Molded chip fabrication method and apparatus

28-01-2020 дата публикации

Номер:

US10546978B2

Автор: Eric J. Tarsa, James Ibbetson, Michael S. Leung

Принадлежит: Cree Inc

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/5 H01L21/56 H01L21/565 H01L22 H01L222 H01L2224 H01L2224/H01L2224/2 H01L2224/25 H01L2224/251 H01L2224/2518 H01L24 H01L24/H01L24/9 H01L24/96 H01L27 H01L27/H01L27/1 H01L27/15 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/1 H01L2924/12 H01L2924/120 H01L2924/1204 H01L2924/12041 H01L2924/18 H01L2924/181 H01L2924/1815 H01L293 H01L2933 H01L2933/H01L2933/0 H01L2933/00 H01L2933/004 H01L2933/0041 H01L3 H01L33 H01L33/H01L33/5 H01L33/50 H01L33/504

IPC - классификация

C C0 C09 C09K C09K1 C09K11 C09K11/C09K11/7 C09K11/77 C09K11/773 C09K11/7734 F F2 F21 F21V F21V9 F21V9/F21V9/3 F21V9/38 H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/4 H01L23/43 H01L23/433 H01L23/4334

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