18-06-2015 дата публикации
Номер: US20150168831A1
Provided is a polymer compound that has excellent sensitivity, high resolution, and small line edge roughness and is capable of forming a fine pattern precisely, and less causes post-develop defects. 2. The polymer compound according to claim 1 ,{'sub': '2', 'sup': a', 'a', 'a, 'wherein the polar group of the monomer unit (b) comprises at least one group selected from the group consisting of —O—, —C(═O)—, —C(═O)—O—, —C(═O)—O—C(═O)—, —C(=O)—NH—, —S(═O)—O—, —OR, —C(═O)—OR, and —CN, where Rrepresents, independently in each occurrence, optionally substituted alkyl.'}5. The polymer compound according to claim 1 ,wherein the polymer compound has a weight-average molecular weight of from 1000 to 50000.6. The polymer compound according to claim 1 ,wherein the polymer compound has a weight-average molecular weight of Mw and a number-average molecular weight of Mn and has a molecular weight distribution Mw/Mn of from 1.0 to 3.0, where the molecular weight distribution is a ratio of Mw to Mn.7. A photoresist resin composition comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the polymer compound according to ;'}a photoacid generator; andan organic solvent.8. A method for producing a semiconductor structure claim 7 , the method comprising forming a pattern using the photoresist resin composition according to .11. The polymer compound according to claim 2 ,wherein the polymer compound has a weight-average molecular weight of from 1000 to 50000.12. The polymer compound according to claim 3 ,wherein the polymer compound has a weight-average molecular weight of from 1000 to 50000.13. The polymer compound according to claim 4 ,wherein the polymer compound has a weight-average molecular weight of from 1000 to 50000.14. The polymer compound according to claim 2 ,wherein the polymer compound has a weight-average molecular weight of Mw and a number-average molecular weight of Mn and has a molecular weight distribution Mw/Mn of from 1.0 to 3.0, where the molecular weight ...
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