Cooling type packaging member production method and its applied cooling structure

The invention discloses a preparation method for a radiation package and a radiation structure used by the radiation package, wherein the method mainly comprises the steps of connecting a semi-conductor chip to and electrically on a chip carrier, and connecting a radiation structure to the semi-conductor chip; and the radiation structure is provided with a covering layer on the surface and convexly provided with a supporting part on the edge, wherein, the plan view size of the radiation structure is larger than that of the completed package, so the chip carrier connected with the semi-conductor chip and the radiation structure are arranged in a mould cavity of a packaging mould which is filled with packaging materials so as to form a package colloid covering the radiation structure and the semi-conductor chip, wherein, when the mould flowing velocity of the lower part of the radiation structure is higher than that of the upper part of the radiation structure for pushing and pressing the ...

Manufacturing method of semiconductor package and applied heat radiating structure therein

The invention discloses a method for manufacturing a semiconductor package. The method is as follows: a semiconductor chip is electrically connected to a chip carrying part and a heat dissipation structure is arranged on the semiconductor chip, the semiconductor chip is arranged inside a die cavity of a package die which is filled with package materials to form a package colloid, wherein, the heat dissipation structure comprises a radiating fin the plane size of which is more than the predetermined size of the semiconductor package, a covering layer which is formed on the surface of the radiating fin, and a plurality of salient points which are formed on the surface edge of the covering layer where the semiconductor chip is not covered relatively; when the flow velocity of the package materials under the heat dissipation structure is more than that of the package materials above the heat dissipation structure and then the radiating fin is pushed upwards, warping of the radiating fin can ...

Method and equipment for detecting interaction of biomacromolecules

Method and apparatus for screening G protein coupled receptor medicine

This invention shows a method and device which is used to screen G-protein-coupled receptor medicine. First put buffer solution into liquid storage pool.Second, G-protein-coupled receptor exists in organic bodies, it delivers signals to lower effect systems. Arrestin protein can uncouple acceptor and G protein, it helps acceptor to put up endocytosis reaction leaded by coated veside. Third, put G-protein-coupled receptor, medicine molecule, arrestin, G protein into liquid storage pool. Fourth, regulate voltage to make samples to move in one direction. Fifth, change voltage, detect the signals of the samples and screen the medicine molecule. This device includes sample mix-reaction stream, sample separate and detecting stream. This method is very convenient for use. The device has a simple structure and is low in cost.

Cooling type semiconductor package

The invention discloses a heat-dissipating semiconductor enclosure, comprising a chip carrier and a semiconductor chip which is electrically connected to the chip carrier; a heat conduction glue holder area is arranged at the surface of the semiconductor chip; the border of the heat conduction glue holder area is away from the border of the semiconductor chip; the heat-dissipating semiconductor enclosure further comprises heat conduction glue which is arranged in the heat conduction glue holder area, a heat dissipating element which is connected on the heat conduction glue, and an enclosing rubber body which is arranged between the chip carrier and the heat dissipating element and covers the chip carrier and the heat dissipating element.; in this way, the border of the functional surface, the border of the non-functional surface and the side edges of the semiconductor chip can all be embedded into the enclosing rubber body, thus increasing the contact area of the enclosing rubber body with ...