Method for controlling agricultural machine and configuration method of agricultural machine parameters

The embodiment of the invention provides a method for controlling an agricultural machine, an agricultural machine parameter configuration method and device, a processor, a storage medium and the agricultural machine. The method comprises the following steps: acquiring an operation signal of the agricultural machine in an operation process of the agricultural machine in an automatic driving mode; determining an action mode of the agricultural machine according to the operation signal, wherein the action mode comprises at least one of a left turn-around mode, a right turn-around mode and an obstacle avoidance bypassing mode; and controlling the agricultural machinery to execute an action corresponding to the action mode. Through the technical scheme, the action mode of the agricultural machine can be adjusted according to different operation requirements in the operation process of the automatic driving mode, manual participation is not needed to repeatedly adjust the action of the agricultural ...

FORM RECOGNITION METHODS, FORM EXTRACTION METHODS AND APPARATUSES THEREOF

Preparation methods of titanium dioxide porous film

The invention discloses preparation methods of a titanium dioxide porous film. A metal titanium target and a metal zinc target are sputtered with three different methods on a cleaned substrate by adopting a magnetron sputter plating method. The preparation method 1 comprises the steps of: firstly, growing a zinc oxide thin film and then growing a titanium oxide thin film. The preparation method 2 comprises the step of simultaneously growing the zinc oxide thin film and the titanium oxide thin film. The preparation method 3 comprises the steps of: firstly growing the zinc oxide thin film and the titanium oxide thin film, and then growing the titanium oxide thin film. The invention has simple preparation process; the prepared silica porous film has homogeneous distribution, controllable thickness, large specific surface, strong adhesive force and no crack; the quality of products is easier to control in the massive industrialized production, and the comprehensive production cost is lowered ...

Water constant temperature system of self-adjusting culture pond

The invention relates to a water constant temperature system of a self-adjusting culture pond, which comprises a culture pond (1), a constant temperature pump (2), a heat exchanger (3), a temperature dynamic detection and analysis control device (4), a water temperature probe (5) and a water circulating pump (6), wherein, the heat exchanger (3) is connected between the culture pond (1) and the constant temperature pump (2) through a pipeline; a pond water temperature signal detected by the water temperature probe (5) is transmitted to the temperature dynamic detection and analysis control device (4) for analysis and processing of the temperature signal; a control signal is output and transmitted to the constant temperature pump (2) for controlling operation of the constant temperature pump (2); the constant temperature pump (2) is an air energy heat pump; and the water circulating pump (6) is connected between the culture pond (1) and the heat exchanger (3). The water constant temperature ...

Liver subsection method based on CT image and system thereof

The invention discloses a liver division method based on a CT image, which comprises the following steps: firstly, an MSCTP artery sequence image and a hepatic portal vein sequence image of the abdomen are pretreated, and the outline of the liver is automatically divided to obtain the liver image; secondly, a multi-scale filtering method based on a Hessian matrix is used for strengthening blood vessels, a dividing method such as region enlargement, and the like is used for dividing the hepatic portal vein, and a three-dimensional topology thinning method is used for picking up the central line of the hepatic portal vein; the blood vessels are identified mutually in classification; distance change and Voronoi arithmetic are then used for calculation, and the outline of the liver is used for covering values to obtain division results; the three-dimensional liver division results are finally reconstructed. The system comprises a liver division module, a blood vessel strengthening dividing ...

Traditional Chinese medicine preparation for treating insect and snake bites

The invention discloses a traditional Chinese medicine preparation for treating insect and snake bites. The traditional Chinese medicine preparation is prepared from the following components in parts by weight: 20-50 parts of adder tongue herb, 15-40 parts of mock-strawberry, 10-30 parts of Chinese lobelia, 10-25 parts of poisonous buttercup herb,10-20 parts of pinellia ternate and 5-20 parts of large-leaf sculellaria barbata. The traditional Chinese medicine preparation for treating insect and snake bites is good in combination effect of raw materials, accurate in curative effect, and high in virus-relieving and inflammation-diminishing effects, and is capable of effectively treating the insect and snake bites.

Counter-flow multi-level condensation heat pump water heater

The invention discloses a counter-flow multi-level condensation heat pump water heater. The counter-flow multi-level condensation heat pump water heater comprises an air-supplying enthalpy-increasing compressor, a vortex tube refrigerator, an evaporator and more than three levels of serially connected condensers; the exhaust port of the air-supplying enthalpy-increasing compressor is connected with the air inlet of the vortex tube refrigerator, the high-temperature side exhaust end of the vortex tube refrigerator, the more than three levels of serially connected condensers, the evaporator and the air suction port of the air-supplying enthalpy-increasing compressor in turn to form a fluorine side circular flow path; and water pipes of the more than three levels of serially connected condensers are connected to form a water side circular flow path, and under the driving of water pumps of the condensers, the flowing direction of the water in the water side circular flow path is opposite to ...

Multi-stage self-adaptive household heat pump water heater

The invention relates to a multi-stage self-adaptive household heat pump water heater which comprises a hot water tank and an air source heat pump water-heating unit, wherein a main condenser close to the bottom of the hot water tank and an auxiliary condenser close to the top of the hot water tank are arranged in the hot water tank, the auxiliary condenser comprises a water inlet and a water outlet which are positioned at the upper part of the hot water tank and are arranged in the same horizontal position, the water inlet is arranged in the hot water tank, a pipeline at the water outlet of the auxiliary condenser is provided with an outlet water temperature probe, the main condenser and the auxiliary condenser are connected with the air source heat pump water-heating unit through fluorine transmission pipelines, the fluorine transmission pipeline of the main condenser is provided with a main electromagnetic valve, and the fluorine transmission pipeline of the auxiliary condenser is provided ...

Cuprous compounds and preparation methods of copper thin film by chemical vapor deposition using same

The invention discloses cuprous compounds and preparation methods of copper thin film by chemical vapor deposition using same. The cuprous compounds have a general formula shown as the formula (1): (R1COCHCOR2) CuLn (1), wherein n is 1 to 2, and the structural formula of R1 is shown as a formula (2) or is any one of CH2X1, CH2X1 (CHX1) q, NH2, H, F and Ph; the structural formula of R2 is shown as the formula (2) or a formula (3), or is any one of CH2X1, CH2X1 (CHX1) q, NH2, H, F, Ph, CH2X1O, CH2X1 (CHX1) qO and NH2O, and R3, R4 and R5 in the formula (2) is any one of CH2X1, CH2X1 (CHX1) q, NH2, H, F and Ph; R6, R7 and R8 in the formula (3) is any one of CH2X1, CH2X1 (CHX1) q, NH2, H, F and Ph, and X1 is any one of H, Ph, NH2 and F; q is 1 to 4, and L is P (O-Bu) 3 or P [O-Pr] 3; and Ph represents phenyl, Bu representsbutyl, and Pr represents propyl. The cuprous compounds have better stability and volatility in air, and are suitable for being precursors of chemical vapor deposition of copper ...

Method for producing architectural materials by using paper making sludge

The invention belongs to the technical field of environmental protection, and relates to a method for preparing a building material by using industrial wastes (paper making sludge, different steel slag, furnace cinders, waste concrete) as main raw materials and applying an accelerated carbonation technology, in particular to the method for producing the building material by using the paper making sludge. The method comprises the following steps: according to the weight ratio of between 1 to 0.5 and 1 to 4, mixing the paper making sludge with a carbonized material; adding water into the mixture and mixing the mixture evenly; pressing the mixture into a semi-finished product of the building material; and preparing the semi-finished product of the building material into a finished product of the building material under the curing of accelerated carbonation. The method effectively makes use of the industrial wastes such as the paper making sludge, reduces the emission of the greenhouse gas ...

Energy accumulation type air conditioning water chiller/heater

The invention provides an energy accumulation type air conditioning water chiller/heater. The water chiller/heater comprises a refrigerant circulation system, an air conditioner indoor unit (19), a hot water accumulation tank circulation system and an energy accumulation water tank circulation system, wherein the refrigerant circulation system comprises a refrigerant circulating pipe (G), a compressor (1), a hot water side heat exchanger (4), a fin type heat exchanger (5), an air conditioner side heat exchanger (13), an electric heating component (14) and a gas-liquid separator (15). The energy accumulation type air conditioning water chiller/heater is low in cost, can realize the functions of cold accumulation and heat accumulation, can improve the refrigerating and heating capacities, and improves the energy efficiency of the unit.

Integrated compact in-package light engine

An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chipand to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.2 Tbit/s total capacity of data communication ...

Traditional Chinese medicine preparation for treating jaundice

The invention discloses a traditional Chinese medicine preparation for treating jaundice, which includes following raw material components, by weight: 20-35 parts of selaginella moellendorfii, 15-32 parts of common scouring rush herb, 10-30 parts of lygodium japonicum, 10-25 parts of buddleja officinalis, 10-20 parts of artemisia capillaries, 10-15 parts of cape jasmine, 8-15 parts of rhizome imperata cylindrica, 6-13 parts of rhubarbs, 5-10 parts of curcuma aromatica, 3-10 parts of radix isatidis, 3-10 parts of bupleurum, 2-9 parts of poria cocos, 1-7 parts of fructus melia toosendan, 1-5 parts of dandelion, 1-5 parts of cape jasmine, 1-3 parts of cape jasmine, 0.5-2 parts of plumeria rubra and 0-2 parts of radix glycyrrhizae. The traditional Chinese medicine preparation is good in raw material composition effects, is short in treatment course and has excellent effects of completely treating the jaundice.

Plasma directional scanning antenna

The invention provides a plasma directional scanning antenna, which comprises a vacuum chamber. Cathodes and anodes which correspond to each other are arranged in the vacuum chamber; magnet field generating equipment is arranged outside the vacuum chamber; a plurality of plasma sheets are formed in the vacuum chamber; the cathodes are a plurality of cathode groups which are intersected at the same end point and positioned on the same horizontal plane; the cathode groups are connected to a plurality of high-voltage excitation power supplies through a group of fast transfer switches; the fast transfer switches control the fast switching of the plurality of plasma sheets; in included angles, the maximum flare angle between two cathodes is 90 degrees, and the other included angles of the plurality of cathodes can be uniformly or non-uniformly distributed in the range of 90 degrees so as to realize 180-degree radiation to incident electromagnetic waves; the high-voltage power supplies are used ...

Hepatic tumor comprehensive surgical planning analogy method and system thereof based on three-dimensional multimode images

The invention discloses a hepatic tumor comprehensive surgical planning analogy method and a system thereof based on three-dimensional multimode images. The method comprises the steps that firstly, a data base containing the data of an object is constructed; secondly, three-dimensional registration and fusion are conducted on the medical images, having different modes or single mode and differentperiods, of the object; thirdly, a specific tissue is divided by the automatic and semi-automatic modes, and the three-dimensional modeling of important tissues in and around the liver is realized bythe three-dimensional reconstruction technology so as to reconstruct an abdominal three-dimensional model having the immersion and interaction features; fourthly, before-simulation comprehensive riskanalysis is conducted based on the modeling result, referred to the practice guidelines and combined with the object information; and finally, all kinds of simulation surgical plans are designed according ...

Integrated heat pump water heater

The invention relates to an integrated heat pump water heater comprising a compressor (1), a copper coil tube (2), a bearing heat preservation water tank (3), a throttle mechanism (4) and a generator (5), wherein, the compressor (1) is connected with the bearing heat preservation water tank (3) and the generator (5); the throttle mechanism (4) is arranged on a connection pipeline of the generator (5) and the bearing heat preservation water tank (3); the bearing heat preservation water tank (3) is positioned at the upper part of a host; the copper coil tube (2) is wounded on the bearing heat preservation water tank (3) after being pressed; and the bearing heat preservation water tank (3) is a clear water porcelain enamel inner container. In the using process, the copper coil tube is completely insulated with water, namely the electricity is leaked from the host, and the water does not electrify, thus greatly improving the safety; the chlorine icon in the water has no influence on the clear ...

Regeneration aggregate made of carbonized maintaining castoff

The invention relates to a recycled aggregate made by pre-adding water to carbonated curing wastes for forming balls which absorb carbon dioxide gas in industrial waste gas, which belongs to the building material technique field. The recycled aggregate is made by adopting the following processes of: utilizing steel slag or cement containing carbonization compositions as a raw material, adding water for even mixture, and implementing the granulation for spheroidizing so as to make the recycled aggregate under the curing of carbonization gas; and the carbonization compositions include one or more than one of calcium oxide, calcium hydroxide, dicalcium silicate, tricalcium silicate, hydrated calcium silicate, hydrated calcium aluminate, hydrated calcium ferrite, ettringite, magnesium hydroxide and magnesium oxide, and the carbonization compositions have a weight percentage of no less than 30 percent in materials. The recycled aggregate has the main point that: the accelerated carbonization ...

Simple method for removing trace bromate ion in water

The invention discloses a simple method for removing trace bromate ion in water. The method comprises the following steps that: a thin polyaniline film is synthesized by a constant potential mode under a proper electric potential by using a three-electrode system; and the thin polyaniline film with stable property is obtained. The thin film on the surface of the electrode has an excellent electrocatalytic activity for the bromate ion; by an electrochemical catalytic reduction reaction, the bromate ion which has the same trace amount in natural water is reduced to a national standard; and the bromate solution with higher concentration has better transferring and removing efficiencies. When pH value is equal to 6-8, and the bromate ion with initial concentration 2ppm is removed to the concentration 20 ppb. The method has the following advantages of convenience, low cost, no adjustment of pH value, and better application value and market prospect.

Hitting game apparatus

Auditory localization wireless measurement method

The invention belongs to the fields of measurement and wireless communication, disclosing a sound localization-based wireless measuring method. Firstly, a plurality of wireless acoustic sensors are arranged in a designated area; the coordinates of the sensors are confirmed, and one of the wireless sensors is used as a data aggregation and processing point; a positioning method by means of receiving a signal energy is adopted to localize the sound; a plurality of wireless acoustic sensors are used for measuring a sound signal sent by a target; and a plurality of the most suitable sensors are selected to participate into the sound localization according to a measured sound signal intensity so as to localize the sound by the positioning method by means of receiving the signal energy. In order to overcome the influence of noise and heterogeneity of a medium and to improve positioning accuracy, the problem of an equation set solution is changed into an optimization problem; and a steepest descent ...

Hepatic portal vein tree modeling method and system thereof

The invention discloses a hepatic vein vascular tree modeling method and a system thereof. The method comprises the following steps: using a liver model to obtain a liver image, and utilizing the multi-scale filtration method to strengthen a blood vessel; cutting a hepatic vein; extracting a central line of the hepatic vein; detecting and removing a link in the central line; and utilizing OSG/VTKto rebuild the hepatic vein vascular tree after pruning. The system comprises an image acquisition module, a blood vessel strengthening module, a blood vessel cutting module, a vascular tree central line extracting module and a vascular tree rebuilding module. The invention improves similarity functions in the filtering process, analyzes the characteristics of the ring and adopts corresponding unlinking methods for different links; and utilizes the relation of radius of blood vessel and the branch length when pruning. The invention effectively enhances the hepatic vein, improves the contrast between ...

Method for preparing ferric oxide yellow pigment by waste iron hydrochloric acid lotion

The invention discloses a method for preparing ferric oxide yellow pigment by waste iron hydrochloric acid lotion, which adopts a wet oxidation method. The method comprises the following steps: processing the waste iron hydrochloric acid lotion; preparing a crystal seed; fading red; carrying out two-step oxidation; pressing and filtering; and drying. The method can rapidly and simply process the waste iron hydrochloric acid lotion with lower ferrous concentration, more impurity iron content and higher acidity, which is discharged by industries, such as metallurgy, steel, machinery, chemistry,pharmacy, and the like, the waste iron hydrochloric acid lotion can reach the Chinese allowed discharge standard, and the ferric oxide yellow pigment which can be used for industries, such as construction, paint, and the like is prepared.

Double-position rotary automatic welding machine

The invention discloses a double-position rotary automatic welding machine, which comprises a rack and welding chambers symmetrically arranged at two sides of the top part of the rack, wherein a pair of welding guns is arranged in each welding chamber symmetrically; the welding machine further comprises a rotary working platform and a pair of positioning devices, the rotary working platform is positioned below the welding chamber and comprises a rotating shaft, a rotary platform and a driving motor for driving the rotating shaft, and workpiece assembling slots are formed on the outer side of the rotary platform uniformly; and the positioning devices between the welding guns and the rotary working platform are positioning slots formed by two pieces of symmetrically arranged trapezoidal bending plates with opposite tops, and the width of the positioning slots is matched with that of a square steel pipe. The invention is capable of continuously and automatically welding sealing blocks at the ...

Method for producing architectural materials by using paper making sludge

The present invention belongs to the technical field of environmental protection, and relates to a method for preparing a building material by using industrial wastes (paper making sludge, different steel slag, furnace cinders, waste concrete) as main raw materials and applying an accelerated carbonation technology, in particular to the method for producing the building material by using the paper making sludge. The method comprises the following steps: according to the weight ratio of between 1 to 0.5 and 1 to 4, mixing the paper making sludge with a carbonized material; adding water into the mixture and mixing the mixture evenly; pressing the mixture into a semi-finished product of the building material; and preparing the semi-finished product of the building material into a finished product of the building material under the curing of accelerated carbonation. The method effectively makes use of the industrial wastes such as the paper making sludge, reduces the emission of the greenhouse ...

Traditional Chinese medicine preparation for treating rheumatism

The invention discloses a traditional Chinese medicine preparation for treating rheumatism, which includes following raw material components, by weight: 25-50 parts of litsea cubeba, 15-40 parts of lindera glauca, 13-35 parts of eleutherine americana, 10-30 parts of lindera communis, 10-25 parts of fissistigma polyanthum, 10-20 parts of desmos chinensis, 5-20 parts of kadsura heteroclite, 5-15 parts of illicium simonsii and 3-10 parts of ficus tinctoria. The traditional Chinese medicine preparation is good in raw material combination effect, is convenient to prepare and can effectively treat the rheumatism.

Adaptive self-regulating energy-saving heat pump water heater and operation method thereof

The invention discloses an adaptive self-regulating energy-saving heat pump water heater, which comprises a compressor 1 (1), a four-way valve 1 (3), a liquid accumulator 1 (7), an expansion valve 1 (9) and a vapor-liquid separator 1 (15) connected in turn in a first compressor system, a compressor 2 (2), a four-way valve 2 (4), a liquid accumulator 2 (8), an expansion valve 2 (10) and a vapor-liquid separator 2 (6) in a second compressor system, and a condenser assembly (11), an evaporator assembly (12) and a control valve (13) shared by the two systems. The heat pump water heater is characterized in that: the two liquid accumulators are connected together through a copper pipe, and inlets and outlets of the condenser assembly and the evaporator assembly are provided with six electromagnetic valves for controlling the flow direction of a refrigerant. The operation method for the adaptive self-regulating energy-saving heat pump water heater has a strong heat mode, an energy-saving mode ...

Integrated machine with functions of air conditioner, water heater and floor heating thermostat

The invention relates to an integrated machine with functions of air conditioner, water heater and floor heating thermostat. The integrated machine comprises a host machine and a hot water tank which is connected with the host machine, wherein the host machine of the integrated machine comprises an air conditioning system, a water heating system and a floor heating system; the hot water tank comprises an air conditioning condenser and a hot water condenser; the air conditioning system is connected with the air conditioning condenser; the water heating system is connected with the hot water condenser; and the path for communicating the air conditioning system and the air conditioning condenser is provided with a three-way valve. The integrated machine with functions of air conditioner, water heater and floor heating thermostat of the invention can realize independent water heating, air conditioning refrigerating and heating or floor heating, save energy and reduce installation space and ...

Action simulating equipment, system and method for entertainment

The present invention relates to an amusement-used action simulator, system and method. The simulator includes a TV equipment, action equipments and a control equipment. The TV equipment includes a screen and projector components. The action equipments includes a vehicle frame, a seat frame which is arranged under the vehicle frame, and the level pushing components which drive the vehicle frame doing level and reciprocating motion. The control equipment controls the level pushing components and drives the seat frame following the vehicle to do level motion anear or away from the screen, when the level pushing components drive the vehicle frame doing level motion. The rising and descending of the seat can be realized by level pushing components pushing the seat frame to do level and forward and backward motion, and can also be realized by pushing and swinging components, accordingly, the takeoff and descendent feelings can be simulated. Because the motion directions of all seats are uniform ...

Hepatic portal vein tree modeling method and system thereof

The invention discloses a hepatic vein vascular tree modeling method and a system thereof. The method comprises the following steps: using a liver model to obtain a liver image, and utilizing the multi-scale filtration method to strengthen a blood vessel; cutting a hepatic vein; extracting a central line of the hepatic vein; detecting and removing a link in the central line; and utilizing OSG/VTK to rebuild the hepatic vein vascular tree after pruning. The system comprises an image acquisition module, a blood vessel strengthening module, a blood vessel cutting module, a vascular tree central line extracting module and a vascular tree rebuilding module. The invention improves similarity functions in the filtering process, analyzes the characteristics of the ring and adopts corresponding unlinking methods for different links; and utilizes the relation of radius of blood vessel and the branch length when pruning. The invention effectively enhances the hepatic vein, improves the contrast between ...

Oxygen-controlled aluminum-rich high-entropy alloy composite material and preparation method thereof

The invention relates to the technical field of abrasion and corrosion resistance protection, in particular to an oxygen control aluminum-rich high-entropy alloy composite material and a preparation method thereof. The preparation method of the oxygen-controlled aluminum-rich high-entropy alloy composite material comprises the steps that Al powder, Cr powder, Fe powder and Ni powder are weighed according to the molar ratio of a: b: c: d and then put into an inflatable ball-milling tank, vacuumizing is conducted, and inert gas is filled into the inflatable ball-milling tank; wherein the value range of a is 1.5 to 3; the value range of a, b, c and d is 0.9-1.1; carrying out ball milling, and naturally cooling for 3-7 hours after the ball milling is completed; starting the ball mill again and simultaneously filling oxygen for ball milling, and naturally cooling for 5-10 hours after ball milling is completed; and the composite powder material is taken out and pressed into a blank, then the ...

Constant-temperature variable energy-saving water heater

The invention disclose an constant-temperature variable energy-saving water heater, which comprises a system control device and a heat pump system, wherein the system control device is arranged on a water storage tank; the heat pump system consists of a compressor, an evaporator, a throttle valve and a condenser and is provided with a first waterway pipe and a second waterway pipe which are communicated with a cold water main pipe; the other end of the first waterway pipe is communicated with a cold-hot water mixing valve, and a first waterway switching valve is arranged in a path from the other end of the first waterway pipe to the cold-hot water mixing valve; a second waterway switching valve is arranged in a hot water outlet pipe; the other end of the second waterway pipe is communicated with the second waterway switching valve, and a recycle pump, a flow transducer, the condenser, an outflow water temperature detector and a third water-path switching valve are connected in turn in a ...

Automatic adjusting method, device and system for emission line angle of puncture needle probe

The invention provides an automatic adjusting method for an emission line angle of a puncture needle probe. The method comprises the following steps: primarily adjusting a scanning line emission angle of the probe; emitting and obtaining puncture echo data; carrying out needle body identification on the puncture echo data, and calculating an inclined angle of a needle body; calculating an optimal scanning line emission angle of the probe according to the inclined angle of the identified needle body; and adjusting the scanning line emission angle according to the calculated optimal scanning line emission angle condition. The invention further provides corresponding device and system. By the aid of the method, the scanning line emission angle can be automatically adjusted according to the position of a puncture needle.

Intelligent hydrogenation machine

The invention discloses an intelligent hydrogen adding machine, and particularly relates to the technical field of hydrogen adding machines, the intelligent hydrogen adding machine comprises a hydrogen adding machine body, a supporting frame is arranged above the hydrogen adding machine body, and a safety mechanism is arranged at one end of the supporting frame; the safety assembly comprises a vehicle guide rail arranged at one end of the supporting frame, and a plurality of transmission shaft rods movably connected through bearings are embedded into the top end of the vehicle guide rail. A safety mechanism is adopted to enable a vehicle to be located under a vehicle guide rail, a positioning linkage belt is guided to move on the outer walls of a plurality of transmission shaft rods, and a linkage concave plate moves along a track of the vehicle guide rail; the connecting rope drives the hydrogen detector to move back and forth along the periphery of the hydrogenation vehicle to detect ...

Traditional Chinese medicine preparation for treating pulmonary tuberculosis

The invention discloses a traditional Chinese medicine preparation for treating pulmonary tuberculosis. The preparation is composed of the following components in parts by weight: 30 to 58 parts of herba tripterospermi, 20 to 47 parts of mulberry bark, 17 to 43 parts of asparagus fern, 15 to 40 parts of pratia nummularia, 10 to 33 parts of physalis angulata, 10 to 20 parts of dioscorea esquirolii, and 7 to 12 parts of flos farfarae. The preparation has the advantages of reasonable formula, simple preparation technology, and prominent curative effect, and is capable of treating pulmonary tuberculosis effectively.

Method for preparing ferric oxide yellow pigment by waste iron hydrochloric acid lotion

The invention discloses a method for preparing ferric oxide yellow pigment by waste iron hydrochloric acid lotion, which adopts a wet oxidation method. The method comprises the following steps: processing the waste iron hydrochloric acid lotion; preparing a crystal seed; fading red; carrying out two-step oxidation; pressing and filtering; and drying. The method can rapidly and simply process the waste iron hydrochloric acid lotion with lower ferrous concentration, more impurity iron content and higher acidity, which is discharged by industries, such as metallurgy, steel, machinery, chemistry, pharmacy, and the like, the waste iron hydrochloric acid lotion can reach the Chinese allowed discharge standard, and the ferric oxide yellow pigment which can be used for industries, such as construction, paint, and the like is prepared.

Freezing and refrigerating device with hot water supply

The invention relates to a freezing and refrigerating device with hot water supply, comprising an air compressor, a dryer, a heat regenerator, a freezing and refrigerating device, a vortex tube refrigeration device, a hot water heat exchange device and an ejector. The freezing and refrigerating device with hot water supply is characterized in that the air compressor is connected with the heat regenerator through the dryer, the heat regenerator is connected with the vortex tube refrigeration device through the freezing and refrigerating device, and the vortex tube refrigeration device is connected with the air compressor through the hot water heat exchange device, the heat regenerator and the ejector. The invention has the advantages that a freezing and refrigerating function and a hot water function are combined into a whole, no Freon refrigerant is needed to be used, and a design requirement can be met by directly adopting air circulation.

Frequency conversion control method for heat pump water heater

The invention relates to a frequency conversion control method for a heat pump water heater. The frequency conversion control method for the heat pump water heater is characterized by comprising the following steps of: performing frequency conversion control on a compressor of the heat pump water heater; performing frequency conversion control on a throttle mechanism of the heat pump water heater; performing frequency conversion control on a defrosting mechanism of the heat pump water heater; and performing frequency conversion control on an exhaust temperature of the heat pump water heater. The frequency conversion control method for the heat pump water heater has the advantages of high heating speed, few start-stop times, small temperature fluctuation of a water tank and energy conservation. At a high ambient temperature, the frequency of the compressor can be reduced and the circulating flow quantity of a system can be reduced, so that the suction pressure is reduced and the stable operation ...

Skid-mounted hydrogenation system for automobile

The invention belongs to the field of preparation of hydrogenation devices, and particularly relates to a skid-mounted hydrogenation system for an automobile. Comprising a hydrogen discharging system and a nitrogen purging system, the hydrogen discharging system comprises a first hydrogen inlet, the first hydrogen inlet is communicated with the hydrogen discharging system, a hydrogen outlet of the hydrogen discharging system is communicated with a hydrogen inlet of a gas compressor through a first pipeline, and the first pipeline is further communicated with a hydrogen inlet of a hydrogen adding machine through a direct charging pipeline 4; a first check valve is arranged on the first pipeline, and a first filter, a first pneumatic cut-off valve and a second check valve are sequentially arranged on the direct filling pipeline from left to right. According to the invention, equipment loss can be reduced, air supply is stable, and explosion occurs in the conveying process.

Multi-axis hydraulic synchronization control system, method and device

The invention discloses a multi-axis hydraulic synchronization control system, method and device, and belongs to the technical field of synchronization control. The system comprises a controller, a digital-to-analogue conversion module, at least two hydraulic proportional valves and position feedback devices the number of which is equal to the number of the hydraulic proportional valves; the controller is connected with each hydraulic proportional valve through the digital-to-analogue conversion module, and each hydraulic proportional valve can drive a hydraulic cylinder which is connected with each hydraulic proportional valve; each position feedback device is respectively connected with the controller, each position feedback device can detect the position of each hydraulic cylinder, andtransmits the detected position data to the controller; and the controller can control each hydraulic proportional valve according to the position data of each hydraulic cylinder transmitted by each position ...

Vehicle-mounted volume measurement method, system and device and storage medium

The invention discloses a vehicle-mounted wood volume measurement method, system and device and a storage medium, and belongs to the technical field of vehicle-mounted wood volume measurement, and the method comprises the steps: obtaining an image of the end face of each vehicle-mounted wood, and taking the image as a training sample set; noise reduction processing, camera calibration and feature recognition processing are carried out on the images in the training sample set, and size detection is carried out on the finally extracted contour; performing transformation or enhancement processing on the images in the training sample set to increase training samples; wood volume parameters and a calculation formula are initialized according to different types of vehicle-mounted wood volume objects in live wood transaction; inputting the training sample into a deep learning network for training by adopting an artificial intelligence algorithm to obtain an AI model for calculating the wood diameter ...

Health food with beauty-maintaining fatigue-resisting effects and preparation method thereof

The invention relates to the technical field of health food, and discloses health food with beauty-maintaining fatigue-resisting effects and a preparation method thereof. Ginkgo biloba extractive and cassia seed extractive are employed, and other raw materials are auxiliary materials. The health food has effects of maintaining beauty, caring health and alleviating eye fatigue.

Method for preparing titanium dioxide thin film with large specific surface area

The invention discloses a method for preparing a titanium dioxide thin film with large specific surface area. In the method, a laminated composite film of zinc and titanium dioxide and a laminated composite film of zinc oxide and titanium dioxide are prepared on a cleaned substrate in a laminated sputter coating mode by a physical vapor deposition method respectively; in addition, a mixed composite film of which the zinc oxide and the titanium dioxide are mutually doped is prepared by a target mixed plating method; and the composite films prepared by the methods are acidified in different modes to prepare the titanium dioxide thin film with the large specific surface area. A preparation process of the method is highly controllable; the prepared titanium dioxide film has the advantages of large specific surface area, uniform distribution, adjustable thickness and high adhesion; the quality of a product is easy to control during large-scale industrial production; the comprehensive production ...

Environmental protection bag

The invention relates to a daily life article, in particular to a hand bag. The hand bag comprises an outer bag (1) and a grip (2), and is characterized by that an inner bag (3) is arranged in the outer bag (1), a layer of thin film (4) is arranged in the inner bag (3), the inner bag (3) is connected to the bottom of the outer bag (1), and the thin film (4) in the inner bag (3) is plastic thin film. The environmental protection bag in the invention has multiple layers, so that different products can be bagged in separation, such as food and garbage, thus solving problems of sanitation and food safety, being favorable for bagging with convenient and protecting the environment.

Liver subsection method based on CT image and system thereof

The invention discloses a liver division method based on a CT image, which comprises the following steps: firstly, an MSCTP artery sequence image and a hepatic portal vein sequence image of the abdomen are pretreated, and the outline of the liver is automatically divided to obtain the liver image; secondly, a multi-scale filtering method based on a Hessian matrix is used for strengthening blood vessels, a dividing method such as region enlargement, and the like is used for dividing the hepatic portal vein, and a three-dimensional topology thinning method is used for picking up the central line of the hepatic portal vein; the blood vessels are identified mutually in classification; distance change and Voronoi arithmetic are then used for calculation, and the outline of the liver is used for covering values to obtain division results; the three-dimensional liver division results are finally reconstructed. The system comprises a liver division module, a blood vessel strengthening dividing ...

Cuprous compounds and preparation methods of copper thin film by chemical vapor deposition using same

The invention discloses cuprous compounds and preparation methods of copper thin film by chemical vapor deposition using same. The cuprous compounds have a general formula shown as the formula (1): (R1COCHCOR2) CuLn (1), wherein n is 1 to 2, and the structural formula of R1 is shown as a formula (2) or is any one of CH2X1, CH2X1 (CHX1) q, NH2, H, F and Ph; the structural formula of R2 is shown as the formula (2) or a formula (3), or is any one of CH2X1, CH2X1 (CHX1) q, NH2, H, F, Ph, CH2X1O, CH2X1 (CHX1) qO and NH2O, and R3, R4 and R5 in the formula (2) is any one of CH2X1, CH2X1 (CHX1) q, NH2, H, F and Ph; R6, R7 and R8 in the formula (3) is any one of CH2X1, CH2X1 (CHX1) q, NH2, H, F and Ph, and X1 is any one of H, Ph, NH2 and F; q is 1 to 4, and L is P (O-Bu) 3 or P [O-Pr] 3; and Ph represents phenyl, Bu represents butyl, and Pr represents propyl. The cuprous compounds have better stability and volatility in air, and are suitable for being precursors of chemical vapor deposition of copper ...

Energy-saving solar air source heat pump multifunctional machine

The invention relates to an energy-saving solar air source heat pump multifunctional machine, comprising a solar heating device and an air source heat pump heating device, and further comprising a refrigeration and heating water circulation loop, a sunlight-free independent heating water circulation loop, a weak-sunlight independent heating water circulation loop, a strong-sunlight independent heating water circulation loop and an independent refrigeration circulation loop. The energy-saving solar air source heat pump multifunctional machine of the invention organically combines solar energy with an air source heating pump, so that heat of the solar energy is fully used for solving a problem of being lack of heat in the air source heating pump, and heating capacity and energy efficiency ratio of products are both improved.

Logical adaptation method, system and logical adaptation interface

The embodiment of the invention discloses a logical adaptation method, a system and a logical adaptation interface. The method is applied to a programmable logic device, and comprises the steps of: receiving a data signal transmitted by an peripheral component interconnect bus interface; and converting the received data signal into a preset logic interface data signal according to the logic model matched with the peripheral component interconnect bus interface, wherein the logic interface data signal is matched with the logic application of an access device. By adopting the method provided by the embodiment of the invention, the data signal sent by the access device can be matched with the logic application of the access device.

Infrared laser currency detection system

The invention discloses an infrared laser currency detection system and relates to a currency detection system. The system comprises a recognition system, a currency conveying mechanism and a motion control system, wherein the recognition system comprises a fluorescence area recognition system; the fluorescence area recognition system is connected with the motion control system and comprises an excitation light source and a recognition module, and the recognition module is connected with the motion control system; the fluorescence area recognition system of the recognition system is an infrared recognition system; and the infrared recognition system comprises an excitation light source and a recognition module, the excitation light source is an infrared light source capable of emitting 980 nm light rays, and the recognition module receives and recognizes visible light emitted by an infrared fluorescence area through stimulation and is connected with the motion control system. The system ...

METHODS AND APPARATUSES FOR PROCESSING IMAGE AND IDENTITY VERIFICATION, ELECTRONIC DEVICES, AND STORAGE MEDIA

Integrated compact in-package light engine

An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chip and to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.2 Tbit/s total capacity of data communication ...

Electromagnetical four-way valve connection in parallel reversing arrangement used for heat pump set

Goods-fleeing preventing method of medicine

The invention provides a goods-fleeing preventing method of medicine, comprising the following steps: (1) setting goods-fleeing preventing information on a minimum sales packing box of medicine, and storing the information to be investigated when the medicine is sold; (2) collecting the information on goods-fleeing packages; (3) matching the collected information with the stored information when selling to confirm a sale area of goods so as to search out the source of goods-fleeing. The method is characterized in that the embedded goods-fleeing preventing information is integrated with numbers of lot identification mark, production date and effective period till by code spraying or laser technology, thereby not influencing the reading of the numbers of lot identification mark, production date and effective period till and also being capable of distinguishing the goods-fleeing preventing information clearly and guaranteeing that the goods-fleeing preventing information is not smeared or ...

Product anti-fake anti-channel conflict coding method

The invention provides a product anti-fake anti-channel conflict coding method. The coding method comprises the following steps: (1) setting anti-fake anti-channel conflict coding information on a product according to the coding method, and saving the coding information for checking; (2) collecting the product coding information; and (3) comparing the collected information with the coding method and the coding information in a database to confirm the authenticity of the product and confirm the distribution region of the product. The coding method not only can solve the anti-fake problem of the product, but also can effectively prevent and control the occurrence of channel conflict action.

Plasma excitation power supply

The invention discloses a plasma excitation power supply, which comprises a primary rectifying and filtering circuit, a primary high frequency inverting circuit, a primary amplifying circuit, a secondary rectifying and filtering circuit, a secondary high frequency inverting circuit, a single chip control circuit, a secondary amplifying circuit, a last rectifying and filtering circuit, a current-limiting reflux device and a pulse output circuit. The power source adopts dual-stage high frequency inverting and amplifying technology to generate output of high voltage wide pulse, thus having automatic constant voltage function. Another inversion is carried out on the rectified voltage after primary amplification, and pulse chopping is carried out during inversion. Pulse type high frequency voltage is subject to secondary amplification followed by rectification and filtration to form needed high voltage square wave. The pulse signal is controlled by the single chip, and the generated pulse signal ...

Proportional control type one-time heating heat pump water heater

The invention relates to a proportional control type one-time heating heat pump water heater. A heat storage water tank is connected with a double-system condenser through a pipeline; the double-system condenser is provided with two sets of heating systems, namely a heating system I and a heating system II; the upper outlet J of the heating system I is connected with the lower outlet G of the heating system II through a two-way electromagnetic valve, the lower outlet I of the heating system I is connected with the upper outlet H of the heating system II, and the outlet H and the outlet G forma loop through a three-way electromagnetic valve; and the heat storage water tank is provided with a water inlet valve, the water inlet valve is connected with the heat storage water tank through a three-way proportional temperature adjusting valve, and a water pump is arranged between the three-way proportional temperature adjusting valve and the three-way electromagnetic valve. By identifying the ...

Five-axis full-automatic reciprocating paint spraying machine

The invention provides a five-axis full-automatic reciprocating paint spraying machine, which comprises a frame, a workpiece disc on a working table of the frame, an X-axis servo system, a Y-axis servo system and a Z-axis servo system which are arranged on the frame, and a spray gun mounting mechanism and a control system which are arranged below the Z-axis servo system. The spray gun mounting mechanism comprises a spray gun swing arm mechanism and a spray gun rotating mechanism arranged at the lower end of the spray gun swing arm mechanism; the spray gun swing arm mechanism is connected with an output shaft side wall flange of a swing arm speed reducer of a swing arm driving part through a connecting piece; the swing arm driving part of the spray gun swing arm mechanism is arranged on the connecting piece at the lower end of a Z-axis mechanism; the swing arm driving part drives the spray gun rotating mechanism; the spray gun rotating mechanism comprises a bevel driving wheel fixed on a ...

Horizontal oscillating bar four-wheel rover

The invention discloses a horizontal oscillating bar four-wheel rover, and relates to a four-wheel rover to solve the problem that a four-wheel rover has low terrain adaptability and low obstacle performance and cannot complete complicated exploration missions on the planet surface or in other severe environments. The rover body is fixedly connected with a vertical bar; a cross-bar is orthogonal to the vertical bar and is rotatably connected to the vertical bar; the front end of an independent oscillating bar is hinged to the lower rear end of the vertical bar, while the rear end is fixedly connected with a rear steering device; the independent oscillating bar is connected with the vertical bar through a second spring; the rear steering device is hinged with a rear steering wheel through a rear wheel side link; the front end of the vertical rod is connected with the upper end of a front wheel side link through a front steering device; the lower end of the front wheel side link is hinged ...

Plasma omnidirectional scanning antenna

The invention provides a plasma omnidirectional scanning antenna, which comprises a vacuum chamber. Cathodes and anodes which correspond to each other are arranged in the vacuum chamber; magnetic field generating equipment is arranged outside the vacuum chamber; and a plurality of plasma sheets are formed in the vacuum chamber. The plasma omnidirectional scanning antenna is characterized in that:the cathodes are a plurality of cathode groups which are intersected at the same end point and positioned on the same horizontal plane; the cathode groups are connected to a plurality of high-voltageexcitation power supplies through a group of fast transfer switches; the fast transfer switches control the fast switching of the plurality of plasma sheets; in included angles, the maximum flare angle between two cathodes is near 180 degrees, and the other included angles of the plurality of cathodes can be uniformly or non-uniformly distributed in the range of 180 degrees so as to realize omnidirectional ...

Traditional Chinese medicine preparation for treating hypertension

The invention discloses a traditional Chinese medicine preparation for treating hypertension. The traditional Chinese medicine preparation is prepared from the following components in parts by weight: 20-50 parts of nightshade, 15-40 parts of cassia occidentalis, 10-30 parts of chinese mesona herb, 10-25 parts of crotalaria mucronata, 10-20 parts of sophora japonica, 5-20 parts of flos magnolia, 5-15 parts of platycladus orientalis and 3-10 parts of mulberry bark. The traditional Chinese medicine preparation for treating hypertension is good in combination effect of raw materials, fast in acting, and low in price, and is capable of effectively treating hypertension.

Hydraulic separation device for humified garbage and method for separating humified garbage

The invention discloses a hydraulic separation device for humified garbage and a method for separating the humified garbage, belonging to the field of garbage disposal. The upper part of the device is connected in series with a third-level hydroseparator, a descending pipe is connected in series with the third-level hydroseparator, a residue sediment cylinder is arranged below a first-level hydroseparator, a second-level hydroseparator and the third-level hydroseparator are respectively connected with a sludge sediment hopper, the residue sediment cylinder is connected with an independent residue discharge valve, the sludge sediment hopper is connected with a sludge discharge valve, the residue discharge valve and the sludge discharge valve are connected with a solid-liquid separation box, a return pipe is arranged at the upper part of the hydroseparator and communicated with a circulating water tank, the inside of the circulating water tank is provided with a water circulation pump, and ...

Suspension gear and hanger suspending method used in low gravity experiment of planetary rover

The invention provides a suspension gear and a hanger suspending method used in the low gravity experiment of a planetary rover. The planetary rover comprises a suspension mechanism. The invention is characterized in that the suspension gear comprises a set of suspension mechanisms, a plurality of pairs of suspension points, a plurality of isometric slings, a constant force stay cable suspension point and a constant force stay cable, wherein the set of suspension mechanisms is arranged above the planetary rover and has the same configuration and size as the suspension mechanism of the planetary rover; the suspension points are respectively arranged in the up-down corresponding positions on the planetary rover and the suspension mechanisms; the isometric slings connect each pair of suspension points corresponding to each other up and down; the constant force stay cable suspension point is arranged above the suspension mechanisms and is positioned on the same vertical line with the center ...

Method for reflection of electromagnetic waves

The invention relates to a method for the reflection of electromagnetic waves, which is characterized in that: instead of using a conventional solid metal surface as a reflecting electromagnetic wave surface, the method uses a plasma technique to generate a plasma sheet serving as a reflecting surface of the electromagnetic waves to realize the reflection of the electromagnetic waves. The plasma density is adjusted by adjusting the voltage of an external excitation power supply to meet the reflection requirements on the electromagnetic waves with different frequencies; the shape of the plasma sheet is adjusted by an externally provided axial magnetic field to form curved-surface or planar plasma sheet; and by utilizing a method for using a non-solid form plasma surface as the reflecting surface, the shape of the reflecting surface can be flexibly changed and the electromagnetic waves with different frequencies can be selectively reflected.

Memory table based phone number level settlement cost analysis system

A memory table based phone number level settlement cost analysis system is characterized in that timely statistics and analysis of the phone number cost of a user is realized by way of memory tables and other accounting domain system sharing is provided; the analyzed service scope covers all the inter-network settlement and inner-repartition service data; and simultaneously new increase and off-network analysis and statistics are carried out on the number of the users in the home network and in the different networks. The system adopts the wide table model designed according to the teleservice model to cover all the services operated by telecom, and adopts the mode of statistics in the memory, thus reducing the consumption of data read-write and the transaction operations which seriously occupy the system resources and greatly improving the analysis and statistics efficiency. The system can timely reflect the development situations of the clients of the home network and other operators ...

Device for reflection of electromagnetic waves

The invention relates to a device for the reflection of electromagnetic waves, which is characterized by comprising a vacuum chamber (3), wherein a cathode (2) and a anode (1) are arranged in the vacuum chamber (3), and the cathode (2) and the anode (1) are externally connected with an excitation power supply; and a magnetic field generator (4) is arranged outside the vacuum chamber (3) and is used for generating an axial magnetic field vertical to the cathode (2) and the anode (1), and the axial magnetic field convolutes electrons to generate secondary ionization so as to form a plasma sheet (5) in the vacuum chamber (3). The cathode (2) is a hollow or solid filamentary cathode made of brass. The anode (1) is plate-like or rod-like. The magnetic field outside the vacuum chamber (3) is a permanent magnetic field or is generated by a coil sleeved outside the vacuum chamber, and the coil is connected with a direct current supply. The electromagnetic waves of different frequency bands can ...

Parallel-flow two-stage condensation heat pump water heater

The invention relates to a parallel-flow two-stage condensation heat pump water heater comprising an air-supply enthalpy-rise compressor, a first-stage condenser, a second-stage condenser, a vortex tube refrigerator, an economizer and an evaporator; an exhaust port of the air-supply enthalpy-rise compressor is connected with the first-stage condenser, the air inlet end of the vortex tube refrigerator, the low-temperature exhaust end of the vortex tube refrigerator, the economizer, a throttling valve, the evaporator and an air entry of the air-supply enthalpy-rise compressor in sequence to form a fluorine collateral circulation flow path; and the first-stage condenser and the second-stage condenser are connected by a water pipe to form a water collateral circulation flow path. Under the driving of the water pump, the water flowing direction of the water collateral circulation flow path is same with the fluorine flow direction in the fluorine collateral circulation flow path, therefore,the ...

Riverway water quality monitoring device

The invention relates to the field of water quality detection equipment, in particular to a riverway water quality monitoring device which comprises a sealing shell and a water quality detector arranged in the sealing shell, a floating plate is installed on the sealing shell, a rotating screw is installed on the floating plate, and a detection probe of the water quality detector is located outside the sealing shell. Wherein a winding rod is rotationally arranged on the sealing shell, a driving piece for driving the winding rod to rotate is arranged on the sealing shell, a connecting rope is wound on the winding rod, one end of the connecting rope is connected with a sampling box, an opening is formed in the top of the sampling box, the detection probe penetrates through the opening, a water pipe is arranged at the top of the sampling box, and a valve is arranged on the water pipe. The probability that the water quality monitoring device sinks to the water bottom is reduced, water quality ...

Sugar-free type health-care tea beverage and preparation method thereof

The invention discloses a health-care tea. The health-care tea provided by the invention is sweet and delicious, is prepared by compounding medicines such as desmodium triquetrum, buckwheat tea, licorice root and herba houttuyniae, and is an ideal summer beverage capable of clearing summerheat, engendering fluid and slaking thirst. Besides, the health-care tea has a suppressing effect for obesity and hypertension, and is a good item for reducing blood pressure and lipid. The health-care tea has relatively good nutritional value and medicinal value. The health-care tea is reasonable in formula, simple to process and convenient for drinking, has no side effect, and is suitable for people of all ages.

Method for producing hydrochloride of dopamine D4 receptor agonist A-412997

The invention discloses a method for producing hydrochloride of a dopamine D4 receptor agonist A-412997. The method comprises the following steps of: obtaining lithium pyridine by using a cheap reagent of butyl lithium as an exchange reagent; reacting with N-Boc-4-piperidone to obtain a compound of 1-N-Boc-4-(2-pyridyl)-4-hydroxypiperidine; removing water molecules, adding Boc, hydrogenating, removing the Boc and performing other steps to obtain a compound of 4-(2-pyridyl)piperidine dihydrochloride; and performing substitution on the 4-(2-pyridyl)piperidine dihydrochloride and a compound of chloracetyl m-toluidine to obtain the target product, namely the hydrochloride of the dopamine D4 receptor agonist A-412997. The process flow is simple, the method is suitable for industrial production, the reagent has low price, the yield is high, the total yield is 44.5 percent, and the method is an effective method for producing the hydrochloride of A-412997.

Split bearing mechanism

The invention discloses a split bearing mechanism, relates to a bearing mechanism and solves the problem that a bearing cannot be successfully sleeved inwards from the two ends of a mechanical structure of which non-installation surfaces at two ends have large shaft diameters and a middle installation surface has a small shaft diameter. An outer upper half ring and an outer lower half ring are buckled with each other so as to form an outer ring body; a cylindrical bump consists of a first lug and a corresponding second lug; a fastening barrel is sleeved on the cylindrical bump; an inner upper half ring and an inner lower half ring are buckled with each other so as to form an inner ring body; a first cage and a second cage are buckled with each other so as to form a keeping ring body; the first cage and the second cage are detachably connected with each other through a circular arc iron sheet; a plurality of first rolling bolts are annularly arranged on the keeping ring body; the first rolling ...

IDENTITY AUTHENTICATION, UNLOCKING, AND PAYMENT METHODS AND APPARATUSES, STORAGE MEDIA, PRODUCTS, AND DEVICES

Plasma generating device

The invention discloses a plasma generating device, which comprises a shell (12), a Helmholtz coil (11), a negative pole (9), and a positive pole (10); the interior of the shell (12) is a vacuum cavity; the Helmholtz coil (11) is arranged coaxial with the shell (12); the negative pole (9) is positioned in the shell (12); the positive pole (10) is positioned in the shell (12) and opposite to the negative pole (9); the negative pole (9) is of a hollow metal tube structure with an opening along the axial direction, the opening direction is opposite to the positive pole (10), and the negative pole (9) and the positive pole (10) are arranged parallelly. In the invention, high density and large area plasma plate is generated by adopting magnetic confinement linear hollow negative pole dischargemode, thus having enhancing plasma density by hollow negative pole, and forming the uniform plasma plate (13) with density being over 10<12>cm<-3>, geometric size being over 60cm*60cm and thickness kept ...

Regeneration aggregate made of carbonized maintaining castoff

The invention relates to a recycled aggregate made by pre-adding water to carbonated curing wastes for forming balls which absorb carbon dioxide gas in industrial waste gas, which belongs to the building material technique field. The recycled aggregate is made by adopting the following processes of: utilizing steel slag or cement containing carbonization compositions as a raw material, adding water for even mixture, and implementing the granulation for spheroidizing so as to make the recycled aggregate under the curing of carbonization gas; and the carbonization compositions include one or more than one of calcium oxide, calcium hydroxide, dicalcium silicate, tricalcium silicate, hydrated calcium silicate, hydrated calcium aluminate, hydrated calcium ferrite, ettringite, magnesium hydroxide and magnesium oxide, and the carbonization compositions have a weight percentage of no less than 30 percent in materials. The recycled aggregate has the main point that: the accelerated carbonization ...

Method for preparing composite Ag-Ti oxide antibacterial film by magnetron sputtering

The invention discloses a method for preparing a composite Ag-Ti oxide antibacterial film by magnetron sputtering, mainly comprising the steps of: 1) carrying out pretreatment on the surface of film carrier base material, sequentially washing by more than two organic solvents and deionized water under the condition of ultrasonic wave, the washing time by using the organic solvents and the deionized water being 5-15min, and finally, drying at 15-85 DEG C for 0.5-3h under the vacuum condition; 2) arranging a metal Ti target and a metal Ag target on a magnetron sputtering device, taking argon as working gas, filling reaction gas containing oxygen into a vacuum chamber of the magnetron sputtering device, sputtering the metal Ti by an intermediate frequency magnetron sputtering power supply of the magnetron sputtering device, sputtering the Ag by the magnetron sputtering power supply, and obtaining Ag-Ti metal oxide composite coating film. The method is simple and efficient, and the obtained ...

Front through lamp positioning structure and vehicle

The front penetrating lamp positioning structure comprises a front penetrating lamp, a front protection assembly and two headlamps, the front penetrating lamp is located above the front protection assembly, and the front portion of a vehicle body is connected with at least one first support; the first support is provided with a first Z-direction positioning part used for being correspondingly matched with a front bumper assembly and a second Z-direction positioning part used for being correspondingly matched with a front penetrating lamp. One of the left end part and the right end part of the front penetrating lamp and the headlamp is provided with a strip-shaped positioning hole, the other one is provided with a positioning piece which is correspondingly matched with the strip-shaped positioning hole, and the long axis direction of the strip-shaped positioning hole is the Y direction; a plurality of gap blocks are arranged between at least one of the two headlamps and the front penetrating ...

Stage synchronous lift control system and method

The invention discloses a stage lift synchronization control system and a stage lift synchronization control method, and relates to a motor driven synchronization control system, in particular to the motor driven synchronization control system and a motor driven synchronization control method for overall stage lift. The stage lift synchronization control system comprises more than two motors, frequency converters, a controller, a digital-to-analogue (D/A) module, a transistor input/output (I/O) module and an absolute encoder, wherein the frequency converters are matched with the motors; each motor is provided with an incremental encoder; each frequency converter is provided with a program guidance (PG) card, a brake unit and a brake resistor; the controller transmits commands to the frequency converters and is connected with the frequency converters through the D/A module; the absolute encoder is used for detecting a stage lifting position; the frequency converters are connected with the ...

IEC 61850 digital distance electric power data collecting method and apparatus thereof

The invention discloses an IEC 61850 digital distance electric power data collecting method which adopts configuration tools to carry out modeling configuration to electric power data so as to generate corresponding configuration files, and adopts a communication module to complete data collection according to data content and service types which are defined by the configuration files. Configuration in the whole process is flexible and the data required for communication can be customized according to actual transmission requirement. The invention also discloses an IEC 61850 digital distance electric power data collecting apparatus comprising a main processor module, a network-card module, an optical-fiber converter module, an interface module and a storage module, wherein the main processor module is respectively connected with the network-card module, the optical-fiber converter module, the interface module and the storage module. The invention can collect digital electric power meter ...

Self-regulating steady-state low-temperature heat-pump water heater and operating method thereof

The invention relates to a self-regulating steady-state low-temperature heat-pump water heater comprising an evaporator, a condenser, a compressor, a control device, a four-way reversion valve, a medium-pressure receiver and an intermediate heat exchanger which can form a closed main loop, wherein the four-way reversion valve is positioned on a connection access arranged between the evaporator and the condenser, the medium-pressure receiver and the intermediate heat exchanger are arranged on the other connection access arranged between the evaporator and the condenser, and a temperature sensor, an electronic expansion valve and a pressure sensor are positioned on the closed main loop. The self-regulating steady-state low-temperature heat-pump water heater is characterized in that an air-supply loop is arranged between the compressor and the intermediate heat exchanger. The self-regulating steady-state low-temperature heat-pump water heater has a main purpose of preventing hot-water preparation ...

Constant-temperature variable energy-saving water heater

The invention disclose an constant-temperature variable energy-saving water heater, which comprises a system control device and a heat pump system, wherein the system control device is arranged on a water storage tank; the heat pump system consists of a compressor, an evaporator, a throttle valve and a condenser and is provided with a first waterway pipe and a second waterway pipe which are communicated with a cold water main pipe; the other end of the first waterway pipe is communicated with a cold-hot water mixing valve, and a first waterway switching valve is arranged in a path from the other end of the first waterway pipe to the cold-hot water mixing valve; a second waterway switching valve is arranged in a hot water outlet pipe; the other end of the second waterway pipe is communicated with the second waterway switching valve, and a recycle pump, a flow transducer, the condenser, an outflow water temperature detector and a third water-path switching valve are connected in turn ina ...

Method and apparatus for processing back-pressure data

The embodiment of invention discloses a method for processing data counterpressure and a device thereof. The method comprises the following steps: storing data received by the sending end in first-input first-output queue; recording an address of next data to be sent in the first-input first-output queue when the receiving end generates data counterpressure; and when finishing data counterpressure of the receiving end, sequentially reading data from the first-input first-output queue and sending the data to the receiving end according to the address of the next data to be sent. The embodiment of the invention stores the received data in the first-input first-output queue; when the receiving end generates the data counterpressure, the address of the next data to be sent is recorded; and after the data counterpressure is finished, data is sequentially read from the recorded address and is sent to the data receiving end, thereby solving the problems of data loss, data error and the like caused ...

Quick, high-quality, maximum-density projection realization method

The invention provides a quick, high-quality, maximum-density projection realization method. In the method, by combining the conventional improved scheme and according to the 24 kinds of conditions of the entrance of light rays into data blocks, recursion of the data blocks is performed by using an octree structure, transparent data blocks and sub nodes are skipped over effectively by using an octree maximum-minimum structure, the CPU utilization efficiency is improved and computing time is reduced effectively by using parallel computing, and data access amount and computing amount are reduced by using unit boundary sampling. Thus, data computing is reduced greatly, and real-time high-quality maximum-density projection is realized.

Method for realizing data exchange among service systems by using storage and logistics center model

The invention relates to a method for realizing data exchange among service systems by using a storage and logistics center model. The method uses the storage and logistics center model to establish a data storage and administration center, the data storage and administration center receives and stores data of each service system, and sends relative data to the service system which sends the request of extracting data. In the process of receiving and sending the data, the data storage and administration center checks and verifies the data. Compared with the prior art, the method has the effect that actual use results prove that the performance of a transmitting system (typical system of the prior art) broken on the basis of the data exchange ratio of the logistics center model is improved by 10%, resource consumption is lowered by 30%, system fault rate is lowered by 20%, and each process can be examined and controlled.

LNG (Liquefied Natural Gas) filling station and filling equipment thereof

According to the LNG filling station and the filling equipment thereof, the temporary storage tank and the first electric control valve are additionally arranged on the pressure relief pipeline above the pump pool so that gasified LNG in the pump pool can be stored in the temporary storage tank, and then the gasified LNG stored in the temporary storage tank can flow into the pump pool by controlling opening of the first electric control valve under the preset condition; compared with the mode that gasified LNG in the pump pool is directly released through a two-way safety valve in the prior art, the loss of the gasified LNG in the pump pool is reduced, and the cost is saved.

Methodology of Applying Storage and Logistics Center Model to Achieve Business Data Exchange between Systems

A methodology of applying storage and logistics center model to achieve business data exchange between systems, is based on the storage logistics center model, establishes data storage management center, which receives and saves the data in each business system and sends data extraction request to the corresponding data; Conducts a detailed checking and verification action in the sending and receiving process of aforementioned data storage management center. Comparing with the existing technology and according to the empirical test, the data delivery stem that is based on fragmented data transportation of the logistics center model (the most typical system in the concurrent technology) shows that: performance is increased by 10%, resource consumption is reduced by 30%, system failure rate has dropped 20%, and each process can be controlled.

SILICON-BASED ELECTRO-OPTIC DEVICE

PROBLEM TO BE SOLVED: To provide an electrode connection structure which achieves an efficient optical connection and enables both high-speed operations and a reduction in optical propagation loss in a silicon-based electro-optic device formed on an SOI substrate. SOLUTION: In the electro-optic device, a stack structure including a first silicon semiconductor layer of a first conductivity type and a second silicon semiconductor layer of a second conductivity type has a rib waveguide shape to form an optical confinement area, and a slab portion of a rib waveguide includes an area to which a metal electrode is connected. The slab portion in the area to which the metal electrode is connected is thicker than a surrounding slab portion. The area to which the metal electrode is connected is set within a range of a distance from the rib waveguide to the area to which the metal electrode is connected such that, when the distance is changed, an effective refractive index of the rib waveguide in ...

Suspension gear and hanger suspending method used in low gravity experiment of planetary rover

The invention provides a suspension gear and a hanger suspending method used in the low gravity experiment of a planetary rover. The planetary rover comprises a suspension mechanism. The invention is characterized in that the suspension gear comprises a set of suspension mechanisms, a plurality of pairs of suspension points, a plurality of isometric slings, a constant force stay cable suspension point and a constant force stay cable, wherein the set of suspension mechanisms is arranged above the planetary rover and has the same configuration and size as the suspension mechanism of the planetary rover; the suspension points are respectively arranged in the up-down corresponding positions on the planetary rover and the suspension mechanisms; the isometric slings connect each pair of suspension points corresponding to each other up and down; the constant force stay cable suspension point is arranged above the suspension mechanisms and is positioned on the same vertical line with the center ...

Early tumor detection method

The invention provides an early tumor detection method. The method combines traditional medical detection equipment to obtain tissue partition information of an interest region, distributes the range of electromagnetic property parameters to different tissue structure partitions by referring to the electromagnetic property parameter distribution database of all tissues of the human body, and then works out the electromagnetic property parameter distribution database of the tissue of the interest region through electromagnetic inverse problem solution, and effectively detect early tumors and the tissue lesions without clear boundary. The method combines the tissue partition information with the electromagnetic property parameter distribution range information of the tissue during solving electromagnetic inverse problem, thereby greatly reducing the computation. The electromagnetic inverse problem solving method of the invention which combines with the traditional medical detection equipment ...

Medicine liquor for treating migraine

The invention discloses medicine liquor for treating migraine, which comprises following raw material components, by weight: 20-55 parts of chloranthaceae, 15-43 parts of radix ophiopogonis, 15-35 parts of uncaria, 15-25 parts of radix angelicae, 10-20 parts of gastrodia elata, 3-5 parts of angelica sinensis, 5-20 parts of a component which is not mentioned, 5-15 parts of semen cassia, 3-12 parts of artemisia anomala and 3-10 parts of rhizome chuanxiong. The medicine liquor is reasonable in component formula, is significant in effects when being used and can effectively prevent relapse of the migraine.

Method for drawing volume rendering cutting surface

The invention provides a method for drawing a volume rendering cutting surface. Aiming at two conventional cutting modes, an in-and-out intersection point quick jumping cutting method is adopted, and the cutting surface is subjected to special light treatment so as to draw the cutting surface. The method has a high speed and a drawing result is favorable for observation and medical diagnosis. A one-time surrounding body method and deep judgment are adopted, the one-time surrounding body is needed to be solved for data volume, the method is well integrated with a ray tracing algorithm, multiple times of repetitive computation and the judgment of spatial logic are reduced, judgment in the ray tracking is not needed for a view angle cutting surface, logic operation is reduced, and the cutting surface is subjected to special illumination computation, so that the drawn cutting surface has a smooth effect and is convenient to observe.

Curved-surface film projection system and method therefor

Hepatic tumor comprehensive surgical planning analogy method and system thereof based on three-dimensional multimode images

The invention discloses a hepatic tumor comprehensive surgical planning analogy method and a system thereof based on three-dimensional multimode images. The method comprises the steps that firstly, a data base containing the data of an object is constructed; secondly, three-dimensional registration and fusion are conducted on the medical images, having different modes or single mode and different periods, of the object; thirdly, a specific tissue is divided by the automatic and semi-automatic modes, and the three-dimensional modeling of important tissues in and around the liver is realized by the three-dimensional reconstruction technology so as to reconstruct an abdominal three-dimensional model having the immersion and interaction features; fourthly, before-simulation comprehensive risk analysis is conducted based on the modeling result, referred to the practice guidelines and combined with the object information; and finally, all kinds of simulation surgical plans are designed according ...

Traditional Chinese medicine preparation for treating pharyngitis

The invention discloses a traditional Chinese medicine preparation for treating pharyngitis, which includes following raw material components, by weight: 25-50 parts of tibetan barberry, 20-40 parts of round-leaved birthwort, 15-40 parts of cyclea hypoglauca, 10-30 parts of honeysuckle, 10-25 parts of fructus forsythia, 10-20 parts of rubus parvifolius, 5-20 parts of platycodon grandiflorum, 5-15 parts of radix ophiopogonis, 3-10 parts of daemonorops margaritae, 3-7 parts of radix glycyrrhizae and 500-1000 parts of water. The traditional Chinese medicine preparation is reasonable in the formula of the raw material components, is significant in effects when being used, and can effectively treat the pharyngitis disease.

Hot-water frost preventing and defrosting device with compressor cooling

The invention relates to a hot-water frost preventing and defrosting device with compressor cooling, which comprises a water tank (14), a cold water tube (1),a hot-water outlet tube (2), a heat pump circulation loop tube (G) for connecting a throttle valve (11), a fin type evaporator (7), a compressor (13) and a condenser (15) in sequence, and a fan motor (10) opposite to the outlet side of the evaporator, wherein a relevant humidity sensor (4) is arranged on the side of the evaporator; a wind speed sensor (8) is arranged on the outlet side of the evaporator; a pressure sensor (9) is arrangedon the heat pump circulation loop tube between the evaporator and the compressor; the hot-water outlet tube is connected with a hot-water outlet branch tube (2a) on which an opening regulating valve (5) is arranged; a defrosting spraying device (6)is arranged on the outlet end of the hot-water outlet branch tube; and a water storage sink (3) is arranged below the evaporator. The invention does not influence ...

Preparation method of high dispersed nano-silver particle

Quick, high-quality, maximum-density projection realization method

The invention provides a quick, high-quality, maximum-density projection realization method. In the method, by combining the conventional improved scheme and according to the 24 kinds of conditions of the entrance of light rays into data blocks, recursion of the data blocks is performed by using an octree structure, transparent data blocks and sub nodes are skipped over effectively by using an octree maximum-minimum structure, the CPU utilization efficiency is improved and computing time is reduced effectively by using parallel computing, and data access amount and computing amount are reduced by using unit boundary sampling. Thus, data computing is reduced greatly, and real-time high-quality maximum-density projection is realized.

METHODS AND APPARATUSES FOR PROCESSING IMAGE AND IDENTITY VERIFICATION, ELECTRONIC DEVICES, AND STORAGE MEDIA

Embodiments of the present disclosure provide method for processing images and apparatuses, method for identity verifications and apparatuses, electronic devices, and storage media. The method for processing images includes: obtaining first feature data of a first user image; comparing the first feature data with at least one piece of second feature data included in a database to obtain a comparison result; and determining, according to the comparison result, whether to update the database. According to the embodiments of the present disclosure, it is beneficial to the database to adapt to identity verification in different scenarios and changes in user's appearance generated over time, thereby improving the user experience. 1. A method for processing an image , comprising:obtaining first feature data of a first user image;comparing the first feature data with at least one piece of second feature data comprised in a database to obtain a comparison result; anddetermining, according to the comparison result, whether to update the database.2. The method according to claim 1 , wherein the comparing the first feature data with at least one piece of second feature data comprised in a database to obtain a comparison result comprises:determining at least one similarity between the first feature data and the at least one piece of second feature data; andobtaining the comparison result based on the at least one similarity.3. The method according to claim 2 , wherein the obtaining the comparison result based on the at least one similarity comprises:determining a maximum value in the at least one similarity as the comparison result.4. The method according to claim 1 , wherein the determining claim 1 , according to the comparison result claim 1 , whether to update the database comprises:in response to the comparison result being greater than or equal to a first predetermined threshold, determining to update the database.5. The method according to claim 4 , wherein the first ...

Total heat recovery direct-heating constant temperature heat pump hot-water unit and control method thereof

The invention relates to a total heat recovery direct-heating constant temperature heat pump hot-water unit, which comprises a compressor (1), four-way reversing valves (2 and 3) and a fin type heat exchanger (5), an outlet of the compressor (1) is connected with an inlet of the fin type heat exchanger through the four-way reversing valves, the heat pump hot-water unit also comprises a hot-water side heat exchanger (4) and an air-conditioner side heat exchanger (13), and inlets of the hot-water side heat exchanger (4) and the air-conditioner side heat exchanger are connected with the outlet of the compressor through the four-way reversing valves. The invention also provides a control method of the heat pump hot-water unit, which comprises the following steps: separated water cooling, water heating at the same time of water cooling, separated water heating, defrosting in winter, and flow control of heating in winter. The heat pump hot-water unit and the control method have the advantages ...

Excitant for preparing construction material by carbonized curing wastes

The invention belongs to the technical field of a constructional material, and relates to an excitant used for carbonizing and curing offal prepared constructional materials. The excitant comprises not less than 50 percent of excitable components by weight which are one or more than one of NaHCO3, soluble glass, plaster, Ca(HCO3)2, NaCl and Na2CO3. The excitant has the advantages that when offal prepared constructional materials are carbonized and cured, the excitant can promote carbonization in carbonization materials through the excitable components by adding the excitant of proper amount, thus increasing the carbonization ratio and reducing the discharged carbon dioxide as a greenhouse gas to great extent, preparing products for carbonizing and curing constructional materials having good performance, and reducing the production cycle with good economic benefit.

Auditory localization wireless measurement method

The invention belongs to the fields of measurement and wireless communication, disclosing a sound localization-based wireless measuring method. Firstly, a plurality of wireless acoustic sensors are arranged in a designated area; the coordinates of the sensors are confirmed, and one of the wireless sensors is used as a data aggregation and processing point; a positioning method by means of receiving a signal energy is adopted to localize the sound; a plurality of wireless acoustic sensors are used for measuring a sound signal sent by a target; and a plurality of the most suitable sensors are selected to participate into the sound localization according to a measured sound signal intensity so as to localize the sound by the positioning method by means of receiving the signal energy. In order to overcome the influence of noise and heterogeneity of a medium and to improve positioning accuracy, the problem of an equation set solution is changed into an optimization problem; and a steepest descent ...

Method and apparatus for processing back-pressure data

The embodiment of invention discloses a method for processing data counterpressure and a device thereof. The method comprises the following steps: storing data received by the sending end in first-input first-output queue; recording an address of next data to be sent in the first-input first-output queue when the receiving end generates data counterpressure; and when finishing data counterpressure of the receiving end, sequentially reading data from the first-input first-output queue and sending the data to the receiving end according to the address of the next data to be sent. The embodimentof the invention stores the received data in the first-input first-output queue; when the receiving end generates the data counterpressure, the address of the next data to be sent is recorded; and after the data counterpressure is finished, data is sequentially read from the recorded address and is sent to the data receiving end, thereby solving the problems of data loss, data error and the like caused ...

Anti-misoperation method for automation personnel in electric power system

The invention discloses an anti-misoperation method for the automation personnel in the electric power system. The anti-misoperation method comprises the following steps: (1) firstly, logging in the nodes allowing the remote-control operations as a user having the remote-control permission, and selecting the remote-control objects; (2) reading a station remote-control information list and a remote-control prescription and permission list; and (3) firstly, judging whether the remote-control permission is allocated to the corresponding remote control object, if not, according to the test results, logging off the remote-control process, and if so, according to the test results, further verifying whether the permission is ineffective, if so, logging off the remote-control process, and if not, entering into the normal remote-control process. By taking the factors, such as operators, responsibility areas, nodes at which operations are performed, permission time limit and the like, into comprehensive ...

LIGHT EMITTING DEVICE

According to embodiments of the present invention, a light emitting device is provided. The light emitting device includes: an active region comprising at least one p-i-n junction, the at least one p-i-n junction comprising a p-doped region, an intrinsic region and an n-doped region; a first contact; and a second contact, wherein the active region is disposed between the first contact and the second contact; and wherein a voltage applied to the first contact and the second contact produces a current configured to flow between the first contact and the second contact in a direction substantially parallel to a surface of the intrinsic region of the active region configured to emit a light. According to embodiments of the present invention, the intrinsic region includes a multiple quantum well (MQW) such that a current injected flows laterally in a direction substantially parallel to the surface of the wells of the MQW. 1. A light emitting device , comprising:an active region comprising at least one p-i-n junction, the at least one p-i-n junction comprising a p-doped region, an intrinsic region and an n-doped region;a first contact; anda second contact, wherein the active region is disposed between the first contact and the second contact; andwherein a voltage applied to the first contact and the second contact produces a current configured to flow between the first contact and the second contact in a direction substantially parallel to a surface of the intrinsic region of the active region configured to emit a light.2. The light emitting device of claim 1 , wherein the at least one p-i-n junction comprises a plurality of p-i-n junctions.3. The light emitting device of claim 2 , wherein adjacent p-i-n junctions of the plurality of p-i-n junctions are configured back-to-back to form a p-i-n-i-p structure or an n-i-p-i-n structure.4. The light emitting device of claim 3 , wherein each of the intrinsic regions of the plurality of p-i-n junctions comprises a multiple ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

OPERATION METHOD OF ROBOT OPERATING SYSTEM AND A ROBOT CONTROL METHOD

An operation method of robot operating system and a robot control method are provided in this invention. The operation method of robot operating system includes steps of: monitoring an operating state of the Linux kernel through the security kernel when the security kernel and the Linux kernel of the robot operating system are both started; and hosting the Linux kernel through the security kernel when the Linux kernel runs abnormally or crashes. The technical scheme of the present invention is able to improve stability and safety of the robot operation. 1. An operation method of robot operating system comprising a security kernel and a Linux kernel that share a physical memory and run on different physical memory addresses respectively , the operation method of robot operating system comprising:monitoring an operating state of the Linux kernel through the security kernel when the security kernel and the Linux kernel of the robot operating system are both started; andhosting the Linux kernel through the security kernel when the Linux kernel runs abnormally or crashes.2. The operation method of robot operating system according to claim 1 , wherein a startup process of the security kernel and the Linux kernel comprises:loading a multi-operating system startup program through a basic input/output system;booting the security kernel to start through the multi-operating system startup program; andbooting the Linux kernel to start through the security kernel.3. The operation method of robot operating system according to claim 2 , wherein the step of booting the security kernel to start through the multi-operating system startup program comprises:parsing an elf file of the security kernel through the multi-operating system startup program; andre-locating each segment of the elf file according to header information of the elf file when a validity of a Multiboot header of the elf file is confirmed, so that the security kernel runs on a first physical memory address of a ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1. A manufacturing method of a molded photosensitive assembly of an array imaging module , comprising the steps of:(a) providing a circuit board, having at least two sets of electronic elements coupled at a peripheral portion thereof, electrically coupled with at least two photosensitive units each having a photosensitive area and a non-photosensitive area encircling said photosensitive area, one or more connecting elements connecting said two non-photosensitive areas of said at least two photosensitive units with said circuit board;(b) providing an enclosing film at a mold engaging surface of a first mold body of a mold;(c) receiving said circuit board in said mold and positioning between said first mold body and a second mold body, wherein when said first mold body and said second mold body are coupled with each other in mold closing state, a mold cavity is formed between said first mold body and said second mold body, wherein said peripheral portion of said circuit board and a center portion of said circuit board are correspondingly disposed in said mold cavity, wherein said mold engaging surface of said ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1. An array imaging module , comprising:at least two optical lenses; anda molded photosensitive assembly, which comprises:at least a circuit board having at least two coupling areas on a top lateral side thereof, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said at least two coupling areas thereof;at least two photosensitive units, each having a photosensitive area and a non-photosensitive area provided on a top side thereof, electrically coupled at said at least two coupling areas of said circuit board respectively, wherein one or more connecting elements electrically connect said non-photosensitive areas of said at least two photosensitive units with said circuit board;a molded base integrally coupled at said circuit board to integrally encapsulate and enclose said electronic elements and said connecting elements therein that prevents said electronic elements and said connecting elements from exposing to outside and isolates said electronic elements and said connecting elements with each other to prevent mutual interference ...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens. 1. A molded photosensitive assembly , comprising:at least two photosensitive units;a circuit board, wherein said at least two photosensitive units are electrically coupled at said circuit board;at least one electronic element electrically coupled at said circuit board; anda molded base integrally molded to couple at said circuit board at a peripheral portion thereof to form an integrated structure having at least two optical windows forming at least two light channels through said two photosensitive units respectively, wherein said at least one electronic element is molded to be sealed and enclosed within said molded base for preventing an exposure of said at least one electronic element, wherein said photosensitive units are aligned with said optical windows respectively.2. The molded photosensitive assembly claim 1 , as recited in claim 1 , further comprising at least one lead wire having two ends electrically connected to a chip connector of said photosensitive unit and said circuit board respectively so as to electrically connect said photosensitive unit with said circuit board claim 1 , wherein at least one of said at least one lead wire is integrally molded to be sealed and enclosed within said molded base.3. The molded photosensitive ...

Adjustable Optical Lens and Camera Module, Manufacturing Method and Applications Thereof

An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor. 1225-. (canceled)226. A camera module , comprising:an optical sensor; andan adjustable optical lens, arranging in a photosensitive path of said optical sensor, wherein said adjustable optical lens comprises an optical structural member and at least two lenses, wherein each of said lenses is arranged in an internal space of said optical structural member along a vertical direction of said optical structural member, wherein a central axis line of said camera lens and a central axis line of said optical sensor are coincided through adjusting a position of at least one of said lenses in said internal space of said optical structural member, and then said lens after adjusted is affixed in position and said adjustable optical lens and said optical sensor are packaged to form said camera module.2271. The camera module , as recited in claim , wherein said optical structural member has at least one adjustment channel provided communicating said internal space of said optical structural member with an external environment and positioned ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1. A manufacturing method of a molded photosensitive assembly of an array imaging module , comprising a step of molding a mold sealer to couple at and seal on a circuit board with at least two photosensitive units.2. The method claim 1 , as recited in claim 1 , before the molding step claim 1 , further comprising the steps of:electrically connecting each of the photosensitive units to the circuit board via at least a lead wire; andenclosing the lead wire by the mold sealer.3. The method claim 2 , as recited in claim 2 , wherein the molding step further comprises a step of extending the mold sealer to a non-photosensitive area of each of the photosensitive units.4. The method claim 2 , as recited in claim 2 , further comprising the steps of forming at least a coupling slot at a top side of the mold sealer for engaging with at least one of a supporter claim 2 , an optical lens claim 2 , a driver claim 2 , and a light filter of the array imaging module.5. The method claim 2 , as recited in claim 2 , further comprising a step of forming a step-like platform that upwardly extends from an inner side of the mold ...

Methods and devices for authorizing operation

A system for authorizing an operation is provided. The system may acquire motion data collected by a wearable device. A mobile terminal may determine whether the motion data matches with a physical motion for verification. If the motion data matches with the physical motion for verification, the mobile terminal may be authorized to perform a predetermined operation corresponding to the physical motion for verification. Thus, a user's identity may be verified based on the wearable device that collects motion data.

CHARACTER IMAGE PROCESSING METHOD AND APPARATUS, DEVICE, AND STORAGE MEDIUM

Provided are character image processing methods and apparatuses, devices, storage medium, and computer programs. The character image processing method mainly comprises: obtaining at least one image block containing a character in a character image to be processed; obtaining image block form transformation information of the image block on the basis of a neural network, the image block form transformation information being used for changing a character orientation in the image block to a predetermined orientation, and the neural network being obtained by means of training using an image block sample having form transformation label information; performing form transformation processing on the character image to be processed according to the image block form transformation information; and performing character recognition on the character image to be processed which is subjected to the form transformation. 1. A character image processing method , comprising:obtaining at least one image block containing a character in a character image;obtaining, on the basis of a neural network, image block form transformation information of each of the at least one image block, the image block form transformation information being used for changing a character orientation in an image block to a predetermined orientation;performing, according to the image block form transformation information, form transformation processing on the character image; andperforming character recognition on the character image which is subjected to the form transformation.2. The method according to claim 1 , wherein the obtaining at least one image block containing a character in a character image comprises:performing cutting processing on the character image to obtain the at least one image block containing the character in the character image; orperforming filling processing on the character image to obtain the at least one image block containing the entire character image.3. The method according to ...

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors. 1. A photosensitive unit for an array camera module comprising two or more camera lenses , comprising:a photosensitive portion which comprises a circuit board including at least a main circuit board with one or more circuit elements provided thereon, and two or more photosensitive sensors which are provided on said circuit board, wherein each of said photosensitive sensors has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, wherein said photosensitive portion further comprises connecting elements electrically connecting said main circuit board to said non-photosensitive areas of said photosensitive sensors; andan encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive areas of said photosensitive sensors so as to overlappedly affix said photosensitive sensors on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive areas and surrounding said photosensitive areas of said photosensitive sensors to form a lower covering section, an upper installing section and two or more annular inclined inner walls upwardly and outwardly extending from said non-photosensitive areas of said photosensitive sensors to said installing sections respectively to define two or more windows above said photosensitive areas of said ...

Adjustable Optical Lens and Camera Module and Manufacturing Method Thereof

An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module. 1. An adjustable optical lens , comprising:an optical structural member; andtwo or more lenses, wherein each of said lenses is arranged in an internal space of said optical structural member along an axial direction of said optical structural member, wherein one or more positions of at least one of said lenses in said internal space of said optical structural member is adapted to be adjustably arranged.2. The adjustable optical lens claim 1 , as recited in claim 1 , wherein said optical structural member has at least one adjustment channel adapted to communicate said internal space of said optical structural member with an external environment claim 1 , and said lens is arranged in said internal space of the optical structural member corresponding to said adjustment channel claim 1 , so that at least one position of said lens in said internal space of said optical structural member is able to be adjusted through said adjustment channel.3. The adjustable optical lens claim 2 , as recited in claim 2 , wherein said lens of said adjustable optical lens in said internal space of said optical structural member is able to be adjusted in at least ...

Adjustable Optical Lens and Camera Module and Manufacturing Method Thereof

An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module. 120-. (canceled)21. A camera module , comprising:an optical device including an optical sensor; andan adjustable optical lens arranged along a photosensitive path of said optical sensor, wherein said adjustable optical lens comprises an optical structural member and one or more lenses, wherein each of said lenses is arranged in an internal space of said optical structural member along an axial direction of said optical structural member, while at least one of said lenses is preassembled in an adjustable manner that, before packaging said adjustable optical lens and said optical device, a position of said lens in said internal space of said optical structural member is able to be adjusted until a central axis line of said adjustable optical lens and a central axis line of said optical sensor are coincided or within a predetermined range of deviation therebetween, wherein said lens after adjustment is fixed in position in said optical structural member and said adjustable optical lens and said optical device is packaged to form said camera module.22. The camera module claim 21 , as recited in claim 21 , wherein said optical structural ...

MOLDED PHOTOSENSITIVE ASSEMBLY FOR ARRAY IMAGING MODULE FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 121-. (canceled)22. A manufacturing method of a molded photosensitive assembly of an array imaging module including at least two optical lenses , comprising:providing at least a circuit board having one or more electronic elements and one or more connecting elements electrically coupled at said circuit board;providing at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive area encircling said photosensitive area, wherein said one or more connecting element electrically connect said non-photosensitive area to said circuit board;providing an enclosing film at a mold engaging surface of said circuit board that is substantially the surface being molded;molding a molded base to integrally enclose, package and seal said circuit board and said non-photosensitive area, to integrally and sealedly embed and enclose said one or more electronic elements and said one or more connecting elements therein to form an integrated body, wherein when a first mold body and a second mold body are coupled with each other in a mold closing state, said ...

VERTICAL INTEGRATION OF HYBRID WAVEGUIDE WITH CONTROLLED INTERLAYER THICKNESS

An silicon photonics device of hybrid waveguides having a coupling interlayer with an accurately controlled thickness and a method of making the same. The device includes a first plurality of Si waveguides formed in a SOI substrate and a first layer of SiOoverlying the first plurality of Si waveguides and a second plurality of SiNwaveguides formed on the first layer of SiO. At least one SiNwaveguide is disposed partially overlapping with at least one of the first plurality Si waveguides in vertical direction separated by the first layer of SiOwith a thickness controlled no greater than 90 nm. The device includes a second layer of SiOoverlying the second plurality of SiNwaveguides. The method of accurately controlling the coupling interlayer SiOthickness includes a multilayer SiO/SiN/SiOhard mask process for SiOetching and polishing as stopping and buffering layer as well as Si waveguide etching mask. 1. A method of using a vertically integrated hybrid waveguides with interlayer thickness control , the method comprising: (1) providing a substrate;', '(2) forming a multi-layer hard mask overlying the substrate, the multi-layer hard mask comprising a top silicon oxide layer overlying a silicon nitride layer overlying a first silicon oxide layer;', '(3) forming a first waveguide pattern in the substrate, the first waveguide pattern comprising at least one first waveguide made by part of the substrate carrying the multi-layer hard mask on top;', '(4) forming a dielectric layer to overlay the first waveguide pattern and rest of the substrate;', '(5) removing at least partially the dielectric layer to expose the multi-layer hard mask overlying the at least one first waveguide;', '(6) removing at least partially the multi-layer hard mask to leave substantially the first silicon oxide layer overlying the at least one first waveguide;', '(7) forming a second silicon oxide layer overlying the first silicon oxide layer such that total thickness of the first silicon oxide layer ...

CAMERA LENS MODULE AND MANUFACTURING METHOD THEREOF

A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration. 143-. (canceled)44. A camera lens module with a split lens , characterized by comprising:an image sensor having a photosensitive path; anda lens assembly, which includes an optical lens set, a lens barrel set, and an aperture memberwherein the optical lens set includes at least two optical lenses, and the lens barrel set includes at least two lens barrels, and the at least two optical lenses are correspondingly installed within one of the optical barrel respectively to form at least two optical lens modules, and the aperture member is provided at a distal portion of the outmost optical lens module, and the optical lens modules are pre-assembled on the photosensitive path of the image sensor, and the assembling position of one of the at least two optical lens modules is adapted to be adjusted with respect to the position of the image sensor.45. The camera lens module according to claim 44 , wherein the assembling position of the aperture member is adjustable with respect to the position of the optical lens module.46. The camera lens module according to claim 44 , wherein at least one of the optical lenses is installed in at least one of the lens barrels in such a manner that the assembling position of the pre-assembled optical lens is arranged to be adjustable inside the respective ...

Adjustable Optical Lens and Camera Module and Manufacturing Method Thereof

An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module. 1. An adjustable optical lens , comprising:an optical structural member; andtwo or more lenses, wherein each of said lenses is arranged in an internal space of said optical structural member along an axial direction of said optical structural member, wherein one or more positions of at least one of said lenses in said internal space of said optical structural member is adapted to be adjustably arranged.2. The adjustable optical lens claim 1 , as recited in claim 1 , wherein said optical structural member has at least one adjustment channel adapted to communicate said internal space of said optical structural member with an external environment claim 1 , and said lens is arranged in said internal space of the optical structural member corresponding to said adjustment channel claim 1 , so that at least one position of said lens in said internal space of said optical structural member is able to be adjusted through said adjustment channel.3. The adjustable optical lens claim 2 , as recited in claim 2 , wherein said lens of said adjustable optical lens in said internal space of said optical structural member is able to be adjusted in at least ...

System-Level Camera Module with Electrical Support and Manufacturing Method Thereof

A camera module includes an optical lens, a photosensitive sensor and an electrical support. The electrical support includes a circuit arrangement embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit arrangement, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support riot only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component. 130-. (canceled)31. An electrical support for a camera module including a photosensitive sensor and an optical lens , comprising:a support body for supporting the optical lens; anda circuit arrangement embedded in said support body adapted for conductively connecting with the photosensitive sensor so as to enable said electrical support to serve as a base and a circuit board of the camera module.32. The electrical support claim 31 , as recited in claim 31 , further comprising a connecting member and a camera component means claim 31 , wherein said circuit arrangement comprises one or more electrical conductors and a plurality of electronic elements which are pre-connected with said electrical conductors in an electrically connecting manner claim 31 , wherein said connecting member is provided at said support body and electrically connected with said electrical conductors and said electronic elements claim 31 , wherein said camera component means is coupled at said support body and electrically connected to said connecting member claim 31 , such that said support body forms said circuit board to electrically connect with said camera component means and serves as said base to support said camera component means.33. The electrical support claim 32 , as recited in claim 32 , wherein said camera component means comprises said photosensitive sensor claim 32 , wherein said connecting member ...

System-Level Camera Module with Electrical Support and Manufacturing Method Thereof

A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

INTEGRATED COMPACT IN-PACKAGE LIGHT ENGINE

An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chip and to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.2 Tbit/s total capacity of data communication with median-or-short-reach electrical interconnect. 1. An integrated optical transceiver comprising:a substrate member having a surface region; a set of four laser devices configured to output four laser lights;', a set of four modulator devices formed in the surface region and respectively receiving corresponding one of the two portions of the four laser lights;', 'a driver device coupled to the set of four modulator devices and configured to drive each modulator device to modulate a respective one of the four laser lights;, 'a set of four power splitter devices coupled to the four laser lights to split each of the four laser lights to two portions leading to two replicated transmit paths, each transmit path including,'}], 'a transmitter unit provided on the surface region and comprising a photodetector device configured to receive four input optical signals and convert the four input optical signals to respective electrical signals; and', 'a transimpedance amplifier ...

MULTI-PURPOSE PLANET ROVER

A multi-purpose planet planetary exploration rover is provided in this invention, which relates to the field of planet exploration. The multi-purpose planetary exploration rover includes a case body, mounted with a first wheel at left and right sides respectively; and a cantilever, having a front end connected to the case body, a rear end of the cantilever being mounted with a second wheel; wherein the cantilever is rotated or fixed relative to the case body, the second wheel is steered relative to the cantilever, and the first wheel and the second wheel are used to drive the multi-purpose planetary exploration rover. Compared with the prior art, the multi-purpose planetary exploration rover of this invention can effectively explore special geographic locations such as cliffs, volcanic craters, craters and lava caves on alien planets. 1. A multi-purpose planetary exploration rover , comprising:a case body, mounted with a first wheel at left and right sides respectively; anda cantilever, having a front end connected to the case body, a rear end of the cantilever being mounted with a second wheel;wherein the cantilever is rotated or fixed relative to the case body, the second wheel is steered relative to the cantilever, and the first wheel and the second wheel are used to drive the multi-purpose planetary exploration rover.2. The multi-purpose planetary exploration rover according to claim 1 , wherein:the cantilever is mounted with a first locking mechanism, and the first locking mechanism enables the cantilever to remain fixed relative to the case body;the multi-purpose planetary exploration rover is mounted with a detection device;the detection device comprises a plurality of multi-dimensional force sensors, and the plurality of multi-dimensional force sensors are mounted at shafts of the first wheel and the second wheel respectively.3. The multi-purpose planetary exploration rover according to claim 2 , wherein the two first wheels enable the multi-purpose ...

Camera Lens Module and Manufacturing Method Thereof

A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration. 125-. (canceled)26. A camera lens module , comprising:an image sensor having a photosensitive path; anda lens assembly coupled to said image sensor along said photosensitive path, wherein said lens assembly comprises at least one optical lens module, wherein said optical lens module comprises a lens barrel and at least an optical lens supported within said lens barrel, wherein an assembling position of said optical lens module with respect to a position of said image sensor is arranged to be adjustable for calibration and said relative position of said optical lens module is permanently fixed after calibration.27. The camera lens module claim 26 , as recited in claim 26 , wherein said lens assembly further comprises an aperture member coupled at said optical lens module.28. The camera lens module claim 26 , as recited in claim 26 , wherein said image sensor comprises a photosensitive chip and a lens base coupled to said optical lens module and supported said photosensitive chip in said lens base claim 26 , wherein said assembling position of said optical lens module is adjusted to align a centerline of said lens assembly with a centerline of said photosensitive chip for calibration claim 26 , such that said assembling position of said optical lens module is permanently fixed after ...

Camera Lens Module and Manufacturing Method Thereof

A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration. 1. A camera lens module , comprising:an image sensor having a photosensitive path; anda lens assembly coupled to said image sensor along said photosensitive path, wherein said lens assembly comprises at least one optical lens module, wherein said optical lens module comprises a lens barrel and at least an optical lens supported within said lens barrel, wherein an assembling position of said optical lens module with respect to a position of said image sensor is arranged to be adjustable for calibration and said relative position of said optical lens module is permanently fixed after calibration.2. The camera lens module claim 1 , as recited in claim 1 , wherein said lens assembly further comprises an aperture member coupled at said optical lens module.3. The camera lens module claim 1 , as recited in claim 1 , wherein said image sensor comprises a photosensitive chip and a lens base coupled to said optical lens module and supported said photosensitive chip in said lens base claim 1 , wherein said assembling position of said optical lens module is adjusted to align a centerline of said lens assembly with a centerline of said photosensitive chip for calibration claim 1 , such that said assembling position of said optical lens module is permanently fixed after said centerline of said ...

METHOD FOR OBTAINING ROAD MARKING DATA AND A DEVICE THEREOF

A method for obtaining road marking data and a device thereof are provided. The method includes steps of: obtaining coordinates of calibration references on a to-be-marked road; importing the coordinates of the calibration references into an electronic image of the to-be-marked road; determining, according to a difference between the coordinates of the calibration references and coordinates of to-be-calibrated points corresponding to the calibration references in a road image included in the electronic image, whether to perform a calibration on the coordinates of the to-be-calibrated points; and when the difference is greater than a threshold, performing the calibration on the coordinates of the to-be-calibrated points, and using calibrated coordinates of the to-be-calibrated points as road marking data. By applying the present disclosure, the accuracy of road marking data can be improved. 1. A method for obtaining road marking data , comprising:obtaining coordinates of calibration references on a to-be-marked road;importing the coordinates of the calibration references into an electronic image of the to-be-marked road;determining, according to a difference between the coordinates of the calibration references and coordinates of to-be-calibrated points corresponding to the calibration references in a road image included in the electronic image, whether to perform a calibration on the coordinates of the to-be-calibrated points; andwhen the difference is greater than a threshold, performing the calibration on the coordinates of the to-be-calibrated points, and using calibrated coordinates of the to-be-calibrated points as road marking data.2. The method for obtaining road marking data in claim 1 , further comprising:when the difference is not greater than the threshold, obtaining coordinates of a road line of the to-be-marked road, and using the coordinates of the road line as the road marking data.3. The method for obtaining road marking data in claim 2 , wherein the ...

LIGHT ENGINE BASED ON SILICON PHOTONICS TSV INTERPOSER

A method for forming a silicon photonics interposer having through-silicon vias (TSVs). The method includes forming vias in a front side of a silicon substrate and defining primary structures for forming optical devices in the front side. Additionally, the method includes bonding a first handle wafer to the front side and thinning down the silicon substrate from the back side and forming bumps at the back side to couple with a conductive material in the vias. Furthermore, the method includes bonding a second handle wafer to the back side and debonding the first handle wafer from the front side to form secondary structures based on the primary structures. Moreover, the method includes forming pads at the front side to couple with the bumps at the back side before completing final structures based on the secondary structures and debonding the second handle wafer from the back side. 1. An optical-electrical module based on silicon photonics TSV interposer comprising:a silicon substrate including a front side and a back side;a plurality of through-silicon vias (TSVs) formed in a first region of the silicon substrate, each TSV being configured to fill a conductor material ended with a pad at the front side and a bump at the back side;a coupler suspended over a cavity in the front side, the cavity being formed in a second region isolated from the first region after the plurality of TSVs is formed;a laser device disposed in a trench in the second region of the front side;a fiber installed in a V-groove in the second region of the front side, the fiber being configured to couple with the coupler and the laser device; andone or more electrical IC chips having electrodes coupled directly with some pads at the front side that electrically connected to some bumps at the back side through the conductive material in the plurality of TSVs.2. The optical-electrical module of claim 1 , wherein the silicon substrate comprises at least a patterned metallization layer and one or more ...

Camera Lens Module and Manufacturing Method Thereof

A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration. 120-. (canceled)21. A camera lens module , comprising:an image sensor having a photosensitive path; anda lens assembly coupled to said image sensor along said photosensitive path, wherein said lens assembly comprises one or more optical lens modules and an aperture member coupled at said respective optical lens module, wherein said optical lens module comprises a lens barrel and at least an optical lens supported within said lens barrel, wherein an assembling position of said optical lens module with respect to a position of said image sensor is arranged to be adjustable for calibration and said assembling position of said optical lens module is permanently fixed after calibration.22. The camera lens module claim 21 , as recited in claim 21 , wherein said lens assembly comprises two or more optical lens modules and said aperture member is coupled at a top portion of one of said optical lens modules claim 21 , wherein said assembling positions of said aperture member and said optical lens modules are arranged to be adjustable with respect to each other and said position of said image sensor for calibration during assembling thereof.23. The camera lens module claim 21 , as recited in claim 21 , wherein said image sensor comprises a lens base coupled to said optical lens module and ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1105-. (canceled)106. A molded photosensitive assembly of an array imaging module , comprising:a photosensitive device, which comprises a circuit board and at least two photosensitive units coupled at the circuit board, anda mold sealer molded to seal the circuit board and the photosensitive units to form an one-piece integrated device.107. The molded photosensitive assembly claim 106 , as recited in claim 106 , wherein the mold sealer has two optical windows aligned with the photosensitive units to form two light channels for the photosensitive units respectively.108. The molded photosensitive assembly claim 106 , as recited in claim 106 , wherein each of the optical windows of the mold sealer is configured to have a tapered size that a cross section of the optical window is gradually increased from bottom to top.109. The molded photosensitive assembly claim 107 , as recited in claim 107 , wherein a top side of the mold sealer is arranged for supporting at least one of a supporter claim 107 , an optical lens claim 107 , a driver claim 107 , and a light filter of the array imaging module.110. The molded ...

Adjustable Optical Lens and Camera Module and Manufacturing Method and Applications Thereof

An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor. 1. A camera module , comprising:a photosensitive device including an optical sensor; andan adjustable optical lens member which is arranged in a photo sensitive path of said optical sensor and comprises an optical structural member, one or more lenses and an aperture member, wherein each of said lenses is arranged in an internal space of said optical structural member, wherein at least one of said lenses is preassembled in said internal space of said optical structural member serving as an adjustable lens, wherein said aperture member has at least one adhesive injection channel extended corresponding to said adjustable lens, such that after said adjustable lens is adjusted, said adhesive injection channel is guided for adjusting an assembling position of said aperture member, adjusting an assembling position of said adjustable optical element, and injecting adhesive into said adjustable optical device through said adhesive injecting channel to affix a position of said adjustable lens, wherein when said adjustable lens is adjusted inside ...

SPLIT LENS ASSEMBLY AND CAMERA MODULE

Disclosed are a split lens assembly and a camera module. The split lens assembly comprises a first lens module and a second lens module. The first lens module is assembled to the second lens module. The first lens module and the second lens module are calibrated and assembled. A spacing that facilitates calibration is located between the first lens module and the second lens module. 1. A split lens assembly , comprising at least two lens modules and a spacing provided between every two adjacent lens modules , each of the lens modules further comprising a lens set and a lens barrel , the lens barrel holding the lens set inside the lens barrel , the lens set comprising at least two lenses , and the spacing being provided between an edge of a lens near an image side of a lens set and an edge of a lens near an object side of another lens set.2. The split lens assembly according to claim 1 , wherein the split lens assembly further comprises a connecting medium claim 1 , and every two lens modules are connected by means of the connecting medium.3. The split lens assembly according to claim 2 , wherein the connecting medium is a thermosetting material or a photocuring material.4. The split lens assembly according to claim 2 , wherein the spacing is located between non-light-transmissive portions of an image side surface of a lens nearest to the image side in a lens set and an object side surface of a lens nearest to the object side in another lens set located at an image side of the lens set.5. The split lens assembly according to claim 4 , wherein a minimum height of the spacing ranges greater than or equal to 0.02 mm.6. The split lens assembly according to claim 5 , wherein the minimum height of the spacing ranges from 0.15 mm to 1 mm.7. The split lens assembly according to claim 4 , wherein the split lens assembly further comprises at least one spacer claim 4 , and wherein the spacer is disposed between the lenses of the8. The split lens assembly according to claim 7 , ...

Adjustable Optical Lens and Camera Module and Aligning Method Thereof

An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively. 1. A camera module , comprising:an optical sensor, andan adjustable optical lens, which is optically coupled with said optical sensor, comprising one or more lens elements and an optical structure element, wherein said lens elements are spacedly arranged in order along an optical path of said optical sensor within said optical structure element, wherein at least one of said lens elements is configured as an adjustable lens element that an assemble position thereof is arranged to be adjustable before permanently affixed to said optical structure element, wherein one or more channels are provided in said optical structure element and positioned with respect to said adjustable lens element to communicate an interior space of said optical structure element with an outside environment thereof for adjusting and permanently fixing said adjustable lens element in position within said optical structure element.2. The camera module claim 1 , as recited in claim 1 , wherein said channel is functioned as an adjusting channel positioned corresponding to a position of said adjustable lens element for adjusting said adjustable lens element within said optical structure element and functioned as a fixing channel for permanently fixing said adjustable lens element in position within said optical structure element.3. The camera module claim 1 , as recited in claim 1 , wherein at least ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units coupled at the chip coupling area of the circuit board, at least two lead wires electrically connected the photosensitive units at the chip coupling area of the circuit board, and a mold sealer which includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1. A molded photosensitive assembly for an array imaging module comprising at least two optical lenses , comprising:at least a circuit board having one or more electronic elements electrically coupled at said circuit board;at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive encircling said photosensitive area; anda molded base integrally molded at said circuit board to integrally and sealedly embed and enclose said electronic elements and said connecting elements therein to form an integrated body, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein each of said optical windows is configured to have a tapered size that a cross section of said optical window is gradually increased from bottom to top, wherein said at least two optical windows form at least two light channels through said photosensitive units and the optical lenses respectively; andat least one light filter, which is coupled at a top ...

AUTOMATIC CLOCK TREE SYNTHESIS EXCEPTIONS GENERATION

Systems and techniques are described for automatically generating clock tree synthesis (CTS) exceptions. The process can use on one or more criteria to identify sequential circuit elements that can be ignored during clock skew minimization. For example, the process can identify sequential circuit elements whose clock skew cannot be balanced with other sequential circuit elements due to structural reasons, identify sequential timing elements that do not have a timing relationship with other sequential timing elements in the clock tree, and/or identify sequential circuit elements whose data pins have a sufficiently large slack so that clock skew is not expected to cause timing violations at any of the data pins. Next, the process can generate clock tree exceptions based on the identified sequential circuit elements. 1. A method for generating clock tree synthesis (CTS) exceptions for a circuit design , the method comprising:a computer identifying a set of sequential circuit elements in the circuit design that can be ignored during clock skew minimization; andthe computer generating CTS exceptions based on the identified set of sequential circuit elements.2. The method of claim 1 , further comprising performing CTS on the circuit design by using the CTS exceptions.3. The method of claim 1 , wherein said identifying includes identifying sequential circuit elements in the circuit design whose clock skew cannot be balanced with other sequential circuit elements due to structural reasons.4. The method of claim 1 , wherein said identifying includes identifying sequential timing elements in the circuit design that do not have a timing relationship with other sequential timing elements in the clock tree.5. The method of claim 1 , wherein said identifying includes identifying sequential circuit elements in the circuit design whose data pins have a sufficiently large slack so that clock skew is not expected to cause timing violations at any of the data pins.6. A non-transitory ...

DUAL-STRUCTURE CLOCK TREE SYNTHESIS (CTS)

Dual-structure clock tree synthesis (CTS) is described. Some embodiments can construct a set of upper-level clock trees, wherein each leaf of each upper-level clock tree is a root of a lower-level clock tree. Each upper-level clock tree can be optimized to reduce an impact of on-chip-variation and/or cross-corner variation on clock skew. Next, for each leaf of each upper-level clock tree, the embodiments can construct a lower-level clock tree to distribute a clock signal from the leaf of the upper-level clock tree to a set of clock sinks. The lower-level clock tree can be optimized to reduce latency, power consumption, and/or area. 1. A method for clock tree synthesis , the method comprising:constructing a set of upper-level clock trees, wherein each leaf of each upper-level clock tree is a root of a lower-level clock tree, and wherein each upper-level clock tree is optimized to reduce an impact of on-chip-variation and/or cross-corner variation on clock skew; andfor each leaf of each upper-level clock tree, constructing a lower-level clock tree, wherein the lower-level clock tree distributes a clock signal from the leaf of the upper-level clock tree to a set of clock sinks, and wherein the lower-level clock tree is optimized to reduce latency, power consumption, and/or area.2. The method of claim 1 , wherein wires in upper-level clock trees have wider widths than wires in lower-level clock trees.3. The method of claim 1 , wherein all horizontal wires of a given upper-level clock tree are routed on the same metal layer.4. The method of claim 1 , wherein all vertical wires of a given upper-level clock tree are routed on the same metal layer.5. The method of claim 1 , wherein all buffers in a given upper-level clock tree have the same size.6. A non-transitory computer-readable storage medium storing instructions that claim 1 , when executed by a computer claim 1 , cause the computer to perform a method for clock tree synthesis claim 1 , the method comprising: ...

Adjustable Optical Lens and Camera Module and Manufacturing Method Thereof

An adjustable optical lens and camera module and manufacturing method thereof are provided, wherein the camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens, which is arranged in a photosensitive path of the optical sensor, includes an optical structural member and at least two lenses. Each of the lens is arranged in an internal space of the optical structural member along an axial direction of the optical structural member, wherein before packaging the adjustable optical lens and the optical sensor, at least one position of the lens in the internal space of the optical structural member is able to be adjusted, so that a central axis line of the adjustable optical lens and a central axis line of the optical sensor are coincided, so as to improve the image quality of the camera module.

MULTI-GROUP LENS, CAMERA MODULE, AND ELECTRONIC DEVICE THEREOF

A multi-group lens assembly (), a camera module (), and an electronic device () therefore are provided. The multi-group lens assembly () includes at least two group units ( and ). At least a first gap () is provided between the at least two adjacent group units ( and ) to compensate a difference between the multi-group lens assembly () and an optical design system, thus allowing an optical system of the multi-group lens assembly conform to the optical design system of the present invention. 1. A multi-group lens assembly , comprising:at least two group units; andat least one first gap between at least two adjacent group units to compensate for a difference between the multi-group lens assembly and an optical design system, so that an optical system of the multi-group lens assembly conforms to the optical design system.2. The multi-group lens assembly according to claim 1 , wherein the multi-group lens assembly includes two group units claim 1 , which are a first group unit and a second group unit claim 1 , respectively claim 1 , and the first group unit includes a first bearing component and at least one first group lenses which is mounted in the first bearing component claim 1 , and the second group unit includes a second bearing component and at least one second group lens which is mounted in the second bearing component claim 1 , so as to form two lens assembly units separately.3. The multi-group lens assembly according to claim 2 , wherein the first bearing component forms a first gap with the second bearing component claim 2 , and a connection medium is provided in the first gap.4. The multi-group lens assembly according to claim 2 , wherein the first bearing component includes a first main body and an extension platform claim 2 , the extension platform forms a first gap with the second bearing component of the second group unit.5. The multi-group lens assembly according to claim 4 , wherein the extension platform forms a ring structure.6. The multi-group lens ...

System-Level Camera Module with Electrical Support and Manufacturing Method Thereof

A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component. 1. A camera module , comprising:an optical lens;a photosensitive sensor, wherein said optical lens is positioned along a photosensitive path of said photosensitive sensor; andan electrical support, which comprises:a support body that supports said optical lens, having a first top surface and a second top surface at a level higher than said first top surface, wherein said first top surface and said second top surface are arranged at same top side of said support body;a circuit arrangement embedded in said support body and conductively connected with said photosensitive sensor; anda connecting member comprising a plurality of photosensitive sensor conductive members formed on a surface of said support body and electrically connected with said circuit arrangement.2. The camera module claim 1 , as recited in claim 1 , wherein said photosensitive sensor is coupled with said support body and electrically connected to said photosensitive sensor conductive members to electrically connect with said circuit arrangement.3. The camera module claim 1 , as recited in claim 1 , wherein said support body forms a circuit board to electrically connect with said photosensitive sensor and serves as a base to support said photosensitive sensor.4. The camera module claim 2 , as recited in claim 2 , wherein said support body forms a circuit board to electrically connect with said photosensitive sensor and serves as a base to ...

Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof

A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1. A molded photosensitive assembly for an array imaging module comprising at least two optical lenses , comprising:at least a circuit board having one or more electronic elements electrically coupled at said circuit board;at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive encircling said photosensitive area; anda molded base integrally molded at said circuit board to integrally and sealedly embed and enclose said electronic elements and said connecting elements therein to form an integrated body, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein each of said optical windows is configured to have a tapered size that a cross section of said optical window is gradually increased from bottom to top, wherein said at least two optical windows form at least two light channels through said photosensitive units and the optical ...

IDENTITY AUTHENTICATION, UNLOCKING, AND PAYMENT METHODS AND APPARATUSES, STORAGE MEDIA, PRODUCTS, AND DEVICES

An identity authentication method includes: obtaining first feature data of a first user image; performing quantization processing on the first feature data to obtain second feature data; and obtaining an identity authentication result based on the second feature data. 1. An identity authentication method , comprising:obtaining first feature data of a first user image;performing quantization processing on the first feature data to obtain second feature data; andobtaining an identity authentication result based on the second feature data.2. The method according to claim 1 , further comprising: before the performing quantization processing on the first feature data claim 1 , performing dimensionality increasing transform processing on the first feature data by using a transform parameter to obtain transformed data claim 1 ,wherein the performing quantization processing on the first feature data to obtain second feature data comprises: performing quantization processing on the transformed data to obtain the second feature data.3. The method according to claim 2 , wherein the performing dimensionality increasing transform processing on the first feature data by using a transform parameter to obtain transformed data comprises:determining a product of the first feature data and the transform parameter as the transformed data.4. The method according to claim 2 , further comprising: before the performing dimensionality increasing transform processing on the first feature data by using a transform parameter claim 2 , initializing the transform parameter; andperforming iterative update on the initialized transform parameter based on multiple pieces of sample feature data, until an iteration termination condition is met.5. The method according to claim 4 , wherein the initializing the transform parameter comprises:initializing the transform parameter by means of a Gaussian random function.6. The method according to claim 4 , wherein the performing iterative update on the ...

Camera Module Based on Molding Technique and Molded Circuit Unit and Manufacturing Method Thereof

Molded circuit unit of camera module, based on molding technique, and manufacturing method thereof, includes a circuit board portion and a molding portion. The circuit board portion is electrically connected with a sensor of the camera module. The molding portion is molded to form on the circuit board portion to enclose electric elements protruded on the circuit board portion and support the camera lens of the camera module.

Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens. 1. An array imaging module , comprising:at least two optical lenses; anda molded photosensitive assembly, which comprises:at least a circuit board which has at least one receiving chamber provided in a top lateral side thereof, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said receiving chambers respectively;at least two photosensitive units, each having a photosensitive area provided on a top side thereof, electrically coupled at said circuit board for photoelectric conversion, wherein at least one of said two photosensitive units is received in said respective receiving chamber to reduce a height difference between said top lateral side of said circuit board and said top side of said photosensitive unit so as to reduce a thickness of said molded photosensitive assembly; anda molded base integrally coupled at a peripheral portion of said circuit board to integrally encapsulate and enclose at least one of said sets of said electronic elements therein to form an integrated body to prevent said electronic elements from exposing to outside and isolate said electronic elements with each other to prevent mutual interference therebetween, so as to reduce a distance ...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens. 1. An array imaging module , comprising:at least two optical lenses; andat least a molded photosensitive assembly which comprises:at least a circuit board having at least two coupling areas on a top lateral side thereof, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said two coupling areas thereof;at least two photosensitive units electrically coupled at said coupling areas of said circuit board respectively for photoelectric conversion;a molded base integrally coupled at said circuit board to integrally encapsulate and enclose said electronic elements therein to form an integrated body that prevents said electronic elements from exposing to outside and isolates said electronic elements with each other to prevent mutual interference therebetween, so as to reduce a distance between every two said electronic elements to reduce a size of said molded photosensitive assembly, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein said two optical lenses are ...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device

An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens. 1. A manufacturing method of a molded photosensitive assembly of an array imaging module , comprising the steps of:(a) providing at least a circuit board having at least two coupling area and at least two sets of electronic elements electrically coupled thereat outside said two coupling areas;(b) providing an enclosing element at a mold engaging surface of a first mold body of a mold;(c) receiving said circuit board in said mold and positioning between said first mold body and a second mold body, wherein when said first mold body and said second mold body are coupled with each other in mold closing state, a mold cavity is formed between said first mold body and said second mold body, wherein a peripheral portion of said circuit board and a center portion of said circuit board are correspondingly disposed in said mold cavity, wherein said mold engaging surface of said first mold body is shielded from directly contacting with said circuit board that provides a buffering effect at said mold engaging surface of said first mold body to prevent said circuit board from being directly impacted when said first mold body and said second mold body are closed and coupled with each other, as well as a sealing effect between said mold engaging surface of said ...

Camera Lens Module and Manufacturing Method Thereof

A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses. 1. A lens assembly , comprising:a first optical lens module, comprising a first carrier and at least one first optical lens received in the first carrier; anda second optical lens module, comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier,wherein when the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.2. The lens assembly according to claim 1 , wherein an adjustable clearance exists between an outer peripheral surface of the first carrier and an inner peripheral surface of the bearing portion.3. The lens assembly according to claim 1 , wherein an adjustable clearance exists between a bottom surface of the first carrier and a top surface of the bearing portion.4. The lens assembly according to claim 3 , wherein an adjustable clearance exists between the bottom surface of the lowermost lens of the first optical lenses and the top surface of the bearing portion of the second optical ...

Vertical integration of hybrid waveguide with controlled interlayer thickness

An silicon photonics device of hybrid waveguides having a coupling interlayer with an accurately controlled thickness and a method of making the same. The device includes a first plurality of Si waveguides formed in a SOI substrate and a first layer of SiO 2 overlying the first plurality of Si waveguides and a second plurality of Si 3 N 4 waveguides formed on the first layer of SiO 2 . At least one Si 3 N 4 waveguide is disposed partially overlapping with at least one of the first plurality Si waveguides in vertical direction separated by the first layer of SiO 2 with a thickness controlled no greater than 90 nm. The device includes a second layer of SiO 2 overlying the second plurality of Si 3 N 4 waveguides. The method of accurately controlling the coupling interlayer SiO 2 thickness includes a multilayer SiO 2 /Si 3 N 4 /SiO 2 hard mask process for SiO 2 etching and polishing as stopping and buffering layer as well as Si waveguide etching mask.

OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION

An optical transceiver by hybrid multichip integration. The optical transceiver includes a PCB with a plurality of prefabricated surface bonding sites. A first chip includes a FOWLP package of multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer is disposed on the PCB by respectively bonding a plurality of conductor balls between the dielectric redistribution layer and the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) in the dielectric molding layer. The optical transceiver further includes a second chip configured as a Sipho die comprising photonics devices embedded in a SOI wafer substantially free from any electronics device process. The second chip is stacked over the first chip with multiple conductor bumps being bonded respectively to the soldering material in the multiple TMVs. 1. An optical transceiver by hybrid multichip integration comprising:a PCB with a plurality of prefabricated surface bonding sites;a first chip comprising multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer, the first chip being disposed on the PCB by bonding the dielectric redistribution layer via a plurality of conductor balls respectively on the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) formed in the dielectric molding layer; anda second chip comprising photonics devices embedded in a SOI wafer having a front surface with multiple conductor bumps being added, the second chip being stacked over the first chip with the multiple conductor bumps on the front surface being bonded respectively to the soldering material in the multiple TMVs.2. The optical transceiver of wherein the first chip comprises multiple electronics dies packaged together using an Embedding Insulation Sheet (EBIS) type material for the ...

COMPACT OPTICAL TRANSCEIVER BY HYBRID MULTICHIP INTEGRATION

A compact optical transceiver formed by hybrid multichip integration. The optical transceiver includes a Si-photonics chip attached on a PCB. Additionally, the optical transceiver includes a first TSV interposer and a second TSV interposer separately attached nearby the Si-photonics chip on the PCB. Furthermore, the optical transceiver includes a driver chip flip-bonded partially on the Si-photonics chip through a first sets of bumps and partially on the first TSV interposer through a second sets of bumps. Moreover, the optical transceiver includes a transimpedance amplifier module chip flip-bonded partially on the Si-photonics chip through a third sets of bumps and partially on the second TSV interposer through a fourth set of bumps. 12-. (canceled)3. The optical transceiver of wherein the first set of bumps comprises one or more first signal bumps alternatively arranged with one or more first ground bumps in a staggered manner along a nominal direction claim 11 , each first signal bump being soldered to one of the first conductive pads connected to a first transmission line on the Si-photonics chip and each first ground bump being soldered to a neighboring one of the first conductive pads connected to a first GND plane on the Si-photonics chip claim 11 , the first transmission line having a first width substantially smaller than a width of the first GND plane.4. The optical transceiver of wherein the first transmission line comprises a first trace section connected directly to the corresponding one of the first conductive pads claim 5 , the first trace section having a reduced width of at least half of the first width resulting in reduced parasitic capacitance and enhanced inductance associated with the first signal bump connection between the driver chip at top to the Si-photonics chip at bottom connected to the modulator embedded therein.5. An optical transceiver by hybrid multichip integration comprising:a Si-photonics chip attached on a PCB;a first TSV ...

Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors. 1. A camera module , comprising:a camera lens; anda photosensitive unit, comprising an encapsulation portion and a photosensitive portion that comprises a main circuit board and a photosensitive sensor, wherein said encapsulation portion is molded to form a support on said main circuit board and said photosensitive sensor to enable said camera lens to be installed thereon and positioned at a photosensitive path of said photosensitive sensor.2. The camera module claim 1 , as recited in claim 1 , wherein said encapsulation portion forms a concave shaped window which is defined by an inclined inner wall of said encapsulation portion and positioned above said photosensitive sensor to provide a light path of said photosensitive sensor.3. The camera module claim 1 , as recited in claim 1 , wherein the top of said encapsulation portion is adapted for installing a camera module component selected from the group consisting of a frame claim 1 , an optical filter claim 1 , a camera lens and a motor unit of said camera module.4. The camera module claim 1 , as recited in claim 1 , wherein said photosensitive portion comprises at least one connecting element which electrically connects said photosensitive sensor and said main circuit board claim 1 , wherein said photosensitive portion encapsulates and wraps up said connecting element claim 1 , so as to avoid said connecting element from being directly exposed to the outside.5. The ...

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors. 1. A photosensitive unit for a camera module comprising at least a camera lens , comprising:a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, at least an optical filter overlappedly disposed on said photosensitive sensor covering said photosensitive area of said photosensitive sensor and at least a portion of said non-photosensitive area of said photosensitive sensor, one or more connecting elements electrically connecting said main circuit board to an outer edge of said non-photosensitive area of said photosensitive sensor that is not covered by said optical filter;an encapsulation portion which is molded to form a support on said main circuit board and inwaredly extended to said outer edge of said non-photosensitive area of said photosensitive sensor which is not covered by said optical filter, and a peripheral edge of said optical filter which is positioned above said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board and affixing said optical filter on said photosensitive sensor in position by means of molding, said encapsulation portion being protrudingly formed on said main ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1. A molded photosensitive assembly for an array imaging module comprising at least two optical lenses , comprising:at least a circuit board having one or more electronic elements electrically coupled at said circuit board;at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive encircling said photosensitive area, wherein one or more connecting elements are electrically connected to said two non-photosensitive areas of said two photosensitive units and said circuit board; anda molded base integrally molded at said circuit board to integrally and sealedly embed and enclose said electronic elements and said connecting elements therein to form an integrated body, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein each of said optical windows is configured to have a tapered size that a ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1. An array imaging module , comprising:at least two optical lenses; andat least a molded photosensitive assembly, which comprises:at least a circuit board which has one or more receiving chambers provided in a top lateral side thereof, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said one or more receiving chambers respectively;at least two photosensitive units, each having a photosensitive area and a non-photosensitive area provided on a top side thereof, electrically coupled at said circuit board, wherein at least one of said photosensitive units is received in at least one of said receiving chambers to reduce a height difference between said top lateral side of said circuit board and said top side of said photosensitive unit so as to reduce a thickness of said molded photosensitive assembly, wherein one or more connecting elements electrically connect said non-photosensitive areas of said at least two photosensitive units with said circuit board respectively; anda molded base integrally coupled at said circuit board to ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1. An array imaging module , comprising:at least two optical lenses; andat least a molded photosensitive assembly which comprises:at least a circuit board having at least two coupling areas on a top lateral side thereof, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said at least two coupling areas thereof;at least two photosensitive units, each having a photosensitive area and a non-photosensitive area provided on a top side thereof, electrically coupled at said coupling areas of said circuit board respectively wherein one or more connecting elements electrically connect said non-photosensitive areas of said at least two photosensitive units with said circuit board;a molded base integrally coupled at said circuit board to integrally encapsulate and enclose said electronic elements and said connecting elements therein to form an integrated body that prevents said electronic elements from exposing to outside and isolates said electronic elements with each other to prevent mutual interference therebetween, so as to reduce a ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively. 1: An array imaging module , comprising:at least two optical lenses; anda molded photosensitive assembly, which comprises:at least a circuit board having at least two coupling areas and at least two peripheral areas surrounding said two coupling areas respectively on a top lateral side of said circuit board, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said two coupling areas thereof respectively without mutually interfered with each other;at least two photosensitive units, each having a photosensitive area and a non-photosensitive area provided on a top side thereof, electrically coupled at said coupling areas of said circuit board respectively, wherein a plurality of connecting elements electrically connect said non-photosensitive areas of said two photosensitive units with said circuit board;at least two supporting members for protecting said two sets of connecting elements respectively during a molding process of said molded photosensitive assembly, each of said supporting members comprises an encircling frame shaped ...

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

OPTICAL TRANSCEIVER BY FOWLP AND DOP MULTICHIP INTEGRATION

An optical transceiver by hybrid multichip integration. The optical transceiver includes a PCB with a plurality of prefabricated surface bonding sites. A first chip includes a FOWLP package of multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer is disposed on the PCB by respectively bonding a plurality of conductor balls between the dielectric redistribution layer and the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) in the dielectric molding layer. The optical transceiver further includes a second chip configured as a Sipho die comprising photonics devices embedded in a SOI wafer substantially free from any electronics device process. The second chip is stacked over the first chip with multiple conductor bumps being bonded respectively to the soldering material in the multiple TMVs. 1. An optical system comprising:an optical transceiver device comprising:a board with a plurality of prefabricated surface bonding sites;a first chip comprising multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer, the first chip being disposed on the board by bonding the dielectric redistribution layer via a plurality of conductor balls respectively on the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) formed in the dielectric molding layer and one or more prefabricated recessed structures;a second chip comprising photonics devices embedded in a silicon on insulator (SOI) wafer having a front surface with multiple conductor bumps and a fiber coupling structure, the second chip being stacked over the first chip with the multiple conductor bumps on the front surface being bonded respectively to the soldering material in the multiple TMVs; andan optical fiber fixed within V-grooves defined between recessed regions ...

METHOD FOR CO-PACKAGING LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE

A co-packaged optical module includes a substrate, a processor arranged on the substrate and a plurality of light engines mounted around the processor on the substrate using mounting assemblies configured to attach the respective light engines to the substrate. The light engines and the mounting assemblies are disposed along a perimeter of the substrate, including at corners of the substrate. Each of the mounting assemblies includes a socket, a metal clamp clamping a corresponding one of the light engines into the socket, and a plurality of pins which when mated with corresponding holes in the substrate cause peripheries of the mounting assemblies, including the light engines, the sockets and the metal clamps, to be flush with the perimeter of the substrate. 1. A co-packaged optical module comprising:a substrate;a processor arranged on the substrate; anda plurality of light engines mounted around the processor on the substrate using mounting assemblies configured to attach the respective light engines to the substrate, the light engines and the mounting assemblies disposed along a perimeter of the substrate, including at corners of the substrate;each of the mounting assemblies comprising a socket, a metal clamp clamping a corresponding one of the light engines into the socket, and a plurality of pins which when mated with corresponding holes in the substrate cause peripheries of the mounting assemblies, including the light engines, the sockets and the metal clamps, to be flush with the perimeter of the substrate.2. The co-packaged optical module of wherein the metal clamp includes a metal wire shaped to have a perimeter less than a perimeter of the socket and greater than a perimeter of the light engines.3. The co-packaged optical module of wherein each of the light engines comprises a base substrate having electrical contacts claim 1 , and wherein each of the sockets comprises a base member having an array of through holes claim 1 , the co-packaged optical module ...

Co-packaged light engine chiplets on switch substrate

A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines. 1. An optical communication system comprising:a co-packaged optical module comprising a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate, the processor and the light engines generating different amounts of heat during operation; anda heatsink mounted to the co-packaged optical module, the heatsink comprising a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.2. The optical communication system of further comprising a chassis including the co-packaged optical module and a fan providing convective cooling to the co-packaged optical module claim 1 , the heatsink and the fan collectively removing the heat from the co-packaged optical module irrespective of locations and non-uniform heat generated by the processor and the light engines.3. The optical communication system of wherein the heat pipes are disposed in trenches formed in the heatsink and wherein the trenches extend through the heatsink to regions proximate to the processor and the light engines to allow the heat pipes to conduct heat from the processor and the light engines.4. The optical communication system of wherein ...

FORM RECOGNITION METHODS, FORM EXTRACTION METHODS AND APPARATUSES THEREOF

Methods, devices, apparatuses, and systems for form recognition and form extraction are provided. In one aspect, a form recognition method includes: obtaining a form line extraction result of a to-be-recognized form image by performing a form line extraction process on the to-be-recognized form image, obtaining a corrected to-be-recognized form image by performing a correction process on the to-be-recognized form image based on the form line extraction result of the to-be-recognized form image and a preset form template, and performing a text recognition process on the corrected to-be-recognized form image to obtain a form recognition result. The form line extraction result includes at least one of a plurality of first form lines or a plurality of first form line intersections, and the preset form template has at least one of a plurality of preset second form lines or a plurality of preset second form line intersections. 1. A form recognition method performed by a computing device , the method comprising:obtaining a form line extraction result of a to-be-recognized form image by performing a form line extraction process on the to-be-recognized form image, wherein the form line extraction result comprises at least one of a plurality of first form lines or a plurality of first form line intersections;obtaining a corrected to-be-recognized form image by performing a correction process on the to-be-recognized form image based on the form line extraction result of the to-be-recognized form image and a preset form template, wherein the preset form template has at least one of a plurality of preset second form lines or a plurality of preset second form line intersections; andperforming a text recognition process on the corrected to-be-recognized form image to obtain a form recognition result.2. The method of claim 1 , wherein obtaining a corrected to-be-recognized form image comprises: a matching result of form lines by performing a matching process on the plurality of ...

Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors. 1. A photosensitive unit for a camera module comprising at least a camera lens , comprising:a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor;an encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said covering section of said encapsulation portion is molded to have an integral enclosure connection with said main circuit board and to cover ...

MOBILE TERMINAL AND SPECIFIC ABSORPTION RATE REDUCTION METHOD

A mobile terminal and a method for reducing a specific absorption rate are disclosed. The mobile terminal includes: a control unit is connected to an input unit, a memory and a switch, an antenna group containing multiple antennas, and the switch connected to each antenna and the radio-frequency circuit; wherein the input unit is configured to: detect a location of the mobile terminal relative to a user, and notify the control unit of the location; the memory is configured to: store location-specific absorption rate corresponding information of each antenna; and the control unit is configured to: according to the location, search the location-specific absorption rate corresponding information for a specific absorption rate of each antenna at the location obtained, select an antenna according to the specific absorption rate of each antenna at the location and control the switch to connect the selected antenna with the radio-frequency circuit.

CAMERA LENS MODULE AND MANUFACTURING METHOD THEREOF

A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses. 1. A lens assembly , comprising:a first optical lens module, comprising a first carrier and at least one first optical lens received in the first carrier; anda second optical lens module, comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier,wherein when the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses, andwherein overall optical properties of the lens assembly are adjusted in six degrees by means of active calibration, so that the adjustable clearance is formed into a curing clearance.2. The lens assembly according to claim 1 , wherein an adjustable clearance exists between an outer peripheral surface of the first carrier and an inner peripheral surface of the bearing portion.3. The lens assembly according to claim 1 , wherein an adjustable clearance exists between a bottom surface of the first carrier and a top surface of the bearing portion.4. The lens assembly according to ...

MULTI-CHANNEL PARALLEL OPTICAL RECEIVING DEVICE

The present disclosure provides a multi-channel parallel optical receiving device, including a carrier, a light receiving chip, a plurality of optoelectronic diodes disposed on a top surface of an end of the carrier, an optical fiber connector disposed in another end of the carrier, and an arrayed waveguide grating disposed on the top surface of the carrier. The plurality of optoelectronic diodes is electrically connected to the light receiving chip, and an input end of the arrayed waveguide grating is connected to the optical fiber connector for receiving an optical signal from the optical fiber. The optical signals are divided into multi-channel optical signals in parallel. The top surface of an output end of the arrayed waveguide grating is at a predetermined angle, causing the multi-channel optical signals to be reflected by the top surface and to photosensitive surfaces of the optoelectronic diodes arranged in parallel. 1. A multi-channel parallel optical receiving device , comprising: a carrier and an light receiving chip; a plurality of optoelectronic diodes disposed on a top surface of an end of the carrier , and the plurality of optoelectronic diodes electrically connected to the light receiving chip; an optical fiber connector disposed in another end of the carrier; an arrayed waveguide grating further disposed on the top surface of the carrier; and an input end of the arrayed waveguide grating connected to the optical fiber connector for receiving an optical signal from the optical fiber;wherein the optical signals are divided into multi-channel optical signals in parallel by the arrayed waveguide grating based on their wavelengths, the top surface of an output end of the arrayed waveguide grating is at a predetermined angle, causing the multi-channel optical signals reflected by the top surface to be reflected to an photosensitive surface of the plurality of optoelectronic diodes arranged in parallel.2. The multi-channel parallel optical receiving device ...

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors. 1. A photosensitive unit for a camera module comprising at least a camera lens , comprising:a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor;an encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said covering section of said encapsulation portion is molded to have an integral enclosure connection with said main circuit board and to cover ...

System-Level Camera Module with Electrical Support and Manufacturing Method Thereof

A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component. 1. A camera module , comprising:an optical lens;a photosensitive sensor, wherein said optical lens is positioned along an photosensitive path of said photosensitive sensor; andan electrical support, which comprises:a support body, which supports said optical lens, having a first top surface and a second top surface at a level higher than said first top surface to form a step-down stair configuration; anda circuit arrangement embedded in said support body and conductively connected with said photosensitive sensor;a connecting member comprising a plurality of photosensitive sensor conductive members formed on a surface of said support body and electrically connected with said circuit arrangement, wherein said photosensitive sensor is coupled with said support body and electrically connected to said plurality of photosensitive sensor conductive members to electrically connect with said circuit arrangement; anda plurality of electric component conductive members formed on said first top surface of said support body of said electrical support and electrically connected with said circuit arrangement, whereby said support body forms a circuit board to electrically connect with said photosensitive sensor and serves as a base to support said photosensitive sensor.2. The camera module claim 1 , as recited in claim 1 , further comprising a driver coupling with said optical lens claim 1 , wherein said connecting ...

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors. 1. An array camera module , comprising:at least two camera lenses, anda circuit unit which comprises:at least two photosensitive sensors,a circuit board portion electrically connects said at least two photosensitive sensors thereon, anda conjoined encapsulation portion integrally molded on said circuit board portion to support said at least two camera lenses above said at least two photosensitive sensors respectively while said camera lenses are positioned in photosensitive paths of said at least two photosensitive sensors respectively.2. The array camera module claim 1 , as recited in claim 1 , wherein said conjoined encapsulation portion forms at least two windows therein claim 1 , wherein said at least two windows are positioned above and aligned with said at least two photosensitive sensors respectively so as to provide at least two lights paths between said at least two camera lenses and said at least two photosensitive sensors respectively.3. The array camera module claim 1 , as recited in claim 1 , wherein said circuit board portion comprises at least one circuit element protruded from said main circuit board claim 1 , wherein said conjoined encapsulation portion encapsulates and wraps up said circuit element so as to prevent said circuit element from being directly exposed to the outside.4. The array camera module claim 1 , as recited in claim 1 , wherein said circuit unit comprises at least two motor connecting ...

Camera Module and Array Camera Module with Circuit Board Unit and Photosensitive Unit and Manufacturing Method Thereof

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors. 1. A photosensitive unit for a camera module comprising at least a camera lens , comprising:a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor; andan encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said window gradually reduces a size thereof from top to bottom to define a larger upper size and a smaller lower size so as to enable said ...

LENS MODULE AND CAPTURING MODULE INTERGRATING FOCUSING MECHANISM AND ASSEMBLY METHOD THEREFOR

A split lens assembly module, comprising: a focusing mechanism; and a lens assembly, wherein the lens assembly comprises at least two optical lenses, at least one lens barrel member and a bearing structure, each of the at least one lens barrel member holds at least one optical lens to form at least one to-be-adjusted lens assembly, the bearing structure holds at least one optical lens to form a fixing lens assembly, the to-be-adjusted lens assembly is pre-assembled on the fixing lens assembly, the to-be-adjusted lens assembly is suitable for being adjusted relative to an assembly position of the fixing lens assembly, the fixing lens assembly is mounted inside the focusing mechanism through the bearing structure, and moves as the focusing mechanism is powered on, which is suitable for focusing. 1. A split lens assembly module , comprising:a focusing mechanism; anda lens assembly, wherein the lens assembly comprises at least two optical lenses, at least one lens barrel member and a bearing structure, each of the at least one lens barrel member holds at least one optical lens to form at least one to-be-adjusted lens assembly, the bearing structure holds at least one optical lens to form a fixing lens assembly, the to-be-adjusted lens assembly is pre-assembled on the fixing lens assembly, the to-be-adjusted lens assembly is suitable for being adjusted relative to an assembly position of the fixing lens assembly, the fixing lens assembly is mounted inside the focusing mechanism through the bearing structure, and moves as the focusing mechanism is powered on, which is suitable for focusing.2. The split lens assembly module according to claim 1 , wherein the lens barrel member is pre-assembled on a top of the bearing structure by glue to realize a pre-assembly of the to-be-adjusted lens assembly and the fixing lens assembly.3. The split lens assembly module according to claim 2 , wherein the glue used in the pre-assembly is a mixed adhesive of a UV adhesive and a ...

LENS MODULE AND CAPTURING MODULE INTERGRATING FOCUSING MECHANISM AND ASSEMBLY METHOD THEREFOR

A lens module and a capturing module integrating a focusing mechanism and an assembly method therefor. A lens module () comprises at least one optical lens (), a focusing mechanism (), and a supporting structure component (). Each optical lens () is mounted in an accommodating cavity of the supporting structure component () in a height direction of the supporting structure component (). The supporting structure component () is connected inside of the focusing mechanism () as a carrier of the focusing mechanism (). The supporting structure component () moves as the focusing mechanism () is powered, and is thereby suitable for focusing. By replacing a carrier and a lens cone of a conventional focusing mechanism with the supporting structure component (), an overall assembly process is simplified, the yield and quality of a module are improved, and the manufacturing costs are reduced. 1121-. (canceled)122. A camera module , comprising:a photosensitive device, the photosensitive device comprising a photosensitive chip; and a split lens assembly module, wherein the split lens assembly module is disposed on a photosensitive path of the photosensitive chip, the split lens assembly module comprises a focusing mechanism and a lens assembly, the lens assembly comprises at least two optical lenses, at least one lens barrel member and a bearing structure, each of the at least one lens barrel member holds at least one optical lens to form at least one to-be-adjusted lens assembly, the bearing structure holds at least one optical lens to form a fixing lens assembly, the to-be-adjusted lens assembly is pre-assembled on the fixing lens assembly, the to-be-adjusted lens assembly is suitable for being adjusted relative to an assembly position of the photosensitive chip, the fixing lens assembly is mounted inside the focusing mechanism through the bearing structure, and moves as the focusing mechanism is powered on, which is suitable for focusing.123. The camera module according to ...

Camera Lens Module with One or More Optical Lens Modules and Manufacturing Method Thereof

A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

SOFT BIOMIMETIC LEGGED ROBOT

A soft biomimetic legged robot is provided in the present invention, including a plurality of soft robotic arms. The soft robotic arms include a plurality of motion units, and each of the motion units includes one or more of a twist module, an extension module, a contraction, and a bending module. The plurality of motion units is combined to achieve a full-posture motion of the soft robotic arms. By using soft robotic arms composed of different motion units, the soft biomimetic legged robot of the present invention can not only realize the underwater swimming and crawling, but the crawling on land or slopes, thereby adapting to more complicated environments and achieving richer functions. The motion posture is not limited to a single bending, twisting, extension, and shortening. The soft robotic arm can achieve full-posture movements, and its motion type is more complete. 1. A soft biomimetic legged robot , comprising:{'b': 1', '1', '11', '11', '16', '17', '18', '19, 'a plurality of soft robotic arms (), wherein the soft robotic arms () comprise a plurality of motion units (), and each of the motion units () comprises one or more of twist modules (), extension modules (), contraction modules (), and bending modules ();'}{'b': 11', '1, 'wherein the plurality of motion units () is combined to achieve a full-posture motion of the soft robotic arms ().'}216161163162163162163161161162161161. The soft biomimetic legged robot according to claim 1 , wherein the twist modules () comprise a first elastic substrate () claim 1 , a counter-clockwise twist actuator () claim 1 , and a clockwise twist actuator (); each of the counter-clockwise twist actuator () and the clockwise twist actuator () comprises a plurality of actuators; the counter-clockwise twist actuators () are symmetrically disposed on the first elastic substrate () in a left-handed manner along a central axis of the first elastic substrate () claim 1 , and the clockwise twist actuators () are symmetrically disposed ...

LEG-ARM-PADDLE COMPOSITE UNDERWATER ROBOT

A leg-arm-paddle underwater robot is provided in the present invention, which includes: a frame, an operating mechanism, a traveling mechanism, and a propulsion mechanism. The traveling mechanism is adapted to enable the leg-arm-paddle composite underwater robot to travel. The propulsion mechanism is adapted to enable the leg-arm-paddle composite underwater robot to float in water. The operating mechanism includes a first robot arm, a second robot arm, and a first mounting base, wherein the first mounting base is detachably connected to the frame. Both the first robot arm and the second robot arm are rotatably connected to the first mounting base, and rotation centers of the first robot arm and the second robot arm are the same. The operating mechanism of the leg-arm-paddle composite underwater robot has a compact structure and a large working range. The leg-arm-paddle composite underwater robot has reduced volume, enhanced operation capability, wide applicability, and strong practicability. 1. A leg-arm-paddle composite underwater robot , comprising:{'b': 1', '2', '3', '4, 'a frame (), an operating mechanism (), a traveling mechanism () and a propulsion mechanism ();'}{'b': '3', 'wherein the traveling mechanism () is adapted to enable the leg-arm-paddle composite underwater robot to travel;'}{'b': '4', 'wherein the propulsion mechanism () is adapted to enable the leg-arm-paddle composite underwater robot to float in water;'}{'b': 2', '210', '220', '230', '230', '1', '210', '220', '230', '210', '220, 'wherein the operating mechanism () comprises a first robot arm (), a second robot arm (), and a first mounting base (), wherein the first mounting base () is detachably connected to the frame (), both the first robot arm () and the second robot arm () are rotatably connected to the first mounting base (), and rotation centers of the first robot arm () and the second robot arm () are the same.'}2210211220221211221230211221. The leg-arm-paddle composite underwater robot ...

TERRAIN MODELING METHOD THAT FUSES GEOMETRIC CHARACTERISTICS AND MECHANICAL CHARATERISTICS, COMPUTER READABLE STORAGE MEDIUM, AND TERRAIN MODELING SYSTEM THEREOF

A terrain modeling method that fuses geometric characteristics and mechanical characteristics, and a terrain modeling system are provided in the present invention. The method includes steps of: obtaining color images and depth images of the detected region, performing a terrain semantic segmentation on the color images, and fusing ground semantic information obtained by the semantic segmentation and depth information contained in the depth images at the same time to generate the point clouds; mapping the point clouds to a raster map in a map coordinate system to generate corresponding rasters, and updating the elevation values to the corresponding rasters; and calculating the input images in terms of terra-mechanical characteristics, and updating calculation results to the corresponding rasters to generate a terrain model. A mechanical characteristic parameter is added to a terrain factor, and terrain characteristics are innovatively performed from two dimensions of geometric characteristic and mechanical characteristics. 1. A terrain modeling method that fuses geometric characteristics and mechanical characteristics , comprising steps of:obtaining input images of a detected region, and processing the input images to generate point clouds comprising elevation values of the input images;mapping the point clouds to a raster map in a map coordinate system to generate corresponding rasters, and updating the elevation values to the corresponding rasters; andcalculating the input images in terms of terra-mechanical characteristics, and updating calculation results to the corresponding rasters to generate a terrain model.2. The terrain modeling method that fuses geometric characteristics and mechanical characteristics according to claim 1 , wherein the step of obtaining input images of a detected region and processing the input images to generate point clouds comprises:obtaining color images and depth images of the detected region, performing a terrain semantic ...

Adjustable Optical Lens and Camera Module and Aligning Method Thereof

An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively.

INTELLIGENT REAL-TIME ROBOT OPERATING SYSTEM ARCHITECTURE AND OPERATION METHOD THEREOF

An Intelligent Real-Time Robot Operating System (IRT-ROS) architecture and an operation method thereof are provided. The IRT-ROS architecture includes a General-Purpose OS kernel, a Real-Time OS kernel, and an Inter-processor Interrupt interface. The General-Purpose OS kernel is configured to run a General-Purpose OS to execute a non-real-time process. The Real-Time OS kernel is configured to run a Real-Time OS to execute a real-time process. The IPI interface is connected between the General-Purpose OS kernel and the Real-Time OS kernel, and is configured to support communication between the non-real-time process and the real-time process. The AIRT-ROS architecture allows Linux and RTERS to respectively execute non-real-time process and real-time process, and to respectively respond IRQ of non-real-time devices and IRQ of real-time devices. Communications between non-real-time process and real-time process are supported. Therefore, the workload for driving the general-purpose external devices is greatly reduced. 1. An Intelligent Real-Time Robot Operating System (IRT-ROS) architecture , comprising:a General-Purpose OS kernel, configured to run a General-Purpose OS to execute a non-real-time process;a Real-Time OS kernel, configured to run a Real-Time OS to execute a real-time process; andan Inter-Processor Interrupt (IPI) interface, connected between the General-Purpose OS kernel and the Real-Time OS kernel, and configured to support communication between the non-real-time process and the real-time process.2. The IRT-ROS architecture according to claim 1 , further comprising:an external I/O Advanced Programmable Interrupt Controller (I/O APIC), whereinthe General-Purpose OS kernel further comprises a first Local Advanced Programmable Interrupt Controller (LAPIC), connected to the external I/O APIC and configured to respond to an Interrupt Request (IRQ) of a non-real-time device via the external I/O APIC; andthe Real-Time OS kernel further comprises a second LAPIC, ...

THREE-LAYER INTELLIGENCE SYSTEM ARCHITECTURE AND AN EXPLORATION ROBOT

A three-layer intelligence system architecture and an exploration robot are provided. The three-layer intelligence system architecture includes: a digital twin module for creating a virtual exploration environment and a virtual robot according to explored environment data acquired in real time by the exploration robot and robot data of the exploration robot; a virtual reality module for generating a process and a result of the virtual robot executing the control commands in the virtual exploration environment according to the virtual exploration environment, the virtual robot, and control commands of a control personnel for the exploration robot; and a man-machine fusion module for transmitting the control commands and showing the control personnel the process and the result of the virtual robot executing the control commands in the virtual exploration environment, and causing the exploration robot to execute the control commands after acquiring a feedback indicating that the control personnel confirms the control commands. 1. A three-layer intelligence system architecture for an exploration robot , comprising:a digital twin module, configured to create a virtual exploration environment and a virtual robot according to environment data of an explored environment acquired in real time by the exploration robot and robot data of the exploration robot;a virtual reality module, configured to generate a process and a result of the virtual robot executing the control commands in the virtual exploration environment according to the virtual exploration environment, the virtual robot, and control commands of a control personnel for the exploration robot; anda man-machine fusion module, configured to transmit the control commands and showing the control personnel the process and the result of the virtual robot executing the control commands in the virtual exploration environment, and causing the exploration robot to execute the control commands after acquiring a feedback ...

INTEGRATED OPTICAL TRANSCEIVER

An optical transceiver includes a silicon photonics substrate, transmitter circuitry, and receiver circuitry that are heterogeneously integrated. The transmitter circuitry includes a plurality of laser devices formed on the silicon photonics substrate, each of the plurality of laser devices configured to generate a respective laser light, a plurality of modulators formed on the silicon photonics substrate, each of the plurality of modulators configured to modulate the laser lights based on driver signals and output, from the silicon photonics substrate, the modulated laser lights, and a driver formed on the silicon photonics substrate and configured to generate the driver signals. The receiver circuitry includes a photodetector configured to receive a plurality of optical signals and convert the plurality of optical signals to respective electrical signals and a transimpedance amplifier device configured to receive the electrical signals and output the electrical signals from the silicon photonics substrate as electrical outputs. 1. An optical transceiver , comprising:a silicon photonics substrate;transmitter circuitry provided on the silicon photonics substrate, the transmitter circuitryconfigured to (i) modulate laser lights received from a plurality of laser devices based on driver signals and (ii) output, from the silicon photonics substrate, the modulated laser lights;andreceiver circuitry provided on the silicon photonics substrate, the receiver circuitryconfigured to receive a plurality of optical signals and convert the plurality of optical signals to respective electrical signals,the silicon photonics substrate, the transmitter circuitry, and the receiver circuitry being heterogeneously integrated.2. The optical transceiver of claim 1 , wherein the transmitter circuitry comprises a plurality of laser devices formed on the silicon photonics substrate claim 1 , each of the plurality of laser devices being configured to generate a respective laser light.3. The ...

Adjustable Optical Lens and Camera Module and Manufacturing Method and Applications Thereof

An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.

Array camera module and its molded photosensitive assembly, circuit board assembly, and electronic device

本創作係一種陣列攝像模組及其模塑感光組件、線路板組件以及電子設備，其中所述陣列攝像模組包括至少兩光學鏡頭和一模塑感光組件，所述模塑感光組件進一步包括：至少兩感光元件、一線路板和一模塑基座。每個所述感光元件分別被導通地連接於所述線路板，所述模塑基座具有至少兩光窗，並且所述模塑基座與所述線路板的邊緣區域一體結合，以使每個所述感光元件分別對應於每個所述光窗，其中每個所述光學鏡頭分別被設置於每個所述感光元件的感光路徑，以藉由每個所述光窗分別為每個所述感光元件和每個所述光學鏡頭提供一光線通路。

Multi-group lens, camera module, and electronic device thereof

A multi-group lens assembly (10), a camera module (100), and an electronic device (200) therefore are provided. The multi-group lens assembly (10) includes at least two group units (11 and 12). At least a first gap (15) is provided between the at least two adjacent group units (11 and 12) to compensate a difference between the multi-group lens assembly (10) and an optical design system, thus allowing an optical system of the multi-group lens assembly conform to the optical design system of the present invention.

System and method for monitoring SMT apparatuses

A method for monitoring surface mount technology (SMT) apparatuses includes the steps of: providing a data saving module for saving attribute data on the SMT apparatuses, the attribute data including maintenance parameters, repair parameters, and defect rate parameters; obtaining dynamic data on the SMT apparatuses in real time, the dynamic data including maintenance data, repair data, and defect rate data; and monitoring the SMT apparatuses by comparing the attribute data and the dynamic data on the SMT apparatuses.

Camera module, electrical support thereof, and assembling method therefor

Light engine based on silicon photonics TSV interposer

A method for forming a silicon photonics interposer having through-silicon vias (TSVs). The method includes forming vias in a front side of a silicon substrate and defining primary structures for forming optical devices in the front side. Additionally, the method includes bonding a first handle wafer to the front side and thinning down the silicon substrate from the back side and forming bumps at the back side to couple with a conductive material in the vias. Furthermore, the method includes bonding a second handle wafer to the back side and debonding the first handle wafer from the front side to form secondary structures based on the primary structures. Moreover, the method includes forming pads at the front side to couple with the bumps at the back side before completing final structures based on the secondary structures and debonding the second handle wafer from the back side.

Remote-control method for performing social media function by remote-control electronic device using remote controller and the remote controller thereof

本發明係揭露一種使用遙控器的遙控電子裝置執行社群媒體功能的遙控方法及其遙控器。當遙控器向電子裝置下達播放媒體的指令之後，即向伺服器上傳媒體播放最新狀態資料，伺服器係依據媒體播放最新狀態資料、其它各個遙控器之前上傳的各個通訊錄與各個媒體播放最新狀態資料，伺服器進行判斷，然後向遙控器傳送連線狀態資料。遙控器依據連線狀態資料，在顯示器顯示該通訊錄的各個人員的最新連線訊息，以及選擇性執行社群聊天程式，進行互動。

Camera module adopting detachable lens and assembly method thereof

本發明係一種採用分體式鏡頭的攝像模組及其組裝方法，其中所述攝像模組包括一感光裝置和一鏡頭裝置，所述鏡頭裝置包括多個主要由至少一鏡片和至少一鏡筒部件形成的鏡頭部件，所述光闌安裝於最外側的所述鏡頭部件的頂部，其中所述鏡頭部件預組裝於所述感光裝置的感光路徑上，且至少一個所述鏡頭部件和所述鏡片或/和所述光闌的組裝位置相對於所述感光裝置的位置適於被調整，縮減了測試工序，降低了成本，保證了所述攝像模組的較高的成像質量。

Light engine based on silicon photonics tsv interposer

A method for forming a silicon photonics interposer having through-silicon vias (TSVs). The method includes forming vias in a front side of a silicon substrate and defining primary structures for forming optical devices in the front side. Additionally, the method includes bonding a first handle wafer to the front side and thinning down the silicon substrate from the back side and forming bumps at the back side to couple with a conductive material in the vias. Furthermore, the method includes bonding a second handle wafer to the back side and debonding the first handle wafer from the front side to form secondary structures based on the primary structures. Moreover, the method includes forming pads at the front side to couple with the bumps at the back side before completing final structures based on the secondary structures and debonding the second handle wafer from the back side.

System-level camera module with electrical support and manufacturing method thereof

A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

Camera lens module and manufacturing method thereof

A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Camera lens module with one or more optical lens modules and manufacturing method thereof

A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Compact optical transceiver by hybrid multichip integration

A compact optical transceiver formed by hybrid multichip integration. The optical transceiver includes a Si-photonics chip attached on a PCB. Additionally, the optical transceiver includes a first TSV interposer and a second TSV interposer separately attached nearby the Si-photonics chip on the PCB. Furthermore, the optical transceiver includes a driver chip flip-bonded partially on the Si-photonics chip through a first sets of bumps and partially on the first TSV interposer through a second sets of bumps. Moreover, the optical transceiver includes a transimpedance amplifier module chip flip-bonded partially on the Si-photonics chip through a third sets of bumps and partially on the second TSV interposer through a fourth set of bumps.

Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device

Multi-group lens, camera module, and electronic device thereof

A multi-group lens assembly ( 10 ), a camera module ( 100 ), and an electronic device ( 200 ) therefore are provided. The multi-group lens assembly ( 10 ) includes at least two group units ( 11 and 12 ). At least a first gap ( 15 ) is provided between the at least two adjacent group units ( 11 and 12 ) to compensate a difference between the multi-group lens assembly ( 10 ) and an optical design system, thus allowing an optical system of the multi-group lens assembly conform to the optical design system of the present invention.