METHOD OF SEPARATING ACID

MOLDING POWDER

A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 μm or more and 200 μm or less, and the fluororesin has a D10 of 12 μm or more. 1. A shaping material for a powder bed fusion method , comprising a powder of a fluororesin ,wherein the fluororesin has a D50 of 30 μm or more and 200 μm or less, andthe fluororesin has a D10 of 12 μm or more.2. The shaping material according to claim 1 , wherein the fluororesin has a D50 of 50 μm or more and 70 μm or less claim 1 , andthe fluororesin has a D10 of 17 μm or more.3. The shaping material according to claim 1 , wherein the fluororesin has a D50 of 50 μm or more and 70 μm or less claim 1 ,the fluororesin has a D10 of 17 μm or more, andthe fluororesin has a D90 of 130 μm or less.4. The shaping material according to claim 1 , wherein the powder of the fluororesin has a static bulk density of 0.850 g/ml or more and 1.500 g/ml or less.5. The shaping material according to claim 1 , wherein the powder of the fluororesin has a static bulk density of 0.950 g/ml or more and 1.100 g/ml or less.6. The shaping material according to claim 1 , wherein the fluororesin is a tetrafluoroethylene-perfluoroalkoxyethylene copolymer claim 1 , a tetrafluoroethylene-hexafluoropropylene copolymer claim 1 , or an ethylene-tetrafluoroethylene copolymer.7. The shaping material according to claim 1 , further comprising a material other than the fluororesin.8. The shaping material according to claim 7 , wherein the other material is a silica claim 7 , a carbon fiber claim 7 , graphite claim 7 , a carbon nanotube claim 7 , a carbon nanohorn claim 7 , fullerene claim 7 , aluminum oxide claim 7 , clay claim 7 , montmorillonite claim 7 , or talc.9. The shaping material according to claim 7 , wherein the other material is a silica particle. This application is a Continuation of International Application No. PCT/JP2019/017887 filed Apr. 26, 2019, claiming priority based on Japanese ...

POWER CONVERSION APPARATUS PROVIDED WITH SEMICONDUCTOR MODULE AND ELECTRONIC COMPONENT PRESSURIZED BY PRESSURIZING MEMBER

A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction. 1. A power conversion apparatus comprising:a semiconductor module that integrates a semiconductor element;an electronic component electrically connected to the semiconductor module;a plurality of cooling pipes that cool the semiconductor module and the electronic component, the cooling pipes being disposed to sandwich both sides of the semiconductor module and the electronic component;a casing that accommodates the semiconductor module, the electronic component and the cooling pipes, an abutting surface being provided at a part of the casing, wherein the electronic component comes into contact with the abutting surface;a semiconductor section including the semiconductor module and the cooling pipes arranged therein;an electronic component section including the electronic component and the cooling pipes; anda pressurizing member that pressurizes the semiconductor section in a first direction, the first direction extending from the semiconductor module to the electronic component section, whereinthe semiconductor section and the electronic component section are arranged to be adjacent to each other;the electronic component ...

SHAPING POWDER

A shaping material for a powder bed fusion method, containing a powder of a fluororesin. 1. A shaping material for a powder bed fusion method , comprising a powder of a fluororesin.2. The shaping material according to claim 1 , wherein the powder of the fluororesin has a static bulk density of 0.3 g/ml or more and 1.5 g/ml or less.3. The shaping material according to claim 1 , wherein the powder of the fluororesin has a particle diameter of 10 μm or more and 300 μm or less in terms of D50.4. The shaping material according to claim 1 , wherein the powder of the fluororesin has a Hausner ratio of 1.10 or more and 1.30 or less.5. The shaping material according to claim 1 , wherein the powder of the fluororesin has a sphericity of 0.60 or more.6. The shaping material according to claim 1 , wherein the powder of the fluororesin has a sphericity of 0.70 or more and 0.95 or less.7. The shaping material according to claim 1 , wherein the fluororesin is a tetrafluoroethylene-perfluoroalkoxyethylene copolymer claim 1 , a tetrafluoroethylene-hexafluoropropylene copolymer claim 1 , or an ethylene-tetrafluoroethylene copolymer.8. The shaping material according to claim 1 , further comprising a silica particle. The present disclosure relates to a three-dimensionally shaping powder, and particularly relates to a shaping powder which is used in a powder bed fusion method.In recent years, an interest in a three-dimensionally shaping apparatus, a so-called 3D printer, has increased as a technique of shaping a three-dimensional structure. As a system regarding three-dimensional shaping, for example, a vat photopolymerization method of performing shaping by irradiating a monomer of a photocurable resin in a vat with light, a material extrusion method of performing shaping by extruding a flowable material from a nozzle to stack the flowable material, a binder injection method of performing shaping by injecting a binder into a powder material to bind the powder material, an inkjet method ...

VEHICLE INTERIOR BOARD AND METHOD FOR MANUFACTURING SAME

A vehicle interior board which is thin, lightweight, has high strength, has less degradation, peeling and the like near an end portion of a metal plate, and has high quality and excellent productivity; and a method for manufacturing the same. The vehicle interior board includes a pair of metal plates and a foamed polyurethane layer formed between the pair of metal plates. A projecting ridge projecting outwardly and extending in a predetermined direction along the outer surface is formed on an outer surface of the metal plate. Thus, it is possible to obtain desired strength and rigidity even when the metal plates or the foamed polyurethane layer are thinned or when a lightweight aluminum plate or the like is adopted as the metal plates. Therefore, it is possible to reduce weight of a vehicle interior board. 1. A vehicle interior board comprising:a pair of metal plates each comprising an outer surface; anda foamed polyurethane layer formed between the pair of metal plates, whereina projecting ridge projecting outwardly and extending in a predetermined direction along the outer surface the metal plate.2. The vehicle interior board according to claim 1 , whereinat a peripheral edge portion, the foamed polyurethane layer is formed to cover peripheral end portions of the metal plates and flush with outer surfaces of the metal plates.3. A method for manufacturing a vehicle interior board claim 1 , comprising:a step of molding a pair of flat metal plates respectively into predetermined planar shapes;a step of coating main surfaces respectively corresponding to inner surfaces of the pair of metal plates with an epoxy resin-based coating agent;a step of forming a molding space between the pair of metal plates by sandwiching the pair of metal plates between a lower mold and an upper mold so that the main surfaces corresponding to the inner surfaces coated with the coating agent face each other; anda step of forming a foamed polyurethane layer by reacting raw materials of ...

PELLICLE

The purpose of the present invention is to provide a pellicle which has, on the inner surface of the pellicle frame, a pressure-sensitive adhesive layer that has holding performance capable of satisfactorily adhering suspended substances including dust thereto and that has excellent resistance to short-wavelength light. This pellicle comprises a pellicle frame, a pellicle film stretched over the pellicle frame, and a pressure-sensitive adhesive layer disposed inside the pellicle frame, wherein the pressure-sensitive adhesive layer comprises a copolymer having structural units represented by formula (1) and structural units represented by formula (2), the amount of the copolymer being 60 mass % or more of the pressure-sensitive adhesive layer. 1. A pellicle comprising:a pellicle frame;a pellicle membrane stretched over one opening of the pellicle frame; anda tacky layer provided on an inner surface of the pellicle frame, [{'br': None, 'sub': 2', '2, '—CHCF—\u2003\u2003(1)'}, {'br': None, 'sub': 2', '3, '—CFCF(CF)—\u2003\u2003(2)'}], 'wherein the tacky layer contains a copolymer having a structural unit represented by Formula (1) and a structural unit represented by Formula (2), in an amount of 60mass % or more with respect to a total weight of the tacky layer.'}2. The pellicle according to claim 1 , wherein a content of the structural unit represented by Formula (1) in the copolymer is 50mass % or more and 85mass % or less with respect to a total mass of the copolymer.3. The pellicle according to claim 1 , wherein a weight average molecular weight of the copolymer is 80 claim 1 ,000 or more and 160 claim 1 ,000 or less.4. The pellicle according to claim 1 , wherein a fluorine content of the copolymer is 64mass % or more and 71mass % or less with respect to the total mass of the copolymer.5. The pellicle according to claim 1 , wherein the copolymer further contains a structural unit represented by Formula (3).{'br': None, 'sub': 2', '2, '—CFCF—\u2003\u2003(3)'}6. The ...

Pellicles having low adhesive residue

Apparatus for manufacturing filter

Composite of alkaliiproof glass

Ignition coil for internal combustion engine

The invention relates to an ignition coil 2 for an internal combustion engine, which is composed of low tension components including a low tension coil 516 and high tension components including a high tension coil 512, a high tension terminal 27 connected to the high tension coil 512 and a connecting member 512a connected between the high tension coil 512 and the high tension terminal 27. The ignition coil further comprises a conductive member 513, 535b, 530b, 540b, 550 for providing a conductive surface area to moderate electric field strength around the high tension components.

Ignition coil for internal combustion engine

A conductive member (513, 535b, 530b, 540b, 550) is disposed between a secondary spool (510) and a high tension terminal (27) to shield the wire connecting the secondary coil (512) and the high tension terminal (27). The conductive member has a wide surface facing the low tension components to moderate the electric field strength around low tension components, thereby preventing trees from growing in the insulating filler of the ignition coil (2).

Pellicle for high numerical aperture exposure device

This invention provides a pellicle that is used in a semiconductor lithography process and is usable in an exposure device having a numerical aperture in an optical system of not less than 1.0. The pellicle comprises a pellicle film having a thickness which has been regulated so that the transmittance as measured in an angle of incidence of exposure light to the pellicle film of not less than 0º and not more than 20º is not less than 95%. The use of the pellicle can realize the manufacture of a semiconductor element having a nonconventional fine circuit pattern at good yield while preventing the adherence of dust onto a leticule.

Ignition coil for internal combustion engine

An ignition coil 2 for an internal combustion engine comprises a casing 100, a transformer section composed of a columnar core 502 disposed in the casing 100, a secondary coil 512 which is wound around said core 502, wherein a secondary spool 510 has the secondary coil 512 thereon, a primary coil 516 disposed around the secondary coil 512, wherein a primary spool 514 which is disposed around the secondary coil 512 and has the primary coil 516 thereon, and an auxiliary core 508 disposed around the primary coil 516. A high tension terminal 27 is connected to the secondary coil 512, and an insulating filler 29 is disposed in the casing 100, wherein the primary spool 514 comprises a portion projecting from an imaginary straight line extending between a high tension end of outer periphery of the high tension terminal 27 immersed and an end of inner periphery of the auxiliary core 508.

Method of manufacturing pellicle and pellicle manufacturing jig

A method of manufacturing a pellicle, in which a thin film which is one of the components of a pellicle to serve as a dust-proof cover of a mask used for patterning in the manufacture of a semiconductor device or a liquid crystal display panel is temporarily formed on a frame larger than a specific frame which is another component of the pellicle, adhesive is applied to the specific frame beforehand and the larger frame is put on the specific frame with adhesive to bond the thin film which is applied temporarily to the larger frame to the specific frame. The thin film which is applied to the larger frame is transferred to the specific frame and parts of the thin film which protrude from the specific frame are cut off with a physical cutting means to obtain a pellicle. Immediately after, or simultaneously when, or before the parts of the thin film are cut off with the physical cutting means, coating material which is obtained by dissolving a specific resin in organic solvent is applied to the parts of the thin film which are to be cut off with the physical cutting means.

Shaping powder

A shaped body of a fluororesin obtained using a shaping material comprising a powder of a fluororesin. The powder of the fluororesin has a static bulk density of 0.3 g/ml or more and 1.5 g/ml or less, and a particle diameter of 10 μm or more and 300 μm or less in terms of D50. Also disclosed is a three-dimensional structure containing the shaped body, and a method of shaping the shaping material.

Shaping powder

Shaped object of fluororesin

The present invention provides a shaping material for a powder bed fusion method, comprising a powder of a fluororesin.

Shaping powder

A shaping material for a powder bed fusion method, containing a powder of a fluororesin.

Composite of alkaliiproof glass

Molding powder

A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 μm or more and 200 μm or less and a D10 of 12 μm or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.

Manufacture of artificial decorative veneet

Cord mounting type disc structure

Method of brushing wooden veneer

Method of molding cement products reinforced with glass fiber

Manufacture of artificial decorative veneer

Energieumwandlungsgerät, das mit einem Halbleitermodul und einer elektronischen Komponente vorgesehen ist, die durch ein Druckbeaufschlagungsbauteil druckbelastet werden

Eine Leistungsumwandlungsgerät (1) weist Folgendes auf: ein Halbleitermodul (2), eine elektronische Komponente (3), eine Vielzahl von Kühlleitungen (4) und ein Gehäuse (5), das das Halbleitermodul, die elektronische Komponente und die Kühlleitungen aufnimmt. Eine Anlagefläche (7) ist an einem Teil des Gehäuses vorgesehen, in dem die elektronische Komponente mit der Anlagefläche in Kontakt kommt. Ein Druckbeaufschlagungsbauteil (61) drückt das Halbleitermodul in eine erste Richtung (X), die sich von dem Halbleitermodul zu der elektronischen Komponente erstreckt. Die elektronische Komponente weist einen Teilkörper (30) und einen Flügelabschnitt (31) auf und der Flügelabschnitt steht von dem Teilkörper an zumindest jeder Seite von beiden Seiten davon in Bezug auf eine zweite Richtung (Y) senkrecht zu der ersten Richtung vor und kommt mit der Anlagefläche von einer Halbleitermodulseite in Bezug auf die erste Richtung in Kontakt.

Proszek formujący

Dyeing of veneer

Polvo de moldeado

La presente invención proporciona un material de conformación para un método de unión por fusión en lecho de polvo, conteniendo el material de conformación un polvo de una resina de fluorocarbono. (Traducción automática con Google Translate, sin valor legal)

Manufacture of artificial decorative veneer

Honeycomb connecting chair

Pellicle

The purpose of the present invention is to provide a pellicle which has, on the inner surface of the pellicle frame, a pressure-sensitive adhesive layer that has holding performance capable of satisfactorily adhering suspended substances including dust thereto and that has excellent resistance to short-wavelength light. This pellicle comprises a pellicle frame, a pellicle film stretched over the pellicle frame, and a pressure-sensitive adhesive layer disposed inside the pellicle frame, wherein the pressure-sensitive adhesive layer comprises a copolymer having structural units represented by formula (1) and structural units represented by formula (2), the amount of the copolymer being 60 mass % or more of the pressure-sensitive adhesive layer. —CH 2 CF 2 —  (1) —CF 2 CF(CF 3 )—  (2)