24-10-2019 дата публикации
Номер: US20190327840A1
Автор:
Dana Craig Bookbinder,
Yunfeng Gu,
Prantik Mazumder,
Rajesh Vaddi,
BOOKBINDER DANA CRAIG,
GU YUNFENG,
MAZUMDER PRANTIK,
VADDI RAJESH,
Bookbinder, Dana Craig,
Gu, Yunfeng,
Mazumder, Prantik,
Vaddi, Rajesh
Принадлежит:
In some embodiments, a method comprises leaching a surface of a glass or glass ceramic substrate to form a leached layer. The glass or glass ceramic substrate comprises a multi-component material. The material has a bulk composition, in mol % on an oxide basis: 51% to 90% SiO; 10% to 49% total of minority components RO. Leaching comprises selectively removing components ROof the glass or glass ceramic substrate preferentially to removal of SiO. In the leached layer, the ROconcentration is 50% or less than the ROconcentration of the bulk composition. 1. A method , comprising:leaching a surface of a glass or glass ceramic substrate to form a leached layer; [ [{'sub': '2', '51% to 90% SiO;'}, {'sub': 'x', '10% to 49% total of minority components RO; and'}], 'the glass or glass ceramic substrate comprises a multi-component material, the material having a bulk composition, in mol % on an oxide basis, {'sub': x', '2, 'wherein leaching comprises selectively removing components ROof the glass or glass ceramic substrate preferentially to removal of SiO;'}, {'sub': x', 'x, 'wherein, in the leached layer, the ROconcentration is 50% or less than the ROconcentration of the bulk composition.'}], 'wherein2. The method of claim 1 , further comprising:etching the surface; {'sub': 2', 'x, 'etching comprises selectively removing SiOfrom the substrate preferentially to removal of minority components RO.'}, 'wherein3. The method of claim 2 , wherein:leaching the surface is performed before etching the surface.4. The method of claim 2 , wherein:leaching the surface is performed after etching the surface.5. The method of claim 1 , wherein:after leaching, the surface has a surface roughness Ra of 0.3 nm or more, and the leached layer has a thickness of 100 nm or more.6. The method of claim 2 , wherein:after leaching and etching, the surface has a surface roughness Ra of 0.4 nm or more, and the leached layer has a thickness of 20 nm or more.7. The method of claim 2 , wherein:after leaching ...
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