24-02-2022 дата публикации
Номер: US20220059359A1
Принадлежит:
A method of cyclic etching, comprising: (A) depositing, prior to cyclically etching a substrate through a mask opening, a pre-etch protection layer conformally over the mask, sidewalls of the mask defining the mask opening; and an exposed portion of the substrate exposed through the mask opening, the pre-etch protection layer deposited to a first thickness; and (B) cyclically etching the substrate by: (i) depositing a protection layer in the opening of the mask, the protection layer deposited to a second thickness that is less than half of the first thickness; (ii) etching through a portion of the protection layer disposed on the substrate and etching the substrate; and (iii) repeating (i) and (ii) until an end point is reached. 1. A method of cyclic etching , comprising:(A) depositing, prior to cyclically etching a substrate through a mask opening, a pre-etch protection layer conformally over the mask, sidewalls of the mask defining the mask opening; and an exposed portion of the substrate exposed through the mask opening, the pre-etch protection layer deposited to a first thickness; and (i) depositing a protection layer in the opening of the mask, the protection layer deposited to a second thickness that is less than half of the first thickness;', '(ii) etching through a portion of the protection layer disposed on the substrate and etching the substrate; and', '(iii) repeating (i) and (ii) until an end point is reached., '(B) cyclically etching the substrate by2. The method of claim 1 , wherein depositing the pre-etch protection layer further comprises:forming the pre-etch protection layer from a carbon-containing gas.3. The method of claim 2 , wherein depositing the protection layer further comprises:forming the protection layer from a same carbon-containing gas as the pre-etch protection layer.4. The method of claim 2 , wherein depositing the pre-etch protection layer further comprises:applying bias power to the substrate.5. The method of claim 4 , wherein ...
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