Method of mounting semiconductor device

The invention relates to a method of mounting a semiconductor device. Pressurizing and heating are conducted while spraying reducing gas (21) to conduct bump jointing. A plurality of semiconductor elements are arranged on the surface of a substrate (2), and all pressurized heavy substances (22) are divided, and thereby flowing path of the reducing gas (21) can be ensured, gap between a bump (4) and an electrode terminal can be inhibited, and warping at the time of bump jointing can be prevented.

Production method for solder transfer base material, solder precoating method, and solder transfer base material

Provided is a production method for a solder transfer base material which makes forming a solder layer with a thickness that is appropriate for the electronic part or circuit board. The production method is provided with: an adhesive layer forming process, in which an adhesive layer (2) is formed on the surface of a base material; a solder layer forming process, in which a solder layer is formed by positioning a plurality of solder powder bodies (3) in such a way that openings are formed between the solder powder bodies; and a filler supplying process in which fillers (4) are supplied between the solder powder into the openings formed on the adhesive layer.

Electronic-component mounted body, electronic component, and circuit board

An electronic-component mounted body of the present invention has an electronic component (1), which is provided with a plurality of component-side electrode terminals (3a, 3b), mounted on a circuit board (6), which is provided with a plurality of circuit-board side electrode terminals (7a, 7b) corresponding to the plurality of component-side electrode terminals (3a, 3b). The electronic-component mounted body is provided with: a plurality of protruded electrodes (5a, 5b) that are formed on each of the plurality of component-side electrode terminals (3a, 3b) of the electronic component (1), and that electrically connect the electronic component (1) and the circuit board (6); and a dummy electrode (3c) that is formed on the electronic component (1), and that is electrically connected to a component-side electrode terminal (3a), among the plurality of component-side electrode terminals (3a, 3b), located at a prescribed position. The electronic-component mounted body is characterized in having ...

Semiconductor device

Disclosed is a semiconductor device, which is provided with an electrode for external connection, said electrode being formed above a semiconductor substrate (1) by having interlayer insulating films (11, 21) and the like therebetween. The electrode for external connection has: a pad metal layer (8) having the upper surface thereof exposed; a first metal layer (2) formed between the pad metal layer (8) and the semiconductor substrate (1); and at least two first vias (22), which penetrate an interlayer insulating film (21), electrically connect together the pad metal layer (8) and the first metal layer (2), and which are formed on the interlayer insulating film (21). The maximum interval (b) between the first vias (22) is larger than the width (a) of the pad metal layer (8).

Snap navigation of a scrollable list

Methods, systems, and computer-readable media for providing snap navigation in a scrollable list are presented. Certain items of the content items in the scrollable list may represent natural or desirable breakpoints for scrolling through the list. As a list view scrolls through the scrollable list in response to user input, the list view may suspend scrolling when it reaches a breakpoint content item. In some embodiments, a computing device may determine that a given content item represents a breakpoint in the scrollable list based on a breakpoint rule. The breakpoint rule may be based on any suitable criteria for identifying the content item as a breakpoint for scrolling the list. For example, the breakpoint rule may be based on the content of the content item or a category of the content item.

Solder transfer base, method for producing solder transfer base, and method for transferring solder

In order to provide a solder transfer base which enables a transfer without breaking a fragile film of a semiconductor element that has a fragile dielectric film, the present invention provides a solder transfer base (5), which is provided with a base layer (1), an adhesive layer (2) that is arranged on the base layer (1), and a plurality of solder particles (3) that are arranged on the adhesive layer (2). The base layer (1) is a porous member, and is provided with a plurality of pores that pass through at least a remover liquid from the side on which the adhesive layer (2) is not arranged to the side on which the adhesive layer (2) is arranged. In addition, the adhesive layer (2) has such a characteristic that the adhesive layer (2) is expanded when the remover liquid is injected thereinto.

Semiconductor device and semiconductor device manufacturing method

The invention provides a semiconductor device and a semiconductor device manufacturing method, which are advantaged by narrow spacing, guaranteeing of high connecting reliability, and simple structure. The semiconductor device manufacturing method includes the steps of attaching two or more solder particles (3) on at least one electrode among a plurality of electrodes (1a) of an electronic component (1), arranging the electrode (1a) of the electronic component (1) and an electrode (2a) of a circuit board (2) so as to oppose each other, abutting the solder particles (3) attached on a surface of the electrode (1a) of the electronic component (1) to the electrode (2a) of the circuit board (2) and heating the solder particles (3), and connecting electrically the electrode (1a) of the electronic component (1) and the electrode (2a) of the circuit board (2) via two or more solder joint bodies (8) made by melting the solder particles (3).

THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD

A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape. 117-. (canceled)18. A three-dimensional circuit board comprising:a board;a first wiring-electrode group provided on a plurality of steps on the board; anda second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction,wherein at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape,an electronic component is mounted on at least one of the highest step and a lowest step of the first wiring-electrode group,a connection electrode for connecting only between the electronic components, anda first dummy electrode is provided for holding the connection electrode.19. A three-dimensional circuit board comprising:a board;a first wiring-electrode group provided on a plurality of steps on the board and having at least one free end; anda second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction,wherein at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape; anda second dummy electrode is provided for holding the first wiring-electrode group.20. A three-dimensional circuit board comprising:a board;a first wiring-electrode group provided on a plurality of steps on the board and having at least one free end; anda second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction,wherein at least a connecting portion between the first wiring-electrode group and ...

SEMICONDUCTOR DEVICE

An externally connecting electrode is formed above a semiconductor substrate with interlayer insulation films and disposed in the externally connecting electrode. The externally connecting electrode has a pad metal layer whose upper surface is exposed, a first metal layer formed between the pad metal layer and the semiconductor substrate, and at least two first vias which penetrate the interlayer insulation film and electrically connect the pad metal layer to the first metal layer and are formed in the interlayer insulation film. The maximum interval b between the first vias is larger than the width a of the pad metal layer. 1. A semiconductor device comprising an externally connecting electrode formed on a semiconductor substrate with at least two interlayer insulation films disposed in the externally connecting electrode , wherein a first metal layer having an exposed upper surface;', 'a second metal layer formed between the first metal layer and the semiconductor substrate;', 'a third metal layer formed between the first metal layer and the second metal layer; and', 'at least two first vias penetrating a first interlayer insulation film provided between the second metal layer and the third metal layer, for electrically connecting the second metal layer to the third metal layer, and, 'the externally connecting electrode hasa maximum interval between the first vias is larger than a width of the first metal layer.2. The semiconductor device according to claim 1 , whereinthe external connecting electrode further has at least two second vias penetrating a second interlayer insulation film provided between the first metal layer and the third metal layer, for electrically connecting the first metal layer to the third metal layer, andthe maximum interval between the first vias is larger than a maximum interval between the second vias.3. The semiconductor device according to claim 2 , whereina permittivity of the first interlayer insulation film is lower than a ...

Anti-viral agent

A method of suppressing the proliferation of virus comprises administering an antiviral agent comprising as an effective component at least one member selected from the group consisting of 5,7,4′-trihydroxy-3′,5′-dimethoxyflavone, 3-hydroxypyridine, p-hydroxybenzaldehyde and vanillin to one in need of suppressing of viral proliferation.

ELECTRONIC-COMPONENT MOUNTED BODY, ELECTRONIC COMPONENT, AND CIRCUIT BOARD

An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position. 1. An electronic-component mounted body comprising:an electronic component having a plurality of component-side electrode terminals;a circuit board having a plurality of circuit-board side electrode terminals for the component-side electrode terminals, the electronic component being mounted on the circuit board;a plurality of protruded electrodes formed respectively on the component-side electrode terminals on the electronic component to electrically connect the electronic component and the circuit board; andat least one dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals, whereinthe protruded electrode on the component-side electrode terminal in the predetermined position electrically connected to the at least one dummy electrode is higher than the protruded electrodes on the component-side electrode terminals in different positions from the ...

Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate

An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.

MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE MOUNTING STRUCTURE OF THE ELECTRONIC COMPONENT

A mounting structure of an electronic component includes a plurality of joining portions that join a plurality of first electrode terminals on the electronic component to a plurality of second electrode terminals on a circuit board. The joining portions each include a first projecting electrode formed on the first electrode terminal, a second projecting electrode formed on the second electrode terminal, and a solder portion that joins the first projecting electrode to the second projecting electrode. The end face of the first projecting electrode is larger in area than the end face of the second projecting electrode, and at least a part of the second electrode terminals exposed from the circuit board has a larger area than the bottom of the second projecting electrode. 1. A mounting structure of an electronic component , comprising:the electronic component having a plurality of first electrode terminals;a circuit board having a plurality of second electrode terminals for the respective first electrode terminals; anda plurality of joining portions that join the first electrode terminals to the respective second electrode terminals,wherein the joining portions each include a first projecting electrode formed on the first electrode terminal, a second projecting electrode formed on the second electrode terminal, and a solder portion that joins the first projecting electrode to the second projecting electrode,the first projecting electrode has an end face larger in area than an end face of the second projecting electrode, andat least a part of the second electrode terminals exposed from the circuit board has an area larger than an area of a bottom of the second projecting electrode.2. The mounting structure of the electronic component according to claim 1 , wherein the second electrode terminal located in a region corresponding to an outer end of the electronic component is exposed from the circuit board so as to have a smaller exposed area than the second electrode ...

SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AND METHOD FOR TRANSFERRING SOLDER

A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused. 1. A solder transfer substrate , comprising:a base layer;an adhesive layer arranged on the base layer; andplural solder powders arranged on the adhesive layer, whereinin the base layer, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged.2. A solder transfer substrate according to claim 1 , whereinthe adhesive layer has a characteristic of expanding with the peeling-off liquid infused.3. A solder transfer substrate according to claim 1 , whereinthe base layer is a porous member.4. A solder transfer substrate according to claim 1 , whereinthe plurality of holes are provided so as to penetrate from a face of the base layer, which does not touch the adhesive layer, towards a face of the base layer, which touches the adhesive layer.5. A solder transfer substrate according to claim 4 , whereinthe plurality of holes are formed at least to an inside of the adhesive layer.6. A solder transfer substrate according to claim 1 , whereinthe base layer is larger than the adhesive layer in respect of a compression rate at a time of heating.7. A manufacturing method of a solder transfer substrate claim 1 , comprising:an adhesive layer forming step of forming an adhesive layer on a surface of a base layer having a plurality of holes; anda solder powder loading step of loading, on the adhesive ...

COMPOUND OR SALT THEREOF, ANTIVIRAL AGENT, AND PHARMACEUTICAL COMPOSITION

The present invention addresses the problem of providing a tricin derivative having higher antiviral activity. The compound according to the present invention is a compound represented by formula (I) or a salt thereof. 2. The compound according to or a salt thereof claim 1 , wherein one or more of Rand Rare a fluorine atom.3. The compound according to or a salt thereof claim 1 , wherein one or more of R claim 1 , R claim 1 , Rand Rare a fluorine atom and Ris a hydrogen atom or a hydroxy group.4. The compound according to or a salt thereof claim 1 , wherein one or more of R claim 1 , R claim 1 , Rand Rare a fluorine atom and Ris a hydrogen atom or a hydroxy group.5. The compound according to or a salt thereof claim 1 , wherein one or more of R claim 1 , R claim 1 , Rand Rare a fluorine atom and Ris a hydrogen atom or a hydroxy group.6. The compound according to or a salt thereof claim 1 , wherein one or more of R claim 1 , R claim 1 , Rand Rare a fluorine atom and Ris a hydrogen atom or a hydroxy group.7. The compound according to or a salt thereof claim 1 , wherein one or more of R claim 1 , R claim 1 , Rand Rare a fluorine atom and Ris a hydrogen atom or a hydroxy group.8. An antiviral agent comprising the compound according to or a salt thereof.9. A pharmaceutical composition comprising the compound according to or a salt thereof. This application is a U.S. National-Stage entry under 35 U.S.C. § 371 based on International Application No. PCT/JP2018/016362, filed Apr. 20, 2018, which was published under PCT Article 21(2) and which claims priority to Japanese Application No. 2017084293, filed Apr. 21, 2017, which are all hereby incorporated in their entirety by reference.The present invention relates to a compound or a salt thereof, an antiviral agent and a pharmaceutical composition.Tricin [4′,5,7-trihydroxy-3′,5′-dimethoxyflavone (tricin)], which is one of flavonoids, is known to be contained in Poaceae plants, etc. and to have various bioactivities such as ...

Providing Enhanced Message Management User Interfaces

Methods, systems, and computer-readable media for providing enhanced message management user interfaces are presented. In some embodiments, a computing device may present a user interface comprising a scrollable content display region that includes at least two message cards and at least two target zones. The computing device may receive first input moving a first message card to a first target zone. In response to receiving the first input, the computing device may perform a first action on a first email message corresponding to the first message card. Thereafter, the computing device may receive second input moving a second message card to a second target zone. In response to receiving the second input, the computing device may perform a second action different from the first action on a second email message corresponding to the second message card. At least one action may be defined by a user of the computing device. 1. A method , comprising: a scrollable content display region that includes at least two message cards, each message card corresponding to an email message; and', 'at least two target zones arranged along at least two different sides of the scrollable content display region;, 'presenting, by a computing device, a user interface comprisingreceiving, by the computing device, first input moving a first message card of the at least two message cards to a first target zone of the at least two target zones;in response to receiving the first input, performing, by the computing device, a first action on a first email message corresponding to the first message card;receiving, by the computing device, second input moving a second message card of the at least two message cards to a second target zone of the at least two target zones; andin response to receiving the second input, performing, by the computing device, a second action different from the first action on a second email message corresponding to the second message card,wherein at least one action of ...

Providing Enhanced Application Interoperability

Methods, systems, and computer-readable media for providing enhanced application interoperability are presented. In some embodiments, a computing device may present, on at least one display screen, a first user interface that is associated with a first application. In response to determining that the at least one display screen has been rotated from a first orientation to a second orientation, the computing device may present, on the at least one display screen, a second user interface that is associated with a second application different from the first application. In one or more embodiments, the second user interface may include at least some information that is contextually related to information included in the first user interface. In addition, a state of the first application may be preserved when the second user interface that is associated with the second application is presented. 1. A method , comprising:presenting, by a computing device, and on at least one display screen, a first user interface that is associated with a first application;determining, by the computing device, that the at least one display screen has been rotated from a first orientation to a second orientation; andbased on determining that the at least one display screen has been rotated from the first orientation to the second orientation, presenting, by the computing device, and on the at least one display screen, a second user interface that is associated with a second application different from the first application,wherein the second user interface includes at least some information that is contextually related to information included in the first user interface, andwherein a state of the first application is preserved when the second user interface that is associated with the second application is presented.2. The method of claim 1 , wherein functionality of the second application is limited when the second user interface that is associated with the second application is presented ...

MOUNTING STRUCTURE AND MANUFACTURING METHOD FOR SAME

In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal () of an electronic component () and an electrode terminal () of a substrate () contains an alloy () and a metal () having a lower modulus of elasticity than the alloy (). The junction has a cross section structure in which the alloy () is surrounded by the metal () having the lower modulus of elasticity. 1. A mounting structure comprising:an electronic component having a plurality of first electrode terminals;a substrate having a plurality of second electrode terminals; andjunctions each of which contains an alloy and a metal having a lower modulus of elasticity than the alloy, has a cross section structure containing the alloy surrounded by the metal having the lower modulus of elasticity, and connects the first electrode terminal and the second electrode terminal.2. The mounting structure according to claim 1 , wherein at least one of the junctions has a portion connecting an alloy grown from the first electrode terminal and an alloy grown from the second electrode terminal claim 1 , and the connecting portion contains an alloy surrounded by the metal having the lower modulus of elasticity.3. The mounting structure according to claim 1 , wherein on a cross section where a ratio of the metal having the lower modulus of elasticity is maximized in at least one of the junctions disposed on an outer periphery of the electronic component claim 1 , the ratio of the metal having the lower modulus of elasticity is higher than a ratio of the metal having the lower modulus of elasticity on a cross section where the ratio of the metal having the lower modulus of elasticity is maximized in at least one of the junctions disposed at a center of the electronic component.4. The mounting structure according to claim 1 , wherein the junction ...

OPTICAL MODULE STRUCTURE

An optical module structure includes a main substrate, an interposer substrate electrically connected to the main substrate via a first protruding electrode, a first communication LSI electrically connected to the interposer substrate via a second protruding electrode, an IC element electrically connected to the interposer substrate via a lateral-surface connection terminal of the interposer substrate and via a third protruding electrode, an Si bench substrate electrically connected to the IC element via a fourth protruding electrode and via a lateral-surface connection terminal of the Si bench substrate, an optical element electrically connected to the Si bench substrate via a fifth protruding electrode, and an optical fiber optically connected via an optical waveguide formed on the Si bench substrate. 1. An optical module structure comprising:a main substrate,an interposer substrate electrically connected to the main substrate via a first protruding electrode;a first communication LSI electrically connected to the interposer substrate via a second protruding electrode;an IC element electrically connected to the interposer substrate via a lateral-surface connection terminal of the interposer substrate and via a third protruding electrode;an Si bench substrate electrically connected to the IC element via a fourth protruding electrode and via a lateral-surface connection terminal of the Si bench substrate;an optical element electrically connected to the Si bench substrate via a fifth protruding electrode; andan optical fiber optically connected via an optical waveguide formed on the Si bench substrate.2. The optical module structure according to claim 1 , comprising a second communication LSI electrically connected to the interposer substrate.3. The optical module structure of claim 2 , wherein the main substrate comprises a cavity in which the second communication LSI lies.4. The optical module structure according to claim 1 , comprising a heat-radiating sheet ...

EJECTOR REFRIGERATION CYCLE

An ejector refrigeration cycle includes a compressor, a radiator, a branch portion, an ejector, a suction side decompressor, a windward evaporator, and a leeward evaporator. The ejector includes a nozzle portion and a pressure increasing portion. The windward evaporator and the leeward evaporator include at least one outflow side evaporation portion. The leeward evaporator includes a suction side evaporation portion. An outflow side evaporation temperature is a refrigerant evaporation temperature in the at least one outflow side evaporation portion of the leeward evaporator. A suction side evaporation temperature is a refrigerant evaporation temperature in the suction side evaporation portion of the leeward evaporator. At least one of the nozzle portion or the suction side decompressor is configured to adjust a refrigerant passage area such that a temperature difference between the outflow side evaporation temperature and the suction side evaporation temperature is at or below a predetermined reference temperature difference. 1. An ejector refrigeration cycle comprising:a compressor configured to compress a refrigerant and discharge the refrigerant;a radiator configured to release heat of the refrigerant that flowed out of the compressor;a branch portion configured to divide a flow of the refrigerant that flowed out of the radiator into one flow and another flow; a nozzle portion configured to decompress the refrigerant of the one flow that was divided at the branch portion, the refrigerant being ejected from the nozzle portion,', 'a refrigerant suction port through which the refrigerant is drawn by a suction force of the ejected refrigerant, and', 'a pressure increasing portion in which the refrigerant ejected from the nozzle portion and the refrigerant drawn through the refrigerant suction port are mixed, the pressure increasing portion being configured to increase a pressure of the mixture;, 'an ejector that has'}a suction side decompressor configured to ...

Hydraulic system for working machine

A hydraulic system for a working machine includes an fluid cooler including an input port and an output port, the fluid cooler being configured to cool an operation fluid, an outputting portion to output the operation fluid, a traveling hydraulic device to be activated by the operation fluid, an operating hydraulic device to be activated by the operation fluid, a first output fluid tube connecting the operating hydraulic device to a tank, a second output fluid tube branching from the first output fluid tube and being connected to the input port of the fluid cooler, a third output fluid tube connecting the outputting portion to the output port of the fluid cooler, a fourth output fluid tube connected to the traveling hydraulic device, the fourth output fluid tube being connected to the second output fluid tube, and a first check valve disposed on the fourth output fluid tube.

HYDRAULIC SYSTEM FOR WORKING MACHINE

A hydraulic system for a working machine includes a hydraulic actuator having a first fluid chamber and a second fluid chamber, an accumulator, an outputting fluid tube to output an operation fluid, and a switching valve to be switched between a first position and a second position. The first position allows the first fluid chamber and the second fluid chamber to be communicated with the outputting fluid tube and thereby allowing a floating operation. The second position allows the first fluid chamber and the accumulator to be communicated with each other, allows the second fluid chamber and the outputting fluid tube to be communicated with each other, and thereby allows an anti-vibration operation. 1. A hydraulic system for a working machine , comprising:a hydraulic actuator having a first fluid chamber and a second fluid chamber;an accumulator;an outputting fluid tube to output an operation fluid; and the first position allowing the first fluid chamber and the second fluid chamber to be communicated with the outputting fluid tube and thereby allowing a floating operation,', 'the second position allowing the first fluid chamber and the accumulator to be communicated with each other, allowing the second fluid chamber and the outputting fluid tube to be communicated with each other, and thereby allowing an anti-vibration operation., 'a switching valve to be switched between a first position and a second position,'}2. The hydraulic system for the working machine according to claim 1 , comprising:a control valve to control the operation fluid that is to be supplied to the hydraulic actuator;a first supplying tube connecting the control valve to the first fluid chamber;a second supplying tube connecting the control valve to the second fluid chamber;a first communicating tube connected to the first supplying tube and connected to the switching valve; anda second communicating tube connected to the second supplying tube and connected to the switching valve.3. The ...

Method for manufacturing semiconductor device

A method for manufacturing a semiconductor device includes: supplying a resist to a first surface of a semiconductor element having a plurality of electrode pads to cover the electrode pad surfaces; opening the resist on the electrode pad surfaces to expose the electrode pad surfaces from the resist; curing the resist by applying light or heat to the resist; forming bump electrodes on the electrode pad surfaces by filling a plating solution into the openings of the resist; and peeling the resist from the first surface of the semiconductor element.

SOLID-STATE IMAGING DEVICE

A solid-state imaging device includes a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. The sealing resin includes a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components. 1. A solid-state imaging device comprising:a solid-state imaging element including a light receiving surface;a main substrate connected to a surface of the solid-state imaging element on an opposite side to the light receiving surface;electronic components mounted on the main substrate; anda sealing resin positioned between the solid-state imaging element and the main substrate.2. The solid-state imaging device according to claim 1 ,wherein an outer edge of the main substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element; andan outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element.3. The solid-state imaging device according to claim 1 , further comprising:a transparent member fixed to the light receiving surface of the solid-state imaging element by an adhesive,wherein an outer edge of the transparent member seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element, andan outer edge of the adhesive seen from the light ...

Semiconductor device manufacturing method and semiconductor device

A plurality of protruding electrodes of a semiconductor chip are in contact with a plurality of electrodes formed on a semiconductor substrate, via a plurality of solder sections. In this state, the solder sections are melted so as to form a plurality of solder bonding sections joined to the protruding electrodes of the semiconductor chip and the electrodes of the semiconductor substrate. Moreover, a distance between a part of the semiconductor chip and the semiconductor substrate is larger than a distance between the other part of the semiconductor chip and the semiconductor substrate, extending at least some of the solder bonding sections. Thus, the solder bonding sections vary in height. Holes are then formed at least in a solder bonding section having a maximum height out of the solder bonding sections. After that, the solder bonding sections are solidified.

Navigating a Hierarchical Data Set

Methods, systems, and computer-readable media for providing navigation in a hierarchical data set are presented. In some embodiments, a computing device may generate a user interface including a first node as a focused node at a fixed focal point along with a subset of a first plurality of related nodes having a relationship with the first node. In some instances discussed herein, user input may be received selecting a second node as the focused node, such as a scrolling action dragging the second node to the fixed focal point. The user interface may be updated to display a subset of a second plurality of related nodes having a relationship with the second node. In some arrangements, the hierarchical data set may correspond to an organizational chart, a workflow, a directory structure, a categorized list, a taxonomy, or any other type of hierarchical data. 1. A method comprising:generating, by a computing device, a user interface having a fixed focal point and a content region configured to present one or more nodes representing at least a portion of a hierarchical data set, said one or more nodes including a first node representing a first element of the hierarchical data set;updating, by the computing device, the user interface to present the first node as a focused node at the fixed focal point; andupdating, by the computing device, the user interface to include at least a portion of a first plurality of related nodes, the first plurality of related nodes representing a first plurality of elements of the hierarchical data set that are related to the first element.2. The method of claim 1 ,wherein the fixed focal point is maintained at a constant position fixed relative to the content region of the user interface as the first node is moved away from the fixed focal point, andwherein a given node is determined to be the focused node when the given node at least partially overlaps the fixed focal point.3. The method of claim 1 , wherein each of the first plurality ...

WORKING MACHINE

A working machine body includes a machine body having a front and a rear opposite to the front in a front-rear direction and an engine mounted in the machine body. A selective catalytic reduction catalyst is provided in the machine body and connected to the machine body and connected to the engine. A urea aqueous solution tank is to store a urea aqueous solution. The urea aqueous solution tank is connected to the selective catalytic reduction catalyst and provided in the machine body between the engine and the front of the machine body in the front-rear direction. 1. A working machine comprising:a machine body having a front and a rear opposite to the front in a front-rear direction of the working machine and having a right side and a left side opposite to the right side in a right-left direction perpendicular to the front-rear direction;a right traveling device arranged on the right side of the machine body;a left traveling device arranged on the left side of the machine body;a boom having a boom front and a boom rear opposite to the boom front in the front-rear direction, the boom rear being rotatably supported at the rear of the machine body, the boom front being to be connected to a working tool;an engine mounted in the machine body;a selective catalytic reduction catalyst provided in the machine body and connected to the engine; anda urea aqueous solution tank to store a urea aqueous solution, the urea aqueous solution tank being connected to the selective catalytic reduction catalyst and provided in the machine body between the engine and the front of the machine body in the front-rear direction.2. The working machine according to claim 1 , wherein the urea aqueous solution tank is provided on either side of the right side and the left side in the right-left direction.3. The working machine according to claim 1 , wherein the engine has an output shaft which is provided along the front-rear direction.4. The working machine according to claim 1 , further ...

Semiconductor element and solid-state imaging apparatus

A semiconductor element includes a plurality of microlenses provided on a main surface to collect light, a plurality of conductive electrodes provided on a back surface of the main surface, a photoelectric converter to which the light collected by the plurality of microlenses is guided, and a strain sensor provided on the same layer as the photoelectric converter to detect a strain. A solid-state imaging apparatus includes the semiconductor element, a transparent member, an adhesive layer that covers the plurality of microlenses and adheres to the transparent member, and a plurality of external connection electrodes electrically connected to the plurality of conductive electrodes, respectively.

Snap Navigation of a Scrollable List

Methods, systems, and computer-readable media for providing snap navigation in a scrollable list are presented. Certain items of the content items in the scrollable list may represent natural or desirable breakpoints for scrolling through the list. As a list view scrolls through the scrollable list in response to user input, the list view may suspend scrolling when it reaches a breakpoint content item. In some embodiments, a computing device may determine that a given content item represents a breakpoint in the scrollable list based on a breakpoint rule. The breakpoint rule may be based on any suitable criteria for identifying the content item as a breakpoint for scrolling the list. For example, the breakpoint rule may be based on the content of the content item or a category of the content item. 1. A method comprising:generating, by a computing device, a user interface presenting a list view of a scrollable list that includes a plurality of content items, the list view including a first portion of the plurality of content items;receiving, by the computing device, user input corresponding to a first scroll command;based on the first scroll command, updating, by the computing device, the list view to scroll through the plurality of content items, thereby including a first additional content item of the plurality of content items in the list view;determining, by the computing device, whether the first additional content item satisfies a breakpoint rule; andwhen it is determined that the first additional content item satisfies the breakpoint rule, suspending further updates that are based on the first scroll command,wherein the scrollable list includes a second additional content item following the first additional content item in a direction associated with the first scroll command.2. The method of claim 1 , further comprising:when it is determined that the first additional content item does not satisfy the breakpoint rule, updating the list view to continue scrolling ...

WORKING MACHINE

A working machine includes a machine body having a front and a rear opposite to the front in a front-rear direction and an engine mounted in the machine body. A selective catalytic reduction catalyst is provided in the machine body and connected to the machine body and connected to the engine. A fuel tank is provided in the machine body to supply fuel to an engine. A urea aqueous solution tank is to store a urea aqueous solution. The urea aqueous solution tank is connected to the selective catalytic reduction catalyst and provided in the machine body between the engine and the front of the machine body in the front-rear direction. A traveling device support body supports the right traveling device and the left traveling device. The machine body does not rotate with respect to the traveling device support body. 1. A working machine comprising:a machine body having a front and a rear opposite to the front in a front-rear direction of the working machine and having a right side and a left side opposite to the right side in a right-left direction perpendicular to the front-rear direction;a right traveling device arranged on the right side of the machine body;a left traveling device arranged on the left side of the machine body;a boom having a boom front and a boom rear opposite to the boom front in the front-rear direction, the boom rear being rotatably supported at the rear of the machine body, the boom front being to be connected to a working tool;an engine mounted in the machine body;a selective catalytic reduction catalyst provided in the machine body and connected to the engine;a fuel tank provided in the machine body to supply fuel to the engine;a urea aqueous solution tank to store a urea aqueous solution, the urea aqueous solution tank being connected to the selective catalytic reduction catalyst and provided in the machine body between the engine and the front of the machine body in the front-rear direction; anda traveling device support body supporting the ...

WIRING BOARD

A wiring board includes a semiconductor chip mounting surface, an external connection surface provided on an opposite side from the semiconductor chip mounting surface, and pads provided on the semiconductor chip mounting surface. Each pad includes a columnar section, and a tapered section, continuously formed on a first end of the columnar section, and having a cross sectional area that decreases toward a direction away from the columnar section. The tapered section of each pad projects from the semiconductor chip mounting surface.

HYDRAULIC SYSTEM FOR WORKING MACHINE

A hydraulic system for a working machine includes a hydraulic actuator having a first fluid chamber and a second fluid chamber, an accumulator, an outputting fluid tube to output an operation fluid, and a switching valve to be switched between a first position and a second position. The first position allows the first fluid chamber and the second fluid chamber to be communicated with the outputting fluid tube and thereby allowing a floating operation. The second position allows the first fluid chamber and the accumulator to be communicated with each other, allows the second fluid chamber and the outputting fluid tube to be communicated with each other, and thereby allows an anti-vibration operation. 1. A hydraulic system for a working machine , comprising:a hydraulic actuator;a float switching valve to perform a floating operation of the hydraulic actuator;an anti-vibration switching valve to perform an anti-vibration operation of the hydraulic actuator; anda control valve to stop the anti-vibration operation performed by the anti-vibration switching valve when the float switching valve performs the floating operation.2. The hydraulic system for the working machine according to claim 1 , comprising:a first switch connected to the control device and configured to issue a first command of the floating operation; anda second switch connected to the control device and configured to issue a second command of the floating operation,wherein the control device is configured to stop the anti-vibration operation performed in accordance with the second command when obtaining the first command while the anti-vibration switching valve is performed in accordance with the second command.3. The hydraulic system for the working machine according to claim 1 , comprisingan accumulator, the anti-vibration position allowing the accumulator and the hydraulic actuator to be communicated with each other and thereby allowing an anti-vibration operation,', 'the stop position allowing the ...

EJECTOR MODULE

When an ejector having a variable nozzle and a variable throttle mechanism are integrated together as an ejector module, a nozzle-side central axis CL and a decompression-side driving mechanism have a twisted positional relationship, if the nozzle-side central axis CL is defined as a central axis of a nozzle-side driving mechanism in a displacement direction in which the nozzle-side driving mechanism of the ejector having the variable nozzle displaces a needle valve, and the decompression-side central axis CL is defined as a central axis of a decompression-side driving mechanism in a displacement direction in which the decompression-side driving mechanism of the variable throttle mechanism displaces a throttle valve. When viewed from the central axis direction of one of the nozzle-side central axis CL and the decompression-side central axis CL, a driving portion corresponding to the one central axis is disposed to overlap with the other central axis. 1. An ejector module for use in an ejector refrigeration cycle , the ejector refrigeration cycle including: a compressor configured to compress and discharge a refrigerant; a radiator configured to dissipate heat from the refrigerant discharged from the compressor; a first evaporator configured to evaporate the refrigerant; and a second evaporator configured to evaporate the refrigerant and to cause the refrigerant to flow out to a suction side of the compressor , the ejector module comprising:a nozzle configured to decompress a part of the refrigerant flowing out of the radiator and to inject the decompressed refrigerant;a decompression portion configured to decompress another part of the refrigerant flowing out of the radiator;a body portion having a refrigerant suction port, through which the refrigerant is drawn from an outside by a suction effect of an injection refrigerant injected from the nozzle;a pressurizing portion configured to pressurize a mixed refrigerant of the injection refrigerant and a suction ...

A welding bump and a method for forming the same, and a semiconductor device and a method for manufacturing the same

Compound or salt thereof, antiviral agent, and pharmaceutical composition

Hydraulic system for working machine

A hydraulic system for a working machine includes a hydraulic actuator having a first fluid chamber and a second fluid chamber, an accumulator, an outputting fluid tube to output an operation fluid, and a switching valve to be switched between a first position and a second position. The first position allows the first fluid chamber and the second fluid chamber to be communicated with the outputting fluid tube and thereby allowing a floating operation. The second position allows the first fluid chamber and the accumulator to be communicated with each other, allows the second fluid chamber and the outputting fluid tube to be communicated with each other, and thereby allows an anti-vibration operation.

Spline rolling tool, and process of manufacturing spline rolling tool

A spline rolling tool including a plurality of forming teeth that are to bite into a cylindrical workpiece so as to roll splines in the workpiece. Each of the forming teeth has an incomplete toothed region in which a crest of each forming tooth is removed such that an upper end of each forming tooth in the incomplete toothed region is defined by an incomplete-toothed region surface that includes a curved surface portion, a flat surface portion and a slant surface portion. The incomplete-toothed region surface is defined at its periphery by a chamfered edge that has a surface roughness of not larger than about 3.2 μm. Also disclosed is a process of manufacturing the spline rolling tool, which includes a chamfering step of forming the chamfered edge by using a wire brush having abrasive grains that are fixed to bristles of the wire brush.

Compound or salt thereof, antiviral agent, and pharmaceutical composition

The present invention addresses the problem of providing a tricin derivative having higher antiviral activity. The compound according to the present invention is a compound represented by formula (I) or a salt thereof.(In formula (I), at least one of R¹-R⁵represents a fluorine atom, and the rest of R¹-R⁵, which are not fluorine atoms, represent a hydrogen atom or a hydroxy group.)

Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

After a first electronic component is inserted in a base substrate, first circuit patterns are formed on the inserted first electronic component, and then a second electronic component is mounted on the first circuit patterns to complete an electronic component-mounted component. According to the above method, the thickness of a module may be decreased by the thickness of the base substrate. Further, since the electronic component is surface-mounted, electronic components of arbitrary sizes and types may be used.

Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method

A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused.

Noncontact information storage medium and method for manufacturing same

A non-contact information storage medium has IC chip (30) having at least a function of storing information, and resin substrate (10) having antenna pattern (14) for communicating a signal to an external device. Antenna terminal (141) disposed at one end of antenna pattern (14) on resin substrate (10) and electrode terminal (22) of IC chip (30) are mounted so that the antenna terminal faces the electrode terminal. Insulating layer (32) for gap regulation of at least 5 µm is disposed between antenna pattern (14) and circuit forming surface (20) of IC chip (30).

Figure moving method

【課題】 整列された多数の図形を整列した状態で移動させるための効率的な図形移動方法を提供する。 【解決手段】 図形移動方法は、行列状に配置された複数の図形をグループ化して行列状に配置された複数の図形グループを生成する図形グループ生成ステップと、上記複数の図形より全体基準図形を設定する全体基準図形設定ステップと、上記全体基準図形が選択されて移動するとき全ての図形を上記全体基準図形と同様に移動させる図形全体移動ステップと、上記図形グループの各々において上記複数の図形より１つの基準図形を設定する基準図形設定ステップと、上記基準図形の１つが選択されて移動するとき上記全体基準図形が含まれる図形グループ以外の全ての図形グループを図形グループ間の行と列の相対的な関係を維持した状態にて移動させる図形グループ移動ステップと、とを有する。 【選択図】 図１１

Electronic component mounting structure and method for manufacturing the structure

【課題】柔軟性を有する狭ピッチで微細な突起電極を介して、低い加圧力での接続を可能とし、圧接時の応力による電子部品などの破損を防止した信頼性に優れる電子部品実装構造体とその製造方法を提供する。 【解決手段】複数の電極端子１０ａを設けた電子部品１０と、電極端子１０ａに対向する位置に接続端子１２ａを設けた実装基板１２と、電極端子１０ａ上または接続端子１２ａ上に設けた突起電極１３を介して電極端子１０ａと接続端子１２ａとを接続する電子部品実装構造体１であって、突起電極１３は、少なくとも導電性フィラー１３ａと感光性樹脂１３ｂとを含み、感光性樹脂１３ｂの樹脂成分架橋密度が突起電極１３の高さ方向に異なることを特徴とする。 【選択図】図１

Spline Rolling Tool, and Process of Manufacturing Spline Rolling Tool

A spline rolling tool including a plurality of forming teeth that are to bite into a cylindrical workpiece so as to roll splines in the workpiece. Each of the forming teeth has an incomplete toothed region in which a crest of each forming tooth is removed such that an upper end of each forming tooth in the incomplete toothed region is defined by an incomplete-toothed region surface that includes a curved surface portion, a flat surface portion and a slant surface portion. The incomplete-toothed region surface is defined at its periphery by a chamfered edge that has a surface roughness of not larger than about 3.2 μm. Also disclosed is a process of manufacturing the spline rolling tool, which includes a chamfering step of forming the chamfered edge by using a wire brush having abrasive grains that are fixed to bristles of the wire brush.

Optical module structure

An optical module structure includes a main substrate, an interposer substrate electrically connected to the main substrate via a first protruding electrode, a first communication LSI electrically connected to the interposer substrate via a second protruding electrode, an IC element electrically connected to the interposer substrate via a lateral-surface connection terminal of the interposer substrate and via a third protruding electrode, an Si bench substrate electrically connected to the IC element via a fourth protruding electrode and via a lateral-surface connection terminal of the Si bench substrate, an optical element electrically connected to the Si bench substrate via a fifth protruding electrode, and an optical fiber optically connected via an optical waveguide formed on the Si bench substrate.

Electronic part mounting structure and its manufacturing method

An electronic part mounting structure includes electronic part ( 2 ) having a plurality of electrode terminals ( 3 ), a substrate provided with connection terminals ( 6 ) in locations corresponding to these electrode terminals ( 3 ), and protruding electrode ( 7 ) for connecting one of electrode terminals ( 3 ) and one of connection terminals ( 6 ), where electrode terminal ( 3 ) of electronic part ( 2 ) and connection terminal ( 6 ) of substrate ( 5 ) are connected through protruding electrode ( 7 ), and protruding electrode ( 7 ) is formed of a conductive resin including a photosensitive resin and a conductive filler.

Navigating a hierarchical data set

Methods, systems, and computer-readable media for providing navigation in a hierarchical data set are presented. In some embodiments, a computing device may generate a user interface including a first node as a focused node at a fixed focal point along with a subset of a first plurality of related nodes having a relationship with the first node. In some instances discussed herein, user input may be received selecting a second node as the focused node, such as a scrolling action dragging the second node to the fixed focal point. The user interface may be updated to display a subset of a second plurality of related nodes having a relationship with the second node. In some arrangements, the hierarchical data set may correspond to an organizational chart, a workflow, a directory structure, a categorized list, a taxonomy, or any other type of hierarchical data.

Three-dimensional electronic circuit apparatus

Ejektormodul

Ejektormodul (20) für eine Verwendung in einem Ejektorkühlzyklus (10), wobei der Ejektorkühlzyklus (10) Folgendes aufweist: einen Kompressor (11), der so aufgebaut ist, dass er ein Kühlmittel komprimiert und abgibt; einen Radiator (12), der so aufgebaut ist, dass er Wärme von dem vom Kompressor (11) abgegebenen Kühlmittel abgibt; einen ersten Verdampfer (17), der so aufgebaut ist, dass er das Kühlmittel verdampft; und einen zweiten Verdampfer (18), der so aufgebaut ist, dass er das Kühlmittel verdampft und bewirkt, dass das Kühlmittel zu einer Saugseite des Kompressors (11) herausströmt, wobei das Ejektormodul (20) Folgendes aufweist:eine Düse (51), die so aufgebaut ist, dass sie ein Teil des Kühlmittels, das aus dem Radiator (12) herausströmt, dekomprimiert und das dekomprimierte Kühlmittel einspritzt;einen Dekompressionsabschnitt (20a), der so aufgebaut ist, dass er einen anderen Teil des Kühlmittels, das aus dem Radiator (12) herausströmt, dekomprimiert;einen Körperabschnitt (21) mit einem Kühlmittelsauganschluss (21b), durch den das Kühlmittel von einer Außenseite durch einen Saugeffekt eines Einspritzkühlmittels angesaugt wird, das von der Düse (51) eingespritzt wird;einen Druckbeaufschlagungsabschnitt (52), der so aufgebaut ist, dass er ein gemischtes Kühlmittel aus dem Einspritzkühlmittel und einem Saugkühlmittel, das von dem Kühlmittelsauganschluss (21b) angesaugt wird, mit Druck beaufschlagt;einen dekompressionsseitigen Ventilkörper (61), der so aufgebaut ist, dass er eine Kanalquerschnittsfläche des Dekompressionsabschnittes (20a) ändert; undeinen dekompressionsseitigen Antriebsabschnitt (62, 621), der so aufgebaut ist, dass er den dekompressionsseitigen Ventilkörper (61) versetzt, wobeiein drosselseitiger Auslass (21d), durch den das Kühlmittel aus dem Dekompressionsabschnitt (20a) herausströmt, mit einer Kühlmitteleinlassseite des ersten Verdampfers (17) verbunden ist,der Kühlmittelsauganschluss (21b) mit einer Kühlmittelauslassseite des ersten ...

半導体装置、半導体装置の製造方法、製造装置及び製造システム

【課題】実装工程において回路基板側に与える応力を緩和し得る半導体装置を提供する。【解決手段】複数個の電極パッド２を備えた半導体装置であって、複数個の電極パッド２の上に開口部を有するレジストを備え、開口部は、電極パッド側から順にテーパ開口部８ａ、応力緩和開口部８ｂ及び柱状開口部８ｃを有し、テーパ開口部８ａは斜面が直線であり、応力緩和開口部８ｂは、底面積が上面積よりも大きく、且つ、斜面が内側に湾曲した円錐台形状であり、応力緩和開口部８ｂは、応力緩和開口部８ｂの底面より応力緩和開口部８ｂの側面が横方向に膨出した形状を呈し、テーパ開口部８ａ及び応力緩和開口部８ｂが合わさる面で、開口部はくびれ形状を呈する。【選択図】図２Ｅ

半導体装置の製造方法および製造装置

【課題】実装工程において脆弱な絶縁膜を有する半導体装置に与える応力を緩和し得る半導体装置を提供する。【解決手段】複数個の上記電極パッドの上に位置するバンプと、上記バンプを覆うレジストと、上記レジストの内部に、上記バンプと上記レジストの外部とを繋ぐ空気の抜け穴と、を有する半導体装置を用いる。また、複数個の上記電極パッドの上にバンプと、上記バンプを覆うレジストと、上記バンプと空気の抜け穴で連結されたダミーバンプと、を有する半導体装置を用いる。【選択図】図１

半導体装置の製造方法

【課題】多ピン化、大口径化が進む半導体素子において、短い生産時間で、安定した形状を確保し、さらに低コストで製造可能な微小突起電極の形成方法を提供する。【解決手段】複数個の電極パッドを有する半導体素子の上記電極パッド面を覆うように全面にレジストを供給するレジスト工程と、上記レジストの上記電極パッド面を開口する開口工程と、上記レジストに光ないしは熱を加え、上記レジストを硬化する硬化工程と、上記レジストの開口にめっきを充填するめっき工程と、上記レジストを剥離する剥離工程と、を備えた半導体装置の製造方法を用いる。【選択図】図１

Solid-state imaging apparatus including semiconductor element with photoelectric converter and strain sensors

A semiconductor element includes a plurality of microlenses provided on a main surface to collect light, a plurality of conductive electrodes provided on a back surface of the main surface, a photoelectric converter to which the light collected by the plurality of microlenses is guided, and a strain sensor provided on the same layer as the photoelectric converter to detect a strain. A solid-state imaging apparatus includes the semiconductor element, a transparent member, an adhesive layer that covers the plurality of microlenses and adheres to the transparent member, and a plurality of external connection electrodes electrically connected to the plurality of conductive electrodes, respectively.

エジェクタ式冷凍サイクル、および流量調整弁

【課題】負荷変動によらず吸引側蒸発器へ流入する冷媒の流量を適切に調整可能なエジェクタ式冷凍サイクルを提供する。【解決手段】吸引側蒸発器１９へ流入する冷媒を減圧させる吸引側減圧装置１５として、吸引側蒸発器１９の出口側の冷媒の過熱度ＳＨ１が基準過熱度ＫＳＨ１に近づくように絞り開度を変化させる温度式膨張弁を採用し、さらに、吸引側減圧装置１５の入口側の冷媒を、吸引側減圧装置１５を迂回させて吸引側蒸発器１９の入口側へ導くバイパス通路１６と、バイパス通路１６を開閉する機能を有する可変絞り装置１７とを備える。可変絞り装置１７は、吸引側減圧装置１５から流出する冷媒の流量Ｇｅ１が基準流量ＫＧｅ１以下となった際に、バイパス通路１６を開く。【選択図】図１

Anti-viral agent

Provided is an antiviral agent with high antiviral activities and low side effects (cytotoxicity). Specifically provided is an antiviral agent comprising as an effective component at least one member selected from the group consisting of 5,7,4'-trihydroxy-3',5'-dimethoxyflavone, 3-hydroxypyridine, p-hydroxybenzaldehyde and vanillin.

Solid-state imaging device

Semiconductor device and methods of manufacturing semiconductor device

A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.

多層配線基板およびその製造方法

【課題】基板との密着性に優れるとともに、微細なランド部を介して接続された多層配線基板およびその製造方法を提供することを目的とする。 【解決手段】少なくとも第１ランド部２０を有する第１の配線パターン３０を備えた基板１０と、第１の配線パターン３０の第１ランド部２０をビアホールとして有する層間絶縁層４０と、層間絶縁層４０の表面でビアホールと接続される第２ランド部４５を有する第２の配線パターン５０とを備え、第１ランド部２０の断面形状が凹部形状を有し、その外周側面の高さが第１の配線パターン３０の厚みより高いとともに、層間絶縁層４０が第１の配線パターン３０の厚み以上で、第１ランド部２０の外周側面の高さ以下の厚みに形成された構成を有する。 【選択図】図１

熱交換器

【課題】冷凍サイクルの運転状態や入力される冷媒流量などの条件によらず、常に冷媒の凍結を好適に防止できる熱交換器を提供する。【解決手段】熱交換器２０は、風下側蒸発器１８の風下第２ターンＲ１２の下部に設置される第１サーミスタ３１と、風上側蒸発器１７の風上第２ターンＲ２２の上部、かつ、風上第１ターンＲ２１と反対側の半分の部分Ｒ２２２に設置される第２サーミスタ３２とを備える。第１サーミスタ３１は、冷媒の供給流量が基準範囲である通常状態において冷媒が最低温度となる領域の温度Ｔ１を計測する。第２サーミスタ３２は、冷媒の供給流量が基準範囲を下回る低流量となる異常状態において最低温度となる領域の温度Ｔ２を計測する。熱交換器２０の制御部３０は、冷媒温度Ｔ１とＴ２とを比較して異常状態を検知し、異常状態を解消するために冷媒の供給量を調整する異常回復制御を実施する。【選択図】図２

作業機

【課題】機体に搭載されたキャビン、機体の右側及び左側に配置された走行装置、キャビンの側方に設けられたブーム、ブームに装着された作業具及び機体の後部に搭載されたエンジンを有する作業機に尿素水タンクを良好に搭載する。【解決手段】機体と、機体に搭載されたキャビンと、機体の右側及び左側に配置された走行装置と、機体の側方に設けられたブームと、ブームに装着された作業具と、機体の後部に搭載されたエンジンと、尿素水を貯留し、エンジンの前方に設けられた尿素水タンク本体と、を有する。【選択図】図１

作業機

【課題】機体に搭載されたキャビン、機体の右側及び左側に配置された走行装置、キャビンの側方に設けられたブーム、ブームに装着された作業具及び機体の後部に搭載されたエンジンを有する作業機に尿素水タンクを良好に搭載する。【解決手段】機体と、機体に搭載されたキャビンと、機体の右側及び左側に配置された走行装置と、機体の側方に設けられたブームと、ブームに装着された作業具と、機体の後部に搭載されたエンジンと、尿素水を貯留し、エンジンの前方に設けられた尿素水タンク本体と、を有する。【選択図】図１

ガスセンサ装置

【課題】反応速度が速いガスセンサ装置を提供すること。【解決手段】ガスセンサ装置は、キャビティ構造を有する基板と、前記基板のキャビティ構造の凹部に配置されたセンサ素子と、前記凹部を覆うように前記基板に接合された水素透過膜と、を含む。【選択図】図１

導電性組成物および配線基板

【課題】導電体粒子同士の３次元的接合を積極的に推進し、全体としての導電性を向上させることのできる導電性組成物および配線基板を提供する。 【解決手段】導電性組成物４は、加熱により硬化する樹脂バインダ１と、この樹脂バインダ１の硬化開始温度より低い変態開始温度を有し、変態開始温度以上で形状が伸張する導電性の第１形状記憶粒子２と、上記樹脂バインダ１の硬化開始温度より低い変態開始温度を有し、変態開始温度以上で形状が収縮する導電性の第２形状記憶粒子３とを少なくとも含有した組成を有する。 この構成によって、形状記憶粒子が互いに絡み合い、低抵抗の導体配線やビア導体を形成することができ、それを用いて配線基板および多層配線基板を形成することができる。 【選択図】図１

半導体装置およびその製造方法

【課題】電子部品と基板との接続信頼性を向上させた半導体装置、およびその製造方法を提供する。 【解決手段】半導体装置は、電極７が設けられた電子部品１と、上面に電極７と電気的に接続された基板電極１３が設けられ、電極７と基板電極１３とが対向するように配置された基板２と、電極７と基板電極１３とを接続させる接続部材９と、フラックスを含み、少なくとも接続部材９と基板電極１３との接続部分に接する第１の樹脂部３ｂと、第１の樹脂部より３ｂもフラックスの濃度が低い第２の樹脂部３ａとを有し、電子部品１と基板２との間の隙間に充填された封止フィルム３とを備えている。 【選択図】図１

多層配線基板およびその製造方法

【課題】基板との密着性に優れるとともに、微細なビアホールを介して配線基板を多層化できる多層配線基板およびその製造方法を提供することを目的とする。 【解決手段】少なくとも一方の面に第１の配線パターン２を有する絶縁性基板１と、第１の配線パターン２と接続するビアホール５を有する、導電性フィラー３を分散して含む層間絶縁層４と、層間絶縁層４の表面でビアホール５と接続される第２の配線パターン６とを備え、第１の配線パターン２とビアホール５との界面が導電性フィラー３により接続されるように構成する。 【選択図】図１

Expansionsventil

Ein Expansionsventil umfasst einen Gehäuseblock (41), einen Ventilkörper (50, 150A, 150B) und ein Strahlströmungsbeschränkungselement (51, 51A). Der Gehäuseblock (41) hat einen Kältemitteldurchgang (49) darin. Der Kältemitteldurchgang (49) umfasst eine Ventilöffnung (53) und einen von der Öffnung stromabwärtigen Durchgang (49b) stromabwärtig von der Ventilöffnung (53). Der Ventilkörper (50, 150A, 150B) ist in dem Gehäuseblock (41) angeordnet, um zwischen einer vollständig geöffneten Position, in welcher der Ventilkörper (50, 150A, 150B) die Ventilöffnung (53) vollständig öffnet, und einer vollständig geschlossenen Position, in welcher der Ventilkörper (50, 150A, 150B) die Ventilöffnung (53) vollständig schließt, beweglich zu sein. Das Strahlströmungsbeschränkungselement (51, 51A) ist in dem von der Öffnung stromabwärtigen Durchgang (49b) angeordnet, um eine Strahlströmung des Kältemittels, die stromabwärtig von der Ventilöffnung (53) erzeugt wird, zu beschränken. Das Strahlströmungsbeschränkungselement (51, 51A) hat eine Querschnittsfläche S2, welche Beziehungen S2 <= S1 - S0 und S2 >= 0,03 x S1 erfüllt, in denen S1 eine Querschnittsfläche des von der Öffnung stromabwärtigen Durchgangs (49b) ist und S0 eine Querschnittsfläche eines ringförmigen Durchgangs ist, der zwischen der Ventilöffnung (53) und dem Ventilkörper (50, 150A, 150B) definiert wird, wenn der Ventilkörper (50, 150A, 150B) in der vollständig offenen Position ist.

Method for manufacturing semiconductor device and semiconductor device

A method for manufacturing a semiconductor device includes providing a semiconductor element having an electrode terminal, forming a resist on the semiconductor element, the resist having a first surface facing the electrode terminal and a second surface opposite to the first surface, providing an imprint mold having a third surface and a protrusion protruding from the third surface, forming an opening in the resist by disposing the imprint mold on the second surface of the resist and inserting the protrusion into the resist, the third surface of the imprint mold facing the second surface of the resist, the protrusion being aligned with the electrode terminal, curing the resist by applying energy to the resist, widening the opening in a radial direction of the opening by causing the resist to react with a developer, and forming a bump by filling the opening with metal, in which the forming of the opening in the resist is performed in a state where a gap is provided between the second surface of the resist and the third surface of the imprint mold.

導電性材料、この導電性材料を用いた電子部品実装構造体および配線基板ならびにそれらの製造方法

【課題】感光性樹脂と低融点金属からなる導電性フィラーとを含む感光性液状樹脂に対して光照射を行い硬化させた後、感光性樹脂の軟化温度まで加熱して感光性樹脂を収縮させるとともに導電性フィラー相互間の接合を生じさせることで低抵抗を実現できる導電性材料と、接続信頼性の高い電子部品実装構造体および低コストの配線基板ならびにこれらの製造方法とを提供する。 【解決手段】低融点金属からなる導電性フィラー１６と硬化済樹脂１７とからなる材料であって、導電性フィラー１６が分散された液状の感光性樹脂２２に光照射を行うことで硬化させ、さらに加熱または加熱と加圧を行うことで硬化した感光性樹脂２５を収縮させて、導電性フィラー１６相互間の接合を生じさせる構成からなる。 【選択図】図４

作業機

【課題】 移動手段及び傾倒手段を上方から見ながら、冷却機器の水平移動及び傾倒が容易にできるようにする。 【解決手段】 機体フレーム３にエンジン７及び冷却機器８を搭載し、機体フレーム３に冷却機器８を取り付ける支持台１２と冷却機器８を固定する装着部材１３とを設け、冷却機器８と支持台１２との間に、装着部材１３による固定を解除した状態で、冷却機器８をエンジン７側から離れる方向に水平移動可能にする移動手段Ａと、冷却機器８上部をエンジン７から離れる方向へ傾倒可能にする傾倒手段Ｂとを設ける。移動手段Ａは、冷却機器８に設けられた支持具７１及び係合部材７２と、支持台１２上に設けられていて係合部材７２の水平移動を案内するガイド板７３とを有し、傾倒手段Ｂは、支持台１２上に設けられていてガイド板７３から水平移動で突出してきた係合部材７２をガイド溝７３ａより上側の位置で受持する傾倒保持部材７４を有する。 【選択図】図１

カメラモジュールとその製造方法

【課題】小型・薄型化が容易で、生産性や接続信頼性に優れたカメラモジュールおよびその製造方法を提供する。 【課題手段】光学結像をするレンズ１０１を有するレンズ鏡筒ユニット１０と、主面に光学結像を受ける受光部１５１と一方の面に形成された表面電極に接続され側面の溝部に形成された凹部電極１５２とを有する固体撮像素子１５と、溝部と対向する位置の凸部に形成された凸部電極１６２を設けた貫通孔と、を有する筐体１３と、を備え、固体撮像素子１５が筐体１３の貫通孔に埋め込まれ、凹部電極１５２と凸部電極１６２とを接続する。 【選択図】図１

半導体素子の実装方法

【課題】薄型化，狭ピッチ端子化された半導体素子であっても、生産性を維持しながら、はんだ接合の際の反りを抑制することを目的とする。 【解決手段】半導体素子を搭載する毎に加圧状態で加熱して仮接合を行い、全ての半導体素子を仮接合した後、一括して加圧状態で加熱して本接合を行うことにより、薄型化，狭ピッチ端子化された半導体素子であっても、生産性を維持しながら、はんだ接合の際の反りを抑制して積層することができる。 【選択図】図３

零件安裝裝置

[課題]提供一種零件安裝裝置，其可以在每次零件的外形尺寸之變更之時，在不需要進行光軸調整以及調焦距之情形下，以非常高的精度在短時間內對基板進行零件安裝。[解決手段]安裝頭具有到達透明保持構件之貫通孔，該透明保持構件可將零件保持並安裝到基板上，其中該零件與該基板各自具有圖案特徵部，並可用攝像裝置同時拍攝通過保持構件以及第1貫通孔而被第1反射光學系統反射之第1攝像光程上的保持零件與基板的圖案特徵部、與通過保持構件以及第2貫通孔而被第1反射光學系統與第2反射光學系統反射之第2攝像光程上的保持零件與基板的圖案特徵部，且可藉由移動調整裝置因應零件之兩圖案特徵部的位置使攝像單元沿貫通孔排列方向移動而進行位置調整。

Mounting structure of electronic component with joining portions and method of manufacturing the same

A mounting structure of an electronic component includes a plurality of joining portions that join a plurality of first electrode terminals on the electronic component to a plurality of second electrode terminals on a circuit board. The joining portions each include a first projecting electrode formed on the first electrode terminal, a second projecting electrode formed on the second electrode terminal, and a solder portion that joins the first projecting electrode to the second projecting electrode. The end face of the first projecting electrode is larger in area than the end face of the second projecting electrode, and at least a part of the second electrode terminals exposed from the circuit board has a larger area than the bottom of the second projecting electrode.

携帯用電子機器

(57)【要約】 （修正有） 【課題】 携帯用電子機器を、直接使用している人以外 の人にも容易にディスプレイパネルに表示される内容を 提示する事が可能にする。 【解決手段】 本体部１０と、表示パネル６０を内蔵す る表示部５０と、表示部５０を本体部１０に本体部側基 部のほぼ中央部を介して所定角度旋回可能に係止すると 共に、本体部面を被覆する様に開閉自在に本体部１０に 取り付ける取り付け部とを備え、取り付け部は、表示部 ６０を本体部側基部のほぼ中央部で固定する固定部１６ ０と、本体部１０内に下部が本体部の筐体底面より所定 距離離間するように位置決め固定された円筒状の軸受け 部１２０と、固定部１６０を回動可能に係止する固定部 係止部１１０と、該固定部係止部１１０端部より延出す る軸受け部１２０の内周部に摺動可能に軸支され先端部 が本体部筐体で位置決め係止される。

導電性パターンの形成方法、導電性パターン形成用組成物および導電性パターンを有する電子部品

【課題】基材表面に、導電性に優れ、断面のアスペクト比が高い導電性パターンを形成する方法およびその方法に用いる組成物を提供する。 【解決手段】導電性パターン形成用液状組成物を露光面を有する容器に供給する工程と、導電性パターンが形成される表面を有する基材を前記組成物に浸漬する工程と、露光面と基材の表面との間に所定厚みの組成物層が介在するように基材を配置し、組成物層にマスクを介して露光し、所定パターンの硬化物層を形成する工程と、露光面と形成された硬化物層の表面との間に所定厚みの新たな組成物層が介在するように基材を移動させ、その組成物層にマスクを介して露光し、所定パターンの硬化物層を更に形成する操作を１回以上行い、硬化物層の積層膜を形成する工程と、基材の表面から未硬化の組成物を除去する工程と、積層膜を熱処理する工程とを有する導電性パターンの形成方法およびその方法に用いる導電性パターン形成用組成物。 【選択図】図１

Antiviral composition

作業機

【課題】アタッチメントを接続して使用できる接続構造を有する作業機において、部品点数を削減して、接続構造を小型化することができる作業機を提供すること。 【解決手段】機体と、機体に設けられた作業装置と、作業装置に設けられた接続部材と、接続部材に接続可能な油圧アクチュエータと、油圧アクチュエータに供給する作動油を制御する制御弁と、制御弁に接続可能な第１管材と、油圧アクチュエータに接続可能な第２管材とを備え、接続部材は、第１管材を接続可能な第１接続部と、第２管材を接続可能な複数の第２接続部と、第１接続部から複数の第２接続部に向けて延び、且つ少なくとも２つに分岐して複数の第２接続部に繋がる分岐油路とを有している。 【選択図】図５

零件之安裝方法及安裝裝置

本發明之目的在於提供一種零件之安裝方法及安裝裝置，其不受有安裝裝置之溫度變化之某過程或因長時間驅動之安裝裝置之熱膨脹之影響，而可高精度安裝構件間間隙。 本發明係於安裝中同時測量至安裝構件11之距離B與至基板12之上表面14之距離A，算出構件間間隙D，以成為預先設定之值之方式一邊控制一邊安裝。

電子部品実装済基板および回路モジュール

【課題】電子部品を埋設する絶縁性樹脂基材のクラックの発生を防止できる電子部品実装済基板を提供する。 【解決手段】電子部品１１０の裏面に、厚み方向に丸み１３０を有する補強部材１４０を設けて、絶縁性樹脂基材１５０に埋設して電子部品実装済基板１００を形成する。これにより、電子部品実装済基板１００の曲げ応力やねじり応力による電子部品１１０の端縁での応力集中を丸み１３０により分散し、クラックの発生しない信頼性に優れた電子部品実装済基板１００を実現できる。 【選択図】図１

Semiconductor device and methods of manufacturing semiconductor device

A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.

半導體裝置製造方法及半導體裝置

本發明之半導體裝置製造方法係在半導體晶片(1)之複數個突起狀電極(4)介隔複數個焊錫部而抵接於半導體基板(11)上所形成之複數個電極(13)之狀態下，使複數個焊錫部熔融，而形成接合於半導體晶片(1)之複數個突起狀電極(4)與半導體基板(11)之複數個電極(13)之複數個焊錫接合部(7)。繼而，使半導體晶片(1)之一部分與半導體基板(11)之間之間隔(A)大於半導體晶片(1)之其他部分與半導體基板(11)之間之間隔(B)，而拉伸複數個焊錫接合部(7)中至少一部分之焊錫接合部。藉此，在複數個焊錫接合部(7)之高度上產生偏差。繼而，在複數個焊錫接合部(7)中之至少在高度成為最大之焊錫接合部(7a)內形成空孔(8)。其後，使複數個焊錫接合部(7)凝固。

Semiconductor device manufacturing method and semiconductor device

冷凍サイクル装置

【課題】サイクルを循環する循環冷媒流量の変化によらず、冷凍サイクル装置に高いＣＯＰを発揮させる。 【解決手段】冷媒を放熱させる放熱器１２としてパス構成を変更することで冷媒が放熱しながら流通する熱交換距離Ｌｈｘを変更可能に構成されたものを採用し、圧縮機から吐出された冷媒の吐出冷媒圧力Ｐｄが、熱交換距離Ｌｈｘを最短距離Ｌｍｉｎとしたときの最短時吐出冷媒圧力Ｐｄｍｉｎ以下となるように、熱交換距離Ｌｈｘを変化させる。これにより、循環冷媒流量の変化によらず、圧縮機の消費動力の増加を抑制して、冷凍サイクル装置に高いＣＯＰを発揮させる。 【選択図】図３

抗菌剤

【課題】海洋病原細菌に対する抗菌剤とその海洋での利用を提供すること。【解決手段】本発明の一態様はクマザサエキスを有効成分とする海洋病原細菌に対する抗菌剤である。本発明の一態様において、海洋病原細菌による感染症の発症を予防させたい海洋魚類に、抗菌剤を、海洋で飼育中に接触させる。本発明の一態様は、抗菌剤が混合された、海洋魚類の飼料である。本発明の一態様は、抗菌剤を用いた海洋魚類の生産方法である。本発明の一態様では、海洋病原細菌による感染症の発症を予防させたい海洋魚類に、抗菌剤が混合された飼料を、海洋で飼育中に摂取させる。【選択図】なし

エジェクタ式冷凍サイクル

【課題】蓄冷手段を備えるエジェクタ式冷凍サイクルの成績係数（ＣＯＰ）を向上させる。【解決手段】送風空気を最大冷却能力で冷却する際に、圧縮機に要求される冷媒吐出能力を基準冷媒吐出能力としたときに、圧縮機を基準冷媒吐出能力よりも高い冷媒吐出能力を発揮するように作動させる作動モードと圧縮機を停止させる停止モードとを交互に切り替えることによって、圧縮機の冷媒吐出能力を制御する。これにより、作動モード時に、エジェクタのノズル部へ流入させる冷媒流量を増加させて、ディフューザ部における冷媒昇圧量を増加させることができるので、圧縮機１１の消費動力を低減させて、ＣＯＰを向上させることができる。【選択図】図３

安裝構造及其製造方法

本發明提供一種具有脆弱膜之半導體晶片等電子零件安裝於電路基板等基板之安裝構造中，可提高連接可靠性之安裝構造。將電子零件(1)之電極端子(4)與基板(2)之電極端子(5)連接之接合部包含合金(8)與較該合金(8)低彈性模數之金屬(9)，且合金(8)具有由低彈性模數之金屬(9)包圍之剖面構造。

冷凍サイクル装置

【課題】吐出温度保護制御時に吐出側冷媒温度を速やかかつ確実に低下させることが可能な冷凍サイクル装置を提供すること。 【解決手段】空調制御装置２０は、温度センサ１５０が検出する冷媒温度が上限温度ＴＤ１以上となったときには、制御バルブ１１０に入力される電流をオン状態からオフ状態として可変容量型の圧縮機１００の冷媒吐出を停止し、温度センサ１５０が検出する冷媒温度が下限温度ＴＤ２以下となったときには、制御バルブ１１０に入力される電流をオフ状態からオン状態として圧縮機１００の冷媒吐出を再開する。 【選択図】図１

端子装着方法及び端子装着用冶具

【課題】圧入穴に圧入される端子の振れを抑えることができる端子装着方法を提供する。 【解決手段】底壁３の圧入穴３１に端子４を圧入する場合には、まず、底壁３の後方に端子装着用冶具５を、底壁３の前方にガイド部７をそれぞれ配置して、ガイド部７の収納穴７１に収納された端子４の一端を、底壁３の圧入穴３１を通して支持穴５１と向き合わせる。続いて、圧入穴３１内に端子４を圧入すると、圧入穴３１の後端開口部から突出した端子４が、支持穴５１に前端開口部から挿入される。圧入穴３１への端子４の圧入が済んだら、ガイド部７を端子４から離間させると共に、端子装着用冶具５を端子４から離脱させる。 【選択図】図２

エジェクタ式冷凍サイクル

【課題】エジェクタあるいは吸引側減圧部の圧力損失によって生じる空調能力の低下を抑制可能なエジェクタ式冷凍サイクルを提供する。【解決手段】室内凝縮器１２、室外熱交換器１４、エジェクタ１６のディフューザ部１６ｄから流出した冷媒を蒸発させる流出側蒸発器１８、固定絞り１７にて減圧された冷媒を蒸発させてエジェクタ１６の冷媒吸引口１６ｃ側へ流出させる吸引側蒸発器１９を備えるエジェクタ式冷凍サイクルに、室外熱交換器１４から流出した冷媒を吸引側蒸発器１９の冷媒入口側へ導くバイパス通路２１、およびバイパス通路２１を開閉する開閉弁２２を設ける。そして、室内凝縮器１２を放熱器として用い、室外熱交換器１４、流出側蒸発器１８および吸引側蒸発器１９を蒸発器として用いる除湿暖房時にバイパス通路を開く。【選択図】図１

部品の実装方法及び実装装置

【課題】実装装置の温度変化があるプロセス又は長時間駆動での実装装置の熱膨張の影響を受けず、部材間ギャップを高精度に実装できる部品の実装方法及び実装装置を提供することを目的とする。【解決手段】実装中に実装部材１１までの距離Ｂと基板１２の上面１４までの距離Ａとを同時に測定し、部材間ギャップＤを算出し、予め設定された値になるよう制御しながら実装する。【選択図】図１

シールド電線とシールド部材の接続構造、シールド部材

【課題】シールド電線に引張力が加わった場合でも、シールド電線の編組とシールド部材の編組接続部とのずれを抑制できる構造を提供する。【解決手段】第１シールド部材５は、シールド電線２の編組露出部分２４ａを加締める編組接続部５２を備えている。編組接続部５２は、基部５４と、長尺加締め片５５と、短尺加締め片５６と、を備えている。短尺加締め片５６の先端側には、シールド電線２から離れる方向に曲げられた第１屈曲部５６ａと、第１屈曲部５６ａよりも先端側において第１屈曲部５６ａとは逆方向に曲げられた第２屈曲部５６ｂと、を有するクランク部５７が形成されている。編組接続部５２が編組露出部分２４ａの外周を加締めた状態では、短尺加締め片５６の第２屈曲部５６ｂよりも先端側の先端部５６ｐが、長尺加締め片５５の先端部５５ｐの外側に位置して長尺加締め片５５の先端部５５ｐを内側に押さえている。【選択図】図８

Solid-state imaging device

To provide a solid-state imaging device including a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, in which an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. Furthermore, to provide the solid-state imaging device in which the sealing resin is a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components is included.

データベース検索プログラム

【課題】 検索対象データベースの追加・変更や検索に使用する検索プログラムの追加・変更や検索条件の追加・変更の発生時に、クライアント装置側の検索アプリケーションの修正を不要とし、保守性を向上させることが可能な技術を提供することにある。 【課題手段】 クライアント装置は、利用可能なデータベースおよび利用可能な検索プログラムに関する情報を定義したリソース情報ファイルをサーバ装置に要求し、サーバ装置からリソース情報ファイルを受信する。クライアント装置は、検索プログラム選択画面および検索条件入力画面を動的に生成する。 【選択図】 図４

作業機の油圧システム

【課題】ヒートアップ油路内の作動油の排出を確実にコントロールすることができる作業機の油圧システムを提供する。【解決手段】作業機の油圧システムは、作動油を吐出する油圧ポンプＰ２と、油圧ポンプから吐出された作動油を供給対象に送る少なくとも１つの比例弁３４と、比例弁が組み込まれた弁ボディと、弁ボディに形成されていて、油圧ポンプから吐出された作動油を流入させるヒートアップ油路ｗと、ヒートアップ油路を通過した作動油を油圧機器６３に供給する開位置と油圧機器に供給しないと共に油圧機器からの作動油を戻す閉位置とに切り替え可能な少なくとも１つの切替弁と、切替弁及び比例弁を操作する制御装置ＣＵと、制御装置によって切替弁及び比例弁の少なくとも１つが操作されることによってヒートアップ油路に流入した作動油を戻す戻し回路と、を備えている。【選択図】図２

半導体装置の製造方法及び半導体装置

【課題】半導体素子を実装基板にフリップチップ実装する際に、実装基板側に与える応力を緩和する半導体装置の製造方法及び半導体装置を提供する。【解決手段】半導体装置の製造方法は、半導体素子１に設けられた複数の電極端子の表面を覆うレジスト３を形成する工程と、電極端子直上のレジストに、インプリント型５に設けられた突起部５ａを差し込むことにより、レジストに開口部３ａを形成する工程と、レジストにエネルギーを与えて、レジストを硬化させる工程と、開口部を現像液と反応させて、開口部を径方向に拡げる工程と、開口部にバンプとなる金属を充填する工程とを含む。レジストを開口する工程は、レジストの表面とインプリント型の内面５ｃとの間に隙間を設けた状態で行われる。【選択図】図１

半導体装置の製造方法、半導体装置の製造装置、及び半導体装置

【課題】突起電極を形成するための、改善された半導体装置の製造方法、半導体装置の製造装置、及び半導体装置を提供する。【解決手段】半導体素子に設けられた複数の電極端子の表面を覆うレジストを形成するレジスト形成工程と、開口部の型であるナノインプリント型を、レジストを挟んで複数の電極端子に押し当てることにより、レジストに開口部を形成するレジスト開口工程と、ナノインプリント型を介してレジストにエネルギーを与えてレジストを硬化させるレジスト硬化工程と、開口部を現像液と反応させて径方向に拡げる現像工程と、開口部にバンプとなる金属を充填する金属充填工程と、レジストを複数の電極端子の表面から剥離する剥離工程と、を備える。【選択図】図１

部品の実装装置

【課題】 実装部材の貼り付け工程内で、実装部材を保持しながら、接合部材に対し均一な紫外光照射することができる部品の実装装置を提供する。 【解決手段】 実装部材１１を保持する実装部材保持部１０と、実装部材が実装される被実装部材１２を保持する被実装部材保持部２と、実装部材と被実装部材との間に配置される接合部材１３に紫外光を照射する紫外光照射部４と、実装部材保持部と被実装部材保持部とを相対的に接近離間させる駆動部３とを備え、実装部材保持部が、被実装部材保持部と紫外光照射部との間に配置された実装装置であって、実装部材保持部は、紫外光を透過する部材５で形成され、かつ、実装部材を保持する面の平面方向の中心部から外側に向けて電極密度が密から疎となる透明電極６を備えるとともに、実装部材保持部は、実装部材を保持する面に、紫外光を拡散する紫外光拡散部８を備える。 【選択図】図１

部品実装装置

【課題】 部品の外形サイズの変更の度に、光軸調整及び焦点距離合わせを行う必要がなく、非常に高い精度で短時間で基板に部品実装できる部品実装装置を提供する。 【解決手段】 それぞれパターン特徴部３ｂ，３ａ，１６ａ，１６ｂを有する基板１３に部品２を保持して実装可能な透明保持部材５に至る貫通穴６９ａ，６９ｂを実装ヘッド１が有し、保持部材及び第１貫通穴を通り第１反射光学系６１で反射された第１撮像光路６５での保持部品と基板とのパターン特徴部と、保持部材及び第２貫通穴を通りかつ第１反射光学系と第２反射光学系６２とで反射された第２撮像光路での保持部品と基板とのパターン特徴部とを撮像装置１１ａ，１１ｂで同時撮像し、部品の両パターン特徴部の位置に応じて撮像ユニットを貫通穴配列方向沿いに移動調整装置７０で移動させて位置調整可能とする。 【選択図】図１Ａ

零件安裝裝置

[課題]本發明提供一種零件安裝裝置，可以一邊在無溫度偏差的情況下將被安裝構件的保持構件保持在高溫，一邊以非常高的精度在短時間內將被安裝構件安裝到基板上。 [解決手段]藉由配置在安裝頭側面的拍攝裝置來辨識安裝頭所保持的被安裝構件以進行對位。在安裝頭的內部，在與拍攝裝置相對向的位置上配置光學零件，且在光垂直反射至被安裝構件的辨識標記的位置上配置光學零件。在拍攝裝置與安裝頭之間設置防熱霧吹氣噴嘴與板狀的整流板。噴嘴是設置成使得從噴嘴噴射出的噴流與從安裝頭到拍攝裝置的光程交叉，且整流板是與安裝頭分離而設置，引導噴流沿著整流板的表面流動。

部品実装装置

【課題】被実装部材の保持部材を温度ばらつき無く高温に保持しながら、非常に高い精度で短時間で基板に被実装部材を実装することができる部品実装装置を提供する。 【解決手段】実装ヘッド１で保持した被実装部材２を、実装ヘッド側面に配置された撮像装置１１により認識し、位置合わせする。実装ヘッド１の内部には、撮像装置１１に対向する位置に光学部品１０を配置し、被実装部材２の認識マーク３に垂直に光が反射する位置に光学部品１０を配置する。撮像装置１１と実装ヘッド１との間に陽炎防止ブローノズル１６と板状の整流板１７とを設ける。ノズルは、ノズルから噴射した噴流２０が実装ヘッドから撮像装置に至るまでの光路１８と交差するように設けられ、かつ整流板が実装ヘッドと離間して設けられて、噴流が整流板の表面に沿って流れるように導かれる。 【選択図】図２

電気集塵装置用電極部材、電気集塵装置の集塵極及び電気集塵装置

【課題】簡易にゆがみを少なくすることができ、集塵極と放電極の絶縁距離を確実に確保することが可能な電気集塵装置用電極部材、電気集塵装置の集塵極及び電気集塵装置を提供する。【解決手段】本開示に係る電気集塵装置用電極部材１０は、ガス流れ方向に沿って配置される集塵極と、ガス流れ方向に沿って配置され、集塵極に対向して配置される放電極と、を有する電気集塵装置の集塵極に用いられる電気集塵装置用電極部材１０であって、中空の柱状であり、長手方向に沿って２本以上配置されるパイプ材６と、長手方向に沿って隣り合うパイプ材６同士を連結する連結部７とを備え、連結部７は、一方向がパイプ材６の長手方向に沿って配置され、一端が一方のパイプ材６の端部とボルト接合され、他端が他方のパイプ材６の端部とボルト接合される取付部１１を有する。【選択図】図５

多層配線基板およびその製造方法

【課題】製造工程の簡略化と環境負荷の低減を図ることによって、製造コストの大幅な低減を実現する多層配線基板の製造方法を提供することを目的とする。 【解決手段】導電ペーストからなる第１の配線層１２を基板１１上に形成し、第１の配線層１２上に導電ペーストからなる突起状電極１３を形成する。次に、突起状電極１３の外周部から所定の間隙部２３を有する領域部を遮蔽したマスクパターンを有するスクリーン印刷版２１を用いて、突起状電極１３と間隙部２３を設けて高分子樹脂からなる絶縁性樹脂層１４を第１の配線層１２上に形成する。次に、絶縁性樹脂層１４を加熱して高分子樹脂を低粘度化させ、流動化した高分子樹脂で間隙部２３を埋めた後、高分子樹脂を固化させて絶縁性樹脂層１４を形成する。次に、絶縁性樹脂層１４の上に導電ペーストからなる第２の配線層１５を形成する。 【選択図】図２