Multifunctional gas-liquid separator used for heat pump system

The invention discloses a multifunctional gas-liquid separator used for a heat pump system. The multifunctional gas-liquid separator is a columnar cylinder, and is equipped with a middle clapboard with a ascending pipe for dividing the gas-liquid separator into an upper cylinder and a lower cylinder, a overheat pipe for overheating gaseous condensing agent at low pressure side is arranged in the upper cylinder, can effectively avoids liquid drop from directly entering into a compressor and liquid impact phenomenon, and improves life of the compressor; a supercooling pipe for supercooling liquid condensing agent at high pressure side and reboiling liquid drop at the low pressure side is arranged at the lower cylinder, improves heat transferring performance of a evaporator, working environment of a expansion valve, and low-temperature performance of a heat pump, and effectively increases heating capacity. The separator has multiple functions and simple structure, and can be used for heat ...

Film resistor structure and method for manufacturing same

The invention relates to a film resistor structure which at least comprises a substrate and a composite film resistor which is formed at the substrate. The composite film resistor is formed by mixing semiconductor metal copper or/and nickel oxide which is provided with negative temperature coefficient of resistance (TCR) and conductive metal material which is provided with positive temperature coefficient of resistance in dispersed way. Thus, when the resistance value of a film resistance chip is improved to be larger than 1000 Omega/square area, the value of TCR can still be guaranteed to be less than 200ppm/DEG C effectively.

Method for manufacturing copper foil

The invention provides a method of preparing a copper foil, which includes providing a cathode; providing an anode; providing an electrolyte, which contains sulfuric acid, cupelric sulfate and rhodamine chemicals; and providing current for the cathode and the anode, so conduct a technology of electrolyzing the copper foil.

具耐折性的电解铜箔的制造方法

The production process of electrolytic copper foil with high breaking strength includes providing one electrolyzer filled with copper sulfate electrolyte, gel in the concentration lower than 1.5 ppm and chlorine ion in the concentration lower than 30 ppm and provided with anode and cathode; and making current flow through the anode and the cathode to electrolyze copper sulfate and produce copper in the cathode to form electrolytic copper foil.

Pressurized air source heat pump water heater

The invention discloses a pressurized air source heat pump water heater, and an ejector used for leading a system to be pressurized is arranged inside the system. The ejector consists of a decompression section, a mixing chamber and a pressure-increasing section; an outlet of a compressor is provided with a bypass provided with a flow rate regulating valve, and the bypass is connected with an inlet of the ejector. The throat part of the ejector is provided with an interface which is connected with an outlet of an evaporator; an outlet of the ejector is connected with an inlet of the compressor, high temperature and high pressure fluid led out from a bypass pipe is taken as working fluid, after entering the ejector, the working fluid injects low-pressure condensed gas from the evaporator, and then entering into the diffusion section together, so that the pressure is increased, and the aim of pressurization is achieved. The pressurized air source heat pump water heater can effectively increase ...

高高温伸长率电解铜箔的制造方法

The present invention relates to the making process of electrolytic copper foil with great high-temperature elongation. The electroplating process uses acid copper sulfate electroplating solution containing gelatin not more than 1.5 ppm and chlorine ion not more than 20 ppm, and the electroplating solution makes it possible to raise the high-temperature elongation of the produced electrolytic copper foil and the copper foil is used in making multilayer printed circuit board without hot cracking, bending and distortion produced.

Film resistance structure and manufacturing method thereof

The invention discloses a film resistance structure comprising a resistance layer, and the resistance layer consists of a copper oxide layer and a plurality of metal islands arranged on the copper oxide layer. The surface of the copper oxide layer is provided with a plurality of adjacent nodule-shaped notch regions among which gaps in netted distribution are arranged. The metal islands are respectively arranged at the gaps among the nodule-shaped notch regions. The invention also discloses a manufacturing method of the film resistance structure. The film resistance structure can effectively improve the sheet resistance Rhos and maintain the lower temperature coefficient of resistance (TCR).

Film resistor structure and method for manufacturing same

The invention relates to a film resistor structure which at least comprises a substrate and a composite film resistor which is formed at the substrate. The composite film resistor is formed by mixing semiconductor metal copper or/and nickel oxide which is provided with negative temperature coefficient of resistance (TCR) and conductive metal material which is provided with positive temperature coefficient of resistance in dispersed way. Thus, when the resistance value of a film resistance chip is improved to be larger than 1000 Omega/square area, the value of TCR can still be guaranteed to beless than 200ppm/DEG C effectively.

Film resistance structure and manufacturing method thereof

The invention discloses a film resistance structure comprising a resistance layer, and the resistance layer consists of a copper oxide layer and a plurality of metal islands arranged on the copper oxide layer. The surface of the copper oxide layer is provided with a plurality of adjacent nodule-shaped notch regions among which gaps in netted distribution are arranged. The metal islands are respectively arranged at the gaps among the nodule-shaped notch regions. The invention also discloses a manufacturing method of the film resistance structure. The film resistance structure can effectively improve the sheet resistance Rhos and maintain the lower temperature coefficient of resistance (TCR).

Building integration high-efficiency flat heat collector core plate

The invention discloses a building integration high-efficiency flat heat collector core plate, which mainly comprises an upper Lambda-shaped corrugated plate and a lower Lambda-shaped corrugated plate, wherein the upper plate formed by pressing a stainless steel piece of 0.45 to 0.55mm, the Lambda-shaped flare angle is between 60 to 120 degrees, and the corrugation depth is 3 to 4mm; the lower plate is formed from plastics by injection molding, and passages for liquid to flow in and out are arranged at two ends of the lower plate; and the upper and the lower plates are provided with seal grooves. By adopting the design, the core plate is formed the steps of putting a sealing ring into the seal groove of the lower plate, covering the upper plate, pressing down a pressure plate and bolts and screwing nuts. In the heat collector core plate, due to the corrugated grooves of the fluid flowing passages, the fluid produces swirl in large quantity, the heat transmission is greatly enhanced, and ...

Method for manufacturing copper foil