УСТРОЙСТВО ДЛЯ УДАЛЕНИЯ ПОКРЫТИЙ НЕМЕТАЛЛИЧЕСКИХ МАТЕРИАЛОВ

Устройство для удаления покрытий неметаллических материалов, содержащее импульсно-периодический лазер и сканатор, отличающееся тем, что оно выполнено в виде робота, на выходном колене которого закреплен сканатор, который снабжен расположенным в нем объективом с длиннофокусной линзой, при этом объектив имеет фокусное расстояние F , которое определяется по формуле:,где d - диаметр параллельного гауссовского лазерного пучка на объективе сканатора,L - продольная величина перетяжки сходящегося гауссовского пучка,λ - длина волны излучения лазера,γ - отношение наибольшей интенсивности лазерного излучения, при которой материал подложки ещё не разрушается к наименьшей интенсивности, при которой покрытие ещё снимается полностью.

УСТРОЙСТВО ДЛЯ ИЗГОТОВЛЕНИЯ БОРОЗДКИ И СПОСОБ ИЗГОТОВЛЕНИЯ БОРОЗДКИ

Изобретение относится к устройству (100) и способу для изготовления бороздки путем формирования бороздки на поверхности объекта с использованием лазерного луча. Устройство (11) источника света выводит лазерный луч, многоугольное зеркало (10) отражает лазерный луч, выходящий из устройства (11) источника света. Оптическая система размещена на оптическом пути лазерного луча, отраженного от многоугольного зеркала (10), и включает в себя концентрирующую часть (13A), которая передает лазерный луч, отраженный от одной поверхности многоугольного зеркала (10), так, чтобы он фокусировался на поверхности объекта, и неконцентрирующую часть (13B), которая предусматривается вне концентрирующей части (13A) и передает лазерный луч, отраженный от угловой части, в которой встречаются две смежные поверхности многоугольного зеркала (10), так, чтобы он не фокусировался на поверхности объекта. Технический результат состоит в обеспечении получения однородной обработки бороздки и однородной глубины бороздки без ...

СПОСОБ СОЗДАНИЯ РАДУЖНОГО ЭФФЕКТА НА ПОВЕРХНОСТИ МАТЕРИАЛА И УСТРОЙСТВА ДЛЯ ВЫПОЛНЕНИЯ ТАКОГО СПОСОБА

Изобретения относятся к способу и устройству для создания радужного эффекта на поверхности изделия (1). Лазерные лучи (9) с длительностью импульса меньше одной наносекунды направляют на указанную поверхность в смежных оптических полях систем (14) фокусирования по меньшей мере двух неподвижных устройств или в оптической области по меньшей мере одного подвижного устройства. Каждое указанное устройство (устройства) содержит источник (8) лазерного излучения, сканер (13) и указанную систему (14) фокусирования для нанесения структуры в виде небольших волн на указанную поверхность на ширину указанного импульса. Указанную поверхность сканируют по меньшей мере одним сканером (13) с помощью указанных лазерных лучей (9) вдоль группы линий (5, 6; 16, 17, 18, 16’, 17’, 18’), которые следуют друг за другом в направлении (7) относительного перемещения изделия (1) и по меньшей мере одного сканера (13), и вдоль группы линий, лежащих на продолжении друг друга в направлении, перпендикулярном указанному направлению ...

УСТРОЙСТВО ДЛЯ ОЧИСТКИ ПЛОЩАДЕЙ ПОДА

Deflecting device for a laser unit

A deflecting device for a laser unit for deflecting the laser beam in the x and y directions has in the path of the laser beam a first mirror for the y deflection, which can be pivoted by a drive motor about an axis perpendicular to the impinging laser beam, and a second mirror for the x deflection, which can be pivoted by a drive motor about an axis perpendicular to the impinging laser beam and to the pivoting axis of the first mirror. A third mirror, which is at an unalterable angle with respect to the direction of the rays of the laser beam(s) coming from the first mirror (12), is mounted unpivotably and is interchangeable with a second mirror (16). The second and the third mirrors (16, 20) are arranged on a slide which can be moved between two positions in such a way that, in the one position of the slide (22), the second mirror (16) lies in the path of the rays of the laser beam(s) and, in the other position of the slide (22), the third mirror (20) lies in the path of the rays of the ...

Structuring the surface of materials

Material such as glass, plastic, semiconductor material, wood or ceramic is surface worked using a laser beam of wavelength 1.4-3.0 mu m.

VERFAHREN ZUM GRAVIEREN VON DRUCKFORMEN MITTELS ENERGIESTRAHLEN

Vorrichtung zum Härten und Formen von photohärtbaren Fluiden durch simultanes Beleuchten und Abstreichen

Laserbearbeitungsrobotersystem und Steuerverfahren für Laserbearbeitungsrobotersystem

Laserbearbeitungsrobotersystem (100), umfassend:eine Laserbestrahlungsvorrichtung (12), die dazu konfiguriert ist, ein Objekt (W) mit einem Laserstrahl (L) zu bestrahlen und einen Bestrahlungspunktverschiebungsvorgang zum Verschieben eines Bestrahlungspunkts mit dem Laserstrahl auf einer Oberfläche des Objekts (W) auszuführen;einen Roboter (11), der dazu konfiguriert ist, die Laserbestrahlungsvorrichtung (12) zu bewegen;eine Laserbestrahlungsvorrichtungssteuerung (14), die dazu konfiguriert ist, den Bestrahlungspunktverschiebungsvorgang der Laserbestrahlungsvorrichtung (12) zu steuern; undeine Robotersteuerung (13), die dazu konfiguriert ist, den Roboter (11) zu steuern,wobei die Robotersteuerung (13) zu Folgendem konfiguriert ist:Bestimmen von mehreren ersten interpolierten Positionen (Pn) durch Interpolieren von mehreren Zielpositionen, die zum Generieren einer Bewegungsbahn der Laserbestrahlungsvorrichtung (12) verwendet werden, basierend auf einer ersten Interpolationsperiode (T1), ...

VORRICHTUNG UND VERFAHREN ZUM FUEGEN MIT LASERSTRAHLUNG

EINRICHTUNG ZUM AUSRICHTEN EINES LASERSTRAHLES

Laserstrahlmaschine

Laserbearbeitungssystem zur Bearbeitung eines Werkstücks mittels eines Laserstrahls und Verfahren zum Steuern eines Laserbearbeitungssystems

Ein Laserbearbeitungssystem, insbesondere ein Laserschweißsystem, zur Bearbeitung eines Werkstücks mittels eines Laserstrahls, umfasst: einen Laserbearbeitungskopf zum Einstrahlen des Laserstrahls auf eine Werkstückoberfläche zur Erzeugung einer Dampfkapillare; eine optische Messvorrichtung zur Abstandsmessung mittels eines optischen Messstrahls; eine Bilderfassungseinheit, die eingerichtet ist, ein Bild von einem Bereich der Werkstückoberfläche zu erfassen, der die Dampfkapillare und einen durch Einstrahlen des optischen Messstrahls erzeugten Messfleck umfasst, wobei das Laserbearbeitungssystem eingerichtet ist, basierend auf dem erfassten Bild eine Position des Messflecks und eine Position der Dampfkapillare zu bestimmen. Ein Verfahren zum Bearbeiten eines Werkstücks mittels eines Laserstrahls, umfasst die Schritte: Einstrahlen des Laserstrahls auf eine Werkstückoberfläche zur Erzeugung einer Dampfkapillare; Einstrahlen eines optischen Messstrahls auf die Werkstückoberfläche zum Messen ...

Verfahren zum Kalibrieren einer Steuerung zur Ablenkung eines Laserstrahls

A process is disclosed for calibrating a laser beam scanning control. A light-sensitive medium (5) is irradiated at predetermined positions by a laser beam (2) in order to generate a test image (20), then partial digital images of sections (21) of the test image (20) are generated and the digital partial images are assembled into a total digital image of the test image (20). The data for correcting the laser beam (2) scanning control (4) are calculated on the basis of a comparison between real positions of the laser beam (2) on the total digital image and predetermined set co-ordinates.

Vorrichtung zur Substratbehandlung mittels Laserstrahlung

Vorrichtung zur Substratbehandlung mittels Laserstrahlung, mit einem Drehspiegel (16), durch den ein einfallender Laserstrahl reflektiert wird und über eine Anordnung (24) von nebeneinander liegenden Fokussierlinsen (24i-24n) schwenkbar ist, die in einem ihrer Brennweite entsprechenden Abstand vom bewegten, vorzugsweise durch eine bewegte Materialbahn gebildeten Substrat (10) angeordnet sind, wobei der einfallende Laserstrahl durch eine Eintrittslinsenanordnung aus einer oder mehreren hintereinander angeordneten Linsen (14, 14') auf den Drehspiegel (16) fokussiert wird und zwischen dem Drehspiegel (16) und der Anordnung (24) von in einem ihrer Brennweite entsprechenden Abstand vom Substrat (10) angeordneten nebeneinander liegenden Fokussierlinsen (24i-24n,) eine Anordnung (18) von nebeneinander liegenden Kollimatorlinsen (18i-18n) vorgesehen ist, die in einem ihrer Brennweite entsprechenden Abstand vom Drehspiegel (16) angeordnet sind, dadurch gekennzeichnet, dass zumindest zwei jeweils ...

Precision machining apparatus

A precision laser machining apparatus 1, comprising; i) a linear track 5; ii) a machining head 7 moveable along the linear track, the machining head comprising a laser 9 operable to emit a beam which intersects an R-axis wherein movement of the machining head along the linear track causes the intersection of the beam and the R-axis to move along the R-axis, and, iii) a workpiece support platform rotatable around a Theta-axis, wherein the Theta-axis and R-axis intersect with, and are orthogonal to, one another. The machining head may move between two end stops, defining first and second limit points of the intersection of the beam and the R-axis along the R-axis (the first and second limit points are optionally equidistant from the intersection between the two axes). The apparatus may be configured to machine a workpiece formed of a sheet material and may comprise a loading arrangement (such as a robotic arm) for grasping a workpiece and placing the workpiece on the support platform. A second ...

Laser scan speed calibration

Fixture for additive manufacturing and heat treatment

A fixture suitable for use in an additive layer manufacturing (ALM) and heat treatment process, comprising; i) a tool with an upper surface and a lower surface, and, ii) an attachment system configured to releasably secure a substrate to the upper surface of the tool, wherein the tool comprises a body with an upper face and a lower face and a reinforcement layer (which may be a superalloy) cladding the upper or lower face (or optionally both faces) of the body. The reinforcement layer(s) may have a lower thermal expansion coefficient than the body, and optionally may be bonded to the body. The fixture may comprise a reinforcement layer with a Young’s modulus which reduces by less than 30% between 93oC and 649oC, or a reinforcement layer with a Young’s modulus at 500oC which is greater than 100 GPa. Additional aspects are directed towards a method of manufacturing the fixture according to the first aspect, and a method of additive manufacturing an article using the fixture of the first aspect ...

PROCEDURE FOR THE COMPENSATION OF POSITION DEVIATIONS OF A DIAL OR A SIGN RELATIVE TO INSCRIPTION EQUIPMENT

ARRANGEMENT AND PROCEDURE FOR THE HARD ONE OF INFRARED RADIATION EMITTED BY COATING MATERIALS AND UBERZUGEN OF MEANS OF IRASERN

MECHANISM FOR THE DIVERSON OF A RAY OF LIGHT.

PROCEDURE FOR THE PRODUCTION OF PRESSURE PLATES WITH THE HELP OF A LASER BEAM.

FAR AND DEVICE FOR SPLITTING FLATTENING WORKPIECES FROM SPRÖDBRÜCHIGEM MATERIAL

SCANNER FOR INDUSTRIAL LASER MACHINES

METHOD OF, AND APPARATUS FOR, LASER BLACKENING OF A SURFACE, WHEREIN THE LASER HAS A SPECIFIC POWER DENSITY AND/OR A SPECIFIC PULSE DURATION

A method of blackening a surface, comprises applying laser radiation to the surface of a target (10) to produce a periodic arrangement of structures on the surface of the target (10), wherein the laser radiation comprises pulsed laser radiation comprising a series of laser pulses and the power density of the pulses is in a range 2 GW/ cm2 to 50 GW/cm2 or 0.1 TW/cm2 to 3 TW/cmz, and/or a pulse duration between 200 femtoseconds to 1000 picoseconds.

METHOD FOR LASER BEAM WELDING OF ONE OR MORE STEEL SHEETS MADE OF PRESS-HARDENABLE MANGANESE-BORON STEEL

The invention relates to a method for laser beam welding of one or more steel sheets made of press-hardenable manganese-boron steel, wherein at least one of the steel sheets (1, 2, 2') has a coating (4) of aluminum. The laser beam welding is done by feeding additional wire (11) into the melt bath (9) generated exclusively by means of a laser beam (6), wherein the additional wire (11) contains at least one austenite-stabilizing alloy element. The aim of the invention is to achieve, at relatively low energy consumption and high productivity, that the weld seam after hot forming (press hardening) has a strength that is comparable to the base material. This aim is achieved, according to the invention, in that the laser beam (6) is put in oscillation in such a way that the laser beam oscillates transversely to the welding direction, wherein the oscillation frequency of the laser beam (6) is at least 200 Hz, preferably at least 500 Hz. The method according to the invention offers, in particular ...

METHOD AND COMPUTER PROGRAM PRODUCT FOR OCT MEASUREMENT BEAM ADJUSTMENT

The invention relates to a method for ascertaining translational deviations between the measuring coordinate system (15) of a measuring mirror scanner (13), which can be tilted about two axes (C, D) and deflects a measuring beam (12) in two dimensions, and the processing coordinate system (10) of a processing mirror scanner (7), which can be tilted about two axes (A, B) and deflects both the measuring beam (12) deflected by the measuring mirror scanner (13) and a processing beam (3) in two dimensions onto a workpiece (2). The measuring beam (12') reflected on the workpiece (2) travels back on the path of the incident measuring beam (12) and is captured by a high-resolution measuring sensor (17) in order to determine high-resolution information about the workpiece (2). In a zero position of the measuring mirror scanner (13), the reflected measuring beam (12') is imaged in the sensor image (18) of the measuring sensor (17) onto a previously known image position (19). The method comprises ...

LASER WELDING SYSTEMS FOR ALUMINUM ALLOYS AND METHODS OF LASER WELDING ALUMINUM ALLOYS

Systems and methods of a laser welding device to weld aluminum are disclosed. The device includes a laser generator (102) to generate welding-type lasing power and a lens (104) to focus the welding- type lasing power at a focal point on an aluminum workpiece (118) to generate a weld puddle. A laser scanner (106) to control the lens to move the focal point of the welding-type lasing power in multiple dimensions over the aluminum workpiece during welding, the laser generator and the laser scanner to perform the welding without filler metal being added to the workpiece.

LASER WELDING, CLADDING, AND/OR ADDITIVE MANUFACTURING SYSTEMS AND METHODS OF LASER WELDING, CLADDING, AND/OR ADDITIVE MANUFACTURING

Systems and methods of a laser welding device are disclosed. The laser welding device includes a laser generator (102) configured to generate welding-type lasing power. A lens (104) focuses the welding-type lasing power at a focal point on a workpiece to generate a puddle during a welding-type operation. A wire feeder (123) is configured to feed wire to the puddle generated by the laser generator. A laser scanner (106) controls the lens to move the focal point of the welding-type lasing power in multiple dimensions over the workpiece during the welding-type operation. In some examples, the feed wire is used in an additive manufacturing process.

LASER WELDING HEAD WITH DUAL MOVABLE MIRRORS PROVIDING BEAM MOVEMENT AND LASER WELDING SYSTEMS AND METHODS USING SAME

A laser welding head with movable mirrors may be used to perform welding operations, for example, with wobble patterns and/or seam finding/tracking and following. The movable mirrors provide a wobbling movement of one or more beams within a relatively small field of view, for example, defined by a scan angle of 1-2°. The movable mirrors may be galvanometer mirrors that are controllable by a control system including a galvo controller. The laser welding head may also include a diffractive optical element to shape the beam or beams being moved. The control system may also be used to control the fiber laser, for example, in response to the position of the beams relative to the workpiece and/or a sensed condition in the welding head such as a thermal condition proximate one of the mirrors.

METHOD FOR LASER WELDING THE END FACES OF THE JOINTS OF TWO CONNECTING FLANGES HELD IN AN ADJOINING MANNER

The invention relates to a method for laser welding the end faces of the joints (5, 6) of two connecting flanges (3, 4), which are held in an adjoining manner, of two connecting partners (1, 2) made of a steel material. According to the method, in addition to being moved in the advancement direction, which follows the longitudinal extension of the joints (5, 6), the welding laser beam (8) is moved back and forth in an oscillating manner transversely to the advancement direction. At least one of the two connecting partners (1, 2) to be welded at the connecting flange (3, 4) joints (5, 6) is equipped with a metal coating at least in the region of the respective connecting flange (3, 4). The weld pool produced by the energy input during the laser welding process is kept in a liquid state in order to allow degassing processes and/or distribution processes to be carried out in a controlled manner for phases of the metal coating of the at least one connecting partner, said metal coating being ...

Vorrichtung zum Bohren von Uhrensteinen mittels Laserstrahlung

Verfahren und Vorrichtung zum Bohren von Werkstücken mittels Laserstrahlung

DEFLASHING PROCESS OF A MECHANICAL PART AND DEVICE FOR IMPLEMENTING SAID METHOD.

Method of etching a timepiece and timing element obtained by such a method.

L’invention concerne un procédé de gravage d’un élément (1), comprenant une application sur l’élément d’un faisceau laser (5) dont les impulsions durent chacune moins d’une picoseconde, de sorte à réaliser un usinage pour enlèvement de matière sur l’élément et une coloration de la surface de fond (6) d’usinage. L’invention concerne également un élément obtenu par la mise en œuvre du procédé selon l’invention, un mécanisme horloger comprenant un tel élément ainsi qu’une pièce d’horlogerie comprenant un tel mécanisme ou un tel élément.

Laser machining systems and - method, a laser beam dithering can.

Laserbearbeitungssysteme und -verfahren sind in der Lage, einen Laserstrahl (110) zu bewegen, während gleichbleibende Laserstrahleigenschaften an Bearbeitungsstellen aufrechterhalten werden. Die Laserbearbeitungssysteme (120) erzeugen einen kollimierten Laserstrahl, der eine gleichbleibende Leistungsdichte in Z-Richtung entlang wenigstens eines Abschnitts einer Länge des Laserstrahls aufweist, und dithern den kollimierten Laserstrahl in X- oder Y-Richtung. Durch das Dithering des kollimierten Laserstrahls wird eine gleichbleibende Laserbearbeitung auf einer dreidimensionalen Oberfläche ermöglicht, um beispielsweise einen gleichbleibenden Auftrag einer Beschichtung in einem Laserauftragschweissprozess bereitzustellen. Ein Laserbearbeitungssystem kann ein Strahlübertragungssystem (130) umfassen, das sowohl die Kollimation als auch das Dithering des kollimierten Lasers sowie eine Einstellung des Strahldurchmessers des kollimierten Strahls bereitstellt.

КОРПУС БАНКИ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ

У корпуса (1) банки с замкнутой вокруг оси (2) банки боковой стенкой (3) банки, которая содержит металлический слой, и закрывающей частью (13, 33, 56), которая содержит металлический слой, в области (53) перекрытия закрывающей части (13, 33, 56) и боковой стенки (3) банки по линии соединения выполнено лазерное соединение между металлическими слоями боковой стенки (3) банки и закрывающей части (13, 33, 56). Лазерное соединение содержит множество прерываний по линии соединения или соответственно множество узко ограниченных областей, в которых два металлических слоя сплавлены друг с другом. В лазерном соединении расположен полимерный материал (3b, 7а, 13d, 15, 54, 58). Лазерное соединение обеспечивает устойчивость, а полимерный материал (3b, 7a, 13d, 15, 54, 58) - герметичность соединения между боковой стенкой (3) банки и закрывающей частью (13, 33, 56).

Method and apparatus for joining workpieces at a lap joint

Beam scanning device, pattern drawing device, and method for examining accuracy of pattern drawing device

Processing method and system of white bright welding spot

Machining control device, laser machining device, and laser control method

Anti-counterfeiting mark manufacturing method, device, verification method, device and processing system

Device and method for preparing microstructure on surface of silicon crystal through femtosecond laser filaments

Ultrafast laser processing is equipped with opto-electromechanical cooperative control system

Method for reducing contact resistance of crystalline silicon solar cell

The invention discloses a method for reducing the contact resistance of a crystalline silicon solar cell, and the method comprises the steps: enabling each conductive wire which is arranged in parallel to be correspondingly pressed on a main grid line of a surface electrode of the solar cell, and enabling the conductive wires to extend in the extension direction of the main grid lines; electrically connecting the first end of a power supply with each conductive wire, electrically connecting the second end of the power supply with the back electrode of the solar cell, and applying reverse voltage to the solar cell through the power supply; a strip-shaped laser spot is irradiated on the solar cell, and the strip-shaped laser spot extends along a second direction; the strip-shaped laser spot moves in the extension direction of the main grid line to scan a surface electrode of the solar cell, and atoms of the metal and semiconductor materials are remelted and recrystallized at an interface; ...

Special laser welding device and method for longitudinal and deep weld joint based on front reflecting lens

The invention discloses a laser welding device and method special for a longitudinal deep weld joint based on a front reflector, and relates to the technical field of laser welding. The device comprises a robot, a shielding gas device, a laser welding head, a computer control system and a laser device, and a reflecting mirror, a light intensity monitoring device, a visual monitoring device and a reflecting conversion head can change a laser transmission path. The light intensity monitoring device is used for monitoring and regulating the brightness of the longitudinal and deep welding seam; the visual monitoring device presents a three-dimensional image of the deep weld joint on the computer, and welding parameters are calculated through the artificial intelligence system and then fed back to the laser; the robot adjusts the laser beam to the to-be-welded position by adjusting the position of a reflection conversion head of the laser welding head. The invention provides a high-intelligence ...

LASER MACHINING APPARATUS

... 본 발명은 적층체를 반도체 기판으로부터 박리시키지 않고 원하는 폭의 레이저 가공 홈을 형성할 수 있는 레이저 가공 장치를 제공하는 것을 목적으로 한다. 척 테이블에 유지된 피가공물에 레이저 광선을 조사하는 레이저 광선 조사 수단과, 척 테이블을 X축 방향으로 상대 이동시키는 가공 이송 수단과, 척 테이블을 Y축 방향으로 상대 이동시키는 인덱싱 이송 수단을 구비하고, 레이저 광선 조사 수단이 레이저 광선을 발진하는 레이저 광선 발진 수단과 레이저 광선 발진 수단으로부터 발진된 레이저 광선을 집광하여 상기 척 테이블에 유지된 피가공물에 조사하는 집광 렌즈를 구비하고 있다. 레이저 광선 조사 수단은, 레이저 광선 발진 수단과 집광 렌즈 사이에 배치되고 상기 레이저 광선 발진 수단으로부터 발진된 레이저 광선의 Y축 방향의 에너지 분포의 가우스의 가장자리 부분을 수직인 분포로 형성하는 에너지 분포 수정 수단과, 레이저 광선의 X축 방향의 에너지 밀도를 조정하는 에너지 밀도 조정 수단을 구비하고 있다.

LASER PROCESSING APPARATUS, PROCESSING CONTROL APPARATUS, AND PULSE FREQUENCY CONTROL METHOD

타겟 특징부와 레이저 비임의 관통 렌즈 정렬을 사용하는 레이저 처리 시스템

... 작업편을 마이크로기계가공하기 위한 레이저 처리 시스템은 작업편의 특징부를 처리하기 위한 레이저 펄스들을 생성하기 위한 레이저 소스와, 작업편의 표면에 관하여 처리 궤적에 따른 레이저 비임 스팟 위치의 제1 상대 이동을 부여하기 위한 갈바노미터-구동(갤보) 서브시스템과, 음향-광학 편향기(AOD) 서브시스템을 포함한다. AOD 서브시스템은 AOD들과 전자-광학 편향기들의 조합을 포함할 수 있다. AOD 서브시스템은 디더 방향에 따른 편향 위치의 함수로서 레이저 펄스들의 강도 프로파일을 변화시킬 수 있다. AOD 서브시스템은 작업편 특징부들에 처리 레이저 비임을 정렬하기 위해 사용될 수 있다.

반도체 패키징, 자동차 전기 장치, 배터리 및 기타 부품에 대한 가시 레이저 용접 방법

... 본 발명은 가시 레이저 시스템을 사용하여 부재들을 일괄 용접하는 방법에 관한 것으로, 특히 배터리 팩과 같은 에너지 저장 장치에서 청색 레이저 시스템을 사용하여 전도성 부재, 바람직하게는 얇은 전도성 부재를 용접하는 방법에 관한 것이다.

SELF RECOGNITION CNC MACHINING

digitalizador a laser e aparelho de processamento a laser

Dispositif optique pour le marquage de pièces transparentes

Dispositif optique et système pour le marquage interne de pièces transparentes comme des contenants ou récipients transparents, qui n’entraine pas de contamination et qui soit suffisamment rapide pour pouvoir être intégré dans une ligne de conditionnement afin de permettre un marquage de ceux-ci. Le système comprenant un dispositif optique comprend des moyens de séparation 30 pour séparer un faisceau laser pulsé 11 en un premier 31 et un deuxième 32 faisceaux laser séparés, des moyens de déflection 60 pour diriger le premier 31 et ledit deuxième 32 faisceaux lasers séparés en direction de la surface 3 de la pièce 2, et des moyens de focalisation 70 configurés pour focaliser le premier 31 et le deuxième 32 faisceaux laser séparés en-dessous de la surface 3 et à l’intérieur de la paroi 4 de la pièce transparente 2.

Pattern drawing device, pattern drawing method, device manufacturing method, laser light source device, beam scanning device, and beam scanning method

Provided is a pattern drawing device for drawing, by means of scanning spots of a laser beam, a predetermined pattern on an object to be irradiated, wherein the pattern drawing device comprises: a light source device that emits the laser beam; a plurality of drawing units that each have an optical lens system and an optical scanning member that scans the laser beam in order to generate the scanning spots by causing the laser beam to be incident, the plurality of drawing units being disposed such that the scanning spots scan different regions on the object to be irradiated; and a plurality of selection optical elements that are arranged serially along an advancing direction of the laser beam from the light source device in order to switch whether the laser beam from the light source device will be caused to be incident in a drawing unit selected from among the plurality of drawing units.

Characterization method and system for a laser processing machine with a moving sheet or web

The present invention discloses a method to calibrate a laser cutting machine without stopping the production. The method is adapted to laser cutting machine which use a conveyor belt to convey the sheets while cutting them with the laser. The method allows to place calibration marks at locations on the sheet that are convenient according to the production job, thereby minimising the waste of material.

Substrate cutting apparatus and method of cutting substrate using the same

СПОСОБ ОБРАБОТКИ МАТЕРИАЛОВ С ИСПОЛЬЗОВАНИЕМ МНОГОЛУЧЕВОГО ЛАЗЕРНОГО СКАНИРОВАНИЯ

... Способ обработки материалов с использованием многолучевого лазерного сканирования отличающийся тем, что обрабатываемое поле разделяют на сектора в виде равносторонних треугольников, квадратов или прямоугольников. Выходные окна сканирующих лазерных головок размещают над вершинами этих секторов на высоте, определяемой по формуле hd/tg, где d - длина стороны треугольного сектора или диагональ квадратного или прямоугольного сектора, - максимальный угол сканирования. На каждом шаге обработки, определяемом компьютерной программой, в каждом секторе оценивают объем необработанного материала и направляют лучи в сектора, имеющие наибольший объем необработанного материала. Между сканирующими головками и обрабатываемым полем устанавливают датчики, позволяющие вычислять поправки для компенсации ошибок юстировки сканирующих головок. В результате обеспечивается более равномерная загрузка большого количества лазерных пучков, что позволяет многократно повысить производительность установки, допускающей ...

MICROLENS ARRAYS FOR PARALLEL MICROPATTERNING

Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features, A method includes emitting a laser beam providing the laser beam to a lenslet array including a plurality of lenslets, and generating, from the laser beam, a plurality of laser sub-beams using the lenslet array. Each one of the plurality of laser sub-beams is generated by a corresponding one of the plurality of lenslets. Each lenslet of the plurality of lenslets has the same shape.

DEVICE FOR REMOTE LASER MACHINING HAVING A SENSOR SCANNER APPARATUS

The invention relates to a device for the remote laser machining of at least one workpiece (2) by means of a machining laser beam (3), comprising a laser-guiding unit (4) and at least one sensor unit (14) optically decoupled from the laser-guiding unit (4), which laser-guiding unit and sensor unit can be jointly moved by a manipulator (5), in particular around and/or along a plurality of manipulator axes, and/or in relation to which laser-guiding unit and sensor unit the workpiece (2) can be moved by means of a manipulator, in particular around and/or along a plurality of manipulator axes, wherein the machining laser beam (3) can be guided to a process location (8) on the workpiece (2) by means of the laser-guiding unit (4) and the sensor unit (14) has an optical sensor (19) for sensing an analysis region (17) on the workpiece (2) and means for moving the analysis region (17) in relation to the motion of the manipulator (5) and/or of the workpiece (2). According to the invention, the sensor ...

METHOD FOR MACHINING A METAL-CERAMIC SUBSTRATE, SYSTEM FOR SUCH A METHOD, AND METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A METHOD

The invention relates to a method and a system for machining a metal-ceramic substrate (1), having the steps of: - providing a metal-ceramic substrate (1), and - forming a predetermined breaking line (7) and/or a separating line in order to separate the metal-ceramic substrate (1) using laser light (10) of an ultrashort pulse laser, wherein the metal-ceramic substrate (1) is stationary while forming the predetermined breaking line (7) and/or the separating line, and the laser light (10) for forming the predetermined breaking line (7) and/or the separating line is moved over the metal-ceramic substrate (1), in particular by means of a mirror element (30) and a lens (20) with a long focal length.

GALVANOMIRROR, GALVANOSCANNER USING GALVANOMIRROR, LASER PROCESSING MACHINE USING GALVANOMIRROR, AND METHOD FOR MANUFACTURING GALVANOMIRROR

A galvanomirror (10) has: a mirror surface section (10A) having a mirror surface; and a rear surface reinforcing section (12) bonded to the rear surface side of the mirror surface. The mirror surface section (10A) comprises a single crystal SiC wafer, and the rear surface reinforcing section (12) is formed of a C/SiC material. Consequently, the stiffness of the mirror surface section is improved, the thickness of the mirror surface section is reduced, and the weight of the rear surface reinforcing section of the mirror surface section is reduced, thereby increasing the resonant frequency of the galvanomirror, and obtaining the galvanomirror achieving high accuracy and not being susceptible to warping even if the galvanomirror is moved at a high speed.

QUANTUM CASCADE LASER DEVICES AND METHODS FOR OPTICAL-FIBER PROCESSING FOR CONNECTOR APPLICATIONS

Devices and methods for optical-fiber processing for connector applications are disclosed, wherein the devices and methods utilize a quantum cascade laser operated under select processing parameters to carry out end face polishing. The method includes supporting the optical fiber in a ferrule so that a bare end section of the fiber protrudes from an end of the ferrule by a protrusion distance. The method then includes irradiating the end face with light from the quantum cascade laser to polish the end face. The quantum cascade laser can also be used to form a bump in a central portion of the end face, wherein the bump facilitates physical contact between respective end faces of connected optical fibers.

LASER INDUCED FORWARD TRANSFER WITH HIGH THROUGHPUT AND RECYCLING OF DONOR MATERIAL ON A TRANSPARENT DRUM

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to using a transparent cylinder with a light beam projected from inside the cylinder through the transparent wall onto donor material carried on the outer surface of the cylinder.

Optical mirror and optical scanner and laser machining apparatus using the same

A reliable galvano-mirror employed for laser machining is disclosed. The mirror is far reduced its weight for getting a higher rotation. On the rear surface of the mirror, a lightweight rib-structure, which is formed from a mirror support beam centered across the surface and some ribs extending from the beam, holds the mirror. Against a distortion occurred in rotating at high speed, the mirror is provided with a high rigidity. And the mirror is structured integrally with the motor shaft holder. Besides, a slit is formed between the rib disposed close to the holder and the support beam centered across the rear surface of the mirror. Providing slit enables to minimize a local distortion caused by a stress from fastening screws to attach the mirror to the motor shaft.

Laser bending method and apparatus for bending a work piece in normal and reverse directions

A work piece can be bent in opposite directions by irradiating a laser beam onto one side of the work piece. A tension anneal is applied to a metal plate. The metal plate is bent by irradiating a defocused laser beam onto a front surface of the tension-annealed metal plate so that the metal plate is bent in a state in which the front surface of the metal plate is convex at a position where the laser beam is scanned.

Laser machining apparatus

A laser machining apparatus comprises a first, a second and a third mirror for turning the direction of a laser beam, which are provided in between a machining head for irradiating a workpiece with the laser beam and a vertical Z-axis drive for moving the machining head in the vertical direction. The laser machining apparatus further comprises first drive means for varying the relative position between the first mirror, and the second and third mirrors by moving the relative position in the direction in which the laser beam proceeds from the first mirror to the second mirror, and second drive means for varying the relative position between the second and third mirrors by moving the relative position in the direction in which the laser beam proceeds from the second mirror to the third mirror.

Method and apparatus for marking patterns by a scanning laser beam, a mask applied to the same apparatus

Energy distribution at a section of a laser beam is leveled by causing the laser beam, emitted by a continuous wave Q-switch pulse from a laser oscillator having an acousto-optic Q-switch element, to pass through a mask having a mask pattern. The laser beam having passed the mask is reflected by a pair of reflection mirrors provided on a pair of galvanometers. The reflected laser beam passes through an objective lens and is focused on a processing object. A desired character or sign is marked on the processing object through a scanning with the laser beam focused on the processing object by driving a pair of galvanometers.

Laser marking device for continuous marking and for compensating for inertial force of optical scanning devices

A laser marking device for describing geometric forms such as characters and symbols including at least one line element on a surface that is being irradiated with laser light for two-dimensional scanning, comprises: a laser source; scanning optics for allowing the laser light from the laser source to be deflected two-dimensionally; and a control system for controlling both the ON/OFF operation of the laser source and the deflecting operation of the scanning optics. The control system includes ROM which stores graphic data on the line elements, CPU which retrieves the graphic data from ROM and constructs a command for graphic description, GDC which receives the command and constructs both coordinate data on a plurality of points of locus and laser ON/OFF data, and line memory which, in response to a WRITE command from GDC, receives the coordinate data and laser ON/OFF data while outputting the former to the scanning optics and the latter to laser source at a given speed.

Underwater laser processing device including chamber with partitioning wall

An underwater laser processing system has a laser torch; a laser torch driving mechanism for changing a laser emission position of the laser torch; and a chamber with one end opened to an external environment, which contains the laser torch; wherein a partitioning wall for preventing permeation of water is provided between a free end of the chamber and the laser torch. The system is used for detecting a sensitized portion and repairing it at one time using a sensitization detecting arrangement. Moreover, it is used for forming an alloying layer by melting a sprayed coating film, and for forming a new surface layer by emitting a laser beam through a solution containing a metal component.

MULTI-MATERIALS AND PRINT PARAMETERS FOR ADDITIVE MANUFACTURING

Systems and methods for multi-materials and varying print parameters in Additive Manufacturing systems are provided. In one example, a layer including a first powder material and a second material different from the first powder material are deposited, such that at least a first portion of the first powder material is in a first area that is devoid of the second material. An energy beam is generated and applied to fuse the layer at a plurality of locations. In another example, a layer of a powder material is deposited based on a first subset of parameters. An energy beam is generated based on a second subset of the parameters, and the energy beam is applied to fuse the layer at a plurality of locations based on a third subset of the parameters. At least one of the parameters is set to have different values during a slice printing operation.

Nozzle with laser scanning head for direct metal deposition

An apparatus for performing direct material deposition upon a substrate for generating a three dimensional object includes a motion system for moving an head. The head includes a laser for generating a laser beam and a laser scanner for directing the laser beam at the substrate for generating a melt pool at the substrate. A nozzle delivers material into the melt pool generated by the laser beam for forming a bead of material upon the substrate. The laser scanner is cooperable with the motion system, which is moveable along a first path while the laser scanner is simultaneously moveable along a second path for progressively generating a bead of material deposited upon the substrate.

Method of cutting substrate

A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.

METHOD OF PRODUCING ELECTRODE-EQUIPPED PLATE SPRING OF RAILCAR BOGIE

A method of producing an electrode-equipped plate spring of a railcar bogie includes: a resin removing step of partially irradiating a surface of fiber-reinforced resin, prepared by including electrically conductive fibers in resin, of a plate spring with a laser beam to partially remove the resin and partially expose the electrically conductive fibers; and an electrode forming step of attaching an electrode to an exposed region formed by partially exposing the electrically conductive fibers of the fiber-reinforced resin.

Detector device having an array of detector elements for scanning a field of view

In order to scan a rather large field of view quickly, the field of view is imaged, by an imaging optical system, in the plane of a detector having a substantially linear array of detector elements. The path of rays comprises a rotating optically refracting wedge for causing a nutating movement of the image and, coaxial therewith a rotating Dove prism for causing rotation of the image. The wedge and the Dove prism rotate at different rotary speeds.

Laser processing apparatus

Disclosed herein is a laser processing apparatus including a beam swinging unit provided between a pulsed laser oscillator and a focusing unit for swinging the optical path of a pulsed laser beam oscillated from the pulsed laser oscillator and then introducing the pulsed laser beam to the focusing unit. The beam swinging unit includes a polygon scanner provided on the upstream side of the focusing unit for scanning the pulsed laser beam oscillated from the pulsed laser oscillator and introducing the pulsed laser beam scanned to the focusing unit and an acoustooptic deflecting unit provided on the upstream side of the polygon scanner and on the downstream side of the pulsed laser oscillator for deflecting the optical path of the pulsed laser beam oscillated from the pulsed laser oscillator and introducing the pulsed laser beam deflected to the polygon scanner.

METHOD FOR LASER WELDING OF CURVED SURFACES

A method of laser welding together two or more overlapping metal workpieces (12, 14 or 12, 504, 14) that define a welding region (16) in which at least a portion of an accessible top surface (20, 120, 220, 520) of a workpiece stack-up (10, 110, 210, 510) is curved or angled includes advancing a laser beam (24) along a beam travel pattern (74) that at least partially lies on the portion of the top surface that is curved or angled while maintaining a constant focal distance (64) of the laser beam during such advancing travel. The beam travel pattern may be projected onto a curved portion (20″, 220″) of the top surface, an angled portion (120″) of the top surface, or two or more portions (20′, 20″, 120′, 120″, 220′, 220″, 220′″) of the top surface that lack planarity.

Three-dimensional printing of three-dimensional objects

The present disclosure provides three-dimensional (3D) printing methods, apparatuses, systems and/or software to form one or more three-dimensional objects, some of which may be complex. The three-dimensional objects may be formed by three-dimensional printing using one or more methodologies. In some embodiments, the three-dimensional object may comprise an overhang portion, such as a cavity ceiling, with diminished deformation and/or auxiliary support structures.

LASER PROCESSING APPARATUS

A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

OPTICAL DEVICE AND METHOD FOR PROVIDING TWO OFFSET LASER BEAMS

A method for providing a first and a second laser beam, which are spatially offset in relation to an input laser beam. The method includes: providing a laser source for generating the input laser beam; providing a spatial offsetting unit for providing an offset laser beam that can keep the same polarization between the input laser beam and the offset laser beam; providing a separating unit including a first module for separation by polarization in order to obtain, from the offset laser beam: the first laser beam spatially offset by transmission; and the second laser beam spatially offset by reflection, the first and second spatially offset laser beams being suitable for each describing a circle.

LASER CUTTING METHOD

A laser cutting method of the present invention comprises the steps below: a feeding mechanism generating movement information by driving the workpiece to move, and transmitting the movement information to a computing mechanism; transmitting a cutting path to the computing mechanism, making the computing mechanism calculate the cutting path and the movement information to generate a compensation cutting path, and transmitting the compensation cutting path to a fixed laser cutting mechanism; by a laser cutting mechanism, projecting a laser beam onto a moving workpiece, and continuously changing the projection direction of the laser beam onto the workpiece according to the compensation cutting path, so that the workpiece is cut by the laser beam to form a target pattern. Whereby, when the laser cutting mechanism performs laser cutting on the workpiece, the workpiece still moves without stopping, thereby shortening the processing time and relatively improving production efficiency.

SYSTEMS AND METHODS FOR MEASURING RADIATED THERMAL ENERGY DURING AN ADDITIVE MANUFACTURING OPERATION

This disclosure describes various methods and apparatus for characterizing an additive manufacturing process. A method for characterizing the additive manufacturing process can include generating scans of an energy source across a build plane; measuring an amount of energy radiated from the build plane during each of the scans using an optical sensing system that monitors two discrete wavelengths associated with a blackbody radiation curve of the layer of powder; determining temperature variations for an area of the build plane traversed by the scans based upon a ratio of sensor readings taken at the two discrete wavelengths; determining that the temperature variations are outside a threshold range of values; and thereafter, adjusting subsequent scans of the energy source across or proximate the area of the build plane.

LASER BEAM SCANNER

A laser beam scanner including a laser beams positioning optic, a plurality of optical fibres for delivering a plurality of laser beams and a fibre termination optic aligned to direct the laser beams from output ends of the plurality of optical fibres to the laser beams positioning optic. The laser beams positioning optic is movable relative to the fibre termination optic to scan the laser beams across a working surface.

Lighthouse scanner with a rotating mirror and a circular ring target

The present invention introduces a scanning arrangement and a method suitable for coating processes applying laser ablation. The arrangement is suited to prolonged, industrial processes. The arrangement comprises a target, which has an annular form. The laser beam direction is controlled by a rotating mirror locating along the center axis of the annular target. The scanning line will rotate circularly along the inner target surface when the mirror rotates. The focal point of the laser beams may be arranged to locate on the inner target surface to ensure a constant spot size. A ring-formed, a cylinder-shaped or a cut conical-shaped target may be used. The inner surface of the target may thus be tapered in order to control the release direction of the ablated material towards a substrate to be coated.

WELDING METHOD

A welding method for welding a first metal member to a second metal member, where the first metal member is plate-shaped, includes: bringing the first metal member into contact with the second metal member; and radiating a laser beam along a spiral scanning pattern straddling an interface line between the first metal member and the second metal member.

LASER OSCILLATOR, LASER MACHINING DEVICE IN WHICH SAME IS USED, AND LASER OSCILLATION METHOD

A laser oscillator includes a plurality of laser modules, beam coupler (12) that couples a plurality of laser beams (LB1 to LB4) emitted from the plurality of laser modules to form a coupled laser beam, beam coupler (12) emitting the coupled laser beam, and a condensing lens unit having a condensing lens, the condensing lens unit condensing the coupled laser beam to have a given beam diameter and guiding the condensed coupled laser beam to a transmission fiber. Beam coupler (12) has optical members (OC1 to OC4) configured to change optical paths of laser beams (LB1 to LB4). By changing the optical paths of laser beams (LB1 to LB4) by optical members (OC1 to OC4,) a beam profile of the coupled laser beam emitted from the transmission fiber is changed without adjusting a position of the condensing lens.

BLACK SUB-ANODIZED MARKING USING PICOSECOND BURSTS

A method includes generating a plurality of pulse bursts with a predetermined quantity of intra-burst pulses in each pulse burst and a temporal spacing between the intra-burst pulses, and with a pulse burst frequency, and scanning the pulse bursts across an anodized target at a scan rate so that the pulse bursts overlap at the anodized target by an amount that is above an overlap damage threshold and the intra-burst pulses provide a peak power and peak fluence that are below an ablation threshold of the anodized target so as to produce a laser mark on the anodized target with an L value of less than or equal to 30 and without a damage to an anodized layer of the anodized target.

SUPER CHARGER COMPONENTS

A pulley assembly having a body, a shaft mount and a plurality of bolts is disclosed. The body is aligned to the shaft mount by providing a tight tolerance between a shoulder portion of the bolt and a neck portion of a counter sunk hole formed in the body. Additionally, an outer surface of the body may have a pattern of friction lines or patches formed by fusing particulate matter to the outer surface with heat generated by a laser beam.

Laser machining apparatus and laser machining method

A moving mechanism relatively moves a machining head emitting a laser beam, with respect to a sheet metal along a surface of the sheet metal. A beam vibrating mechanism vibrates the laser beam for irradiation on the sheet metal in a predetermined vibration pattern, while the machining head is relatively moved by the moving mechanism. A vibration control section controls the beam vibrating mechanism to progressively reduce an amplitude of the vibration pattern from a first position to a corner portion when the machining head moves toward the corner portion and reaches the first position before the corner portion by a predetermined distance, and progressively increase the amplitude of the vibration pattern until the machining head reaches a second position ahead of the corner portion by the predetermined distance from the corner portion, at a time of producing a product having the corner portion.

METHOD FOR LASER WELDING TWO THIN WORKPIECES IN A REGION OF OVERLAP

A method for laser welding two workpieces includes arranging a first workpiece of a thickness D1 and a second workpiece of a thickness D2 on top of one another so that the first workpiece and the second workpiece overlap in a region of overlap. Each of D1 and D2 is 400 μm or less. The method further includes melting, using a laser beam guided along a weld seam, a material of the first workpiece over an entirety of the thickness D1 and a material of the second workpiece over only a partial thickness TD of the thickness D2 in the region of overlap, from a side of the first workpiece. The laser beam generates a vapor capillary that extends to a capillary depth KT into the first workpiece or into the first workpiece and the second workpiece, where 0.33*EST≤KT≤0.67*EST, with EST being a weld depth EST=D1+TD.

Lamination molding apparatus

An irradiation device of a lamination molding apparatus includes: at least one laser source, generating a laser beam; a first galvano scanner, scanning the laser beam; a second galvano scanner, scanning the laser beam; and an irradiation controller, controlling the laser source, the first galvano scanner, and the second galvano scanner. Irradiable ranges of the laser beams by using the first galvano scanner and the second galvano scanner respectively include an entire of a molding region. A first X-axis galvano mirror and a first Y-axis galvano mirror of the first galvano scanner and a second X-axis galvano mirror and a second Y-axis galvano mirror of the second galvano scanner are disposed to be plane-symmetric to each other.

3D LASER DEVICE FOR ULTRASHORT PULSES

A laser device includes a laser module for generating a laser beam of sub-nanosecond laser pulses with a laser source, and arranged downstream of the laser module in a beam path of the laser beam, a deviating instrument for variable deviation of the laser beam in two spatial directions. The laser device further includes a focusing instrument for variable displacement of a focal point of the laser beam in a third spatial direction that corresponds to a propagation direction of the laser pulses.

METHOD OF AND SYSTEM FOR WELDING USING AN ENERGY BEAM SCANNED REPEATEDLY IN TWO DIMENSIONS

A method of establishing a weld joint (105) comprises the step of projecting an energy beam (2) such as a laser beam onto an interface area (103) between two parts (101, 102) to be joined. The beam (2) is projected onto the interface area (103) so as to produce a primary spot on the interface area (103), and the beam (2) is repetitively scanned in two dimensions in accordance with a scanning pattern so as to establish an effective spot (21) on the object (101, 102), the effective spot (21) having a two-dimensional energy distribution. The effective spot (21) is displaced along a track (104) over the interface area (103) so as to progressively melt mating portions of the first part (101) and the second part (102) so as to form the weld joint (105). The effective spot (21) can feature an asymmetric energy distribution.

SELECTIVE LASER SOLIDIFICATION APPARATUS AND METHOD

This disclosure concerns a selective laser solidification apparatus comprising; a powder bed (104, 304) onto which powder layers can be deposited, at least one laser module (1, 2, 3, 4) for generating a plurality of laser beams for solidifying the powder material deposited onto the powder bed (104, 304), a laser scanner (106a, 106b, 106c, 106d, 306a, 306b, 306c, 306d, 306e) for individually steering each laser beam to solidify separate areas in each powder layer (104, 304), and a processing unit (131). A scanning zone (1a, 2a, 3a, 4a, 201a, 201b, 201c, 201d, 301a, 301b, 301c, 301d, 301e) for each laser beam is defined by the locations on the powder bed (104) to which the laser beam can be steered by the laser scanner (106a, 106b, 106c, 106d, 306a, 306b, 306c, 306d, 306e). The laser scanner (106a, 106b, 106c, 106d, 306a, 306b, 306c, 306d, 306e) is arranged at least two of the scanning zones 1a, 2a, 3a, 4a, 201a, 201b, 201c, 201d, 301a, 301b, 301c, 301d, 301e) overlap or are coterminous.

High Throughput Solar Cell Ablation System

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Устройство одновременного сканирования двумя лазерными пучками

Устройство одновременного сканирования двумя лазерными пучками включает в себя два механических сканирующих устройства, которые установлены рядом так, чтобы области сканирования каждого полностью перекрывали ростовую зону установки. Оба сканирующих устройства оснащены вариофокальными объективами, фокусирующими лазерные пучки на всей плоскости ростовой зоны. Технический результат заключается в расширении технологических возможностей обработки и изготовления деталей при обеспечении их высокого качества и точности обработки за счет обеспечения полного перекрытия рабочей зоны. 3 з.п. ф-лы. Ц 1 174390 ко РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) (2 за зао 0 (51) МПК В23К 26/08 (2014.01) СО2В 26/10 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21)(22) Заявка: 2016144179, 10.11.2016 (24) Дата начала отсчета срока действия патента: 10.11.2016 Дата регистрации: 11.10.2017 Приоритет(ы): (22) Дата подачи заявки: 10.11.2016 (45) Опубликовано: 11.10.2017 Бюл. № 29 Адрес для переписки: 197046, Санкт-Петербург, пр-кт Каменноостровский, 1-3, пом. 30, ООО "Юридическая фирма Городисский и Партнеры" (72) Автор(ы): Орлов Андрей Евгеньевич (КО), Смоленцев Сергей Сергеевич (КО), Тимофеев Владимир Андреевич (КО), Ксенофонтов Алексей Олегович (КП) (73) Патентообладатель(и): Российская Федерация в лице Министерства промышленности и торговли Российской Федерации (Минпромторг России) (КП) (56) Список документов, цитированных в отчете о поиске: У\О 2016128287 А1, 18.08.2016. ГР 2001075039 А, 23.03.2001. 0$ 20040129685 АТ, 08.07.2004. \УО 2013061587 А1, 02.05.2013. (54) УСТРОЙСТВО ОДНОВРЕМЕННОГО СКАНИРОВАНИЯ ДВУМЯ ЛАЗЕРНЫМИ ПУЧКАМИ (57) Реферат: Устройство одновременного сканирования двумя лазерными пучками включает в себя два механических сканирующих устройства, которые установлены рядом так, чтобы области сканирования каждого полностью перекрывали ростовую зону установки. Оба сканирующих устройства оснащены вариофокальными объективами, фокусирующими ...

Automated beam marker

A beam marking system is disclosed for marking on beams with a marking device. The beam marking system includes a beam marking device configured to mark on the surface of a beam. A movable arm is coupled to the marking device. The movable arm has at least three movable components that collectively move the beam marking device along or about at least three axes. A controller is in electronic communication with the movable arm and the marking device. The controller controlling the movement of the at least three movable components of the movable arm and controlling the operation of the marking device. In some instances, the beam marking system can automatically mark beams, such as metal beams used in heavy construction projects in a rapid and accurate manner.

Optical device and laser beam machining apparatus having optical device

An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

Laser processing method and laser processing apparatus

The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

Defect correcting apparatus and defect correcting method

The present disclosure provides a defect correcting apparatus including a defect detecting device configured to detect a defect within a repetitive pattern in a multilayer substrate a defect correcting device configured to correct the defect in the multilayer substrate by a specified defect correcting method, and a control device configured to, when the defect detected by the defect detecting device is detected overlapping a region in which occurrence of an interlayer short-circuit defect is assumed, generate an object corresponding to the defect correcting method for the interlayer short-circuit defect, and controlling the defect correcting device for correcting the defect using the generated object.

Niobium based superconducting radio frequency(scrf) cavities comprising niobium components joined by laser welding, method and apparatus for manufacturing such cavities

Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities involving atleast one laser beam welded components in the SCRF cavity welded from inside surface of the wall of cavity directed to achieving more than half the thickness to full depth penetration with minimum HAZ, minimizing distortion and shrinkage. The method ensures improved weld quality and surface finish substantially free of any weld defects. Also disclosed is the welding nozzle system and welding rigs adapted to facilitate such laser welding of the Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities. The invention is thus directed to enhancing productivity, ensuring consistent quality and reliability, enhanced weld penetration with minimum HAZ, smooth finish of weld joints at possible reduced costs.

Orthogonal integrated cleaving device

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

Method and System for Mitigation of Particulate Inclusions in Optical Materials

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

Scanned laser light source

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Laser machining apparatus with switchable laser system and laser machining method

A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Laser processing method and apparatus

A laser processing method processes spots on an object in a scan area with a laser beam emitted from a laser emitter. The method includes steps of covering the scan area in such a way as to transmit the laser beam and define a closed space over the scan area, jetting an inert gas into the closed space so that the jetted inert gas forms a gas curtain sweeping along the scan area in the closed space, and discharging the inert gas from the closed space while maintaining a positive pressure in the closed space, thereby removing plumes from the spots processed with the laser beam and preventing the spots from oxidizing. The method is capable of stably laser-processing the object without changing the color of the processed spots.

Annealing method and annealing apparatus

An annealing method irradiates a target object, having a film formed on its surface, with a laser beam to perform an annealing process to the target object. The surface of the target object is irradiated with the laser beam obliquely at an incident angle that is determined to achieve an improved laser absorptance of the film.

Wafer dividing method

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

Method for Printing a Substrate Using an Anilox Roll, an Anilox Roll for a Printing Method and a Printing Apparatus

The invention relates to an anilox roll for a printing apparatus. The anilox roll comprises a cylinder having a surface. The surface comprises a fluid distribution structure for receiving, distributing and transferring a fluid such as an ink. The fluid distribution structure comprises a channel formed in the surface having channel walls. This channel is arranged for distributing the fluid over the fluid distribution structure. The channel comprises channel parts, wherein the courses of connected channel parts are at an angle with respect to each other for preventing a linear distribution of the fluids to be received in a course direction of the channel, allowing a meandering distribution of the fluid to be received in the channel. Side walls of the channel are arranged for allowing a meandering flow of the fluid throughout the fluid distribution surface.

Method and Apparatus for Forming an Anilox Roll

The invention relates to a method and apparatus for forming an anilox roll. The method includes supplying a cylinder of the anilox roll that has an outer surface to be tooled, supplying at least a laser source and laser engraving the outer surface of the anilox roll with a laser spot that is formed by a laser source for obtaining a tooled anilox roll, and applying an optical guide in the light path of the laser for enabling the laser spot to move reciprocally on the outer surface to be tooled.

Laser match honing system and method

A laser match honing system and method are provided for processing one of a pair of mechanically matching components ( 1, 2 ) having matching portions ( 12, 22, 16, 26 ) that will be fitted with each other. A dimension of the matching portion ( 12, 16 ) of the first component ( 1 ) is measured and is then used for calculating the desired dimension of the corresponding matching portion ( 22, 26 ) of the second component ( 2 ). An actual dimension of the matching portion ( 22, 26 ) of the second component ( 2 ) is also measured. Then, the matching portion ( 22, 26 ) of the second component ( 2 ) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

Laser processing systems and methods for beam dithering and skiving

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Printing Method With a Printing Apparatus Provided With an Anilox Roll

A printing apparatus has a printing device having a supply for a substrate to be printed and a supply for ink. The printing device has a printing roll with an image and an anilox roll mounted in a bearing. The anilox roll comprising a cylinder having a surface with a fluid distribution structure for receiving the fluid. The fluid distribution structure has a channel formed in the surface for distributing the fluid over the fluid distribution structure. The channel having a course and opposite channel walls positioned next to each other in a relative parallel oscillating fashion. Printing in a first operational mode, heavy layers of ink on said substrate with relatively large fluid droplets and Printing in a second operational mode, details on said substrate with relatively small fluid droplets.

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Laser ablation tooling via distributed patterned masks

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

Laser Processing Machines

A laser processing machine includes a workpiece support, a movement unit that is movable relative to the workpiece support, the movement unit being configured to move a laser processing head over the workpiece support, and a switch cabinet in which one or more control components of the laser processing machine are provided. An arrangement of the switch cabinet provides a free movement space disposed underneath at least a portion of the switch cabinet, wherein at least a portion of the movement unit is disposed within the free movement space.

METHOD AND DEVICE FOR LASER-JOINING SHEET METAL PARTS

The invention relates to a device and to an associated method for joining sheet metal parts, each with a flange, by laser, wherein the flanges of the sheet metal parts () are joined into one connecting flange. The device has a clamping device () for clamping the sheet metal parts () to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam (). Moreover, the device has a compensation shaft () which tracks the laser beam () according to a relative movement between the connecting flange and a guidance apparatus. 1. A device for joining sheet metal parts each with a flange , by laser , wherein the flanges of the sheet metal parts are joined into one connecting flange , in which the flanges of the sheets to be joined abut flat against each other and thus form a joint with a flange planewherein the device has clamping device to clamp the sheet metal parts to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam which is designed to route a laser beam substantially parallel to the connecting flange and transverse to the clamping direction to a front side of at least one of the flanges of the sheet metal parts to be joined,whereinthe device further comprises a compensation shaft which, when the device is connected to a guidance apparatus, tracks the laser beam according to a relative motion between the connecting flange and the guidance apparatuscharacterized in that the beam guidance system has at least one optical element with which a beam angle at which the laser beam runs on a plane perpendicular to the main clamping direction is to be influenced in such a way that switching between different beam angles is possible in the area of a possible processing point such that in each instance a lateral angle is produced away from a sheet part projecting beyond the joint andthat the device has an apparatus for monitoring the ...

LASER-IRRADIATED THIN FILMS HAVING VARIABLE THICKNESS

A crystalline film includes a first crystalline region having a first film thickness and a first crystalline grain structure; and a second crystalline region having a second film thickness and a second crystalline grain structure. The first film thickness is greater than the second film thickness and the first and second film thicknesses are selected to provide a crystalline region having the degree and orientation of crystallization that is desired for a device component. 1. A system for processing a film comprising:a laser source capable of producing a pulsed laser beam;one or more optical elements capable of generating a first laser beam and a second laser beam having different beam characteristics from the pulsed laser beam, wherein the first laser beam has a first energy density to melt a first region of a film to be crystallized to form a first crystalline region having a first grain structure and the second laser beam has a second energy density sufficient to melt a second region of the film to be crystallized to form a second crystallized region having a second grain structure, wherein the first energy density is greater than the second energy density;a stage configured to support and position a film to be crystallized such that the first laser beam is directed to and irradiates a first portion of the stage and a second laser beam is directed to and irradiates a second portion of the stage; anda computer for controlling the laser source, optical elements, and stage to facilitate the delivery of the first laser beam and the second laser beam to portions of the stage corresponding to first and second regions of a film to be crystallized..2. The system of claim 1 , comprising a film positioned on the stage.3. The system of claim 2 , wherein the first laser beam irradiates a first region of the film and the second laser beam irradiates a second region of the film.4. The system of claim 3 , wherein the irradiations of the first region of the film and the second ...

Laser Puncher for Punching Hole on Tipping Paper in a Curved Manner

The present invention discloses a laser puncher for punching holes on tipping paper in a curve manner, which comprises a panel, a light guiding cylinder, a laser connected with the light guiding cylinder, a transmission system driving a piece of tipping paper to move and at least one focusing optical head and at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is provided with the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the external periphery of the moving optical cylinder is provided with an anti-rotation linear bearing, which is fixed on the panel, and the driving motor drives the focusing optical head to reciprocate back and forth via the screw shaft, the nut, the connecting rod and the moving optical cylinder. The present invention can increase the identifiability of tipping papers on which holes are punched with a laser puncher as well as the air permeability of tipping papers. 1. A laser puncher for punching holes on tipping paper in a curved manner , comprising;a panel;a light guiding cylinder;a laser connected with the light guiding cylinder;a transmission system driving a piece of tipping paper to move; andat least one focusing optical head, wherein at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is fitted glidingly in the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the ...

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Method for welding steel material to ni-based superalloy and welding joint

When a turbine impeller ( 4 ) formed from an Ni-based superalloy and a rotor shaft ( 2 ) formed from a steel material are joined by being fused together via welding in a boundary portion, a mixing ratio of a welding metal ( 6 ) that is formed in the boundary portion by fusing together the Ni-based superalloy forming the turbine impeller ( 4 ) and the steel material forming the rotor shaft ( 2 ) is between 0.5 and 0.8. As a result, it is possible to obtain a sound welding joint in which there are no cracks in the boundary between the welding metal ( 6 ) and the Ni-based superalloy ( 4 ).

APPARATUS AND METHOD FOR MATERIAL PROCESSING USING A TRANSPARENT CONTACT ELEMENT

A method of preparing an apparatus for material processing by generating optical breakthroughs in an object. The apparatus includes a variable focus adjustment device. A contact element is mounted to the apparatus, the contact element has a curved contact surface having a previously known shape. The position of the contact surface is determined prior to processing the object, by focusing measurement laser radiation near or on the surface by the variable focus adjustment device, and the focus position is adjusted in a measurement surface intersecting the expected position of the contact surface. Radiation from the focus of the measurement laser radiation is confocally detected. The position of points of intersection between the measurement surface and the contact surface is determined from the confocally detected radiation to determine the position of the contact surface from the position of the points of intersection and the previously known shape of the contact surface. 1. A method of preparing an apparatus for material processing by producing optical breakthroughs in or on an object , said apparatus comprising a variable three-dimensionally acting focus adjustment device for focusing pulsed processing laser radiation on different locations in or on the object , whereina contact element, which is transparent for the processing laser radiation and is to be placed on the object, is mounted to the apparatus, said contact element having, on its side to be placed on the object, a contact surface and, located opposite, an entry surface for the processing laser radiation, the contact surface having a known shape;prior to processing the object, the position of the contact surface with respect to the focus adjustment device is determined by irradiation of laser radiation on the contact surface, by focusing measurement laser radiation near or on the contact surface by the variable focus adjustment device, an energy density of the focused measurement laser radiation being too ...

Method and apparatus for marking an article

Numerous embodiments of methods and apparatus for marking articles are disclosed. In one embodiment, a method of marking an article includes providing an article having a preliminary visual appearance; modifying a region of the article; and directing a plurality of optical pulses into the modified region of the article. The plurality of optical pulses can be configured to produce a visible mark on the article. Generally, the mark can be characterized as having a modified visual appearance different from the preliminary visual appearance.

Analyte sensor

Devices and methods are provided for continuous measurement of an analyte concentration. The device can include a sensor having a plurality of sensor elements, each having at least one characteristic that is different from other sensor(s) of the device. In some embodiments, the plurality of sensor elements are each tuned to measure a different range of analyte concentration, thereby providing the device with the capability of achieving a substantially consistent level of measurement accuracy across a physiologically relevant range. In other embodiments, the device includes a plurality of sensor elements each tuned to measure during different time periods after insertion or implantation, thereby providing the sensor with the capability to continuously and accurately measure analyte concentrations across a wide range of time periods. For example, a sensor system 180 is provided having a first working electrode 150 comprising a first sensor element 102 and a second working electrode 160 comprising a second sensor element 104 , and a reference electrode 108 for providing a reference value for measuring the working electrode potential of the sensor elements 102, 104.

Substrate markings

Apparatus, systems, and methods are provided to generate markings on the side of a substrate. The markings represent information. In an embodiment, the information provided in the markings may be used to collect information during an assembly process.

Light Recycling For Additive Manufacturing Optimization

A method and an apparatus pertaining to recycling and reuse of unwanted light in additive manufacturing can multiplex multiple beams of light including at least one or more beams of light from one or more light sources. The multiple beams of light may be reshaped and blended to provide a first beam of light. A spatial polarization pattern may be applied on the first beam of light to provide a second beam of light. Polarization states of the second beam of light may be split to reflect a third beam of light, which may be reshaped into a fourth beam of light. The fourth beam of light may be introduced as one of the multiple beams of light to result in a fifth beam of light. 1. A method , comprising the steps of:multiplexing, by a first optical assembly, multiple beams of light including at least one or more beams of light from one or more light sources;reshaping and blending, by an optical device, the multiple beams of light to provide a first beam of light;applying, by a spatial polarization valve, a spatial polarization pattern on the first beam of light to provide a second beam of light;splitting, by a polarizer, polarization states of the second beam of light to reflect a third beam of light;reshaping, by a second optical assembly, the third beam of light into a fourth beam of light; andintroducing, by the second optical assembly, the fourth beam of light to the first optical assembly as one of the multiple beams of light to result in a fifth beam of light that is emitted through and not reflected by the polarizer.2. The method of claim 1 , wherein the receiving of the multiple beams of light including at least one or more beams of light from the one or more light sources comprises receiving at least the one or more beams of light from at least a solid state laser or a semiconductor laser.3. The method of claim 1 , wherein the applying of the spatial polarization pattern on the first beam of light comprises applying the spatial polarization pattern on the first ...

THIN-FILM DEVICES AND FABRICATION

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations. 122-. (canceled)23. A method of fabricating an optical device , the method comprising , in the following order:depositing a lower transparent conductor layer on a substantially transparent substrate;depositing a defect mitigation insulating (DMIL) layer on the lower transparent conductor layer;removing material down to the DMIL and a predefined depth of material from the lower transparent conductor layer in regions at predefined locations in a bus bar expose area along a side of the substantially transparent substrate;depositing an electrochromic device stack over the substantially transparent substrate; andremoving the electrochromic device stack at the predefined locations to expose the lower transparent conductor layer.24. The method of fabricating the optical device of claim 23 , wherein removing the electrochromic device stack at the predefined locations forms spaced punch through areas penetrating into the lower transparent conductor layer; and further comprising filling the spaced punch through areas with a material to form a bus bar.25. The method of fabricating the optical device of claim 24 ,wherein the spaced punch through areas form a plurality of separated scribe lines along the side of the substantially transparent substrate; andwherein the electrochromic device stack is at least partially intact between the separated scribe lines.26. The method of fabricating the optical device of claim 23 , wherein the bus bar ...

LASER SYSTEM AND METHOD FOR PROCESSING SAPPHIRE

Laser processing of sapphire is performed using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm (hereinafter “QCW laser”). Laser processing of sapphire using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 10%) and in an inert gas atmosphere such as argon or helium. Laser processing of sapphire using a QCW laser may further include the use of an assist laser having a shorter wavelength and/or pulse duration to modify a property of the sapphire substrate to form absorption centers, which facilitate coupling of the laser light pulses of the QCW laser into the sapphire. 1. A method for laser processing a sapphire substrate , the method comprising:periodically switching on a power source to pulse a continuous wave laser, thereby operating the laser in a quasi-continuous wave (“QCW”) mode so as to emit consecutive pulses of laser light at a wavelength ranging between about 1060 nm and about 1070 nm;focusing the pulses of laser light at the sapphire substrate; andlaser processing the sapphire substrate with the pulses of laser light.2. The method of further comprising supplying inert gas in a vicinity of the sapphire substrate.3. The method of claim 2 , wherein the inert gas is selected from the group consisting of argon and helium.4. The method of claim 1 , wherein laser processing the sapphire substrate is selected from the group consisting of cutting claim 1 , scribing claim 1 , and drilling.5. The method of claim 1 , wherein laser processing includes cutting with a speed between about 10 and 40 inches per minute claim 1 , and wherein the sapphire substrate has a thickness between about 0.1 and about 1 mm.6. The method of claim 1 , wherein the laser is an ytterbium fiber laser.7. The method of claim 1 , wherein the laser is operated with a duty cycle ranging between about 1% and about 10%.8. The method of claim 1 , wherein ...

SYSTEMS AND METHODS FOR WELDING

A welding fixture including an electromagnet, a non-magnetic support configured to receive at least two sheets of material to be welded, and one or more clamping shoes configured to cooperate with the electromagnet to apply a clamping pressure to the at least two sheets of material and the non-magnetic support as a result of a magnetic force produced by the electromagnet is provided. A first of the at least two sheets of material is in contact with at least one of the one or more clamping shoes, and a second of the at least two sheets of material is in contact with at least the non-magnetic support. The one or more clamping shoes being shaped such that a perimeter defined by the one or more clamping shoes is located in the vicinity of a defined weld line to be welded on the at least two sheets of material, the weld line remaining substantially free from optical obstruction during production of the magnetic force. 1. A welding fixture , comprising:an electromagnet;a non-magnetic support configured to receive at least two sheets of material to be welded; andone or more clamping shoes configured to cooperate with the electromagnet to apply a clamping pressure to the at least two sheets of material and the non-magnetic support as a result of a magnetic force produced by the electromagnet;wherein a first of the at least two sheets of material is in contact with at least one of the one or more clamping shoes, and wherein a second of the at least two sheets of material is in contact with at least the non-magnetic support, the one or more clamping shoes being shaped such that a perimeter defined by the one or more clamping shoes is located in the vicinity of a defined weld line to be welded on the at least two sheets of material, the weld line remaining substantially free from optical obstruction during production of the magnetic force.2. The welding fixture of claim 1 , further comprising a laser welding device or an electron beam welding device.3. The welding fixture of ...

HANDHELD PULSED LASER DEVICE FOR CLEANING OR TREATING A SURFACE

The present invention relates to a handheld pulsed laser device for cleaning or treating a surface, comprising a laser source, a focal distance adjuster and a beam deflector. The laser source is configured to emit a pulsed laser beam and the focal distance adjuster, is configured to change a focal distance of the beam. The beam deflector may comprise at least one movable mirror onto which the beam is deflected, wherein the deflector is configured to deflect the beam to scan the beam along the surface. 1. A handheld pulsed laser device for cleaning or treating a surface , comprising:a laser source, configured to emit a pulsed laser beam;a focal distance adjuster, configured to change a focal distance of the beam, and;a beam deflector, configured to deflect the beam to scan the beam along the surface;at least one sensor, configured to provide a sensor signal, representative for of a parameter that is related to a characteristic of the surface; anda control unit, configured to control the beam deflector to scan the beam along the surface in an, at least, two-dimensional pattern, based on the sensor signal.2. The pulsed laser device according to claim 1 , wherein the pattern of the beam comprises an outer contour and wherein the outer contour is filled-up by the beam with a back-and-forth scanning movement within the outer contour.3. The pulsed laser device according to claim 2 , wherein the back-and-forth scanning movement is superpositioned with a sinusoidal pattern.4. The pulsed laser device according to claim 2 , wherein the back-and-forth scanning movement is superpositioned with a spiral pattern.5. The pulsed laser device according to claim 1 , wherein the beam deflector comprises at least one mirror claim 1 , which is tiltable around at least one perpendicular axis.6. The pulsed laser device according to claim 1 , wherein the focal distance adjuster comprises a movable lens element and a piezo-element claim 1 , which is configured move the movable lens element to ...

LASER PROCESSING SYSTEM

There is provided a laser processing system including: a robot; a laser emission section provided on the robot; an irradiation path calculation section configured to calculate an irradiation path of a laser beam emitted from the laser emission section using information on a position of the robot; a determination section configured to determine whether the irradiation path calculated passes through an allowable irradiation region that is predetermined; and a laser-output reduction section configured to reduce output of the laser beam to be emitted to the irradiation path to a second output lower than a first output for processing in accordance with a determination by the determination section that the irradiation path does not pass through the allowable irradiation region. 1. A laser processing system comprising:a robot;a laser emission section provided on the robot;an irradiation path calculation section configured to calculate an irradiation path of a laser beam emitted from the laser emission section using information on a position of the robot;a determination section configured to determine whether the irradiation path calculated passes through an allowable irradiation region that is predetermined; anda laser-output reduction section configured to reduce output of the laser beam to be emitted to the irradiation path to a second output lower than a first output for processing in accordance with a determination by the determination section that the irradiation path does not pass through the allowable irradiation region.2. The laser processing system according to claim 1 , whereinthe laser emission section includes a scanner configured to perform scan operation, andthe irradiation path calculation section calculates the irradiation path further using information on a position of the scan operation of the scanner.3. The laser processing system according to claim 2 , whereinthe scanner includes a mirror configured to perform the scan operation and a motor configured ...

CALIBRATION TEST PIECE FOR GALVANOMETRIC LASER CALIBRATION

Some embodiments may include a galvanometric laser system, comprising: a laser device to generate a laser beam; an X-Y scan head module to position the laser beam on a work piece, the X-Y scan head module including a laser ingress to receive the laser beam and a laser egress to output the laser beam; a support platen located below the laser egress; an in-machine imaging system integrated with the galvanometric laser, wherein a camera of the in-machine imaging system is arranged to view a surface of an object located on the support platen using one or more optical components of the X-Y scan head module to generate assessment data associated with a calibration of the X-Y scan head module by imaging the surface of the object, wherein a calibration fiducial is located on the surface of the object. 1. A galvanometric laser system , comprising:a laser device to generate a laser beam;an X-Y scan head module to position the laser beam on a work piece, the X-Y scan head module including a laser ingress to receive the laser beam and a laser egress to output the laser beam;a support platen located below the laser egress and arranged to receive a work piece;an in-machine imaging system integrated with the galvanometric laser, wherein a camera of the in-machine imaging system is arranged to use one or more optical components of the X-Y scan head module to view an object located on the support platen; anda calibration test piece to place on the support platen during a calibration routine prior to positioning the laser beam on the work piece, the calibration test piece with a planar surface including a calibration fiducial usable by the camera to generate calibration data associated with a calibration of the X-Y scan head module.2. The galvanometric laser system of claim 1 , further comprising a selective optic located between the laser ingress and the laser device claim 1 , the selective optic being optically transmissive to the laser beam and optically non-transmissive to light ...

Laser wire processing device

A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

LOCATION OF IMAGE PLANE IN A LASER PROCESSING SYSTEM

Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution. 1. A method of processing a workpiece using a laser processing system having a scan lens , the method , comprising:producing a first beam of laser energy characterized by a first spatial intensity distribution having a non-circular perimeter shape at the focal point of the beam when viewed in a plane that is orthogonal to a path along which the beam of laser energy propagates;processing a first workpiece using the first beam of laser energy;the processing comprising forming a plurality of features in the first workpiece, wherein a first distance between the scan lens and the first workpiece during the forming of one of the plurality of features is different from a second distance between the scan lens and the first workpiece during the forming of at least one other of the plurality of features;determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution;setting a process distance as the distance between the scan lens and the first workpiece during the forming of the feature having the shape that most closely resembles the shape of the first spatial intensity distribution;determining an imaging plane as a plane at the process ...

Method for defining a laser tool path

Open patches whose boundary is affected by the laser ray 2 being defined for any areas which could not be machined from validated closed patches 15. Optionally, the method also comprises a step 400 of merging of the validated closed patches 15 into groups 50 of patches.

LASER PROCESSING APPARATUS, METHODS OF LASER-PROCESSING WORKPIECES AND RELATED ARRANGEMENTS

Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed. 1. (canceled)2. An apparatus for laser-processing a workpiece , the apparatus , comprising:a laser source configured to generate a plurality of laser pulses;a scan lens arranged in a beam path along which the plurality of laser pulses are directable to the workpiece to thereby irradiate a process spot at the workpiece;a first positioner including an acousto-optical deflector (AOD) system arranged along the optical path between the laser source and the scan lens, wherein the first positioner is operative to deflect the plurality of laser pulses relative to the scan lens to thereby position the process spot within a first scanning range associated with the first positioner a processor configured to generate one or more control signals to which the first positioner is responsive; and', {'b': 3', '14, 'computer memory accessible by the processor, wherein the computer memory has instructions stored thereon which, when executed by the processor, cause the first positioner to scan the process spot along a process trajectory to form a via in the workpiece, wherein the process trajectory defines a sequence of spot locations to be addressed upon irradiating the workpiece with the plurality of laser pulses during formation of the via and wherein a maximum diameter of the via is smaller than or equal to the first scanning range. claims -. (canceled ...

HEATING SYSTEM FOR COMPOSITE REWORK OF AIRCRAFT

A method and apparatus comprising a laser unit and a controller. The laser unit is configured to generate a number of laser beams. The controller is configured to operate the laser unit to generate the number of laser beams resulting in a desired level of heating of a composite patch that cures the composite patch on a composite structure. 115-. (canceled)16. A method for curing a composite patch on a composite structure , the method comprising:attaching a rework system to a location on the composite structure comprising the composite patch;receiving, in a controller configured to operate a laser unit, rework information for generating commands for selecting and transmitting, from the laser unit, a wavelength and intensity required to pass through a vacuum bag with a vacuum applied to the vacuum bag and cause a desired level of heating of the composite patch, within the vacuum bag, for each step needed to cure the composite patch on the composite structure, while avoiding overheating a fiber in the composite patch; andoperating the rework system, controlling the laser unit, a number of laser beams resulting in the desired level of heating of the composite patch that cures the composite patch on the composite structure.17. The method of claim 16 , wherein the operating step comprises:identifying parameters for operating the rework system to generate the number of laser beams resulting in the desired level of heating of the composite patch that cures the composite patch on the composite structure; andoperating the rework system using the parameters identified to generate the number of laser beams resulting in the desired level of heating of the composite patch that cures the composite patch on the composite structure.18. The method of claim 17 , wherein the operating step further comprises:monitoring heating of the composite patch during operation of the rework system using the parameters identified to generate the number of laser beams resulting in the desired level ...

Method for matching and tracking workpieces in laser etching operation

A method for matching and tracking workpieces in laser etching operation includes generating by the computer a label image that uniquely identifies the workpiece, moving a laser head to the workpiece, setting the laser head to a first power level by a power controller, etching the product image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the first power level in accordance with a product image in a pixel wise fashion across the workpiece, moving the laser head to the label by the transport mechanism, setting the laser head to a second power level by the power controller, etching the label image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the second power level in accordance with the label image in a pixel wise fashion across the label. 1. A method for matching and tracking workpieces in laser etching operation , comprising:receiving a product image by a computer, wherein the product image is to be reproduced on a workpiece by laser etching;generating, by the computer, a label image that uniquely identifies the workpiece, wherein the workpiece and the label are placed over a platform in a laser etching apparatus;moving a laser head to the workpiece by a transport mechanism;setting the laser head to a first power level by a power controller;while scanning the laser head across the workpiece, etching the product image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the first power level in accordance with the product image in a pixel wise fashion across the workpiece;moving the laser head to the label by the transport mechanism;setting the laser head to a second power level by the power controller;while scanning the laser head across the label, etching the label image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the second power level in ...

Laser processing apparatus and laser processing method

A laser processing apparatus that condenses a laser beam into an annular shape to irradiate the condensing position of the laser beam within a thickness range of a substrate, and shifts the condensing position in such a manner that the center of the condensing position that is annular moves in a circular manner, at a stage of shifting the condensing position in a thickness direction of the substrate and a planar direction of the substrate.

METHOD AND SYSTEM FOR LASER HARDENING OF A SURFACE OF A WORKPIECE

A method of laser hardening of a surface area of a workpiece, such as a surface of a journal of a crankshaft, including the steps of generating a relative movement between the surface of the workpiece and a laser source to allow a laser spot to subsequently be projected onto different portions of the surface area, and during the relative movement, repetitively scanning the laser beam so as to produce a two-dimensional equivalent effective laser spot on the surface area. The energy distribution of the effective laser spot is adapted so that it is different in a more heat sensitive subarea, such as in an area adjacent to an oil lubrication opening, than in a less heat sensitive subarea, so as to prevent overheating of the more heat sensitive subarea. 1. An apparatus for hardening a surface area of a workpiece , the surface area comprising at least one less heat sensitive subarea and at least one more heat sensitive subarea , the apparatus comprising a laser source arranged to project an effective laser spot onto the surface area and means for generating relative movement between said surface area and the effective laser spot so that said effective laser spot is moved along said surface area so as to subsequently and progressively heat different portions of said surface area to a temperature suitable for hardening , whereby said effective laser spot is arranged to feature a two-dimensional energy distribution , the apparatus further comprising a control system for controlling operation of the apparatus , wherein said control system is arranged to modify said two-dimensional energy distribution so that it is different in said more heat sensitive subarea than in said less heat sensitive subarea.2. The apparatus according to claim 1 , wherein said at least one more heat sensitive subarea includesan area adjacent to a hole in the surface area, such as an oil lubrication hole; and/ora fillet, such as an undercut fillet; and/ora previously hardened portion of the surface ...

LASER SYSTEMS AND TECHNIQUES FOR WORKPIECE PROCESSING UTILIZING OPTICAL FIBERS AND MULTIPLE BEAMS

In various embodiments, a workpiece is processed utilizing primary and secondary laser beams having different wavelengths and which are coupled into specialized optical fibers. The primary and secondary beams may be utilized during different stages of workpiece processing. 1. A method of processing a workpiece utilizing a primary laser beam and a secondary laser beam , wherein a wavelength of the primary laser beam is longer than a wavelength of the secondary laser beam , the method comprising:providing a step-core optical fiber having an input end and an output end opposite the input end, wherein the step-core optical fiber comprises (i) an inner core having a first refractive index, (ii) surrounding the inner core, an outer core having a second refractive index smaller than the first refractive index, (iii) surrounding the outer core, a cladding having a third refractive index smaller than the second refractive index, (iv) a first inner core numerical aperture (NA) relative to the cladding, (v) a second inner core NA relative to the outer core, and (vi) an outer core NA relative to the cladding;disposing a workpiece proximate the output end of the optical fiber;during a first stage, coupling at least the secondary laser beam into the optical fiber to form a first output beam emitted from the output end of the optical fiber and directed to a surface of the workpiece, whereby energy of the first output beam is absorbed by the workpiece; andduring a second stage after at least a portion of the surface of the workpiece reacts to absorption of energy of the first output beam, (i) coupling at least the primary laser beam into the optical fiber to form a second output beam emitted from the output end of the optical fiber and directed to the surface of the workpiece, and (ii) thereduring, causing relative movement between the second output beam and the workpiece, whereby the workpiece is cut along a processing path determined at least in part by the relative movement.2. ...

LOCATION-SPECIFIC LASER ANNEALING TO IMPROVE INTERCONNECT MICROSTRUCTURE

A method (and structure) includes performing an initial partial anneal of a metal interconnect overburden layer for semiconductor devices being fabricated on a chip on a semiconductor wafer. Orientation of an early recrystallizing grain at a specific location on a top surface of the metal overburden layer is determined, as implemented and controlled by a processor on a computer. A determination is made whether the orientation of the early recrystallizing grain is desirable or undesirable. 1. A method , comprising:performing an initial partial anneal of a metal interconnect and overburden layer for semiconductor devices being fabricated on a chip on a semiconductor wafer;detecting an orientation of an early recrystallizing grain at a specific location on a top surface of the metal overburden layer, as implemented and controlled by a processor on a computer; anddetermining whether the detected orientation of the early recrystallizing grain is desirable or undesirable.2. The method of claim 1 , further comprising performing a laser anneal at specific locations to promote or inhibit certain grain orientations from growing.3. The method of claim 1 , wherein said metal overburden layer comprises copper (Cu).4. The method of claim 1 , wherein said specific location comprises a point of a plurality of points of a discrete sampling grid of said top surface claim 1 , said discrete sampling grid having a sample interval based on an expected overburden grain size.5. The method of claim 4 , wherein said discrete sampling grid is selectively applied to at least one of different regions and different layers of a chip during fabrication of a semiconductor wafer.6. The method of claim 1 , wherein said detecting and determining of orientation comprises evaluation of grain orientation using a scanning electron microscope (SEM) equipped with electron backscatter diffraction (EBSD).7. The method of claim 1 , further comprising:monitoring said initial partial anneal by using a laser ...

LASER MACHINING DEVICE AND LASER MACHINING METHOD

Provided are a laser machining device and a laser machining method capable of stably operating an autofocus function without causing an unfavorable state such as an overshoot etc. A laser machining device and a laser machining method of the present invention performs a normal AF (autofocus) control when a scan position of the machining laser light and the detecting laser light is located in a work central portion, and performs a slow-tracking AF (autofocus) control with a trackability to a displacement of a main surface of a work reduced to be lower than a trackability of the normal AF control when the scan position of the machining laser light and the detecting laser light is located in a work end portion. 1. A laser machining device which condenses a machining laser light inside a work to form a modified region inside the work along a planned dividing line , the laser machining device comprising:a condensing lens configured to condense the machining laser light and a detecting laser light toward the work;a scanner configured to relatively move the condensing lens and the work in a direction orthogonal to an optical axis direction of the condensing lens, to scan the machining laser light and the detecting laser light over the work;an adjuster configured to adjust a distance between the condensing lens and the work;a detector configured to detect a reflected light to output a detection signal according to a height of a main surface of the work, the reflected light being the detecting laser light reflected on the main surface of the work;a first controller configured to control, based on the detection signal output by the detector, the adjuster so as to cause a light condensing point of the detecting laser light to track a displacement of the main surface of the work, in case where a scan position of the machining laser light and the detecting laser light is in a central portion of the work; anda second controller configured to control, based on the detection signal ...

COMPACT DEVICE AND PROCESS FOR THE PRODUCTION OF NANOPARTICLES IN SUSPENSION

The invention shows a device for producing nanoparticles, the device having a pulsed laser with a scanning device for guiding the beam of the laser over a target that is fixed in a flow-through chamber. The flow-through chamber is reversibly connected to a supply line for carrier fluid, so that the flow-through chamber is exchangeable e.g. for a further flow-through chamber having a different target and/or a different dimensioning. 1. A device for the production of nanoparticles , comprising a pulsed laser , a scanning device to guide a beam of the laser , a flow-through chamber having a target support wall , a radiation-transparent wall opposite the target support wall , a supply line connected to at least one reservoir for carrier fluid and connected to the flow-through chamber , a controlled conveying device arranged in the supply line and configured to control a flow velocity of carrier fluid within the flow-through chamber in a range of 1 to 10 mm/s , wherein the laser has a maximum power of 5 W and is configured to emit pulses having a pulse energy of 0.01 to 10 mJ and a pulse duration of 0.5 to 10 ns with a repetition rate of 500 to 5000 Hz and a fluence of 0.1 to 10 J/cm.2. The device according to claim 1 , wherein the laser is configured to emit pulses having a pulse energy of 10 to 1000 μJ and a pulse duration of 0.5 to 1 ns with a repetition rate of 500 to 5000 Hz and a fluence of 0.1 to 10 J/cm.3. The device according to claim 1 , wherein a distance of the radiation-transparent wall section from a target supported by the target support wall is at maximum 5 mm.4. The device according to claim 1 , wherein the scanning device is configured to guide the laser beam at a speed of 0.1 to 10 m/s over a target supported by the target support wall.5. The device according to claim 1 , the conveying device comprising one or both of a controlled valve and a controlled pump.6. The device according to claim 1 , wherein the flow-through chamber is arranged with its ...

Workpiece management method and sheet cutting machine

A workpiece management method includes a frame unit forming step of forming a frame unit with a workpiece supported in an opening of an annular frame via a resin sheet, a printing step of, after performing the frame unit forming step, printing identification information of the workpiece on the resin sheet in an area between an outer periphery of the workpiece and an inner periphery of the annular frame, a processing step of processing the workpiece by a processing machine, a separation step of separating the processed workpiece from the resin sheet, and a storage step of storing the resin sheet from which the workpiece has been separated. A sheet cutting machine suitable for use in the workpiece management method is also disclosed.

Laser patterning apparatus for three-dimensional object

A laser patterning apparatus for a three-dimensional object includes a laser generator, a beam expander configured to adjust a size of a laser beam generated by the laser generator, a dynamic focusing module configured to adjust a z-axis focus position of the laser beam passing through the beam expander, a scan head configured to adjust x- and y-axis focus position of the laser beam passing through the beam expander, a shape recognizer configured to recognize a shape of a three-dimensional object, and a controller configured to extract x-, y-, and z-axis data of the three-dimensional object and to control the scan head and the dynamic focusing module, in order to pattern the three-dimensional object with the laser beam.

Device For Operating A Machine Tool And Machine Tool

A device is provide for operating a machine tool. The machine tool includes a rotation unit designed to rotate a workpiece about an axis of rotation with an adjustable rotational speed progression, and an ultra-short pulse laser for generating laser pulses, the laser being arranged such that material of the workpiece is removed by means of the laser pulses. The device is configured to adjust the rotational speed progression based on geometry data of a specified geometry and/or a specified surface quality characteristic value representative of a corresponding surface quality. 1. A device for operating a machine tool ,wherein the machine tool has a rotation unit that rotates a workpiece about an axis of rotation with an adjustable rotational speed progression, and an ultra-short pulse laser for generating laser pulses, wherein the ultra-short pulse laser is arranged such that material of the workpiece is removed by the laser pulses, andwherein the device is configured to adjust the rotational speed progression based on speed control data comprising at least one of (a) geometry data of a specified geometry or (b) a specified surface quality characteristic value representative of a corresponding surface quality.23-. (canceled)4. The device of claim 1 , wherein the machine tool further comprises a galvanometer scanner arranged between the ultra-short pulse laser and the workpiece and configured to displace a point of impingement of the respective laser pulse on the surface of the workpiece along the axis of rotation with an adjustable scanning speed progression claim 1 , andwherein the device is configured to adjust the scanning speed progression based on the speed control data.5. (canceled)6. A machine tool for machining a workpiece claim 1 , with the machine tool comprising:a rotation unit configured to rotate the workpiece about an axis of rotation with an adjustable rotational speed progression,an ultra-short pulse laser that generates laser pulses and is arranged ...

REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed. 1. A method for selectively removing a protective coating from a substrate , comprising:applying a protective coating to a substrate; andselectively cutting at least a portion of the protective coating with a removal medium comprising a laser light.2. The method of claim 1 , wherein applying the protective coating comprises applying a polyp-xylylene) coating to the substrate.3. The method of claim 1 , wherein selectively cutting at least the portion of the protective coating comprises exposing a periphery of at least one portion of the substrate through the protective coating.4. The method of claim 1 , wherein exposing the periphery of the at least one portion of the substrate comprises exposing a periphery of a selected feature and/or component of the substrate.5. The method of claim 3 , wherein exposing at least the periphery of the at least one portion of the substrate comprises exposing the protective coating to a laser beam.6. The method of claim 5 , further comprising:exposing an area of the substrate delineated by the periphery of the at least one portion of the substrate.7. The method of claim 6 , wherein the area is exposed by scanning the laser beam across a region of the protective coating located over the area of the substrate.8. The method of claim 7 , wherein scanning comprises raster scanning the laser beam across the region of the protective coating.9. The method of claim 1 , wherein selectively cutting comprises selectively cutting at least the portion of the protective ...

DEVICE FOR CUTTING A WEB OF MATERIAL

A device for cutting a web of material comprises movement means for moving a web of material to be cut, defining a feed path for the web at least partly rotatable about a central axis and equipped with at least one conveyor mounted around the central axis, at least one cutting head equipped with a laser source and an optical system configured to direct the laser beam towards a cutting zone, where the optical system of the cutting head comprises at least one directing member located inside the conveyor to direct the laser beam away from the central axis towards the cutting zone. 1. A device for cutting a web of material , comprising:movement means by which a web of material to be cut is made to advance and defining for the web a feed path which is at least partly rotatable about a central axis; the movement means comprising at least a conveyor mounted around the central axis and defining an at least partly curved cutting zone;at least one laser cutting head laser equipped with a laser source configured to generate a laser beam, and an optical system configured to direct the laser beam towards the cutting zone;Wherein the optical system of the cutting head comprises at least one directing member located inside the conveyor to direct the laser beam away from the central axis towards the cutting zone; the directing member being rotatable about its axis of rotation and oriented in such a way that the laser beam defines on the web a cutting line transversal to the feed path of the web.2. The device according to claim 1 , wherein the conveyor constitutes a curved feed surface for the web and is equipped claim 1 , at the cutting zone claim 1 , with at least one permeable portion permeable to the laser beam and facing the directing member claim 1 , so as to allow the laser beam to pass through the feed surface.3. The device according to claim 2 , wherein the permeable portion is defined by a through opening.4. The device according to claim 2 , wherein the permeable portion ...

LASER APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

A laser apparatus and a method for manufacturing a display device are provided. A laser apparatus includes: a stage; a laser providing unit above the stage and configured to provide a laser beam; a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; and a control unit to control an operation of the scanner, and the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation. 1. A laser apparatus comprising:a stage;a laser providing unit above the stage and configured to provide a laser beam;a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; anda control unit to control an operation of the scanner,wherein the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation.2. The laser apparatus of claim 1 , wherein the control unit calculates a processing area to which the laser beam is irradiated and a non-processing area to which the laser beam is not irradiated.3. The laser apparatus of claim 2 , wherein claim 2 , when a position of a target aiming point of the laser beam is located in the processing area claim 2 , the control unit controls to open the shutter if a moving speed of the target aiming point of the laser beam is higher than or equal to a reference speed claim 2 , and to close the shutter if the moving speed of the target aiming point of the laser beam is lower than the reference speed.4. The laser apparatus of claim 3 , wherein the control unit controls to close the shutter when the position of the target aiming point of the laser beam is located in the non-processing area.5. The laser apparatus of claim 3 , wherein a number of scans of the laser beam per ...

LONG AND HIGH RESOLUTION STRUCTURES FORMED BY ADDITIVE MANUFACTURING TECHNIQUES

A method of additive manufacture suitable for large and high resolution structures is disclosed. The method may include sequentially advancing each portion of a continuous part in the longitudinal direction from a first zone to a second zone. In the first zone, selected granules of a granular material may be amalgamated. In the second zone, unamalgamated granules of the granular material may be removed. The method may further include advancing a first portion of the continuous part from the second zone to a third zone while (1) a last portion of the continuous part is formed within the first zone and (2) the first portion is maintained in the same position in the lateral and transverse directions that the first portion occupied within the first zone and the second zone. 1. An apparatus for additive manufacture in a three-dimensional space corresponding to longitudinal , lateral , and transverse directions that are orthogonal to one another , the apparatus comprising:a conveyor configured to sequentially advance each portion of a continuous part in the longitudinal direction from a first zone to a second zone;an energy patterning system configured to amalgamate, within the first zone, selected granules of a granular material with unamalgamated granules of the granular material removed within the second zone, wherein the conveyor is configured to advance a first portion of the continuous part from the second zone to a third zone while (1) a last portion of the continuous part is formed within the first zone and (2) the first portion is maintained in the same position in the lateral and transverse directions that the first portion occupied within the first zone and the second zone; anda processor configured to determine a current position or orientation of the continuous part by locating one or more features of a feature map in an intersecting wall that intersects two neighboring portions of the continuous part,wherein, in amalgamating the selected granules of the ...

Laser marking system and method for laser marking a workpiece

A laser marking system for marking a predetermined pattern on a workpiece may include a first light source structured to emit first light at a first wavelength; a second light source structured to emit second light at a second wavelength different from the first wavelength and selected to mark a marking surface of the workpiece; beam shaping optics structured to adjust a focal length of the second light; beam steering optics structured to aim the first laser light and the second laser light; a controller configured to control the first light source to emit the first light at the marking surface of the workpiece and control the beam steering optics to aim the second light so as to mark the marking surface of the workpiece and create the first predetermined pattern; and a camera structured to detect first light reflected from the marking surface and record an image.

LASER WELDING OF TRANSPARENT WORKPIECES

Methods and devices for laser welding of mutually overlapping workpieces by pulsed laser beams, for example, Ultrashort-pulsed (USP) laser beams, are provided. In one aspect, a method includes directing a pulsed laser beam through one workpiece onto the other workpiece and moving the pulsed laser beam in a feed direction relative to the two workpieces to produce a weld seam between the two workpieces bearing against one another. A deflection back and forth of the pulsed laser beam directed transversely or parallel to the feed direction is superposed on the pulsed laser beam moved in the feed direction. 1. A method of laser welding of two mutually overlapping workpieces by a pulsed laser beam , the method comprising:directing the pulsed laser beam through a first workpiece onto a second workpiece, the first and second workpieces mutually overlapping each other; andmoving the pulsed laser beam in a feed direction relative to the first and second workpieces to produce a weld seam between the first and second workpieces,wherein a deflection back and forth of the pulsed laser beam directed transversely or parallel to the feed direction is superposed on the pulsed laser beam moved in the feed direction.2. The method of claim 1 , wherein at least one of the first workpiece or the second workpiece is formed from at least one of glass claim 1 , polymer claim 1 , or glass ceramic.3. The method of claim 2 , wherein the at least one of the first workpiece or the second workpiece is formed partially with an opaque material.4. The method of claim 1 , wherein at least one of the first workpiece or the second workpiece has a transparency of at least 90% at a laser wavelength of the pulsed laser beam.5. The method of claim 1 , wherein the first and second workpieces are moved exclusively in the feed direction and at the same time the laser beam is deflected back and forth exclusively transversely or parallel to the feed direction.6. The method of claim 1 , wherein the first and ...

LASER MACHINING ROBOT SYSTEM

A laser machining robot system that simplifies programming of a scanner operation is provided. A laser machining robot system includes a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner. The robot controller includes: a machining information input unit that inputs machining information; a G-code generation unit that generates a G-code program using the machining information; and a G-code communication unit that transmits the G-code program to the scanner controller. The scanner controller includes a scanner program processing unit that applies the G-code program as a scanner operation program for operating the scanner. 1. A laser machining robot system including a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner , whereinthe robot controller includes:a machining information input unit that inputs machining information;a G-code generation unit that generates a G-code program using the machining information; anda G-code communication unit that transmits the G-code program to the scanner controller, andthe scanner controller includes a scanner program processing unit that applies the G-code program as a scanner operation program for operating the scanner.2. The laser machining robot system according to claim 1 , whereinthe robot controller further includes a storage unit that stores a template program, andthe G-code generation unit generates the G-code program by editing the template program stored in the storage unit using the machining information.3. A laser machining robot system including a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner claim 1 , whereinthe robot controller includes:a machining information input unit that inputs machining information; anda machining information communication unit that transmits the machining information to ...

MANUFACTURING METHODS FOR MULTI-LOBED COOLING HOLES

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof. 1. A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface , the method comprising:forming a cooling hole inlet at the first wall surface;forming a cooling hole outlet at the second wall surface;forming a metering section downstream from the inlet; andforming a multi-lobed diffusing section between the metering section and the outlet,wherein the inlet, outlet, metering section and multi-lobed diffusing section are formed by a technique selected from the group consisting of laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.2. The method of claim 1 , wherein the wall comprises a metal or superalloy substrate.3. The method of claim 1 , wherein the second wall surface comprises a coating claim 1 , and wherein at least a portion of the cooling hole extends through the coating.4. The method of claim 3 , wherein the coating comprises:a bond coating; anda thermal barrier coating.5. The method of claim 4 , wherein a portion of the diffusing section is located within the coating.6. The method of claim 5 , wherein the entire diffusing section is located within the coating.7. The method of claim 6 , wherein a portion of the metering section is located within the coating.8. The method of claim 1 , wherein the inlet and metering section ...

METHOD FOR REFINING MAGNETIC DOMAIN OF GRAIN-ORIENTED ELECTRICAL STEEL SHEET, AND DEVICE THEREFOR

Provided is a method and device for refining a magnetic domain of a grain-oriented electrical steel plate. The magnetic domain refining method of a grain-oriented electrical steel plate for stable permanent magnetic domain refining processing even if a steel plate is transferred at high speed of 2 m/s or more includes zigzag controlling for straightly transferring the steel plate without being inclined in right and left directions along a production line center, tension controlling for applying tension to the steel plate to maintain the steel plate in a flat state, steel plate support roll position adjusting for controlling a predetermined position of the steel plate in up and down directions while supporting the steel plate, and laser irradiating for irradiating a laser beam to melt the steel plate to form a groove in a surface of the steel plate. 1. A magnetic domain refining method of a grain-oriented electrical steel plate for stable permanent magnetic domain refining processing even if a steel plate is transferred at high speed of 2 m/s or more , the method comprising:zigzag controlling for straightly transferring the steel plate without being inclined in right and left directions along a production line center;tension controlling for applying tension to the steel plate to maintain the steel plate in a flat state;steel plate support roll position adjusting for controlling a predetermined position of the steel plate in up and down directions while supporting the steel plate; andlaser irradiating for irradiating a laser beam to melt the steel plate to form a groove in a surface of the steel plate.2. A magnetic domain refining method of a grain-oriented electrical steel plate for stable permanent magnetic domain refining processing even if a steel plate is transferred at high speed of 2 m/s or more , the method comprising:tension controlling for applying tension to the steel plate to maintain the steel plate in a flat state;steel plate support roll position ...

PATTERNED THIN FILMS BY THERMALLY INDUCED MASS DISPLACEMENT

The described invention provides a method of patterning a thin film deposited on a substrate comprising applying a moving focused field of thermal energy to the thin film deposited on the substrate; and dewetting the thin film from the substrate. Dewetting the thin film from the substrate is characterized by a negative space of a desired design; and displacement of the thin film into adjacent structures, thereby accumulating thin film in the adjacent structures. 1. A method of patterning a thin film deposited on a substrate comprising:(A) applying a moving focused field of thermal energy to the thin film deposited on the substrate; and(B) dewetting the thin film from the substrate, (i) a negative space of a desired design; and', '(ii) displacement of the thin film into adjacent structures, thereby accumulating thin film in the adjacent structures., 'the dewetting being characterized by2. The method according to claim 1 , wherein the focused field of thermal energy is from a laser.3. The method according to claim 1 , wherein the focused field of thermal energy is at a wavelength matched to the wavelength absorbed by the thin film.4. The method according to claim 3 , wherein the wavelength is not absorbed by the substrate.5. The method according to claim 1 , wherein the thin film is an inorganic compound.6. The method according to claim 1 , wherein the thin film is comprised of a metal or metal alloy.7. The method according to claim 6 , wherein the metal is comprised of bismuth.8. The method according to claim 6 , wherein the metal is comprised tin.9. The method according to claim 1 , wherein the substrate is an inorganic substance.10. The method according to claim 9 , wherein the inorganic substance is selected from the group consisting of glass claim 9 , ceramic claim 9 , silicon oxide and silicon nitride.11. The method according to claim 10 , wherein the inorganic substance is glass.12. The method according to claim 11 , wherein the glass is borosilicate glass.13. ...

Si SUBSTRATE MANUFACTURING METHOD

An Si substrate manufacturing method includes a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to Si to a depth, equivalent to a thickness of an Si substrate to be manufactured, from a flat surface of an Si ingot and irradiating the Si ingot with the laser beam while relatively moving the focal point and the Si ingot in a direction < parallel to a cross line at which a crystal plane { and a crystal plane { intersect or a direction [ orthogonal to the cross line, and an indexing feed step of executing indexing feed of the focal point and the Si ingot relatively in a direction orthogonal to a direction in which the separation band is formed. 1100. A silicon substrate manufacturing method for manufacturing a silicon substrate from a silicon ingot in which a crystal plane () is made to be a flat surface , the silicon substrate manufacturing method comprising:{'b': 110', '100', '111', '110, 'a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to silicon to a depth equivalent to a thickness of the silicon substrate to be manufactured from the flat surface and irradiating the silicon ingot with the laser beam while relatively moving the focal point and the silicon ingot in a direction <> parallel to a cross line at which a crystal plane {} and a crystal plane {} intersect or a direction [] orthogonal to the cross line;'}an indexing feed step of executing indexing feed of the focal point and the silicon ingot relatively in a direction orthogonal to a direction in which the separation band is formed; and{'b': '100', 'a wafer manufacturing step of repeatedly executing the separation band forming step and the indexing feed step to form a separation layer parallel to the crystal plane () as a whole inside the silicon ingot and separating the silicon ...

Golf club head hosel marking

A method and a related system of forming laser etched indicia on an external surface of the golf club. The method includes directing a laser beam onto a golf club head, and etching a prescribed indicia into the golf club head. The etching is generated by at least one of: (i) rotating the golf club head relative to the laser beam; and (ii) rotating the laser beam relative to the golf club head.

Laser filamentation

The invention relates to a method and a device for separating the excess glass (32) in the production of hollow glass products (12), wherein the method comprises: centring a hollow glass product (12) in a receiving device (10), which is designed to hold the hollow glass (12) and to rotate about a rotational axis in such a way that a separation line (24) along which the excess glass (32) is to be separated from the hollow glass product (12) to be produced is centred in relation to the rotational axis; processing the hollow glass product (12) in a plurality of positions along the separation line (24) by means of a laser beam in order to generate local filaments with a weakened glass structure during a rotation of the hollow glass product (12) about the rotational axis; and introducing energy along the separation line (24) in order to separate the excess glass (32) along the weakened glass structure.

LASER MACHINING DEVICE

There is provided a laser machining device including a heat radiation measurement unit that measures intensity of heat radiation of a workpiece irradiated with a laser beam, and a determination unit that determines a state of a target by defining an object used in machining work as the target, based on the intensity of the heat radiation measured by the heat radiation measurement unit. 1. A laser machining device comprising:a heat radiation measurement unit that measures intensity of heat radiation of a workpiece irradiated with a laser beam; anda determination unit that determines a state of a target by defining an object used in machining work as the target, based on the intensity of the heat radiation measured by the heat radiation measurement unit.2. The laser machining device according to claim 1 ,wherein the determination unit determines the state of the target which relates to intensity of the laser beam.3. The laser machining device according to claim 1 ,wherein the determination unit determines whether or not the target is abnormal.4. The laser machining device according to claim 1 , further comprising:a control unit that controls the state of the target, based on the state of the target which is determined by the determination unit.5. The laser machining device according to claim 1 , further comprising:a scanning unit that changes an irradiation position of the workpiece irradiated with the laser beam,wherein the target is the workpiece, andwherein the determination unit determines an abnormal location of the workpiece, based on the intensity of the heat radiation measured by the heat radiation measurement unit.6. The laser machining device according to claim 5 ,wherein the determination unit determines whether or not a first position or the vicinity of the first position of the workpiece is abnormal, based on a comparison between the intensity of the heat radiation obtained when the first position of the workpiece is irradiated with the laser beam and the ...

CALIBRATED LASER PRINTING METHOD

The present disclosure relates to a calibrated laser printing method, which is a pre-laser machining operation of wafers and comprises steps as follows: a piece of calibration glass is carried and leveled by a leveling system; a plurality of target points are marked on the piece of calibration glass by a laser system based on data of default positions of the plurality of target points on the piece of calibration glass; true positions of the target points on the piece of calibration glass are measured by an image system; data of measured true positions is transmitted to a resetting system; the piece of calibration glass is shifted to a next location by a displacement system on which the leveling system is carried for repetitive executions of above steps in the case of measurement not completed; data between default and true positions of the target points is compared; a reflecting mirror is deflected by an angle for calibrations of laser beams projected on a wafer in the case of any offset between default and true positions of the target points out of specification. 1. A calibrated laser printing method , comprising steps as follows:(a) a piece of calibration glass is carried and leveled by a leveling system;(b) a plurality of target points are marked on the piece of calibration glass by a laser system based on data of default positions of the plurality of target points on the piece of calibration glass;(c) true positions of the target points on the piece of calibration glass are measured by an image system;(d) data of measured true positions is transmitted to a resetting system;(e) the piece of calibration glass is shifted to a next location by a displacement system on which the leveling system is carried for repetitive executions from (b) to (e);(f) data between default and true positions of the target points is compared;(g) a reflecting mirror is deflected by an angle for calibrations of laser beams projected on a wafer in the case of any offset between default and ...

ADJUSTMENT ASSISTANCE DEVICE AND LASER WELDING APPARATUS

An adjustment assistance device is attached to a galvanometer scanner at a laser output side of the galvanometer scanner and used to adjust a tool coordinate system of the galvanometer scanner. The adjustment assistance device includes a light-receiving member having a light-receiving surface, which is at least one flat surface; and a connecting member that connects the light-receiving member to the galvanometer scanner and that enables the light-receiving surface to face a laser output port of the galvanometer scanner with a predetermined distance therebetween. The light-receiving member includes a light-receiving mark portion on the light-receiving surface, the light-receiving mark portion being a mark used to quantify a relative positional difference between a reference light-receiving position for light output from the laser output port and an actual light-receiving position at which the light output from the laser output port is received. 1. An adjustment assistance device attached to a galvanometer scanner at a laser output side of the galvanometer scanner and used to adjust a tool coordinate system of the galvanometer scanner , the adjustment assistance device comprising:a light-receiving member having a light-receiving surface, which is at least one flat surface; anda connecting member that connects the light-receiving member to the galvanometer scanner, the connecting member enabling the light-receiving surface to face a laser output port of the galvanometer scanner with a predetermined distance therebetween,wherein the light-receiving member includes a light-receiving mark portion on the light-receiving surface, the light-receiving mark portion being a mark used to quantify a relative positional difference between a reference light-receiving position for light output from the laser output port and an actual light-receiving position at which the light output from the laser output port is received.2. The adjustment assistance device according to claim 1 , ...

PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR ELEMENT MANUFACTURING METHOD, SEMICONDUCTOR LASER ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR LASER ELEMENT

A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction. 1. A puncture forming method of forming a puncture in a sample by irradiating a surface of the sample with a light beam , the puncture forming method comprising:forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; andforming a second puncture by irradiating a second position on the surface of the sample with a second pulse of the light beam after the forming of the first puncture, the second puncture at least partially overlapping the first puncture, the second position being positioned away from the first position in a first direction,wherein the second puncture has a tip positioned inside the sample, the tip being bent in a direction opposite to the first direction.2. The puncture forming method according to claim 1 ,wherein the light beam is polarized in a direction perpendicular to the first direction.3. The puncture forming method according to claim 1 ,wherein the light beam is a laser beam.4. A semiconductor element manufacturing method of manufacturing a semiconductor element by separating a semiconductor element substrate claim 1 , the semiconductor element manufacturing method comprising:forming a first puncture by irradiating a first position on a surface of the semiconductor element ...

Scanned pulse anneal apparatus and methods

Apparatus, system, and method for thermally treating a substrate. A source of pulsed electromagnetic energy can produce pulses at a rate of at least 100 Hz. A movable substrate support can move a substrate relative to the pulses of electromagnetic energy. An optical system can be disposed between the energy source and the movable substrate support, and can include components to shape the pulses of electromagnetic energy toward a rectangular profile. A controller can command the source of electromagnetic energy to produce pulses of energy at a selected pulse rate. The controller can also command the movable substrate support to scan in a direction parallel to a selected edge of the rectangular profile at a selected speed such that every point along a line parallel to the selected edge receives a predetermined number of pulses of electromagnetic energy.

METHOD AND DEVICE FOR LASER MACHINING A SUBSTRATE WITH MULTIPLE LASER RADIATION DEFLECTION

A method and device for laser machining a substrate, involves deflecting the laser radiation using a galvanometer scanner and an electro-optical deflector. The laser radiation thus deflected multiple times is then directed at a machining position on the substrate. By superposing an additional beam deflection by the electro-optical deflector onto the advance movement in the machining direction, which deflector is operated with steady oscillation excitation for this purpose, the resultant beam deflection follows a circular revolving path. In the process, the series of pulses of a pulsed radiation source is restricted to individual or a plurality of machining positions on the substrate, and forms for example a cutting front so as to thus quickly and reliably produce a kerf having the desired width. 1. A laser machining method for machining a substrate by laser radiation from a mode-coupled laser beam source , the method comprising:deflecting laser radiation two or more times using at least one first deflection unit including a galvanometer scanner and using at least one second deflection unit including an electro-optical deflector; anddirecting radiation at a machining position on the substrate,wherein the laser radiation is deflected using the electro-optical deflector as the electro-optical deflector is moved along a closed revolving path, and in thatwherein a pulse frequency of the laser radiation from a mode-coupled pulsed laser radiation source is controlled such that the machining position on the substrate follows the closed revolving path in a predetermined region depending on the pulse frequency of the laser radiation by means of single pulses and/or a series of pulses.2. The method of claim 1 , wherein the laser radiation is deflected onto the substrate in a manner restricted to a portion of a full revolution on the revolving path.3. The method of claim 1 , wherein the laser radiation is deflected into a particular machining position on the substrate according ...

ARRANGEMENT FOR CLEANING BAKING SURFACES

A laser arrangement cleans baking surfaces configured in a relief-like manner and optionally cleans evaporation and/or sealing strips of baking plates of a baking machine. The laser arrangement has a laser source for outputting a laser beam onto a locally selectable target area by continuous variation of the output direction of the laser beam and traversing a contour forming the target area. Deflecting optics are arranged at a distance from the laser source and in the target area of the laser source for deflecting the laser beam and for projecting the target area formed by the contour onto the baking plate to be cleaned along a projection direction. The deflecting optics has a device for adjustment for varying the projection direction and the outlet direction of the laser beam. 118-. (canceled)19. A configuration , comprising:a baking device with an endless conveyor;a loading device;a first device;a heated baking chamber;a second device;a product removal device;baking tongs disposed on said endless conveyor, said baking tongs each having evaporation and/or sealing strips and baking plates including a lower plate and an upper plate connected pivotably to said lower plate, said baking plates having baking surfaces, said baking tongs are each conveyed successively along said endless conveyor from said loading device for application of a baking mass into an opened baking tong, to said first device for closing a baking tong, through said heated baking chamber, further to said second device for opening said baking tong, and then to said product removal device for removing baked products from the baking tong; a laser source for outputting a laser beam onto a locally selectable target area by continuous variation of an output direction of the laser beam and traversing a contour defining the target area;', 'deflecting optics disposed at a distance from said laser source and in said target area of said laser source for deflecting the laser beam and for projection of the ...

APPARATUSES AND METHODS FOR ACCURATE STRUCTURE MARKING AND MARKING-ASSISTED STRUCTURE LOCATING

Working equipment includes a tool configured to work a structure at a working location thereon, with the structure having an applied marking at a known location with a known relationship with the working location. A computer system is configured to determine placement of the structure, and accordingly position the tool into at least partial alignment with the working location, and which in at least one instance, the tool is aligned with a second, offset location. A camera is configured to capture an image of the structure and including the marking, and further including the second location with which the tool is aligned. And the computer system is configured to process the image to locate the working location, reposition the tool from the second location and into greater alignment with the located working location, and control the repositioned tool to work the structure at the located working location. 1. A working equipment comprising:a tool configured to work a structure at a working location thereon, the structure having a permanent marking applied thereto at a known location with a known relationship with the working location;a computer system coupled to the tool and configured to determine placement of the structure, and position the tool into at least partial alignment with the working location according to the placement, the tool in at least one instance being aligned with a second location offset from the working location; anda camera coupled of the computer system and configured to capture an image of at least a portion of the structure and including the permanent marking, and further including the second location with which the tool is aligned,wherein the computer system is configured to process the image to locate the working location, reposition the tool from the second location and into greater alignment with the located working location, and control the repositioned tool to work the structure at the located working location.2. The working equipment of ...

Method of manufacturing boron coated straws for neutron detection through spiral winding and welding

A method and apparatus are disclosed with a continuous straw forming process for spiral winding boron-coated foil into a rounded tube or cylinder with an overlap and tight contact between the spiral edges, and a welding process utilizing a high precision fiber laser to weld the spiral seem forming a straw tube.

SIMULTANEOUS PATTERN-SCAN PLACEMENT DURING SAMPLE PROCESSING

A laser ablation system, and method, facilitates the execution of user-defined scans (i.e., in which a laser beam is scanned across a sample along a beam trajectory to ablate or dissociate a portion of the sample) and enables the user define additional scans while a scan is being executed. 1. A method for use with a laser ablation system having a sample chamber accommodating a sample within an interior thereof , a laser configured to generate a laser beam having parameters suitable for ablating or otherwise dissociating a portion of the sample within the sample chamber , and at least one scanning component configured to impart relative movement between the sample and the laser beam , the method comprising:processing image data, representative of obtained imagery of the sample, to generate location data, the location data associating at least one location within the obtained imagery with at least one corresponding spatial location within the interior of the sample chamber;controlling an operation of at least one selected from the group consisting of the laser and the at least one scanning component to execute a first scan in a first region-of-interest of the sample where the sample is to be ablated or otherwise dissociated by the laser beam; andwhile controlling an operation of at least one of the laser and the motion stage to execute the first scan, generating and storing scan data defining a second scan to be executed in a second region-of-interest of the sample where the sample is to be ablated or otherwise dissociated by the laser beam.2. The method of claim 1 , prior to controlling the operation of at least one of the laser and the at least one scanning component to execute the first scan claim 1 , generating and storing scan data defining the first scan.3. The method of claim 1 , further comprising generating and storing scan data defining the first scan in response receiving user input obtained through a user interface.4. The method of claim 1 , after ...

Laser welding systems for aluminum alloys and methods of laser welding aluminum alloys

Systems and methods of a laser welding device to weld aluminum are disclosed. The device includes a laser generator to generate welding-type lasing power and a lens to focus the welding-type lasing power at a focal point on an aluminum workpiece to generate a weld puddle. A laser scanner to control the lens to move the focal point of the welding-type lasing power in multiple dimensions over the aluminum workpiece during welding, the laser generator and the laser scanner to perform the welding without filler metal being added to the workpiece.

Syringe and gasket systems

A process for producing gaskets with an improved channel for use in matched syringe and plunger systems, preferably prefilled plastic syringe systems. In particular, an improved process for making and inspecting continuous channels in a gasket film by laser treatment. The gaskets are useful in matched syringe and plunger systems with high and consistent container closure integrity (CCI), and consistent break loose and glide forces over time, and sealability.

Machining Apparatus for Laser Machining a Workpiece, Set of Parts for a Machining Apparatus for Laser Machining a Workpiece and Method for Laser Machining a Workpiece using such Machining Apparatus

A machining apparatus for laser machining a workpiece () in a machining zone () is provided, having a first interface () for a machining laser source for generating a machining laser beam (), an outlet opening () for the machining laser beam (), In an optical system between the first interface () and the outlet opening (), which has at least one laser beam guiding device () having at least one movable surface () and at least one actuator (), with which the movable surface () is dynamically adjustable, and a cooling device () for cooling the at least one actuator (), wherein the cooling device () has at least one primary circuit () through which a first cooling fluid can flow without contact with the actuator (). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece () and a method of laser machining a workpiece () using such machining apparatus are also provided. 117-. (canceled)18. A machining apparatus for laser machining a workpiece in a machining zone , in particular for laser cutting , in particular a laser machining head , having a first interface for a machining laser source for generating a machining laser beam;an outlet opening for the machining laser beam;an optical system between the first interface and the outlet opening, which has at least one laser beam guiding device having at least one movable surface and at least one actuator, with which the movable surface is dynamically adjustable; anda cooling device for cooling the at least one actuator, wherein the cooling device has at least one primary circuit through which a first cooling fluid can flow without contact with the actuator;characterized in that the cooling device has a closed secondary circuit, through which a second cooling fluid can flow in contact with the actuator and which can be cooled by a first of the primary circuits.19. The machining apparatus according to claim 18 ,wherein the cooling device has at least one element selected from an interior, in which ...

Method and system for laser hardening of a surface of a workplace

A method of laser hardening a surface area of a workpiece, such as a surface of a journal of a crankshaft, includes the step of: generating a relative movement between the surface of the workpiece and a laser source to allow a laser spot to subsequently be projected onto different portions of said surface area. The method also includes the step of repetitively scanning the laser beam so as to produce a two-dimensional equivalent effective laser spot on said surface area, during the relative movement. The scanning pattern can include at least three substantially parallel lines which the laser spot follows in a certain order. When the workpiece includes several journals having different widths, two laser sources may be used to harden the surface area of the wider journals.

Laser machining apparatus that machines surface of workpiece by irradiating laser beam thereon

In a laser machining apparatus, a scanner is configured to scan a laser beam emitted from a laser beam emission device. A first part of a workpiece is exposed through an opening formed in the workpiece. A controller is configured to perform: acquiring shape data indicative of a shape of the workpiece; acquiring machining pattern data indicative of a machining pattern to be machined on the first part; acquiring a length of the machining pattern based on the machining pattern data; calculating an unmachinable position on a setting surface using the length and the shape data, the unmachinable position resulting from a second part of the workpiece hindering the laser beam reaching the first part, at least a part of the machining pattern being unmachinable on the first part in a state where the workpiece is set on the unmachinable position; and displaying the unmachinable position on a display.

Systems and Methods for Monitoring and/or Controlling Wobble-Processing Using Inline Coherent Imaging (ICI)

A system and method may be used to monitor and/or control material processing where a process beam is moved in a wobble pattern, such as a wobble-welding process. While at least one process beam is moved according to a wobble pattern on a processing site (e.g., a weld site) of a workpiece, an ICI system moves an imaging beam at least partially independently of the process beam to one or more measurement locations on the wobble pattern and obtains ICI measurements (e.g., depth measurements) at those locations. The ICI measurement(s) may be used, for example, to evaluate keyhole and/or melt pool characteristics during a welding process. Although the present application describes wobble welding processes, the systems and methods described herein may also be used with other material processing applications where a laser or other energy beam is wobbled or dithered during processing including, without limitation, additive manufacturing, marking and material removal. 1. A laser material processing system comprising:a material modification beam source for generating a process beam;a processing head coupled to the material modification beam source and including at least one process beam scanning actuator, for directing and moving the process beam according to a wobble pattern in at least one axis on a processing site of a workpiece;an inline coherent imaging (ICI) system optically coupled to the processing head, the ICI system including at least one imaging beam scanning actuator for positioning the imaging beam at least partially independently of the process beam; anda control system for controlling at least the material modification beam source, the process beam scanning actuator, and the imaging beam scanning actuator, wherein the control system is programmed to cause the processing head to scan the process beam in the wobble pattern, and wherein the control system is programmed to cause the imaging beam scanning actuator to move the imaging beam to a plurality of ...

Direct Address Laser Ablation

A system and method for selectively removing tire material from the bead portions of a cured tire to reduce one or more harmonics of at least one uniformity parameter are disclosed. According to aspects of the present disclosure, tire material is selectively removed using a plurality of direct address commands. The direct address commands specify ablation parameters for discrete ablation segments at specific angular locations around the bead of the tire. The direct address commands are generated by analyzing the desired ablation pattern for the bead of the tire. The ablation device can then be controlled to selectively remove tire material in discrete ablation segments at identified addresses pursuant to the direct address commands to achieve the desired ablation pattern on one or more tracks along the bead portion of the tire using a single pass of the ablation device. 115-. (canceled)16. A method for reducing one or more harmonics of at least one uniformity parameter in a tire , comprising:receiving a plurality of ablation patterns for a bead of a tire, each ablation pattern associated with a different track location on the bead of the tire in the bead seat, low flange zone and high flange zone, each ablation pattern defining a desired ablation depth relative to an angular location around the bead and calculated to correct for one or more harmonics of at least one uniformity parameter for the tire;identifying a plurality of addresses for the bead, each address being associated with a specific angular location on the bead of the tire;analyzing each ablation pattern to determine a plurality of direct address commands to achieve the plurality of ablation patterns, the plurality of direct address commands specifying ablation parameters for a plurality of discrete ablation segments at one or more of the plurality of addresses along the bead of the tire;controlling the ablation device to selectively remove tire material from the bead in discrete ablation segments ...

LASER WELDING METHOD

Laser welding is performed while moving irradiation positions of a laser beam and a measurement beam in forward, rightward, rearward and leftward directions, and the penetration depth of a weld portion is measured during laser welding in each of the directions. Then, a direction in which a value smaller than a reference value is measured is determined to be an optical axis deviation direction, and a correction value is added to the values measured during the laser welding when the laser welding is performed in the optical axis deviation direction. 1. A laser welding method for welding a weld portion by using a laser beam , the method comprising:emitting, to the weld portion, the laser beam and a measurement beam coaxially aligned with the laser beam, the measurement beam having a wavelength different from a wavelength of the laser beam;performing laser welding while moving an irradiation position of the laser beam and an irradiation position of the measurement beam in at least a first direction, a second direction opposite to the first direction, a third direction crossing the first direction, or a fourth direction opposite to the third direction;measuring a penetration depth of the weld portion in accordance with the measurement beam reflected on the weld portion during the laser welding;determining an optical axis deviation direction in which an optical axis of the measurement beam deviates from the laser beam, by relatively comparing a plurality of values measured; andadding a predetermined correction value to the values measured during the laser welding when the laser welding is performed in the optical axis deviation direction.2. The laser welding method of claim 1 , whereinin the determining of the optical axis deviation direction, the plurality of values measured are compared with a predetermined reference value, and a direction in which a value smaller than the reference value is measured is determined to be the optical axis deviation direction.3. The laser ...

COMPOSITIONAL MODIFICATION OF GLASS ARTICLES THROUGH LASER HEATING AND METHODS FOR MAKING THE SAME

Glass articles and methods for modifying a composition of a surface portion of the glass article are disclosed. The method includes heating the surface portion of the glass article with a laser beam to a temperature within a range of about 1100?C to about 2200?C such that the heating evaporates one or more metalloids and/or one or more alkali metals present at the surface portion, and modifies the composition of the surface portion such that the surface portion has a lower alkali metals concentration and/or a lower metalloids concentration as compared to a portion of the glass article that is not heated by the laser beam. 1. A method of modifying a composition of a surface portion of a glass article , the method comprising heating the surface portion of the glass article with a laser beam to a temperature within a range of about 1100° C. to about 2200° C. , such that the heating evaporates one or more metalloids and/or one or more alkali metals present at the surface portion , and modifies the composition of the surface portion such that the surface portion comprises a lower alkali metals concentration and/or a lower metalloids concentration as compared to a portion of the glass article that is not heated by the laser beam.2. The method of claim 1 , further comprising preheating the glass article to a temperature within a range of about 50° C. to about 900° C. before heating the surface portion of the glass article with the laser beam.3. The method of claim 1 , wherein heating the surface portion of the glass article with the laser beam comprises scanning the laser beam along the surface portion of the glass article using a rotating polygon mirror.4. The method of any one of claim 1 , wherein the laser beam has a scan frequency within a range of about 10 kHz to about 100 Hz.5. The method of any one of claim 1 , wherein the laser beam is focused on the surface portion of the glass article using an f-theta lens.6. The method of any one of claim 1 , wherein the laser ...

METHOD FOR STRUCTURING A TRANSPARENT SUBSTRATE WITH A LASER IN A BURST MODE

Method for structuring a top surface of a transparent substrate, the substrate being transparent to visible light with a laser source able to emit a laser beam in a burst mode, the burst mode being characterized by a train of pulses comprising sets of laser pulses repeated over time; wherein each of the sets of laser pulses of the train of pulses comprises a first and second pulses with a time interval between them comprised between 5 ns to 50 ns, preferably between 10 ns to 40 ns, and more preferably about 25 ns; wherein each of the first and second pulses has an energy density on the top surface comprised between 0.5 nJ/umand 50 nJ/um; and wherein the train of pulses is able to structure the top surface. 1. A method for structuring a top surface of a transparent substrate , said substrate being transparent to visible light , the method comprising the steps of:(a) providing said transparent substrate with said top surface;(b) providing a laser machining device comprising a laser source able to emit a laser beam in a burst mode, said burst mode being characterized by a train of pulses comprising sets of laser pulses repeated over time; wherein said laser source is a femtosecond laser source;', 'wherein each of said sets of laser pulses of said train of pulses comprises a first and second pulse with a time interval between them between 5 ns to 50 ns;', {'sup': 2', '2, 'wherein each of said first and second pulses has an energy density on said top surface between 0.5 nJ/umand 50 nJ/um; and'}, 'wherein said train of pulses is configured to structure said top surface., '(c) using said laser source for irradiating said transparent substrate from the top surface with a laser beam according to said burst mode;'}2. The method according to further comprising claim 1 , before step (c) claim 1 , the additional step of:determining an ablation threshold of said transparent substrate being defined by an energy density per pulse;wherein said first and second pulses have an energy ...

METHOD AND DEVICE FOR MACHINING A ROTARY TOOL WITH A PLURALITY OF CUTTING BODIES

A rotary tool () working surface () includes a plurality of cutting bodies (). The rotary tool () can be driven about a rotational axis (R). The actual enveloping surface (HF) of the working surface () is ascertained by an optical measuring arrangement (). At least one other target variable (GS) is detected, which describes a microscopic parameter of the working surface (). The actual variable (GI) corresponding to each specified target variable (GS) is detected by the measuring arrangement (), and the deviation between the target variable (GS) and the actual variable (GI) is determined. If the actual enveloping surface (HF) lies outside of a specified target enveloping area (HR) or if a deviation (D) between an actual variable (GI) and the corresponding target variable (GS) is unacceptably large, selected first and/or second cutting bodies () are machined and/or removed by a laser device (). 12124. A method for machining a rotationally drivable rotary tool () comprising a plurality of cutting bodies () , which form at least one tool blade or a cutting area , the method comprising:{'b': 21', '21, 'specifying a target enveloping area (HR) for the rotary tool () about a rotational axis (R) of the rotary tool (),'}{'b': '24', 'i': 'a', 'determining one or more first cutting bodies (), which are to be machined and/or removed, having a position or shape that lies outside of specified tolerances,'}{'b': 24', '24, 'i': a', 'b, 'systematically machining and/or removing the first cutting bodies () and second cutting bodies ().'}2. The method according to further comprising:{'b': 21', '24', '24, 'specifying at least one further target variable (GS), which determines a cutting characteristic of the rotary tool () and which characterizes an individual cutting body () and/or a group of cutting bodies (),'}{'b': 24', '24, 'determining an actual variable (GI) for individual ones of the specified target variables (GS) of an individual cutting body () and/or a group of cutting ...

INSPECTING METHOD FOR INSPECTING INFLUENCE OF INSTALLATION ENVIRONMENT UPON PROCESSING APPARATUS

A method for inspecting the influence of an installation environment upon a processing apparatus includes setting a mark for specifying a relative positional relation between a chuck table and a processing unit, imaging the mark plural times by using an imaging unit when a moving unit is at rest, and detecting the position of the mark from an image and then determining whether or not the influence of the installation environment upon the processing apparatus is present based on whether the change in position of the mark is less than or more than a threshold. 1. An inspecting method for inspecting the influence of an installation environment upon a processing apparatus including a chuck table for holding a workpiece , a processing unit processing said workpiece held on said chuck table , moving mechanism for relatively moving said chuck table and said processing unit , and an imaging unit fixed to said processing unit to image said workpiece held on said chuck table , said inspecting method comprising:a mark setting step of setting a mark for specifying a relative positional relation between said chuck table and said processing unit;an imaging step of imaging said mark plural times by using said imaging unit in the condition where said moving mechanism is at rest; anda determining step of detecting the position of said mark from an image obtained by said imaging step and then determining whether or not the influence of said installation environment upon said processing apparatus is present;said determining step being performed in such a manner that when the amount of change in position of said mark is less than a threshold, it is determined that the relative positional relation between said chuck table and said processing unit is not influenced by said installation environment, whereas when the amount of change in position of said mark is greater than or equal to said threshold, it is determined that the relative positional relation between said chuck table and said ...

LIGHT CONTROL FILM FORMED WITH A SECURITY FEATURE

A light control film is described that is formed with at least one security feature therein. The security feature is not visible when the film is viewed at an incorrect angle. The security feature only becomes visible when the film is viewed at the correct viewing angle or range of viewing angles. A plurality of security features can be formed in the film at substantially the same location(s), but at different angles, so that each security feature only becomes visible when the film is viewed at the correct respective viewing angle or range of viewing angles. The light control film can be integrated into any type of document where resistance to counterfeiting and fraudulent alteration are important, such as plastic identification or credit cards, or passports. 1. A light control film having a plurality of micro light control structures formed in the film , and a first security feature formed in the micro light control structures , wherein the light control film is generally transparent or translucent at a primary viewing angle , the first security feature is not visible when the light control film is viewed at a first viewing angle , and the first security feature is visible when the light control film is viewed at a correct viewing angle or range of viewing angles.2. The light control film of claim 1 , further comprising a second security feature formed in the micro light control structures located in generally the same area and/or adjacent to the first security feature claim 1 , wherein the film is generally transparent or translucent at the primary viewing angle claim 1 , the second security feature is not visible when the light control film is viewed at the first viewing angle claim 1 , and the second security feature is visible when the light control film is viewed at a correct viewing angle or range of viewing angles claim 1 , the correct viewing angle or range of viewing angles at which the second security feature is visible is different than or the same as ...

METHOD FOR THE VACUUM LASER WELDING OF AN AT LEAST TWO-PART WORKPIECE

A method for the vacuum laser welding of an at least two-part workpiece includes a workpiece or a workpiece carrier, on which the workpiece is arranged, and a welding mask which are moved relatively toward one another and pressed against one another so that a welding chamber is enclosed and sealed in a gas-tight manner. The welding mask is rotatably mounted. The welding chamber is evacuated and an annular connecting region between at least two workpiece parts of the workpiece that is exposed to the vacuum in the welding chamber is welded by a laser beam. The workpiece or the workpiece carrier together with the workpiece and the welding mask are turned in relation to the welding mask holder. Air is admitted to the welding chamber and the workpiece or the workpiece carrier on which the workpiece is arranged and the welding mask are moved relatively away from one another. 1. A method for the vacuum laser welding of an at least two-part workpiece , the method comprising the steps of:(a) providing a workpiece or a workpiece carrier on which the workpiece is arranged, and providing a welding mask rotatably mounted in a welding mask holder;(b) forming a welding chamber that is enclosed and sealed in a gas-tight manner by moving the workpiece or the workpiece carrier and the welding mask relatively toward one another and pressing against one another;(c) evacuating the welding chamber;(d) welding by a laser beam an annular connecting region between at least two workpiece parts of the workpiece that is exposed to the vacuum in the welding chamber, wherein the laser beam propagates through the welding chamber, and wherein the workpiece or the workpiece carrier together with the workpiece and the welding mask are turned in relation to the welding mask holder;(e) admitting air to the welding chamber; and(f) moving the workpiece or the workpiece carrier on which the workpiece is arranged and the welding mask relatively away from one another.2. The vacuum laser welding method as ...

LASER WELDING APPARATUS AND LASER WELDING METHOD

A laser welding apparatus generates laser by a laser oscillator, converges the laser by a condenser lens, and applies the laser to an upper sheet and a lower sheet superposed together so as to weld the upper sheet and the lower sheet to each other. According to this apparatus, by laser irradiation, a melt pool Y is formed in the upper sheet and the lower sheet superposed together. Furthermore, by laser irradiation, the melt pool Y is caused to flow, and the upper sheet and the lower sheet are welded together. 1. A laser welding apparatus for welding a plurality of sheets adjacent to each other , comprising:a laser oscillator that generates laser; anda condenser lens that converges the laser,wherein the laser welding apparatus is configured to weld the plurality of sheets together by applying the laser to a first side of a first sheet from among the plurality of sheets so as to form a melt pool which penetrates completely through at least the first sheet, and applying the laser to the melt pool so that the melt pool flows.wherein the laser welding apparatus is further configured to scan the laser on the melt pool so as to cause a circumferential flow of the melt pool and to cause undulation in the flowing melt pool thereby gathering the melt pool due to surface tension generated in the melt pool, andwherein the undulation includes a portion of the melt pool extending away from the first sheet on a second side of the first sheet opposite the first side.2. The laser welding apparatus according to claim 1 , whereinthe laser welding apparatus is configured to cause the melt pool to flow by scanning the laser applied to the melt pool, by driving the condenser lens.3. The laser welding apparatus according to claim 1 , further comprisinga jig that is drivable while holding the plurality of sheets, whereinthe laser welding apparatus is configured to cause the melt pool to flow by scanning the laser applied to the melt pool, by driving the jig.4. The laser welding apparatus ...

APPARATUS AND METHOD FOR BEAM DIAGNOSIS ON LASER PROCESSING OPTICS

Apparatus for determining geometrical parameters of a laser beam includes an optical system, a device for output coupling radiation, a beam diagnostic device, and a reflector element. The optical system focuses the laser beam into a processing region. The device for output coupling radiation couples out radiation that runs through the optical system in a direction opposite to a direction of the laser beam. The reflector element has a first surface which is partially reflecting and curved, where the curvature is equal to a mean curvature of a wave front of the laser beam in a positioning region of the reflector element. 1. An apparatus for determining geometrical parameters of a laser beam , comprising:an optical system configured to focus the laser beam into a processing region,a device for output coupling of radiation that travels in a direction opposite to a direction of travel of the laser beam through the optical system,a beam diagnostic device, anda first reflector element with a first surface,wherein the first reflector element is placeable in a positioning region between the optical system and the processing region,wherein the first surface of the first reflector element is partially reflecting and is curved,wherein a curvature of the first surface is equal to a mean curvature of a wave front of a focused laser beam in the positioning region of the first reflector element, andwherein the focused laser beam is focused by the optical system.2. The apparatus according to claim 1 , wherein the first surface of the first reflector element is set concentrically to the wave front of the focused laser beam.3. The apparatus according to claim 1 , wherein a center of curvature of the first surface of the first reflector element is set to a target position of a laser beam focus of the focused laser beam.4. The apparatus according to claim 1 , further comprising a positioning apparatus claim 1 , wherein the first reflector element is coupled to the positioning apparatus ...

LASER-PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME

Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed. 1. A laser-processing apparatus , comprising:a laser source operative to generate a beam of laser energy, wherein the beam of laser energy is propagatable along a beam path;a first positioner arranged within the beam path, wherein the first positioner is operative to deflect the beam path; anda controller coupled to the first positioner,wherein the controller is configured to control an operation of the first positioner to deflect the beam path within a first primary angular range and within a second primary angular range, wherein the second primary angular range does not overlap the first angular range and is not contiguous with the first primary angular range, andwherein the controller is further configured to control an operation of the first positioner to deflect the beam path to a first plurality of angles within the first primary angular range and to a second plurality of angles within second primary angular range.2. The apparatus of claim 1 , wherein the laser source is operative to generate a beam of laser energy having a wavelength in the ultraviolet (UV) range of the electromagnetic spectrum.3. The apparatus of claim 1 , wherein the laser source is operative to generate a beam of laser energy having a ...

LASER WELDING OF METAL PIN PAIRS WITH TIME-DEPENDENT SCAN PATTERN AND ENERGY INPUT

A method for laser welding a pair of metal pins delivers a laser beam to a work-side of the pair of metal pins where a respective pair of surfaces of the metal pins are adjacent to each other and face in the same direction. The laser beam first traces a first path on the work-side to form a melt pool by keyhole welding. The first path crosses an interface between the metal pins. After tracing the first path, the laser beam is switched to trace a second path on the work-side with the laser beam at a delivered rate of energy per unit path length that is less than the one used for the first path. The second path crosses the interface and is within the first path. The method is well-suited for welding of hairpin and I-pin stators. 1. A method for laser welding a pair of metal pins , comprising the steps of:delivering a laser beam to a work-side of the pair of metal pins where a respective pair of surfaces of the metal pins are adjacent to each other and face in the same direction;tracing a first path on the work-side with the laser beam at a first delivered rate of energy per unit path length to form a melt pool by keyhole welding, the first path crossing an interface between the metal pins; andafter the tracing a first path step, tracing a second path on the work-side with the laser beam at a second delivered rate of energy per unit path length that is at most ⅔ of the first delivered rate of energy per unit path length, the second path crossing the interface and being within the first path.2. The method of claim 1 , comprising switching from the tracing a first path step to the tracing a second path step before a depth-to-width aspect ratio of a keyhole of the keyhole welding reaches a value of three.3. The method of claim 2 , further comprising keeping the depth-to-width aspect ratio at less than three throughout the tracing a first path step and the tracing a second path step.4. The method of claim 2 , further comprising keeping the depth-to-width aspect ratio at ...

METHOD AND SYSTEM FOR HEATING AN OBJECT USING AN ENERGY BEAM

A method of heating a portion of an object includes the steps of 1. A method of heating at least one selected portion of an object , the method including the following steps:projecting, with a device comprising a scanner, an energy beam onto a surface of the object so as to produce a primary spot on the surface, and repetitively scanning the beam in two dimensions in accordance with a scanning pattern so as to establish an effective spot on the surface, the effective spot having a two-dimensional energy distribution,displacing the effective spot in relation to the surface of the object to progressively heat the at least one selected portion of the object, wherein displacing the effective spot in relation to the surface of the object comprises displacing the effective spot following a track featuring at least one change of direction;whereinthe method includes maintaining the effective spot aligned with the track by modifying operation of the scanner in correspondence with the at least one change of direction.2. The method according to claim 1 , wherein the step of maintaining the effective spot aligned with the track is carried out without pivoting the device around any axis for the purpose of aligning the effective spot with the track.3. The method according to claim 1 , wherein the step of modifying operation of the scanner is carried out so as to turn the effective spot around an axis substantially aligned with the energy beam claim 1 , without turning the device and without turning the object around any axis substantially aligned with the energy beam.4. The method according to claim 1 , wherein the track extends in a plane claim 1 , and wherein the step of modifying operation of the scanner is carried out so as to turn the effective spot around an axis substantially perpendicular to the plane claim 1 , without turning the device and without turning the object around any axis substantially perpendicular to the plane.5. The method according to claim 1 , including ...

METHOD OF PREPARING AN ALUMINUM METAL PIECE FOR WELDING

A method of preparing aluminum metal pieces for welding, along with welded sheet metal assemblies formed from the prepared aluminum metal pieces. In one embodiment, a scanning beam of a laser is directed at an edge portion of the sheet metal piece such that a portion of the scanning beam is configured to impact an oxide layer at the edge portion. The laser is pulsed in a series of ablating pulses at the edge portion, with the ablating pulses creating an ablation plume that includes ablated material from the oxide layer of the primary surface and the peripheral surface of the edge portion. The ablation plume is analyzed, and ablation and analyzing continues until a threshold of at least one constituent in the ablation plume or the analysis plume is met or exceeded. One or more operating parameters of the laser are adjusted based on the analysis of the ablation plume or analysis plume. In some embodiments, two aluminum metal pieces are simultaneously prepared. 1. A method of preparing an aluminum metal piece for welding , the aluminum metal piece having an oxide layer , the method comprising the steps of:directing a beam of a laser at an edge portion of the aluminum metal piece such that a portion of the beam is configured to impact the oxide layer at the edge portion, wherein the edge portion includes at least a part of a primary surface of the aluminum metal piece, at least a part of a secondary surface of the aluminum metal piece, and at least a part of a peripheral surface of the aluminum metal piece, the peripheral surface being situated between the primary surface and the secondary surface;pulsing the laser in a series of cleaning pulses at the edge portion, wherein the cleaning pulses create a cleaning plume that includes ablated material from the oxide layer located at the primary surface and ablated material from the oxide layer located at the peripheral surface;analyzing the cleaning plume for the series of cleaning pulses or analyzing an analysis plume ...

Laser machining method and apparatus

A method of delivering a beam of laser-radiation to a workpiece for processing the workpiece comprises transmitting the beam twice through an acousto-optic modulator (AOM) crystal in opposite zero-order directions of the AOM at separate locations on the AOM crystal, before delivering the beam to the workpiece.

Chamber Systems For Additive Manufacturing

A method of additive manufacture is disclosed. The method may include creating, by a 3D printer contained within an enclosure, a part having a weight greater than or equal to 2,000 kilograms. A gas management system may maintain gaseous oxygen within the enclosure atmospheric level. In some embodiments, a wheeled vehicle may transport the part from inside the enclosure, through an airlock, as the airlock operates to buffer between a gaseous environment within the enclosure and a gaseous environment outside the enclosure, and to a location exterior to both the enclosure and the airlock. 1. A method of additive manufacture , the method comprising:operating a manufacturing facility comprising a first enclosure, a first machine contained within the first enclosure, a first gas management system, and an airlock, the airlock comprising an interior, a first door interfacing between the interior of the airlock and an interior of the first enclosure, and a second door interfacing between the interior of the airlock and an area exterior to the first enclosure;creating, by the first machine during the operating, a first part via a first process comprising additive manufacture using an energy beam to amalgamate selected portions of a powder located within the first enclosure;maintaining, by the first gas management system during the creating, gaseous oxygen within the first enclosure below atmospheric levels;transporting the first part from inside the first enclosure, through the airlock as the airlock operates to buffer between a gaseous environment within the first enclosure and a gaseous environment outside the first enclosure, and to the area; andcontinuously supporting the first part during the transporting.2. The method of claim 1 , wherein:the first part has a weight; andthe continuously supporting comprises continuously supporting, by a vehicle, conveyor system, railway, or belt during the transporting, the weight of the first part from inside the first enclosure, ...

LASER BEAM POSITIONING SYSTEM, LASER PROCESSING DEVICE AND CONTROL METHOD

A method is provided of controlling a laser processing device with at least one laser. The method includes setting an optical path of the laser processing device by at least one rotatable mirror; a first triggering of the laser at a first point in time so as to generate a first laser spot; continuously adjusting, the optical path of the laser processing device; and a second triggering of the laser at a second point in time so as to generate a second laser spot. The method also includes, before the second triggering: determining the second point in time so that the position of the second laser spot has a desired distance, along the path, to the position of the first laser spot. 1. A method of controlling a laser processing device having at least one laser , comprising:setting an optical path of the laser processing device by at least one deflection element, including at least one rotatable mirror, so that a path point which can be generated by a laser beam following the optical path lies on a desired path on or in an object;a first triggering of the laser at a first point in time so as to generate a first laser spot;adjusting, in particular continuously adjusting, the optical path of the laser processing device by the at least one rotatable mirror, so that a path point which can be generated by the laser beam following the optical path lies on the desired path;a second triggering of the laser at a second point in time so as to generate a second laser spot;wherein the method comprises the following step before the second triggering:determining the second point in time on the basis of at least one of a target position, a first or a higher time derivative thereof, and a first or a higher time derivative of an actual position of the path point of the optical path along the desired path, so that a position of the second laser spot has a desired distance, along the desired path, to a position of the first laser spot.2. The method according to claim 1 , wherein the second ...

RECHARGEABLE BATTERY AND MANUFACTURING METHOD THEREOF

A rechargeable battery and a manufacturing method of the same are provided, which can aid in preventing an electric short from occurring between electrode plates by forming a cutting portion of each on the electrode plates in the shape of a curved surface or a bead having a uniform thickness and/or a diameter sufficient to prevent or substantially prevent the cutting portion from piercing a separator separating the electrode plates from each other. In a present embodiment, the electrode assembly includes an electrode plate having a current collector plate, a coating portion having an electrically active material coated on the current collector plate, a non-coating portion formed at an edge of the current collector plate and not coated with the electrically active material, a cutting portion inwardly formed from the non-coating portion, and a curved portion formed along the cutting portion in a thickness direction of the non-coating portion. 1. A rechargeable battery comprising:a case;an electrode assembly in the case; anda terminal electrically connected to the electrode assembly and passing through the case, an electrode plate comprising a current collector plate,', 'a coating portion having an electrically active material coated on the current collector plate,', 'a non-coating portion formed at an edge of the current collector plate and not coated with the electrically active material,', 'a cutting portion inwardly formed from the non-coating portion, and', 'a curved portion formed along the cutting portion in a thickness direction of the non-coating portion., 'wherein the electrode assembly comprises'}2. The rechargeable battery of claim 1 , wherein the curved portion has a circular or oval section perpendicular to a lengthwise direction of the cutting portion.3. The rechargeable battery of claim 1 , wherein each of the cutting portion and the curved portion is bent at least one time.4. The rechargeable battery of claim 1 , wherein each of the cutting portion and ...