Radiating semiconductor sealing structure and making method thereof

The present invention relates to a radiating semiconductor sealing structure and a making method thereof. Mainly, a semiconductor chip is jointed and electrically connected to a chip bearing part, and a radiating part with a blackening layer through a blackening processing is provided; a protective layer is formed on the blackening layer; then, a sealing colloid is formed on the chip bearing part, and is used for coating the semiconductor chip, the protective layer and the radiating part to enable the protective layer to be arranged between the blackening layer and the sealing colloid as a buffer layer between the blackening layer and the sealing colloid; and further, a problem that the radiating part and the blackening layer are delaminated because of stress applied to the radiating part and the blackening layer.

Method for making semiconductor device and bearing part using this method

The invention discloses a manufacturing method of a semiconductor device and a bearing assembly used therein, comprising: placing a substrate embedded with a chip into an opening of a bearing assembly, the bearing part is formed with at least a store hole and a inspection hole, wherein the store hole can be used for injecting compound to fill the internals between the substrate and the bearing part via the capillary phenomenon, in order to judge whether the intervals between the substrate and the bearing part are completely filled with the compound via observing whether the inspection hole is filled with the compound; after completely filled with the compound, carrying out mould-pressing process to form a package colloid for coating the chip; then carrying out ball mounting process and cutting process in order to form expected semiconductor device. Via the inspection hole, the user can inspect whether the intervals between the substrate and the bearing part are completely filled with the ...

Heat radiating type package construction and manufacturing method thereof

The invention discloses a heat dissipation packaging structure and a manufacturing method thereof. An active surface of a semi-conductor chip is arranged on and electrically connected to a chip bearing unit that is connected with a radiator element provided with a radiating part and a supporting part, to ensure that the semi-conductor can be contained in an containing space formed by the radiator part and the supporting part; wherein, the radiating part has openings formed corresponding to the semi-conductor chip, and then a packaging colloid used for coating the semi-conductor chip and the radiator element is formed, and the packaging colloid is thinned to remove the packaging colloid on the semi-conductor chip, so as to expose an inactive surface and a top surface of the radiating part of the semi-conductor outside the packaging colloid so as to prepare the heat dissipation packaging structure by the way of simplifying the process steps and cost, and also avoid the problem of the crushing ...

Cooling type packaging member production method and its applied cooling structure

The invention discloses a preparation method for a radiation package and a radiation structure used by the radiation package, wherein the method mainly comprises the steps of connecting a semi-conductor chip to and electrically on a chip carrier, and connecting a radiation structure to the semi-conductor chip; and the radiation structure is provided with a covering layer on the surface and convexly provided with a supporting part on the edge, wherein, the plan view size of the radiation structure is larger than that of the completed package, so the chip carrier connected with the semi-conductor chip and the radiation structure are arranged in a mould cavity of a packaging mould which is filled with packaging materials so as to form a package colloid covering the radiation structure and the semi-conductor chip, wherein, when the mould flowing velocity of the lower part of the radiation structure is higher than that of the upper part of the radiation structure for pushing and pressing the ...

Method for producing semiconductor packaging part

The invention relates to a method for producing a semiconductor packaging part, adopting a plurality of substrates and a bearing part provided with multiple openings, wherein flip-chip semiconductor chips and radiating pieces are sequentially arranged on each substrate, the size of each substrate is approximately equal to the predetermined size of a packaging part, and the size of each radiating piece is smaller than the size of each substrate so as to position the substrates in the openings of the bearing part; then packaging colloids used for covering the chips and the radiating pieces are formed on the openings, wherein areas covered by the packaging colloids are larger than the size of the openings, the step of demoulding is carried out, and laser is utilized for eliminating the packaging colloids which cover the radiating pieces; the operation of cutting is carried out along the edges of the substrates to produce a plurality of semiconductor packaging parts, thereby enabling the packaging ...

Semiconductor package and the production method thereof

Method for producing semiconductor packaging part

The invention relates to a method for producing a semiconductor packaging part, adopting a plurality of substrates and a bearing part provided with multiple openings, wherein flip-chip semiconductor chips and radiating pieces are sequentially arranged on each substrate, the size of each substrate is approximately equal to the predetermined size of a packaging part, and the size of each radiating piece is smaller than the size of each substrate so as to position the substrates in the openings of the bearing part; then packaging colloids used for covering the chips and the radiating pieces are formed on the openings, wherein areas covered by the packaging colloids are larger than the size of the openings, the step of demoulding is carried out, and laser is utilized for eliminating the packaging colloids which cover the radiating pieces; the operation of cutting is carried out along the edges of the substrates to produce a plurality of semiconductor packaging parts, thereby enabling the packaging ...