Capacitor package structure and antioxidative composite electrode foil thereof

The present invention provides a capacitor package structure and an antioxidative composite electrode foil thereof. The antioxidative composite electrode foil includes a base layer, a conductive film structure and an antioxidative film structure. The base layer has a top surface and a bottom surface. The conductive film structure includes a plurality of first conductive film layers, the antioxidative film structure includes a plurality of first antioxidative film layers, and the first conductive film layers and the first antioxidative film layers are alternately stacked on top of one another and disposed on the top surface of the base layer. Thereof, the thickness and the cost of the antioxidative composite electrode foil are decreased, and the antioxidative function of the antioxidative composite electrode foil is increased, by matching the conductive film structure and the antioxidative film structure.

STACKED SOLID-STATE ELECTROLYTIC CAPACITOR WITH MULTI-DIRECTIONAL PRODUCT LEAD FRAME STRUCTURE

A stacked solid-state electrolytic capacitor with multi-directional product lead frame structure includes a plurality of capacitor units, a substrate unit and a package unit. The capacitor units are stacked onto each other. Each capacitor unit has a positive electrode and a negative electrode, the positive electrode of each capacitor unit has a positive pin extended outwards, the positive pins are electrically stacked onto each other, and the negative electrodes are electrically stacked onto each other. The substrate unit has at least one positive guiding substrate electrically connected to the positive pins of the capacitor units and a plurality of negative guiding substrates electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit in order to expose an end of the at least one positive guiding substrate and an end of each negative guiding substrate.

Zuruckziehbare Endkappe für LED-Röhre

Ausführungsformen einer Endkappe für eine LED-Röhre sind beschrieben. In einem Aspekt kann eine Endkappe für eine LED-Röhre ein Endkappengehäuse, mindestens eine elastische Komponente und eine Verbindungsanordnung enthalten. Das Endkappengehäuse kann mindestens einen Stromanschluss darauf beinhalten, der konfiguriert ist, sich mit einer externen Stromquelle zu verbinden. Die elastische Komponente kann sich im Innern des Endkappengehäuses befinden. Das Endkappengehäuse kann an einem ersten Ende der Verbindungsanordnung mittels einer ausfahrbaren Verbindung verbunden werden, und ein zweites Ende der Verbindungsanordnung gegenüber dem ersten Ende davon wird mit einem Körper der LED-Röhre durch mindestens einen Stromanschlussstecker verbunden. Der Stromanschlussstecker kann mit dem mindestens einen Stromanschluss verbunden werden, wenn die elastische Komponente gedrückt wird. Der Stromanschlussstecker kann von dem mindestens einen Stromanschluss getrennt bleiben, wenn die elastische Komponente ...

Improved air hood structure

Structure for folding & fastening fuse box

ELECTROMAGNETIC WAVE SHIELDING TAPE USING NANOMATERIALS

An electromagnetic wave shielding tape using nanomaterials includes a carrier substrate, a first nanostructure, a second nanostructure, and an insulating enclosing structure for enclosing the carrier substrate, the first nanostructure, and the second nanostructure. The carrier substrate has a first surface and a second surface opposite to the first surface. The first nanostructure is disposed on the first surface of the carrier substrate, and the second nanostructure is disposed on the second surface of the carrier substrate. 1. An electromagnetic wave shielding tape using nanomaterials , comprising:a carrier substrate having a first surface and a second surface opposite to the first surface;a first nanostructure disposed on the first surface of the carrier substrate;a second nanostructure disposed on the second surface of the carrier substrate; andan insulating enclosing structure for enclosing the carrier substrate, the first nanostructure, and the second nanostructure.2. The electromagnetic wave shielding tape of claim 1 , wherein the carrier substrate is a metal plate or a metal foil claim 1 , the carrier substrate has a plurality of first micro concave areas and a plurality of second micro concave areas claim 1 , the first micro concave areas are arranged as a first predetermined pattern disposed on the first surface of the carrier substrate claim 1 , the second micro concave areas are arranged as a second predetermined pattern disposed on the second surface of the carrier substrate claim 1 , and the first predetermined pattern and the second predetermined pattern are the same or different claim 1 , wherein the first nanostructure includes a plurality of first nanostructure groups disposed on the first surface of the carrier substrate and a first filling covering body disposed on the first surface of the carrier substrate to cover the first nanostructure groups claim 1 , the first nanostructure groups are respectively disposed on the first micro concave areas ...

METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS

The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.

Method of manufacturing a winding-type solid electrolytic capacitor package structure without using a lead frame

A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.

Retractable end-cap for LED tube

Embodiments of an end-cap with retractable and rotatable pin for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, an end-cap base assembly, a power-pin assembly, and at least one elastic component. The power-pin assembly may include at least one power pin thereon and configured to connect to an external power source. The power-pin assembly may protrude out of a center opening of the end-cap housing. The end-cap base assembly may have at least one power connector one end of which is connected to the body of the LED tube to receive electric power. The at least one elastic components may reside inside the end-cap housing and is placed between the power-pin assembly and the end-cap base assembly. The power connector may connect to the at least one power pin when the at least one elastic component is pressed.

Winding-type solid electrolytic capacitor package structure

一種捲繞型固態電解電容器封裝結構，其包括：電容單元、封裝單元及導電單元。電容單元包括一捲繞型電容器，其具有一第一導電接腳及一第二導電接腳。封裝單元包括一包覆電容單元的封裝體。導電單元包括一電性連接於第一導電接腳的第一導電端子及一電性連接於第二導電接腳的第二導電端子。第一導電端子與第二導電端子彼此分離。第一導電端子具有一接觸第一導電接腳且被包覆在封裝體內的第一內埋部及一連接於第一內埋部且裸露在封裝體外的第一裸露部，且第二導電端子具有一接觸第二導電接腳且被包覆在封裝體內的第二內埋部及一連接於第二內埋部且裸露在封裝體外的第二裸露部。

Carrier structure using nanomaterials and method of manufacturing the same

The prevent invention provides a carrier structure using nanomaterials includes a carrier substrate and a first nanostructure. The carrier substrate has a first surface and a plurality of first micro concave areas arranged as a first predetermined pattern disposed on the first surface. The first nanostructure includes a plurality of first nanostructure groups, and the nanostructure groups are respectively disposed on the first micro concave areas and respectively extended outwardly from the first micro concave areas. Whereby, the heat-dissipating efficiency of the carrier structure is increased by using the first nanostructure groups. The present invention further provides a method of manufacturing the carrier structure using nanomaterials.

Stacked capacitor with positive multi-pin structure

A stacked capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit has a positive electrode that has a positive pin extended outwards therefrom. The positive pins of the capacitor units are divided into a plurality of positive pin units that are separated from each other, and the positive pins of each positive pin unit are electrically stacked onto each other. Each capacitor unit has a negative electrode, and the negative electrodes of the capacitor units are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins of the capacitor units and a negative guiding substrate electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.

STACKED-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE

A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.

METHOD FOR MANUFACTURING A POLYMER COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING A CAPACITOR PACKAGE STRUCTURE USING THE POLYMER COMPOSITE MATERIAL

The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material. 1. A method for manufacturing a polymer composite material , comprising:mixing a carbon nanomaterial with polystyrene sulfonate to form a carbon nanomaterial modified by polystyrene sulfonate;adding 3,4-ethylenedioxythiophene into a solution comprising the carbon nanomaterial modified by polystyrene sulfonate; andinitiating a polymerization reaction to allow a reaction between 3,4-ethylenedioxythiophene and the carbon nanomaterial modified by polystyrene sulfonate in the solution for forming a product stream comprising the polymer composite material, the polymer composite material comprising a poly(3,4-ethylenedioxythiophene) unit, a polystyrene sulfonate unit and the carbon nanomaterial;wherein the polystyrene sulfonate unit is connected between the poly(3,4-ethylenedioxythiophene) unit and the carbon nanomaterial, and the polystyrene sulfonate unit is bonded to the poly(3,4-ethylenedioxythiophene) unit through a polymerization process, the content of the nanomaterial ranging from 0.01-1.5 wt. % based on the weight of the polymer composite material.2. The method according to claim 1 , wherein the step of initiating the polymerization reaction further comprises adding an oxidant into the solution.3. The ...

Winding-type solid electrolytic capacitor package structure without using lead frames and method of manufacturing the same

一種不需使用導線架的捲繞型固態電解電容器封裝結構，其包括一捲繞型電容器及一封裝體。捲繞型電容器具有一被封裝體所包覆的捲繞本體、一從捲繞本體的其中一側端延伸而出的正極導電引腳、及一從捲繞本體的另外一側端延伸而出的負極導電引腳。封裝體具有一第一側面、一第二側面及一底面。正極導電引腳具有一被包覆在封裝體內的第一內埋部及一連接於第一內埋部且裸露在封裝體外的第一裸露部，且第一裸露部沿著封裝體的第一側面與底面延伸。負極導電引腳具有一被包覆在封裝體內的第二內埋部及一連接於第二內埋部且裸露在封裝體外的第二裸露部，且第二裸露部沿著封裝體的第二側面與底面延伸。

Heat dissipation structure using nanomaterials and method of manufacturing the same

The prevent invention provides a heat dissipation structure using nanomaterials includes a carrier substrate, a first nanostructure, and a heat-conducting structure. The carrier substrate has a first surface and a plurality of first micro concave areas arranged as a first predetermined pattern disposed on the first surface. The first nanostructure includes a plurality of first nanostructure groups, and the nanostructure groups are respectively disposed on the first micro concave areas and respectively extended outwardly from the first micro concave areas. The heat-conducting structure includes at least one heat-conducting layer disposed on the first surface of the carrier substrate to cover the first nanostructure groups. Whereby, the heat-dissipating efficiency of the heat dissipation structure is increased by using the first nanostructure groups. The present invention further provides a method of manufacturing the heat dissipation structure using nanomaterials.

Electrochemical process for presensitized plate with multiple-frequency method

Retractable End-Cap For LED Tube

Embodiments of an end-cap for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, at least one elastic component, and a connecting assembly. The end-cap housing may include at least one power pin thereon and configured to connect to an external power source. The elastic component may reside inside the end-cap housing. The end-cap housing may connect to a first end of the connecting assembly via an extendable connection and a second end of the connecting assembly opposite to the first end thereof connects to a body of the LED tube through at least one power connector. The power connector may connect to the at least one power pin when the elastic component is pressed. The power connector may remain separate from the at least one power pin when the elastic component is not pressed. 1. An end-cap of a light-emitting diode (LED) tube , comprising:an end-cap housing;at least one elastic component; and the end-cap housing includes at least one power pin thereon and configured to connect to an external power source,', 'the at least one elastic component resides inside the end-cap housing,', 'the end-cap housing connects to a first end of the connecting assembly via an extendable connection and a second end of the connecting assembly opposite to the first end thereof connects to a body of the LED tube through at least one power connector,', 'the power connector connects to the at least one power pin when the at least one elastic component is pressed, and', 'the power connector remains separate from the at least one power pin when the at least one elastic component is not pressed., 'a connecting assembly, wherein2. The end-cap of claim 1 , wherein the connecting assembly comprises:at least one screw; and an upper half of the screw near a screw head of the at least one screw has no screw thread,', 'the at least one screw resides inside the at least one groove, and', 'a bottom half of the at least one screw fastens the end-cap ...

Add-On Smart Controller For LED Lighting Device

An add-on smart controller for an LED lighting device includes a power input port, a power output port, a housing, a control unit in the housing, and at least one control signal receiver in the control unit. A power input of the control unit is connected to the power input port. A power output of the control unit is connected to the power output port. The control signal receiver is configured to receive external control signals. The control unit is configured to activate the power output port to supply output voltage responsive to the control unit receiving an ON signal. The control unit is configured to deactivate the power output port responsive to the control unit receiving an OFF signal. 1. An add-on smart controller for an LED lighting device , comprising:a power input port;a power output port;a housing;a control unit in the housing; andat least one control signal receiver in the control unit, a power input of the control unit is connected to the power input port,', 'a power output of the control unit is connected to the power output port,', 'the control signal receiver is configured to receive external control signals,', 'the control unit is configured to activate the power output port to supply output voltage responsive to the control unit receiving an ON signal, and', 'the control unit is configured to deactivate the power output port responsive to the control unit receiving an OFF signal., 'wherein2. The add-on smart controller of claim 1 , wherein the control unit includes a dimmer configured to control the output voltage or current flowing through the power output port according to the control signal.3. The add-on smart controller of claim 2 , wherein the dimmer is a voltage-based step-dimmer and configured to control the output voltage of the power output port according to the control signal.4. The add-on smart controller of claim 3 , wherein the voltage-based step-dimmer comprises a control signal input port claim 3 , a controllable switcher claim 3 , ...

Capacitance unit and stacked solid electrolytic capacitor

A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.

Linear solid-state lighting with shock protection switches

A linear light-emitting diode (LED)-based solid-state device comprising at least two shock protection switches, at least one each at the two ends of the device, fully protects a person from possible electric shock during re-lamping with LED lamps.

Linear solid-state lighting free of shock hazard

A linear light-emitting diode (LED)-based solid-state lamp having an electrically insulating heat sink that comprises a honeycomb structure is used to replace a conventional metallic one for efficiently dissipating the heat generated by operating the lamp. The lamp further built with a pair of shock protection switches can operate free of electric shock hazard.

Stacked solid electrolytic capacitor with multi-pin structure

A stacked solid electrolytic capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. The positive electrode of each capacitor unit has a positive pin extended outwards therefrom. The positive pins are divided into a plurality of positive pin units that are separated from each other and electrically stacked onto each other. The negative electrode of each capacitor unit has a negative pin extended outwards therefrom. The negative pins are divided into a plurality of negative pin units. The negative pin units are separated from each other and the negative pins of each negative pin unit are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins and a negative guiding substrate electrically connected to the negative pins. The package unit covers the capacitor units and one part of the substrate unit.

LED lighting device with replaceable driver-control module

An LED lighting device with a replaceable driver-control module interface is described. The LED lighting device may include a driver-less LED lighting device, a driver-control module with driver function, and a housing interface on the driver-less LED lighting device to house and connect the driver-control module. The driver-less LED lighting device receives AC from an external AC source and passes the AC to the driver-control module. The driver-control module receives AC from the driver-less LED lighting device and provides DC to the driver-less lighting device to drive LED diodes in the driver-less LED lighting device. The housing interface on the lighting device houses the driver-control module such that, when the driver-control module is fastened to the driver-less lighting device through the housing interface, the driver-control becomes an integral part of the lighting device.

Retractable end-cap for LED tube

Embodiments of an end-cap for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, at least one elastic component, and a connecting assembly. The end-cap housing may include at least one power pin thereon and configured to connect to an external power source. The elastic component may reside inside the end-cap housing. The end-cap housing may connect to a first end of the connecting assembly via an extendable connection and a second end of the connecting assembly opposite to the first end thereof connects to a body of the LED tube through at least one power connector. The power connector may connect to the at least one power pin when the elastic component is pressed. The power connector may remain separate from the at least one power pin when the elastic component is not pressed.

Composite thermal pad using nanomaterials and method of manufacturing the same

The prevent invention provides a composite thermal pad using nanomaterials and a method of manufacturing the same. The composite thermal pad includes a first carrier substrate, a plurality of first top nanostructures and a plurality of first bottom nanostructures. The carrier substrate has a first top surface and a first bottom surface opposite to the first top surface. The first top nanostructures are disposed on the first top surface of the first carrier substrate. The first bottom nanostructures are disposed on the first top surface of the first carrier substrate. Therefore, the first carrier substrate, the first top nanostructures and the first bottom nanostructures are combined to form a first composite thermal pad for providing heat conduction efficiency.

Polymer composite material, method for manufacturing the polymer composite material, capacitor package structure using the polymer composite material and method for manufacturing the capacitor package structure

The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.

Novel capacitor package structure

The instant disclosure relates to a novel capacitor package structure which includes a multilayered film capacitor, a packaging unit, a first lead terminal, and a second lead terminal. The multilayered film capacitor includes two terminal electrodes and a capacitor element disposed between the terminal electrodes, wherein the capacitor element consists of a plurality of metal layers and a plurality of dielectric layers which are alternately deposited. The packaging unit covers the multilayered film capacitor. The first and second lead terminals are electrically connected to the terminal electrodes of the multilayered film capacitor.

White balance adjustment method for a digital image capturing device

A white balance adjustment method for a digital image capturing device is disclosed. The white balance adjustment method comprises the steps of: setting a color temperature estimation area; capturing an image with the digital image capturing device; choosing one or more analysis blocks from the image; determining whether values of Cb and Cr of each analysis block are located in either a color temperature zone or a white zone of the color temperature estimation area; collecting and calculating each point value of each color temperature that is located in the color temperature estimation area to obtaining a final color temperature; and performing a white balance adjustment procedure according to the final color temperature.

Retractable end-cap for LED tube

Embodiments of an end-cap for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, an elastic component, a power connector, and a movable assembly. The movable assembly may include a power pin thereon and configured to connect to an external power source. The elastic component may reside inside the end-cap housing. A first end of the movable assembly may connect to the end-cap housing. A second end of the connecting assembly opposite to the first end thereof may connect to a body of the LED tube through the power connector. The power connector may be electrically disconnected from the power pin when the end-cap housing is pressed. The power connector may be electrically connected to the power pin when the end-cap housing is not pressed.

Linear solid-state lighting with a double safety mechanism free of shock hazard

A linear light-emitting diode (LED)-based solid-state lamp having a double safety mechanism that comprises at least three shock protection switches, fully protects a person from possible electric shock during re-lamping or maintenance. One protection switch provided at each end of the lamp is able to cut off power when the associated end of the lamp is not inserted into the lamp socket. A third protection switch can be used to turn off the power from the AC main for additional shock protection.

MULTI-PURPOSE RECHARGEABLE LED LIGHTING DEVICE

An LED lighting device includes at least one LED light source emitting light, at least one rechargeable battery for supplying power when external power is not available, at least one electrical connector for connecting the rechargeable battery to external power source for recharging, and at least one control mechanism for switching the operation mode of the device. By setting the operation mode via the control mechanism, the LED light device can be used for more than one intended purposes such as regular lighting, emergency lighting, and flashlight. 1. An LED lighting device comprising at least one LED light source , at least one rechargeable battery for supplying power , at least one electrical connector for connecting the at least one rechargeable battery to external power source for recharging , and at least one control mechanism for switching the device to any of a plurality of operation modes , wherein the plurality of operation modes includes (a) the at least one rechargeable battery supplying power to the at least one LED light source when the external power source is on , and the at least one LED light source is off when the external power source is off; (b) the at least one rechargeable battery supplying power to the at least one LED light source when the external power source is off , and the at least one LED light source is shut off when the external power source is on; and (c) the at least one rechargeable battery supplying power to the at least one LED light source regardless of whether the external power is on or off2. The LED lighting device of claim 1 , wherein the external power source is derived from another lighting fixture.3. The LED lighting device of claim 1 , wherein an internal driver circuitry is used for converting the power of the at least one rechargeable battery to drive the at least one LED light source.4. The LED lighting device of claim 2 , wherein an internal driver circuitry is used for converting the power of the at least one ...

Lamellar stacked solid electrolytic capacitor

A lamellar stacked solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit is composed of a negative foil, an isolation paper with conductive polymer substance, a positive foil, an isolation paper with conductive polymer substance and a negative foil that are stacked onto each other in sequence, the positive foils of the capacitor units are electrically connected to each other, the negative foils of the capacitor units are electrically connected to each other, and the positive foils and the negative foils are insulated from each other. The substrate unit has a positive guiding substrate electrically connected to the positive foils of the capacitor units and a negative guiding substrate electrically connected to the negative foils of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.

Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same

A winding-type solid electrolytic capacitor package structure using a carrier board includes a substrate unit, a capacitor unit, a package body and an electrode unit. The substrate unit includes a substrate body. The capacitor unit includes at least one winding capacitor, and the winding capacitor includes a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package unit includes a package body disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure covering the first lateral surface of the package body and electrically contacting the positive end surface and a negative electrode structure covering the second lateral surface of the package body and electrically ...

CAPACITANCE UNIT AND STACKED SOLID ELECTROLYTIC CAPACITOR

A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.

LINEAR SOLID-STATE LIGHTING FREE OF SHOCK HAZARD

A linear light-emitting diode (LED)-based solid-state lamp having an electrically insulating heat sink that comprises a honeycomb structure is used to replace a conventional metallic one for efficiently dissipating the heat generated by operating the lamp. The lamp further built with a pair of shock protection switches can operate free of electric shock hazard.

Stacked solid electrolytic capacitor with multi-welding structure and a manufacturing method thereof

The invention discloses a stacked solid electrolytic capacitor with multi-welding structure. The stacked solid electrolytic capacitor with multi-welding structure includes a plurality of solid electrolytic capacitor elements. Each of these solid electrolytic capacitors has an anode and a cathode. The anode has at least two welding regions. Each of these welding regions disposes a welding material. Because the volume of the welding material on each of these welding regions is less than the volume of the welding material on traditional single-welding structure, the energy required is smaller when welding. The stacked solid electrolytic capacitor with multi-welding structure is used to reduce the probability of the internal structure of the cathode damaged by the stress that caused by the distortion or bending.

Capacitor unit and stacked solid electrolytic capacitor

A capacitor unit has an anode portion, a cathode portion and an insulting portion. The insulting portion is provided for in a form of headband to cover the partial surface of the anode portion to divide the anode and the cathode portions. The cathode portion covers on the anode portion and is located behind the insulting portion. The cathode portion at least has a conductive layer which is made of a conductive polymer having copper, copper alloy or the mixture thereof.

Substrate structure having filaments and method of manufacturing the same

The prevent invention provides a substrate structure having filaments and a method of manufacturing the same. The substrate structure includes a carrier substrate, a plurality of first filament structures and a plurality of second filament structures. The carrier substrate has a first surface and a second surface opposite to the first surface. The first filament structures are integrally disposed on the first surface of the carrier substrate, and the second filament structures are integrally disposed on the second surface of the carrier substrate. Therefore, the heat dissipation efficiency of the substrate structure is increased by using the first filament structures and the second filament structures.

White balance method for a digital image capture device

A white balance method for a digital image capture device is disclosed. The white balance method comprises the steps of: setting a color temperature estimation area; capturing an image by the digital image capture device; choosing one or more analysis blocks from the image; determining whether values of Cb and Cr of each analysis block is located at either a color temperature zone or a white zone of the color temperature estimation area; calculating votes of color temperature that is located in the color temperature estimation area; obtaining a final color temperature; and proceeding white balance according to the final color temperature.

Method for fabricating solid electrolytic capacitors

The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.

White balance adjustment method for a digital image capturing device

A white balance adjustment method for a digital image capturing device is disclosed. The white balance adjustment method comprises the steps of: setting a color temperature estimation area; capturing an image with the digital image capturing device; choosing one or more analysis blocks from the image; determining whether values of Cb and Cr of each analysis block are located in either a color temperature zone or a white zone of the color temperature estimation area; collecting and calculating each point value of each color temperature that is located in the color temperature estimation area to obtaining a final color temperature; and performing a white balance adjustment procedure according to the final color temperature.

Opening-sealed element and solid electrolytic capacitor thereof

An opening-sealed element of the instant disclosure includes a cover body, an exterior convex portion, and an interior convex portion. The cover body has a first surface and a second surface opposite to the first surface, and a pair of terminal holes formed thereon extends through the first and second surfaces. The exterior convex portion having at least one first abutting surface is arranged on the first surface of the cover body, and an expansion space is formed concavely therein. The interior convex portion having at least one second abutting surface is arranged on the second surface of the cover body. Specially, the opening-sealed element is configured to prevent the capacitor element from swaying, so that the electrical property of the solid electrolytic capacitor with the opening-sealed element can be improved.

Multi-purpose rechargeable LED lighting device

An LED lighting device includes at least one LED light source emitting light, at least one rechargeable battery for supplying power when external power is not available, at least one electrical connector for connecting the rechargeable battery to external power source for recharging, and at least one control mechanism for switching the operation mode of the device. By setting the operation mode via the control mechanism, the LED light device can be used for more than one intended purposes such as regular lighting, emergency lighting, and flashlight.

METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS

The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high- temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit. 1. A method for improving fabrication of solid electrolytic capacitors comprising the steps of:providing an anodized foil and a cathodized foil; andemploying a winding process for winding a spacer between the anodized foil and the cathodized foil along with a plurality of lead electrodes to form a tubular core, in which the anodized foil is formed by a powder of aluminum formed onto a sheet of aluminum, dried, high temperature sintered to result with a porous aluminum sintered body and forming an oxidized film thereon.2. The method as recited in claim 1 , wherein the anodized foil is formed by the powder of aluminum sprayed onto the sheet of aluminum claim 1 , dried claim 1 , high temperature sintered to result with the porous aluminum sintered body. This is a continuation application of prior application Ser. No. 14/797,610 filed on Jul. 13, 2015, which is a divisional application of Ser. No. #13/803,064 filed on Mar. 14, 2013, issued as U.S. Pat. No. #9,123,468 on 1 Sep. 2015.1. Field of the InventionThe instant disclosure relates to a method for fabricating solid electrolytic capacitors; in particular, a method for improving fabrication of solid electrolytic capacitors.2. Description of Related ArtAs technology rapidly evolves in the semiconductor industry, the demand for products ...

Method for adjusting manufacturing parameter and controlling system using the same

VOICE RESPONSIVE CAMERA SYSTEM

A camera system includes a driver rotating a rotor and an attached supporter. Two sound sensors on the supporter measure sound signals from an acoustic source. A camera on the supporter is aligned with the acoustic source when the driver rotates the supporter according to differences between the sound signals.

Imaging device and light intensity compensating system and method of the same

Winding-type solid electrolytic capacitor package structure without using a lead frame

A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.

Winding-type solid electrolytic capacitor package structure using a lead frame and method of manufacturing the same

一種使用導線架的捲繞型固態電解電容器封裝結構，其包括：捲繞型電容器、封裝體及導電單元。捲繞型電容器具有一捲繞本體、一正極導電引腳及一負極導電引腳。正極導電引腳的末端具有一切割面，且負極導電引腳的末端具有一研磨面。封裝體包覆捲繞型電容器。導電單元包括一電性連接於正極導電引腳的正極導電端子及一電性連接於負極導電引腳的負極導電端子。正極導電端子具有一被包覆在封裝體內的第一內埋部及一裸露在封裝體外的第一裸露部。負極導電端子具有一被包覆在封裝體內的第二內埋部及一裸露在封裝體外的第二裸露部。第一裸露部與第二裸露部皆沿著封裝體的外表面延伸。

Stacked capacitor with many product pins

A stacked capacitor with many product pins includes a plurality of capacitor units, a substrate unit and a package unit. The capacitor units are stacked onto each other, and the positive side of each capacitor unit has a positive pin extended outwards therefrom. The positive pins are electrically stacked onto each other. The negative sides of the capacitor units are electrically stacked onto each other. The substrate unit has at least one positive guiding substrate electrically connected to the positive pins of the capacitor units and a plurality of negative guiding substrates electrically connected to the negative pins of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit in order to expose one end of the positive guiding substrate and one end of each negative guiding substrate.

High energy storage capacitor unit

The present invention provides a high energy storage capacitor unit. The high energy storage capacitor unit includes an electrolyte, a positive electrode, and a negative electrode. The electrolyte has an electrically conductive polymer. The positive electrode and the negative electrode, having a spacing therebetween, are immersed in the electrolyte. The positive electrode, having a substrate and a transition metal oxide layer formed thereon, results in the highest possible capacitance density.

Substrate structure using nanomaterials and method of manufacturing the same

The prevent invention provides a substrate structure using nanomaterials and a method of manufacturing the same. The substrate structure includes a carrier substrate and a first nanostructure. The carrier substrate has a first surface and a plurality of first micro concave areas arranged as a first predetermined pattern disposed on the first surface. The first nanostructure includes a plurality of first nanostructure groups, and the nanostructure groups are respectively disposed on the first micro concave areas and respectively extended outwardly from the first micro concave areas. Therefore, the heat-dissipating efficiency of the carrier structure is increased by using the first nanostructure groups.

Polymer composite material, method for manufacturing the polymer composite material, capacitor package structure using the polymer composite material and method for manufacturing the capacitor package structure

The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly (3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial is 0.01-1.5 wt. % based on the weight of the polymer composite material. Therefore, the polymer composite material provided by the instant disclosure effectively enhances the electrical properties of the capacitor.

Method for cooling roller of run-out table area and rolling system thereof

A method for cooling rollers in a run-out table area and a rolling system are provided. The run-out table area includes multiple upper spray modules and multiple lower spray modules. The method includes: after a tail end of a rolling material passes through the run-out table area, obtaining a cooling mode corresponding to the upper spray modules and the lower spray modules according to a target temperature; estimating a cooling duration according to a thickness of a next rolling material; and controlling the upper spray modules and the lower spray modules according to the cooling mode and the cooling duration. Therefore, the water quantity for cooling is dynamically adjusted according to temperature and thickness of the current and the next rolling material.

WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE

A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body. 1. A winding-type solid electrolytic capacitor package structure , comprising:a capacitor unit including at least one winding-type capacitor, wherein the at least one winding-type capacitor having at least one first conductive pin and at least one second conductive pin;a package unit including a package body enclosing the capacitor unit, wherein the package body has a first lateral face, a second lateral face opposite to the first lateral face, and a bottom face connected between the first lateral face and the second lateral face; anda conductive unit including at least one first conductive terminal electrically connected to the at least one first conductive pin and at least one second conductive terminal electrically connected to the at least one second conductive pin, wherein the at least one first conductive terminal and the at least one second conductive terminal are separated from each other, the at least one first conductive terminal has a first embedded portion contacting the at least one first ...

Winding-type capacitor package structure and method of manufactured the same

LINEAR SOLID-STATE LIGHTING WITH BROAD VIEWING ANGLE

A linear light-emitting diode (LED)-based solid-state device comprising a curved surface to hold a flexible printed circuit board with multiple linear arrays of surface mount LEDs provides lighting applications with a broad viewing angle over 180° along the radial direction. On each of the two lamp bases of the lamp, a shock-protection switch is mounted to prevent shock hazard during re-lamping.

Improved process for the production of solid-state electrolytic capacitor

The instant disclosure relates to an improved process for the production of solid-state electrolytic capacitor, comprising the following steps. The first step is providing an insulating substrate. The next step is forming a plurality of conducting colloids including aluminum powder on the insulating substrate. The next step is executing a high-temperature sintering process to metalize the conducting colloids to form a plurality of aluminum plates. The next step is forming a dielectric layer on every aluminum plate. The next step is forming an isolating layer on every dielectric layer to define an anode area and a cathode area. The last step is forming a conducting layer on the dielectric layer of every cathode area to form a solid-state electrolytic capacitative unit.

Measurement fixture

Imaging device capable of auto-tracking sound source

MULTI-FUNCTION PRINTER

A multi-function printer including a body, a door, a carriage, and a linkage is provided. The door is assembled to the body and capable of being opened or closed relative to the body. The carriage is movably disposed on the body. The linkage disposed in the body is configured between the carriage and the door. The linkage has a driven end and a driving end. The driven end is located on a moving path of the carriage, and the door is located on a moving path of the driving end. When the carriage moves to a pushing segment, the carriage drives the driven end of the linkage, such that the driving end of the linkage pushes the door open.

Stacked solid-state electrolytic capacitor with multi-directional product lead frame structure

A stacked solid state solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. The substrate unit includes a positive guiding substrate and a negative guiding substrate. The positive guiding substrate has a positive exposed end integrally extended therefrom along a first predetermined direction. The negative guiding substrate has a first negative exposed end integrally extended therefrom along a second predetermined direction, a second negative exposed end integrally extended therefrom along a third predetermined direction, and a third negative exposed end integrally extended therefrom along a fourth predetermined direction. The first, the second, the third and the fourth predetermined directions are different. The capacitor units are stacked on top of one another and disposed on the negative guiding substrate. The package unit encloses the capacitor units, one part of the positive and one part of the negative guiding substrate.

Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same

A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR) includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having at least one through hole, and the stacked-type capacitors are electrically connected between the first conductive terminal and the second conductive terminal. The bottommost one of the first stacked-type capacitors is fixed on the top surface of the second conductive terminal through conductive paste, and the conductive paste has a first conductive portion disposed between the bottommost one of the first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive ...

CAPACITOR CATHODE FOIL STRUCTURE AND MANUFACTURING METHOD THEREOF

The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.

Conductive polymer and devices thereof

An conductive polymer is disclosed which is poly(3, 4-ethylenedioxythiophene)+An-, and An- is Fe(CH3C6H4SO3)3. The poly(3, 4-ethylenedioxythiophene) has one selected from the group consisting of pyridine, pyridine derivative, imidazole, imidazole derivative, ethanolamine and ethanolamine derivative on the main chain.

Device for adjusting sensitivity and adjusting method of the same

Capacitor cathode foil structure and manufacturing method thereof

The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.

Electromagnetic wave shielding tape using nanomaterials

An electromagnetic wave shielding tape using nanomaterials includes a carrier substrate, a first nanometer structure, a second nanometer structure, and an insulative inclosing structure. The carrier substrate has a first surface and a second surface opposite to the first surface. The first nanometer structure is disposed on the first surface of the carrier substrate. The second nanometer structure is disposed on the second surface of the carrier substrate. The carrier substrate, the first nanometer structure and the second nanometer structure are enclosed by the insulative inclosing structure. Whereby, the electromagnetic wave shielding tape using nanomaterials of the present invention can provide an electromagnetic wave protection function or an anti-EMI (electromagnetic interference) function.

SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

The instant disclosure provides a solid electrolytic capacitor package structure and method of manufacturing the same. The solid electrolytic capacitor package structure includes a capacitor assembly, at least one electrode pin and a package body enclosing the capacitor assembly and the electrode pin. The electrode pin includes an embedded portion enclosed by the package body and an exposed portion positioned outside the package body. The method of manufacturing the solid electrolytic capacitor package structure includes a protection step including forming a protecting film on the exposed portion; a coating step including depositing a nanomaterial on the solid electrolytic capacitor package structure to form a nanofilm, wherein the nanomaterial penetrates into defects of the solid electrolytic capacitor package structure; and a deprotection step including removing the protecting film. The instant disclosure provides improved air-tight and water-tight properties of the solid electrolytic capacitor package structure, thereby increasing the lifetime thereof. 1. A method for manufacturing a solid electrolytic capacitor package structure , wherein the solid electrolytic capacitor package structure comprises a capacitor assembly , at least one electrode pin electrically connected to the capacitor assembly and a package body enclosing the capacitor assembly and at least a part of the electrode pin , and the electrode pin has an embedded portion enclosed by the package body and an exposed portion positioned outside the package body , the method for manufacturing the electrolytic capacitor package structure comprises:performing a pre-treatment step for forming an electrode pin protective film to enclose the exposed portion of the electrode pin;performing a coating step for forming a nanofilm penetrating and sealing a microstructure of the solid electrolytic capacitor package structure; andperforming a post-treatment step for removing the electrode pin protective film.2. The ...

Electromagnetic wave shielding tape using nanomaterials

An electromagnetic wave shielding tape using nanomaterials includes a carrier substrate, a first nanostructure, a second nanostructure, and an insulating enclosing structure for enclosing the carrier substrate, the first nanostructure, and the second nanostructure. The carrier substrate has a first surface and a second surface opposite to the first surface. The first nanostructure is disposed on the first surface of the carrier substrate, and the second nanostructure is disposed on the second surface of the carrier substrate.

Method of manufacturing a winding-type solid electrolytic capacitor package structure using a lead frame

A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.

Capacitance unit and stacked solid electrolytic capacitor

Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same

A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package body is disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure for covering the first lateral surface and electrically contacting the positive end surface and a negative electrode structure for covering the second lateral surface and electrically contacting the negative end surface.

Solid electrolytic capacitor package structure and method of manufacturing the same

The instant disclosure provides a solid electrolytic capacitor package structure and method of manufacturing the same. The solid electrolytic capacitor package structure includes a capacitor assembly, at least one electrode pin and a package body enclosing the capacitor assembly and the electrode pin. The electrode pin includes an embedded portion enclosed by the package body and an exposed portion positioned outside the package body. The method of manufacturing the solid electrolytic capacitor package structure includes a protection step including forming a protecting film on the exposed portion; a coating step including depositing a nanomaterial on the solid electrolytic capacitor package structure to form a nanofilm, wherein the nanomaterial penetrates into defects of the solid electrolytic capacitor package structure; and a deprotection step including removing the protecting film. The instant disclosure provides improved air-tight and water-tight properties of the solid electrolytic capacitor package structure, thereby increasing the lifetime thereof.

MULTI-FUNCTION PRINTER

A multi-function printer including a body, a door, a feeding module, a transmission module, and a cam assembly is provided. The door is assembled to the body being opened or closed relative to the body. The feeding module and the transmission module are disposed in the body. The feeding module has a driving gear. The transmission module has a swim arm with an end connected to the driving gear. The cam assembly is movably disposed in the body and configured between the door and the transmission module. The cam assembly is in a moving range of the swim arm, and the door is in a moving range of the cam assembly. When the driving gear rotates in a direction, the other end of the swim arm is engaged to the cam assembly, and drives the cam assembly to push the door open. 1. A multi-function printer , comprising:a body;a door, assembled to the body and being opened or closed relative to the body;a feeding module, disposed in the body, and the feeding module including a driving gear;a transmission module, disposed in the body, and the transmission module including a first swim arm, an end of the first swim arm being connected to the driving gear; anda cam assembly, movably disposed in the body, and being configured between the transmission module and the door, wherein the cam assembly is in a moving range of the first swim arm, and the door is in a moving range of the cam assembly, when the driving gear rotates in a first direction, the other end of the first swim arm is engaged to the cam assembly, and drives the cam assembly to push the door open.2. The multi-function printer as darned in claim 1 , wherein when the driving gear rotates in a second direction claim 1 , the other end of the first swim arm is disengaged from the cam assembly claim 1 , the first direction is opposite to the second direction.3. The multi-function printer as darned in claim 2 , wherein the first swim arm is pivoted to the body claim 2 , and the transmission module comprises:a first gear, ...

LIGHTING DEVICE WITH VIRTUAL LIGHT SOURCE

A lighting device includes a light source and an enclosure enclosing the light source wherein a portion of the enclosure has a focus-forming curvature such that when the light from the light source is reflected off the enclosure element the reflected light intersects at the focus of the curvature and creates a virtual light source at the focus. A reflective coating or a reflective material may be applied to the enclosure, or a ball lens may be used around the light source, to increase the intensity of the reflected light and of the virtual light source. A diffuser may be used to change the size and shape of the virtual light source.

Solid electrolytic capacitor having a protective structure and method for manufacturing the same

A solid electrolytic capacitor with a protective structure, which includes stacked capacitor elements electrically connected to the positive and negative terminal. A packaging material such as synthetic resin is used to encapsulate the capacitor elements, the positive terminal, and the negative terminal. Before packaging, a protective layer is formed by a colloid material, which covers the main body of the capacitor that includes the capacitor elements, the positive terminal, and the negative terminal. The protective layer provides a better seal and relieves the external pressure exerting on the capacitor during the packaging process. The protection prevents structural damage to the capacitor's main body while reducing the risk of short-circuits and excessive current leakage.

Solid electrolytic capacitor package structure and method of manufacturing the same

The instant disclosure provides a solid electrolytic capacitor package structure and method of manufacturing the same. The solid electrolytic capacitor package structure includes a capacitor assembly, at least one electrode pin and a package body enclosing the capacitor assembly and the electrode pin, and the electrode pin includes an embedded portion enclosed by the package body and an exposed portion positioned outside of the package body. The method of manufacturing the solid electrolytic capacitor package structure includes a protection step including forming a protecting film on the exposed portion; a coating step including depositing a nanomaterial on the solid electrolytic capacitor package structure to form a nanofilm, wherein the nanomaterial penetrates into defects of the solid electrolytic capacitor package structure; and a deprotection step including removing the protecting film. The instant disclosure may effectively improve the air-tight and water-tight properties of the solid ...

WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE WITHOUT USING A LEAD FRAME AND METHOD OF MANUFACTURING THE SAME

A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.

WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE USING A CARRIER BOARD AND METHOD OF MANUFACTURING THE SAME

A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package body is disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure for covering the first lateral surface and electrically contacting the positive end surface and a negative electrode structure for covering the second lateral surface and electrically contacting the negative end surface.

CAPACITOR ASSEMBLY HAVING A NON-SYMMETRICAL ELECTRODE STRUCTURE AND CAPACITOR SEAT STRUCTURE THEREOF

The present disclosure provides a capacitor assembly having a non-symmetrical electrode structure and a capacitor seat structure thereof. The capacitor assembly includes a capacitor seat structure and a capacitor package structure. The capacitor seat structure includes a capacitor seat, a first electrode layer and a second electrode layer. The capacitor seat has a first through hole, a first groove, a second through hole and a second groove. The capacitor package structure includes a first conductive pin and a second conductive pin. The first conductive pin passes through the first through hole and is disposed inside the first groove to electrically contact the first electrode layer. The second conductive pin passes through the second through hole and is disposed inside the second groove to electrically contact the second electrode layer. 1. A capacitor assembly having a non-symmetrical electrode structure , comprising:a capacitor seat structure including a capacitor seat, a first electrode layer and a second electrode layer, wherein the first electrode layer and the second electrode layer are disposed on a bottom side of the capacitor seat and separated from each other, and the capacitor seat has a first through hole, a first groove communicated with the first through hole, a second through hole separated from the first through hole, and a second groove communicated with the second through hole; anda capacitor package structure disposed on the capacitor seat structure, wherein the capacitor package structure includes a wound capacitor, a package casing for enclosing the wound capacitor, a first conductive pin electrically contacting the wound capacitor and partially exposed from the package casing, and a second conductive pin electrically contacting the wound capacitor and partially exposed from the package casing;wherein the first conductive layer is partially received inside the first groove, and the first conductive pin has a first through portion passing ...

Capacitor assembly having a non-symmetrical electrode structure and capacitor seat structure thereof

The present disclosure provides a capacitor assembly having a non-symmetrical electrode structure and a capacitor seat structure thereof. The capacitor assembly includes a capacitor seat structure and a capacitor package structure. The capacitor seat structure includes a capacitor seat, a first electrode layer and a second electrode layer. The capacitor seat has a first through hole, a first groove, a second through hole and a second groove. The capacitor package structure includes a first conductive pin and a second conductive pin. The first conductive pin passes through the first through hole and is disposed inside the first groove to electrically contact the first electrode layer. The second conductive pin passes through the second through hole and is disposed inside the second groove to electrically contact the second electrode layer.

WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE USING A LEAD FRAME AND METHOD OF MANUFACTURING THE SAME

A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.

Multi-function printer

一種事務機，包括機體、門蓋、滑動架以及連桿組。門蓋可開闔地組裝至機體。滑動架可來回移動地配置在機體內。連桿組配置在機體內且位在滑動架與門蓋之間。連桿組具有從動端與驅動端。從動端位在滑動架的移動路徑上。門蓋位在驅動端的移動路徑上。當滑動架移動至推動段時，滑動架驅動連桿組的從動端，而帶動驅動端推動門蓋相對於機體開啟。

Sealing element and wound-type solid state electrolytic capacitor thereof

A sealing element of the instant disclosure includes a cover body, an exterior convex portion, and an interior convex portion. The cover body has a first surface, a second surface arranged opposite to the first surface, and a pair of terminal holes formed on the cover body and extending through the first and second surfaces. The exterior convex portion has at least one first abutting surface arranged on the first surface of the cover body and an expansion space formed concavely in the exterior convex portion. The interior convex portion has at least one second abutting surface arranged on the second surface of the cover body. Specifically, the sealing element is configured to prevent the capacitor element from swaying, so that the electrical property of the wound-type solid state electrolytic capacitor with the sealing element can be improved.

Foil coil for capacitor and manufacturing method thereof

The instant disclosure relates to a manufacturing method of cathode foil for capacitor, comprising the following steps. The first step is providing a foil, subsequently inserting the foil into a reactor. The next step is executing a heating process to increase the temperature of the foil that is between 400 DEG C to 1000 DEG C. The next step is feeding a flow of carbon precursor to the reactor. The next step is executing a cooling process to decrease the temperature of the foil that is below 100 DEG C to deposit a grapheme layer on the foil. The last step is depositing an anti-oxidative layer on the grapheme layer.

CAPACITOR CATHODE FOIL STRUCTURE AND MANUFACTURING METHOD THEREOF

The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement. 1. A manufacturing method of capacitor cathode foil structure , comprising the following steps:providing a base foil, subsequently inserting the base foil into a reactor;executing a heating process for heating the base foil to a temperature region of 400° C. to 1000° C.;directing a carbon containing precursor gas into the reactor; andexecuting a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.2. The manufacturing method of capacitor cathode foil structure according to claim 1 , wherein the base foil is heated to a temperature region of 400° C. to 1000° C. under oxygen-free atmosphere claim 1 , protective atmosphere claim 1 , or reducing atmosphere during the heating process.3. The manufacturing method of capacitor cathode foil structure according to claim 1 , wherein the base foil is heated to a temperature region of 450° C. to 660° C. during the heating process ranges from 1 to 100 hours.4. The manufacturing method of capacitor cathode foil structure according to claim 1 , wherein the carbon containing precursor gas is CHgas claim 1 , x is 1≦x≦10 claim 1 , y is 2≦y≦20 claim 1 , the ...

CAPACITOR UNIT WITH HIGH-ENERGY STORAGE

The present invention provides a capacitor unit with high-energy storage which includes an electrolyte, a positive electrode, and a negative electrode. The electrolyte includes an electrically conductive polymer composition. The positive and negative electrodes are arranged in the electrolyte. The positive electrode includes a substrate and a transition metal oxide layer formed on the substrate, resulting in the highest possible capacitance density. 1. A capacitor unit with high-energy storage:an electrolyte;a positive electrode arranged in the electrolyte, having a substrate and a transition metal oxide layer formed on the substrate; anda negative electrode arranged in the electrolyte corresponding to the positive electrode.2. The capacitor unit with high-energy storage according to claim 1 , wherein the substrate is a porous metal substrate.3. The capacitor unit with high-energy storage according to claim 2 , wherein the porous metal substrate is an aluminum foam structure claim 2 , a nickel foam structure claim 2 , or a titanium foam structure.4. The capacitor unit with high-energy storage according to claim 1 , wherein the transition metal oxide layer is made from manganese oxide (MnO) claim 1 , nickel oxide (NiO) claim 1 , cobalt oxide (CoO) claim 1 , vanadium oxide (VO) claim 1 , iridium oxide (IrO) claim 1 , or rubidium oxide (RuO).5. The capacitor unit with high-energy storage according to claim 1 , the electrolyte is a gel electrolyte.6. The capacitor unit with high-energy storage according to claim 5 , wherein the gel electrolyte comprises an electrically conductive polymer composition.7. The capacitor unit with high-energy storage according to claim 6 , wherein the electrically conductive polymer composition comprises at least one inherently conductive polymer or copolymer selected from polypyrroles claim 6 , polythiophenes claim 6 , polyacetylenes claim 6 , polyphenylenes claim 6 , polystyrenes claim 6 , polyanilines claim 6 , polyacenes claim 6 , ...

Multi-function printer

A multi-function printer including a body, a door, a feeding module, a transmission module, and a cam assembly is provided. The door is assembled to the body being opened or closed relative to the body. The feeding module and the transmission module are disposed in the body. The feeding module has a driving gear. The transmission module has a swim arm with an end connected to the driving gear. The cam assembly is movably disposed in the body and configured between the door and the transmission module. The cam assembly is in a moving range of the swim arm, and the door is in a moving range of the cam assembly. When the driving gear rotates in a direction, the other end of the swim arm is engaged to the cam assembly, and drives the cam assembly to push the door open.

Stacked solid electrolytic capacitor with multi-welding structure

Solid electrolytic capacitor package structure using nanomaterials and capacitor unit thereof, and method of manufacturing a capacitor unit

The prevent invention provides a solid electrolytic capacitor package structure using nanomaterials and a capacitor unit thereof, and a method of manufacturing a capacitor unit. The solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a first electrode substrate, a second electrode substrate and a first composite nanometer material layer disposed between the first electrode substrate and the second electrode substrate. The package unit is used to enclose the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first electrode substrate and a second conductive terminal electrically connected to the second electrode substrate. The first composite nanometer material layer includes a polymer material and a plurality of first nanometer particles mixed with the polymer material. Each first nanometer particle has a first average particle diameter with a predetermined ...

Multi-function printer

A multi-function printer including a body, a door, a feeding module, a transmission module, and a cam assembly is provided. The door assembled to the body being opened or closed relative to the body. The feeding module and the transmission module are disposed in the body. The feeding module has a driving gear. The transmission module has a swim arm with an end connected to the driving gear. The cam assembly movably disposed in the body and configured between the door and the transmission module. The cam assembly is in a moving range of the swim arm, and the door is in a moving range of the cam assembly. When the driving gear rotates in a direction, the other end of the swim arm is engaged to the cam assembly, and drives the cam assembly to push open the door.

System and method for adjusting sensitivity of camera module

A system for adjusting a sensitivity of a camera module includes a memory unit configured for storing a plurality of pre-initialized pixel adjusting maps; an image capturing unit configured for capturing an image from the camera module and acquiring pixel values of the image to determine a pixel value range of the pixel values; a comparison unit configured for comparing the pixel range with the input-ranges of the pixel adjusting maps to determine which one of the input ranges of the pixel adjusting maps the pixel value range of the image; and an adjusting unit configured for adjusting the pixel value of the image to adjusting the sensitivity of the camera module according to the determined pixel adjusting map and outputting adjusted pixel values. The system can not only breakthrough the limit of the self-character of the amplifier, but also decrease noise in course of adjusting the sensitivity of the camera module.

Method for fabricating solid electrolytic capacitors

The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.

Winding-type solid electrolytic capacitor package structure using a lead frame

A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.

Stacked-type solid electrolytic capacitor package structure

A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.

Add-on smart controller for LED lighting device

An add-on smart controller for an LED lighting device includes a power input port, a power output port, a housing, a control unit in the housing, and at least one control signal receiver in the control unit. A power input of the control unit is connected to the power input port. A power output of the control unit is connected to the power output port. The control signal receiver is configured to receive external control signals. The control unit is configured to activate the power output port to supply output voltage responsive to the control unit receiving an ON signal. The control unit is configured to deactivate the power output port responsive to the control unit receiving an OFF signal.

Linear solid-state lighting with broad viewing angle

A linear light-emitting diode (LED)-based solid-state device comprising a curved surface to hold a flexible printed circuit board with multiple linear arrays of surface mount LEDs provides lighting applications with a broad viewing angle over 180° along the radial direction. On each of the two lamp bases of the lamp, a shock-protection switch is mounted to prevent shock hazard during re-lamping.

Winding-type solid electrolytic capacitor package structure

A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.

STRUCTURE OF LED (LIGHT-EMITTING DIODE) LIGHTING BULB

A structure of LED (Light-Emitting Diode) lighting bulb has a fin base, a pillar, a circuit board, an electrical connector, and a cover. The fin base forms a bore extending through a central portion and the bore has an inner circumferential surface forming an internal thread. The pillar has an outer circumferential surface forming an external thread, and the pillar is received and retained in the bore through threading engagement. The circuit board is mounted to an end of the pillar, and the circuit board carries an LED and conductor wires. The electrical connector is recessed to form a hollow configuration having an inside surface forming threading, and is coupled to the pillar through threading engagement while electrically connected to the conductor wires. The cover is mounted to the fin base. The mounting arrangement of the pillar and circuit board facilitates replacement of the circuit board and maintenance. 1. An LED (Light-Emitting Diode) lighting bulb , comprises:a fin base, which forms a bore extending through a central portion thereof, the bore having an inner circumferential surface forming an internal thread;a pillar, which has an outer circumferential surface forming an external thread to allow the pillar to be received and retained in the bore of the fin base through threading engagement;a circuit board, which is mounted to an end of the pillar and carrying thereon an LED and conductor wires;an electrical connector, which is recessed to form a hollow configuration having an inside surface forming threading, the electrical connector being coupled to the pillar through threading engagement and being electrically connected to the conductor wires of the conductor wires; anda cover, which is mounted to the fin base,whereby through the mounting between the pillar and the circuit board, easy replacement and maintenance of the circuit board are realized.2. The LED lighting bulb according to claim 1 , wherein the cover and the fin base are molded with moldable ...

Structure of holder of led lighting tube

A structure of holder of LED lighting tube includes a holder body, two end sockets, and two retainers. The two end sockets are respectively mounted to two ends of the holder body and each of the end sockets forms an opening. The two retainers are respectively received in the end sockets, and each of the retainers has a central portion forming a longitudinal passage, which receives and retains therein a metal clip. As such, the arrangement of power supply inside the holder body is simplified, so that the holder body and the end sockets can be manufactured in an integrally-formed manner and the metal clips can be used to clamp an LED lighting tube to thereby improving manufacturing efficiency and reducing manufacturing costs, and facilitating easy mounting and dismounting of the LED lighting tube.

SOLID ELECTROLYTIC CAPACITOR HAVING A PROTECTIVE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

A solid electrolytic capacitor with a protective structure, which includes stacked capacitor elements electrically connected to the positive and negative terminal. A packaging material such as synthetic resin is used to encapsulate the capacitor elements, the positive terminal, and the negative terminal. Before packaging, a protective layer is formed by a colloid material, which covers the main body of the capacitor that includes the capacitor elements, the positive terminal, and the negative terminal. The protective layer provides a better seal and relieves the external pressure exerting on the capacitor during the packaging process. The protection prevents structural damage to the capacitor's main body while reducing the risk of short-circuits and excessive current leakage. 1. A solid electrolytic capacitor having a protective structure , comprising:a positive terminal;a negative terminal;at least one capacitor element having an anode and a cathode disposed in a stack-configuration on the upper surface of the positive and negative terminals to form a main body of the capacitor, the anode and the cathode regions of the capacitor element electrically connected to the positive and the negative terminals respectively;an insulating element having at least one layer of colloid disposed on the main body of the capacitor to form an air-tight protective layer, wherein the positive and negative terminals are partially exposed; anda packaging material enclosing the insulating element.2. The solid electrolytic capacitor according to claim 1 , wherein the air-tight protective layer is an insulating polymer.3. The solid electrolytic capacitor according to claim 1 , wherein the air-tight protective layer is a resin.4. The solid electrolytic capacitor according to claim 1 , wherein the packaging material is a polymer.5. A solid electrolytic capacitor with a protective structure comprising:a positive terminal;a negative terminal;at least one capacitor element having an anode and a ...

LED (LIGHT-EMITTING DIODE) LAMP WITH LIGHT REFLECTION

The present invention is primarily related to a LED (Light-Emitting Diode) lamp with light reflection, which provides both the forward and the backward illumination via the configuration of reflection plate with one side or both sides regularly distributed with a plurality of protruding or hollow geometric spatial blocks, for example, pyramids or cones to enable both light transparency and reflection, and thus enlarges the practical space of prior LED lamp illumination and provides more utility and convenience. 1. A LED (Light-Emitting Diode) lamp with light reflection , comprising:a lamp, which is composed of a base, an electrical connector and a circuit board, wherein the base is fixed connecting with the electrical connector and is installed with a plurality of radiation fins around the circumference, and the base is at one end configured with a circuit board which is installed with a plurality of LED and is electrically connected with the electrical connector;a transparent lamp cover, set up over the base and the circuit board, which has an opening at the front end; anda reflection plate, configured with the said opening, is light transparent and is regularly distributed at one side or both sides with a plurality of protruding or hollow geometric spatial blocks.2. A LED lamp with light reflection according to claim 1 , wherein the plurality of protruding or hollow geometric spatial blocks are pyramids.3. A LED lamp with light reflection according to claim 1 , wherein the plurality of protruding or hollow geometric spatial blocks are cones4. A LED lamp with light reflection according to claim 1 , wherein the reflection plate configured at the opening can be modified by different colors claim 1 , size claim 1 , number or the area embodied on the surface of the transparent lamp cover.5. A LED lamp with light reflection according to claim 1 , wherein the reflection plate is replaced by paint claim 1 , coated on the surface by different size or color claim 1 , which ...

LED LIGHTING STRUCTURE

The present invention relates to an LED lighting structure, which includes a plurality of lighting units arranged and mounted to a base. Each lighting unit includes a seat, which has a surface to which a plurality of heat dissipation fins is mounted and an opposite surface to which a circuit board is attached. The circuit board includes a plurality of light-emitting diodes. The lighting units are arranged to allow the light-emitting diodes to face outward. In this way, all the light can be projected outward or toward a direction where lighting is desired so that no light would be wasted and the lighting efficiency and the convenience of use are improved. 1. An LED lighting structure , which comprises a plurality of lighting units that is arranged and mounted on at least one base , each of the lighting units comprises a seat , the seat having a surface to which a circuit board that is electrically connected to the base is attached , the circuit board comprising a plurality of light-emitting diodes , wherein the arrangement of the lighting units allows the light-emitting diodes all facing outward.2. The LED lighting structure according to claim 1 , wherein each of seats of the lighting units has an opposite surface to which a plurality of heat dissipation fins is mounted.3. The LED lighting structure according to claim 1 , wherein the seat of each of the lighting units has an opposite surface opposing each other and located at an inner side of the lighting unit.4. The LED lighting structure according to claim 2 , wherein the seat of each of the lighting units has an opposite surface opposing each other and located at an inner side of the lighting unit.5. The LED lighting structure according to claim 1 , wherein each of the lighting units comprises a cover claim 1 , the cover being mounted to the seat and located above and housing the circuit board and the light-emitting diodes.6. The LED lighting structure according to claim 5 , wherein the cover comprises a hollow ...

CAPACITOR UNIT AND STACKED SOLID ELECTROLYTIC CAPACITOR HAVING THE SAME

The present invention relates to a capacitor unit, which includes an anode portion, a cathode portion, and an insulating portion. The insulating portion is provided for in a form of a headband to partially cover the surface of the anode portion to divide the anode and the cathode portions. The cathode portion partially covers the anode portion and is located behind the insulating portion. The cathode portion has at least one conductive layer which is made of a conductive polymer having copper, copper alloy, or a mixture thereof. 1. A capacitor unit , comprising:an anode portion;a cathode portion; andan insulating portion, wherein the insulating portion is provided for in a form of a headband to partially cover the surface of the anode portion, while the cathode portion partially covers on the anode portion and is located behind the insulating portion, with the cathode portion having at least one conductive layer which is made of a conductive polymer having copper, copper alloy, or a mixture of the copper and copper alloy.2. The capacitor unit as claimed in claim 1 , wherein the copper claim 1 , the copper alloy claim 1 , or the mixture thereof of the conductive polymer has a solid content ranged from 40% to 90%.3. The capacitor unit as claimed in claim 1 , wherein the copper claim 1 , the copper alloy claim 1 , or the mixture thereof of the conductive polymer has a solid content ranged from 50% to 70%.4. The capacitor unit as claimed in claim 3 , wherein the anode portion has a valve metal foil and an oxide dielectric layer covering the valve metal foil.5. The capacitor unit as claimed in claim 2 , wherein the anode portion has a valve metal foil and an oxide dielectric layer covering the valve metal foil.6. The capacitor unit as claimed in claim 5 , wherein the cathode portion further has a conductive polymer layer partially covering the surface of the oxide dielectric layer and a carbon glue layer covering the conductive polymer layer claim 5 , with the conductive ...

NOVEL CAPACITOR PACKAGE STRUCTURE

A novel capacitor package structure of the instant disclosure includes a mutilayer film capacitor, a package unit, a first conductive terminal, and a second conductive terminal. The mutilayer film capacitor includes two terminal electrodes and a mutilayer body between the two terminal electrodes, wherein the mutilayer body includes a plurality of metal layers stacked alternately with a plurality of dielectric layers. The package unit encloses the mutilayer film capacitor. The first conductive terminal and the second conductive terminal are electrically connected to the two terminal electrodes, respectively. 1. A novel capacitor package structure , comprising:a mutilayer film capacitor comprising two terminal electrodes and a mutilayer body between the two terminal electrodes, wherein the mutilayer body comprises a plurality of metal layers stacked alternately with a plurality of dielectric layers;a package unit enclosing the mutilayer film capacitor; anda first conductive terminal and a second conductive terminal electrically connected to the two terminal electrodes, respectively.2. The novel capacitor package structure according to claim 1 , wherein the mutilayer film capacitor further comprises a top protective layer laminated to a top surface of the mutilayer body and a bottom protective layer laminated to a bottom surface of the mutilayer body.3. The novel capacitor package structure according to claim 1 , wherein the first conductive terminal has a first embedded portion enclosed by the package unit claim 1 , and two opposite ends of the first embedded portion extending away from each other directly contact one of the two terminal electrodes claim 1 , and wherein the second conductive terminal has a second embedded portion enclosed by the package unit claim 1 , and two opposite ends of the second embedded portion extending away from each other directly contact another one of the two terminal electrodes.4. The novel capacitor package structure according to claim ...

SPEAKER

A speaker adapted to be disposed on a head-mounted device includes a housing member, a speaker unit, a vibrating unit and an abutting member. The housing member is adapted to be disposed on the head-mounted device and is formed with an opening adapted to open toward an ear of a user when in use. The speaker unit is disposed on the housing member in a manner that the speaker unit is not directly in contact with the head of the user when in use. The vibrating unit is disposed on the housing member and is capable of generating vibrations. The abutting member is disposed on the vibrating unit, is adapted to be in contact with the skin of the user, and is capable of transmitting the vibrations to the skull of the user.

EARPHONE DEVICE

An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.

Passive diaphragm assembly

A passive diaphragm assembly includes a counterweight member, a first diaphragm and a second diaphragm. The first diaphragm and the second diaphragm are spaced apart from each other, are connected respectively to opposite ends of the counterweight member, and cooperate with the counterweight member to define an air space thereamong.

Speaker device

A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.

SEALING ELEMENT AND WOUND-TYPE SOLID STATE ELECTROLYTIC CAPACITOR THEREOF

A sealing element of the instant disclosure includes a cover body, an exterior convex portion, and an interior convex portion. The cover body has a first surface, a second surface arranged opposite to the first surface, and a pair of terminal holes formed on the cover body and extending through the first and second surfaces. The exterior convex portion has at least one first abutting surface arranged on the first surface of the cover body and an expansion space formed concavely in the exterior convex portion. The interior convex portion has at least one second abutting surface arranged on the second surface of the cover body. Specifically, the sealing element is configured to prevent the capacitor element from swaying, so that the electrical property of the wound-type solid state electrolytic capacitor with the sealing element can be improved. 1. A sealing element disposed at an open end of a capacitor casing and forming a hermetic seal with the capacitor casing in order to retain a capacitor element in the capacitor casing , comprising:a cover body having a first surface exposed from the capacitor casing and a second surface oppositely arranged from the capacitor element, and the cover body having a pair of terminal holes arranged thereon, the pair of holes extending through the first surface and the second surface;an exterior convex portion arranged on the first surface of the cover body, and the exterior convex portion having a first abutting surface arranged at an apex thereof and at least one expansion space; andan interior convex portion arranged on the second surface of the cover body to interface with the capacitor element, and the interior convex portion having a second abutting surface arranged at an apex thereof; wherein the second abutting surface is partially in contact with a surface of the corresponding capacitor element.2. The sealing element as recited in claim 1 , wherein the exterior convex portion is arranged between the two terminal holes claim ...

CAPACITOR CATHODE FOIL STRUCTURE AND MANUFACTURING METHOD THEREOF

The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement. 1. A manufacturing method of capacitor cathode foil structure , comprising the following steps:providing a base foil, subsequently inserting the base foil into a reactor;executing a heating process for heating the base foil to a temperature region of 400° C. to 1000° C.;directing a carbon containing precursor gas into the reactor; andexecuting a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.2. The manufacturing method of capacitor cathode foil structure according to claim 1 , wherein the base foil is heated to a temperature region of 400° C. to 1000° C. under oxygen-free atmosphere claim 1 , protective atmosphere claim 1 , or reducing atmosphere during the heating process.3. The manufacturing method of capacitor cathode foil structure according to claim 1 , wherein the base foil is heated to a temperature region of 450° C. to 660° C. during the heating process ranges from 1 to 100 hours.4. The manufacturing method of capacitor cathode foil structure according to claim 1 , wherein the carbon containing precursor gas is CHgas claim 1 , x is 1≦x≦10 claim 1 , y is 2≦y≦20 claim 1 , the ...

Polymer composite material, method for manufacturing the polymer composite material, capacitor package structure using the polymer composite material and method for manufacturing the capacitor package structure

The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.

Retractable End-Cap For LED Tube

Embodiments of an end-cap with retractable and rotatable pin for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, an end-cap base assembly, a power-pin assembly, and at least one elastic component. The power-pin assembly may include at least one power pin thereon and configured to connect to an external power source. The power-pin assembly may protrude out of a center opening of the end-cap housing. The end-cap base assembly may have at least one power connector one end of which is connected to the body of the LED tube to receive electric power. The at least one elastic components may reside inside the end-cap housing and is placed between the power-pin assembly and the end-cap base assembly. The power connector may connect to the at least one power pin when the at least one elastic component is pressed. 1. An end-cap of a light-emitting diode (LED) tube , comprising:an end-cap housing;a power-pin assembly;an end-cap base assembly; and the power-pin assembly includes at least one power pin thereon, the at least one power pin configured to connect to an external power source,', 'the power-pin assembly protrudes out of a center opening of the end-cap housing,', 'the end-cap base assembly includes at least one power connector thereon, the at least one power connector configured to connect to a body of the LED tube to supply power to the LED tube,', 'the at least one power connector connects to the at least one power pin when the elastic component is pressed, and', 'the at least one power connector remains separate from the at least one power pin when the elastic component is not pressed., 'an elastic component disposed between the power-pin assembly and the end-cap base assembly, wherein2. The end-cap of claim 1 , wherein an interlocking mechanism exists between the end-cap housing and the power-pin assembly such that the power-pin assembly is rotatable inside the center opening of the end-cap housing.3. The end-cap ...

METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS

The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit. 1. A method for improving fabrication of solid electrolytic capacitors comprising the steps of:providing an insulating substrate;forming a plurality of aluminum powder containing conductive gel bodies on the insulating substrate, wherein two adjacent conductive gel bodies define a scribe line therebetween;employing a high temperature sintering process to metalize the conductive gel bodies into a plurality of aluminum substrates;forming a dielectric layer on each of the surface of the aluminum substrate;forming an isolation layer on each of the dielectric layer to define an anodic region and a cathodic region; andcovering the dielectric layer of the cathodic region with a conductive layer.2. The method as recited in claim 1 , wherein the step of covering the conductive layer includes steps of: forming a conductive polymer layer on the dielectric layer of the cathodic region; forming a carbon gel layer on the conductive polymer layer; and forming a silver gel layer on the carbon gel layer.3. The method as recited in claim 2 , wherein the carbon gel layer is formed by one of the following: a conductive carbon gel claim 2 , and a carbon based paste.4. The method as recited in claim 1 , wherein the aluminum powder containing conductive gel bodies comprises:a thermosetting resin presented ...

Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same

A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package body is disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure for covering the first lateral surface and electrically contacting the positive end surface and a negative electrode structure for covering the second lateral surface and electrically contacting the negative end surface.

WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE USING A LEAD FRAME AND METHOD OF MANUFACTURING THE SAME

A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body. 1. A winding-type solid electrolytic capacitor package structure using a lead frame , comprising:a capacitor unit including at least one winding capacitor, wherein the at least one winding capacitor has a winding body, a positive conductive lead pin extended from a First lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body, the positive conductive lead pin has a cutting surface formed on an end thereof, and the negative conductive lead pin has a grinding surface formed on an end thereof;a package unit including a package body for enclosing the at least one winding capacitor, wherein the package body has a first lateral surface, a second lateral surface opposite to the first lateral surface, and a bottom surface connected between the first lateral surface and the second lateral surface; anda conductive unit including a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to ...

WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE WITHOUT USING A LEAD FRAME AND METHOD OF MANUFACTURING THE SAME

A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body. 1. A winding-type solid electrolytic capacitor package structure without using a lead frame , comprising:a capacitor unit including at least one winding capacitor, wherein the at least one winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body; anda package unit including a package body for enclosing the winding body, wherein the package body has a first lateral surface, a second lateral surface opposite to the first lateral surface, and a bottom surface connected between the first lateral surface and the second lateral surface;wherein the positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion connected with the first embedded portion and exposed outside the package body, and the first exposed portion is extended along the first lateral surface and the bottom surface of the package body;wherein the negative conductive lead pin has a second embedded portion enclosed by the package body and a ...

LIGHTING DEVICE WITH VIRTUAL LIGHT SOURCE

A lighting device includes a light source and an enclosure enclosing the light source wherein a portion of the enclosure has a focus-forming curvature such that when the light from the light source is reflected off the enclosure element the reflected light intersects at the focus of the curvature and creates a virtual light source at the focus. A reflective coating or a reflective material may be applied to the enclosure, or a ball lens may be used around the light source, to increase the intensity of the reflected light and of the virtual light source. A diffuser may be used to change the size and shape of the virtual light source. 1. A lighting device comprising: at least one light source and an enclosure element enclosing the at least one light source wherein a portion of the enclosure element has a focus-forming curvature such that light from the at least one light source and then reflected off the focus-forming curvature of the enclosure element intersects at or in a proximate region around a focus of the focus-forming curvature and creates a virtual light source at the focus.2. The lighting device as claimed in claim 1 , wherein the portion of the enclosure element having the focus-forming curvature is a part or all of an ellipsoid and the at least one light source is positioned at or adjacent to one of the two focuses of the ellipsoid claim 1 , such that the light from the at least one light source and then reflected off the focus-forming curvature of the enclosure element intersects at or in a proximate region around the other focus of the ellipsoid.3. The lighting device as claimed in claim 1 , wherein the portion of the enclosure element having the focus-forming curvature is a part of a paraboloid claim 1 , and the at least one light source is positioned in the open end of the paraboloid.4. The lighting device as claimed in claim 1 , wherein an optical lens is placed between the at least one light source and the focus of the focus-forming curvature of the ...

Retractable End-Cap For LED Tube

Embodiments of an end-cap for an LED tube are described. In one aspect, an end-cap for an LED tube may include an end-cap housing, an elastic component, a power connector, and a movable assembly. The movable assembly may include a power pin thereon and configured to connect to an external power source. The elastic component may reside inside the end-cap housing. A first end of the movable assembly may connect to the end-cap housing. A second end of the connecting assembly opposite to the first end thereof may connect to a body of the LED tube through the power connector. The power connector may be electrically disconnected from the power pin when the end-cap housing is pressed. The power connector may be electrically connected to the power pin when the end-cap housing is not pressed. 1. An end-cap of a light-emitting diode (LED) tube , comprising:an end-cap housing;a first elastic component;a power connector; and the movable assembly comprises a power pin thereon and configured to connect to an external power source,', 'the first elastic component resides inside the end-cap housing,', 'a first end of the movable assembly connects to the end-cap housing, and', 'a second end of the movable assembly opposite to the first end thereof connects to a body of the LED tube through the power connector,', 'the power connector is electrically disconnected from the power pin when the end-cap housing is pressed, and', 'the power connector is electrically connected to the power pin when the end-cap housing is not pressed., 'a movable assembly, wherein2. The end-cap of claim 1 , wherein the power connector is retractable in a direction along a longitudinal axis of the LED tube claim 1 , and wherein a retracting range of the power connector is between 1 mm and 10 mm approximately.3. The end-cap of claim 1 , wherein when the end-cap housing is pressed claim 1 , a distance of separation between the power connector and the at least one power pin is between 2 mm and 10 mm approximately. ...

LED Lighting Device With Replaceable Driver-Control Module

An LED lighting device with a replaceable driver-control module interface is described. The LED lighting device may include a driver-less LED lighting device, a driver-control module with driver function, and a housing interface on the driver-less LED lighting device to house and connect the driver-control module. The driver-less LED lighting device receives AC from an external AC source and passes the AC to the driver-control module. The driver-control module receives AC from the driver-less LED lighting device and provides DC to the driver-less lighting device to drive LED diodes in the driver-less LED lighting device. The housing interface on the lighting device houses the driver-control module such that, when the driver-control module is fastened to the driver-less lighting device through the housing interface, the driver-control becomes an integral part of the lighting device. 1. A light-emitting diode (LED) lighting device with a replaceable driver-control module interface , comprising:a driver-less LED lighting device;a driver-control module; and the driver-less LED lighting device comprises a plurality of LED diodes, at least one PCB board supporting the LED diodes, at least one lens cover, at least one heat sink, and a housing interface configured to house and connect to the driver-control module;', 'the driver-control module comprises a main body, an AC-to-DC converter, an AC-in port, and a DC-out port;', 'the driver-less LED lighting device is configured to receive an AC electrical power from an external AC source and provide the AC electrical power to the AC-in port of the driver-control module;', 'the AC-to-DC converter of the driver-control module is configured to convert the AC electrical power to a DC electrical power and provide the DC electrical power through the DC-out port to the driver-less LED lighting device;', 'the housing interface of the driver-less LED lighting device is configured to provide electrical contacts such that the driver- ...

SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE FOR DECREASING EQUIVALENT SERIES RESISTANCE AND METHOD OF MANUFACTURING THE SAME

A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion. 1. A solid electrolytic capacitor package structure for decreasing equivalent series resistance , comprising:a capacitor unit including a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other, wherein each first stacked-type capacitor has a first positive electrode portion and a first negative electrode portion;a package unit including a package body for enclosing the capacitor unit; anda conductive unit including a first conductive terminal and a second conductive terminal separated from the first conductive terminal, wherein the first conductive terminal has a first embedded portion electrically connected to the first positive electrode portion of the first stacked-type capacitor and enclosed by the package body and a first exposed portion connected with the first embedded portion and exposed from the package body, and the second conductive terminal has a second embedded portion ...

CAPACITOR PACKAGE STRUCTURE AND ANTIOXIDATION ELECTRODE FOIL THEREOF

The present disclosure provides a capacitor package structure and an antioxidation electrode foil thereof. The antioxidation electrode foil includes a base layer, a conductive film structure, and an antioxidation film structure. The base layer has a top surface and a bottom surface. The conductive film structure includes a plurality of first conductive film layers. The antioxidation film structure includes a plurality of first antioxidation film layers. The first conductive film layers and the first antioxidation film layers are alternately stacked on top of one another and disposed on the top surface of the base layer. 1. An antioxidation electrode foil , comprising:a base layer having a top surface and a bottom surface;a conductive film structure including a plurality of first conductive film layers; andan antioxidation film structure including a plurality of first antioxidation film layers;wherein the first conductive film layers and the first antioxidation film layers are alternately stacked on top of one another and disposed on the top surface of the base layer.2. The antioxidation electrode foil of claim 1 , wherein the bottommost one of the first conductive film layers is disposed on the top surface of the base layer claim 1 , the bottommost one of the first antioxidation film layers is disposed on the bottommost one of the first conductive film layers claim 1 , and the topmost one of the first antioxidation film layers is disposed on the topmost one of the first conductive film layers.3. The antioxidation electrode foil of claim 1 , wherein the bottommost one of the first antioxidation film layers is disposed on the top surface of the base layer claim 1 , the bottommost one of the first conductive film layers is disposed on the bottommost one of the first antioxidation film layers claim 1 , and the topmost one of the first antioxidation film layers is disposed on the topmost one of the first conductive film layers.4. The antioxidation electrode foil of claim ...

METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS

The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit. 1. A method for improving fabrication of solid electrolytic capacitors comprising the steps of:employing a cold press process to form an aluminum pellet from a powder of aluminum;forming a dielectric layer on the surface of the aluminum pellet; andforming a conductive layer on the surface of the dielectric layer.2. The method as recited in claim 2 , wherein the step forming the conductive layer includes steps of: forming a conductive polymer layer on the surface of the dielectric layer; forming a carbon gel layer on the surface of the conductive polymer layer; and forming a silver gel layer on the surface of the carbon gel layer.3. The method as recited in claim 2 , wherein the powder of aluminum has uneven and cavernous surfaces.4. The method as recited in claim 2 , wherein the step of cold press forming the aluminum pellet includes a lead electrode to be inserted with the aluminum powder to form the aluminum pellet claim 2 , and a compression load ranging from 3 to 15 MN/m. This application is a divisional application of U.S. application Ser. No. 13/803,064, filed on Mar. 14, 2013, and entitled “IMPROVED METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS”, the entire contents of which are hereby incorporated by reference.1. Field of the InventionThe instant disclosure relates to a ...

Method of manufacturing a winding-type solid electrolytic capacitor package structure using a lead frame

A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.

METHOD OF MANUFACTURING A WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE WITHOUT USING A LEAD FRAME

A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body. 1. A method of manufacturing a winding-type solid electrolytic capacitor package structure without using a lead frame , comprising:providing at least one winding capacitor, wherein the at least one winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body;forming a package body to enclose the winding body, wherein the positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion connected with the first embedded portion and exposed outside the package body, and the negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion connected with the second embedded portion and exposed outside the package body; andbent the first exposed portion and the second exposed portion along an outer surface of the package body.2. The method of claim 1 , wherein the winding body has a positive foil sheet claim 1 , a negative foil sheet and an isolation paper ...

Solid state electrolytic capacitor

Structure of led (light-emitting diode) lighting bulb

An LED (Light-Emitting Diode) lighting bulb includes an electrical connector, a base, a circuit board, and a cover. The electrical connector is recessed to form a hollow configuration having an intermediate section forming threading. The base is formed by molding a moldable material. The base has a lower end forming a neck portion that has an outer circumferential surface forming threading for being fit to the electrical connector and an upper end to which the circuit board is mounted. The circuit board carries an LED thereon. The cover is formed by molding a moldable material and is mounted to the base. As such, an LED lighting bulb showing the advantages of reduced weight, reduced power consumption, improved heat dissipation performance, multiple colors, and excellent operation safety is provided.

Multi-function printer

Display device

A display device, including a substrate, a first transistor, a second transistor, a first pixel electrode, a second pixel electrode, and a common electrode layer, is provided. The first transistor and the second transistor are disposed on the substrate. The first pixel electrode is electrically connected to the first transistor. The second pixel electrode is electrically connected to the second transistor. The second pixel electrode is disposed adjacent to the first pixel electrode. The common electrode layer has a first slit. The first slit spans from the first pixel electrode to the second pixel electrode.

Speaker device

A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.

Earphone device

An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.

固態電解電容器之改良製法

Display device

A display device includes a substrate, a transistor, a pixel electrode, a first conductive layer and a second conductive layer. The transistor is disposed on the substrate. The pixel electrode is disposed on the substrate. The pixel electrode is electrically connected to the transistor. The first conductive layer is disposed on the pixel electrode. The first conductive layer has a first slit. The second conductive layer is disposed on the pixel electrode. The second conductive layer has a second slit. The first slit and the second slit are overlapped with the pixel electrode.

Winding-type capacitor package structure and method of manufacturing the same

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

Device for adjusting sensitivity and adjusting method of the same

Control device of data collecting system

Imaging device and light intensity compensating system and method of the same

Stacked solid electrolytic capacitor and a method for manufacturing the same

A stacked solid electrolytic capacitor and a method for manufacturing the same are disclosed. The stacked solid electrolytic capacitor includes two capacitor sets, a positive electrode conducting device, a negative electrode conducting device, and a package unit. Each capacitor set includes at least one capacitor unit. The front side of the positive electrode portion of the capacitor set extends to form a positive electrode pin. The positive electrode conducting device has at least one first positive electrode conducting lead frame and at least one second positive electrode conducting lead frame. The first positive electrode conducting lead frame is electrically connected with the second positive electrode conducting lead frame. The negative electrode conducting device has at least one negative electrode conducting lead frame, and is electrically connected with the negative electrode of the two capacitor sets by using metal conductive material.

The etch method of cathode foil in the aluminum electrolysis capacitor

Winding-type capacitor package structure and method of manufacturing the same

A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.

Light-emitting diode (led) lighting structure

An improved light-emitting diode (LED) lighting structure includes a body of LED and a light reflection layer. In a preferred form of the lighting structure, the LED body includes a dual-pin through-hole LED, which has a coupling section for mounting and positioning. The light reflection layer is formed on a rear portion of the LED body and extends frontward to form a hood-like configuration for reflection of light. In an alternative form of the lighting structure, the LED body includes one or more surface-mount LEDs, each of which has electrodes respectively soldered to a circuit formed on a board. The LED body is deposited in a hood having an opening. The hood has an inside surface on which a light reflection layer is formed. As such, advantages in terms of elimination of light leakage, reduction of loss of light energy, increase of LED lighting performance, ease of use, and stability of mounting can be achieved.

Conductive paste, manufacturing method thereof, capacitor element and manufacturing method thereof

A conductive paste, a manufacturing method of a conductive paste, a capacitor element and a manufacturing method of a capacitor element are provided. The conductive paste includes a conductive composite material powder and a resin. The conductive composite material powder is obtained by grinding a conductive composite material in a solid state. The resin is mixed with the conductive composite material powder.

Display device

A display device includes a substrate, a transistor, a pixel electrode, a first conductive layer and a second conductive layer. The transistor is disposed on the substrate. The pixel electrode is disposed on the substrate. The pixel electrode is electrically connected to the transistor. The first conductive layer is disposed on the pixel electrode. The first conductive layer has a first slit. The second conductive layer is disposed on the pixel electrode. The second conductive layer has a second slit. The first slit and the second slit are overlapped with the pixel electrode.