FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD

In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.

Semiconductor systems having dual leadframes

A dual leadframe (100) for semiconductor systems comprising a first leadframe (110) having first metal zones separated by first gaps, the first zones including portions of reduced thickness and joint provisions in selected first locations, and further a second leadframe (120) having second metal zones separated by second gaps, the second zones including portions of reduced thickness and joint provisions (150) in selected second locations matching the first locations. The second leadframe is stacked on top of the first leadframe and the joint provisions of the matching second and first locations linked together. The resulting dual leadframe may further include insulating material (140) filling the first and second gaps and the zone portions of reduced thickness, and has insulating surfaces coplanar with the top and bottom metallic surfaces.

Semiconductor Systems Having Premolded Dual Leadframes

A dual leadframe () for semiconductor systems comprising a first leadframe () having first metal zones separated by first gaps, the first zones including portions of reduced thickness and joint provisions in selected first locations, and further a second leadframe () having second metal zones separated by second gaps, the second zones including portions of reduced thickness and joint provisions () in selected second locations matching the first locations. The second leadframe is stacked on top of the first leadframe and the joint provisions of the matching second and first locations linked together. The resulting dual leadframe may further include insulating material () filling the first and second gaps and the zone portions of reduced thickness, and has insulating surfaces coplanar with the top and bottom metallic surfaces. 1. A dual leadframe for semiconductor systems comprising:a first leadframe of first thickness having first metal zones separated by first gaps, the first zones including portions of the first thickness and portions of a second thickness smaller than the first thickness, the first thickness portions including joint provisions in selected first locations;a second leadframe of third thickness having second metal zones separated by second gaps, the second zones including portions of the third thickness and portions of a fourth thickness smaller than the third thickness, the third thickness portions including joint provisions in selected second locations matching the first locations,wherein the second leadframe is stacked on top of the first leadframe and the joint provisions of the matching second and first locations linked together, the resulting dual leadframe having:a top surface;a bottom surface; anda thickness equal to the sum of the first and third thicknesses.2. The dual leadframe of wherein the first thickness is equal to the third thickness.3. The dual leadframe of wherein the first thickness is greater than the third thickness.4. The dual ...

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

A described example includes: a MEMS component on a device side surface of a first semiconductor substrate; a second semiconductor substrate bonded to the device side surface of the first semiconductor substrate by a first seal patterned to form sidewalls that surround the MEMS component; a third semiconductor substrate having a second seal extending from a surface and bonded to the backside surface of the first semiconductor substrate by the second seal, the second seal forming sidewalls of a gap beneath the MEMS component. A trench extends through the first semiconductor substrate and at least partially surrounds the MEMS component. The third semiconductor substrate is mounted on a package substrate. A bond wire or ribbon bond couples the bond pad to a conductive lead on the package substrate; and mold compound covers the MEMS component, the bond wire, and a portion of the package substrate.

Semiconductor device package with thermal pad

A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package

The techniques of the present invention are directed towards setting a photonic device into a groove of a substrate, which is then attached to the chip sub-assembly in a way that the resulting optoelectronic package has a low profile and the interconnects between the photonic device and the semiconductor chip are short. The technique involves partially etching a groove in a substrate to allow for positioning of a photonic device within the groove. The photonic device is connected to the chip sub-assembly through interconnects that extend through the thickness of the substrate. The photonic devices are placed on their sides so that the active facets are perpendicular to the main axis of the chip sub-assembly. In this configuration, the optical fibers can be positioned parallel to the CSA top surface, ensuring a low module profile in the process.

Bump bond structure for enhanced electromigration performance

A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.

Integrated circuit device package having a support coating for improved reliability during temperature cycling

An apparatus and method for increasing integrated circuit device package reliability is disclosed. According to one embodiment of the present invention, a support coating is added to a wafer after solder bumps have been added but prior to dicing. This support coating or underfill layer provides added strength to the eventual reflowed solder connections, such that the operational lifetime of these connections is increased with respect to failure due to temperature cycling.

High strength solder joint formation method for wafer level packages and flip applications

A Micro SMDxt package is provided that configured for mounting to a circuit board. The SMDxt package includes a silicon-based IC having an array of contact pads on one side of thereof, and a die electrically attached to the silicon-based IC. A plurality of solder balls is included, each of which has a polymeric core surrounded by a metallic shell that in turn is surrounded by a layer of solder material. Further, each solder ball is positioned in contact with a corresponding contact pad of the package. An intertwined intermetallic fusion layer is formed through the fusion between material components of the contact pads and the solder material, via heat treatment. The intermetallic fusion extends between and from an outer surface of the metallic shell of each solder to an outer surface of a corresponding contact pad to form a high strength intermetallic solder joint therebetween.

I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES

A semiconductor device is described. The device includes an integrated circuit die having an active surface that includes a plurality of input/output (I/O) pads. The device further includes a plurality of crack resistant structures. Each crack resistant structure is formed over an associated I/O pad and includes an associated raised portion. Each I/O pad may be bumped with solder such that a solder bump is formed over the associated crack resistant structure on the I/O pad.

Methods and arrangements for forming solder joint connections

The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

In a described example, an apparatus includes: a first semiconductor die with a component on a first surface; a second semiconductor die mounted on a package substrate and having a third surface facing away from the package substrate; a solder seal bonded to and extending from the first surface of the first semiconductor die flip chip mounted to the third surface of the second semiconductor die, the solder seal at least partially surrounding the stress sensitive component; a first solder joint formed between the solder seal and the third surface of the second semiconductor die; a second solder joint formed between solder at an end of the post connect and the third surface of the second semiconductor die; and a mold compound covering the second surface of the first semiconductor die, a portion of the second semiconductor die, and an outside periphery of the solder seal.

Semiconductor Systems Having Premolded Dual Leadframes

A dual leadframe () for semiconductor systems comprising a first leadframe () having first metal zones separated by first gaps, the first zones including portions of reduced thickness and joint provisions in selected first locations, and further a second leadframe () having second metal zones separated by second gaps, the second zones including portions of reduced thickness and joint provisions () in selected second locations matching the first locations. The second leadframe is stacked on top of the first leadframe and the joint provisions of the matching second and first locations linked together. The resulting dual leadframe may further include insulating material () filling the first and second gaps and the zone portions of reduced thickness, and has insulating surfaces coplanar with the top and bottom metallic surfaces. 121-. (canceled)22. A semiconductor system comprising:a molded dual leadframe having a surface with coplanar metallic and insulating regions, the dual leadframe including a first leadframe formed below and linked with a second leadframe, the first leadframe including zones of a first metal thickness and zones of a second metal thickness smaller than the first thickness, and the second leadframe including zones of a third metal thickness and zones of a fourth metal thickness smaller than the third thickness;a first active semiconductor chip flip-attached to metallic regions of the surface; anda passive electronic component conductively attached to metallic regions of the surface.23. The system of wherein the dual leadframe includes locations having a space volume formed between a metal zone of second thickness aligned with a metal zone of fourth thickness claim 22 , the space volume suitable to house a second active semiconductor chip.24. The system of claim 23 , wherein the first and the second active semiconductor chips are the transistors and integrated circuits of a power supply converter claim 23 , and the passive component is an inductor ...

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

Integrated circuit backside metallization

A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

PRE-PLATED LEAD TIP FOR WETTABLE FLANK LEADFRAME

A method for making a semiconductor device is provided. The method generally includes forming a package having a first plurality of leads extending from a first side of the package, the package disposed on a leadframe. The method generally includes making a first cut adjacent to a first side of a first lead of the first plurality of leads, the first side extending from the first side of the package. The method generally includes making a second cut adjacent to a second side of the first lead of the first plurality of the lead, the second side of the lead opposite the first side of the lead and extending from the first side of the package.

Open cavity package using chip-embedding technology

A method for fabricating packaged semiconductor devices (100) with an open cavity (110a) in panel format; placing (process 201) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad (230) and symmetrically placed vertical pillars (231); attaching (process 202) semiconductor chips (101) with sensor systems face-down onto the tape; laminating (process 203) and thinning (process 204) low CTE insulating material (234) to fill gaps between chips and grid; turning over (process 205) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process 206) uniform metal layer across assembly and optionally plating (process 209) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process 212) insulating stiffener across panel; opening (process 213) cavities in stiffener to access the sensor system; and singulating (process 214) packaged devices by cutting metallic pieces.

Integrated circuit backside metallization

A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

Conductive paths for transmitting an electrical signal through an electrical connector

The claimed invention relates to structures suitable for improving the performance and reliability of electrical connectors. One embodiment of the claimed invention includes an integrated circuit die having an electrical contact coupled with electrically conductive paths that share a common electrical source. The conductive paths are configured to transmit the same electrical signal to the electrical contact, which supports an electrical connector, such as a solder bump. The electrical connector couples the die with an outside component, such as a circuit board. Each of the conductive paths connect to the electrical contact at different interface locations. When the electrical signal passes through the interface locations, the paths are configured to have non-zero current densities at those locations. The electrical resistance of the conductive paths may be substantially similar. Thus, instead of being concentrated at a single point, current is more evenly distributed along the junction ...

High strength solder joint formation method for wafer level packages and flip applications

A Micro SMDxt package is provided that configured for mounting to a circuit board. The SMDxt package includes a silicon-based IC having an array of contact pads on one side of thereof, and a die electrically attached to the silicon-based IC. A plurality of solder balls is included, each of which has a polymeric core surrounded by a metallic shell that in turn is surrounded by a layer of solder material. Further, each solder ball is positioned in contact with a corresponding contact pad of the package. An intertwined intermetallic fusion layer is formed through the fusion between material components of the contact pads and the solder material, via heat treatment. The intermetallic fusion extends between and from an outer surface of the metallic shell of each solder to an outer surface of a corresponding contact pad to form a high strength intermetallic solder joint therebetween.

Clamping device for lifting slab, panel or sheet material

Clamping device suitable for lifting and handling of sheet like-objects, having a rigid frame with a fixed jaw that provides a first clamping surface, a movable jaw that provides a second clamping surface that is substantially parallel to the first clamping surface, the movable jaw being supported at the frame for reciprocating, linear movement towards and away from the fixed jaw, and an operating mechanism arranged to bias the movable jaw towards the fixed jaw in response to an actuating force being exerted on a tensile force transmitting member of the operating mechanism, thereby to abut the respective clamping surfaces onto opposite faces of an object received between the jaws and frictionally clamping same against displacement, characterised in that the movable jaw comprises a clamping plate on which the second clamping surface is provided, the clamping plate being inclined at an angle of about 8 to 12 degrees with respect to the first and second clamping surfaces and being supported ...

Foil-based method for packaging intergrated circuits

One aspect of the present invention involves a foil-based method for packaging integrated circuits. Initially, a metallic foil and a photoresist layer are attached with a carrier. The photoresist layer is exposed and patterned. Afterward, multiple integrated circuit dice are connected to the foil. The dice and portions of the foil are encapsulated in a molding material. The foil is then etched based on the patterned photoresist layer to define multiple device areas in the foil, where each device area supports at least one of the integrated circuit dice. Some aspects of the present invention relate to panel arrangements that are involved in the aforementioned method.

PRINTED REPASSIVATION FOR WAFER CHIP SCALE PACKAGING

Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure. 1. A method , comprising:forming a conductive seed layer at least partially above a conductive feature of a wafer;forming a conductive structure on at least a portion of the conductive seed layer;performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure;curing the deposited polymer material; andattaching a solder ball structure to a side of the conductive structure.2. The method of claim 1 , wherein performing the printing process includes performing multiple printing passes to deposit multiple layers of the polymer material proximate the side of the conductive structure.3. The method of claim 2 , wherein curing the deposited polymer material includes:heating the wafer while performing the printing process to at least partially cure the polymer material.4. The method of claim 3 , wherein curing the deposited polymer material further includes:after performing the printing process, performing a final curing process that thermally cures the polymer material.5. The method of claim 2 , wherein curing the deposited polymer material includes:exposing the polymer material to ultraviolet light while performing the printing process to at least partially cure the polymer material.6. The method of claim 5 , wherein curing the deposited polymer material further includes:after performing the printing process, performing a final curing process that UV cures the polymer material.7. The method of claim 1 , further comprising:after ...

Flip chip packaged devices with thermal pad

In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.

Metal ribs in electromechanical devices

In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

THIN FOIL SEMICONDUCTOR PACKAGE

One aspect of the present invention involves a foil-based method for packaging integrated circuits. Initially, a metallic foil and a photoresist layer are attached with a carrier. The photoresist layer is exposed and patterned. Afterward, multiple integrated circuit dice are connected to the foil. The dice and portions of the foil are encapsulated in a molding material. The foil is then etched based on the patterned photoresist layer to define multiple device areas in the foil, where each device area supports at least one of the integrated circuit dice. Some aspects of the present invention relate to panel arrangements that are involved in the aforementioned method. 1. A method for packaging integrated circuits , comprising:attaching a metallic foil and a photoresist layer with a carrier;exposing and patterning the photoresist layer;after the exposing and patterning of the photoresist layer, electrically connecting a multiplicity of integrated circuit dice to the foil;encapsulating the dice and the foil in a molding material; andafter the encapsulating of the dice and the foil, etching the foil based on the patterned photoresist layer to define a multiplicity of device areas, wherein each device includes at least one of the dice.2. A method as recited in claim 1 , wherein the dice are wirebonded directly to the metallic foil without using an intermediate adhesion layer.3. A method as recited in claim 1 , further comprising:after patterning the photoresist layer and before the connecting of the dice to the foil, drilling alignment holes in the foil to help align dice with the foil.4. A method as recited in claim 1 , wherein there are a plurality of openings in the carrier that penetrate entirely through the carrier.5. A method as recited in claim 1 , wherein the metallic foil and the photoresist layer are positioned on the carrier such that the photoresist layer is sandwiched between the carrier and the metallic foil.6. A method as recited in claim 5 , further ...

OPEN CAVITY PACKAGE USING CHIP-EMBEDDING TECHNOLOGY

A method for fabricating packaged semiconductor devices () with an open cavity () in panel format; placing (process ) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad () and symmetrically placed vertical pillars (); attaching (process ) semiconductor chips () with sensor systems face-down onto the tape; laminating (process ) and thinning (process ) low CTE insulating material () to fill gaps between chips and grid; turning over (process ) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process ) uniform metal layer across assembly and optionally plating (process ) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process ) insulating stiffener across panel; opening (process ) cavities in stiffener to access the sensor system; and singulating (process ) packaged devices by cutting metallic pieces. 1. A method for fabricating packaged semiconductor devices comprising:providing semiconductor chips, each semiconductor chip having a first height and a first surface including a sensor system, terminals, and sidewalls;providing metallic pieces, having a second height greater than the first height, each metallic piece comprising a flat pad having vertical pillars on the flat pad positioned symmetrically relative to a center of the flat pad a flat pad surface opposite the vertical pillars being solderable;placing the vertical pillars on an adhesive carrier tape to form a grid of metallic pieces, the metallic pieces spaced by openings;placing each semiconductor chip inside each opening, each semiconductor chip having the sensor system and the terminals facing downward and the sidewalls spaced by gaps from a sidewall of an adjacent metallic piece;laminating, using an insulating polymer to fill the gaps between each semiconductor chip and the sidewall of the adjacent metallic piece, and to cover a second surface of the semiconductor chip facing away from the ...

Semiconductor systems having premolded dual leadframes

A dual leadframe (100) for semiconductor systems comprising a first leadframe (110) having first metal zones separated by first gaps, the first zones including portions of reduced thickness and joint provisions in selected first locations, and further a second leadframe (120) having second metal zones separated by second gaps, the second zones including portions of reduced thickness and joint provisions (150) in selected second locations matching the first locations. The second leadframe is stacked on top of the first leadframe and the joint provisions of the matching second and first locations linked together. The resulting dual leadframe may further include insulating material (140) filling the first and second gaps and the zone portions of reduced thickness, and has insulating surfaces coplanar with the top and bottom metallic surfaces.

Printed repassivation for wafer chip scale packaging

Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure.

SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD

An electronic device includes a die attach pad, a semiconductor die, a lead, a package structure, and tie bars, where the die attach pad has opposite first and second sides, the semiconductor die is attached to the second side of the die attach pad, the lead has a first portion connected to a circuit of the semiconductor die by a bond wire, the package structure exposes a portion of the first side of the die attach pad and the second portion of the lead. Four tie bars extend outward from the die attach pad and the tie bars have respective ends exposed outside the package structure.

REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE

In described examples, a method of printing repassivation onto a substrate includes depositing an ink comprising particles of a repassivation material onto specified locations on a surface of the substrate using an inkjet printer, and curing the repassivation material. The ink is deposited so that specified portions of the substrate surface are not covered by the ink

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.

OILFIELD MATERIAL METERING GATE OBSTRUCTION REMOVAL SYSTEM

A system is disclosed. The system is provided with an oilfield material reservoir, a fluid nozzle, and a fluid supplier. The oilfield material reservoir is provided with an opening for receiving an oilfield material and an orifice for discharging the oilfield material. The fluid nozzle is positioned adjacent to the orifice to direct a fluid flow through the orifice, and the fluid supplier is connected to the fluid nozzle. 1. A system , comprisingan oilfield material reservoir having an opening for receiving an oilfield material and an orifice for discharging the oilfield material;a fluid nozzle positioned adjacent the orifice to direct a fluid flow through the orifice; anda fluid supplier connected to the fluid nozzle.2. The system of claim 1 , wherein the fluid nozzle comprises a solid member claim 1 , said solid member comprises:a through hole configured therein to define a first inlet on a first end and a second inlet on a second end; anda slot configured around a central portion of the solid member and intersecting with the through hole.3. The system of claim 2 , wherein the fluid nozzle is mounted to the oilfield material reservoir in such a manner that the slot of the fluid nozzle corresponds to an opening formed within the oilfield material reservoir.4. The system of claim 2 , wherein the fluid supplier is connected to both the first inlet and the second inlet of the fluid nozzle.5. The system of claim 4 , wherein an electromechanical control valve is disposed between the fluid supplier and each of the first inlet and the second inlet of the fluid nozzle.6. The system of claim 1 , further comprising an automatic control unit that regulates at least one parameter of a fluid flow through the fluid nozzle.7. The system of claim 6 , wherein said at least one parameter is selected from a group consisting of fluid duration claim 6 , fluid frequency claim 6 , and fluid directional sequencing.8. The system of claim 6 , wherein the automatic control unit is a computer ...

Low profile package and method

In a method aspect, a multiplicity of ICs are attached to routing on a structurally supportive carrier (such as a wafer). The dice are encapsulated and then both the dice and the encapsulant layer are thinned with the carrier in place. A second routing layer is formed over the first encapsulant layer and conductive vias are provided to electrically couple the first and second routing layers as desired. External I/O contacts (e.g. solder bumps) are provided to facilitate electrical connection of the second routing layer (or a subsequent routing layer in stacked packages) to external devices. A contact encapsulant layer is then formed over the first encapsulant layer and the second routing layer in a manner that embeds the external I/O contacts at least partially therein. After the contact encapsulant layer has been formed, the carrier itself may be thinned significantly and singulated to provide a number of very low profile packages. The described approach can also be used to form stacked multi-chip packages.

SYSTEM AND METHOD FOR DELIVERY OF OILFIELD MATERIALS

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner. 1. A mobile support structure for supporting at least one modular silo , the mobile support structure comprising:a support base having a first end and a second end, a top surface and a bottom surface, a first side and a second side;a frame structure connected to the support base, the frame structure extending above the support base to define a passage between the deck and the frame structure, the frame structure having at least one silo receiving region sized and configured to receive at least one modular silo;a first expandable base on the first side of the support base; anda second expandable base on the second side of the support base.2. The mobile support structure of claim 1 , wherein the first expandable base and the second expandable base are movable to a support position wherein the support base claim 1 , the first expandable base and the second expandable base are configured to provide vertical and lateral support to the at least one modular silo.3. The mobile support structure of claim 2 , further comprising a first set of moveable joints connecting the first expandable base to at least one of the frame structure and the support base claim 2 , and a second set of moveable joints connecting the second expandable base to at least one of the frame structure and the support base.4. The mobile support structure of claim 1 , further comprising a first actuator connected to the ...

SYSTEM AND METHOD FOR DELIVERY OF OILFIELD MATERIALS

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner. 1. A system for handling an oilfield material , comprising:a silo formed as a modular unit with a hollow interior to hold oilfield material, the silo having a first silo connection;a support structure separate from the silo and the trailer, the support structure having a silo receiving region for securing the silo in a vertical orientation, the support structure comprising a first support connection by which the first silo connection may be selectively engaged with the support structure while the silo is in a lateral position and to maintain engagement while the silo is erected to the vertical orientation into the silo receiving region2. The system as recited in claim 1 , wherein the support structure comprises a load cell configured to receive a force from the silo to monitor the amount of oilfield material in the silo.3. The system as recited in claim 1 , further comprising a trailer supporting the silo in a lateral position;4. The system as recited in claim 1 , wherein the support structure comprises a plurality of expandable bases to stabilize the silo.5. The system as recited in claim 4 , wherein each expandable base is slidably mounted for lateral extension.6. The system as recited in claim 4 , wherein each expandable base is hingedly connected to the support structure.7. The system as recited in claim 1 , wherein the support structure comprises a support frame integrated into a ...

SYSTEM AND METHOD FOR DELIVERY OF OILFIELD MATERIALS

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner. 1. A method for handling oilfield material , comprising:transporting a silo in a first orientation to a desired location;transporting at least one support structure to the desired location separate from the silo, the at least one support structure having at least one connection for selective engagement with the silo;coupling the silo to the at least one connection of the at least one support structure; anderecting the silo to a second orientation.2. The method of claim 1 , further comprising at least partially filling the silo with the oilfield material.3. The method of claim 1 , wherein transporting the support structure to the desired location further comprises positioning the support structure on a mat system.4. The method of claim 1 , wherein transporting the support structure to the desired location further comprises transporting a trailer integrated with the support structure.5. The method of claim 1 , further comprising positioning a blender below the silo.6. The method of claim 1 , further comprising transferring oilfield material from the silo directly into the blender via gravity.7. The method of claim 1 , wherein the oilfield material is selected from a group consisting of: proppant claim 1 , fiber claim 1 , guar claim 1 , fluid claim 1 , and gel.8. The method of claim 1 , further comprising moving the silo from the second orientation to the first orientation claim 1 , and ...

System and method for delivery of oilfield materials

A system and methodology facilitates the handling of oilfield materials in a space efficient manner. The oilfield materials are delivered without blowers to at least one modular silo. Each modular silo comprises an outer housing defining an enclosed interior. A vertical conveyor is positioned within the enclosed interior and is used to lift the oilfield material from a silo inlet to an upper portion of the modular silo without utilizing airflow to carry the oilfield materials. Once the oilfield materials are disposed within the upright modular silo, the outflow of oilfield materials through a silo outlet may be controlled so as to selectively release the desired amount of material into a blender or other suitable equipment.

PROPPANT MIXING AND METERING SYSTEM

An oilfield material reservoir is disclosed. The oilfield material reservoir has a body, the body having an upper end, a lower end, a sidewall extending between the upper and lower ends, the sidewall defining a recess within the body, an opening defined by the upper end, and a first orifice defined by the lower end. The oilfield material reservoir is also provided with a metering gate connected to the body at the lower end. The metering gate has a base having a second orifice aligned with the first orifice, and a knife gate connected to the base. The second orifice has a substantially trapezoidal shape. The knife gate is configured to slidably cover the second orifice. A method is also disclosed for controlling a discharge rate of oilfield material within the oilfield material reservoir by adjusting a metering open area of the second orifice according to mathematical modeling equations. 1. An oilfield material reservoir , comprising:a body, the body having an upper end, a lower end, a sidewall extending between the upper end and the lower end, the sidewall defining a recess within the body, an opening defined by the upper end, and a first orifice defined by the lower end; anda metering gate connected to the body at the lower end, the metering gate comprising a base having a second orifice aligned with the first orifice, the second orifice having a substantially trapezoidal shape, the metering gate having a knife gate connected to the base, the knife gate configured to slidably cover the second orifice.2. The oilfield material reservoir of claim 1 , wherein the knife gate is connected to the base by an actuator.3. The oilfield material reservoir of claim 2 , wherein the actuator has a base connected to the base of the metering gate and a piston with a piston head claim 2 , extending from the base claim 2 , connected to the knife gate.4. The oilfield material reservoir of claim 3 , wherein the piston of the actuator retracts to slidably cover the second orifice with ...

Embedded die package multichip module

An embedded die package includes a first die having an operating voltage between a first voltage potential and a second voltage potential that is less than the first voltage potential. A via, including a conductive material, is electrically connected to a bond pad on a surface of the first die, the via including at least one extension perpendicular to a plane along a length of the via. A redistribution layer (RDL) is electrically connected to the via, at an angle with respect to the via defining a space between the surface and a surface of the RDL. A build-up material is in the space.

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line. 1. A method for fabricating a semiconductor device , comprising:depositing a pattern of conductive ink on a first surface of a silicon wafer comprising a plurality of dies, the pattern comprising a clearance area along a scribe line between each of the plurality of dies; andfocusing a laser, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer, wherein the second surface is opposite the first surface, and the point is aligned with the clearance area.2. The method of claim 1 , further comprising separating each of the plurality of dies along the scribe line.3. The method of claim 1 , further comprising depositing an adhesion layer on the first side of the silicon wafer.4. The method of claim 3 , further comprising depositing a barrier layer on the adhesion layer.5. The method of claim 4 , wherein the inkjet printing comprises printing the pattern of conductive ink on the barrier layer claim 4 , wherein the clearance area exposes the barrier layer.6. The method of claim 4 , further comprising applying an atmospheric plasma to remove oxide from the barrier layer.7. The method of claim 1 , further comprising curing the printed pattern of conductive ink.8. The method of claim 1 , further comprising detecting claim 1 , through the silicon wafer claim 1 , fiducial marks on the second surface of the silicon wafer to align an inkjet print nozzle to dispense the pattern of ...

SYSTEM AND METHOD FOR DELIVERY OF OILFIELD MATERIALS

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner. 1. A mobile support structure for supporting at least one modular silo , the mobile support structure comprising:a support base having a first end and a second end, a top surface and a bottom surface, a first side and a second side;a frame structure connected to the support base, the frame structure extending above the support base to define a passage between the top surface and the frame structure, the frame structure having at least one upper silo receiving region sized and configured to receive at least one modular silo;a first extended base having a framework design, the first extended base disposed on the first side of the support base; anda second extended base having a framework design, the second extended base disposed on the second side of the support base.2. The mobile support structure of claim 1 , wherein the first extended base and the second extended base are movable to a support position wherein the support base claim 1 , the first extended base and the second extended base are configured to provide vertical and lateral support to the at least one modular silo.3. The mobile support structure of claim 2 , further comprising a first set of moveable joints connecting the first extended base to at least one of the frame structure and the support base claim 2 , and a second set of moveable joints connecting the second extended base to at least one of the frame structure and ...

Mobile oilfield materialtransfer unit

A mobile oilfield material transfer unit includes a chassis having a gooseneck and support base, the support base including a first portion and second portion, and the chassis further comprising a rear axle suspension system coupled with at least two wheels for movably supporting the chassis. The mobile oilfield material transfer unit further includes an erecting mast assembly having a mast movably connected with the chassis proximate to the second portion, and an actuator system coupled with the mast and with the chassis for moving the mast between a horizontal position and a vertical position. At least two vertical conveyor assemblies may be coupled with the erecting mast and moveable between the horizontal position and the vertical position, and at least two horizontal conveyor systems may be coupled with the support frame and engageable with the at least two vertical conveyor assemblies. Each of the at least two horizontal conveyor systems may have a horizontal section with an inlet and an inclinable section with a discharge chute. Also, each of the at least two horizontal conveyor systems may be adapted to move a volume of oilfield material from the inlet to the discharge chute.

METAL RIBS IN ELECTROMECHANICAL DEVICES

In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity. 1. A device , comprising:a semiconductor die;a thin-film layer;an air cavity positioned between the semiconductor die and the thin-film layer, the air cavity comprising a resonator positioned on the semiconductor die; anda rib coupled to a surface of the thin-film layer opposite the air cavity.2. The device of claim 1 , wherein the rib comprises a metal rib having a thickness ranging from 1 micron to 100 microns and having a stiffness of at least 120KN/m.3. The device of claim 1 , wherein the rib has a surface with an area matching or exceeding an area of a surface of a platform on which the resonator is positioned.4. The device of claim 1 , wherein the rib is a continuous member.5. The device of claim 1 , wherein the rib has six surfaces.6. The device of claim 1 , further comprising a conductive terminal formed in the thin-film layer and coupled to an active surface of the semiconductor die.7. The device of claim 1 , wherein the thin-film layer comprises a polymer having a thickness ranging from 1 micron to 100 microns.8. The device of claim 1 , wherein the thin-film layer has a thickness of at least 10 microns.9. The device of claim 1 , wherein the device comprises a micro-electro-mechanical system (MEMS) device or a bulk acoustic wave (BAW) device.10. The device of claim 1 , further comprising a mold compound covering the semiconductor die claim 1 , the thin-film layer claim 1 , and the rib.11. The device of claim 1 , wherein the air cavity has a depth ranging from 50 microns to 10 millimeters.12. A device claim 1 , comprising:a semiconductor die;an insulative layer;an air cavity positioned between the semiconductor die and the insulative layer, the air cavity ...

SYSTEM AND METHODOLOGY FOR DELIVERING BULK MATERIAL AT A WORK SITE

A technique facilitates delivery of bulk materials at a desired site, such as a wellsite. According to an embodiment, a silo is pivotably mounted to a trailer, such as an over-the-road trailer. An actuator is coupled between the silo and the trailer to enable transition of the silo between a transverse position for transport and an upright position which facilitates outflow of the bulk material. The system also may comprise various other features used alone or in combination, such as pivotable wings, a foldable trailer, and an adjustable suspension which allows a frame of the trailer to be positioned firmly on the ground. 1. A system for delivering a dry , bulk material , comprising: a frame;', 'a plurality of wheels to enable movement along a road; and', 'an adjustable suspension coupled between the frame and the plurality of wheels, the adjustable suspension being actuatable to move the frame between a raised position and a lowered position which allows the frame to rest on the ground;', 'a silo pivotably mounted on the frame, the silo being movable via an actuator between a transverse position for transport and an upright position for delivery of dry, bulk material; and', 'a plurality of wings pivotably mounted to the frame, the plurality of wings being movable between a raised position for transport and a lateral position for engaging the ground when the frame is resting on the ground in the lowered position., 'a trailer constructed for over-the-road use, the trailer comprising2. The system as recited in claim 1 , wherein the trailer is foldable to reduce a system footprint while the silo is in the upright position.3. The system as recited in claim 2 , wherein the actuator is operable to fold a portion of the frame to an upright frame position.4. The system as recited in claim 1 , further comprising a conveyor coupled to the frame.5. The system as recited in claim 4 , wherein the conveyor is an enclosed auger-type conveyor.6. The system as recited in claim 4 , ...

SYSTEM AND METHOD FOR DELIVERY OF OILFIELD MATERIALS

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner. 1. A mobile support structure for supporting at least one modular silo , the mobile support structure comprising:a support base having a first end and a second end, a top surface and a bottom surface, a first side and a second side;a frame structure connected to the support base, the frame structure extending above the support base to define a passage between the top surface and the frame structure, the frame structure having at least one upper silo receiving region sized and configured to receive at least one modular silo;a first extended base having a framework design, the first extended base disposed on the first side of the support base; anda second extended base having a framework design, the second extended base disposed on the second side of the support base.2. The method of claim 23 , wherein the first extended base and the second extended base are movable to a support position wherein the support base claim 23 , the first extended base and the second extended base are configured to provide vertical and lateral support to the at least one modular silo.3. The method of claim 2 , further comprising a first set of moveable joints connecting the first extended base to at least one of the frame structure and the support base claim 2 , and a second set of moveable joints connecting the second extended base to at least one of the frame structure and the support base.4. The method of ...

Apparatus for Mixing Solid Particles and Fluids

An apparatus that includes a casing having an outer layer and an inner layer, a hopper, a rotary drive, a slinger, an impeller, an inlet, and an outlet. The hopper is operable for delivering bulk solids into the casing. The inlet is operable for delivering fluid into the casing. The outlet is operable for discharging a mixture of the bulk solids and the fluid from the casing. The rotary drive is disposed external to the casing, and the slinger is suspended for rotation within the casing via a drive extension extending from the rotary drive into the casing. The impeller is coupled with the slinger within the casing.

THERMAL MANAGEMENT MODULE AND ROTARY VALVE THEREOF

A thermal management module is provided that includes a housing, a rotary valve, and a sealing assembly arranged in a passageway of the housing. The sealing assembly includes a main seal, a secondary seal, and a seal support. The main seal is loose-fitting on the seal support and is loose-fitting in the housing, allowing rotation of the main seal. The rotating seal will wear uniformly, thereby reducing wear, and maintain good sealing performance throughout the lifetime of the thermal management module. The rotary valve can be configured with an opening that is asymmetric in relation to an axial direction of the rotary valve, thereby providing a rotational torque for turning the main seal. The opening of the rotary valve can have a die parting line that is inclined relative to the axial direction of the rotary valve, also providing a rotational torque for turning the main seal. 1. A thermal management module , comprising:a housing provided with passageway; the passageway having a central axis;a rotary valve arranged in the housing; the rotary valve having a central axis and at least one opening, the at least one opening being in fluid communication with an external channel via the passageway of the housing; and,a sealing assembly arranged in the passageway of the housing;wherein the sealing assembly comprises a main seal, a secondary seal and a seal support; the seal support has a hollow cylindrical portion and a flange connected to an axial end of the hollow cylindrical portion; the main seal and the secondary seal are arranged successively, in an axial direction of the passageway, in a space between the flange and hollow cylindrical portion of the seal support and the housing; the main seal is in contact with the rotary valve in the axial direction of the passageway, and the secondary seal abuts the main seal at one end and abuts the flange at another end in the axial direction of the passageway; and, the main seal rotates during rotation of the rotary valve.2. The ...

MOBILE ERECTOR SYSTEM

A mobile support structure (MSS) includes a frame structure for receiving modular silos, a base moveable between transportation and support configurations, and connectors coupling with the silos. A mobile erecting assembly includes a chassis, a lift structure rotatable between transportation and mounting orientations while engaged with a silo, an engagement structure movable between first and second positions while engaged with the silo, and an actuator to move the engagement structure and silo between the first and second positions. The silo is connected to the mobile erector assembly in the transportation orientation, and the mobile erector assembly is then aligned relative to the MSS, such as by engaging an alignment member of the mobile erector assembly with a chassis alignment post of the MSS. The mobile erector assembly is then operated to move the silo to the mounting orientation, and the silo is then coupled to the MSS. 118. A mobile support structure (MSS) () , comprising:{'b': '50', 'a trailer-mounted support base ();'}{'b': 52', '72', '20, 'a frame structure () connected to and extending above the support base to define a plurality of silo-receiving regions () each configured to receive a corresponding one of a plurality of modular silos ();'}{'b': '54', 'an extendable base () moveable between a transportation configuration and a support configuration; and'}{'b': '56', 'a plurality of silo connectors () each disposed on the extendable base and operable to couple with a corresponding one of the plurality of modular silos.'}2. The MSS of wherein the MSS is within predetermined size limits for transportation on public roads and highways when the extendable base is in the transportation configuration but not when the extendable base is in the support configuration.376786668. The MSS of wherein the extendable base comprises first and second extendable bases ( claim 1 , ) disposed on first and second sides ( claim 1 , ) of the support base claim 1 , ...

COMPACT ARTICULATION MECHANISM

An articulation mechanism for large scale mobile aggregate system equipment. The mechanism includes a screw device that is pivotally secured to an elongated portion of the equipment to drive its movement to and from a collapsed position. The screw device is driven by a screw jack and moved within a housing while the housing itself is pivotally secured to another portion of the equipment. Rollers within the housing may be used to stabilize the lateral movement of the screw device during the opening, closing or self-locking of the elongated portion by the mechanism. 1. An articulation mechanism to support a hinge at an interface between an elongated portion of oilfield aggregate management equipment and another portion of the equipment , the mechanism comprising:a screw device with an exposed end pivotally secured to the elongated portion;a housing about a first region of the screw device for stably accommodating at least the first region therethrough, the housing pivotally secured to the other portion of the equipment; anda screw jack coupled to the housing and about a second region of the screw device for threadable engagement with the second region therethrough for lateral and substantially locking engagement therewith.2. The articulation mechanism of wherein the housing is rectangular for accommodating a rectangular configuration of the first region and the second region is threaded for the threadable engagement.3. The articulation mechanism of further comprising supportive rollers to support the rectangular first region through the rectangular housing.4. The articulation mechanism of further comprising a protective covering for receiving the threaded second region therein.5. The articulation mechanism of further comprising a motor to provide power to the screw jack for engaged movement of the second region to laterally move the screw device.6. The articulation mechanism of wherein the jack screw is of a substantially self-locking gear ratio to support the locking ...

FIBER DELIVERY SYSTEM

A system for managing fiber on-site at an oilfield. The system includes a packing region and a corresponding region which both interface a bulk of the fiber simultaneously. However, the packing region is of a moving character and the corresponding region is of a substantially different character which may or may not be static in nature. Regardless, the difference in character between the adjacent regions allows for a substantially continuous manner of packing fiber. This may be particularly beneficial where the fiber is of a crimped nature or otherwise comparatively light or of low density as may be the case for certain downhole fracturing or cementing applications utilizing the fiber at the oilfield. 1. A fiber delivery system comprising:a packing region having a moving character and to interface fiber material for packing and advancing thereof toward a metering location of the system; anda corresponding region adjacent the packing region to simultaneously interface the fiber material and having a character that is substantially different from the moving character of the conveyance region.2. The system of wherein the fiber material is one of crimped and between about 15 and about 25 pounds per cubic foot.3. The system of wherein the moving character is provided by a device selected from a group consisting of at least one auger claim 1 , a conveyor belt and a drag chain.4. The system of wherein the substantially different character of the corresponding region is one of a static character claim 1 , a vibrating character claim 1 , a conveyor belt effected character claim 1 , a drag chain effected character claim 1 , an auger effected character and a passive moving character.5. The system of further comprising:a hopper for receiving the fiber material in an unpacked manner in advance of the packing; anda metering mechanism at the metering location to meter packed fiber material from the regions.6. The system of wherein the metering mechanism comprises a metering auger. ...

FIBER MIXING SYSTEM

An apparatus comprising a first mixer, a second mixer, and a pump. The first mixer may comprise a first material inlet for receiving a first material, a first fluid inlet for receiving a first fluid, and a first outlet for discharging a first mixture comprising the first material and the first fluid. The second mixer may comprise a second material inlet for receiving a second material, a second fluid inlet for receiving the first mixture from the first outlet, and a second outlet for discharging a second mixture comprising the second material and the first mixture. The pump may comprise a pump inlet for receiving the second mixture at a first pressure and a pump outlet for discharging the second mixture at a second pressure. The second pressure may be substantially greater than the first pressure. 1. An apparatus , comprising:a first mixer comprising a first material inlet for receiving a first material, a first fluid inlet for receiving a first fluid, and a first outlet for discharging a first mixture comprising the first material and the first fluid;a second mixer comprising a second material inlet for receiving a second material, a second fluid inlet for receiving the first mixture from the first outlet, and a second outlet for discharging a second mixture comprising the second material and the first mixture; anda pump comprising a pump inlet for receiving the second mixture at a first pressure and a pump outlet for discharging the second mixture at a second pressure, wherein the second pressure is substantially greater than the first pressure.2. The apparatus of further comprising a first fluid source claim 1 , wherein the first and second fluid inlets are fluidly connected with the first fluid source claim 1 , wherein: receive the first fluid through the second fluid inlet;', 'mix the first fluid, the second material, and the first mixture to form a third mixture; and', 'discharge the third mixture through the second outlet; and, 'the second mixer is further ...

PROPPANT MIXING AND METERING SYSTEM

An oilfield material reservoir is disclosed. The oilfield material reservoir has a body, the body having an upper end, a lower end, a sidewall extending between the upper and lower ends, the sidewall defining a recess within the body, an opening defined by the upper end, and a first orifice defined by the lower end. The oilfield material reservoir is also provided with a metering gate connected to the body at the lower end. The metering gate has a base having a second orifice aligned with the first orifice, and a knife gate connected to the base. The second orifice has a substantially trapezoidal shape. The knife gate is configured to slidably cover the second orifice. A method is also disclosed for controlling a discharge rate of oilfield material within the oilfield material reservoir by adjusting a metering open area of the second orifice according to mathematical modeling equations. 1. An oilfield material reservoir , comprising:a body, the body having an upper end, a lower end, a sidewall extending between the upper end and the lower end, the sidewall defining a recess within the body, an opening defined by the upper end, and a first orifice defined by the lower end; anda metering gate connected to the body at the lower end, the metering gate comprising a base having a second orifice aligned with the first orifice, the second orifice having a substantially trapezoidal shape, the metering gate having a knife gate connected to the base, the knife gate configured to slidably cover the second orifice.2. The oilfield material reservoir of claim 1 , wherein the knife gate is connected to the base by an actuator.3. The oilfield material reservoir of claim 2 , wherein the actuator has a base connected to the base of the metering gate and a piston with a piston head claim 2 , extending from the base claim 2 , connected to the knife gate.4. The oilfield material reservoir of claim 3 , wherein the piston of the actuator retracts to slidably cover the second orifice with ...

Chassis and support structure alignment

This disclosure introduces chassis alignment assemblies for aligning a chassis with a support structure. An example implementation includes a chassis having first wheels, a jacking assembly coupled to the chassis and having second wheels, and a jacking actuation member operable to vertically displace the second wheels relative to the chassis to engage the ground and raise the first wheels off of the ground such that the jacking assembly supports an end of the chassis. Another example implementation includes a chassis, having first wheels, and an outrigger assembly having: a frame movable between transport and alignment orientations; second wheels; and an outrigger actuation member operable to move the frame relative to the chassis.

MOBILE ERECTOR SYSTEM

A mobile support structure (MSS) includes a frame structure for receiving modular silos, a base moveable between transportation and support configurations, and connectors coupling with the silos. A mobile erecting assembly includes a chassis, a lift structure rotatable between transportation and mounting orientations while engaged with a silo, an engagement structure movable between first and second positions while engaged with the silo, and an actuator to move the engagement structure and silo between the first and second positions. The silo is connected to the mobile erector assembly in the transportation orientation, and the mobile erector assembly is then aligned relative to the MSS, such as by engaging an alignment member of the mobile erector assembly with a chassis alignment post of the MSS. The mobile erector assembly is then operated to move the silo to the mounting orientation, and the silo is then coupled to the MSS. 118. A mobile support structure (MSS) () , comprising:{'b': '50', 'a trailer-mounted support base ();'}{'b': 52', '72', '20, 'a frame structure () connected to and extending above the support base to define a plurality of silo-receiving regions () each configured to receive a corresponding one of a plurality of modular silos ();'}{'b': '54', 'an extendable base () moveable between a transportation configuration and a support configuration; and'}{'b': '56', 'a plurality of silo connectors () each disposed on the extendable base and operable to couple with a corresponding one of the plurality of modular silos.'}2. The MSS of wherein the MSS is within predetermined size limits for transportation on public roads and highways when the extendable base is in the transportation configuration but not when the extendable base is in the support configuration.376786668. The MSS of wherein the extendable base comprises first and second extendable bases ( claim 1 , ) disposed on first and second sides ( claim 1 , ) of the support base claim 1 , ...

ADJUSTMENT APPARATUS FOR CONTAINER INSTALLATION

An apparatus comprising a chassis, a mast movably coupled with the chassis, a first actuator operable to pivot the mast with respect to the chassis along a substantially vertical plane, and a second actuator operable to move the mast in a lateral direction with respect to the chassis along a substantially horizontal plane. The mast may support an oilfield material container. By pivoting the mast, the first actuator may be operable to pivot the oilfield material container with respect to the chassis along a substantially vertical plane. By moving the mast, the second actuator may be operable move the oilfield material container in a lateral direction with respect to the chassis along a substantially horizontal plane. 1. An apparatus , comprising:a chassis;a base movably coupled with the chassis;a mast pivotably connected with the base and supporting an oilfield material container in a transport orientation;a first actuator operable to pivot the mast and the oilfield material container from the transport orientation to an operational orientation; anda second actuator operable to move the base, and thus the mast and the oilfield material container, relative to the chassis.2. The apparatus of wherein the chassis comprises an axis extending longitudinally along the chassis claim 1 , and wherein the second actuator is operable to move the base in a lateral direction with respect to the axis claim 1 , wherein the lateral direction is substantially horizontal.3. The apparatus of wherein the second actuator is disposed adjacent a first end of the base claim 2 , wherein the second actuator is operable to move at least a first portion of the base claim 2 , and thus the mast and the oilfield material container claim 2 , in the lateral direction claim 2 , wherein the apparatus further comprises a third actuator disposed adjacent a second end of the base claim 2 , and wherein the third actuator is operable to move at least a second portion of the base claim 2 , and thus the mast ...

MODULAR FIBER FEEDER

An apparatus is disclosed, which controls and meters the feed of fibers into a fluid which includes a housing having an intake opening and a discharge opening, two or more toothed metering elements mounted on a plurality of spindles, and a shear bar disposed within the housing above and between the toothed metering elements. The spindles are rotatably mounted within the housing. A fluid is disposed adjacent the discharge opening for receiving fibers. In some cases, a mass of fibers is introduced into the apparatus via the intake opening, the mass of fibers contacts the shear bar and the toothed metering elements, and may be divided into substantially discrete fibers by the contact with the shear bar and the toothed metering elements, and delivery of the fibers to the fluid is metered by controlling rotational speed of the toothed metering elements. 1. An apparatus for controlling feed of fibers into a fluid , the apparatus comprising:a housing having an intake opening and a discharge opening;a plurality of toothed metering elements mounted on a plurality of spindles, the spindles rotatably mounted within the housing;a shear bar disposed above and between the plurality of toothed metering elements; and,a fluid disposed adjacent the discharge opening for receiving fibers.2. The apparatus of wherein a mass of fibers is introduced into the apparatus via the intake opening claim 1 , wherein the mass of fibers contacts the shear bar and the plurality of toothed metering elements claim 1 , and wherein delivery of the fibers to the fluid is metered by controlling rotational speed of the plurality of toothed metering elements.3. The apparatus of wherein the plurality of spindles is two spindles claim 2 , and wherein the two spindles rotate in opposite directions.4. The apparatus of wherein the mass of fibers is divided into substantially discrete fibers by the contact with the shear bar and the plurality of toothed metering elements.5. The apparatus of wherein the discrete ...

SYSTEM AND METHOD FOR PREPARING A TREATMENT FLUID

A system and method are disclosed for preparing a treatment fluid and includes charging packets containing an additive encased within a liner to a first container packet storage area of a first container; passing the packets to a packet shredder; breaching the liners of the packets to expose the additive; passing exposed additive to a mixer; passing an aqueous solution to the mixer from a second container; and mixing the exposed additive with the aqueous solution to form the treatment fluid. The first container can also include a first container proppant storage area, and proppant is passed from the first container proppant storage area to the mixer. The treatment fluid can be charged to a well bore penetrating a subterranean formation. The system and method can also include a silo positioned in fluid flow communication with the first container and partitioned into a silo packet storage area and a silo proppant storage area. 1. A system for preparing a treatment fluid comprising:a first container comprising a first container packet storage area having a packet delivery opening, wherein the first container packet storage area is for storing packets comprising an additive encased within a liner;a packet shredder comprising a shredder inlet and a shredder outlet, wherein the shredder inlet is positioned below the packet delivery opening;a mixer having a first mixer inlet, a second mixer inlet and a mixer outlet, wherein the first mixer inlet is positioned in fluid flow communication with the shredder outlet; anda second container comprising an aqueous solution and having an aqueous solution outlet in fluid flow communication with the second mixer inlet.2. The system of further comprising a wellbore penetrating a subterranean formation and connected in fluid flow communication with the mixer outlet.3. The system of wherein the first container further comprises a first container proppant storage area for storing proppant and having a proppant delivery opening positioned ...

ADJUSTMENT APPARATUS FOR CONTAINER INSTALLATION

An apparatus comprising a chassis, a mast movably coupled with the chassis, a first actuator operable to pivot the mast with respect to the chassis along a substantially vertical plane, and a second actuator operable to move the mast in a lateral direction with respect to the chassis along a substantially horizontal plane. The mast may support an oilfield material container. By pivoting the mast, the first actuator may be operable to pivot the oilfield material container with respect to the chassis along a substantially vertical plane. By moving the mast, the second actuator may be operable move the oilfield material container in a lateral direction with respect to the chassis along a substantially horizontal plane. 1. An apparatus , comprising:a chassis;a base movably coupled with the chassis;a mast pivotably connected with the base and supporting an oilfield material container in a transport orientation;a first actuator operable to pivot the mast and the oilfield material container from the transport orientation to an operational orientation; anda second actuator operable to move the base, and thus the mast and the oilfield material container, relative to the chassis.2. The apparatus of wherein the chassis comprises an axis extending longitudinally along the chassis claim 1 , and wherein the second actuator is operable to move the base in a lateral direction with respect to the axis claim 1 , wherein the lateral direction is substantially horizontal.3. The apparatus of wherein the second actuator is disposed adjacent a first end of the base claim 2 , wherein the second actuator is operable to move at least a first portion of the base claim 2 , and thus the mast and the oilfield material container claim 2 , in the lateral direction claim 2 , wherein the apparatus further comprises a third actuator disposed adjacent a second end of the base claim 2 , and wherein the third actuator is operable to move at least a second portion of the base claim 2 , and thus the mast ...

COMPACT ARTICULATION MECHANISM

An articulation mechanism for large scale mobile aggregate system equipment. The mechanism includes a screw device that is pivotally secured to an elongated portion of the equipment to drive its movement to and from a collapsed position. The screw device is driven by a screw jack and moved within a housing while the housing itself is pivotally secured to another portion of the equipment. Rollers within the housing may be used to stabilize the lateral movement of the screw device during the opening, closing or self-locking of the elongated portion by the mechanism. 1. An articulation mechanism to support a hinge at an interface between an elongated portion of oilfield aggregate management equipment and another portion of the equipment , the mechanism comprising:a screw device with an exposed end pivotally secured to the elongated portion;a housing about a first region of the screw device for stably accommodating at least the first region therethrough, the first region having at least one flat side, the housing being pivotally secured to the other portion of the equipment;a screw jack coupled to the housing and about a second region of the screw device for threadable engagement with the second region therethrough for lateral and substantially locking engagement therewith; anda plurality of rollers coupled with the housing at a position to engage the at least one flat side of the screw device to stabilize the articulation mechanism.2. The articulation mechanism of wherein the housing is rectangular for accommodating a rectangular configuration of the first region claim 1 , the second region being threaded for the threadable engagement.3. The articulation mechanism of wherein the plurality of rollers engages a plurality of flat sides of the screw device to support the first region as it moves through the housing.4. The articulation mechanism of further comprising a protective covering for receiving the threaded second region therein.5. The articulation mechanism of ...

Fan-out electronic device

An electronic device (100) includes a substrate (110) and an integrated circuit (120) provided on the substrate (110) having a surface facing away from the substrate (110). An insulating layer (150) extends over the substrate (110) and around the integrated circuit (120) to define an interface (154) between the insulating layer (150) and the integrated circuit (120). An electrically conductive via (130) is provided on the surface of the integrated circuit (120). An insulating material (140) extends over the via (130) and includes an opening (142) exposing a portion of the via (130). A repassivation member (162) extends over the insulating layer (150) and has a surface (164) aligned with the interface (154). An electrically conductive redistribution member (181) is electrically connected to the via (130) and extends over the repassivation member (162) into contact with the insulating layer (150).

Stress Buffer Layer in Embedded Package

The disclosed principles provide a stress buffer layer between an IC die and heat spreader used to dissipate heat from the die. The stress buffer layer comprises distributed pairs of conductive pads and a corresponding set of conductive posts formed on the conductive pads. In one embodiment, the stress buffer layer may comprise conductive pads laterally distributed over non-electrically conducting surfaces of an embedded IC die to thermally conduct heat from the IC die. In addition, such a stress buffer layer may comprise conductive posts laterally distributed and formed directly on each of the conductive pads. Each of the conductive posts thermally conduct heat from respective conductive pads. In addition, each conductive post may have a lateral width less than a lateral width of its corresponding conductive pad. A heat spreader is then formed over the conductive posts which thermally conducts heat from the conductive posts through the heat spreader. 1. An integrated circuit (IC) package , comprising:a plurality of pads contacting a non-electrically conducting surface of an IC die;a plurality of posts directly on each of the plurality of pads, wherein each of the plurality of posts has a lateral width less than a lateral width of its corresponding pad of the plurality of pads; anda heat conducting structure attached to the plurality of posts, the heat conducting structure including a surface exposed from the IC package.2. The IC package according to claim 1 , wherein each of the plurality of pads and each of the plurality of posts comprise copper.3. The IC package according to claim 1 , wherein each of the plurality of posts comprise a substantially cylindrical shape.4. The IC package according to claim 1 , wherein each of the plurality of posts are substantially equally spaced.5. The IC package according to claim 1 , wherein a height of each pair of the plurality of pads and corresponding plurality of posts together is in the range of 30 μm-60 μm when a height of ...

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line. 1. A method for fabricating a semiconductor device , comprising:inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer comprising a plurality of dies, the pattern comprising a clearance area along a scribe line between the dies;focusing a laser, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer, wherein the second surface is opposite the first surface, and the point is aligned with the clearance area; andseparating the dies along the scribe line.2. The method of claim 1 , further comprising depositing an adhesion layer on the first side of the silicon wafer.3. The method of claim 2 , further comprising depositing a barrier layer on the adhesion layer.4. The method of claim 3 , wherein the inkjet printing comprises printing the pattern of nanosilver conductive ink on the barrier layer claim 3 , wherein the clearance area exposes the barrier layer.5. The method of claim 3 , further comprising applying an atmospheric plasma to remove oxide from the barrier layer.6. The method of claim 1 , further comprising curing the printed pattern of nanosilver conductive ink.7. The method of claim 1 , further comprising detecting claim 1 , through the silicon wafer claim 1 , fiducial marks on the second surface of the silicon wafer to align an inkjet print nozzle to dispense the pattern of nanosilver conductive ink.8. The method of claim 1 , ...

Mixing apparatus with stator and method

A mixer and method for mixing are provided. The mixer includes a housing having a fluid inlet, an additive inlet, and an outlet, with the housing defining a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber, wherein, when rotated, the impeller draws fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a stator disposed at least partially around the slinger, with the stator including vanes spaced circumferentially apart so as to define flowpaths therebetween.

Mixing apparatus with flush line and method

A mixer and method for mixing are provided. The mixer includes a housing including a fluid inlet, an additive inlet, and an outlet. The housing defines a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber. When rotated, the impeller pumps fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a flush line extending between the mixing chamber and the additive inlet. The flush line is receives, from the mixing chamber, a portion of the fluid pumped by the impeller and to deliver the portion of the fluid to the additive inlet.

INTEGRATED PROCESS DELIVERY AT WELLSITE

A mixing unit comprising a frame, a rheology control portion, and a high-volume solids blending portion. The rheology control portion comprises means for receiving a first material from a first transfer mechanism, a dispersing/mixing system connected with the frame, and a first metering system to meter the first material from the first material receiving means to the dispersing/mixing system. The dispersing/mixing system disperses/mixes the metered first material with a fluid to form a first fluid mixture. The high-volume solids blending portion comprises means for receiving a second material from a second transfer mechanism, a solids blending system connected with the frame, and a second metering system to meter the second material from the second material receiving means to the solids blending system. The solids blending system blends the metered second material with the first fluid mixture to form a second fluid mixture. 1. An apparatus , comprising: a frame;', means for receiving a first material from a first transfer mechanism;', 'a dispersing and/or mixing system connected with the frame; and', 'a first metering system operable to meter the first material from the first material receiving means to the dispersing and/or mixing system, wherein the dispersing and/or mixing system is operable to disperse and/or mix the metered first material with a fluid to form a first fluid mixture; and, 'a rheology control portion comprising, means for receiving a second material from a second transfer mechanism, wherein the second material is a high-volume solids material;', 'a solids blending system connected with the frame; and', 'a second metering system operable to meter the second material from the second material receiving means to the solids blending system, wherein the solids blending system is operable to blend the metered second material with the first fluid mixture to form a second fluid mixture., 'a high-volume solids blending portion comprising], 'a mixing unit ...

HYDRATION SYSTEMS AND METHODS

A substantially continuous stream of aqueous fluid and a substantially continuous stream of gel having a first concentration are combined to form a substantially continuous stream of gel having a second concentration. The second concentration is substantially lower than the first concentration. The gel having the second concentration may thereafter be utilized in conjunction with a well fracturing operation. 1. A method , comprising:communicating a substantially continuous stream of gel having a first concentration;communicating a substantially continuous stream of aqueous fluid;combining the substantially continuous streams of gel having the first concentration and aqueous fluid to form a substantially continuous stream of gel having a second concentration, wherein the second concentration is substantially lower than the first concentration; andutilizing the gel having the second concentration in a well fracturing operation.2. The method of further comprising:mixing a substantially continuous stream of hydratable material with a substantially continuous stream of aqueous fluid with a mixer to form the gel having the first concentration; anddischarging the gel having the first concentration from the mixer as the substantially continuous streams of hydratable material and aqueous fluid are being mixed to form the substantially continuous stream of gel having the first concentration.3. The method of wherein:the hydratable material substantially comprises guar; andthe aqueous fluid substantially comprises water.4. The method of further comprising claim 1 , before combining the substantially continuous streams of gel having the first concentration and aqueous fluid to form the substantially continuous stream of gel having the second concentration claim 1 , communicating the substantially continuous stream of gel having the first concentration through a hydration tank to permit the substantially continuous stream of gel having the first concentration to reach a ...

MOBILE OILFIELD MATERIALTRANSFER UNIT

A mobile oilfield material transfer unit includes a chassis having a gooseneck and support base, the support base including a first portion and second portion, and the chassis further comprising a rear axle suspension system coupled with at least two wheels for movably supporting the chassis. The mobile oilfield material transfer unit further includes an erecting mast assembly having a mast movably connected with the chassis proximate to the second portion, and an actuator system coupled with the mast and with the chassis for moving the mast between a horizontal position and a vertical position. At least two vertical conveyor assemblies may be coupled with the erecting mast and moveable between the horizontal position and the vertical position, and at least two horizontal conveyor systems may be coupled with the support frame and engageable with the at least two vertical conveyor assemblies. Each of the at least two horizontal conveyor systems may have a horizontal section with an inlet and an inclinable section with a discharge chute. Also, each of the at least two horizontal conveyor systems may be adapted to move a volume of oilfield material from the inlet to the discharge chute. 1. A mobile oilfield material transfer system , comprising:a mobile oilfield material transfer unit comprising a chassis and an erecting mast assembly having a mast movably connected with the chassis and an actuator system coupled with the mast and with the chassis for moving the mast between a horizontal position and a vertical position;a first conveyor assembly configured to be coupled with the mast and moveable between the horizontal position and the vertical position, wherein the first conveyor assembly comprises a first conveyor, an inlet, and an upper discharge portion, wherein the first conveyor is configured to move oilfield material from the inlet to the upper discharge portion; anda second conveyor assembly including a second conveyor having a horizontal section with an ...

OILFIELD MATERIAL MIXING AND METERING SYSTEM

An oilfield material reservoir is disclosed as having a body and a base connected to and positioned beneath the body. The body has an upper end, a lower end, a sidewall having a first side and a second side extending between the upper end and the lower end forming a recess, and a partition positioned within the recess adjacent to the lower end and extending between the first and second sides of the sidewall. The base has a discharge opening formed within the lower side, and a plurality of augers extending between the first and second ends. The plurality of augers have opposing-hand flights configured to drive an oilfield material toward the discharge opening of the base. 1. An oilfield material reservoir , comprising:a body with an upper end, a lower end, a sidewall having a first side and a second side opposite the first side and extending between the upper end and the lower end forming a recess, and a partition positioned within the recess adjacent to the lower end and extending between the first and second sides of the sidewall; anda base positioned adjacent to and beneath the body, the base having an upper side, a lower side opposite the upper side, a first end, a second end opposite the first end, a discharge opening formed within the lower side, and a plurality of augers having opposing-hand flights configured to drive an oilfield material toward the discharge opening of the base.2. The oilfield material reservoir of claim 1 , wherein the partition is aligned with the discharge opening.3. The oilfield material reservoir of claim 2 , wherein the partition and the discharge opening are parallel.4. The oilfield material reservoir of claim 1 , wherein the partition includes a first partition wall and a second partition wall which are connected together in the shape of a chevron claim 1 , an apex of the chevron positioned above the lower end of the body.5. The oilfield material reservoir of claim 4 , wherein the partition is formed from a single piece of material.6 ...

METAL COMPOSITE PRODUCTION METHOD

A metal composite apparatus and a method to produce the metal composite apparatus is disclosed, including placing a metal skeleton inside a mold, the metal skeleton having a skeleton top surface, a skeleton bottom surface, cutouts, and a central bore having a top end and a bottom end; pouring molten white iron into the mold to substantially encapsulate the metal skeleton forming a single piece cast; protecting the top end and the bottom end of the central bore from contact with the molten white iron; and cooling the single piece cast to form the metal composite apparatus having an apparatus top surface and an apparatus bottom surface. 1. A method of producing a metal composite apparatus comprising:a. placing a metal skeleton comprising metal inside a mold, wherein the metal skeleton comprises a skeleton top surface, a skeleton bottom surface, cutouts, and a central bore having a top end and a bottom end;b. pouring molten white iron into the mold to substantially encapsulate the metal skeleton forming a single piece cast; wherein the top end and the bottom end of the central bore are protected from contact with the molten white iron; the melting point of the metal of the metal skeleton is equal to or greater than the melting point of the molten white iron; andc. cooling the single piece cast to form the metal composite apparatus having an apparatus top surface and an apparatus bottom surface.2. The method of wherein the metal of the metal skeleton has lower hardness claim 1 , better machinability and better shock absorption than the white iron in solid form.3. The method of wherein the metal of the metal skeleton comprises a metal alloy.4. The method of wherein the metal alloy is an alloy steel.5. The method of wherein the white iron has superior wear resistance as compared to the metal of the metal skeleton.6. The method of wherein the metal skeleton further comprises at least two protrusions extending from the skeleton bottom surface and protruding through the ...

Integral Reciprocating Pump Structure Supporting Spacer Section

A reciprocating pump having a power end, a fluid end, and a spacer section interposing the power and fluid ends. The power end includes a structural support frame having structural members that are each a discrete, unitary member. Each structural member forms a portion of a crankcase frame, a portion of a crosshead support frame, and a portion of a support base. The support base portion extends beneath the crosshead support frame and the spacer section. 1. An apparatus comprising: a portion of a crankcase frame;', 'a portion of a crosshead support frame; and', 'a portion of a support base, wherein the support base portion extends beneath the crosshead support frame and the spacer section., 'a reciprocating pump comprising a power end, a fluid end, and a spacer section interposing the power and fluid ends, wherein the power end comprises a structural support frame comprising a plurality of structural members that are each a discrete, unitary member, and wherein each structural member forms2. The apparatus of wherein the spacer section comprises a spacer frame fastened to the support base.3. The apparatus of wherein the spacer section is vertically supported by direct contact with the support base.4. The apparatus of wherein:the structural members are first structural members;the structural support frame further comprises a plurality of second structural members that are each a discrete, unitary member; andeach second structural member forms a portion of the crankcase frame and a portion of the crosshead support frame but not the support base.5. The apparatus of wherein the first and second structural support members are collectively connected in parallel.6. The apparatus of wherein the support base is configured to connect the reciprocating pump to a base structure.7. The apparatus of wherein the spacer section comprises a spacer frame comprising a plurality of spacer members each disposed between the fluid end and the crosshead support frame.8. The apparatus of ...

Reciprocating Pump Trunnions Connecting Crosshead and Connecting Rod

A crosshead assembly for a reciprocating pump. The crosshead assembly has a crosshead and a connecting rod configured to connect with a crankshaft of the reciprocating pump. Trunnions detachably connect with the connecting rod and facilitate pivotable connection of the connecting rod and the crosshead. 1. An apparatus comprising: a crosshead;', 'a connecting rod configured to connect with a crankshaft of the reciprocating pump; and', 'trunnions detachably connected with the connecting rod and facilitating pivotable connection of the connecting rod and the crosshead., 'a crosshead assembly for a reciprocating pump, wherein the crosshead assembly comprises2. The apparatus of wherein the trunnions pivotably engage at least a portion of the crosshead to pivotably connect the connecting rod with the crosshead.3. The apparatus of wherein:the connecting rod comprises a first surface at a first end of the connecting rod and a second surface at a second end of the connecting rod; anda fluid passage extends through the connecting rod between the first and second surfaces.4. The apparatus of wherein the first end of the connecting rod pivotably engages the crosshead claim 3 , and wherein the fluid passage comprises:a first bore extending through the first end perpendicularly with respect to the connecting rod;a second bore extending between the first bore and the first surface; anda third bore extending between the first bore and the second surface.5. The apparatus of wherein:a first end of the connecting rod comprises an outer surface;the first end pivotably engages the crosshead; a first bore extending through the first end perpendicularly with respect to the connecting rod; and', 'a second bore extending between the first bore and the outer surface;, 'a fluid passage extending through the connecting rod comprisesthe trunnions pivotably engage at least a portion of the crosshead to pivotably connect the connecting rod with the crosshead; andeach trunnion closes an opposing ...

Stress Buffer Layer in Embedded Package

The disclosed principles provide a stress buffer layer between an IC die and heat spreader used to dissipate heat from the die. The stress buffer layer comprises distributed pairs of conductive pads and a corresponding set of conductive posts formed on the conductive pads. In one embodiment, the stress buffer layer may comprise conductive pads laterally distributed over non-electrically conducting surfaces of an embedded IC die to thermally conduct heat from the IC die. In addition, such a stress buffer layer may comprise conductive posts laterally distributed and formed directly on each of the conductive pads. Each of the conductive posts thermally conduct heat from respective conductive pads. In addition, each conductive post may have a lateral width less than a lateral width of its corresponding conductive pad. A heat spreader is then formed over the conductive posts which thermally conducts heat from the conductive posts through the heat spreader. 1. An integrated circuit (IC) package , comprising:a plurality of pads over an IC die within the IC package, each of the plurality of pads contacting a non-electrically conducting surface of the IC die;a plurality of posts directly on each of the plurality of pads, wherein each of the plurality of posts has a lateral width less than a lateral width of its corresponding pad of the plurality of pads; anda heat spreader attached to the plurality of posts, the heat spreader including a surface exposed from the IC package.2. The IC package according to claim 1 , wherein each of the plurality of pads and each of the plurality of posts comprise copper.3. The IC package according to claim 1 , wherein each of the plurality of posts comprise a substantially cylindrical shape.4. The IC package according to claim 1 , wherein each of the plurality of posts are substantially equally spaced.5. The IC package according to claim 1 , wherein a height of each pair of the plurality of pads and corresponding plurality of posts together is ...

System and method for preparing a treatment fluid

A system and method are disclosed for preparing a treatment fluid and includes charging packets containing an additive encased within a liner to a first container packet storage area of a first container; passing the packets to a packet shredder; breaching the liners of the packets to expose the additive; passing exposed additive to a mixer; passing an aqueous solution to the mixer from a second container; and mixing the exposed additive with the aqueous solution to form the treatment fluid. The first container can also include a first container proppant storage area, and proppant is passed from the first container proppant storage area to the mixer. The treatment fluid can be charged to a well bore penetrating a subterranean formation. The system and method can also include a silo positioned in fluid flow communication with the first container and partitioned into a silo packet storage area and a silo proppant storage area.

Sistema y método para preparar un fluido de tratamiento

Se describen un sistema y un método para preparar un fluido de tratamiento que incluyen cargar paquetes que contienen un aditivo encerrado dentro de un revestimiento a un área de almacenamiento de paquetes del primer recipiente de un primer recipiente; pasar los paquetes a una desfibradora de paquetes; romper los revestimientos de los paquetes para exponer el aditivo; pasar el aditivo expuesto a un mezclador, pasar una solución acuosa al mezclador desde un segundo recipiente; y mezclar el aditivo expuesto con la solución acuosa para formar el fluido de tratamiento. El primer recipiente también puede incluir un área de almacenamiento de apuntalante del primer recipiente; y el apuntalante se pasa del área de almacenamiento de apuntalante del primer recipiente al mezclador, El fluido de tratamiento puede ser cargado a un agujero de pozo que penetra una formación subterránea. El sistema y el método también pueden incluir un silo posicionado en comunicación de flujo de fluido con un primer recipiente y dividido en un área de almacenamiento de paquetes del silo y un area de almacenamiento de apuntalante del silo.

Deep learning system and learning method using of convolutional neural network based image patterning

The present invention relates to a deep learning system using image patterning based on a convolutional neural network and an image learning method using the same, which includes an image input unit for inputting an input image; A patterning module for generating an input image received from the image input unit as a plurality of patterned pattern images; A CNN learning unit based on a convolution neural network (CNN) that learns an input image received from an image input unit and a pattern image received from a patterning module; A CNN execution unit for receiving learning information from the CNN learning unit and an input image received from the image input unit; And a final classifier for receiving image information from the CNN executing unit and classifying objects of the image information according to types. The present invention provides an image learning apparatus capable of enhancing the quality of image learning information that is vulnerable to various environmental problems (shaking, illuminance, noise, degradation of recognition rate, etc.) and a deep learning system using the same.

Valve train of an internal combustion engine with a cam follower

The invention relates to a valve train (1) of an internal combustion engine (2) with a cam follower (4), which is provided with a roller (9) rolling on a lobe (3) and applies a stroke to a gas exchange valve (6), and with a support element (5) connected to a hydraulic medium supply (15) of the internal combustion engine, the element having an articulated head (13) on which the cam follower is pivotally supported with a socket (12), wherein a feed opening (18) extending through the socket and flowing into the socket and a flow opening (19) communicating in the socket with the feed opening are provided for injecting the lobe and/or the roller. To this end, the openings should be disposed in relation to each other in the pivot direction of the cam follower such that they are hydraulically separated from each other, or are hydraulically connected to each other only via a choke gap (20), in the closed position of the gas exchange valve.

Integrated process delivery at wellsite

A mixing unit comprising a frame, a rheology control portion, and a high-volume solids blending portion. The rheology control portion comprises means for receiving a first material from a first transfer mechanism, a dispersing/mixing system connected with the frame, and a first metering system to meter the first material from the first material receiving means to the dispersing/mixing system. The dispersing/mixing system disperses/mixes the metered first material with a fluid to form a first fluid mixture. The high-volume solids blending portion comprises means for receiving a second material from a second transfer mechanism, a solids blending system connected with the frame, and a second metering system to meter the second material from the second material receiving means to the solids blending system. The solids blending system blends the metered second material with the first fluid mixture to form a second fluid mixture.

System and method for delivery of oilfield materials

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner.

Hydration systems and methods

A substantially continuous stream of aqueous fluid and a substantially continuous stream of gel having a first concentration are combined to form a substantially continuous stream of gel having a second concentration. The second concentration is substantially lower than the first concentration. The gel having the second concentration may thereafter be utilized in conjunction with a well fracturing operation.

Adjustment apparatus for container installation

An apparatus includes a chassis and a mast movably coupled with the chassis and supporting an oilfield material container. The apparatus also includes a first actuator which is operable to pivot the mast, and thus the oilfield material container, with respect to the chassis in a substantially vertical plane. The apparatus also includes a second actuator operable to move the mast, and thus the oilfield material container, in a substantially horizontal plane.

Mobile oilfield materialtransfer unit

A mobile oilfield material transfer unit includes a chassis having a gooseneck and support base, the support base including a first portion and second portion, and the chassis further comprising a rear axle suspension system coupled with at least two wheels for movably supporting the chassis. The mobile oilfield material transfer unit further includes an erecting mast assembly having a mast movably connected with the chassis proximate to the second portion, and an actuator system coupled with the mast and with the chassis for moving the mast between a horizontal position and a vertical position. At least two vertical conveyor assemblies may be coupled with the erecting mast and moveable between the horizontal position and the vertical position, and at least two horizontal conveyor systems may be coupled with the support frame and engageable with the at least two vertical conveyor assemblies. Each of the at least two horizontal conveyor systems may have a horizontal section with an inlet and an inclinable section with a discharge chute. Also, each of the at least two horizontal conveyor systems may be adapted to move a volume of oilfield material from the inlet to the discharge chute.

Integrated process delivery at wellsite

A mixing unit comprising a frame, a rheology control portion, and a high-volume solids blending portion. The rheology control portion comprises means for receiving a first material from a first transfer mechanism, a dispersing/mixing system connected with the frame, and a first metering system to meter the first material from the first material receiving means to the dispersing/mixing system. The dispersing/mixing system disperses/mixes the metered first material with a fluid to form a first fluid mixture. The high-volume solids blending portion comprises means for receiving a second material from a second transfer mechanism, a solids blending system connected with the frame, and a second metering system to meter the second material from the second material receiving means to the solids blending system. The solids blending system blends the metered second material with the first fluid mixture to form a second fluid mixture.

System and method for delivery of oilfield materials

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner.

System and method for delivery of oilfield materials

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner.

Hydration systems and methods

A substantially continuous stream of aqueous fluid and a substantially continuous stream of gel having a first concentration are combined to form a substantially continuous stream of gel having a second concentration. The second concentration is substantially lower than the first concentration. The gel having the second concentration may thereafter be utilized in conjunction with a well fracturing operation.

Crosshead bushing systems and methods

Systems and methods presented herein are directed toward a reciprocating pump. The reciprocating pump includes a fluid section including a plurality of fluid-displacing members. Each fluid-displacing member is configured to displace fluid through the reciprocating pump. The reciprocating pump also includes a power section including a plurality of crossheads. Each crosshead is coupled to a respective fluid-displacing member. The power section is configured to actuate the fluid section by actuating the plurality of crossheads through respective crosshead bores formed through the power section. The power section includes a plurality of structural members. The power section also includes a plurality of pairs of support plates. Each pair of support plates is permanently joined to two structural members of the plurality of structural members. Each support plate comprises a precision interior surface. The power section further includes a plurality of pairs of arcuate crosshead guide sections. Each arcuate crosshead guide section is secured in place between two structural members of the plurality of structural members against a respective pair of support plates of the plurality of pairs of support plates. Each pair of arcuate crosshead guide sections includes a top arcuate crosshead guide section and a bottom arcuate crosshead guide section configured to form a portion of a respective crosshead bore.

Compact articulation mechanism

An articulation mechanism for large scale mobile aggregate system equipment. The mechanism includes a screw device that is pivotally secured to an elongated portion of the equipment to drive its movement to and from a collapsed position. The screw device is driven by a screw jack and moved within a housing while the housing itself is pivotally secured to another portion of the equipment. Rollers within the housing may be used to stabilize the lateral movement of the screw device during the opening, closing or self-locking of the elongated portion by the mechanism.

System and method for delivery of oilfield materials

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner.

Hydration apparatus and method

Vessels including an enclosure having an outer perimeter and an interior space, a channel disposed in the interior space, a first port disposed on a surface of the first enclosure at or proximate to a first end of the channel, and a second port disposed on a surface of the first enclosure at or proximate to a second end of the channel, where the channel has a length greater than the shortest distance between the first port and the second port, and where the first port and the second port are in fluid communication with one another.

Mixing apparatus with stator and method

Mobile erector system

A mobile support structure (MSS) includes a frame structure for receiving modular silos, a base moveable between transportation and support configurations, and connectors coupling with the silos. A mobile erecting assembly includes a chassis, a lift structure rotatable between transportation and mounting orientations while engaged with a silo, an engagement structure movable between first and second positions while engaged with the silo, and an actuator to move the engagement structure and silo between the first and second positions. The silo is connected to the mobile erector assembly in the transportation orientation, and the mobile erector assembly is then aligned relative to the MSS, such as by engaging an alignment member of the mobile erector assembly with a chassis alignment post of the MSS. The mobile erector assembly is then operated to move the silo to the mounting orientation, and the silo is then coupled to the MSS.

Mobile oilfield material transfer unit

A mobile oilfield material transfer unit includes a chassis having a gooseneck and support base, the support base including a first portion and second portion, and the chassis further comprising a rear axle suspension system coupled with at least two wheels for movably supporting the chassis. The mobile oilfield material transfer unit further includes an erecting mast assembly having a mast movably connected with the chassis proximate to the second portion, and an actuator system coupled with the mast and with the chassis for moving the mast between a horizontal position and a vertical position. At least two vertical conveyor assemblies may be coupled with the erecting mast and moveable between the horizontal position and the vertical position, and at least two horizontal conveyor systems may be coupled with the support frame and engageable with the at least two vertical conveyor assemblies. Each of the at least two horizontal conveyor systems may have a horizontal section with an inlet and an inclinable section with a discharge chute. Also, each of the at least two horizontal conveyor systems may be adapted to move a volume of oilfield material from the inlet to the discharge chute.

Proppant mixing and metering system

Clamping device for lifting slab, panel, or sheet material

Camping device suitable for lifting and handling of sheet like-objects, having a rigid frame configured to straddle an edge region of sheet-like objects, the frame including a stationary jaw and a frame housing defining a gap between them in which the sheet-like object may be received, the stationary jaw providing a first clamping surface, a movable jaw supported at the frame within the gap for movement towards and away from the stationary jaw, the movable jaw providing a second clamping surface, and an actuating carriage arranged to transmit a clamping force, the carriage being located between the movable jaw and frame housing for reciprocating movement along a longitudinal axis of the device on actuator tracks present at the movable jaw and frame housing, at least a portion of one of the actuator tracks having an inclined portion devised to bias the movable jaw towards the stationary jaw as the actuator carriage is caused by the clamping force to be displaced along the inclined portion, whereby the respective clamping surfaces are brought in contact with opposite faces of the sheet-like object when received within the frame and frictionally clamp same against displacement, characterized in that the movable jaw is supported at and mounted to the frame by at least one linkage arm which is articulated or pivoted at the movable jaw and near the upper end of the frame, respectively.

System and method for delivery of oilfield materials

A system and methodology facilitates the handling of oilfield material. The oilfield material is stored in at least one silo which enables use of gravity to feed the oilfield material to a blender or other suitable equipment. Each modular silo is transportable and may be engaged with a support structure via a pivot connection. Once engaged, the silo is pivoted to a raised, upright position on the support structure. The oilfield material is then moved to an interior of the silo, and gravity may be used to feed the oilfield material to a blender or other equipment in a controlled manner.

Compact articulation mechanism

A method utilizes a large-scale aggregate management system at a worksite. Mobile equipment is delivered with an elongated portion in a collapsed position relative another portion. A screw jack laterally moves a screw device extending/retracting the screw device. An end of the screw device is pivotally secured to the elongated portion and the screw device housing is pivotally coupled to the other portion of the equipment. Lateral movement of the screw device causes the elongated portion to pivot from the collapsed position to an operating position relative to the another portion. The screw device supports a load from the elongated equipment during movement from the collapsed position to the operating position. The screw device holds the elongated portion in the operating position in a substantially self-locking manner. The mobile equipment is operated, while the elongated portion is in the operating position, to deliver aggregate for a well related application.

Adjustment apparatus for container installation

An apparatus comprising a chassis, a mast movably coupled with the chassis, a first actuator operable to pivot the mast with respect to the chassis along a substantially vertical plane, and a second actuator operable to move the mast in a lateral direction with respect to the chassis along a substantially horizontal plane. The mast may support an oilfield material container. By pivoting the mast, the first actuator may be operable to pivot the oilfield material container with respect to the chassis along a substantially vertical plane. By moving the mast, the second actuator may be operable move the oilfield material container in a lateral direction with respect to the chassis along a substantially horizontal plane.

Fabrication process for protecting circuit components

One example includes a method for fabricating an integrated circuit (IC) device. The method includes fabricating a semiconductor die comprising an IC. The method also includes patterning a film over a portion of the first surface of the semiconductor die. The method also includes attaching a second surface of the semiconductor die opposite the first surface to a substrate. The method further includes depositing molding material over the semiconductor die to cover at least the first surface of the semiconductor die.

Metal ribs in electromechanical devices

In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

Usňový materiál se zlepšenými ekologickými parametry a způsob jeho přípravy

Usňový materiál obsahuje alespoň jeden biopolymer ze skupiny zahrnující substituovanou metylcelulózu a bakteriální celulózu, v množství 10 až 30 hmotn. d., alespoň jeden syntetický biodegradabilní polymer ze skupiny zahrnující polykaprolakton, kyselinu polymléčnou a polyvinylalkohol v množství 10 až 40 hmotn. d., alespoň jednu modifikační a zpracovatelskou složku na bázi rostlinné biomasy ze skupiny zahrnující kašovitou substanci z javorových listů a z odpadních jablek, v množství 10 až 50 hmotn. d., a dále jako změkčovadlo glycerol v množství 10 až 30 hmotn. d., přičemž celkové množství této směsi činí 100 hmotn. d. Způsob přípravy tohoto usňového materiálu zahrnuje: extrakci kaše z rostlinné biomasy alkalickým zpracováním pomocí 8 až 12% roztoku NaOH při teplotě 150 až 200 °C po dobu 1 až 2 h; vymývání extrahované kaše vodou o pH 7 až 9; sušení při teplotě 50 až 80 °C do konstantní hmotnosti; míchání získaného produktu s ostatními složkami; tváření směsi do plošného útvaru o konstantní tloušťce 1 až 3 mm; sušení ve volném prostředí při teplotě 20 až 30 °C do konstantní hmotnosti.

System and method for preparing a treatment fluid

A system and method are disclosed for preparing a treatment fluid and includes charging packets containing an additive encased within a liner to a first container packet storage area of a first container; passing the packets to a packet shredder; breaching the liners of the packets to expose the additive; passing exposed additive to a mixer; passing an aqueous solution to the mixer from a second container; and mixing the exposed additive with the aqueous solution to form the treatment fluid. The first container can also include a first container proppant storage area, and proppant is passed from the first container proppant storage area to the mixer. The treatment fluid can be charged to a well bore penetrating a subterranean formation. The system and method can also include a silo positioned in fluid flow communication with the first container and partitioned into a silo packet storage area and a silo proppant storage area.

Bump bond structure for enhanced electromigration performance

A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.

Sample Analysis Chip and Sample Analysis Method Using Sample Analysis Chip

The present invention provides a chip for sample assay and a sample assay method using same, the chip being capable of assaying a target analyte included in a sample, even with a trace amount of the sample, due to improved efficiency in capture of the target analyte included in the sample.

Mixing apparatus with flush line and method

A mixer and method for mixing are provided. The mixer includes a housing including a fluid inlet, an additive inlet, and an outlet. The housing defines a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber. When rotated, the impeller pumps fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a flush line extending between the mixing chamber and the additive inlet. The flush line is receives, from the mixing chamber, a portion of the fluid pumped by the impeller and to deliver the portion of the fluid to the additive inlet.

Mixing apparatus with stator and method

A mixer and method for mixing are provided. The mixer includes a housing having a fluid inlet, an additive inlet, and an outlet, with the housing defining a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber, wherein, when rotated, the impeller draws fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a stator disposed at least partially around the slinger, with the stator including vanes spaced circumferentially apart so as to define flowpaths therebetween.

Elektrochemisches system

Ein elektrochemisches System umfasst eine Mehrzahl gestapelter Bipolarplatten (2), welche jeweils aus zwei strukturierten, Wellenberge (17) und Wellentäler (18) beschreibenden Halbblechen (3, 4) zusammengesetzt sind, wobei zwischen den Halbblechen (3, 4) einer jeden Bipolarplatte (2) durch die Wellenberge (17) und Wellentäler (18) Kühlmittelkanäle (19) gebildet sind und die Bipolarplatten (3, 4) auf ihren Außenseiten zugleich Strömungskanäle (9, 10) für Betriebsmedien begrenzen, und wobei sich jeweils zwischen zwei Bipolarplatten (2) eine Membrananordnung (5) befindet. In einem Übergangsbereich (7) zwischen einem Aktivfeld (6) und einem Verteilerfeld (8) einer jeden Bipolarplatte (2) geht eine bezüglich einer Ebene, in der die Membrananordnung (5) liegt, spiegelsymmetrische Anordnung der Strömungskanäle (9, 10) in eine in deren Querrichtung versetzte Anordnung über.

Aparato y método de hidratación

Tanques que incluyen un receptáculo o cámara que tiene un perímetro exterior y un espacio interior, un canal dispuesto en el espacio interior, una primera puerta dispuesta sobre una superficie del primer receptáculo en o cerca de un primer extremo del canal, y una segunda puerta dispuesta sobre una superficie del primer receptáculo cerca o próxima un segundo extremo del canal, en donde el canal tiene una longitud mayor que la distancia más corta entre la primera puerta y la segunda puerta, y en donde la primera puerta y la segunda puerta se encuentran en comunicación fluida entre sí. Opcionalmente el tanque puede tener un segundo receptáculo con un perímetro exterior y un espacio interior con un segundo canal dispuesto en el espacio interior, una tercera puerta dispuesta sobre una superficie del segundo receptáculo en o cerca de un primer extremo del segundo canal, y una cuarta puerta dispuesta sobre una superficie del segundo receptáculo en o cerca de un segundo extremo del segundo canal, en donde la segunda puerta, la tercera puerta y la cuarta puerta se encuentran en comunicación fluida. En otras variantes opcionales, el tanque además incluye una pluralidad de receptáculos en donde cada uno tiene un perímetro externo y un espacio interior, un canal dispuesto en el espacio interior, una puerta dispuesta sobre una superficie del receptáculo en o cerca de un primer extremo del canal, y una puerta dispuesta sobre una superficie del receptáculo en o cerca de un segundo extremo del canal, en donde el canal tiene una longitud mayor que una distancia más corta entre las puertas, y la segunda puerta y las puertas dispuestas sobre la superficie de la pluralidad de receptáculos se encuentran en comunicación fluida. La forma perimetral de los receptáculos puede ser cualquier forma adecuada, incluyendo aunque sin limitarse a ello, una forma sustancialmente circular, ovoide o rectangular.

Embedded die package multichip module

An embedded die package (410) includes a die having an operating voltage between a first voltage potential and a second voltage potential that is less than the first voltage potential. A via, including a conductive material, is electrically connected to a bond pad (464) on a surface of the die, the via including at least one extension (494) perpendicular to a plane along a length of the via. A redistribution layer (460) is electrically connected to the via, at an angle with respect to the via defining a space (470) between the surface of the die and a surface of the redistribution layer (460). A build-up material is in the space.

Mixing apparatus with flush line and method

A mixer and method for mixing are provided. The mixer includes a housing including a fluid inlet, an additive inlet, and an outlet. The housing defines a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber. When rotated, the impeller pumps fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a flush line extending between the mixing chamber and the additive inlet. The flush line is receives, from the mixing chamber, a portion of the fluid pumped by the impeller and to deliver the portion of the fluid to the additive inlet.

Integrated process delivery at wellsite

A mixing unit comprising a frame, a rheology control portion, and a high-volume solids blending portion. The rheology control portion comprises means for receiving a first material from a first transfer mechanism, a dispersing/mixing system connected with the frame, and a first metering system to meter the first material from the first material receiving means to the dispersing/mixing system. The dispersing/mixing system disperses/mixes the metered first material with a fluid to form a first fluid mixture. The high-volume solids blending portion comprises means for receiving a second material from a second transfer mechanism, a solids blending system connected with the frame, and a second metering system to meter the second material from the second material receiving means to the solids blending system. The solids blending system blends the metered second material with the first fluid mixture to form a second fluid mixture.

Elektrochemisches System

Elektrochemisches System, umfassend eine Mehrzahl gestapelter Bipolarplatten (2), welche jeweils aus zwei strukturierten, Wellenberge (17) und Wellentäler (18) beschreibenden Halbblechen (3, 4) zusammengesetzt sind, wobei zwischen den Halbblechen (3, 4) einer jeden Bipolarplatte (2) durch die Wellenberge (17) und Wellentäler (18) Kühlmittelkanäle (19) gebildet sind und die Bipolarplatten (3, 4) auf ihren Außenseiten zugleich Strömungskanäle (9, 10) für Betriebsmedien begrenzen, und wobei sich jeweils zwischen zwei Bipolarplatten (2) eine Membrananordnung (5) befindet, wobei in einem Übergangsbereich (7) zwischen einem Aktivfeld (6) und einem Verteilerfeld (8) einer jeden Bipolarplatte (2) eine bezüglich einer Ebene, in der die Membrananordnung (5) liegt, spiegelsymmetrische Anordnung der Strömungskanäle (9, 10) in eine in deren Querrichtung versetzte Anordnung übergeht, wobei innerhalb des Übergangsbereichs (7) die, die Kühlmittelkanäle (19) bildenden Wellenberge (17) und Wellentäler (18) des ersten Halbblechs (3) einer jeden Bipolarplatte (2) derart gegenüber den Wellenbergen (17) und Wellentälern (18) des zweiten Halbblechs (4) auseinanderlaufen, dass im Aktivfeld (6) gegebene getrennte, zueinander parallele Kühlmittelkanäle (19) in jeder Bipolarplatte (2) in einen zusammenhängenden, sich über mehrere Wellenberge (17) und Wellentäler (18) erstreckenden Kühlmittelraum (20) übergehen, und wobei in demjenigen Abschnitt des Übergangsbereichs (7), in welchem die einzelnen Kühlmittelkanäle (19) einer jeden Bipolarplatte (2) zu einem Kühlmittelraum (20) vereint sind, die Membrananordnung (5) lose zwischen den benachbarten Bipolarplatten (2) liegt, wobei die Auslenkbarkeit der Membrananordnung (5) durch diese Bipolarplatten (2) in Querrichtung der Strömungskanäle (9, 10) alternierend in lediglich einer Richtung, jeweils normal zur genannten Ebene, blockiert ist.

Crankshaft and connecting rod assemblies for hydraulic fracturing pumps

Crankshaft and connecting rod assemblies for hydraulic fracturing pumps and related methods may enhance the flow of fracturing fluid into a wellhead during a high-pressure fracturing operation. The assemblies and methods may include a crankshaft having a crankpin between first and second journals. The crankpin may include first and second longitudinally spaced ridges at least partially extending circumferentially around the crankpin. The assemblies and methods further may include first and second connecting rods connected to the crankpin. The first connecting rod may include first and second crankpin connectors connected to the crankpin and at least partially defining therebetween a connecting rod clearance between and positioned to at least partially receive therein an end of a second connecting rod. The assemblies and methods also may include first and second rod clamps connected to the first crankpin connector, thereby to rotatably connect the first and second connecting rods to the crankpin.

Mixing apparatus with stator and method

A mixer and method for mixing are provided. The mixer includes a housing having a fluid inlet, an additive inlet, and an outlet, with the housing defining a mixing chamber in fluid communication with the fluid inlet, the additive inlet, and the outlet. The mixer also includes an impeller disposed in the mixing chamber, wherein, when rotated, the impeller draws fluid through the fluid inlet. The mixer also includes a slinger disposed in the mixing chamber and configured to receive the fluid from the impeller and to receive an additive from the additive inlet. When rotated, the slinger slings the fluid and the additive radially outwards. The mixer further includes a stator disposed at least partially around the slinger, with the stator including vanes spaced circumferentially apart so as to define flowpaths therebetween.

Clamping Device for Lifting Slab, Panel or Sheet Material

Integral reciprocating pump structure supporting spacer section

A reciprocating pump having a power end, a fluid end, and a spacer section interposing the power and fluid ends. The power end includes a structural support frame having structural members that are each a discrete, unitary member. Each structural member forms a portion of a crankcase frame, a portion of a crosshead support frame, and a portion of a support base. The support base portion extends beneath the crosshead support frame and the spacer section.