ЭЛЕКТРОПРОВОДЯЩАЯ КОМПОЗИЦИЯ

Изобретение относится к полимерным материалам с особыми электрическими свойствами. Оно может использоваться для изготовления электропроводящих покрытий или резистивных нагревателей. Технической задачей изобретения является повышение электропроводности композиции и расширение диапазона ее изменения. Осуществление изобретения достигается тем, что в качестве порошкового термопласта композиция содержит полиаминимидное связующее ПАИС-104, а в качестве проводящего наполнителя - нестехиометрические нитриды титана TiNX, где 0,5≤х≤0,95, при следующем соотношении компонентов, мас.%: порошкообразное связующее ПАИС-104 5-40, нитрид титана TiNX, где 0,5≤ х≤0,95 60-95. По сравнению с известными электропроводящими полимерными композициями увеличивается электропроводность и значительно расширяется диапазон ее изменения. Использование в качестве термопласта связующего ПАИС-104 позволяет увеличить температуру эксплуатации до 300-350oС. 2 табл.

ПОДШИПНИКОВЫЙ ЭЛЕМЕНТ

Изобретение относится к подшипниковому элементу с металлическим опорным телом, расположенным на нем слоем подшипникового металла, а также с расположенным поверх него слоем полимера, причем слой полимера включает в себя полиамидимидную смолу, дисульфид молибдена (MoS2) и графит. Подшипниковый элемент образован из металлического опорного тела, слоя металла, расположенного на опорном теле, слоя полимера расположенного поверх слоя металла, и также при необходимости другими слоями, расположенными между слоем металла и слоем полимера. Слой полимера включает в себя полиамидимидную смолу, дисульфид молибдена (MoS2) и графит. Причем доля полиамидимидной смолы выбрана из области с нижней границей 23,08 мас.% и верхней границей 35,78 мас.%, доля MoS2 выбрана из области с нижней границей 40,37 мас.% и верхней границей 48,08 мас.%, а доля графита выбрана из области с нижней границей 23,85 мас.% и верхней границей 28,85 мас.%. Технический результат: улучшение износостойкости, коррозионной стойкости и ...

ЧАСТИЧНО КРИСТАЛЛИЧЕСКОЕ ПЛАВКОЕ ПОЛИИМИДНОЕ СВЯЗУЮЩЕЕ И КОМПОЗИЦИЯ ДЛЯ ЕГО ПОЛУЧЕНИЯ

Изобретение относится к частично кристаллическому плавкому полиимидному связующему для термостойких композиционных материалов, применяемых при производстве термостойких материалов для авиации, автомобиле- и судостроении, строительства, а также к композиции для получения этого связующего. Композиция частично кристаллического плавкого полиимидного связующего содержит следующее соотношение компонентов в мас.%: 12-23 поли-[4,4'-бис(4''-N-фенокси)дифенил]амидокислоты, 0,01-8 ароматического бисфтальимида или смеси ароматических бисфтальимидов, остальное - амидный растворитель. Композиция представляет собой раствор в амидном растворителе поли-[4,4'-бис(4''-N-фенокси)дифенил]амидокислоты на основе ароматической тетракарбоновой кислоты, выбранной из ряда: 3,3',4,4'-дифенилоксидтетракарбоновая кислота, 3,3',4,4'-дифенилтетракарбоновая кислота, 1,3-бис(3',4-дикарбоксифенокси)бензол, и растворимого в амидных растворителях ароматического бисфтальимида или смеси произвольного состава растворимых в амидных ...

ТЕРМОПЛАСТИЧНАЯ ПОЛИЭФИРИМИДНАЯ КОМПОЗИЦИЯ С БАЗАЛЬТОВЫМ ВОЛОКНОМ

Изобретение относится к области химии высокомолекулярных соединений, а именно к применению термопластичной полиэфиримидной композиции с базальтовым волокном для литья под давлением, при этом композиция состоит из полиэфиримида, наполнителя - базальтового волокна и талька. Полученная термопластичная полиэфиримидная композиция с базальтовым волокном обладает улучшенным комплексом прочностных и термических свойств. 1 з.п. ф-лы, 1 табл., 7 пр.

ПОЛИМЕР С УЛУЧШЕННЫМИ ХАРАКТЕРИСТИКАМИ И СПОСОБ ЕГО ПОЛУЧЕНИЯ

Изобретение относится к способу обработки полиимида, используемого для таких продуктов как волокна, пленки, листы, блоки и другие конфигурации. Обработку осуществляют посредством временного увеличения подвижности цепей полиимида в течение цикла отверждения полиимида после инициирования отверждения полиимида и до завершения цикла отверждения. Временную подвижность цепей полиимида обеспечивают посредством введения пластификатора, выбранного из COи HO, либо путем воздействия импульсного электрического поля, либо путем воздействия ультразвукового облучения. Указанными способами обработки термореактивного полиимида получают полиимиды с термоокислительной стабильностью, меньшей или равной 2,2% потери массы при 650°F (343°C) при атмосферном давлении в течение 1000 ч, температурой стеклования в сухих условиях, большей или равной 700°F (371°C), и температурой стеклования в жарких/влажных условиях, большей или равной 690°F (366°C). 4 н.п. ф-лы, 1 ил.

МАЛЕИМИДНЫЕ СМОЛЫ

Изобретение относится к отверждаемой полимерной композиции, предназначенной для получения композита, и композиционному материалу. Отверждаемая полимерная композиция содержит следующие компоненты: (A) компонент, представляющий собой предшественник термореактивной бисмалеимидной смолы, полученный в результате реакции малеинового ангидрида и диамина, выбранного из толуолдиаминов, метилендианилинов, 1,3- и 1,4-фенилендиаминов, диаминодифенилизопропилиденов, диаминодифенилкетонов, диаминодифенилоксидов, диаминодифенилсульфидов и Cалкилендиаминов; (B) арилсульфонсодержащий бисмалеимидный компонент и (C) полиарилсульфоновый термопластичный агент, повышающий сопротивление разрушению, который не содержит малеимидных боковых и/или концевых групп. Компоненты композиции присутствуют в таком количестве, что в результате отверждения отвержденная смола имеет гомогенную морфологию. Композиционный материал содержит вышеуказанную полимерную композицию и армирующие волокна в концентрации от 30 до 70% мас.

ПОЛИИМИДНОЕ СВЯЗУЮЩЕЕ ДЛЯ АРМИРОВАННЫХ ПЛАСТИКОВ, ПРЕПРЕГ НА ЕГО ОСНОВЕ И ИЗДЕЛИЕ, ВЫПОЛНЕННОЕ ИЗ НЕГО

Изобретение относится к области получения полиимидов, а именно к области получения полиимидного связующего для армированных пластиков. Полиимидное связующее представляет собой продукт взаимодействия диангидрида бензофенон-3,3′-4,4′-тетракарбоновой кислоты и м-фенилендиамина и модифицирующую добавку - полидиметил(γ-аминопропилэтокси)фенилсилазан. Полиимидное связующее дополнительно содержит γ-аминопропилтриэтоксисилан в количестве 2-5 мас.%. Также изобретение относится области получения препрегов, представляющих собой полиимидное связующее в соответствии с изобретением и волокнистый материал. Полиимидное связующее в соответствии с изобретением способствует повышению теплостойкости и влагостойкости армированных пластиков и изделий из них. 3 н. и 1 з.п. ф-лы, 3 табл.

ПОЛИМЕРНЫЙ МАТЕРИАЛ

Изобретение относится к способу получения полимерного материала, к полимерному материалу и его применению для изготовления фасонных химически или биологически стойких материалов или изделий, предпочтительно целостных изделий, а также к способу формования таких материалов или изделий и полученным таким способом материалам или изделиям. Полимерный материал получают смешением посредством экструзии первого компонента и второго компонента при полном или практическом отсутствии воды. Первый компонент представляет собой один или несколько гидрофильных полимеров, выбранных из группы, в которую входят поливиниловые спирты, этиленвиниловые спирты, полигидроксиэтилметакрилаты, полиоксиды этилена, блок-полимеры алкоксиамидов, воздухопроницаемые термопластичные эластомеры и полиуретаны. Второй компонент представляет собой полиэтиленимин. Полученный полимерный материал одновременно обладает как воздухопроницаемостью, так и нейтрализующими свойствами, требуемыми для химически стойкого материала, например ...

АНТИФРИКЦИОННЫЙ КОМПОЗИЦИОННЫЙ МАТЕРИАЛ

Описывается новый антифрикционный композиционный материал, включающий фенольную смолу, графит и синтетическое волокно, отличающийся тем, что в качестве синтетического волокна он содержит полиоксадиазольное волокно или полипарафенилентерефталамидное или полиамидобензимидазольное волокно, в качестве фенольной смолы содержит фенолформальдегидную или крезолформальдегидную смолу и дополнительно содержит хлопчатобумажное волокно, а также оксид алюминия при следующем количественном содержании компонентов, мас.%: полиоксадиазольное или полипарафенилентерефталамидное, или полиамидобензимидазольное волокно - 25-57, фенолформальдегидная или крезолформальдегидная смола - 18-43, грабит - 1,5-16, хлопчатобумажное волокно - 6-42, оксид алюминия - 0,3-9. Технический результат - создание антифрикционного композиционного материала, имеющего низкий коэффициент трения, высокую устойчивость к расслоению во время эксплуатации при одновременном сохранении низкого износа, необходимой прочности и ударной вязкости ...

ПОЛИМЕРНАЯ КОМПОЗИЦИЯ ДЛЯ АНТИФРИКЦИОННОГО МАТЕРИАЛА И СПОСОБ ПОЛУЧЕНИЯ АНТИФРИКЦИОННОГО МАТЕРИАЛА

Полимерная композиция для антифрикционного материала и способ получения антифрикционного углеродного материала. Изобретение относится к композициям, служащим для изготовления деталей узлов трения, эксплуатируемых в жестких условиях: при температуре выше 300oC, а также при нагрузках выше 20 МПа в условиях сухого трения. В основу изобретения положена задача повышения устойчивости материала к воздействию высоких динамических нагрузок (т.е. увеличение нагрузочного предела его работоспособности, износостойкости и снижения коэффициента трения), упрощения способа получения материала. Решение поставленной задачи достигается тем, что антифрикционная полимерная композиция содержит в качестве связующего олигоимид с концевыми амидными группами в виде порошка, а графит в качестве наполнителя содержится в ней в смеси с окисью иттрия, при следующем соотношении компонентов, %: олигоимид с концевыми амидными группами 70 - 40, графит искусственный 29 - 58, окись иттрия 1 - 2. Упрощение способа получения ...

КОМПОЗИЦИЯ ДЛЯ ПОЛУЧЕНИЯ ПЕНОПОЛИИМИДНЫХ МАТЕРИАЛОВ

Изобретение относится к химии высокомолекулярных соединений. Изобретение может найти применение в авиации, автомобиле- и судостроении, строительстве, там, где существует потребность в легких прочных негорючих материалах. Изобретением решается задача создания пенополиимидных композиционных материалов на основе эластичных пен. Композиция включает связующее - форполимер, при термообработке которого получается эластичный пенополиимид, и наполнитель. Композиция отличается тем, что во-первых, она содержит в качестве связующего форполимер на основе смеси двух ароматических диаминов из ряда: 4,4'-диаминодифенилметан, м- и п-фенилендиамины, 4,4'-диаминодифениловый эфир, 4,4'-диаминодифенилсульфид, 4,4'-диаминодифенилсульфон, взятых в соотношении 0,2-0,8:0,8-0,2, и диэфира 3,3',4,4'-бензофенонтетракарбоновой кислоты и низшего алифатического спирта. Во-вторых, наполнитель в композиции - термостойкое волокно из ряда: аримидное, арамидное и углеродное. Соотношение компонентов, мас.%: связующее - 30- ...

ОЛИГОМЕР НА ОСНОВЕ БИСМАЛЕИНИМИДОВ И АЗОМЕТИНОВ И КОМПОЗИЦИОННЫЙ МАТЕРИАЛ НА ЕГО ОСНОВЕ

Изобретение относится к получению новых олигомеров на основе бисмалеинимидов и азаметинов общей формулы (см. рис.), где n = 2; a : b : c = (25 6) : (2 6) : 1 с мол. м. 1300 - 4000, а также к композиционному материалу, содержащему указанные олигомеры. Связующее используется в количестве 30 - 50 мас. ч. на 100 мас. ч. материала. Синтезированные олигомеры могут применяться как самостоятельно в качестве заливочных компаундов, покрытий, а также для получения композиционных материалов с температурой отверждения 200°С и с длительной работоспособностью при повышенной температуре (250 - 300°С) в том числе и в условиях повышенной влажности. 2 с.п. ф-лы, 2 табл.

Способ получения аппретированных стеклянных волокон и полимерный композиционный материал

Изобретение относится к области производства конструкционных изделий специального назначения в аддитивных технологиях. Предложены способ получения аппретированного стекловолокна путём нанесения аппрета, представляющего собой 3,4-толуилендиамин 1,0-3,5 мас.%, на стекловолокно из раствора с массовой концентрацией 0,21-0,73% в ацетоне с последующим ступенчатым подъёмом температуры до 60°C и одновременной отгонкой растворителя, аппретированное стеклянное волокно, полученное по предложенному способу, и полимерный композиционный материал, который содержит 80 мас.% полимерной матрицы на основе полиэфиримида и 20 мас.% предложенного аппретированного стеклянного волокна. Технический результат – улучшение прочности при сжатии создаваемого полимерного стекловолоконного композиционного материала, за счет введения аппретирующего компонента, который повышает смачиваемость наполнителя и увеличивает межмолекулярные взаимодействия между стеклянным волокном и полиэфиримидной матрицей. 3 н.п. ф-лы, 1 табл ...

Способ получения аппретированного стекловолокна и полимерно-стекловолоконная композиция

Изобретение относится к области производства конструкционных изделий в аддитивных технологиях. Предложены способ получения аппретированного стекловолокна путём нанесения аппрета, представляющего собой 1,3-диоксибензол 0,5-3,0 мас.%, на стекловолокно из раствора с массовой концентрацией 0,11–0,63% в ацетоне с последующим ступенчатым подъёмом температуры до 55 °C и одновременной отгонкой растворителя, аппретированное стеклянное волокно, полученное по предложенному способу, и полимерно-стекловолоконная композиция, которая содержит 80 мас.% полимерной матрицы на основе полиэфиримида и 20 мас.% предложенного аппретированного стеклянного волокна. Технический результат – улучшение модуля упругости и прочности при разрыве создаваемой полимерно-стекловолоконной композиции, за счёт введения аппретирующего компонента, который повышает смачиваемость наполнителя и увеличивает межмолекулярные взаимодействия между стеклянным волокном и полиэфиримидной матрицей. 3 н.п. ф-лы, 1 табл., 6 пр.

Способ получения аппретированных углеродных волокон и полиэфиримидный композит

Группа изобретений может быть использована в производстве изделий с помощью аддитивных технологий. Способ получения аппретированных углеродных волокон включает нанесение аппретирующего состава из раствора с последующей сушкой. Аппретирующий состав содержит 1-метил-2,5-диаминобензол и полиэфирэфиркетон на основе 4,4'-диоксидифенилпропана и 4,4'-дифторбензофенона. Предложен также полиэфиримидный углеволокнистый композит. Группа изобретений позволяет увеличить упругость и прочность при изгибе полиэфиримидного углеволокнистого композита. 2 н.п. ф-лы, 1 табл., 6 пр.

Способ получения аппретированного стекловолокна и полимерный композиционный материал на его основе

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Способ получения аппретированных стеклянных волокон и армированная ими полимерная композиция

Изобретение относится к способу получения аппретированных стеклянных волокон и армированных ими полимерных композиций, предназначенных для использования в качестве конструкционных полимерных материалов в аддитивных технологиях. Аппрет наносят на стеклянные волокна из раствора 4,4'диаминодифенилсульфона (ДАДФС) с массовой концентрацией 0,1-0,7 % в смеси органических растворителей: ацетона и изопропанола, и проводят ступенчатый подъём температуры в среде газообразного азота с одновременной отгонкой растворителя по режиму: 20°С – 25 мин, 30°С – 35 мин, 45°С – 20 мин, 55°С – 15 мин, 65°С – 30 мин, 85°С – 30 мин. Количество компонентов аппретированного волокна соответствует соотношению, мас.%: стекловолокно 96,5-99,5, ДАДФС 0,5-3,5. Полимерная композиция состоит из 80 мас.% полиэфиримида и 20 мас.% указанного аппретированного стекловолокна. Технический результат - улучшение прочности при сжатии полимерной композиции за счет введения аппретирующего компонента, который повышает смачиваемость наполнителя ...

ПОЛИМЕРНАЯ ВЛАГОЧУВСТВИТЕЛЬНАЯ КОМПОЗИЦИЯ ДЛЯ ДАТЧИКОВ ВЛАЖНОСТИ РЕЗИСТИВНОГО ТИПА

Изобретение относится к химии высокомолекулярных соединений, а именно к полимерным ВК, которые используются для изготовления датчиков влажности резистивного типа. Эти датчики находят применение в электронной промышленности, радиотехнике, сельском хозяйстве, энергетике. ВК получены на основе полиамидоимида формулы: с добавлением в качестве влагочувствительного вещества полиэтиленгликоля (ПЭГ) в соотношениях, мас.%: ПАИ с ММ (50oC 100) • 103 - 52,3-58,5; ПЭГ с ММ 400oC 2000 - 41,5-47,7. Заявленные датчики влажности работают в интервале 15-99% и обеспечивают линейную зависимость влагопоглощения и электропроводности в широком интервале температур - 0-85oС, что является обязательным условием эксплуатации датчиков. Температурная и абсолютная погрешности датчиков составляют соответственно 0,3%/oС, 2,0%, что в два раза меньше, чем у приведенных аналогов. 6 табл., 2 ил.

Способ получения аппретированных стеклянных волокон и полиэфиримидный композит

Группа изобретений может быть использована в производстве изделий с помощью аддитивных технологий. Способ получения аппретированных стеклянных волокон включает нанесение аппретирующего состава из раствора с последующей сушкой. Аппретирующий состав содержит п-тоилудендиамин и полиэфирэфиркетон на основе 4,4'-диоксидифенилпропана и 4,4'-дифторбензофенона. Предложен также полиэфиримидный композит. Группа изобретений позволяет увеличить прочность при изгибе полиэфиримидного композита, содержащего аппретированное стеклянное волокно. 2 н.п. ф-лы, 1 табл., 6 пр.

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Изобретение относится к способу получения полиакрилимидных пенопластов, используемых в формованных изделиях, в частности в ракетостроении, кораблестроении, автомобилестроении, а также в медицинской технике. Описан способ получения вспениваемых сшитых полимеров на основе композиции из смеси полиакриламида (ПАА), малеинового ангидрида (МА) и щавелевой кислоты (ЩК). Для получения изделия из порошкообразной композиции прессовали заготовку пенопласта в течение 15 мин при температуре 100±5°С и давлении 15-20 МПа. Затем плиты пресса охлаждали вместе с заготовкой до комнатной температуры. Вспенивание и отверждение заготовки пенопласта проводили в полуограниченном объеме в форме по заданному режиму: вспенивание и отверждение при температуре 230-270°С в течение 1-3 часов, с последующим доотверждением пенопласта при температуре 150-200°С в течение 1-3 часов. Технический результат - высокие физико-механические показатели пенопласта в сочетании с улучшенными эксплуатационными свойствами. 3 з.п. ф-лы ...

КОМПОЗИЦИЯ ФТАЛОНИТРИЛЬНОГО СВЯЗУЮЩЕГО ДЛЯ ПОЛИМЕРНЫХ КОМПОЗИЦИОННЫХ МАТЕРИАЛОВ, СПОСОБ ЕЕ ПОЛУЧЕНИЯ, СПОСОБ ПОЛУЧЕНИЯ ПОЛИМЕРНОГО КОМПОЗИЦИОННОГО МАТЕРИАЛА И МАТЕРИАЛ, ПОЛУЧЕННЫЙ ЭТИМ СПОСОБОМ

Изобретение относится к композиции связующего, предназначенной для изготовления полимерного композиционного материала (ПКМ) или препрегов для ПКМ, к вариантам способа получения композиции связующего, к способу отверждения композиции связующего, к полимерному композиционному материалу и способу его получения. Композиция связующего включает: (1) полимеризуемую смесь, содержащую один или несколько бис-фталонитрильных мономеров общей формулы:где X, Y, Z каждый независимо выбирают из группы, состоящей из H, F, Cl, Br и CH, в количестве 20-94 мас.% от массы полимеризуемой смеси; один или несколько реактивных пластификаторов-антипиренов общей формулы:,где группаможет находиться в мета- или параположении относительно атома кислорода, связанного с бензольным кольцом, а R выбирают из арила, оксиарила, алкила или оксиалкила, или пластификаторов-антипиренов общей формулы:,в которой R выбирают из арила, оксиарила, алкила или оксиалкила, взятых в количестве 5-80 мас.% от общей массы полимеризуемой смеси ...

ПОЛИМЕРНАЯ ВЛАГОЧУВСТВИТЕЛЬНАЯ КОМПОЗИЦИЯ ДЛЯ ДАТЧИКОВ ВЛАЖНОСТИ РЕЗИСТИВНОГО ТИПА

Изобретение относится к химии высокомолекулярных соединений, а именно - к полимерным ВК, которые используются для изготовления датчиков влажности резистивного типа. Эти датчики находят применение в электронной промышленности, радиотехнике, сельском хозяйстве, энергетике. ВК получены на основе полиамидоимида формулы: с добавлением в качестве влагочувствительного вещества полиэтиленгликоля (ПЭГ) в мас.%: ПАИ с ММ (50 100) 103 52,3 - 58,5, ПЭГ с ММ 400 2000 41,5 - 47,7. Заявленные датчики влажности работают в интервале 15 - 99% и обеспечивают линейную зависимость влагопоглощения и электропроводности в широком интервале температур 0 - 85°С, что является обязательным условием эксплуатации датчиков. Температурная и абсолютная погрешности датчиков составляют соответственно 0,3%/°С, 2,0%/, что в два раза меньше, чем у приведенных аналогов.

Композиция для термостойкого полиимидного пенопласта

Композиция для термостойкого полиимидного пенопласта, включающая порошок форполимера полиимида и неорганического наполнителя, отличающаяся тем, что, с целью уменьшения усадочных явлений при отверждении, а также повышения прочности и стойкости к тепловым нагрузкам, в качестве неорганического наполнителя она содержит алюмохромфосфатные микросферы, и компоненты взяты в следующем соотношении, вес.%: Форполимер полиимида 60-90 Алюмохромфосфатные микросферы 10-40 ...

СПОСОБ ПОЛУЧЕНИЯ ПОЛИАМИДОКИСЛОТ С ЗАДАННОЙ СТЕПЕНЬЮ ПОЛИМЕРИЗАЦИИ ИЗ ВЫСОКОАКТИВНЫХ МОНОМЕРОВ

Изобретение относится к области синтеза ароматических полиамидокислот - промежуточного продукта в синтезе полиимидов. Описан способ получения полиамидокислот с заданной степенью полимеризации поликонденсацией высокоактивных мономеров, заключающийся в добавлении к раствору диамина твердого диангидрида тетракарбоновой кислоты и монофункционального соединения, при этом синтез проводят в три стадии: поликонденсация диамина с диангидридом тетракарбоновой кислоты, взятом в количестве от 0,84 до 0,98 моля на 1 моль диамина, затем конденсация с монофункциональным соединением, в качестве которого используют ангидрид фталевой кислоты, и далее поликонденсация с диангидридом тетракарбоновой кислоты. Технический результат - получение полиамидокислот с заданной степенью полимеризации в случае применения высокоактивных мономеров. 1 н. и 3 з.п. ф-лы, 2 пр.

ТЕРМОПЛАСТИЧНЫЕ ИЗДЕЛИЯ С ВЫСОКОЙ ТЕМПЕРАТУРОЙ СТЕКЛОВАНИЯ

... 1. Композиционный материал, представляющий электронный компонент, где композиционный материал содержит электропроводящий материал, расположенный либо сверху либо снизу, по меньшей мере, части подложки или покрытия, соответственно, где подложка или покрытие содержит материал, выбранный из группы, состоящей из: а) несмешивающейся смеси полимеров, содержащей один или более полиэфиримидов, имеющей более чем одну температуру стеклования, где полиэфиримид имеет температуру стеклования выше, чем 217°С; b) смешивающейся смеси полимеров, содержащей один или более полиэфиримидов, имеющей одну единственную температуру стеклования выше, чем 180°С; или с) одного полиэфиримида, имеющего температуру стеклования выше, чем 247°С. ! 2. Композиционный материал по п.1, где полиэфиримид имеет соотношение атомов водорода к атомам углерода от приблизительно 0,4 до 0,85. ! 3. Композиционный материал по п.1, где полиэфиримид является в значительной степени свободным от бензильных протонов. ! 4. Композиционный материал ...

КОМПОЗИЦИЯ ДЛЯ АНТИФРИКЦИОННОГО ПОКРЫТИЯ

Изобретение относится к полимерным композициям, используемым для получения антифрикционных покрытий, применяемых в узлах сухого трения. Покрытие на основе предлагаемой композиции наиболее эффективно может быть использовано в машиностроении, приборостроении, в частности в медицинских эндоскопах. Цель изобретения состоит в создании композиции для антифрикционного покрытия с более низким коэффициентом трения, с более низким износом. Это достигается тем, что в в раствор бис(мадеимидо)дифенилметана, диаминодифенилметана и ароматических амидоаминов общей формулыгде n = 1 - 5;R =NHвводят анифрикционные наполнители при следующем соотношении компонентов, мас. ч. : бис-(малеимидо)дифенилметан 20,0 - 35,0; ароматические амидоамины 10,0 - 25,0; диаминодифенилметан 2,0 - 5,0; дисульфид молибдена 40,0 - 55,0; графит 10,0 - 15,0. Использование предлагаемой композиции для антифрикционного покрытия позволяет снизить износ покрытия за 5 ч трения с 0,0012 до 0,0007г, а коэффициент трения в выбранном режиме ...

КОЛЬЦЕОБРАЗНЫЕ ИЛИ ТРУБЧАТЫЕ ФОРМОВАННЫЕ ИЗДЕЛИЯ ИЗ НОВЫХ ПОЛИМЕРНЫХ СМЕСЕЙ

... 1. Трубчатое промышленное изделие кольцеобразной или трубчатой формы, имеющее наружный диаметр, внутренний диаметр и длину, выполненное из одного или нескольких материалов, выбранных из группы, состоящей из a) несмешиваемой смеси полимеров, содержащей один или несколько полиэфиримидов, имеющих более одной температуры стеклования, где полиэфиримид имеет температуру стеклования более чем 217°С; b) смешиваемой смеси полимеров, содержащей один или несколько полиэфиримидов, имеющих единую температуру стеклования более чем 180°С; или с) отдельного полиэфиримида, имеющего температуру стеклования более чем 247°С. ! 2. Трубчатое промышленное изделие по п.1, в котором полиэфиримид имеет отношение атомов водорода к атомам углерода в пределах примерно между 0,4 и 0,85. ! 3. Трубчатое промышленное изделие по п.1, в котором полиэфиримид по существу не содержит бензильных протонов. ! 4. Трубчатое промышленное изделие по п.1, в котором наружный диаметр изделия является по существу одинаковым по всей длине ...

ТЕРМОРЕАКТИВНАЯ СМОЛА, СОДЕРЖАЩАЯ ОБЛУЧЕННЫЙ ТЕРМОПЛАСТИЧЕСКИЙ АГЕНТ ДЛЯ ПОВЫШЕНИЯ УДАРНОЙ ПРОЧНОСТИ

... 1. Неотвержденная полимерная композиция, включающая термореактивный полимерный компонент, облученный термопластический агент для повышения ударной прочности и отвердитель. ! 2. Неотвержденная полимерная композиция по п.1, в которой указанный термореактивный полимерный компонент выбирают из группы, состоящей из эпоксидных смол, смол на основе цианатных сложных эфиров и бисмалеимидных смол. ! 3. Неотвержденная полимерная композиция по п.2, в которой указанный облученный термопластический агент для повышения ударной прочности выбирают из группы, состоящей из простого полиэфирсульфона, простого полиэфирэфирсульфона, простого полиэфиримида и полифенилсульфона. ! 4. Неотвержденная полимерная композиция по п.3, в которой указанный отвердитель выбирают из группы, состоящей из дициандиамида и ароматических аминов. ! 5. Препрег, включающий неотвержденную полимерную композицию по п.1 и волокнистый армирующий материал. ! 6. Препрег по п.5, в котором указанный волокнистый армирующий материал выбирают ...

Антифрикционная композиция

Антифрикционная композиция

Вулканизуемая резиновая смесь

Способ обработки электропроводящего композиционного материала на основе полипиромеллитимида

Способ получения антифрикционного материала

Полимерная композиция

Использование: полимерные композиции на основе поли-бис-малеимида может быть использованы в качестве термо-тепло- стойких литьевых изделий, пресс-материалов и связующих для слоистых пластиков конструкционного назначения. Сущность: для повышения стабильности материала к действию высоких температур композиция содержит поли-бис-малеимид 85 - 25, угольная пыль 5 - 15. 2 табл.

Клеевая композиция

КЛЕЕВАЯ КОМПОЗИЦИЯ, содержащая полиамидокислоту, эпоксидную смолу и диметилформамид, о т л и ч а ю щ а я с я тем, что, с целью повыАения прочности клеевого шва при склеивании полиимидных пленок, композиция дополнительно содержит мелкокристаллическую аморфную окись магния при следующем соотношении компонентов, мае. % Полиамидокислота 52,18-52,84 Эпоксидная смола 13,00--13,72 Диметилформамид 28,07-28,48 Мелкокристаллическая аморфная окись магния 5,68-6,03 (Л С ...

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Harzzusammensetzung und deren Herstellung

Aminmodifizierte Polyimid-Membran für Gastrennung und Ultrafiltration

MIKROPOROESE, UNDURCHSICHTIGE, UNLOESLICHE, ASYMMETRISCHE MEMBRAN UND VERFAHREN ZUR HERSTELLUNG DERSELBEN

PSEUDO-NETZWERK KONDENSATIONSPOLYMERE

POLYIMID-ZUSAMMENSETZUNG UND DAMIT HERGESTELLTES PREPREG UND LAMINAT

Polymer-Mischungen und daraus hergestellte Gegenstände

SCHLAGZAEHE THERMOPLASTISCHE FORMMASSEN AUS AROMATISCHEN POLYETHERSULFONEN UND POLYALKYLENTEREPHTHALATEN

Schmelzstabile Polyarylenthioätherketone und Verfahren zu ihrer Herstellung

VERFAHREN UND ZUSAMMENSETZUNG ZUR VERBESSERUNG DER GASBARRIERENEIGENSCHAFTEN POLYMERER BEHÄLTER UND FILME

POLYIMID UND HOCHTEMPERATUR KLEBSTOFF DAVON.

VERBUNDMATERIAL AUS HOCHTEMPERATURBESTAENDIGEN POLYMEREN UND DIREKT DARAUF AUFGEBRACHTEN METALLSCHICHTEN.

Composite materials consist of thermoplastics (I) based on polyaryl ether sulphones, polyarylene ether ketones, polyether imides or thermotropic polymers, which are resistant to high temp., and a metal layer (II) applied directly to this, the surface area of which is increased by chemical or mechanical treatment. The novel features are that the enlarged surface area of (II) is towards (I); and the bond strength between (I) and (II) is min. 1.9 N/m, measured at a peel rate of 20 mm/min and angle of peel of 180 deg.C..

THERMOPLASTISCHE FORMMASSEN

BISMALEINIMIDE, SOWIE DARAUS HERGESTELLTE POLYIMIDE.

AROMATISCHE ETHERIMIDE

VERFAHREN ZUR HERSTELLUNG VAKUUMFESTER BISMALEINIMIDEN

POLYIMIDE HARZZUBEREITUNG.

ANTI-VERGILBUNGS- POLYKONDENSATIONSPOLYMERZUSAMMENSETZUNGEN UND GEGENSTÄNDE

VINYL-HARZ-ZUSAMMENSETZUNG.

Kunststoffmischung, welche destrukturierte Stärke enthält.

Strahlungsempfindliche Kunststoffzusammensetzung

VERFAHREN ZUR HERSTELLUNG HITZEBESTAENDIGER VERSTAERKTER KOERPER ODER GEGENSTAENDE

Heat-resistant copolyimides - used in mfr. of reinforced mouldings or as impregnants

Copolyimides having repeat units of formula (I) (where 10-90% of R comprise units of formula (II) and 90-10% of R are units of formula (III) and/or (IV) are dry-mixed with a reinforcing material, e.g. inorganic fibres, PTFE powder, Al-powder, fibrous fabric or roving. Alternatively a copolyimide soln. is used as impregnant for a reinforcing matrix, with the solvent being removed subsequently. The resulting dry mixt. is melted, under pressure, at a temp. at least as high as Tg of the polymer; followed by cooling. Polymers are used in mfr. of engineering components and laminates.

POLYARYLENETHER-POLYETHERIMID BLENDS UND VERFAHREN ZU IHRER HERSTELLUNG

EPOXIDHARZ-MISCHUNGEN

HAERTBARE HARZZUSAMMENSETZUNG

POLY(BIPHENYLETHERSULFON)-HARZE MIT VERBESSERTER UV-VERGILBUNGSBESTÄNDIGKEIT

POLYIMIDFILM UND VERFAHREN ZU DESSEN HERSTELLUNG

THERMOPLASTIC MOULDING MATERIALS BASED ON A STYRENE-ACRYLONITRILE COPOLYMER, AN ELASTOMER AND A POLYIMIDE

MONOCARBONSÄURESALZE VON IMIDAZOLREAKTIONSPRODUKTEN, VERFAHREN ZUR HERSTELLUNG DER SALZE, UND OBERFLÄCHENBEHANDLUNGEN, ZUSÄTZE FÜR HARZE UND HARZZUSAMMENSETZUNGEN WELCHE DIESE ENTHALTEN

RADIATION-SENSIBLE COATING COMPOSITION AND ITS USE

Zwischenübertragungselement aus mit Polyanalin und Russ gefülltem Polyimid

Curable silicone-polyimide block copolymers

Silicone-polyimide block copolymers are obtained from a siloxanimide which contains hydrosilyl end groups or vinyl end groups and can be converted into a silicone-polyimide block copolymer using a platinum catalyst. The resultant platinum-containing silicone-polyimide block copolymer can be cured using a crosslinking agent.

TRENNFINGER FÜR ELEKTROFOTOGRAFISCHE GERÄTE

TISSUEPAPIERPRODUKT DAS MIT ADHÄSIV ZUSAMMENGEFÜGTE BLÄTTER ENTHÄLT

Kunstoffsubstrate zur Verwendung in elektronischen Anzeigesystemen

OXIDATIONSBESTÄNDIGE STARRE AROMATISCHE POLYIMIDZUSAMMENSETZUNGEN UND VERFAHREN ZU IHRER HERSTELLUNG

REINFORCED STRUCTURAL PLASTICS

... 1,243,643. Laminates. T.R.W. Inc. 10 July, 1968 [10 July, 1967]. No. 32948/68. Heading B5N. [Also in Divisions C3 and D1] Laminates may be made from plies of a reinforcing material impregnated with a polyimide precursor obtained from a polyamine, a polyanhydride and a mono-anhydride of formula where each R is H or alkyl and the R radical on the left of the formula is substituted in the 4 or 5 position of the ring. The reinforcing material may be carbon cloth, glass cloth, a silicate, boride, carbide, silicide, nitride, oxide or metal. It may be impregnated with a dispersion of a powdered precursor as defined above in a solution of a precursor also as defined above but of lower molecular weight and solvent removed before curing with heat and pressure.

Curable compositions

BORON REINFORCED POLYIMIDE COMPOSITES

... 1353058 Boron filament polyimide laminate T R W Inc 19 April 1971 [25 May 1970] 25769/71 Heading B5N [Also in Division C3] Boron filament polyimide laminates are made by applying a solution or dispersion in an organic solvent of a heat-curable polyamideacid prepared by reacting a polyamine, a polyanhydride and monoanhydride where R is H or C 1 -C 5 alkyl, in approximately stoichiometric proportions of polyamine to total anhydride, to a drum covered with a terephthalic acid polyester film, applying a scrim cloth to the coated film, partially drying, applying further solution or dispersion, partially drying, winding boron filaments on to the drum (208 filaments/inch) and more solution or dispersion applied. The assembly is then partially dried, removed from the drum, further dried and cut into rectangular pieces which are pressed to form a 10 ply laminate at 315‹ C. and 100 p.s.i. Reference is made to Specifications 1,241,445 and 1,243,643.

PHENOLIC SOLUTIONS OF IMIDE-AMIDE POLYMERS

... 1392799 Coated products RHONE-POULENC SA 15 Oct 1973 [16 Oct 1972] 47996/ 73 Heading B2E [Also in Division C3] Copper wire is lacquered with a composition which comprises an imide-amide polymer dissolved in a phenolic solvent comprising at least one phenol with m.p. 50‹C, and 0.1- 50% wt, based on (polymer + solvent) and a saturated or ethylenically unsaturated carboxylic acid. The polymer may be a polytrimellitmideamide, e.g. of repeating unit It may contain small amounts of water and N-methyl pyrrolidone. The phenol may be phenol or a cresol; also present may be xylenols, pyrocatechol, resorcinol, hydroquinone, or phloroglucinol. The acid may be formic, acetic, propionic, butyric, acrylic, crotonic, or methacrylic acid. The acid lowers the viscosity of the solution.

FILLED POLYIMIDE MOLDING POWDER AND PRODUCTION THEREOF

A polyimide molding powder and a process for producing the same are disclosed, said powder comprising an aggregate of polyimide particles, in which the whole or a large portion of said powder comprises polyimide particles composed of a particulate filler coated with a polyimide resin and/or polyimide particles composed of a fibrous filler coated with a polyimide resin, and said process comprising reacting an aromatic tetracarboxylic acid dianhydride and an aromatic diamino compound in an organic solvent to synthesize a polyimide precursor and imidating the polyimide precursor to precipitate polyimide particles, wherein a particulate filler and/or a fibrous filler dispersed in a prescribed amount of an organic solvent is or are added to the reaction system at any stage before the imidation of the polyimide precursor. The molding powder produces polyimide molded products free from brittleness and excellent in appearance, as well as various performance characteristics due to the improving ...

Polyamide-imide resin pastes

A paste which does not cause screen clogging in repeated printings and shows excellent mechanical stability comprises polyamide-imide resin solution dissolved in a non-nitrogen-containing solvent, and resin fine particles dispersed in the solution in an amount of 1 to 50% by weight relative to the resulting polyamide-imide resin paste.

POLYETHERAMIDE-IMIDE POLYMER COMPOSITION

Resin compositions

Resin compositions that may have excellent heat resistance, izod impact strength, rigidity and dimensional resistance suitable for the automobile, electric and electronic industries comprise: a) a resin which has from 40 to 85 mole % of component (I) and from 60 to 15 mole % of component (II), and b) an olefin, elastomer polyamide or polyester resin: the ratio a/b preferably being from 5/95 to 99/1 (by weight); component I being: wherein R1 is a C1-18 alkyl group or a C3-12 cycloalkyl group; and component II being wherein R2 represents a hydrogen atom or a C1-8 alkyl group and each of R3 and R4 independently represents a C1-8 alkyl group.

Maleimide copolymer resin compositions

Heat-curable epoxy resin adhesive.

Heat-curable adhesive compositions, suitable for bonding brake linings to metallic supports, comprise, as active components, a) 30 to 90% by weight of one or more prepolymers selected from polyesterimides, polyamide-imides and polyhydantoins; b) 2 to 40% by weight of an epoxide resin and/or an epoxidised novolac resin; c) 0.1 to 20% by weight of curing agent, effective under curing conditions, for component b), d) 0 to 40% by weight of a heat- curable phenolformaldehyde resin having a softening point above 20 DEG C and e) 0 to 40% by weight of a copolymer obtained by copolymerisation of e1) 30 to 80% by weight of one or more (C1-8alkyl) esters of acrylic or methacrylic acid, e2) 5 to 25% by weight of acrylonitrile and/or methacrylonitrile, e3) 2 to 20% by weight of one or more omega -hydroxy-alkyl esters of acrylic or methacrylic acid having 1 to 5 carbon atoms in the alkyl radical, e4) 0 to 35% by weight of styrene and e5) 0 to 15% by weight of an olefinically unsaturated carboxylic acid ...

Composite sliding material

Preparing selective permeable membranes

A process is described for preparing a selective permeable membrane comprising coating a solution consisting essentially of (i) a polyimide polymer consisting essentially of a repeating unit of the formula (I): (I) wherein R1 is a divalent organic group, (ii) a swelling agent selected from the group of compounds represented by formula (II) and (III): R3O--CH2CHR2O)nR4 (II) R5--OH)m (III) wherein R2, R3 and R4, which may be the same or different, can be hydrogen, a methyl group, or an ethyl group, and when R2 is hydrogen, n can be an integer of from 1 to 5, and when R2 is a methyl or ethyl group, n can be an integer of from 1 to 3, R5 is a saturated aliphatic hydrocarbon group containing 3 to 6 carbon atoms, and m can be an integer of from 2 to 6, and (iii) an organic solvent, on a supporting substrate, and immersing the solution coated supporting substrate in a coagulating liquid which does not dissolve the polyimide polymer and is miscible with the organic solvent, to coagulate the polyimide ...

COMPOSITE MATERIAL AND A PROCESS FOR MANUFACTURING THE SAME

POLYAMIDE-IMIDE COMPOSITIONS FOR IMPARTING ELECTRICAL PROPERTIES AND ARTICLES PRODUCED USING THE COMPOSITIONS

POLYAMIDE-IMIDE/POLYIMIDE BLENDS

CURABLE SILICONEPOLYIMIDE BLOCK COPOLYMERS

CO-SOLVENT ACCELERATOR

POLYMER COMPOSITIONS

Friction pads for use in disc brakes

POLYIMIDE-FORMING COMPOSITIONS

... 1,255,028. Laminates. MONSANTO CO. 24 Dec., 1968 [2 Jan., 1968], No. 61302/68. Heading B5N. [Also in Divisions B2 and C3] A polyimide-forming composition comprises a mixture of (A) an aromatic tri- or tetracarboxylic acid or an ester or ammonium salt thereof; (B) an aromatic at least a diprimary amine; and (C) at least 0-1% by wt. of (A)+(B) of a thermal stabilizer which is an alkyl acid ester or an ammonium or substituted ammonium salt of phosphoric acid or of an oxyacid of boron or sulphur. Extensive lists of possible ingredients (A), (B) and (C) are given; the proportions of (A) : (B) may vary from 70% molar excess of (B) to 10% excess of (A). The compositions may also comprise solvents, catalysts, fillers, extenders, adhesion promoters and blowing or foaming agents. They may be used in the manufacture of fibre-reinforced composites e.g. using glass or asbestos fibre or cloth. Glass cloth used in Examples is surface-treated with 3-aminopropyl triethoxysilane. 12-ply laminates are made ...

MOULDING CELLULAR POLYCARBODIIMIDE

... 1527290 Moulding cellular polycarbodiimides ROTH FRERES SA 2 Nov 1976 [17 Nov 1975 2 Sept 1976] 45430/76 Heading C3C [Also in Division B5] A method of moulding articles from a cellular panel preform of polycarbodiimide comprises placing the panel in a mould and die assembly, heating by both radiation and direct contact to a temperature of 130-190‹ C. and applying pressure when the preform reaches its softening point, e.g. 130‹ C., until a body density of 40- 100 kg/cu. m. is obtained. A skin having a density up to 300 kg./cu. m. may be formed. After moulding the mould may be cooled by an air-jet. Wall slabs, fake ceilings and pipe insulation may be formed.

AQUEOUS DISPERSIONS OF PERFLUOROOLEFIN POLYMERS CONTAINING FILM-FORMING MATERIALS

AQUEOUS POLYAMIDE/IMIDE DISPERSIONS

STABILIZATION OF HIGH TEMPERATURE PLASTICS

... 1536488 Stabilizing aromatic polymers EXXON RESEARCH & ENG CO 9 April 1976 14659/76 Heading C3R Polymers containing methylene groups attached to aromatic rings are stabilized against oxidation at high temperatures by incorporating in them 0À0005 to 2À0% by weight of copper, nickel or cobalt salts of inorganic or organic acids, or copper chelates. The polymers may contain heterocyclic rings. In examples the polymer used has repeating units of formula and the stabilizers used are cuprous chloride, cupric chloride, cuprous bromide, cupric acetate, cupric acetylacetonate, cobaltous chloride, nickelous chloride, cupric nitrate, cupric benzoate, cupric benzoyl acetonate, copper salicylaldehyde chelate, cupric ethylacetoacetate and copper - 8 - quinolinolate; some compositions also contain octabromobiphenyl as a flame retardant.

RUBBER POLYMERS

Method and composition for improving gas barrier properties of polymeric containers and films.

A polymer composition and method for reducing the permeability of gases through molded polymeric containers and films by incorporating into the polymer from which the container or film is formed an effective amount of a barrier-enhancing additive, such as monoesters of hydroxybenzoic acid and hydroxynaphthoic acid.

Method and composition for improving gas barrier properties of polmyeric containers and films

Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product

An object is to provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal•polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. To meet this object, a composition is prepared containing (A) polyimide and (B) mixed solvent of two kinds or more, and the solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14.

Alignment film, composition for forming alignment film and liquid crystal display device

Disclosed is a liquid crystal display device including: a first substrate and a second substrate, one of which is transparent; a liquid crystal layer disposed between the first substrate and the second substrate; a group of electrodes for applying an electric field to the liquid crystal layer, which is formed on one of the first substrate and the second substrate; a plurality of active elements connected to the group of electrodes; and an alignment film disposed on one of the first substrate and the second substrate, wherein the alignment film contains a polyimide and a precursor of the polyimide, each of which is formed from a diamine and an acid anhydride, and the diamine contains a first diamine having an acidic group and a second diamine having a nitrogen atom-containing functional group other than two amino groups.

Polyimide precursor solution composition containing filler, and polyimide film using same

There is provided a filler-containing dispersion solution exhibiting very improved filler dispersion stability by dispersing a filler in a solvent using a polyimide precursor solution composition. Furthermore, in the filler-containing dispersion solution, a tetracarboxylic dianhydride and/or its derivative is reacted with a diamine compound to prepare a filler-containing polyimide precursor solution composition, which is then used to provide a polyimide in which a filler is dispersed.

Liquid crystal polyimide, liquid crystal resin composition containing same, and resin film for semiconductor elements

A liquid crystal polyimide, containing: repeating units of formula (I) and having liquid crystallinity, wherein A 1 and A 2 are each independently a tetravalent residue of a tetracarboxylic acid, B 1 is a residue of a bis(amino)polysiloxane of formula (II), and C 1 is a residue of an organic diamine, wherein R 1 to R 6 are each independently a lower alkyl group, x is from 0 to 10, D 1 is an alkylene group, y is 0 or 1, and Z 1 is selected from the group consisting of —H, —CH 3 , CF 3 , —F, —CN and —NO 2 . In addition, a liquid crystal resin composition and a resin film for a semiconductor element containing the liquid crystal polyimide.

Binder for lithium secondary battery, negative electrode for lithium secondary battery, lithium secondary battery, binder precursor solution for lithium secondary battery, and method for manufacturing negative electrode for lithium secondary battery

Provided is a binder capable of realizing a lithium secondary battery that includes a negative electrode including a negative-electrode active material layer containing at least one of silicon and a silicon alloy as a negative-electrode active material and also containing a binder and has an excellent charge-discharge cycle characteristic. The binder for the lithium secondary battery contains a polyimide resin that is formed by imidizing either a tetracarboxylic acid or a tetracarboxylic anhydride and a diamine, the polyimide resin having a hydrolyzable silyl group.

Electrically insulating and thermally conductive composition and electronic device

An embodiment of the invention provides an electrically insulating and thermally conductive composition including 5-80 parts by weight of a resin, 20-95 parts by weight of an electrically insulating and thermally conductive powder, and 0.0001-2 parts by weight of a graphene. Another embodiment of the invention also provides an electronic device including the electrically insulating and thermally conductive composition.

Thermally and dimensionally stable polyimide films and methods relating thereto

The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Coverlay compositions and methods relating thereto

The present disclosure is directed to a coverlay comprising a polyimide film and an adhesive layer. The polyimide film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

Polyimide resins for high temperature wear applications

Polyimide resin compositions that contain an end-capped rigid aromatic polyimide, graphite and, optionally, a filler selected from sepiolite, attapulgite, kaolinite, or a mixture thereof, are found to exhibit low wear at high temperatures. Such compositions are especially useful in molded articles that are exposed to wear conditions at high temperatures such as aircraft engine parts.

Laminate structure, method for manufactuing laminate structure, electronic element array, image displaying medium, image displaying apparatus, diamine, polyamic acid, and polyimide

Disclosed is a laminate structure including a substrate, a wettability changing layer, and an electrical conductor layer, wherein the wettability changing layer and the electrical conductor layer are laminated on the substrate in order, wherein the wettability changing layer contains a polyimide, wherein the polyimide is obtainable by dehydrating and ring-opening a polyamic acid, wherein the polyamic acid is obtainable by ring-opening and addition-polymerizing a diamine and a tetracarboxylic acid dianhydride, wherein the diamine includes a compound represented by a general formula of: or a compound represented by a general formula of: wherein each of R 1 and R 2 in formula ( 1 ) is defined in the specification, and wherein R 1 in formula ( 2 ) is defined in the specification.

Photoaligning material with lateral substitution

The present invention relates to photoaligning material with lateral substitution, compositions thereof, and its use for optical and electro optical devices, especially liquid crystal devices (LCDs).

Polyetherimide compositions and methods for the manufacture and use thereof

This disclosure relates to polyetherimide compositions whose residual phenolic monomers exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed polyetherimides and articles of manufacture comprising the disclosed polyetherimides.

NANOCOMPOSITE COATINGS FOR THREADED CONNECTIONS

A coating which provides corrosion resistance, wear resistance, and, optionally, lubrication, for deposition on a threaded article is disclosed. The coating comprises a polymer matrix, such as a polyimide, which is modified with small amounts of a fluorine containing polymer modifier, as well as other compounds or additives to improve performance of the coating. Additionally, the coating can further comprise a solid lubricant or an anticorrosion compound dispersed within the polymer matrix. 1. A threaded article comprising: a polymer selected from the group consisting of epoxies and polyimides;', 'about 0.5 to about 15 wt. % of a fluorine containing polymer modifier;', 'about 5 to about 15 wt. % of an anticorrosion compound;', 'about 10 to about 15 wt. % of an adhesion additive comprising zinc oxide, said zinc oxide provided in an effective amount to promote adhesion of the first coating composition to the thread portion., 'a first coating composition deposited on a thread portion of the threaded article, comprising2. The threaded article of claim 1 , wherein the mean diameter of the zinc oxide ranges between approximately 10 nm to approximately 10 μm.3. The threaded article of claim 1 , wherein the fluorine containing polymer modifier comprises perfluoropolyether.4. The threaded article of claim 1 , wherein the first coating composition comprises a single layer.5. The threaded article of claim 1 , wherein the first coating composition further comprises about 3 to about 30 wt. % of a solid lubricant.6. The threaded article of claim 5 , wherein the solid lubricant is selected from the group consisting of graphite claim 5 , molybdenum disulfide claim 5 , HDPE and PTFE.7. The threaded article of claim 1 , wherein the first coating composition further comprises at least one of:about 3 to about 8 wt % zinc;about 1 to about 5 wt. % zinc(II)phosphate;about 1 to about 5 wt. % Carbon black; andabout 10 to about 20 wt. % of polydimethylsiloxane.8. The threaded article of ...

WATER VAPOR BARRIER FILM AND METHOD FOR PRODUCING SAME

The present invention provides a film for a back sheet of a solar cell exhibiting excellent water vapor barrier properties, water resistance and gas barrier properties, has flexibility and mechanical strength and has excellent heat stability, and a method for producing the film. 1. A laminated film , comprising a clay membrane coated and dried on a resin film substrate , wherein:the clay membrane is formed of a clay and an additive consisting of a thermoplastic or thermosetting resin;a weight ratio of the clay relative to total solid in the clay membrane is 60 to 90% by weight;a water resistance imparting heat treatment is performed after coating and drying of the clay membrane on the resin film substrate; and{'sup': −15', '2', '−1', '−1', '2, 'the resin film of the resin film substrate has an oxygen gas transmission coefficient at a room temperature of less than 4.0×10cmscmHg, a volume resistivity in the perpendicular direction of 10 MΩ or more, and a water vapor transmission rate of less than 3 g/m·day (test method: Dish method, test period: 140 hr).'}2. The laminated film according to claim 1 , wherein the clay is purified bentonite or synthetic smectite and at least 90% by mole of intercalating exchangeable ions of the clay is lithium ion.3. The laminated film according to claim 1 , wherein the additive is a polyimide.4. The laminated film according to claim 1 , wherein the resin film substrate comprises a polyethylene terephthalate (PET).5. A method for producing the laminated film according to claim 1 , the method comprising:applying a clay paste prepared from a clay, an additive consisting of a thermoplastic or thermosetting resin, and a dispersion medium as a solvent to a resin film having a flat surface, to form a coated substrate;drying the coated substrate;removing the dispersion medium; andperforming a water resistance imparting heat treatment to form the laminated film,wherein:the clay comprises lithium ion which is at least 90% by mole of intercalating ...

PHOTOSENSITIVE POLYMIDES

The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board. 12. A photosensitive composition claim 1 , which comprises claim 1 , based on the total weight of the composition claim 1 , at least 1% by weight of the photosensitive polyimide according to and at least one photoinitiator.13. The photosensitive composition according to claim 12 , further comprising a reactive monomer or oligomer.14. The photosensitive composition according to or claim 12 , which is a liquid photo resist composition or a solid dry film photo resist composition. The invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.Electronic products recently have more and more miniaturized and lighter in weight. In accordance with this, various electronic parts are required to be downsized. Based on the ground that flexible printed wiring boards have the advantage of flexibility and light weight, their demand greatly increases.With respect to the materials used, coverlay films can be divided into the following three types: photosensitive coverlay film (first type), non-photosensitive coverlay film (second type) and thermal plastic coverlay film (third type). The photosensitive coverlay film (first type) also can be divided into polyimide based coverlay film (PT based coverlay film) and non-polyimide based coverlay film (non-PI based coverlay film). Since the non-PI based coverlay film has poor heat resistance, higher ...

Polysiloxane-grafted polyimide resin composition and applications thereof

A polysiloxane-grafted polyimide resin composition includes a polysiloxane-grafted polyimide resin, and a solvent. The polysiloxane-grafted polyimide resin is represented by formula (I): wherein W represents a tetravalent organic group, R represents a trivalent organic group, and X represents a polysiloxane-containing group.

Liquid crystal display and method of manufacturing the same

A liquid crystal display includes a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a pixel electrode disposed on the first base substrate and including a plurality of branch portions, and a first alignment layer disposed on the pixel electrode. The second substrate includes a second base substrate, a common electrode disposed on the second base substrate, and a second alignment layer disposed on the common electrode.

Fuser member

The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a thermoplastic polyimide/polybenzimidazole blend. A method of making the fuser member is provided.

FINE GRAPHITE PARTICLES, GRAPHITE PARTICLE-DISPERSED LIQUID CONTAINING THE SAME, AND METHOD FOR PRODUCING FINE GRAPHITE PARTICLES

Fine graphite particles include plate-like graphite particles; and an aromatic vinyl copolymer which is adsorbed on the plate-like graphite particles, and which contains a vinyl aromatic monomer unit represented by the following formula (1): 1. Fine graphite particles comprising:plate-like graphite particles; and {'br': None, 'sub': '2', '—(CH—CHX)—\u2003\u2003(1)'}, 'an aromatic vinyl copolymer which is adsorbed on the plate-like graphite particles, and which contains a vinyl aromatic monomer unit represented by the following formula (1)(in the formula (1), X represents a phenyl group, a naphthyl group, an anthracenyl group, or a pyrenyl group, provided that these groups may have each a substituent).2. The fine graphite particles according to claim 1 , whereinthe aromatic vinyl copolymer comprises the vinyl aromatic monomer unit and another monomer unit derived from at least one monomer selected from the group consisting of (meth)acrylic acid, (meth)acrylates, (meth)acrylamides, vinylpyridines, maleic anhydride, and maleimides.3. The fine graphite particles according claim 1 , whereinthe aromatic vinyl copolymer is a block copolymer.4. The fine graphite particles according to claim 1 , whereinthe plate-like graphite particles have thicknesses of 0.3 to 1000 nm.5. The fine graphite particles according to claim 1 , whereinat least one functional group selected from the group consisting of hydroxyl group, carboxyl group, and epoxy group is bonded to 50% or less of all carbon atoms near a surface of the plate-like graphite particle.6. The fine graphite particles according to claim 1 , further comprising at least one hydrocarbon chain which is bonded to the aromatic vinyl copolymer claim 1 , and which is selected from the group consisting of alkyl chains claim 1 , oligoolefin chains claim 1 , and polyolefin chains.7. The fine graphite particles according to claim 6 , whereinthe aromatic vinyl copolymer has a functional group, andthe hydrocarbon chain is formed by ...

AMORPHOUS HEAT-FUSIBLE FIBER, FIBER STRUCTURE, AND HEAT-RESISTANT MOLDED ARTICLE

Provided are a heat-fusible fiber having excellent heat resistance, flame retardancy and dimensional stability; a fiber structure comprising the heat-fusible fiber; and a molded article produced by applying a heat fusion treatment to the fiber structure and having excellent heat resistance. The heat-fusible fiber comprises an amorphous PES type polymer (A) not substantially having a melting point and an amorphous PEI type polymer (B) in the mixture ratio (weight) of (A)/(B)=5/95 to 95/5, the fiber having a single glass transition temperature in the range between 80° C. and 200° C., and being amorphous. The fiber structure comprises 10% by weight or higher of the amorphous heat-fusible fiber. The molded article comprises at least a fiber structure comprising 10% by weight or higher of the amorphous heat-fusible fiber, to be fusion-bonded at a temperature higher than the glass transition temperature of the amorphous heat-fusible fiber. 1: An amorphous heat-fusible fiber , comprising:(A) an amorphous polyester not substantially having a melting point; and(B) an amorphous polyetherimide,wherein:a weight ratio of (A)/(B) is 5/95 to 95/5; andthe fiber has a single glass transition temperature in a range between 80° C. and 200° C.2: The amorphous heat-fusible fiber of claim 1 , wherein the amorphous polyester (A) comprises a terephthalic acid component (D) and an isophthalic acid component (E) claim 1 , wherein a copolymerization ratio (mole % ratio) of (D)/(E) ranges from 70/30 to 40/60.4: The amorphous heat-fusible fiber of claim 1 , having a dry heat shrinkage percentage of 3% or less at a temperature of (glass transition temperature −10) ° C.5: The amorphous heat-fusible fiber of claim 1 , wherein the fiber is a melt-spun and un-drawn fiber.6: A fiber structure claim 1 , comprising 10% by weight or higher of the amorphous heat-fusible fiber of .7: A heat-resistant molded article claim 1 , comprising a fiber structure claim 1 , comprising 10% by weight or higher of the ...

Crosslinked blends of polyphenylene sulfide and polyphenylsulfone for downhole applications, methods of manufacture, and uses thereof

A composition includes a crosslinked product of a polyphenylene sulfide and a polyphenylsulfone. A method for the manufacture of the crosslinked product of a polyphenylene sulfide and a polyphenylsulfone includes heating the polyphenylene sulfide and the polyphenylsulfone in presence of a crosslinking agent at a temperature and for a time effective to form the crosslinked product of polyphenylene sulfide and polyphenylsulfone.

POLYIMIDE FIBER WITH HIGH STRENGTH AND HIGH MODULUS AND ITS PREPARATION METHOD

A high-strength high-modulus polyimide fiber and its preparation method pertain to the technical field of high-performance organic fiber. This fiber includes the polyimide (PI) fiber made from 3,3′,4,4′-biphenyl tetracarboxylic diandhydride (BPDA), p-phenylenediamine (pPDA) and 2-(4-aminophenyl)-1H-benzimidazol-5-amine (BIA), wherein the molar ratio between PPDA and BIA is 1:10˜3:1. During the synthesis, other diamine and diandhydride monomers may also be added. In the preparation process, the gradient temperature reaction method and one-step continuous preparation method are adopted, the synthesis and processing difficulty caused by the increase of the content of BIA is overcome, the problem of poor uniformity and stability of fiber is solved and PI fiber with high strength and high modulus is obtained. Its strength may reach 4.5 GPa and modulus may reach 201 GPa. Moreover, the sources of the raw materials are extensive, the spinning process is continuous, the cost is low, the efficiency is high and industrial production may be realized. 144. A high-strength high-modulus polyimide fiber , comprising polyimide fiber obtained from random copolymerization of 3 , 3′ , , ′-benzophenone tetracarboxylic dianhydride (BPDA) , p-phenylenediamine (pPDA) and 2-(4-aminophenyl)-1H-benzimidazol-5-amine (BIA) , wherein molar ratio between pPDA and BIA is 1:10˜3:1.2. The high-strength high-modulus polyimide fiber according to claim 1 , wherein the polyimide fiber comprises copolymerization of BPDA claim 1 , pPDA and BIA with other diamine or/and dianhydride claim 1 , wherein molar ratio between said other diamine and the total addition amount of pPDA and BIA is 1:10˜1:4 claim 1 , molar ratio between said other dianhydride and BPDA is 1:10˜3:7.3. A method for preparing the high-strength high-modulus polyimide fiber according to claim 1 , comprising the following steps:A: providing pPDA, BIA and BPDA at a molar ratio of 1:0.95˜1:1.05 between pPDA and BPDA And at a molar ratio of 1:10 ...

LIQUID CRYSTAL ALIGNMENT FILM, METHOD FOR PREPARING SAME AND LIQUID CRYSTAL DISPLAY DEVICE COMPRISING SAME

The invention provides a liquid crystal alignment film, a method for preparing the same and a liquid crystal display device comprising the same. The alignment film comprises polyimide obtained by reacting the compound as shown in Formula 2 or Formula 3 with the aromatic diamine as shown in Formula 1, wherein the R, R, R, R, R, R, R, R′, R′, R′, R′, R′, R′, R′, or R′ substituent is H, alkyl, aralkyl or haloalkyl, and the Ar is aryl. The liquid crystal alignment film has a tactic spatial configuration, decreases the π-π attractive interaction between the polyimide backbones, allows the directional and homogenous alignment of the liquid crystal molecules on the surface of the polyimide, and thereby increases the contrast of the liquid crystal display. 3. The liquid crystal alignment film according to claim 1 , wherein the R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , R′ claim 1 , or R′ substituent is alkyl containing 1-10 carbon atoms claim 1 , aralkyl containing 6-20 carbon atoms or haloalkyl containing 1-10 carbon atoms; and the Ar is phenyl claim 1 , biphenylyl or diphenyl ether radical.4. The liquid crystal alignment film according to claim 3 , wherein the alkyl is methyl claim 3 , ethyl claim 3 , n-propyl claim 3 , isopropyl claim 3 , n-butyl claim 3 , isobutyl or t-butyl.5. The liquid crystal alignment film according to claim 3 , wherein the aralkyl is phenyl claim 3 , tolyl claim 3 , benzyl or triphenylmethyl.6. The liquid crystal alignment film according to claim 3 , wherein the haloalkyl is difluoromethyl or trifluoromethyl.7. A liquid crystal display device claim 1 , wherein said liquid crystal display device comprises the liquid crystal alignment film according to .9. The method of preparation according to claim 8 , whereinthe duration of mixing and agitation in the step 1) is about 24 h; andin the step 2), after the polyamic acid is evenly ...

Coating Composition Including High Molecular Weight Polycarbodiimide, Method Of Preparing Same, And Method Of Preparing Coating On A Substrate

A coating composition comprises a high molecular weight polycarbodiimide. The high molecular weight polycarbodiimide is produced via a method. A method of preparing the coating composition and a method of forming a coating on a substrate with the coating composition are also disclosed. 1. A coating composition , comprising: providing an isocyanate component comprising toluene diisocyanate (TDI);', 'providing a carbodiimidization catalyst;', 'providing a first solvent having a boiling point temperature of from about 50 to about 150° C.;', 'polymerizing the isocyanate component for a first period of time in the first solvent and in the presence of the carbodiimidization catalyst to produce a reaction mixture including at least one carbodiimide compound and the first solvent;', 'combining a second solvent, which is the same as or different from the first solvent, and the reaction mixture; and', 'polymerizing the at least one carbodiimide compound for a second period of time in the first and second solvents and in the presence of the carbodiimidization catalyst to produce said high molecular weight polycarbodiimide., 'a high molecular weight polycarbodiimide, which is formed from the steps of2. A coating composition set forth in wherein said high molecular weight polycarbodiimide has a mole fraction percentage greater than 0 having a molecular weight of at least about 100 claim 1 ,000.3. A coating composition as set forth in wherein said high molecular weight polycarbodiimide has a mole fraction percentage greater than 0 having a molecular weight of at least about 500 claim 1 ,000.4. A coating composition as set forth in wherein the first solvent comprises an aromatic solvent.5. A coating composition as set forth in wherein the second solvent comprises a cyclic ether.6. A coating composition as set forth in wherein the first solvent comprises toluene and the second solvent comprises tetrahydrofuran (THF).7. A coating composition as set forth in wherein the first period ...

POLYIMIDE RESINS FOR HIGH TEMPERATURE APPLICATIONS

Polyimide resin compositions that contain an aromatic polyimide, graphite, and acid-washed fibrous clay are found to exhibit high thermal oxidative stability. Such compositions are especially useful in molded articles that are exposed to high temperatures, such as bushings, bearings, and seal rings that are used in aerospace, transportation, and materials handling applications. 1. A composition comprising in admixture(a) an aromatic polyimide in an amount between about 30 and about 90 weight parts;(b) acid-washed fibrous clay in an amount between about 0.5 and about 12 weight parts, and(c) graphite in an amount between about 0 and about 60 weight parts; wherein all weight parts combined together total to 100 weight parts.2. The composition according to wherein the fibrous clay is sepiolite or attapulgite.3. The composition according to wherein the fibrous clay is rheological grade sepiolite or rheological grade attapulgite.4. The composition according to wherein component (a) is present in an amount between about 40 and 54 weight parts; component (b) is present in an amount between about 0.5 and about 12 weight parts; andcomponent (c) is present in an amount between about 46 and about 60 weight parts.5. A three-dimensional article comprising an aromatic polyimide resin composition claim 1 , said composition comprising in admixture(a) an aromatic polyimide in an amount between about 30 and about 90 weight parts;(b) acid-washed fibrous clay in an amount between about 0.5 and about 12 weight parts; and(c) graphite in an amount between about 0 and about 60 weight parts; wherein all weight parts combined together total to 100 weight parts.6. The article according to wherein the fibrous clay is sepiolite or attapulgite.7. The article according to wherein the fibrous clay is rheological grade sepiolite or rheological grade attapulgite.10. The article according to wherein greater than 60 to about 85 mol % of the Rgroups comprise p-phenylene radicals claim 9 , and about 15 ...

POLYIMIDE RESINS FOR HIGH TEMPERATURE APPLICATIONS

Polyimide resin compositions that contain an aromatic polyimide, graphite, and acicular titanium dioxide are found to exhibit high thermal oxidative stability. Such compositions are especially useful in molded articles that are exposed to high temperatures, such as bushings, bearings, and seal rings that are used in aerospace, transportation, and materials handling applications. 2. The composition according to wherein component (a) is present in an amount between about 40 and 54 weight parts; component (b) is present in an amount between about 0.5 and about 10 weight parts; and component (c) is present in an amount between about 46 and about 60 weight parts.3. A composition comprising in admixture(a) an aromatic polyimide in an amount between about 35 and about 90 weight parts;(b) acicular titanium dioxide particles in an amount between about 0.5 and about 4.8 weight parts, wherein the average particle diameter is between about 10 and about 500 nm and the average particle length is between about 1 and about 100 μm, provided that the particle aspect ratio is at least 3; and(c) graphite in an amount between about 0 and about 60 weight parts;wherein all weight parts combined together total to 100 weight parts.7. The article according to wherein greater than 60 to about 85 mol % of the Rgroups comprise p-phenylene radicals claim 6 , and about 15 to less than 40 mol % comprise m-phenylene radicals.8. The article according to further comprising as a component (d) one or more additives in an amount in the range of about 5 to about 70 wt % based on the weight of the total (a)+(b)+(c)+(d) composition.9. The article according to which is in the form of a rod claim 4 , a rube claim 4 , a plaque claim 4 , a ring claim 4 , a disc claim 4 , or a bar.10. The article according to which comprises a bushing claim 4 , bearing claim 4 , washer claim 4 , seal ring claim 4 , wear pad claim 4 , wear strip claim 4 , spline claim 4 , gasket claim 4 , slide block claim 4 , or valve component ...

Liquid crystal display

A liquid crystal display including a first substrate; a second substrate facing the first substrate; a thin film transistor disposed on the first substrate; an organic layer disposed on the thin film transistor; a pixel electrode disposed on the organic layer; a lower alignment layer disposed on the pixel electrode; a common electrode disposed on the second substrate; and an upper alignment layer disposed on the common electrode, wherein a first free radical included in the organic layer and a second free radical included in at least one of the lower alignment layer and the upper alignment layer are radical bonded.

METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE

The present invention provides a thermoplastic resin composition, which is excellent in low-temperature toughness and high-temperature creep characteristics, by a method for producing a thermoplastic resin composition by melt-kneading: 1. A method for producing a thermoplastic resin composition by melt-kneading:(a) a polyphenylene sulfide resin, with{'sup': '2', '(b) a polyetherimide resin or a polyethersulfone resin, wherein the thermoplastic resin composition contains 99 to 1% by weight of the component (a) and 1 to 99% by weight of the component (b) based on 100% by weight of the total amount of the component (a) and the component (b); the melt-kneading step is the step of melt-kneading by an extruder provided with an elongational flow zone which is a zone in which melt-kneading is performed while being allowed to undergo elongational flow; and a flow effect pressure drop before and after the elongational flow zone is from 50 to 1,000 kg/cm.'}2. The method for producing a thermoplastic resin composition according to claim 1 , wherein a ratio of the total length of the elongational flow zone to the full length of a screw of the extruder is from 5 to 60%.3. The method for producing a thermoplastic resin composition according to claim 1 , which satisfies the equation Lk/D=0.2 to 10 claim 1 , where Lk denotes the length of one elongational flow zone in a screw of the extruder claim 1 , and D denotes a screw diameter.4. A thermoplastic resin composition comprising:(a) a polyphenylene sulfide resin, and(b) a polyetherimide resin or a polyethersulfone resin, wherein the thermoplastic resin composition contains 99 to 1% by weight of the component (a) and 1 to 99% by weight of the component (b) based on 100% by weight of the total amount of the component (a) and the component (b), and also satisfies the following conditions:(i) tensile elongation, measured in accordance with ASTM-D638 under the conditions of a tension speed of 10 mm/minute and an ambient temperature of − ...

MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO

The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. 1. A base film comprising: i. at least 50 mole percent of an aromatic dianhydride, based upon a total dianhydride content of the polyimide, and', 'ii. at least 50 mole percent of an aromatic diamine based upon a total diamine content of the polyimide;, 'A. a chemically converted polyimide in an amount from 40 to 90 weight percent of the base film, the chemically converted polyimide being derived from 'wherein the thickness of the base film is from 8 to 152 microns.', 'B. a filler, excluding low conductivity carbon black and pigments, in an amount from 10 to 60 wt % of the base film; and'}2. The base film in accordance with wherein the chemically converted polyimide is made by the step of mixing a polyamic acid solution with a catalyst or dehydrating agent capable of converting a polyamic acid to a polyimide.3. The base film in accordance with wherein: pyromellitic dianhydride,', '3,3′,4,4′-biphenyl tetracarboxylic dianhydride,', '3,3′,4,4′-benzophenone tetracarboxylic dianhydride;', '4,4′-oxydiphthalic anhydride,', '3,3′,4,4′-diphenyl sulfone tetracarboxylic dianhydride,', '2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane,', 'Bisphenol A dianhydride, and', ' ...

POLYIMIDE SHEET AND MANUFACTURING METHOD THEREOF

[Problem] 1. A polyimide sheet formed by laminating at least two polyimide films , such that a thickness of the polyimide sheet is at least 0.2 mm , and a linear expansion coefficient in any two orthogonal directions in a plane is at most 10 ppm/° C.2. The polyimide sheet described in claim 1 , which is obtained by laminating at least two polyimide films having a linear expansion coefficient in the tensile mode in at least one planar direction of at least 10 ppm/° C.3. The polyimide sheet described in or claim 1 , wherein the following relationships apply claim 1 , when αT is a modulus of elasticity in a direction TD and αM is a modulus of elasticity in a direction MD claim 1 , in a bend test of a polyimide sheet obtained by laminating polyimide films in a same direction claim 1 , and when β2 is a modulus of elasticity in a direction orthogonal to β1 and β1 claim 1 , which are moduli of elasticity in desired directions claim 1 , in a bend test of a polyimide sheet obtained by laminating after rotating each polyimide film to a desired angle:{'br': None, 'i': M+αT', 'αM+αT, '(α)/2)−0.5[GPa]≦β1≦()/2)+0.5[GPa],'}{'br': None, 'and'}{'br': None, 'i': M+αT', 'αM+αT, '(α)/2)−0.5[GPa]≦β2≦()/2)+0.5[GPa].'}4. The polyimide sheet described in any of through 3 claims 1 , wherein the following relationships apply claims 1 , when yT is a maximum stress in a direction TD and yM is a maximum stress in a direction MD claims 1 , in a bend test of a polyimide sheet obtained by laminating polyimide films in a same direction claims 1 , and when δ2 is a maximum stress in a direction orthogonal to δ1 and δ1 claims 1 , which are maximum stresses in desired directions claims 1 , in a bend test of a polyimide sheet obtained by laminating after rotating each polyimide film to a desired angle:{'br': None, 'i': M+γT', 'γM+γT, '(γ)/2)−20[MPa]≦δ1≦()/2)+20[MPa],'}{'br': None, 'and'}{'br': None, 'i': M+γT', 'γM+γT, '(γ)/2)−20[MPa]≦δ2≦()/2)+20[MPa].'}5. A method of manufacturing a polyimide sheet ...

PIGMENTED POLYIMIDE FILMS AND METHODS RELATING THERETO

The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer. 1. A base film comprising:A. a chemically converted polyimide in an amount from 63 to 96 weight percent of the base film, the chemically converted polyimide being derived from:a. at least 50 mole percent of an aromatic dianhydride, based upon a total dianhydride content of the polyimide, andb. at least 50 mole percent of an aromatic diamine based upon a total diamine content of the polyimide;B. a pigment, other than carbon black, present in an amount from 2 to 35 weight percent of the base film; andC. a particulate matting agent that is alumina, barium sulfate, mixtures of at least two of alumina, barium sulfate and silica, the matting agent:a. is present in an amount from 1.6 to 10 weight percent of the base film,b. has a median particle size from 1.3 to 10 microns,c. has a density from 2 to 4.5 g/cc such that the base film has a 60 degree gloss from 2 to 35.2. The base film in accordance with wherein:a. the aromatic dianhydride is selected from the group consisting of:pyromellitic dianhydride,3,3′,4,4′-biphenyl tetracarboxylic dianhydride,3,3′,4,4′-benzophenone tetracarboxylic dianhydride,4,4′-oxydiphthalic anhydride,3,3′,4,4′-diphenyl sulfone tetracarboxylic ...

POLYETHERIMIDE POLYCARBONATE BLENDS

The disclosure relates to compositions exhibiting a UV resistance of ΔE ranging from more than 0 to less than or equal to 10 units after exposure to ultraviolet light for 300 hours, per ASTM D-4459 protocol. The compositions can include at least 15 wt. % of a polyetherimide; at least 35 wt. % of a polycarbonate; a polyetherimide siloxane; and optionally, at least one UV stabilizer. The disclosure also relates to methods of shaping such compositions and articles produced from such compositions. 2. The composition of claim 1 , wherein the polyetherimide is a homopolymer.3. The composition of claim 1 , wherein the weight ratio of polycarbonate to polyetherimide provides the composition with a melt index ranging from 1.5 to 6 g/min. claim 1 , at 295° C. and at a loading level of 6.7 kg claim 1 , wherein the melt index is sufficient to enable the composition to be molded into a cavity having a dimension greater than 0 and less than or equal to 3 mm.4. The composition of claim 3 , wherein the melt index is sufficient to enable the composition to be molded into a cavity having a dimension greater than 0 and less than or equal to 1 mm.5. The composition of wherein the polycarbonate is present in an amount of at least 50 wt. %.6. The composition of claim 1 , wherein the polycarbonate is a copolymer of polycarbonate and siloxane.7. The composition of claim 1 , wherein the polycarbonate is a homopolymer.8. The composition of claim 1 , wherein the weight ratio of polycarbonate to polyetherimide is from 2:5 to 4:5.9. The composition of claim 8 , wherein the impact strength is greater than 50 μm.10. The composition of claim 1 , further comprising a phosphorus stabilizer in an amount of between 0.1-10 wt. %.11. The composition of claim 1 , having a tensile modulus of elasticity (MPa) of from 2800 MPa to 3300 MPa.12. The composition of claim 1 , wherein the tensile elongation at yield ranges from 2% to 20%.13. The composition of claim 1 , wherein the tensile elongation at break ...

RESIN COMPOSITION, COMPOSITE CURED PRODUCT USING SAME, AND METHOD FOR PRODUCING THE COMPOSITE CURED PRODUCT

A resin composition including 10 to 90% by mass of (A) a component to be polymerized containing a compound represented by Formula (1), and 90 to 10% by mass of (B) a thermosetting resin, the (A) and (B) each being capable of undergoing a reaction to increase molecular weight by itself when heated: 2. The resin composition according to claim 1 , wherein said compound represented by Formula (1) is one selected from the group consisting of a cyclic polyphenylene sulfide claim 1 , a cyclic polyphenylene ether ether ketone claim 1 , a cyclic polyphenylene ether ketone and a cyclic polyphenylene ether sulfone.3. The resin composition according to claim 1 , wherein said (B) is one selected from the group consisting of an epoxy resin claim 1 , a bismaleimide resin and a polyimide resin.4. The resin composition according to claim 1 , further comprising a zero-valent transition metal compound.5. The resin composition according to claim 4 , wherein said zero-valent transition metal compound comprises a metal belonging to Groups 8 to 11 and Periods 4 to 6 of the periodic table.6. The resin composition according to claim 1 , further comprising an alkali metal salt.7. The resin composition according to claim 1 , further comprising (C) a reinforcement fiber.8. The resin composition according to claim 7 , wherein said (C) reinforcement fiber is a carbon fiber.9. A method of producing a composite cured product comprising allowing the resin composition according to to react by heating to obtain a composite cured product.10. A method of producing a composite cured product comprising impregnating the resin composition according to into a reinforcement fiber and then allowing said resin composition to react by heating to obtain a composite cured product.12. The composite cured product according to claim 11 , further comprising (C) a reinforcement fiber.13. The resin composition according to claim 2 , wherein said (B) is one selected from the group consisting of an epoxy resin claim 2 , ...

Liquid crystal display deviceand methods for manufacturing the same

A liquid crystal display device includes a first substrate having a first alignment base layer disposed thereon, a second substrate facing the first substrate and having a second alignment base layer disposed thereon, and ferroelectric liquid crystals vertically aligned between the first substrate and the second substrate. The first alignment controller combines with the first alignment base layer and includes a side chain longer than that of the first alignment base layer. The second alignment controller combines with the second alignment base layer and includes a side chain longer than that of the second alignment base layer. The ferroelectric liquid crystals are pre-tilted by the first alignment controller and the second alignment controller, and as a result, transmittance may be improved. Because the ferroelectric liquid crystals are pre-tilted, a cell gap may be decreased and high-speed driving may be possible at a low voltage.

TRANSPARENT POLYIMIDE FILM AND PREPARATION METHOD THEREOF

The present invention relates to a transparent polyimide film with improved tensile strength and a preparation method thereof, and more specifically to a colorless, transparent polyimide film having excellent optical properties and improved tear strength at the same time through the use of a monomer containing a functional group or an improver for improving tensile strength, and a preparation method thereof, wherein the functional group is selected from the group consisting of a hexafluoro group, a sulfone group, and an oxy group. 1. A method of preparing a transparent polyimide film , comprising the steps of:copolymerizing an aromatic dianhydride and an aromatic diamine to obtain polyamic acid; andcasting the polyamic acid on a support to imidize the polyamic acid,wherein the method further comprises the step of introducing an additive for improving tear strength before or after obtaining the polyamic acid, orthe step of introducing a monomer including a functional group selected from the group consisting of a hexafluro group, a sulfone group and an oxy group before obtaining the polyamic acid.2. The method of claim 1 , wherein the additive is at least one selected from among polyphenylsilsesquioxane claim 1 , tetramethoxy silane claim 1 , tetraethoxy silane claim 1 , tetrabutoxy silane claim 1 , 3-aminopropyl triethoxy silane claim 1 , and 3-aminopropyl trimethoxy silane.3. The method of claim 1 , wherein the additive is included in an amount of 0.001-20 parts by weight based on 100 parts by weight of the polyamic acid.4. A transparent polyimide film claim 1 , comprising:a unit structure derived from an aromatic dianhydride and an aromatic diamine,wherein the transparent polyimide film further comprises an additive for improving tear strength, ora unit structure derived from a monomer including a functional group selected from the group consisting of a hexafluro group, a sulfone group and an oxy group.5. The transparent polyimide film of claim 4 , wherein the ...

COMPOSITES INCLUDING SILICON-OXY-CARBIDE LAYERS AND METHODS OF MAKING THE SAME

Composites comprising at least one silicon-oxy-carbide (SOC) layer deposited onto a polymeric matrix substrate to enhance their thermo-oxidative stability are provided. The SOC layer is formed onto the polymeric matrix substrate by atmospheric plasma deposition to produce an thermo-oxidative barrier coating or an adhesion-promoting layer to enable the deposition of a variety of known (or future developed) metallic and/or ceramic materials as oxygen and/or thermal barriers. 1. A composite , comprising: a polymeric substrate and a thermo-oxidative barrier coating comprising a silicon-oxy-carbide (SOC) layer having a thickness from about 100 to about 900 nm and covering at least one surface of the polymeric substrate.2. The composite of claim 1 , wherein the SOC layer is formed by atmospheric plasma deposition.3. The composite of claim 2 , wherein the SOC layer includes a carbon content ranging from about 3% to about 50%.4. The composite of claim 2 , wherein the SOC layer includes a silicon content ranging from about 3% to about 50%.5. The composite of claim 2 , wherein the SOC layer includes an oxygen content ranging from about 3% to about 50%.6. The composite of claim 2 , wherein the SOC layer reduces oxygen diffusion into the polymeric substrate.7. The composite of claim 6 , wherein said composite comprises a thermo-oxidative stability (TOS) of less than about 5.0% weight loss relative to a composite comprising the same polymeric substrate and being devoid of the SOC layer.8. The composite of claim 6 , wherein said composite comprises a thermo-oxidative stability (TOS) of less than about 2.0% weight loss relative to a composite comprising the same polymeric substrate and being devoid of the SOC layer.9. The composite of claim 2 , wherein the polymeric substrate comprises a polymeric matrix selected from a polyimide claim 2 , an epoxy claim 2 , bismaleimide claim 2 , and a cyanate ester.10. The composite of claim 2 , wherein the polymeric substrate comprises a ...

METHODS OF SOLUBILIZING MILLING MEDIA IN PIGMENT PARTICLE DISPERSIONS

The present invention describes methods for preparing a pigment particle dispersion. Specifically, a premix composition including pigments, dispersants and a liquid carrier is milled by a solid milling agent to predetermined particle size. The solid milling agent is solubilized in the liquid carrier which eliminates the need for separating the solid milling agent from the dispersion. 1. A method for preparing an in-situ , pigment particle dispersion comprising:providing a premix composition including one or more pigments, one or more dispersants, and a liquid carrier;milling said premix composition in the presence of a solid milling agent to a predetermined particle size whereby said solid milling agent is substantially insoluble in said liquid carrier; andsolubilizing said solid milling agent in said liquid carrier.2. The method according to claim 1 , wherein said solubilizing said solid milling agent is carried out after obtaining said predetermined particle size.3. The method according to or claim 1 , wherein said solubilizing said solid milling agent is carried out by neutralizing via pH adjustment.4. The method according to claim 3 , wherein said pH adjustment is addition of an acid.5. The method according to claim 3 , wherein pH adjustment is addition of a base.6. The method according to claim 4 , wherein said acid is selected from acetic acid claim 4 , lactic acid claim 4 , phosphoric acid claim 4 , hydrochloric acid claim 4 , or combinations thereof.7. The method according to claim 5 , wherein said base is selected from ammonia claim 5 , monoethylamine claim 5 , triethylamine claim 5 , sodium hydroxide claim 5 , potassium hydroxide claim 5 , or combinations thereof.8. The method according to or claim 5 , wherein said solubilizing said solid milling agent is carried out by adding one or more additional solvents to said premix composition.9. The method according to or claim 5 , wherein said solubilizing said solid milling agent is carried out by neutralizing ...

POLYMER PARTICLE, AQUEOUS DISPERSION INCLUDING THE SAME, AND FLUORORESIN COATING COMPOSITION USING THE SAME

The present invention provides a polymer particle comprising a polymer and a filler contained therein, wherein the polymer is soluble in an organic solvent and is also water insoluble, and wherein the polymer particle contains from 5 to 500 parts by weight of filler per 100 parts by weight of polymer, and a mean particle size of 75 μm or less. The invention also provides an aqueous dispersion including this particle; an aqueous fluororesin coating composition that uses this aqueous dispersion; and a fluororesin laminate or layered coating having a layer obtained from this fluororesin coating composition. 1. A polymer particle comprising a polymer and a filler contained therein , wherein the polymer is soluble in an organic solvent and is also water insoluble , and wherein the polymer particle contains from 5 to 500 parts by weight of filler per 100 parts by weight of polymer , and a mean particle size of 75 μm or less.2. The polymer particle according to claim 1 , wherein the polymer is at least one selected from polyimides claim 1 , polyamide imides claim 1 , polyamides claim 1 , polyesters claim 1 , polyethylene terephthalate claim 1 , polyphenylene sulfide claim 1 , polysulfones claim 1 , polyetherimides claim 1 , and polyethersulfones.3. The polymer particle according to or claim 1 , wherein the filler is an organic particle or inorganic particle.4. The polymer particle according to claim 3 , wherein the inorganic particle is at least one selected from silicon carbide claim 3 , silicon oxide claim 3 , aluminum oxide claim 3 , zinc oxide claim 3 , tin oxide claim 3 , titanium dioxide claim 3 , barium sulfate claim 3 , and carbon black.5. The polymer particle according to claim 3 , wherein the organic particle is at least one selected from polyphenylene sulfide claim 3 , polyetheretherketone claim 3 , and aramid.6. A polymer particle aqueous dispersion comprising a polymer particle according to and an organic solvent in which the polymer of said polymer particle ...

POLYAMIC ACID RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME

The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A′, C, C′ are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A′, or C, C′. 4. The polyamic acid resin composition according to claim 1 , further comprising (c) inorganic particles. The present invention relates to a polyamic acid resin composition. More specifically, the present invention relates to a polyamic acid resin composition to be used suitably for, e.g., flexible substrates of a flat-panel display, electronic paper, a solar battery, and the like; a surface protective coat for a semiconductor device; a dielectric film among layers; an insulation layer or spacer layer of an organic electro-luminescence device (organic EL device); a planarization layer of a thin film transistor substrate; an insulation layer of an organic transistor; a flexible printed circuit board; and a binder for electrodes of a lithium ion secondary battery.Organic films are advantageous in that they are excellent in flexibility and less prone to rupture as compared with glass. Recently, there is an increasing move toward rendering displays more flexible by replacing the substrates of flat display panels from conventional glass to organic films.In the event that a display is produced on an organic film, a process is common in which the organic film is formed on a substrate and the organic film is peeled off from the substrate after the production of a device. An organic film can be formed on a substrate by the following methods. One example is a method in which an organic film is stuck on a glass substrate with an adhesive (e.g., Patent Document 1). Alternatively, another example is a method in which a substrate is coated with a solution containing a resin as a raw material of a film ...

CHLORO-SUBSTITUTED POLYETHERIMIDES HAVING IMPROVED RELATIVE THERMAL INDEX

A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed. 1. A polymer comprising a polyetherimide having an OH content that is greater than 0 and less than or equal to 100 parts per million by weight (ppm) and a chlorine content that is greater than 0 ppm.3. The polyetherimide of claim 1 , wherein chlorine content is present in an amount greater than 0 to 4 claim 1 ,000 ppm.4. The polyetherimide of claim 1 , wherein the polyetherimide has a flame retardant rating of V0 at 1.5 mm.5. The polyetherimide of claim 3 , wherein the polyetherimide has a flame retardant rating of V0 at 0.8 mm.7. A composition comprising the polyetherimide of claim 6 , and an additional polymer.8. The composition of claim 6 , wherein the polymer is selected from the group consisting of polyesters claim 6 , polycarbonates claim 6 , polyolefins claim 6 , polysulfones claim 6 , polyphenylene sulfides claim 6 , polyetheretherketones claim 6 , polyethersulfones claim 6 , polyamides claim 6 , polyamideimides claim 6 , polyimides other than the polyetherimide of claim 6 , and combinations thereof.9. A composition comprising the polyetherimide of and an additional polymer.10. The composition of claim 1 , wherein the polymer is selected from the group consisting of polyesters claim 1 , polycarbonates claim 1 , polyolefins claim 1 , polysulfones claim 1 , polyphenylene sulfides claim 1 , polyetheretherketones claim 1 , polyethersulfones claim 1 , polyamides claim 1 , polyamideimides claim 1 , polyimides other than the polyetherimide of claim 1 , and combinations thereof.11. A method for preparing the polyetherimide of claim 1 , which comprises contacting claim 1 , in o-dichlorobenzene or anisole as diluent claim 1 , substantially equimolar amounts of a disodium salt of a dihydroxy compound of formula HO—R′—OH claim 1 , and a slurry of a ...

CARBOXYL GROUP-CONTAINING POLYIMIDE, THERMOSETTING RESIN COMPOSITION AND FLEXIBLE METAL-CLAD LAMINATE

The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide. 119-. (canceled)20. A thermosetting resin composition to be used as a resist layer of a printed circuit board which is characterized in that it contains a carboxyl group-containing polyimide and an oxirane ring-containing compound , and in that said carboxyl group-containing polyimide has such a structure where the chain of a terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound , wherein said terminal acid anhydride group-containing imide prepolymer has been produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound.21. The thermosetting resin composition according to claim 20 , wherein the using amount of an oxirane ring-containing compound is 2 to 100 parts by weight to 100 parts by weight of the carboxyl group-containing polyimide.22. The thermosetting resin composition according to claim 20 , wherein it further contains a phosphorus atom-containing organic filler.23. The thermosetting resin composition according to claim 22 , wherein the ratio by weight of the carboxyl group-containing ...

Polyimide seamless belt and process for production thereof, and polyimide precursor solution composition

A seamless belt formed of a polyimide including a repeating unit represented by the formula (1): in which 25 mol % to 95 mol % of A is a tetravalent unit represented by the formula (2): 75 mol % to 5 mol % of A is a tetravalent unit represented by the formula (3): 15 mol % to 95 mol % of B is a divalent unit represented by the formula (4): and 85 mol % to 5 mol % of B is a divalent unit represented by the formula (5):

POLYETHERIMIDES, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM

Polyetherimide compositions are described wherein the polyetherimide composition comprises a polyetherimide comprising a reacted combination of alkali metal salts comprising an alkali metal salt of a dihydroxy aromatic compound and an alkali metal salt of a monohydroxy aromatic compound with a bis(halophthalimide), wherein the alkali metal salt of the monohydroxy aromatic compound is included in an amount of greater or equal to 5 mole percent based on the total moles of the alkali metal salts, and the polyetherimide has a weight average molecular weight less than 43,000 Daltons. The polyetherimide exhibits lower levels of chlorine and chlorine end groups, lower levels of bis(halophthalimide) and bis(phthalimide), and low plate-out during manufacturing. 3. The polyetherimide composition of claim 1 , wherein the polyetherimide comprises from 0.5 to 4 weight percent of a monohydroxy aromatic compound substituent claim 1 , based on the total weight of the polyetherimide.4. The polyetherimide composition of claim 1 , wherein a total content of residual bis(halophthalimide) and residual bis(phthalimide) is less than 0.05 weight percent claim 1 , based on the total weight of the polyetherimide.5. The polyetherimide composition of claim 1 , wherein a total content of residual bis(halophthalimide) is less than 600 ppm claim 1 , based on the total weight of the polyetherimide.6. The polyetherimide composition of claim 1 , wherein a content of chloride is less than 3000 ppm claim 1 , based on the total weight of the polyetherimide.7. The polyetherimide composition of claim 1 , wherein the composition has a plate-out weight of less than 1.1 mg claim 1 , when determined using 200 shots from a 100° F. (37.8° C.) mold having the dimensions of 5×6×0.16 inches (12.7×15.2×0.4 cm).8. The polyetherimide composition of claim 1 , wherein the composition has a plate-out weight of less than 1.1 mg claim 1 , when determined using 200 shots from a 350° F. (177° C.) Dynatup having the ...

POLYAMIDE-IMIDE RESIN COMPOSITION, POLYAMIDE-IMIDE RESIN FILM USING THE RESIN COMPOSITION, AND SEAMLESS BELT INCLUDING THE RESIN FILM

A polyamide-imide resin composition according to embodiment of the present invention, including a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other, wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %. 1. A polyamide-imide resin composition , comprising a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other , wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %.2. A polyamide-imide resin composition according to claim 1 , wherein the acid components (A) contain a hydrogenated dimer acid.3. A polyamide-imide resin composition according to or claim 1 , wherein the polyisocyanate component comprises contain an aromatic diisocyanate.4. A polyamide-imide resin composition according to or claim 1 , wherein the acid components (A) further contain a tricarboxylic anhydride and a ratio of the tricarboxylic anhydride in the acid components (A) is 90 mol % to 97 mol %.5. A polyamide-imide resin film claim 1 , which is obtained by using the polyamide-imide resin composition according to .6. A polyamide-imide resin film according to claim 5 , wherein the film has a rupture elongation of 60% or more.7. A polyamide-imide resin film according to claim 5 , wherein the film has a remaining solvent amount of 2% or less.8. A seamless belt claim 5 , comprising the polyamide-imide resin film according to . This application claims priority under 35 U.S.C. Section 119 to Japanese Patent Application No. 2012-144173 filed on Jun. 27, 2012, which are herein incorporated by references.1. Field of the InventionThe present invention related to a polyamide-imide resin composition, a polyamide-imide resin film using the resin composition, and a seamless belt including the resin film.2. Description of the Related ArtA polyamide-imide resin is a resin ...

Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4' diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance

A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more. In the formula, R 1 and R 2 are a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of R 1 and R 2 is the aromatic hydrocarbon group having 6 to 10 carbon atoms; R 3 is an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, R 3 s are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.

Organic el element, radiation-sensitive resin composition, and cured film

The organic EL display element is constituted by having a substrate, a TFT disposed on the substrate, a protective film covering the TFT, an anode disposed on the protective film, an organic luminescent layer disposed on the anode, a bank that defines an arranging area for the organic luminescent layer, and a cathode disposed on the organic luminescent layer. At least one of the protective film and bank is constituted as a cured film that is formed by using a radiation-sensitive resin composition containing a resin and a compound having a quinonediazide structure, contains a resin and at least one of a compound having a quinonediazide structure and a compound having an indenecarboxylic acid structure, and has an excellent patterning property.

Material for alignment layer of liquid crystal display

The present invention provides a material for alignment layer of liquid crystal display, which includes a solvent and a polymer dissolved in the solvent. The polymer includes a backbone and a first side chain linked to the backbone. The first side chain has a stronger lateral dipole moment. The material for alignment layer of liquid crystal display is characterized in that a first side chain that contains both a flexible chain segment and rigid chain segment is linked to the backbone of the polymer and the first side chain has a stronger lateral dipole moment, making it taking a rotation or tilting motion under the application of an electric field so as to effect alignment of the liquid crystal molecules in the pre-tilt angle.

ACRYLIC RESIN FILM

Disclosed herein is an acrylic resin film having excellent heat resistance and mechanical strength, less fish-eyes, and high transparency. The acrylic resin film is obtained by molding a resin composition containing a glutarimide acrylic resin (G) and a (meth)acrylic resin (F) obtained by polymerization of a vinyl group-containing compound in the presence of alkyl acrylate-based cross-linked elastic particles having an average particle size of less than 80 nm. 3. The acrylic resin film according to claim 1 , wherein claim 1 , when an amount of the resin composition is taken as 100 wt % claim 1 , an amount of the alkyl acrylate-based cross-linked elastic particles contained in the resin composition is 5 to 40 wt %.4. The acrylic resin film according to claim 1 , wherein claim 1 , when an amount of the resin composition is taken as 100 wt % claim 1 , amounts of the glutarimide acrylic resin (G) and the (meth)acrylic resin (F) contained in the resin composition are 40 to 90 wt % and 60 to 10 wt % claim 1 , respectively.5. The acrylic resin film according to claim 1 , wherein the (meth)acrylic resin (F) is obtained by polymerization of a monomer mixture (E) containing 60 to 100 wt % of alkyl methacrylate and 0 to 40 wt % of alkyl acrylate in the presence of alkyl acrylate-based cross-linked elastic particles (B) having an average particle size of less than 80 nm and obtained by copolymerization of 100 parts by weight of a monomer mixture containing 50 to 100 wt % of alkyl acrylate and 50 to 0 wt % of alkyl methacrylate and 0.5 to 5 parts by weight of a polyfunctional monomer having two or more non-conjugated double bonds per molecule.6. The acrylic resin film according to claim 1 , wherein the (meth)acrylic resin (F) is obtained by polymerization of a monomer mixture (E) containing more than 10 wt % but 35 wt % or less of unsaturated carboxylic acid claim 1 , 50 wt % or more but less than 90 wt % of alkyl methacrylate and 0 wt % or more but less than 40 wt % of alkyl ...

POLYIMIDE FILM INCORPORATING POLYIMIDE POWDER DELUSTRANT, AND MANUFACTURE THEREOF

A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films. 1. A polyimide film comprising:a polyimide layer including a polyimide base polymer; anda polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995.2. The polyimide film according to claim 1 , wherein the diamine is oxydianiline (ODA) claim 1 , and the dianhydride is pyromellitic dianhydride (PMDA).3. The polyimide film according to claim 1 , wherein the polyimide powder has an average particle size between about 2 μm and about 10 μm.4. The polyimide film according to claim 1 , further comprising a color pigment distributed in the polyimide base polymer.5. The polyimide film according to claim 4 , wherein the color pigment has a weight ratio between about 2 and about 10 wt % of the weight of the polyimide layer.6. The polyimide film according to claim 4 , wherein the color pigment is carbon black.7. The polyimide film according to claim 1 , wherein the polyimide powder has a weight ratio between about 20 and about 50 wt % of the total weight of the polyimide layer.8. The polyimide film according to claim 1 , further including a second polyimide layer stacked on a surface of the polyimide layer.9. The polyimide film according to claim 8 , wherein the second polyimide layer also includes ...

Method for producing masterboard alignment film and transfer printing plate and alignment solution

Embodiments of the present invention disclose a method for producing a masterboard alignment film, and a transfer printing plate and an alignment solution. The method comprises coating the alignment solution on a masterboard having two or more substrates using the transfer printing plate which has a transfer region simultaneously covering the two or more substrates, so that the alignment solution forms an alignment film on the masterboard; and removing the alignment film on the masterboard which is located in regions that are out of the display regions of the substrates and where there is no need to retain the alignment film. This method can solve the existing display defect issues that are caused by too thick peripheral regions of the alignment film, and the overlapping of the too thick peripheral regions of the alignment film with the sealant region.

METHOD OF PRODUCING POLYIMIDE RESIN, METHOD OF PRODUCING POLYIMIDE COATING, METHOD OF PRODUCING POLYAMIC ACID SOLUTION, POLYIMIDE COATING, AND POLYAMIC ACID SOLUTION

A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea. 1. A method of producing a polyimide resin , comprising heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component at a temperature between 120° C. and 350° C. in N ,N ,N′ ,N′-tetramethylurea.2. A method of producing a polyimide coating , comprising heating a polyimide precursor coating formed by coating on a base substance a polyamic acid solution resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component at a temperature between 120° C. and 350° C. in N ,N ,N′ ,N′-tetramethylurea.3. The method of producing a polyimide coating according to claim 2 , wherein the amount of N claim 2 ,N claim 2 ,N′ claim 2 ,N′-tetramethylurea is from 20 to 2000 parts by mass based on 100 parts by mass of total amount of the tetracarboxylic acid dianhydride component and the diamine component.4. A polyimide film produced by the method according to .5. A method of producing a polyamic acid solution claim 2 , comprising reacting a tetracarboxylic acid dianhydride component and a diamine component in N claim 2 ,N claim 2 ,N′ claim 2 ,N′-tetramethylurea.6. The method of producing a polyamic acid solution according to claim 5 , wherein the amount of N claim 5 ,N claim 5 ,N′ claim 5 ,N′-tetramethylurea is from 20 to 2000 parts by mass based on 100 parts by mass of total amount of the tetracarboxylic acid dianhydride component and the diamine component.7. A polyamic acid solution produced by the method according to . This application claims priority under 35 U.S.C. §119(a)-(d) to Japanese Patent Application No. 2012-182348, filed Aug. 21, 2012, the content of which is incorporated herein by reference.1. Field of the InventionThe present invention relates to a method of producing a polyimide resin, a method ...

POLYIMIDE LAMINATED FILM AND METHOD OF PREPARING POLYIMIDE LAMINATED FILM

A polyimide laminated film includes a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape and a non-porous polyimide layer that has a porosity of 5% or less. 1. A polyimide laminated film comprising:a porous polyimide layer that has a porosity of from 30% to 90% and pores having a spherical shape; anda non-porous polyimide layer that has a porosity of 5% or less.2. The polyimide laminated film according to claim 1 , [{'br': None, 'Tp>Tn \u2003\u2003(1)'}, {'br': None, 'i': 'Tp+Tn≤', '10 μm≤100 μm \u2003\u2003(2)'}], 'wherein the polyimide laminated film, satisfies the following Expressions (1) and (2)wherein Tp represents an average film thickness of the porous polyimide layer (in a case of including a plurality of the porous polyimide layers, a sum of respective average film thicknesses of the porous polyimide layers), and Tn represents an average film thickness of the non-porous polyimide layer (in a case of including a plurality of the non-porous polyimide layers, a sum of respective average film thicknesses of the non-porous polyimide layers).3. The polyimide laminated film according to claim 1 ,wherein the porous polyimide layer contacts the non-porous polyimide layer.4. The polyimide laminated film according to claim 3 ,wherein in a cross-section in a direction orthogonal to an interface between the non-porous polyimide layer and the porous polyimide layer, a maximum, cross-section height Zt obtained from a sum of a maximum value of a mountain height Zp of a contour curve of the interface and a maximum value of a valley depth Zv is 0.5 μm or less.5. The polyimide laminated film according to claim 1 ,wherein the porosity of the porous polyimide layer is 50% or more.6. The polyimide laminated film according to claim 1 ,wherein Tp is from 5 μm to 100 μm.7. The polyimide laminated film according to claim 1 ,wherein Tp is from 5 μm to 70 μm.8. The polyimide laminated film according to claim 1 ,wherein Tn is from 1 μm. to ...

RESIN POWDER, SEALING MATERIAL, ELECTRONIC COMPONENT, AND RESIN POWDER MANUFACTURING METHOD

Resin powder includes aggregates of spherical particles of a resin composition. The resin composition contains: a resin component including a thermosetting resin; and a non-resin component including at least one electrically insulative inorganic particle and/or at least one magnetic particle. 1. Resin powder comprising aggregates of spherical particles of a resin composition ,the resin composition containing: 'a non-resin component including at least one electrically insulative inorganic particle and/or at least one magnetic particle.', 'a resin component including a thermosetting resin; and'}2. The resin powder of claim 1 , wherein 'a core including the at least one electrically insulative inorganic particle and the resin component covering the core.', 'each of the spherical particles includes'}3. The resin powder of claim 1 , wherein 'a core including the at least one magnetic particle and the resin component covering the core.', 'each of the spherical particles includes'}4. The resin powder of claim 1 , whereinin volume particle size distribution, a mean particle size of the resin powder is larger than or equal to 10 μm and smaller than or equal to 200 μm.5. The resin powder of claim 1 , whereinin the volume particle size distribution, a ratio of the spherical particles whose particle size is larger than or equal to 50 μm and smaller than or equal to 100 μm to the resin powder is greater than or equal to 70 wt. %.6. The resin powder of claim 1 , whereinthe volume particle size distribution has one frequency peak.7. The resin powder of claim 1 , whereinan average circularity of the aggregates is greater than or equal to 0.90 and less than or equal to 1.00.8. The resin powder of claim 1 , whereinthe resin component is in an uncured state.9. The resin powder of claim 1 , whereinthe resin powder further contains nanofiller.10. The resin powder of claim 9 , whereina content of the nanofiller is greater than or equal to 0.1 wt. % and less than or equal to 2 wt. % with ...

LIQUID CRYSTAL ALIGNING AGENT COMPOSITION, METHOD FOR PRODUCING LIQUID CRYSTAL ALIGNMENT FILM USING SAME, AND LIQUID CRYSTAL ALIGNMENT FILM USING SAME

The present invention provides a liquid crystal aligning agent composition that has excellent storage stability, can secure a high imidization rate, and can produce a liquid crystal alignment film having improved film strength together with liquid crystal alignment properties, a method for producing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display device using the same. 2. The liquid crystal aligning agent composition of claim 1 , wherein the functional group substituted in the primary or secondary amine is capable of being substituted with a hydrogen atom at a temperature of 90° C. or higher.3. The liquid crystal aligning agent composition of claim 1 , wherein the primary or secondary amine compound is included in an amount of 0.03 parts by weight to 30 parts by weight claim 1 , based on a total of 100 parts by weight of the first polymer for the liquid crystal aligning agent and the second polymer for the liquid crystal aligning agent.4. The liquid crystal aligning agent composition of claim 1 , wherein the primary amine or the secondary amine in the primary or secondary amine compounds each independently has a linear or cyclic structure.6. The liquid crystal aligning agent composition of claim 1 , wherein a weight ratio between the first polymer for a liquid crystal aligning agent and the second polymer for a liquid crystal aligning agent is 1:9 to 9:1.7. The liquid crystal aligning agent composition of claim 1 , wherein the molecular weight of the compound having two or more epoxy groups in a molecule is 100 g/mol to 10 claim 1 ,000 g/mol.8. The liquid crystal aligning agent composition of claim 1 , wherein the compound having two or more epoxy groups in a molecule is a cycloaliphatic-based epoxy claim 1 , a bisphenol-based epoxy claim 1 , or a novolac-based epoxy.9. The liquid crystal aligning agent composition of claim 1 , wherein the compound having two or more epoxy groups in a molecule is ...

POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM MANUFACTURED USING SAME

The present invention relates to a polyimide precursor composition, and a polyimide film manufactured using same. According to the present invention, since a polyimide film is manufactured from a mixture of a polyimide precursor having a structure that is advantageous to surface charge accumulation and a polyimide precursor having a structure capable of exhibiting high heat-resistant characteristics, a flexible device using the polyimide film as a substrate can have both improved charge accumulation characteristics caused by an electric field to be generated during the operation of a TFT device and heat high heat-resistant characteristics. 2. The polyimide precursor composition according to claim 1 , wherein the reactive functional group of the end capper in the formula 1 is at least one reactive structure selected from a maleic-based reactive structure claim 1 , a cyclobutene-based reactive structure claim 1 , an acetylene-based reactive structure claim 1 , a nadic-based reactive structure claim 1 , an epoxy-based reactive structure or a phenylethynyl-based reactive structure.4. The polyimide precursor composition according to claim 1 , wherein the first polyamic acid and the second polyamic acid are contained in a molar ratio of 20:80 to 80:20.5. The polyimide precursor composition according to claim 1 , wherein each of the first polyamic acid and the second polyamic acid comprises a reaction product of para-phenylenediamine and 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenylcarboxylic dianhydride claim 1 , and the reaction product is obtained by reacting para-phenylenediamine in excess of the equivalent ratio relative to 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenylcarboxylic dianhydride.6. The polyimide precursor composition according to claim 5 , wherein the first polyamic acid is a reaction product from reacting para-phenylenediamine with 3 claim 5 ,3′ claim 5 ,4 claim 5 ,4′-biphenylcarboxylic dianhydride in the presence of 1 to 10 moles of reactive end capper ...

PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM COMPRISING THE SAME

The present invention relates to a photosensitive resin composition including a poly(imide-benzoxazine) block copolymer, and a cured film. The poly(imide-benzoxazine) block copolymer included in the photosensitive resin composition enables the formation of a cured film having excellent mechanical and insulation even at a low temperature of less than 200° C. 6. The photosensitive resin composition according to claim 1 , wherein in the poly(imide-benzoxazine) block copolymer claim 1 , the weight ratio of the repeat unit having a polymerization degree m and the repeat unit having a polymerization degree n is 1:0.01 to 1:100.7. The photosensitive resin composition according to claim 1 , wherein the poly(imide-benzoxazine) block copolymer has a weight average molecular weight of 5000 to 100 claim 1 ,000 g/mol.8. The photosensitive resin composition according to claim 1 , wherein the photocurable multifunctional acrylic compound includes one or more acrylic compounds selected from the group consisting of an acrylate-based compound claim 1 , a polyester acrylate-based compound claim 1 , a polyurethane acrylate-based compound claim 1 , an epoxy acrylate-based compound claim 1 , and a caprolactone modified acrylate-based compound.9. The photosensitive resin composition according to claim 1 , wherein the composition comprises 1 to 50 parts by weight of the photocurable multifunctional acrylic compounds claim 1 , based on 100 parts by weight of the poly(imide-benzoxazine) block copolymer.10. A cured film formed by curing the photosensitive resin composition according to .11. The cured film of claim 10 , wherein the curing is performed at a temperature of from 160 to 220° C. This application is a 35 U.S.C. § 371 National Phase Entry Application from PCT/KR2018/008367, filed on Jul. 24, 2018, and designating the United States, which claims the benefit of Korean Patent Application No. 10-2017-0118859 filed on Sep. 15, 2017 and Korean Patent Application No. 10-2018-0085443 filed ...

Banding band

This banding band has a belt-like portion having a plurality of teeth on at least one surface thereof, and a securing portion positioned at one end of the belt-like portion, wherein the securing portion has a through-hole into which the other end of the belt-like portion can be inserted, and at least the belt-like portion comprises an amorphous resin having a glass transition temperature of 180° C. or higher.

COMPOUND FOR ENHANCING ADHESION PROPERTIES OF POLYIMIDE RESIN AND POLYIMIDE COPOLYMER PRODUCED USING SAME

The present invention provides a novel polyimide resin adhesion enhancer having a fluorene framework, wherein a polyimide film produced using same exhibits conventional properties such as heat resistance and mechanical properties, and maintains adhesion with a carrier substrate while not being affected with respect to retardation even during a high-temperature process. 5. A polyimide copolymer compising a polymerized and cured product of a polyimide precursor composition comprising:an acid dianhydride, a diamine and a dimethylsiloxane(DMS)-diphenylsiloxane(DPS) oligomer, as polymerization components;a solvent having a positive distribution coefficient (Log P) at 25° C.; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the compound of .'}7. The polyimide copolymer according to , wherein the compound according to is contained in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the polyimide precursor composition.8. The polyimide copolymer according to , wherein the compound according to is contained in an amount of 0.001 to 0.5 mole per mole of the acid dianhydride.9. The polyimide copolymer according to claim 6 , wherein the weight average molecular weight of the dimethylsiloxane-diphenylsiloxane oligomer having the structure of Formula (6) is 4000 g/mol or more.10. The polyimide copolymer according to claim 5 , wherein the solvent having a positive distribution coefficient (Log P) at 25° C. is an amide-based solvent.11. The polyimide copolymer according to claim 10 , wherein the amide-based solvent is at least one selected from the group consisting of dimethylpropionamide (DMPA) claim 10 , diethylpropionamide (DEPA) claim 10 , N claim 10 ,N-diethylacetamide (DEAc) claim 10 , N claim 10 ,N-diethylformamide (DEF) and N-ethylpyrrolidone (NEP).12. A polyimide film comprising the polyimide copolymer according to .13. The polyimide film according to claim 12 , wherein the retardation of the polyimide film is −500 to 500 nm.14. The polyimide film ...

THICK POLYIMIDE FILM HAVING IMPROVED SURFACE QUALITY AND METHOD OF MANUFACTURING SAME

The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13. 1. A polyimide film manufactured by imidizing a polyamic acid solution , wherein a following parameter A falls within a range from 0.4 to 1.13:{'br': None, 'i': A', 'V·Mn', 'T, 'sup': '2', '=log(()·√{square root over ()})−21'}wherein V is a viscosity of the polyamic acid solution and is 200,000 cP to 250,000 cP as measured at 23° C. when a solid content thereof is 18.5 wt %, Mn is a number average molecular weight of polyamic acid dissolved in the polyamic acid solution and is 100,000 g/mole to 150,000 g/mole, and T is a thickness of the polyimide film and is 55 μm to 110 μm.2. The polyimide film of claim 1 , wherein the polyamic acid has a weight average molecular weight/number average molecular weight ratio (=Mw/Mn) of 1.5 to 1.8.3. The polyimide film of claim 1 , wherein the polyamic acid comprises:a first polymer chain having a number average molecular weight of 10,000 g/mole to 80,000 g/mole;a second polymer chain having a number average molecular weight of greater than 80,000 g/mole to 170,000 g/mole; anda third polymer chain having a number average molecular weight of greater than 170,000 g/mole to 400,000 g/mole.4. The polyimide film of claim 1 , wherein claim 1 , based on a total weight of the polyamic acid claim 1 ,an amount of the first polymer chain is 5% to 20%,an amount of the second polymer chain is 70% to 90%, andan amount of the third polymer chain is 5% to 10%.5. The polyimide film of claim 1 , wherein when the polyimide film is subjected to corona treatment and is tested using an adhesive claim 1 , an adhesion of the polyimide film is 1 claim 1 ,100 gf/mm or more.6. The polyimide film of claim 1 , having a modulus of 3.3 Gpa or more claim 1 , an elongation of 75% or more ...

THERMALLY STABLE AND ELECTRICALLY ISOLATING BARRIER FILM

A thermoset barrier film including: a reaction product of the formulas (I), (II), (III), (IV), or a mixture thereof, as defined herein. Also disclosed are methods of making and using the thermoset barrier film, and devices incorporating the thermoset barrier film. 1. A thermoset barrier film , comprising:a reaction product comprising:a fluorinated polyimide oligomer having anhydride end caps, in from 50 to 90 wt %;a cross-linker, in from 1 to 40 wt %, comprising a polyhedral oligomeric silsesquioxane having at least one pendant group selected from an epoxy group, a di-aryl group, an acrylate group, or mixtures thereof;a tie agent having at least one of each of an acrylate group and an epoxy group, in from 0.1 to 20 wt %;an epoxy silane adhesion promoter, in from 0.1 to 3 wt %; andan initiator, in from 1 to 20 wt %, based on a total of 100 wt % of the barrier film, wherein the barrier film is electrically isolating and has a voltage breakdown of from 300 to 1900 volts per micron,wherein the barrier film is thermally stable up to at least 250° C. with no loss in mass below 250° C., andfurther wherein the barrier film has a water contact angle of from 89 degrees to 112 degrees.2. The barrier film of claim 1 , further comprising:a surface modified nano-silica having a primary particle size of from about 10 nm to 20 nm in a total amount of from 5 to 30 wt % by superaddition, wherein the barrier film has a pencil hardness of at least 7 H.3. The barrier film of claim 2 , wherein the cross-linker is in from 8 to 40 wt %.4. The barrier film of claim 1 , further comprising:at least one fluorine booster compound selected from a fluorinated urethane-acrylate of formula, a fluorinated epoxy, or a mixture thereof, in a total amount of from 0.1 to 30 wt % by superaddition.5. The barrier film of claim 4 , wherein the fluorinated polyimide oligomer is in from 50 to 54 wt % claim 4 , the cross-linker is in from about 14 to 18 wt % claim 4 , the tie agent is in from about 5 to 8 wt % ...

REACTIVE FRIABLE POLYIMIDE AND METHOD OF MAKING

Disclosed herein is a friable polyimide powder having a weight average molecular weight, as determined by gel permeation chromatography (GPC) using polystyrene standards, of less than or equal to 24,500 Daltons and a reactive aromatic amine end group concentration greater than or equal to 3 mole percent, wherein 90 weight percent of the powder particles are reducible to less than or equal to 75 micrometers by mechanical grinding. Also disclosed is a method of making the friable polyimide powder, a processed polyimide resulting from the friable polyimide powder and compositions comprising the processed polyimide. 1. A friable polyimide powder havinga weight average molecular weight, as determined by gel permeation chromatography using polystyrene standards, of less than or equal to 24,500 Daltons, anda reactive aromatic amine end group concentration greater than 3 mole percent,wherein 90 weight percent of the powder particles are reducible to less than or equal to 75 micrometers by mechanical grinding.2. The friable polyimide powder of claim 1 , having a weight average molecular weight of 5 claim 1 ,000 to 24 claim 1 ,500 Daltons.3. The friable polyimide powder of claim 1 , having a reactive aromatic amine end group concentration of 3.1 to 40 mole percent.4. The friable polyimide powder of claim 1 , wherein 90 weight percent of the particles are reducible to 1 to 75 micrometers.5. The friable polyimide powder of claim 1 , wherein 90 weight percent of the particles are reducible to 25 to 75 micrometers by mechanical grinding.8. The friable polyimide powder of claim 7 , wherein each R is independently meta-phenylene claim 7 , para-phenylene claim 7 , 4 claim 7 ,4′-diphenylene sulfone claim 7 , a combination comprising at least one of the foregoing claim 7 , and Z is 4 claim 7 ,4′-diphenylene isopropylidene.12. A method of making a processed polyimide powder comprising mechanically grinding the friable polyimide powder of claim 1 , sieving the product of grinding with a ...

AQUEOUS BINDER SOLUTIONS

The present invention is directed to aqueous systems for polyamideimide, polyether imide, and/or polyamic acid binder solutions. The present invention provides stable aqueous binder solutions equivalent or superior to current aqueous binder solutions. 1. An aqueous binder solution comprising a) water , b) polyamideimide or polyether imide , c) an amine , and d) one or more solvent; wherein the one or more solvent comprises acetoacetamides , guanidines , or mixtures thereof.2. An aqueous binder solution of further comprising one or more of: viscosity modifiers claim 1 , thinning solvent claim 1 , binders claim 1 , pigments claim 1 , fillers claim 1 , dispersing aids claim 1 , surface tension modifiers claim 1 , and fluoropolymers.3. The aqueous binder solution of wherein the thinning solvent is a diether claim 2 , an alcohol claim 2 , or a glycol ether.4. The aqueous binder solution of claim 1 , wherein the solvent is selected from acetoacetamide claim 1 , dimethyl acetoacetamide claim 1 , n-methyl acetoacetamide claim 1 , diethyl acetoacetamide claim 1 , tetramethyl guanidine claim 1 , or a mixture thereof.5. The aqueous binder solution of wherein the c) amine and d) solvent are the same.6. The aqueous binder solution of wherein the c) amine and d) solvent are both tetramethyl guanidine.7. The aqueous binder solution of wherein the solvent comprises dimethylacetoacetamide.8. The aqueous binder solution of wherein the solvent comprises tetramethyl guanidine. The field of invention is related to alternate solvent systems for polyethersulfone, polyamideimide, polyether imide, polyimide, and/or polyamic acid binder solutions.Fluoropolymers have found use in many non-stick and release coating applications such as, for example, non-stick coatings for cookware. However, due to the non-stick nature of perfluoropolymers, primer layers having binders are generally needed to adhere to a surface of a substrate prior to application of the fluoropolymers, to enable sufficient ...

RESIN COMPOSITION AND ARTICLES MADE THEREFROM

Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on. 5. The resin composition of claim 1 , comprising 30 to 80 parts by weight of the flame retardant and 60 to 100 parts by weight of the aliphatic long-chain maleimide compound.6. The resin composition of claim 1 , further comprising a vinyl compound claim 1 , epoxy resin claim 1 , cyanate ester resin claim 1 , phenolic resin claim 1 , benzoxazine resin claim 1 , styrene maleic anhydride resin claim 1 , polyester claim 1 , amine curing agent claim 1 , polyamide claim 1 , polyimide or a combination thereof.7. The resin composition of claim 1 , further comprising 5 to 55 parts by weight of a vinyl compound.8. The resin composition of claim 1 , further comprising 5 to 15 parts by weight of a triallyl isocyanurate prepolymer.9. The resin composition of claim 1 , further comprising 20 to 40 parts by weight of a vinyl benzyl maleimide resin.10. An article made from the resin composition of claim 1 , comprising a prepreg claim 1 , a resin film claim 1 , a resin film with copper foil claim 1 , a laminate or a printed circuit board.11. The article of claim 10 , which is capable of sustaining 20 times of reflow test by reference to IPC-TM-650 2.6.27 after 5 lamination processes without delamination.12. The article of claim 10 , which is capable of preventing weave exposure after 5-minute immersion in a NaOH solution.13. The article of claim 10 , having a storage modulus of ...

COMPOSITION COMPRISING POLYMER AND INORGANIC PARTICLES, POLYIMIDE-INORGANIC PARTICLES COMPOSITE, ARTICLE INCLUDING THE COMPOSITE, AND OPTICAL DEVICE INCLUDING THE ARTICLE

A composition including a polymer including at least one of an amic acid structural unit and an imide structural unit, inorganic particles, and a compound represented by Chemical Formula 1, a polymer-inorganic particle composite prepared from the composition, an article, and an optical device including the article: 2. The composition of claim 1 , wherein Rof Chemical Formula 1 is a linear or branched C1 to C20 alkyl group.3. The composition of claim 1 , wherein n of Chemical Formula 1 is an integer greater than or equal to 5 and less than or equal to 20.4. The composition of claim 1 , wherein the inorganic particle is an oxide claim 1 , a hydroxide claim 1 , a carboxylate claim 1 , or a nitride of Ti claim 1 , Si claim 1 , Al claim 1 , Zr claim 1 , Zn claim 1 , Sn claim 1 , B claim 1 , Ce claim 1 , Sr claim 1 , Ca claim 1 , Ba claim 1 , In claim 1 , or W claim 1 , a graphene oxide claim 1 , or a combination thereof.5. The composition of claim 1 , wherein the inorganic particle is silica claim 1 , alumina claim 1 , titania claim 1 , strontium titanate claim 1 , zirconia claim 1 , zinc oxide claim 1 , indium tin oxide claim 1 , strontium carbonate claim 1 , zirconium tungsten oxide claim 1 , antimony-doped tin oxide claim 1 , graphene oxide claim 1 , or a combination thereof.6. The composition of claim 1 , wherein the inorganic particles are titania nanorods.7. The composition of claim 6 , wherein the inorganic particles have an average particle diameter of a longest particle diameter of less than or equal to 50 nanometers.8. The composition of claim 1 , wherein the inorganic particles are present in the composition in an amount of less than or equal to 50 parts by weight based on 100 parts by weight of the polymer.9. The composition of claim 1 , wherein the compound represented by Chemical Formula 1 is present in the composition in an amount of less than 300 parts by weight based on 100 parts by weight of the inorganic particle.10. The composition of claim 1 , ...

THERMOPLASTIC COMPOSITION AND METHOD OF PREPARING THE SAME

A method of preparing a thermoplastic composition is provided. The method includes the following steps. A polyetherimide or a polyphenylene sulfide is provided. A polyimide is provided, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP. A melt process is performed to mix the polyetherimide and the polyimide or mix the polyphenylene sulfide and the polyimide to form a thermoplastic composition. Further, a thermoplastic composition is also provided. 1. A method of preparing a thermoplastic composition , comprising:providing a polyetherimide;providing a polyimide, wherein a glass transition temperature of the polyimide is between 128° C. and 169° C., a 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone (NMP) and a solid content of the polyimide is 30 wt %, a viscosity of the polyimide is between 100 cP and 250 cP; andperforming a melt process to mix the polyetherimide and the polyimide to form the thermoplastic composition.2. The method of preparing the thermoplastic composition according to claim 1 , wherein the polyimide is used in an amount of from 1 part by weight to 10 parts by weight based on a use amount of 100 parts by weight of the polyetherimide.3. The method of preparing the thermoplastic composition according to claim 1 , wherein a process temperature of the melt process is between 300° C. and 350° C.4. The method of preparing the thermoplastic composition according to claim 1 , wherein a melt index (MI) of the thermoplastic composition is from 7 g/10 min to 15 g/10 min at 320° C.5. A thermoplastic composition claim 1 , comprising:a polyetherimide; anda ...

LIQUID CRYSTAL DISPLAY DEVICE, ALIGNMENT FILM FORMING MATERIAL, AND POLYMER COMPOUND

A liquid crystal display device () includes a pair of substrates (), a liquid crystal layer () sandwiched between the pair of substrates (), an alignment film () disposed between the liquid crystal layer () and at least one substrate (), and an alignment-sustaining layer () disposed between the alignment film () and the liquid crystal layer () and regulating the tilt direction of at least liquid crystal molecules close to the alignment film () among the liquid crystal molecules constituting the liquid crystal layer (). The alignment film () contains a polymer compound having a functional group represented by the following Formula (1): 6. The liquid crystal display device according to claim 1 , wherein the alignment film is made of a polyimide claim 1 , a polyamic acid claim 1 , or a polysiloxane.7. The liquid crystal display device according to claim 1 , wherein the alignment film contains a polymer compound having a photoreactive functional group.8. The liquid crystal display device according to claim 7 , wherein the photoreactive functional group is a group having a cinnamate group claim 7 , a chalcone group claim 7 , a coumarin group claim 7 , an azobenzene group claim 7 , or a tolan group.10. The liquid crystal display device according to claim 1 , wherein the alignment-sustaining layer is formed by radical polymerizations of a radical polymerizable monomer. Some aspects of the present invention relate to a liquid crystal display device, an alignment film-forming material, and a polymer compound.The present application claims priority from Japanese Patent Application No. 2017-069987, filed Mar. 31, 2017, the disclosure of which is hereby incorporated by reference herein in its entirety.A liquid crystal display device includes a pair of substrates and a liquid crystal layer disposed therebetween, and performs display by utilizing that the alignment direction of liquid crystal molecules changes depending on the voltage applied to a liquid crystal layer. The ...

BIS(AZOBENZENE) DIAMINES AND PHOTOMECHANICAL POLYMERS MADE THEREFROM

Bis(azo-benzene) diamine monomers and a method of synthesizing the monomers are provided. The bis(azo-benzene) diamine monomers, in combination with amine reactive monomers, form polymers, such as polyimides and copolyimides, having photomechanical and thermomechanical properties. 3. The bis(azobenzene)-containing copolyimide of claim 2 , wherein L is —O—.4. The bis(azobenzene)-containing copolyimide of claim 2 , wherein L is —S—. This application is a divisional of U.S. application Ser. No. 15/584,464 (pending), filed May 2, 2017, which was a divisional of U.S. application Ser. No. 14/845,450, filed Sep. 4, 2015, which claims benefit of and priority to U.S. Provisional Patent Application Serial Nos. 62/046,433 and 62/046,372, each of which was filed on Sep. 5, 2014. The disclosure of each of these applications is incorporated herein by reference, in its entirety.The invention described herein may be manufactured and used by or for the Government of the United States for all governmental purposes without the payment of any royalty.The invention generally relates to bis(azobenzene)-containing diamines, as well as the polymers and copolymers made therefrom. More particularly, the invention relates to bis(azobenzene)-containing diamines, which are useful for preparing polyimide, polyamide, and poly(amide-imide) polymers and copolymers having photomechanical properties and methods of making the same.Photomechanical polymers are a special class of stimuli-responsive materials that can transduce light into mechanical work. Photo-initiated shape adaptivity or force generation (actuation) are particularly intriguing due to the salient features of light, namely, remote and wireless (contactless) triggering with ease of spatial, temporal, directional (through polarization), and magnitude (with intensity) control.Considerable effort has been undertaken in both the synthesis of photoresponsive polymers and the characterization of their photomechanical outputs. To date, ...

POLY(AMIC ACID) SYNTHESIS AND CONVERSION TO HIGH MOLECULAR WEIGHT POLYIMIDE

A process is disclosed for synthesis of a poly(amic acid), including reacting a dianhydride and a diamine in the presence of a tertiary amine, tertiary ammonium salt, tertiary ammonium hydroxide, secondary amine, secondary ammonium salt, secondary ammonium hydroxide, quaternary ammonium salt, quaternary ammonium hydroxide, ammonium hydroxide, or a combination comprising at least one of the foregoing, in water, at a temperature of 60 C to 180 C, or 60 C to 100 C, or 100 C to 180 C, under an inert atmosphere, with agitation, to produce an aqueous poly(amic acid). 1. A process for synthesis of a poly(amic acid) , the process comprising:reacting a dianhydride and a diamine in the presence of a higher monoamine comprising tertiary amine, tertiary ammonium salt, tertiary ammonium hydroxide, secondary amine, secondary ammonium salt, secondary ammonium hydroxide, quaternary ammonium salt, quaternary ammonium hydroxide, ammonium hydroxide, or a combination comprising at least one of the foregoing, in water, at a temperature of 60° C. to 180° C., under an inert atmosphere, with agitation, to produce an aqueous poly(amic acid).2. The process of claim 1 ,wherein the dianhydride is bisphenol A dianhydride, pyromellitic dianhydride, 3,3′,4,4′-biphenyl dianhydride, 3,3′,4,4′-benzophenone dianhydride, 3,3′,4,4′-oxydiphthalic dianhydride, 1,4-bis(3,4 dicarboxyl phenoxy)benzene dianhydride, 1,3-bis(2,3-dicarboxyphenoxy)benzene dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, or a combination comprising at least one of the foregoing.3. The process of claim 1 , wherein the diamine is meta-phenylene diamine claim 1 , para-phenylene diamine claim 1 , 4 claim 1 ,4′-diaminodiphenylene ether claim 1 , oxydianiline claim 1 , 4 claim 1 ,4′-diamino-3 claim 1 ,3′-dimethyl diphenyl methane claim 1 , 1 claim 1 ,4-bis(4-aminophenoxy) benzene claim 1 , 2 claim 1 ,2′-bis(4-(4-amino phenoxy)phenyl)propane claim 1 , 3 claim 1 ,3′-diaminodiphenylene sulphone claim 1 , 4 claim 1 ,4′- ...

Composite material containing artificial graphite, graphite sheet and manufacturing method of manufacturing the same

A method of manufacturing composite material containing artificial graphite is disclosed. An artificial graphite powder and a first solvent are mixed together to obtain a graphite dispersion solution, and a particle size of the graphite powder is less than 50 μm. The graphite dispersion solution and a polyamic acid solution are mixed together to obtain a liquid mixture. The liquid mixture is heated to obtain a polyamic acid film containing artificial graphite powder. The imidization of the polyamic acid film is performed to obtain the composite material containing artificial graphite. A method of manufacturing a graphite sheet by using the composite material containing artificial graphite as raw material is disclosed.

MULTILAYER TRANSMISSION LINE PLATE

Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion. 1. A multilayered transmission line plate comprising:one pair of ground layers,a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers,a first insulating portion disposed between the differential wiring layer and the one ground layer, anda second insulating portion disposed between the differential wiring layer and the other ground layer,wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer containing a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.21111. The multilayered transmission line plate of claim 1 , comprising an insulating layer (-I) as the first insulating portion and an insulating layer (-II) as the second insulating portion claim 1 , wherein the insulating layer (-I) is a resin layer and the insulating layer (-II) is a fiber base material layer.3222222222. The multilayered transmission line plate of claim 1 , comprising an insulating layer (-I) as the second insulating portion and an insulating layer (-II) as the first insulating portion claim 1 , wherein the insulating layer (-II) includes ...

PROPPANT COMPRISING A CROSSLINKED POLYMER FOR TREATMENT OF SUBTERRANEAN FORMATIONS

Various embodiments disclosed relate to proppants comprising crosslinked polymers for treatment of sub-terranean formations. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include placing a proppant including a crosslinked polymer in the subterranean formation. 169.-. (canceled)70. A method of treating a subterranean formation , comprising:placing in the subterranean formation a proppant comprising a crosslinked polymer, and{'sup': 3', '3, 'wherein the proppant comprises particles having a density less than 1.0 g/cmand particles having a density greater than 1.0 g/cm.'}71. The method of claim 70 , wherein the proppant comprises particles having a density of about 0.2 g/cmto less than 1.0 g/cmand particles having a density greater than 1.0 g/cmto about 2.3 g/cm.72. The method of claim 70 , wherein the proppant has a tensile strength of about 5 MPa to about 20 MPa claim 70 , and wherein the proppant has a compressive strength of about 50 MPa to about 300 MPa.73. The method of claim 70 , wherein the composition is free of viscosifiers and cross-linked viscosifiers.74. The method of claim 70 , further comprising repeatedly and sequentially placing a pad fluid comprising a cross-linked viscosifier and the composition comprising the proppant in the subterranean formation.75. The method of claim 70 , wherein the crosslinked polymer is about 80 wt % to about 100 wt % of the proppant.76. The method of claim 70 , wherein the crosslinked polymer is a crosslinked polyimide claim 70 , and wherein the proppant comprises at least one other polymer in addition to the crosslinked polyimide.77. The method of claim 76 , wherein the at least one other polymer is selected from the group consisting of a crosslinked polyimide claim 76 , a crosslinked epoxy-based material claim 76 , a crosslinked furan-based resin claim 76 , a crosslinked polyacrylate claim 76 , a crosslinked vinyl polymer claim 76 , a polyaryl ether ...

BINDER RESIN, POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM AND SEMICONDUCTOR DEVICE

The present specification relates to a binder resin, a photosensitive resin composition, an insulating film and a semiconductor device. 2. The binder resin of claim 1 , wherein L is a substituted or unsubstituted alkylene group.6. The binder resin of claim 1 , wherein the binder resin has a weight average molecular weight of 1 claim 1 ,000 g/mol to 70 claim 1 ,000 g/mol.7. A positive-type photosensitive resin composition comprising: the binder resin of ; a photo active compound; a cross-linking agent; a surfactant; and a solvent.8. The positive-type photosensitive resin composition of claim 7 , wherein based on 100 parts by weight of the binder resin claim 7 , the positive-type photosensitive resin composition comprises:10 parts by weight to 40 parts by weight of the photo active compound;5 parts by weight to 50 parts by weight of the cross-linking agent;0.05 part by weight to 5 parts by weight of the surfactant; and50 parts by weight to 300 parts by weight of the solvent.9. An insulating film comprising the positive-type photosensitive resin composition of or a cured product thereof.10. A semiconductor device comprising the insulating film of . This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0095253 filed in the Korean Intellectual Property Office on Jul. 30, 2020, the entire contents of which are incorporated herein by reference.The present application relates to a binder resin, a positive-type photosensitive resin composition, an insulating film and a semiconductor device.Since an interlayer insulating film or a surface protective film of a semiconductor device is required to have excellent mechanical properties and high heat resistance, a polyimide-based binder resin having excellent physical properties is used. The polyimide-based binder resin requires a high temperature heat treatment of 350° C. or higher in order to obtain a pattern and a thin film which have excellent physical properties using a polyimide ...

LIQUID CRYSTAL DISPLAY DEVICE

The present invention provides a liquid crystal display device with a high degree of freedom in molecular structure design of an alignment film and with reduced image sticking. The liquid crystal display device includes a pair of substrates; a liquid crystal layer held between the substrates; an alignment film disposed on a liquid crystal layer side surface of at least one of the substrates; and a polymer layer disposed between the liquid crystal layer and the alignment film, the alignment film containing a first polymer containing at least one structure represented by the following formula (1) in a side chain, 3. The liquid crystal display device according to claim 2 ,wherein the first polymer contains the structure represented by the above formula (1-1) in a side chain.6. The liquid crystal display device according to claim 1 ,wherein the first polymer contains at least one of a polyamic acid structure or a polyimide structure in a main chain.8. The liquid crystal display device according to claim 1 ,wherein the first polymer contains at least one photo-functional group.9. The liquid crystal display device according to claim 8 ,wherein the first polymer contains at least one photo-functional group selected from the group consisting of a cinnamate group, an azobenzene group, a chalcone group, and a coumarin group, each of which optionally contains a substituent.10. The liquid crystal display device according to claim 1 ,wherein the second polymer is a polymer obtained by radically polymerizing the at least one monomer.12. The liquid crystal display device according to claim 1 ,wherein the liquid crystal display device is in a liquid crystal driving mode of an MVA mode, a 4D-RTN mode, an FFS mode, or an IPS mode. The present application claims priority under 35 U.S.C. § 119 to U.S. Provisional Patent Application No. 62/702,112 filed on Jul. 23, 2018, the contents of which are incorporated herein by reference in their entirety.The present invention relates to liquid ...

LIQUID CRYSTAL ALIGNING AGENT COMPOSITION, METHOD FOR PREPARING LIQUID CRYSTAL ALIGNMENT FILM USING SAME, AND LIQUID CRYSTAL ALIGNMENT FILM USING SAME

The present invention relates to a liquid crystal aligning agent composition including a terminal modifier of a specific chemical structure together with a polyimide or a precursor polymer thereof. 4. The liquid crystal aligning agent composition of claim 1 , wherein the terminal modifier compound represented by Chemical Formula 1 is present in an amount of 0.1% by weight to 20% by weight claim 1 ,. based on the total weight of the liquid crystal aligning agent composition.10. The liquid crystal aligning agent composition of claim 8 , wherein the second polymer is contained in an amount of 0.5% by weight to 40% by weight claim 8 , based on the total weight of the liquid crystal aligning agent composition.11. A method for preparing a liquid crystal alignment film including the steps of:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'coating the liquid crystal aligning agent composition of onto a substrate to form a coating film;'}drying the coating film;irradiating the dried coating film with light or rubbing the coating film to perform alignment treatment; andheat-treating and curing the alignment-treated coating film.12. The method for preparing a liquid crystal alignment film of claim 11 , wherein the step of drying the coating film is performed at a temperature of 50° C. to 150° C.13. The method for preparing a liquid crystal alignment film of claim 11 , wherein the step of heat-treating and curing the alignment-treated coating film is performed at a temperature of 180° C. to 300° C.14. A liquid crystal alignment film comprising an aligned cured product of the liquid crystal aligning agent composition of .15. A liquid crystal display device comprising the liquid crystal alignment film of . This application is a National Phase entry pursuant to 35 U.S.C. § 371 of PCT/KR2019/000160 filed on Jan. 4, 2019, and claims the benefits of filing date of Korean Patent Application No. 10-2018-0007958 filed with Korean Intellectual Property Office on Jan. 22, 2018, the ...

POLYMER, ION-EXCHANGE MEMBRANE, AND STRUCTURE-ENHANCED MEMBRANE EMPLOYING THE SAME

The present disclosure provides a polymer, including a first repeating unit represented by formula (I), a second repeating unit represented by formula (II), and a third repeating unit represented by formula (III). The first repeating unit, the second repeating unit, and the third repeating unit are arranged in an alternating fashion, in a random fashion, or in discrete blocks. The molar ratio of the first repeating unit, the second repeating unit and the third repeating unit is m:n:o, and m:(n+o) is from 60:40 to 85:15. The definitions of a, R, R, A, and R are as defined in the specification. 2. The polymer as claimed in claim 1 , wherein m:n is from 99:1 to 70:30 claim 1 , and n:o is from 60:40 to 30:70.3. The polymer as claimed in claim 1 , wherein a weight average molecular weight of the polymer is from 5000 to 400000.4. The polymer as claimed in claim 1 , wherein a weight average molecular weight of the polymer is from 50000 to 100000. The present application is based on, and claims priority from, Taiwan Application Serial Number 108125799, filed on Jul. 22, 2019, the disclosure of which is hereby incorporated by reference herein in its entirety.The present disclosure relates to a polymer, and particularly to a polymer used in membranes, ion-exchange membranes, and structure-enhanced membranes employing the polymer.With the increasing popular awareness of environmental protection issues and the growing demand for water resources, water treatment-related research such as raw water desalination and wastewater recycling are booming.A common raw water desalination method is electrodialysis (ED). Cations can only penetrate through a cation-exchange membrane and anions can only penetrate through an anion-exchange membrane. Electrodialysis (ED) utilizes this property to separate selected cations and anions from each other in water through an ion-exchange membrane. Specifically, by applying a DC electric field, anions (e.g., Cl) in raw water will move toward the anode, ...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Provided is a heat-curable maleimide resin composition capable of being turned into a cured product with a superior dielectric property, and allowing a plating layer(s) to be formed only at laser-irradiated parts on the surface of or inside the cured product. The heat-curable maleimide resin composition contains: 1. A heat-curable maleimide resin composition comprising:(A) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and {'br': None, 'sub': 2', '4, 'ABO\u2003\u2003(1)'}, '(B) a laser direct structuring additive in an amount of 5 to 100 parts by mass per 100 parts by mass of the component (A), the laser direct structuring additive being a metal oxide having a spinel structure and represented by the following average composition formula (1)wherein A represents one or more metal elements selected from iron, copper, nickel, cobalt, zinc, magnesium and manganese, B represents iron or chrome, provided that A and B do not both represent iron.2. The heat-curable maleimide resin composition according to claim 1 , wherein an average particle size of the component (B) is 0.01 to 5 μm.3. The heat-curable maleimide resin composition according to claim 1 , wherein the component (B) is such that after an aqueous dispersion of the component (B) is prepared by immersing 10 parts by mass of the component (B) in 50 parts by mass of pure water claim 1 , and then left to stand at 125±3° C. for 20±1 hours claim 1 , a sodium ion concentration in the aqueous dispersion of the component (B) is not higher than 50 ppm claim 1 , and a chloride ion concentration in the aqueous dispersion of the component (B) is not higher than 50 ppm.6. The heat-curable maleimide resin composition according to claim 1 , further comprising a mold release agent claim 1 , an adhesion aid and a curing accelerator.7. The heat-curable maleimide resin composition according ...

LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE

The present invention provides a liquid crystal display device that includes: a pair of substrates; a liquid crystal layer held between the substrates; and an alignment film disposed on a liquid crystal layer side surface of at least one of the substrates, the liquid crystal layer containing a liquid crystal material that has a nematic-isotropic phase transition temperature of 75° C. or lower and a nematic phase temperature range narrower than 100° C., the alignment film containing a first polymer and a second polymer, the first polymer having in its main chain at least one selected from a polyamic acid structure and a polyimide structure or a polysiloxane structure, the second polymer being obtained by polymerizing at least one monomer including at least one monomer containing an azobenzene group. 3. The liquid crystal display device according to claim 1 ,wherein the first polymer contains at least one photo-functional group selected from the group consisting of a cinnamate group, an azobenzene structure, a chalcone group, and a coumarin group, each of which may contain a substituent.4. The liquid crystal display device according to claim 1 ,wherein the alignment film includes a lower layer containing the first polymer and an upper layer disposed on a liquid crystal layer side of the lower layer and containing the second polymer.5. The liquid crystal display device according to claim 4 ,wherein the lower layer is a photo-alignment layer.6. The liquid crystal display device according to claim 4 ,wherein the lower layer is a vertical alignment layer.7. The liquid crystal display device according to claim 4 ,wherein the lower layer is a horizontal alignment layer.8. The liquid crystal display device according to claim 1 ,wherein the liquid crystal layer contains a liquid crystal material that has a nematic-isotropic phase transition temperature of 75° C. or lower and a nematic phase temperature range narrower than 100° C.9. The liquid crystal display device according ...

LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE

The present invention provides a liquid crystal display device includes: a pair of substrates; a liquid crystal layer held between the substrates; an alignment film disposed on a liquid crystal layer side surface of at least one of the substrates; and a polymer layer disposed between the liquid crystal layer and the alignment film, the liquid crystal layer containing liquid crystal compounds aligned in a predetermined direction with no voltage applied, the alignment film containing a first polymer containing in its main chain at least one selected from a polyamic acid structure and a polyimide structure, the polymer layer containing a second polymer obtained by polymerizing at least one monomer containing an azobenzene group, the second polymer covalently bonded to the first polymer. 4. The liquid crystal display device according to claim 3 ,wherein the first polymer contains a functional group represented by the formula (3-1).6. The liquid crystal display device according to claim 1 ,wherein the first polymer contains at least one photo-functional group.7. The liquid crystal display device according to claim 6 ,wherein the first polymer contains at least one photo-functional group selected from the group consisting of a cinnamate group, an azobenzene group, a chalcone group, and a coumarin group, each of which may contain a substituent.8. The liquid crystal display device according to claim 1 ,wherein the liquid crystal display device is in a liquid crystal driving mode of a horizontal alignment mode, andthe polymer layer aligns the liquid crystal compounds in a directional parallel to surfaces of the substrates.9. The liquid crystal display device according to claim 1 ,wherein the liquid crystal display device is in a liquid crystal driving mode of an FFS mode, an IPS mode, an MVA mode, or a 4D-RTN mode.13. The method for manufacturing a liquid crystal display device according to claim 12 ,wherein the first polymer contains a functional group represented by the ...

Liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display element having thereof

The present invention relates to a liquid crystal alignment agent, a liquid crystal alignment film made by the liquid crystal alignment agent and a liquid crystal display element having the liquid crystal alignment film. The liquid crystal alignment agent includes a polymer (A) and a solvent (B). The polymer (A) is synthesized by reacting a mixture that includes a tetracarboxylic dianhydride compound (a) and a diamine compound (b). According to the specific diamine compound (b) and an amount of the same, the aforementioned liquid crystal alignment agent has better pretilt angle stability.

RESIN COMPOSITION

A resin composition for insulating coating material, comprises: a polyimide resin and/or a precursor thereof; and a polymer having a heterocyclic ring at a side chain, wherein the content of the polymer having a heterocyclic ring at a side chain is 0.1 to 7 parts by weight relative to 100 parts by weight of the polyimide resin and/or the precursor thereof. By adding a prescribed amount of the polymer having a heterocyclic ring at a side chain, there can be obtained a resin composition for insulating coating material still maintaining heat resistance and together having excellent bending resistance. 1. A resin composition for insulating coating material , comprising: a polyimide resin and/or a precursor thereof; and a polymer having a heterocyclic ring at a side chain , wherein the content of the polymer having a heterocyclic ring at a side chain is 0.1 to 7 parts by weight relative to 100 parts by weight of the polyimide resin and/or the precursor thereof.2. The resin composition for insulating coating material according to claim 1 , wherein the polymer having a heterocyclic ring at a side chain is one or two or more selected from the group consisting of polyvinylpyrrolidone claim 1 , polyvinylpyridine claim 1 , and copolymers containing at least one of vinylpyrrolidone and vinylpyridine as a copolymerization component.3. The resin composition for insulating coating material according to claim 1 , wherein the glass transition temperature (Tg) of the polyimide resin and/or the precursor thereof is 250 to 400° C.7. The resin composition for insulating coating material according to claim 6 , wherein the polyimide resin and/or the precursor thereof contains the repeating unit containing a structure represented by the following formula (5) and the repeating unit containing a —C(O)NH— structure.8. The resin composition for insulating coating material according to claim 7 , wherein the —C(O)NH— structure is a structure derived from 4 claim 7 ,4′-diaminobenzanilide.9. The ...

CURED BODY AND MULTILAYERED SUBSTRATE

Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 μm or less, and the island part contains the polyimide. 1. A cured body of a resin composition including an epoxy compound , a curing agent , an inorganic filler , and a polyimide ,a content of the inorganic filler being 30% by weight or more and 90% by weight or less in 100% by weight of the cured body,the cured body having a sea-island structure having a sea part and an island part, the island part having an average long diameter of 5 μm or less, and the island part containing the polyimide.2. The cured body according to claim 1 , whereina content of the polyimide is 3% by weight or more and 50% by weight or less in 100% by weight of components excluding the inorganic filler in the cured body.3. The cured body according to claim 1 , whereinthe curing agent contains an active ester compound.4. The cured body according to claim 1 , whereinthe resin composition contains a curing accelerator.5. The cured body according to claim 1 , whereinthe inorganic filler contains a silica.6. The cured body according to claim 5 , whereina content of the silica is 40% by weight or more in 100% by weight of the cured body.7. The cured body according claim 1 , whereinthe polyimide has an aliphatic structure having 6 or more carbon atoms.8. The cured body according to claim 1 , whereinthe polyimide is a polyimide excluding a polyimide having a siloxane skeleton.9. The cured body ...

RESIN COMPOSITION, CURED RELIEF PATTERN THEREOF, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELECTRONIC COMPONENT OR SEMICONDUCTOR EQUIPMENT USING THE SAME

An object of the present invention is to provide a resin composition capable of suppressing surface roughness in a thin film portion and maintaining insulation reliability of a thin film portion, a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern. The constitution of the present invention for achieving the above-mentioned object is as follows. That is, the present invention provides a resin composition containing: (a) at least one resin selected from an alkali-soluble polyimide, an alkali-soluble polybenzoxazole, an alkali-soluble polyamide-imide, precursors thereof, and copolymers thereof; and (b) an alkali-soluble phenol resin, wherein a ratio (R/R) between an alkali dissolution rate (R) of the resin (a) and an alkali dissolution rate (R) of the resin (b) satisfies a relationship of 0.5≤R/R≤2.0. The present invention also provides a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern. 1. A resin composition comprising:(a) at least one resin selected from an alkali-soluble polyimide, an alkali-soluble polybenzoxazole, an alkali-soluble polyamide-imide, precursors thereof, and copolymers thereof; and(b) an alkali-soluble phenol resin,{'sub': b', 'a', 'a', 'b', 'b', 'a, 'wherein a ratio (R/R) between an alkali dissolution rate (R) of the resin (a) and an alkali dissolution rate (R) of the resin (b) satisfies a relationship of 0.5≤R/R≤2.0.'}2. The resin composition according to claim 1 , wherein the ratio (R/R) between the alkali dissolution rate (R) of the resin (a) and the alkali dissolution rate (R) of the resin (b) satisfies a relationship of 0.8≤R/R<1.0.3. The resin composition according to claim 1 , further comprising (c) a quinone diazide compound and having photosensitivity.4. The resin composition according to ...

POLYIMIDE POLYMER, POLYIMIDE FILM, AND FLEXIBLE COPPER-COATED LAMINATE

A polyimide polymer represented by the following formula 1 is provided. 3. A polyimide film comprising the polyimide polymer of .4. The polyimide film of claim 3 , wherein a dielectric constant of the polyimide film is 3 to 3.55.5. The polyimide film of claim 3 , wherein a coefficient of thermal expansion of the polyimide film is 12 ppm/° C. to 22 ppm/° C.6. The polyimide film of claim 3 , wherein a glass transition temperature of the polyimide film is 350° C. to 365° C.7. A flexible copper-coated laminate comprising: {'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'a polyimide film disposed on the copper foil, wherein the polyimide film is the polyimide film of .'}, 'a copper foil; and'}8. The flexible copper-coated laminate of claim 7 , further comprising an adhesive layer disposed between the copper foil and the polyimide film. This is a continuation application of and claims the priority benefit of the prior patent application Ser. No. 14/565,420, filed on Dec. 10, 2014, now allowed, which claims the priority benefit of Taiwan application serial no. 103137208, filed on Oct. 28, 2014. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.Field of the InventionThe invention relates to a polyimide polymer, a polyimide film, and a flexible copper-coated laminate. More particularly, the invention relates to a polyimide polymer having a low dielectric constant, a polyimide film including the polyimide polymer, and a flexible copper-coated laminate including the polyimide film.Description of Related ArtAs electronic devices gradually become thinner and lighter, the demand for use of a flexible printed circuit board greatly increases. The mainly upstream material of the flexible printed circuit board is a flexible copper-coated laminate which is produced by coating or attaching a polyimide polymer onto a copper foil. In the current industry environment, the polyimide polymer is ...

RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD

The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less. 1. A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x) , when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis , and also surrounded by the x axis , is greater than an area surrounded by a stress-strain curve f2(x) , when the amount of strain is decreased from 0.3% , and also surrounded by the x axis , and the amount of change in the amount of strain when tensile stress is 0 , before and after applying tensile stress , is 0.05% or less.2. The resin composition according to claim 1 , wherein the cured product exhibits a feature in whichthe ratio of a second proportion of a change in stress relative to a change in the amount of strain between a first amount of strain when stress is 0 and a second amount of strain resulting from adding 0.1% to the first amount of strain on the curve f2(x) toa first proportion of a change in stress relative to a change in the amount of strain at an amount of strain of 0% to 0.1% on the curve f1(x) is 0.5 or less.3. The resin composition according to claim 1 , wherein the cured product exhibits a feature in which the ratio of tensile stress on a stress-strain curve f2(0 ...

LIGHT ABSORBER AND ORGANIC ELECTROLUMINESCENCE DEVICE INCLUDING THE SAME

Provided are a light absorber represented by Formula 1 and an organic electroluminescence device including a light absorption layer including the light absorber: 3. The light absorber as claimed in claim 1 , wherein Ar is a substituted or unsubstituted phenyl group claim 1 , a substituted or unsubstituted biphenyl group claim 1 , a substituted or unsubstituted naphthyl group claim 1 , a substituted or unsubstituted fluorene group claim 1 , a substituted or unsubstituted dibenzofuran group claim 1 , or a substituted or unsubstituted dibenzothiophene group.4. The light absorber as claimed in claim 1 , wherein a maximum absorption wavelength is from about 380 nm to about 410 nm.8. The organic electroluminescence device as claimed in claim 6 , wherein Ar is a substituted or unsubstituted phenyl group claim 6 , a substituted or unsubstituted biphenyl group claim 6 , a substituted or unsubstituted naphthyl group claim 6 , a substituted or unsubstituted fluorene group claim 6 , a substituted or unsubstituted dibenzofuran group claim 6 , or a substituted or unsubstituted dibenzothiophene group.9. The organic electroluminescence device as claimed in claim 6 , wherein the light absorber has a maximum absorption wavelength of about 380 nm to about 410 nm.10. The organic electroluminescence device as claimed in claim 6 , wherein the light absorption layer is provided on the second electrode and makes contact with the second electrode.11. The organic electroluminescence device as claimed in claim 6 , wherein the light absorption layer is a thin film encapsulation layer covering the first electrode claim 6 , the hole transport region claim 6 , the emission layer claim 6 , the electron transport region and the second electrode.13. An organic electroluminescence device claim 6 , comprising:a first electrode;a hole transport region provided on the first electrode;an emission layer provided on the hole transport region;an electron transport region provided on the emission layer;a ...

FIBER REINFORCED POLYETHERIMIDE COMPOSITIONS

Disclosed herein are compositions comprising a polyetherimide, a polyester carbonate, and a reinforcement agent; wherein the composition comprises the reinforcement agent in an amount ranging from 1 wt % to 70 wt % relative to the total weight of the composition; wherein the polyester carbonate comprises at least 40 mole % resorcinol based aryl ester linkages. Also, disclosed herein are articles comprising the compositions disclosed. 1. A composition comprising a polyetherimide , a polyester carbonate , and a reinforcement agent;wherein the composition comprises the reinforcement agent in an amount ranging from 1 wt % to 70 wt % relative to the total weight of the composition; andwherein the polyester carbonate comprises at least 40 mole % resorcinol based aryl ester linkages.2. The composition of claim 1 , wherein the composition comprises the polyetherimide in an amount ranging from 25 wt % to 60 wt % relative to the total weight of the composition; and wherein the composition comprises the polyester carbonate in an amount ranging from 20 wt % to 50 wt % relative to the total weight of the composition.3. The composition claim 1 , wherein the reinforcement agent comprises a carbon fiber or a glass fiber or a combination thereof.4. The composition of claim 1 , wherein the polyester carbonate comprises the resorcinol based aryl ester linkages in an amount ranging from 40 mole % to 95 mole % based on the total mole % of the polyester carbonate.5. The composition of claim 1 , wherein the composition comprises the reinforcement agent in an amount ranging from 5 wt % to 35 wt % relative to the total weight of the composition.6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. The composition of claim 1 , wherein the composition further comprises a polyetherimide-siloxane copolymer.11. The composition of claim 10 , wherein the polyetherimide-siloxane copolymer is present in an amount ranging from 0.1 wt % to 10 wt % relative to the total weight of the composition.12. ...

POLYIMIDE PRECURSOR RESIN COMPOSITION

This resin composition is characterized by comprising (a) 100 parts by mass of a polyimide precursor containing a structural unit represent by general formula (1) (wherein, R1 and R2 are each independently selected from a hydrogen atom, monovalent aliphatic hydrocarbons having 1-20 carbon atoms, and aromatic groups, and X1 is a tetravalent organic group having 4-32 carbon atoms), (b) 0.001-5 parts by mass of a silicone-based surfactant, and (c) an organic solvent. 3. The resin composition according to claim 2 , wherein Xin general formula (3) represents a tetravalent organic group derived from at least one type of compound selected from the group consisting of 4 claim 2 ,4′-(hexafluoroisopropylidene)diphthalic anhydride claim 2 , 3 claim 2 ,3′ claim 2 ,4 claim 2 ,4′-biphenyltetracarboxylic dianhydride and 4 claim 2 ,4′-oxydiphthalic dianhydride.4. The resin composition according to claim 2 , wherein Xin general formula (3) represents a tetravalent organic group derived from 4 claim 2 ,4′-(hexafluoroisopropylidene)diphthalic anhydride.5. The resin composition according to claim 2 , wherein the molar ratio of the structural unit represented by formula (2) to the structural unit represented by formula (3) in the polyimide precursor of (a) is within the range of 90:10 to 50:50.8. The resin composition according to claim 7 , wherein the molar ratio of the polyimide precursor (a1) to the polyimide precursor (a2) in the polyimide precursor of (a) is within the range of 90:10 to 50:50.11. The resin composition according to claim 1 , wherein the organic solvent of (c) contains a compound having a boiling point within the range of 170° C. to 270° C.12. The resin composition according to claim 1 , wherein the organic solvent of (c) contains a compound having a vapor pressure at 20° C. of 250 Pa or less.14. The resin composition according to claim 1 , further containing (d) an alkoxysilane compound.18. A method for producing a resin film claim 1 , comprising:{'claim-ref': {'@ ...

LOSS-DISSIPATION FLEXIBLE COPPER CLAD LAMINATE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification. 4. The low-dissipation flexible copper clad laminate of claim 3 , wherein a dielectric constant of the polyimide film is 2.8 to 3.5.5. The low-dissipation flexible copper clad laminate of claim 3 , wherein a dissipation factor of the polyimide film is less than 0.0025.8. The manufacturing method of claim 6 , wherein the organic solvent is dimethylacetamide claim 6 , dimethylformamide claim 6 , or N-methyl-2-pyrrolidone.9. The manufacturing method of claim 6 , wherein a molar ratio of the diamine monomer represented by formula (i) to the dianhydride monomer represented by formula (ii) is 0.9 to 1.1.10. An electronic device comprising the low-dissipation flexible copper clad laminate of . This application claims priority to Taiwan Application Serial Number 109128303, filed Aug. 19, 2020, which is herein incorporated by reference.The present disclosure relates to a flexible copper clad laminate, a manufacturing method thereof and an electronic device. More particularly, the present disclosure relates to a low-dissipation flexible copper clad laminate, a manufacturing method thereof and an electronic device.Since 2015, the International Telecommunication Union (ITU) is officially announced the vision of 5Generation Mobile Network, all relevant units have successively developed the new technologies and materials. Furthermore, for the new generation of communication networks, it must be achieved the expectances, such as the high transmission rate, the high stability, the low latency and the low transmission loss, at the high frequencies.The printed circuit board (PCB) is mainly used in the electronic products, such as communications, ...

Asymmetric Diamine Compounds Containing Two Functional Groups and Polymers Therefrom

The present invention relates to a novel diamine compound, wherein two substituents R and R′ are introduced asymmetrically, and a polymer thereof. The polymer may have excellent solubility in the organic solvent and allows for easy processibility after imidization, thus giving proper film maintaining superior properties, such as thermal, mechanical, and optical properties for applications in electrical, electronic, or optical materials. 2: The asymmetrical diamine compound according to claim 1 , wherein R and R′ are hydrocarbyl group comprising fluorine.1: The asymmetrical diamine compound according to claim 1 , wherein L is any one selected from the group consisting of a direct bond claim 1 , —O— claim 1 , and —S—.6: The process for producing the asymmetrical diamine compound according to claim 5 , wherein R and R′ are hydrocarbyl group comprising fluorine.7: The process for producing the asymmetrical diamine compound according to wherein L is any one selected from the group consisting of a direct bond claim 5 , —O— claim 5 , and —S—.9: A process for producing polymer selected from a group of polyamide claim 1 , polyamic acid claim 1 , and polyimide claim 1 , wherein asymmetric diamine compound according to is used in the polymerization as monomer.11: The A process for producing the polyimide according to claim 10 , wherein said asymmetrical diamine compound and tetracarboxylic acid monomers are dissolved in organic solvent to produce polyamic acid claim 10 , followed by heating and stirring to complete imidization.12: The process for producing the polyimide according to claim 10 , wherein said tetracarboxylic acid is any one selected from a group consisting of 1 claim 10 ,2 claim 10 ,4 claim 10 ,5-Benzenetetracarboxylic dianhydride claim 10 , 3 claim 10 ,3′ claim 10 ,4 claim 10 ,4′-Benzophenonetetracarboxylic dianhydride claim 10 , 2 claim 10 ,2′ claim 10 ,3 claim 10 ,3′-Benzophenonetetracarboxylic dianhydride claim 10 , 3 claim 10 ,3′ claim 10 ,4 claim 10 ,4′- ...

THERMOPLASTIC COPOLYIMIDES

The present invention relates to semiaromatic semicrystalline thermoplastic copolyimides obtained by polymerization of at least: (a) an aromatic compound comprising two anhydride functions and/or carboxylic acid and/or ester derivatives thereof; (b) a diamine of formula (I) NH2-R—NH2 in which R is a divalent aliphatic hydrocarbon-based radical optionally comprising heteroatoms, the two amine functions being separated by a number X of carbon atoms, X being between 4 and 12; and (c) a diamine of formula (II) NH2-R′—NH2 in which R′ is a divalent aliphatic hydrocarbon-based radical optionally comprising heteroatoms, the two amine functions being separated by a number Y of carbon atoms, Y being between 10 and 20; it being understood that diamine (b) is different from diamine (c). 133-. (canceled)34. A semiaromatic semicrystalline thermoplastic copolyimide obtained by polymerization of at least:(a) an aromatic compound comprising two anhydride functions and/or carboxylic acid and/or ester derivatives thereof;(b) a diamine of formula (I) NH2-R—NH2 selected from the group consisting of: 1,4-diaminobutane, 1,5-diaminopentane, 2-methyl-1,5-diaminopentane, hexamethylenediamine, 3-methylhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,2,4- and 2,4,4-trimethyl-hexamethylenediamine, 1,7-diaminoheptane, 1,8-diaminooctane; and(c) a diamine of formula (II) NH2-R′—NH2 in which R′ is a saturated or unsaturated divalent aliphatic hydrocarbon-based radical, optionally comprising heteroatoms, wherein the two amine functions are separated by a number Y of carbon atoms, Y is between 10 and 20, and the radical R′ comprises not more than 20 carbon atoms.35. The copolyimide as claimed in claim 34 , wherein the copolyimide is obtained with addition of chain limiter(s) and/or supplemented with an excess of one of the monomers claim 34 , so as to create a stoichiometric imbalance.36. The copolyimide as claimed in claim 34 , wherein the copolyimide has a melting point Tf of between 50 ...

FLEXIBLE SUBSTRATE ASSEMBLY AND ITS APPLICATION FOR FABRICATING FLEXIBLE PRINTED CIRCUITS

A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base. 1. A method of fabricating a flexible printed circuit , comprising:providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other;forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer;while the flexible substrate is supported by the carrying support, applying one or more processing step on the flexible substrate; andwhile the release layer remains adhered in contact with the support base, peeling the flexible substrate with an electric circuit formed thereon from the release layer;wherein the release layer and the flexible substrate respectively comprise a polyimide layer.2. The method according to claim 1 , wherein the step of providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other includes:providing a rigid support base; andforming a first polyimide layer serving as the release layer on the support base, wherein the step of forming the first polyimide layer includes incorporating in a polyamic acid solution an adhesion promoting agent for promoting adhesion between the release layer and the support base, and a release agent for achieving a peeling strength between the release layer and the flexible substrate that is less than a peeling strength between the first ...

Poly(amic acid) composition and polyimide composition

There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride.

Polyamic acid resin, polyamideimide film, and method for preparing the same

Provided are a polyamic acid resin, a polyamideimide film, and a method for preparing the same. More specifically, provided are a polyamic acid resin derived from a combination of specific components, a polyamideimide film capable of implementing high modulus and excellent optical properties while implementing excellent mechanical properties, heat properties, and electrical properties, and a method for preparing the same.

ELECTRICAL TRACKING RESISTANCE COMPOSITIONS, ARTICLES FORMED THEREFROM, AND METHODS OF MANUFACTURE THEREOF

A composition comprises, based on the total weight of the composition, 45 wt % to 75 wt % of a polyetherimide; and 20 wt % to 45 wt % of talc; and 5 wt % to 15 wt % of a fluorinated polymer; wherein the composition has a number of drops to tracking at 250 volts of greater than or equal to 50 drops according to ASTM D-3638-85. 4. The composition of claim 3 , wherein R is m-phenylene and Q is isopropylidene.5. The composition of claim 3 , whereinat least 50 mole percent (mol %) of the R groups are bis(3,4′-phenylene)sulfone, bis(3,3′-phenylene)sulfone, or a combination comprising at least one of the foregoing and the remaining R groups are p-phenylene, m-phenylene or a combination comprising at least one of the foregoing; and Z is 2,2-(4-phenylene)isopropylidene.6. The composition of claim 1 , wherein the fluorinated polymer comprises polytetrafluoroethylene.8. The composition of claim 7 , wherein the composition has:a tensile strength greater than or equal to 70 MPa determined according to ASTM D638;a tensile modulus of greater than or equal to 6500 GPa determined according to ASTM method D638, anda heat deflection temperature of greater than or equal to 200° C. measured on 3.2 millimeter injection molded bar at 1.82 MPa stress according to ASTM D648.10. The composition of claim 9 , wherein the composition has:a tensile strength greater than or equal to 40 MPa determined according to ASTM D638;a tensile modulus of greater than or equal to 11,000 GPa determined according to ASTM method D638, anda heat deflection temperature of greater than or equal to 210° C. measured on 3.2 millimeter injection molded bar at 1.82 MPa stress according to ASTM D648.11. The composition of claim 1 , further comprising an additive selected from a processing aid claim 1 , a heat stabilizer claim 1 , a dye claim 1 , a flame retardant claim 1 , or a combination comprising at least one of the foregoing.12. An insulating material comprising the composition of .13. An article selected from a ...

RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE

Provided are a resin composition including a coloring material, a resin, and a solvent, in which, in a case where a film having a thickness of 0.60 μm is formed by heating the resin composition at 200° C. for 30 minutes, a rate of change ΔA in an absorbance of the film after performing a heating treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere, which is represented by Expression (1), is 50% or less; a film formed of the resin composition; a color filter; a solid-state imaging element; and an image display device. In the following expression, ΔA is the rate of change in the absorbance of the film after the heating treatment, A1 is a maximum value of an absorbance of the film before the heating treatment in a wavelength range of 400 to 1100 nm, and A2 is an absorbance of the film after the heating treatment, and is an absorbance at a wavelength showing the maximum value of the absorbance of the film before the heating treatment in a wavelength range of 400 to 1100 nm.

TEMPERATURE SENSOR ELEMENT

There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a matrix resin and a plurality of conductive domains contained in the matrix resin, and the matrix resin constituting the temperature-sensitive film has a degree of molecular packing of 40% or more, as determined based on measurement by an X-ray diffraction method, according to expression (i): Degree of molecular packing (%)=100×(Area of peak derived from ordered structure)/(Total area of all peaks).

TEMPERATURE SENSOR ELEMENT

There is provided a temperature sensor element including a pair of electrodes and a temperature-sensitive film disposed in contact with the pair of electrodes, in which the temperature-sensitive film includes a fluorine atom and the temperature-sensitive film includes a matrix resin and a plurality of conductive domains contained in the matrix resin, and the conductive domains includes a conductive polymer.

POLY(AMIDE-IMIDE) COPOLYMER, COMPOSITION FOR PREPARING POLY(AMIDE-IMIDE) COPOLYMER, ARTICLE INCLUDING POLY(AMIDE-IMIDE) COPOLYMER, AND DISPLAY DEVICE INCLUDING THE ARTICLE

A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: 2. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 1 claim 1 , Lis a C1 to C20 alkylene group claim 1 , Rand Rare each independently F or Cl claim 1 , both a and b are 1 claim 1 , and c and d are each independently an integer ranging from 0 to 2.3. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 1 claim 1 , Lis methylene group claim 1 , both a and b are 1 claim 1 , and both c and d are 0.4. The poly(amide-imide) copolymer according to claim 1 , wherein the diamine represented by Chemical Formula 2 comprises a ring system comprising two C6 to C12 aromatic rings linked by a single bond claim 1 , wherein each of the two C6 to C12 aromatic rings are independently substituted by an electron-withdrawing group selected from a halogen atom claim 1 , a nitro group claim 1 , a cyano group claim 1 , a C1 or C2 haloalkyl group claim 1 , a C2 to C6 alkanoyl group claim 1 , or a C1 to C6 ester group.7. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 3 claim 1 , Ris a phenylene group claim 1 , and each X is independently Cl or Br.8. The poly(amide-imide) copolymer according to claim 1 , wherein the tetracarboxylic acid dianhydride represented by Chemical Formula 4 comprises at least one selected from 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenyl tetracarboxylic dianhydride (BPDA) claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA) claim 1 , 4 claim 1 ,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) claim 1 , and 4 claim 1 ,4′-oxydiphthalic anhydride (ODPA).9. The poly(amide-imide) copolymer according to claim 1 , wherein the tetracarboxylic acid ...

POLY(AMIDE-IMIDE) COPOLYMER, COMPOSITION FOR PREPARING POLY(AMIDE-IMIDE) COPOLYMER, ARTICLE INCLUDING POLY(AMIDE-IMIDE) COPOLYMER, AND DISPLAY DEVICE INCLUDING THE ARTICLE

A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: 2. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 1 claim 1 , Lis a C1 to C20 alkylene group claim 1 , Rand Rare each independently F or Cl claim 1 , both a and b are 1 claim 1 , and c and d are each independently an integer ranging from 0 to 2.3. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 1 claim 1 , Lis methylene group claim 1 , both a and b are 1 claim 1 , and both c and d are 0.4. The poly(amide-imide) copolymer according to claim 1 , wherein the diamine represented by Chemical Formula 2 comprises a ring system comprising two C6 to C12 aromatic rings linked by a single bond claim 1 , wherein each of the two C6 to C12 aromatic rings are independently substituted by an electron-withdrawing group selected from a halogen atom claim 1 , a nitro group claim 1 , a cyano group claim 1 , a C1 or C2 haloalkyl group claim 1 , a C2 to C6 alkanoyl group claim 1 , or a C1 to C6 ester group.7. The poly(amide-imide) copolymer according to claim 1 , wherein in Chemical Formula 3 claim 1 , Ris a phenylene group claim 1 , and each X is independently Cl or Br.8. The poly(amide-imide) copolymer according to claim 1 , wherein the tetracarboxylic acid dianhydride represented by Chemical Formula 4 comprises at least one selected from 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenyl tetracarboxylic dianhydride (BPDA) claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA) claim 1 , 4 claim 1 ,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) claim 1 , and 4 claim 1 ,4′-oxydiphthalic anhydride (ODPA).9. The poly(amide-imide) copolymer according to claim 1 , wherein the tetracarboxylic acid ...

CURABLE MIXTURES BASED ON XYLYLENE BISMALEIMIDE

The invention relates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) 119-. (canceled)23. Curable mixture according to claim 20 , wherein the comonomer component consists of at least one comonomer selected from: 3 claim 20 ,3′-diallylbisphenol A claim 20 , diallyl ether of bisphenol A claim 20 , bis-(o-propenylphenoxy)benzophenone claim 20 , m-aminobenzhydrazide claim 20 , bisphenol A dicyanate ester claim 20 , diallyl phthalate claim 20 , triallyl isocyanurate claim 20 , triallyl cyanurate claim 20 , styrene claim 20 , and divinylbenzene.26. Curable mixture according to claim 20 , wherein the polyimide component consists of at least one polyimide selected from 4 claim 20 ,4′-bismaleimidodiphenylmethane claim 20 , bis(3-methyl-5-ethyl-4-maleimidophenyl)methane claim 20 , bis(3 claim 20 ,5-dimethyl-4-maleimidophenyl)methane claim 20 , 4 claim 20 ,4′-bismaleimidodiphenyl ether claim 20 , 4 claim 20 ,4′-bismaleimidodiphenylsulfone claim 20 , 3 claim 20 ,3′-bismaleimidodiphenylsulfone claim 20 , bismaleimidodiphenylindane claim 20 , 2 claim 20 ,4-bismaleimidotoluene claim 20 , 2 claim 20 ,6-bismaleimidotoluene claim 20 , 1 claim 20 ,3-bismaleimidobenzene claim 20 , 1 claim 20 ,2-bismaleimidobenzene claim 20 , 1 claim 20 ,4-bismaleimidobenzene claim 20 , 1 claim 20 ,2-bismaleimidoethane claim 20 , 1 claim 20 ,6-bismaleimidohexane claim 20 , 1 claim 20 ,6-bismaleimido-(2 claim 20 ,2 claim 20 ,4-trimethyl)hexane claim 20 , 1 claim 20 ,6-bismaleimido-(2 claim 20 ,4 claim 20 ,4-trimethyl)hexane claim 20 , 1 claim 20 ,4-bismaleimidocyclohexane claim 20 , 1 claim 20 ,3-bis(maleimidomethyl)cyclohexane claim 20 , 1 claim 20 ,4-bis(maleimidomethyl)cyclohexane claim 20 , and 4 claim 20 ,4′-bismaleimidodicyclohexylmethane.27. Curable mixture according to claim 20 , whereinRM % is defined as 5 wt % to 70 wt %;RP % is defined as 1 wt % to 60 wt %; andRC % is defined as 20 wt % to 80 wt %.28. Curable mixture according to claim 20 , further comprisinga ...