Film resistor structure and method for manufacturing same

The invention relates to a film resistor structure which at least comprises a substrate and a composite film resistor which is formed at the substrate. The composite film resistor is formed by mixing semiconductor metal copper or/and nickel oxide which is provided with negative temperature coefficient of resistance (TCR) and conductive metal material which is provided with positive temperature coefficient of resistance in dispersed way. Thus, when the resistance value of a film resistance chip is improved to be larger than 1000 Omega/square area, the value of TCR can still be guaranteed to be less than 200ppm/DEG C effectively.

Method for manufacturing copper foil

The invention provides a method of preparing a copper foil, which includes providing a cathode; providing an anode; providing an electrolyte, which contains sulfuric acid, cupelric sulfate and rhodamine chemicals; and providing current for the cathode and the anode, so conduct a technology of electrolyzing the copper foil.

具耐折性的电解铜箔的制造方法

The production process of electrolytic copper foil with high breaking strength includes providing one electrolyzer filled with copper sulfate electrolyte, gel in the concentration lower than 1.5 ppm and chlorine ion in the concentration lower than 30 ppm and provided with anode and cathode; and making current flow through the anode and the cathode to electrolyze copper sulfate and produce copper in the cathode to form electrolytic copper foil.

Copper foil structure for promoting tenacity and its forming method

The invention provides a copper foil construction with improved flexibility resistance and the forming method. The copper foil construction comprises: one copper foil basic foil, one dark face and light face, and one thermo-stable treating layer, which is fixed on said dark face. The invention can improve the flexibility resistance of soft printing circuit board.

Siromosi medicinal composition and its making method

A composite medicine in the form of tablet or capsule is prepared from sirolimus, the carrier chosen from povidone K30, poloxamer 188 and vitamin-E polyethanediol succinate, and auxiliary. Its preparing process is also disclosed.

高高温伸长率电解铜箔的制造方法

The present invention relates to the making process of electrolytic copper foil with great high-temperature elongation. The electroplating process uses acid copper sulfate electroplating solution containing gelatin not more than 1.5 ppm and chlorine ion not more than 20 ppm, and the electroplating solution makes it possible to raise the high-temperature elongation of the produced electrolytic copper foil and the copper foil is used in making multilayer printed circuit board without hot cracking, bending and distortion produced.

Film resistance structure and manufacturing method thereof

The invention discloses a film resistance structure comprising a resistance layer, and the resistance layer consists of a copper oxide layer and a plurality of metal islands arranged on the copper oxide layer. The surface of the copper oxide layer is provided with a plurality of adjacent nodule-shaped notch regions among which gaps in netted distribution are arranged. The metal islands are respectively arranged at the gaps among the nodule-shaped notch regions. The invention also discloses a manufacturing method of the film resistance structure. The film resistance structure can effectively improve the sheet resistance Rhos and maintain the lower temperature coefficient of resistance (TCR).

Film resistor structure and method for manufacturing same

The invention relates to a film resistor structure which at least comprises a substrate and a composite film resistor which is formed at the substrate. The composite film resistor is formed by mixing semiconductor metal copper or/and nickel oxide which is provided with negative temperature coefficient of resistance (TCR) and conductive metal material which is provided with positive temperature coefficient of resistance in dispersed way. Thus, when the resistance value of a film resistance chip is improved to be larger than 1000 Omega/square area, the value of TCR can still be guaranteed to beless than 200ppm/DEG C effectively.

Film resistance structure and manufacturing method thereof

The invention discloses a film resistance structure comprising a resistance layer, and the resistance layer consists of a copper oxide layer and a plurality of metal islands arranged on the copper oxide layer. The surface of the copper oxide layer is provided with a plurality of adjacent nodule-shaped notch regions among which gaps in netted distribution are arranged. The metal islands are respectively arranged at the gaps among the nodule-shaped notch regions. The invention also discloses a manufacturing method of the film resistance structure. The film resistance structure can effectively improve the sheet resistance Rhos and maintain the lower temperature coefficient of resistance (TCR).

Electrolyte and method for manufacturing copper foil by using same

The invention provides an electrolyte, comprising sulfuric acid, copper sulfate, a sulphur-containing compound, a polyether compound and a quinones compound. The electrolyte has the following chemical formulas (I), wherein A is oxygen or sulphur or N having a hydrogen atom ligand group structure; B is nitrogen or carbon containing a hydrogen atom ligand group; and R1-R9 can be independently hydrogen, alkyl with carbon numbers of 1-6, amino or amino having an alkyl substituent group. The invention also provides a method for manufacturing copper foil by using the electrolyte.

System and method for monitoring communication record

The invention discloses a system for monitoring communication record. The system is arranged in a communication device, wherein the communication device comprises a memory. The system comprises a setting module, a record module and a sending module, wherein the setting module is used for setting monitor information and monitoring modes; the record module is used for recording communication information between the communication device and other communication devices, generating corresponding communication record, and storing the generated communication record into the memory; and the sending module is used for reading corresponding communication record from the memory according to the set monitoring modes, and sending the read communication record to a monitor. The system and the method can monitor the communication record of the controlled communication device in time.

Method for manufacturing copper foil

Method for preparing demethyl rapamycin by utilizing bacillus megaterium

The invention relates to a method for preparing demethyl rapamycin by utilizing bacillus megaterium, including that bacillus megaterium is inoculated to slope culture medium to be cultured and then is inoculated into seed culture medium to be cultured, and then the seed culture solution is inoculated into a transformation culture medium. When the bacillus megaterium propagates in the transformation culture medium, substrate rapamycin is added, the bacillus megaterium carries out transformation on the rapamycin, so as to obtain bacillus megaterium transformed rapamycin transformation solution, and the transformation solution contains 29, 42-O-didemethyl rapamycin, 42-O-demethyl rapamycin and 29-O-demethyl rapamycin and other rapamycin derivates. The invention has the advantage that micro organism is adopted to obtain rapamycin derivate. Pollution to the environment is less, action condition is mild, and no group protection is required, and transformation efficiency of rapamycin derivate ...