Touch screen and manufacturing method thereof

The present invention provides a method of manufacturing a touch screen, comprising the steps of: a) forming a conductive layer on a substrate; b) forming an etching resist pattern on the conductive layer; and c) forming a conductive pattern having a line width smaller than the line width of the etching resist pattern by over-etching the conductive layer by using the etching resist pattern and a touch screen manufactured by the method. According to the present invention, a touch screen comprising a conductive pattern having an ultrafine line width can be economically and efficiently provided.

ELECTRICAL CONDUCTOR AND A PRODUCTION METHOD THEREFOR

Provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electro-conductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that, for at least 30% of the entire surface area of the transparent substrate, when a straight line is drawn intersecting the electroconductive pattern, the ratio of the standard deviation to the mean value of the distances between adjacent points of intersection between the straight line and the electroconductive pattern (the distance distribution ratio) is at least 2%. Also, provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electroconductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that at least 30% of the entire surface area of the transparent substrate is accounted for by continuously distributed closed motifs, and the ratio of the standard deviation to the mean value of the surface areas of the closed motifs (the surface area distribution ratio) is at least 2%. 1. An electrical conductor comprising:a transparent substrate; andan electric conductive pattern on at least one side of the transparent substrate,when a straight line that crosses the electric conductive pattern is drawn, wherein 30% or more of the entire area of the transparent substrate has the electric conductive pattern in which a ratio (distance distribution ratio) of standard deviation in respects to an average value of distances between adjacent intersection points of the straight line and the electric conductive pattern is 2% or more.2. The electrical conductor according to claim 1 , wherein the straight line that crosses the electric conductive pattern is a line in which the standard deviation of the distances between adjacent intersection points ...

CONDUCTIVE METAL INK COMPOSITION AND METHOD FOR FORMING A CONDUCTIVE PATTERN

The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern, and the method of preparing a conductive pattern using the same. 1. A conductive metal ink composition which comprises a conductive metal powder; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer , and which is used for forming a conductive pattern , by being printed on a substrate with a roll-printing process.2. The conductive metal ink composition of claim 1 , wherein the composition is used for forming an electrode of flat panel display device.3. The conductive metal ink composition of claim 1 , wherein the conductive metal powder comprises at least one metal powder selected from the group consisting of silver (Ag) claim 1 , copper (Cu) claim 1 , gold (Au) claim 1 , chrome (Cr) claim 1 , aluminum (Al) claim 1 , tungsten (W) claim 1 , zinc (Zn) claim 1 , nickel (Ni) claim 1 , iron (Fe) claim 1 , platinum (Pt) and lead (Pb).4. The conductive metal ink composition of claim 1 , wherein the conductive metal powder has an average particle diameter of 1 to 100 nm.5. The conductive metal ink composition of claim 1 , wherein the first non-aqueous solvent comprises at least one nonvolatile solvent selected from the group consisting of alcohol-based solvent claim 1 , glycol-based solvent claim 1 , polyol-based solvent claim 1 , glycol ether-based solvent claim 1 , glycol ether ester-based solvent claim 1 , ketone-based solvent claim 1 , hydrocarbon-based solvent claim 1 , lactate-based solvent claim 1 , ester-based solvent claim 1 , aprotic sulfoxide-based solvent claim 1 , and nitrile-based solvent claim 1 , which have a vapor pressure of 3 torr or lower at 25° C.6. The conductive metal ink composition of claim 1 , wherein the first non- ...

CONDUCTIVE STRUCTURE BODY AND METHOD FOR MANUFACTURING THE SAME

An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention. 1. A conductive structure body , comprising:a substrate;a conductive pattern layer; and{'sub': x', 'y, 'a darkening pattern layer comprising AlON(0≦x≦1.5, 0≦y≦1),'}wherein x and y mean ratios of numbers of O and N atoms to one Al atom, respectively.2. The conductive structure body according to claim 1 , wherein a thickness of the darkening pattern layer is 10 nm or more and 400 nm or less.3. The conductive structure body according to claim 1 , wherein the darkening pattern layer further comprises at least one selected from the group consisting of a dielectric material claim 1 , metal and mixture thereof.4. The conductive structure body according to claim 3 , wherein the dielectric material is selected from the group consisting of SiO claim 3 , SiO claim 3 , MgF claim 3 , and SiNz (z is an integer of 1 or more).5. The conductive structure body according to claim 3 , wherein the metal is selected from the group consisting of Fe claim 3 , Co claim 3 , Ti claim 3 , V claim 3 , Cu claim 3 , Al claim 3 , Au claim 3 , and Ag.6. The conductive structure body according to claim 1 , wherein the darkening pattern layer has an area of 80 to 120% of an area where the conductive pattern layer is occupied.7. The conductive structure body according to claim 1 , wherein a line width of the darkening pattern layer is the same as or ...

ELECTRODE, AND ELECTRONIC DEVICE COMPRISING SAME

The present invention relates to an electrode comprising an auxiliary electrode comprising a conductive pattern and a main electrode provided on at least a portion of the auxiliary electrode to be electrically connected to the auxiliary electrode, and a manufacturing method thereof. 1. An electrode , comprising:an auxiliary electrode comprising a conductive pattern; anda main electrode provided on at least a portion of the auxiliary electrode to be electrically connected to the auxiliary electrode.2. The electrode according to claim 1 , wherein when an allowable thickness deviation of an element provided on the electrode is β% claim 1 , a taper angle (α) of the conductive pattern of the auxiliary electrode is represented by the following Equation 1:{'br': None, '0≦α≦Arc[(1−0.01×β)]\u2003\u2003[Equation 1]'}3. The electrode according to claim 2 , wherein the allowable thickness deviation of the element provided on the electrode is 10% or less.4. The electrode according to claim 1 , wherein the conductive pattern of the auxiliary electrode has a taper angle of greater than 0 degree and 25 degrees or less.5. The electrode according to claim 1 , wherein the conductive pattern of the auxiliary electrode comprises silver claim 1 , aluminum claim 1 , copper claim 1 , neodymium claim 1 , molybdenum claim 1 , or an alloy thereof.6. The electrode according to claim 1 , wherein the main electrode comprises a transparent conductive material.7. The electrode according to claim 1 , wherein the main electrode has a structure covering all of an upper surface and lateral surfaces of the auxiliary electrode.8. An electronic device comprising an electrode according to .9. The electronic device according to claim 8 , wherein the electronic device is a touch panel claim 8 , an organic light emitting diode or a display device.10. A method of manufacturing an electrode claim 8 , comprising:1) forming an auxiliary electrode comprising a conductive pattern on a substrate; and2) forming a ...

TOUCH PANEL COMPRISING AN ELECTRICALLY-CONDUCTIVE PATTERN AND A PRODUCTION METHOD THEREFOR

The present invention relates to a touch panel comprising a structure body comprising: a substrate; a conducting pattern that is provided on at least one surface of the substrate; and a light absorption pattern provided on at least one surface of the conducting pattern and provided on at least a portion of regions corresponding to the conducting pattern, and a method for manufacturing the same. 1. A structure body comprising:a substrate;a conducting layer provided on at least one surface of the substrate; anda light absorption layer provided on at least one surface of the conducting layer.2. The structure body according to claim 1 , wherein a total reflectance measured in a direction of an opposite surface of a surface of the light absorption layer claim 1 , which is contacted with the conducting layer claim 1 , is 15% or less.35-. (canceled)6. The structure body according to claim 1 , wherein the light absorption layer is provided between the conducting layer and the substrate claim 1 , and a total reflectance measured in a side of the substrate is 15% or less.79-. (canceled)10. The structure body according to claim 1 , wherein the light absorption layer is provided on an opposite surface of a surface in which the conducting layer is contacted with the substrate claim 1 , and a total reflectance measured in a side of the light absorption layer is 15% or less.1113-. (canceled)14. The structure body according to claim 1 , wherein a 20° gloss value of the structure body is 350 or less.15. (canceled)16. The structure body according to claim 1 , wherein a 60° gloss value of the structure body is 300 or less.1722-. (canceled)23. The structure body according to claim 1 , wherein the light absorption layer comprises one or more selected from the group consisting of a dielectric material claim 1 , metal claim 1 , an alloy of metals claim 1 , metal oxide claim 1 , metal nitride claim 1 , metal oxynitride and metal carbide.24. The structure body according to claim 23 , ...

PRINTING DEVICE AND PRINTING METHOD

Provided are a reverse offset printing apparatus and a reverse offset printing method, including: a printed film supplying unit and a printed film collecting unit for continuously supplying a printed film; a printed film supporting unit provided between the printed film supplying unit and the printed film collecting unit; a printing roll for transferring a printed matter pattern to the printed film on the printed film supporting unit, in which the printed roll is provided so that a progress direction of the printed film is parallel to a rotation direction of the printing roll at a place where the printed matter pattern is transferred; a coating unit coating a printed matter on the printing roll; and a cliché provided on a stage for mounting the cliché in order to form the printed matter pattern on the printing roll. 1. A reverse offset printing apparatus , comprising:a printed film supplying unit and a printed film collecting unit for continuously supplying a printed film;a printed film supporting unit provided between the printed film supplying unit and the printed film collecting unit;a printing roll for transferring a printed matter pattern to the printed film on the printed film supporting unit, in which the printing roll is provided so that a progress direction of the printed film is parallel to a rotation direction of the printing roll at a place where the printed matter pattern is transferred;a coating unit coating a printed matter on the printing roll; anda cliché provided on a stage for mounting the cliché in order to form the printed matter pattern on the printing roll.2. The reverse offset printing apparatus of claim 1 , wherein the printing roll is provided to freely move among a place where the printed matter is coated on the printing roll by the coating unit claim 1 , a place where the printed matter pattern is formed on the printing roll by the cliché claim 1 , and a place where the printed matter pattern is transferred to the printed film.3. The ...

ELECTRICAL CONDUCTOR AND A PRODUCTION METHOD THEREFOR

Provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electro-conductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that, for at least 30% of the entire surface area of the transparent substrate, when a straight line is drawn intersecting the electroconductive pattern, the ratio of the standard deviation to the mean value of the distances between adjacent points of intersection between the straight line and the electroconductive pattern (the distance distribution ratio) is at least 2%. Also, provided are an electrical conductor and a production method therefor; the electrical conductor comprising a transparent substrate and an electroconductive pattern provided on at least one surface of the transparent substrate, and the electroconductive pattern being of a type such that at least 30% of the entire surface area of the transparent substrate is accounted for by continuously distributed closed motifs, and the ratio of the standard deviation to the mean value of the surface areas of the closed motifs (the surface area distribution ratio) is at least 2%. 1. An electrical conductor comprising:a transparent substrate; andan electric conductive pattern on at least one side of the transparent substrate,when a straight line that crosses the electric conductive pattern is drawn, wherein 30% or more of the entire area of the transparent substrate has the electric conductive pattern in which a ratio (distance distribution ratio) of standard deviation in respects to an average value of distances between adjacent intersection points of the straight line and the electric conductive pattern is 2% or more.2. The electrical conductor according to claim 1 , wherein the straight line that crosses the electric conductive pattern is a line in which the standard deviation of the distances between adjacent intersection points ...

CONDUCTIVE METAL INK COMPOSITION, AND METHOD FOR FORMING A CONDUCTIVE PATTERN

An exemplary embodiment of the present invention relates to a conductive metal ink composition comprising a conductive metal powder; a non-aqueous solvent; an organo phosphate compound; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition. 1. A conductive metal ink composition , comprising:a conductive metal powder;a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or less at 25° C. and a second non-aqueous solvent having a vapor pressure of more than 3 torr at 25° C.;an organo phosphate compound; anda polymer coating property improving agent.2. The conductive metal ink composition according to claim 1 , wherein the conductive metal ink composition is printed on a substrate by a roll printing process and used for forming a conductive pattern.3. The conductive metal ink composition according to claim 2 , wherein the conductive metal ink composition is used for forming an electrode of a flat display device.4. The conductive metal ink composition according to claim 1 , wherein the conductive metal powder comprises one or more metal powders selected from the group consisting of silver (Ag) claim 1 , copper (Cu) claim 1 , gold (Au) claim 1 , chromium (Cr) claim 1 , aluminum (Al) claim 1 , tungsten (W) claim 1 , zinc (Zn) claim 1 , nickel (Ni) claim 1 , iron (Fe) claim 1 , platinum (Pt) claim 1 , palladium (Pd) claim 1 , and lead (Pb).5. The conductive metal ink composition according to claim 1 , wherein the conductive metal powder has an average particle diameter of 1 to 100 nm.6. The conductive metal ink composition according to claim 1 , wherein the first non-aqueous solvent comprises one or more selected from the group consisting of an alcohol-based solvent claim 1 , a glycol-based solvent claim 1 , a polyol-based solvent claim 1 , a glycol ether-based solvent claim 1 , a glycol ether ester-based solvent claim 1 , a ketone-based solvent ...

Conductive metal ink composition, and method for preparing a conductive pattern

The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.

INK COMPOSITION FOR PRINTING, AND PRINTING METHOD USING SAME

Provided are an ink composition for a printing method, in which the ink composition is applied to a printing blanket, a portion of a coating film is removed using a cliche, and then the coating film remaining on the printing blanket is transferred to an object to be printed, in which the ink composition before printing satisfies the following [Equation 1] [INK≦BNKγc] and the ink coating film on the printing blanket satisfies the following [Equation 2] [BNKγc≦INK≦SUB] immediately before the removal of the portion of the ink coating film from the printing blanket using the cliche, and a printing method using the same. 1. An ink composition for a printing method ,wherein the ink composition is applied to a printing blanket, a portion of a coating film is removed using a cliche, and then the coating film remaining on the printing blanket is transferred to an object to be printed, [{'br': None, 'i': INK', '≦BNKγc, 'sub': 'ST', '[Equation 1]'}, {'br': None, 'i': BNKγc≦INK', '≦SUB, 'sub': SE', 'SE, '[Equation 2]'}, 'in Equations 1 and 2,', {'sub': 'ST', 'INKis an initial surface tension of the ink composition,'}, 'BNKγc is a critical surface tension of wetting of the printing blanket,', {'sub': 'SE', 'INKis a surface energy of the ink coating film on the printing blanket, and'}, {'sub': 'SE', 'SUBis a surface energy of the object to be printed.'}], 'wherein the ink composition before printing satisfies the following [Equation 1] and the ink printing film on the printing blanket satisfies the following [Equation 2] immediately before the removal of the portion of the ink coating film from the printing blanket using the cliche2. The ink composition of claim 1 , wherein a difference between INKand BNKγc in Equation 1 is 2 mN/m or more.3. The ink composition of claim 1 , wherein a difference between BNKγc and INKin Equation 2 is 2 mN/m or more.4. The ink composition of claim 1 , wherein a difference between INKand SUBin Equation 2 is 2 mN/m or more.5. The ink composition of ...

ROLL-PRINTING APPARATUS AND ROLL-PRINTING METHOD USING THE SAME

Provided are a roll printing apparatus and a roll printing method using the same. The roll printing apparatus according to the present invention comprises 1) a first cliché stage, 2) a second cliché stage, 3) a pattern transfer unit provided between the first cliché stage and the second cliché stage and comprising a roll type printed film support unit, 4) a first printing unit comprising a first printing roll moving to the pattern transfer unit on the first cliché stage, and 5) a second printing unit comprising a second printing roll moving the pattern transfer unit on the second cliché stage, in which the first cliché stage and the second cliché stage are disposed on the same line and a film substrate is comprised in the roll type printed film support unit. The roll printing apparatus according to the present invention can perform a continuous roll printing, thereby reducing a tack time and as a result, improving productivity. 1. A roll printing apparatus , comprising:1) a first cliché stage;2) a second cliché stage;3) a pattern transfer unit provided between the first cliché stage and the second cliché stage and comprising a roll type printed film support unit;4) a first printing unit comprising a first printing roll moving to the pattern transfer unit on the first cliché stage; and5) a second printing unit comprising a second printing roll moving the pattern transfer unit on the second cliché stage,wherein the first cliché stage and the second cliché stage are disposed on the same line and a film substrate is comprised in the roll type printed film support unit.2. The roll printing apparatus of claim 1 , wherein the pattern transfer unit comprises a printed film supplying unit continuously supplying the film substrates and a printed film collecting unit continuously collecting the film substrates.3. The roll printing apparatus of claim 2 , wherein the roll type printed film support unit is disposed between the printed film supplying unit and the printed film ...

Touch panel and display device including same

The present invention relates to a touch panel, comprising a screen part, a router part, a flexible printed circuit board (FPCB) part, a first pad part comprising two or more router connection regions connecting the screen part and the router part, and a second pad part comprising two or more FPCB connection regions connecting the router part and the flexible printed circuit board (FPCB) part, in which at least some regions of the two or more FPCB connection regions comprise a conductive pattern having opening regions.

TRANSPARENT CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

The present invention provides a transparent conductive substrate comprising: a transparent substrate, and a conductive pattern provided on the transparent substrate, wherein the conductive pattern comprises line breakage portions performing electric breakage, and a pattern of a broken line formed when the line breakage portions are connected comprises an irregular pattern shape. The present invention can minimize a moiré phenomenon and a diffraction phenomenon by external light by performing line breakage of a regular or irregular conductive pattern by using the irregular pattern. 1. A transparent conductive substrate comprising:a transparent substrate, anda conductive pattern provided on the transparent substrate,wherein the conductive pattern comprises line breakage portions performing electric breakage, and a pattern of a broken line formed when the line breakage portions are connected comprises an irregular pattern shape.2. The transparent conductive substrate of claim 1 , wherein the conductive pattern comprises a pattern formed of a conductive metal line.3. The transparent conductive substrate of claim 2 , wherein the line breakage portions electrically break the conductive metal line claim 2 , and an interval between the electrically broken conductive metal lines is 50 μm or less.4. The transparent conductive substrate of claim 3 , wherein the interval between the electrically broken conductive metal lines is 0.5 to 15 μm.5. The transparent conductive substrate of claim 2 , wherein the pattern formed of the conductive metal line comprises a straight line claim 2 , a curved line claim 2 , or a closed curve formed of the straight line and the curved line.6. The transparent conductive substrate of claim 1 , wherein the conductive pattern is a regular or irregular pattern.7. The transparent conductive substrate of claim 1 , wherein the conductive pattern comprises a mesh pattern.8. The transparent conductive substrate of claim 7 , wherein the mesh pattern ...

TOUCH PANEL AND DISPLAY DEVICE INCLUDING THE SAME

The present invention relates to a touch panel, comprising: a screen part comprising a first conductive pattern portion, and a router part comprising a second conductive pattern portion, in which the first conductive pattern portion and the second conductive pattern portion have the same line height, and there is no connecting portion in a region in which the first conductive pattern portion and the second conductive pattern portion are connected to each other, and a display apparatus comprising the same. 1. A touch panel , comprising:a screen part comprising a first conductive pattern portion; anda router part comprising a second conductive pattern portion,wherein the first conductive pattern portion and the second conductive pattern portion have the same line height, and there is no connecting portion in a region where the first conductive pattern portion and the second conductive pattern portion are connected with each other.2. The touch panel of claim 1 , wherein a linear resistance value on the shortest distance from any one side contacting the second conductive pattern portion to the other side facing the one side in any one electrically connected region of the first conductive pattern portion is equal to or larger than a linear resistance value from any one side contacting the first conductive pattern portion to the other side where the second conductive pattern portion contacts the FPCB claim 1 , in any one electrically connected region of the second conductive pattern portion.3. The touch panel of claim 1 , wherein in any one electrically connected region of the first conductive pattern portion claim 1 , a flow direction of electricity in the first conductive pattern portion from any one side of the screen part to the other side facing the one side and an angle of the conductive line of the first conductive pattern portion are different from each other.4. The touch panel of claim 1 , wherein at least a part of the second conductive pattern portion has a ...

CONDUCTIVE SUBSTRATE AND ELECTRONIC DEVICE COMPRISING SAME

Disclosed are an electric conducting substrate, comprising a transparent substrate and an electric conducting pattern comprising an electric conducting line provided on the transparent substrate, and an electronic device comprising the same. 1. An electric conducting substrate , comprising:a transparent substrate; andan electric conducting pattern comprising an electric conducting line provided on the transparent substrate,wherein the electric conducting pattern comprises cells closed by the electric conducting line,a 0.5-squared value of an area of the cell is defined as a characteristic length (Lc) of the cells, and{'sub': av', 'av, 'claim-text': [{'br': None, 'i': W', '/AR', Lc, 'sup': '0.5', 'sub': 'av', '=[(1)−1\u2003\u2003[Formula 1]'}, {'br': None, 'i': W=', 'Lc, 'sub': 'av', '13exp(−0.0052)+α\u2003\u2003[Formula 2]'}], 'when a graph 1 representing the following Formula 1 and a graph 2 representing the following Formula 2 are illustrated by setting an average of characteristic lengths (Lc) of the cells as an X axis and setting a line width (W) of the electric conducting line as a Y axis, the line width (W) of the electric conducting line and the average of characteristic lengths (Lc) of the cells are comprised in a crossing region of a lower region of the graph 1 and a lower region of the graph 2in Formulas 1 and 2,W is a line width of the electric conducting line,{'sub': 'av', 'Lcis an average of characteristic lengths of cells closed by the electric conducting line,'}AR is an aperture ratio of the electric conducting pattern, andα is a constant.2. The electric conducting substrate of claim 1 , wherein when a graph 1 representing Formula 1 and a graph 2 representing Formula 2 are illustrated by setting a characteristic length (Lc) of the cells as an X axis and setting a line width (W) of the electric conducting line as a Y axis claim 1 , the line width (W) of the electric conducting line and the characteristic length (Lc) of the cells are comprised in a ...

CLICHE FOR OFFSET-PRINTING AND METHOD FOR MANUFACTURING SAME

The present invention relates to a cliché for offset printing and a method of manufacturing the same, and the cliché for offset printing according to the present invention comprises: a groove pattern, wherein a depth of at least a partial region of the groove pattern is different from a depth of a residual region. The present invention may comprise a double etching process when a cliché for offset printing is manufactured to control a bottom touch phenomenon that is a problem exhibited when a known wide line width is implemented, thus manufacturing the cliché for offset printing having various line widths and etching depths. 1. A cliché for offset printing comprising:a groove pattern,wherein a depth of at least a partial region of the groove pattern is different from a depth of a residual region.2. The cliché for offset printing of claim 1 , wherein the regions having different depths of the groove pattern comprise regions having different line widths of the groove pattern.3. The cliché for offset printing of claim 2 , wherein the region having the relatively larger line width of the groove pattern comprises the region having the larger depth as compared to the region having the relatively smaller line width.4. The cliché for offset printing of claim 1 , wherein the groove pattern comprises at least two patterns having different line widths claim 1 , and a difference between the line widths of at least two patterns is 15 μm or more.5. The cliché for offset printing of claim 4 , wherein at least two patterns where the difference between the line widths is 15 μm or more are connected to each other.6. The cliché for offset printing of claim 1 , wherein the groove pattern comprises two or more patterns where the difference between the line widths is 15 μm or more.7. The cliché for offset printing of claim 6 , wherein the groove pattern further comprises a pattern having the line width that is different from the minimum line width by 500 μm or more.8. The cliché for ...

COMPOSITION FOR PRINTING AND PRINTING METHOD USING THE SAME

Provided are a composition for printing for use in a printing method which uses a silicon-based blanket, including: 1) a binder resin, 2) a low-boiling point solvent having a boiling point of 100° C. or less, and 3) a high-boiling point solvent having a boiling point of 180° C. or more, wherein the high-boiling solvent has a difference in solubility parameter with the binder resin of 3 (cal·cm)or less, a difference in solubility parameter with the silicon-based blanket of 4 (cal·cm)or more, and a swelling parameter for the silicon-based blanket of 2 or less, and a printing method using the same. 1. A composition for reverse offset printing , which uses a silicon-based blanket , comprising:1) a binder resin;2) a low-boiling point solvent having a boiling point of 100° C. or less; and3) a high-boiling point solvent having a boiling point of 180° C. or more,{'sup': 1/2', '1/2, 'wherein the high-boiling solvent has a difference in solubility parameter with the binder resin of 3 (cal·cm)or less, a difference in solubility parameter with the silicon-based blanket of 4 (cal·cm)or more, and a swelling parameter for the silicon-based blanket of 2 or less.'}2. The composition for reverse offset printing of claim 1 , wherein the binder resin is a Novolac resin.3. The composition for reverse offset printing of claim 1 , wherein the Novolac resin has a weight average molecular weight of from 2 claim 1 ,000 to 8 claim 1 ,000.4. The composition for reverse offset printing of claim 1 , wherein the high-boiling point solvent is an aromatic alcohol-based solvent.5. The composition for reverse offset printing of claim 4 , wherein the high-boiling point solvent comprises one or more selected from the group consisting of resorcinol claim 4 , m-cresol claim 4 , o-cresol claim 4 , p-cresol claim 4 , benzyl alcohol and phenol.6. The composition for reverse offset printing of claim 1 , wherein the low-boiling point solvent comprises one or more selected from the group consisting of dimethyl ...

CONDUCTIVE SUBSTRATE AND TOUCH SCREEN HAVING SAME

The present invention relates to a conducting substrate and a touch screen comprising the same, and the conducting substrate according to the present invention comprises a board, and an electric conducting pattern provided on at least one surface of the board, wherein the electric conducting pattern comprises a border structure of closed figures continuously connected and does not comprise the closed figures having the same shape in a predetermined unit area (1 cm×1 cm), and the number of vertexes of the closed figures is different from the number of vertexes of quadrangles having the same number as the closed figures. 1. A conducting substrate , comprising:a board; andan electric conducting pattern provided on at least one surface of the board,wherein the electric conducting pattern comprises a border structure of closed figures continuously connected and does not comprise the closed figures having the same shape in a predetermined unit area (1 cm×1 cm), and the number of vertexes of the closed figures is different from the number of vertexes of quadrangles having the same number as the closed figures.2. A conducting substrate , comprising:a board; andan electric conducting pattern provided on at least one surface of the board,wherein the electric conducting pattern comprises a border structure of closed figures continuously connected and does not comprise the closed figures having the same shape in a predetermined unit area (1 cm×1 cm), and the number of vertexes of the closed figures is different from the number of vertexes of polygons formed by connecting the shortest distances between centers of masses of the closed figures.3. A conducting substrate , comprising:a board: andan electric conducting pattern provided on at least one surface of the board, {'br': None, '(standard deviation of distances between vertexes/average of the distances between the vertexes)×100. \u2003\u2003[Equation 1]'}, 'wherein the electric conducting pattern comprises a border structure ...

CONDUCTIVE STRUCTURE, TOUCH PANEL, AND METHOD FOR MANUFACTURING SAME

Provided are a conductive structure including a) a base. b) a conductive pattern provided on at least one side of the base. and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof. 1. A conductive structure , comprising:a) a base;b) a conductive pattern provided on at least one side of the base; andc) a darkening layer provided on the upper surface and the lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern.2. The conductive structure of claim 1 , wherein a color range of a pattern area configured by the darkening layer and the conductive pattern claim 1 , which is measured at the surface where the darkening layer of the conductive substrate is viewed claim 1 , has a L value of 20 or less claim 1 , an A value of −10 to 10 claim 1 , and a B value of −70 to 70 based on the CIE LAB color coordination.3. The conductive structure of claim 1 , wherein total reflectivity in the pattern area configured by the darkening layer and the conductive pattern claim 1 , which is measured at the surface where the darkening layer of the conductive substrate is viewed claim 1 , is 17% or less based on 550 nm.4. The conductive structure of claim 1 , wherein the darkening layer includes one kind or more selected from a group constituted by a dielectric material claim 1 , a metal claim 1 , a metal alloy claim 1 , a metal oxide claim 1 , a metal nitride claim 1 , a metal oxynitride claim 1 , and a metal carbide.5. The conductive structure of claim 4 , wherein the metal includes one kind or more selected from a group constituted by Ni claim 4 , Mo claim 4 , Ti claim 4 , Cr claim 4 , Al claim 4 , Cu claim 4 , Fe claim 4 , Co ...

CONDUCTIVE SUBSTRATE AND TOUCH SCREEN HAVING SAME

The present invention relates to a conducting substrate and a touch screen comprising the same, and the conducting substrate according to the present invention comprises a board, an electric conducting pattern provided on at least one surface of the board, and a darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern, wherein a reflective diffraction intensity of a reflective diffraction image obtained by radiating light emitted from a point light source on one surface from which the darkening layer is visible is reduced by 60% or more as compared to the conducting substrate having the same constitution except that the electric conducting pattern is formed of Al and does not comprise the darkening layer. 1. A conducting substrate comprising:a board,an electric conducting pattern provided on at least one surface of the board, anda darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern,wherein a reflective diffraction intensity of a reflective diffraction image obtained by radiating light emitted from a point light source on one surface from which the darkening layer is visible is reduced by 60% or more as compared to the conducting substrate having the same constitution except that the electric conducting pattern is formed of Al and does not comprise the darkening layer.2. A conducting substrate comprising:a board,an electric conducting pattern provided on at least one surface of the board, anda darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern,wherein total reflectance measured by using a total reflectance measuring device with an assumption of ambient light on one surface from which the darkening layer is visible is reduced by 20% or more as compared to the conducting substrate having ...

CONDUCTIVE SUBSTRATE AND TOUCH PANEL COMPRISING SAME

The invention relates to a conducting substrate and a touch panel comprising the same. A conducting substrate according to one embodiment of the invention comprises at least one base material and at least one conductive pattern on the base material, wherein the arithmetic average roughness height (Ra) of the surface of the conductive pattern is 0.1-0.3 μm. The conducting substrate and the touch panel comprising the same do not obstruct the view, have excellent conductivity, and can reduce the intensity of a diffraction pattern caused by reflected light. 1. A conducting substrate comprising:at least one base material; andat least one conductive pattern provided on the base material;wherein a surface of the conductive pattern has an arithmetic average roughness height (Ra) of 0.1-0.3 μm.2. The conducting substrate according to claim 1 , wherein the conducting substrate comprises:a first base material;a first conductive pattern provided on the first base material;a second base material on the first conductive pattern; anda second conductive pattern on the second base material.3. The conducting substrate according to claim 1 , wherein the conducting substrate further comprises a coating layer between the base material and the conductive pattern claim 1 ,wherein a surface of the coating layer has an arithmetic average roughness height (Ra) of 0.1-0.3 μm.4. The conducting substrate according to claim 1 , wherein the conducting substrate further comprises a coating layer between the base material and the conductive pattern claim 1 ,wherein an interface between the coating layer and the conductive pattern has an arithmetic average roughness height (Ra) of 0.1-0.3 μm.5. The conducting substrate according to claim 3 , wherein the coating layer is an anti-reflection layer.6. The conducting substrate according to claim 3 , wherein the conducting substrate further comprises an adhesive layer on the conductive pattern.7. The conducting substrate according to claim 6 , wherein the ...

TOUCH PANEL COMPRISING CONDUCTIVE PATTERN

The present invention relates to a touch panel comprising a conductive pattern having improved transmittance and concealing property, and the touch panel according to the present invention can have an effect of improvement in transmittance, a concealing property, and uniformity, and a reduction in strength of a diffraction pattern by reflection light in a conductive pattern by providing the conductive patterns comprising regions having different aperture ratios on both surfaces of a transparent substrate at predetermined positions, or laminating the transparent substrate having the conductive patterns comprising the regions having different aperture ratios. 1. A touch panel comprising:a first conductive substrate comprising a first transparent substrate and a first conductive pattern provided on the first transparent substrate, anda second conductive substrate comprising a second transparent substrate and a second conductive pattern provided on the second transparent substrate in a laminate form,wherein the first conductive pattern comprises regions A and B having different aperture ratios having a difference of 0.5% or more therebetween, the second conductive pattern comprises region C overlapping the region A and region D overlapping the region B, and a difference between a product of the aperture ratio of the region A and the aperture ratio of the region C and a product of the aperture ratio of the region B and the aperture ratio of the region D is 2% or less.2. A touch panel comprising:a transparent substrate,a first conductive pattern provided on one surface of the transparent substrate, anda second conductive pattern provided on the other surface of the transparent substrate,wherein the first conductive pattern comprises regions A and B having different aperture ratios having a difference of 0.5% or more therebetween, the second conductive pattern comprises region C overlapping the region A and region D overlapping the region B, and a difference between a ...

LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

The present specification relates to a liquid crystal display device and a method for manufacturing the same. 2. The liquid crystal display device of claim 1 , wherein the light reflection reducing layer has a thickness of greater than or equal to 10 nm and less than or equal to 100 nm.3. The liquid crystal display device of claim 1 , wherein the light reflection reducing layer has an extinction coefficient (k) of greater than or equal to 0.1 and less than or equal to 2 in light with a wavelength of 550 nm.4. The liquid crystal display device of claim 1 , wherein the light reflection reducing layer has a refractive index (n) of greater than or equal to 2 and less than or equal to 3 in light with a wavelength of 550 nm.5. The liquid crystal display device of claim 1 , wherein light reflectance of the electrode provided with the light reflection reducing layer is 50% or less.6. The liquid crystal display device of claim 1 , wherein the light reflection reducing layer includes one or more types selected from the group consisting of metal oxides claim 1 , metal nitrides and metal oxynitrides.7. The liquid crystal display device of claim 6 , wherein the metal oxide claim 6 , the metal nitride and the metal oxynitride are derived from one claim 6 , two or more metals selected from the group consisting of Cu claim 6 , Al claim 6 , Mo claim 6 , Ti claim 6 , Ag claim 6 , Ni claim 6 , Mn claim 6 , Au claim 6 , Cr and Co.8. The liquid crystal display device of claim 1 , wherein the pixel electrode and the common electrode include one claim 1 , two or more metals selected from the group consisting of Cu claim 1 , Al claim 1 , Mo claim 1 , Ti claim 1 , Ag claim 1 , Ni claim 1 , Mn claim 1 , Au claim 1 , Cr and Co.9. The liquid crystal display device of claim 1 , wherein the light reflection reducing layer is an oxide claim 1 , a nitride or an oxynitride of metals included in the pixel electrode and the common electrode.10. The liquid crystal display device of claim 1 , wherein ...

Compound

The present application relates to a curable composition, a cured product and uses of the curable composition and the cured product. By comprising the curable compound having a certain structure, the present application can provide a curable composition which can increase cohesiveness of the cured product without increasing viscosity of the composition before curing, also minimize the increase of the elastic modulus, and also minimize the ratio of a nonreactive oligomer with an effect of improving the interfacial adhesion. The curable composition can be applied to a variety of optical applications and can be usefully used, for example, for bonding various optical functional members in a display device, for example, for directly bonding a touch panel and a display panel. 2. The compound according to claim 1 , wherein the core (A) and the chain (B) of Formula 1 each comprise at least one polyalkylene oxide unit.3. The compound according to claim 2 , wherein the polyalkylene oxide unit is a polyethylene oxide unit or a polypropylene oxide unit.4. The compound according to claim 1 , wherein the core (A) of Formula 1 is a core derived from polyalkylene polyol.5. The compound according to claim 4 , wherein the polyalkylene polyol has a weight average molecular weight in a range of 1000 to 10 claim 4 ,000.9. The compound according to claim 7 , wherein the structure of -L-Q-L- or the structure of -L-Q-L- in Formulas 2 and 3 is a structure derived from a diisocyanate compound.10. The compound according to claim 9 , wherein the diisocyanate compound is tolylene diisocyanate claim 9 , xylene diisocyanate claim 9 , diphenylmethane diisocyanate claim 9 , hexamethylene diisocyanate claim 9 , isoboron diisocyanate claim 9 , tetramethylxylene diisocyanate or naphthalene diisocyanate.11. The compound according to claim 7 , wherein [O-A]in Formula 7 is a structure derived from polyalkylene glycol.12. The compound according to claim 7 , wherein A in Formula 3 is a core derived from ...

THIN-FILM TRANSISTOR SUBSTRATE AND DISPLAY DEVICE COMPRISING SAME

The present specification relates to a thin-film transistor substrate and a display device including the same. 2. The thin-film transistor substrate of claim 1 , wherein the thickness of the light reflection reduction layer is in the range of 10 nm to 100 nm.3. The thin-film transistor substrate of claim 1 , wherein the extinction coefficient k of the light reflection reduction layer is in the range of 0.1 to 2 in light having a wavelength of 550 nm.4. The thin-film transistor substrate of claim 1 , wherein a refractive index n of the light reflection reduction layer is in the range of 2 to 3 in the light having the wavelength of 550 nm.5. The thin-film transistor substrate of claim 1 , wherein light reflectance of an electrode having the light reflection reduction layer is 50% or less.6. The thin-film transistor substrate of claim 1 , wherein the light reflection reduction layer includes at least one selected from a group consisting of metal oxide claim 1 , metal nitride claim 1 , and metal oxynitride.7. The thin-film transistor substrate of claim 6 , wherein the metal oxide claim 6 , the metal nitride claim 6 , and the metal oxynitride are derived from one or two or more metals selected from a group consisting of Cu claim 6 , Al claim 6 , Mo claim 6 , Ti claim 6 , Ag claim 6 , Ni claim 6 , Mn claim 6 , Au claim 6 , Cr claim 6 , and Co.8. A display device comprising the thin-film transistor substrate of . This application claims priority to and the benefit of Korean Patent Application No. 10-2015-0064822 filed in the Korean Intellectual Property Office on May 8, 2015, the entire contents of which are incorporated herein by reference.The present specification relates to a thin-film transistor substrate and a display device including the same.A thin-film transistor (TFT) as a transistor formed by sequentially depositing a semiconductor, an insulator, a metallic thin film, and the like on a substrate is developed and commercialized in various fields including ...

TRANSPARENT CONDUCTIVE LAMINATE, TRANSPARENT ELECTRODE INCLUDING TRANSPARENT CONDUCTIVE LAMINATE, AND METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE LAMINATE

Provided are a transparent conductive laminate, a transparent electrode including the transparent conductive laminate, and a manufacturing method for the transparent conductive laminate. 1. A transparent conductive laminate , comprising:a transparent substrate; two or more transparent conductive patterns provided on the transparent substrate; and a conductive line having higher electrical conductivity than the transparent conductive pattern,wherein the conductive line and the transparent conductive pattern are provided on the same surface of the transparent substrate, and the conductive line is provided between at least two adjacent transparent conductive patterns to contact at least a part of the transparent conductive pattern.2. The transparent conductive laminate of claim 1 , wherein the conductive line is provided between the transparent conductive patterns to contact the transparent conductive pattern.3. The transparent conductive laminate of claim 1 , wherein an upper surface step of the transparent conductive pattern and the conductive line which face a lower surface adjacent to the transparent substrate is 0 nm or more and 30 nm or less.4. (canceled)5. The transparent conductive laminate of claim 1 , further comprising:a transparent conductive layer provided on the upper surface of the transparent conductive pattern and the conductive line.6. The transparent conductive laminate of claim 1 , wherein the thickness of the transparent conductive pattern is 15 nm or more and 200 nm or less.7. The transparent conductive laminate of claim 1 , wherein the line width of the conductive line is 2 μm or more and 70 μm or less.8. The transparent conductive laminate of claim 5 , wherein the thickness of the transparent conductive pattern is 50 nm or more and 180 nm or less.9. The transparent conductive laminate of claim 1 , wherein a shape of the transparent conductive pattern is a triangle claim 1 , a quadrangle claim 1 , a honeycomb shape claim 1 , or a Voronoi polygon. ...

CONDUCTIVE STRUCTURE, MANUFACTURING METHOD THEREFOR, AND ELECTRODE COMPRISING CONDUCTIVE STRUCTURE

The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body. 1. A conductive structure body , comprising;a substrate;a metal layer provided on the substrate; anda light reflection reducing layer provided on at least one surface of the metal layer,wherein the light reflection reducing layer includes oxides of Mo and Ti or oxynitrides of Mo and Ti.2. The conductive structure body of claim 1 , wherein the light reflection reducing layer includes MoTiaOxNy (00 claim 1 , a claim 1 , x and y mean ratios of the number of atoms of Ti claim 1 , O and N claim 1 , respectively).4. The conductive structure body of claim 3 , wherein the element content of Mo of the light reflection reducing layer is 25 at % or more and 40 at % or less.5. The conductive structure body of claim 3 , wherein the element content of Ti of the light reflection reducing layer is 10 at % or more and 25 at % or less.6. The conductive structure body of claim 1 , wherein the light reflection reducing layer is provided between the metal layer and the substrate claim 1 , and total reflectance measured in an opposite direction to a surface with the light reflection reducing layer of the substrate is 35% or less.7. The conductive structure body of claim 1 , wherein the substrate claim 1 , the metal layer claim 1 , and the light reflection reducing layer are sequentially provided and total reflectance measured in an opposite direction to a surface with the metal layer of the light reflection reducing layer is 35% or less.8. The conductive structure body of claim 1 , wherein the light reflection reducing layers are provided on an upper surface and a lower surface of the metal layer.9. The conductive structure body of claim 1 , wherein the light reflection reducing layer includes one or more metals of Cu claim 1 , Ag claim 1 , Ar claim 1 , ...

COMPOSITION FOR PRINTING AND PRINTING METHOD USING THE SAME

Provided are a composition for printing for use in a printing method which uses a silicon-based blanket, including: 1) a binder resin, 2) a low boiling point solvent having a boiling point of less than 100° C., 3) a medium boiling point solvent having a boiling point of 100° C. or more and less than 180° C., and 4) a high boiling point solvent having a boiling point of 180° C. or more, wherein the medium boiling point solvent and the high-boiling solvent have a difference in solubility parameter with the binder resin of 3 (cal·cm)or less, a difference in solubility parameter with the silicon-based blanket of 4 (cal·cm)or more, and a swelling parameter for the silicon-based blanket of 2 or less, and a printing method using the same. 1. A reverse offset printing composition using a silicon-based blanket , comprising:1) a binder resin,2) a low boiling point solvent having a boiling point of less than 100° C.,3) a medium boiling point solvent having a boiling point of 100° C. or more and less than 180° C., and4) a high boiling point solvent having a boiling point of 180° C. or more,{'sup': 1/2', '1/2, 'wherein the low boiling point solvent and the high boiling point solvent have a solubility parameter difference of 3 (cal·cm)or less to the binder resin and 4 (cal·cm)or more to the silicon-based blanket, and a swelling parameter of 2 or less to the silicon-based blanket.'}2. The reverse offset printing composition of claim 1 , wherein the binder resin is a novolac resin.3. The reverse offset printing composition of claim 1 , wherein a weight average molecular weight of the novolac resin is 2 claim 1 ,000 to 8 claim 1 ,000.4. The reverse offset printing composition of claim 1 , wherein the high boiling point solvent is an aromatic alcohol-based solvent.5. The reverse offset printing composition of claim 4 , wherein the high boiling point solvent includes one or more kinds selected from the group consisting of resorcinol claim 4 , m-cresol claim 4 , o-cresol claim 4 , p- ...

METHOD FOR TRANSMITTING NOTIFICATION INFORMATION AND ELECTRONIC DEVICE THEREOF

A method in an electronic device is provided. The method includes identifying an output characteristic of at least one peripheral device, converting or reconfiguring output information of an event generated by at least one application program based on the identified output characteristic, and transmitting the converted or reconfigured output information of the event to the at least one peripheral device.

DECORATION MEMBER AND MANUFACTURING METHOD THEREFOR

The present disclosure relates to a decoration element comprising a light reflective layer; and a color developing layer comprising a light absorbing layer provided on the light reflective layer, wherein the light absorbing layer comprises two or more points with different thicknesses. 1. A decoration element comprising:a light reflective layer; anda color developing layer comprising a light absorbing layer provided on the light reflective layer,wherein the light absorbing layer comprises two or more points with different thicknesses.2. The decoration element of claim 1 , wherein the light absorbing layer comprises two or more regions with different thicknesses.3. The decoration element of claim 1 , wherein the light absorbing layer comprises one or more regions in which an upper surface has an inclined surface with an inclined angle of greater than 0 degrees and less than or equal to 90 degrees claim 1 , and the light absorbing layer comprises one or more regions having a thickness different from a thickness in any one region having the inclined surface.4. The decoration element of claim 1 , wherein the light absorbing layer comprises one or more regions with a gradually changing thickness.5. The decoration element of claim 1 , wherein the light absorbing layer comprises one or more regions in which an upper surface has an inclined surface with an inclined angle of greater than 0 degrees and less than or equal to 90 degrees claim 1 , and at least one region having the inclined surface has a structure in which a thickness of the light absorbing layer gradually changes.6. The decoration element of claim 1 , wherein the light absorbing layer has dichroism of ΔE*ab>1.7. The decoration element of claim 1 , wherein an upper surface of the light absorbing layer comprises a pattern having a cone-shaped protrusion or groove claim 1 , a pattern having a protrusion in which the highest point has a line shape or a groove in which the lowest point has a line shape claim 1 , or ...

CONDUCTIVE SUBSTRATE COMPRISING CONDUCTIVE PATTERN AND TOUCH PANEL COMPRISING SAME

The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate according to the present invention comprises: a transparent substrate, and a conductive pattern comprising a conductive line provided on the transparent substrate, wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less. The conductive substrate according to the present invention can more efficiently conceal a metal line comprised in the conductive pattern. 1. A conductive substrate comprising:a transparent substrate, anda conductive pattern comprising a conductive line provided on the transparent substrate,wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less.2. The conductive substrate of claim 1 , wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 10 μm or less.3. The conductive substrate of claim 1 , wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 5 μm or less.4. The conductive substrate of claim 1 , comprising:a line breakage portion performing breakage at an angle of 80 to 110° in the longitudinal direction of at least one conductive line constituting the conductive pattern.5. The conductive substrate of claim 1 , wherein the conductive pattern comprises one or more selected from the group consisting of metal claim 1 , metal oxides claim 1 , metal nitrides claim 1 , metal oxynitrides claim 1 , and a metal alloy.6. The conductive ...

ELECTRICALLY-CONDUCTIVE STRUCTURE AND A PRODUCTION METHOD THEREFOR

An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. 2. The conductive structure body according to claim 1 , wherein an extinction coefficient k of the conductive structure body is 0.2 or more and 2.5 or less.3. The conductive structure body according to claim 1 , wherein total reflectance measured in a direction of an opposite surface of a surface of the darkening pattern layer claim 1 , which is in contact with the conductive pattern layer claim 1 , is 20% or less.4. The conductive structure body according to claim 1 , wherein the darkening pattern layer is provided between the conductive pattern layer and the substrate claim 1 , and the total reflectance measured at a side of the substrate is 20% or less.5. The conductive structure body according to claim 1 , wherein a brightness value L* of the conductive structure body is 50 or less based on a L*a*b* color value.6. The conductive structure body according to claim 1 , wherein surface resistance of the conductive structure body is 1 Ω/square or more and 300 Ω/square or less.7. The conductive structure body according to claim 1 , wherein surface resistance of the darkening layer or the conductive layer of the conductive structure body before patterning is more than 0 Ω/square and 2 Ω/square or less.8. The conductive structure body according to claim 1 , wherein a thickness of the darkening pattern layer is 10 nm or more and 400 nm or less.9. The conductive structure body according to claim 1 , wherein a thickness of the darkening pattern layer is 30 nm or more and 300 nm or less.10. The ...

CONDUCTIVE SUBSTRATE COMPRISING CONDUCTIVE PATTERN AND TOUCH PANEL COMPRISING SAME

The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate according to the present invention comprises: a transparent substrate, and a conductive pattern comprising a conductive line provided on the transparent substrate, wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less. The conductive substrate according to the present invention can more efficiently conceal a metal line comprised in the conductive pattern. 1. A conductive substrate comprising:a transparent substrate, anda conductive pattern comprising a conductive line provided on the transparent substrate,wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less.2. The conductive substrate of claim 1 , wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 10 μm or less.3. The conductive substrate of claim 1 , wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 5 μm or less.4. The conductive substrate of claim 1 , comprising:a line breakage portion performing breakage at an angle of 80 to 110° in the longitudinal direction of at least one conductive line constituting the conductive pattern.5. The conductive substrate of claim 1 , wherein the conductive pattern comprises one or more selected from the group consisting of metal claim 1 , metal oxides claim 1 , metal nitrides claim 1 , metal oxynitrides claim 1 , and a metal alloy.6. The conductive ...

CONDUCTIVE PATTERN AND MANUFACTURING METHOD THEREOF

The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width. 1. A method for manufacturing a conductive pattern , comprising the steps of:a) forming a conductive film on a substrate;b) forming an etching resist pattern on the conductive film; andc) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern.2. The method for manufacturing a conductive pattern according to claim 1 , wherein in the step a) claim 1 , deposition claim 1 , sputtering claim 1 , wet coating claim 1 , evaporation claim 1 , electroplating claim 1 , electroless plating or lamination of a metal cladding is used.3. The method for manufacturing a conductive pattern according to claim 1 , wherein the step a) is a step for forming a conductive film by using a method for providing conductivity by firing or drying after coating a solution of organic metal claim 1 , nanometal or a complex thereof on the substrate.4. The method for manufacturing a conductive pattern according to claim 1 , wherein in the step b) claim 1 , a line edge roughness (LER) of the etching resist pattern is controlled by ½ or less of the line width of a conductive pattern to be formed in the step c).5. The method for manufacturing an insulated conductive pattern according to claim 1 , wherein in the step c) claim 1 , an etching time is a just-etching time to a time that ...

CONDUCTIVE STRUCTURE, TOUCH PANEL, AND METHOD FOR MANUFACTURING SAME

Provided are a conductive structure including a) a base, b) a conductive pattern provided on at least one side of the base, and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof. 1. A conductive structure , comprising:a) a base;b) a conductive pattern provided on at least one side of the base; andc) a darkening layer provided on the upper surface and the lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern.2. The conductive structure of claim 1 , wherein a color range of a pattern area configured by the darkening layer and the conductive pattern claim 1 , which is measured at the surface where the darkening layer of the conductive substrate is viewed claim 1 , has a L value of 20 or less claim 1 , an A value of −10 to 10 claim 1 , and a B value of −70 to 70 based on the CIE LAB color coordination.3. The conductive structure of claim 1 , wherein total reflectivity in the pattern area configured by the darkening layer and the conductive pattern claim 1 , which is measured at the surface where the darkening layer of the conductive substrate is viewed claim 1 , is 17% or less based on 550 nm.4. The conductive structure of claim 1 , wherein the darkening layer includes one kind or more selected from a group constituted by a dielectric material claim 1 , a metal claim 1 , a metal alloy claim 1 , a metal oxide claim 1 , a metal nitride claim 1 , a metal oxynitride claim 1 , and a metal carbide.5. The conductive structure of claim 4 , wherein the metal includes one kind or more selected from a group constituted by Ni claim 4 , Mo claim 4 , Ti claim 4 , Cr claim 4 , Al claim 4 , Cu claim 4 , Fe claim 4 , Co ...

HEATING ELEMENT

The present invention relates to a heating element and a method for manufacturing same, and more specifically, a heating element and a method for manufacturing same is provided, the heating element comprising: an adhesive film; and a conductive heating pattern provided on the adhesive film, wherein the adhesive film has a rate of adhesive force reduction due to an external stimulus of at least 30% with respect to the adhesive force thereof prior to the application of an external stimulus. 1. A heating element comprising:an adhesive film; anda conductive heating pattern provided on the adhesive film,wherein the adhesive film has an adhesive strength decrement of 30% or greater by an external stimulus based on adhesive strength before the external stimulus.2. The heating element of claim 1 , wherein the external stimulus is one or more of heat claim 1 , light irradiation claim 1 , a pressure and a current.3. The heating element of claim 1 , wherein the external stimulus is ultraviolet irradiation.4. The heating element of claim 1 , wherein the adhesive film is prepared using a composition for the adhesive film including an adhesive resin claim 1 , an initiator and a crosslinking agent.5. The heating element of claim 1 , further comprising a substrate provided on a surface opposite to the surface of the adhesive film provided with the conductive heating pattern.6. The heating element of claim 1 , further comprising a darkening pattern provided at least one of on the conductive heating pattern and between the conductive heating pattern and the adhesive film.7. The heating element of claim 1 , wherein the conductive heating pattern has a line height of 10 μm or less. The present specification claims priority to and the benefits of Korean Patent Application No. 10-2016-0053158, filed with the Korean Intellectual Property Office on April 29, 2016, the entire contents of which are incorporated herein by reference.The present specification describes a heating element and a ...

TOUCH PANEL COMPRISING CONDUCTIVE PATTERN

The present invention relates to a touch panel comprising a conductive pattern having improved transmittance and concealing property, and the touch panel according to the present invention can have an effect of improvement in transmittance, a concealing property, and uniformity, and a reduction in strength of a diffraction pattern by reflection light in a conductive pattern by providing the conductive patterns comprising regions having different aperture ratios on both surfaces of a transparent substrate at predetermined positions, or laminating the transparent substrate having the conductive patterns comprising the regions having different aperture ratios. 1. A touch panel comprising:a first conductive substrate comprising a first transparent substrate and a first conductive pattern provided on the first transparent substrate, anda second conductive substrate comprising a second transparent substrate and a second conductive pattern provided on the second transparent substrate in a laminate form,wherein the first conductive pattern comprises regions A and B having different aperture ratios having a difference of 0.5% or more therebetween, the second conductive pattern comprises region C overlapping the region A and region D overlapping the region B, and a difference between a product of the aperture ratio of the region A and the aperture ratio of the region C and a product of the aperture ratio of the region B and the aperture ratio of the region D is 2% or less.2. A touch panel comprising:a transparent substrate,a first conductive pattern provided on one surface of the transparent substrate, anda second conductive pattern provided on the other surface of the transparent substrate,wherein the first conductive pattern comprises regions A and B having different aperture ratios having a difference of 0.5% or more therebetween, the second conductive pattern comprises region C overlapping the region A and region D overlapping the region B, and a difference between a ...

NOVEL HETEROTRICYCLIC DERIVATIVE COMPOUND AND USE OF SAME

A novel heterotricyclic compounds of Formula 1 or pharmaceutically acceptable salts thereof, and uses thereof are disclosed. The novel heterotricyclic compounds exhibit an inhibitory activity against EZH1 (enhancer of zeste homolog 1) and/or EZH2 (enhancer of zeste homolog 2) activity. Pharmaceutical compositions containing these compounds as active ingredient is also disclosed. The heterotricyclic compound, pharmaceutically acceptable salts thereof, or compositions containing the compound or salt are useful in treating tumor or cancer in a subject.

Touch screen and manufacturing method thereof

The present invention provides a method of manufacturing a touch screen, comprising the steps of: a) forming a conductive layer on a substrate; b) forming an etching resist pattern on the conductive layer; and c) forming a conductive pattern having a line width smaller than the line width of the etching resist pattern by over-etching the conductive layer by using the etching resist pattern and a touch screen manufactured by the method. According to the present invention, a touch screen comprising a conductive pattern having an ultrafine line width can be economically and efficiently provided.

CLICHE FOR OFFSET-PRINTING AND METHOD FOR MANUFACTURING SAME

The present invention relates to a cliché for offset printing and a method of manufacturing the same, and the cliché for offset printing according to the present invention comprises: a groove pattern, wherein a depth of at least a partial region of the groove pattern is different from a depth of a residual region. The present invention may comprise a double etching process when a cliché for offset printing is manufactured to control a bottom touch phenomenon that is a problem exhibited when a known wide line width is implemented, thus manufacturing the cliché for offset printing having various line widths and etching depths. 1. A cliché for offset printing comprising:a groove pattern,wherein a depth of at least a partial region of the groove pattern is different from a depth of a residual region.2. The cliché for offset printing of claim 1 , wherein the regions having different depths of the groove pattern comprise regions having different line widths of the groove pattern.3. The cliché for offset printing of claim 2 , wherein the region having the relatively larger line width of the groove pattern comprises the region having the larger depth as compared to the region having the relatively smaller line width.4. The cliché for offset printing of claim 1 , wherein the groove pattern comprises at least two patterns having different line widths claim 1 , and a difference between the line widths of at least two patterns is 15 μm or more.5. The cliché for offset printing of claim 4 , wherein at least two patterns where the difference between the line widths is 15 μm or more are connected to each other.6. The cliché for offset printing of claim 1 , wherein the groove pattern comprises two or more patterns where the difference between the line widths is 15 μm or more.7. The cliché for offset printing of claim 6 , wherein the groove pattern further comprises a pattern having the line width that is different from the minimum line width by 500 μm or more.8. The cliché for ...

LIGHT-EMITTING-ELEMENT ENCAPSULATING COMPOSITION, LIGHT-EMITTING DIODE AND LIQUID CRYSTAL DISPLAY DEVICE

An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency. 1. An encapsulating composition for a light emitting element , comprising:a curable silicone compound; and {'br': None, 'sup': a+', '−, 'sub': m', 'f', 'n', 'a, 'M[X(YOR)]\u2003\u2003Formula 1'}, 'a conductivity-providing agent represented by the following Formula 1{'sup': 'a+', 'sub': 'f', 'wherein M represents an inorganic or organic cation, X represents a nitrogen or carbon atom, Y represents a carbon or sulfur atom, R, represents a perfluoroalkyl group, a and m each independently represent an integer of 1 or 2, and n represents an integer of 2 or 3 (provided that m is the integer 1 when Y is a carbon atom, m is the integer 2 when Y is a sulfur atom, n is the integer 2 when X is a nitrogen atom, and n is the integer 3 when X is a carbon atom).'}2. The composition of claim 1 , wherein the silicone compound is a heat-curable silicone compound or a UV-curable silicone compound.3. The composition of claim 1 , wherein the silicone compound comprises:(1) an organopolysiloxane containing two or more alkenyl groups in the molecule; and(2) an organopolysiloxane containing two or ...

ORGANIC LIGHT-EMITTING DISPLAY DEVICE

The present specification relates to an organic light emitting display device. 2. The organic light emitting display device of claim 1 , wherein a thickness of the light reflection reducing layer is 10 nm or more and 100 nm or less.3. The organic light emitting display device of claim 1 , wherein an extinction coefficient (k) of the light reflection reducing layer is 0.1 or more and 2 or less with light having a wavelength of 550 nm.4. The organic light emitting display device of claim 1 , wherein a refractive index (n) of the light reflection reducing layer is 2 or more and 3 or less with light having a wavelength of 550 nm.5. The organic light emitting display device of claim 1 , wherein light reflectance of an electrode provided with the light reflection reducing layer is 50% or less.6. The organic light emitting display device of claim 1 , wherein the light reflection reducing layer comprises one or more kinds selected from the group consisting of a metal oxide claim 1 , a metal nitride claim 1 , and a metal oxynitride.7. The organic light emitting display device of claim 6 , wherein the metal oxide claim 6 , the metal nitride claim 6 , and the metal oxynitride are derived from one or two or more metals selected from the group consisting of Cu claim 6 , Al claim 6 , Mo claim 6 , Ti claim 6 , Ag claim 6 , Ni claim 6 , Mn claim 6 , Au claim 6 , Cr claim 6 , and Co.8. The organic light emitting display device of claim 1 , wherein the light reflection reducing layer is provided on a surface facing the substrate of the gate electrode claim 1 , the source electrode claim 1 , the drain electrode claim 1 , the gate line claim 1 , and the data line.9. The organic light emitting display device of claim 1 , wherein the organic light emitting display device has a bottom emission structure.10. The organic light emitting display device of claim 1 , wherein each of the organic light emitting display devices comprises a first electrode electrically connected with the drain ...

TRANSPARENT CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

The present invention provides a transparent conductive substrate comprising: a transparent substrate, and a conductive pattern provided on the transparent substrate, wherein the conductive pattern comprises line breakage portions performing electric breakage, and a pattern of a broken line formed when the line breakage portions are connected comprises an irregular pattern shape. The present invention can minimize a moiré phenomenon and a diffraction phenomenon by external light by performing line breakage of a regular or irregular conductive pattern by using the irregular pattern. 1. A transparent conductive substrate comprising:a transparent substrate, anda conductive pattern provided on the transparent substrate,wherein the conductive pattern comprises line breakage portions performing electric breakage, and a pattern of a broken line formed when the line breakage portions are connected comprises an irregular pattern shape.2. The transparent conductive substrate of claim 1 , wherein the conductive pattern comprises a pattern formed of a conductive metal line.3. The transparent conductive substrate of claim 2 , wherein the line breakage portions electrically break the conductive metal line claim 2 , and an interval between the electrically broken conductive metal lines is 50 μm or less.4. The transparent conductive substrate of claim 3 , wherein the interval between the electrically broken conductive metal lines is 0.5 to 15 μm.5. The transparent conductive substrate of claim 2 , wherein the pattern formed of the conductive metal line comprises a straight line claim 2 , a curved line claim 2 , or a closed curve formed of the straight line and the curved line.6. The transparent conductive substrate of claim 1 , wherein the conductive pattern is a regular or irregular pattern.7. The transparent conductive substrate of claim 1 , wherein the conductive pattern comprises a mesh pattern.8. The transparent conductive substrate of claim 7 , wherein the mesh pattern ...

TOUCH PANEL AND DISPLAY DEVICE INCLUDING SAME

The present invention relates to a touch panel, comprising: a screen part comprising a first conductive pattern portion, and a router part comprising a second conductive pattern portion, in which the first conductive pattern portion and the second conductive pattern portion have the same line height, and there is no connecting portion in a region in which the first conductive pattern portion and the second conductive pattern portion are connected to each other, and a display apparatus comprising the same. 1. A touch panel , comprising:a screen part comprising a first conductive pattern portion; anda router part comprising a second conductive pattern portion,wherein the first conductive pattern portion and the second conductive pattern portion have the same line height, and there is no connecting portion in a region where the first conductive pattern portion and the second conductive pattern portion are connected with each other.2. The touch panel of claim 1 , wherein a linear resistance value on the shortest distance from any one side contacting the second conductive pattern portion to the other side facing the one side in any one electrically connected region of the first conductive pattern portion is equal to or larger than a linear resistance value from any one side contacting the first conductive pattern portion to the other side where the second conductive pattern portion contacts the FPCB claim 1 , in any one electrically connected region of the second conductive pattern portion.3. The touch panel of claim 1 , wherein in any one electrically connected region of the first conductive pattern portion claim 1 , a flow direction of electricity in the first conductive pattern portion from any one side of the screen part to the other side facing the one side and an angle of the conductive line of the first conductive pattern portion are different from each other.4. The touch panel of claim 1 , wherein at least a part of the second conductive pattern portion has a ...

PRINTING PLATE FOR REVERSE OFFSET PRINTING AND METHOD FOR MANUFACTURING SAME

The present application is relating to a printing plate for reverse offset printing, a method for preparing the same, and a method for forming a bezel pattern using the printing plate. The printing plate for reverse offset printing according to an exemplary embodiment of the present application is effective for forming a bezel pattern of a display substrate. 1. A printing plate for reverse offset printing comprising: an intaglio portion corresponding to at least one bezel pattern , [{'br': None, '[Equation 1]'}, {'br': None, 'i': 't Подробнее

CLICHÉ AND PRINTING APPARATUS COMPRISING SAME

The present specification describes a cliché, a method of manufacturing the cliché, and a printing method using the cliché. 1. A cliché comprising:a support roll; anda flexible base provided to surround at least one surface of the support roll and having an uneven portion,wherein a porous sheet is provided between the support roll and the flexible base.2. The cliché of claim 1 , wherein a buffer layer for improving adhesion force is provided between the flexible base and the uneven portion claim 1 , or the flexible base is subjected to pre-treatment for improvement of the adhesion force.3. The cliché of claim 1 , wherein a depth of the uneven portion is 1 micrometer or more.4. The cliché of claim 1 , comprising:a SiOx layer provided on a surface of the base, on which the uneven portion is provided.5. The cliché of claim 4 , wherein a thickness of the SiOx layer is 10 nm or more and 2 mm or less.6. The cliché of claim 4 , wherein surface energy of the SiOx layer is 40 dyn/cm or more and 4 claim 4 ,000 dyn/cm or less.7. The cliché of claim 4 , wherein the surface energy of the SiOx layer is 40 dyn/cm or more and 70 dyn/cm or less.8. The cliché of claim 1 , wherein an average pore size of the porous sheet is 0.1 micrometers or more and 100 micrometers or less.9. The cliché of claim 1 , wherein the porous sheet is any one of a sintered bodies of a polymer claim 1 , metal and ceramic.10. The cliché of claim 1 , wherein porosity of the porous sheet is 10% or more and 50% or less.11. The cliché of claim 1 , wherein a vacuum suction hole is provided in the support roll.12. The cliché of claim 1 , wherein both ends of the flexible base in a circumferential direction of the support roll are fixed to the support roll by a magnet.13. The cliché of claim 12 , wherein the support roll has a groove portion in a direction that is parallel to a rotation axis of the roll claim 12 , and the ends of the flexible base are fixed in the groove portion by the magnet.14. The cliché of claim ...

PRINTING PLATE AND METHOD FOR MANUFACTURING SAME

The present invention relates to a cliché and a method for manufacturing the same, and the cliché according to the present invention comprises a cliché comprising: a groove pattern, wherein the groove pattern comprises a region composed of linear patterns which do not intersect with each other and the region composed of linear patterns is a square region comprising two or more lines of a linear pattern in the region and comprises a region in which the line width (W) and the depth (D) of the linear pattern and the ratio (R) of a region which does not comprise the linear pattern in the square region and the aperture line width (W) of a mask pattern for forming a pattern, which corresponds to the linear pattern, satisfy specific relationship equation(s). The cliché according to the present invention may prevent the bottom touch phenomenon of ink transferred onto the cliché. 1. A cliché , comprising:a groove pattern,{'sub': '0', 'claim-text': [{'br': None, 'i': W=', 'D+W', '+X, 'sub': '0', '2\u2003\u2003[Relationship Equation 1]'}, {'br': None, 'i': D≧', 'R/, '42.9 exp(−0.35)−1.5\u2003\u2003[Relationship Equation 2]'}], 'wherein the groove pattern comprises a region composed of linear patterns which do not intersect with each other and the region composed of linear patterns is a square region comprising two or more lines of a linear pattern in the region and comprises a region in which a line width (W) and a depth (D) of the linear pattern and the ratio (R) of a region which does not comprise the linear pattern in the square region and an aperture line width (W) of a mask pattern for forming a pattern, which corresponds to the linear pattern, satisfy the following Relationship Equations 1 and 2wherein, X is a constant,{'sub': '0', 'D, W, Wand X are values of micrometer units, and'}R is a value more than 0 and less than 1.2. The cliché of claim 1 , wherein the line width (W) and a pitch (P) of the linear pattern in the square region and the ratio (R) of the region which ...

Novel dioxoloisoquinolinone derivatives and use thereof

Disclosed are novel dioxoisoquinolinone derivative compounds, pharmaceutically acceptable salts thereof, optical isomers, hydrates, and solvates thereof as well as uses thereof. More specifically, the novel dioxoisoquinolinone derivative compounds, pharmaceutically acceptable salts, optical isomers, hydrates, solvates show inhibition activity of EZH1 (Enhancer of zeste homolog 1) and/or EZH2 (Enhancer of zeste homolog 2) activity. Pharmaceutical compositions containing the compound is also disclosed.

Substrate

A substrate on which a specific type spacer is formed, a substrate comprising an alignment film formed on the spacer, and an optical device using such a substrate are disclosed herein. By controlling the shape of the spacer formed on the substrate, even when the alignment film is formed on the top of the spacer and the orientation treatment is performed, the uniform orientation treatment can be performed without any influence by the step or the like of the spacer, whereby a substrate or the like capable of providing a device having excellent optical performance can be provided. 1. A substrate , comprising:a base layer; anda spacer disposed on the base layer,wherein the spacer having a curved portion, wherein a cross section of the curved portion have at least one region having curvature.2. The substrate according to claim 1 , wherein a curvature of the cross section has a maximum of 2 claim 1 ,000 mmor less.3. The substrate according to claim 2 , wherein the cross section does not include a curvature of 0 mm.4. The substrate according to claim 1 , wherein the curved portion has a height in a range of 1 μm to 20 μm.5. The substrate according to claim 1 , wherein the curved portion has a width in a range of 2 μm to 40 μm.6. The substrate according to claim 1 , wherein the spacer has a height in a range of 1 μm to 50 μm.7. The substrate according to claim 1 , wherein the spacer further comprising:a tapered portion disposed on the surface of the base layer, wherein the curved portion is disposed on the tapered portion.8. A substrate claim 1 , comprising:a base layer;a spacer disposed on the base layer; andan alignment film disposed on the base layer and the spacer,wherein the alignment film has a curved portion, wherein a cross section of the curved portion have at least one region having curvature.9. The substrate according to claim 8 , wherein the curvature of the cross section has a maximum of 2 claim 8 ,000 mmor less.10. The substrate according to claim 9 , wherein ...

ELECTRONIC DEVICE USING LOGICAL CHANNELS FOR COMMUNICATION

An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs. 1. A method for operating an electronic device , the method comprising:executing, by at least one processor of the electronic device, an application program to interface with a framework interface;routing, by the framework interface, data between the application program and one or more communication modules, wherein each of the one or more communication modules is configured to operate according to a selected one or more communication protocols, and wherein the framework interface is configured to select at least one of the one or more communication modules for at least part of the data; andcommunicating, by the one or more communication modules, the data with one or more external electronic devices.2. The method of claim 1 , further comprising:providing to the framework interface, by the application program, at least one of a preference or a selection of the one or more communication protocols,wherein the routing of the data between the application program and the one or more communication modules is based at least partly on the one of the preference or the selection of the one or more communication protocols.3. The method of claim 2 , wherein the at least one of the preference or the selection comprises at least one of an ...

TOUCH PANEL AND DISPLAY DEVICE INCLUDING SAME

The present invention relates to a touch panel, comprising a screen part, a router part, a flexible printed circuit board (FPCB) part, a first pad part comprising two or more router connection regions connecting the screen part and the router part, and a second pad part comprising two or more FPCB connection regions connecting the router part and the flexible printed circuit board (FPCB) part, in which at least some regions of the two or more FPCB connection regions comprise a conductive pattern having opening regions. 1. A touch panel , comprising:a screen part;a router part;a flexible printed circuit board (FPCB) part;a first pad part comprising two or more router connection regions connecting the screen part and the router part; anda second pad part comprising two or more FPCB connection regions connecting the router part and the flexible printed circuit board (FPCB) part,wherein at least some regions of the two or more FPCB connection regions comprise a conductive pattern having opening regions.2. The touch panel of claim 1 , wherein a ratio of the opening regions in the two or more FPCB connection regions is 10 to 99%.3. The touch panel of claim 1 , wherein at least some regions of the two or more router connection regions comprise a conductive pattern having opening regions.4. The touch panel of claim 3 , wherein a ratio of the opening regions in the two or more router connection regions is 10 to 99%.5. The touch panel of claim 1 , wherein the screen part comprises a first conductive pattern claim 1 , and the router part and the first pad part comprise second conductive patterns claim 1 , and at least a part of the second conductive pattern has a line width different from the first conductive pattern.6. The touch panel of claim 5 , wherein a difference in a line width between at least a part of the second conductive pattern and the first conductive pattern is 5 micrometers or more.7. The touch panel of claim 5 , wherein a difference in a line width between at ...

Liquid crystal display device

The present specification relates to a liquid crystal display device.

A sheet and an optical fingerprint scanner

The present application relates to a sheet comprising, in a single layer, a first light control part capable of providing light always totally reflected only in a specific interlayer laminate structure among sheet constructions; and a second light control part capable of providing light whose total reflection is determined according to a fingerprint pattern in contact with the surface layer of the sheet by changing a part of the light provided from the first light control part and totally reflected in the specific interlayer laminate structure at a predetermined angle and emitting it to reach the surface layer of the sheet without being totally reflected in the specific interlayer laminate structure, and a device thereof. The sheet has excellent user identification or authentication capability through a fingerprint and can be applied to a large area display device to recognize a plurality of fingerprint patterns without being influenced by each other.

INK COMPOSITION FOR PRINTING, AND PRINTING METHOD USING SAME

Provided are an ink composition for a printing method, in which the ink composition is applied to a printing blanket, a portion of a coating film is removed using a cliche, and then the coating film remaining on the printing blanket is transferred to an object to be printed, in which the ink composition before printing satisfies the following [Equation 1] [INK≤BNKγc] and the ink coating film on the printing blanket satisfies the following [Equation 2] [BNKγc≤INK≤SUB] immediately before the removal of the portion of the ink coating film from the printing blanket using the cliche, and a printing method using the same. 2. The ink composition of claim 1 , wherein said and silicone-based or a fluorine-based surfactant is present in an amount of from 0.01 wt % to 5 wt % based on the total weight of the ink composition.3. The ink composition of claim 1 , wherein the binder has a surface tension from 26 mN/m to 45 mN/m.4. The ink composition of claim 1 , wherein said at least two different solvents comprise a first solvent in an amount of 10 wt % to 40 wt % based on the total weight of the ink composition and a second solvent in an amount of 0.1 wt % to 50 wt % based on the total weight of the ink composition.5. The ink composition of claim 4 , wherein the first solvent comprises a solvent having a surface tension from 11 mN/m to 24 mN/m and the second solvent comprises a solvent having a surface tension from 26 mN/m to 72 mN/m.6. The ink composition of claim 4 , wherein said first solvent is selected from the group consisting of dimethyl glycol claim 4 , trimethyl chloro methane claim 4 , methanol claim 4 , ethanol claim 4 , isopropanol claim 4 , propanol claim 4 , hexane claim 4 , heptane claim 4 , octane claim 4 , 1-chlorobutane claim 4 , methyl ethyl ketone claim 4 , cyclohexane.7. The ink composition of claim 4 , wherein said second solvent is selected from the group consisting of dimethyl acetamide claim 4 , γ-butyl lactone claim 4 , hydroxytoluene claim 4 , propylene ...

HEATING ELEMENT AND MANUFACTURING METHOD THEREOF

Provided are a heating element, which includes: a transparent substance; a conductive heating line that is provided on at least one side of the transparent substance; bus bars that is electrically connected to the conductive heating line; and a power portion that is connected to the bus bars, wherein 30% or more of the entire area of the transparent substance has a conductive heating line pattern in which, when the straight line that intersects the conductive heating line is drawn, a ratio (distance distribution ratio) of standard deviation in respects to an average value of distances between adjacent intersection points of the straight line and the conductive heating line is 5% or more, and a method for manufacturing the same. 1. A heating element comprising a transparent substance; a conductive heating line that is provided on at least one side of the transparent substance; bus bars that is electrically connected to the conductive heating line; and a power portion that is connected to the bus bars , wherein 30% or more of the entire area of the transparent substance has a conductive heating line pattern in which , when a straight line that intersects the conductive heating line is drawn , a ratio (distance distribution ratio) of standard deviation in respects to an average value of distances between adjacent intersection points of the straight line and the conductive heating line is 5% or more.2. The heating element according to claim 1 , wherein the straight line that intersects the conductive heating line is a line in which the standard deviation of the distances between adjacent intersection points of the straight line and the conductive heating line is the smallest value.3. The heating element according to claim 1 , wherein the straight line that intersects the conductive heating line is a straight line that vertically extends in respects to the tangent line of any one point of the conductive heating line.4. The heating element according to claim 1 , wherein ...

Substrate

A substrate on which spacers are disposed in a certain arrangement state and an optical device using such a substrate are provided. A plurality of spacers are irregularly disposed on a substrate depending on a predetermined rule, so that overall uniform optical characteristics can be ensured without causing a so-called moire phenomenon or the like, while the spacers maintain the uniform cell gap in the construction of the optical device.

APPARATUS AND METHOD FOR REVERSE OFFSET PRINTING

The present specification describes a reverse offset printing apparatus and a method. 1. A reverse offset printing apparatus comprising:a blanket roll;a coating unit provided to coat a printing composition on the blanket roll;a cliché roll that includes an uneven unit provided to form a pattern by being in contact with the outer peripheral surface of the blanket roll, and removing part of the printing composition coated on the blanket roll;a cliché roll cleaning unit provided to clean the uneven unit of the cliché roll while the cliché roll removes part of the printing composition coated on the blanket roll, which includes a cleaning solution injection unit and a vacuum suction unit; anda printed unit equipped with a printed material, and provided to transfer the printing composition pattern on the blanket roll to the printed material.2. (canceled)3. The reverse offset printing apparatus of claim 1 , wherein the blanket roll is disposed at a place where the outer peripheral surface borders each of the cliché roll and the printed material installed on the printed unit claim 1 , which is also a place where coating is carried out by the coating unit.4. The reverse offset printing apparatus of claim 1 , wherein the blanket roll is disposed to be movable between a place where coating is carried out by the coating unit claim 1 , and a place where the outer peripheral surface borders each of the cliché roll and the printed material installed on the printed unit.5. The reverse offset printing apparatus of claim 1 , wherein the blanket roll is disposed to be movable between a place where coating is carried out by the coating unit claim 1 , a place where the outer peripheral surface borders the cliché roll claim 1 , and a place where the outer peripheral surface borders the printed material installed on the printed unit.6. The reverse offset printing apparatus of claim 1 , wherein the blanket roll is disposed to be movable between a place where the outer peripheral surface ...

TOUCH SENSOR AND METHOD FOR MANUFACTURING SAME

The present application relates to a touch sensor and a method of manufacturing the same, and the touch sensor according to the present application includes: a substrate; and a driving electrode unit, a sensing electrode unit, and a wiring electrode unit provided on the same surface of the substrate, in which each of the driving electrode unit, the sensing electrode unit, and the wiring electrode unit includes a conductive pattern including a shielding portion and an opening portion. 1. A touch sensor , comprising:a substrate; anda driving electrode unit, a sensing electrode unit, and a wiring electrode unit provided on the same surface of the substrate,wherein the touch sensor includes a touch sensing region and a touch non-sensing region,each of the driving electrode unit, the sensing electrode unit, and the wiring electrode unit includes a conductive pattern including a shielding portion and an opening portion,the wiring electrode unit includes a first wiring electrode unit positioned in the touch sensing region of the touch sensor and a second wiring electrode unit positioned in the touch non-sensing region of the touch sensor, and the first wiring electrode unit includes one or two or more bundles of wires connecting the driving electrode unit or the sensing electrode unit to the second wiring electrode unit,the conductive pattern configuring the touch sensing region includes a form, in which n repeat unit patterns are repeated in a width direction of the touch sensing region, andthe second wiring electrode unit is provided in a touch non-sensing region provided to be adjacent to a lateral surface of an upper portion of the touch sensing region and a touch non-sensing region provided to be adjacent to a lateral surface of a lower portion of the touch sensing region.2. The touch sensor of claim 1 , wherein at least some of the bundles of the first wiring electrode unit are connected to the second wiring electrode unit provided in the touch non-sensing region ...

TOUCH SENSOR AND METHOD FOR MANUFACTURING SAME

The present application relates to a touch sensor and a method of manufacturing the same, and the touch sensor according to the present application includes: a substrate; and a driving electrode unit, a sensing electrode unit, and a wiring electrode unit provided on the same surface of the substrate, in which each of the driving electrode unit, the sensing electrode unit, and the wiring electrode unit includes a conductive pattern including a shielding portion and an opening portion. 1. A touch sensor , comprising:a substrate; anda driving electrode unit, a sensing electrode unit, and a wiring electrode unit provided on the same surface of the substrate,wherein the touch sensor includes a touch sensing region and a touch non-sensing region,each of the driving electrode unit, the sensing electrode unit, and the wiring electrode unit includes a conductive pattern including a shielding portion and an opening portion,the wiring electrode unit includes a first wiring electrode unit positioned in the touch sensing region of the touch sensor and a second wiring electrode unit positioned in the touch non-sensing region of the touch sensor, andthe conductive pattern configuring the touch sensing region includes a form, in which n repeated unit patterns are repeated in a width direction of the touch sensing region.2. The touch sensor of claim 1 , wherein a width D of the repeat unit pattern is expressed by Equation 1 below claim 1 ,{'br': None, 'i': D=A', 'n×m, '/()\u2003\u2003[Equation 1]'}in Equation 1, A is a width of the touch sensing region, n is the number of repeat unit patterns, and m is a divisor of n.4. The touch sensor of claim 3 , wherein the bundle is formed in a pattern shape claim 3 , in which a closed figure having two disconnection points is continuously disposed in a direction from one side of the substrate adjacent to an end of the second wiring electrode to the other side of the substrate facing the one side claim 3 ,a virtual straight line connecting the ...

Substrate

A substrate having a spacer formed thereon, a method of making the same, and an optical device including the same are disclosed herein. In one embodiment, a substrate includes a base layer, and a black column spacer formed on the base layer, wherein the black column spacer has an optical density in a range of 1.1 to 4, and wherein the black column spacer having a curved portion, wherein a cross section of the curved portion having at least one region having curvature. 1. A substrate , comprising:a base layer; anda black column spacer formed on the base layer,wherein the black column spacer has an optical density in a range of 1.1 to 4, andwherein the black column spacer having a curved portion, wherein a cross section of the curved portion having at least one region having curvature.2. The substrate according to claim 1 , wherein the black spacer comprises a pigment or a dye.3. The substrate according to claim 1 , wherein the black spacer comprises a metal oxide claim 1 , a metal nitride claim 1 , a metal oxynitride claim 1 , carbon black claim 1 , graphite claim 1 , an azo-based pigment claim 1 , a phthalocyanine pigment or a carbon-based material.4. The substrate according to claim 1 , wherein the base layer is an inorganic base layer or an organic base layer.5. The substrate according to claim 1 , further comprising:an electrode layer present between the base layer and the column spacer, wherein the spacer is in contact with the electrode layer.6. The substrate according to claim 1 , wherein a curvature of the cross section has a maximum of 2 claim 1 ,000 mmor less.7. The substrate according to claim 6 , wherein the cross section does not include a curvature of 0 mm.8. The substrate according to claim 1 , wherein the curved portion has a height in a range of 1 μm to 20 μm and a width in a range of 2 μm to 40 μm.9. The substrate according to claim 1 , wherein the space further comprising:a tapered portion disposed between the curved portion and the base layer, ...

CONDUCTIVE FILM AND PRODUCTION METHOD THEREOF

The present application relates to a conductive film, a production method for the same, and a use of the same. The present application is capable of providing, for example, a conductive film without air bubbles, etc. which are generated by heat treatment, etc. during a production process, and inhibit optical physical properties. In particular, the present application can provide a conductive film without generation of air bubbles even in a structure in which the conductive layers exist on both sides of the conductive film. 1. A conductive film comprising:an intermediate base layer; anda conductive base layer attached to one or both sides of the intermediate base layer to have a room temperature peel strength of 1,000 gf/inch or more with respect to the intermediate base layer, which is measured at a peeling rate of 0.3 m/min and a peeling angle of 180 degrees.2. The conductive film of claim 1 , wherein conductive base layers having a room temperature peel strength of 1 claim 1 ,000 gf/inch or more with respect to the intermediate base layer claim 1 , which is measured at a peeling rate of 0.3 m/min and a peeling angle of 180 degrees claim 1 , are attached to both sides of the intermediate base layer.3. The conductive film of claim 1 , wherein the conductive base layer is attached to an intermediate base layer by means of a pressure-sensitive adhesive layer or adhesive layer.4. The conductive film of claim 3 , wherein the pressure-sensitive adhesive layer includes at least one selected from the group consisting of an acrylic pressure-sensitive adhesive claim 3 , a silicone pressure-sensitive adhesive claim 3 , a rubber pressure-sensitive adhesive and a polyester pressure-sensitive adhesive.5. The conductive film of claim 4 , wherein the acrylic pressure-sensitive adhesive includes any one selected from the group consisting of ethyl (meth)acrylate claim 4 , n-propyl (meth)acrylate claim 4 , isopropyl (meth)acrylate claim 4 , n-butyl (meth)acrylate claim 4 , t-butyl ( ...

SUBSTRATE FILM

There are provided a substrate film, a laminate, and method of manufacturing a polarizing film. The present application provides a substrate film capable of effectively manufacturing a polarizing film having a thickness of about 10 μm or less, about 8 μm or less, about 7 μm or less, about 6 μm or less, or about 5 μm or less and having an excellent function such as polarization performance, a laminate, and a method of manufacturing the same. According to the invention, it is possible to prevent tearing, curling, or the like from occurring in the elongation process and manufacture a polarizing film by easily elongating a polarization material such as a PVA-based resin. 1. An elongatable substrate film satisfying the following Formula 1:{'br': None, 'i': 'E/R≧', '5,\u2003\u2003[Formula 1]'}where, in Formula 1, E denotes an elongation (unit: %) of the elongatable substrate film measured at room temperature, R denotes a restoration ratio (unit: %), the restoration ratio is measured such that a laminate manufactured by adhering a polyvinyl alcohol film having the same horizontal and vertical lengths as the substrate film and a thickness of 30 μm to a surface of the substrate film cut to a horizontal length of 50 mm and a vertical length of 100 mm is elongated 5 times in a vertical direction in water (temperature: 60° C.), is taken out of the water, the polyvinyl alcohol film is released, the laminate is maintained for 1 hour at room temperature, a length (T) of the substrate film in a vertical direction is measured, and the measured value is assigned to Formula ┌100×(T−A)/A┘, where A in the Formula is a vertical length of the substrate film before the elongation.2. The elongatable substrate film of claim 1 ,wherein the elongation is in a range of 200% to 1500%.3. The elongatable substrate film of claim 1 ,wherein the tensile strength is in a range of 20 MPa to 200 MPa.4. The elongatable substrate film of claim 1 ,wherein an integral value of the elongation curve is in a ...

BLANKET MANUFACTURING APPARATUS AND BLANKET MANUFACTURING METHOD

The present specification relates to an apparatus for manufacturing a blanket, a method for manufacturing a blanket, a blanket manufactured using the same, a reverse offset printing roll provided with the blanket, and a reverse offset printing apparatus including the same. 1. An apparatus for manufacturing a blanket comprising:a surface plate on which a substrate film is supplied;a coating unit coating a blanket composition on the substrate film; anda comma blade horizontally moving on the surface plate coated with the blanket composition,wherein, of the whole surface of the comma blade, the surface contacting the blanket composition is an angular surface.2. The apparatus for manufacturing a blanket of claim 1 , wherein viscosity of the blanket composition is 10 claim 1 ,000 cp or more and 1 claim 1 ,000 claim 1 ,000 cp or less.3. The apparatus for manufacturing a blanket of claim 1 , wherein a thickness of the coated blanket composition is 0.1 mm or more and 100 mm or less.4. The apparatus for manufacturing a blanket of claim 1 , wherein claim 1 , in the angular surface of the comma blade claim 1 , an acute angle formed between any one surface and a neighboring surface of the above-mentioned any one surface is 5° or more and 30° or less.5. The apparatus for manufacturing a blanket of claim 1 , wherein the surface plate has a thickness variation of 20 μm or less.6. The apparatus for manufacturing a blanket of claim 1 , wherein the surface plate includes any one or more of granite claim 1 , artificial granite claim 1 , diamond resins claim 1 , ceramics claim 1 , metals and glass.7. The apparatus for manufacturing a blanket of claim 1 , wherein the surface plate is provided with substrate film adhering means.8. The apparatus for manufacturing a blanket of claim 7 , wherein the substrate film adhering means includes a vacuum suction unit having any one or more of a hole structure claim 7 , a groove structure and a line structure formed on the surface of the surface ...

METHOD FOR CULTURING DIFFERENTIATION-PROMOTING AND -SUSTAINING SPHEROID FORM OF TONSIL-DERIVED STEM CELLS

The present invention relates to: a method for producing a spheroid form of tonsil-derived stem cells, the method enhancing growth and differentiation efficiency of tonsil-derived stem cells; and a method for producing a spheroid form of parathyroid hormones from the same. The method of the present invention for producing a spheroid form of tonsil-derived stem cells cultures the tonsil-derived stem cells in the form of a spheroid to thereby enhance the proliferation rate of the stem cells per se and remarkably increase differentiation potency into parathyroid cells. Thereby, the method has a remarkable effect on the growth and differentiation of the tonsil-derived stem cells into parathyroid cells, etc. 1. A method for producing a spheroid form of tonsil-derived stem cells , the method comprising:(a) transferring a suspension of tonsil-derived stem cells into a hemispherical microwell that is formed in such a way that at least one liquid polymer is hardened in a form of hemispherical microwell, wherein the liquid polymer is selected from among polydimethylsiloxane, silicon polymer, polybutadiene, polyisobutylene and polyurethane and forms a meniscus due to surface tension; and(b) producing a spheroid form of tonsil-derived stem cells by culturing the tonsil-derived stem cells prepared by the step (a) in the hemispherical microwell.2. The method of claim 1 , wherein the microwell is formed in such a way that polydimethylsiloxane is hardened.3. The method of claim 1 , wherein the microwell is 100 to 1000 μm width and 60 to 600 μm depth.4. The method of claim 1 , wherein the culture is performed for 1 to 20 days.5. The method of claim 1 , wherein the culture is performed in Dulbecco's modified Eagle's medium-High Glucose (DMEM-HG) containing fetal bovine serum and antibiotics.6. A method for producing a spheroid form of parathyroid cells from tonsil-derived stem cells claim 1 , the method comprising:(a) transferring a suspension of tonsil-derived stem cells into a ...

CONDUCTIVE STRUCTURE BODY AND METHOD FOR MANUFACTURING THE SAME

An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention. 1. A conductive structure body , comprising:a substrate;a conductive pattern layer; anda darkening pattern layer comprising AlOxNy (0 Подробнее

Conductive substrate and electronic device comprising same

Disclosed are an electric conducting substrate, comprising a transparent substrate and an electric conducting pattern comprising an electric conducting line provided on the transparent substrate, and an electronic device comprising the same.

ROLL PRINTING MACHINE AND METHOD OF ROLL PRINTING USING SAME

The present application relates to a roll printing apparatus and a roll printing method using the same, and the roll printing apparatus according to the present application comprises a printing roll support, a printing roll, a blanket which is provided on an outer surface of the printing roll, a coater which coats a surface of the blanket with ink, a cliche, and a printing object, in which the printing roll is provided to be fixed to the printing roll support so as to perform rotational motion, and the cliche is conveyed by the rotational motion of the printing roll. 1. A roll printing apparatus comprising:a printing roll support, a printing roll, a blanket which is provided on an outer surface of the printing roll, a coater which coats a surface of the blanket with ink, a cliche, and a printing object,wherein the printing roll is provided to be fixed to the printing roll support so as to perform rotational motion, and the cliche is conveyed by the rotational motion of the printing roll.2. The roll printing apparatus of claim 1 , wherein a movement speed of the cliche is synchronized by the rotational motion of the printing roll.3. The roll printing apparatus of claim 1 , further comprising:an idle roll,wherein the idle roll is provided at a lower end of the cliche.4. The roll printing apparatus of claim 3 , wherein the printing object is a flat plate-shaped substrate claim 3 , and the flat plate-shaped substrate is provided on the idle roll.5. The roll printing apparatus of claim 1 , further comprising:a roll-shaped supporting unit which supports the printing object,wherein the printing object is a film substrate.6. The roll printing apparatus of claim 5 , further comprising:a printing object providing unit which continuously provides the film substrate, and a printing object collecting unit which continuously collects the film substrate.7. The roll printing apparatus of claim 6 , wherein the roll-shaped supporting unit is provided between the printing object ...

ELECTRICALLY-CONDUCTIVE STRUCTURE AND A PRODUCTION METHOD THEREFOR

An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention. 2. The conductive structure body according to claim 1 ,wherein an extinction coefficient k of the conductive structure body is 0.2 or more and 0.8 or less.3. The conductive structure body according to claim 1 ,wherein a refractive index of the conductive structure body is 0 or more and 3 or less.4. The conductive structure body according to claim 1 ,wherein the darkening pattern layer further comprises at least one selected from the group consisting of a dielectric material, metal and mixture thereof.5. The conductive structure body according to claim 4 ,wherein the dielectric material is selected from the group consisting of SiO, SiO2, MgF2, and SiNz (z is an integer of 1 or more).6. The conductive structure body according to claim 4 ,wherein the metal is selected from the group consisting of Fe, Co, Ti, V, Cu, Al, Au, and Ag.7. The conductive structure body according to claim 1 ,wherein the darkening pattern layer has an area of 80% to 120% of an area where the conductive pattern layer is occupied.8. The conductive structure body according to claim 1 ,wherein a line width of the darkening pattern layer is the same as or larger than a line width of the conductive pattern layer.9. The conductive structure body according to claim 1 ,wherein a thickness of the conductive pattern layer is 0.01 μm or more and 10 μm or ...

Substrate

A substrate having a spacer thereon and an optical device including the same are disclosed herein. In some embodiments, a substrate includes a base layer, a transparent column spacer formed on the base layer, and a black layer present between the transparent column spacer and the base layer. In some embodiments, an alignment film is present on the spacer. 1. A substrate , comprising:a base layer;a transparent column spacer formed on the base layer; anda black layer present between the transparent column spacer and the base layer.2. The substrate according to claim 1 , wherein the base layer is a flexible base layer.3. The substrate according to claim 1 , wherein a ratio (T/B) of an area (B) of the black layer and an area (T) of a bottom of the column spacer is in a range of 0.5 to 1.5.4. The substrate according to claim 1 , wherein the black layer has an area equal to or smaller than that of the bottom of the column spacer.5. The substrate according to claim 1 , wherein the black layer and the column spacer are overlapped with each other.6. The substrate according to claim 1 , wherein the black layer comprises a metal having a physical ductility value of 0.55 or more.7. The substrate according to claim 1 , wherein the black layer includes one or more of the following layers claim 1 , each layer having a metal with a physical ductility value of 0.55 or more:a metal layer,a metal oxide layer,a metal nitride layer, anda metal oxynitride layer.8. The substrate according to claim 7 , wherein the black layer is a multilayer structure comprising a first layer and a second layer claim 7 , wherein the first layer is the metal layer and the second layer is one of the metal oxide layer claim 7 , the metal nitride layer or the metal oxynitride layer.9. The substrate according to claim 7 , wherein the black layer is a multilayer structure comprising a first layer and two second layer claim 7 , each second layer on opposing sides of the first layer claim 7 , wherein the first ...

DISPLAY DEVICE

Provided are a display panel, a backward diode equipped on a bottom surface of the display panel, a packaging film for packaging the backward diode, and a pressure-sensitive adhesive layer formed between the display panel and the packaging film. The packaging film includes a first region corresponding to a top surface of the backward diode, and a second region extending from the first region and corresponding to a side surface of the backward diode. Due to the display device, a bezel region can be minimized. 1. A display device , comprising:a display panel;a backward diode equipped on a bottom surface of the display panel;a packaging film for packaging the backward diode; anda pressure-sensitive adhesive layer formed between the display panel and the packaging film,wherein the packaging film includes:a first region corresponding to a top surface of the backward diode; anda second region extending from the first region and corresponding to a side surface of the backward diode.2. A display device , comprising:a display panel;a backward diode equipped on a bottom surface of the display panel; anda packaging film for packaging the display panel and the backward diode, a first region corresponding to a top surface of the backward diode; and', 'a second region extending from the first region and corresponding to a side surface of the display panel and a side surface of the backward diode., 'wherein the packaging film includes3. The device according to claim 1 , wherein the packaging film further includes a third region extending from the second region and corresponding to a bottom surface of the backward diode.4. The device according to claim 1 , which includes two to four second regions.5. The device according to claim 1 , wherein the packaging film has an absolute value of in-plane retardation (R) of 30 nm or less.6. The device according to claim 1 , wherein the packaging film has an absolute value of thickness-direction retardation (R) of 35 nm or less.7. The device ...

PACKAGING FILM FOR DISPLAY DEVICE

Provided is a packaging film for a display device, which includes a first region corresponding to a top surface of a backward diode equipped on a bottom surface of a display panel; and a second region extending from the first region and corresponding to a side surface of the backward diode. Due to the packaging film, a bezel region can be minimized. 1. A packaging film for a display device , comprising:a first region corresponding to a top surface of a backward diode equipped on a bottom surface of a display panel; anda second region extending from the first region and corresponding to a side surface of the backward diode.2. A packaging film for a display panel , comprising:a first region corresponding to a top surface of a display panel; anda second region extending from the first region and corresponding to a side surface of the display panel and a side surface of a backward diode equipped on a bottom surface of the display panel.3. The film according to or , further comprising:a third region extending from the second region and corresponding to the bottom surface of the backward diode.4. The film according to or , wherein two to four second regions are included.5. The film according to or , wherein the packaging film has an absolute value of in-plane retardation (R) of 30 nm or less.6. The film according to or , wherein the packaging film has an absolute value of thickness-direction retardation (R) of 35 nm or less.7. The film according to claim 3 , which has a notch part formed on a boundary line between the first and second regions claim 3 , or a boundary line between the second and third regions.8. The film according to claim 3 , wherein the first and second regions or the second and third regions have a bending strength of 1.0 to 10.0 gf on each boundary line.9. The film according to or claim 3 , wherein the packaging film has a thickness claim 3 , which satisfies an area of the first region and the following Equation:{'br': None, 'i': T', '×S', +a, 'sup': '2 ...

ELECTRONIC DEVICE USING LOGICAL CHANNELS FOR COMMUNICATION

An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs. 129.-. (canceled)30. A method for operating an electronic device , the method comprising:establishing, by an electronic device, one or more physical channels with an external electronic device, using one or more communication protocols; andcommunicating, by the electronic device, data with the external electronic device via one or more logical channels or sessions, using the one or more physical channels,wherein the one or more logical channels or sessions are independent of the one or more communication protocols.31. The method of claim 30 , wherein communicating the data comprises transmitting data from one or more application programs running on the electronic device to the external electronic device.32. The method of claim 30 , further comprising:executing a first application program and a second application program on the electronic device, transmitting first data from the first application program using a first logical channel or session on a first physical channel, and', 'transmitting second data from the second application program using a second logical channel or session on the first physical channel., 'wherein communicating the data comprises33. The method of claim 30 , wherein the one or more communication ...

ELECTRONIC DEVICE USING FRAMEWORK INTERFACE FOR COMMUNICATION

An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs. 190.-. (canceled)91. A method for operating an electronic device , the method comprising:establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules;executing, by the electronic device, two or more application programs to interface with the framework interface; andcommunicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs,wherein communicating the data comprises providing, by the framework interface, a data packet including a payload, to the communication module, andwherein the payload includes first data from one of the two or more application programs, and second data from another of the two or more application programs.92. The method of claim 91 , wherein the framework interface communicates the data from the two or more application programs to the one or more communication modules claim 91 , using the at least one logical channel or ...

SWELLING TAPE FOR FILLING GAP

The present application relates to a swelling tape and a method of filling a gap. The swelling tape is, for example, applied in gaps in which a fluid is present and deformed into a three-dimensional shape to fill the gaps and fix in place objects separated by gaps as needed. 1. A swelling tape for filling a gap , comprising:a substrate layer that is deformed in a length direction upon contact with a fluid; and {'br': None, 'i': X', '/X, 'sub': 2', '1, '1.5≦≦150\u2003\u2003[Equation 1]'}, 'a pressure-sensitive adhesive layer formed in a direction parallel to a length direction of the substrate layer on one surface of the substrate layer, and satisfying Equation 1{'sub': 1', '2, 'where Xis a peeling strength of the pressure-sensitive adhesive layer measured at room temperature, and at a peeling rate of 5 mm/sec and a peeling angle of 180 degrees with respect to a surface opposite to the surface of the substrate layer on which the pressure-sensitive adhesive layer is formed, and Xis a peeling strength measured with respect to glass at room temperature and at a peeling rate of 5 mm/sec and a peeling angle of 180 degrees.'}2. The swelling tape for filling a gap of claim 1 , wherein the swelling tape is deformed into a three-dimensional shape having a height of 0.001 mm to 2.00 mm in a direction perpendicular to the length direction of the substrate layer upon contact with a fluid.3. The swelling tape for filling a gap of claim 1 , wherein the substrate layer has a deformation ratio in the length direction according to Equation 2 of 10% or more:{'br': None, 'i': L', '−L', 'L, 'sub': 2', '1', '1, 'Deformation ratio in length direction=()/×100\u2003\u2003[Equation 2]'}{'sub': 1', '2, 'where Lis an initial length before the substrate layer is in contact with a fluid, and Lis a length of the substrate layer measured at room temperature or 60° C. after the substrate layer has been in contact with a fluid for 24 hours.'}4. The swelling tape for filling a gap of claim 1 , ...

ORGANIC LIGHT EMITTING ELEMENT

The present specification relates to an organic light emitting device. 1. An organic light emitting device , comprising:a transparent electrode;a metal electrode provided to face the transparent electrode;one or more organic material layers provided between the transparent electrode and the metal electrode; anda light reflection reducing layer provided while being in contact with a surface of the metal electrode facing the transparent electrode,wherein the light reflection reducing layer includes an aluminum oxynitride.2. The organic light emitting device of claim 1 , wherein a difference in a work function between the metal electrode and the light reflection reducing layer is 0 eV or more and 1.4 eV or less.3. The organic light emitting device of claim 1 , wherein a work function of the light reflection reducing layer is 3.5 eV or more and 4.2 eV or less.4. The organic light emitting device of claim 1 , wherein the light reflection reducing layer includes an aluminum oxynitride expressed with AlxOyNz claim 1 , andx is at % of aluminum and has a value of 55 to 65,y is at % of oxygen and has a value of 1 to 10, andz is at % of nitrogen and has a value of 30 to 40.5. The organic light emitting device of claim 1 , wherein the metal electrode includes one or two or more metals selected from the group consisting of Cu claim 1 , Al claim 1 , Mo claim 1 , Ti claim 1 , Ag claim 1 , Ni claim 1 , Mn claim 1 , Au claim 1 , Cr claim 1 , and Co.6. The organic light emitting device of claim 1 , wherein a thickness of the light reflection reducing layer is 10 nm or more and 100 nm or less.7. The organic light emitting device of claim 1 , further comprising:a metal layer, which is in contact with a surface of the light reflection reducing layer facing the transparent electrode and has a thickness of less than 10 nm.8. The organic light emitting device of claim 7 , wherein the metal layer is transparent or translucent.9. The organic light emitting device of claim 1 , wherein an ...

CONDUCTIVE PATTERN LAMINATE AND ELECTRONIC DEVICE COMPRISING SAME

The present application provides a conductive pattern laminate including: a substrate having concave portions or protrusion portions on an upper surface thereof; and a conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate, in which the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other, a method for manufacturing the same, and an electronic apparatus including the laminate. 1. A conductive pattern laminate comprising:a substrate having concave portions or protrusion portions on an upper surface thereof; anda conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate,wherein the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other.2. The conductive pattern laminate of claim 1 , wherein a depth of the concave portions or a height of the protrusion portions is larger than a thickness of the conductive film.3. The conductive pattern laminate of claim 1 , wherein a depth of the concave portions or a height of the protrusion portions is 0.1 to 30 μm.4. The conductive pattern laminate of claim 1 , wherein a taper angle of at least a part of the concave portions or the protrusion portions is 60 or more degrees.5. The conductive pattern laminate of claim 1 ...

CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

A method for preparing a conducting substrate according to the present invention comprises: ) forming a conducting pattern on a substrate; ) forming a first darkening layer in at least a partial area on the conducting pattern by performing electroplating; and ) forming a second darkening layer in at least a partial area on the conducting pattern by dipping the conducting pattern in an oxidizer solution. 11. . A method for preparing a conducting substrate , comprising:1) forming a conducting pattern on a substrate;2) forming a first darkening layer in at least a partial area on the conducting pattern by performing electroplating; and3) forming a second darkening layer in at least a partial area on the conducting pattern by dipping the conducting pattern in an oxidizer solution.2. The method of claim 1 , wherein the conducting pattern comprises an electrically connected region and an electrically insulated region claim 1 , andthe first darkening layer is formed on the electrically connected region.3. The method of claim 1 , wherein the conducting pattern comprises an electrically connected region and an electrically insulated region claim 1 , andthe second darkening layer is formed on the electrically insulated region.4. The method of claim 1 , wherein the conducting pattern comprises a pattern formed by a conducting metal wire.5. The method of claim 1 , wherein the first darkening layer or the second darkening layer comprises one or more selected from the group consisting of metal claim 1 , an alloy of metal claim 1 , oxide of metal claim 1 , nitride of metal claim 1 , oxyntride of metal claim 1 , and carbide of metal.6. The method of claim 5 , wherein the metal comprises one or more selected from the group consisting of Ni claim 5 , Mo claim 5 , Ti claim 5 , Cr claim 5 , Al claim 5 , Cu claim 5 , Fe claim 5 , Co claim 5 , Ti claim 5 , V claim 5 , Au claim 5 , and Ag.7. The method of claim 1 , further comprising:forming a third darkening layer on the substrate, ...

Substrate

A substrate and a method for producing the same are disclosed herein. In some embodiments, a substrate includes a base layer, a black layer formed on the base layer, and column spacers formed on the black layer, wherein a loss rate of spacers measured by a peel test is 15% or less. The substrate can have excellent adhesiveness of the spacer to the base layer or the black layer and ensuring appropriate darkening properties. The method can effectively produce such a substrate without adverse effects such as occurrence of foreign materials without separate treatment such as heat treatment.

SWELLING TAPE FOR FILLING GAP

The present invention relates to swelling tape for filling a gap and its use. The swelling tape is, for example, applied between gaps in which a fluid is present, thereby being deformed into a three-dimensional shape to fill the gap and fix an object separated by gaps as needed. 1. A swelling tape for filling a gap , comprising:a substrate film having a shore A hardness according to ASTM D2240 of 70A or more, and a shore D hardness according to JIS K-7311 of 40D or more; anda pressure-sensitive adhesive layer formed in a direction parallel to a length direction of the substrate film on one surface of the substrate film.2. The swelling tape for filling a gap of claim 1 , wherein the substrate film comprises thermoplastic polyurethane.3. The swelling tape for filling a gap of claim 2 , wherein the thermoplastic polyurethane is a reaction product of a mixture of an isocyanate compound having at least two isocyanate groups claim 2 , a polyol compound claim 2 , and a chain extender.4. The swelling tape for filling a gap of claim 3 , wherein a total content of the isocyanate compound and the chain extender in the mixture is 20 to 300 parts by weight claim 3 , relative to 100 parts by weight of the polyol compound.5. The swelling tape for filling a gap of claim 3 , wherein the isocyanate compound is an aromatic isocyanate compound claim 3 , an alicyclic isocyanate compound claim 3 , or an aliphatic isocyanate compound.6. The swelling tape for filling a gap of claim 3 , wherein the polyol compound is polyester polyol claim 3 , polyester polyol claim 3 , polycarbonate polyol claim 3 , polycaprolactame polyol claim 3 , polybutadiene polyol claim 3 , or polysulfide polyol.7. The swelling tape for filling a gap of claim 3 , wherein the chain extender is a bifunctional hydroxyl compound claim 3 , a trifunctional hydroxyl compound claim 3 , a tetrafunctional hydroxyl compound claim 3 , or a bifunctional amine compound.8. The swelling tape for filling a gap of claim 1 , wherein ...

Compositions containing SPHEROID CELL AGGREGATES for enhance ovary function and preparation method of the same

The present invention can improve or recover ovarian functions of mammals by containing spheroidal cell aggregates including placenta-derived mesenchymal stem cells as an active ingredient. 1. A pharmaceutical composition for improving ovarian functions comprising spheroidal cell aggregates including placenta-derived mesenchymal stem cells as an active ingredient.2. The pharmaceutical composition according to claim 1 , wherein the spheroidal cell aggregates have less junction boundary between cells due to junctional complexes between adjacent cells and extracellular matrices (ECMs) claim 1 , and thus a relatively smooth outer surface.3. The pharmaceutical composition according to claim 1 , wherein the pharmaceutical composition for improving ovarian functions is used to relieve or treat at least one symptom selected from the group consisting of early ovarian failure claim 1 , infertility claim 1 , subfertility claim 1 , early menopausal claim 1 , menopausal and climacteric symptoms.4. The pharmaceutical composition according to claim 1 , further comprising an adjuvant.5. The pharmaceutical composition according to claim 1 , wherein the pharmaceutical composition is formulated in the form of an injection.6. A use for preparing a pharmaceutical composition for improving ovarian functions comprising spheroidal cell aggregates including placenta-derived mesenchymal stem cells.7. The use according to claim 6 , wherein the spheroidal cell aggregates are obtained by three-dimensionally culturing placenta-derived mesenchymal stem cells claim 6 , and have less junction boundary between cells due to junctional complexes formed between adjacent cells and extracellular matrices (ECMs) claim 6 , and thus a smooth outer surface claim 6 , compared to placenta-derived mesenchymal stem cells before culture.8. The use according to claim 6 , wherein the spheroidal cell aggregates have a mean diameter of 250 μm or less.9. A method of producing spheroidal cell aggregates for improving ...

BLANKET MANUFACTURING APPARATUS AND BLANKET MANUFACTURING METHOD

The present specification relates to an apparatus for manufacturing a blanket, a method for manufacturing a blanket, a blanket manufactured using the same, a reverse offset printing roll provided with the blanket, and a reverse offset printing apparatus including the same. 110-. (canceled)11. A method for manufacturing a blanket comprising:1) supplying a substrate film to a surface plate;2) coating a blanket composition on the substrate film;3) adjusting a thickness of the coated blanket composition by horizontally moving a comma blade on the surface plate coated with the blanket composition; and4) manufacturing a blanket by drying or curing the blanket composition at room temperature,wherein, of the whole surface of the comma blade, the surface contacting the blanket composition is an angular surface.12. The method for manufacturing a blanket of claim 11 , further comprising removing dust on the substrate film prior to the step of 1).13. The method for manufacturing a blanket of claim 11 , wherein the step of 3) horizontally moves the comma blade so that a distance from an end of the comma blade closest from the surface plate to an upper surface of the surface plate remains constant.14. The method for manufacturing a blanket of claim 11 , wherein claim 11 , in the step of 1) claim 11 , the substrate film may closely contact the surface plate by applying vacuum negative pressure to the substrate film through a vacuum suction unit having any one or more of a hole structure claim 11 , a groove structure and a line structure formed on the surface of the surface plate.15. The method for manufacturing a blanket of claim 11 , wherein claim 11 , in the step of 1) claim 11 , the substrate film may closely contact the surface plate by applying tension to the substrate film through the substrate film supplying unit and the substrate film collecting unit.16. The method for manufacturing a blanket of claim 11 , wherein claim 11 , the blanket composition includes a siloxane- ...

TOUCH SCREEN AND MANUFACTURING METHOD THEREFOR

The present application relates to a touch screen and a method of manufacturing the same. A touch screen according to an exemplary embodiment of the present application includes: a driving electrode unit including a driving electrode pattern (Tx pattern) provided on a first substrate; and a sensing electrode unit including a sensing electrode pattern (Rx pattern) provided on a second substrate, in which the driving electrode pattern and the sensing electrode pattern include a conductive metal line, and a pitch of the driving electrode pattern is smaller than a pitch of the sensing electrode pattern. 1. A touch screen , comprising:a driving electrode unit including a driving electrode pattern (Tx pattern) provided on a first substrate; anda sensing electrode unit including a sensing electrode pattern (Rx pattern) provided on a second substrate,wherein the driving electrode pattern and the sensing electrode pattern include a conductive metal line, anda pitch of the driving electrode pattern is smaller than a pitch of the sensing electrode pattern.2. The touch screen of claim 1 , wherein the pitch of the sensing electrode pattern is 100 to 400 μm.3. The touch screen of claim 1 , wherein the pitch of the driving electrode pattern is 100 to 400 μm.4. The touch screen of claim 1 , wherein a variation of charges per unit area of the sensing electrode unit for touch sensing of a lower surface of the driving electrode unit is 40% or less.5. The touch screen of claim 1 , wherein a variation of charges per unit area of the sensing electrode unit for touch sensing of a lower surface of the driving electrode unit is 20% or less.6. The touch screen of claim 1 , further comprising:an optically clear adhesive (OCA) film between the driving electrode unit and the sensing electrode unit.7. The touch screen of claim 1 , wherein each of the driving electrode pattern and the sensing electrode pattern independently includes one or more selected from the group consisting of a metal claim ...

METHOD OF PREPARING LARGE-AREA, THREE-DIMENSIONAL GRAPHENE TRANSPARENT ELECTRODE USING ELECTROSPRAY PROCESS AND LARGE-AREA, THREE-DIMENSIONAL GRAPHENE TRANSPARENT ELECTRODE PREPARED THEREFROM

Provided are a method of preparing a large-area, three-dimensional graphene transparent electrode using an electrospray deposition method and a large-area, three-dimensional graphene transparent electrode prepared therefrom. More particularly, the present invention is related to a method of preparing a large-area, three-dimensional graphene transparent electrode using an electrospray deposition method, which may easily prepare a large-area graphene transparent electrode having high transparency and conductivity through an electrospray process and may obtain effects, which may not be realized in a two-dimensional transparent electrode prepared by a typical method such as CVD, due to a three-dimensional stack structure in which graphene is arranged perpendicular to a substrate, and a large-area, three-dimensional graphene transparent electrode prepared therefrom. 1. A method of preparing a large-area , three-dimensional graphene transparent electrode , the method comprising:respectively preparing a substrate, a conductive polymer solution, and a graphene solution;spraying the conductive polymer solution and the graphene solution on the substrate by an electrospray process using an electrospray apparatus including a nozzle; anddrying.2. The method of claim 1 , wherein graphene formed on the substrate is arranged perpendicular to the substrate.3. The method of claim 1 , wherein the substrate comprises one selected form the group consisting of single silicon claim 1 , p-Si (silicon) claim 1 , alkaline silicate-based glass claim 1 , alkali-free glass claim 1 , quartz glass claim 1 , a silicon substrate claim 1 , acrylate claim 1 , polycarbonate claim 1 , polyethylene naphthalate (PEN) claim 1 , polyethylene terephthalate (PET) claim 1 , polyamide claim 1 , and a combination thereof.4. The method of claim 1 , wherein the conductive polymer comprises one selected form the group consisting of polyaniline claim 1 , polypyrrole claim 1 , polyacetylene claim 1 , polythiophene ...

TOUCHSCREEN AND METHOD FOR MANUFACTURING SAME

The present application relates to a touch screen and a method for preparing the same, and the touch screen according to the present application comprises a screen part and a non-screen part, in which the non-screen part comprises a router part, a flexible printed circuit board (FPCB) part, a first pad part connecting the screen part and the router part, a second pad part connecting the router part and the flexible printed circuit board part, and a decoration part, the screen part comprises a first conductive pattern, the router part, the first pad part, and the second pad part each comprise a second conductive pattern, and the decoration part comprises a third conductive pattern, and a darkened pattern or a color pattern provided on at least one surface of the third conductive pattern and provided in a region corresponding to the third conductive pattern. 1. A touch screen comprising:a screen part; anda non-screen part,wherein the non-screen part comprises a router part, a flexible printed circuit board (FPCB) part, a first pad part connecting the screen part and the router part, a second pad part connecting the router part and the flexible printed circuit board part, and a decoration part,the screen part comprises a first conductive pattern,the router part, the first pad part, and the second pad part each comprise a second conductive pattern, andthe decoration part comprises a third conductive pattern, and a darkened pattern or a color pattern provided on at least one surface of the third conductive pattern and provided on a region corresponding to the third conductive pattern.2. The touch screen of claim 1 , wherein the router part claim 1 , the first pad part claim 1 , the second pad part claim 1 , and the decoration part each independently additionally comprise a dummy pattern.3. The touch screen of claim 1 , wherein the first conductive pattern claim 1 , the second conductive pattern claim 1 , and the third conductive pattern have the same line height.4. The ...

Method for Preparing Superabsorbent Polymer and Superabsorbent Polymer Prepared Thereby

The present invention relates to a method for preparing a superabsorbent polymer that progresses dry mixing of fine powders and a specific powder type of polymer binder when reassembling fine powders generated during the preparation process of a superabsorbent polymer, and thus obviates the necessity for a moisture drying process after reassembling fine powders, thereby reducing thermal losses, improving productivity, and obtaining a superabsorbent polymer having excellent basic absorption properties, and a superabsorbent polymer prepared by the method. 1. A method for preparing a superabsorbent polymer , comprising:conducting crosslinking polymerization of water soluble ethylenically unsaturated monomers having acid groups of which at least a part are neutralized, in the presence of an internal crosslinking agent, to form a hydrogel polymer comprising a first crosslinked polymer;gel grinding the hydrogel polymer to form a gel ground hydrogel polymer;drying the gel ground hydrogel polymer, and grinding and sieving the dried hydrogel polymer to form base polymer powders; andheat treating the base polymer powders to progress surface crosslinking, in the presence of a surface crosslinking agent,wherein the method further comprises:recovering fine powders, after sieving the dried hydrogel polymer;reassembling the fine powders in the presence of a powder type of polymer binder to provide reassembled fine powders; andmixing the reassembled fine powders with the hydrogel polymer before drying.2. The method for preparing a superabsorbent polymer according to claim 1 , wherein as the powder type of polymer binder comprises polyethylene oxide powders having a weight average molecular weight of 100 claim 1 ,000 to 600 claim 1 ,000 g/mol.3. The method for preparing a superabsorbent polymer according to claim 1 , wherein the fine powders have an average particle diameter less than 150 JIM and wherein providing the reassembled fine powders comprises dry mixing the fine powders ...

FILM MASK, METHOD FOR MANUFACTURING SAME, AND METHOD FOR FORMING PATTERN USING FILM MASK

The present application relates to a film mask including: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and a release force enhancement layer provided on the darkened light-shielding pattern layer and having surface energy of 30 dynes/cm or less, a method for manufacturing the same, and a method for forming a pattern using the film mask. 1. A film mask comprising:a transparent substrate;a darkened light-shielding pattern layer provided on the transparent substrate; anda release force enhancement layer provided on the darkened light-shielding pattern layer and having surface energy of 30 dynes/cm or less.2. The film mask of claim 1 , wherein the darkened light-shielding pattern layer has a reflectance of about 30% or less in a UV region range.3. The film mask of claim 1 , wherein the darkened light-shielding pattern layer is composed of at least one of a black matrix material claim 1 , a carbon black-based material claim 1 , a resin mixed with a dye claim 1 , and AlOxNy (0≤x≤1.5 claim 1 , 0≤y≤1 claim 1 , and x and y are a ratio of O atoms and N atoms to one Al atom claim 1 , respectively).4. The film mask of claim 1 , further comprising:a metal layer provided between the transparent substrate and the darkened light-shielding pattern layer.5. The film mask of claim 1 , wherein a metal layer is provided between the transparent substrate and the darkened light-shielding pattern layer claim 1 , the film mask includes two or more regions of the metal layer where the thicknesses are different from each other or two or more regions of the darkened light-shielding pattern layer where the thicknesses are different from each other claim 1 , or the film mask includes a region where a metal layer is provided between the transparent substrate and the darkened light-shielding pattern layer and a region where the transparent substrate and the darkened light-shielding pattern layer are brought into direct contact with each ...

TOUCH SCREEN SENSOR

The present application relates to a touch screen sensor. A touch screen sensor according to an exemplary embodiment of the present application includes a driving electrode unit including a driving electrode pattern (Tx pattern) provided on a first base substrate; and a sensitive electrode unit including a sensitive electrode pattern (Rx pattern) provided on a second base substrate, in which the driving electrode pattern and the sensitive electrode pattern include conductive metal lines and the touch screen sensor includes at least one touch non-sensing area and at least one touch sensing area. 1. A touch screen sensor , comprising:a driving electrode unit including a driving electrode pattern (Tx pattern) provided on a first base substrate; anda sensitive electrode unit including a sensitive electrode pattern (Rx pattern) provided on a second base substrate,wherein the driving electrode pattern and the sensitive electrode pattern include conductive metal lines and the touch screen sensor includes at least one touch non-sensing area and at least one touch sensing area.2. The touch screen sensor of claim 1 , further comprising:an FPCB which electrically connects the driving electrode unit and the sensitive electrode unit to an external power source,wherein the driving electrode pattern and the sensitive electrode pattern are provided in entire areas of the touch non-sensing area and the touch sensing area, respectively,the driving electrode pattern and the sensitive electrode pattern provided in the touch sensing area are electrically connected to the FPCB independently, andthe driving electrode pattern which is provided in the touch non-sensing area is not electrically connected to the FPCB.3. The touch screen sensor of claim 2 , wherein the driving electrode pattern and the sensitive electrode pattern which are provided in the touch non-sensing area further independently include a disconnection area which disconnects electrical connection in the pattern.4. The ...

CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

An exemplary embodiment of the present invention comprises: 1) forming a crystalline transparent conducting layer on a substrate; 2) forming an amorphous transparent conducting layer on the crystalline transparent conducting layer; 3) forming at least one pattern open region so as to expose a part of the crystalline transparent conducting layer by patterning the amorphous transparent conducting layer; and 4) forming a metal layer in the at least one pattern open region. 1. A method for preparing a conducting substrate , the method comprising:1) forming a crystalline transparent conducting layer on a substrate;2) forming an amorphous transparent conducting layer on the crystalline transparent conducting layer;3) forming at least one pattern open region so as to expose a part of the crystalline transparent conducting layer by patterning the amorphous transparent conducting layer; and4) forming a metal layer in the at least one pattern open region.2. The method of claim 1 , wherein step 1) is performed by a method of forming the amorphous transparent conducting layer on the substrate and thereafter claim 1 , heat-treating the amorphous transparent conducting layer.3. The method of claim 1 , wherein step 1) is performed by a method of high-temperature depositing a material for a transparent conducting layer on the substrate.4. (canceled)5. The method of claim 1 , wherein patterning of the amorphous transparent conducting layer is performed by a photolithography method.6. The method of claim 1 , wherein the amorphous transparent conducting layer is patterned by using an etching solution claim 1 , andonly the amorphous transparent conducting layer is selectively patterned by a difference in solubility between the amorphous transparent conducting layer and the crystalline transparent conducting layer to the etching solution.7. The method of claim 6 , wherein the etching solution comprises an oxalic acid based material.8. (canceled)9. The method of claim 1 , wherein the ...

Film mask, method for manufacturing same, and method for forming pattern using film mask and pattern formed thereby

The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and groove portions provided in a region where the darkened light-shielding pattern layer is not provided, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern manufactured by using the same.

FILM MASK, METHOD FOR MANUFACTURING SAME, AND METHOD FOR FORMING PATTERN USING FILM MASK AND PATTERN FORMED THEREBY

The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and an embossed pattern part provided on a surface of the transparent substrate, which is provided with the darkened light-shielding pattern layer, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern formed by using the same. 1. A film mask comprising:a transparent substrate;a darkened light-shielding pattern layer provided on the transparent substrate; andan embossed pattern part provided on a surface of the transparent substrate, which is provided with the darkened light-shielding pattern layer.2. The film mask of claim 1 , wherein the embossed pattern part comprises two or more embossed patterns formed at a predetermined gap.3. The film mask of claim 1 , wherein the embossed pattern part comprises two or more embossed patterns having the same thickness and formed at a predetermined gap.4. The film mask of claim 1 , wherein the darkened light-shielding pattern layer has a reflectance of about 30% or less in a UV region.5. The film mask of claim 1 , further comprising:a metal layer provided between the transparent substrate and the darkened light-shielding pattern layer.6. The film mask of claim 1 , wherein a metal layer provided between the transparent substrate and the darkened light-shielding pattern layer is provided claim 1 , the film mask comprises two or more regions of the metal layer where the thicknesses are different from each other or two or more regions of the darkened light-shielding pattern layer where the thicknesses are different from each other claim 1 , or the film mask comprises a region where a metal layer is provided between the transparent substrate and the darkened light-shielding pattern layer and a region where the transparent substrate and the darkened light-shielding pattern layer are brought into direct contact with each other. ...

TOUCH SENSOR AND METHOD FOR MANUFACTURING SAME

The present application relates to a touch sensor and a method for preparing the same, and the touch sensor according to the present application includes: a substrate; and a driving electrode part, a sensing electrode part, and a wiring electrode part, which are provided on the same surface of the substrate, in which the driving electrode part, the sensing electrode part, and the wiring electrode part each include a conductive pattern including a shielding part and an opening. 2. A touch sensor comprising:a substrate; anda driving electrode part, a sensing electrode part, and a wiring electrode part, which are provided on the same surface of the substrate,wherein the driving electrode part, the sensing electrode part, and the wiring electrode part comprise a conductive pattern comprising a shielding part and an opening,the wiring electrode part comprises a first wiring electrode part disposed at a touch sensing region of the touch sensor and a second wiring electrode part disposed at a touch non-sensing region of the touch sensor, and the first wiring electrode part comprises one or two or more bundles of wirings which connect the driving electrode part or the sensing electrode part to the second wiring electrode part,the bundle is composed of a form of pattern in which closed figures having two disconnection points are consecutively disposed in a direction from one side of the substrate, which is adjacent to an end of the second wiring electrode part, to the other side of the substrate facing the one side,a virtual straight line connecting the adjacent disconnection points of the consecutively disposed closed figures as the shortest distance has one or more inflection points, and an angle which the virtual straight line forms at the inflection point is 90° or more, anda pattern tangent to the virtual straight line electrically connects the driving electrode part or the sensing electrode part to the second wiring electrode part.4. The touch sensor of claim 1 , ...

CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

An exemplary embodiment of the present invention comprises: 1) forming a crystalline transparent conducting layer on a substrate; 2) forming an amorphous transparent conducting layer on the crystalline transparent conducting layer; 3) forming at least one pattern open region so as to expose a part of the crystalline transparent conducting layer by patterning the amorphous transparent conducting layer; and 4) forming a metal layer in the at least one pattern open region. 1. A method for preparing a conducting substrate , the method comprising:1) forming a crystalline transparent conducting layer on a substrate;2) forming an amorphous transparent conducting layer on the crystalline transparent conducting layer;3) forming at least one pattern open region so as to expose a part of the crystalline transparent conducting layer by patterning the amorphous transparent conducting layer; and4) forming a metal layer in the at least one pattern open region.2. The method of claim 1 , wherein step 1) is performed by a method of forming the amorphous transparent conducting layer on the substrate and thereafter claim 1 , heat-treating the amorphous transparent conducting layer.3. The method of claim 1 , wherein step 1) is performed by a method of high-temperature depositing a material for a transparent conducting layer on the substrate.4. The method of claim 1 , wherein the crystalline transparent conducting layer and the amorphous transparent conducting layer comprise one or more selected from the group consisting of indium oxide claim 1 , zinc oxide claim 1 , indium tin oxide claim 1 , indium zinc oxide claim 1 , and a transparent conducting polymer.5. The method of claim 1 , wherein patterning of the amorphous transparent conducting layer is performed by a photolithography method.6. The method of claim 1 , wherein the amorphous transparent conducting layer is patterned by using an etching solution claim 1 , andonly the amorphous transparent conducting layer is selectively ...

Heating element and manufacturing method thereof

Provided are a heating element, which includes: a transparent substance; a conductive heating line that is provided on at least one side of the transparent substance; bus bars that is electrically connected to the conductive heating line; and a power portion that is connected to the bus bars, wherein 30% or more of the entire area of the transparent substance has a conductive heating line pattern in which, when the straight line that intersects the conductive heating line is drawn, a ratio (distance distribution ratio) of standard deviation in respects to an average value of distances between adjacent intersection points of the straight line and the conductive heating line is 5% or more, and a method for manufacturing the same.

Conductive substrate comprising conductive pattern and touch panel comprising same

The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate according to the present invention comprises: a transparent substrate, and a conductive pattern comprising a conductive line provided on the transparent substrate, wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less. The conductive substrate according to the present invention can more efficiently conceal a metal line comprised in the conductive pattern.

Touchscreen and method for manufacturing same

The present application relates to a touch screen and a method for preparing the same, and the touch screen according to the present application comprises a screen part and a non-screen part, in which the non-screen part comprises a router part, a flexible printed circuit board (FPCB) part, a first pad part connecting the screen part and the router part, a second pad part connecting the router part and the flexible printed circuit board part, and a decoration part, the screen part comprises a first conductive pattern, the router part, the first pad part, and the second pad part each comprise a second conductive pattern, and the decoration part comprises a third conductive pattern, and a darkened pattern or a color pattern provided on at least one surface of the third conductive pattern and provided in a region corresponding to the third conductive pattern.

Novel dioxoloisoquinolinone derivatives and use thereof

The present invention relates to novel dioxoisoquinolinone derivative compounds and use thereof. More specifically, the present invention relates to novel dioxoisoquinolinone derivative compounds with inhibition activity of EZH1(Enhancer of zeste homolog 1) and/or EZH2(Enhancer of zeste homolog 2) activity, a pharmaceutically acceptable salt thereof, and/or pharmaceutical compositions comprising the same.

Method for manufacturing insulated conductive pattern and laminate

The present invention provides: a method for manufacturing an insulated conductive pattern, wherein a conductive film and an insulation layer pattern are formed on a substrate, and the insulation layer pattern is reformed to cover a conductive pattern after formation of the conductive pattern by etching the conductive film using the insulation layer pattern as a mask; and a laminate manufactured thereby. According to the present invention, the number of processes is sharply reduced in comparison with the existing processes, and economic efficiency can be greatly improved.

Method of manufacturing a double side conductive film

Conducting substrate and touch screen comprising the same