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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 6. Отображено 6.
31-08-2011 дата публикации

Method for encapsulating and manufacturing glue perfusion molded SIM (subscriber identity module) film card with flip naked chip

Номер: CN0102169553A
Автор: YIGAO CHEN, ZONGYI LI, WEIJUN YANG, XIAOPENG GUO, DONG XIA, CHEN YIGAO, LI ZONGYI, YANG WEIJUN, GUO XIAOPENG, XIA DONG
Принадлежит:

The invention relates to a method for encapsulating and manufacturing a glue perfusion molded SIM (subscriber identity module) film card with a flip naked chip, which comprises the following steps of: directly flipping a thinned naked chip with a metal bump on a flexible circuit board of an SIM film card, and in a loading region of the SIM film card, using the glue to encapsulate the loading region of the flip naked chip by using the glue perfusion method. The SIM film card is produced by flipping the naked chip with the metal bump and pouring the glue, the thickness of the SIM film card and the consistency of the appearance are improved; and meanwhile, the stress state of the film card is improved due to the integral encapsulation effect of the glue so that the quality of the SIM film card is more stable and the batch processing can be realized. The film card can be prevented from damaging due to the extrusion and bending stress in the use process, so that the SIM card can be connected ...

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Номер записи: 1
04-11-2009 дата публикации

Chip-on-board packaging process applied to system in package (SiP)

Номер: CN0101572238A
Автор: XINCHAO WANG, YIGAO CHEN, ZONGYI LI, XIANG YAN, WANG XINCHAO, CHEN YIGAO, LI ZONGYI, YAN XIANG
Принадлежит:

The invention relates to a chip-on-board packaging process applied to a system in package (SiP), which is used for transferring a bonding pad on a chip. The packaging process comprises a plurality of chips which are stacked three-dimensionally; the packaging process also comprises a chip-on-board (U2) which is attached to a chip requiring bonding pad transferring and is attached on an upper layer or a lower layer of the chip requiring the bonding pad transferring; the bonding pad of the chip requiring the bonding pad transferring is connected with a bonding pad on the chip-on-board (U2) in a lead bonding mode, is connected with a bonding pad with space lead bonding of the chip-on-board (U2) through a circuit in the chip-on-board (U2), and then is connected to a substrate in the lead bonding mode. The packaging process can transfer the bonding pad on the chip through the chip-on-board.

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Номер записи: 2
08-04-2009 дата публикации

Software interface design method for communicating with third party intelligent equipment protocol

Номер: CN0101404656A
Автор: WEIDONG ZHAI, XUELIN ZHANG, ZHIHONG MA, YIGAO CHEN, YONGBO XIA, ZHAI WEIDONG, ZHANG XUELIN, MA ZHIHONG, CHEN YIGAO, XIA YONGBO
Принадлежит:

The invention provides a method for designing a software interface communicating with a protocol of third party intelligent equipment. The method comprises the following steps: an intelligent equipment protocol dynamic library is set corresponding to master program; functions related to the protocol are separated from the master program, and independently encapsulated and stored in the intelligent equipment protocol dynamic library; and the intelligent equipment protocol dynamic library presents the same interface for the master program to invoke protocols. As the same interface is presented to the master program, the master program can be transferred after protocols of different intelligent equipment are encapsulated according to the mode, and the master program can transfer all protocol dynamic libraries by using a group of interfaces. The method for designing the interface leads the master program to keep unchanged, thereby greatly reducing cost and risk for switching in the intelligent ...

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Номер записи: 3
14-07-2010 дата публикации

System level packaging method of flip chip and attached passive element on support plate chip

Номер: CN0101777504A
Автор: YIGAO CHEN, PANPAN GAO, ZONGYI LI, CHUNHUA WANG, XINCHAO WANG, CHEN YIGAO, GAO PANPAN, LI ZONGYI, WANG CHUNHUA, WANG XINCHAO
Принадлежит:

The invention relates to a system level packaging method of a flip chip and an attached passive element on a support plate chip, which comprises a plurality of chips and a plurality of passive elements, wherein the chips at least comprise one support plate chip and one flip chip, and the chips are piled up in a three-dimensional manner. The method is characterized in that the support plate chip comprises two kinds of bonding pads, wherein the first kind of bonding pads are metal lug structures or metal ball structures; the metal lug structures or the metal ball structures are directly obtained on the aluminium bonding pads of a common chip by an electroplating or bumping process; the second kind of bonding pads are consistent with the bonding pads of the common chip and are the aluminium bonding pads; scaling powder is brushed on the bonding pads of all metal lugs or metal balls of the support plate chip; and primary reflow soldering is carried out on the flip chip and the passive element ...

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Номер записи: 4
22-08-2012 дата публикации

Method for encapsulating and manufacturing glue perfusion molded SIM (subscriber identity module) film card with flip naked chip

Номер: CN0102169553B
Автор: YIGAO CHEN, ZONGYI LI, WEIJUN YANG, XIAOPENG GUO, DONG XIA, CHEN YIGAO, LI ZONGYI, YANG WEIJUN, GUO XIAOPENG, XIA DONG
Принадлежит:

The invention relates to a method for encapsulating and manufacturing a glue perfusion molded SIM (subscriber identity module) film card with a flip naked chip, which comprises the following steps of: directly flipping a thinned naked chip with a metal bump on a flexible circuit board of an SIM film card, and in a loading region of the SIM film card, using the glue to encapsulate the loading region of the flip naked chip by using the glue perfusion method. The SIM film card is produced by flipping the naked chip with the metal bump and pouring the glue, the thickness of the SIM film card and the consistency of the appearance are improved; and meanwhile, the stress state of the film card is improved due to the integral encapsulation effect of the glue so that the quality of the SIM film card is more stable and the batch processing can be realized. The film card can be prevented from damaging due to the extrusion and bending stress in the use process, so that the SIM card can be connected ...

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Номер записи: 5
20-07-2011 дата публикации

System level packaging method of flip chip and attached passive element on support plate chip

Номер: CN0101777504B
Автор: YIGAO CHEN, PANPAN GAO, ZONGYI LI, CHUNHUA WANG, XINCHAO WANG, CHEN YIGAO, GAO PANPAN, LI ZONGYI, WANG CHUNHUA, WANG XINCHAO
Принадлежит:

The invention relates to a system level packaging method of a flip chip and an attached passive element on a support plate chip, which comprises a plurality of chips and a plurality of passive elements, wherein the chips at least comprise one support plate chip and one flip chip, and the chips are piled up in a three-dimensional manner. The method is characterized in that the support plate chip comprises two kinds of bonding pads, wherein the first kind of bonding pads are metal lug structures or metal ball structures; the metal lug structures or the metal ball structures are directly obtained on the aluminium bonding pads of a common chip by an electroplating or bumping process; the second kind of bonding pads are consistent with the bonding pads of the common chip and are the aluminium bonding pads; scaling powder is brushed on the bonding pads of all metal lugs or metal balls of the support plate chip; and primary reflow soldering is carried out on the flip chip and the passive element ...

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Номер записи: 6