Method for solution phase synthesis of oligonucleotides

Method for solution phase synthesis of oligonucleotides

Method for solution phase synthesis of oligonucleotides

Adhesive formulations

Adhesive formulations

An adhesive composition including as principal components: (a) about 10-90% by weight of at least one free radical-polymerizable monomer, (b) about 0-20% by weight of an adhesion promoter, (c) about 10-80% by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (M w ) less than about 18,000 or a number average molecular number (M n ) less than about 10,000 and; (d) about 1-15% by weight of an auxiliary high molecular weight toughener (or toughening agent) with a M w greater than about 18,000 or a M n greater than about 10,000 based on the total weight of components (a)-(d).

Structural adhesives containing maleimide terminated polyimides

A maleimide terminated polyimide incorporated into a two-part acrylic structural adhesive system. The maleimide terminated polyimide of the various embodiments of the present invention provide improving thermal stability, strength, and toughness.

Elastomer adhesive with rapid tack development

An adhesive composition having two distinct reaction mechanisms, a first being the reaction between a tri-functional isocyanate and an active hydrogen compound and a second begin the free radical initiation of an acrylic monomer. This adhesive develops tack strength through the first reaction allowing two substrates to remain in position relative to one another while the free radical cure of the acrylic monomer takes place to fully bond the substrates together, for example when adhering a rubber liner to the inside of a metallic tank.

Acrylic structural adhesive having improved T-peel strength

Epoxy-modified, two-part acrylic structural adhesives represented by an A-side in a preferred embodiment containing a monomer selected from group (a) and (b), wherein (a) is 4-(C3-C10 alkyl) cyclohexylmethacrylate, 2,5-(C1-C6 alkyl) disubstituted cyclohexylmethacrylate, 3,5-(C1-C6 alkyl) disubstituted cyclohexylmethacrylate. 3,3,4-(C1-C4 alkyl) tri-substituted cyclohexylmethacrylate, 3,3,5-(C1-C4 alkyl) tri-substituted cyclohexylmethacrylate, 3,3,5,5-(C1-C4 alkyl) tetra-substituted cyclohexylmethacrylate, and (b) is C7-C10 alkyl methacrylates selected from bornyl (C10H17 cyclo) methacrylate, and isobornyl methacrylate; a multifunctional crosslinking monomer, a cure rate modifier, an inorganic filler, an adhesion promoter, a reactive diluent, a solid and/or liquid toughener, and a reducing agent; and a B-side containing an epoxy resin, an oxidizer, a non-reactive liquid carrier, an inorganic filler, a thixotropic agent, optional plasticizer in addition to said liquid carrier; and an optional ...

ELASTOMER ADHESIVE WITH RAPID TACK DEVELOPMENT

An adhesive composition having two distinct reaction mechanisms, a first being the reaction between a tri-functional isocyanate and an active hydrogen compound and a second begin the free radical initiation of an acrylic monomer. This adhesive develops tack strength through the first reaction allowing two substrates to remain in position relative to one another while the free radical cure of the acrylic monomer takes place to fully bond the substrates together, for example when adhering a rubber liner to the inside of a metallic tank. 1. An adhesive comprising an acrylate monomer , a tri-functional isocyanate , an active hydrogen compound and a free radical initiator.2. The adhesive of claim 1 , wherein the tri-functional isocyanate comprises an isocyanurate or biuret based tri-isocyanate.3. The adhesive of claim 2 , wherein the tri-functional isocyanate comprises an isocyanurate trimer of hexamethylene diisocyanate.4. The adhesive of claim 1 , wherein the tri-functional isocyanate is present in an amount from about 1.0 to about 7.0 claim 1 , preferably about 3.0 to about 5.0 weight percent based upon the weight percent of the adhesive.5. The adhesive of claim 1 , wherein the acrylate monomer comprises at least one of tetrahydrofurfuryl methacrylate or methyl methacrylate.6. The adhesive of claim 1 , wherein the acrylate monomer comprises at least 50 percent by weight of the adhesive.7. The adhesive of claim 1 , wherein the adhesive further comprises at least one of a toughener and an adhesion promoter.8. The adhesive of claim 1 , wherein the adhesive further comprises an amine.9. The adhesive of claim 1 , wherein the adhesive further comprise a moisture scavenger.10. The adhesive of claim 9 , wherein the moisture scavenger comprises para-toluenesulfonyl isocyanate.11. The adhesive of claim 1 , wherein the active hydrogen containing compound comprises at least one of methacrylic acid claim 1 , phosphoric acid claim 1 , HEMA-phosphate or hydrophilic fumed silica.12. ...

Semiconductor packaged device and its manufacturing method

Adhesive formulations containing a primary low molecular weight toughener and an auxiliary high molecular weight toughener

An adhesive composition including as principal components: (a) about 10-90 % by weight of at least one free radical-polymerizable monomer; (b) about 0-20 % by weight of an adhesion promoter; (c) about 10-80 % by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (Mw) less than about 18,000 or a number average molecular number (Mn) less than about 10,000; and (d) about 1-15 % by weight of an auxiliary high molecular weight toughener (or toughening agent) with a Mw greater than about 18,000 or a Mn greater than about 10,000 based on the total weight of components (a)-(d).

Ball grid array semiconductor package

Manufacturing method of semiconductor package of encapsulating body with opening slot

Dual-die semiconductor package using lead as die pad

High strength, long-open time structural polyurethane adhesive and method of use thereof

Disclosed is a two-part polyurethane structural adhesive and method of bondi ng structural components, that exhibits at least 25 minutes of open time at 32 ~C in large beads and cures to high strength under ambient conditions. The adhesive composition in one part is an isocyanate or isocyanate prepolymer a nd in a second part is a polyol mixture (I) or (II), wherein 75 % to 100 % by weight of the polyol mixture (I) or (II) are polyols having secondary hydrox yl functionality and the polyol mixture (I) or (II) contains a long chain secondary polyol defined hereinbelow. The polyol mixture in one embodiment i s substantially absent short chain polyols having functionality of 2, and includes an amount from 30 % to 80 % by weight on total polyol weight in (I) of long chain secondary polyol of molecular weight from 200 to 12000 and fro m 20 % to 70 % by weight on total weight of the polyol mixture and of a short chain secondary polyol with functionality greater than 2 and a molecular weight of from 90 to 800. In another embodiment, 5 % to 80 % of a long chain secondary polyol of molecular weight of from 2000 to 12000 is present togeth er with 5 % to 70 % of a short chain secondary polyol having a functionality of greater than 2, and 5 % to 70 % of a short chain secondary polyol having a functionalityof 2 and a molecular weight of from 90-800.

Substrate for passive device

Process for producing ion exchange membranes, and the ion exchange membranes produced thereby

The present invention relates to ion exchange membranes comprising soluble graft copolymer comprising a backbone of a first polymer having a main chain containing aromatic rings and a polymerizable vinyl or ring containing compound which contains at least one functional group which displays ion exchange functionality or may be converted to display ion exchange functionality, which is grafted onto said first polymer on at least one of said aromatic rings or on at least one benzylic carbon atom of said aromatic rings. The copolymer components may be selected to produce membranes for a variety of uses including electrodialytic processes such as electrodialytic concentration and separation processes, electrodialytic water splitting, electrolysis or electrolytic splitting of water and fuel cells for electrical generation; and pressure or chemical potential driven membrane processes such as ultrafiltration, reverse osmosis, piezodialysis, diffusion dialysis and pervaporation. The ion exchange membranes of the present invention display excellent mechanical properties, electrical and mechanical stability to oxidizing acids, good permselectivity and resistance to fouling. Process for making said graft copolymers, and process for making specific graft copolymers are also disclosed.

Singulation method of semiconductor package

Manufacturing method for semiconductor package with heat sink

Process for producing ion exchange membranes, and the ion exchange membranes produced thereby

The present invention relates to ion exchange membranes comprising soluble graft copolymer comprising a backbone of a first polymer having a main chain containing aromatic rings and a polymerizable vinyl or ring containing compound which contains at least one functional group which displays ion exchange functionality or may be converted to display ion exchange functionality, which is grafted onto said first polymer on at least one of said aromatic rings or on at least one benzylic carbon atom of said aromatic rings. The copolymer components may be selected to produce membranes for a variety of uses including electrodialytic processes such as electrodialytic concentration and separation processes, electrodialytic water splitting, electrolysis or electrodialytic splitting of water and fuel cells for electrical generation: and pressure or chemical potential driven membrane processes such as ultrafiltration, reverse osmosis, piezodialysis, diffusion dialysis and pervaporation. The ion exchange membranes of the present invention display excellent mechanical properties, electrical and mechanical stability to oxidizing acids, good permselectivity and resistance to fouling. Process for making said graft copolymers, and process for making specific graft copolymers are also disclosed.

Adhesive formulations

An adhesive composition including as principal components: (a) about 10-90 % by weight of at least one free radical-polymerizable monomer; (b) about 0-20 % by weight of an adhesion promoter; (c) about 10-80 % by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (Mw) less than about 18,000 or a number average molecular number (Mn) less than about 10,000; and (d) about 1-15 % by weight of an auxiliary high molecular weight toughener (or toughening agent) with a Mw greater than about 18,000 or a Mn greater than about 10,000 based on the total weight of components (a)-(d).

High strength, long-open time structural polyurethane adhesive and method of use thereof

Disclosed is a two-part polyurethane structural adhesive and method of bonding structural components, that exhibits at least 25 minutes of open time at 32 °C in large beads and cures to high strength under ambient conditions. The adhesive composition in one part is an isocyanate or isocyanate prepolymer and in a second part is a polyol mixture (I) or (II), wherein 75 % to 100 % by weight of the polyol mixture (I) or (II) are polyols having secondary hydroxyl functionality and the polyol mixture (I) or (II) contains a long chain secondary polyol defined hereinbelow. The polyol mixture in one embodiment is substantially absent short chain polyols having functionality of 2, and includes an amount from 30 % to 80 % by weight on total polyol weight in (I) of long chain secondary polyol of molecular weight from 200 to 12000 and from 20 % to 70 % by weight on total weight of the polyol mixture and of a short chain secondary polyol with functionality greater than 2 and a molecular weight of from 90 to 800. In another embodiment, 5 % to 80 % of a long chain secondary polyol of molecular weight of from 2000 to 12000 is present together with 5 % to 70 % of a short chain secondary polyol having a functionality of greater than 2, and 5 % to 70 % of a short chain secondary polyol having a functionality of 2 and a molecular weight of from 90-800.

Adhesive formulations containing a primary low molecular weight toughener and an auxiliary high molecular weight toughener

An adhesive composition including as principal components: (a) about 10-90 % by weight of at least one free radical-polymerizable monomer; (b) about 0-20 % by weight of an adhesion promoter; (c) about 10-80 % by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (Mw) less than about 18,000 or a number average molecular number (Mn) less than about 10,000; and (d) about 1-15 % by weight of an auxiliary high molecular weight toughener (or toughening agent) with a Mw greater than about 18,000 or a Mn greater than about 10,000 based on the tot al weight of components (a)-(d).

Structure of sign lamp for automobile

Asynchronous transfer mode multiplexer for interactive multimedia applications

Tape ball grid array chip package structure and the process thereof

Substrate carrier with elastic component

Integrated circuit package mold structure capable of preventing flash

Singulation method of integrated circuit packaging cell

Wafer level semiconductor package structure having high heat dissipation function and the process thereof

Semiconductor package with molding compound flange and fabrication method thereof

Method of fusing to break the electrically-conductive wiring in the semiconductor packaging test procedure

Leadless image sensor package

Photosensitive semiconductor package to prevent delamination

Semiconductor package with enhanced heat-dissipation efficiency

Layout method of thin and fine ball grid array semiconductor package substrate

Mold device for use in semiconductor press

Photosensitive semiconductor packaging process for preventing flashing

Door hinge for heavy loading

BGA semiconductor packaged-component with embedded heat dissipation member

發電裝置

Control device for use with special oil