Method of treating cancer using adenosine and its analogs

Intrusion resistant glass laminate

ANTIBIOTIC COMPOSITIONS COMPRISING SILVER AND SELENIUM

Disclosed herein are antibiotic compositions, for example compositions that comprise a metal- containing agent and an organoselenium agent, and uses thereof.

MEMS ACTUATORS AND SWITCHES

The microelectromechanical (MEMS) switches employ movable actuators wherein one can move perpendicular to an underlying substrate and one or more others can move in a direction substantially parallel to the underlying substrate. Methods of operating MEMS switches are also disclosed. The improvements can enhance the performance of MEMS switches and/or reduce their manufacturing costs.

Method for clearing garbage by utilizing push-pull automatic swinging device

The invention discloses a method for clearing garbage by utilizing a push-pull automatic swinging device. The method comprises the steps that a hand grip 6 and a rear wheel 5 are pushed to roll; a crankshaft 7 connected with the rear wheel 5 is driven to rotate; one end of a first connecting rod 8 connected with a connecting rod journal of the crankshaft 7 swings; a second connecting rod 9 connected with the other end of the first connecting rod 8 by a spherical pair stretches and retracts horizontally; stretching and retraction of the second connecting rod 9 tows displacement of a movable plate 4; one end of a left front support plate 302 is connected with a rivet or a sliding block slides in a groove of the movable plate 4; one end of a right front support plate 301 is connected with a rivet or the sliding block can slide in the groove of the movable plate 4; and the displacement of the movable plate 4 can drive the right front support plate 301 and the left front support plate 302 to ...

Mobile terminal wallpaper switching control method and mobile terminal

The invention relates to the mobile terminal field, and provides a mobile terminal wallpaper switching control method and a mobile terminal. The method provided by the embodiment of the invention comprises steps of setting non-unlocking points on a graphical unlocking interface of the mobile terminal as wallpaper switching points; prompting a user to set wallpaper corresponding to the wallpaper switching points; and unlocking the mobile terminal and switching the wallpaper on the standby desktop of the mobile terminal to the wallpaper corresponding to the wallpaper switching points according to an unlocking pattern drawn by the user on the graphical unlocking interface and the set wallpaper switching points. By employing the method, the user can switch the wallpaper to the wallpaper corresponding to the wallpaper switching points according to user preferences when the user unlocks the mobile terminal. The method is simple and fast, and provides better usage experience for the user.

Method and device for carrier frequency migration estimation

The invention discloses a method and the device for the estimation of carrier frequency offset. A base station carries out a two-dimensional joint maximum likelihood estimate to the received signal, getting the vector norm of channel shock response and the carrier frequency offset; the carrier frequency offset is estimated according to the least squares criterion and vector norm, which is applied to the estimation of carrier frequency offset of the allocation plan of various subcarrier, there is no requirement to the allocation plan of the subcarrier between users, it is not needed that the subcarrier is allocated to the users in the existing technique any longer, it is also applied in the regular or irregular allocation of the subcarrier. Because the embodiment supplied by the invention supports the irregular allocation of the subcarrier, therefore, the system can allocate better subcarriers, the transmission channel, to the users according to the channel situation to get more frequency ...

Insulation glass

The utility model provides an insulation glass, including glass and aerosil slab, glass and aerosil slab are installed on the frame support, be provided with at least a slice aerosil slab in glass's the at least one side, the frame support is provided with the cavity, it has the insulator to fill in the cavity. The utility model discloses an aerogel insulation glass has better thermal insulation nature and light transmissivity.

Swing check valve

The invention relates to a swing check valve. The swing check valve comprises a valve body, wherein an inlet channel and an outlet channel are formed in the left end and right end of the valve body respectively, a middle head gasket is installed at the upper end of the valve body, a valve deck is connected to the upper end of the middle head gasket, a valve seat is arranged on the right side of the inlet channel, a rocker bar is hinged to the right end of the valve seat, a rocker bar shaft is connected to the upper end of the rocker bar, a sealing gasket is arranged at the left end of the valve seat, a pressing plate is arranged at the left end of the sealing gasket, the pressing plate is tightly connected with the sealing gasket through a bolt, the diameter of the pressing plate is smaller than that of the inlet channel, and the diameter of the sealing gasket is larger than that of the inlet channel. According to the swing check valve, the sealing performance of the valve body is guaranteed ...

Arabic number tesseral code

In the information era, distinguishing hand-written digits is significant in data processing. The present invention proposes one new digit coding scheme and this can standardize the hand writing of digits and simplify and recognition of hand written digits.

Ceiling fan

The invention discloses a ceiling fan which comprises a hanging bracket, a hanging rod, a hanging handleless cup, a cover body, a motor, fan blades and a ceiling fan controller, wherein the ceiling fane controller comprises an MCU (Microprogrammed Control Unit), a wireless receiving unit, a rectification filtration unit, a DC/DC (Direct Current/Direct Current) converter, a motor driving unit, a voltage reversal detection unit and a PWM (Pulse-Width Modulation) controller, wherein the MCU is respectively connected with the wireless receiving module, the motor driving unit, the voltage reversal detection unit and the PWM controller; the MCU controller receives a control signal from the ceiling fan controller by virtue of the wireless receiving unit; the motor driving unit is connected with the motor and is capable of driving the motor; the voltage reversal detection unit is connected with the motor and is capable of feeding back a signal to the MCU; the rectification filtration unit is connected ...

Method for modifying slide for liquid-based cytodiagnosis

The invention discloses a method for modifying a slide for liquid-based cytodiagnosis, which comprises the following steps of: slide washing, slide silanization and slide hydroformylation. The slide surface modified by the method is relatively rough, so that the problem that the surface is smooth and low in adhesion to cells in the prior art is solved.

Piping shaft manufacturing formwork and industrialized piping shaft production method

The invention relates to a piping shaft manufacturing formwork produced in an industrialized mode and a piping shaft production method based on industrialized production. The piping shaft manufacturing formwork comprises a concrete base plate, a first brick formwork body, a second brick formwork body, an inner formwork body and an outer formwork body. The first brick formwork body is bricked on the top face of the concrete base plate. The second brick formwork body is bricked on the concrete base plate and located on the periphery of the first brick formwork body. The inner formwork body is arranged on the top face of the first brick formwork body and flush with the outer side face of the first brick formwork body. The outer formwork body is arranged on the top face of the second brick formwork body and flush with the inner side face of the second brick formwork body. At least one overflow pipe is buried in the first brick formwork body and the second brick formwork body. Multiple first ...

Method for implementing frequency hopping synchronization for orthogonal frequency division multiplex

High-efficiency steel-smelting wet-process dedusting sewage and refining sewage processor

Modified steam secondary heating device

The utility model discloses a modified steam secondary heating device, including thermal -insulated outer container and processing inner box, both ends are equipped with outlet duct and intake pipe respectively about the processing inner box, be equipped with the thermometer on the outlet duct, the processing inner box outside still is equipped with thermal -insulated outer container, be equipped with thermal -insulated clearance between thermal -insulated outer container and the processing inner box, the incasement is equipped with the baffle in the processing, be equipped with heating chamber and dehumidification chamber in the processing inner box of the baffle left and right sides, be equipped with the dehumidification piece in the dehumidification chamber, dehumidification piece upper end link bit meets in the inner sealing plate in the processing inner box outside, the heating inner box surface at inner sealing plate place is equipped with down the installing port, the inner sealing ...

Synchronous belt transmission structure for carrying glass tooling plate trolley

The utility model discloses a synchronous belt transmission structure for carrying a glass tooling plate trolley, which comprises a transmission line body, the transmission line body comprises a driving shaft assembly, a tensioning assembly, an upper idler wheel assembly, a lower idler wheel assembly and a synchronous belt, and the driving shaft assembly, the tensioning assembly, the upper idler wheel assembly and the lower idler wheel assembly are connected in series through the synchronous belt. Due to the fact that the tensioning assemblies are installed from top to bottom at intervals, thenumber of meshing teeth of the transmission side of the synchronous belt and the idle wheel is increased, the phenomenon of tooth jumping caused by asynchronous rotation of the synchronous belt and the idle wheel during rapid starting and stopping is avoided, and the transmission stability of the tool plate trolley is enhanced. By improving the structures of the driving shaft assembly and the idle ...

Automatic driving takeover performance prediction method and system

The invention relates to an automatic driving takeover performance prediction method, which comprises the following steps of 1, enabling a driver to take over a vehicle under different working conditions, obtaining multiple pieces of experimental sample data, and constructing an experimental sample database; step 2, according to statistical characteristics of vehicle driving data after takeover, endowing experimental sample data with classification labels; and 3, constructing a random forest takeover performance prediction model, determining an optimal parameter combination of the model by using the sample data set, and predicting the takeover performance level in real time. According to the method, under the condition of considering the cognitive load of the driver, the state of the driver is monitored in real time, the L3-level automatic driving vehicle takeover performance level is predicted, and the accuracy rate reaches 94.3%.

Inter-station time synchronization method and related equipment

The embodiment of the invention discloses an inter-station time synchronization method and related equipment, and is applied to the technical field of communication. Comprising the step that a to-be-synchronized base station monitors a synchronization signal. Wherein the synchronization signal is periodically sent by the clock source base station, and the clock of the clock source base station is determined by the absolute moment. And when the to-be-synchronized base station detects the synchronization signal, the clock of the clock source base station is determined according to the synchronization signal. And the to-be-synchronized base station determines the time deviation between the to-be-synchronized base station and the clock source base station according to the clock of the clock source base station. And the to-be-synchronized base station adjusts a clock corresponding to the to-be-synchronized base station according to the time deviation, so that the clock corresponding to the to-be-synchronized ...

Tweezers clamping training system and method

The invention provides a tweezers clamping training system and method.The tweezers clamping training system comprises a tweezers simulator and VR equipment, the tweezers simulator comprises a holding handle and a simulation device connected with the holding handle, the simulation device is provided with a gear connecting rod connected with the holding handle, and the gear connecting rod is provided with a detection shaft; the two ends of the detection shaft are connected with the gear connecting rod and the angle sensor respectively, the simulation device further comprises a driving circuit board, a connector and a shell, the connector is arranged at the end, away from the driving circuit board, of the shell, the driving circuit board is electrically connected with the angle sensor and the connector, and the VR equipment comprises a wearable VR imaging module and an upper system. And after the upper system processes angle data detected by the angle sensor, information is fed back to the ...

INTRUSION RESISTANT GLASS LAMINATES

Composite laminate interlayers for a glass laminate comprising a sheet of polyethylene terephthalate (PET) layer (203) between layers of plasticized polyvinyl butyral (PVB) adhesive layers (202, 204), wherein at least one of the PVB adhesive layers is stiffened, e.g. by reduction in the amount of plasticizer, and has a glass transition temperature greater than 35 °C. The PET is preferably 0.075 to 0.25 mm (3-10 mils) thick and can have a functional coating (407) for reducing radiation, e.g. UV or IR or visible light, transmission through the glass laminate. The laminate can also comprise at least one elastomeric layer (406) adapted to reducing sound transmission through the glass laminate. The laminates exhibit enhanced maximum flexural modulus of greater than about 350 Newtons/centimeter. © KIPO & WIPO 2007 ...

A semiconductor package of a flipped MOSFET and its manufacturing method

This invention is aims to providing a flipped MOSFET and its manufacturing method, also providing a lead frame structure, which can support to flipped FET attach on lead frame with solder or adhesive directly, thus enhance the device thermal performance. Half etch or punch the area of lead frame to form some grooves which separate die paddle into several pieces, at least including Gate connecting area and Source connecting areas. All grooves are formed based to FET size, and there is at least a surrounding groove so as to ensure the remaining scribe of wafer place on the groove to avoid electrical short. Dispense solder paste or conductive adhesive on each pieces of die paddle, and then flipped FET and attach on die paddle, due to separate whole die paddle into several smaller. pieces and have grooves to protect paste/adhesive bleed out, which enhance the connection between FET and die paddle.

Cathode composite material of lithium ion battery

Stacked power semiconductor device using dual lead frame and manufacturing method

A stacked power semiconductor device includes vertical metal oxide semiconductor field-effect transistors and dual lead frames packaged with flip-chip technology. In the method of manufacturing the stacked power semiconductor device, a first semiconductor chip is flip chip mounted on the first lead frame. A mounting clips is connected to the electrode at back side of the first semiconductor chip. A second semiconductor chip is mounted on the second lead frame, which is then flipped and stacked on the mounting clip.

Battery protection package and process of making the same

The present invention discloses small-size battery protection packages and provides a process of fabricating small-size battery protection packages. A battery protection package includes a first common-drain metal oxide semiconductor field effect transistor (MOSFET), a second common-drain MOSFET, a power control integrated circuit (IC), a plurality of solder balls, a plurality of conductive bumps, and a packaging layer. The power control IC is vertically stacked on top of the first and second common-drain MOSFETs. At least a majority portion of the power control IC and at least majority portions of the plurality of solder balls are embedded into the packaging layer. The process of fabricating battery protection packages includes steps of fabricating power control ICs; fabricating common-drain MOSFET wafer; integrating the power control ICs with the common-drain MOSFET wafer and connecting pinouts; forming a packaging layer; applying grinding processes; forming a metal layer; and singulating ...

Adaptive equalizer system for short burst modems and link hopping radio networks

A method for an adaptive equalization apparatus in a multiple-link hopping radio system includes hopping among a plurality of radio links to receive variable-length bursts of radio signals on the plurality of radio links and equalizing amplitude and phase variations of a slow channel for each radio link from a received burst on the radio link. Further, the method includes storing the estimated tap coefficients pertinent to each radio link and using the tap weights of the current burst of the radio link to reliably pre-compensate the channel amplitude and phase distortion of a next received burst on the radio link.

Semiconductor Package And Fabrication Method Thereof

A method of making a semiconductor packaged device comprises mounting onto a lead frame a bottom of a molded semiconductor chip having a first plastic package body covering a top face of a semiconductor chip, encapsulating the lead frame and the semiconductor chip with a second plastic package body with top surfaces of conductive contact bodies electrically connected to electrodes on the top surface of the semiconductor chip exposed and plating conductive pads on a top surface of the assembly structure to provide external electrical connections to the electrodes through the conductive contact bodies.

HIGH RIGIDITY INTERLAYERS AND LIGHT WEIGHT LAMINATED MULTIPLE LAYER PANELS

This disclosure is related to the field of polymer interlayers for multiple layer panels and multiple layer panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of high rigidity interlayers and light weight laminated multiple layer panels incorporating high rigidity interlayers.

POLY(VINYL ACETAL) RESIN COMPOSITIONS, LAYERS, AND INTERLAYERS HAVING ENHANCED OPTICAL PROPERTIES

Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.

TORQUE BASED CLUTCH FUEL CUT OFF

An engine control system comprises a clutch cut off enable module and a torque control module. The clutch cut off enable module generates an enable signal based on a clutch engagement signal and an accelerator pedal signal. The torque control module reduces a spark advance of an engine to a minimum value and disables fueling of cylinders of the engine based on the enable signal. The minimum value is a minimum allowed spark advance for current engine airflow.

CURVE-FITTING METHOD TO CALCULATE COARSE FREQUENCY OFFSET

A method comprising the steps of: providing a known sequence comprising a plurality of data points; and curve-fitting the plurality of data points to calculate coarse frequency offset.

Apparatus for stripping metal sheets from cathode blank

An apparatus for stripping metal sheets from a cathode blank includes: a frame; a stripping assembly disposed on the frame; and a receiving mechanism including at least one receiving platform which is disposed on the frame for receiving the deposited metal sheets. The stripping assembly includes: first and second clipping mechanisms for clipping a conductive member on an upper end of the cathode blank; first and second stripping mechanisms for stripping the deposited metal sheets from two surfaces of the cathode blank; a bottom positioning mechanism for positioning a lower end of the cathode blank; and first and second loosening mechanisms each including a push rod which is movably disposed on the frame in the transversal direction for pushing the cathode blank.

Sound reducing polymer interlayers

METHOD OF TREATING CANCER USING ADENOSINE AND ITS ANALOGS

Carrier phase recovery system for adaptive burst modems and link hopping radio networks

Multifunctional tea-alcohol therapeutic suit

The invention belongs to the field of medical instruments, and particularly relate to a multifunctional tea-alcohol therapeutic suit, which comprises a therapeutic suit , wherein the therapeutic suit is provided with a collar which is detachably connected with a protective cap; the therapeutic suit is provided with a first treatment hole at the position of abdomen, a second treatment hole at the position of neck , and a third treatment hole at the position of waist. The first, second and third treatment holes are respectively detachably connected with a therapeutic blanket, the side of the collar is provided with a snap button, and the side of the therapeutic suit is provided with a lace. The invention solves the problems complicated operation process of traditional therapy. Figure 1 ...

APPARATUS FOR STRIPPING METAL SHEETS FROM CATHODE BLANK

An apparatus for stripping metal sheets from a cathode blank comprises: a frame; a stripping assembly disposed on the frame; and a receiving mechanism comprising at least one receiving platform which is disposed on the frame for receiving the deposited metal sheets. The stripping assembly comprises: at least one clipping mechanism for clipping a conductive member on an upper end of the cathode blank; first and second stripping mechanisms for stripping the deposited metal sheets from two surfaces of the cathode blank; a bottom positioning mechanism for positioning a lower end of the cathode blank; and first and second loosening mechanisms each comprising a push rod which is movably disposed on the frame in the transversal direction for pushing the cathode blank.

DEFECT RESISTING ACOUSTIC POLYMER INTERLAYERS

This disclosure is related to the field of polymer interlayers for multiple layer glass panels and multiple layer glass panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of polymer interlayers comprising multiple thermoplastic layers which resist the formation of optical defects.

HIGH RIGIDITY INTERLAYERS AND LIGHT WEIGHT LAMINATED MULTIPLE LAYER PANELS

This disclosure is related to the field of polymer interlayers for multiple layer panels and multiple layer panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of high rigidity interlayers and light weight laminated multiple layer panels incorporating high rigidity interlayers.

ACOUSTIC TRANSMISSION DEVICES AND PROCESS FOR MAKING AND USING SAME

Acoustic tags and a process for fabrication are disclosed for identifying and tracking various hosts including inanimate and animate objects in up to three dimensions. The acoustic tags may be powered by a single power source. Tags can have an operation lifetime of up to 90 days or longer at a transmission rate of 3 seconds. The acoustic tags have an enhanced signal range that enhances detection probability when tracking the hosts.

Multi-layer lead frame package and method of fabrication

The invention provides a multi-layer lead frame package and a method of fabrication. The present invention features a lead-frame package, having a first, second, third and fourth electrically conductive structures with a pair of semiconductor dies disposed therebetween defining a stacked structure. The first and second structures are spaced-apart from and in superimposition with the first structure. A semiconductor die is disposed between the first and second structures. The semiconductor die has contacts electrically connected to the first and second structures. A part of the third structure lies in a common plane with a portion of the second structure. The third structure is coupled to the semiconductor die. An additional semiconductor die is attached to one of the first and second structures. The fourth structure is in electrical contact with the additional semiconductor die. A molding compound is disposed to encapsulate a portion of said package with a sub-portion of the molding compound ...

Unmanned plane-based industrial water pollution source detection method

The invention relates to an unmanned plane-based industrial water pollution source detection method. The unmanned plane-based industrial water pollution source detection method comprises the following steps of 1, planning an unmanned plane flight course based on positions of industrial enterprises around water, 2, acquiring drainage images of drainage pipes of the industrial enterprises by a remote sensing device carried by an unmanned plane, and 3, controlling the unmanned plane in real time so that the unmanned plane enters into the drainage pipe and acquiring and recovering enterprise drainage samples by a collection device carried by the unmanned plane. The unmanned plane-based industrial water pollution source detection method can realize image monitoring and sampling random-inspection of enterprise drainage by the unmanned plane, thereby realizing analysis of enterprise-caused influence on the water, is not influenced by time and space, avoids treatment on water before inspection, ...

Electric egg whisk

An electric egg whisk comprises a stirring rod and a drive device. The drive device comprises a hollow handle, a motor, a power supply, a hollow guide column and a drive shaft, wherein the motor and the power supply are arranged in the hollow handle, the hollow guide column is arranged at one end of the handle and is connected with the handle, and the drive shaft penetrates through the guide column. One end of the drive shaft is connected with the stirring rod, the other end of the drive shaft is connected with the motor and is driven by the motor to rotate, the drive device further comprises a spring and a sleeve ring, the guide column is sleeved with the spring, one end of the spring is connected with the sleeve ring, the other end of the spring is connected with the handle, the sleeve ring can slide along the guide column, and the periphery of the sleeve ring is provided with an annular cover. The electric egg whisk has the advantages of being simple in structure, small in size, convenient ...

Sound reducing wedge shaped polymer interlayers

Locking device specially used for wire drawing device

The invention relates to a locking device specially used for a wire drawing device. The locking device comprises a chuck and a rotating wheel, wherein the chuck has a circular truncated cone-shaped structure; external threads are evenly arranged on the outer side wall of the chuck; grooves are respectively and symmetrically formed along the central axis of the chuck; the grooves respectively have a U-shaped structure; a circular through hole is formed in the middle of the chuck; bosses are evenly arranged on the inner side wall of the circular through hole along the central axis; the bosses respectively have an arc-shaped structure; the six grooves and the six bosses are available; the rotating wheel consists of a hoop and six rotating rods; each rotating rod has a cylinder structure; the six rotating rods are evenly arranged on the outer side wall of the hoop; the hoop sleeves the chuck in a winding way. When being used in the bolt wire drawing process, the locking device is convenient ...

New composition capable of protecting liver, detoxifying and relieving pain and preparation method

A new compounded composition capable of protecting liver, detoxifying and relieving pain is composed of, in parts by weight, 5-10 parts of glucurolactone and 24-75 parts of glucosamine. Glucurolactone in the compounded composition has the effect of preventing liver from damaging and detoxifying, and glucosamine has the alleviation function on arthritis and neuroinflammation. The two raw materials of the new composition give a play to synergistic effect in vivo, are safe and effective, and are applicable to medicines, food and health products.

Manufacturing method of quasi monocrystalline silicon solar cell

The invention relates to a manufacturing method of a quasi monocrystalline silicon solar cell. According to the manufacturing method, quasi monocrystalline silicon is introduced as the base material of the solar cell. On the basis of a traditional monocrystalline and polycrystalline silicon solar cell manufacturing method, the surface reflectivity of a textured silicon wafer is reduced from 26% to 21% by improving the corrosion amount of the silicon wafer, and the square resistance of the diffused silicon wafer is increased to above 75ohm/square by adjusting the diffusion process. In addition, after heavy doping diffusion, PN nodes at the edge of the silicon wafer are isolated with the help of laser, the positioning process of the silicon wafer is simplified, and the production efficiency of products is improved. Meanwhile, a designed novel electrode grid line reduces the printing consumption of positive silver paste, reduces the shading area of the cell and improves the open-circuit voltage ...

Centrifugal air wheel

The utility model relates to a centrifugal air wheel contains multi -disc blade, reinforcing ring and hub, and multi -disc blades annular blading is connected with circular shape hub and annular reinforcing ring respectively, wherein the outward flange that radially stretches out the hub of one side edge hub of every blade. The wind wheel of this kind of structure is in the easier drawing of patterns of the in -process of moulding plastics to wind wheel air supply volume has in the course of the work been improved.

Diphase machine vision positioning system

Diphase machine vision positioning system, including the base frame, install two X axle movement module in the base frame, Y axle movement module and Z axle movement module, they are mutually perpendicular between two liang, Z axle movement module installs the rotation module in the lower part, install the suction nozzle in the rotation module, the camera fixing device of frame bottom goes up to control and installs coarse positioning camera and fine positioning camera respectively, be connected with the industry control is electromechanical respectively, install camera lens no. 1 and camera lens no. 2 on coarse positioning camera and the fine positioning camera respectively, the manual control suction nozzle removes the coarse positioning camera respectively with the work piece, the coordinate parameter is fixed a position and takes notes to the visual field of fine positioning camera, through the motion of industrial computer control four -axis motion platform, according to the coordinate ...

Insulation glass

The utility model provides an insulation glass, include the frame support and install the multi -disc glass on the frame support, the frame support with form airtight cavity between glass, airtight cavity intussuseption is filled with the aerosil granule, the material of frame support is aerosil, be provided with support piece in the frame support. The utility model discloses an insulation glass has better thermal insulation nature and light transmissivity.

Quality and on-line number P2P video frequency search method

The invention relates to a P2P video search system and a relative method, based on quality and online number, wherein the video search system comprises a search engine, a quality check server, an information optimize memory server, a P2P medium exchange control server, and a WEB server, the search engine, the quality check server, the information optimize memory server, the P2P medium exchange control server, and the WEB server are connected with internet via networks. The invention provides a sequence list which main character indexes are video resource play quality and online number, therefore, user can make selection effectively according to the search result, to quickly select the network video resource with better quality, while the play quality of the resource will not be decreased along with the increase of user access.

Solar energy storage ventilated heating system

The invention discloses a solar energy storage, ventilation and heating system, which comprises a heat storage wall composed of a heat-insulation layer, a heat storage layer and an aluminum plate painted with black paint, a heat storage ventilation channel or a combination thereof, which are sequentially arranged on the outer side of the external wall of a building; a transparent cover plate arranged on the outer side of the heat storage wall or the heat storage ventilation channel; an air sandwich between the transparent cover plate and the heat storage wall; and an upper vent and a lower vent having valves and arranged on the transparent cover plate and the heat storage wall. The solar energy storage, ventilation and heating system can achieve intermittent ventilation and heating without consuming non-renewable energy by using the special heat absorption and release functions of a phase-change heat storage material and by controlling the valves of the vents. The system has the advantages ...

Multi -functional steamer

The utility model discloses a multi -functional steamer, including steam generator and stewing box, the steam generator top is equipped with stewing box, stewing box is big -end -up's a toper section of thick bamboo, stewing box top hinged to has the pot cover, be linked together through a secondary heating section of thick bamboo between stewing box and the steam generator, the secondary heating section of thick bamboo outside is around being equipped with electromagnetic heating coil, be equipped with a steam pipe and no. Two steam pipe between a steam generator and the secondary heating section of thick bamboo, all be equipped with the solenoid valve on steam pipe and no. Two steam pipe, two solenoid valves, steam generator and electromagnetic heating coil electric connection respectively are located the control panel at pot cover top, the utility model is simple and reasonable in structure, having realized the dry -type and having cooked and traditional steam cooked switching, made ...

Black reactive dye as well as preparation method and application thereof

The invention provides a black reactive dye composition as well as a preparation method and application thereof, and belongs to the field of reactive dyes. The dye composition comprises a component A composed of one or more compounds in the formula (I), a component B composed of one or more compounds in the formula (II), a component C composed of one or more compounds in the formula (III) and optional auxiliaries. The black reactive dye composition disclosed by the invention is excellent in performance, suitable for dyeing or printing cellulose fibers, protein fibers and other hydroxyl-containing or nitrogen-containing fiber materials, good in fixation rate, good in lifting power, good in various performance indexes, especially excellent in color fastness such as washing resistance, friction resistance, perspiration resistance and the like, and good in color fastness. The reactive black dye is an environment-friendly reactive black dye capable of meeting the requirements of high-end customers ...

Hotspot content recommendation method and device, computer equipment and readable storage medium

The invention provides a hotspot content recommendation method and device, computer equipment and a readable storage medium. The hotspot content recommendation method comprises the steps of obtaining a search text and a plurality of sorted album corresponding to the search text; determining a hotspot album in the content platform from the plurality of album; when it is determined that the number of the hot album is larger than or equal to a preset threshold value, keywords corresponding to the hot album are combined; inputting the search text and the combined keyword set into a pre-trained classification model, and determining whether the search text is a hot text or not; when it is determined that the search text is the hot text, reordering the remaining album except the hot album, so that the recommendation sequence of the hot album is before the recommendation sequence of the remaining album; according to the recommendation sequence, the hot album and the remaining album are sent to ...

Ternary alloy dehydrogenation catalyst as well as preparation method and application thereof

The invention belongs to the technical field of hydrogen storage material dehydrogenation, and particularly relates to a ternary alloy dehydrogenation catalyst, a preparation method and application thereof, the dehydrogenation catalyst comprises the following components: (a) an active component, the active component is a ternary alloy containing Pt and another two metals, the particle size of the ternary alloy is 1.5-2.5 nm, the total content of the active component is 0.03 wt.%-8 wt. The other two metals are selected from two of Fe, Co, Ni and Sn; and (b) a carrier, the carrier is a spinel carrier, the content of the carrier is the residual content of the catalyst except the active component, and the spinel carrier has an AB2O4 structure.

Integral hoisting equipment for marine fan

The invention discloses marine fan integral hoisting equipment which comprises a water conveyor, a carrying platform is formed on the water conveyor, and at least one set of stabilizing assemblies and at least one set of hoisting mechanisms are arranged on the carrying platform; wherein the hoisting mechanism comprises two opposite hoisting parts, the hoisting parts are used for driving a fan tower to ascend and descend, two parallel guide rails are installed on the carrying platform, the two hoisting parts are installed on the two guide rails in a sliding mode respectively, and the stabilizing assembly is arranged between the two guide rails; the water transportation device is further provided with a pile holding device, the pile holding device is arranged between the two guide rails, and the pile holding device is provided with an arc-shaped clamping body, so that the pile holding device and the fan pile body can be clamped and locked, and the water transportation device and the fan pile ...

Remote sensing image change detection method

The invention relates to a remote sensing image change detection method, and belongs to the technical field of remote sensing image recognition. According to the method, an input mode of a twin network capable of sharing weights is selected in a coding part, dual-time-phase images are respectively input into the same network branches for feature extraction, the over-fitting phenomenon is reduced by sharing the weights, and the two network branches select residual error connection modules as convolution units to respectively extract the features of the images, so that the image features are extracted; the convergence speed of the network is accelerated; meanwhile, a dense connection method is utilized, information lost in the continuous downsampling process of the image is aggregated layer by layer through upsampling, and therefore the small target extraction capacity of the network is improved; an attention module is introduced into the transverse connection part of the coding part and ...

Polymeric interlayers and multiple layer panels made therefrom exhibiting enhanced properties and performance

Semiconductor package with adhesive material pre-printed on the lead frame and chip and the manufacturing method

A combined packaged power semiconductor device

HIGH RIGIDITY INTERLAYERS AND LIGHT WEIGHT LAMINATED MULTIPLE LAYER PANELS

This disclosure is related to the field of polymer interlayers for multiple layer panels and multiple layer panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of high rigidity interlayers and light weight laminated multiple layer panels incorporating high rigidity interlayers. 1. A multi-layer interlayer comprising:a stiff polymer layer;a soft polymer layer in contact with said stiff polymer layer;wherein at least one polymer layers comprises plasticized poly(vinyl butyral); andwherein the stiff polymer layer has a glass transition temperature of greater than 33° C.2. The multi-layer interlayer of wherein said stiff polymer layer and said soft polymer layer comprise poly(vinyl butyral).3. The multi-layer interlayer of wherein said multilayer interlayer comprises a second stiff polymer layer in contact with said soft polymer layer claim 1 , and wherein the soft polymer layer is between said two stiff polymer layers.4. The multi-layer interlayer of wherein at least one of the stiff polymer layers has a glass transition temperature of greater than 33° C. and the soft polymer layers has a glass transition temperature of less than 30° C.5. The multi-layer interlayer of wherein at least one of the stiff polymer layers has a glass transition temperature of greater than 33° C. and the soft polymer layers has a glass transition temperature of less than 15° C.6. The multi-layer interlayer of wherein at least one of the stiff polymer layers has a glass transition temperature of greater than 33° C. and the soft polymer layers has a glass transition temperature of less than 5° C.7. The multi-layer interlayer of wherein at least one of the stiff polymer layers has a glass transition temperature of greater than 33° C. and the soft polymer layers has a glass transition temperature of less than 0° C.8. The multi-layer interlayer of wherein the first and the third polymer layers have a glass transition temperature of greater ...

STORED DATA REVERIFICATION MANAGEMENT SYSTEM AND METHOD

A system and method are provided for verifying data copies and reverifying the copies over the life span of media according to a verification policy. Characteristics of media and use of media are tracked to provide metrics which may be used to dynamically reevaluate and reassign verification policies to optimize media usage. Copies that fail verification operations may be repaired by repeating a storage operation for recent copies or by substituting a close temporal copy of the failed copy.

POLYMER INTERLAYERS COMPRISING A BLEND OF TWO OR MORE RESINS

An interlayer comprised of a blend of thermoplastic resins and at least one high refractive index having improved acoustic and optical quality is disclosed. The use of a blend thermoplastic resins and a high refractive index plasticizer improves transparency and acoustic properties without sacrificing other characteristics of the interlayer.

Achsendrehmomentbasierter Tempomat

Achsendrehmomentsteuersystem, umfassend: ein Achsendrehmomentanforderungsmodul (200, 300), das eine Achsendrehmomentanforderung empfängt und das die Achsendrehmomentanforderung selektiv ausgibt, wobei die Achsendrehmomentanforderung auf einer Tempomat-Drehmomentanforderung basiert; ein Achsendrehmomentumwandlungsmodul (304), das die Achsendrehmomentanforderung empfängt und das die Achsendrehmomentanforderung in eine Maschinendrehmomentanforderung umwandelt; und ein Ratenbegrenzungsmodul (812), das die Maschinendrehmomentanforderung und eine Pedal-Maschinendrehmomentanforderung empfängt, eine Ratenbegrenzung basierend auf einem Betrag einer Änderung der Pedal-Maschinendrehmomentanforderung einstellt und die Ratenbegrenzung auf die Maschinendrehmomentanforderung anwendet, wenn die Tempomat-Drehmomentanforderung größer als die Pedal-Maschinendrehmomentanforderung ist, wobei die Ratenbegrenzung ferner basierend auf einem Ratenbegrenzungs-Offset für eine Drehmomentsicherheit, welcher ein basierend ...

MEMS ACTUATORS AND - SWITCHES

Sound reducing wedge shaped polymer interlayers

Abstract The present invention is in the field of polymer interlayers and multiple layer glass panels comprising polymer interlayers, and, more specifically, the present invention is in the field of wedge shaped polymer interlayers.

INTEGRATED MEMS PACKAGING

The microelectromechanical system (MEMS) package includes a substrate onto which is disposed or otherwise formed an active MEMS device, a cap for hermetically sealing the MEMS package and a pair of barrier walls for preventing bonding material for the cap from contaminating unintended areas of the substrate.

MULTIPLE LAYER INTERLAYERS HAVING A GRADIENT REGION

The present invention provides multiple layer interlayers that can be used in multiple layer glass panel type applications to reduce the amount of sound transmitted through the panel while also providing a colored region within a gradient region. The acoustic effect can be achieved by using two or more polymer sheets having differing compositions that have been combined into a single multiple layer interlayer, and the gradient region effect is achieved by forming a colored region in one or more gradient regions of the individual layers.

AX213 AND AX132 PCSK9 ANTAGONISTS AND VARIANTS

Antagonists of human proprotein convertase subtilisin-kexin type 9 ("PCSK9") are disclosed. The disclosed antagonists are effective in the inhibition of PCSK9 function and, accordingly, present desirable antagonists for use in the treatment of conditions associated with PCSK9 activity. The present invention also discloses nucleic acid encoding said antagonists, vectors, host cells, and compositions comprising the antagonists. Methods of making PCSK9-specific antagonists as well as methods of using the antagonists for inhibiting or antagonizing PCSK9 function are also disclosed and form important additional aspects of the present disclosure.

Self -limiting temperature electric heat piece extrusion device

The utility model relates to an electric heating field especially relates to a self -limiting temperature electric heat piece extrusion device, including the support, set up the squeeze roll on the support, the squeeze roll is including crosing the last squeeze roll of support both sides, well squeeze roll and lower squeeze roll, go up squeeze roll, well squeeze roll and down squeeze roll top -down parallel arrangement in between the support both sides the squeeze roll outside is equipped with the adjusting device who is used for adjusting each squeeze roll roll surface distance, and each squeeze roll is rotated by its transmission shaft of external force drive. Through the utility model discloses in set up the distance of adjusting device between to the squeeze roll and adjust to the self -limiting temperature electric heat piece that adapts to different thickness extrudees, through the utility model discloses lieutenant general's cooling water is cooled down to squeeze roll and extruded ...

Apparatus for producing with spent lye treatment regeneration slice sodium sulfhydrate

The utility model relates to an apparatus for producing with spent lye treatment regeneration slice sodium sulfhydrate, its technical scheme is: including the waste liquid jar, the naoh storage tank, the retort, the drawing liquid pump, the distillation column, the vacuum pump, the adsorption tower, the electrical heating jar, the storage tank, the stirring storage tank, steam boiler, the slicer, a compressor, the naoh storage tank passes through drawing liquid pump ligation jar, the electrical heating jar is connected to the waste liquid jar, the adsorption tower is connected to retort and electrical heating jar, the adsorption tower passes through the storage tank and connects two sets of distillation columns, vacuum pump and steam boiler are connected to the top of distillation column, the stirring storage tank is connected to the distillation column, the slicer is connected to the exit end of stirring storage tank, the compressor is connected to the slicer, the beneficial effects of ...

Network optimization method and equipment

The embodiment of the invention provides a network optimization method and network optimization equipment, which belong to the field of communication and can be used for quantitatively determining an HSPA+ technology upgrading and deploying area, reducing the error of the technology upgrading and deploying area and improving the network optimization and planning accuracy. The method comprises the steps of acquiring the types of user terminals and the core domain identities of the user terminals when the user terminals establish services; counting the times of data services established by different user terminals according to the types and the core domain identities of the user terminals; reclassifying terminals of different types according to the capabilities and the counting results of the user terminals; acquiring the service time duty cycle of the reclassified user terminals of different types and determining a network upgrading technology according to the service time duty cycle; determining ...

Universal rerailer for high-speed railway

The invention discloses a universal rerailer for a high-speed railway, which comprises two sets of re-railing devices corresponding to the advancing direction in which a locomotive derails. The universal rerailer is characterized in that: each re-railing device comprises a left re-railing body and a right re-railing body arranged at the two sides of a rail in parallel, and wheel guiding plates connected to the tail ends of the re-railing bodies, and a wheel guider is added on the front end at one side of the re-railing body. By adopting the universal rerailer for a high-speed railway provided by the invention, the service efficiency is greatly improved, the rescue demands under various circumstances are met preferably, and the advantages of high structural strength, light weight and strong capability of resisting compression and deformation is achieved, thus having good popularization value.

Insulation glass

The utility model provides an insulation glass, include the frame support and install the multi -disc glass on the frame support, the frame support with form airtight cavity between glass, be provided with at least a slice aerosil slab in the airtight cavity. The utility model discloses an insulation glass has better thermal insulation nature and light transmissivity.

Automatic cleaning device for viscosity meter

The invention relates to an automatic cleaning device for a viscosity meter, which comprises an air source module, a plurality of cleaning assemblies and an electromagnetic valve that are sequentially connected; the automatic cleaning device also comprises an electric control module connected with the electromagnetic valve through a circuit, wherein each cleaning assembly comprises a gas-liquid converting assembly connected with the air source module and a throttling valve connected with the gas-liquid converting assembly; and the gas-liquid converting assembly comprises a pneumatic triple piece and a pneumatic hydraulic pump sequentially connected, and also comprises a pressure regulating assembly connected with the pneumatic triple piece, the pneumatic triple piece is connected with an air source inlet, and the pneumatic hydraulic pump is connected with a cleaning agent inlet and a high-pressure cleaning agent outlet. The automatic high-pressure cleaning device integrating instruments ...

Flood-discharging energy dissipater of hydroelectric project

The invention discloses a flood-discharging energy dissipater of a hydroelectric project. The flood-discharging energy dissipater is formed by two side overflow piers and a middle pier, wherein the two side overflow piers and the middle pier are arranged on the slope section of a dam facing. The three overflow piers form three flip buckets and two narrow water discharging gaps. By adopting the flood-discharging energy dissipater, the flood discharged through surface outlets can be fully diffused, the energy dissipation effect is good and the range of flood flow is unlimited. Compared with all kinds of traditional flood-discharging energy dissipaters, the flood-discharging energy dissipater of the invention can solve the problems that the longitudinal distance of the water tongue discharged by the traditional narrow gaps is long and the transverse diffusion range of the water flow of the diffusion bucket lips is large, so the flood-discharging energy dissipation of the discharged flood is ...

Fire-fighting safety device for explosive production

A fire-fighting safety device for explosive production comprises a fire-fighting hose, an automatic switch is arranged on the fire-fighting hose, the automatic switch is connected to an electric control system, the electric control system is connected to an alarm and a sensor, and the fire-fighting hose is also provided with a manual switch which is in a parallel connection with the automatic switch. The fire-fighting safety device can sense the change of the temperature and smoke density in the equipment through the sensor, measures the values of the temperature and the smoke density, monitors the changing situation, and emits the data to the electric control system; then the data is compared to a preset alarm value; furthermore, the electric control system can automatically control the firefighting equipment, can automatically start the firefighting equipment in no time, and gives an alarm; even if the automatic switch is out of service, the device can also be manually started, so the ...

Beneficiation method for complex multi-metal sulfide electrum comprehensive recovery

The invention provides a beneficiation method for complex multi-metal sulfide electrum comprehensive recovery. According to the technical scheme, an efficient re-separation technology of Knelson concentrators is adopted according to the property and the characteristic of multi-metal sulfide electrum, and coarse gold particles are recovered in the early stage; through composite reagents of sodium sulfite, zinc sulfate and sodium silicate, slurry is highly dispersed, sphalerite and pyrite are inhibited intensively, and a novel collecting agent BK301 is adopted for synchronous flotation enrichment of gold, lead and copper minerals; copper sulfate is adopted for activation, and a fine separation technology is performed many times under high alkalinity (the pH of ore pulp ranges from 11 to 12), influences of slurry are effectively eliminated, and active separation on the sphalerite is achieved; for high-viscosity micro-fine particle cyanidation slag, the composite reagents of lime and zinc sulfate ...

Multifunctional figure bookcase

The invention discloses a multifunctional figure bookcase and belongs to book displaying cases. The multifunctional figure bookcase comprises a plurality of chambers used for placing books, a display platform used for displaying the books is arranged at the position close to the top of each chamber, each display platform comprises a display shelf and strip-type support frames horizontally fixed on the side walls of each chamber, each support frame is provided with a horizontal guide slot, support bolts used for supporting the support shelf are arranged at one end, located at the opening of each chamber, of the support frames, the support bolts are located in the lower sides of the corresponding guide slots, two sides at one end of each display shelf are provided with protrusions capable of extending into the guide slots and sliding along the guide slots while the other end of the same is provided with a support plate capable of preventing the books from slipping off. The multifunctional ...

Water sample separated radiation type collaborative sterilization method

The invention discloses a water sample separated radiation type collaborative sterilization method comprising the following steps: 1) under the gnotobasis environment, a millipore membrane of 0.45 mu m filters a water sample; 2) the filtered water sample is moved to a clean and transparent sterilized glass container to be radiated and sterilized by an ultraviolet lamp, wherein ultraviolet radiation intensity is 100-120 uw/cm2, and ultraviolet radiation time is 5-70 min; and 3) water sample sterilization effect is detected with a panel bacterial colony counting method, and the water quality difference of the water sample after sterilized and before sterilized is detected. The method of the invention is simple, easy to realize and effective; and sterilization effect is 100%, and the water quality of the water sample before sterilized and after sterilized basically keeps constant, i.e. the difference of the water quality of the water sample is less than 3%. The invention solves the technical ...

Method for sterilization in chlamydomonas reinhardtii culture process by mixture of tebuconazole and nalidixic acid

The invention belongs to methods for killing bacteria and fungi in chlamydomonas reinhardtii and discloses a method for sterilization in a chlamydomonas reinhardtii culture process by mixture of tebuconazole and nalidixic acid. The method includes: A, inoculating chlamydomonas contaminated by mixed bacteria onto a TAP solid medium plate, and culturing for 3-5 days at the temperature of 23+/-0.5 DEG C, in an occulting light period of 14/10 and under the light intensity of 8000Lx; C, transferring the chlamydomonas well grown on the TAP solid medium plate to a TAP plate with mixed antibacterial agents, and culturing for 5-8 days at the temperature of 23+/-0.5 DEG C, in the occulting light period of 14/10 and under the light intensity of 8000Lx; D, transferring the sterilized chlamydomonas to the common TAP solid medium plate, and culturing for 3-5 days at the temperature of 23+/-0.5 DEG C, in the occulting light period of 14/10 and under the light intensity of 8000Lx to achieve a standby for ...

Process and device for eliminating lead-acid storage battery polar column adhesive bubbles

The invention provides a process and device for eliminating lead-acid storage battery polar column adhesive bubbles. The process includes the following steps: firstly, the dropwise adding process of the conventional lead-acid storage battery polar column adhesive is carried out, the dropwise adding of the lead-acid storage battery polar column adhesive is confirmed to be finished, and adhesive amount is appropriate; secondly, a firearm device is opened and regulated, so that flame ejected by the sprayer of the firearm device is light blue; thirdly, the outer flame of the flame ejected by the sprayer of the firearm device is aligned to the battery polar column adhesive, and the sprayer is uniformly and fast swung, thus ensuring all the battery polar column adhesives to be baked; fourthly, the polar column adhesive is baked for three times every 5 minutes of standing; and fifthly, whether bubbles exist on the polar column adhesive is checked, the battery is pushed into a baking oven after ...

Soil conveying machine for fruit and vegetable planting

The utility model discloses a soil conveying machine for fruit and vegetable planting. Supporting legs are fixedly connected to the four corners of the bottom of the machine body, a sliding groove is formed in the bottom of the machine body, a sliding plate is slidably installed in the sliding groove, a shielding plate is fixedly connected to the bottom of the sliding plate, the top of the shielding plate makes contact with the bottom of the machine body, and a first spring is welded to one side of the sliding plate. One end of the first spring is welded to the inner wall of one side of the sliding groove, one side of the shielding plate is fixedly connected with one end of a guide rope, one side of the machine body is fixedly connected with an L-shaped plate, a vertical hole is formed in the top of the L-shaped plate, a vertical plate is slidably installed in the vertical hole, the bottom of the vertical plate is fixedly connected with a bottom plate, and the other end of the guide rope ...

Mobile wireless charging transmitting terminal

The invention discloses a mobile wireless charging transmitting terminal, which comprises a working circuit, a shell, a first track, a second track, a power module and a functional coil group, the power module comprises a metal plate and a transmitting coil; the first rail is arranged between the two second rails in a sliding manner; the power module is slidably arranged on the first track; the functional coil group comprises a plurality of functional coils; any two adjacent functional coils are overlapped, and the width of the overlapped area accounts for two thirds of the width of the functional coils; the functional coil extends along the directions of the first track and the second track; when movement is needed, at least three-phase alternating current with the phase difference of 120 degrees is input to the functional coil on the movement path. The electromagnetic field generated after the functional coil is powered on generates traction force, movement of the transmitting end is ...

Indanone and indazolone derivatives with antioxidant activity as well as synthesis method and application of indanone and indazolone derivatives

The invention relates to indanone and indazolone derivatives with antioxidant activity and a synthesis method and application thereof, and the synthesis method comprises the following synthesis steps: by taking nickel trifluoromethanesulfonate as a catalyst, 1, 3-bis (2, 6-diisopropyl phenyl) imidazole-2-ene (IPr) as a ligand, 1, 1, 3, 3-tetramethyldisiloxane as a hydrogen source, lithium tert-butoxide as an additive and 1, 4-dioxane as a solvent, carrying out a reaction at the temperature of 60-80 DEG C for 2-4 hours to obtain the indanone and indazolone derivatives with antioxidant activity. The method comprises the following steps: respectively carrying out intramolecular acyl reduction Heck cross-coupling on o-vinyl methyl benzoate and o-azo methyl benzoate derivatives, and characterizing the reduced Heck cross-coupling product by means of 1H NMR (nuclear magnetic resonance), 13C NMR (nuclear magnetic resonance), HRMS (high resolution mass spectrometry) and the like. A series of indanone ...

CDKN2B as marker for hypoxia detection and application of CDKN2B

The invention discloses CDKN2B serving as a marker for hypoxia detection and application of the CDKN2B. The CDKN2B can be obviously up-regulated through hypoxia for the first time, then mouse hypoxia experiments, human endothelial HUVEC cell hypoxia and DFO simulation hypoxia experiments verify that the expression quantities of the CDKN2B in mRNA levels and protein levels in hypoxic people and mice are increased, and it is prompted that the CDKN2B can be used as a marker for hypoxia detection.

Smelting method of material for low-burr floating seal ring

The invention discloses a smelting method of a material for a low-burr floating seal ring, and belongs to the technical field of floating oil seal machining, the smelting method comprises the following steps: S1, smelting scrap steel, pig iron and auxiliary materials into molten iron; s2, dissolving the molten iron, removing slag and deoxidizing to form dissolved molten iron; s3, metal titanium is added into the dissolved clear molten iron, and the metal titanium reacts with the boride till the metal titanium is not dissolved in the dissolved clear molten iron any more; s4, adding a rare earth alloy after the S3 is completed, and reacting the rare earth alloy with the boride to generate a rare earth boride; and S5, deslagging again to obtain the material for the floating seal ring. According to the technical scheme, burrs on the surface of the floating seal ring are eliminated, tension of an oil film attached to the floating seal ring is increased, and oil seal performance is improved.

Voltage stability analysis method and system based on multi-pendulum characteristics of voltage disturbed curve

The invention discloses a voltage stability analysis method and system based on the multi-pendulum characteristic of a voltage disturbed curve, and the method comprises the steps: a main server obtains a voltage disturbed curve of at least one node, and carries out the analysis of each voltage disturbed curve based on the multi-pendulum characteristic, the analysis time and the curve wavelet packet decomposition processing layer number corresponding to each voltage disturbed curve are determined; the main server establishes an analysis task corresponding to each node and issues the analysis task to at least one sub-server; for any sub-server, carrying out wavelet packet analysis on the voltage disturbed curve based on the analysis time and the number of layers of wavelet packet decomposition processing of the curve so as to obtain a wavelet decomposition coefficient of each layer corresponding to the voltage disturbed curve; for any sub-server, determining a characteristic value of each ...

Micro-grid and power distribution network collaborative planning method and device and storage medium

The invention discloses a micro-grid and power distribution network collaborative planning method and device and a storage medium, and the method comprises the steps: initializing power grid data, and setting an initial value of a penalty function multiplier and an initial value of the number of iterations; constructing a double-layer planning model of the micro-grid planning model and the power distribution network planning model, and determining an operation model of an upper-layer power distribution network main body and an operation model of a lower-layer micro-grid main body after decoupling; solving an initial energy transaction demand and a flexible resource transmission quantity of the micro-grid planning model, and transmitting the initial energy transaction demand and the flexible resource transmission quantity to an upper-layer power distribution network main body as virtual variable initial values; solving the operation model of the upper-layer power distribution network main ...

Optical fiber composite overhead ground wire

The invention belongs to the technical field of power cables, and particularly relates to an optical fiber composite overhead ground wire, which is provided with an optical unit and at least three aluminum-clad steel wires positioned outside the optical unit, and is characterized in that the optical unit consists of a loose tube and at least one optical communication component positioned in the loose tube; a spacing part is arranged between the optical unit and the aluminum-clad steel wires, the spacing part is formed by enclosing arc-shaped sections with the same number as the aluminum-clad steel wires, the openings of arc-shaped bays of the arc-shaped sections face outwards, the arc-shaped bays are spirally arranged around the axis of the spacing part, and the bottom of each arc-shaped section is provided with an extending part for separating the loose tube from the arc-shaped section. The outer wall of the loose tube is attached to the extending part, and the aluminum-clad steel wires ...

SOUND REDUCING WEDGE SHAPED POLYMER INTERLAYERS

The present invention is in the field of polymer interlayers and multiple layer glass panels comprising polymer interlayers, and, more specifically, the present invention is in the field of wedge shaped polymer interlayers. © KIPO & WIPO 2008 ...

Lead frame-based discrete power inductor

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BACTERIAL THIOREDOXIN REDUCTASE INHIBITORS AND METHODS FOR USE THEREOF

The mechanism of action of Ebselen differentiates between bacterial and mammalian thioredoxin reductase (TrxR). It displays fast oxidation of mammalian Trx and via the NADPH-TrxR catalyzed turnover of ebselen selenol with hydrogen peroxide, and therefore are mammalian antioxidants. Ebselen, and its diselenide, are strong competitive inhibitors of TrxR with Kof 0.14 μM and 0.46 μM, respectively. mutants lacking glutathione reductase or glutathione were much more sensitive to inhibition by ebselen. Since either glutaredoxin or thioredoxin systems are electron donors to ribonucleotide reductase, ebselen targets primarily glutathione and glutaredoxin-negative bacteria, a class which includes major pathogens. Ebselen, and similar compounds are therefore useful as antibacterial agents, even for multiresistant strains. Two major pathogenic bacteria, which previously had not been known to be sensitive to ebselen, (tuberculosis) and (stomach ulcer and cancer), were shown to be excellent targets. was also sensitive to ebsulfur. 2. The method according to claim 1 , wherein the prokaryotic infection comprises infection with a bacteria lacking glutathione.3. The method according to claim 1 , wherein the animal is a mammal claim 1 , and wherein the compound is a selective prokaryotic thioredoxin reductase inhibitor which does not substantially inhibit mammalian thioredoxin reductase claim 1 , administered in an effective amount.4Mycobacterium tuberculosis.. The method according to claim 1 , wherein the prokaryotic infection comprises5Helicobacter pylori.. The method according to claim 1 , wherein the prokaryotic infection comprises6. The method according to claim 1 , further comprising the step of determining a glutathione and glutathione reductase expression of the prokaryote causing the prokaryotic infection and the sensitivity of thioredoxin reductase to inhibition.7. A method of treating a mammal infected with a prokaryote claim 1 , comprising administering at least one ...

POLYMER INTERLAYERS HAVING IMPROVED OPTICAL PROPERTIES

An interlayer comprised of a thermoplastic resin, at least one high refractive index plasticizer and, optionally, a conventional plasticizer. The use of a thermoplastic resin, a high refractive index plasticizer, and, optionally, a conventional plasticizer reduces or minimizes the optical defects caused by different refractive indices without sacrificing other characteristics of the interlayer.

SEMICONDUCTOR PACKAGE HAVING HIGH MECHANICAL STRENGTH

A semiconductor wafer is singulated to form a plurality of semiconductor packages. The semiconductor wafer has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A semiconductor package has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A thickness of the rigid supporting layer is larger than a thickness of the semiconductor substrate. A thickness of the metal layer is thinner than the thickness of the semiconductor substrate. An entirety of the rigid supporting layer may be made of a single crystal silicon material or a poly-crystal silicon material. The single crystal silicon material or the poly-crystal silicon material may be fabricated from a reclaimed silicon wafer. An advantage of using a reclaimed silicon wafer is for a cost reduction.

Multiple layer interlayers having a gradient region

The present invention provides multiple layer interlayers that can be used in multiple layer glass panel type applications to reduce the amount of sound transmitted through the panel while also providing a colored region within a gradient region. The acoustic effect can be achieved by using two or more polymer sheets having differing compositions that have been combined into a single multiple layer interlayer, and the gradient region effect is achieved by forming a colored region in one or more gradient regions of the individual layers.

Method for producing wheat glutamine peptide

The present invention discloses a method for producing wheat glutamine peptide using wheat gluten powder as raw material, belonging to the fields of food and biotechnology. The method includes the steps of: performing enzymolysis in two steps using Alcalase and papain with the wheat gluten powder as raw material, to obtain the wheat glutamine peptide with components with molecular weight of less than 1000 Da being more than 90%, characteristic glutamine peptide segment glutamine-arginine-glutamine (Gln-Arg-Gln, QRQ) content being more than 2.0% and glutamine content being up to 23.54% by treating the enzymatic hydrolysate by centrifugation, ultrafiltration, concentration, spray drying, etc. The produced glutamine peptide can be used as functional nutrition composition ingredient in the development and production of ordinary foods, health foods and medicines.

Methods of and apparatus for programming and managing diverse network components, including electronic-ink based display devices, in a mesh-type wireless communication network

A wireless communication network for programming and monitoring a plurality of network-managed devices, including electronic-ink based display devices, comprising a network management computer system, a network gateway device, one or more wireless network routers, a plurality of network-managed devices, and a network coordinator. The wireless communication network of the present invention bridges the gap between wireless display networks, wireless sensor networks, and the worlds of passive, active and partially-active RFID and real-time locating systems. The wireless communication network of the present invention allows conventional communication network protocols to operate in more flexible ways in dynamic, diverse, and heterogeneous application environments, in fields including retail, healthcare, transport, logistics, manufacturing, education, etc. At the same time, the wireless communication network of the present invention is preferably based on the IEEE 802.15.4 network layer standard ...

SEMICONDUCTOR ENCAPSULATION AND METHOD THEREOF

A semiconductor encapsulation comprises a lead frame further comprising a chip carrier and a plurality of pins in adjacent to the chip carrier. A plurality of grooves opened from an upper surface of the chip carrier partially dividing the chip carrier into a plurality of chip mounting areas. A bottom portion of the grooves is removed for completely isolate each chip mounting area, wherein a width of the bottom portion of the grooves removed is smaller than a width of the grooves. In one embodiment, a groove is located between the chip carrier and the pins with a bottom portion of the groove removed for isolate the pins from the chip carrier, wherein a width of the bottom of the grooves removed is smaller than a width of the grooves. 1. A metal clip semiconductor encapsulation comprises:a lead frame comprising a chip carrier and a plurality of pins in adjacent to the chip carrier; an upper surface of the chip carrier being provided with a first groove dividing the chip carrier into a first chip mounting area and a second chip mounting area;a first semiconductor chip having a plurality of top electrodes disposed on the first chip mounting area through a first adhesive, wherein an excessive amount of the first adhesive accumulated at a bottom corner of the first groove near the first chip mounting area;a second semiconductor chip having a bottom electrode and a plurality of top electrodes disposed on the second chip mounting area, with its bottom electrode mounted onto the second chip mounting area through a second adhesive;a first metal clip having a first end and a second end, wherein the first end of the first metal clip connecting to a top electrode of the first semiconductor chip, wherein the second end of the first metal clip disposed inside the first groove; anda plastic package for at least partially encapsulating the chip carrier, the pins, the first and second semiconductor chips and the first metal clip.2. The metal clip semiconductor encapsulation of ...

TOUCH-CONTROLLED SYSTEM AND METHOD

A touch-controlled system and a touch-controlled method are provided. The touch-controlled system includes a screen, a host, and an electronic pen. The screen is used to display an image with hidden coding. The host is used to drive the screen for displaying. When the electronic touches the screen, the electronic pen captures a part of the image of the screen and sends captured image to the host. At least one hidden information in the captured image. The host analyses and decodes the hidden information, to get a cursor position where the electronic pen touches, and the cursor position is displayed on the screen. 1. A touch-controlled system , comprising:a screen, arranged for displaying an image with hidden coding;a host, coupled to the screen, arranged for driving the screen to display the image; andan electric pen, wherein when the electronic pen touches the screen, the electronic pen captures a part of the image on the screen and sends the captured image to the host,wherein at least one hidden information is hidden in the image captured by the electronic pen, the host is arranged for analysing and decoding the hidden information of the captured image to obtain a cursor position where the electronic pen touches, so as to display the cursor position on the screen.2. The touch-controlled system as claimed in claim 1 , wherein the electronic pen transmits the hidden information through radio frequency claim 1 , universal serial bus claim 1 , or blue-tooth.3. The touch-controlled system as claimed in claim 1 , wherein before the host drives the screen claim 1 , a coding pattern or a digital watermark is embedded to the image to be displayed; and the host analyses the coding pattern or the digital watermark of the captured image claim 1 , and performs decoding according to the coding pattern or the digital watermark claim 1 , so as to obtain coordinates of the cursor position.4. The touch-controlled system as claimed in claim 1 , wherein before the host drives the ...

MANAGING COPIES OF DATA

A method in a computer system for retrieving data from one of multiple copies of the data is provided, referred to as the data management system. The data management system receives a request identifying data object to be accessed. Then, the data management system queries a metabase to locate data copies that contain the identified data object, wherein the data copies are created from similar source data, and wherein for each data copy the metabase contains an indication of the availability of the copy relative to other copies. Next, the data management system determines one of the located data copies to use to access the identified data object, wherein the determination is made based on the indicated availability contained in the metabase for each of the located data copies. Then, the data management system accesses the identified data object using the determined one of the located data copies. 1. A method in a computer system for accessing data stored in multiple copies , the method comprising:displaying a web-based user interface configured to receive a request identifying at least one data object to be accessed;receiving through the web-based user interface a request identifying at least one data object to be accessed; wherein the multiple data copies include primary copies and secondary copies,', 'wherein the secondary copies include at least one backup copy, and', 'wherein the querying includes accessing a database of metadata to determine which of the multiple data copies contain the requested data without accessing the computer systems where the primary copy is stored; and, 'querying an index to locate one or more data copies from multiple data copies that contain the identified at least one data object,'} 'wherein a user can access the one or more data copies by selecting a desired copy from the displayed list.', 'displaying a list of results comprising data copies located by the query that satisfy the request,'}2. The method of wherein the displayed list ...

Touch device input device and operation method of the same

A touch device operation method is provided. The touch device input method comprises the steps as follows. A display frame is provided on the touch display module of the touch device, wherein the display frame comprises a software keyboard having virtual keys. A touch input on the touch display module is detected. The touch input is determined to correspond to a triggered key of one of the virtual keys. An amount of characters that the triggered key has is determined. When the amount of characters is not larger than one, the character is displayed on the display frame. When the amount of characters is larger than one, the virtual keys are updated to output under-selection characters in a neighboring area of the triggered key. A displacement of the touch input is detected to select one of the virtual keys. A touch device is disclosed herein as well.

METHOD OF MAKING A COPPER WIRE BOND PACKAGE

A method for making a wire bond package comprising the step of providing a lead frame array comprising a plurality of lead frame units therein, each lead frame unit comprises a first die pad and a second die pad each having a plurality of tie bars connected to the lead frame array, a plurality of reinforced bars interconnecting the first and second die pads; the reinforced bars are removed after molding compound encapsulation. 1. A method for making a wire bond package comprising the following steps:Step 1: providing a lead frame array comprising a plurality of lead frame units therein, wherein each lead frame unit comprises a first die pad and a second die pad each having a plurality of tie bars connected to the lead frame array, and a plurality of reinforced bars extending from the first die pad to the second die pad;Step 2: mounting a first and a second semiconductor chip onto the first and second die pads, respectively; electrically connecting a plurality of electrodes on the first and second semiconductor chips via wire bonding to a plurality of leads along the first and second die pads;Step 3: encapsulating the lead frame unit, the chips and the bond wires with a body of molding compound, the body of molding compound filling a space above a top surface of the reinforced bars between the first die pad and the second die pad, at least a bottom of the plurality of reinforced bars being exposed through a bottom of the body of molding compound;Step 4: disconnecting the first and second die pads by removing at least a portion of the reinforced bars from the bottom of the body of molding compound die pad thus electrically isolating the first and second die pads.2. The method for making a wire bond package of claim 1 , wherein the step of wire bonding in Step 2 further comprising electrically connecting the plurality of electrodes on the first and second semiconductor chips to the plurality of leads around the first and second die pads via copper (Cu) wire bonding.3. ...

Structure of Mixed Semiconductor Encapsulation Structure with Multiple Chips and Capacitors

A semiconductor package for power converter application comprises a low-side MOSFET chip and a high-side MOSFET chip stacking one over the other. The semiconductor package may further enclose a capacitor whereas the capacitor may be a discrete component or an integrated component on chip level with the low-side MOSFET. The semiconductor package may further comprise a PIC chip to provide a complete power converter on semiconductor chip assembly package level. 1. A semiconductor package for power converter application comprises:a lead frame with a die pad and a plurality of pins separated from the die pad without electrical connection;a high-side MOSFET chip and a low-side MOSFET chip each having a bottom drain electrode, a top gate and a top source electrode respectively, whereasthe low-side MOSFET chip is bonded onto the die pad with the bottom drain electrode electrically connected to the die pad;the high-side MOSFET chip is stack on the low-side MOSFET chip with the bottom drain electrode of high-side MOSFET chip stacking above but insulated from the top source electrode of low-side MOSFET chip.2. The semiconductor package of further comprises:a capacitor sandwiched between the low-side MOSFET chip and the high-side MOSFET chip.3. The semiconductor package of further comprises:A dielectric layer disposed on top of the source electrode of low-side MOSFET chip insulating the drain electrode of high-side MOSFET chip from the source electrode of low-side MOSFET chip, whereas the low-side source electrode, the dielectric layer and the high-side drain electrode constitutes a capacitor.4. The semiconductor package of further comprises:A dielectric layer disposed on top of the source electrode of low-side MOSFET chip, a first metal layer disposed over the dielectric layer, whereas the low-side source electrode, the dielectric layer and the first metal layer constitute a capacitor.5. The semiconductor package of wherein:The first metal layer has an area smaller than the ...

PACKAGE STRUCTURE FOR DC-DC CONVERTER

A package structure for DC-DC converter disclosed herein can reduce the number of encapsulated elements as a low-side MOSFET chip can be stacked above the high-side MOSFET chip of a first die pad, through die pads of different thicknesses or interposers with joint parts of different thicknesses; moreover, it further reduces the size of the entire semiconductor package as a number of bond wires are contained in the space between the controller and the low-side MOSFET chip. Moreover, electrical connection between the top source electrode pin and the bottom source electrode pin of the low-side MOSFET chip is realized with a metal joint plate, such that when the DC-DC converter is sealed with plastic, the metal joint plate can be exposed outside to improve the thermal performance and effectively reduce the thickness of the semiconductor package. 1. A package structure for DC-DC converter , comprising:{'b': 21', '22, 'a high-side MOSFET chip () and a low-side MOSFET chip () respectively having a bottom drain electrode, a top gate electrode and a top source electrode;'}{'b': 11', '12', '21', '11', '11, 'a lead frame having a first die pad () and a second die pad (), the first die pad having a first portion and a second portion wherein said high-side MOSFET chip () being disposed on the first portion of the first die pad () with its bottom drain electrode electrically connected with the first die pad ();'}{'b': 40', '11', '21, 'a controller () disposed on the second portion of the first die pad () and being electrically connected with the top gate electrode of the high-side MOSFET chip (); and'}{'b': 30', '12', '21', '211', '21', '30', '40, 'a conductive interposer () disposed on top of the second die pad () and at least a portion of the high-side MOSFET chip () and being electrically connected with the top source electrode () of the high-side MOSFET chip (), wherein said interposer () does not cover the controller ();'}{'b': 22', '30', '40', '211', '21, 'wherein the low- ...

PREPARATION OF AN OPTICAL PH SENSOR BASED ON FLUORESCEIN AND 1-HEPTANESULFONIC ACID SODIUM CO-INTERCALATED LAYERED DOUBLE HYDROXIDE

This invention relates to the field of preparation technology of optical pH sensor by co-intercalated fluorescein and 1-heptanesulfonic acid sodium into layered double hydroxide. The sensor is composed by conductive materials and the surface LDH films by co-interacted FLU and HES. The synthesis method is: first: synthesis of LDH colloid suspension, subsequently, the FLU and HES co-intercalated LDH colloid solution was prepared following the ion-exchange method, then the thin film of FLU-HES/LDH was spreaded on the surface of the conductive material by electrophoretic deposition, and the oriental pH sensor was synthesized. The advantages of the present invention is: first, the LDH matrix provides chromophore molecules with a confined and stable environment; the novel electrophoretic deposition strategy in this work provides a method for precise control of thickness (ranging from nanometers to micrometers), and the oriental pH sensor show good pH responsive. 1. An optical pH sensor based on fluorescein and 1-heptanesulfonic acid sodium co-intercalated layered double hydroxide , wherein: the sensor is composed by conductive materials and the surface plated by fluorescein and 1-heptanesulfonic acid sodium co-intercalated layered double hydroxide.The composition of the fluorescein and 1-heptanesulfonic acid sodium co-intercalated layered double hydroxide is:{'sub': 1', 'x', '2', '1−x', 'y', 'x', '2', '2, '(M)(M)(FLU)(HES)(OH)·mHO,'}{'sup': −5', '−2, 'sub': '2', 'x=0.5-0.8, 10≦y/z≦10, is the interlayer HO, and m=0.3-1.5.'}HES is 1-heptanesulfonic acid sodium; FLU is fluorescein.2. A method of preparing an optical pH sensor based on fluorescein and 1-heptanesulfonic acid sodium co-intercalated layered double hydroxide , wherein , the detailed processes are as follows:{'sub': 1', '2', '1', '2', '1', '3', '2, 'a. Soluble M, Mmetal salt with molar ratio of M/M=1˜3 is dissolved in deionized water to form a mixed salt solution with [M]=0.01˜1.6 mol/L; A water solution of NH·HO ...

SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEAD FRAME AND CHIP, AND ITS MANUFACTURING METHOD

This invention discloses a semiconductor package with adhesive material pre-printed on the lead frame and chip, and the manufacturing method. The adhesive material is applied onto the chip carrier and the pin of the lead frame and also on the front electrode of the semiconductor chip via pre-printing. The back of the semiconductor chip is adhered on the chip carrier, and the front electrode of the semiconductor chip and the pin are connected respectively with a metal connector. The size, shape and thickness of the adhesive material are applied according to different application requirements according to size and shapes of the contact zone of the semiconductor chip and the metal connector. Particularly, the adhesive zones are formed by pre-printing the adhesive material thus significantly enhance the quality and performance of semiconductor products, and improves the productivity. 1. A method for manufacturing a semiconductor package comprising:pre-printing a first adhesive material onto a plurality of front electrodes and a back electrode of a semiconductor chip disposed on a wafer at room temperature followed by pre-curing the adhesive material at a first temperature then dicing the wafer into a plurality of semiconductor chips;pre-printing a second adhesive material on a plurality of adhesive zones including a chip carrier and pins on a lead frame at room temperature followed by curing the adhesive material at a second high temperature;applying a third high temperature for adhering the back electrode of the semiconductor chip to the chip carrier of the lead frame;providing metal connector plates and applying a fourth high temperature for adhering the metal connector plates to the front electrodes and the pins on the leadframe; andapplying a molding material to encapsulate the semiconductor chip and at least portions of the lead frame and the metal connections plates.2. The method for manufacturing a semiconductor package of wherein:the steps of applying the first ...

DATA MINING SYSTEMS AND METHODS FOR HETEROGENEOUS DATA SOURCES

Systems and methods integrate disparate backup devices with a unified interface. In certain examples, a management console manages data from various backup devices, while retaining such data in its native format. The management console can display a hierarchical view the client devices and/or their data and can further provide utilities for processing the various data formats. A data structure including fields for storing both metadata common to the client device data and value-added metadata can be used to mine or process the data of the disparate client devices. The unified single platform and interface reduces the need for multiple data management products and/or customized data utilities for each individual client device and provides a single pane of glass view into data management operations. Integrating the various types of storage formats and media allows a user to retain existing storage infrastructures and further facilitates scaling to meet long-term management needs. 1displaying with a management console information regarding backup data stored in a plurality of heterogeneous client devices, wherein the backup data of each client device is stored in a different backup format, and wherein the management console integrates a plurality of utilities for performing a plurality of data management operations on the backup data of the plurality of heterogeneous client devices, wherein the management console further provides a single interface for the plurality of utilities;selecting a first data management operation of the plurality of data management operations to be performed by at least one of the plurality of utilities in response to user input;selecting backup data from at least one of the plurality of heterogeneous client devices in response to user input; andperforming the first data management operation on the selected backup data of the at least one client device in response to said selecting the first data management operation and said selecting the ...

WAFER LEVEL PACKAGE STRUCTURE AND THE FABRICATION METHOD THEREOF

The present invention relates to a package for semiconductor device and the fabrication method for integrally encapsulating a whole semiconductor chip within a molding compound. In the semicondcutor device package, bonding pads distributed on the top of the chip are redistributed into an array of redistributed bonding pads located in an dielectric layer by utilizing the redistribution technique. The electrodes or signal terminals on the top of the semiconductor chip are connected to an electrode metal segment on the bottom of the chip by conductive materials filled in through holes formed in a silicon substrate of a semiconductor wafer. Furthermore, the top molding portion and the bottom molding portion seal the semiconductor chip completely, thus providing optimum mechanical and electrical protections. 1. A wafer level chip scale package method comprises the following steps:providing a wafer comprising a plurality of semiconductor chips;forming a plurality of solder bumps on a front side of the wafer electrically connected to a plurality of bonding pads of the semiconductor chips;casting a first molding material on the front side of the wafer such that the front side of the wafer and the solder bumps are covered by a first molding layer;grinding a backside opposite to the front side of the wafer;cutting through the wafer from its backside after grinding to form cutting grooves separating each semiconductor chip, and the cutting grooves extending to a depth in the first molding layer;casting a second molding material on the backside of the wafer to form a second molding layer covering the backside of the thinned wafer and at the same time filling in the cutting grooves;grinding the first molding layer to expose a top surface of the solder bumps;cutting along the cutting grooves to separate the semiconductor chips, the first and second molding layers covering the front side, the backside and sidewalls of the separated chips.2. The method of claim 1 , wherein the ...

Mir-150 for the treatment of blood disorders

The invention provides methods of treating certain blood related disorders, in particular, thrombocytopenia and anemia comprising increasing miR-150 expression or inhibiting miR-150 in progenitor cells respectively.

METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE

The invention relates to a power semiconductor device and its preparation methods thereof. Particularly, the invention aims at providing a method for reducing substrate contribution to the Rdson (drain-source on resistance) of power MOSFETs, and a power MOSFET device made by the method. By forming one or more bottom grooves at the bottom of Si substrate, the on resistance of the power MOSFET device attributed to the substrate is effectively reduced. A matching lead frame base complementary to the substrate with bottom grooves further improves the package of the power MOSFET device. 1. A method for making a low-Rdson vertical power MOSFET device in an epitaxial layer of a first conductivity type supported on a substrate with a bottom of the epitaxial layer configured as a bottom electrode of the vertical power MOSFET device comprises the following steps:depositing a bottom passivation layer covering a bottom surface of the substrate;forming a plurality of openings in the bottom passivation layer;etching the substrate through the openings on the bottom passivation layer forming a plurality of grooves penetrating the substrate exposing portions of the bottom surface of the epitaxial layer;implanting dopant of the first conductivity type from the bottom of the substrate forming a plurality of heavily doped regions at the exposed portions of the bottom of the epitaxial layer corresponding to the grooves; anddepositing a metal layer covering the bottom surface of the substrate and sidewalls of the grooves and the exposed portions of the bottom surface of the epitaxial layerwherein, the metal layer forming a bottom metal electrode of the vertical power MOSFET.2. The method according to wherein both the substrate and the epitaxial layer being lightly doped.3. The method according to wherein the step of etching the substrate being realized by using wet etching or deep reaction doping etching.4. The method according to wherein an etchant used for wet etching on the substrate ...

SYSTEMS AND METHODS FOR SEGMENTATION OF RADIOPAQUE STRUCTURES IN IMAGES

A method of determining a model of a marker includes obtaining projection images, each of the projection images having an image of a marker that indicates a shape of the marker, determining binary images of the marker for respective ones of the projection images, and constructing a three-dimensional model of the marker using the binary images, the three-dimensional model comprising a set of voxels in a three-dimensional space that collectively indicates a three-dimensional shape of the marker, wherein the act of constructing the three-dimensional model is performed using a processing unit. 1. A method of determining a model of a marker , comprising:obtaining projection images, each of the projection images having an image of a marker that indicates a shape of the marker;determining binary images of the marker for respective ones of the projection images; andconstructing a three-dimensional model of the marker using the binary images, the three-dimensional model comprising a set of voxels in a three-dimensional space that collectively indicates a three-dimensional shape of the marker, wherein the act of constructing the three-dimensional model is performed using a processing unit.2. The method of claim 1 , wherein the set of voxels for the three-dimensional model of the marker comprises a first voxel and a second voxel claim 1 , wherein the first voxel has a first value associated therewith to indicate a first degree of certainty that the first voxel belongs to the three-dimensional model claim 1 , and the second voxel has a second value associated therewith to indicate a second degree of certainty that the second voxel belongs to the three-dimensional model claim 1 , the first value and the second value being different.3. The method of claim 1 , wherein the act of obtaining the projection images comprises:receiving a set of reference images; andselecting a subset of the reference images as the projection images;wherein two of the reference images in the selected ...

METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRESSION IN WAFER LEVEL PACKAGING PROCESS

The invention generally relates to a packaging method of an ultra-thin chip, more specifically, the invention relates to a method for packaging the ultra-thin chip with solder ball thermo-compression in wafer level packaging process. The method starts with disposing solder balls on metal pads arranged on the front surface of semiconductor chips that are formed at the front surface of a semiconductor wafer. The solder balls are soften by heating the wafer, a compression plate is applied with a pressure on the top ends of the solder balls thus forming a co-planar top surface at the top ends of the solder balls. A molding compound is deposited on the front surface of the wafer with the top ends of the solder balls exposed. The wafer is then ground from its back surface to reduce its thickness to achieve ultra-thin chip. 1. A method for packaging an ultra-thin chip with solder ball thermo-compression in wafer level packaging process , comprising:depositing multiple solder balls correspondingly on multiple metal pads arranged on a front surface of semiconductor chips formed on a front surface of a semiconductor wafer and spaced apart from each other by a scribe line;heating the semiconductor wafer to soften the solder balls;placing a compression plate above or on the top ends of the solder balls and moving the compression plate towards the top surface of the wafer, ensuring that the surface of the compression plate adjacent to the top surface of the wafer is kept in parallel to the top surface of the wafer during the entire compression process, forming a co-planar top flat surface of the top ends of the solder balls;forming a molding layer covering on the front surface of the semiconductor wafer and surrounding the sidewall of the solder balls with the top surface of the solder balls exposed from the molding layer;grinding the back surface of the semiconductor wafer to reduce its thickness; andcutting the semiconductor wafer and the molding layer at the scribe line to ...

SYSTEM AND METHOD OF READING AND WRITING OPERATING PARAMETERS AND DATA FOR A CONTROL DEVICE

The present disclosure provides a system for reading and writing operating parameters and real-time data for a control device. The system includes a power source, and a read/write device powered by the power source, the read/write device configured to conduct modulation of the power supply voltage based on a predetermined encoding mode. The system also includes a control device powered by the read/write device, wherein operating parameters and data information are exchanged between the control device and the read/write device, and the control device is configured to conduct demodulation of an output voltage transmitted by the read/write device. The system further includes power lines electrically connecting the power source to the read/write device and the read/write device to the control device. 1. A system for reading and writing operating parameters and real-time data for a control device , the system comprising:a power source;a read/write device powered by the power source, the read/write device configured to conduct modulation of the power supply voltage based on a predetermined encoding mode;a control device powered by the read/write device, wherein operating parameters and data information are exchanged between the control device and the read/write device, and the control device is configured to conduct demodulation of an output voltage transmitted by the read/write device; andpower lines electrically connecting the power source to the read/write device and the read/write device to the control device.2. The system of claim 1 , further comprising memory installed in the control device claim 1 , the memory used to store data related to the operating parameters.3. The system of claim 2 , wherein the memory is non-volatile memory.4. The system of claim 1 , wherein the read/write device comprises a voltage modulation component and a current sampling and testing component claim 1 , the voltage modulation component configured to provide the output voltage to the ...

COMBINED STREAM AUXILIARY COPY SYSTEM AND METHOD

A system and method for transferring data in a library storage system. The library storage system comprises a management server including a storage policy. A media agent is connected to the management server. A plurality of storage media and a data source are connected to the media agent. The data source is divided into at least a first and a second portion of data. The portions of data are transferred from the data source to a first and second primary storage medium using a first and a second data stream respectively. The media agent then causes the first and second portion of data to be transferred from the first and second storage medium to a third auxiliary storage medium using a third combined data stream. Auxiliary copying is performed in chunks and multiple streams are copied in parallel. 112.-. (canceled)13. A system for transferring data in a multi-tiered storage system , the system comprising:a data source;a media agent comprising one or more hardware processors and which is communication with the data source;a first storage medium, a second storage medium, and a third storage medium, wherein at least the first storage medium and the second storage medium are connected to the media agent, wherein the data in the data source is divided into at least a first portion of data and a second portion of data, the data comprising multiple file types, and wherein transfer the first and second portions of data from the data source to the first storage medium and the second storage medium using a first data stream and a second data stream respectively to create a first backup copy of the data stored in the data source;', 'identify the multiple file types of data in the first and second portions of data;', 'determine based at least upon the file types if the first portion of data and the second portion of data in the first backup copy can be combined;', transferring the first and second portions of the first backup copy of the data from the first and second storage ...

Packaging method of molded wafer level chip scale package (wlcsp)

A WLCSP method comprises: depositing a metal bump on bonding pads of chips; forming a first packaging layer at front surface of wafer to cover metal bumps while forming an un-covered ring at the edge of wafer to expose the ends of each scribe line located between two adjacent chips; thinning first packaging layer to expose metal bumps; forming a groove on front surface of first packaging layer along each scribe line by cutting along a straight line extended by two ends of scribe line exposed on front surface of un-covered ring; grinding back surface of wafer to form a recessed space and a support ring at the edge of the wafer; depositing a metal layer at bottom surface of wafer in recessed space; cutting off the edge portion of wafer; and separating individual chips from wafer by cutting through first packaging layer, the wafer and metal layer along groove.

ALUMINUM ALLOY LEAD-FRAME AND ITS USE IN FABRICATION OF POWER SEMICONDUCTOR PACKAGE

A semiconductor package is provided with an Aluminum alloy lead-frame without noble metal plated on the Aluminum base lead-frame. Aluminum alloy material with proper alloy composition and ratio for making an aluminum alloy lead-frame is provided. The aluminum alloy lead-frame is electroplated with a first metal electroplating layer, a second electroplating layer and a third electroplating layer in a sequence. The lead-frame electroplated with the first, second and third metal electroplating layers is then used in the fabrication process of a power semiconductor package including chip connecting, wire bonding, and plastic molding. After the molding process, the area of the lead-frame not covered by the molding compound is electroplated with a fourth metal electroplating layer that is not easy to be oxidized when exposing to air. 1. A method for preparing a power semiconductor package using an aluminum alloy lead-frame comprising a plurality of chip mounting areas and a plurality of pins arranged along a periphery of the chip mounting areas , the method comprising the steps of:electroplating a first metal electroplating layer, a second metal electroplating layer and a third metal electroplating layer on the surface of the lead-frame in sequence;attaching a semiconductor chip at a top surface of the chip mounting area, and electrically connecting a plurality of electrodes arranged at a front surface of the semiconductor chip to corresponding pin connecting areas in different pins through a plurality of bonding wires;depositing a molding compound to encapsulate a portion of the top surface of the chip mounting area as well as the semiconductor chip, the bonding wires and the pin connecting area; andelectroplating a fourth metal electroplating layer on the third metal electroplating layer at an external portion of each pin extending outside of the molding compound.2. The method of claim 1 , wherein the first metal electroplating layer claim 1 , the second metal ...

Intrusion Resistant Glass Laminates

Composite laminate interlayers for adhering a glass laminate comprising a sheet of polyethylene terephthalate (PET) between layers of plasticized polyvinyl butyral (PVB) adhesive layers, wherein at least one of the PVB adhesive layers is stiffened, e.g. by reduction in the amount of plasticizer, and has a glass transition temperature greater than 35° C. The PET is preferably 0.075 to 0.25 mm (3-10 mils) thick and can have a functional coating for reducing radiation, e.g. UV or IR or visible light, transmission through the glass laminate. The laminate can also comprise at least one elastomeric layer adapted to reducing sound transmission through the glass laminate. The laminates exhibit enhanced maximum flexural modulus of greater than about 350 Newtons/centimeter. 1. A composite laminate interlayer consisting essentially of a sheet of polyethylene terephthalate between two layers of plasticized polyvinyl butyral adhesive , wherein each of said plasticized polyvinyl butyral have a thickness in the range of 0.25 to 2 millimeters (10-80 mils) and wherein at least one of said polyvinyl butyral adhesive layers has a glass transition temperature greater than 35° C. , a maximum flexural modulus of at least 350 Newtons/centimeter , and a tensile modulus at 25° C. of greater than about 10Pa.2. An interlayer according to wherein said plasticized polyvinyl butyral adhesive layers are of different thickness.3. An interlayer according to wherein said sheet of polyethylene terephthalate has a thickness greater than 0.075 millimeters (3 mils).4. An interlayer according to wherein said sheet of polyethylene terephthalate has a thickness greater than 0.1 millimeters (4 mils).5. An interlayer according to wherein said sheet of polyethylene terephthalate has a functional coating for reducing radiation transmission.6. A composite laminate interlayer consisting essentially of a layer of polyethylene terephthalate between two layers of plasticized polyvinyl butyral adhesive layers claim ...

SOLUTION-BASED METHODS FOR RNA EXPRESSION PROFILING

The present invention is directed to novel high-throughput, low-cost, and flexible solution-based methods for RNA expression profiling, including expression of microRNAs and mRNAs. 1. A solution-based method for determining the expression level of a population of target nucleic acids , comprising:a) providing in solution a population of target-specific bead sets, wherein each target-specific bead set is individually detectable and comprises a capture probe which corresponds to an individual target nucleic acid referred to as an individual bead set;b) hybridizing in solution the population of target-specific bead sets with a population of molecules that can contain a population of detectable target molecules, wherein each target nucleic acid has been transformed into a corresponding detectable target molecule which will specifically bind to its corresponding individual target-specific bead set; andc) screening in solution for detectable target molecules hybridized to target-specific beads to determine the expression level of the population of target nucleic acids.2. The method of claim 1 , wherein the population of target-specific bead sets comprises at least 5 individual bead sets that can bind with a corresponding set of target nucleic acids.3. The method of claim 1 , wherein the population of target-specific beads comprises at least 100 individual bead sets that can bind with a corresponding set of target nucleic acids.4. The method of claim 1 , wherein the population of target nucleic acids is a population of mRNAs.5. The method of claim 1 , wherein the population of target nucleic acids is a population of mRNAs and wherein each mRNA has been transformed into a corresponding detectable target molecule by a process comprising:a) reverse transcribing the mRNA target nucleic acid to generate a cDNA;b) contacting the cDNA with an upstream probe and a downstream probe, wherein the upstream probe comprises a universal upstream sequence and an upstream target-specific ...

Li-air batteries having ether-based electrolytes

A lithium-air battery includes a cathode including a porous active carbon material, a separator, an anode including lithium, and an electrolyte including a lithium salt and polyalkylene glycol ether, where the porous active carbon material is free of a metal-based catalyst.

DEFECT RESISTING ACOUSTIC POLYMER INTERLAYERS

This disclosure is related to the field of polymer interlayers for multiple layer glass panels and multiple layer glass panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of polymer interlayers comprising multiple thermoplastic layers which resist the formation of optical defects. 1. A polymer interlayer comprising:a first polymer layer comprising plasticized poly(vinyl butyral) having a molecular weight less than 140,000 Daltons;a second polymer layer comprising plasticized poly(vinyl butyral) having a molecular weight greater than 140,000 Daltons;a third polymer layer comprising plasticized poly(vinyl butyral) having a molecular weight less than 140,000 Daltons;wherein said second polymer layer is disposed between said first polymer layer and said third polymer layer, thereby resulting in a polymer interlayer having two skin layers and a core layer.2. The polymer interlayer of wherein said first polymer layer and/or said third polymer layer has a molecular weight less than 130 claim 1 ,000 Daltons.3. The polymer interlayer of wherein said first polymer layer and/or said third polymer layer has a molecular weight less than 120 claim 1 ,000 Daltons.4. The polymer interlayer of wherein said first polymer layer and/or said third polymer layer has a molecular weight less than 110 claim 1 ,000 Daltons.5. The polymer interlayer of wherein said first polymer layer and/or said third polymer layer has a flow in the range of about 0.19 mm to about 0.37 mm as measured by DF135.6. The polymer interlayer of wherein said first polymer layer and/or said third polymer layer has an embossed post heat surface roughness claim 1 , Rz claim 1 , ranging from about 25 to about 55 microns.7. The polymer interlayer of wherein said first polymer layer and/or said third polymer layer has a stress relaxation modulus claim 5 , G′(t) claim 5 , of less than about 100 Pascals.8. The polymer interlayer of wherein said first polymer layer and/ ...

HIGH RIGITY INTERLAYERS AND LIGHT WEIGHT LAMINATED MULTIPLE LAYER PANELS

This disclosure is related to the field of polymer interlayers for multiple layer panels and multiple layer panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of high rigidity interlayers and light weight laminated multiple layer panels incorporating high rigidity interlayers. 1. A multi-layer glass panel comprising:a first glass substrate;a second glass substrate;a polymer layer disposed between said first and second glass substrate; wherein said polymer layer has a glass transition temperature of greater than 33° C.; wherein the combined thickness of said first glass substrate and said second glass substrate is less than or equal to about 4.0 mm.2. The multi-layer glass panel of where said polymer interlayer comprises poly(vinyl butyral).3. The multi-layer glass panel of wherein the combined thickness of said first glass substrate and said second glass substrate is less than or equal to about 3.9 mm.4. The multi-layer glass panel of wherein the thickness of said second glass substrate is less than the thickness of said first glass substrate.5. The multi-layer glass panel of wherein the combined thickness of said first glass substrate and said second glass substrate is less than or equal to about 3.7 mm.6. The multi-layer glass panel of wherein said multi-layer glass panel has a deflection stiffness of greater than 300 N/cm when the combined thickness of the first glass substrate and the second glass substrate is less than or equal to 4.0 mm. 77. The multi-layer glass panel of wherein said multi-layer glass panel has a deflection stiffness that is at least 10 percent higher than the deflection stiffness of a multiple layer panel of the same thickness and glass configuration without a polymer layer having a glass transition temperature of greater than 33° C.8. A multi-layer glass panel comprising:a first glass substrate;a second glass substrate;a multilayer interlayer comprising a first polymer layer and a ...

Wireless network device

Various wireless network components offer increased flexibility, ease of use, functionality and performance in many demanding applications in diverse fields of use. In particular, a wireless multi-function network device for use on a wireless communication network can serve multiple functions and dynamically switch and reconfigure from a network router into a network coordinator in the event that the originally designated network coordinator is permanently or temporally disabled.

THICK CLEANING COMPOSITION

A thick cleaning composition, comprising a long-chain fatty acyl acidic amino acid ester; a fatty compound of fatty acid, fatty alcohol, fatty alcohol ether or polyol fatty acid ester; a surfactant; a solvent composed of water, lower alcohol, polyol and polyol ether; and further comprising a beautifying and cleaning adjuvant for skin, eyes, teeth and hair. The cleaning composition can achieve satisfactory thick appearance when used for cleaning skin and hair, and maintain stable viscosity at different temperatures. In use, the composition can be easily daubed, and foams quickly with good foaming quality. 1. A thick cleaning composition , the thick cleaning composition comprising the following components (a) , (b) , (c) and (d):a component (a): one or more long-chain fatty acyl acidic amino acid esters, which accounts for 0.01%-30% of the cleaning composition based on weight percentage;a component (b): one or more fatty compounds selected from fatty acids, fatty alcohols, fatty alcohol ethers or polyol fatty acid esters, which accounts for 0.1%-50% of the cleaning composition based on weight percentage;a component (c): one or more surfactants, which accounts for 1%-80% of the cleaning composition based on weight percentage; anda component (d): a solvent composed of one or more substances selected from water, lower alcohols, polyols and polyol ethers, which accounts for 10%-90% of the cleaning composition based on weight percentage.2. The thick cleaning composition according to claim 1 , wherein the composition is a surfactant lyotropic liquid crystal.3. The thick cleaning composition according to claim 2 , wherein the composition at least comprises one of a lamellar liquid crystal claim 2 , a hexagonal liquid crystal and/or a cubic liquid crystal.5. The thick cleaning composition according to claim 4 , wherein the amino acid moiety of the component (a) claim 4 , the long-chain fatty acyl acidic amino acid ester(s) claim 4 , is derived from L-aspartic acid and L- ...

METHOD FOR PREPARING ACTIVE PEPTIDES FROM CORN GERM PROTEINS

The present invention discloses a method for producing antihypertensive active peptides with corn germ protein as the material. The method comprises an alkali-heat treatment and continuous enzymolysis of the corn germ protein. The components with molecular weight less than 1000 Da in the active peptides obtained according to the present method account for more than 92%, and alanine-tyrosine (Ala-Tyr, AY) as the characteristic peptide fragments in the antihypertensive peptides accounts for more than 0.6%, so that the active peptides have a good ACE inhibitory activity in vitro as well as stability against temperature, pH and major gastrointestinal digestive enzymes, and have a significant effect of lowering blood pressure on spontaneous hypertension rats in vivo. The active peptides can be applied as a new functional nutrient to development and production of food, health food and pharmaceutical. 1. A method for preparing active peptides from corn germ protein powders , including the following steps:adding the corn germ protein powders to a reaction tank, mixing the corn germ protein powders with water to form a first feed liquid, and the feed liquid being adjusted to be alkalescent, heated to 50˜90° C., and stirred at this temperature for 20˜60 min;centrifugalizing the alkalescent first feed liquid in the reaction tank and collecting slag from the alkalescent first feed liquid;mixing the slag with water to form a second feed liquid, the second feed liquid being heated to 50˜90° C. and centrifugalized, and collecting slag from the second feed liquid; the same processing is repeated at least twice to obtain purified slag;the purified slag being mixed with water at a water-slag ratio of 100:40˜60, stirred, and subjected to a first enzymolysis and a second enzymolysis by alkali protease and compound protease in sequence to obtain an enzymatic hydrolysate, wherein the compound protease is comprised of papain and neutral protease; andheating the enzymatic hydrolysate to ...

FABRICATION METHOD OF A MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES

This invention discloses a mixed alloy lead frame for power semiconductor devices, which includes a plurality of heat sinks and a pin array; the heat sinks are made of the first material, with positioning holes on their upper parts and welding zones at the center of their lower parts, while the pin array is made of the second material, which is different from the first material, with a plurality of sets of terminals leading out from its upper end and lower end respectively. The heat sinks are positioned on the lead frame assembly welding plate, the pin is positioned in the area between the upper heat sinks and lower heat sinks on the lead frame assembly welding plate. The mixed alloy lead frame for power semiconductor devices in this invention improves the heat dissipation of lead frame, reduces the fabrication cost of lead frame, and enhances the flexibility of fabrication. 1. A method of using mixed alloy lead frame for packaging power semiconductor devices comprises the following steps:{'b': 3', '3', '3', '31', '31', '31', '3', '3', '3', '311', '311', '311', '31', '31', '31', '32', '32', '32', '3', '3', '3, 'Step 1. Fabricate a lead frame assembly welding plate (,′,″), set a plurality sets of upper and lower grooves (,′,″) at an upper part and a lower part of the lead frame assembly welding plate (,′,″) respectively, set a plurality of heat sink positioning columns (,′,″) in each groove (,′,″), and set a plurality of pin positioning columns (,′,″) at a center of the lead frame assembly welding plate (,′,″) between the upper and lower grooves;'}{'b': 1', '1', '1', '13', '13', '13', '12', '12', '12', '1', '1', '1, 'Step 2. Fabricate a plurality of heat sinks (,′,″), set a positioning hole (,′,″) and a heat sink welding zone (,′,″) on each heat sink (,′,″);'}{'b': 3', '2', '2', '2', '21', '21', '21', '2', '2', '2', '211', '211', '211', '12', '12', '12', '21', '21', '21', '22', '22', '22', '21', '21', '21, 'Step . Fabricate a pin array (,′,″), branch out a plurality ...

MULTI-LAYER LEAD FRAME PACKAGE AND METHOD OF FABRICATION

The present invention features a method for fabricating a lead-frame package, having a first, second, third and fourth electrically conductive structures with a pair of semiconductor dies disposed therebetween defining a stacked structure. The first and second structures are spaced-apart from and in superimposition with the first structure. A semiconductor die is disposed between the first and second structures. The semiconductor die has contacts electrically connected to the first and second structures. A part of the third structure lies in a common plane with a portion of the second structure. The third structure is coupled to the semiconductor die. 1. A method of fabricating a lead frame package said method comprising:providing a first lead frame;fixedly attaching a first semiconductor die to said first lead frame;fixedly attaching a second lead frame to said first semiconductor die, with said first semiconductor die being disposed between said first and second lead frames;fixedly attaching a second semiconductor die to said second lead frame, with said second lead frame being disposed between said first and second semiconductor dies and electrically connecting a contact on said first semiconductor die to a contact on said second semiconductor die;fixedly attaching a third lead frame to said second semiconductor die, with said second semiconductor die being disposed between said second and third lead frames;encapsulating said semiconductor dies in an electrically non-conductive compound; andsingulating said package.2. The method as recited in wherein said providing first lead frame further comprises providing a first array of said first lead frames connected on a first frame claim 1 ,wherein said fixedly attaching a second lead frame further comprises fixedly attaching a second array of said second lead frames connected on a second frame to said first semiconductor die,wherein said fixedly attaching a third lead frame further comprises fixedly attaching a third ...

SYSTEMS AND METHODS FOR PAIRING A WIRELESS TRANSCEIVER UNIT FOR SANITARY WARE

Systems and methods for pairing a wireless transceiver unit for sanitary ware are provided. An exemplary pairing method includes emitting a pairing instruction signal from a wireless sender of the wireless transceiver unit, receiving the emitted pairing instruction signal at one or more wireless receivers, and detecting a signal intensity of the pairing instruction signal received at each of the one or more wireless receivers. The method further includes returning a pairing response from each of the one or more wireless receivers to the wireless sender. The pairing response includes an ID of the wireless receiver and an indication of the signal intensity detected at the wireless receiver. The method further includes selecting the pairing response indicating the highest detected signal intensity and storing the ID of the wireless receiver included in the selected pairing response. 1. A method for pairing a wireless transceiver unit for sanitary ware , the method comprising:emitting a pairing instruction signal from a wireless sender of the wireless transceiver unit;receiving the emitted pairing instruction signal at one or more wireless receivers and detecting a signal intensity of the pairing instruction signal received at each of the one or more wireless receivers;returning a pairing response from each of the one or more wireless receivers to the wireless sender, wherein the pairing response returned by a wireless receiver includes an ID of the wireless receiver and an indication of the signal intensity detected at the wireless receiver;selecting, by the wireless sender, the pairing response indicating the highest detected signal intensity among the pairing responses returned by the one or more wireless receivers; andstoring the ID of the wireless receiver included in the selected pairing response in a local memory of the wireless sender.2. The method of claim 1 , wherein the wireless sender is located in a seat of a toilet and at least one of the wireless ...

SEMICONDUCTOR ENCAPSULATION METHOD

A semiconductor encapsulation comprises a lead frame further comprising a chip carrier and a plurality of pins in adjacent to the chip carrier. A plurality of grooves opened from an upper surface of the chip carrier partially dividing the chip carrier into a plurality of chip mounting areas. A bottom portion of the grooves is removed for completely isolate each chip mounting area, wherein a width of the bottom portion of the grooves removed is smaller than a width of the grooves. In one embodiment, a groove is located between the chip carrier and the pins with a bottom portion of the groove removed for isolate the pins from the chip carrier, wherein a width of the bottom of the grooves removed is smaller than a width of the grooves. 1. A semiconductor encapsulation method comprises the following steps:Step 1: providing a lead frame comprising a chip carrier and a plurality of pins in adjacent to the chip carrier with a first groove open from a top surface of the lead frame to a depth shallower than a thickness of the lead frame located between the chip carrier and at least one of the plurality of the pins;Step 2: disposing a first semiconductor chip having a plurality of top electrodes on the chip carrier, connecting a bottom of the first semiconductor chip to the chip carrier through a first adhesive;Step 3: providing a first metal connection connecting a top electrode of the first semiconductor chip to the at least one of the plurality of the pins;Step 4: providing a plastic package for at least partially encapsulating the chip carrier, the pins, the first semiconductor chip and the metal connection; andStep 5: removing a bottom portion of the first groove so as to electrically isolate the at least one of the plurality of the pins from the chip carrier.2. The semiconductor encapsulation method of claim 1 , wherein in Step 2 an excessive amount of the first adhesive accumulated at a bottom corner of the first groove near the chip carrier.3. The semiconductor ...

DATA MINING SYSTEMS AND METHODS FOR HETEROGENEOUS DATA SOURCES

Systems and methods integrate disparate backup devices with a unified interface. In certain examples, a management console manages data from various backup devices, while retaining such data in its native format. The management console can display a hierarchical view the client devices and/or their data and can further provide utilities for processing the various data formats. A data structure including fields for storing both metadata common to the client device data and value-added metadata can be used to mine or process the data of the disparate client devices. The unified single platform and interface reduces the need for multiple data management products and/or customized data utilities for each individual client device and provides a single pane of glass view into data management operations. Integrating the various types of storage formats and media allows a user to retain existing storage infrastructures and further facilitates scaling to meet long-term management needs. 1displaying with a management console information regarding backup data stored in a plurality of heterogeneous client devices, wherein the backup data of each client device is stored in a different backup format, and wherein the management console integrates a plurality of utilities for performing a plurality of data management operations on the backup data of the plurality of heterogeneous client devices, wherein the management console further provides a single interface for the plurality of utilities;selecting a first data management operation of the plurality of data management operations to be performed by at least one of the plurality of utilities in response to user input;selecting backup data from at least one of the plurality of heterogeneous client devices in response to user input; andperforming the first data management operation on the selected backup data of the at least one client device in response to said selecting the first data management operation and said selecting the ...

Top Exposed Semiconductor Chip Package

A semiconductor package and it manufacturing method includes a lead frame having a die pad, and a source lead with substantially a V groove disposed on a top surface. A semiconductor chip disposed on the die pad. A metal plate connected to a top surface electrode of the chip having a bent extension terminated in the V groove in contact with at least one of the V groove sidewalls. 1. A semiconductor package comprising:a lead frame having a first die pad, a first source lead and first gate lead separated but near the first die pad, wherein the first source lead having substantially a V groove disposed on its top surface with two sidewalls of the V groove terminated substantially on a same plane coplanar to the top surface of the first source lead;a first semiconductor chip having a source electrode and a gate electrode on its top surface and a drain electrode on its bottom surface disposed on the first die pad with the bottom drain electrode electrically attached to a top surface of the first die pad through a conductive adhesive;a first metal plate with a first bent extension, wherein a bottom face of the first metal plate electrically attached to the source electrode of the first semiconductor chip and the first bent extension terminated in the V groove of the first source lead, the first bent extension being in contact with at least one of the V groove sidewalls;a first bond wire electrically connecting the gate electrode of the first semiconductor chip to the first gate lead of the lead frame; anda molding plastic encapsulating the first chip, the first metal plate, the first bond wire and the lead frame with a bottom face of the lead frame exposed on the bottom of the molding encapsulation.2. The semiconductor package of wherein the V groove has symmetric sidewalls.3. The semiconductor package of wherein an end face of a portion of an end of the first metal plate opposite to the bent extension exposed through a middle portion of a side surface of the ...

MIR-150 FOR THE TREATMENT OF BLOOD DISORDERS

The invention provides methods of treating certain blood related disorders, in particular, thrombocytopenia and anemia comprising increasing miR-150 expression or inhibiting miR-150 in progenitor cells respectively. 1. A method of treating thrombocytopenia in a host in need thereof , the method comprising administering an effective amount of an agent that increases miR-150 expression in a cell to a host.2. The method of claim 1 , wherein the cell is a progenitor cell.3. The method of claim 2 , wherein the progenitor cell is a hematopoietic progenitor cell.4. The method of claim 1 , wherein the agent is a vector comprising a nucleic acid sequence that is at least 90% identical to SEQ. ID. No. 1.5. The method of claim 4 , wherein the vector is a virus.6. The method of claim 1 , wherein the agent is a nucleic acid sequence that is at least 90% identical to SEQ. ID. No. 1.7. A method of treating thrombocytopenia in a host in need thereof claim 1 , the method comprising:a. obtaining a sample of hematopoietic progenitor cells from said host;b. contacting the hematopoietic progenitor cells with a vector comprising a nucleic acid sequence that is at least 90% identical to SEQ. ID. No. 1; andc. introducing the cell from step b into the host. This application is a continuation of co-pending U.S. patent application Ser. No. 13/652,672 filed on Oct. 16, 2013, which is a continuation application of U.S. patent application Ser. No. 12/363,016 filed on Jan. 30, 2009 and now abandoned, which claims benefit under 35 U.S.C. §119(e) of U.S. Provisional Application No. 61/062,931 filed on Jan. 30, 2008, and U.S. Provisional Application No. 61/086,556 filed on Aug. 6, 2008, the contents of each of which are incorporated herein by reference in their entireties.This invention was made with Government support under No. 219335 awarded by the National Institute of Health. The Government has certain rights in the invention.The instant application contains a Sequence Listing which has been ...

STACKED DUAL CHIP PACKAGE HAVING LEVELING PROJECTIONS

The present invention is directed to a lead-frame having a stack of semiconductor dies with interposed metalized clip structure. Level projections extend from the clip structure to ensure that the clip structure remains level during fabrication. 1. A semiconductor package comprising:a first semiconductor die;a dip structure attached to the first semiconductor die; anda plurality of leveling projections located between the clip structure and the first semiconductor die, such that the clip structure is parallel with the semiconductor die, wherein an adhesive material is located between at least some of the leveling projections, attaching the clip structure to the first semiconductor die.2. The package of wherein said leveling projections have a common height.3. The package of wherein said clip structure is in electrical communication with a package lead.4. The package of wherein the leveling projections are electrically non-conductive.5. The package of wherein at least some of said adhesive material is electrically conductive and located between at least some of the leveling projections claim 4 , electrically connecting at least a portion of the clip structure to the first semiconductor die.6. The package of wherein the clip structure further comprises a first conductive segment and a second conductive segment.7. The package of wherein the tops of the first and second conductive segments are co-planar.8. The package of wherein the first conductive segment is conductively attached to the first semiconductor die claim 7 , and the second conductive segment is superimposed with but electrically isolated from the first semiconductor die.9. The package of further comprising a second semiconductor chip stacked on the clip structure on a side opposite that of the first semiconductor die.10. A semiconductor package comprising:a first semiconductor die;a clip structure, having first and second conductive segments, attached to the first semiconductor die; anda plurality of ...

PROCESS FOR PREPARING 6-IODO-2-OXINDOLE

Disclosed is a method for the synthesis of 6-iodo-2-oxindole useful as intermediate in the manufacture of pharmaceutically active ingredients. Also disclosed is a novel intermediate used in the synthesis of this compound. 2. The method according to claim 1 , wherein a suitable base is sodium methanolate or sodium ethanolate.3. The method according to claim 1 , wherein the reaction is conducted in a suitable solvent or mixture of solvents.5. The method according to claim 4 , wherein a suitable reducing agent in a) is a tin(II)-based reducing agent.6. The method according to claim 4 , wherein the reduction reaction in a) is conducted in a suitable solvent or mixture of solvents.7. The method according to claim 4 , wherein a suitable acid in b) is aqueous HCl.8. The method according to claim 4 , wherein the cyclization and/or decarboxylation and/or further reduction reaction in b) is conducted in a suitable solvent or mixture of solvents.9. The method according to claim 1 , wherein the intermediate compound of formula (B) is isolated.10. The method according to claim 1 , wherein the intermediate compound obtained from step a) of is isolated.11. The method according to claim 4 , wherein the intermediate compound obtained from any reactions of step b) of aspect 4 is isolated.12. The method according to claim 4 , wherein the intermediate compound of formula (B) and/or the intermediate compound obtained from step a) of is/are isolated.13. The method according to claim 1 , wherein R and R′ are the same and are ethyl or methyl.14. The method according to claim 1 , wherein the compound of formula (A) is prepared by iodination of 2-chloro-nitrobenzene.15. The method according to claim 14 , wherein the system I/NalOis used for iodination.16. The method according to claim 14 , wherein the reaction is conducted in a suitable solvent or mixture of solvents. This invention relates to a novel method for the synthesis of 6-iodo-2-oxindole useful as intermediate in the manufacture of ...

Semiconductor Package with Connecting Plate for Internal Connection

A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding. 1. A semiconductor package comprising:A plurality of semiconductor chips each having a plurality of electrode contact areas disposed on a top surface;A first connecting plate comprising a plurality of connecting plate tie bar upward regions separating the connecting plate into a plurality of connecting plate portions;whereas each of the plurality of connecting plate portions electrically connecting to a contact area of the plurality of electrode contact areas;whereas a conductive section of each of the plurality of connecting plate tie bar upward regions is removed such that each of the plurality of connecting plate portions is electrically isolated from the others.2. The semiconductor package of wherein the first connecting plate comprising a first connecting plate portion and a second connecting plate portion separated by one or more tie bar upward regions claim 1 , the first connecting plate portion electrically connects to a first electrode contact area on a first semiconductor chip and the second connecting plate portion electrically connects to a second electrode contact area on the first semiconductor chip.3. The semiconductor package of further comprising:A molding material encapsulating the first semiconductor chip and the first and second connecting plate portions having a top surface with a shallow ...

ELECTRONIC DEVICE AND THE CONTROLLING METHOD THEREOF

The present invention discloses an electronic device and the controlling method thereof. More specifically, the device and method of the present invention are capable of providing a pre-determined function in a pre-determined situation by inputting and comparing an accelerating data generated by an acceleration sensor. Thus, the present invention allows the user to define a three-dimensional action path as the trigger requirement of a pre-determined function. Accordingly, the user is capable of applying the electronic device with more flexibility and less limitation thereof. 1. A controlling method of an electronic device , comprising the following steps of:automatically obtaining a reference data from a memory of an electronic device, the reference data comprising a plurality of acceleration factors, each of the plurality of acceleration factors comprising a plurality of acceleration vector data and a plurality of acceleration dimension data;automatically obtaining a verifying data from the memory, the verifying data having a plurality of acceleration factors, each of the plurality of acceleration factors comprising a plurality of acceleration vector data and a plurality of acceleration dimension data;automatically comparing the reference data with the verifying data so as to generate a control signal by a CPU of the electronic device; andautomatically activating a pre-determined function of the electronic device in accordance with the control signal.2. The method of the claim 1 , wherein the reference data is generated by an acceleration sensor of the electronic device in accordance with the acceleration applied to the electronic device.3. The method of the claim 1 , wherein the verifying data is generated by an acceleration sensor of the electronic device in accordance with the acceleration applied to the electronic device.4. The method of the claim 1 , wherein the reference data and the verifying data respectively comprise a plurality of subsequent orientation ...

Semiconductor Packaging Method Using Connecting Plate for Internal Connection

A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding. 1. A process of making a semiconductor package comprising:a. providing a plurality of semiconductor chips each having a plurality of electrode contact areas disposed on a top surface;b. providing a first connecting plate comprising a plurality of connecting plate tie bar upward regions separating the connecting plate into a plurality of connecting plate portions;c. electrically connecting each of the plurality of connecting plate portions to a contact area of the plurality of electrode contact areas;d. applying a molding compound to substantially encapsulate the plurality of semiconductor chips and the first connecting plate; ande. grinding a top surface of the molding compound and the plurality of tie bar upward regions to the extent a conductive section of each of the plurality of tie bar upward regions is removed such that each of the plurality of tie bar upward regions is electrically isolating from the other.2. The process of making a semiconductor package of further comprising:applying a dielectric layer on top of the grinded surface. This Patent Application is a Divisional Application of a co-pending application Ser. No. 12/722,528 with attorney Docket#APOM039 and filed on Mar. 12, 2010. Thus, this application claims the Priority Date of the co-pending application Ser. No. 12/722,528. Also, the ...

CATHODE COMPOSITE MATERIAL, METHOD FOR MAKING THE SAME, AND LITHIUM ION BATTERY USING THE SAME

A method for making a cathode composite material of a lithium ion battery is disclosed. In the method, a composite precursor is formed. The composite precursor includes a cathode active material precursor and a coating layer precursor coated on a surface of the cathode active material precursor. The composite precursor is reacted with a lithium source chemical compound, to lithiate both the cathode active material precursor and the coating layer precursor in the composite precursor. 1. A method for making a cathode composite material of a lithium ion battery comprising steps of:forming a composite precursor comprising a cathode active material precursor and a coating layer precursor coated on a surface of the cathode active material precursor;reacting the composite precursor with a lithium source chemical compound, to lithiate both the cathode active material precursor and the coating layer precursor in the composite precursor.2. The method of claim 1 , wherein in the reacting the composite precursor with the lithium source chemical compound claim 1 , the coating layer precursor has a chemical reaction with the lithium source chemical compound to produce a coating layer claim 1 , and a material of the coating layer is a lithium metal oxide having a crystal structure belonging to C2/c space group of the monoclinic crystal system.3. The method of claim 1 , wherein a material of the coating layer precursor is hydroxides or oxides of metal element which has a +4 valence.4. The method of claim 1 , wherein in the reacting the composite precursor with the lithium source chemical compound claim 1 , the cathode active material precursor has a chemical reaction with the lithium source chemical compound to produce a cathode active material.5. The method of claim 4 , wherein the cathode active material precursor is at least one of hydroxides of a transition metal claim 4 , oxysalts of the transition metal claim 4 , and oxides of the transition metal.6. The method of claim 5 , ...

CATHODE COMPOSITE MATERIAL AND LITHIUM ION BATTERY USING THE SAME

A cathode composite material includes a cathode active material and a coating layer coated on a surface of the cathode active material. The cathode active material includes a layered type lithium transition metal oxide. A material of the coating layer is a lithium metal oxide having a crystal structure belonging to C2/c space group of the monoclinic crystal system. The present disclosure also relates to a lithium ion battery including the cathode composite material. 1. A cathode composite material comprising a cathode active material and a coating layer coated on a surface of the cathode active material , the cathode active material comprises a layered type lithium transition metal oxide , the coating layer comprises a lithium metal oxide having a crystal structure that belongs to C2/c space group of the monoclinic crystal system , wherein a general formula of the lithium metal oxide is [LiM□][LiMNA□]O , wherein A represents a metal element having a +4 valence , M and N respectively represent doping chemical elements , “□” represents an atom vacancy occupying a Li site of [Li][LiAA]O , 0<2a<1 , 0<2b+c<1/3 , and 0<2c<2/3.2. (canceled)3. The cathode composite material of claim 1 , wherein A is selected from the group consisting of Ti claim 1 , Sn claim 1 , Mn claim 1 , Pb claim 1 , Te claim 1 , Ru claim 1 , Hf claim 1 , Zr claim 1 , and any combination thereof4. The cathode composite material of claim 1 , wherein the M and N are respectively selected from the group consisting of alkali metal elements claim 1 , alkaline-earth metal elements claim 1 , Group-13 elements claim 1 , Group-14 elements claim 1 , transition metal elements claim 1 , rare-earth elements claim 1 , and any combination thereof.5. The cathode composite material of claim 4 , wherein M and N are respectively selected from the group consisting of Co claim 4 , Mn claim 4 , Ni claim 4 , Cr claim 4 , V claim 4 , Ti claim 4 , Sn claim 4 , Cu claim 4 , Al claim 4 , Fe claim 4 , B claim 4 , Sr claim 4 , Ca ...

CATHODE COMPOSITE MATERIAL, METHOD FOR MAKING THE SAME, AND LITHIUM ION BATTERY USING THE SAME

A cathode composite material includes a cathode active material and a coating layer coated on a surface of the cathode active material. A material of the coating layer is a lithium metal oxide having a crystal structure belonging to C2/c space group of the monoclinic crystal system. The present disclosure also relates to a lithium ion battery including the cathode composite material. 1. A cathode composite material comprising: a cathode active material and a coating layer coated on a surface of the cathode active material , the coating layer comprises a lithium metal oxide having a crystal structure belongs to C2/c space group of the monoclinic crystal system , wherein a general formula of the lithium metal oxide is [LiM□][LiMNA□]O , wherein A represents a metal element having a +4 valence , M and N respectively represent doping chemical elements , “□” represents an atom vacancy occupying a Li site of [Li][LiA]O , 0≦2a<1 , 0≦2b+c<1/3 , and 0≦2c<2/3.2. (canceled)3. The cathode composite material of claim 1 , wherein A is selected from the group consisting of Ti claim 1 , Sn claim 1 , Mn claim 1 , Pb claim 1 , Te claim 1 , Ru claim 1 , Hf claim 1 , Zr claim 1 , and any combination thereof.4. The cathode composite material of claim 1 , wherein the M and N are respectively selected from the group consisting of alkali metal elements claim 1 , alkaline-earth metal elements claim 1 , Group-13 elements claim 1 , Group-14 elements claim 1 , transition metal elements claim 1 , rare-earth elements claim 1 , and any combination thereof.5. The cathode composite material of claim 4 , wherein M and N are respectively selected from the group consisting of Co claim 4 , Mn claim 4 , Ni claim 4 , Cr claim 4 , V claim 4 , Ti claim 4 , Sn claim 4 , Cu claim 4 , Al claim 4 , Fe claim 4 , B claim 4 , Sr claim 4 , Ca claim 4 , Ga claim 4 , Nd claim 4 , Mg claim 4 , and combinations thereof.6. The cathode composite material of claim 1 , wherein at least one of M and N comes from the cathode ...

CATHODE COMPOSITE MATERIAL AND LITHIUM ION BATTERY USING THE SAME

A cathode composite material includes a cathode active material and a coating layer coated on a surface of the cathode active material. The cathode active material includes a spinel type lithium nickel manganese oxide. The coating layer includes a lithium metal oxide having a crystal structure belonging to C2/c space group of the monoclinic crystal system. The present disclosure also relates to a lithium ion battery including the cathode composite material. 1. A cathode composite material comprising a cathode active material and a coating layer coated on a surface of the cathode active material , the cathode active material comprises a spinel type lithium nickel manganese oxide , the coating layer comprises a lithium metal oxide having a crystal structure that belongs to C2/c space group of the monoclinic crystal system.2. The cathode composite material of claim 1 , wherein a general formula of the lithium metal oxide is [LiM□][LiMNA□]O claim 1 , wherein A represents a metal element having a +4 valence claim 1 , M and N respectively represent doping chemical elements claim 1 , “□” represents an atom vacancy occupying a Li site of [Li][LiA]O claim 1 , 0≦2a<1 claim 1 , 0≦2b+c<1/3 claim 1 , and 0≦2c<2/3.3. The cathode composite material of claim 2 , wherein A is selected from the group consisting of Ti claim 2 , Sn claim 2 , Mn claim 2 , Pb claim 2 , Te claim 2 , Ru claim 2 , Hf claim 2 , Zr claim 2 , and any combination thereof.4. The cathode composite material of claim 2 , wherein the M and N are respectively selected from the group consisting of alkali metal elements claim 2 , alkaline-earth metal elements claim 2 , Group-13 elements claim 2 , Group-14 elements claim 2 , transition metal elements claim 2 , rare-earth elements claim 2 , and any combination thereof.5. The cathode composite material of claim 4 , wherein M and N are respectively selected from the group consisting of Co claim 4 , Mn claim 4 , Ni claim 4 , Cr claim 4 , V claim 4 , Ti claim 4 , Sn claim 4 ...

CATHODE COMPOSITE MATERIAL AND LITHIUM ION BATTERY USING THE SAME

A cathode composite material includes a cathode active material and a coating layer coated on a surface of the cathode active material. The cathode active material includes a layered type lithium nickel cobalt manganese oxide. The coating layer comprises a lithium metal oxide having a crystal structure belonging to C2/c space group of the monoclinic crystal system. The present disclosure also relates to a lithium ion battery including the cathode composite material. 1. A cathode composite material comprising a cathode active material and a coating layer coated on a surface of the cathode active material , the cathode active material comprises a layered type lithium nickel cobalt manganese oxide , the coating layer comprises a lithium metal oxide having a crystal structure that belongs to C2/c space group of the monoclinic crystal system , wherein a general formula of the lithium metal oxide is [LiM□][LiMNA□]O , wherein A represents a metal element having a +4 valence , M and N respectively represent doping chemical elements , “□” represents an atom vacancy occupying a Li site of [Li][LiA]O , 0≦2a<1 , 0≦2b+c<1/3 , and 0≦2c<2/3.2. (canceled)3. The cathode composite material of claim 1 , wherein A is selected from the group consisting of Ti claim 1 , Sn claim 1 , Mn claim 1 , Pb claim 1 , Te claim 1 , Ru claim 1 , Hf claim 1 , Zr claim 1 , and any combination thereof.4. The cathode composite material of claim 1 , wherein the M and N are respectively selected from the group consisting of alkali metal elements claim 1 , alkaline-earth metal elements claim 1 , Group-13 elements claim 1 , Group-14 elements claim 1 , transition metal elements claim 1 , rare-earth elements claim 1 , and any combination thereof.5. The cathode composite material of claim 4 , wherein M and N are respectively selected from the group consisting of Co claim 4 , Mn claim 4 , Ni claim 4 , Cr claim 4 , V claim 4 , Ti claim 4 , Sn claim 4 , Cu claim 4 , Al claim 4 , Fe claim 4 , B claim 4 , Sr claim 4 ...

Cathode composite material and lithium ion battery using the same

A cathode composite material includes a cathode active material and a coating layer coated on a surface of the cathode active material. The cathode active material includes a spinel type lithium manganese oxide. The coating layer comprises a lithium metal oxide having a crystal structure belonging to C2/c space group of the monoclinic crystal system. The present disclosure also relates to a lithium ion battery including the cathode composite material.

Cathode composite material and lithium ion battery using the same

A cathode composite material includes a cathode active material and a coating layer coated on a surface of the cathode active material. The cathode active material includes a lithium cobalt oxide. The coating layer includes a lithium metal oxide having a crystal structure belonging to C2/c space group of the monoclinic crystal system. The present disclosure also relates to a lithium ion battery including the cathode composite material.

Method and system for group number-based microblog aggregation

The present disclosure provides a method for group number-based microblog aggregation and a system for group number-based microblog aggregation, which are used for realizing microblog aggregation display for group numbers. In the present disclosure, the binding relationship between a group number and microblog accounts is established, a large number of microblog accounts are bound by one group number, so that a client can initiate a microblog aggregation request based on the group number, and microblog messages issued by a large number of bound microblog accounts can be obtained by only transmitting one group number in an inquiry interface. According to the present disclosure, group users can learn the microblog dynamic states of other group users in real time conveniently, group functions are expanded, and time and network traffic of the users are saved. 1. A method for group number-based microblog aggregation , comprising:establishing a binding relationship between a group number and microblog accounts; andacquiring microblog messages issued by the bound microblog accounts based on the binding relationship between the group number and the microblog accounts after receiving a request for group number-based microblog aggregation initiated by a client, and feeding the acquired microblog messages back to the client.2. The method according to claim 1 , wherein the microblog accounts bound to the group number comprise microblog accounts of group member users and/or microblog accounts of non-group member users.3. The method according to claim 2 , wherein when the microblog accounts are the microblog accounts of the group member users claim 2 , the step of establishing a binding relationship between a group number and microblog accounts comprises:acquiring the accounts of the group member users according to the group number, inquiring the group member users who have subscribed microblog, acquiring the microblog accounts of the group member users who have subscribed ...

MOLDED INTELLIGENT POWER MODULE FOR MOTORS

An intelligent power module (IPM) has a first, second, third and fourth die supporting elements, a first, second, third, fourth, fifth and sixth transistors, a connection member, a low voltage IC, a high voltage IC, a plurality of leads and a molding encapsulation. The first transistor is attached to the first die supporting element. The second transistor is attached to the second die supporting element. The third transistor is attached to the third die supporting element. The fourth, fifth and sixth transistor s are attached to the fourth die supporting element. The low and high voltage ICs are attached to the connection member. The molding encapsulation encloses the first, second, third and fourth die supporting elements, the first, second, third, fourth, fifth and sixth transistors, the connection member and the low and high voltage ICs. The IPM has a reduced thermal resistance of junction-to-case (RJC) compared to a conventional IPM. 1. An intelligent power module (IPM) for driving a motor , the IPM comprising:a first, second, third and fourth die supporting elements;a first transistor attached to the first die supporting element;a second transistor attached to the second die supporting element;a third transistor attached to the third die supporting element;a fourth, fifth, and sixth transistors attached to the fourth die supporting element;a connection member;a low voltage integrated circuit (IC) attached to the connection member; the low voltage IC being electrically connected to the first, second and third transistors;a high voltage IC attached to the connection member, the high voltage IC being electrically connected to the fourth, fifth, and sixth transistors;a first plurality of leads;a second plurality of leads;a first dummy bar; anda molding encapsulation enclosing the first, second, third, and fourth die supporting elements, the first, second, third, fourth, fifth, and sixth transistors, the connection member, the low voltage IC, and the high voltage IC ...

RECHARGEABLE NON-AQUEOUS SODIUM-AIR BATTERIES

An electrochemical device includes an air cathode using air as the cathodic gas; a discharge product of sodium peroxide dihydrate; an anode comprising sodium metal; a porous fiber separator; and a non-aqueous electrolyte comprising a sodium salt and a solvent. 1. An electrochemical device comprising:an air cathode comprising air;an anode comprising a metal;{'sub': 2', '2', '2, 'a discharge product comprising sodium peroxide dihydrate (NaO.2HO);'}a porous separator; anda non-aqueous electrolyte comprising a sodium salt and a solvent.2. The electrochemical device of claim 1 , wherein the air cathode comprises an air cathode layer comprising an electroconductive material and the air.3. The electrochemical device of claim 1 , wherein the air comprises N claim 1 , O claim 1 , H claim 1 , CO claim 1 , Ar claim 1 , and/or water.4. The electrochemical device of claim 2 , wherein the electroconductive material comprises a porous carbon material selected from one or more of synthetic graphite claim 2 , natural graphite claim 2 , expanded graphite claim 2 , graphene claim 2 , reduced graphene oxide claim 2 , a metal-organic framework claim 2 , amorphous carbon claim 2 , hard carbon claim 2 , soft carbon claim 2 , carbon black claim 2 , acetylene black claim 2 , carbon spheres claim 2 , mesocarbon microbeads (MCMB) claim 2 , mesoporous carbon claim 2 , porous carbon matrix claim 2 , carbon nanofiber claim 2 , carbon aerogel claim 2 , single-walled carbon nanotubes claim 2 , multi-walled carbon nanotubes claim 2 , and carbon nanotube arrays.5. The electrochemical device of claim 1 , wherein the electrochemical device comprises a sodium-air secondary battery.6. The electrochemical device of claim 1 , wherein the air cathode comprises a catalyst.7. The electrochemical device of claim 6 , wherein the catalyst comprises carbon claim 6 , a noble metal claim 6 , Pt claim 6 , Pd claim 6 , Au claim 6 , Ru claim 6 , Ir claim 6 , Ag claim 6 , PtNi claim 6 , PtAu claim 6 , PtCu claim 6 , ...

Acoustic Transmission Device and Process for Tracking Selected Hosts

A new acoustic tag and process are disclosed for identifying and tracking underwater hosts in up to three dimensions. The acoustic tag has an operation lifetime up to a year or longer at a pulse rate interval of about 15 seconds. The acoustic tag has a signal detection range up to at least about 500 meters that enhances detection probability. 1. An acoustic transmission (tag) device , comprising:a power source that delivers a power source voltage to power a tag circuit, the tag circuit delivers a selected voltage to a piezoelectric transducer that transmits an acoustic transmission signal at a selected signal intensity between about 159 dB and about 163 dB, the tag is configured to provide a selectable tag lifetime at the selected signal intensity of at least about 98 days at a pulse rate interval of about 5 seconds.2. The acoustic device of claim 1 , wherein the tag lifetime is at least about 365 days at a pulse rate interval of about 15 seconds and a signal intensity of 161 dB.3. The acoustic device of claim 1 , wherein the tag circuit includes a dual boost converter sub-circuit that couples to two analog switches that delivers the selected voltage to the piezoelectric transducer.4. The acoustic device of claim 1 , wherein the tag circuit includes a dual boost converter sub-circuit that generates voltage potentials that alternate between about −3 volts and about +7 volts.5. The acoustic device of claim 1 , wherein the tag circuit delivers a selected voltage delivered to the piezoelectric transducer that is at least about 20 volts (peak-to-peak).6. The acoustic device of claim 1 , wherein the power source delivers a selectable power source voltage between about 1.8 V to about 3.0 V.7. The acoustic device of claim 1 , wherein the tag circuit expends an energy for transmission of the acoustic signal from the piezoelectric transducer of less than or equal to about 283 μJ per transmission at a signal intensity of 161 dB.8. The acoustic device of claim 1 , wherein the ...

Dual-leadframe Multi-chip Package

A dual-leadframe multi-chip package comprises a first leadframe with a first die pad, and a second leadframe with a second die pad; a first chip mounted on the first die pad functioning as a high-side MOSFET and second chip mounted on the second die pad functioning as a low-side MOSFET. The package may further comprises a bypass capacity configured as a third chip mounted on the first die pad or integrated with the first chip. The package may further comprise a three-dimensional connecting plate formed as an integrated structure as the second die pad for electrically connecting a top contact area of the first chip to a bottom contact area of the second chip. A top connecting plate connects a top contact area of the second chip and a top contact area of the third chip to an outer pin of the first leadframe. 1. A dual-leadframe multi-chip package comprises:a first leadframe comprising a first die pad and multiple outer pins, a second leadframe comprising a second die pad;a first chip mounted on the first die pad with a bottom contact area of the first chip electrically connected to the first die pad, a second chip mounted on the second die pad with a bottom contact area of the second chip electrically connected to the second die pad and a third chip mounted on the first die pad with a bottom contact area of the third chip electrically connected to the first die pad;a top connecting plate electrically connecting a top contact area of the second chip and a top contact area of the third chip to an outer pin;wherein a top contact area of the first chip electrically connects to the second die pad.2. The dual-leadframe multi-chip package of wherein:the top contact area of the first chip electrically connects to the second die pad via bond wires.3. The dual-leadframe multi-chip package of wherein the first chip and the third chip are integrated to form a chip mounted on the first die pad.4. The dual-leadframe multi-chip package of wherein:the first chip is a high-side metal- ...

Packaging structure of a semiconductor device

A method of making a semiconductor packaged device comprises mounting onto a lead frame a bottom of a molded semiconductor chip having a first plastic package body covering a top face of a semiconductor chip, encapsulating the lead frame and the semiconductor chip with a second plastic package body with top surfaces of conductive contact bodies electrically connected to electrodes on the top surface of the semiconductor chip exposed and plating conductive pads on a top surface of the assembly structure to provide external electrical connections to the electrodes through the conductive contact bodies.

THIN POWER DEVICE AND PREPARATION METHOD THEREOF

A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back surface of the substrate, a through opening opened from the front surface and through the substrate exposing a third contact pad at the back surface of the substrate, a semiconductor chip embedded into the through opening with a back metal layer at a back surface of the semiconductor chip attached on the third contact pad, and a plurality of conductive structures electrically connecting electrodes at a front surface of the semiconductor chip with the corresponding first contact pads in the first sets of first contact pads. 1. A thin power device comprising:a substrate having a first set of first contact pads arranged at a front surface of the substrate and a second set of second contact pads arranged at a back surface of the substrate, wherein each first contact pad in the first set of contact pads being electrically connected with a second contact pad in the second set of contact pads;a through opening opened from the front surface and through the substrate thus exposing a third contact pad at the back surface of the substrate, wherein the third contact pad is one of the second set of second contact pads not electrically connected with any first contact pad in the first set of contact pads;a semiconductor chip embedded into the through opening, wherein a back metal layer at a back surface of the chip is attached on the third contact pad; anda plurality of conductive structures electrically connecting electrodes at a front surface of the chip with the corresponding first contact pads in the first sets of contact pads.2. The thin power device according to claim 1 , wherein an underfill is filled in a gap between edges of the through opening and a periphery of the chip; and the conductive structure is an aerosol jet printed strip positioned atop front surfaces of the substrate ...

Solar Cells Having a Novel Bus Bar Structure

A solar cell () includes a photoelectric conversion layer () having a front surface () and a back surface (), a back electrode () disposed on the back surface () of the photoelectric conversion layer (), a plurality of electrically conductive fingers () disposed on the front surface () of the photoelectric conversion layer (), and a plurality of primary bus bars () disposed on the front surface () of the photoelectric conversion layer (). Each primary bus bar () is electrically connected to a plurality of electrically conductive fingers (). The solar cell () can include from 4 to 12 primary bus bars () on the front surface () of the photoelectric conversion layer () and the primary bus bars () on the front surface () of the photoelectric conversion layer () have a total surface area of at most about 4 cm. 1. A solar cell , comprising:a photoelectric conversion layer having a front surface and a back surface;a back electrode disposed on the back surface of the photoelectric conversion layer;a plurality of electrically conductive fingers disposed on the front surface of the photoelectric conversion layer; anda plurality of primary bus bars disposed on the front surface of the photoelectric conversion layer, each primary bus bar being electrically connected to a plurality of electrically conductive fingers;{'sup': '2', 'wherein the solar cell comprises from 4 to 12 primary bus bars on the front surface of the photoelectric conversion layer, the primary bus bars on the front surface of the photoelectric conversion layer having a total surface area of at most about 4 cm.'}2. The solar cell of claim 1 , wherein the solar cell comprises from 5 to 10 primary bus bars on the front surface of the photoelectric conversion layer.3. The solar cell of claim 1 , wherein the solar cell comprises from 5 primary bus bars on the front surface of the photoelectric conversion layer.4. The solar cell of claim 1 , wherein each primary bus bar comprises a plurality of nodes.5. The solar ...

Soldering System

This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.

MANAGING STORAGE PERFORMANCE CONSISTENCY WITH FEEDBACK CONTROL

A method for managing storage performance consistency, where the method determines a target throughput for writes to a memory sub-system, increases a tracking variable with a granularity based on the target throughput at fixed intervals, decreases the tracking variable based on writes of host data received from a host system to the memory sub-system, and adjusts a priority of host data writes to the memory sub-system relative to writes of reclaimed data from the memory sub-system in response to the tracking variable indicating a deviation from the target throughput. 1. A method for managing storage performance consistency , the method comprising:determining a target throughput for writes to a memory sub-system;increasing a tracking variable with a granularity based on the target throughput at fixed intervals;decreasing the tracking variable based on writes of host data received from a host system to the memory sub-system; andadjusting a priority of host data writes to the memory sub-system relative to a priority of reclaimed data writes from the memory sub-system in response to the tracking variable indicating a deviation from the target throughput.2. The method of claim 1 , wherein adjusting the priority further comprises:comparing the tracking variable to an initial tracking variable value.3. The method of claim 2 , wherein adjusting the priority further comprises:increasing the priority of host data writes relative to the priority of reclaimed data writes in response to the tracking variable being greater than the initial tracking variable value.4. The method of claim 2 , wherein adjusting the priority further comprises:decreasing the priority of host data writes relative to the priority of reclaimed data writes in response to the tracking variable being less than the initial tracking variable value.5. The method of claim 1 , further comprising:increasing the target throughput in response to a space consumption tracking variable being less than a space release ...

CATALYTIC CATHODE FOR A LITHIUM-OXYGEN BATTERY

A metal-air battery includes an anode; a low-dimensional catalyst cathode; and an electrolyte; wherein: the low-dimensional catalyst cathode comprises a functional metal layer on a carbon support overcoated with a catalyst layer; the electrolyte comprises an aprotic solvent that is an ether-based solvent, a fluorinated ether-based solvent, an oligo (ethylene oxide) solvent, or a mixture of any two or more thereof; and the electrolyte is free of carbonate solvents. 1. A metal-air battery comprising:an anode;a low-dimensional catalyst cathode; andan electrolyte comprising a salt and an aprotic solvent; the low-dimensional catalyst cathode comprises a functional metal layer on a carbon support;', 'a catalyst layer at least partially overlaying the functional metal layer;', 'the aprotic solvent comprises an ether-based solvent, a fluorinated ether-based solvent, an oligo (ethylene oxide) solvent, or a mixture of any two or more thereof; and', 'the electrolyte is free of carbonate solvents., 'wherein2. The metal-air battery of claim 1 , wherein the functional metal layer comprises Al claim 1 , Si claim 1 , Ti claim 1 , V claim 1 , Cr claim 1 , Co claim 1 , Ni claim 1 , Cu claim 1 , Zn claim 1 , Ge claim 1 , Nb claim 1 , Mo claim 1 , Pd claim 1 , Ag claim 1 , In claim 1 , Sn claim 1 , Ir claim 1 , Pt claim 1 , Au claim 1 , or a mixture of any two or more thereof.3. The metal-air battery of claim 1 , wherein the catalyst layer comprises Mn claim 1 , Fe claim 1 , Co claim 1 , Ni claim 1 , Ru claim 1 , Pd claim 1 , Ag claim 1 , Os claim 1 , Ir claim 1 , Pt claim 1 , or a combination of any two or more thereof.4. The metal-air battery of claim 1 , wherein the functional metal layer comprises Cr claim 1 , Cu claim 1 , Ag claim 1 , Au claim 1 , or a mixture of any two or more thereof.5. The metal-air battery of claim 1 , wherein the catalyst layer comprises Ni claim 1 , Pd claim 1 , Ir claim 1 , Pt claim 1 , or a combination of any two or more thereof.6. The metal-air battery ...

METHOD AND APPARATUS FOR DETERMINING SIGNAL QUALITY INFORMATION OF FREQUENCY

This application provides a method and an apparatus for determining signal quality information of a frequency. In this method, terminal devices do not need to perform inter-frequency measurement or inter-RAT measurement, but only need to perform intra-frequency measurement and report signal quality information of an intra-frequency to a network device, so that the network device can determine signal quality information of an inter-frequency. In this way, the network device may select a carrier for the terminal devices based on the signal quality information of the intra-frequency and the signal quality information of the inter-frequency. Clearly, because the terminal devices do not need to perform the inter-frequency measurement or the inter-RAT measurement, in addition to ensuing a carrier selection gain, the method can further ensure service continuity and service throughputs of the terminal devices, and avoid overheads of the inter-frequency measurement and the inter-RAT measurement. 1. A method for determining signal quality information of a frequency , comprising:obtaining, by a network device, signal quality information, of a first frequency, from terminal devices, wherein the first frequency is a frequency used by a serving cell accessed by the terminal devices; anddetermining, by the network device, signal quality information of a second frequency based on the signal quality information of the first frequency and a stored first mapping relationship, wherein the second frequency is different from the first frequency, and the first mapping relationship is a mapping relationship between the signal quality information of the first frequency and the signal quality information of the second frequency.2. The method according to claim 1 , wherein the first mapping relationship is obtained by modeling sample data of the signal quality information of the first frequency and sample data of the signal quality information of the second frequency claim 1 , whereinthe ...

Aquatic Organism Tracking Devices, Systems and Associated Methods

Aquatic organism tracking devices, systems and associated methods are described. According to one aspect, an aquatic organism tracking device includes a housing, a transducer coupled with the housing and configured to transmit a data transmission externally of the housing and an aquatic organism associated with the tracking device, a programmable oscillator coupled with the housing, and wherein the programmable oscillator is configured to generate a clock signal having a selected one of a plurality of different frequencies, processing circuitry coupled with the housing and configured to receive the clock signal from the programmable oscillator and to execute a plurality of executable instructions according to the clock signal, a power source coupled with the housing and configured to store electrical energy, and wherein the processing circuitry is configured to control the provision of the electrical energy from the power source to the transducer to generate the data transmission as a result of the execution of the instructions. 1. An aquatic organism tracking device comprising:a housing;a transducer coupled with the housing and configured to transmit a data transmission externally of the housing and an aquatic organism associated with the tracking device;a programmable oscillator coupled with the housing, and wherein the programmable oscillator is configured to generate a clock signal having a selected one of a plurality of different frequencies;processing circuitry coupled with the housing and configured to receive the clock signal from the programmable oscillator and to execute a plurality of executable instructions according to the clock signal;a power source coupled with the housing and configured to store electrical energy; andwherein the processing circuitry is configured to control the provision of the electrical energy from the power source to the transducer to generate the data transmission as a result of the execution of the instructions.2. The device of ...

NOVEL PROCESS FOR THE MANUFACTURE OF 4-AMINOBENZOAMIDINE DIHYDROCHLORIDE

The present invention relates to a process for the preparation of 4-aminobenzoamidine (4-AMBA) salts of general formula (I) 54: The process for the preparation of a compound of formula (I) or (II) according to any one of - claims 1 , wherein the alcoholic solvent or alcoholic solution is ethanolic or methanolic.64: The process for the preparation of a compound of formula (I) or (II) according to any one of - claims 1 , wherein the alcoholic solvent or alcoholic solution is methanolic.7: The process according to claim 3 , wherein the alcoholic solvent or alcoholic solution in step (A) claim 3 , (B) and (C) is the same and is ethanolic or methanolic.84: The process according to any one of - claims 1 , wherein the HCl or HBr in step (A) or step (B) is in a concentration from 5% to 30% (weight %) in alcohol.94: The process according to any one of - claims 2 , wherein a molar ratio of HCl or HBr to compound (III) is from 2:1 to 20:1.104: The process according to any one of - wherein the reaction according to step (A) is conducted at a temperature from −10° C. to 80° C.113: The process according to any one of - claims 1 , wherein the amination step (B) is running at the temperature from 20° C. to 80° C.123: The process according to any one of - claims 1 , wherein the reaction is running in NHsolved in an alcohol solution with a concentration of NHfrom 5% to 30% (weight %).133: The process according to any one of - claims 1 , wherein the molar ratio of NHto imino ether (II) is from 2:1 to 20:1. The present invention relates to a process for the preparation of 4-aminobenzoamidine (4-AMBA) salts of general formula (I)preferably the salts thereof with hydrochloric or hydrobromic acid, particularly preferred the dichloride salt.A compound of formula (I) is a key intermediate for Dabigatran etexilate, which is known as an orally active prodrug for the reduction of stroke and systemic embolism. It was first disclosed in WO 98/37075. Processes for the manufacture of dabigatran ...

MULTIPLE LAYER INTERLAYER HAVING IMPROVED OPTICAL AND SOUND INSULATION PROPERTIES

Multilayered interlayers having good acoustic properties comprising a stiff skin layer(s) and a soft core layer(s) are disclosed. The multilayered interlayers comprise: a first polymer layer (skin layer) comprising plasticized poly(vinyl acetal) resin; a second polymer layer (core layer) comprising plasticized poly(vinyl acetal) resin; wherein at least one plasticizer is a high refractive index plasticizer. The multilayered interlayers have low mottle and resist mottle formation. 1. A polymer interlayer comprising:a soft layer having a first refractive index, the soft layer comprising a first poly(vinyl acetal) resin having a first residual hydroxyl content and a first residual acetate content, and a first plasticizer;a first stiffer layer having a second refractive index, the stiffer layer comprising a second poly(vinyl acetal) resin having a second residual hydroxyl content and a second residual acetate content, and a second plasticizer;a second stiffer layer having a third refractive index, the second stiffer layer comprising a third poly(vinyl acetal) resin having a third residual hydroxyl content and a third residual acetate content, and a third plasticizer;wherein at least one of the first, second and third plasticizers is a high refractive index plasticizer having a refractive index of at least about 1.460;wherein the absolute value of the difference between the first refractive index and the second refractive index and the first refractive index and the third refractive index (delta RI) are each less than about 0.010;wherein the difference between at least one of the first residual hydroxyl content and the second residual hydroxyl content and the second residual hydroxyl content and the third residual hydroxyl content is at least 2.0 weight percent; andwherein the polymer interlayer has a damping loss factor (η) (as measured by ISO 16940) of at least about 0.15 at 20° C. and a sound transmission loss (STL) (as measured by ASTM E90 (2009) at 20° C.) of at ...

MULTILAYER INTERLAYER HAVING SOUND DAMPING PROPERTIES OVER A BROAD TEMPERATURE RANGE

A polymer interlayer having improved sound insulation is disclosed. The polymer interlayer comprises: at least one soft layer wherein the soft layer comprises a poly(vinyl butyral) resin composition having a dispersity in composition of at least 0.40 and a plasticizer; and a stiff layer comprising a poly(vinyl butyral) resin composition and a plasticizer; wherein the polymer interlayer has a damping loss factor () (as measured by Mechanical Impedance Measurement according to ISO 16940) of at least about 0.15 measured at two or more different temperatures selected from 10° C., 20° C. and 30° C. 1. A polymer interlayer having improved sound insulation , the polymer interlayer comprising:a first stiff layer comprising a poly(vinyl butyral) resin composition and a plasticizer;a soft layer comprising a poly(vinyl butyral) resin composition and a plasticizer, wherein the soft layer has a dispersity in composition of at least 0.40; anda second stiff layer comprising a poly(vinyl butyral) resin composition and a plasticizer, wherein the soft layer is adjacent to and between the first stiff and the second stiff layer;{'img': {'@id': 'CUSTOM-CHARACTER-00010', '@he': '2.79mm', '@wi': '2.12mm', '@file': 'US20180029341A1-20180201-P00002.TIF', '@alt': 'custom-character', '@img-content': 'character', '@img-format': 'tif'}, 'wherein the polymer interlayer has a damping loss factor () (as measured by Mechanical Impedance Measurement according to ISO 16940) of at least about 0.15 measured at two or more different temperatures selected from 10° C., 20° C. and 30° C.'}2. The polymer interlayer of claim 1 , wherein the poly(vinyl butyral) resin composition in the soft layer comprises a first poly(vinyl butyral) resin having a first residual hydroxyl content and a second poly(vinyl butyral) resin having a second residual hydroxyl content claim 1 , wherein the difference between the first residual hydroxyl content and the second residual hydroxyl content is at least 1.0 weight percent.3. ...

DEFECT RESISTING ACOUSTIC POLYMER INTERLAYERS

This disclosure is related to the field of polymer interlayers for multiple layer glass panels and multiple layer glass panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of polymer interlayers comprising multiple thermoplastic layers which resist the formation of optical defects. 1. A polymer interlayer comprising:a first polymer layer comprising at least one polymer selected from the group consisting of poly(vinyl butyral), polyurethane, and poly(ethylene-co-vinyl acetate);a second polymer layer comprising at least one polymer selected from the group consisting of poly(vinyl butyral), polyurethane, and poly(ethylene-co-vinyl acetate); wherein said second polymer layer is in contact with said first polymer layer; anda third polymer layer comprising at least one polymer selected from the group consisting of poly(vinyl butyral), polyurethane, and poly(ethylene-co-vinyl acetate); wherein said third polymer layer is in contact with said second polymer layer; and wherein said second polymer layer is disposed between said first polymer layer and said third polymer layer, thereby resulting in a polymer interlayer comprising two skin layers and a core layer; andwherein each of said skin layers has a flow of about 0.19 mm to about 0.37 mm as measured by DF135, and wherein said first polymer layer and/or said third polymer layer has a stress relaxation modulus, G′(t), measured at a temperature of 150° C. and a time of 100 seconds, in the range of from 0.10 to 100 Pascals.2. The polymer interlayer of claim 1 , wherein said first polymer layer and/or said second polymer layer and/or said third layer comprise poly(vinyl butyral).3. The polymer interlayer of claim 2 , wherein said skin layers each have a flow of 0.19 to 0.26 mm as measured by DF135.4. The polymer interlayer of claim 1 , wherein said first polymer layer and/or said third polymer layer has an embossed post heat surface roughness claim 1 , Rz claim 1 , ranging ...

DATA MINING SYSTEMS AND METHODS FOR HETEROGENEOUS DATA SOURCES

Systems and methods integrate disparate backup devices with a unified interface. In certain examples, a management console manages data from various backup devices, while retaining such data in its native format. The management console can display a hierarchical view of the client devices and/or their data and can further provide utilities for processing the various data formats. A data structure including fields for storing both metadata common to the client device data and value-added metadata can be used to mine or process the data of the disparate client devices. The unified single platform and interface reduces the need for multiple data management products and/or customized data utilities for each individual client device and provides a single pane of glass view into data management operations. Integrating the various types of storage formats and media allows a user to retain existing storage infrastructures and further facilitates scaling to meet long-term management needs. 1. (canceled)2. A method for processing data from a plurality of client devices , the method comprising:providing a graphical user interface including on-screen graphics representing a plurality of client devices in a storage network system, wherein the plurality of client devices comprises one or more first client devices storing secondary copy data in different secondary copy formats and one or more second client devices storing primary copy data generated by one or more applications executing on the second client devices, wherein the graphical user interface is provided via a management console executing on a computing device in network communication with the client devices;receiving a data operation request including (i) a first selection of at least one second client device of the second client devices, and (ii) a first data management operation to be performed on the first data of the at least one second client device, the first data of the at least one second client device generated ...

STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

The invention relates to a power semiconductor device and a preparation method, particularly relates to preparation of stacked dual-chip packaging structure of MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) using flip chip technology with two interconnecting plates. The first chip is flipped and attached on the base such that the first chip is overlapped with the third pin; the back metal layer of the first chip is connected to the bonding strip of the first pin through a first interconnecting plate; the second chip is flipped and attached on a main plate portion of the first interconnecting plate such that the second chip is overlapped with the fourth pin; and the back metal layer of the second chip is connected to the bonding strip of the second pin through the second interconnecting plate. 1. A stacked dual-chip package , comprising:a lead frame comprising a base, a first pin and a second pin respectively arranged at a left side and a right side of the base, a third pin and a fourth pin arranged at a rear side or a front side of the base, wherein the first pin comprises a bonding strip extending along a direction parallel to the left side edge of the base and the second pin comprises a bonding strip extending along a direction parallel to the right side edge of the base;a first chip comprising a first electrode and a second electrode at its front surface and a back metal layer formed on its back surface with a plurality of interconnection structures formed on the first electrode and second electrode, wherein the first chip is flipped and attached on a front surface of the base such that the second electrode of the first chip is overlapped with the third pin defining an overlapping area on the first chip, wherein the second electrode is connected to the third pin through the interconnection structure formed on the second electrode while the interconnection structures formed on the first electrode are attached on the front surface of the base;a first ...

STACKED MULTI - CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the meal clip; bonding wires electrically connecting electrodes on the third semiconductor chip to the first and second semiconductor chips and the pins of the lead frame; plastic molding encapsulating the lead frame, the chips and the metal clip. 1. A stacked multi-chip packaging structure comprising:a lead frame comprising a first die paddle, a second die paddle and a plurality of pins separated from each other, wherein the second die paddle comprises a first part and a second part separated from each other;a first semiconductor chip attached on the first die paddle with a back electrode at a back surface of the first semiconductor chip electrically connected onto the first die paddle;a second semiconductor chip being flipped and attached on the second die paddle with a first front electrode and a second front electrodes at a front surface of the second semiconductor chip electrically connected onto the first part and the second part of the second die paddle respectively;a metal clip mounted on top of the first and second chips electrically attached onto a first front electrode on a front surface of the first chip and a back electrode arranged on a back surface of the flipped second chip;a third semiconductor chip having a back surface attached onto a top surface of the metal clip, the back surface of the third semiconductor chip being electrically isolated from the metal clip;bonding wires electrically connecting electrodes on a front surface of the third semiconductor chip to a second electrode on the front surface of the first semiconductor chip and the pins; anda plastic package body encapsulating the bonding wires, the first, second and third semiconductor chips, ...

Battery protection package and process of making the same

The present invention discloses small-size battery protection packages and provides a process of fabricating small-size battery protection packages. A battery protection package includes a first common-drain metal oxide semiconductor field effect transistor (MOSFET), a second common-drain MOSFET, a power control integrated circuit (IC), a plurality of solder balls, a plurality of conductive bumps, and a packaging layer. The power control IC is vertically stacked on top of the first and second common-drain MOSFETs. At least a majority portion of the power control IC and at least majority portions of the plurality of solder balls are embedded into the packaging layer. The process of fabricating battery protection packages includes steps of fabricating power control ICs; fabricating common-drain MOSFET wafer; integrating the power control ICs with the common-drain MOSFET wafer and connecting pinouts; forming a packaging layer; applying grinding processes; forming a metal layer; and singulating battery protection packages.

MCSP POWER SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF

The present invention discloses the MCSP power semiconductor device and the preparation method thereof. In the present invention method, a metal foil layer is attached to the back of the wafer using a conductive adhesive layer and a composite tape is laminated on the metal foil layer. Thus, individual MCSP power semiconductor devices are separated by cutting the wafer, the conductive adhesive, the metal foil layer and the composite tape along the scribe lines between adjacent semiconductor chips formed on the front of the wafer. 1. A process for preparing a power semiconductor device comprising:providing a wafer having a front surface and a back surface opposite the front surface;providing a molding layer on the front surface of the wafer;coating a precious metal layer on a front surface of a metal foil layer;laminating the front surface of the metal foil layer to the back surface of the wafer using a conductive adhesive layer for bonding;attaching a composite tape on a back surface of the metal foil layer; andcutting along scribe lines between adjacent semiconductor chips, wherein the molding layer, the wafer, the conductive adhesive layer, the metal foil layer and the composite tape are cut through to separate individual power semiconductor devices.2. The method of claim 1 , further comprising the step of marking identification tags on the composite tape before cutting along scribe lines between adjacent chips.3. The method of claim 1 , further comprising applying heat to the wafer and simultaneously applying pressure to the metal foil layer during the process of laminating the metal foil layer to the back surface of the wafer claim 1 , or applying heat to the wafer and simultaneously applying pressure to the composite layer and the metal foil layer after the composite tape is attached to the metal foil layer.4. (canceled)5. (canceled)6. The method of claim 1 , further comprising attaching a dummy wafer onto a top surface of the molding layer claim 1 , applying ...

BI-METALLIC NANOPARTICLES AS CATHODE ELECTROCATALYSTS

A lithium-air battery cathode catalyst includes core-shell nanoparticles on a carbon support, wherein: a core of the core-shell nanoparticles is platinum metal; and a shell of the core-shell nanoparticles is copper metal; wherein: the core-shell nanoparticles have a weight ratio of the copper metal to the platinum metal from about % to about % copper to from about % to about % platinum, with a remaining percentage being the carbon support. 1. A metal-air battery cathode catalyst comprising core-shell nanoparticles on a carbon support , wherein: a core of the core-shell nanoparticles comprises platinum metal; and a shell of the core-shell nanoparticles comprises copper metal; wherein:the core-shell nanoparticles have a weight ratio of the copper metal to the platinum metal from about 4% to about 6% copper to from about 2% to about 12% platinum, with a remaining percentage being the carbon support.2. The metal-air battery cathode catalyst of claim 1 , wherein the ratio is from about 4% to about 6% copper:about 2% to about 12% platinum.3. The metal-air battery cathode catalyst of claim 1 , wherein the ratio is about 5 wt % copper:about 2.5 wt % platinum.4. The metal-air battery cathode catalyst of claim 1 , wherein the ratio is about 5 wt % copper:about 5 wt % platinum.5. The metal-air battery cathode catalyst of claim 1 , wherein the ratio is about 5 wt % copper:about 10 wt % platinum.6. The metal-air battery cathode catalyst of claim 1 , wherein the carbon support comprises synthetic graphite claim 1 , natural graphite claim 1 , amorphous carbon claim 1 , hard carbon claim 1 , soft carbon claim 1 , acetylene black claim 1 , mesocarbon microbeads (MCMB) claim 1 , carbon black claim 1 , Ketjen black claim 1 , mesoporous carbon claim 1 , porous carbon matrix claim 1 , carbon nanotube claim 1 , carbon nanofiber claim 1 , or graphene.7. The metal-air battery cathode catalyst of claim 1 , wherein an average diameter of the nanoparticles is from 1 nm to about 100 nm claim 1 ...

METHOD FOR PRODUCING WHEAT GLUTAMINE PEPTIDE

The present invention discloses a method for producing wheat glutamine peptide using wheat gluten powder as raw material, belonging to the fields of food and biotechnology. The method includes the steps of: performing enzymolysis in two steps using Alcalase and papain with the wheat gluten powder as raw material, to obtain the wheat glutamine peptide with components with molecular weight of less than 1000 Da being more than 90%, characteristic glutamine peptide segment glutamine-arginine-glutamine (Gln-Arg-Gln, QRQ) content being more than 2.0% and glutamine content being up to 23.54% by treating the enzymatic hydrolysate by centrifugation, ultrafiltration, concentration, spray drying, etc. The produced glutamine peptide can be used as functional nutrition composition ingredient in the development and production of ordinary foods, health foods and medicines. 1. An industrial enzymatic hydrolysis method for producing glutamine peptide from wheat gluten powder , comprising the following steps:1) mixing the wheat gluten powder with water with a liquid-feed ratio of 100: 2-20 (L: kg) to form a slurry, adjusting the slurry to pH 8-12, heating to 50-90° C. and stiffing at this temperature for 20-90 min, to form a basic liquid material,2) separating the basic liquid material into supernatant and residue, collecting the residue and diluting the residue with water, heating to 50-80° C., stirring and separating, to obtain a purified residue, and3) mixing the purified residue with water with a water-residue ratio of 100: 10-50, stirring, adjusting to pH 7-9, heating to 40-60° C., and then adding Alcalase in an amount of 1000-8000 units per gram protein, reacting for 1-5 h, after that, adding papain in an amount of 1000-2000 units per gram protein, and performing enzymatic hydrolysis under a temperature of 45-55° C. for 1-3 h, to obtain enzymatic hydrolysate, heating the enzymatic hydrolysate to 120-135° C. to conduct enzyme inactivation, to obtain wheat protein enzymatic ...

METHOD, APPARATUS AND SYSTEM OF DISPLAYING A FILE

A device, method and system of displaying a file on a mobile communication device may comprise duplicating at least a leftmost part of a file to obtain a duplicated leftmost part of the file, and displaying a frame through moving a display window along the frame, the frame comprising a rightmost part of the file and the duplicated leftmost part of the file, wherein the duplicated leftmost part of the file is placed on right of the rightmost part of the file. In some embodiments, the mobile communication device may control the display window to automatically move to a leftmost side of the frame, if the display window moves to a rightmost side of the frame, and further in response to a user instruction of continuing viewing the file. 116-. (canceled)17. An apparatus , comprising:a duplicating module to duplicate at least a leftmost part of a file to obtain a duplicated leftmost part of the file; anda displaying module to display a frame through moving a display window along the frame, the frame comprising a rightmost part of the file and the duplicated leftmost part of the file, wherein the duplicated leftmost part of the file is placed on right of the rightmost part of the file.18. The apparatus of claim 17 , further comprising a movement control module to control the display window to automatically move to a leftmost side of the frame claim 17 , if the display window moves to a rightmost side of the frame.19. The apparatus of claim 18 , wherein the movement control module is to control the display window to automatically move to the leftmost side of the frame claim 18 , further in response to a user instruction of continuing viewing the file.20. The apparatus of claim 17 , wherein the duplicated leftmost part of the file is at least as wide as the display window.21. The apparatus of claim 17 , wherein the rightmost part of the file is at least as wide as the display window.22. The apparatus of claim 17 , wherein the duplicating module is further to place a space or ...

Polymer interlayers having improved sound insulation properties

A polymer interlayer comprising a layer comprising a poly(vinyl acetal) resin having a residual hydroxyl content and a residual acetate content, and a plasticizer, wherein the residual hydroxyl content, the residual acetate content and the plasticizer are selected such that the polymer interlayer has at least one glass transition temperature less than about 20° C. and a peak tan delta of greater than 1.33, and a glass panel having a configuration of 2.3-mm glass//interlayer//2.3-mm glass and at 20° C. has a transmission loss, TL w , of greater than 42 decibels as measured by weighted average sound transmission loss at 2000 to 8000 Hz, and a transmission loss, TL c , of greater than 38 decibels at the coincident frequency is disclosed.

Antenna structure of a communications device

A communications device includes a ground plane, a signal source, a filling material and an antenna. The signal source is electrically connected to the ground plane. The antenna has a predetermined metal pattern and is coupled to the signal source. The filling material is a non-conductive material and the filling material and the predetermined metal pattern are bonded heterogeneously via a surface-mount technology.

ANTENNA STRUCTURE OF A COMMUNICATIONS DEVICE

A communications device includes a system ground plane, a signal source, a device frame, a magnetic conductive material and an antenna. The signal source is electrically coupled to the system ground plane. The device frame is perpendicular to the system ground plane. The antenna is electrically coupled to the signal source and is disposed on the device frame. The magnetic conductive material is disposed adjacent to the antenna but spaced apart by a first predetermined distance from the antenna. The magnetic line of force induced by the antenna is directed in a predetermined direction by the magnetic conductive material. 1. A communications device , comprising:a system ground plane;a signal source, electrically coupled to the system ground plane;a device frame, perpendicular to the system ground plane;a magnetic conductive material; andan antenna, electrically coupled to the signal source and disposed on the device frame,wherein the magnetic conductive material is disposed adjacent to the antenna but spaced apart by a first predetermined distance from the antenna, and wherein magnetic line of force induced by the antenna is directed in a predetermined direction by the magnetic conductive material.2. The communications device as claimed in claim 1 , wherein the magnetic conductive material is directly connected to the system ground plane.3. The communications device as claimed in claim 1 , further comprising:a metal component, disposed adjacent to the antenna but spaced a second predetermined distance away from the antenna,wherein the magnetic conductive material is directly connected to the metal component.4. The communications device as claimed in claim 1 , further comprising:a metal component, disposed adjacent to the antenna but spaced apart by a second predetermined distance from the antenna,wherein the magnetic conductive material is disposed between the antenna and the metal component and the magnetic conductive material is not connected to the metal component. ...

DUAL-BAND ANTENNA STRUCTURE

A dual-band antenna structure includes a ground plane, a signal source, a coupling gap, a first feeding arm, a second feeding arm, a first radiation arm, and a second radiation arm. The first and second feeding arms are electrically coupled to the signal source. The first radiation arm has a first open end and a first grounding point. The second radiation arm has a second open end and a second grounding point. The first and second open ends are opposite each other. The first and second grounding points are electrically connected to the ground plane. 1. A dual-band antenna structure , comprising:a ground plane;a signal source;a coupling gap;a first feeding arm, wherein the first feeding arm is electrically coupled to the signal source;a second feeding arm, wherein the second feeding arm is electrically coupled to the signal source;a first radiation arm, wherein the first radiation arm has a first open end and a first grounding point, and wherein the first grounding point is electrically connected to the ground plane; anda second radiation arm, wherein the second radiation arm has a second open end and a second grounding point, wherein the first open end and the second open end are opposite to each other, and wherein the second grounding point is electrically connected to the ground plane.2. The dual-band antenna structure as claimed in claim 1 , wherein a first coupling loop structure is formed by the first feeding arm and the first radiation arm through the coupling gap.3. The dual-band antenna structure as claimed in claim 1 , wherein a second coupling loop structure is formed by the second feeding arm and the second radiation arm through the coupling gap.4. The dual-band antenna structure as claimed in claim 1 , wherein a first coupling loop structure is formed by the first feeding arm and the first radiation arm through the coupling gap claim 1 , wherein a second coupling loop structure is formed by the second feeding arm and the second radiation arm through the ...

HIGH ANGLE CONSTANT VELOCITY JOINT

A constant velocity joint is provided with at least a pair of tracks whose geometry is defined based on ball path that follows a parametric equation and the parametric function is in the form of a polynomial displacement function of a fourth order or larger. 1. A constant velocity joint for a driveline system comprising:an inner joint part defining a plurality of inner ball races and an outer joint part defining a plurality of outer ball races;the inner ball races and the outer ball races cooperate to form a plurality of tracks which each define a respective travel path, wherein at least one of the respective travel paths or tracks is defined as a constantly changing curve with a non-continuous radius; anda ball located in each of the plurality of tracks.2. The constant velocity joint of claim 1 , wherein at least one of the plurality of tracks is defined by a parametric equation.3. The constant velocity joint of claim 2 , wherein the at least one track of the plurality of tracks includes a first set of tracks defined by a first parametric equation and a second set of tracks defined by a second parametric equation claim 2 , wherein the first parametric equation includes a different coefficient than the second parametric equation.4. The constant velocity joint of claim 2 , wherein the parametric equation is in the form of a polynomial displacement function of a fourth order or larger.5. A constant velocity joint with at least a pair of tracks whose geometry is defined based on ball path that follows a parametric equation and the parametric function is in the form of a polynomial displacement function of a fourth order or larger.6. The constant velocity joint according to claim 5 , wherein the at least one pair of tracks includes a first set of tracks and a second set of tracks claim 5 , wherein the first set of tracks is defined by a parametric equation A and the second set of tracks is defined by a parametric equation B claim 5 , wherein the coefficients of A and B ...

POLY(VINYL ACETAL) RESIN COMPOSITIONS, LAYERS, AND INTERLAYERS HAVING ENHANCED OPTICAL PROPERTIES

Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance. 1. An interlayer comprising:a first resin layer, wherein said first resin layer comprises a first poly(vinyl acetal) resin and a first plasticizer, and wherein said first poly(vinyl acetal) resin has a first refractive index;a second resin layer adjacent to said first resin layer, wherein said second resin layer comprises a second poly(vinyl acetal) resin and a second plasticizer, and wherein said second poly(vinyl acetal) resin has a second refractive index,a third resin layer adjacent to said second resin layer, wherein said third resin layer comprises a third poly(vinyl acetal) resin and a third plasticizer, and wherein said third poly(vinyl acetal) resin has a third refractive index,wherein at least one of said first poly(vinyl acetal) resin, said second poly(vinyl acetal) resin, and said third poly(vinyl acetal) resin comprises residues of an aldehyde having a refractive index of at least 1.421;wherein the difference between the amount of said second plasticizer and amount of at least one of said first plasticizer and said third plasticizer is at least 8 parts per hundred parts of resin, andwherein the absolute value of the difference between said second refractive index and at least one of said first refractive index and said third refractive index is not more than 0.010.2. The interlayer of claim 1 , wherein the difference between the amount of said second plasticizer and the amount of at least one of said first plasticizer and said third plasticizer is at least 10 parts per hundred parts of resin.3. The interlayer of claim 1 , wherein the absolute value of the difference between said ...

TECHNIQUES AND APPARATUS FOR ANISOTROPIC STRESS COMPENSATION IN SUBSTRATES USING ION IMPLANTATION

A method may include providing a substrate, where the substrate includes a first main surface and a second main surface, opposite the first main surface. The second main surface may include a stress compensation layer. The method may include directing ions to the stress compensation layer in an ion implant procedure. The ion implant procedure may include exposing a first region of the stress compensation layer to a first implant process, wherein a second region of the stress compensation layer is not exposed to the first implant process. 1. An apparatus for substrate stress control , comprising:a beam scanner to scan an ion beam with respect to a substrate, the substrate including a stress control layer;a user interface, coupled to the beam scanner;a controller, coupled to the beam scanner and the user interface, the controller comprising:a processor; anda memory unit coupled to the processor, including a scan routine, the scan routine operative on the processor to receive substrate stress information from the user interface and generate an implant pattern to control the beam scanner, the implant pattern to generate an anisotropic stress within the stress control layer.2. The apparatus of claim 1 , the scan routine operative on the processor to generate the implantation pattern as a plurality of implantation stripes.3. The apparatus of claim 1 , the scan routine operative on the processor to direct the beam scanner to:implant a first implantation stripe with a first dose of ions,implant a second implantation stripe, immediately adjacent the first implantation stripe with a second dose of ions, different from the first dose of ions; andimplant a third implantation stripe, immediately adjacent the second implantation stripe and not immediately adjacent the first implantation stripe, with the first dose of ions.4. The apparatus of claim 1 , wherein the implant pattern comprises a first region and a second region claim 1 , the scan routine operative on the processor to ...

EVALUATION AND REPORTING OF RECOVERY READINESS IN A DATA STORAGE MANAGEMENT SYSTEM

An illustrative report server interoperates with one or more enhanced storage managers to evaluate whether backup operations and restore operations meet their recovery point objectives (RPO) and recovery time objectives (RTO), respectively. RTO is evaluated using a tiered approach based on past performance of restore and/or backup operations. The illustrative storage manager executes pre-defined queries that extract relevant information from an associated database that houses information about storage operations. The report server recommends alternative kinds of backup operations for data that fails to meet its RTO using traditional backups. The report server is configured to analyze and report RPO and RTO readiness for several levels of data entities, including multiple systems, single system, groups of clients, single clients, and subclients. 1. A method comprising: wherein the storage manager manages storage operations in a data storage management system,', 'wherein the database comprises information on backup and restore operations in the data storage management system, and', 'wherein the queries extract information on backup and restore operations in the data storage management system to produce query results;, 'by a storage manager that executes on a first computing device comprising one or more first processors and first computer memory, executing queries against a database associated with the storage manager,'}transmitting by the storage manager the query results comprising one of recovery point objectives(RPO) and recovery time objectives (RTO) associated with backup and restore operations from the storage manager to a report server that executes on a second computing device comprising one or more second processors and second computer memory;applying denormalization techniques to the query results to produce denormalized query results; andusing the denormalized query results to produce a report by the report server, wherein the report comprises one of: a ...

POWER SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF

A preparation method for a power semiconductor device includes: providing a lead frame containing a plurality of chip mounting units, one side edge of a die paddle of each chip mounting unit is bent and extended upwardly and one lead connects to the bent side edge of the die paddle and extends in an opposite direction from the die paddle; attaching a semiconductor chip to the top surface of the die paddle; forming metal bumps on each electrode at the front of the semiconductor chip with a top end of each metal bump protruding out of a plane of the top surface of the lead; heating the metal bump and pressing a top end of each metal bump by a pressing plate forming a flat top end surface that is flush with the top surface of the lead; and cutting the lead frame to separate individual chip mounting units. 1. A power semiconductor device comprising:a chip mounting unit, wherein a side edge of a die paddle of the chip mounting unit is bent and extended upwardly and a lead connects to the bent side edge of the die paddle and is horizontally extended out in an opposite direction from the die paddle;a semiconductor chip attached on a top surface of the die paddle;a plurality of electrodes at a front surface the semiconductor chip; anda respective metal bump of a plurality of metal bumps formed on each of the plurality of electrodes at the front surface of the semiconductor chip, wherein a flat top end surface of the respective metal bump is flush with a top surface of the lead.2. The power semiconductor device of further comprising a non-conductive bonding agent coated on the top surface of the die paddle around the semiconductor chip to secure the semiconductor chip on the die paddle.3. (canceled)4. The power semiconductor device of further comprising a plastic packaging body covering the chip mounting unit claim 2 , the semiconductor chip claim 2 , the plurality of metal bumps and the non-conductive bonding agent claim 2 , wherein a bottom surface of the die paddle is ...

POLYMER INTERLAYERS HAVING IMPROVED SOUND INSULATION PROPERTIES

A polymer interlayer comprising a layer comprising a poly(vinyl acetal) resin having a residual hydroxyl content and a residual acetate content, and a plasticizer, wherein the residual hydroxyl content, the residual acetate content and the plasticizer are selected such that the polymer interlayer has at least one glass transition temperature less than about 20° C. and a peak tan delta of greater than 1.29, and a glass panel having a configuration of 2.3-mm glass//interlayer//2.3-mm glass and at 20° C. has a transmission loss, TL, of greater than 41 decibels as measured by weighted average sound transmission loss at 2000 to 8000 Hz, and a transmission loss, TL, of greater than 38 decibels at the coincident frequency is disclosed. 1. A polymer interlayer comprising:a layer comprising a poly(vinyl acetal) resin having a residual hydroxyl content and a residual acetate content, anda plasticizer,wherein the residual hydroxyl content, the residual acetate content and the plasticizer are selected such that the polymer interlayer has at least one glass transition temperature less than about 20° C. and a peak tan delta of greater than 1.29,{'sub': w', 'c, 'and a glass panel having a configuration of 2.3-mm glass//interlayer//2.3-mm glass and at 20° C. has a transmission loss, TL, of greater than 41 decibels as measured by weighted average sound transmission loss at 2000 to 8000 Hz, and a transmission loss, TL, of greater than 38 decibels at the coincident frequency.'}2. The polymer interlayer of claim 1 , wherein the peak tan delta is greater than 1.30.3. The polymer interlayer of claim 1 , wherein the peak tan delta is greater than 1.32.4. The polymer interlayer of claim 1 , wherein the peak tan delta is greater than 1.34.5. The polymer interlayer of claim 1 , wherein the sound transmission loss claim 1 , TL claim 1 , is greater than 41.5 decibels.6. The polymer interlayer of claim 1 , wherein the transmission loss claim 1 , TL claim 1 , is greater than 42 decibels.7. The ...

RECHARGEABLE LITHIUM-HYDROXIDE BASED NON-AQUEOUS LITHIUM OXYGEN BATTERIES

An electrochemical device includes an air cathode; a lithium-containing anode metal; a porous separator; and a non-aqueous electrolyte comprising a lithium salt, a sodium salt, and a solvent; wherein the electrochemical device is a lithium-air battery. 1. An electrochemical device comprising:an air cathode;a lithium-containing anode;a discharge product that is LiOH;a porous separator; anda non-aqueous electrolyte comprising a lithium salt, a sodium salt, and a solvent;wherein the electrochemical device is a lithium-air battery that has been discharged at least one time.2. The electrochemical device of claim 1 , wherein the porous separator comprises a glass fiber material claim 1 , a carbon fiber material claim 1 , polyethylene claim 1 , polypropylene claim 1 , poly/propylene/polyethylene/polypropylene claim 1 , solid state membranes claim 1 , or a combination of any two or more thereof.3. The electrochemical device of claim 1 , wherein the anode further comprises a current collector claim 1 , a conductive carbon material claim 1 , a binder claim 1 , or any combination thereof.4. The electrochemical device of comprising the current collector claim 3 , wherein the current collector comprises copper claim 3 , stainless steel claim 3 , or titanium.5. The electrochemical device of comprising the conductive carbon material claim 3 , wherein the conductive carbon material comprises synthetic graphite claim 3 , natural graphite claim 3 , expanded graphite claim 3 , graphene claim 3 , reduced graphene oxide claim 3 , a metal-organic framework claim 3 , amorphous carbon claim 3 , hard carbon claim 3 , soft carbon claim 3 , carbon black claim 3 , acetylene black claim 3 , carbon spheres claim 3 , mesocarbon microbeads (MCMB) claim 3 , mesoporous carbon claim 3 , porous carbon matrix claim 3 , carbon nanofiber claim 3 , carbon aerogel claim 3 , single-walled carbon nanotubes claim 3 , multi-walled carbon nanotubes claim 3 , carbon nanotube arrays claim 3 , and any mixture of ...

Systems and Methods for Monitoring Organisms Within an Aquatic Environment

Systems and methods for monitoring organisms within an aquatic environment are described. According to one aspect, an injectable acoustic transmission device includes a body configured to be injected inside of an organism, a transducer within the body and configured to convert a plurality of electrical signals into a plurality of data transmissions which are transmitted externally of the body and the organism, a plurality of circuit components within the body and configured to use electrical energy from a power source to generate the electrical signals which are provided to the transducer, and wherein the transducer defines an internal volume and at least one of the circuit components is provided within the internal volume of the transducer. 1. An injectable acoustic transmission device comprising:a body configured to be injected inside of an organism;a transducer within the body which is configured to convert a plurality of electrical signals into a plurality of data transmissions which are transmitted externally of the body and the organism;a plurality of circuit components within the body which are configured to use electrical energy from a power source to generate the electrical signals which are provided to the transducer; andwherein the transducer defines an internal volume and at least one of the circuit components is provided within the internal volume defined by the transducer.2. The device of wherein the circuit components comprise a sensor configured to generate environment data regarding an environment of the device and the data transmissions include the environment data.3. The device of wherein the transducer is configured to transmit the data transmissions externally of the body in a plurality of separate data transmissions.4. The device of further comprising the power source claim 3 , and wherein the circuit components include energy storage circuitry configured to store the electrical energy for the electrical signals which are converted into the ...

SYNTHESIS OF 2,4-DICHLORO-5-TRIFLUOROMETHYL-PYRIMIDINE

This invention relates to a novel method for the synthesis of 2,4-dichloro-5-trifluoromethyl-pyrimidine useful as intermediate in the manufacture of pharmaceutically active ingredients. 1. A method for preparing 5-trifluoromethyl-uracil (5-TFU) comprising{'sub': 3', '2, 'a) trifluoromethylation of uracil with sodium trifluoromethanesulfinate (CFSONa) and organic peroxide in water to form 5-trifluoromethyluracil (5-TFU), wherein the reaction temperature after the addition of an aqueous solution of organic peroxide is kept in a range of about 40-100° C.'}2. Method according to wherein the sodium trifluoromethanesulfinate (CFSONa) used in step a) has a commercial grade of about 50-70% sodium trifluoromethanesulfinate (CFSONa).3. Method according to wherein the commercial grade sodium trifluoromethanesulfinate (CFSONa) is pre-treated before use in step a).4. Method according to wherein the commercial grade sodium trifluoromethanesulfinate (CFSONa) is pre-treated before use in step a) by slurrying in ethyl acetate claim 3 , filtration and concentration.5. Method according to wherein the commercial grade sodium trifluoromethanesulfinate (CFSONa) is pre-treated before use in step a) by slurrying the commercial grade sodium trifluoromethanesulfinate (CFSONa) in ethyl acetate claim 4 , heating of the resulting suspension to about 40-50° C. claim 4 , stirring at this temperature claim 4 , filtering of the suspension claim 4 , adding water to the filtrate and removing substantially all ethyl acetate.6. Method according to wherein the organic peroxide used in step a) is tert-butyl hydroperoxide (TBHP).7. Method according to wherein the organic peroxide used in step a) is tert-butyl hydroperoxide (TBHP) claim 6 , wherein the aqueous solution of tert-butyl hydroperoxide (TBHP) has a content of about 70% tert-butyl hydroperoxide (TBHP).8. Method according to wherein the organic peroxide used in step a) is continuously dosed to the reaction mixture.9. Method according to wherein ...

BLENDS OF POLY(VINYL ACETAL) RESINS FOR COMPOSITIONS, LAYERS, AND INTERLAYERS HAVING ENHANCED OPTICAL PROPERTIES

Resin compositions, layers, and interlayers comprising two or more poly(vinyl acetal) resins and at least one blending agent or haze reducing agent are provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance. 1. An interlayer comprising:a resin layer comprising a blend of at least two poly(vinyl acetal) resins, a plasticizer, and at least one blending agent, wherein said resin layer has at least two glass transition temperatures, wherein the difference between the two glass transition temperatures is at least 5° C.;wherein said blending agent comprises one moiety that is more compatible with said first poly(vinyl acetal) resin than with said second poly(vinyl acetal) resin and a second moiety that is more compatible with the second poly(vinyl acetal) resin than with said first poly(vinyl acetal) resin, wherein said blending agent is present in said resin layer in an amount of at least 0.5 weight percent, based on the total weight of said resin layer.2. The interlayer of claim 1 , wherein said blending agent has an HLB value of not more than 16.3. The interlayer of claim 1 , wherein said blending agent is selected from the group consisting of glycols and glycol ethers.4. The interlayer of claim 1 , wherein said resin layer further comprises at least one plasticizer present in an amount in the range of from at least 10 parts per hundred resin (phr) to less than 50 phr and wherein said resin layer has at least one glass transition temperature in the range of from 26 to 70° C.5. The interlayer of claim 1 , wherein said resin layer further comprises at least one plasticizer present in an amount in the range of at least 10 phr to not more than about 90 phr claim 1 , and wherein said resin layer has at least one glass transition temperature of less than 25° C.6. The interlayer of claim 1 , wherein said blend in said resin layer further comprises a third ...

METHOD OF IMPROVING DECODING SPEED BASED ON OFF-THE-SHELF CAMERA PHONE

A system and method for decoding an image of decodable indicia, the computer system that includes receiving a request to decode an image, disabling the automatic focus on a camera in a client, setting the focus to a predetermined focus point that is close to the camera lens, capturing the image, locating the decodable indicia in the image and decoding the image of decodable indicia. 1. A computer system for decoding an image of decodable indicia , the computer system comprising:one or more processors, one or more computer-readable memories and one or more computer-readable, tangible storage devices; wherein said client is provided by a device comprising a camera and', 'wherein said camera comprises a lens;, 'program instructions, stored on at least one of the one or more storage devices for execution by at least one of the one or more processors via at least one of the one or more memories, to receive a request from a client to decode an image of decodable indicia'}program instructions, stored on at least one of the one or more storage devices for execution by at least one of the one or more processors via at least one of the one or more memories to, responsive to receiving said request, disable the automatic focus setting on said camera; wherein said focus point is the closest to said lens of said group of predetermined focus points and', 'wherein said focus point was not previously selected in response to said request;, 'program instructions, stored on at least one of the one or more storage devices for execution by at least one of the one or more processors via at least one of the one or more memories, to, responsive to receiving said request, select a focus point from a group of predetermined focus points'} 'wherein said client is configured to output said image of decodable indicia;', 'program instructions, stored on at least one of the one or more storage devices for execution by at least one of the one or more processors via at least one of the one or more ...

Autonomous Sensor Fish to Support Advanced Hydropower Development

An improved sensor fish with robust design and enhanced measurement capabilities. This sensor fish contains sensors for acceleration, rotation, magnetic field intensity, pressure, and temperature. A low-power microcontroller collects data from the sensors and stores up to 5 minutes of data on a non-volatile flash memory. A rechargeable battery supplies power to the sensor fish. A recovery system helps locating sensor fish. The package, when ready for use is nearly neutrally buoyant and thus mimics the behavior of an actual fish. 1. A method for collecting environmental data using a sensor fish , the method comprising recovering the sensor fish by actuation by a microcontroller to cause the sensor fish to sever a line dispatching one or more weights and causing the sensor fish to become more buoyant.2. The method of further comprising downloading data from the microcontroller and erasing a portion of memory of said microcontroller to prepare said microcontroller for a subsequent deployment.3. The method of further comprising using the sensor fish to detect at least one parameter comprising one or more of orientation claim 1 , acceleration claim 1 , rotational velocity claim 1 , magnetic field intensity claim 1 , pressure claim 1 , and/or external temperature.4. The method of wherein the sensor fish is nearly neutrally buoyant prior to actuation.5. The method of further comprising sampling data using the sensor fish at up to 8 claim 1 ,192 Hz for a preselected programmable period of time.6. The method of further comprising triggering an alarm to facilitate identification and location of the sensor fish.7. The method of furthering comprising identifying the sensor fish using an LED.8. The method of further comprising identifying the senor fish using a radio frequency (RF) beacon.9. The method of further comprising selectively activating or deactivating the microcontroller by a magnetic field.10. The method of further comprising downloading data collected during use and ...

INJECTABLE ACOUSTIC TRANSMISSION DEVICES AND PROCESS FOR MAKING AND USING SAME

Injectable acoustic tags and a process of making are described for tracking host animals in up to three dimensions. The injectable acoustic tags reduce adverse biological effects and have a reduced cost of manufacture compared with conventional surgically implanted tags. The injectable tags are powered by a single power source with a lifetime of greater than 30 days. The injectable tags have an enhanced acoustic signal transmission range that enhances detection probability for tracking of host animals. 1. An injectable acoustic transmission device , comprising:{'sup': '3', 'an injectable containment vessel that defines an internal volume below about 115 mmfor containing components in a configuration and dimensions that allows the injectable acoustic transmission device to be injectable;'}a power source configured to power operation of the injectable acoustic transmission device over a duration of greater than about 30 days of full-time activity at a selected transmission rate;a controller configured to supply one or more tag codes, each tag code having a selectable code length up to 64-bits and including an identification (ID) code of a selectable bit length therein; andat least one piezoelectric transducer disposed at an end of the containment vessel configured to transmit an acoustic signal containing the one or more tag codes and their respective identification codes encoded therein for the acoustic signal at a receiver disposed external to the injectable acoustic transmission device.2. The device of claim 1 , wherein at least one of the one or more tag codes includes numeric data collected from one or more sensors within the device.3. The device of claim 2 , wherein the numeric data is temperature data collected from a temperature sensor.4. The device of claim 1 , wherein at least one of the at least one piezoelectric transducers includes an inner wall and an outer wall each with a surface electrode claim 1 , the inner wall is offset towards the forward ...

ERROR BLOCK DETERMINATION

In some examples, a window in an image may be identified. At least one property of the window may be identified. Based on the at least one property, whether the window is an error block may be determined. 1. A non-transitory computer-readable storage medium comprising instructions executable by a processor to:identify a window in an image;identify at least one property of the window; anddetermine, based on the at least one property, whether the window is an error block.2. The non-transitory computer-readable storage medium of wherein the at least one property is associated with a title bar of the window.3. The non-transitory computer-readable storage medium of wherein the at least one property comprises a saturation of the title bar.4. The non-transitory computer-readable storage medium of further comprising instructions executable by the processor to:identify another window in an image; andidentify at least one other property of the other window,wherein the instructions to determine whether the window is an error block comprise instructions executable by the processor to determine, based on the at least one property and the at least one other property, which of the window and the other window is the error block.5. The non-transitory computer-readable storage medium of wherein the at least one property comprises a size of the window.6. The non-transitory computer-readable storage medium of wherein the at least one property comprises a widget in the window.7. The non-transitory computer-readable storage medium of wherein the instructions to identify the widget comprise instructions executable by the processor to:identify a feature in the window;compare the feature to a sample widget in a widget library; andclassify the feature as the widget in response to the widget matching the sample widget,wherein the widget comprises an icon associated with an error.8. The non-transitory computer-readable storage medium of wherein the instructions to identify the window comprise ...

In-design real-time electrical impact verification flow

Techniques for analyzing a routed interconnection of a net of a circuit are discussed herein. Some embodiments may include a method comprising with a computer, analyzing the circuit to determine a performance parameter of the net, wherein the circuit is analyzed based at least in part on applying pre-layout simulation data of the net to layout data of the circuit. Additionally or alternatively, the circuit may be analyzed based on extracting characteristics of the routed interconnection from the layout data of the net.

Transmitters for Animals and Methods for Transmitting from Animals

Animal transmitters are provided that can include: a transducer configured to transmit a signal; process circuitry coupled to the transducer; and an energy harvesting element coupled to the process circuitry. Animals having a transmitter coupled thereto are also provided with the transmitter including an energy harvesting element in operational alignment with the animal's musculoskeletal system. Methods for transmitting the location of an animal are also provided with the methods including: coupling a transmitter powered by an energy harvesting element to the animal; and monitoring the transmissions of the transmitter. 1. A method for transmitting the location of an animal , the method comprising:coupling a transmitter powered by an energy harvesting element to the animal; andmonitoring the transmissions of the transmitter.2. The method of further comprising mechanically associating the energy harvesting element with the musculoskeletal system of the animal.3. The method of wherein the musculoskeletal system of the animal includes a portion that is articulated claim 2 , the element being associated with the articulating portion.4. The method of further comprising establishing a range of power levels in the transmitter and transmitting when the power level is above the upper level and storing energy when the power lever is below the lower level.5. The method of further comprising transmitting an acoustic signal.6. The method of further comprising implanting the transmitter within the animal.7. The method of further comprising implanting the transmitter between the midline and dorsal fin of a fish. This application is a divisional of U.S. patent application Ser. No. 15/088,032 which was filed Mar. 31, 2016, entitled “Transmitters for Animals and Methods for Transmitting from Animals”, which claims priority to U.S. Provisional Patent Application Ser. No. 62/267,738 which was filed on Dec. 15, 2015, the entirety of each of which is incorporated by reference herein.This ...

ENZYME BEVERAGE OF NATURAL GARDEN STUFF AND METHOD FOR PREPARING THE SAME

The present invention discloses an enzyme beverage of natural garden stuff and a method for preparing the same. The enzyme beverage is prepared from a fresh juice extracted from fresh garden stuffs and added with marine fish-skin collagen peptide, as a fermentation substrate, by dilution, blending and sterilization followed by stepwise fermentation with and yeast in sequence. With stepwise fermentation of the garden stuff juice from two or more fresh garden stuffs with and yeast, and the addition of marine fish-skin collagen peptide for accelerating growth and metabolism of fermenting strains, said beverage contains more abundant metabolites from the nutritional ingredients of the natural garden stuffs, and will bring more beneficial and nutritional effects on health. 1lactobacillus. An enzyme beverage of natural garden stuff , wherein the enzyme beverage is prepared by stepwise fermentation of a fermentation substrate with and yeast , the fermentation substrate contains a garden stuff pulp and marine fish-skin collagen peptide powder , the garden stuff pulp is prepared by juicing at least two or more kinds of the garden stuff and blending them.2. The enzyme beverage according to claim 1 , wherein the fermentation substrate contains a garden stuff pulp and the marine fish-skin collagen peptide powder claim 1 , the garden stuff pulp is prepared by juicing at least two or more kinds of the garden stuff claim 1 , and one or more kinds of edible fungi and marine algae claim 1 , and blending them.3. The enzyme beverage according to claim 1 , wherein the marine fish-skin collagen peptide powder has an average molecular weight of less than 1000.4. The enzyme beverage according to claim 2 , wherein the marine fish-skin collagen peptide powder has an average molecular weight of less than 1000.5. The enzyme beverage according to claim 1 , where the enzyme beverage is prepared by a method comprising the following steps:(1) preparing a fermentation substrate: juicing at least ...

MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME

An intelligent power module (IPM) has a first, second, third and fourth die paddles, a first, second, third, fourth, fifth and sixth metal-oxide-semiconductor field-effect transistors (MOSFETs), a tie bar, a metal slug, a plurality of spacers, a plurality of leads and a molding encapsulation. The molding encapsulation encloses the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth MOSFETs, the tie bar and the plurality of spacers. A bottom surface of the metal slug is exposed from the molding encapsulation. A process for fabricating the IPM comprises preparing the first, second, third and fourth die paddles, the first, second, third, fourth, fifth and sixth MOSFETs, the tie bar, the plurality of leads, the metal slug and the plurality of spacers and applying a molding process to form the molding encapsulation. 1. A method for fabricating an intelligent power module (IPM) for driving a motor , the method comprising the steps of:providing a leadframe comprising a first, second, third and fourth die paddles and a plurality of leads;providing a first transistor attached to a top surface of the first die paddle, a second transistor attached to a top surface of the second die paddle, a third transistor attached to a top surface of the third die paddle, a fourth, fifth, and sixth transistors attached to a top surface of the fourth die paddle;electrically connecting the first, second, third, fourth, fifth, and sixth transistors to the plurality of leads respectively;providing a metal slug and a plurality of spacers; wherein the plurality of spacers are between the metal slug and the first, second, third and fourth die paddles; and wherein the plurality of spacers separate the metal slug from contacting the first, second, third, and fourth die paddles; andapplying a molding process to form a molding encapsulation enclosing the first, second, third, and fourth die paddles, the first, second, third, fourth, fifth, and sixth ...

POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHOD

A power semiconductor device package includes a conductive assembly including a connecting structure and a semiconductor die having an aperture formed therethrough, the aperture being sized and configured to spacedly receive the connecting structure. In an alternative embodiment, a power semiconductor device package includes a conductive assembly including a connecting structure and a pair of semiconductor die disposed on either side of the connecting structure in spaced relationship thereto. 1. A power semiconductor device package comprising:a semiconductor die having opposed sides and contacts, a first set of which is disposed on one of said opposed sides and a second set of which is disposed on the remaining side of said opposed sides; andan electrically conductive assembly in mechanical contact with said first set and having an electrically conductive connecting structure, extending away from said first set toward said remaining side and terminating proximate to said second set,wherein said semiconductor die includes an aperture extending between said opposed sides, with said electrically conductive assembly passing through said aperture.2. The device of wherein said aperture is located approximately in the center of said electrically conductive assembly.3. A power semiconductor device package comprising:a plurality of spaced-apart semiconductor die each of which has opposed side and a plurality of contacts a first set of which is disposed on one of said opposed sides and a second set of which is disposed on the remaining side of said opposed sides; andan electrically conductive assembly in mechanical contact with said first set and having an electrically conductive connecting structure disposed between said plurality of spaced-apart semiconductor die and extending along a first direction away from said first set toward said remaining side and terminating proximate to said second set.4. The device of wherein electrically conductive assembly and its connecting ...

HIGH RIGIDITY INTERLAYERS AND LIGHT WEIGHT LAMINATED MULTIPLE LAYER PANELS

This disclosure is related to the field of polymer interlayers for multiple layer panels and multiple layer panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of high rigidity interlayers and light weight laminated multiple layer panels incorporating high rigidity interlayers. 2. The multi-layer interlayer of claim 1 , wherein at least one of the stiff polymer layers has a plasticizer content of less than or equal to about 30 phr.3. The multi-layer interlayer of claim 1 , wherein at least one of the stiff polymer layers has a plasticizer content of less than or equal to about 28 phr.4. The multi-layer interlayer of claim 1 , wherein the plasticizer content in the first stiff polymer layer is different from the plasticizer content in the second stiff polymer layer.5. The multi-layer interlayer of claim 1 , wherein the first stiff polymer layer and second stiff polymer layer have a glass transition temperature of greater than 33° C.6. The multi-layer interlayer of claim 1 , wherein the amount of plasticizer in the soft polymer layer is at least 13 phr greater than the amount of plasticizer in the stiff polymer layers.7. The multi-layer interlayer of claim 1 , wherein the amount of plasticizer in the soft polymer layer is at least 20 phr greater than the amount of plasticizer in the stiff polymer layers.8. The multi-layer interlayer of claim 1 , wherein the amount of plasticizer in the soft polymer layer is at least 25 phr greater than the amount of plasticizer in the stiff polymer layers.9. The multi-layer interlayer of claim 1 , wherein the soft polymer layer has a glass transition temperature of less than 15° C.10. The multi-layer interlayer of claim 1 , wherein the soft polymer layer has a glass transition temperature of less than 5° C.11. The multi-layer interlayer of claim 1 , wherein the soft polymer layer has a glass transition temperature of less than 0° C.12. A multi-layer interlayer comprising:a stiff ...

WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKSIDE METALLIZATION

A wafer process for molded chip scale package (MCSP) comprises: depositing metal bumps on bonding pads of chips on a wafer; forming a first packaging layer at a front surface of the wafer to cover the metal bumps; forming an un-covered ring at an edge of the wafer to expose two ends of each scribe line of a plurality of scribe lines; thinning the first packaging layer to expose metal bumps; forming cutting grooves; grinding a back surface of the wafer to form a recessed space and a support ring at the edge of the wafer; depositing a metal seed layer at a bottom surface of the wafer in the recessed space; cutting off an edge portion of the wafer; flipping and mounting the wafer on a substrate; depositing a metal layer covering the metal seed layer; removing the substrate from the wafer; and separating individual chips from the wafer by cutting through the first packaging layer, the wafer, the metal seed layers and the metal layers along the scribe lines. 1. A wafer process for molded chip scale package (MCSP) for packaging semiconductor chips formed at a front surface of a semiconductor wafer , each semiconductor chip comprising a plurality of metal bonding pads formed on a respective front surface of said each semiconductor chip , the wafer process comprising the steps of:forming a respective metal bump on each of the plurality of metal bonding pads;forming a first packaging layer at the front surface of the semiconductor wafer to cover the metal bumps, wherein a radius of the first packaging layer is smaller than a radius of the semiconductor wafer so as to form an un-covered ring at an edge of the semiconductor wafer, and wherein two ends of each scribe line of a plurality of scribe lines are located between two adjacent semiconductor chips and extend to a front surface of the un-covered ring;thinning the first packaging layer to expose the metal bump from the first packaging layer;forming a respective cutting groove on a front surface of the thinned first ...

DRIVE MECHANISM, MASSAGE MECHANISM AND MASSAGE GUN

A drive mechanism, a massage mechanism and a massage gun are provided and belong to the technical field of power transmission. The drive mechanism includes: a drive motor; a first eccentric wheel, an end surface thereof fixedly connected to an output shaft of the drive motor and another end surface thereof provided with a first eccentric shaft; a drive lever, arranged on a side of the first eccentric wheel facing away from the drive motor and an end thereof being assembled with the first eccentric shaft by a first bearing; a second eccentric shaft, assembled on another end of the drive lever facing away from the first eccentric shaft; a second eccentric wheel, assembled with the second eccentric shaft by a second bearing and an end thereof facing away from the second eccentric shaft being provided with a fixing part; and a transmission piston, pivotally connected with the drive lever. 1. A drive mechanism , comprising:a drive motor;a first eccentric wheel, wherein an end surface of the first eccentric wheel is fixedly connected to an output shaft of the drive motor, and another end surface of the first eccentric wheel is provided with a first eccentric shaft;a drive lever, provided on a side of the first eccentric wheel facing away from the drive motor, wherein an end of the drive lever is engaged with the first eccentric shaft by a first bearing;a second eccentric shaft, disposed on an end of the drive lever facing away from the first eccentric shaft;a second eccentric wheel, engaged with the second eccentric shaft by a second bearing, wherein an end of the second eccentric wheel facing away from the second eccentric shaft is provided with a fixing part; anda transmission piston, pivotally connected to the drive lever.2. The drive mechanism according to claim 1 , wherein an edge of the first eccentric wheel is provided with a marking portion claim 1 , the first eccentric wheel and the second eccentric wheel have the same structure claim 1 , and the marking portion ...