direction. Electroplating solution may capable of contacting any portions of the groove to electroplate, to form the conductive material.

Manufacturing technology of whole-plate gold-plated plate

The invention discloses a manufacturing technology of a whole-plate gold-plated plate, comprising the following steps: a. manufacturing all in-plate graphs comprising a gold-plated zone and an outer layer gold-plated wire on a circuit board at a time, meanwhile, manufacturing an outer-layer lead and a conducting assistant edge; and connecting the gold-plated zone with the outer layer gold-plated wire, connecting the outer layer gold-plated wire with the outer layer lead, and connecting the outer layer lead with the conducting assistant edge; b. conducting by the outer layer lead and the conducting assistant edge to plate gold on the gold-plated zone and the outer layer gold-plated wire on the circuit board; and c. removing the outer layer lead by a laser fixed-point fusing technology. The manufacturing technology provided by the invention can overcome the defects of diffusion coating for plating the gold, under etching, poor gold plating quality, collapse of the gold-plated zone and process ...

Mechanical controlled deep blind hole processing technology

The invention is applicable to the field of PCB plate manufacture and provides mechanical controlled deep blind hole processing technology used for drilling a blind hole on a PCB. A blind hole with specified depth and stair hierarchy is drilled on the PCB by at least two times. The diameter of the blind hole is reduced by layers along the depth direction. The blind hole is drilled to be a blind hole with stair hierarchy, and the diameter of the blind hole is reduced by layers along the depth direction. In the process of electroplating, the diameter of a superficial layer is larger than the diameter of a deep layer of the blind hole along the depth direction, thus more electroplating solution is filled, the circulation and exchange areas of the deep layer with the outside electroplating solution are increased at the same time, the circulation and exchange of the electroplating solution in the blind hole with the outside electroplating solution are easier, the circulation and exchange rates ...

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides and equilong connecting finger patterns on the PCB; (2) sticking a conductive adhesive tape; (3) sticking an anti-plating adhesive tape to the non-gold plating area; (4) utilizing the conductive adhesive tape as the gold-plating lead to plate gold on the equilong connecting fingers; (5) tearing off the anti-plating adhesive tape; (6) tearing off the conductive adhesive tape; and (7) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not arranged on the PCB and are unnecessary to be removed, thus naturally avoiding the problem of hidden trouble of reliability of the areas of the connecting fingers in long-term use because the gold-plating leads ...

State estimation method for offshore oilfield group power grid

The invention provides a state estimation method for the offshore oilfield group power grid. The method comprises the following steps that S1) data collected from SCADA is read in; S2) the initial voltage and current are set, and horizontal and vertical coordinates of a node voltage and horizontal and vertical coordinates of a node injection current serve as quantities of state; S3) the residual error of an objective function is calculated, 2-norm of the residual error of a measurement equation serves as the objective function, and an interior point method is called for solution; and S4) a weighted residual error Tw is used to determine whether a node is an adverse measurement node, if yes, the structure is output, and otherwise, the step 3) is returned to and data of the next node is calculated and determined. The state estimation method has the advantages that the node injection current serves as the quantity of the state, the interior point method is called for solution, the qualified ...

Process for manufacturing local gold-plated board

The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: manufacturing inner layer leads on the inner layer of a circuit board; making all the patterns in the board and a conductive auxiliary frame on the periphery of the circuit board on the surface of the circuit board once; sticking protective dry films to non-gold-plated areas to protect the non-gold-plated areas; adopting the inner layer leads as the gold-plated leads to plate gold on the gold-plated areas on the circuit board; removing the protective dry films on the non-gold-plated areas; and milling off the conductive auxiliary frame to ensure the inner layer leads to insulate each other, wherein the patterns in the board are provided with the gold-plated areas and the non-gold-plated areas; and the inner layer leads ensure all the gold-plated areas to be electrically conducted with the conductive auxiliary frame. By etching all the patterns in the board once, counterpoint ...

Manufacturing process of whole gold-plated panel

The invention discloses a manufacturing process of a whole gold-plated panel, comprising the following steps: a. all in-panel graphs with gold-plated regions and non gold-plated regions are manufactured on a circuit board by one time; b. a metal conducting layer with the thickness of 0.3-0.8mu m is coated on the circuit board of the whole panel with manufactured in-panel graphs in a settling way; c. a protective dry film is adhered on the non gold-plated region coated with a metal conducting layer to protect the non gold-plated region, and the gold-plated region coated with a metal conducting layer is exposed; d. the coated metal conducting layer is utilized for electric conduction, and gold plating is carried out on the gold-plated region of the circuit board; e. the protective dry film on the non gold-plated region, which is flushed and soaked by 3-5 percent NaOH for 2-5 minutes, is removed; and f. a sodium peroxydisulfate solution is used for removing the metal conducting layer on the ...

Process for manufacturing local gold-plated board

The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: making all the patterns in the board on a circuit board once; depositing a conducting layer with thickness of 0.3-0.8mu m on the circuit board with all the patterns; patterning the outer layers of non-gold-plated areas with the conducting layer, namely sticking protective dry films to the non-gold-plated areas to protect the non-gold-plated areas; plating gold on gold-plated areas on the circuit board; removing the protective dry films on the non-gold-plated areas; and carrying out microetching so as to remove the conducting layer on the non-gold-plated areas, wherein the patterns in the board are provided with the gold-plated areas and the non-gold-plated areas. By etching all the patterns in the board once, counterpoint precision deviation between the gold-plated areas and the non-gold-plated areas can not exist on the circuit board.

Process for manufacturing whole gold-plated board

The invention discloses a process for manufacturing a whole gold-plated board. The process comprises the following steps: a. making all the patterns in the board and a conductive auxiliary frame on the circuit board once; b. screen-printing conductive printing ink on auxiliary gold-plated areas; c. covering the conductive printing ink layer with a protective dry film; d. adopting the conductive printing ink as the gold-plated leads to plate gold on gold-plated areas on the circuit board; e. removing the protective dry film; f. removing the conductive printing ink layer; and g. carrying out solder resist on the auxiliary gold-plated areas and the conductive auxiliary frame, wherein the patterns in the board are provided with the gold-plated areas and the auxiliary gold-plated areas; and the conductive printing ink ensures all the gold-plated areas to be electrically connected with each other and with the conductive auxiliary frame. Through the process, the problems of seepage plating, incomplete ...

Circuit board manufacturing method and circuit board with embedded metal matrix

The invention discloses a circuit board manufacturing method and a circuit board with an embedded metal matrix, thereby settling multiple defects caused by manufacture of partial thick copper through partial electroplating or partial micro-corrosion technology in prior art. In some embodiments of the invention, the circuit board manufacturing method comprises the steps of supplying the metal matrix and an inner layer board, wherein at least one surface of the inner layer board is provided with a thick copper line; laminating an outer layer board on the surface with the thick copper line on the inner layer board, placing the metal matrix in a non-through trough which is arranged on the outer layer board, wherein the trough is arranged on the surface which is far from the inner layer board on the outer layer board; pressing the thick copper line, the outer layer board and the metal matrix for integrating; machining at least one conducting hole which arrives at or penetrates deeply into the ...

Method for processing high-precision PCB (Printed Circuit Board) with nonmetal and metal edges

The invention discloses a method for processing a high-precision PCB (Printed Circuit Board) with nonmetal and metal edges. The method comprises the following steps of: (a) determining an external form; (b) electroplating; (c) determining an outer-layer pattern; (d) electroplating the pattern; (3) drilling; and (f) alkaline etching; The method has the advantages that a wet process and a machining process are combined, an board edge of which a contact step is smaller than 0.05mm between the metal part and the nonmetal part of the PCB can be processed, and the precision is high.

Automatic airlock eliminating device of electric submersible pump

The invention discloses an automatic airlock eliminating device of an electric submersible pump. The automatic airlock eliminating device of the electric submersible pump comprises a body adopting a tubular structure, wherein an inner boss integrally formed with the body is arranged in the tubular-structure body, a locating clamp ring is arranged at the position, which keeps a certain distance from the inner boss, of the upper end of the inner boss, a movable valve element is clamped between the locating clamp ring and the inner boss, and a runner is formed in the middle part of the valve element. The automatic airlock eliminating device has the benefits as follows: when a producing well causes an airlock phenomenon, the electric submersible pump can automatically eliminate the airlock phenomenon, and no additional cost is required, so that the offshore oilfield producing well can resume production rapidly, the hourly rate of production of the producing well is increased, and the loss of ...

Manufacturing method of circuit board with step groove

The invention discloses a manufacturing method of a circuit board with a step groove. The manufacturing method includes the following steps that: an isolation cage is manufactured, and the isolation cage is pasted at a step groove position of the surface of an inner-layer board; an outer-layer board is fittingly pressed on the inner-layer board, and a through hole is formed at a step groove position of the outer-layer board in advance, and after being fittingly pressed, the isolation cage can be located in the through hole; and the isolation cage is taken out from the through hole, so that a step groove can be formed. According to the technical scheme of the invention, the isolation cage is adopted to directly from the step groove without a deep milling control step required, and therefore, techniques are simple; and gaskets are not adopted, and therefore, problems of being difficult to remove the gaskets and gasket residuals can be solved, and the problem of high possibility of delamination ...

Test method for back drilling depth of PCB plate

The invention discloses a test method for the back drilling depth of a PCB plate, comprising the following steps: carrying out back drilling machining on a first through hole to be tested; and then testing whether the depth or the layering of a back drilling hole in the first through hole meets the requirements as follows: 1) if detecting that the first through hole, a second through hole and a third through hole are electrically conducted, judging that the back drilling depth of the first through hole is shallow; 2) if detecting that the first through hole is not electrically conducted with the second through hole while being electrically conducted with the third through hole, judging that the back drilling depth of the first through hole is appropriate; and 3) if detecting that the first through hole, the second through hole and the third through hole are not electrically conducted, judging that the back drilling depth of the first through hole is deep. In the test method, electric conductions ...

Emergency control method for offshore oilfield cluster power grid

The invention provides an emergency control method for an offshore oilfield cluster power grid, comprising operation parameter collection, control strategy table generation, and execution control. Operation parameter collection comprises the steps of collecting current operation parameters of a power grid and determining the current mode of operation and mode of wiring and the overall structure of a system, and operation parameter collection is periodic. Control strategy table generation comprises the steps of analyzing possible types of faults of the system, scanning and calculating different types of faults, finding corresponding optimal strategies, generating a strategy table corresponding to the current operation parameters, judging whether the collected operation parameters are refreshed, and regenerating a strategy table when a data refreshing signal is detected. Execution control comprises the steps of judging current accident disturbance of the power grid and searching a matching ...

Method for preparing cefotaxime

The invention relates to a method for preparing cefotaxime, which comprises the following steps: dissolving 7-ACA and AE- active ester in methylene dichloride, adding triethylamine into the solution with stirring and controlling the reaction temperature to be 20 to 35 DEG C and the reaction time to be 30 to 50 minutes; after the reaction is finished, extracting condensed reaction solution with water, adjusting the pH of water extract to 5.0 to 7.0 with weak acid, filtering the water extract, and subjecting the filtered water extract to adsorption bleaching by alumina; and after bleaching, adding ethanol serving as a crystallization dispersant into the water extract, dripping hydrochloric acid to precipitate crystals, growing crystals, centrifuging the solution, washing the crystals with ethanol, and drying the crystals to obtain the cefotaxime.

Mother board and method for processing mother board

The embodiment of the invention relates to a mother board which is formed by lamination of two subboards with through holes; the surface of each through hole is covered with bottom copper needed by forming a circuit; each through hole independently forms a blind hole on the mother board; and each layer of bottom copper is covered with nickel-copper-nickel interlayer. In addition, the embodiment ofthe invention also provide a method for processing the mother board; by adopting the embodiment of the invention, the nickel-copper-nickel interlayer can protect the completeness for covering the bottom copper on the surface of the through hole of the subboard, and increase the reliability of hole copper; in addition, as all the blind holes can be plugged by devices independently, the informationcapacity of a circuit board can be increased greatly under the condition of same layer/thickness of the circuit board.

Processing method of printing circuit board blind hole

The invention relates to a processing method of a printing circuit board blind hole, comprising the following processing steps: a plurality of through holes are respectively drilled on each daughter board, copper is respectively plated on the inner wall of each through hole and then a circuit and a welding disc are etched on each daughter board; a semi-curing plate is respectively bonded on each daughter board and holes are processed on the semi-curing plate positioned on the top surface of each daughter board; the semi-curing plate positioned on the bottom surface of each daughter board covers the whole bottom surface of the daughter board; a copper foil is respectively bonded on the semi-curing plates on the bottom surface and the top surface of each daughter board, the daughter boards bonded with the semi-curing plate are laminated under high temperature; the copper foil of the semi-curing plate at the position of the bottom surface of each daughter board is removed, a gummosis semi-curing ...

Manufacturing process of whole gold-plated panel

The invention discloses a manufacturing process of a whole gold-plated panel, comprising the following steps: a. all in-panel graphs with gold-plated regions and non gold-plated regions are manufactured on a circuit board by one time; b. a metal conducting layer with the thickness of 0.3-0.8mu m is coated on the circuit board of the whole panel with manufactured in-panel graphs in a settling way; c. a protective dry film is adhered on the non gold-plated region coated with a metal conducting layer to protect the non gold-plated region, and the gold-plated region coated with a metal conducting layer is exposed; d. the coated metal conducting layer is utilized for electric conduction, and gold plating is carried out on the gold-plated region of the circuit board; e. the protective dry film on the non gold-plated region, which is flushed and soaked by 3-5 percent NaOH for 2-5 minutes, is removed; and f. a sodium peroxydisulfate solution is used for removing the metal conducting layer on the ...

Dipeptidyl peptidase I inhibitor and application thereof

The invention relates to a dipeptidyl peptidase I inhibitor shown in a general formula (I) and application, in particular to the dipeptidyl peptidase I inhibitor shown in the general formula (I) and application of the dipeptidyl peptidase I inhibitor in preparing and preventing and/or treating diseases related to DPP-1. The compound provided by the invention is an ideal high-activity DPP-1 inhibitor; clinical diseases capable of being used for treatment and/or prevention comprise lung related diseases such as non-cystic fibrosis bronchiectasis (NCFBE), asthma, chronic obstructive pulmonary disease (COPD) and respiratory distress syndrome, autoimmune diseases such as ANCA related vasculitis, lupus erythematosus nephropathy, inflammatory bowel disease and rheumatoid arthritis, sepsis, alpha 1 antitrypsin deficiency, and the like. , cancer, diabetic cardiomyopathy, etc.

Method for plating gold on equilong connecting fingers

The invention relates to a method for plating gold on equilong connecting fingers. The method comprises the following steps: (1) preparing a printed circuit board (PCB) and manufacturing intra-board patterns, conductive auxiliary sides, equilong connecting finger patterns and leads for gold plating in the board on the PCB; (2) sticking an anti-plating adhesive tape to the non-gold plating area; (3) utilizing the leads for gold plating in the board as the gold-plating leads to plate gold on the equilong connecting fingers; (4) tearing off the anti-plating adhesive tape; (5) coating a protective dry film on the PCB and exposing the leads for gold plating in the board; (6) etching off the leads for gold plating in the board; (7) removing the protective dry film on the PCB; and (8) carrying out resistance welding on the PCB, trimming and chamfering the PCB. The method has the following beneficial effects: in the method, the gold-plating leads are not led out from the tips of the connecting ...

Method for processing PCB

The invention discloses a method for processing a PCB, which comprises the following steps: drilling required semi-holes or whole holes in the PCB; drilling slots at positions which are adjacent to the semi-holes or the whole holes and partially cover the whole holes to form slotted semi-holes; redrilling at the original positions of the drilled semi-holes or whole holes by using a drill with the same diameter as that of each of the holes, and deburring the redrilled holes; and plating the PCB with the drilled slots and semi-holes in a manner of copper precipitation and metalizing the PCB to form metalized slotted semi-holes. By using the method for processing the PCB of the invention, the burrs rolled into the holes during drilling can be broken or extruded to a position where two holes are tangent and where the burrs are cut off by the drill. Therefore, the method has the advantages of high de-burring speed, high efficiency and low labor cost; and the situation of poor plating caused ...

Circuit breaker is controlled mutually to middling pressure of offshore platform electric wire netting

The utility model discloses a circuit breaker is controlled mutually to middling pressure of offshore platform electric wire netting, including GLSM -200 series main control unit, GLSD series drive unit, GLSV series permanent magnetism switch body and operation capacitance box, including GLSM -200 series main control unit, GLSD series drive unit, GLSV series permanent magnetism switch ontology integration integration shaping, GLSM -200 series main control unit and GLSD series drive unit through the connection of high -speed fiber communication, GLSD series drive unit pass through PID control circuit with GLSV series permanent magnetism switch body and connect, GLSD series drive unit is connected with the operation capacitance box through communication cable, has solved to produce the disturbance and influence technical problem such as equipment life electric power power supply system produced shoving and transient state impact such as overvoltage when having realized restraining on -off ...

Printed circuit board and method for machining same

An embodiment of the invention discloses a printed circuit board and a method for machining the same. The method mainly includes: laminating a first heat dissipating metal base to a position between a first sheet set and a second sheet set, wherein N heat dissipating metal columns are arranged on the first surface of the first heat dissipating metal base, and the N is a positive integer; removing part of sheets on the surface of the first sheet set so as to enable part of a column body of at least one heat dissipating metal column in the N heat dissipating metal columns on the first surface of the first heat dissipating metal base to extend out of the surface of the first sheet set; arranging a second heat dissipating metal base which is pluggable on the surface of the first sheet set, wherein part of a column body is plugged in the groove of the second heat dissipating metal base. By the arrangement, heat dissipating performance of the heat dissipating structure in the printed circuit ...

Regulating valve with segmented flow characteristics

A regulating valve with segmented flow characteristics is of a basic structure with a single valve base, and the flow characteristics of the regulating valve are determined by the geometric line of a valve element matched with the valve base. The regulating valve is characterized in that the geometric line of the valve element is composed of two sections of curves, the first section presents an equal percent flow characteristic, and the second section presents a straight line flow characteristic. The regulating valve has the advantages that the valve has practical flow characteristic curves, and implementation of precision control of flow in a wide range is facilitated; the valve serves as a flow control element in an automatic control application system, small flow and large flow are easily and stably controlled when output, and extra-regulation is not prone to occurring, for instance, when the regulating valve is applied to a control system of an oil burning boiler, flameout is not prone ...

Pim kinase inhibitor

A compound having a structure as shown in general formula (I), a deuterated compound, a stereoisomer, or a pharmaceutically acceptable salt thereof, a pharmaceutical composition comprising same, and use thereof. The compound has a good PIM kinase inhibitory effect, is a novel and ideal PIM inhibitor having high activity and low toxicity, and can be used for treating and/or preventing hematoma such as acute myeloid leukemia, bone marrow fibrosis and chronic lymphocytic leukemia, solid tumors such as gastric cancer and prostate cancer, and other diseases.

Micro-actuated switch (I)

Pim kinase inhibitor

A compound having a structure as shown in general formula (I), a deuterated compound, a stereoisomer, or a pharmaceutically acceptable salt thereof, a pharmaceutical composition comprising same, and use thereof. The compound has a good PIM kinase inhibitory effect, is a novel and ideal PIM inhibitor having high activity and low toxicity, and can be used for treating and/or preventing hematoma such as acute myeloid leukemia, bone marrow fibrosis and chronic lymphocytic leukemia, solid tumors such as gastric cancer and prostate cancer, and other diseases.

Crushing apparatus capable of simultaneously performing drying

Provided is a crushing apparatus capable of simultaneously performing drying, said apparatus comprising a drying unit and a crushing unit, the drying unit comprising a heat-carrying tube (16) and a heat source, the crushing unit comprising a crushing chamber (2), a material inlet (15), a material outlet and a crushing tool, the material inlet (15) and the material outlet being respectively arranged above and below the crushing chamber (2), the heat-carrying tube (16) and the crushing tool being arranged within the crushing chamber (2), the heat-carrying tube (16) being hollow, a bottom portion being provided with an opening, heat-carrying gas provided by the heat source entering into the crushing chamber (2) via the heat-carrying tube (16). The crushing apparatus simultaneously performs drying and crushes a material without being additionally provided with a drying chamber, prevents dust produced by the material from polluting the environment during the crushing process, prevents the material from adhering to inner walls of the crushing chamber, and implements high-efficiency material crushing and drying.

A quick release fastening actuator

Shift mechanism for electric switch

Keyswitch structure of a computer keyboard

Moisture preventing structure of switch connecting pin

Fast triggering input apparatus of rolling signals

Tow ball

ゴルフ練習用クラブ

【課題】内管、第１カウンターウェイト、第２カウンターウェイト、外管、及びグリップを備えるゴルフ練習用クラブを提供する。【解決手段】ゴルフ練習用クラブは、内管１の両端にそれぞれ第１取付穴及び第２取付穴を設け、第１カウンターウェイト３が第１取付穴に固定され、第２カウンターウェイト２が第２取付穴に固定され、外管４が内管にかぶせて装着され、グリップ５が外管の一端にかぶせて装着され、そのうち、第１カウンターウェイトの重量は第２カウンターウェイトの重量よりも重い。【効果】ゴルフ練習用クラブは、設計が簡単で、持ち運びに利便性が高く、両端にそれぞれ重量の異なる２つのカウンターウェイトを設置する。使用者は、ゴルフ練習用クラブのそれぞれの端部を握ってスイングすることで、スイングスピード及びボールを打つ力加減といった異なる練習を行うことができ、使用者の練習効果が向上する。【選択図】図１

Shopping trolley for easily loading or unloading

Improved structure for displaying case

Structure for press button of computer keyboard

Sialyl lewisx mimetics containing phenyl backbones

A light-emitting type micro switch

Control structure of multi-instruction switch

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Architecture effectively connecting rotary switch and casing