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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 15. Отображено 15.
11-05-2011 дата публикации

Packaging structure of external heat radiator of pyramid lock hole heat radiation block of base island exposed chip

Номер: CN0102054802A
Автор: XINCHAO WANG, ZHIZHONG LIANG, PANPAN GAO, WANG XINCHAO, LIANG ZHIZHONG, GAO PANPAN
Принадлежит:

The invention relates to a packaging structure of an external heat radiator of a pyramid lock hole heat radiation block of a base island exposed chip, comprising a chip (3), a metal base island (1), a metal inner pin (4), a metal wire (5), a conductive or nonconductive heat conducting bonding substance I (2) and a plastic package body (8); the metal base island (1) is exposed out of the plastic package body (8); a heat radiation block (7) with a lock hole (7.1) is arranged above the chip (3); a conductive or nonconductive heat conducting bonding substance II (6) is embedded between the heat radiation block (7) and the chip (3); and a heat radiator (11) is arranged above the heat radiation block (7) and is fixedly connected with the heat radiation block (7) by a screw (12) through the lock hole (7.1). The packaging structure can provide strong heat radiation capacity to ensure that the heat of the chip can be rapidly conducted to the outside of a packaging body, thereby preventing the chip ...

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Номер записи: 1
28-07-2010 дата публикации

Upright packaging structure with paddle exposing chip for locking hole heat dissipation block externally connected with heat dissipation plate by raised cylinder

Номер: CN0101789408A
Автор: PANPAN GAO, ZHIZHONG LIANG, XINCHAO WANG, GAO PANPAN, LIANG ZHIZHONG, WANG XINCHAO
Принадлежит:

The invention relates to an upright packaging structure with a paddle exposing a chip for a locking hole heat dissipation block externally connected with a heat dissipation plate by a raised cylinder, comprising the chip (3), the metal paddle (1), a metal inner pin (4), a metal wire (5), a conductive or nonconductive heat-conducting bonding substance I (2) and a plastic package body (8). The metal paddle (1) exposes the plastic package body (8), a heat dissipation block (7) is arranged above the chip (3) and is provided with locking holes (7.1) and a conductive or nonconductive heat-conducting bonding substance II (6) is embedded between the heat dissipation block (7) and the chip (3); the heat dissipation block (7) exposes the surface of the plastic package body (8) but not protrudes the plastic package body (8); a heat dissipation plate (11) is arranged above the heat dissipation block (7) and inserted and connected with the heat dissipation block (7) through the raised cylinder (11.1 ...

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Номер записи: 2
28-07-2010 дата публикации

Upright packaging structure with paddle exposing chip for locking hole heat dissipation block externally connected with radiator by raised cylinder

Номер: CN0101789409A
Автор: PANPAN GAO, ZHIZHONG LIANG, XINCHAO WANG, GAO PANPAN, LIANG ZHIZHONG, WANG XINCHAO
Принадлежит:

The invention relates to an upright packaging structure with a paddle exposing a chip for a locking hole heat dissipation block externally connected with a radiator by a raised cylinder, comprising a chip (3), the metal paddle (1), a metal inner pin (4), a metal wire (5), a conductive or non-conductive heat conducting bonding substance I (2) and a plastic sealing body (8). The metal paddle (1) exposes the plastic sealing body (8); a radiating block (7) is arranged above the chip (3) and is provided with locking holes (7.1); conductive or non-conductive heat conducting bonding substances II (6) are inlayed between the radiating block (7) and the chip (3); a radiator (11) is arranged above the radiating block (7) and is plug connection with the radiating block (7) through a raised cylinder (11.1); and conductive or non-conductive heat conducting bonding substances III (13) are inlayed. The packaging structure has strong heat-dissipation ability.

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Номер записи: 3
04-05-2011 дата публикации

Package structure with embedded inner pins, chip, inverted radiating block and external radiator

Номер: CN0102044506A
Автор: XINCHAO WANG, ZHIZHONG LIANG, JIONGJIONG GU, PANPAN GAO, WANG XINCHAO, LIANG ZHIZHONG, GU JIONGJIONG, GAO PANPAN
Принадлежит:

The invention relates to a package structure with embedded inner pins, a chip, an inverted radiating block and an external radiator. The package structure comprises the chip (3), the metal inner pins (4), metal convex blocks (10) and plastic package bodies (8), wherein the metal inner pins (4) are embedded in the plastic package bodies (8). The package structure is characterized in that the radiating block (7) is arranged above the chip (3); conductive or non-conductive heat conducting bonding substances II (6) are nested between the radiating block (7) and the chip (3); the radiator (11) is arranged above the radiating block (7); and conductive or non-conductive heat conducting bonding substances III (13) are nested between the radiator (11) and the radiating block (7). The package structure has strong capability of providing the radiating function and ensures the heat of the chip to be rapidly conducted outside the package bodies.

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Номер записи: 4
07-07-2010 дата публикации

External connection heat radiation plate encapsulation structure of positive installation lock hole heat radiation block of base island exposed chip

Номер: CN0101771008A
Автор: PANPAN GAO, ZHIZHONG LIANG, XINCHAO WANG, GAO PANPAN, LIANG ZHIZHONG, WANG XINCHAO
Принадлежит:

The invention relates to an external connection heat radiation plate encapsulation structure of a positive installation lock hole heat radiation block of a base island exposed chip, which comprises a chip (3), a metal base island (1), a metal inner pin (4), a metal wire (5), a first conductive or nonconductive heat-conductive adhesive material (2) and a plastic encapsulation body (8), wherein the metal base island (1) is carried under the chip, the metal wire (5) is used for signal interconnection from the chip to the metal inner pin, the first nonconductive heat-conductive adhesive material (2) is arranged between the chip and the metal base island, the metal base island (1) is exposed out of the plastic encapsulation body (8), a heat radiation block (7) is arranged above the chip (3), the heat radiation block (7) is provided with a lock hole (7.1), a second conductive or nonconductive heat-conductive adhesive material (6) is embedded and arranged between the heat radiation block (7) and ...

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Номер записи: 5
14-07-2010 дата публикации

System level packaging method of flip chip and attached passive element on support plate chip

Номер: CN0101777504A
Автор: YIGAO CHEN, PANPAN GAO, ZONGYI LI, CHUNHUA WANG, XINCHAO WANG, CHEN YIGAO, GAO PANPAN, LI ZONGYI, WANG CHUNHUA, WANG XINCHAO
Принадлежит:

The invention relates to a system level packaging method of a flip chip and an attached passive element on a support plate chip, which comprises a plurality of chips and a plurality of passive elements, wherein the chips at least comprise one support plate chip and one flip chip, and the chips are piled up in a three-dimensional manner. The method is characterized in that the support plate chip comprises two kinds of bonding pads, wherein the first kind of bonding pads are metal lug structures or metal ball structures; the metal lug structures or the metal ball structures are directly obtained on the aluminium bonding pads of a common chip by an electroplating or bumping process; the second kind of bonding pads are consistent with the bonding pads of the common chip and are the aluminium bonding pads; scaling powder is brushed on the bonding pads of all metal lugs or metal balls of the support plate chip; and primary reflow soldering is carried out on the flip chip and the passive element ...

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Номер записи: 6
04-05-2011 дата публикации

Package structure with embedded inner pins, chip, inverted locking hole, radiating block, convex column and external radiator

Номер: CN0102044509A
Автор: XINCHAO WANG, ZHIZHONG LIANG, PANPAN GAO, YUBIN LIN, WANG XINCHAO, LIANG ZHIZHONG, GAO PANPAN, LIN YUBIN
Принадлежит:

The invention relates to a package structure with embedded inner pins, a chip, an inverted locking hole, a radiating block, a convex column and an external radiator. The package structure comprises the chip (3), the metal inner pins (4), metal convex blocks (10) and plastic package bodies (8), wherein the metal inner pins (4) are embedded in the plastic package bodies (8); the radiating block (7) is arranged above the chip (3) and is provided with the locking hole (7.1); the radiator (11) is arranged above the radiating block (7); the convex column (11.1) protrudes from the middle of the lower end face of the radiator (11); the radiator (11) is connected with the radiating block (7) with the locking hole by the convex column (11.1) through insertion; and conductive or non-conductive heat conducting bonding substances III (13) are nested between the radiator (11) and the radiating block (7) and in the locking hole (7.1). The package structure has strong capability of providing the radiating ...

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Номер записи: 7
28-07-2010 дата публикации

Upright packaging structure with paddle exposing chip for inverted T-shape locking hole heat dissipation block externally connected with radiator

Номер: CN0101789407A
Автор: PANPAN GAO, ZHIZHONG LIANG, XINCHAO WANG, GAO PANPAN, LIANG ZHIZHONG, WANG XINCHAO
Принадлежит:

The invention relates to an upright packaging structure with a paddle exposing a chip for an inverted T-shape locking hole heat dissipation block externally connected with a radiator, comprising the chip (3), the metal paddle (1), a metal inner pin (4), a metal wire (5), a conductive or nonconductive heat-conducting bonding substance I (2) and a plastic package body (8). The metal paddle (1) exposes the plastic package body (8), the heat dissipation block (7) is arranged above the chip (3) and is provided with locking holes (7.1), a conductive or nonconductive heat-conducting bonding substance II (6) is embedded between the heat dissipation block (7) and the chip (3); the radiator (11) is arranged above the heat dissipation block (7) and is fixedly connected with the heat dissipation block (7) by using screws through the locking hole (7.1) and the heat dissipation block (7) is in an inverted T-shaped structure. The invention has strong ability of heat dissipation so that the heat of the ...

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Номер записи: 8
11-05-2011 дата публикации

External radiator packaging structure for matrix island-exposed chip face-up radiating block

Номер: CN0102054803A
Автор: XINCHAO WANG, ZHIZHONG LIANG, PANPAN GAO, WANG XINCHAO, LIANG ZHIZHONG, GAO PANPAN
Принадлежит:

The invention relates to an external radiator packaging structure for a matrix island-exposed chip face-up radiating block. The external radiator packaging structure comprises a chip (3), a metal matrix island (1), a metal inner pin (4), a metal wire (5), a conductive or nonconductive heat conducting bonding material I (2) and a plastic package body (8), wherein the metal matrix island (1) is loaded below the chip; the metal wire (5) is used for interconnecting signals from the chip to the metal inner pin; the conductive or nonconductive heat conducting bonding material I (2) is arranged between the chip and the metal matrix island; and the metal matrix island (1) is exposed out of the plastic package body (8). The external radiator packaging structure is characterized in that: a radiating block (7) is arranged above the chip (3), and a conductive or nonconductive heat conducting bonding material II (6) is embedded between the radiating block (7) and the chip (3); and a radiator (11) is ...

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Номер записи: 9
07-07-2010 дата публикации

External connection heat radiator encapsulation structure of positive installation rectangular heat radiation block of base island exposed chip

Номер: CN0101771006A
Автор: PANPAN GAO, ZHIZHONG LIANG, XINCHAO WANG, GAO PANPAN, LIANG ZHIZHONG, WANG XINCHAO
Принадлежит:

The invention relates to an external connection heat radiator encapsulation structure of a positive installation rectangular heat radiation block of a base island exposed chip, which comprises a chip (3), a metal base island (1), a metal inner pin (4), a metal wire (5), a first conductive or nonconductive heat-conductive adhesive material (2) and an insulated plastic encapsulation body (8), wherein the metal base island (1) is carried under the chip, the metal wire (5) is used for signal interconnection from the chip to the metal inner pin, the first conductive or nonconductive heat-conductive adhesive material (2) is arranged between the chip and the metal island, and the metal base island (1) is exposed out of the plastic encapsulation body (8). The invention is characterized in that a heat radiation block (7) is arranged above the chip (3), a second conductive or nonconductive heat-conductive adhesive material (6) is embedded and arranged between the heat radiation block (7) and the ...

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Номер записи: 10
14-07-2010 дата публикации

External radiator packaging structure of inverted-T heat radiating block positively arranged on base island exposed chip

Номер: CN0101777539A
Автор: PANPAN GAO, ZHIZHONG LIANG, XINCHAO WANG, GAO PANPAN, LIANG ZHIZHONG, WANG XINCHAO
Принадлежит:

The invention relates to an external radiator packaging structure of an inverted-T heat radiating block positively arranged on a base island exposed chip, which comprises a chip (3), a bearing metallic base island (1) below the chip (3), a metallic inner pin (4), a metallic wire (5) for signal interconnection from the chip (3) to the metallic inner pin (4), a heat conducting bonding material I (2) with electric conduction or non-electric conduction between the chip (3) and the metallic base island (1) and a plastic packaging body (8), wherein the metallic base island (1) is exposed out of the plastic packaging body (8). The external radiator packaging structure is characterized in that a heat radiating block (7) is arranged above the chip (3), and a heat conducting bonding material II (6) with electric conduction or non-electric conduction is embedded between the heat radiating block (7) and the chip (3); and a heat radiator (11) is arranged above the heat radiating block (7), a heat conducting ...

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Номер записи: 11
20-07-2011 дата публикации

System level packaging method of flip chip and attached passive element on support plate chip

Номер: CN0101777504B
Автор: YIGAO CHEN, PANPAN GAO, ZONGYI LI, CHUNHUA WANG, XINCHAO WANG, CHEN YIGAO, GAO PANPAN, LI ZONGYI, WANG CHUNHUA, WANG XINCHAO
Принадлежит:

The invention relates to a system level packaging method of a flip chip and an attached passive element on a support plate chip, which comprises a plurality of chips and a plurality of passive elements, wherein the chips at least comprise one support plate chip and one flip chip, and the chips are piled up in a three-dimensional manner. The method is characterized in that the support plate chip comprises two kinds of bonding pads, wherein the first kind of bonding pads are metal lug structures or metal ball structures; the metal lug structures or the metal ball structures are directly obtained on the aluminium bonding pads of a common chip by an electroplating or bumping process; the second kind of bonding pads are consistent with the bonding pads of the common chip and are the aluminium bonding pads; scaling powder is brushed on the bonding pads of all metal lugs or metal balls of the support plate chip; and primary reflow soldering is carried out on the flip chip and the passive element ...

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Номер записи: 12
28-07-2010 дата публикации

Upright packaging structure with paddle exposing chip for heat dissipation block externally connected with heat dissipation plate

Номер: CN0101789406A
Автор: PANPAN GAO, ZHIZHONG LIANG, XINCHAO WANG, GAO PANPAN, LIANG ZHIZHONG, WANG XINCHAO
Принадлежит:

The invention relates to an upright packaging structure with a paddle exposing a chip for a heat dissipation block externally connected with a heat dissipation plate, comprising a chip (3), a metal paddle (1) carried below the chip, a metal inner pin (4), a metal wire (5) interconnecting signals between the chip and the metal inner pin, a conductive or nonconductive heat-conducting bonding substance I (2) between the chip and the metal paddle and a plastic package body (8), wherein the metal paddle (1) exposes the plastic package body (8). The packaging structure is characterized in that the heat dissipation block (7) is arranged above the chip (3), a conductive or nonconductive heat-conducting bonding substance II (6) is embedded between the heat dissipation block (7) and the chip (3); a heat dissipation plate (11) is arranged above the heat dissipation block (7) and a conductive or nonconductive heat-conducting bonding substance III (13) is embedded between the heat dissipation block ...

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Номер записи: 13
11-05-2011 дата публикации

Capsulation structure with inner pin embedded in flip-chip locking hole and radiator externally connected on radiating block

Номер: CN0102054801A
Автор: XINCHAO WANG, ZHIZHONG LIANG, PANPAN GAO, YUBIN LIN, WANG XINCHAO, LIANG ZHIZHONG, GAO PANPAN, LIN YUBIN
Принадлежит:

The invention relates to a capsulation structure with inner pin embedded in a flip-chip locking hole and a radiator externally connected on a radiating block. The capsulation structure comprises a chip (3), inner metallic pin (4), a metal bump (10), a conductive or nonconductive heat-conduction bonding matter I (2) between the chip and the inner metallic pin, and a plastic capsulation element (8), wherein the inner metallic pin (4) are embedded in the plastic capsulation element (8. The capsulation structure is characterized in that a radiating block (7) is arranged above the chip (3); the radiating block (7) is provided with a locking hole (7.1); a conductive or nonconductive heat-conduction bonding matter II (6) is nested between the radiating block (7) and the chip (3); a radiator (11) is arranged above the radiating block (7); and the radiator (11) is fixedly connected to the radiating block (7) by a screw (12) through the locking hole (7.1). The capsulation structure provided by the ...

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Номер записи: 14
07-07-2010 дата публикации

External connection heat radiation cap encapsulation structure of positive installation locking hole heat radiation block projected post of base island exposed chip

Номер: CN0101771007A
Автор: PANPAN GAO, ZHIZHONG LIANG, XINCHAO WANG, GAO PANPAN, LIANG ZHIZHONG, WANG XINCHAO
Принадлежит:

The invention relates to an external connection heat radiation cap encapsulation structure of a positive installation locking hole heat radiation block projected post of a base island exposed chip, which comprises a chip (3), a metal base island (1), a metal inner pin (4), a metal wire (5), a first conductive or nonconductive heat-conductive adhesive material (2) and a plastic encapsulation body (8), wherein the metal base island (1) is exposed out of the plastic encapsulation body (8), a heat radiation block (7) is arranged above the chip (3), the heat radiation block (7) is provided with a locking hole (7.1), a second conductive or nonconductive heat-conductive adhesive material (6) is embedded and arranged between the heat radiation block (7) and the chip (3), a heat radiation cap (11) is arranged above the heat radiation block (7), the heat radiation cap (11) is in insertion connection with the heat radiation block (7) through a projected post (11.1), a third conductive or nonconductive ...

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Номер записи: 15