Epoxy Resin Composition

To provide an epoxy resin composition which can form a cured material having low dielectric constant and low dielectric loss tangent in a radio frequency region, and a film obtained by using the epoxy resin composition. An epoxy resin composition comprising: (A) at least one epoxy resin selected from the group consisting of a novolac epoxy resin having a phenolic skeleton and a biphenyl skeleton, and a bifunctional linear epoxy resin having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group; and (B) a modified phenolic novolac having a phenolic hydroxyl group, at least part of which is esterified with a fatty acid.

RESIN COMPOSITION, DIE BONDING MATERIAL AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a die bonding material having good low-temperature adhesiveness to a wiring substrate and good filling performance to a dent part of a wiring step and to provide a resin composition of the material and a semiconductor device. SOLUTION: The composition includes (A) a vinyl compound of formula (1), (B) an elastomer, (C) a urethane prepolymer derived from a polyol having a solubility parameter of 8.00-9.00 and a compound having an isocyanate group and (D) a silane coupling agent. In formula (1), R1 to R7 are each H, alkyl or the like; X of -(O-X-O)- is a diphenylene skeleton; Y of -(Y-O)- is a phenylene skeleton; Z is an organic group; a and b are each an integer of 0-300 provided that one of a and b is not zero; and c and d are each 0 or 1. COPYRIGHT: (C)2011,JPO&INPIT ...

Epoxy resin composition, adhesive film and cover lay film thereof

The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the frequency range of 1-10 GHz, while having a flame retardancy meeting V-0 or VTM-0 according to UL-94 standard; and a resin composition which is used for the purpose of producing the adhesive film and the coverlay film. The present invention provides a resin composition which is characterized by containing (A) a vinyl compound represented by general formula (1) and having a mass average molecular weight (Mw) of 500-4,000, (B) a thermoplastic elastomer, (C) a thermosetting resin other than the vinyl compound represented by general formula (1), (D) a curing agent and (E) an organic aluminum phosphinate. This resin composition is also characterized in that the component (E) is contained in an amount of 10-50 parts by mass per 100 parts by mass of the total of the ...

EPOXY RESIN COMPOSITION

Resin composition, insulating film and semiconductor device using the same

Provided are: an insulating film having excellent adhesive strength to metal foil that forms FPC wiring and to FPC substrate material such as polyimide film and exhibiting electrical characteristics in the high frequency range, specifically, low dielectric constant ([epsilon]) and low dielectric tangent (tan[delta]) in the 1-10 GHz frequency range; and a resin composition used in manufacturing said insulating film. This resin composition contains (A) a thermosetting resin having styrene groups on the ends and having a phenylene ether backbone, (B) a hydrogenated styrene thermoplastic elastomer, and (C) a polytetrafluoroethylene filler, and contains 40 mass% to 80 mass% of the component (C) with respect to the total mass of the components (A)-(C).

Epoxy resin composition, adhesive film and cover lay film thereof

Resin composition, and insulating film and semiconductor device using same

Provided are: an insulating film as a cover lay film, the insulating film having an excellent adhesive strength with respect to a metal foil which forms wiring of an FPC and with respect to an FPC substrate material such as a polyimide film or the like, exhibiting excellent electrical properties in a high-frequency range, specifically exhibiting a low permittivity (e) and a low dielectric tangent (tand) in a frequency range of 1 to 10 GHz, and having an excellent shelf life; and a resin composition contained in said insulating film. Said resin composition contains (A) modified polyphenylene ether having ethylenically unsaturated groups at both terminals thereof, (B) an epoxy resin, (C) a styrene-based thermoplastic elastomer, (D) a compound having an imide group and an acrylate group in one molecule, and (E) a curing catalyst; and contains 0.5-4 parts by mass of the component (D) with respect to total 100 parts by mass of the components (A) to (E).

RESIN COMPOSITION FOR FILM, FILM, FILM WITH BASE MATERIAL, METAL/RESIN LAMINATE BODY, RESIN CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING FILM

Provided is a resin composition for a film, which is used for producing the film having excellent insulating properties and thermal conductivity. The provided resin composition for the film contains a thermosetting resin (A) and hexagonal boron nitride secondary agglomerated particles (B). Here, the hexagonal boron nitride secondary agglomerated particles (B) contains hexagonal boron nitride secondary agglomerated particles (B-1) having a cohesive breaking strength of 7 MPa or more and hexagonal boron nitride secondary agglomerated particles (B-2) having a cohesive breaking strength of 3 MPa or more and less than 7 MPa.

Resin film

本發明提供一種樹脂薄膜，其係適合使用作為在MEMS技術領域所使用的犧牲層。本發明一種樹脂薄膜，其係由(A)玻璃轉移點(Tg)為40~80℃且具有與環氧樹脂反應的官能基之丙烯酸樹脂、(B)環氧樹脂、(C)酚樹脂、及(D)四苯基鏻四(對甲苯基)硼酸鹽所構成。

ANTISTATIC INSULATING MATERIAL FILM AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an insulating material film excellent in antistatic properties. SOLUTION: In the antistatic insulating material film, an antistatic layer is formed on one side of a support, and an insulating material layer is formed on the other side of the support. COPYRIGHT: (C)2008,JPO&INPIT ...

EPOXY RESIN COMPOSITION

Disclosed is an epoxy resin composition which is capable of forming a cured product having a low dielectric constant and a dielectric loss tangent in a high frequency range. Also disclosed is a film obtained by using such an epoxy resin composition. The epoxy resin composition contains (A) one or more epoxy resins selected from the group consisting of novolac epoxy resins having a phenol skeleton and a biphenyl skeleton and bifunctional linear epoxy resins having a hydroxyl group with a weight average molecular weight of 10,000-200,000, and (B) a modified phenol novolac wherein at least a part of a phenolic hydroxyl group is esterified with a fatty acid. © KIPO & WIPO 2007 ...

PROTECTIVE FILM FOR ROTARY GRINDING STONE, ROTARY GRINDING STONE, AND METHOD FOR MANUFACTURING ROTARY GRINDING STONE

【課題】回転砥石の耐摩耗性、耐久性、切断効率および切断精度を向上し得る回転砥石用保護フィルムの提供。 【解決手段】特定のビニル化合物と、ゴムおよび／または熱可塑性エラストマーとを含有する熱硬化性樹脂組成物からなる回転砥石用保護フィルム、ならびに、特定のエポキシ樹脂と、フェノール性ヒドロキシ基の少なくとも一部を脂肪酸でエステル化した変性フェノールノボラックとを含有するエポキシ樹脂組成物からなる回転砥石用保護フィルム。 【選択図】なし

Resin composition, and adhesive film, cover lay film and interlayer adhesive formed therefrom

Coverlay film, flexible printed wiring board using the same, and method for manufacturing thereof

The coverlay film of the present invention comprises (A) a specific vinyl compound, (B) a polystyrene-poly(ethylene/butylene) block copolymer, (C) a polystyrene-poly(ethylene-ethylene/propylene) block copolymer, (D) an epoxy resin, and (E) a bismaleimide. The mass ratio of each component satisfies (A+E)/(B+C) = 0.81-1 and (B)/(C) = 1-4. An adhesive layer containing 1-10 mass% of the component (D) with respect to the total mass of the components (A)-(E) is formed on one surface of an organic film having a melting point that is higher than the thermal curing temperature of the adhesive layer, a dielectric constant of 4 or less in an area having a frequency of 1-10 GHz, and a dielectric loss tangent of 0.02 or less.

Insulating film and semiconductor device

... [Object] To provide an insulating film which exhibits excellent film property and heat resistant after curing, and has thermal conductivity of 3.0 W/mK or more. [Solution] An insulating film comprising (A) novolak epoxy resin, (B) butadiene-acrylonitrile copolymer, (C) aralkylphenol resin, (D) curing catalyst and (E) insulating filler having thermal conductivity of 20 W/mK or more, wherein (B) component is 10 to 20 parts.mass relative to total 100 parts.mass of (A) to (C), (E) component is 60 to 85 volume% relative to insulating film 100 volume%.

Resin composition for films, film, film with base, metal/resin laminate, resin cured product, semiconductor device, and method for producing film

Provided is a resin composition for films, which is used for the production of a film that has excellent insulating properties and excellent thermal conductivity. This resin composition for films contains (A) a thermosetting resin and (B) secondary agglomerated particles of hexagonal boron nitride. In this regard, the secondary agglomerated particles (B) of hexagonal boron nitride contains (B-1) hexagonal boron nitride secondary agglomerated particles having a cohesive failure strength of 7 MPa or more and (B-2) hexagonal boron nitride secondary agglomerated particles having a cohesive failure strength of 3 MPa or more but less than 7 MPa.

Thermosetting resin composition, film containing same, and multilayer wiring board using same

Provided are: a film; and a thermosetting resin composition used in the production of the film. This film has excellent adhesive strength with respect to a substrate material and a metal foil which forms the wiring of a printed circuit board. Furthermore, this film exhibits excellent electrical properties in a high-frequency region. Specifically, this film exhibits a low dielectric constant ([epsilon]) and a low dielectric loss tangent (tan [delta]) in the frequency range of 1-100 GHz. Moreover, this film can be cured at lower temperatures. The thermosetting resin composition used in the production of the film contains (A) a thermosetting resin having a styrene group at the end, (B) a styrene-based thermoplastic elastomer, (C) a sulfide-based silane coupling agent, and (D) a dialkyl peroxide-based radical polymerization initiator.

METHOD AND A MEMBER FOR SHIELDING A HOUSING OF AN ELECTRONIC DEVICE CAPABLE OF IMPROVING THE DEGREE OF FREEDOM OF A HOUSING SHAPE

PURPOSE: A method and a member for shielding a housing of an electronic device are provided to secure an electrical connection between a conductor layer of a shield member and a ground electrode by interposing a conductive adhesive between the conductor layer of the shield member and the ground electrode. CONSTITUTION: A shield member(21) includes a base sheet(34) and an uncured adhesive layer(32). The base sheet is made of a synthetic resin film having heat resistance and electrical insulation property. A conductive layer(31) is formed on the base sheet by printing, coating, and sintering a conductive silver paste. The uncured adhesive layer is formed on the conductive layer. The uncured adhesive layer is attached to a housing(20) of an electronic device. The uncured adhesive layer is made of thermosetting resin having low melt viscosity. © KIPO 2009 ...

Shield method and shield material for electronic component enclosures

The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.

Film antenna and method of manufacturing the same, and film for antenna substrate used for them

COVERLAY FILM

PROBLEM TO BE SOLVED: To provide a coverlay film that has excellent adhesive strength to an FPC substrate material, such as metal foil wiring an FPC and a polyimide film, and has excellent electrical properties at high frequency. SOLUTION: The coverlay film comprises: (A) a vinyl compound represented by general formula (1), (B) at least one of a polystyrene-poly(ethylene/butylene) block copolymer and a polystyrene-poly(ethylene-ethylene/propylene) block copolymer, (C) an epoxy resin, and (D) a curing catalyst, wherein assuming that the component (A) is 100 pts.mass, 70-500 pts.mass of the component (B), 1-9 pts.mass of the component (C), and 0.001-5 pts.mass of the component (D) are included. COPYRIGHT: (C)2011,JPO&INPIT ...

Epoxy resin composition

Heat curable resin composition, insulation film, interlayer insulation film, multilayer wiring board and semiconductor apparatus

An object of present invention is to provide a polyphenylene ether (PPE) type heat curable resin composition that has high frequency characteristics, excellent heat resistance reliability (change amount of dielectric loss tangent (tan [delta]) is small) and excellent solder heat resistance. Provided is a heat curable resin composition having (A) a polyphenylene ether having an unsaturated double bond at its terminal and having a number average molecular weight of 800 to 4500; (B) phenolic antioxidant having a melting point of 200 DEG C or higher; and (C) thermoplastic elastomer.

FILM FOR CAPACITOR

【課題】信頼性の高いコンデンサ用フィルムを用いたコンデンサ及びその製造方法を提供することである。また、誘電体フィルムの巻回後の含浸工程を要しない簡略された製造方法を可能とし、製造コストを低くできるコンデンサ用フィルム、そのコンデンサ用フィルムを用いたコンデンサ及びその製造方法を提供することである。 【解決手段】誘電体フィルムと金属薄膜とそれらに密着して形成された樹脂薄膜とからなるコンデンサ用フィルムであって、樹脂薄膜は、高周波領域で低誘電率及び低誘電正接を有する硬化物を形成可能な低溶融粘度のＡステージ樹脂の薄膜であるコンデンサ用フィルムを提供する。 【選択図】図１（ａ）

Resin composition, and adhesive film and coverlay film each of which is formed of same

The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the frequency range of 1-10 GHz, while having a flame retardancy meeting V-0 or VTM-0 according to UL-94 standard; and a resin composition which is used for the purpose of producing the adhesive film and the coverlay film. The present invention provides a resin composition which is characterized by containing (A) a vinyl compound represented by general formula (1) and having a mass average molecular weight (Mw) of 500-4,000, (B) a thermoplastic elastomer, (C) a thermosetting resin other than the vinyl compound represented by general formula (1), (D) a curing agent and (E) an organic aluminum phosphinate. This resin composition is also characterized in that the component (E) is contained in an amount of 10-50 parts by mass per 100 parts by mass of the total of the ...

Film forming resin composition, insulating film and semiconductor device

METHOD FOR MANUFACTURING FIBER REINFORCED UNCURED FILM AND FIBER REINFORCED UNCURED FILM

PROBLEM TO BE SOLVED: To provide a method for manufacturing a fiber reinforced uncured film for hardly leaving bubbles in a fiber reinforced uncured film for preventing breakage of a base material even if the base material with comparatively low strength is used and for allowing thinning of the fiber reinforced uncured film. SOLUTION: The method for manufacturing a fiber reinforced uncured film includes a first process, in which a thermosetting resin composition comprising a thermosetting resin and a volatile solvent and having viscosity of 1,000 mPa s or lower is applied onto a support carrier 3 to form a liquid coating film 7, a second process, in which a fibrous base material 9 with thickness of 8-100 μm, air permeability of 5-200 cm3/cm2/sec, and apparent density of 0.5-1.5 g/cm3 is embedded in the liquid coating film formed in the first process, and a third process, in which the fibrous base material embedded in the liquid coating film in the second process and the liquid coating film ...

Heat curable resin composition, insulation film, interlayer insulation film, multilayer wiring board and semiconductor apparatus

An object of the present invention to provide a heat curable resin composition which is excellent in heat resistance, moisture resistance reliability, and resistance to moisture absorption reflow. Provided is a heat curable resin composition having: (A) a heat curable resin having an unsaturated double bond at its terminal; (B) a silica filler whose surface is treated with a specific long chain spacer type silane coupling agent containing an alkyl group having at least an unsaturated double bond at the end; and (C) a flexibility -providing resin (except component (A)). It is preferable that the unsaturated double bond of the component (B) is a vinyl group.

Semiconductor device

An object of the present invention is to provide a highly reliable semiconductor device having heating body with excellent heat dissipation, which solves the following issues: an issue of lowered bonding strength between a heating body and a substrate caused by stress which is generated due to the difference in thermal expansion coefficient between the heating body and the substrate when a high thermal conductivity film is in cooling after heat curing and in a heating process after assembly, and an issue of insufficient heat-resistance of the film. The present invention provides a semiconductor device l having a heating body 2, a heat receiver 3, and a high heat conduction layer 4 provided in-between the heating body 2 and the heat receiver 3 for transmitting heat from the heating body to the heat receiver, wherein the high heat conduction layer 4 contains a thermosetting body of a high heat conduction film containing the following (A) to (D) and has a thickness of 10 to 300 m: (A) two ...

Composition for film, and adhesive film and cover lay film formed therefrom

Provided are an adhesive film and a cover lay film both for use in electrical/electronic applications, the films having excellent flame retardancy and being capable of attaining a reduction in permittivity and a reduction in dielectric loss in a high-frequency region. Also provided is a composition for use in producing these films. The composition for films is characterized by comprising (A) an epoxy resin containing no hydroxy group, (B) a urethane resin containing a phosphorus-containing polyol as a component, (C) a compound having a maleimide group, and (D) a hardener, the ingredients (B) and (C) being contained in amounts of 100-975 parts by mass and 25-100 parts by mass, respectively, per 100 parts by mass of the ingredient (A), the ingredient (D) being contained in an effective amount, and the proportion by mass of the phosphorus to the sum of the ingredients (A) to (D) being 2-7%.

HEATER MEMBER AND HEAT ROLL

PROBLEM TO BE SOLVED: To provide a heater member, which includes self-adhesiveness to dispense with use of an adhesive, and thus absorbs steps of a heating element 2 or the like. SOLUTION: The heater member includes an unreacted thermosetting film 1 formed in a film shape in a flexible unreacted solid state from a vanish obtained by dissolving a resin composition including a resin material 11 having high heat resistance and thermosetting property and an elastomer 10 having high heat resistance to an organic solvent; and a heating element 2 composed of a planar resistor 5 which generates heat in a current path by being connected to a power source. The heating element 2 is bonded to the unreacted thermosetting film 1 by the adhesiveness of the film caused when heating the film to a temperature at which the film 1 is perfectly cured, or lower. COPYRIGHT: (C)2010,JPO&INPIT ...

Shield method for electronic component enclosure and shield material

The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.

CONDUCTIVE MOLDING, ELECTRONIC COMPONENT, ELECTRIC DEVICE, ELECTRICAL CHARACTERISTICS RECOGNITION DEVICE AND METHOD

PROBLEM TO BE SOLVED: To provide an electronic component in which the temperature resistance characteristics can be set well to predetermined conditions. SOLUTION: Between electrode layers 120 formed of a pair of inorganic conductive members in the shape of a thin film, an organic conductive polymer layer 130 is formed of a conductive polyaniline constituent exhibiting positive temperature resistance characteristics in the shape of a thin film by coating. An electronic component 100 having negative temperature resistance characteristics is obtained by contact resistance with the electrode layer 120. An electronic component 100 having desired negative temperature resistance characteristics is obtained by setting the contact area properly. COPYRIGHT: (C)2008,JPO&INPIT ...

Resin film

Thermosetting resin composition and a un-cured film constituted by such thermosetting resin composition

Resin composition, and adhesive film, cover lay film and interlayer adhesive formed therefrom

本發明提供一種組成物，其除了對基板材料具有優異之接著強度，且在頻率1GHz以上之高頻區域之電特性，具體而言在頻率1GHz以上之區域顯示低介電率(ε)及低介電正切(tanδ)以外，熱硬化時之收縮應力亦少，可在180℃以下熱硬化之樹脂組成物；以及使用該樹脂組成物作成之接著薄膜、及覆蓋薄膜。本發明之樹脂組成物含(A)以下述通式(1)表示之乙烯化合物、(B)苯乙烯含量為15~35%之聚苯乙烯-聚(乙烯-丁烯)嵌段共聚物、(C)苯乙烯含量為25~40%之聚苯乙烯-聚(乙烯-乙烯/丙烯)嵌段共聚物、(D)環氧樹脂、(E)雙馬來醯亞胺、(F)利用示差掃描熱量(DSC)測定之發熱峰在100℃以上且180℃以下之有機過氧化物，各成分之質量比為(A+E)/(B+C)=0.81以上且1.00以下，(B)/(C)=1.00以上且4.00以下，且以相對於前述成分(A)~(F)的合計質量之質量百分比計，含有1~10質量%之前述成分(D)，以相對於前述(A)成分含量之質量百分比計，含0.1~10質量%之前述成分(F)，□

Compositon for film and adhesive film using the same, and coverlay film

SEALING RESIN FILM

PROBLEM TO BE SOLVED: To provide a sealing resin film by which an electronic device (e.g. semiconductor element or the like) can be simultaneously mounted and sealed at low pressure, and to provide a method of manufacturing a module using the sealing resin film (e.g. semiconductor device or the like) as well as a module precursor. SOLUTION: The sealing resin film is used to seal an electronic part that is mounted to a substrate wherein a wiring pattern is formed. It is made of resin composition with minimum viscosity of 1-107 Pa s at 60-230°C. COPYRIGHT: (C)2008,JPO&INPIT ...

Film for package of pre-installed type semiconductor

Resin composition, adhesive film and semiconductor device

The present invention provides a resin composition excellent in thermal conductivity, adhesiveness and film formation properties, in particular, a resin composition with excellent thermal conductivity after curing. The resin composition of this invention comprises: (A) aminophenol epoxy resin, (B) at least one selected from the group consisting of phenoxy resin and thermal plastic elastomer, and (C) high-thermal-conductive inorganic filler, and with respect to 1 part by mass of the (A) component, (B) component is 0.5 to 5 parts by mass.

Shield method for electronic component enclosure and shield material

The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to said electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at said electronic component enclosure and the conductive layer to connect electrically.

Insulating film and semiconductor device

Resin composition, insulating film and semiconductor device using the same

Resin composition, adhesive film and semiconductor device

Film antenna and method of manufacturing the same, and film for antenna substrate used for them

The present invention provides: a film antenna which exhibits excellent electrical characteristics in a high-frequency region; and a resin film for use in the film antenna as the substrate. Specifically, the present invention provides a film which is for use as an antenna substrate and which is manufactured using a resin composition which comprises (A) a vinyl compound represented by formula (1), (B) an elastomer, (C) a urethane prepolymer that contains two or more isocyanate or blocked isocyanate groups in one molecule, and (D) a silane coupling agent and in which the content by mass of the component (B) is 10 to 90% relative to 100% of the component (A). In formula (1), R1 to R7 are each hydrogen, alkyl, or the like; X in the -(O-X-O)- moiety is a diphenylene skeleton; Y in each -(Y-O)- moiety is a phenylene skeleton; Z is an organic group; a and b are each an integer of 0 to 300, with the proviso that a case wherein both are 0 is excepted; and c and d are each an integer of 0 or 1.

Resin composition, film, layered sheet, and semiconductor device

Provided is the following resin composition. This resin composition has outstanding strength of adhesion to copper foil and polyimide film. Furthermore, this resin composition shows outstanding electrical properties in a high-frequency range at frequencies of 1 GHz and above. Specifically, this resin composition shows a low dielectric constant ([epsilon]) and a low dielectric tangent (tan[delta]) in the frequency range 1-80 GHz. Furthermore, this resin composition has heat resistance capable of withstanding solder mounting. This resin composition includes (A) a modified elastomer with an acid anhydride group, (B) a solvent-soluble polyimide resin, and (C) an epoxy resin, and the content of (B) is 5-20% by mass with respect to a total 100% by mass of the resin constituents.

Film for package of pre-installed type semiconductor

This invention provides a film for sealing a pre-installed type semiconductor capable of packaging a pre-installed type flip-chip, said film does not cured during preheating for flip-chip package, and only cured during the process of flip-chip package. The film sealing the pre-installed type semiconductor, comprises a liquid epoxy resin (A), a thermoplastic resin (B), a curing agent (C), a potential curing accelerator treated by heating at 50 to 100 DEG C (D) and an inorganic filler (E).

Film forming resin composition, insulating film and semiconductor device

本發明之目的係提供一種薄膜用樹脂組成物，其絕緣性、耐熱性優異，且填入絕緣填料仍可維持接著強度，特別是，即使高度填入高導熱性填料亦可維持接著強度者。 本發明之薄膜用樹脂組成物，其特徵係：包含下述(A)、(B)、(C)、(D)與(E)成分，且相對於(A)成分、(B)成分、(C)成分及(D)成分之總和100質量份，(C)成分為0.5至30.0質量份，(A)在兩末端具有與特定乙烯基鍵結的苯基之聚醚化合物、(B)熱塑性彈性體、(C)萘型環氧樹脂、(D)硬化劑、(E)絕緣填料。

Semiconductor device

LOW PRESSURE THERMOCOMPRESSION BONDING APPARATUS

【課題】 多層化されたプリント配線基板を、低圧で、高い位置決め精度で、被着体の凹凸に対して接着フィルムの良好な埋め込み性と接着性を有して熱圧着できる熱圧着装置を提供することにある。 【解決手段】接着フィルムにより少なくとも２つの被着体を熱圧着するため、所定の溶融粘度を有する薄膜Ａステージ樹脂フィルムを介して低圧で熱圧着する熱圧着装置を提供する。 【選択図】 図１

Coverlay film, flexible printed wiring board using the same, and method for manufacturing thereof

EPOXY RESIN COMPOSITION AND ADHESIVE FILM THEREOF

PROBLEM TO BE SOLVED: To provide an adhesive film which can achieve a low dielectric constant and a low dielectric loss in the high-frequency region, has good workability such as tackiness at normal temperature and flexibility of a film in the step of processing the film, and is used in electric and electronic applications and an epoxy resin composition which is used in preparing the adhesive film. SOLUTION: The epoxy resin composition includes a bifunctional straight chain epoxy resin (A) having a mass average molecular weight (Mw) of 10,000-20,000, a solid epoxy resin (B), a liquid epoxy resin (C), and an epoxy curing agent (D) and includes, based on 100 pts.mass component (A), 10-350 pts.mass respective components (B) and (C) at a content ratio [the component (B)/the component (C)] of the component (B) to the component (C) of 9.5/0.5 to 0.5/9.5 and an effective amount of the component (D). COPYRIGHT: (C)2011,JPO&INPIT ...

Coverlay film, flexible printed circuit board using same, and production method therefor

The coverlay film of the present invention comprises (A) a specific vinyl compound, (B) a polystyrene-poly(ethylene/butylene) block copolymer, (C) a polystyrene-poly(ethylene-ethylene/propylene) block copolymer, (D) an epoxy resin, and (E) a bismaleimide. The mass ratio of each component satisfies (A+E)/(B+C) = 0.81-1 and (B)/(C) = 1-4. An adhesive layer containing 1-10 mass% of the component (D) with respect to the total mass of the components (A)-(E) is formed on one surface of an organic film having a melting point that is higher than the thermal curing temperature of the adhesive layer, a dielectric constant of 4 or less in an area having a frequency of 1-10 GHz, and a dielectric loss tangent of 0.02 or less.

HEAT LOAD DETECTION ELEMENT, ELECTRIC DEVICE, HEAT LOAD DETECTOR, ELECTRICAL CHARACTERISTICS RECOGNITION DEVICE AND METHOD

PROBLEM TO BE SOLVED: To provide an easy-to-fabricate heat load detection element for detecting the extent of received heat load well. SOLUTION: Between electrode layers 120 formed of a pair of inorganic conductive members in the shape of a thin film, an organic conductive polymer layer 130 is formed of a conductive polyaniline constituent exhibiting positive temperature resistance characteristics for gradually increasing the resistance between the electrode layers 120 each time a predetermined heat load is received in the shape of a thin film by coating. A heat load detection element 100 having negative temperature resistance characteristics is obtained by contact resistance with the electrode layer 120. A heat load detection element 100 having desired temperature resistance characteristics and stabilized resistance characteristics depending on the heat load is obtained by setting the contact area properly. COPYRIGHT: (C)2008,JPO&INPIT ...

THERMOSETTING RESIN COMPOSITION AND UNCURED FILM COMPRISING THE SAME

To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and/or a thermoplastic elastomer.

METHOD FOR PRODUCING FILM

PROBLEM TO BE SOLVED: To provide a method for producing an insulating material film useful as a material for electronic equipment, which uniformly thins the thickness of an insulating material layer. SOLUTION: In the method for producing an insulating material film comprising coating a substrate with a varnish by a microgravure method and then drying the varnish to form an insulating material layer, the ratio G/S of the rotational speed G (m/minute) of a gravure roll to the traveling speed S (m/minute) of the substrate is ≥0.75. COPYRIGHT: (C)2008,JPO&INPIT ...

THERMOSETTING FILM FOR DIE BONDING AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS USING THE SAME

PROBLEM TO BE SOLVED: To provide a thermosetting film for die bonding which has superior adhesive strength with a chip, etc., during dicing, can be peeled off a dicing tape when picked up, has superior adhesive strength with the chip, etc., after being cured, suppresses void formation, and has a high elastic modulus at high temperature, folding endurance, and superior humidity resistance at high temperature. SOLUTION: There is provided the thermosetting film for die bonding containing (I) a bifunctional straight-chain epoxy resin of 10,000 to 200,000 in weight-average molecular weight which has a hydroxyl group, (II) one or more epoxy resins selected from a group of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a naphthalene type epoxy resin, (III) a novolak type phenol resin, (IV) a maleimide compound, (V) a silane coupling agent, and (VI) carboxyl group end acrylonitrile butadiene rubber or epoxy group containing acryl rubber. COPYRIGHT: (C)2009,JPO&INPIT ...

METHOD FOR PRODUCING FILM

PROBLEM TO BE SOLVED: To provide a method for producing an insulating material film useful as a material for electronic equipment, which uniformly reduces the thickness of an insulating material layer. SOLUTION: In the method for producing the insulating material film comprising coating a support with a varnish by a microgravure method and then drying the varnish to form the insulating material layer, the ratio G/S of the rotational speed G (m/min) of a gravure roll to the traveling speed S (m/min) of the support is made to be ≥0.75. COPYRIGHT: (C)2012,JPO&INPIT ...

Resin film

The present invention provides a resin film which is suitable for use as a sacrificial layer that is used in the technical field of MEMS. The present invention is a resin film which is composed of (A) an acrylic resin that has a glass transition point (Tg) of 40-80 DEG C, while having a functional group that is reactive with an epoxy resin, (B) an epoxy resin, (C) a phenolic resin, and (D) tetraphenylphosphonium tetra(p-tolyl)borate.

ADHESIVE FILM

PROBLEM TO BE SOLVED: To provide an adhesive film preventing development of tackiness at the temperature around 40°C without impairing properties of the adhesive film. SOLUTION: The adhesive film comprises the following ingredients (A) to (D): (A) 40-70 mass% of an acrylic resin having a glass temperature (Tg) of 50-90°C; (B) 10-30 mass% of a copolymer of an acrylonitrile and an elastomer component; (C) 5-40 mass% of a mixture of a solid epoxy resin and a liquid epoxy resin; and (D) 0.1-5 mass% of an epoxy hardening agent. COPYRIGHT: (C)2010,JPO&INPIT ...

THERMOSETTING FILM FOR DIE BONDING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME

PROBLEM TO BE SOLVED: To provide a thermosetting film for die bonding, exhibiting excellent adhesiveness of a chip or the like at dicing, enabling the stripping from a dicing tape at pickup, providing excellent adhesiveness of a semiconductor chip or the like, with a substrate, a lead frame or the like after curing, and suppressing the formation of voids in the space with the chip, the substrate, the lead frame or the like. SOLUTION: The thermosetting film for the die bonding contains (A) a polyether having phenyl groups with vinyl groups bonded thereto, at both the terminals, and (B) a thermoplastic elastomer and/or a rubber. COPYRIGHT: (C)2009,JPO&INPIT ...

SHIELD METHOD FOR ELECTRONIC COMPONENT ENCLOSURE AND SHIELD MEMBER

PROBLEM TO BE SOLVED: To provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. SOLUTION: The shield method for the electronic component enclosure comprises a process in which a conductive layer is formed at a basic sheet and a shield sheet forming a non-hardening adhesive layer at the counter face to the basic sheet in the conductive layer is punched out to fit in individual electronic component enclosures for forming the shield materials, a process in which the shield material is attached to the electronic component enclosure, and a process in which a conductive adhesive is formed between a ground electrode set at the electronic component enclosure and the conductive layer of the shield material to connect electrically. COPYRIGHT: (C)2009,JPO&INPIT ...

Epoxy resin composition

Disclosed is an epoxy resin composition which is capable of forming a cured product having a low dielectric constant and a dielectric loss tangent in a high frequency range. Also disclosed is a film obtained by using such an epoxy resin composition. The epoxy resin composition contains (A) one or more epoxy resins selected from the group consisting of novolac epoxy resins having a phenol skeleton and a biphenyl skeleton and bifunctional linear epoxy resins having a hydroxyl group with a weight average molecular weight of 10,000-200,000, and (B) a modified phenol novolac wherein at least a part of a phenolic hydroxyl group is esterified with a fatty acid.

Epoxy Resin Composition

To provide an epoxy resin composition which can form a cured material having low dielectric constant and low dielectric loss tangent in a radio frequency region, and a film obtained by using the epoxy resin composition. An epoxy resin composition comprising: (A) at least one epoxy resin selected from the group consisting of a novolac epoxy resin having a phenolic skeleton and a biphenyl skeleton, and a bifunctional linear epoxy resin having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group; and (B) a modified phenolic novolac having a phenolic hydroxyl group, at least part of which is esterified with a fatty acid.

Epoxy resin composition

Disclosed is an epoxy resin composition which is capable of forming a cured product having a low dielectric constant and a dielectric loss tangent in a high frequency range. Also disclosed is a film obtained by using such an epoxy resin composition. The epoxy resin composition contains (A) one or more epoxy resins selected from the group consisting of novolac epoxy resins having a phenol skeleton and a biphenyl skeleton and bifunctional linear epoxy resins having a hydroxyl group with a weight average molecular weight of 10,000-200,000, and (B) a modified phenol novolac wherein at least a part of a phenolic hydroxyl group is esterified with a fatty acid.

Epoxy resin composition

Disclosed is an epoxy resin composition which is capable of forming a cured product having a low dielectric constant and a dielectric loss tangent in a high frequency range. Also disclosed is a film obtained by using such an epoxy resin composition. The epoxy resin composition contains (A) one or more epoxy resins selected from the group consisting of novolac epoxy resins having a phenol skeleton and a biphenyl skeleton and bifunctional linear epoxy resins having a hydroxyl group with a weight average molecular weight of 10,000-200,000, and (B) a modified phenol novolac wherein at least a part of a phenolic hydroxyl group is esterified with a fatty acid.

Epoxy resin composition

To provide an epoxy resin composition which can form a cured material having low dielectric constant and low dielectric loss tangent in a radio frequency region, and a film obtained by using the epoxy resin composition. An epoxy resin composition comprising: (A) at least one epoxy resin selected from the group consisting of a novolac epoxy resin having a phenolic skeleton and a biphenyl skeleton, and a bifunctional linear epoxy resin having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group; and (B) a modified phenolic novolac having a phenolic hydroxyl group, at least part of which is esterified with a fatty acid.

Epoxy resin composition

To provide an epoxy resin composition which can form a cured material having low dielectric constant and low dielectric loss tangent in a radio frequency region, and a film obtained by using the epoxy resin composition. An epoxy resin composition comprising: (A) at least one epoxy resin selected from the group consisting of a novolac epoxy resin having a phenolic skeleton and a biphenyl skeleton, and a bifunctional linear epoxy resin having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group; and (B) a modified phenolic novolac having a phenolic hydroxyl group, at least part of which is esterified with a fatty acid.

Resin composition, film, substrate, semiconductor device, adhesive material for thermal transfer roll and office equipment

【課題】 ワニスにしたときの安定性が高く、塗膜性状がよい樹脂組成物であり、かつ硬化後の接着強度、特に高温保持後にも接着強度を維持できる樹脂組成物を提供することを目的とする。【解決手段】 （Ａ）２５℃で液状であるエポキシ樹脂、（Ｂ）末端に酸無水基を有する特定のイミドオリゴマーを、硬化剤１００質量部に対して、７０〜１００質量部含む硬化剤、および（Ｃ）硬化触媒を含有することを特徴とする樹脂組成物である。この樹脂組成物の（Ａ）成分は、エポキシ当量が１００〜１５００であると、好ましい。【選択図】 なし

Copper member

【課題】新規な銅部材を提供すること。【解決手段】凸部を有するマット面及びシャイニー面を有する銅部材であって、前記マット面のＲｚが０．２５μｍ超０．８１μｍ未満であって、かつ、前記マット面のＲｚに対する前記シャイニー面のＲｚの比率が０．９５～５．６７である、銅部材を提供する。【選択図】なし

Epoxidharzzusammensetzung

エラストマー組成物、フィルムおよび半導体装置

【課題】ポリイミドに対し良好な接着強度を有し、かつ、良好な高周波特性を有するエラストマー組成物を提供すること。 【解決手段】エラストマー組成物は、（Ａ）スチレン系熱可塑性エラストマーと、（Ｂ）エポキシ樹脂と、（Ｃ）両末端にスチレン基を有するポリフェニレンエーテルオリゴマーと、（Ｄ）液状ゴムとを有する。（Ａ）成分と（Ｂ）成分の合計に対し、（Ａ）成分が７０〜９５質量％含まれる。また、（Ａ）、（Ｂ）、および（Ｃ）成分の合計に対し、（Ｃ）成分が１０〜４０質量％含まれる。 【選択図】なし

複合銅部材

【課題】樹脂基材との密着性が良好であり、かつ高周波回路基板に用いた際に伝送損失が少ない高周波特性に優れた複合銅部材および複合銅部材の製造方法を提供する。【解決手段】銅部材の少なくとも一部の表面の上に銅酸化物を含む層が形成された複合銅部材であって、前記銅部材の少なくとも一部の表面のＲｚが、０．２０μｍ以上０.７０μｍ以下である複合銅部材を提供する。【選択図】図１

樹脂フィルム

【課題】ＭＥＭＳ技術分野で用いられる犠牲層としての使用に好適な樹脂フィルムの提供。 【解決手段】（Ａ）ガラス転移点（Ｔｇ）が４０〜８０℃で、エポキシ樹脂と反応する官能基を有するアクリル樹脂、（Ｂ）エポキシ樹脂、（Ｃ）フェノール樹脂、および、（Ｄ）テトラフェニルホスホニウムテトラ（ｐ−トリル）ボレートからなる樹脂フィルム。 【選択図】なし

Harzzusammensetzung, halbleitervorrichtung, und verfahren zur herstellung einer halbleitervorrichtung

Es wird eine Harzzusammensetzung für eine Halbleitervorrichtung vom Typ eines Wafer-Level-Chip-Size Package, die ausgezeichnete Hochfrequenzeigenschaften aufweist und einen Beschichtungsfilm bilden kann, der eine Dicke aufweist, die weniger Unebenheiten besitzt, und bei dem es unwahrscheinlich ist, dass er ein Verziehen des Halbleitersubstrats verursacht, eine Halbleitervorrichtung, die diese verwendet, und ein Verfahren zur Herstellung einer Halbleitervorrichtung bereitgestellt, insbesondere eine Harzzusammensetzung für eine Halbleitervorrichtung vom Typ eines Wafer-Level-Chip-Size Package, wobei die Harzzusammensetzung (A) ein modifiziertes Polyphenylenetherharz mit einer ungesättigten Doppelbindung am Ende davon, (B) ein Elastomer mit einem Butadien-Gerüst und wahlweise (C) ein Lösungsmittel umfasst, eine Halbleitervorrichtung, die diese verwendet, und ein Verfahren zur Herstellung einer Halbleitervorrichtung.

Antenna-equipped semiconductor package and resin composition for antenna-equipped semiconductor package

Provided is an antenna-equipped semiconductor package which is excellent in solder heat resistance and has low transmission loss. In the antenna-equipped semiconductor package 100 in which an antenna unit 5 is integrally formed in a semiconductor device unit 10 , at least one of an insulating layer 1 for connecting the semiconductor device unit 10 and the antenna unit 5 and an insulating layer 1 inside the antenna unit is a cured product of a resin composition including (A) a styrene-based elastomer having a double bond and (B) a compound generating a radical.

樹脂組成物、バックグラインドフィルム、およびそれらの硬化物

【課題】 溶剤で溶解可能で、シェア強度が高いバックグラインドフィルムを作製することができる樹脂組成物を提供することを目的とする。【解決手段】 （Ａ）ガラス転移点（Ｔｇ）が８０℃以下であり、エポキシ樹脂と反応する官能基を有するアクリル樹脂、（Ｂ）エポキシ樹脂、および（Ｃ）テトラフェニルホスホニウムテトラ（ｐ−トリル）ボレートを含み、硬化後のポリエチレンテレフタレートフィルムとのシェア強度が、１０Ｎ以上であることを特徴とする、樹脂組成物である。【選択図】 なし

プリント配線基板、および半導体装置

【課題】 高放熱性であり、温度サイクル特性に優れるプリント配線基板を提供することである。【解決手段】熱伝導率２００Ｗ／ｍ・Ｋ以上の金属板１と、絶縁層２と、銅箔パターン３とを、この順に有し、絶縁層２の絶縁破壊電圧値が、５０ｋＶ／ｍｍ以上であることを特徴とする、プリント配線基板０である。プリント配線基板０は、絶縁層２の２５〜１２５℃での弾性率が、１０ＧＰａ未満であり、絶縁層２の〔（−５５℃での弾性率）／（１２５℃での弾性率）〕が、５０未満であると好ましい。【選択図】 図１