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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 74. Отображено 74.
20-10-2011 дата публикации

CLOSED-LOOP CONTROL FOR IMPROVED POLISHING PAD PROFILES

Номер: US20110256812A1
Автор: Sivakumar Dhandapani, Jun Qian, Christopher D. Cocca, Jason G. Fung, Shou-Sung Chang, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai, DHANDAPANI SIVAKUMAR, QIAN JUN, COCCA CHRISTOPHER D, FUNG JASON G, CHANG SHOU-SUNG, GARRETSON CHARLES C, MENK GREGORY E, TSAI STAN D, COCCA CHRISTOPHER D., FUNG JASON G., GARRETSON CHARLES C., MENK GREGORY E., TSAI STAN D.
Принадлежит: APPLIED MATERIALS, INC.

Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

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Номер записи: 1
30-06-2009 дата публикации

Polishing article with integrated window stripe

Номер: US0007553214B2
Автор: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung, MENK GREGORY E, MCREYNOLDS PETER, RONDUM ERIK S, IYER ANAND N, PRABHU GOPALAKRISHNA B, LEUNG GARLEN C, MENK GREGORY E., RONDUM ERIK S., IYER ANAND N., PRABHU GOPALAKRISHNA B., LEUNG GARLEN C.
Принадлежит: Applied Materials, Inc., APPLIED MATERIALS INC, APPLIED MATERIALS, INC.

A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.

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Номер записи: 2
13-10-2009 дата публикации

Polishing apparatus with grooved subpad

Номер: US0007601050B2
Автор: Steven M. Zuniga, Peter McReynolds, Erik S. Rondum, Benjamin A. Bonner, Henry H. Au, Gregory E. Menk, Gopalakrishna B. Prabhu, Anand N. Iyer, Garlen C. Leung, ZUNIGA STEVEN M, MCREYNOLDS PETER, RONDUM ERIK S, BONNER BENJAMIN A, AU HENRY H, MENK GREGORY E, PRABHU GOPALAKRISHNA B, IYER ANAND N, LEUNG GARLEN C, ZUNIGA STEVEN M., RONDUM ERIK S., BONNER BENJAMIN A., AU HENRY H., MENK GREGORY E., PRABHU GOPALAKRISHNA B., IYER ANAND N., LEUNG GARLEN C.
Принадлежит: Applied Materials, Inc., APPLIED MATERIALS INC, APPLIED MATERIALS, INC.

A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.

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Номер записи: 3
20-02-2007 дата публикации

Materials for chemical mechanical polishing

Номер: US0007179159B2
Автор: Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum, Robert L. Jackson, Garlen Leung, BONNER BENJAMIN A, MCREYNOLDS PETER, MENK GREGORY E, IYER ANAND N, PRABHU GOPALAKRISHNA B, RONDUM ERIK S, JACKSON ROBERT L, LEUNG GARLEN, BONNER BENJAMIN A., MENK GREGORY E., IYER ANAND N., PRABHU GOPALAKRISHNA B., RONDUM ERIK S., JACKSON ROBERT L.
Принадлежит: Applied Materials, Inc., APPLIED MATERIALS INC, APPLIED MATERIALS, INC.

A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

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Номер записи: 4
18-08-2008 дата публикации

DECHUCK APPARATUS USING A SUBPAD WITH A RECESS HAVING A CENTER REGION WITHOUT GROOVES ON AN UPPER SURFACE OF A PLATEN

Номер: KR1020080075468A
Автор: BONNER BENJAMIN A., MCREYNOLDS PETER, MENK GREGORY E., PRABHU GOPALAKRISHNA B., IYER ANAND N., LEUNG GARLEN C., ZUNIGA STEVEN M., RONDUM ERIK S., AU HENRY H.
Принадлежит:

PURPOSE: A dechuck apparatus using a subpad with a recess is provided to prevent a latent deformation of a polishing sheet into a groove from being interfered with a polishing uniformity. CONSTITUTION: A polishing apparatus includes a platen(100), a sub pad, a vacuum source, a carrier head(80), a motor(76), and a controller. The sub pad is formed on the platen to support a polishing sheet having a polishing surface. The sub pad has an inner recess. The vacuum source is connected to the recess of the sub pad and applies a vacuum state, such that the polishing sheet is attached to the recess of the sub pad. The carrier head holds a substrate with respect to the polishing surface and lifts the substrate away from the polishing surface. The motor moves the carrier head on the polishing surface. The controller is configured to arrange the substrate to be apart from the recess, while the substrate is polished, and control the carrier head to lift the substrate from the polishing surface, while ...

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Номер записи: 5
11-02-2010 дата публикации

CHEMICAL MECHANICAL POLISHER WITH HEATER AND METHOD

Номер: US2010035515A1
Автор: MARKS ROBERT, LEE CHRISTOPHER HEUNG-GYUN, LEUNG GARLEN C, MENK GREGORY E, DIAO JIE, RONDUM ERIK S, LEUNG GARLEN C., MENK GREGORY E., RONDUM ERIK S.
Принадлежит:

A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.

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Номер записи: 6
21-08-2007 дата публикации

POLISHING SURFACE CAPABLE OF PREVENTING POTENTIAL DEFORMATION OF POLISHING SHEET IN GROOVE FROM INTERFERING POLISHING UNIFORMITY

Номер: KR1020070082573A
Автор: BONNER BENJAMIN A., MCREYNOLDS PETER, MENK GREGORY E., PRABHU GOPALAKRISHNA B., IYER ANAND N., LEUNG GARLEN C., ZUNIGA STEVEN M., RONDUM ERIK S., AU HENRY H.
Принадлежит:

PURPOSE: A polishing surface is provided to prevent potential deformation of a polishing sheet in a groove from interfering polishing uniformity. CONSTITUTION: A polishing member has a linear polishing sheet having a linear transparent portion, in which the linear transparent portion has flexibility so that it passes a hole having a radius of about 2.5 inches. An upper surface of the polishing sheet is substantially positioned on a plane together with an upper surface of the linear transparent sheet. The linear transparent portion is made of polyurethane. The upper surface of the linear polishing sheet has durability sufficient to withstand conditioning by a conditioning tool. © KIPO 2007 ...

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Номер записи: 7
14-07-2010 дата публикации

Retaining ring with shaped profile

Номер: CN0101778697A
Автор: PRABHU GOPALAKRISHNA B, MENK GREGORY E, JEONGHOON OH, YIN YUAN, PRABHU GOPALAKRISHNA B., MENK GREGORY E., OH JEONGHOON, YUAN YIN
Принадлежит:

Retaining rings with curved or chamfered surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved or chamfered surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.

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Номер записи: 8
18-08-2008 дата публикации

POLISHING MEMBER WITH A WINDOW STRIPE HAVING A GROOVE PATTERN FOR FACILITATING SLURRY DISTRIBUTION BETWEEN A WAFER AND A POLISHING SURFACE

Номер: KR1020080075470A
Автор: BONNER BENJAMIN A., MCREYNOLDS PETER, MENK GREGORY E., PRABHU GOPALAKRISHNA B., IYER ANAND N., LEUNG GARLEN C., ZUNIGA STEVEN M., RONDUM ERIK S., AU HENRY H.
Принадлежит:

PURPOSE: A polishing member with a window stripe is provided to extend a lifetime of a sub pad to be longer than that of a polishing layer by preventing the sub pad from being eroded less than the polishing sheet or a polishing pad. CONSTITUTION: A polishing member includes a polishing layer and a linear polishing sheet(110), which has a linear transparent region molded on the polishing layer. The polishing layer is formed of a non-fixed polishing material containing polyurethane having voids. An uppermost surface of the linear polishing sheet is arranged on the same plane as an uppermost surface of the linear transparent region. The linear transparent region contains the polyurethane without voids and is made of a flexible material, which passes between 2.5-inch-wide rollers with a 60 Shore D scale strength and without cracking. © KIPO 2008 ...

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Номер записи: 9
05-03-2013 дата публикации

Retaining ring with shaped profile

Номер: US0008388412B2
Автор: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk, PRABHU GOPALAKRISHNA B, YUAN YIN, OH JEONGHOON, MENK GREGORY E, PRABHU GOPALAKRISHNA B., MENK GREGORY E.
Принадлежит: Applied Materials, Inc., PRABHU GOPALAKRISHNA B, YUAN YIN, OH JEONGHOON, MENK GREGORY E, APPLIED MATERIALS INC, PRABHU GOPALAKRISHNA B., MENK GREGORY E., APPLIED MATERIALS, INC.

Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.

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Номер записи: 10
23-08-2007 дата публикации

Polishing article with window stripe

Номер: US2007197145A1
Автор: MENK GREGORY E, MCREYNOLDS PETER, RONDUM ERIK S, PRABHU GOPALAKRISHNA B, IYER ANAND N, LEUNG GARLEN C, MENK GREGORY E., RONDUM ERIK S., PRABHU GOPALAKRISHNA B., IYER ANAND N., LEUNG GARLEN C.
Принадлежит:

A polishing article is described. The polishing article includes a linear polishing sheet having a linear transparent portion, wherein the linear transparent portion is formed from a material that has the flexibility to pass around a radius of about 2.5 inches without cracking.

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Номер записи: 11
28-08-2014 дата публикации

METHOD OF FORMING POLISHING SHEET

Номер: US20140237905A1
Автор: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung, BONNER BENJAMIN A, PRABHU GOPALAKRISHNA B, RONDUM ERIK S, MENK GREGORY E, IYER ANAND N, MCREYNOLDS PETER, LEUNG GARLEN C, BONNER BENJAMIN A., PRABHU GOPALAKRISHNA B., RONDUM ERIK S., MENK GREGORY E., IYER ANAND N., LEUNG GARLEN C.
Принадлежит: Applied Materials, Inc.

A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt. 111-. (canceled)12. A method of forming a polishing article , comprising:depositing a liquid precursor on a moving belt;at least partially curing the liquid precursor while on the moving belt to form a polishing layer; anddetaching the polishing layer from the belt.13. The method of claim 12 , wherein depositing the liquid precursor includes depositing the liquid precursor onto a carrier sheet supported on the belt.14. The method of claim 13 , wherein the carrier sheet comprises a thin polyethylene terephthalate polyester film.15. The method of claim 13 , further comprising removing the polishing layer from the carrier sheet.16. The method of claim 15 , further comprising grinding top and bottom surfaces of the polishing layer.17. The method of claim 12 , wherein at least partially curing the liquid precursor includes heating.18. The method of claim 12 , further comprising fully curing the polishing sheet after the polishing sheet is detached from the belt.19. The method of claim 12 , further comprising compressing the polishing sheet.20. The method of claim 15 , wherein compressing includes passing the polishing sheet between pinch rollers.21. The method of claim 12 , further comprising forming grooves in the polishing sheet.22. The method of claim 12 , further comprising trimming edges of the polishing sheet. This application is a divisional of and claims priority to U.S. patent application Ser. No. 12/263,908, filed on Nov. 3, 2008, the entire contents of which are hereby incorporated by reference.This ...

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Номер записи: 12
26-01-2012 дата публикации

REAL-TIME MONITORING OF RETAINING RING THICKNESS AND LIFETIME

Номер: US20120021671A1
Автор: Peter McReynolds, Eric S. Rondum, Garlen C. Leung, Adam H. Zhong, Gregory E. Menk, Gopalakrishna B. Prabhu, Thomas H. Osterheld, MCREYNOLDS PETER, RONDUM ERIC S, LEUNG GARLEN C, ZHONG ADAM H, MENK GREGORY E, PRABHU GOPALAKRISHNA B, OSTERHELD THOMAS H, RONDUM ERIC S., LEUNG GARLEN C., ZHONG ADAM H., MENK GREGORY E., PRABHU GOPALAKRISHNA B., OSTERHELD THOMAS H.
Принадлежит: APPLIED MATERIALS, INC.

A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, a method for monitoring at least one surface of a retaining ring coupled to a carrier head is provided. The method includes moving the carrier head adjacent a sensor device disposed in a polishing module, transmitting energy from the sensor device toward the retaining ring, receiving energy reflected from the retaining ring, and determining a condition of the retaining ring based on the received energy.

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Номер записи: 13
20-06-2006 дата публикации

Polishing processes for shallow trench isolation substrates

Номер: US0007063597B2
Автор: Gopalakrishna B. Prabhu, Thomas H. Osterheld, Garlen C. Leung, Adam H. Zhong, Peter McReynolds, Yi-Yung Tao, Gregory E. Menk, Vasanth N. Mohan, Christopher Heung-Gyun Lee, PRABHU GOPALAKRISHNA B, OSTERHELD THOMAS H, LEUNG GARLEN C, ZHONG ADAM H, MCREYNOLDS PETER, TAO YI-YUNG, MENK GREGORY E, MOHAN VASANTH N, LEE CHRISTOPHER HEUNG-GYUN, PRABHU GOPALAKRISHNA B., OSTERHELD THOMAS H., LEUNG GARLEN C., ZHONG ADAM H., MENK GREGORY E., MOHAN VASANTH N.
Принадлежит: Applied Materials, APPLIED MATERIALS INC, APPLIED MATERIALS

Methods and compositions are provided for planarizing a substrate surface with reduced or minimal topographical defect formation during a polishing process for dielectric materials. In one aspect a method is provided for polishing a substrate containing two or more dielectric layers, such as silicon oxide, silicon nitride, silicon oxynitride, with at least one processing step using a fixed-abrasive polishing article as a polishing article. The processing steps may be used to remove all, substantially all, or a portion of the one or more dielectric layers, which may include removal of the topography, the bulk dielectric, or residual dielectric material of a dielectric layer in two or more steps.

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Номер записи: 14
29-12-2015 дата публикации

Endpointing with selective spectral monitoring

Номер: US0009221147B2
Автор: Jun Qian, Sivakumar Dhandapani, Benjamin Cherian, Thomas H. Osterheld, Jeffrey Drue David, Gregory E. Menk, Boguslaw A. Swedek, Doyle E. Bennett, QIAN JUN, DHANDAPANI SIVAKUMAR, CHERIAN BENJAMIN, OSTERHELD THOMAS H, DAVID JEFFREY DRUE, MENK GREGORY E, SWEDEK BOGUSLAW A, BENNETT DOYLE E, OSTERHELD THOMAS H., MENK GREGORY E., SWEDEK BOGUSLAW A., BENNETT DOYLE E.
Принадлежит: Applied Materials, Inc., QIAN JUN, DHANDAPANI SIVAKUMAR, CHERIAN BENJAMIN, OSTERHELD THOMAS H, DAVID JEFFREY DRUE, MENK GREGORY E, SWEDEK BOGUSLAW A, BENNETT DOYLE E, APPLIED MATERIALS INC, OSTERHELD THOMAS H., MENK GREGORY E., SWEDEK BOGUSLAW A., BENNETT DOYLE E., APPLIED MATERIALS, INC.

A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.

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Номер записи: 15
02-02-2012 дата публикации

RETAINING RING WITH SHAPED PROFILE

Номер: US20120028548A1
Автор: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk, PRABHU GOPALAKRISHNA B, YUAN YIN, OH JEONGHOON, MENK GREGORY E, PRABHU GOPALAKRISHNA B., MENK GREGORY E.
Принадлежит:

Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.

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Номер записи: 16
30-10-2014 дата публикации

METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS

Номер: US20140323017A1
Автор: Jianshe Tang, Thomas H. Osterheld, Fred C. Redeker, Gregory E. Menk, TANG JIANSHE, OSTERHELD THOMAS H, REDEKER FRED C, MENK GREGORY E, OSTERHELD THOMAS H., REDEKER FRED C., MENK GREGORY E.
Принадлежит:

Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects. 1. A chemical mechanical polishing (CMP) system comprising:a polishing pad configured to be rotated on a platen;a polishing head configured to hold a substrate against the polishing pad; andan energized fluid delivery assembly configured to apply an energized fluid to the polishing pad to dislodge slurry residue and debris from the polishing pad.2. The CMP system of wherein the energized fluid delivery assembly includes an acoustically energized fluid delivery unit configured to impart acoustic energy to a fluid and to direct the energized fluid toward the polishing pad.3. The CMP system of wherein the energized fluid delivery assembly includes a pressurized gas energized fluid delivery unit configured to impart energy in the form of pressurized gas to a liquid and to direct the energized fluid toward the polishing pad.4. The CMP system of wherein the energized fluid delivery assembly includes a thermally energized fluid delivery unit configured to impart thermal energy to a liquid sufficient to cause the liquid to change state to a gas and to direct the energized fluid toward the polishing pad.5. The CMP system of further including a vacuum suction unit configured to remove slurry residue and debris dislodged by application of the energized fluid to the polishing pad.6. The CMP system of further including a controller operative to monitor the polishing pad to determine if the polishing pad has been cleaned.7. The CMP ...

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Номер записи: 17
13-06-2012 дата публикации

Polishing article

Номер: CN0101244535B
Автор: PETER MCREYNOLDS, BONNER BENJAMIN A, AU HENRY H, ZUNIGA STEVEN M, MENK GREGORY E, IYER ANAND N, PRABHU GOPALAKRISHNA B, RONDUM ERIK S, LEUNG GARLEN C, MCREYNOLDS PETER, BONNER BENJAMIN A., AU HENRY H., ZUNIGA STEVEN M., MENK GREGORY E., IYER ANAND N., PRABHU GOPALAKRISHNA B., RONDUM ERIK S., LEUNG GARLEN C.
Принадлежит:

The invention provides a polishing article including a polishing sheet; and a solid light-transmissive window in the polishing sheet. The solid transmissive window has a main axis and a non-linear edge that extends along the main axis, wherein the non-linear edge includes a plurality of projections vertical to the main axis, the plurality of parallel projections and a plurality of projections of the polishing material are interlaced with each other.

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Номер записи: 18
24-04-2014 дата публикации

ENDPOINTING WITH SELECTIVE SPECTRAL MONITORING

Номер: US20140113524A1
Автор: Jun Qian, Sivakumar Dhandapani, Benjamin Cherian, Thomas H. Osterheld, Jeffrey Drue David, Gregory E. Menk, Boguslaw A. Swedek, Doyle E. Bennett, QIAN JUN, DHANDAPANI SIVAKUMAR, CHERIAN BENJAMIN, OSTERHELD THOMAS H, DAVID JEFFREY DRUE, MENK GREGORY E, SWEDEK BOGUSLAW A, BENNETT DOYLE E, OSTERHELD THOMAS H., MENK GREGORY E., SWEDEK BOGUSLAW A., BENNETT DOYLE E.
Принадлежит:

A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values. 1. A method of controlling polishing , comprising:polishing a substrate;monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra;selecting less than all of the measured spectra to generate a sequence of selected spectra;generating a sequence of values from the sequence of selected spectra; anddetermining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.2. The method of claim 1 , wherein selecting less than all of the measured spectra comprises comparing each measured spectrum from the sequence of measured spectra to a baseline spectrum.3. The method of claim 2 , wherein the baseline spectrum is determined empirically claim 2 , calculated from an optical model claim 2 , or taken from literature.4. The method of claim 3 , wherein the baseline spectrum is determined empirically using a spectrographic metrology system that generates a measurements spot smaller than a measurement spot generated by the in-situ monitoring system.5. The method of claim 2 , wherein comparing includes calculating a sum-of-squares difference claim 2 , a sum of absolute differences claim 2 , or a cross-correlation between each measured spectrum and the baseline spectrum.6. The method of claim 1 , wherein selecting less than all of the measured spectra comprises determining the presence or absence of a feature in the measured spectrum.7. The method of claim 6 , wherein the feature ...

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Номер записи: 19
30-11-2010 дата публикации

Polishing article with integrated window stripe

Номер: US0007841925B2
Автор: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung, MENK GREGORY E, MCREYNOLDS PETER, RONDUM ERIK S, IYER ANAND N, PRABHU GOPALAKRISHNA B, LEUNG GARLEN C, MENK GREGORY E., RONDUM ERIK S., IYER ANAND N., PRABHU GOPALAKRISHNA B., LEUNG GARLEN C.
Принадлежит: Applied Materials, Inc., APPLIED MATERIALS INC, APPLIED MATERIALS, INC.

A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.

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Номер записи: 20
26-04-2012 дата публикации

APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL MECHANICAL POLISHING CONSUMABLES

Номер: US20120100779A1
Автор: Sivakumar Dhandapani, Asheesh Jain, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai, DHANDAPANI SIVAKUMAR, JAIN ASHEESH, GARRETSON CHARLES C, MENK GREGORY E, TSAI STAN D, GARRETSON CHARLES C., MENK GREGORY E., TSAI STAN D.
Принадлежит: APPLIED MATERIALS, INC.

Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.

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Номер записи: 21
23-08-2007 дата публикации

Polishing system with spiral-grooved subpad

Номер: US2007197147A1
Автор: RONDUM ERIK S, MCREYNOLDS PETER, BONNER BENJAMIN A, MENK GREGORY E, PRABHU GOPALAKRISHNA B, LEUNG GARLEN C, IYER ANAND N, RONDUM ERIK S., BONNER BENJAMIN A., MENK GREGORY E., PRABHU GOPALAKRISHNA B., LEUNG GARLEN C., IYER ANAND N.
Принадлежит:

A polishing system is described. The polishing system includes a polishing layer, and a subpad supporting the polishing layer, where the subpad has a spiral groove formed therein.

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Номер записи: 22
12-01-2012 дата публикации

CLOSED-LOOP CONTROL OF CMP SLURRY FLOW

Номер: US20120009847A1
Автор: Gregory E. Menk, Stan D. Tsai, Sang J. Cho, Sivakumar Dhandapani, MENK GREGORY E, TSAI STAN D, CHO SANG J, DHANDAPANI SIVAKUMAR, MENK GREGORY E., TSAI STAN D., CHO SANG J.
Принадлежит: APPLIED MATERIALS, INC.

Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include measuring the thickness of a polishing pad having grooves or other slurry transport features on a polishing surface. Once the depth of the grooves on the polishing surface is determined, a flow rate of a polishing slurry is adjusted in response to the determined groove depth. A predetermined number of substrates are polished on the polishing surface. The method can then optionally be repeated.

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Номер записи: 23
08-10-2009 дата публикации

POLISHING ARTICLE WITH INTEGRATED WINDOW STRIPE

Номер: US2009253358A1
Автор: MENK GREGORY E, MCREYNOLDS PETER, RONDUM ERIK S, IYER ANAND N, PRABHU GOPALAKRISHNA B, LEUNG GARLEN C, MENK GREGORY E., RONDUM ERIK S., IYER ANAND N., PRABHU GOPALAKRISHNA B., LEUNG GARLEN C.
Принадлежит:

A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.

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Номер записи: 24
23-08-2007 дата публикации

Polishing article with integrated window stripe

Номер: US2007197133A1
Автор: MENK GREGORY E, MCREYNOLDS PETER, RONDUM ERIK S, IYER ANAND N, PRABHU GOPALAKRISHNA B, LEUNG GARLEN C, MENK GREGORY E., RONDUM ERIK S., IYER ANAND N., PRABHU GOPALAKRISHNA B., LEUNG GARLEN C.
Принадлежит:

A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.

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Номер записи: 25
23-08-2007 дата публикации

Polishing apparatus with grooved subpad

Номер: US2007197141A1
Автор: ZUNIGA STEVEN M, MCREYNOLDS PETER, RONDUM ERIK S, BONNER BENJAMIN A, AU HENRY H, MENK GREGORY E, PRABHU GOPALAKRISHNA B, IYER ANAND N, LEUNG GARLEN C, ZUNIGA STEVEN M., RONDUM ERIK S., BONNER BENJAMIN A., AU HENRY H., MENK GREGORY E., PRABHU GOPALAKRISHNA B., IYER ANAND N., LEUNG GARLEN C.
Принадлежит:

A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.

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Номер записи: 26
24-05-2007 дата публикации

MATERIALS FOR CHEMICAL MECHANICAL POLISHING

Номер: US2007117500A1
Автор: BONNER BENJAMIN A, MCREYNOLDS PETER, MENK GREGORY E, IYER ANAND N, PRABHU GOPALAKRISHNA B, RONDUM ERIK S, JACKSON ROBERT L, LEUNG GARLEN, BONNER BENJAMIN A., MENK GREGORY E., IYER ANAND N., PRABHU GOPALAKRISHNA B., RONDUM ERIK S., JACKSON ROBERT L.
Принадлежит:

A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

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Номер записи: 27
23-08-2007 дата публикации

Dechuck using subpad with recess

Номер: US2007197132A1
Автор: MENK GREGORY E, ZUNIGA STEVEN M, RONDUM ERIK S, MCREYNOLDS PETER, PRABHU GOPALAKRISHNA B, LEUNG GARLEN C, IYER ANAND N, MENK GREGORY E., ZUNIGA STEVEN M., RONDUM ERIK S., PRABHU GOPALAKRISHNA B., LEUNG GARLEN C., IYER ANAND N.
Принадлежит:

A method is described. The method includes supporting a polishing sheet having a polishing surface on a subpad having a recess formed therein, applying a vacuum to the recess sufficient to pull portions of the polishing sheet into the recess to induce a recess in the polishing surface, positioning a substrate in a carrier head over the recess in the polishing surface, and lifting the substrate away from the polishing surface while the substrate is positioned over the recess.

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Номер записи: 28
14-05-2013 дата публикации

Chemical mechanical polisher with heater and method

Номер: US0008439723B2
Автор: Robert A. Marks, Christopher Heung-Gyun Lee, Garlen C. Leung, Gregory E. Menk, Jie Diao, Erik S. Rondum, MARKS ROBERT A, LEE CHRISTOPHER HEUNG-GYUN, LEUNG GARLEN C, MENK GREGORY E, DIAO JIE, RONDUM ERIK S, MARKS ROBERT A., LEUNG GARLEN C., MENK GREGORY E., RONDUM ERIK S.
Принадлежит: Applied Materials, Inc., MARKS ROBERT A, LEE CHRISTOPHER HEUNG-GYUN, LEUNG GARLEN C, MENK GREGORY E, DIAO JIE, RONDUM ERIK S, APPLIED MATERIALS INC, MARKS ROBERT A., LEUNG GARLEN C., MENK GREGORY E., RONDUM ERIK S., APPLIED MATERIALS, INC.

A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.

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Номер записи: 29
31-07-2008 дата публикации

SELECTIVE CHEMISTRY FOR FIXED ABRASIVE CMP

Номер: US2008182413A1
Автор: MENK GREGORY E, JACKSON ROBERT L, LEUNG GARLEN C, PRABHU GOPALAKRISHNA B, MCREYNOLDS PETER, IYER ANAND N, MENK GREGORY E., JACKSON ROBERT L., LEUNG GARLEN C., PRABHU GOPALAKRISHNA B., IYER ANAND N.
Принадлежит:

Methods and compositions for planarizing a substrate surface with selective removal rates and low dishing are provided. One embodiment provides a method for selectively removing a dielectric disposed on a substrate having at least a first and a second dielectric material disposed thereon. The method generally includes positioning the substrate in proximity with a fixed abrasive polishing pad, dispensing an abrasive free polishing composition having at least one organic compound and a surfactant therein between the substrate and the polishing pad, and selectively polishing the second dielectric material relative to the first dielectric material.

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Номер записи: 30
30-09-2008 дата публикации

Materials for chemical mechanical polishing

Номер: US0007429210B2
Автор: Benjamin A. Bonner, Peter McReynolds, Gregory E. Menk, Anand N. Iyer, Gopalakrishna B. Prabhu, Erik S. Rondum, Robert L. Jackson, Garlen Leung, BONNER BENJAMIN A, MCREYNOLDS PETER, MENK GREGORY E, IYER ANAND N, PRABHU GOPALAKRISHNA B, RONDUM ERIK S, JACKSON ROBERT L, LEUNG GARLEN, BONNER BENJAMIN A., MENK GREGORY E., IYER ANAND N., PRABHU GOPALAKRISHNA B., RONDUM ERIK S., JACKSON ROBERT L.
Принадлежит: Applied Materials, Inc., APPLIED MATERIALS INC, APPLIED MATERIALS, INC.

A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

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Номер записи: 31
23-08-2007 дата публикации

Polishing article with integrated window stripe

Номер: US2007197134A1
Автор: MENK GREGORY E, MCREYNOLDS PETER, RONDUM ERIK S, IYER ANAND N, PRABHU GOPALAKRISHNA B, LEUNG GARLEN C, MENK GREGORY E., RONDUM ERIK S., IYER ANAND N., PRABHU GOPALAKRISHNA B., LEUNG GARLEN C.
Принадлежит:

A polishing article is described. The polishing article includes an elongated polishing layer, and a transparent carrier layer supporting the polishing layer, where the transparent carrier layer has a projection extending into an aperture in the polishing layer to provide a transparent window in the polishing layer.

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Номер записи: 32
13-09-2007 дата публикации

Smart polishing media assembly for planarizing substrates

Номер: US2007212976A1
Автор: MCREYNOLDS PETER, MENK GREGORY E, BONNER BENJAMIN A, PRABHU GOPALAKRISHNA B, RONDUM ERIK S, LEUNG GARLEN C, IYER ANAND N, MENK GREGORY E., BONNER BENJAMIN A., PRABHU GOPALAKRISHNA B., RONDUM ERIK S., LEUNG GARLEN C., IYER ANAND N.
Принадлежит:

A smart polishing media assembly is provided, along with a polishing system and a method for using the same. In one embodiment, the smart polishing media assembly includes a memory device coupled to a polishing material. The polishing material may be in pad, web or belt form. The memory device generally stores at least one material information, historical use information, and/or conditioning information of the polishing material.

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Номер записи: 33
06-05-2010 дата публикации

MONOLITHIC LINEAR POLISHING SHEET

Номер: US20100112919A1
Автор: Benjamin A. Bonner, Gopalakrishna B. Prabhu, Erik S. Rondum, Gregory E. Menk, Anand N. Iyer, Peter McReynolds, Garlen C. Leung, BONNER BENJAMIN A, PRABHU GOPALAKRISHNA B, RONDUM ERIK S, MENK GREGORY E, IYER ANAND N, MCREYNOLDS PETER, LEUNG GARLEN C, BONNER BENJAMIN A., PRABHU GOPALAKRISHNA B., RONDUM ERIK S., MENK GREGORY E., IYER ANAND N., LEUNG GARLEN C.
Принадлежит: Applied Materials, Inc.

A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.

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Номер записи: 34
25-12-2012 дата публикации

Closed-loop control for effective pad conditioning

Номер: US0008337279B2
Автор: Sivakumar Dhandapani, Stan D. Tsai, Daxin Mao, Sameer Deshpande, Shou-Sung Chang, Gregory E. Menk, Charles C. Garretson, Jason Garcheung Fung, Christopher D. Cocca, Hung Chih Chen, DHANDAPANI SIVAKUMAR, TSAI STAN D, MAO DAXIN, DESHPANDE SAMEER, CHANG SHOU-SUNG, MENK GREGORY E, GARRETSON CHARLES C, FUNG JASON GARCHEUNG, COCCA CHRISTOPHER D, CHEN HUNG CHIH, TSAI STAN D., MENK GREGORY E., GARRETSON CHARLES C., COCCA CHRISTOPHER D.
Принадлежит: Applied Materials, Inc., DHANDAPANI SIVAKUMAR, TSAI STAN D, MAO DAXIN, DESHPANDE SAMEER, CHANG SHOU-SUNG, MENK GREGORY E, GARRETSON CHARLES C, FUNG JASON GARCHEUNG, COCCA CHRISTOPHER D, CHEN HUNG CHIH, APPLIED MATERIALS INC, TSAI STAN D., MENK GREGORY E., GARRETSON CHARLES C., COCCA CHRISTOPHER D., APPLIED MATERIALS, INC.

A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

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Номер записи: 35
24-06-2014 дата публикации

Method for compensation of variability in chemical mechanical polishing consumables

Номер: US0008758085B2
Автор: Sivakumar Dhandapani, Asheesh Jain, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai, DHANDAPANI SIVAKUMAR, JAIN ASHEESH, GARRETSON CHARLES C, MENK GREGORY E, TSAI STAN D, GARRETSON CHARLES C., MENK GREGORY E., TSAI STAN D.
Принадлежит: Applied Materials, Inc., DHANDAPANI SIVAKUMAR, JAIN ASHEESH, GARRETSON CHARLES C, MENK GREGORY E, TSAI STAN D, APPLIED MATERIALS INC, GARRETSON CHARLES C., MENK GREGORY E., TSAI STAN D., APPLIED MATERIALS, INC.

Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.

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Номер записи: 36
28-08-2014 дата публикации

FEED FORWARD PARAMETER VALUES FOR USE IN THEORETICALLY GENERATING SPECTRA

Номер: US20140242881A1
Автор: Jeffrey Drue David, Gregory E. Menk, Doyle E. Bennett, Jun Qian, Sivakumar Dhandapani, Benjamin Cherian, Thomas H. Osterheld, Boguslaw A. Swedek, DAVID JEFFREY DRUE, MENK GREGORY E, BENNETT DOYLE E, QIAN JUN, DHANDAPANI SIVAKUMAR, CHERIAN BENJAMIN, OSTERHELD THOMAS H, SWEDEK BOGUSLAW A, MENK GREGORY E., BENNETT DOYLE E., OSTERHELD THOMAS H., SWEDEK BOGUSLAW A.
Принадлежит:

A method of controlling a polishing operation is described. A controller stores an optical model for a layer stack having a plurality of layers and a plurality of input parameters including a first parameter and a second parameter. The controller stores data defining a plurality of default values for the first parameter and measures an optical property of a substrate and generates a second value. Using the optical model and the second value and iterating over the first values, a number of reference spectra are calculated. A spectrum is measured and the measured spectrum is matched to the reference spectra and the best matched reference spectrum is determined. The first value of the best matched reference spectrum is determined and is used to adjust a polishing endpoint or a polishing parameter of a polishing apparatus. 1. A method of controlling a polishing operation , comprising:storing an optical model for a layer stack having a plurality of layers, the optical model having a plurality of input parameters including a first parameter and a second parameter;storing data defining a plurality of default first values for the first parameter;measuring an optical property of a substrate at a stand-alone or in-sequence metrology station to generate a second value for the second parameter;for each first value from the plurality of first values, calculating a reference spectrum using the optical model based on the first value and the second value, to generate a plurality of reference spectra;transporting the substrate from the stand-alone or in-sequence metrology station to an in-sequence or in-situ monitoring system of a chemical mechanical polishing apparatus;measuring a spectrum with the in-sequence or in-situ monitoring system to provide a measured spectrum;determining a best matching reference spectrum from the plurality of reference spectra that provides a best match to the measured spectrum;determining the first value associated with the best matching reference ...

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Номер записи: 37
24-12-2009 дата публикации

CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING

Номер: US2009318060A1
Автор: DHANDAPANI SIVAKUMAR, TSAI STAN D, MAO DAXIN, DESHPANDE SAMEER, CHANG SHOU-SUNG, MENK GREGORY E, GARRETSON CHARLES C, FUNG JASON GARCHEUNG, COCCA CHRISTOPHER D, CHEN HUNG CHIH, TSAI STAN D., MENK GREGORY E., GARRETSON CHARLES C., COCCA CHRISTOPHER D.
Принадлежит:

A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque.

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Номер записи: 38
22-09-2015 дата публикации

Closed-loop control for improved polishing pad profiles

Номер: US0009138860B2
Автор: Sivakumar Dhandapani, Jun Qian, Christopher D. Cocca, Jason G. Fung, Shou-Sung Chang, Charles C. Garretson, Gregory E. Menk, Stan D. Tsai, DHANDAPANI SIVAKUMAR, QIAN JUN, COCCA CHRISTOPHER D, FUNG JASON G, CHANG SHOU-SUNG, GARRETSON CHARLES C, MENK GREGORY E, TSAI STAN D, COCCA CHRISTOPHER D., FUNG JASON G., GARRETSON CHARLES C., MENK GREGORY E., TSAI STAN D.
Принадлежит: APPLIED MATERIALS, INC., DHANDAPANI SIVAKUMAR, QIAN JUN, COCCA CHRISTOPHER D, FUNG JASON G, CHANG SHOU-SUNG, GARRETSON CHARLES C, MENK GREGORY E, TSAI STAN D, APPLIED MATERIALS INC, COCCA CHRISTOPHER D., FUNG JASON G., GARRETSON CHARLES C., MENK GREGORY E., TSAI STAN D.

Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

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Номер записи: 39
11-10-2011 дата публикации

Retaining ring with shaped profile

Номер: US0008033895B2
Автор: Gopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk, PRABHU GOPALAKRISHNA B, YUAN YIN, OH JEONGHOON, MENK GREGORY E, PRABHU GOPALAKRISHNA B., MENK GREGORY E.
Принадлежит: Applied Materials, Inc., APPLIED MATERIALS INC, APPLIED MATERIALS, INC.

Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.

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Номер записи: 40
16-05-2013 дата публикации

PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE

Номер: US20130122783A1
Автор: Chang Shou-Sung, Cho Sang J., Cocca Christopher D., Dhandapani Slvakumar, Fung Jason G., Garretson Charles C., Menk Gregory E., Tsai Stan D.
Принадлежит: APPLIED MATERIALS, INC

A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change. 1. A method for conditioning a polishing pad , comprising:applying a down force to a conditioning disk that urges the conditioning disk against the polishing pad;measuring a torque required to sweep the conditioning disk across the polishing pad;determining a change in down force by comparing the measured torque to a model force profile (MFP); andadjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.2. The method of claim 1 , wherein the MFP comprises an estimated relationship between the down force claim 1 , the torque claim 1 , and a rate of removal of material from a substrate by the polishing pad.3. The method of claim 1 , wherein the determining comprises:determining the change in down force necessary to maintain a rate of material removal from a substrate by the polishing pad.4. The method of claim 1 , wherein the determining comprises:determining a decrease in down force necessary to achieve a target torque of the MFP.5. The method of claim 1 , wherein the determining comprises:determining an increase in down force necessary to maintain a constant removal rate of the polishing pad in response to the measured torque being less than the MFP.6. The method of claim 1 , wherein the adjusting the down force comprises modifying a conditioning recipe for the polishing pad.7. The method of claim 1 , wherein the adjusting the down force ...

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Номер записи: 41
15-02-2018 дата публикации

POLISHING ARTICLES AND INTEGRATED SYSTEM AND METHODS FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING ARTICLES

Номер: US20180043613A1
Автор: BAJAJ Rajeev, Fung Jason G., Krishnan Kasiraman, Menk Gregory E., ORILALL Mahendra C., Patibandla Nag B., PERRY Russell Edward, Redeker Fred C., Redfield Daniel
Принадлежит:

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device. 1. A polishing article , comprising: [ the plurality of polishing features are formed from a first material,', 'each of the plurality of polishing features are separated by a groove, and', 'the polishing features comprise a plurality of pores that include a second material that is at least partially surrounded by the first material, and, 'a plurality of polishing features forming a polishing surface, wherein'}, 'one or more base features formed from a third material, wherein the plurality of polishing features and the one or more base features form a unitary body., 'a composite pad body comprising2. The polishing article of claim 1 , wherein the second material comprises a gel.3. The polishing article of claim 1 , wherein the second material comprises polyethylene glycol (PEG).4. The polishing article of claim 1 , wherein the first material has a hardness greater than a hardness of the second material.5. The polishing article of claim 1 , wherein the composite pad body comprises a central zone and an edge zone that each comprise the first material and the third material claim 1 , wherein a modulus of the first material in the edge zone is different than a modulus of the first material in the central zone.6. The polishing article of claim 1 , wherein the composite pad body comprises a central zone and an edge zone that each comprise the first material and the third material claim 1 , wherein a modulus of the third material in the edge zone is different ...

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Номер записи: 42
14-04-2016 дата публикации

CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS

Номер: US20160101500A1
Автор: BAJAJ Rajeev, Fung Jason Garcheung, Krishnan Kasiraman, Menk Gregory E., ORILALL Mahendra C., PERRY Russell Edward, Redeker Fred C., Redfield Daniel
Принадлежит:

A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port. 1. A polishing pad for chemical mechanical polishing comprising:a base region having a supporting surface;a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface; andone or more channels formed in an interior region of the polishing pad, the one or more channels extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.2. The polishing pad of claim 1 , wherein:the one or more ports comprises two or more ports; andthe one or more channels comprises two or more channels, wherein at least two of the channels are fluidly coupled to a separate port.3. The polishing pad of claim 2 , wherein the two or more channels comprise at least an inner channel and an outer channel claim 2 , wherein the outer channel substantially surrounds the inner channel.4. The polishing pad of claim 3 , further comprising a pressure sensor disposed in at least one of the inner channel and the outer channel.5. The polishing pad of claim 1 , wherein:the plurality of polishing features comprises fixed polishing features and adjustable polishing features; andthe one or more channels comprises two or more channels, wherein each channel is disposed adjacent to at least some of the adjustable polishing features.6. The polishing pad of claim 1 , wherein each channel is fluidly coupled to two or more ports.7. The polishing pad of claim 6 , wherein at least two of the ...

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Номер записи: 43
21-04-2016 дата публикации

POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS

Номер: US20160107287A1
Автор: BAJAJ Rajeev, CHOCKALINGAM Ashwin, CORNEJO Mario, DAVENPORT Robert E., FU Boyi, Fung Jason G., HARIHARAN Venkatachalam, KAKIREDDY Veera Raghava Reddy, KHANNA Aniruddh, Kumar Ashavani, Menk Gregory E., Ng Hou T., ORILALL Mahendra C., Patibandla Nag B., Redeker Fred C., Redfield Daniel, SINHA Amritanshu, YAMAMURA Mayu
Принадлежит:

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. 1. A polishing pad having a polishing surface that is configured to polish a surface of a substrate , comprising:a plurality of first polishing elements that each comprise a plurality of first polymer layers, wherein at least one of the plurality of first polymer layers forms the polishing surface; andone or more second polishing elements that each comprise a plurality of second polymer layers, wherein at least a region of each of the one or more second polishing elements is disposed between at least one of the plurality of first polishing elements and a supporting surface of the polishing pad,wherein the plurality of first polymer layers comprise a first polymer composition and the plurality of second polymer layers comprise a second polymer composition.2. The polishing pad of claim 1 , wherein the first polymer composition has a storage modulus that is greater than the second polymer composition.3. The polishing pad of claim 1 , wherein the first polymer composition is formed from a first ...

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Номер записи: 44
21-04-2016 дата публикации

PRINTED CHEMICAL MECHANICAL POLISHING PAD

Номер: US20160107288A1
Автор: BAJAJ Rajeev, Krishnan Kasiraman, Menk Gregory E., Michaelson Timothy, ORILALL Mahendra Christopher, Patibandla Nag B., Redeker Fred C., Redfield Daniel
Принадлежит:

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material. 1. A method of fabricating a polishing pad comprising:depositing a plurality of layers with a 3D printer, at least a first layer of the plurality of polishing layers comprises a base material and an additive material; andsolidifying the plurality of layers to form a solidified polishing layer.2. The method of claim 1 , wherein the additive material has a non-homogenous distribution across the solidified polishing layer.3. The method of claim 1 , wherein the additive material modifies a thermal conductivity of the polishing pad.4. The method of claim 1 , wherein the additive material modifies a porosity of the polishing layer.5. The method of claim 4 , wherein the additive material include nanoparticles having a diameter between about 5 nm to about 50 μm.6. The method of claim 1 , wherein the additive material is a piezoelectric material.7. The method of claim 1 , further comprising:successively depositing a plurality of layers on the polishing layers to integrally form a backing layer with the polishing layers.8. The method of claim 7 , wherein forming the backing layer comprises:depositing a material different than that used to form the base material of the polishing layer.9. The method of claim 1 , wherein the polishing layer has a Shore D hardness of about 30 Shore D to about 90 Shore D.10. The method of claim 9 , wherein the polishing layer has a Shore D hardness of about 50 Shore D to about 65 Shore D.11. The method of claim 1 , wherein the polishing layer has a Shore A hardness between about 26 Shore A to about 95 Shore A.12. The method of claim 1 , wherein at least one of the plurality of layers ...

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Номер записи: 45
21-04-2016 дата публикации

CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES

Номер: US20160107290A1
Автор: BAJAJ Rajeev, DAVENPORT Robert E., Fung Jason G., Krishnan Kasiraman, Menk Gregory E., ORILALL Mahendra C., Patibandla Nag B., PERRY Russell Edward, Redeker Fred C., Redfield Daniel
Принадлежит:

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials. 1. A polishing pad , comprising: one or more first features formed from a first material; and', 'one or more second features formed from a second material, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material and the second material., 'a composite polishing pad body comprising2. The polishing pad of claim 1 , wherein the first material comprises a first composition of materials that is formed by depositing droplets of a third material and a fourth material.3. The polishing pad of claim 2 , wherein the second material comprises a second composition of materials that is formed by depositing droplets of a fifth material and a sixth material.4. The polishing pad of claim 1 , wherein the first material has a first hardness and the second material has a second hardness different from the first hardness.5. The polishing pad of claim 4 , wherein the one or more first features and the one or more second features are arranged to achieve a predetermined Young's modulus or a predetermined storage modulus and loss modulus across the composite polishing pad body.6. The polishing pad of claim 1 , wherein the one or more first features are thicker than the one or more second features in a direction normal to a plane that ...

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Номер записи: 46
21-04-2016 дата публикации

POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS

Номер: US20160107295A1
Автор: BAJAJ Rajeev, CHOCKALINGAM Ashwin, CORNEJO Mario, DAVENPORT Robert E., FU Boyi, Fung Jason G., HARIHARAN Venkatachalam, KAKIREDDY Veera Raghava Reddy, KHANNA Aniruddh, Kumar Ashavani, Menk Gregory E., Ng Hou T., ORILALL Mahendra C., Patibandla Nag B., Redeker Fred C., Redfield Daniel, SINHA Amritanshu, YAMAMURA Mayu
Принадлежит:

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. 118.-. (canceled)19. A method of forming a polishing article , comprising:dispensing a first droplet of a first liquid on a surface of a portion of a polishing body, wherein the surface comprises a first material formed by curing an amount of the first liquid; andexposing the dispensed first droplet of the first liquid to electromagnetic radiation for a first period of time to only partially cure the material within the first droplet, wherein exposing the dispensed first droplet of the first liquid occurs after a second period of time has elapsed, and the second time starts when the dispensed first droplet is placed in contact with the surface.20. The method of claim 19 , wherein the second period of time is less than or equal to 1 second.21. The method of claim 19 , wherein the partially cured first droplet has a contact angle relative to the surface of greater than or equal to 55 degrees.22. The method of claim 19 , wherein a contact angle of the dispensed first droplet on the surface after ...

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Номер записи: 47
21-04-2016 дата публикации

POLISHING ARTICLES AND INTEGRATED SYSTEM AND METHODS FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING ARTICLES

Номер: US20160107381A1
Автор: BAJAJ Rajeev, Fung Jason G., Krishnan Kasiraman, Menk Gregory E., ORILALL Mahendra C., Patibandla Nag B., PERRY Russell Edward, Redeker Fred C., Redfield Daniel
Принадлежит:

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device. 1. A polishing article manufacturing system , comprising:a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process;a print section comprising a plurality of printheads disposed between the feed section and the take-up section; anda curing section disposed between the feed section and the take-up section downstream of the curing section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.2. The system of claim 1 , wherein each of the printheads comprises one or more nozzles.3. The system of claim 2 , wherein the nozzles are coupled to a source having a first material and a second material.4. The system of claim 3 , wherein the first material has a different reactivity with electromagnetic energy when compared with the second material.5. The system of claim 3 , wherein the second material is a polymer matrix and the first material comprises a plurality of microelements that are dispersed in the first material.6. The system of claim 5 , wherein the microelements comprise a polymeric material claim 5 , a metallic material claim 5 , a ceramic material claim 5 , or combinations thereof.7. The system of claim 5 , wherein each of the microelements include a mean diameter of about 150 microns to about 10 microns claim 5 , or less.8. A polishing article claim 5 , comprising: a plurality of polishing ...

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Номер записи: 48
02-04-2020 дата публикации

POLISHING ARTICLES AND INTEGRATED SYSTEM AND METHODS FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING ARTICLES

Номер: US20200101657A1
Автор: BAJAJ Rajeev, Fung Jason G., Krishnan Kasiraman, Menk Gregory E., ORILALL Mahendra C., Patibandla Nag B., PERRY Russell Edward, Redeker Fred C., Redfield Daniel
Принадлежит:

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device. 1. A polishing article , comprising: the base region is formed of a first material, and', 'the plurality of raised features comprise regions of the first material and regions of a second material, wherein the regions of the second material are at least partially surrounded by the first material., 'a unitary composite pad body formed of a plurality of printer deposited layers, the unitary pad body comprising a base region and a plurality of raised features extending from the base region to form a polishing surface, wherein'}2. The polishing article of claim 1 , wherein the second material has a hardness greater than a hardness of the first material.3. The polishing article of claim 2 , wherein the regions of the second material comprise discrete regions within a cross-linked polymer matrix of the first material and the second material which forms the unitary composite pad body.4. The polishing article of claim 3 , wherein the second material is formed of polyurethane claim 3 , acrylate claim 3 , epoxy claim 3 , acrylonitrile butadiene styrene (ABS) claim 3 , polyetherimide claim 3 , polyamides claim 3 , melamines claim 3 , polyesters claim 3 , polysulfones claim 3 , polyvinyl acetates claim 3 , fluorinated hydrocarbons claim 3 , or combinations thereof.5. The polishing article of claim 3 , wherein the regions of the second material have a hardness in a range from about 40 Shore D scale to about 90 Shore D scale.6. The polishing article of claim 3 , wherein ...

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Номер записи: 49
28-04-2016 дата публикации

POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS

Номер: US20160114458A1
Автор: BAJAJ Rajeev, CHOCKALINGAM Ashwin, CORNEJO Mario, DAVENPORT Robert E., FU Boyi, Fung Jason G., HARIHARAN Venkatachalam, KHANNA Aniruddh, Kumar Ashavani, Menk Gregory E., Ng Hou T., ORILALL Mahendra C., Patibandla Nag B., REDDY Veera Raghava, Redeker Fred C., Redfield Daniel, SINHA Amritanshu, YAMAMURA Mayu
Принадлежит:

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. 1. A polishing pad having a polishing surface that is configured to polish a surface of a substrate , comprising:a plurality of first polishing elements that are disposed in a pattern relative to the polishing surface, wherein each first polishing element comprises a plurality of first polymer layers that comprise a first polymer material, and at least one of the plurality of first polymer layers in each of the first polishing elements forms a portion of the polishing surface; anda base region that is disposed between each of the plurality of first polishing elements and a supporting surface of the polishing pad, and the base region comprises a second polymer material, andwherein the first polymer material has a first E′30/E′90 ratio and the second polymer material has a second E′30/E′90 ratio that is different from the first E′30/E′90 ratio.2. The polishing pad of claim 1 , whereinat least a region of the polishing pad has a third E′30/E′90 ratio that is different from the first and second E′30/ ...

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Номер записи: 50
11-05-2017 дата публикации

Techniques for combining cmp process tracking data with 3d printed cmp consumables

Номер: US20170133252A1
Автор: Aniruddh KHANNA, Daniel REDFIELD, Gregory E. Menk, Jason G. Fung, John Watkins, Mario CORNEJO, Rajeev Bajaj
Принадлежит: Applied Materials Inc

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

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Номер записи: 51
30-04-2020 дата публикации

TECHNIQUES FOR COMBINING CMP PROCESS TRACKING DATA WITH 3D PRINTED CMP CONSUMABLES

Номер: US20200135517A1
Автор: BAJAJ Rajeev, CORNEJO Mario, Fung Jason G., Khanna Aniruddh Jagdish, Menk Gregory E., Redfield Daniel, Watkins John
Принадлежит:

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus. 1. A method of manufacturing a polishing pad , comprising:depositing a 3D printed first portion of a polishing pad by distributing one or more first polymeric materials from a first nozzle of a 3D print head, wherein the one or more first polymeric materials are electrically non-conductive;depositing a 3D printed RFID tag by distributing one or more second polymeric materials from a second nozzle of a 3D print head on the 3D printed first portion of the polishing pad, wherein the one or more second polymeric materials include at least one electrically conductive or semi-conductive polymeric material; anddepositing a 3D printed second portion of the polishing pad over the 3D printed RFID tag and the 3D printed first portion by distributing the one or more first polymeric materials from the first nozzle of the 3D print head.2. The method of claim 1 , wherein the one or more second polymeric materials are selected from the group consisting of poly(fluorene) claim 1 , poly(phenylene) claim 1 , poly(pyrene) claim 1 , poly(azulene) claim 1 , poly(naphthalene) claim 1 , poly(acetylene) claim 1 , poly(p-phenylene vinylene) claim 1 , poly(pyrrole) claim 1 , poly(carbazole) claim 1 , poly(indole) claim 1 , poly(azepine) claim 1 , poly(aniline) claim 1 , poly(thiophene) claim 1 , poly (3 claim 1 ,4- ...

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Номер записи: 52
14-05-2020 дата публикации

CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES

Номер: US20200147750A1
Автор: BAJAJ Rajeev, DAVENPORT Robert E., Fung Jason G., Krishnan Kasiraman, Menk Gregory E., ORILALL Mahendra C., Patibandla Nag B., PERRY Russell Edward, Redeker Fred C., Redfield Daniel
Принадлежит:

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials. 1. A composite polishing pad , comprising:a base material layer; anda plurality of features extending from the base material layer to form a polishing surface, whereinthe plurality of features and a surface of the base material layer define one or more channels disposed between the features, anda plurality of pores are arranged in a non-random pattern in the plurality of features.2. The composite polishing pad of claim 1 , wherein the plurality of features are formed from a mixture of least two different droplet compositions each dispensed by an additive manufacturing system according to a predetermined pattern.3. The composite polishing pad of claim 1 , wherein the plurality of features comprise a first material composition and the plurality of pores are at least partially filled with a second material composition that is different from the first material composition.4. The composite polishing pad of claim 1 , wherein a Shore hardness of the plurality of features is greater than a Shore hardness of the base material layer.5. The composite polishing pad of claim 1 , wherein the plurality of features have a hardness from about 40 Shore D scale to about 90 Shore D scale.6. The composite polishing pad of claim 1 , wherein the plurality of features comprise a first material composition formed from a mixture of least two different droplet compositions and the ...

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Номер записи: 53
14-06-2018 дата публикации

CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES

Номер: US20180161954A1
Автор: BAJAJ Rajeev, DAVENPORT Robert E., Fung Jason G., Krishnan Kasiraman, Menk Gregory E., ORILALL Mahendra C., Patibandla Nag B., PERRY Russell Edward, Redeker Fred C., Redfield Daniel
Принадлежит:

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials. 1. A method of forming a polishing pad , comprising: depositing a first material over one or more first regions of a surface; and', 'depositing a second material over one or more second regions of the surface, wherein the one or more first regions and the one or more second regions form a continuous part of each of the plurality of composite layers; and, 'depositing a plurality of composite layers with a printer to reach a target thickness, wherein depositing the plurality of composite layers comprisessolidifying the plurality of composite layers to form a composite pad body having one or more first features comprising the first material and one or more second features comprising the second material, wherein the one or more first features and the one or more second features form a unitary body.2. The method of claim 1 , wherein the first material comprises a first composition of materials that is formed by depositing droplets of a third material and a fourth material.3. The method of claim 2 , wherein the second material comprises a second composition of materials that is formed by depositing droplets of a fifth material and a sixth material.4. The method of claim 1 , further comprising depositing a plurality of discontinuous layers with a printer after depositing the plurality of composite layers claim ...

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Номер записи: 54
26-07-2018 дата публикации

THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS

Номер: US20180207770A1
Автор: DAVEY Eric, Gurusamy Jay, KAKIREDDY Veera Raghava Reddy, Menk Gregory E., MIKHAYLICHENKO Ekaterina, Redeker Fred C., Tolles Robert D., TRAN Huyen Karen, Wang You
Принадлежит:

A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing. 1. A polishing article , comprising a polymeric sheet that comprises:a thickness that is defined between a polishing surface and an opposing bottom surface;a length that extends in a first direction that is substantially parallel to the polishing surface;a width that extends in a second direction, which is substantially parallel to the polishing surface and is perpendicular to the first direction, wherein the width is at least two times smaller than the length;a solid polymeric material that is substantially pore free;a plurality of discrete elements that are formed on the polishing surface; andan array of grooves that are formed in the polishing surface, wherein the array of grooves are aligned relative to the first direction or the second direction.2. The polishing article of claim 1 , wherein each of the grooves in the array of grooves extend from the polishing surface to a depth below the polishing surface claim 1 , and the thickness is less than or equal to about 0.48 mm. ...

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Номер записи: 55
03-10-2019 дата публикации

PRINTED CHEMICAL MECHANICAL POLISHING PAD

Номер: US20190299357A1
Автор: BAJAJ Rajeev, Krishnan Kasiraman, Menk Gregory E., Michaelson Timothy, ORILALL Mahendra Christopher, Patibandla Nag B., Redeker Fred C., Redfield Daniel
Принадлежит:

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material. 1. A method of fabricating a polishing pad comprising: ejecting droplets comprising a base material from one of one or more nozzles of the print head;', 'ejecting droplets comprising an additive material from one of the one or more nozzles of the print head, wherein the droplets comprising the additive material are ejected from the print head independently of the droplets comprising the base material; and', 'polymerizing the ejected droplets of the base material and the additive material to form the polishing pad layer comprising a polymer matrix of the base material crosslinked with the additive material., 'successively forming a plurality of polishing pad layers using a print head of an additive manufacturing system, wherein forming a polishing pad layer comprises2. The method of claim 1 , wherein the additive material modifies a porosity of the polishing pad.3. The method of claim 2 , wherein the additive material comprises a UV curable polyurethane-acrylate.4. The method of claim 3 , wherein the UV curable polyurethane-acrylate comprises hollow nanoparticles.5. The method of claim 1 , wherein the additive material comprises piezoelectric material.6. The method of claim 1 , further comprising:successively depositing a plurality of layers on the plurality of polishing layers to integrally form a backing layer therewith.7. The method of claim 6 , wherein forming the backing layer comprises:ejecting droplets comprising a composition of material different than the composition of the base material from one of the one or more nozzles of the print head.8. The method of claim 1 , wherein the polishing pad ...

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Номер записи: 56
21-04-2016 дата публикации

Cmp pad construction with composite material properties using additive manufacturing processes

Номер: WO2016060712A1
Автор: Daniel REDFIELD, Fred C. Redeker, Gregory E. Menk, Jason G. Fung, Kasiraman Krishnan, Mahendra C. Orilall, Nag B. Patibandla, Rajeev Bajaj, Robert E. Davenport, Russell Edward Perry
Принадлежит: Applied Materials, Inc.

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

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Номер записи: 57
31-07-2008 дата публикации

Selective chemistry for fixed abrasive cmp

Номер: US20080182413A1
Автор: Anand N. Iyer, Garlen C. Leung, Gopalakrishna B. Prabhu, Gregory E. Menk, Peter McReynolds, Robert L. Jackson
Принадлежит: Applied Materials Inc

Methods and compositions for planarizing a substrate surface with selective removal rates and low dishing are provided. One embodiment provides a method for selectively removing a dielectric disposed on a substrate having at least a first and a second dielectric material disposed thereon. The method generally includes positioning the substrate in proximity with a fixed abrasive polishing pad, dispensing an abrasive free polishing composition having at least one organic compound and a surfactant therein between the substrate and the polishing pad, and selectively polishing the second dielectric material relative to the first dielectric material.

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Номер записи: 58
21-02-2008 дата публикации

Selective chemistry for fixed abrasive cmp

Номер: WO2008022277A2
Автор: Anand N. Iyer, Garlen C. Leung, Gopalakrishna B. Prabhu, Gregory E. Menk, Peter McReynolds, Robert L. Jackson
Принадлежит: Applied Materials, Inc.

Methods and compositions for planarizing a substrate surface with selective removal rates and low dishing are provided. One embodiment provides a method for selectively removing a dielectric disposed on a substrate having at least a first and a second dielectric material disposed thereon. The method generally includes positioning the substrate in proximity with a fixed abrasive polishing pad, dispensing an abrasive free polishing composition having at least one organic compound and a surfactant therein between the substrate and the polishing pad, and selectively polishing the second dielectric material relative to the first dielectric material.

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Номер записи: 59
23-01-2018 дата публикации

CMP pad construction with composite material properties using additive manufacturing processes

Номер: US9873180B2
Автор: Daniel REDFIELD, Fred C. Redeker, Gregory E. Menk, Jason G. Fung, Kasiraman Krishnan, Mahendra C. Orilall, Nag B. Patibandla, Rajeev Bajaj, Robert E. Davenport, Russell Edward Perry
Принадлежит: Applied Materials Inc

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

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Номер записи: 60
29-12-2020 дата публикации

Polishing pads produced by an additive manufacturing process

Номер: US10875145B2
Автор: Amritanshu SINHA, Aniruddh KHANNA, Ashavani Kumar, Ashwin CHOCKALINGAM, Boyi FU, Daniel REDFIELD, Fred C. Redeker, Gregory E. Menk, Hou T. Ng, Jason G. Fung, Mahendra C. Orilall, Mario CORNEJO, Mayu YAMAMURA, Nag B. Patibandla, Rajeev Bajaj, Robert E. Davenport, Veera Raghava Reddy KAKIREDDY, Venkat HARIHARAN
Принадлежит: Applied Materials Inc

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

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Номер записи: 61
03-11-2020 дата публикации

Polishing pads produced by an additive manufacturing process

Номер: US10821573B2
Автор: Amritanshu SINHA, Aniruddh KHANNA, Ashavani Kumar, Ashwin CHOCKALINGAM, Boyi FU, Daniel REDFIELD, Fred C. Redeker, Gregory E. Menk, Hou T. Ng, Jason G. Fung, Mahendra C. Orilall, Mario CORNEJO, Mayu YAMAMURA, Nag B. Patibandla, Rajeev Bajaj, Robert E. Davenport, Veera Raghava Reddy KAKIREDDY, Venkat HARIHARAN
Принадлежит: Applied Materials Inc

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

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Номер записи: 62
12-04-2022 дата публикации

Polishing pad manufactured by additional manufacturing process

Номер: JP2022058445A
Автор: B Patibandla Nag, BAJAJ Rajeev, Boyi FU, C Orilall Mahendra, C Redeker Fred, CHOCKALINGAM Ashwin, CORNEJO Mario, Davenport Rob, Felicia Yamamura Mayu, G Fung Jason, Gregory E Menk, HARIHARAN Venkatachalam, Jagdish Khanna Aniruddh, Kakireddy Raghava, Kumar Ashavani, Redfield Daniel, SINHA Amritanshu, Tee Ng Hou, アシャヴァニ クマル，, アシュウィン チョカリンガム，, アニルッド ジャグディシュ カンナ，, アムリタンシュ シンハ，, ヴェンカタチャラム ハリハラン，, グレゴリー イー． メンク，, ジェイソン ジー． ファン，, ダニエル レッドフィールド，, ナグ ビー． パティバンドラ，, フレッド シー． レデカー，, ボイ フー，, ホウ ティー ング，, マヘンドラ シー． オリラル，, マユ フェリシア ヤマムラ，, マリオ コルネホ，, ラーガバ カキレディ，, ラジーブ バジャージ，, ロブ ダヴェンポート，
Принадлежит: Applied Materials Inc

【課題】調整可能な化学的、材料的及び構造的な特性を有する高度な研磨パッド及びその研磨パッドを製造する新たな方法を提供する。【解決手段】３次元（３Ｄ）印刷プロセスなどの付加製造プロセスにより製作され、官能性ポリマー、官能性オリゴマー、反応性希釈剤及び硬化剤を含む少なくとも２つの異なる材料から形成された個別的特性及び形状寸法を有する高度な研磨パッド２００であって、少なくとも１つの樹脂前駆体組成物の自動連続堆積により、更にはその後に続く少なくとも１つの硬化ステップにより、複数のポリマー層から形成される。複数のポリマー層の各層は、少なくとも１つのポリマー組成物及び／又は異なる組成物の領域を表す。【選択図】図３Ａ

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Номер записи: 63
11-02-2010 дата публикации

Chemical mechanical polisher with heater and method

Номер: US20100035515A1
Автор: Christopher Heung-Gyun Lee, Erik S. Rondum, Garlen C. Leung, Gregory E. Menk, Jie Diao, Robert Marks
Принадлежит: Applied Materials Inc

A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.

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Номер записи: 64
21-01-2020 дата публикации

CMP pad construction with composite material properties using additive manufacturing processes

Номер: US10537974B2
Автор: Daniel REDFIELD, Fred C. Redeker, Gregory E. Menk, Jason G. Fung, Kasiraman Krishnan, Mahendra C. Orilall, Nag B. Patibandla, Rajeev Bajaj, Robert E. Davenport, Russell Edward Perry
Принадлежит: Applied Materials Inc

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

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Номер записи: 65
05-04-2012 дата публикации

Closed-loop control of cmp slurry flow

Номер: WO2012005939A3
Автор: Gregory E. Menk, Sang J. Cho, Sivakumar Dhandapani, Stan D. Tsai
Принадлежит: Applied Materials, Inc.

Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include measuring the thickness of a polishing pad having grooves or other slurry transport features on a polishing surface. Once the depth of the grooves on the polishing surface is determined, a flow rate of a polishing slurry is adjusted in response to the determined groove depth. A predetermined number of substrates are polished on the polishing surface. The method can then optionally be repeated.

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Номер записи: 66
16-04-2024 дата публикации

CMP pad construction with composite material properties using additive manufacturing processes

Номер: US11958162B2
Автор: Daniel REDFIELD, Fred C. Redeker, Gregory E. Menk, Jason G. Fung, Kasiraman Krishnan, Mahendra C. Orilall, Nag B. Patibandla, Rajeev Bajaj, Robert E. Davenport, Russell Edward Perry
Принадлежит: Applied Materials Inc

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

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Номер записи: 67
07-02-2022 дата публикации

Ｃｍｐプロセスのトラッキングデータを３ｄ印刷されたｃｍｐ消耗材と組み合わせるための技法

Номер: JP2022023027A
Автор: BAJAJ Rajeev, CORNEJO Mario, G Fung Jason, Gregory E Menk, KHANNA Aniruddh, Redfield Daniel, Watkins John, アニルド カナ，, グレゴリー イー． メンク，, ジェーソン ジー． ファン，, ジョン ワトキンス，, ダニエル レッドフィールド，, マリオ コルネホ，, ラジーブ バジャージ，
Принадлежит: Applied Materials Inc

【課題】改善された研磨性能及び好ましいプロセス感知能力を提供するＣＭＰシステム、研磨パッドを提供する。 【解決手段】研磨パッド、研磨ヘッド保持リング、及び研磨ヘッド膜を含むＣＭＰ研磨装置は、例えば三次元（３Ｄ）印刷プロセス等の付加製造プロセスを介して製造されうる。ＣＭＰ装置は、内部に無線通信装置６００の構成要素を一体的に含みうる。ＣＭＰ装置を製造する方法は、無線通信装置を研磨パッド内に３Ｄ印刷することと、予め形成された無線通信装置を受け入れるように構成された凹部を有する研磨パッドを印刷することとを含む。 【選択図】図６

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Номер записи: 68
18-10-2023 дата публикации

付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造

Номер: JP2023153812A
Автор: B Patibandla Nag, BAJAJ Rajeev, C Orilall Mahendra, C Redeker Fred, E Davenport Robert, Edward Perry Russell, G Fung Jason, Gregory E Menk, Krishnan Kasiraman, Redfield Daniel, カシラマン クリシュナン，, グレゴリー イー． メンク，, ジェーソン ジー． ファン，, ダニエル レッドフィールド，, ナグ ビー． パティバンドラ，, フレッド シー． レデカー，, マヘンドラ シー． オリラル，, ラジーブ バジャージ，, ラッセル エドワード ペリー，, ロバート イー． ダヴェンポート，
Принадлежит: Applied Materials Inc

【課題】研磨均一性の改善をもたらす研磨パッドと共に、この改善型の研磨パッドを作製するための方法を提供する。【解決手段】複合パッド本体２０２は、第１材料又は第１の材料混合物で形成された一又は複数の第１フィーチャ２０４と、第２材料又は第２の材料混合物で形成された一又は複数の第２フィーチャ２０６とを含み、一又は複数の第１フィーチャ及び一又は複数の第２フィーチャは、第１材料又は第１の材料混合物、及び、第２材料又は第２の材料混合物を含む複数の層を堆積させることによって、形成される。【選択図】図２Ａ

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Номер записи: 69
15-11-2023 дата публикации

Chemical mechanical polishing articles

Номер: EP4276885A1
Автор: Daniel REDFIELD, Fred C. Redeker, Gregory E Menk, Jason G. Fung, Kasiraman Krishnan, Mahendra C. Orilall, Nag B. Patibandla, Rajeev Bajaj, Russell Edward Perry
Принадлежит: Applied Materials Inc

A polishing article is described. The polishing article includes a composite pad body. The composite pad body includes a plurality of polishing features forming a polishing surface. The plurality of polishing features are formed from a first material. Each of the plurality of polishing features are separated by a groove. The polishing features include a plurality of pores that include a second material that is at least partially surrounded by the first material. Further, the composite pad body includes one or more base features formed from a third material, wherein the plurality of polishing features and the one or more base features form a unitary body.

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Номер записи: 70
21-05-2024 дата публикации

Techniques for combining CMP process tracking data with 3D printed CMP consumables

Номер: US11986922B2
Автор: Aniruddh Jagdish KHANNA, Daniel REDFIELD, Gregory E. Menk, Jason G. Fung, John Watkins, Mario CORNEJO, Rajeev Bajaj
Принадлежит: Applied Materials Inc

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

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Номер записи: 71
02-07-2024 дата публикации

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Номер: US12023853B2
Автор: Daniel REDFIELD, Fred C. Redeker, Gregory E. Menk, Jason G. Fung, Kasiraman Krishnan, Mahendra C. Orilall, Nag B. Patibandla, Rajeev Bajaj, Russell Edward Perry
Принадлежит: Applied Materials Inc

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

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Номер записи: 72
03-06-2010 дата публикации

Monolithic linear polishing sheet

Номер: WO2010062661A2
Автор: Anand N. Iyer, Benjamin A. Bonner, Erik S. Rondum, Garlen C. Leung, Gopalakrishna B. Prabhu, Gregory E. Menk, Peter McReynolds
Принадлежит: Applied Materials, Inc.

A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.

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Номер записи: 73
03-10-2017 дата публикации

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Номер: US09776361B2
Автор: Daniel REDFIELD, Fred C. Redeker, Gregory E. Menk, Jason G. Fung, Kasiraman Krishnan, Mahendra C. Orilall, Nag B. Patibandla, Rajeev Bajaj, Russell Edward Perry
Принадлежит: Applied Materials Inc

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

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Номер записи: 74