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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 4. Отображено 4.
25-07-2012 дата публикации

Low-moisture content packaging method for thin outline (TO) packaging structure

Номер: CN0102020235B
Автор: YANG JUN, XIN ZHENG, KAI DING, RUTAO WANG, YINGCHUN LIU, XINGCAI LIAO, TAI AN, DENGSHUN WANG, ZHENG XIN, DING KAI, WANG RUTAO, LIU YINGCHUN, LIAO XINGCAI, AN TAI, WANG DENGSHUN
Принадлежит:

The invention relates to a low-moisture content packaging method for a thin outline (TO) packaging structure and a packaging assembly thereof, belonging to the technical field of air tightness packaging. The invention is characterized in that an aeration hole is designed on the base of a TO packaging assembly and is used for degassing and aeration treatment and the leakage rate detection of a sealing weld joint, and the design of the aeration hole changes the traditional packaging mode of the TO assembly. On the basis of the TO assembly with an aeration hole structure, the invention adopts a TO packaging assembly packaging method for achieving the packaging by two-time packaging. The invention solves the problem of low-moisture content packaging of the TO packaging assembly; the moisture content in a packaging body can be controlled within 500*10<-6>; the gas purity is controlled to be at least 99 percent; the pressure in the packaging body can be controlled; for low-vacuum packaged products ...

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Номер записи: 1
04-05-2011 дата публикации

High vacuum ceramic LCC packaging method

Номер: CN0102040186A
Автор: YANG JUN, XIN ZHENG, DENGSHUN WANG, KAI DING, TAI AN, KAI YU, MINMING ZHANG, ZHENG XIN, WANG DENGSHUN, DING KAI, AN TAI, YU KAI, ZHANG MINMING
Принадлежит:

The invention belongs to the technical field of micro-electromechanical systems (MEMS) device packaging, and in particular relates to a high vacuum ceramic leadless chip carrier (LCC) packaging method. An MEMS device, which is packaged by the steps of plasma cleaning, eutectic surface mount, lead interconnection, getter activation and eutectic sealing-in according to the method, meets the following requirements: the vacuum degree in a packaging cavity is less than 1Pa; the storage life is more than or equal to 15 years; and the Q value of a silicon micro-machined gyroscope is about 150,000. By adopting a plasma cleaning method, the packaging quality is improved, and the integral leakage rate of the packaging body is reduced, namely the leakage problem is solved; the surface mount is carried out by a method that a surface mount solder same as a sealing-in solder is eutectic, and the gas release amount of materials in the packaging body is reduced; and through getter activation, a small amount ...

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Номер записи: 2
27-08-2014 дата публикации

Oil-pumping-unit counter-potential intelligent feedback device

Номер: CN104009492A
Автор: SONG QINGHUA, XU HOUBIN, WANG DENGSHUN
Принадлежит:

Disclosed is an oil-pumping-unit counter-potential intelligent feedback device which relates to an oil-pumping-unit electrical-energy feedback device. The oil-pumping-unit counter-potential intelligent feedback device aims at solving a problem that the prior oil-pumping units are high in power consumption. The oil-pumping-unit counter-potential intelligent feedback device includes an input wiring end, an input current meter, an input voltage meter, an output voltage meter, a motor thermal protector, a power-saving switch, a work-frequency switch, an input filter, a power-saving AC contactor, a work-frequency AC contactor, an intelligent power-saving unit, a UVW output end, an intelligent feedback unit and a DC electric reactor. The input current meter is serially connected to an input circuit. The input voltage meter is connected in parallel to the circuit. The power-saving switch is sequentially connected with the input filter, the intelligent power-saving unit and the power-saving AC ...

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Номер записи: 3
20-04-2011 дата публикации

Low-moisture content packaging method for thin outline (TO) packaging structure and packaging assembly thereof

Номер: CN0102020235A
Автор: Yang Jun, Zheng Xin, Ding Kai, Wang Rutao, Liu Yingchun, Liao Xingcai, An Tai, Wang Dengshun
Принадлежит:

The invention relates to a low-moisture content packaging method for a thin outline (TO) packaging structure and a packaging assembly thereof, belonging to the technical field of air tightness packaging. The invention is characterized in that an aeration hole is designed on the base of a TO packaging assembly and is used for degassing and aeration treatment and the leakage rate detection of a sealing weld joint, and the design of the aeration hole changes the traditional packaging mode of the TO assembly. On the basis of the TO assembly with an aeration hole structure, the invention adopts a TO packaging assembly packaging method for achieving the packaging by two-time packaging. The invention solves the problem of low-moisture content packaging of the TO packaging assembly; the moisture content in a packaging body can be controlled within 500*10<-6>; the gas purity is controlled to be at least 99 percent; the pressure in the packaging body can be controlled; for low-vacuum packaged products ...

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Номер записи: 4