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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 10. Отображено 10.
20-02-2013 дата публикации

LED package, emitter package and method for emitting light

Номер: CN102938443A
Автор: Leung Michael S., Keller Bernd, Ibbetson James, Tarsa Eric J.
Принадлежит:

An LED package comprises an LED for emitting LED light, and a conversion material remote to said LED for down-converting the wavelength of LED light. The package further comprises a reflector directing at least some of the LED light toward the conversion material; the conversion material down-converting the wavelength of at least some of the reflected LED light. A method for emitting light from an LED package comprising providing an LED, reflector and conversion material, and emitting light from said LED, at least some of the LED light emitted toward the reflector. The method further comprises reflecting at least some of the LED light toward the conversion material, and converting at least some of said reflected LED light at the conversion material. At least some of the converted reflected LED light is emitted by the LED package.

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Номер записи: 1
22-08-2013 дата публикации

SOLID STATE LAMP WITH LIGHT DIRECTING OPTICS AND DIFFUSER

Номер: US20130214666A1
Автор: Edmond John A., Leung Michael S., Tarsa Eric J.
Принадлежит: CREE, INC.

Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, a reflective optical element, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of an arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional pattern of the LEDs to a more omni-directional pattern. 1. A solid state lamp , comprising:an array of solid state emitters;a three-dimensional reflective optical element over at least one of said solid state emitters, said optical element modifying the emission pattern of said array to produce a more omni-directional lamp emission pattern.2. The lamp of claim 1 , wherein said optical element comprises reflective surfaces claim 1 , at least some of said array light reflecting off at least one of said surfaces.3. The lamp of claim 1 , wherein said optical element comprises a cavity.4. The lamp of claim 3 , wherein said cavity extends through the length of said optical element.5. The lamp of claim 3 , wherein said array comprises at least one solid state emitter in said cavity.6. The lamp of claim 3 , wherein said array comprises more than one solid state emitter around the base of said optical element.7. The lamp of claim 1 , wherein the outer surface of said optical element is solid.8. The lamp of claim 1 , wherein said solid state emitters are mounted on a carrier.9. The lamp of claim 8 , wherein said optical element is mounted on said carrier.10. The lamp of claim 1 , wherein at least one of said solid state emitters is coated with ...

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Номер записи: 2
10-07-2014 дата публикации

MOLDED CHIP FABRICATION METHOD AND APPARATUS

Номер: US20140191259A1
Автор: Ibbetson James, Leung Michael S., Tarsa Eric J.
Принадлежит: CREE, INC.

A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices. 1. A method for fabricating a solid state light emitter , comprising:bonding at least one light emitting diode (LED) chip to a temporary bonding media;applying a coating to the at least one LED chip on the bonding media; andremoving the at least one LED chip with said coating from the bonding media.2. The method of claim 1 , wherein said LED chip comprises first and second contacts on opposite surfaces claim 1 , wherein one of said contacts on said bonding media.3. The method of claim 2 , wherein at least a portion of a surface of said one of said contacts is not covered by said coating material.4. The method of claim 1 , wherein said LED chip comprises first and second contacts on the same side of said LED chip claim 1 , wherein both ...

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Номер записи: 3
27-06-2019 дата публикации

MOLDED CHIP FABRICATION METHOD AND APPARATUS

Номер: US20190198725A1
Автор: Ibbetson James, Leung Michael S., Tarsa Eric J.
Принадлежит:

A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices. 1. A light emitting diode (LED) device , comprising:a LED at least partially embedded in a matrix material, wherein the outer surface of said matrix material comprises a plurality of planar surfaces and wherein at least one surface of said LED is uncovered by said matrix material.2. The LED device of claim 1 , wherein said matrix material comprises an encapsulant.3. The LED device of claim 1 , wherein said matrix material comprises epoxy or silicone.4. The LED device of claim 1 , wherein said matrix material comprises a conversion material.5. The LED device of claim 1 , wherein said matrix material is substantially cube-shaped.6. The LED device of claim 1 , wherein said LED is substantially square shaped.7. The LED device of claim 1 , ...

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Номер записи: 4
29-03-2011 дата публикации

Molded chip fabrication method

Номер: US7915085B2
Автор: Eric J. Tarsa, James Ibbetson, Michael S. Leung
Принадлежит: Cree Inc

A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

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Номер записи: 5
22-10-2019 дата публикации

Solid state lamp with light directing optics and diffuser

Номер: US10451251B2
Автор: Eric J. Tarsa, John A. Edmond, Michael S. Leung
Принадлежит: IDEAL Industries Lighting LLC

Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, a reflective optical element, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of an arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional pattern of the LEDs to a more omni-directional pattern.

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Номер записи: 6
25-12-2018 дата публикации

Molded chip fabrication method and apparatus

Номер: US10164158B2
Автор: Eric J. Tarsa, James Ibbetson, Michael S. Leung
Принадлежит: Cree Inc

A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

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Номер записи: 7
28-07-2015 дата публикации

Molded chip fabrication method and apparatus

Номер: US9093616B2
Автор: Eric J. Tarsa, James Ibbetson, Michael S. Leung
Принадлежит: Cree Inc

A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

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Номер записи: 8
11-08-2015 дата публикации

Molded chip fabrication method and apparatus

Номер: US9105817B2
Автор: Eric J Tarsa, James Ibbetson, Michael S Leung
Принадлежит: Cree Inc

A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

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Номер записи: 9
28-01-2020 дата публикации

Molded chip fabrication method and apparatus

Номер: US10546978B2
Автор: Eric J. Tarsa, James Ibbetson, Michael S. Leung
Принадлежит: Cree Inc

A light emitting diode (LED) is disclosed comprising a plurality of semiconductor layers with a first contact on the bottom surface of the semiconductor layers and a second contact on the top surface of the semiconductor layer. A coating is included that comprises a cured binder and a conversion material that at least partially covers the semiconductor layers, wherein the second contact extends through the coating and is exposed on the same plane as the top surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light. In other embodiments first and second contacts are accessible from one side of the LED. A coating is included that comprises a cured binder and a conversion material. The coating at least partially covers the semiconductor layers, with the first and second contacts extending through the coating and exposed on the same plane as a surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light.

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Номер записи: 10