Separating type backpack

The present invention relates to a separating type backpack, which includes an upper side backpack including a shoulder strap; a lower side backpack including a belt member coupled to the upper side backpack which can be attached or detached from the belt member; and a first sliding device which is used for coupling the lower side backpack to be slidably moved according to the belt member.

Storage device and related programming method

A method of programming a storage device comprises determining whether at least one open page exists in a memory block of a nonvolatile memory device, and as a consequence of determining that at least one open page exists in the memory block, closing the at least one open page through a dummy pattern program operation, and thereafter performing a continuous writing operation on the memory block.

Portable terminal for controlling hearing aid and method therefor

A method for controlling a hearing aid using a portable terminal is provided. The method includes taking a photo, generating a control signal to control a hearing mode of the hearing aid according to an analysis of a surrounding condition based on the photo, and transmitting the control signal to the hearing aid.

Poly(ethylene-aliphatic diene) copolymer and preparation method thereof

Disclosed is a poly(ethylene-aliphatic diene) copolymer having superior miscibility, adhesivity, printability and scratch resistance, compared to conventional TPO based TPEs or SBC TPEs, by introducing a variety of functional groups to an end portion of the ethylene-aliphatic diene copolymer such that the poly(ethylene-aliphatic diene) copolymer may be utilized in a variety of fields, and a method thereof.

Apparatus and method for canceling feedback in hearing aid

A method of operating an electronic device is provided. The method includes transmitting, by the electronic device, a control signal for controlling a microphone sensitivity of a hearing aid, to the hearing aid, and transmitting a reception signal from a counterpart electronic device to the hearing aid.

CAMERA LENS MODULE

According to an embodiment, an electronic device including a camera lens module having a miniaturization and a lightening function, as well as a hand-trembling correction function mounted thereon, is described. The camera lens module may include a base, a first moving part containing a lens assembly and coupled to the base, and a second moving part. The first moving part may be configured to move on a plane perpendicular to the optical axis of the lens assembly. The second moving part may be disposed under the base and configured to move in the optical axis direction of the lens assembly. A variable gap between the first moving part and the second moving part may have a distance that varies based on a movement of the second moving part forward or backward in the optical axis direction.

Camera lens module

According to an embodiment, an electronic device including a camera lens module having a miniaturization and a lightening function, as well as a hand-trembling correction function mounted thereon, is described. The camera lens module may include a base, a first moving part containing a lens assembly and coupled to the base, and a second moving part. The first moving part may be configured to move on a plane perpendicular to the optical axis of the lens assembly. The second moving part may be disposed under the base and configured to move in the optical axis direction of the lens assembly. A variable gap between the first moving part and the second moving part may have a distance that varies based on a movement of the second moving part forward or backward in the optical axis direction.

Process of preparing microspheres for sustained release having improved dispersibility and syringeability

Disclosed is a process of preparing sustained release microspheres, containing a biodegradable polymer as a carrier and a drug, using spray drying. The process comprises preparing a solution, suspension or emulsion containing a biodegradable polymer, a drug and a solvent; spray drying the solution, suspension or emulsion; and suspending spray-dried microspheres in an aqueous solution containing polyvinyl alcohol to remove the residual solvent and increase the hydrophilicity of the microsphere surface. The process enables the preparation of microspheres having high drug encapsulation efficiency, almost not having a toxicity problem due to the residual solvent, and having good syringeability. The microspheres prepared according to the present invention release an effective concentration of a drug in a sustained manner for a predetermined period when administered to the body, and are thus useful in the treatment of diseases.

ULTRASOUND SYSTEM FOR PROVIDING AN ULTRASOUND IMAGE OPTIMIZED FOR POSTURE OF A USER

Embodiments of an ultrasound system for detecting a posture of a user and providing an optimal ultrasound image for the posture of the user are disclosed. The ultrasound system includes a display unit including a sensing unit installed in one side of a monitor. The sensing unit detects a position of a user, a distance between the user and the monitor, a height of the user with respect to the monitor and a viewing angle of the user toward the monitor to thereby form and output sensing signals corresponding thereto. The ultrasound system further includes a processing unit coupled to the sensing unit. The processing unit forms the ultrasound image by using ultrasound data and performs optimal image processing for the posture of the user upon the ultrasound image based on the sensing signals. 1. An ultrasound system , comprising:an ultrasound data acquisition unit configured to transmit ultrasound signals to a target object and receive ultrasound echo signals reflected from the target object to thereby acquire ultrasound data;a display unit including a monitor and being configured to display an ultrasound image;a sensing unit installed on one side of the monitor and being configured to detect a position of a user, a distance between the user and the monitor, a height of the user with respect to the monitor and a viewing angle of the user toward the monitor to thereby form and output sensing signals corresponding thereto;a storage unit configured to store optimal posture information necessary for providing an optimal ultrasound image according to a posture of the user; anda processing unit coupled to the ultrasound data acquisition unit, the sensing unit and the storage unit, the processing unit being configured to form the ultrasound image by using the ultrasound data and perform an optimal image processing for the posture of the user upon the ultrasound image based on the sensing signals and the optimal posture information.2. The ultrasound system of claim 1 , wherein ...

NONVOLATILE MEMORY DEVICE AND READ METHOD THEREOF

According to example embodiments, a read method of a nonvolatile memory device includes Disclosed is a read method of a nonvolatile memory device which includes selecting one of a plurality of vertical strings in a nonvolatile memory device, judging a channel length between a common source line and a selected one of the plurality of vertical strings, selecting a sensing manner corresponding to the judged channel length, and performing a sensing operation according to the selected sensing manner. The plurality of vertical strings may extend in a direction perpendicular to a substrate of the nonvolatile memory device. 1. A read method of a nonvolatile memory device comprising:selecting one of a plurality of vertical strings in a nonvolatile memory device, the plurality of vertical strings extending in a direction perpendicular to a substrate of the nonvolatile memory device;judging a channel length between a common source line and the selected one of the plurality of vertical strings;selecting a sensing manner corresponding to the judged channel length; andperforming a sensing operation according to the selected sensing manner.2. The read method of claim 1 , whereinthe nonvolatile memory device includes two of the plurality of vertical strings connected with a bit line between at least two word line cuts.3. The read method of claim 1 , whereinthe nonvolatile memory device includes the plurality of vertical strings arranged in a zigzag structure between at least two word line cuts.4. The read method of claim 3 , wherein at least one corresponding vertical string of the plurality of vertical strings comprises: the at least one string selection transistor including a gate connected with a string selection line; a plurality of cell transistors connected in series to form a channel of the corresponding vertical string,', 'the plurality of cell transistors containing gates connected with word lines, respectively; and, 'at least one string selection transistor connected ...

LATERAL FLOW ATOMIC LAYER DEPOSITION DEVICE

A lateral flow atomic layer deposition device according to an exemplary embodiment of the present invention eliminates a gas flow control plate in a conventional lateral flow atomic layer deposition device and controls shapes of a gas input part and a gas output part in a reactor cover to make a gas flow path to a center of a substrate shorter than a gas flow path to an edge of the substrate and thereby increase the amount of gas per unit area flowing to the center of the substrate. Therefore, film thickness in the center of the substrate in the lateral flow reactor increases. 1. A lateral flow atomic layer deposition device in which gases flow substantially in parallel with a substrate in a reaction space formed between a substrate and an opposite side facing the substrate , comprising:a reactor cover for defining a reaction space together with a substrate supporting plate for supporting the substrate;a gas inlet unit disposed on one side of the reaction space and having an internal shape that becomes wider when approaching the substrate;a gas outlet unit disposed on another side of the reaction space facing the one side of the reaction space, and having an internal shape that becomes wider when approaching the substrate;a gas inlet connected to the gas inlet unit; anda gas outlet connected to the gas outlet unit.2. The atomic layer deposition device of claim 1 , whereinthe gas inlet unit and the gas outlet unit are formed in the reactor cover.3. The atomic layer deposition device of claim 2 , whereinthe reactor cover includes a top wall, a bottom wall, and a side wall,the side wall surrounds at least a part of the side of the top wall, andthe gas inlet unit and the gas outlet unit are formed to face each other on the side of the top wall.4. The atomic layer deposition device of claim 1 , whereinthe gas inlet includes a plurality of inlets.5. The atomic layer deposition device of claim 1 , whereinthe gas inlet is disposed to face the substrate, and the gas inlet ...

Light amount adjusting apparatus and photographing apparatus including the same

A light amount adjusting apparatus includes: a two-dimensional (2D) aperture assembly that adjusts an opening area of a via hole through which light is transmitted; a three-dimensional (3D) aperture plate that forms a first opening and a second opening by blocking a part of the via hole, or moving to outside of the via hole to open the via hole; a first shielding plate that is movable to open or close the first opening; and a second shielding plate that is movable so as to close the second opening when the first shielding plate opens the first opening and to open the second opening when the first shielding plate closes the first opening.

POSITION SENSOR ASSEMBLY AND OPTICAL DEVICE INCLUDING THE SAME

Position sensor assemblies having compact structures and capable of precisely sensing a position change, and optical devices including the same are disclosed. A position sensor assembly is provided that includes: a sensing unit that outputs a signal varying as a magnetic force varies; and a magnet spaced apart from the sensing unit and i movably disposed with respect to the sensing unit, and comprising protrusion units of opposite polarities that protrude from each end portion of the magnet in one surface of the magnet toward the sensing unit. 1. A position sensor assembly comprising:a sensing unit that outputs a signal varying as a magnetic force varies; anda magnet spaced apart from the sensing unit and movably disposed with respect to the sensing unit, and comprising protrusion units of opposite polarities that protrude from each end portion of the magnet in one surface of the magnet toward the sensing unit.2. The position sensor assembly of claim 1 , wherein the one surface of the magnet forms a concave curved surface from the protrusion units toward a center.3. The position sensor assembly of claim 1 , wherein the one surface of the magnet forms a concave inclined surface from the protrusion units toward a center.4. The position sensor assembly of claim 1 , wherein a groove is formed in the one surface of the magnet.5. The position sensor assembly of claim 1 , wherein the sensing unit is disposed outside of a virtual line connecting the protrusion units protruding from both end portions of the magnet.6. An optical device comprising:an optical element through which light may be transmitted;a frame that supports the optical element;a base that movably supports the frame;a driving unit that generates a magnetic force to move the frame with respect to the base;a magnet disposed in one of the frame and the base, and comprising protrusion units of opposite polarities that protrude from each end portion of the magnet in one edge thereof; anda sensing unit disposed in ...

3D SEMICONDUCTOR MEMORY DEVICE

A 3D semiconductor memory device including a plurality of memory cell strings, includes a substrate and a channel that extends from the substrate. Memory cells may be disposed in layers in which the diameter of the channel varies. A programming verification operation may be carried out in a sequence whereby memory cells more likely to fail in programming are verified before attempting to verify memory cells that are less likely to fail programming. In an exemplary embodiment, the verification operation is performed on a memory cell disposed in a layer associated with a larger-diameter channel before performing the verification on a memory cell disposed in a layer associated with a smaller-diameter channel. In an exemplary embodiment, if a verification process detects a programming failure, the verification of subsequent memory cells is cancelled. 1. A 3D semiconductor memory device including a plurality of memory cell strings , the 3D semiconductor memory device comprising:a substrate;a first channel that extends from the substrate in a direction transverse the substrate;a first memory cell that is disposed in a first layer of the first channel;a second memory cell that is disposed in a second layer of the first channel; anda controller that controls the first memory cell and the second memory cell,wherein the controller performs a first step of applying a verifying voltage to the first memory cell disposed in the first layer and a second step of applying a verifying voltage to the second memory cell disposed in the second layer,a first diameter of the first channel disposed in the first layer is greater than a second diameter of the first channel disposed in the second layer, andthe second step is performed only when the verifying operation of the first step is passed.2. The 3D semiconductor memory device of claim 1 , wherein the second layer is disposed between the first layer and the substrate.3. The 3D semiconductor memory device of claim 1 , wherein the first ...

HARD COATING COMPOSITION

A hard coating composition capable of being applied to the modification of a surface of plastic material that is being widely used in household appliances, the hard coating composition including an inorganic dispersion solution that is composed of at least one hydrolytically decomposable silane compound and an inorganic oxide particle, and an organic resin solution that is composed of a photo-curable acrylic-based compound and various additives capable of providing a functionality, such as a surface improving agent and an anti-static agent, the hard coating composition providing pH of between 4 and 6. 1. A hard coating composition , comprising:a surface-modified Boehmite nano particle of 5 to 50 weight %;a photo-hardening-type acrylate compound of 10 to 50 weight %;an organic solvent of 30 to 70 of weight %; anda photo-initiator of 1 to 10 weight %,wherein the hard coating composition is provided with a pH thereof between 4 to 6.2. The hard coating composition of claim 1 , wherein:a surface of the Boehmite nano particle is modified with an alkoxy silane compound, andthe alkoxy silane compound comprises at least one of an acrylic-based alkoxy silane compound and a vinyl-based alkoxy silane compound.3. The hard coating composition of claim 1 , wherein:the photo-hardening-type acrylate compound comprises at least one of acrylate monomer, urethane acrylate, polyester acrylate, polyether acrylate, and acrylic acrylate.4. The hard coating composition of claim 1 , wherein:the organic solvent comprises at least one of methanol, ethanol, isopropanol, normal-propanol, butanol, isobutanol, ethyl-cellosolve, methyl-cellosolve, butyl-celloslove, butyl-acetate, diacetone alcohol, methyl-ethyl ketone, propylene glycol, isopropyl alcohol, and ethylene-glycol isopropyl alcohol.5. The hard coating composition of claim 1 , wherein:the photo-initiator comprises at least one type of a benzo-phenone type, an acetone-phenone type, a benzoin-ether type, benzyl-ketal type, a thioctic- ...

SEPARATING TYPE BACKPACK

The present invention relates to a separating type backpack, which includes an upper side backpack including a shoulder strap; a lower side backpack including a belt member coupled to the upper side backpack which can be attached to or detached from the belt member; and a first sliding device which is used for coupling the lower side backpack to be slidably moved according to the belt member. 1. A separable backpack comprising:an upper backpack having a shoulder strap;a lower backpack having a belt member to which the upper backpack is separably coupled; anda first sliding device configured to couple the lower backpack and the belt member to each other such that the lower backpack is moved along the belt member in a sliding manner.2. The separable backpack according to claim 1 , wherein the first sliding device includes:a first zipper unit that consists of zipper parts sequentially coupled to one another in a longitudinal direction of the belt member; anda first slider, one side of which is located at the lower backpack and the other side of which is coupled to the first zipper unit such that the first slider is moved along the first zipper unit in a sliding manner.3. The separable backpack according to claim 2 , wherein the first slider includes one slider or a plurality of sliders.4. The separable backpack according to claim 1 , wherein the upper backpack and the belt member are separably coupled to each other via a zipper.5. The separable backpack according to claim 1 , wherein any one of one end of the lower backpack and one side of the belt member is provided with a fixing hole claim 1 , and the other one is provided with a retainer that is configured to be inserted into the fixing hole.6. The separable backpack according to claim 1 , wherein the belt member includes a belt and a buckle mounted to one end of the belt so as to couple one end and the other end of the belt to each other claim 1 , andwherein the buckle includes a buckle main body having a through- ...

METHOD FOR MANUFACTURING MULTILAYER STRUCTURE GOLF BALL

Disclosed is a method of manufacturing a golf ball having a multilayer structure. The method uses a forming apparatus including an upper mold, a lower mold, and an intermediate mold. The upper mold and the lower mold include a plurality of hemispheric cavities, respectively. The intermediate mold includes a plurality of protrusions having smaller diameters than those of the cavities, on a top and a bottom to correspond to the cavities. 1. A method of manufacturing a golf ball having a multilayer structure by using a forming apparatus comprising an upper mold and a lower mold comprising a plurality of hemispheric cavities , respectively , and an intermediate mold comprising a plurality of protrusions having smaller diameters than those of the cavities , on a top and a bottom to correspond to the cavities , the method comprising:(a) locating a unit body for forming an outer layer into each of the protrusions on the top of the intermediate mold and each the cavities of the cavities of the lower mold while the upper mold and the lower mold are being separated from each other with a certain space therebetween and the intermediate mold is disposed in the space;(b) forming a pair of cup-shaped outer layers in a semi-cross-linked state in a space formed between the protrusions and the cavities by locating the protrusions on the top and bottom of the intermediate mold in corresponding cavities of the upper mold and the lower mold, respectively;(c) separating the upper mold and the lower mold from each other while the pair of semi-cross-linked cup-shaped outer layers attached to the inside of the cavities;(d) taking the intermediate mold outwardly;(e) locating inner layers having a globular shape, previously formed, in the cavities of the lower mold; and(f) cross-linking the pair of cup-shaped outer layers with the globular inner layers by facing the upper mod and the lower mold with each other.2. A method of manufacturing a golf ball having a multilayer structure by using a ...

Volumetric braking device

A volumetric braking device includes: a brake disk having an outer surface where a plurality of disk vanes are formed with a predetermined spacing therebetween; a cylinder case where the brake disk is arranged, and the internal space of a cylinder is sectioned into a plurality of spaces by the disk vanes; a piston-drive unit, which has a piston roller sliding on the brake disk, and where the compressed pressure resistance generated between the piston roller and any one disk vane and vacuum pressure resistance generated between the piston roller and another disk vane operate as a braking load for the brake disk to perform decelerating and braking operations; a drive motor, which receives an electrical signal from an ECU by a program to operate in a forward or reverse direction; and a drive unit operating module for operating the piston-drive unit by operating the drive motor.

TOOL FOR SURGICAL OPERATION USING ULTRASONIC WAVES

A tool for surgical operation using ultrasonic waves is provided. The tool includes a transducer generating ultrasonic waves, a cylindrical bar-shaped transmitting rod for transmitting the ultrasonic waves, an end effector for cutting a surgical site using the ultrasonic waves transmitted from the transmitting rod, extended from one end of the transmitting rod, in which a part of the circular cross-sectional area thereof is flatly formed from the point corresponding to a second vibration node so as to allow gain step to start at the second vibration node, a rod cover for encompassing the transmitting rod using, as connection points, a plurality of vibration nodes formed when ultrasonic waves are transmitted through the transmitting rod, and a jaw for holding the surgical site while engaged with the end effector, is combined to one end of the rod cover in a pivotable manner, and is positioned to face the end effector. 1. A tool for surgical operation using ultrasonic waves , the tool comprising:a transducer generating ultrasonic waves;a transmitting rod having a cylindrical bar shape and transmitting the ultrasonic waves generated by the transducer to one end portion from the other end portion connected with the transducer;an end effector that extends from one end portion of the transmitting rod and performs cutting or hemostasis of a surgical site by using the ultrasonic waves received from the transmitting rod in which a part of a circular cross-sectional area has a flat surface from a point corresponding to a second vibration node most adjacent from one end portion of the transmitting rod so that a gain step is started at the second vibration node;a rod cover covering the transmitting rod by using a plurality of vibration nodes formed when the ultrasonic waves are transmitted through the transmitting rod as connection points; anda jaw for holding the surgical site while engaged with the end effector, which is combined to one end portion of the rod cover in a ...

ICE MELTING APPARATUS FOR SHIP VOYAGE

Disclosed herein is an ice melting apparatus for a ship voyage including: a boiler configured to heat a thermal medium; a high temperature pump configured to transfer the heated thermal medium; a heating cover unit configured to be heated by the thermal medium transferred by the high temperature pump and attached to a bow part of a ship; and a hot gas jet unit configured to be disposed in front of the heating cover unit and jet the air heated by the thermal medium. 1. An ice melting apparatus for a ship voyage , comprising:a boiler configured to heat a thermal medium;a high temperature pump configured to transfer the heated thermal medium;a heating cover unit configured to be heated by a thermal medium transferred by the high temperature pump and attached to a bow part of a ship; anda hot gas let unit configured to be disposed in front of the heating cover unit and jet the air heated by the thermal medium.2. The ice melting apparatus for a ship voyage of claim 1 , wherein the high temperature pump includes a motor part and an impeller part which allows the motor part to transfer the the medium claim 1 , andthe thermal medium is configured to be circulated into the motor part.3. The ice melting apparatus for a ship voyage of claim 1 , wherein the heating cover unit has a metal pad form haying a blade shape meet jog left and right surfaces of the bow part claim 1 , andan inside of the heating cover unit is provided with a first heat exchange to be heat-exchanged with the thermal medium.4. The ice melting apparatus for a ship voyage of claim 3 , further comprising:a heat insulating pad configured to be disposed at a contact portion with the bow part of the heating cover unit and block heat from the heating cover unit.5. The ice melting apparatus for a ship voyage of claim 1 , further comprising:an extending frame configured to extend from the bow part to the hot gas jet unit to support the hot as jet unit.6. The ice melting apparatus for a ship voyage of claim 5 , ...

BINDER COMPOSITION FOR RECHARGEABLE LITHIUM BATTERY, METHOD OF PREPARING SAME, ELECTRODE FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING SAME

A binder composition for a rechargeable lithium battery includes: an interpenetrating polymer network (IPN) structure including a cyclic polymer including a structural unit represented by Chemical Formula 1 or a structural unit represented by Chemical Formula 2, and polyacrylamide. A method of preparing the same, and an electrode for a rechargeable lithium battery and a rechargeable lithium battery including the same are also disclosed. 3. The binder composition of claim 1 , wherein the cyclic polymer has a weight average molecular weight of about 2 claim 1 ,000 to about 2 claim 1 ,000 claim 1 ,000 g/mol.4. The binder composition of claim 1 , wherein the polyacrylamide has a weight average molecular weight of about 5 claim 1 ,000 g/mol to about 1 claim 1 ,000 claim 1 ,000 g/mol.5. The binder composition of claim 1 , wherein a mole ratio of the cyclic polymer to the polyacrylamide is about 1:9 to about 9:1.6. The binder composition of claim 1 , wherein the binder composition further comprises an alkali metal ion.7. The binder composition of claim 6 , wherein the alkali metal ion is included in the binder composition in an amount of 1 part by mole to 10 parts by mole based on 100 parts by mole of the interpenetrating polymer network (IPN) structure.8. The binder composition of claim 1 , wherein the binder composition further comprises an alkali metal ion and a phosphorus (P)-based compound9. The binder composition of claim 8 , wherein the alkali metal ion and the phosphorus-based compound are adsorbed on the interpenetrating polymer network (IPN) structure.10. The binder composition of claim 8 , wherein the phosphorus-based compound is included in the binder composition in an amount of about 1 part by mole to about 10 parts by mole based on 100 parts by mole of the interpenetrating polymer network (IPN) structure.12. The binder composition of claim 11 , wherein the polyalkylene glycol is included in the binder composition in an amount of about 5 mol % to about 50 mol ...

METAMATERIAL STRUCTURE AND METHOD OF FABRICATING THE SAME

A metamaterial structure may include a first nanoparticle and a second nanoparticle containing a different material from the first nanoparticle. The first and second nanoparticles may be provided to be adjacent to each other and to be in an electrically-coupled state. 1. A metamaterial structure , comprising:a first nanoparticle; anda second nanoparticle containing a different material from the first nanoparticle,wherein the first and second nanoparticles are provided to be adjacent to each other and to be in an electrically-coupled state.2. The metamaterial structure of claim 1 , further comprising a conductive ligand coupled to a surface of each of the first and second nanoparticles.3. The metamaterial structure of claim 1 , wherein a space between the first and second nanoparticles is less than 10 nm.4. The metamaterial structure of claim 1 , wherein the first and second nanoparticles comprise metal particles that are respectively different from each other.5. The metamaterial structure of claim 4 , wherein each of the first and second nanoparticles comprises silver (Ag) claim 4 , gold (Au) claim 4 , copper (Cu) claim 4 , aluminum (Al) claim 4 , nickel (Ni) claim 4 , chromium (Cr) claim 4 , or lead (Pb).6. The metamaterial structure of claim 1 , wherein the first nanoparticle comprises a metal particle claim 1 , andthe second nanoparticle comprises a semiconductor particle.7. The metamaterial structure of claim 6 , wherein the second nanoparticle comprises an elementary semiconductor particle or a compound semiconductor particle.8. The metamaterial structure of claim 7 , wherein the second nanoparticle comprises CdSe claim 7 , PbSe claim 7 , PbS claim 7 , or PbTe.9. The metamaterial structure of claim 1 , wherein the first and second nanoparticles are in contact with each other.10. The metamaterial structure of claim 1 , further comprising a third nanoparticle containing a material different from the first and second nanoparticles claim 1 ,wherein the first to ...

FAN-OUT SEMICONDUCTOR PACKAGE

A fan-out semiconductor package includes: a frame, including a wiring layer, and having a through-hole; a semiconductor chip disposed in the through-hole, and including a connection pad; an encapsulant covering at least a portion of each of the frame and an inactive surface of the semiconductor chip, and having a first opening exposing at least a portion of the wiring layer; an insulating layer disposed on the encapsulant, and having a second opening formed in the first opening to expose at least a portion of the wiring layer; a conductive pattern layer disposed on the insulating layer; a conductive via disposed in the second opening; and a connection structure disposed on the frame and an active surface of the semiconductor chip, and including one or more redistribution layers. The conductive pattern layer and the redistribution layer are electrically connected to the connection pad. 1. A fan-out semiconductor package , comprising:a frame, including a wiring layer, and having a through-hole;a semiconductor chip disposed in the through-hole, and having an active surface on which a connection pad is disposed and an inactive surface opposite to the active surface;an encapsulant covering at least a portion of each of the frame and the inactive surface of the semiconductor chip, and having a first opening exposing at least a portion of the wiring layer;an insulating layer disposed on the encapsulant, and having a second opening formed in the first opening to expose at least a portion of the wiring layer;a conductive pattern layer disposed on the insulating layer;a conductive via disposed in the second opening, and electrically connecting the wiring layer to the conductive pattern layer; anda connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers,wherein the conductive pattern layer and the redistribution layer are electrically connected to the connection pad.2. The fan-out ...

PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT EMBEDDED THEREIN

A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material. 1. A printed circuit board , comprising:a first insulating layer having a first modulus;a second insulating layer disposed on the first insulating layer and having a second modulus; anda cavity penetrating the second insulating layer,wherein the second modulus is greater than the first modulus, andwherein an edge portion of a bottom surface of the cavity is formed of an insulating material.2. The printed circuit board of claim 1 , wherein the insulating material is at least one of the first insulating layer and the second insulating layer.3. The printed circuit board of claim 1 , wherein the second modulus is four times the first modulus or greater.4. The printed circuit board of claim 3 ,wherein the first insulating layer includes liquid crystal polymer, andwherein the second insulating layer includes prepreg.5. The printed circuit board of claim 1 ,wherein the cavity exposes at least a portion of one surface of the first insulating layer, andwherein exposed one surface of the first insulating layer is provided as a bottom surface of the cavity.6. The printed circuit board of claim 5 , further comprising:a first wiring layer disposed on one surface of the first insulating layer,wherein the first wiring layer includes a first wiring pattern having at least a portion buried in the second insulating layer, and a second wiring pattern having at least a portion exposed by the cavity.7. The printed circuit board of claim 6 , further comprising:a second wiring layer disposed on one surface of the second insulating layer; anda wiring via layer penetrating the second insulating layer and ...

DIKE FOR SEMICONDUCTOR/LCD MANUFACTURING AND PROCESSING EQUIPMENT

Disclosed is a dike for semiconductor/LCD manufacturing and processing equipment, in which a plurality of straight blocks and a plurality of corner blocks, having a predetermined height, are engaged to form a polygonal-shaped fence having a predetermined area, and molten epoxy is injected to a predetermined height in the space within the fence and solidified. 1. A dike for semiconductor/LCD manufacturing and processing equipment ,wherein a plurality of straight blocks having a first predetermined height is fitted into coupling gaps formed in a plurality of corner blocks to form a fence having a predetermined shape and a predetermined area, and an epoxy in a molten state is injected to a second predetermined height in a space within the fence and solidified,wherein each of the plurality of straight blocks comprises an outer vertical wall and an inner vertical wall, spaced apart from each other by a first predetermined width to form a space to receive a straight block epoxy injected therein, and an inclined panel disposed above the space so as to be inclined downwards toward the inner vertical wall to connect an upper end of the outer vertical wall to an upper end of the inner vertical wall,wherein each of the plurality of corner blocks comprises a first rear vertical panel and a second rear vertical panel, having a second predetermined width and a third predetermined height and integrally formed so as to be connected to each other with a predetermined included angle formed therebetween, andwherein a horizontal epoxy is formed in the space within the fence, and an inclined epoxy block, configured as a solidified block having an inclined surface inclined at a predetermined angle, is mounted on the horizontal epoxy to form a contaminant discharge path at a lower end of the inclined surface.2. The dike for semiconductor/LCD manufacturing and processing equipment according to claim 1 , wherein each of the plurality of straight blocks is formed to have a predetermined ...

PHARMACEUTICAL COMPOSITION CONTAINING LIRIODENDRON TULIPIFERA L. EXTRACT FOR TREATING CHRONIC MYELOGENOUS LEUKEMIA

The present invention relates to a pharmaceutical composition containing, as an active ingredient, a L. bark extract for treating chronic myelogneous leukemia. More specifically, the present invention relates to the pharmaceutical composition, containing, as the active ingredient, the L. bark extract useful in selectively inhibiting mutant enzyme T315I from a mutation of a BCR-ABL fusion gene that causes chronic myelogenous leukemia, and to a use of epi-Tulipinolide which is an active ingredient of the composition. 1Liriodendron tulipifera. A pharmaceutical composition containing epi-tulipinolide as active ingredient from the extract of the bark of for treating chronic myeloid leukemia (CML) by selectively inhibiting T315I enzyme variant expressed from BCR-ABL fusion gene.2. The pharmaceutical composition according to claim 1 , wherein said composition selectively inhibits the growth of Imatinib resistant chronic myeloid leukemia cells caused by T315I enzyme variant as well as induces the apoptosis of Imatinib resistance chronic myeloid leukemia cells by DNA fragmentation.3. The pharmaceutical composition according to claim 1 , further comprises the pharmaceutically acceptable carrier.4. An oral preparation comprising the pharmaceutical composition of claim 3 , wherein said preparation is at least one selected from of tablet claim 3 , pill claim 3 , powder claim 3 , hard capsule claim 3 , gelatin banding hard capsule claim 3 , soft capsule claim 3 , chewing tablet in the form of caramel or jelly and/or oral solution.5. The oral preparation according to claim 4 , wherein said preparation is selected from soft capsule or oral solution. The present invention relates to a pharmaceutical composition for treating chronic myelogenous leukemia containing the extract from the bark of as active ingredient. More particularly, the present invention relates to a pharmaceutical composition containing the extract from the bark of as active ingredient for selectively inhibiting the ...

PRINTED CIRCUIT BOARD

A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers. 1. A printed circuit board comprising:a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; anda second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers,wherein a dissipation factor of each adhesive layer of the plurality of first adhesive layers is lower than a dissipation factor of each adhesive layer of the plurality of second adhesive layers.2. The printed circuit board of claim 1 , wherein a dissipation factor of each insulating layer of the plurality of first insulating layers is lower than a dissipation factor of each insulating layer of the plurality of ...

PRINTED CIRCUIT BOARD

A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region. 1. A printed circuit board comprising:a plurality of insulating layers arranged in a stacking direction and defining a flexible region and a rigid region relatively arranged in a direction perpendicular to the stacking direction, the rigid region having more insulating layers, among the plurality of insulating layers, arranged in the stacking direction than the flexible region;a first insulating layer, among the plurality of insulating layers, disposed in the flexible region and the rigid region; anda first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region,wherein a thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region.2. The printed circuit board of claim 1 , wherein the first wiring layer in the flexible region comprises a first metal layer claim 1 , andthe first wiring layer in the at least a portion of the rigid region comprises the first metal layer and a second metal layer disposed on the first metal layer.3. The printed circuit board of claim 2 , wherein a thickness of the second metal layer is greater than a thickness of the first metal layer.4. The printed circuit board of claim 2 , wherein in the rigid region claim 2 , the first metal layer and the second metal layer have a shape corresponding to each other.5. The printed circuit board of claim 2 , further comprising a second wiring layer disposed on another surface of the first insulating layer in the rigid region claim 2 , opposite to the one surface of the first ...

SYSTEM AND METHOD FOR INFORMING OF ATTACHMENT POSITIONS OF ECG ELECTRODES

Provided are a system and method for informing of attachment positions of electrocardiogram (ECG) electrodes to improve the quality of ECG data. The system includes a judgment indicator extractor configured to extract a plurality of judgment indicator values from ECG data obtained through ECG electrodes, a reference value setter configured to, in a user-specific reference value setting mode, collect the judgment indicator values for a plurality of pieces of ECG data extracted by the judgment indicator extractor and set user-specific reference values for each judgment indicator, a similarity determiner configured to, in an ECG measurement mode, determine similarity by comparing a plurality of judgment indicator values extracted by the judgment indicator extractor with the user-specific reference values, and an electrode attachment position guide configured to inform a user of attachment positions of the ECG electrodes according to a similarity determination result of each of the judgment indicator values.

LENS ASSEMBLY AND OPTICAL DEVICE COMPRISING SAME

In a lens assembly structure comprising a plurality of lens assemblies, according to the present invention, at least one part of assemblies among the plurality of lens assemblies comprises: a first lens group having a positive refractive power or a negative refractive power; a second lens group having a positive refractive power; and a bending structure for bending an optical path of the first lens group such that the optical path corresponds to an optical axis direction of the second lens group, wherein the bending structure is disposed on the optical path of the first lens group and an optical path of the second lens group, optical axes of the first lens groups disposed in each of the at least one part of lens assemblies meet at one point, and optical axes of the second lens groups disposed in each of the at least one part of lens assemblies may form a triangle. 1. A lens assembly structure comprising a plurality of lens assemblies , at least some lens assemblies of the plurality of lens assemblies comprising:a first lens group having positive refractive power or negative refractive power;a second lens group having positive refractive power; anda bending structure for bending a path of light of the first lens group so as to correspond to an optical-axis direction of the second lens group, whereinthe bending structure is disposed on the path of light of the first lens group and on a path of light of the second lens group,optical axes of the first lens groups disposed on the at least some lens assemblies, respectively, meet at a point, andoptical axes of the second lens groups disposed on the at least some lens assemblies, respectively, are configured to form a triangle.2. The lens assembly structure of claim 1 , wherein the lens assembly is disposed from a subject side to the first lens group claim 1 , the bending structure claim 1 , and the second lens group claim 1 , and is configured to satisfy following [Conditional formula 1] claim 1 , [Conditional formula 2] ...

ELECTRODE ASSEMBLY FOR SECONDARY BATTERIES AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME

Disclosed are an electrode assembly for secondary batteries and a lithium secondary battery including the same. More particularly, an electrode assembly including a cathode, an anode and a separator, wherein the cathode includes a lithium cobalt-based oxide, and a lithium nickel-based composite oxide forming a coating layer over a surface of the lithium nickel-based composite oxide by reacting with a fluorine-containing polymer, as a cathode active material, the anode includes carbon and a silicone oxide as an anode active material, an operating voltage is 2.50 V to 4.35 V, and the cathode active material has high rolling density by a bimodal form in which an average diameter of the cobalt-based oxide and an average diameter of the lithium nickel-based composite oxide are different, and a lithium secondary battery including the same are disclosed. 1. An electrode assembly comprising a cathode , an anode and a separator , wherein the cathode comprises a lithium cobalt-based oxide , and a lithium nickel-based composite oxide forming a coating layer over a surface of the lithium nickel-based composite oxide by reacting with a fluorine-containing polymer , as a cathode active material , the anode comprises carbon and a silicone oxide as an anode active material , an operating voltage is 2.50 V to 4.35 V , and the cathode active material has high rolling density by a bimodal form in which an average diameter of the cobalt-based oxide and an average diameter of the lithium nickel-based composite oxide are different.2. The electrode assembly according to claim 1 , wherein an average diameter of the lithium cobalt-based oxide is 16 to 25 μm claim 1 , and an average diameter of the lithium nickel-based composite oxide is 2 to 10 μm.3. The electrode assembly according to claim 1 , wherein an average diameter of the lithium cobalt-based oxide is 2 to 10 μm claim 1 , and an average diameter of the lithium nickel-based composite oxide is 16 to 25 μm.4. The electrode assembly ...

HEAD MOUNTED ELECTRONIC DEVICE

An electronic device is provided. The electronic device mountable on a head of a user includes a display, a sensor configured to capture an image, a processor electrically connected with the display and the sensor, and a memory electrically connected with the processor, wherein the memory includes instructions, which, when executed, cause the processor to provide a guide screen that guides the user to gaze at a front of a display, to capture an image, in which at least a portion of an eye of the user is included, using the sensor, and to determine a wearing state of the electronic device based on at least one of a location of the eye or a location of a pupil of the user displayed in the captured image. 1. An electronic device mountable on a head of a user , the electronic device comprising:a display;a sensor configured to capture an image;a processor; anda memory, which includes instructions, which, when executed, cause the processor to:provide a guide screen that guides the user to gaze at a front of the display;capture an image, in which at least a portion of an eye of the user is included, using the sensor; anddetermine a wearing state of the electronic device based on a location of the eye or a pupil of the user displayed in the captured image.2. The electronic device of claim 1 , wherein the instructions claim 1 , which claim 1 , when executed claim 1 , cause the processor to:generate a guide screen associated with the wearing state of the electronic device based on the determination result; andprovide the guide screen associated with the wearing state to the display.3. The electronic device of claim 1 , wherein the sensor comprises a first sensor that captures an image of a right eye of the user and a second sensor that captures an image of a left eye of the user.4. The electronic device of claim 3 , wherein the instructions claim 3 , which claim 3 , when executed by the processor claim 3 , cause the processor to determine the wearing state of the electronic ...

SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND METHOD OF DRIVING THE SAME

A semiconductor device inspecting apparatus includes a light source for emitting light to a semiconductor pattern. The semiconductor pattern includes a structure that reflects the light from the light source. The semiconductor device inspecting apparatus further includes an objective optical system disposed in a path of the reflected light from the semiconductor pattern, and a first noise filter disposed in a path of the reflected light having passed through the objective optical system, the first noise filter including at least one bar pattern that filters a diffraction noise of the light. The semiconductor device inspecting apparatus additionally includes a second noise filter disposed in a path of the filtered light from the first noise filter, the second noise filter including an outer frame surrounding a central portion. The semiconductor device inspecting apparatus further includes a first photodetector detecting the light having passed through the second noise filter. 1. A semiconductor device inspecting apparatus , comprising:a light source for emitting light to a semiconductor pattern, wherein the semiconductor pattern includes a structure that reflects the light from the light source;an objective optical system disposed in a path of the reflected light from the semiconductor pattern;a first noise filter disposed in a path of the reflected light having passed through the objective optical system, the first noise filter including at least one bar pattern that filters a diffraction noise of the light;a second noise filter disposed in a path of the filtered light from the first noise filter, the second noise filter including an outer frame surrounding a central portion, wherein the central part blocks light and the outer frame passes light; anda first photodetector detecting the light having passed through the second noise filter.2. The semiconductor device inspecting apparatus of claim 1 ,wherein the bar pattern of the first noise filter overlaps the ...

NONVOLATILE MEMORY DEVICES AND SOLID STATE DRIVES INCLUDING THE SAME

A nonvolatile memory device includes a memory cell array, a voltage generator, and a control circuit. The voltage generator generates word-line voltages to be applied to the memory cell array. The control circuit generates control signals that control the voltage generator in response to a command and an address. The control circuit includes a hacking detection circuit. The hacking detection circuit disables an operation of the nonvolatile memory device when a hacking is detected, wherein the hacking is detected when an access sequence of the command and the address does not match a standard sequence of the nonvolatile memory device a consecutive number of times. 1. A nonvolatile memory device , comprising:a memory cell array;a voltage generator configured to generate word-line voltages to be applied to the memory cell array; anda control circuit configured to generate control signals that control the voltage generator in response to a command and an address,wherein the control circuit includes a hacking detection circuit configured to disable an operation of the nonvolatile memory device when a hacking is detected, wherein the hacking is detected when an access sequence of the command and the address does not match a standard sequence of the nonvolatile memory device a consecutive number of times.2. The nonvolatile memory device of claim 1 , wherein the hacking detection circuit comprises:an access sequence analyzer configured to analyze the access sequence and to output a decision signal that is enabled when the access sequence does not match the standard sequence;a counter configured to count the decision signal that is enabled and to output a counting signal; anda hacking detection signal generator configured to receive the counting signal and to output a hacking detection signal that is enabled when the counting signal exceeds a reference value.3. The nonvolatile memory device of claim 2 , wherein the access sequence analyzer is configured to output the ...

STORAGE DEVICE AND RELATED PROGRAMMING METHOD

A method of programming a storage device comprises determining whether at least one open page exists in a memory block of a nonvolatile memory device, and as a consequence of determining that at least one open page exists in the memory block, closing the at least one open page through a dummy pattern program operation, and thereafter performing a continuous writing operation on the memory block. 1. A method of programming a storage device comprising at least one nonvolatile memory device and a memory controller , comprising:determining whether at least one open page exists in a memory block of the nonvolatile memory device; andas a consequence of determining that at least one open page exists in the memory block, closing the at least one open page through a dummy pattern program operation, and thereafter performing a continuous writing operation on the memory block.2. The method of claim 1 , wherein the determination of whether at least one open page exists in the memory block is performed as a consequence of an unexpected loss of power.3. The method of claim 1 , wherein the determination of whether at least one open page exists in the memory block is performed where a write operation is requested with respect to the memory block.4. The method of claim 1 , wherein the continuous writing operation is performed according to an address scramble technique claim 1 , and wherein the closing the at least one open page comprises programming at least one page associated with at least one dummy wordline and the at least one open page with dummy pattern data according to a predetermined order.5. The method of claim 4 , wherein the predetermined order complies with the address scramble technique.6. The method of claim 4 , wherein the at least one page comprises all pages associated with a wordline of the memory block claim 4 , and the predetermined order complies with the address scramble technique.7. The method of claim 4 , wherein the at least one dummy wordline comprises a ...

CABLE SUBSTRATE

A cable substrate includes an insulating layer, a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer, and a dummy pattern disposed on the insulating layer. At least a portion of the dummy pattern is exposed to the slit portion. 1. A cable substrate comprising:an insulating layer;a slit portion penetrating through at least a portion of the insulating layer in a thickness direction of the insulating layer; anda dummy pattern disposed on the insulating layer,wherein at least a portion of the dummy pattern is exposed to the slit portion.2. The cable substrate of claim 1 , wherein the slit portion extends in a direction from one end of the insulating layer to the other end of the insulating layer.3. The cable substrate of claim 1 , wherein the dummy pattern is disposed on a region of the insulating layer in contact with an end portion of the slit portion in a direction in which the slit portion extends.4. The cable substrate of claim 1 , wherein at least a portion of a side surface of the dummy pattern is coplanar with at least a portion of an inner wall of the slit portion.5. The cable substrate of claim 1 , wherein the insulating layer includes first and second connection portions which are provided with the slit portion interposed therebetween.6. The cable substrate of claim 1 , wherein the insulating layer comprises at least one of polyimide and Liquid Crystal Polymer (LCP).7. The cable substrate of claim 1 , further comprising:a signal pattern disposed on the insulating layer; anda ground pattern disposed on the insulating layer.8. The cable substrate of claim 7 , wherein the dummy pattern is disposed to be spaced apart from the signal pattern and is connected to at least a portion of the ground pattern.9. The cable substrate of claim 7 , further comprising a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the signal pattern.10. A cable ...

POLY(ETHYLENE-ALIPHATIC DIENE) COPOLYMER AND PREPARATION METHOD THEREOF

Disclosed is a poly(ethylene-aliphatic diene) copolymer having superior miscibility, adhesivity, printability and scratch resistance, compared to conventional TPO based TPEs or SBC TPEs, by introducing a variety of functional groups to an end portion of the ethylene-aliphatic diene copolymer such that the poly(ethylene-aliphatic diene) copolymer may be utilized in a variety of fields, and a method thereof. 1. A poly(ethylene-aliphatic diene) copolymer comprising an ethylene block and aliphatic diene block , wherein a portion of the aliphatic diene block is modified by substituting with a functional group selected from the group consisting of a sulfide group , a hydroxyl group , an epoxy group , an amine group , a carboxylic acid group , a silane group and combinations thereof.3. The poly(ethylene-aliphatic diene) copolymer according to claim 1 , wherein the aliphatic diene block is polymerized with one monomer selected from the group consisting of 1 claim 1 ,3-butadiene claim 1 , isoprene claim 1 , 2 claim 1 ,3-dimethyl-1 claim 1 ,3-butadiene claim 1 , 1 claim 1 ,2-dimethyl-1 claim 1 ,3-butadiene claim 1 , 1 claim 1 ,4-dimethyl-1 claim 1 ,3-butadiene claim 1 , 1-ethyl-1 claim 1 ,3-butadiene claim 1 , 3-butyl-1 claim 1 ,3-octadiene claim 1 , 1 claim 1 ,3-hexadiene claim 1 , 4-methyl-1 claim 1 ,3-petadiene claim 1 , 1 claim 1 ,3-petadiene claim 1 , 3-methyl-1 claim 1 ,3-petadiene claim 1 , 2 claim 1 ,4-dimethyl-1 claim 1 ,3-petadiene claim 1 , 3-ethyl-1 claim 1 ,3-petadiene claim 1 , and combinations thereof.4. The poly(ethylene-aliphatic diene) copolymer according to claim 1 , wherein the aliphatic diene block is 5 to 50% substituted.5. The poly(ethylene-aliphatic diene) copolymer according to claim 1 , wherein an average molecular weight of the poly(ethylene-aliphatic diene) copolymer is 20 claim 1 ,000 to 3 claim 1 ,000 claim 1 ,000 and molecular weight distribution of the poly(ethylene-aliphatic diene) copolymer is 1.2 to 3.0.6. A method of preparing the poly( ...

Semiconductor package

A semiconductor package includes: a connection member having a first surface and a second surface opposing each other, and including a first redistribution layer; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the first redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a wiring structure connected to the first redistribution layer and extending in a thickness direction of the encapsulant; a second redistribution layer disposed on the encapsulant and connected to the wiring structure; and a mark disposed on the encapsulant and including a plurality of metal patterns providing identification information and a circuit line connected to the second redistribution layer.

SEMICONDUCTOR PACKAGE

A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin; a mark indicating identification information and carved in the encapsulant; and a passivation layer disposed on the encapsulant and including a transparent resin. 1. A semiconductor package comprising:a connection structure having first and second surfaces opposing each other and including a first redistribution layer;a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the first redistribution layer;an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin;a mark indicating identification information and carved in the encapsulant; anda first passivation layer disposed on the encapsulant and including a transparent resin.2. The semiconductor package according to claim 1 , further comprising a wiring structure connected to the first redistribution layer and extending in a thickness of the encapsulant and a second redistribution layer disposed on the encapsulant and connected to the wiring structure.3. The semiconductor package according to claim 2 , wherein the encapsulant includes an encapsulation region encapsulating the semiconductor chip claim 2 , and an insulating layer disposed on the encapsulation region claim 2 , andthe second redistribution layer is disposed on the insulating layer, and the mark is carved in the insulating layer.4. The semiconductor package according to claim 3 , wherein a carved depth of the mark is smaller than a thickness of the ...

SEMICONDUCTOR PACKAGE

A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection structure and having a plurality of first and second openings exposing, respectively, first and second regions of the redistribution layer; and a plurality of underbump metal bumps connected to the first region of the redistribution layer through the plurality of first openings, respectively. 1. A semiconductor package comprising:a connection structure having first and second surfaces opposing each other and including a redistribution layer;a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer;an encapsulant disposed on the first surface of the connection structure and encapsulating the semiconductor chip;a passivation layer disposed on the second surface of the connection structure and having a plurality of first and second openings to expose, respectively, first and second regions of the redistribution layer; anda plurality of underbump metal bumps connected to the first region of the redistribution layer through the plurality of first openings, respectively.2. The semiconductor package of claim 1 , further comprising a plurality of first electrical connection metals disposed on the passivation layer and connected to the plurality of underbump metal bumps claim 1 , respectively claim 1 , and a plurality of second electrical connection metals disposed in at least portions of the plurality of second openings and connected to the second region of the redistribution layer claim 1 , respectively.3. The ...

COMPOSITE MATERIAL FOR MEANS OF TRANSPORT INCLUDING POLYPROPYLENE RESIN AND LONG CARBON FIBER

The present invention relates to a composite material for a transport, including a polypropylene resin and a carbon long fiber, and more particularly, to a fiber reinforced composite material composition for a transport including 40-90 wt % of a polypropylene resin, 5-60 wt % of a carbon long fiber having a fiber diameter of 1-50 μm and a weight average fiber length of 20-150 mm, and 0.3-10 wt % of a compatibilizer. The compatibilizer includes one selected from the group consisting of an ionomer, a copolymer of propylene-polar monomer, a modification water added polymer and combinations thereof. The composite material has improved interface properties between the polypropylene resin and the carbon long fiber owing to a specific compatibilizer, improved rigidity, impact resistance and heat resistance, and may be applied to various fields requiring the fiber reinforced composite material as well as various transports including an automobile. 1. A fiber reinforced composite material composition for a transport , comprising 40-90 wt % of a polypropylene resin , 5-60 wt % of a carbon long fiber having a fiber diameter of 1-50 μm and a weight average fiber length of 20-150 mm , and 0.3-10 wt % of a compatibilizer ,wherein the compatibilizer comprises one selected from the group consisting of an ionomer, a copolymer of propylene-polar monomer, a modification water added polymer and combinations thereof.2. The fiber reinforced composite material composition for a transport of claim 1 , wherein the polypropylene resin is a polypropylene single polymer or a copolymer of polypropylene and alpha olefin.3. The fiber reinforced composite material composition for a transport of claim 2 , wherein the alpha olefin comprises one selected from the group consisting of 1-butene claim 2 , 1-pentene claim 2 , 1-hexene claim 2 , 4-methyl-1-pentene claim 2 , 1-heptene claim 2 , 1-octene claim 2 , 1-nonene claim 2 , 1-decene claim 2 , 1-undecene claim 2 , 1-dodecene and combinations thereof. ...

FAN-OUT SEMICONDUCTOR PACKAGE

A fan-out semiconductor package includes a core member having a through hole, at least one dummy structure disposed in the core member, a semiconductor chip disposed in the through hole and including an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of each of the core member and the semiconductor chip, and filling at least a portion of the through hole, and a connection member disposed on the core member and the active surface of the semiconductor chip, and including a redistribution layer electrically connected to the connection pad. 1. A semiconductor package comprising:a core member having a first through hole, and including a first insulating layer having a second through hole;a first dummy structure disposed in the second through hole of the first insulating layer of the core member;a semiconductor chip disposed in the first through hole, and including an active surface on which a connection pad is disposed and an inactive surface opposing the active surface;an encapsulant sealing at least a portion of each of the core member and the semiconductor chip, and filling at least a portion of the first through hole; anda connection member disposed on the core member and the active surface of the semiconductor chip, and including a redistribution layer electrically connected to the connection pad,wherein the first dummy structure is electrically insulated from the semiconductor chip,the core member further including a third insulating layer penetrated by the first through hole, andthe third insulating layer covers at least a portion of the first insulating layer, fills at least a portion of the second through hole of the first insulating layer of the core member, and having a portion covering the first dummy structure to separate the first dummy structure from the encapsulant.2. The semiconductor package of claim 1 , wherein the first dummy structure comprises silicon ...

PORTABLE TERMINAL FOR CONTROLLING HEARING AID AND METHOD THEREFOR

A method for controlling a hearing aid using a portable terminal is provided. The method includes taking a photo, generating a control signal to control a hearing mode of the hearing aid according to an analysis of a surrounding condition based on the photo, and transmitting the control signal to the hearing aid. 1. A method for controlling a hearing aid using a portable terminal , the method comprising:taking a photo;generating a control signal to control a hearing mode of the hearing aid according to an analysis of a surrounding condition based on the photo; andtransmitting the control signal to the hearing aid.2. The method of claim 1 , wherein the control signal is generated by taking into account the surrounding condition and a surrounding sound detected by the portable terminal and is used to select a proper hearing mode suitable for the surrounding condition from among multiple hearing modes that the hearing aid offers.3. The method of claim 1 , further comprising:running an application to control change of the hearing mode,wherein the application includes at least one of a photo shoot menu to take the photo, an analysis menu to analyze the taken photo, a volume menu to control the volume of the hearing aid, a threshold menu to adjust thresholds to be set for analysis of the taken photo, and a hearing mode menu to select a proper hearing mode suitable for the surrounding condition.4. The method of claim 3 , wherein the application includes at least one menu claim 3 , andwherein the at least one menu included in the application is automatically or manually established based on analysis of the surrounding condition.5. The method of claim 3 , wherein the hearing mode is newly added or removed based on the surrounding condition of the photo.6. The method of claim 1 , wherein the generating of the control signal comprises:extracting features of at least one object contained in the photo;comparing an object having an outline formed by the extracted features with a ...

CATHODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME

Disclosed are a cathode active material for secondary batteries and a lithium secondary battery including the same. More particularly, a cathode active material for secondary batteries having an operating voltage area of 2.50 V to 4.35 V, including a lithium cobalt-based oxide and a surface-treated lithium nickel-based oxide and having high rolling density by a bimodal form in which an average diameter of the cobalt-based oxide and an average diameter of the lithium nickel-based composite oxide are different, and a lithium secondary battery including the same are disclosed. 1. A cathode active material for secondary batteries having an operating voltage area of 2.50 V to 4.35 V , comprising a lithium cobalt-based oxide and a surface-treated lithium nickel-based oxide , wherein the cathode active material has high rolling density by a bimodal form in which an average diameter of the cobalt-based oxide and an average diameter of the lithium nickel-based composite oxide are different.2. The cathode active material according to claim 1 , wherein rolling density of the cathode active material is higher than rolling density of a cathode active material comprising a lithium cobalt oxide and a lithium nickel-based oxide having similar average diameters and not having a bimodal form.3. The cathode active material according to claim 2 , wherein the rolling density of the cathode active material is 3.8 to 4.0 g/cc.4. The cathode active material according to claim 1 , wherein an average diameter of the lithium cobalt-based oxide is 16 to 25 μm and an average diameter of the lithium nickel-based oxide is 2 to 10 μm.5. The cathode active material according to claim 1 , wherein an average diameter of the lithium cobalt-based oxide is to 10 μm and an average diameter of the lithium nickel-based oxide is 16 to 25 μm.6. The cathode active material according to claim 1 , wherein the lithium cobalt-based oxide is represented by Formula 1 below:{'br': None, 'i': −a', 'a, 'Li(Co(1)M)O2\ ...

METHOD FOR VERIFYING INTEGRITY OF DYNAMIC CODE USING HASH BACKGROUND OF THE INVENTION

Disclosed are methods for verifying the integrity of a dynamic code using a hash and for generating a hash registry for the verification. Provided is the method for generating a hash registry for verification of the integrity of a dynamic code using a hash, comprising: a step for setting a security tag only for a specific function which is a part of program and requires security; a binary generation step for generating a binary by compiling a source code including at least one function to which the security tag is applied; a hash code extraction step for extracting a hash code for a code block of the specific function, if the binary is searched and the security tag is detected; and a hash registry generation step for generating a hash registry including the hash codes for at least one function generated in the has code extraction step. 1. A method for verifying the integrity of a dynamic code using a hash comprising:a step for setting a security tag only for a specific function which is a part of program and requires security;a binary generation step for generating a binary by compiling a source code including at least one function to which the security tag is applied;a hash code extraction step for extracting a hash code for a code block of the specific function, if the binary is searched and the security tag is detected; anda hash registry generation step for generating a hash registry including hash codes for at least one function generated in the has code extraction step.2. The method according to claim 1 , wherein the security tag comprises a start tag indicating a starting point of a integrity check and a end tag indicating end point thereof within the code block of the specific function.3. The method according to claim 2 , wherein the hash code extraction step comprising extracting the hash code for codes from the start tag to the end tag within the code block of the specific function.4. The method according to claim 1 , wherein the hash registry generating ...

PRINTED CIRCUIT BOARD

A printed circuit board includes an internal insulating layer, an internal conductive pattern layer disposed on the internal insulating layer and including a line portion and a bonding pad portion, and an external insulating layer disposed on the internal conductive pattern layer and the internal insulating layer and having an accommodation groove extending therethrough to expose the bonding pad portion. The bonding pad portion includes a connection pattern extending from the line portion of the internal conductive pattern layer embedded in the external insulating layer, and exposed to the accommodation groove; a land pattern disposed closer to a center portion of the accommodation groove than the connection pattern; and a dam pattern connecting the connection pattern and the land pattern, in which a line width of the dam pattern is narrower than a line width of the land pattern. 1. A printed circuit board comprising:an internal insulating layer;an internal conductive pattern layer disposed on the internal insulating layer, and including a line portion and a bonding pad portion; andan external insulating layer disposed on the internal conductive pattern layer and the internal insulating layer, and having an accommodation groove extending through the external insulating layer to expose the bonding pad portion, a connection pattern extending from the line portion of the internal conductive pattern layer embedded in the external insulating layer, and extending in the accommodation groove;', 'a land pattern disposed closer to a center portion of the accommodation groove than the connection pattern; and', 'a dam pattern connecting the connection pattern and the land pattern, in which a line width of the dam pattern is narrower than a line width of the land pattern,, 'wherein the bonding pad portion compriseswherein a thickness of at least one of the land pattern or the dam pattern is thicker than a thickness of the connection pattern, andwherein the land pattern and dam ...

METHOD OF PRODUCING 2, 3-BUTANEDIOL USING RECOMBINANT YEAST

Disclosed is a method of producing 2,3-butanediol using a recombinant yeast having a 2,3-butanediol biosynthesis pathway controlled in a metabolic engineering manner. The method enables production of 2,3-butanediol at high production efficiency from glucose or xylose using a recombinant yeast wherein enzymatic activity of pyruvate decarboxylase is inhibited and exotic genes associated with 2,3-butanediol biosynthesis are introduced. 1Saccharomyces cerevisiae. Recombinant transformed such that functions of pyruvate decarboxylase are lost and acetolactate synthase , acetolactate decarboxylase and butanediol dehydrogenase are expressed.2Saccharomyces cerevisiae. The recombinant according to claim 1 , wherein the loss of functions of the pyruvate decarboxylase is carried out by partially disrupting or entirely deleting each of a PDC1 gene encoding pyruvate decarboxylase 1 and a PDC5 gene encoding pyruvate decarboxylase 5.3Saccharomyces cerevisiaeSaccharomyces cerevisiae. The recombinant according to claim 1 , wherein the recombinant comprises a MTH1 gene modified such that Mth1 claim 1 , a glucose-sensing enzyme claim 1 , is not decomposed after phosphorylation by casein kinase I.4Saccharomyces cerevisiae. Recombinant transformed such that xylose reductase claim 1 , xylitol dehydrogenase and xylulose kinase are expressed claim 1 , functions of pyruvate decarboxylase are lost claim 1 , and acetolactate synthase claim 1 , acetolactate decarboxylase and butanediol dehydrogenase are expressed.5Saccharomyces cerevisiae. The recombinant according to claim 4 , wherein the loss of functions of the pyruvate decarboxylase is carried out by partially disrupting or entirely deleting each of a PDC1 gene encoding pyruvate decarboxylase 1 and a PDC5 gene encoding pyruvate decarboxylase 5.6Saccharomyces cerevisiaeSaccharomyces cerevisiae. The recombinant according to claim 4 , wherein the recombinant comprises an MTH1 gene modified such that Mth1 as a glucose-sensing enzyme is not ...

STRUCTURE ANALYSIS METHOD USING A SCANNING ELECTRON MICROSCOPE

A structure analysis method using a scanning electron microscope includes irradiating a sample with an electron beam having a first landing energy to obtain a first image at a first depth of the sample and accelerating the electron beam to have a second landing energy higher than the first landing energy to obtain a second image at a second depth of the sample. 1. A structure analysis method using a scanning electron microscope , comprising:irradiating a sample with an electron beam having a first landing energy to obtain a first image at a first depth of the sample; andaccelerating the electron beam to have a second landing energy higher than the first landing energy to obtain a second image at a second depth of the sample.2. The structure analysis method of claim 1 ,wherein the irradiating of the sample with the electron beam includes scanning the sample along two-dimensional coordinates.3. The structure analysis method of claim 2 ,wherein the first image is a frame unit image obtained at the first depth, and the second image is a frame unit image obtained at the second depth; andthe method further includes obtaining a three-dimensional image using the first and second images.4. The structure analysis method of claim 3 ,wherein the obtaining of the three-dimensional image includes laminating the first and second images to correspond to the first and second depths.5. The structure analysis method of claim 1 ,wherein the first and second images are images obtained by collecting electronic signals emitted from the sample by the electron beam applied to the sample.6. The structure analysis method of claim 5 ,wherein the first image is a dot unit image at the first depth, and the second image is a dot unit image at the second depth; andthe method further includes measuring a change of the electronic signals using the first and second images and analyzing a change of the material constituting the sample at the first and second depths.7. The structure analysis method of ...

POLY(ETHYLENE-ALIPHATIC DIENE)-G-POLYSTYRENE BASED COPOLYMER HAVING IMPROVED MECHANICAL PROPERTIES AND HEAT RESISTANCE AND METHOD FOR PREPARING SAME

The present invention relates to a poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer having an improved mechanical property and heat resistance, and a method for preparing the same. More particularly, the present invention relates to a poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer, which includes an ethylene-aliphatic diene copolymer as a soft segment and a polystyrene-based polymer grafted to the soft segment as a hard segment, and a method for preparing the same. 2. The poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer of claim 1 , wherein Ris a C2-C20 straight or branched chain alkylene group unsubstituted or substituted with a C1-C18 alkyl group claim 1 , and Ris a C2-C20 straight or branched chain alkyl group unsubstituted or substituted with a C1-C18 alkyl group.3. The poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer of claim 1 , wherein the weight average molecular weight of the graft copolymer is 20 claim 1 ,000-1 claim 1 ,500 claim 1 ,000 and the molecular weight distribution is 1.2-3.0.4. The poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer of claim 1 , wherein the graft copolymer has a graft rate of 0.01-10%.5. The poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer of claim 1 , wherein the weight average molecular weight of the poly(ethylene-aliphatic diene) block of the graft copolymer is 10 claim 1 ,000-1 claim 1 ,000 claim 1 ,000 and the weight average molecular weight of the polystyrene-based block is 10 claim 1 ,000-800 claim 1 ,000.7. The method for preparing a poly(ethylene-aliphatic diene)-g-polystyrene-based copolymer of claim 6 , wherein the aliphatic diene monomer comprises at least one selected from the group consisting of 1 claim 6 ,3-butadiene claim 6 , isoprene claim 6 , 2 claim 6 ,3-dimethyl-1 claim 6 ,3-butadiene claim 6 , 1 claim 6 ,2-dimethyl-1 claim 6 ,3-butadiene claim 6 , 1 claim 6 ,4-dimethyl-1 claim 6 ,3-butadiene claim 6 , 1-ethyl-1 claim 6 ,3-butadiene claim 6 ...

3D PROFILING SYSTEM OF SEMICONDUCTOR CHIP AND METHOD FOR OPERATING THE SAME

A 3D profiling system of a semiconductor chip is provided and includes a storage unit that receives scanning electron microscope (SEM) images of a plurality of semiconductor devices having respective data with respect to a plurality of different components and gray levels of each SEM image. An extraction unit that performs principal component analysis (PCA) on the gray level of the SEM image and separates principal components from among the plurality of different components is also part of the system. Additionally, a calculation unit receives provision of actually measured values of the plurality of semiconductor devices, and applies a multiple linear regression to the principal components based on the measured values to complete a 3D profile of the semiconductor chip. 1. A 3D profiling system of a semiconductor chip comprising:a storage unit that receives scanning electron microscope (SEM) images of a plurality of semiconductor devices having respective data with respect to a plurality of different components and gray levels of the SEM images;an extraction unit that performs principal component analysis (PCA) on the gray levels of the SEM images and separates principal components among the plurality of different components; anda calculation unit that receives actually measured values of the plurality of semiconductor devices, and applies a multiple linear regression to the principal components based on the measured values to complete a 3D profile of the semiconductor chip.2. The system of claim 1 , wherein the application of the multiple linear regression to the principal components by the calculation unit comprises a relational formula that includes a correlation coefficient between the gray levels of the SEM images and the principal components.3. The system of claim 2 , wherein the correlation coefficients between the gray levels and the principal components differ from one another.5. The system of claim 2 , wherein the calculation unit receives the provision of ...

LENS ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME

A lens assembly and an electronic device are provided. The lens assembly and/or the electronic device includes a lens barrel, a housing configured to accommodate the lens barrel on one surface of the housing, and an image sensor assembly mounted to the other surface of the housing, the image sensor being configured to rotate around an optical axis of the lens barrel. The image sensor assembly includes a ring-shaped rotation member facing the other surface of the housing, and a plurality of balls interposed between the rotation member and the other surface of the housing. The rotation member rotates on a plane perpendicular to the optical axis. 1. A lens assembly comprising:a lens barrel;a housing configured to accommodate the lens barrel on one surface of the housing; andan image sensor assembly mounted to another surface of the housing, the image sensor assembly being configured to rotate around an optical axis of the lens barrel, a ring-shaped rotation member facing the other surface of the housing; and', 'a plurality of balls interposed between the rotation member and the other surface of the housing, and, 'wherein the image sensor assembly compriseswherein the rotation member rotates on a plane perpendicular to the optical axis.2. The lens assembly of claim 1 ,wherein the image sensor assembly further comprises a plurality of grooves formed on one surface of the rotation member, andwherein each of the plurality of balls is accommodated in one of the plurality of grooves, protrudes from the one surface of the rotation member, and contacts the other surface of the housing.3. The lens assembly of claim 1 , further comprising:at least one first yoke mounted to the housing;at least one coil mounted to one of the housing and the rotation member, between the rotation member and the at least one first yoke; andat least one magnetic body mounted to the other of the housing and the rotation member, between the rotation member and the at least one first yoke,wherein the ...

SECURITY SYSTEM AND METHOD USING HOME GATEWAY ALLIANCE

A security system using home gateway alliance includes an alliance management server which includes a gateway registration unit which registers at least one of position information and IP (Internet Protocol) information of a home gateway upon making a request for registration of the home gateway; and an alliance management unit which, in response to a request for alliance from a user terminal of the home gateway registered with the gateway registration unit, sets an alliance relationship between the home gateway having made the request for alliance and other home gateways adjacent to the home gateway having made the request for alliance. 1. A security system using home gateway alliance , comprising an alliance management server , wherein the alliance management server comprises:a gateway registration unit which registers at least one of position information and IP (Internet Protocol) information of a home gateway upon making a request for registration of the home gateway; andan alliance management unit which, in response to a request for alliance from a user terminal of the home gateway registered with the gateway registration unit, sets an alliance relationship between the home gateway having made the request for alliance and other home gateways adjacent to the home gateway having made the request for alliance and, when a security incident message indicative of an occurrence of a security incident is received from the home gateway registered with the gateway registration unit, transmits a security incident notification message to either the allied home gateways, which have an alliance relationship with the home gateway where the security incident has occurred, or user terminals of the allied home gateways,wherein the security incident notification message is provided for users of the allied home gateways to cope with the security incident upon receipt of the security incident notification message.2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. ( ...

Method for providing security for common intermediate language-based program

Disclosed is a method for providing security of a program made in a script language. In a method for providing security for a common intermediate language-based program, which provides security for a user DLL used in a platform supporting an application made of common intermediate language code and a plug-in made of native code, the method comprises: a specific function call step of calling a specific function within an application which calls a specific module in a security logic DLL including one or more modules while an application is loaded into a main memory and executed; a DLL request step of requesting the security logic DLL from a security module plug-in in which the security logic DLL is encrypted and stored; a DLL generation step of generating the security logic DLL by decrypting the encrypted DLL in the security module plug-in; a step of transmitting the security logic DLL to the specific function within the application; and a DLL module call step of calling the specific module included in the security logic DLL.

METHOD OF VERIFYING INTEGRITY OF PROGRAM USING HASH

In a method for verifying the integrity of first to Nth binaries (N is a natural number greater than or equal to 2), the method may comprise: loading the first to Nth binaries into a main memory in order to execute the binaries; verifying a self hash to verify, by the Kth binary (K=1, . . . , N-1) which has been loaded into the main memory, the integrity thereof by using a hash; and verifying a link hash by setting any one of the first to Kth binaries as a verification binary and setting a (K+1)th binary to be loaded into the main memory as a binary to be verified so that the verification binary verifies the integrity of the binary to be verified by using a hash. 1. A method for verifying the integrity of first to Nth binaries (N is a natural number greater than or equal to 2) , the method comprising:loading the first to Nth binaries into a main memory in order to execute the binaries;verifying a self hash to verify, by the Kth binary (K =1, . . . , N-1) which has been loaded into the main memory, the integrity thereof by using a hash; andverifying a link hash by setting any one of the first to Kth binaries as a verification binary and setting a (K+1)th binary to be loaded into the main memory as a binary to be verified so that the verification binary verifies the integrity of the binary to be verified by using a hash.2. The method according to claim 1 , further comprising:verifying a self hash by the Nth binary after the Nth binary is loaded into the main memory, and verifying a link hash by setting any one of second to the Nth binaries as the verification binary and setting a first binary as the binary to be verified.3. The method according to claim 1 , in the verifying of the link hash claim 1 , when the binary to be verified is the (K+1)th binary claim 1 , the Kth binary is a verification binary.4. The method according to claim 1 , wherein the verifying of the self hash is performed by a binary loaded into the main memory immediately after the binary is loaded ...

Positive Displacement Type Clutch System, Power Transfer System Including Positive Displacement Type Clutch And Braking System, And Transmission System Including Multiple Positive Displacement Type Clutch System

The positive displacement clutch includes: a clutch disc mounted on an output shaft connected with a load such as a wheel, and having a plurality of vanes arranged with predetermined intervals around its outer side; a clutch casing accommodating the clutch, connected and rotated with an input shaft connected with an engine, and having a plurality of spaces in a cylinder divided by the disc vanes; a piston actuator formed on the clutch casing, rotating with the clutch casing, having a piston roller that comes in contact with the clutch disc, and transmitting rotation of the clutch casing to the clutch disc or not; a magnetic member disposed in the clutch casing and connected with the piston actuator; and a magnetic force generator mounted on an output shaft at a side of the disc casing and operating the piston actuator. 1. A positive displacement clutch comprising:a clutch disc mounted on an output shaft connected with a load such as a wheel, and having a plurality of disc vanes arranged with predetermined intervals around its outer side;a clutch casing accommodating the clutch, connected and rotated with an input shaft connected with an engine, and having a plurality of spaces in a cylinder divided by the disc vanes;a piston actuator formed on the clutch casing, rotating with the clutch casing, having a piston roller that comes in contact with the clutch disc, and transmitting rotation of the clutch casing to the clutch disc or not, using a power transmission load on the clutch disc due to compressive resistance between the piston roller and any one of the disc vanes and vacuum resistance between the piston roller and another one of the disc vanes;a magnetic member disposed in the clutch casing and connected with the piston actuator; anda magnetic force generator mounted on the output shaft at a side of the disc casing and operating the piston actuator by generating a magnetic force in the clutch casing in cooperation with the magnetic member.2. The positive ...

LENS DRIVING ASSEMBLY AND ELECTRONIC APPARATUS HAVING THE SAME

A lens driving assembly includes a cam barrel having an opening in an outer circumferential surface thereof and that rotates around an optical axis, a front barrel accommodated in the cam barrel and that moves in an optical axis direction corresponding to rotation of the cam barrel, and a first lens group assembly that pivots between a home position that is deviated from the optical axis and an alignment position that is aligned with the optical axis, in which the first lens group assembly moves through the opening between the home position and the alignment position according to the rotation of the cam barrel and an elastic force. 1. A lens driving assembly comprising:a cam barrel having an opening in an outer circumferential surface thereof and that rotates around an optical axis;a front barrel accommodated in the cam barrel and that moves in an optical axis direction corresponding to rotation of the cam barrel; anda first lens group assembly that pivots between a home position that is deviated from the optical axis and an alignment position that is aligned with the optical axis,wherein the first lens group assembly moves through the opening between the home position and the alignment position according to the rotation of the cam barrel and an elastic force.2. The lens driving assembly of claim 1 , wherein the cam barrel comprises:a gear formed on the outer circumferential surface of the cam barrel and that receives the driving force from a driving module;a first guide groove formed in an inner circumferential surface of the cam barrel and that guides the front barrel corresponding to the rotation due to the driving force; andat least one protrusion that guides a movement of the first lens group assembly.3. The lens driving assembly of claim 2 , wherein the at least one protrusion of the cam barrel comprises a plurality of protrusions claim 2 , and the plurality of protrusions selectively contact a side surface of the first lens group assembly that rotates claim 2 ...

ETHYLENE-BASED QUATERPOLYMER HAVING LOW GLASS TRANSITION TEMPERATURE AND PREPARATION METHOD THEREOF

The present invention relates to a highly elastic, ethylene-based quaterpolymer and a preparation method thereof. More particularly, the present invention relates to a highly elastic, ethylene-based quaterpolymer which comprises a specific molar ratio of an ethylene unit, a Cα-olefin unit, a Cα-olefin unit and at least one functional unit derived from a styrene-based monomer and to a method for preparing the ethylene-based quaterpolymer using a metallocene catalyst. 1. A highly elastic , ethylene-based quaterpolymer comprising:55-93.9 mol % of an ethylene unit;{'sub': '4-6', '3-40 mol % of a Cα-olefin unit;'}{'sub': '8-12', '3-40 mol % of a Cα-olefin unit; and'}0.1-5 mol % of a functional unit derived from at least one styrene-based monomer,the ethylene-based quaterpolymer having a weight-average molecular weight of 50,000-300,000 and a glass transition temperature between −40° C. and −80° C.2. The highly elastic claim 1 , ethylene-based quaterpolymer according to claim 1 , wherein the copolymer comprises:65-85 mol % of an ethylene unit;{'sub': '4-6', '3-25 mol % of a Cα-olefin unit;'}{'sub': '8-12', '5-25 mol % of a Cα-olefin unit; and'}0.3-2 mol % of a functional unit derived from at least one styrene-based monomer.3. The highly elastic claim 1 , ethylene-based quaterpolymer according to claim 1 , wherein the styrene-based monomer is styrene claim 1 , divinylbenzene claim 1 , p-methylstyrene claim 1 , α-methylstyrene claim 1 , butylstyrene claim 1 , methoxystyrene claim 1 , isopropylstyrene or butenylstyrene.4. The highly elastic claim 1 , ethylene-based quaterpolymer according to claim 1 , wherein the copolymer has a molecular weight distribution of 1-3.5. The highly elastic claim 1 , ethylene-based quaterpolymer according to claim 1 , wherein the copolymer has a Tanδ of 0.3 or greater.6. A method for preparing an ethylene-based quaterpolymer claim 1 , comprising polymerizing 55-93.9 mol % of an ethylene monomer claim 1 , 3-40 mol % of a Cα-olefin monomer claim 1 ...

APPARATUS AND METHOD FOR CANCELING FEEDBACK IN HEARING AID

A method of operating an electronic device is provided. The method includes transmitting, by the electronic device, a control signal for controlling a microphone sensitivity of a hearing aid, to the hearing aid, and transmitting a reception signal from a counterpart electronic device to the hearing aid. 1. A method of operating an electronic device , the method comprising:transmitting, by the electronic device, a control signal for controlling a microphone sensitivity of a hearing aid, to the hearing aid; andtransmitting a reception signal provided from a counterpart electronic device to the hearing aid.2. The method of claim 1 , wherein the transmitting of the reception signal to the hearing aid comprises transmitting the reception signal provided from the counterpart electronic device to the hearing aid using a short-range communication method.3. The method of claim 1 , wherein the transmitting of the reception signal to the hearing aid comprises transmitting the reception signal provided from the counterpart electronic device to the hearing aid using a Bluetooth Low Energy (BLE) protocol communication method deforming one or more of a data transmission interval and a data transmission duration.4. The method of claim 1 , further comprising:collecting a sound signal through a microphone of the electronic device; andtransmitting at least a portion of the sound signal collected through the microphone of the electronic device to the hearing aid.5. The method of claim 4 , wherein the transmitting of the at least the portion of the sound signal to the hearing aid comprises:separating the sound signal collected through the microphone of the electronic device into a surrounding sound and a user voice; andtransmitting the surrounding sound to the hearing aid.6. The method of claim 1 , further comprising claim 1 , if an event for microphone sensitivity restoration takes place claim 1 , transmitting a control signal for restoring the microphone sensitivity of the hearing aid ...

FREQUENCY LOCKED LOOP OF A HETERODYNE STRUCTURE

A frequency locked loop is disclosed. The disclosed frequency locked loop may include: a voltage-controlled oscillator configured to output a LO signal; a mixer configured to mix an RF signal with the LO signal to output an IF signal; a first IF path part configured to transfer the IF signal; a second IF path part configured to transfer the IF signal; and an error amplifier configured to receive output signals of the first IF path part and output signals of the second IF part as input, where the voltage-controlled oscillator adjusts a frequency of the LO signal based on an output signal of the error amplifier, the first IF path part has the conversion gain decreased according to an increase in the frequency of the IF signal, and the second IF path part has the conversion gain increased according to an increase in the frequency of the IF signal. 1. A frequency locked loop comprising:a voltage-controlled oscillator configured to output a LO signal;a mixer configured to mix an RF signal with the LO signal to output an IF signal;a first IF path part configured to transfer the IF signal;a second IF path part configured to transfer the IF signal; andan error amplifier configured to receive output signals of the first IF path part and output signals of the second IF part as input,wherein the voltage-controlled oscillator adjusts a frequency of the LO signal based on an output signal of the error amplifier,the first IF path part has a decrease in conversion gain according to an increase in the frequency of the IF signal, and the second IF path part has an increase in conversion gain according to a decrease in the frequency of the IF signal.2. The frequency locked loop of claim 1 , wherein the first IF path part and the second IF path part are connected in parallel with respect to an output end of the mixer.3. The frequency locked loop of claim 1 , wherein the first IF path part comprises a LPF (low-pass Filter) claim 1 , and the second IF path part comprises a HPF (high- ...

ULTRASONIC DIAGNOSTIC APPARATUS AND CONTROL METHOD THEREOF

Disclosed herein is an ultrasonic diagnostic apparatus. The ultrasonic diagnostic apparatus includes an ultrasound probe provided with an array having at least one transducer; a display configured to display an image captured by the array; a body provided with a controller configured to, when at least one image is selected by a user among a plurality of images captured according to a rotation angle of the array, control a rotation angle of the array to allow the selected image to be displayed on the display. 1. An ultrasonic diagnostic apparatus comprising:an ultrasound probe provided with an array ha ng at least one transducer;a display configured to display an image captured by the array;a body provided with a controller configured to, when at least one image is selected by a user among a plurality of images captured according to a rotation angle of the array, control a rotation angle of the array to allow the selected image to be displayed on the display.2. The ultrasonic diagnostic apparatus of claim 1 , whereinthe controller obtains an image in real time by rotating the array when the ultrasound probe is inserted into the inside of an object.3. The ultrasonic diagnostic apparatus of claim 1 , whereinthe controller sequentially displays images, which are captured according to the rotation angle of the array, on the display.4. The ultrasonic diagnostic apparatus of claim 1 , whereinthe controller displays the plurality of images, which is captured according to the rotation angle of the array, and an image, which is selected by the user, together with each other on the display.5. The ultrasonic diagnostic apparatus of claim 1 , whereinthe controller displays the plurality of images and the image selected by the user, to be distinguished from each other.6. The ultrasonic diagnostic apparatus of claim 1 , whereinthe controller displays the image, which is selected by the user, on the display by enlarging the image selected by the user.7. The ultrasonic diagnostic ...

SERVER AND METHOD FOR PROVIDING DESIGN DATA FOR APPLICATION AND SYSTEM FOR GENERATING APPLICATION

An application design server, method and system are provided. The application design server according to an exemplary embodiment includes a communicator configured to receive design data from a first host device and a controller configured to, in response to receiving a request for the design data from a second host device, transmit the received design data to the second host device, and in response to receiving updated design data corresponding to the design data from the first host device, control the communicator to transmit the updated design data to the second host device. 1. An application design server comprising:a communicator configured to receive design data from a first host device; anda controller configured to, in response receiving a request for the design data from a second host device, transmit the received design data to the second host device, and in response to receiving updated design data corresponding to the design data from the first host device, control the communicator to transmit the updated design data to the second host device.2. The application design server as claimed in claim 1 , wherein the design data is related to a user interface which will be applied to a new application.3. The application design server as claimed in claim 1 , wherein the controller claim 1 , in response to receiving update information to update the design data from the second host device claim 1 , controls the communicator to transmit the update information to the first host device claim 1 , and in response to receiving the updated design data which is generated by applying the update information to the design data from the first host device claim 1 , controls the communicator to transmit the updated design data to the second host device.4. The application design server as claimed in claim 3 , wherein the controller receives the update information from the second host device a plurality of times claim 3 , and receives the updated design data according to the ...

METHOD AND APPARATUS FOR PROTECTING DYNAMIC LIBRARIES

Disclosed is a method for protecting a dynamic library from the static analyzer. 1. A method of protecting a dynamic library , the method comprising:loading, into a main memory, an application program using the dynamic library;loading a security-responsible dynamic library into the main memory;generating a dynamic library-to-be-protected by decrypting an encrypted dynamic library stored in the security-responsible dynamic library; andcalling a specific module included in the dynamic library-to-be-protected by the application program.2. The method according to claim 1 , wherein the generating of the dynamic library-to-be-protected further comprises: storing the dynamic library-to-be-protected in a storage device in the form of a file; and loading the dynamic library-to-be-protected into the main memory.3. The method according to claim 1 , wherein the security-responsible dynamic library is dynamically linked to a security enhancing static library claim 1 , and the dynamic library-to-be-protected is statically linked to the security enhancing static library.4. The method according to claim 3 , wherein the security enhancing static library calls at least one module within the security-responsible dynamic library.5. The method according to claim 3 , wherein the dynamic library-to-be-protected calls at least one module within the security enhancing static library.6. The method according to claim 3 , wherein the code of the security enhancing static library is obfuscated.7. The method according to claim 1 , wherein the security-responsible dynamic library includes a security logic which detects an attack against the application program or the dynamic library-to-be-protected or configures an environment against the attack claim 1 , together with anti-debugging or anti-dump.8. The method according to claim 1 , wherein the application program includes a pseudo dynamic library having the same file name as that of the dynamic library-to-be-protected.9. The method according to ...

ELECTRONIC DEVICE HAVING HEAT DISSIPATION STRUCTURE OF CAMERA

An electronic device according to various embodiments of the present disclosure can include at least one heat component, a camera module comprising a camera disposed near the at least one heat component, and a support comprising a first opening in which the camera module is inserted and disposed with a gap along at least a portion of a periphery of the camera module. 1. An electronic device comprising:at least one heat component;a camera module comprising image capturing circuitry and components disposed within a specified distance of the at least one heat component; anda support comprising a first opening configured to receive the camera module therein and wherein when the camera module is disposed in the first opening, a gap is provided along at least a portion of a periphery of the camera module.2. The electronic device of claim 1 , wherein the first opening is disposed in at least a region of the support claim 1 , and configured to block at least a portion of heat produced from the at least one heat component from being transferred to the camera module.3. The electronic device of claim 1 , wherein the camera module further comprises:a connecting portion including a connector,wherein the connecting portion is physically connected to the support in at least a region of the periphery of the camera module.4. The electronic device of claim 3 , wherein the camera module comprises:a camera unit comprising a camera;a base disposed under the camera unit;a camera support body surrounding the periphery of the camera module; anda flexible thermal conductor disposed under the base,wherein the connecting portion comprises at least a portion of the camera support body, and the flexible thermal conductor extends to a lower portion of the connecting portion.5. The electronic device of claim 4 , further comprising:a Thermal Interface Material (TIM) interposed between the flexible thermal conductor and the support, under the connecting portion.6. The electronic device of claim 4 , ...

BINDER COMPOSITION FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME

A binder composition for a lithium secondary battery and a lithium secondary battery including the binder, the binder composition including a copolymer that includes a first structure unit including amide, a second structural unit including carboxylic acid or a salt thereof, and a third structural unit including a morpholine ring or a thiomorpholine ring. 1. A binder composition for a lithium secondary battery , the binder composition comprising a copolymer that includes:a first structure unit including amide,a second structural unit including carboxylic acid or a salt thereof, anda third structural unit including a morpholine ring or a thiomorpholine ring.5. The binder composition as claimed in claim 1 , wherein the copolymer includes:about 20 wt % to about 68 wt % of the first structural unit,about 30 wt % to about 70 wt % of the second structural unit, andabout 2 wt % to about 10 wt % of the third structural unit, all wt % being based on a total weight of the copolymer.6. The binder composition as claimed in claim 1 , further comprising a cyclic compound.7. The binder composition as claimed in claim 6 , wherein the cyclic compound includes a cellulose compound claim 6 , chitosan claim 6 , alginate claim 6 , or pullulan.8. The binder composition as claimed in claim 6 , wherein a weight ratio of the copolymer to the cyclic compound is about 1:9 to about 5:5.9. The binder composition as claimed in claim 1 , wherein a weight average molecular weight of the copolymer is about 400 claim 1 ,000 to about 1 claim 1 ,000 claim 1 ,000.10. The binder composition as claimed in claim 1 , wherein a pH of the binder composition is about 6.0 to about 11.5.11. A lithium secondary battery claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'an electrode that includes the binder composition for a lithium secondary battery as claimed in and an electrode active material;'}a separator; andan electrolyte.12. The lithium secondary battery as claimed in claim 11 , ...

ANTI-DEBUGGING METHOD

Disclosed is an anti-debugging device. In a method for performing anti-debugging by an anti-debugging device, the method comprises creating a child process; monitoring the state of a parent process by the child process; and monitoring the state of the child process by the parent process. 1. A method for performing anti-debugging by an anti-debugging device , the method comprising:creating a child process;monitoring the state of a parent process by the child process; andmonitoring the state of the child process by the parent process.2. The method of claim 1 , wherein the monitoring of the state of a parent process comprises:acquiring a process state value in a process control block of the parent process by the child process; andchecking whether a process state value of the parent process is in a traced or stopped state.3. The method of claim 2 , further comprising terminating the parent process and the child process when the state of the parent process is the traced state.4. The method of claim 1 , further comprising terminating the child process when the parent process is terminated.5. The method of claim 1 , wherein the monitoring of the state of the child process comprises:acquiring a process state value in a process control block of the child process by the parent process; andchecking whether a process state value of the child process is in a traced or stopped state.6. The method of claim 5 , wherein further comprising terminating the parent process and the child process when the state of the child process is the traced state.7. The method of claim 1 , further comprising terminating the parent process when the child process is terminated.8. An anti-debugging device comprising:a parent process including a child process creating unit configured to create a child process and a child process monitoring unit configured to monitor the state of the child process; anda child process including a parent process monitoring unit configured to monitor the state of the parent ...

PROGRAM PROTECTION DEVICE

Disclosed is a device for protection a program. 1. A device for protecting a program , the device comprising:a protection domain unit including an encrypted protection domain, a start point display unit configured to display a start point of the encrypted protection domain, and an end point display unit configured to display an end point of the encrypted protection domain; anda protection domain connection unit including a decryption unit configured to generate a running code unit by decrypting the encrypted protection domain and a protection domain calling unit configured to call the running code unit.2. The device of claim 1 , wherein the start point display unit and the end point display unit comprises:a label configured to acquire an address of each point when the program is run; anda marking code configured to search a start point and an end point of a protection domain to be encrypted without an influence upon the running of the program.3. The device of claim 1 , wherein the encrypted protection domain is acquired by encrypting binary codes from a marking code included in the start point display unit to a marking code included in the end point display unit after binary codes of the program are generated.4. The device of claim 1 , wherein the decryption unit decrypts binary codes from a label included in the start point display unit to a label included in the end point display unit.5. The device of claim 1 , further comprising a protection domain storage unit configured to store the encrypted protection domain before the decryption unit creates the running code unit.6. The device of claim 5 , wherein the protection domain connection unit further comprises a copy unit configured to copy the encrypted protection domain stored in the protection domain storage unit to store the encrypted protection domain in the running code unit when the running of the running code unit is terminated.7. The device of claim 6 , wherein the copy unit copies the encrypted protection ...

LENS BARREL AND ELECTRONIC DEVICE HAVING THE SAME

A lens barrel may be detachably coupled to a capturing device may comprise a first lens assembly having first lenses mounted therein. A second lens assembly may be coupled to the first lens assembly and may have second lenses mounted therein. The second lenses may be aligned with the first lenses along an optic axis, and an adjusting portion may be provided in the first lens assembly and may be configured to adjust a position of the first lenses relative to the second lenses along a direction the optic axis by an electromagnetic force. 1. A lens barrel detachably coupled to a capturing device , the lens barrel comprising:a first lens assembly having at least one first lens mounted therein; anda second lens assembly coupled with the first lens assembly and having at least one second lens mounted therein, the at least one second lens being aligned with the at least one first lens along an optic axis,wherein the first lens assembly includes an adjusting portion, the adjusting portion being configured to adjust a position of the at least one first lens relative to the at least one second lens along the optic axis by an electromagnetic force.2. The lens barrel of claim 1 , wherein the first lens assembly comprises:a lens module having the at least one first lens mounted therein;a housing accommodating the lens module and configured to facilitate movement of the lens module along the direction of the optic axis and having a first opening at a side thereof; anda guide portion coupled within the first opening of the housing.3. The lens barrel of claim 2 , wherein the adjusting portion comprises:a magnet mounted on an outer wall of the lens module; anda coil mounted on the guide portion, wherein the lens module is movable in the housing by an electromagnetic force generated by the magnet and the coil.4. The lens barrel of claim 1 , further comprising a second opening formed in the second lens assembly claim 1 , and an aligning device positioned within the second opening that ...

VACUUM DRYER

A vacuum dryer including a chamber configured to provide an interior space, support pins in the interior space proximate to a bottom of the chamber, a power supply configured to supply power to the support pins, and a pump coupled to the interior space in the chamber. 1. A vacuum dryer comprising:a chamber configured to provide an interior space;support pins in the interior space proximate to a bottom of the chamber;a power supply configured to supply power to the support pins; anda pump coupled to the interior space in the chamber.2. The vacuum dryer according to claim 1 , further comprising a substrate in the interior space to be dried claim 1 , wherein the support pins directly support the substrate.3. The vacuum dryer according to claim 2 , further comprising a photoresist is on the substrate claim 2 ,wherein the photoresist includes a solvent having a polarity.4. The vacuum dryer according to claim 3 , wherein a voltage level of the power is based on a magnitude of the polarity of the solvent claim 3 , and wherein the voltage level of the power is configured to decrease as the polarity of the solvent increases.5. The vacuum dryer according to claim 3 , wherein a temperature of a contact portion of the substrate that contacts one of the support pins is higher than a temperature of a non-contact portion spaced apart from each of the support pins.6. The vacuum dryer according to claim 1 , wherein each of the support pins has one shape of a cylindrical shape claim 1 , a hemispherical shape claim 1 , a conical shape claim 1 , or a needle shape.7. The vacuum dryer according to claim 1 , wherein each of the support pins comprises a core and a shell configured to enclose the core claim 1 ,wherein the core includes conductive material, andwherein the shell includes insulating material.8. The vacuum dryer according to claim 7 , wherein a thermal conductivity of at least one of the support pins is approximately 0.3 W/mK or less.9. The vacuum dryer according to claim 8 , ...

APPARATUS OF GENERATING CREDIT VIRTUAL CURRENCY AND APPARATUS OF MANAGING CREDIT VIRTUAL CURRENCY

Provided is a virtual currency generation apparatus including a blockchain generator configured to generate a blockchain including a virtual currency that is generated based on a credit limit of a consumer and to update the blockchain based on payment details; an account manager configured to manage multi-signatures of a plurality of accounts sharing the blockchain; and a transaction generator configured to store a transaction condition corresponding to each of the plurality of accounts and to proceed with a payment using the virtual currency based on the transaction condition. 1. A virtual currency generation apparatus comprising:a processor,wherein the processor comprises:a blockchain generator configured to generate a blockchain including a virtual currency that is generated based on a credit limit of a consumer and to update the blockchain based on payment details;an account manager configured to manage multi-signatures of a plurality of accounts sharing the blockchain; anda transaction generator configured to store a transaction condition corresponding to each of the plurality of accounts and to proceed with a payment using the virtual currency based on the transaction condition.2. The virtual currency generation apparatus of claim 1 , wherein the account manager is configured to manage a multi-signature of each of a primary account associated with a user terminal of the consumer and at least one of dependent account associated with the consumer.3. The virtual currency generation apparatus of claim 2 , further comprising:a communicator configured to receive a request for generating a first dependent account from the user terminal,wherein the account manager is configured to authenticate a first private key stored in the user terminal and to determine whether to generate the first dependent account based on a result of the authentication.4. The virtual currency generation apparatus of claim 3 , wherein the account manager is configured to generate the first ...

DISPLAY APPARATUS AND CONTROLLING METHOD THEREOF

A display apparatus is provided. The apparatus includes: a user interface configured to adjust a friction force between the user interface and a pen; and a controller configured to, in response to a pen being touched and moved on the user interface, control the user interface to adjust the friction force based on an input mode of the pen. 1. A display apparatus comprising:a user interface configured to adjust a friction force between the user interface and a pen; anda controller configured to, in response to the pen being touched and moved on the user interface, control the user interface to adjust the friction force based on an input mode of the pen.2. The display apparatus as claimed in claim 1 , wherein in response to the pen being touched and moved on the user interface while a notepad is displayed on the user interface claim 1 , the controller is further configured to control the user interface to display a trajectory of the pen on the notepad.3. The display apparatus as claimed in claim 2 , wherein the notepad comprises one of a plurality of background images claim 2 ,wherein the controller is further configured to control the user interface to adjust the friction force based on a currently displayed background image of the plurality of background images and the input mode of the pen.4. The display apparatus as claimed in claim 3 , wherein in response to an input mode of the pen being selected claim 3 , the controller is further configured to control the user interface to display a background image that corresponds to the selected input mode among the plurality of background images.5. The display apparatus as claimed in claim 2 , wherein the controller is further configured to apply a background image selected from a plurality of background images to the notepad claim 2 , and change the input mode of the pen to an input mode corresponding to the selected background image.6. The display apparatus as claimed in claim 2 , wherein the controller is further ...

AUTO FOCUS LOCKING UNIT AND PHOTOGRAPHING APPARATUS INCLUDING THE SAME

Provided are an auto focus (AF) locking unit and a photo-graphing apparatus including the AF locking unit. In particular, the AF locking unit supports a lens group barrel holder that is descended by a movement of a front barrel in an optical axis direction by using a locking lever provided with an elastic force, and the photographing apparatus includes the AF locking unit. According to an embodiment, the AF locking unit supports the lens group barrel holder including lenses in the optical axis direction by using a driving force transmitted from a motor in correspondence to movements of a cam barrel and a front barrel, and the photographing apparatus includes the AF locking unit. 1. An auto focus (AF) locking unit comprising:a locking protrusion;a locking lever provided in an AF frame accommodating a lens group barrel holder including lenses to be moved in an optical axis direction, and supporting the lens group barrel holder by contacting the locking protrusion when the AF frame is moved to an accommodation location that is adjacent to an image sensor; anda locking lever elastic member providing an elastic force in the optical axis direction to the locking lever in correspondence to the contact between the locking protrusion and the locking lever,wherein when the AF frame is moved toward the accommodation location, a distance between a front surface of the lens group barrel holder and an inner side surface of the AF frame, which faces the front surface of the lens group barrel holder, is reduced.2. The AF locking unit of claim 1 , wherein the front surface of the lens group barrel holder and the inner side surface of the AF frame contact each other at the accommodation location.3. The AF locking unit of claim 1 ,wherein a boss is provided on the front surface of the lens group barrel holder to contact the inner side surface of the AF frame that is at the accommodation location, andwherein a protrusion that is supported by the locking lever is provided on an outer ...

OPTICAL MEASURING METHOD AND APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

An optical measuring method includes generating a Bessel beam, filtering the Bessel beam to generate a focused Bessel beam, vertically irradiating the focused Bessel beam onto a substrate in which an opening is formed, and detecting light reflected from the substrate to obtain an image of a bottom surface of the opening. 1. An optical measuring method comprising:generating a Bessel beam;filtering the Bessel beam to generate a focused Bessel beam;directing the focused Bessel beam into an opening formed in a substrate along a direction orthogonal to an upper surface of the substrate; anddetecting light reflected from a bottom surface of the opening to obtain an image of the bottom surface of the opening.2. The method according to claim 1 , wherein generating the Bessel beam includes:generating Gaussian beam; andpassing the Gaussian beam through a Kessel beam generator in a path of the Gaussian beam to generate the Bessel beam.3. The method according to claim 2 , wherein the Bessel beam generator includes a diffractive optical element including an annular slit and a lens claim 2 , or an axicon lens.4. The method according to claim 1 , wherein generating the focused Bessel beam includes filtering a peripheral region of the Bessel beam claim 1 , and transmitting a central region of the Bessel beam to generate the focused Bessel beam having a single peak.5. The method according to claim 1 , wherein generating the focused Bessel beam includes passing the Bessel beam through a Bessel beam adjuster in a path of the Bessel beam to filter the Bessel beam.6. The method according to claim 5 , wherein the Bessel beam adjuster includes a turret-type aperture filter including a plurality of apertures.7. The method according to claim 6 , wherein at least one of the plurality of apertures has a sunburst shape.8. The method according to claim 6 , wherein the Bessel beam adjuster is configured to move along the path of the Bessel beam.9. The method according to claim 5 , wherein the ...

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip; a second interconnection member disposed on the first interconnection member and the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip; a passivation layer disposed on the second interconnection member and having openings exposing at least portions of the redistribution layer of the second interconnection member; and an under-bump metal layer disposed on the passivation layer and filling at least portions of the openings. In the under-bump metal layer, the number of conductor layers formed on a surface of the passivation layer is different from that of conductor layers formed on the exposed redistribution layer and walls of the openings.

HEAD-MOUNTED DISPLAY APPARATUS

A head-mounted display (HMD) apparatus includes a main body having a first surface facing a user's facial side, at least one connecting part connected to at least one surface of the main body, and a wearing part having a strap form, the wearing part being connected to the at least one connecting part and surrounding a portion of a head of the user such that the main body is held on the user's facial side. The main body includes a first support part extending from a portion of the first surface. The wearing part includes a second support part formed on an inner circumferential surface of a front portion of the wearing part facing a forehead of the user. The first support part and the second support part are supported on the user's forehead, thereby minimizing pressure exerted on zygomatic regions and relieving pressure and weight felt by the user. 1. A head-mounted display (HMD) apparatus comprising:a main body having a first surface configured to faces a user's facial side;at least one connecting part connected to at least one surface of the main body; anda wearing part having a strap form, configured to connect to the at least one connecting part and surround a portion of a head of the user such that the main body is held on the user's facial side,wherein the main body comprises a first support part extending from a portion of the first surface,wherein the wearing part comprises a second support part disposed on an inner circumferential surface of a front portion of the wearing part that faces a forehead of the user, andwherein the first support part and the second support part are configured to be supported on the user's forehead.2. The HMD apparatus of claim 1 , wherein the first support part comprises:a first portion extending from an upper side of the first surface;a second portion extending from a portion of a left side of the first surface; anda third portion extending from a portion of a right side of the first surface.3. The HMD apparatus of claim 2 , ...

PRINTED CIRCUIT BOARD

A method for manufacturing a printed circuit board includes forming a through hole in an insulating layer of the printed circuit board, filling the through hole by plating to form a plating layer on the insulating layer, and removing the plating layer from the insulating layer; and forming a circuit pattern on the insulating layer. 1. A method for manufacturing a printed circuit board , the method comprising:forming a through hole in an insulating layer of the printed circuit board;filling the through hole by plating to form a plating layer on the insulating layer;removing the plating layer from the insulating layer; andforming a circuit pattern on the insulating layer.2. The method of claim 1 , wherein the operation of removing the plating layer comprises fully etching claim 1 , so as to remove all of the plating layer formed on the insulating layer.3. The method of claim 2 , wherein the operation of forming a circuit pattern comprises:forming a seed layer on the insulating layer;forming the circuit pattern on the seed layer by electrolytic plating; andremoving the seed layer.4. The method of claim 1 , wherein the operation of forming a through hole in the insulating layer comprises:forming the through hole using a copper clad laminate; andremoving a copper foil of the copper clad laminate.5. The method of claim 1 , wherein the operation of forming the plating layer comprises:forming an electroless plating layer on an inner wall of the through hole and on the insulating layer; andelectroplating to fill the through hole with a plating, thereby forming an electroplating layer on the insulating layer.6. A printed circuit board comprising:an insulating layer formed comprising a through hole;a via comprising a first plating layer formed on an inner wall of the through hole and a second plating layer formed on the first plating layer and filling the through hole; anda circuit pattern formed on the insulating layer.7. The printed circuit board of claim 6 , wherein the ...

SECONDARY BATTERY AND DEVICE INCLUDING THE SAME

A secondary battery according to one embodiment of the present disclosure includes: a jelly-roll type electrode assembly; a top insulator located at the top of the electrode assembly; and a bottom insulator located at the bottom of the electrode assembly, wherein at least one of the top insulator and the bottom insulator includes a temperature-sensitive polymer that swells in accordance with a temperature rise.

Ethylene-based quaterpolymer having low glass transition temperature and preparation method thereof

The present invention relates to a highly elastic, ethylene-based quaterpolymer and a preparation method thereof. More particularly, the present invention relates to a highly elastic, ethylene-based quaterpolymer which comprises a specific molar ratio of an ethylene unit, a C 4-6 α-olefin unit, a C 8-12 α-olefin unit and at least one functional unit derived from a styrene-based monomer and to a method for preparing the ethylene-based quaterpolymer using a metallocene catalyst.

A process of preparing microspheres for sustained release having improved dispersibility and syringeability

Polyanionic polymers which enhance fusogenicity

The present invention relates generally to the amphiphilic polyelectrolyte, poly(2-ethylacrylic acid) and covalently bonded lipids to generate Lipo-PEAA. These Lipo-PEAA are then used to make pH-sensitive liposomes which become unstable, permeable or fusogenic with certain pH changes. In addition, this invention generally describes methods for delivering therapeutic compounds and drugs to target cells by administering to a host the pH-sensitive liposomes of the present invention.

Electrode assembly for secondary batteries and lithium secondary battery including the same

Disclosed are an electrode assembly for secondary batteries and a lithium secondary battery including the same. More particularly, an electrode assembly including a cathode, an anode and a separator, wherein the cathode includes a lithium cobalt-based oxide, and a lithium nickel-based composite oxide forming a coating layer over a surface of the lithium nickel-based composite oxide by reacting with a fluorine-containing polymer, as a cathode active material, the anode includes carbon and a silicon oxide as an anode active material, an operating voltage is 2.50 V to 4.35 V, and the cathode active material has high rolling density by a bimodal form in which an average diameter of the cobalt-based oxide and an average diameter of the lithium nickel-based composite oxide are different, and a lithium secondary battery including the same are disclosed. In addition, an electrode assembly including a lithium cobalt-based oxide surface-coated with alumina (Al 2 O 3 ), and a lithium secondary battery including the same are disclosed.

Backlight assembly

A backlight assembly having protrusions in a side surface between a side supporter and a cover shield is provided. The protrusions prevent the cover shield from being deformed by an external force and prevent disconnection of a wire between the side supporter and the cover shield. The backlight assembly includes a plurality of light sources; a side supporter having a plurality of U-shaped curved portions which align with and support the light sources; a PCB having a plurality of inverters mounted thereon; a plurality of wires which connect the inverter and an electrode of each light source; a cover shield with an edge for protecting end portions of the light sources and a second edge for protecting the PCB; and an extension formed on one surface of the side supporter opposite to the cover shield edge.

Method for atomic layer deposition (ALD) of silicon oxide film

The present invention relates to a method for forming silicon oxide films on substrates using an atomic layer deposition process. Specifically, the silicon oxide films are formed at low temperature and high deposition rate via the atomic layer deposition process using a Si 2 Cl 6 source unlike a conventional atomic layer deposition process using a SiCl 4 source. The atomic layer deposition apparatus used in the above process can be in-situ cleaned effectively at low temperature using a HF gas or a mixture gas of HF gas and gas containing —OH group.

Composite material for means of transport including polypropylene resin and long carbon fiber

The present invention relates to a composite material for a transport, including a polypropylene resin and a carbon long fiber, and more particularly, to a fiber reinforced composite material composition for a transport including 40-90 wt % of a polypropylene resin, 5-60 wt % of a carbon long fiber having a fiber diameter of 1-50 μm and a weight average fiber length of 20-150 mm, and 0.3-10 wt % of a compatibilizer. The compatibilizer includes one selected from the group consisting of an ionomer, a copolymer of propylene-polar monomer, a modification water added polymer and combinations thereof. The composite material has improved interface properties between the polypropylene resin and the carbon long fiber owing to a specific compatibilizer, improved rigidity, impact resistance and heat resistance, and may be applied to various fields requiring the fiber reinforced composite material as well as various transports including an automobile.

Apparatus and method for satellite communication installed in terrestrial portable phone and similar ground terminal

Disclosed is a method of performing satellite communication in a synchronous or asynchronous mobile terminal containing a satellite communication module (SCM) having a satellite antenna for performing direct communication with a satellite, thus allowing communication in areas where there exists no land communication network as well as allowing land radio communication. The method includes a first step of interfacing between the satellite communication apparatus and the land communication apparatus such that predetermined signals are transmitted/received between the satellite communication apparatus and the land communication apparatus; and a second step of performing the satellite communication according to the signals transmitted/received between the satellite communication apparatus and the land communication apparatus through the interfacing.

Protein-containing lipid implant for sustained delivery and its preparation method

Disclosed are a protein-containing lipid implant for sustained delivery, which comprises a compressed mixture of a protein drug coated with a hydrophilic polymer and a lipid, and a method of preparing the lipid implant. The protein-containing lipid implant for sustained delivery sustains the in vivo release of a protein drug in an active state for a long period of time because the protein drug is evenly distributed in a lipid matrix in a stable state, and thus maintains constant serum levels of the protein drug. Thus, the lipid implant is capable of effectively treating diseases and reducing injection frequency.

Domain managing method, domain extending method and reference point controller electing method

A method of managing a domain, a method of extending a domain, and a method of selecting a reference point controller are provided. The method of operating the domain includes: receiving a request for authenticating a reference point controller from a reference point controller candidate; invalidating a membership of the stored reference point controller; generating a unique reference point controller membership for verifying that the reference point controller candidate is a new reference point controller; and transmitting the generated reference point controller membership to the reference point controller candidate. Accordingly, even when an error occurs in the reference point controller, the function of the reference point controller can be rapidly replaced by using the reference point controller candidate.

Navigation system using wireless communication network and route guidance method thereof

Composition and microsphere for controlled-release of exendin, and method of preparing the same

A controlled-release composition and controlled-release microspheres containing an exendin as an active ingredient, and a method of preparing the same are provided. More specifically, a controlled-release composition containing an exendin as an active ingredient, a biodegradable polymer with a specific viscosity, and coating materials, having high bioavailability and showing sustained release of the active ingredient in an effective concentration for a certain period without an excessive initial burst of the active ingredient; controlled-release microspheres containing a core including an exendin as an active ingredient and a biodegradable polymer, and a coating layer coating the core; and a method of preparing controlled-release microspheres including the steps of mixing an exendin, a biodegradable polymer, and a solvent, removing the solvent from the mixture to prepare hardened microspheres, and coating the hardened microspheres to form a coating layer on the surface of each microsphere, are provided.

Fan-out semiconductor package

A fan-out semiconductor package includes a core member having a through hole, at least one dummy structure disposed in the core member, a semiconductor chip disposed in the through hole and including an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of each of the core member and the semiconductor chip, and filing at least a portion of the through hole, and a connection member disposed on the core member and the active surface of the semiconductor chip, and including a redistribution layer electrically connected to the connection pad.

Printed circuit board including electromagnetic bandgap structure

Disclosed is a printed circuit board, which includes an electromagnetic bandgap structure disposed around an antenna so as to prevent noise from being transmitted to the antenna. The printed circuit board includes an antenna, a circuit chip, a plurality of metal layers and a plurality of dielectric layers, a pair of transmission lines for transmitting a signal to the antenna, and an electromagnetic bandgap structure disposed between the antenna and the circuit chip and for preventing an electromagnetic wave from being transmitted from the circuit chip to the antenna.

Portable terminal for controlling hearing aid and method therefor

Composition and microsphere for controlled release of exendin, and method for its preparation

Una microesfera de liberación controlada con una capa de recubrimiento que comprende un núcleo que contiene una exendina como principio activo, y un polímero biodegradable, y una capa de recubrimiento que recubre el núcleo con un material de recubrimiento, en el que el polímero biodegradable es un polímero seleccionado del grupo constituido por poliláctido (PLA), poliglicólido (PGA), poli(láctido-co-glicólido) (PLGA), poliortoéster, polianhídrido, ácido polihidroxibutírico, policaprolactona, y polialquilcarbonato, un copolímero o una mezcla simple de dos o más seleccionados del grupo polimérico; un copolímero del polímero y polietilenglicol (PEG), o un complejo de polímero-azúcar en el que un azúcar se acopla al polímero o al copolímero, el material de recubrimiento es uno o más seleccionado del grupo constituido por aminoácidos básicos, polipéptidos, y compuestos orgánicos de nitrógeno, en el que el aminoácido básico es uno o más seleccionado del grupo constituido por arginina, lisina, e histidina, el polipéptido comprende de 2 a 10 aminoácidos en el que están comprendidos uno o más aminoácidos básicos seleccionados del grupo constituido por arginina, lisina, e histidina, y el número de aminoácidos básicos es superior al de aminoácidos ácidos, y el compuesto orgánico de nitrógeno es uno o más seleccionado del grupo constituido por creatina, creatinina, y urea. A controlled release microsphere with a coating layer comprising a core containing an exendin as an active ingredient, and a biodegradable polymer, and a coating layer that coats the core with a coating material, in which the biodegradable polymer is a polymer selected from the group consisting of polylactide (PLA), polyglycolide (PGA), poly (lactide-co-glycolide) (PLGA), polyortoester, polyanhydride, polyhydroxybutyric acid, polycaprolactone, and polyalkylcarbonate, a copolymer or a simple mixture of two or more selected from the polymer group; a copolymer of the polymer and polyethylene glycol (PEG), or a ...

Position sensor assembly and optical device including the same

Position sensor assemblies having compact structures and capable of precisely sensing a position change, and optical devices including the same are disclosed. A position sensor assembly is provided that includes: a sensing unit that outputs a signal varying as a magnetic force varies; and a magnet spaced apart from the sensing unit and i movably disposed with respect to the sensing unit, and comprising protrusion units of opposite polarities that protrude from each end portion of the magnet in one surface of the magnet toward the sensing unit.

Digital photographing apparatus and method for dealing with shake

Provided is a digital photographing apparatus and method of obtaining data of a clear image even though the digital photographing apparatus shakes. The digital photographing apparatus includes: a lens; an imaging device generating data from light incident through the lens; an imaging device base on which the imaging device is disposed; a light diode integrated circuit disposed on the imaging device base; and an imaging device base actuator moving the imaging device base and controlling a position of the imaging device. The method comprises generating data from light incident through a lens; detecting a direction of shake of the digital photographing apparatus according to a difference in the amount of light detected in each of four regions of the surface of a light diode integrated circuit; and changing a position of the imaging device in the opposite direction to the detected direction of the shake.

Composition and microsphere for controlled-release of exendin,and method of preparing the same

Polyanionic polymers which enhance fusogenicity

The present invention relates generally to the amphiphilic polyelectrolyte, poly(2-ethylacrylic acid) and covalently bonded lipids to generate Lipo-PEAA. These Lipo-PEAA are then used to make pH-sensitive liposomes which become unstable, permeable or fusogenic with certain pH changes. In addition, this invention generally describes methods for delivering therapeutic compounds and drugs to target cells by administering to a host the pH-sensitive liposomes of the present invention.

Swelling tape for secondary battery and cylindrical secondary battery comprising same

The present invention relates to a swelling tape including a base layer and an adhesive swelling layer, wherein the adhesive swelling layer contains a water-based self-healing binder, an electrode assembly in which the swelling tape is attached to an outer circumferential surface thereof, and a secondary battery including the electrode assembly.

Navigation system using wireless communication network and route guidance method thereof

There is provided a navigation system using a wireless communication system and a route guidance method thereof. In the navigation system, an information center searches out an optimum route between a present vehicle position and a destination referring to map data in its map database and generates route guidance data. A navigation terminal inside the vehicle calculates the present position of the vehicle, transmits the vehicle's current position information to the information center, receives the route guidance data, and announces a notification message. A wireless communication network connects the information center to the navigation terminal wirelessly.

Program protection device

Disclosed is a device for protection a program. The device includes a protection domain unit including an encrypted protection domain, a start point display unit configured to display a start point of the encrypted protection domain, and an end point display unit configured to display an end point of the encrypted protection domain; and a protection domain connection unit including a decryption unit configured to generate a running code unit by decrypting the encrypted protection domain and a protection domain calling unit configured to call the running code unit.

Route guiding method in a navigation system using a wireless network

A route guidance method in a navigation system using a wireless network, wherein a navigation terminal receives route guidance data by which a moveable object is guided to a destination via a plurality of node points in an optimum route from an information center. The navigation terminal determines whether a user has requested a preview of an optimum route. If the preview has been requested, the navigation terminal determines whether preview information is to be provided in text or in image. Upon request for the preview in text, the navigation terminal displays comprehensive route information in text. Upon request for the preview in image, the navigation terminal generates preview information about each node point on the optimum route based on the route guidance data and displays the preview information in image.

NEW VITAMIN E POLIOXIPROPILENPOLIOXIETILENO AND ITS PREPARATION.

Una vitamina E polioxipropilenpolioxietileno, representada por la fórmula general I siguiente: **(Fórmula)** en la que, R1 es -(OCH2CH2)m-, donde m es un número entero de 0 a 150; R2 es ** (Fórmula)** donde n es un número entero de 1 a 200; B es -CH3 en la posición 5, 7 u 8 de la vitamina E; y p es un número entero igual a 1 ó 3. A vitamin E polyoxypropylene polyoxyethylene, represented by the following general formula I: ** (Formula) ** in which, R1 is - (OCH2CH2) m-, where m is an integer from 0 to 150; R2 is ** (Formula) ** where n is an integer from 1 to 200; B is -CH3 at position 5, 7 or 8 of vitamin E; and p is an integer equal to 1 or 3.

Nano-emulsion, the use thereof, and preparation method thereof

The present invention relates to nanoemulsions, the use thereof and preparation method thereof wherein, nanoemulsions contain polyoxypropylene-polyoxyethylene vitamin E as emulsifiers and polyacrylic acid or polyacrylic acid derivative crosspolymers as emulsion assistants, In the present invention nanoemulsions containing POP-POE vitamin E as emulsifiers and polyacrylic acid or polyacrylic acid derivative crosspolymers as emulsion assistants have a very small mean droplet diameter ranging from 43 to 96 nm and are very stable and safe. By using the nanoemulsions described above the inventors prepared nanoemulsion cosmetic compositions with a much smaller mean droplet diameter than nanoemulsions prepared only with emulsifiers, polyoxypropylene-polyoxycthylcne vitamin E. The nanoemulsion cosmetic compositions in the present invention have good effects such as skin softening, skin moisturizing, improving dry atopy skin, skin firming and good spreadability when applied on the skin. Particularly, nanoemulsion skin treating compositions in present invention have an advantage of having a long lasting effect of skin treating due to the favorable penetration of active drug components into the skin.

Method and system for transferring resource

A resource transfer method and system are disclosed. According to the resource transfer method, a transfer chain including a plurality of resource handlers is configured to transfer resources to at least one destination, transfer session identification information corresponding to the transfer chain is generated, a control message including the transfer session identification information to the resource handlers, and the resources are transferred by using the resource handlers. Thus, the resources can be effectively transferred to a requested destination.

Rapid cell culture-testing device capable of preventing separation of solidified fluid

Provided is a cell culture test device including a plurality of well units. Each of the well units includes an inlet portion through which a first fluid and a second fluid are introduced and a bottom portion including a first sub-well including a first fluid-accommodating space. The first fluid-accommodating space has an edge groove formed along the outer circumference of the lower end thereof to accommodate a portion of the first fluid or increases in diameter in a direction from the upper end to the lower end thereof.

Lateral flow deposition apparatus and method of depositing film by using the apparatus

A deposition apparatus and deposition method for forming a film on a substrate are disclosed. A film is deposited on a substrate by exposing the substrate to different flow directions of reactant gases. In one embodiment, the substrate is rotated in the reaction chamber after a film having an intermediate thickness is formed on the substrate. In other embodiments, the substrate is transferred from one reaction chamber to another after a film having an intermediate thickness is formed on the substrate. Accordingly, a film having a uniform thickness is deposited, averaging out depletion effect.

Hard coating composition

A hard coating composition capable of being applied to the modification of a surface of plastic material that is being widely used in household appliances, the hard coating composition including an inorganic dispersion solution that is composed of at least one hydrolytically decomposable silane compound and an inorganic oxide particle, and an organic resin solution that is composed of a photo-curable acrylic-based compound and various additives capable of providing a functionality, such as a surface improving agent and an anti-static agent, the hard coating composition providing pH of between 4 and 6.