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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 5. Отображено 5.
07-01-2009 дата публикации

Illuminating device and its lens used therein

Номер: CN0101338874A
Автор: CANYANG ZHUANG, ZHUANG CANYANG
Принадлежит:

The invention discloses a luminescent device and a lens thereof. The lens comprises a incident surface and a refraction exit surface; the lens is in a slice shape; the subface of the lens is an incident surface; multi-circle ring-shape saw teeth are arranged on the top surface of the lens; these saw teeth are arranged along the direction from the center of the lens toward the inner and outer brims, and the inner lateral-faces and outer lateral-faces of the saw teeth form a refraction exit surface. A total reflection plane can also be arranged on the lateral face of the lens. The luminescent device comprises a light-source and the lens arranged in front of the light source. The invention can reduce the thickness of the lens to the largest extent, as a result, the light loss inside the lens is reduced, and the light emitting efficiency is improved. The very small thickness can realize a relatively small light-beam angle. Besides meeting the requirements of optically designed light-distribution ...

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Номер записи: 1
24-03-2010 дата публикации

Illuminating device and its lens used therein

Номер: CN0100595478C
Автор: CANYANG ZHUANG, ZHUANG CANYANG
Принадлежит:

The invention discloses a luminescent device and a lens thereof. The lens comprises a incident surface and a refraction exit surface; the lens is in a slice shape; the subface of the lens is an incident surface; multi-circle ring-shape saw teeth are arranged on the top surface of the lens; these saw teeth are arranged along the direction from the center of the lens toward the inner and outer brims, and the inner lateral-faces and outer lateral-faces of the saw teeth form a refraction exit surface. A total reflection plane can also be arranged on the lateral face of the lens. The luminescent device comprises a light-source and the lens arranged in front of the light source. The invention can reduce the thickness of the lens to the largest extent, as a result, the light loss inside the lensis reduced, and the light emitting efficiency is improved. The very small thickness can realize a relatively small light-beam angle. Besides meeting the requirements of optically designed light-distribution ...

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Номер записи: 2
04-06-2014 дата публикации

LED package substrate and manufacturing method thereof

Номер: CN103840063A
Автор: WANG DONGLEI, WANG HONGGUAN, ZHUANG CANYANG
Принадлежит:

The invention discloses an LED package substrate and a manufacturing method of the LED package substrate. The LED package substrate comprises a concave cup unit containing an LED chip. The concave cup unit is composed of a transparent bottom plate and a transparent side wall, wherein fluorescent powder particles are contained in the bottom plate and the side wall, and the vertical section of the concave cup unit is of a right-angled U shape. According to the manufacturing method of the LED package substrate, a main material made of a transparent material is heated to be in the molten state or the liquid state; fluorescent powder is added to the main material, and the fluorescent powder and the main material are mixed uniformly; a mold is used for compression molding of the main material, wherein the main material is mixed with the fluorescent powder and is in the molten state or the liquid state, so that the concave cup unit containing the LED chip is formed, or the main material mixed ...

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Номер записи: 3
14-01-2015 дата публикации

Flip chip light-emitting diode with Bragg reflecting layer and method for manufacturing flip chip light-emitting diode with Bragg reflecting layer

Номер: CN104282816A
Автор: WANG DONGLEI, ZHUANG CANYANG, ZHU GUODONG
Принадлежит:

The invention discloses a flip chip light-emitting diode with a Bragg reflecting layer and a method for manufacturing the flip chip light-emitting diode with the Bragg reflecting layer. The light-emitting diode comprises a substrate material, an N type layer, a light-emitting layer, a P type layer, an N electrode and multiple P electrodes which are arranged dispersedly, wherein the Bragg reflecting layer is arranged on the surface of the P type layer, the P electrodes protrude out of the Bragg reflecting layer, and protrusions are formed on the surface of the Bragg reflecting layer. The method for manufacturing the flip chip light-emitting diode with the Bragg reflecting layer comprises the steps that an epitaxial wafer is manufactured; the electrodes are manufactured; the Bragg reflecting layer is formed on the P type layer, so that the P electrodes are exposed from the Bragg reflecting layer, and the protrusions are formed on the surface of the Bragg reflecting layer; packaging and crystal ...

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Номер записи: 4
11-11-2015 дата публикации

LED encapsulation module and LED lamps and lanterns that have this LED encapsulation module

Номер: CN0204760416U
Автор: WANG DONGLEI, ZHUANG CANYANG, WANG HONGGUAN
Принадлежит:

The utility model discloses a LED encapsulation module and LED lamps and lanterns that have this LED encapsulation module, LED encapsulate the module, include: and a support. The electrode pin, the electrode pin set up in on the support, a LED chip, the LED chip is fixed in through the mode of formal dress on the support, just the electrode of LED chip pass through the bonding line with the electrode pin is connected, encapsulation colloid, encapsulation colloid covers the LED chip with the bonding line, the support adopts transparent material to make, the support include the support body with set up in outside convex boss portion on the support body, boss portion global is the inclined plane or to the curved surface of evagination, the LED chip set up in on the top surface of boss portion. The utility model discloses a LED encapsulates the module, going out through the global light reflex with around the LED chip of boss portion, has increased the light quantity to luminous efficacy has ...

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Номер записи: 5