System and Method for Peeling a Semiconductor Chip From a Tape Using a Multistage Ejector

A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip. 1. A system for peeling a semiconductor chip from a tape , the system comprising:a housing having a top surface, wherein the top surface is positioned under the tape on which the chip is attached;a plural sets of tape removing contacts provided at the center of the top surface of the housing, wherein each of the plural sets of tape removing contacts is capable of moving independently or together with the other sets;a plurality of vacuum channels surrounding the plural sets of tape removing contacts;a vacuum source coupled to the plurality of vacuum channels for creating a vacuum to hold the tape firmly; anda controller for controlling the vacuum source and the plural sets of tape removing contacts,wherein the chip is removed from the tape due to the synchronous movement of the plural sets of tape removing contacts once the vacuum source is turned on.3. The system of claim 1 , wherein each set of the plural sets of tape removing contacts is coupled to a respective actuation mechanism that facilitates its movement based upon trigger received from the controller.4. The system of claim 1 , wherein contacts of the plural sets of tape removing contacts comprises at least one of pins or needles.5. The system of claim 1 , further comprising a pickup and place unit ...

Laser Scribing Of Thin-Film Solar Cell Panel

The present invention describes an apparatus for a first laser scribing (P 1 ) on the front electrode of a thin film solar cell panel and a similar apparatus for subsequent laser scribing (P 2 ,P 3 ) on the semiconductor layer and semiconductor layer/rear electrode. Before starting scribing process (P 1 ), the left hand edge or reference line on the left hand edge on a workpiece is aligned substantively parallel to the linear drive before translating the workpiece on the apparatus. Similarly, the first and second scribed lines (Lp 1 ,Lp 2 ) formed during the P 1 and P 2 processes are separately aligned parallel to the linear drive before starting the relevant process (P 2 ,P 3 ). Alternatively, parallelism of the workpiece is carried out for each batch of the workpiece. In both apparatuses, the laser sources are mounted on independently motorised axes.

TRANSFER SYSTEM FOR FLIPPING AND MULTIPLE CHECKING OF ELECTRONIC DEVICES

The present invention includes a transfer system for flipping and checking electronic devices. A first rotary device has a plurality of transfer heads configured to pick electronic devices from a wafer table and place the electronic devices on a transfer head of a second rotary device. Check stations can be positioned around the first and second rotary devices and configured to inspect or check the electronic devices during the flipping process. The transfer system can further include an imaging device to inspect the accuracy of picking and placing of the electronic devices during the flipping process. The wafer table and the first rotary device are inclined to increase the operation space. The system accurately picks, flips and transfers chips at a high operation speed. 1. A transfer system for flipping and checking electronic devices , said transfer system comprising:a wafer table inclined about a first angle with respect to a horizontal axis;a first rotary device positioned at a second angle with respect to a horizontal axis, said first rotary device comprising a plurality of first transfer heads circumferentially arranged around said first rotary device, said first transfer heads configured to pick and hold said electronic devices from said wafer table and transfer said electronic devices to a second rotary device;the second rotary device being rotatable about a horizontal axis, said second rotary device comprising a plurality of second transfer heads vertically arranged on a circumference of said second rotary device, said second rotary device configured to pick said electronic devices from said first rotary device and transfer said electronic devices to a handling device;a first imaging device to inspect said electronic devices to be picked from the wafer table;a second imaging device to inspect said electronic devices to be placed on the handling device;a plurality of check stations positioned around said first and second rotary devices, said plurality of ...

System and method for peeling a semiconductor chip from a tape using a multistage ejector

A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.

System and method for peeling a semiconductor chip from a tape using a multistage ejector

A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.

System and method for peeling a semiconductor chip from a tape using a multistage ejector

A system and method for peeling a semiconductor chip (604) from a tape (606) using a multistage ejector is disclosed. A housing (102) in the multistage ejector houses an inner (202), middle (204) and outer (206) set of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip (604). A vacuum source is utilized for generating vacuum to suck the tape (606). The inner (202), middle (204) and outer (206) sets of tape removing contacts are independently or together moved below the tape (606) at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each inner (202), middle (204) and outer (206) sets of tape removing contact to effectively remove or loosen the tape (606) from the chip. A pick and place unit can then pick up the chip (604) easily without any damage to chip. [FIG. 2]

System and method for peeling a semiconductor chip from a tape using a multistage ejector

A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.

Transfer system for flipping and multiple checking of electronic devices

The present invention includes a transfer system (70) for flipping and checking electronic devices (40, 41, 42, 43). A first rotary device (20) has a plurality of transfer heads (30, 31, 32, 33, 34, 35) configured to pick electronic devices (40, 41, 42, 43) from a wafer table (21) and place the electronic devices (40, 41, 42, 43) on a transfer head (30, 31, 32, 33, 34, 35) of a second rotary device (50). Check stations (22, 23, 24) can be positioned around the first and second rotary devices (20, 50) and configured to inspect or check the electronic devices (40, 41, 42, 43) during the flipping process. The transfer system (70) can further include an imaging device (25, 64) to inspect the accuracy of picking and placing of the electronic devices (40, 41, 42, 43) during the flipping process. The wafer table (21) and the first rotary device (20) are inclined to increase the operation space. The system accurately picks, flips and transfers chips at a high operation speed. FIG. 7 accompanies the abstract.

Laser scribing of thin-film solar cell panel

The present invention describes an apparatus (100) for a first laser scribing (P1) on the front electrode of a thin film solar cell panel and a similar apparatus (100a) for subsequent laser scribing (P2, P3) on the semiconductor layer and semiconductor layer/rear electrode. Before starting scribing process P1, the left hand edge or reference line on the left hand edge on a workpiece is aligned substantively parallel to the linear drive (140) before translating the workpiece on the apparatus (100). Similarly, the first and second scribed lines (Lp1, Lp2) formed during the P1 and P2 processes are separately aligned parallel to the linear drive (140) before starting the relevant process (P2, P3). Alternatively, parallelism of the workpiece is carried out for each batch of the workpiece. In both apparatuses (100, 100a), the laser sources (150) are mounted on independently motorised axes.

Laser scribing of thin-film solar cell panel

Laser scribing of thin-film solar cell panel

A method for laser scribing of thin-films for the manufacture of solar cell panels comprises loading a workpiece with the transparent substrate facing downwards in an input station of a first machine; biasing a reference edge of the workpiece against a front and rear stopper associated with a linear drive; translating the workpiece back and forth between the input station and output station and firing two or more laser beams at a first frequency substantially vertically through a space between the input and output stations to pass through the transparent substrate of the workpiece to scribe parallel lines on the front electrodes with reference to the edge of the workpiece in contact with the front and rear stoppers; and indexing the two or more laser sources and repeating the back and forth translation of the work piece between the input and output stations.

System and method for peeling a semiconductor chip from a tape using a multistage ejector

A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.