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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 22819. Отображено 100.
19-01-2012 дата публикации

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Номер: US20120012999A1
Принадлежит: Hitachi Chemical Co Ltd

The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

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19-01-2012 дата публикации

Bioadhesive compounds and methods of synthesis and use

Номер: US20120016390A1
Принадлежит: KNC NER Acquisition Sub Inc

The invention describes new synthetic medical adhesives and antifouling coatings which exploit the key components of natural marine mussel adhesive proteins.

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26-01-2012 дата публикации

Golf ball

Номер: US20120021852A1
Автор: Kazuhiko Isogawa
Принадлежит: SRI Sports Ltd

A golf ball 2 includes a spherical core 4 , an adhesive layer 6 covering the core 4 , and a cover 8 covering the adhesive layer 6 . The core 4 includes a spherical center 10 and a mid layer 12 covering the center 10 . The adhesive layer 6 is formed from an adhesive. The base polymer of the adhesive is a two-component curing type epoxy resin obtained by curing a bisphenol A type epoxy resin with a curing agent including a polyamine compound. The gel fraction of the adhesive is equal to or greater than 40% but equal to or less than 80%. The ratio of the epoxy equivalent to the amine active hydrogen equivalent in the adhesive is equal to or greater than 2.0/1.0 but equal to or less than 13.0/1.0. The amine active hydrogen equivalent of the curing agent is equal to or greater than 100 g/eq but equal to or less than 800 g/eq. In the adhesive, the proportion of water to the entire volatile component is equal to or greater than 90% by weight.

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02-02-2012 дата публикации

Room temperature curing epoxy adhesive

Номер: US20120024477A1
Автор: Michael A. Kropp
Принадлежит: 3M Innovative Properties Co

Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.

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02-02-2012 дата публикации

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Номер: US20120025400A1
Принадлежит: Nitto Denko Corp

The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.

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02-02-2012 дата публикации

Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor device

Номер: US20120028050A1
Принадлежит: Nitto Denko Corp

The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 8×10 3 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing.

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02-02-2012 дата публикации

Curable adhesive compositions, process, and applications

Номер: US20120029116A1
Принадлежит: Trillion Science Inc

The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

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22-03-2012 дата публикации

Novel aqueous resorcinol-formaldehyde-latex dispersions, adhesion-improved fibres, processes for production thereof and use thereof

Номер: US20120071595A1
Принадлежит: RHEIN CHEMIE RHEINAU GMBH

The present invention relates to novel aqueous resorcinol-formaldehyde-latex dispersion, to adhesion-improved fibres, to processes for production thereof, and to use thereof for improving adhesion in tyres.

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29-03-2012 дата публикации

Terpolymers as pressure-sensitive adhesives

Номер: US20120077887A1
Принадлежит: Surmodics Pharmaceuticals Inc

Disclosed herein are terpolymers that can function as pressure-sensitive adhesives. The disclosed articles comprise the terpolymers adhered to a release liner. The disclosed implant devices comprise the pressure-sensitive adhesive terpolymer adhered to a surface thereof. The pressure-sensitive adhesive terpolymer can promote adhesion of the implant device to a location in a subject.

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05-04-2012 дата публикации

Endoscopic device

Номер: US20120082842A1
Принадлежит: OLYMPUS MEDICAL SYSTEMS CORP

An endoscope device is provided, which includes at least two component members bonded together through an adhesive layer which is formed by curing an adhesive composition, the adhesive composition containing a main agent containing a bisphenol A epoxy resin, a phenol novolac epoxy resin, and an acrylic rubber, a curing agent containing xylylenediamine and its derivative, and a filler. The filler is spherical silica having an average particle size of 0.5 to 20 μm, and accounts for 22 to 44% by mass of a total amount of the adhesive composition.

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19-04-2012 дата публикации

Cationically curable compositions and a primer therefor

Номер: US20120094137A1
Принадлежит: Henkel Ireland Ltd Dublin

The present invention relates to one-part cationically curable compositions with storage stability, wherein cure is independent of external stimuli such as heat and UV irradiation. In particular, the present invention provides for compositions with a long shelf life that will cure only upon application of the composition to the target surface, i.e. the surface is involved in initiating cure of the cationically curable component. Suitable compositions comprise those for curing on a surface comprising carbon-halogen covalent bonds comprising a cationically curable component and a non-halide silver salt. The present invention also relates to a primer capable of promoting cure of cationically curable non-halide silver salt compositions.

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21-06-2012 дата публикации

Curable and cured adhesive compositions

Номер: US20120156501A1
Принадлежит: 3M Innovative Properties Co

Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured adhesive compositions can be used as structural adhesives.

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12-07-2012 дата публикации

Resin with high heat transfer

Номер: US20120178851A1
Принадлежит: Cupa Innovacion SL

A resin with high heat transfer and potential is specially designed to transfer heat between two layers of different nature. One of the layers acts as an energy receiver via the outer face thereof and an energy emitter via the inner face thereof, and the other layer acts as a receiver of the accumulated energy in the resin, acting as connecting bridge between the two layers. The resin with high heat transfer of the invention includes granular particles of slate and preferably granular particles of a metallic nature, in a polymeric matrix.

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20-09-2012 дата публикации

Amine adducts

Номер: US20120238710A1
Принадлежит: Individual

Embodiments include an amine adduct obtainable by reacting an amine compound having at least two amino groups and a monoalkylpolyalkylene glycidyl ether having the formula (C 2 H 3 O)—CH 2 —O—(CH 2 —(CHR 1 )—O) n , —R 2 , wherein n is 1 to 50, each R 1 is independently H or CH 3 , and R 2 is an alkyl group. Embodiments include a curable composition including a resin component and a hardener component that includes the amine adduct.

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04-10-2012 дата публикации

Method of forming an adhesive bond

Номер: US20120247666A1
Принадлежит: GM GLOBAL TECHNOLOGY OPERATIONS LLC

A method of forming an adhesive bond between a first substrate and a second substrate includes applying a semi-crystalline polymeric adhesive composition to a bonding area of the first substrate, and, after applying, disposing the second substrate adjacent to and in contact with the composition to form a workpiece. After disposing, the method includes heating the workpiece to cure the composition and thereby form a thermoset polymeric adhesive material that is crosslinked. After heating, the method includes cooling the workpiece such that the material has a crystalline molecular structure. Concurrent to cooling, the method includes imposing a stress on the material to thereby orient the crystalline molecular structure in a desired direction, and, after imposing, dissipating the stress along the crystalline molecular structure in the desired direction to thereby form the adhesive bond between the first substrate and the second substrate.

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04-10-2012 дата публикации

Plastic pressure vessel for biopharmaceutical applications and methods thereof

Номер: US20120252118A1
Принадлежит: 3M Innovative Properties Co

Described herein is a molded plastic pressure vessel for biopharmaceutical applications and methods thereof. The molded plastic pressure vessel has a surface area of at least 500 inches2 and comprises a polyphenylene oxide polymer; and at least one antioxidant.

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25-10-2012 дата публикации

Methods of bonding articles together and the articles formed thereby

Номер: US20120270040A1
Принадлежит: 3M Innovative Properties Co

A method of bonding at least two articles together, the method includes forming a mold, wherein the mold is formed at least in part from the articles; and depositing a curable composition in the mold, wherein the curable composition polymerizes through metathesis polymerization to form a molded polymer joint that bonds the two articles together; and the article formed thereby. An article that includes a first portion; a second portion; and a molded polymer joint, wherein the molded polymer joint bonds the first portion to the second portion, the molded polymer joint has a thickness of at least about 1.3 mm, the molded polymer joint includes a metathesis polymer, and both the first and second portions have different compositions than the molded polymer joint.

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25-10-2012 дата публикации

Die attach film

Номер: US20120270381A1
Принадлежит: LG Chem Ltd

Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up characteristics in a die pressure-sensitive adhesive process. Further, the die attach film can prevent release, shifting, or deflection of a chip in a wire pressure-sensitive adhesive or molding process. Thus, it is possible to improve embeddability, inhibit warpage of a wafer or wiring substrate, and enhance productivity in a semiconductor packaging process.

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22-11-2012 дата публикации

Method for attaching an optical lens to a printed circuit board with electronic light source

Номер: US20120294011A1
Принадлежит: Shat-R-Shield Inc

The present invention relates to a LED assembly and method for attaching an optical lens to a printed circuit board having an electronic light source such as an LED or OLED, by application of an adhesive comprising silicone or an epoxy and heat curing the adhesive material at a low temperature.

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29-11-2012 дата публикации

Multilayer structure, and a method for making the same

Номер: US20120301714A1
Принадлежит: Dow Global Technologies LLC

The instant invention is a multilayer structure, and a method for making the same. The multilayer structure comprises: (a) at least one substrate layer comprising a polymeric material; (b) at least one adhesion layer, wherein said adhesion layer is derived from an adhesion promoter composition comprising: at least one aqueous epoxy dispersion; at least one hardening agent; optionally at least one leveling agent; at least one toughening agent; and optionally at least one filler; and (c) at least one surface layer comprising a plating metal; wherein said adhesion layer is disposed therebetween said at least one substrate layer and said at least one surface layer.

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29-11-2012 дата публикации

Polyester adhesive composition

Номер: US20120301717A1
Принадлежит: Nitto Denko Corp

The present invention has an object to provide a solvent-free polyester-based adhesive composition having good coatability and capable of forming an adhesive that shows good adhesion performance. The present invention provides a polyester-based adhesive composition containing a polyester having Mw of from 1×10 3 to 20×10 3 as a main component and a trifunctional or more polyepoxy compound as a crosslinking agent, and containing substantially no organic solvent. The molar number, m OH , of hydroxyl group contained in a polyalcohol component constituting the polyester is from 0.5 to 0.98 times of the molar number, m COOH , of carboxyl group contained in a polycarboxylic acid component. The composition has a viscosity at 23° C. of at most 80 Pa·s.

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29-11-2012 дата публикации

Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same

Номер: US20120302667A1
Принадлежит: Cheil Industries Inc

An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.

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06-12-2012 дата публикации

Curable biopolymer nanoparticle latex binder for mineral, natural organic, or synthetic fiber products and non-woven mats

Номер: US20120309246A1
Принадлежит: Individual

A curable aqueous binder composition includes a dispersion of biopolymer particles, optionally with and an inter-particle crosslinking agent, for use in the formation of composite materials such as mineral, natural organic, or synthetic fiber products, including mineral fiber insulation, non-woven mats, fiberglass insulation and related glass fiber products, and wood based products, and construction materials. In an application of the curable aqueous composition to making fiberglass insulation, the composition may be blended with a second resin which may be a non-formaldehyde resin. In an application of the composition to making fiberglass roofing shingles, the biopolymer particles may be mixed into a formaldehyde based resin during or after the polymerization of the resin.

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13-12-2012 дата публикации

Method of reducing the emission of formaldehyde from formaldehyde laden wood products

Номер: US20120316268A1
Автор: Georges Francis
Принадлежит: ADVACHEM SA

A method for the production of wood material articles with low emissions of formaldehyde is provided wherein the applied wood is treated with modified ammonium polyphosphate before bonding. When using formaldehyde resins in the bonding agent, wood material articles can be produced with the inventive method with extremely low formaldehyde emissions.

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13-12-2012 дата публикации

Method of manufacturing of flame retardant panels

Номер: US20120316269A1
Автор: Georges Francis
Принадлежит: ADVACHEM SA

The invention relates to a method for production of wood material articles containing wood containing elements and an organic resin binder system, wherein the wood containing elements are treated with an aqueous composition comprising at least a reaction product (MAPP) of melamine or urea with an ammonium polyphosphate, before being mixed with the organic binder system.

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27-12-2012 дата публикации

Heat activated optically clear adhesive for bonding display panels

Номер: US20120325402A1
Принадлежит: 3M Innovative Properties Co

A method of making a display assembly includes the steps of (a) attaching a first substrate and a second substrate with an optically clear heat activated adhesive to form a laminate. Each of the first and second substrate has opposing major surfaces. At least one of the first and second substrate has a three dimensional surface topography covering at least a portion of one of its major surfaces or is distortion sensitive. At a heat activation temperature, the adhesive is pressure sensitive. The method also includes heating the laminate to the heat activation temperature of the adhesive causing the adhesive to flow. The activation temperature is greater than 40° C. and less than 120° C.

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03-01-2013 дата публикации

Rubber adhesive compositions containing vinyl pyridine latex polymers with alternate nitrogen monomers

Номер: US20130000844A1
Принадлежит: Omnova Solutions Inc

The invention relates to polymeric latexes that can be used in adhesive compositions, which provide improved bonding of rubber articles to rubber reinforcing articles. The adhesive composition includes a single or a blend of polymeric latexes comprising a conjugated aliphatic monomer, a vinylaromatic monomer, a vinylpyridine monomer, and a nitrogen-containing monomer comprising a reactive N-methylol- or N-alkoxy-functionality. Use of the monomer comprising a nitrogen-containing monomer comprising a reactive N-methylol- or N-alkoxy-functionality allows for reduced amounts of the vinylpyridine monomer in the latex, and enhances the bonding properties of the adhesive composition. Use of the adhesive composition provides economic and chemical advantages for the preparation of reinforced rubberized articles.

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14-02-2013 дата публикации

Electrical conductor coated in a bonding layer, and a method of manufacturing such an electrical conductor

Номер: US20130037305A1
Принадлежит: Individual

The invention relates to an electrical conductor coated in an insulating layer itself coated in a bonding layer, the conductor being characterized in that said bonding layer is obtained from a composition comprising a thermoplastics polymer and a settable resin. The invention also applies to a method of manufacturing such an electrical conductor coated in a bonding layer, the method being characterized in that it comprises applying said composition on said electrical conductor coated in said insulating layer, and applying treatment to cause said settable resin to be cured at least in part.

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07-03-2013 дата публикации

Structural adhesives

Номер: US20130056153A1
Автор: Michael Czaplicki
Принадлежит: Zephyros Inc

A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.

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14-03-2013 дата публикации

BONDING AGENT AND DEVICE FOR USE IN MICROFLUIDICS

Номер: US20130064713A1
Принадлежит:

Disclosed embodiments concern a microfluidic device comprising a bonding agent and two or more components. In particular disclosed embodiments, the microfluidic device is made out of the disclosed bonding agent. Also disclosed are embodiments of a method for making a microfluidic device, wherein the method includes using the disclosed bonding agent to couple two or more components together. 4. The device of where the bonding agent is selected from polycaprolactone claim 1 , polycaprolactone diol claim 1 , polycaprolactone triol claim 1 , polycaprolactone-block-polytetrahydrofuan-block polycaprolactone claim 1 , poly(ethylene oxide)-block-polycaprolactone claim 1 , poly(ethylene glycol)-block-poly(e-caprolactone) methyl ether claim 1 , and combinations thereof.5. (canceled)6. The device of where the bonding agent is a thin film.79-. (canceled)10. The device of where the first component and the second component independently are selected from a lamina claim 1 , a microchip claim 1 , a port claim 1 , a valve claim 1 , and a portable detector.1114-. (canceled)15. The device of where the first component and/or the second component comprises at least one channel.1624-. (canceled)2627-. (canceled)2930-. (canceled)32. The device of where the hydrophilic substrate is paper.3334-. (canceled)35. A method of making the device of where the at least one channel is defined to have a particular pattern by adding a solution of the bonding agent in a manner that defines the boundary of the particular pattern.36. A method of making the device of where the hydrophilic substrate is coated with the bonding agent.37. The method of where the hydrophilic substrate is exposed to a radiation source claim 36 , which provides energy sufficient to penetrate the hydrophilic substrate and melt or substantially soften the bonding agent claim 36 , which is exposed to define the at least one channel.39. The method of where the first component and the second component independently are selected from a ...

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28-03-2013 дата публикации

ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS

Номер: US20130079475A1
Принадлежит: Henkel Corporation

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly. 125-. (canceled)26. A composition comprising:An epoxy component;A silane-modified epoxy component;A thermoplastic urethane; andDiaminodiphenyl sulfone.27. The composition of claim 26 , in the form of a pre-applied adhesive.29. The composition of claim 28 , wherein component (C) is made from components (A) and (B) in a by weight ratio of 1:100 to 100:1.30. The composition of claim 28 , wherein component (C) is made from components (A) and (B) in a by weight ratio of 1:10 to 10:1.31. (canceled) 1. FieldAdhesive compositions are provided and more specifically adhesive compositions useful in the die attach process. The adhesive compositions exhibit excellent adhesive film release and die attach properties while also exhibiting void-free coverage in die attach applications.2. Related TechnologyAdhesive compositions play a prominent role in many industrial applications. For example, in the electronics industry, packaging engineers faced with increased challenges of finding new and better ways of creating and attaching dies during the dicing and subsequent die placement processes often rely on adhesive compositions to secure a silicon wafer to a dicing substrate during the dicing process and also to secure the individual diced chips to a circuit board or other substrate during die placement. Numerous adhesive compositions have been proposed for use in such die attach processes, including those described in one or more of U.S. Pat. ...

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04-04-2013 дата публикации

Powdered resins with fillers

Номер: US20130085211A1
Принадлежит: Georgia Pacific Chemicals LLC

Particulate binder compositions and methods for making and using same are provided. The binder composition for producing composite lignocellulose products can include an aldehyde based resin and a filler, an extender, or a combination thereof. The binder composition can be in the form of particulates. The particulates can each comprises the filler, the extender, or the combination thereof and the aldehyde based resin.

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11-04-2013 дата публикации

Epoxy resin composition

Номер: US20130088542A1
Автор: Akane Hisanaga
Принадлежит: Canon Inc

An epoxy resin contains at least a bisphenol-F-type epoxy resin, a latent hardener, and a thixotropic agent. When the amount of the bisphenol-F-type epoxy resin is 100 parts by mass, the amount of the thixotropic agent is in the range of 3.0 parts by mass to 5.0 parts by mass.

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11-04-2013 дата публикации

RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET

Номер: US20130089743A1
Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler. 1. A resin composition comprising:a non-halogen epoxy resin (A);a biphenyl aralkyl phenolic resin (B);a maleimide compound (C); andan inorganic filler (D).2. The resin composition according to claim 1 , wherein the non-halogen epoxy resin (A) is selected from the group consisting of phenol phenyl aralkyl epoxy resins claim 1 , phenol biphenyl aralkyl epoxy resins claim 1 , and naphthol aralkyl epoxy resins.4. The resin composition according to claim 1 , wherein the non-halogen epoxy resin (A) is contained in an amount of 20 to 60 parts by weight based on 100 parts by weight in total of the resins.5. The resin composition according to claim 1 , wherein the biphenyl aralkyl phenol resin (B) is contained in an amount that meets a requirement of an OH/Ep ratio of 0.7 to 1.4 wherein OH represents the number of hydroxyl groups in the biphenyl aralkyl phenol resin; and Ep represents the number of epoxy groups in the non-halogen epoxy resin (A).6. The resin composition according to claim 1 , wherein the maleimide compound (C) is contained in an amount of 5 to 50 parts by weight based on 100 parts by weight in total of the resins.7. The resin composition according to claim 1 , wherein the inorganic filler (D) is contained in an amount of 50 to 150 parts by weight based on 100 parts by weight in total of the resins.8. The resin composition according to claim 1 , which further comprises (E) a naphthol aralkyl resin.9. The resin composition according to claim 8 , wherein the content of the naphthol aralkyl resin (E) is not more ...

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11-04-2013 дата публикации

STORAGE-STABLE HEAT-ACTIVATED TERTIARY AMINE CATALYSTS FOR EPOXY RESINS

Номер: US20130090431A1
Принадлежит:

Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability. 1. A heat-activatable catalyst composition comprising mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin that has a weight average molecular weight of at least about 3000.2. The heat-activatable catalyst composition of wherein the tertiary amine compound includes at least one aminophenol.3. The heat-activatable catalyst composition of wherein the aminophenol is 2-(dimethylaminomethyl)phenol claim 2 , 2 claim 2 ,6-bis(dimethylaminomethyl)phenol claim 2 , 2 claim 2 ,4-bis(dimethylaminomethyl)phenol or 2 claim 2 ,4 claim 2 ,6-tris(dimethylaminomethyl)phenol.4. The heat-activatable catalyst composition of wherein the novolac resin has a weight average molecular weight of from 5000 to 20 claim 1 ,000.5. The heat-activatable catalyst composition of wherein the novolac resin is a phenol novolac resin.6. The heat-activatable catalyst composition of wherein the weight ratio of the tertiary amine compound and the novolac resin is from 40:60 to 70:30.7. The heat-activatable catalyst composition of which is made in a process that includes the steps of:a) combining a tertiary amine catalyst having a melting temperature of no greater than 60° C. and a boiling temperature of at least 130° C. with a particulate novolac resin having a weight average molecular weight of at least 5000 and a volume average particle size of 175 microns or less, at proportions such that from 0.1 to 10 equivalents of phenol groups are provided by the novolac resin per equivalent of tertiary amine groups provided by the tertiary amine catalyst;b) heating the mixture formed in step a) to a temperature of ...

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25-04-2013 дата публикации

Film for tire inner liner and method for manufacturing the same

Номер: US20130101821A1
Принадлежит: KOLON INDUSTRIES INC

This disclosure relates to a film for a tire inner liner including: a base film including a copolymer or mixture of a polyamide-based resin and a polyether-based resin; and an adhesive layer including a resorcinol-formalin-latex (RFL)-based adhesive, and a method for manufacturing the same.

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25-04-2013 дата публикации

Dual cure adhesives

Номер: US20130102698A1
Принадлежит: Henkel Corp

This invention is a dual cure adhesive that can be designed to have a proper balance of properties by choosing formulation materials to meet certain inequalities. The dual cure adhesive comprises ethylenically unsaturated compounds capable of UV-initiated free radical polymerization and epoxy compounds and their corresponding curing agents capable of thermal cure. In a particular embodiment, the dual cure adhesive comprises (A) one or more monofunctional acrylate compounds containing an oxygen-containing cyclic unit, (B) one or more monofunctional acrylate compounds in which the ester group contains a hydrocarbon group consisting of at least six carbon atoms, and (C) one or more thermoplastic, solid, amorphous epoxy compounds having a softening point or melting point between 60° C. and 100° C.

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25-04-2013 дата публикации

Tribologically Modified Glass-Fiber Reinforced Polyoxymethylene

Номер: US20130102718A1
Принадлежит: TICONA GMBH

The present invention relates to a molding composition, a process for the manufacturing of said molding composition, molded parts obtainable therefrom as well as the use of the molding composition for the manufacturing of molded parts used in the automotive industry, for housings, latches, window winding systems, wiper systems, sun roof systems, seat adjustments, levers, gears, claws, pivot housing or wiper arms. 1. A molding composition comprisinga) at least one polyoxymethylene (A),b) at least one coupling agent (B),c) at least one reinforcing fiber (C),d) one or more tribological modifier (D) ande) optionally at least one formaldehyde scavenger (E).2. A molding composition according to claim 1 , wherein the tribological modifier comprises ultrahigh molecular weight polyethylene having an average molecular weight of higher than 1.0·10g/mol.3. A molding composition according to claim 1 , wherein the tribological modifier comprises an ultrahigh molecular weight polyethylene having a viscosity number of higher than 1000 ml/g (determined according to ISO 1628 claim 1 , part 3; concentration in decahydronaphthalin: 0.0002 g/ml).4. A molding composition according to claim 1 , wherein the tribological modifier comprises an ultrahigh molecular weight polyethylene (UHMW-PE) which has a mean particle diameter Dranging from 1 to 5000 μm.5. A molding composition according to claim 1 , wherein the tribological modifier comprises ultrahigh molecular weight polyethylene which is present in the molding composition in an amount up to 30 wt.-% claim 1 , wherein the amount is based on the total weight of the composition.6. A molding composition according to claim 1 , wherein polyoxymethylene (A) is present in an amount up to 95 wt. % claim 1 , preferably ranging from 40 to 90 wt.-%.7. A molding composition according to claim 1 , wherein the coupling agent (B) is a polyisocyanate.8. A molding composition according to claim 1 , wherein the coupling agent (B) is present in an amount ...

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23-05-2013 дата публикации

ADHESIVE FOR FIXING AND/OR EMBEDDING AN ELECTRONIC COMPONENT AND METHOD AND USE

Номер: US20130126091A1

In the case of an adhesive for fixing an electronic component on a circuit board and/or for embedding an electronic component into a circuit board, the electronic component to be fixed and/or embedded being fixed by means of an adhesive bond on a ply or layer of a circuit board, and fixing optionally being followed by jacketing by plies, and/or by covering by at least one further ply, an epoxy resin-based adhesive is selected, which has at least one added additive to adjust the surface tension and/or viscosity, especially a defoamer and/or an additive for adjusting the levelling properties, which can achieve reliable fixing of a component, especially with avoidance of cavities or air inclusions below the surface of the component to be fixed. Also provided are a method and a use. 1. An adhesive for fixing an electronic component to a circuit board and/or embedding an electronic component into a circuit board , the electronic component to be fixed and/or embedded being fixed by means of an adhesive bond to a ply or layer of a circuit board , in particular a multilayer circuit board , and after fixing being optionally encapsulated , in particular by layers matched to the outer contours of the component to be embedded , and/or covered by at least one further layer , wherein an epoxy resin-based adhesive is selected , which comprises at least one additive added for adjusting the surface tension and/or viscosity , in particular a defoamer and/or an additive for adjusting the levelling properties.2. The adhesive according to claim 1 , wherein a defoamer claim 1 , for instance a silicone-free defoamer claim 1 , is added to the adhesive in an amount of less than 3% by weight and claim 1 , in particular claim 1 , about 0.1 to 2.0% by weight.3. The adhesive according to claim 1 , wherein an acrylate claim 1 , e.g. poly(butyl acrylate) claim 1 , an acrylate copolymer claim 1 , e.g. methacrylate copolymer claim 1 , an epoxy resin comprising free hydroxyl claim 1 , isocyanate and ...

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30-05-2013 дата публикации

Fluoropolymer Containing Laminates

Номер: US20130133830A1
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

The multilayer film serves as a laminate. In some embodiments, the film is a multilayered structure that, in its base form, encompasses an intermediate layer with first and second outer layer affixed to opposing sides of the intermediate layer. In some embodiments, the first outer layer is a semi-crystalline fluoropolymer. In some embodiments, the intermediate layer includes a polyester and the second outer layer is an olefinic polymer. 1. A method of making a multilayer film , comprising:providing a first substrate having a first major surface and a second major surface, the first substrate including at least one of polyester and polyamide;applying a fluoropolymer-containing composition onto the first major surface of the first substrate, the fluoropolymer-containing composition being one of an aqueous dispersion or a solution;providing a second substrate including a polyolefin; andpositioning the second substrate adjacent to the second major surface of the first substrate;wherein the multilayer film is a backing film for solar cells.2. The method of claim 1 , wherein the aqueous dispersion or a solution includes a solvent.3. The method of claim 1 , wherein the first substrate includes surface polar functional groups.4. The method of claim 3 , wherein the surface polar functional groups are selected from a group consisting of amino claim 3 , carboxyl claim 3 , and hydroxyl.5. The method of claim 1 , further comprising:applying a primer on at least one of the first and second major surfaces of the first substrate.6. The method of claim 1 , further comprising:applying an adhesive on at least one of the first and second major surfaces of the first substrate.7. The method of claim 1 , wherein the multilayer film includes a silane and the silane is in at least one of the following layers: the first substrate claim 1 , the second substrate claim 1 , the fluoropolymer-containing layer claim 1 , a layer between the fluoropolymer-containing layer and the first substrate ...

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06-06-2013 дата публикации

Filter Element and Process for Producing a Filter Element

Номер: US20130139947A1
Принадлежит: MANN+HUMMEL GMBH

The invention relates to a hotmelt adhesive including a hotmelt adhesive mixture, the mixture having a 15-85% by weight of a first polyester-based hotmelt adhesive and a 15-85% by weight of a second, polyamide-based hotmelt adhesive. 1. A hotmelt adhesive system comprising at least one hotmelt adhesive mixture , the hotmelt adhesive mixture comprisinga) 15-85% by weight of a first hotmelt adhesive that is polyester-based;b) 15-85% by weight of a second hotmelt adhesive that is polyamide-based;wherein weight proportions of the first and the second hotmelt adhesives together constitute 100% by weight of the hotmelt adhesive mixture;wherein the hotmelt adhesive mixture constitutes a proportion of more than 75% by weight of the hotmelt adhesive system, wherein the remainder is comprised of fillers such as chalk and/or pigments, such as titanium dioxide as a white pigment, and/or a tack-providing resin and/or at least one further hotmelt adhesive on polycondensate basis.2. Hotmelt adhesive system according to claim 1 , wherein the polyester-based hotmelt adhesive has a density between 1.15 and 1.35 g/cmand the polyamide-based hotmelt adhesive has a density between 0.95 and 1 g/cm.3. Hotmelt adhesive system according to claim 1 , wherein the polyester-based hotmelt adhesive has an elongation at break of >50%.4. Hotmelt adhesive system according to claim 1 , wherein the polyester-based hotmelt adhesive has a melting point between 150 degrees Celsius and 170 degrees Celsius and the polyamide-based hotmelt adhesive has a melting point between 180 degrees Celsius and 210 degrees Celsius.5. Hotmelt adhesive system according to claim 1 , wherein the polyester-based hotmelt adhesive is formed of a composition of basic materials claim 1 , the composition comprisinga) at least one acid selected from the group: phthalic acid, isophthalic acid, terephthalic acid, adipic acid, succinic acid, 6-hydroxy caproic acid or a mixture of at least two of these acids;b) and at least one diol ...

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13-06-2013 дата публикации

ONE PART EPOXY RESIN INCLUDING ACRYLIC BLOCK COPOLYMER

Номер: US20130146816A1
Принадлежит: TRILLION SCIENCE INC.

An adhesive composition comprising a phenoxy resin, a latent hardener, an acrylic block co-polymer dispersant and a weak solvent wherein the dispersant enables the phenoxy resin to be dispersed in a weak solvent that does not attack the latent hardener thereby providing a composition with good shelf life. The compositions are useful in making anisotropic conductive films. 1. An adhesive coating composition comprising: (i) a phenoxy resin , (ii) a latent hardener , (iii) a multifunctional epoxide , (iv) an acrylic block co-polymer , and (v) a weak solvent having a solubility parameter less than 9.5 , the acrylic block co-polymer dispersing the phenoxy resin in the weak solvent.2. The composition of wherein the phenoxy resin is a linear polymer of bisphenol A diglycidyl ether claim 1 , and the block copolymer has a first flexible block and a second rigid block that makes the copolymer compatible with the uncured phenoxy resin claim 1 , wherein a mixture of the phenoxy resin and the block copolymer forms a dispersion of the phenoxy resin in the weak solvent claim 1 , the solvent having a solubility parameter less than about 9.0.3. The composition of wherein the rigid block is polymethyl methacrylate.4. The composition of wherein the flexible block is formed from a poly(alkyl acrylate) wherein the alkyl group has about 2 to 8 carbon atoms.5. The composition of wherein the flexible block is formed from poly(butyl acrylate).6. The composition of wherein the block copolymer is a triblock copolymer terminating in polymethyl methacrylate blocks.7. The composition of wherein the latent hardener is a microencapsulated curing agent.8. The composition of wherein the latent hardener is an encapsulated imidazole.9. The composition of wherein the block copolymer is present in an amount up to about 15% by weight.10. The composition of wherein the weak solvent is selected from the group consisting of as EtOAc claim 9 , PrOAc claim 9 , i-PrOAc claim 9 , BuOAc claim 9 , sec-BuOAc claim ...

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13-06-2013 дата публикации

Double-Sided Multi-Layer Adhesive

Номер: US20130149502A1
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

Methods for preparing double-sided multi-layer adhesives, double-sided multi-layer adhesives and articles prepared with double-sided multi-layer adhesives are disclosed. The methods for preparing double-sided multi-layer adhesives include providing a first fluid, the first fluid including a polymeric adhesive composition solution or dispersion, providing a second fluid, the second fluid including a curable composition, coating the first fluid and the second fluid onto a substrate, and curing the curable composition to form a double-sided multi-layer adhesive. The coating of the first fluid and the second fluid onto a substrate may include simultaneous slot die coating of the two fluids or sequential coating of the two fluids. The curable composition layer is cured to form a multi-layer adhesive article. The formed multi-layer adhesive article may be a transfer tape. 1. A double-sided multi-layer adhesive comprising: the first layer comprising a first pressure sensitive adhesive composition; and', 'at least one X-B-X reactive oligomer, wherein X comprises an ethylenically unsaturated group, and B comprises a non-siloxane containing segmented urea-based unit, or a non-siloxane containing segmented urethane-based unit.', 'the second layer comprising a second pressure sensitive adhesive composition comprising a cured mixture comprising], 'at least two layers of pressure sensitive adhesive,'}2. The double-sided multi-layer adhesive of claim 1 , wherein B comprises a non-siloxane containing segmented urea-based unit that comprises at least one urea group and at least one oxyalkylene group.3. The double-sided multi-layer adhesive of claim 2 , wherein the X-B-X reactive oligomer is the reaction product of a non-siloxane segmented urea-based diamine and a Z-X material claim 2 , wherein X comprises an ethylenically unsaturated group claim 2 , and Z comprises an amine-reactive group.4. The double-sided multi-layer adhesive of claim 3 , wherein the non-siloxane segmented urea- ...

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13-06-2013 дата публикации

ADHESIVE MATERIAL

Номер: US20130149531A1
Принадлежит: Zephyros, Inc.

An adhesive material and articles incorporating the same is disclosed. The adhesive material includes a liquid epoxy resin and rubber, a solid epoxy resin and rubber, one or more curing agents, and a filler. 1. A heat activatable adhesive composition , comprising:a) at least one liquid epoxy including a rubber and present in an amount of at least about 10% by weight to about 40% by weight of the total adhesive composition;b) at least one solid epoxy including a rubber and present in an amount of at least about 30% by weight to about 60% by weight of the total adhesive compositiond) an epoxy cure activator that activates curing at a temperature as low as about 120° C.2. The adhesive composition of claim 1 , wherein the at least one epoxy liquid includes a butadiene rubber.3. The adhesive composition of claim 1 , wherein the at least one solid epoxy is a CTBN modified resin.4. The adhesive composition of including at least one curing agent accelerator and at least one filler.5. The adhesive composition of claim 4 , wherein the filer is clay and the filler is present in an amount of between about 3 percent and about 10 percent by weight.6. The adhesive composition of claim 1 , wherein the at least one epoxy liquid includes a core/shell polymer.7. The adhesive composition of claim 1 , wherein the at least one epoxy liquid includes a low viscosity epoxy resin.8. The adhesive composition of claim 1 , wherein the at least one epoxy liquid includes a bisphenol-F epoxy resin.9. A heat activatable adhesive composition claim 1 , comprising:a) a solid epoxy including a CTBN rubberb) a liquid epoxy including a core/shell polymer;c) an polyethylene copolymer;d) a plurality of curing agents; andf) a clay filler.10. The adhesive composition of claim 9 , wherein the plurality of curing agents includes a dicyandiamide curing agent and a blocked amine curing agent.11. The adhesive composition of claim 9 , wherein the clay filler is present in an amount of between about 3 percent and ...

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13-06-2013 дата публикации

FLAME-RETARDANT COPOLYETHERESTER COMPOSITION AND ARTICLES COMPRISING THE SAME

Номер: US20130149533A1
Автор: NI YONG
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

Disclosed herein is a flame-retardant copolyetherester composition comprising: (a) at least one copolyetherester; (b) about 5-35 wt % of at least one halogen-free flame retardant; (c) about 0.1-20 wt % of at least one nitrogen-containing compound; (d) about 0.1-10 wt % of at least one aromatic phosphate and (e) about 0.1-10 wt % of at least at least one phenoxy resin. Further disclosed herein are articles comprising component parts formed of the flame-retardant copolyetherester composition. 2. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one copolyetherester is present at a concentration of 25-94.7 wt % claim 1 , with the total wt % of all components of the copolyetherester composition totaling to 100 wt %.3. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one copolyetherester is present at a concentration of 40-94.7 wt % claim 1 , with the total wt % of all components of the copolyetherester composition totaling to 100 wt %.4. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one copolyetherester is present at a concentration of 40-90 wt % claim 1 , with the total wt % of all components of the copolyetherester composition totaling to 100 wt %.5. The flame-retardant copolyetherester composition of claim 1 , wherein claim 1 , in the at least one halogen-free flame retardant claim 1 , each of Rand R claim 1 , is hydrogen.6. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one halogen-free flame retardant is aluminum hypophosphite.7. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one halogen-free flame retardant is present at a concentration of 5-30 wt % claim 1 , with the total wt % of all components of the copolyetherester composition totaling to 100 wt %.8. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one halogen-free flame retardant is present at a ...

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20-06-2013 дата публикации

ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME

Номер: US20130154125A1
Принадлежит:

An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0. 1. An adhesive film , comprising:an amine curing agent; anda phenolic curing agent,wherein, the adhesive film has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.2. The adhesive film as claimed in claim 1 , wherein the amine curing agent is a diamino diphenyl sulfone curing agent.3. The adhesive film as claimed in claim 1 , wherein the phenolic curing agent is a bisphenol A or bisphenol F curing agent.4. The adhesive film as claimed in claim 1 , wherein the adhesive film has a post-molding die-shear strength of 9 kgf or more after curing at 125° C. for 1 hour claim 1 , at 150° C. for 10 minutes claim 1 , and at 175° C. for 1 hour.5. The adhesive film as claimed in claim 1 , wherein the adhesive film has a void area ratio of 5% or less on an adhesive film-attached area claim 1 , after curing at 125° C. for 1 hour and at 150° C. for 1 hour claim 1 , molding at 175° C. for 60 seconds claim 1 , and mold curing at 175° C. for 1 hour.6. An adhesive film claim 1 , comprising:an amine curing agent; anda phenolic curing agent,{'sup': 6', '2, 'the adhesive film having a die-shear strength of 9 kgf or more after curing at 125° C. for 1 hour and at 175° C. for 1 hour, and a storage modulus at 170° C. of 5.0×10dyne/cmor more after 80% curing.'}7. The adhesive film as claimed in claim 6 , wherein the adhesive film has a void area ratio of 5% or less on an adhesive film-attached area claim 6 , after curing at 125° C. for 1 hour and at 150° C. for 1 hour claim 6 , molding at 175° C. for 60 seconds claim 6 , and mold curing at 175° C. for 1 hour.8. The adhesive film as claimed in claim 6 , wherein the amine curing agent is diamino diphenyl sulfone.9. ...

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20-06-2013 дата публикации

ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE BONDED BY THE SAME

Номер: US20130154129A1
Принадлежит:

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst. 1. A semiconductor device bonded by an anisotropic conductive film , the anisotropic conductive film comprising:a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq;a hydrogenated epoxy resin; anda sulfonium cation curing catalyst.2. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film includes:about 1 to about 20 parts by weight of the reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq;about 5 to about 50 parts by weight of the hydrogenated epoxy resin; andabout 0.1 to about 10 parts by weight of the sulfonium cation curing catalyst, all parts by weight being based on 100 parts by weight of the anisotropic conductive film in terms of solid content.3. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film further includes a binder resin and conductive particles.4. The semiconductor device as claimed in claim 3 , wherein the binder resin includes at least one selected from the group of a polyimide resin claim 3 , a polyamide resin claim 3 , a phenoxy resin claim 3 , an epoxy resin claim 3 , a polymethacrylate resin claim 3 , a polyacrylate resin claim 3 , a polyurethane resin claim 3 , an acrylate modified urethane resin claim 3 , a polyester resin claim 3 , a polyester urethane resin claim 3 , a polyvinyl butyral resin claim 3 , a styrene-butylene-styrene resin and epoxy modifications thereof claim 3 , a styrene-ethylene-butylene-styrene resin and modifications thereof claim 3 , and acrylonitrile butadiene rubber and hydrogenated compounds thereof.5. The semiconductor device as claimed in claim 3 , wherein the anisotropic conductive ...

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20-06-2013 дата публикации

OXYGEN-BARRIER FILM AND ADHESIVE

Номер: US20130158186A1
Принадлежит: DIC CORPORATION

An oxygen-barrier film and an adhesive used therefor. Provided are an adhesive, which can be used for packaging foodstuffs and contains mainly a polyester having excellent oxygen-barrier properties, and an oxygen-barrier film that uses the adhesive. The oxygen-barrier film is prepared using an adhesive that includes: an amorphous polyester polyol, which is obtained by polycondensation of a polyvalent carboxylic acid component including at least one type of ortho-oriented aromatic dicarboxylic acid or anhydride thereof, and a polyhydric alcohol including at least one compound selected from the group consisting of ethylene glycol, propylene glycol, butylene glycol, neopentyl glycol and cyclohexanedimethanol, and a curing agent capable of reacting with the amorphous polyester polyol. 1. An oxygen-barrier film wherein an oxygen-barrier adhesive is used therein , and oxygen-barrier properties are provided by a layer obtained by adhesives , and the adhesive comprises:an amorphous polyester polyol, which is obtained by polycondensation of a polyvalent carboxylic acid component comprising at least one type of ortho-oriented aromatic dicarboxylic acid or anhydride thereof, and a polyhydric alcohol component comprising at least one compound selected from the group consisting of ethylene glycol, propylene glycol, butylene glycol, neopentyl glycol and cyclohexanedimethanol, anda curing agent capable of reacting with the amorphous polyester polyol.2. The oxygen-barrier film wherein an oxygen-barrier adhesive is used therein according to claim 1 , wherein the film is structured by bonding a plurality of identical or different resin films.3. A packaging material which is prepared using the oxygen-barrier film according to .4. The oxygen-barrier adhesive defined in claim 1 , wherein an amount of the ortho-oriented aromatic dicarboxylic acid or anhydride thereof relative to a total mass of the polyvalent carboxylic acid component is within a range from 70 to 100% by mass.5. The ...

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20-06-2013 дата публикации

LIQUID CURABLE EPOXY RESIN COMPOSITION AND ADHESIVE AGENT CONTAINING SAME

Номер: US20130158231A1
Принадлежит: NIPPON SODA CO., LTD.

An object of the present invention is to provide a curable epoxy resin composition containing an epoxy resin, wherein the composition is excellent in storage stability and curing characteristics and provides a cured product excellent in characteristics, particularly organic solvent resistance; an adhesive agent consisting of the composition; and an adhesive agent consisting of a curable epoxy resin composition excellent in adhesive strength. The curable epoxy resin composition of the present invention is a liquid curable epoxy resin composition containing the following (A) and (B): (A) an epoxy resin or an epoxy-polyester hybrid resin; and (B) a clathrate containing the following (b1) and (b2): (b1) at least one compound selected from the group consisting of a carboxylic acid compound represented by the formula A(COOH)(wherein A represents a C1-C6 chain hydrocarbon group optionally having a substituent, a C3-C10 monocyclic hydrocarbon group optionally having a substituent, or a C6-C10 bicyclic hydrocarbon group optionally having a substituent; and a represents 2 or 3) and the like; and (b2) at least one compound selected from the group consisting of a compound represented by formula (II) and 1,8-diazabicyclo[5.4.0]undecene-7. 4. The liquid curable epoxy resin composition according to claim 3 , wherein the compound represented by formula (V) is 5-t-butylisophthalic acid claim 3 , 5-hydroxyisophthalic acid claim 3 , or 5-nitroisophthalic acid.5. An adhesive agent containing a liquid curable epoxy resin composition according to .6. The adhesive agent according to claim 5 , wherein the number of moles of component (b2) in component (B) is 0.008 to 0.4 with respect to 1 mol of epoxy group of component (A).8. An adhesive agent containing a liquid curable epoxy resin composition according to .9. An adhesive agent containing a liquid curable epoxy resin composition according to .10. An adhesive agent containing a liquid curable epoxy resin composition according to .11. The ...

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27-06-2013 дата публикации

Adhesive resin composition for hdd motor and hdd motor fabricated using the same

Номер: US20130165551A1
Автор: Hyung Kyu Kim, Kun Kim
Принадлежит: Samsung Electro Mechanics Co Ltd

There are provided an adhesive resin composition for a HDD motor and a HDD motor fabricated using the same. The adhesive resin composition for a HDD motor includes: 25 to 35 parts by weight of a bisphenol E-epoxy resin; 10 to 25 parts by weight of an epoxy resin; 10 to 20 parts by weight of mercaptan; and 5 to 15 parts by weight of imidazole. The constituents of an epoxy adhesive material may be controlled, such that a curing speed may be increased, as compared to the case of the related art, thereby enhancing working efficiency and reliability.

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04-07-2013 дата публикации

Composition Capable of Radiation Activated Catalysis and Radiation Curable Urethane Containing the Composition

Номер: US20130171454A1

A composition capable of radiation activated catalysis is provided. The composition comprises a metal compound, a mercapto compound and an olefinic compound. Radiation curable urethane compositions comprising the disclosed composition are also provided. The radiation curable urethane compositions comprise the disclosed composition, a hydroxyl compound and an isocyanate compound. Activation of the composition by radiation in a urethane formulation provides for an efficient method of curing the urethane composition, Coating and adhesive compositions comprising the radiation curable urethane compositions are also provided. In addition, methods for coating and bonding substrates are disclosed. 113.-. (canceled)14. A method of coating an article comprising applying a coating composition to the surface of the article then irradiating the coated article with radiation to cure the coating composition wherein the coating composition comprises a radiation curable urethane composition comprising a) a composition capable of radiation activated catalysis comprising a metal compound having catalytic activity , a mercapto compound which passivates the metal compound by inhibiting the catalytic activity of the metal compound , and an olefinic compound which reacts with the mercapto compound wherein the reaction between the mercapto compound and the olefinic compound is caused by the radiation; b) a hydroxyl compound; and c) an isocyanate compound.15. The method of coating an article as claimed in claim 14 , wherein the article is selected from the group consisting of glass claim 14 , wood claim 14 , metal claim 14 , plastic claim 14 , ceramic claim 14 , stone claim 14 , iron claim 14 , steel claim 14 , aluminum claim 14 , copper claim 14 , galvanized steel claim 14 , zinc claim 14 , wood claim 14 , fiberboard claim 14 , reaction injection molding urethanes claim 14 , (sheet molding compound) claim 14 , vinyl claim 14 , acrylic claim 14 , polymeric material claim 14 , plastic ...

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04-07-2013 дата публикации

Biphenyl Polyphosphonate, Method for Preparing the Same and Thermoplastic Resin Composition Including the Same

Номер: US20130172471A1
Принадлежит: Cheil Industries Inc

Disclosed herein is a biphenyl polyphosphonate. The biphenyl polyphosphonate is represented by Formula 1: wherein R is hydrogen, substituted or unsubstituted C 1 -C 5 alkyl, substituted or unsubstituted C 2 -C 5 alkenyl, substituted or unsubstituted C 5 -C 6 cycloalkyl, substituted or unsubstituted C 5 -C 6 cycloalkenyl, substituted or unsubstituted C 6 -C 20 aryl, or substituted or unsubstituted C 6 -C 20 aryloxy, R 1 and R 2 are the same or different and are each independently substituted or unsubstituted C 1 -C 6 alkyl, substituted or unsubstituted C 5 -C 6 cycloalkyl, substituted or unsubstituted C 6 -C 12 aryl, or halogen, a and b are the same or different and are each independently an integer from about 0 to about 4, and n is an integer from about 4 to about 500.

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04-07-2013 дата публикации

CROSSLINKABLE COMPOSITION AND METHOD OF PRODUCING THE SAME

Номер: US20130172472A1
Принадлежит:

The instant invention provides a crosslinkable aqueous composition, method of producing the same, crosslinked compositions, and method of producing the same. The crosslinkable composition comprising: an aqueous dispersion comprising; (a) water; (b) a polycarbamate comprising at least an average of 2.0 carbamate functional groups; (c) a polyaldehyde comprising at least two aldehyde groups; (d) an acid catalyst; and (e) optionally one or more surfactants; wherein said aqueous dispersion has a pH in the range of less than 7; and wherein said composition is capable of being crosslinked at a temperature in range of less than 80° C. upon substantial removal of water. 1. A crosslinkable composition comprising: water;', 'a polycarbamate comprising at least an average of 2.0 carbamate functional groups;', 'a polyaldehyde comprising at least two aldehyde groups; and', 'an acid catalyst; and', 'optionally one or more surfactants;', 'wherein said aqueous dispersion has a pH in the range of less than 7., 'an aqueous dispersion comprising;'}2. The crosslinkable composition of claim 1 , wherein said composition is capable of being crosslinked at a temperature in the range of less than 80° C.3. The crosslinkable composition of claim 1 , wherein said composition is capable of being crosslinked at a temperature in the range of less than 40° C.4. The crosslinkable composition of claim 1 , wherein said aqueous dispersion has a pH in the range of less than 4.5. A crosslinkable composition of claim 1 , wherein the said aqueous dispersion remains a stable dispersion for at least 30 days claim 1 , while remaining suitable for its intended purpose6. A crosslinkable composition of claim 1 , wherein the said aqueous dispersion is heat stable at 60 C for a period of 10 days claim 1 , while remaining suitable for its intended purpose7. The crosslinkable composition of claim 1 , wherein said composition is capable of being crosslinked upon substantial removal of water.8. The crosslinkable ...

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04-07-2013 дата публикации

Process for making dendritic polyolefins from telechelic polycyclic olefins

Номер: US20130172493A1
Принадлежит: ExxonMobil Research and Engineering Co

A process for making dendritic hydrocarbon polymers by reacting an amount of one or more telechelic hydrocarbon polymers with an amount of one or more multifunctional coupling agents under conditions sufficient to produce the dendritic hydrocarbon polymer. The telechelic hydrocarbon polymer is made by ring opening metathesis polymerization (ROMP) in the presence of bi-functional alkene chain terminating agents (CTAs). The dendritic hydrocarbon polymer can be hydrogenated to produce a substantially saturated dendritic hydrocarbon polymer. The dendritic polyethylenes (dPE) can be used as processability additives to provide extensional hardening in low concentrations in various conventional polyethylenes (PEs) such as HDPE, LLDPE and mLLDPE.

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11-07-2013 дата публикации

Adhesive composition containing resin having carbon-carbon multiple bond

Номер: US20130177763A1
Принадлежит: Nissan Chemical Corp

An adhesive composition has a polymer that contains a unit structure of Formula (1): L 1 -O-T 1 -O  Formula (1) (where L 1 is an arylene group or a combination of an arylene group and a sulfonyl group or a carbonyl group, and T 1 is a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cyclic alkylene group) and contains, at a terminal or in a side chain or the main chain, at least one group containing a structure of Formula (2-A), a structure of Formula (2-B), or both structures:

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11-07-2013 дата публикации

Low-Tack, UV-Cured Pressure Sensitive Adhesive Suitable for Reclosable Packages

Номер: US20130178554A1
Принадлежит:

UV-cured pressure sensitive adhesive including one or more UV-curable acrylic oligomers, one or more tack control components, and, optionally, an elastomeric material is described herein. The adhesive includes an adhesive component ratio of the various adhesive components effective to provide desired first peel adhesions and subsequent peel adhesions. 2. The pressure sensitive adhesive of claim 1 , wherein the pressure sensitive adhesive includes about 1 to about 90 percent of the UV-curable acrylic oligomer claim 1 , about 1 to about 65 percent of the tack control component claim 1 , and about 5 to about 20 percent of the elastomeric material.3. The pressure sensitive adhesive of claim 1 , wherein the UV-curable acrylic oligomer is an acrylic acid ester.4. The pressure sensitive adhesive of claim 3 , wherein the acrylic acid ester is an acrylic acid ester of a vegetable oil.5. The pressure sensitive adhesive of claim 1 , wherein the elastomeric material includes one of curable elastomeric acrylate esters or methacrylate esters selected from the group consisting of polybutadiene claim 1 , saturated polybutadiene claim 1 , and polyurethane.6. The pressure sensitive adhesive of claim 1 , wherein the tack control component is an aliphatic urethane acrylate oligomer.7. The pressure sensitive adhesive of claim 1 , wherein the adhesive has a viscosity below about 50 claim 1 ,000 Os at about 70 to about 75° F.8. The pressure sensitive adhesive of claim 7 , wherein the viscosity is about 5000 cPs or less at about 160° F.9. The pressure sensitive adhesive of claim 1 , wherein the adhesive is cured with ultraviolet radiation supplied at an energy between about 100 and about 800 mJ/cmso that the UV-cured pressure sensitive adhesive withstands at least 100 double rubs with methyl ethyl ketone.10. The pressure sensitive adhesive of claim 1 , wherein the adhesive exhibits a rolling ball tack between about 4 to about 14 inches. This application is a continuation of prior ...

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11-07-2013 дата публикации

TWO-PART, CYANOACRYLATE /CATIONICALLY CURABLE ADHESIVE SYSTEMS

Номер: US20130178560A1
Принадлежит: Henkel Ireland Limited

Two part cyanoacrylate/cationically curable adhesive systems, are provided. 1. A two part curable composition comprising:(a) a first part comprising a cyanoacrylate component and a cationic catalyst; and(b) a second part comprising a cationic curable component, wherein when mixed together the cationic catalyst initiates cure of the cationic curable component.2. The composition of claim 1 , wherein the cyanoacrylate component comprises HC═C(CN)—COOR claim 1 , wherein R is selected from alkyl claim 1 , alkoxyalkyl claim 1 , cycloalkyl claim 1 , alkenyl claim 1 , aralkyl claim 1 , aryl claim 1 , allyl and haloalkyl groups.3. The composition of claim 1 , wherein the cationic catalyst comprises salts of lithium and metals from Group II of the Periodic Table claim 1 , and non-nucleophilic acids.4. The composition of claim 1 , wherein the cationic catalyst is a non-nucleophilic acid having a pH of less than 1.0 when measured as a 10% by weight solution in water.5. The composition of claim 1 , wherein the cationic catalyst is a member selected from the group consisting of fluoroboric claim 1 , fluoroarsenic claim 1 , fluoroantimonic and fluorophosphoric acids; lithium tetrafluoroborate claim 1 , calcium di-tetrafluoroborate claim 1 , magnesium di-tetrafluoroborate claim 1 , lithum hexafluorophosphate claim 1 , calcium di-hexafluorophosphate claim 1 , magnesium di-hexafluorophosphate claim 1 , lithium hexafluoroantimonate and lithium hexafluoroarsenate; lanthanide triflate salts claim 1 , aryl iodonium salts claim 1 , aryl sulfonium salts claim 1 , lanthanum triflate claim 1 , ytterbium triflate claim 1 , trimethoxyboroxine claim 1 , trimethoxyboroxine-aluminum acetyl acetonate claim 1 , amine-boron trihalide complexes claim 1 , quaternary ammonium salts claim 1 , quaternary phosphonium salts claim 1 , tri-aryl sulfonium salts claim 1 , di-aryl iodonium salts claim 1 , and diazonium salts; trialkoxyboroxine curing agents; and combinations thereof.6. The composition of claim ...

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18-07-2013 дата публикации

HEAT-CURING RESIN COMPOSITION, HEAT-CURING ADHESIVE SHEET, AND METHOD FOR PRODUCING HEAT-CURING ADHESIVE SHEET

Номер: US20130183520A1
Автор: Natori Toshiki
Принадлежит: DEXERIALS CORPORATION

The present invention provides a heat-curing resin composition which is curable without UV irradiation or the like and in which exudation of unreacted epoxy resin and the like at the time of pressure thermoforming is satisfactory. The heat-curing resin composition comprises: an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an epoxy resin; and a curing agent for the epoxy resin, wherein the curing agent contains organic acid dihydrazide, and part of epoxy groups of the acrylic copolymer are cross-linked by liquid polyamine or liquid polyamidoamine, each having at least one of a primary amino group and a secondary amino group. 1. A heat-curing resin composition , comprising: an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an epoxy resin; and a curing agent for said epoxy resin ,wherein part of epoxy groups of the acrylic copolymer are cross-linked by liquid polyamine or liquid polyamidoamine, each having at least one of a primary amino group and a secondary amino group.2. The heat-curing resin composition according to claim 1 , wherein not less than 1% of epoxy groups of the acrylic copolymer are cross-linked by the liquid polyamine or the liquid polyamidoamine claim 1 , each having at least one of a primary amino group and a secondary amino group.3. The heat-curing resin composition according to claim 2 , wherein 3 to 12% of epoxy groups of the acrylic copolymer are cross-linked by the liquid polyamine or the liquid polyamidoamine claim 2 , each having at least one of a primary amino group and a secondary amino group.4. The heat-curing resin composition according to claim 3 , wherein the curing agent contains organic acid dihydrazide.5. The heat-curing resin composition according to claim 4 , wherein a blend ratio of the epoxy group-containing (meth)acrylic ester monomer is 3 to 15% by mass with respect to the acrylic copolymer.6. The heat-curing resin composition according to claim 4 , ...

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25-07-2013 дата публикации

SHAPE MEMORY MATERIAL BASED ON A STRUCTURAL ADHESIVE

Номер: US20130186562A1
Принадлежит: SIKA TECHNOLOGY AG

A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

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25-07-2013 дата публикации

THERMOSETTING ADHESIVE COMPOSITIONS

Номер: US20130187095A1
Принадлежит: DESIGNER MOLECULES, INC.

The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions. 2. The adhesive composition of claim 1 , wherein each R4 is independently selected from the group consisting of methyl claim 1 , ethyl claim 1 , propyl claim 1 , isopropyl claim 1 , butyl claim 1 , isobutyl claim 1 , tert-butyl claim 1 , phenyl and cyclohexyl.3. The adhesive composition of claim 1 , wherein each Ris independently selected from the group consisting of methoxy claim 1 , ethoxy claim 1 , propyloxy and phenoxy.4. The adhesive composition of claim 1 , wherein each Ris independently selected from the group consisting of fluorine claim 1 , chlorine and bromide.5. The adhesive composition of claim 1 , wherein each Ris independently selected from the group consisting of —O(CO)—R claim 1 , wherein Ris C-Calkyl.6. The adhesive composition of claim 1 , wherein the composition has a Tof at least 30° C.7. The adhesive composition of claim 1 , wherein the composition has a Tof at least 100° C.8. The adhesive composition of claim 1 , wherein the composition has a Tof at least 150° C.9. The adhesive composition of claim 1 , wherein the composition has a Tof at least 200° C.10. The adhesive composition of claim 1 , wherein the thermosetting resin is selected from the group consisting of acrylates claim 1 , ...

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01-08-2013 дата публикации

B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES

Номер: US20130197130A1
Принадлежит: Henkel Corporation

An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler. 1. An adhesive composition comprising:(A) an elastomeric polymer comprising a mixture of a vinyl elastomer and an epoxy elastomer, the mixture present in an amount within the range of 20% to 40% by weight,(B) an epoxy resin, present in the adhesive composition in the range of 3% to 10% by weight,(C) reactive diluent comprising a combination of two or more diluents, one of which must have carbon to carbon unsaturation, the combination present in the adhesive composition within the range of 35% to 50% by weight of the composition, and(D) filler, sufficient to bring the total of the composition to 100% by weight.2. The adhesive composition according to in which the mixture of vinyl elastomer and epoxy elastomer are present in a weight ratio of 1:3 and have weight average molecular weights (MW) within the range of 3000 to 100 claim 1 ,000.3. The adhesive composition according to in which the vinyl and epoxy elastomers will have glass transition temperatures (Tg) within the range of −65° to 20° C.4. The adhesive composition according to in which the vinyl and epoxy elastomers are selected from the group consisting of butadiene-acrylonitrile rubbers claim 1 , butadiene rubbers claim 1 , nitrile butadiene rubbers claim 1 , polyurethane elastomers claim 1 , polyisobutene elastomers claim 1 , polyisoprene elastomers claim 1 , polyester amide elastomers claim 1 , ethylene-vinyl acetate copolymer elastomers claim 1 , polypropylene elastomers claim 1 , polyethylene elastomers ...

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15-08-2013 дата публикации

METHOD FOR PRODUCING A MULTILAYER STRUCTURE COMPRISING AN ADHESIVE COMPOSITION BASED ON AN AMYLACEOUS MATERIAL

Номер: US20130209801A1
Принадлежит: ROQUETTE FRERES

A method for producing an article including a multilayer structure containing:—a first layer based on a metal or on an organic polymer;—and a second layer of an adhesive composition including by weight: a) from 15 to 40% of at least one amylaceous material; b) from 10 to 30% by weight of at least one plasticizer for this amylaceous material; c) from 10 to 35% of at least one nongrafted polypropylene; d) from 10 to 35% of at least one polypropylene grafted with a grafting monomer selected from unsaturated carboxylic acid anhydrides, unsaturated carboxylic acids, oxiranes and silanes; these percentages being defined relative to the sum of a, b, c and d; the first and second layers adhering to one another and the method including a step of bringing the adhesive composition into contact in the molten or softened state. 126-. (canceled)27. A process for producing an article comprising a multilayer structure containing:a first layer based on an organic polymer selected from ethylene homopolymers and copolymers;and a second layer of an adhesive composition comprising by weight:a) from 15 to 40% of at least one amylaceous material;b) from 10 to 30% of at least one plasticizer for this amylaceous material;c) from 10 to 35% of at least one nongrafted polypropylene;d) from 10 to 35% of at least one polypropylene grafted with a grafting monomer selected from unsaturated carboxylic acid anhydrides, unsaturated carboxylic acids, oxiranes and silanes;these percentages being defined relative to the sum of a, b, c and d;said first and second layers adhering to one another and said process comprising a step of bringing the adhesive composition into contact in the molten or softened state.28. The process as claimed in claim 27 , wherein the multilayer structure comprises claim 27 , in addition claim 27 , a third layer based on a metal or on an organic polymer claim 27 , the second layer claim 27 , located between the first and third layers claim 27 , also adhering to said third layer. ...

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15-08-2013 дата публикации

Epoxy Composition with Crystallization Inhibition

Номер: US20130210961A1
Принадлежит:

An epoxy resin composition formed, at least in part, as the reaction product of a mixture comprising 95 and 99 wt % of an epoxy component comprising one or more diglycidyl ethers of Bisphenol A and between 1 and 5 wt % of an additive component comprising one or more aromatic amines, wherein each aromatic amine contains no more than two amine hydrogen atoms is provided. Also provided is a method of using the epoxy resin composition including incorporating the epoxy resin composition into a coating, an adhesive, a sealant, a casting, a laminate, or a composite. 1. An epoxy resin composition comprising the reaction product of a mixture comprising between 95 and 99 wt % of an epoxy component comprising one or more diglycidyl ethers of Bisphenol A and between 1 and 5 wt % of an additive component comprising one or more aromatic amines , wherein each aromatic amine contains no more than two amine hydrogen atoms.2. The epoxy resin composition of wherein the one or more aromatic amines are selected from aniline claim 1 , ortho-toluidine claim 1 , meta-toluidine claim 1 , para-toluidine claim 1 , 4-propylaniline claim 1 , 4-ethylaniline claim 1 , 3-chloroaniline claim 1 , 4-hydroxyaniline claim 1 , 3-cyanoaniline claim 1 , 2 claim 1 ,4-dimethylaniline claim 1 , 2 claim 1 ,6-dimethylaniline claim 1 , N claim 1 ,N′-dimethylbenzene-1 claim 1 ,4-diamine claim 1 ,1-naphthalenamine claim 1 , and combinations and mixtures thereof3. The epoxy resin composition according to wherein the one or more aromatic amines comprises aniline.4. The epoxy resin composition of wherein the mixture comprises between 98.7 and 97.5 wt % of one or more diglycidyl ethers of Bisphenol A and between 1.3 and 2.5 wt % aromatic amine.5. The epoxy resin composition of wherein the mixture comprises 97.5 wt % of one or more diglycidyl ethers of Bisphenol A and 2.5 wt % of aniline.6. The epoxy resin composition according to wherein the one or more diglycidyl ethers of Bisphenol A have an epoxide equivalent ...

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15-08-2013 дата публикации

METHODS FOR MAKING POLYMER PARTICULATES IN GEL FORM

Номер: US20130211005A1
Принадлежит: GEORGIA-PACIFIC CHEMICALS, LLC

Methods for making polymer particles in gel form via an emulsion and/or suspension process are provided. The method can include preparing a reactant mixture comprising a carrier fluid and a monomer component containing one or more phenolic compounds and optionally one or more crosslinking compounds, a mixture of Maillard reactants, or a combination thereof. The monomer component can polymerize to form the polymer particles in gel form. The reactant mixture can be located within a reactor having one or more inner surfaces in contact with the reactant mixture during polymerization of the monomer component. The one or more inner surfaces limit a release of metal, metal ions, or a combination thereof into the reactant mixture to produce the polymer particles in gel form containing less than 1 wt % metal atoms, metal ions, or a combination thereof, based on the total weight of the polymer particles in gel form. 1. A method for making polymer particles in gel form via an emulsion or suspension process , the method comprising: the monomer component polymerizes to form the polymer particles in gel form,', 'the reactant mixture is located within a reactor having one or more inner surfaces in contact with the reactant mixture during polymerization of the monomer component, and', 'the one or more inner surfaces limit a release of metal, metal ions, or a combination thereof into the reactant mixture to produce the polymer particles in gel form containing less than 1 wt % metal atoms, metal ions, or a combination thereof, based on the total weight of the polymer particles in gel form., 'preparing a reactant mixture comprising a carrier fluid and a monomer component containing one or more phenolic compounds and optionally one or more crosslinking compounds, a mixture of Maillard reactants, or a combination thereof, wherein2. The method of claim 1 , wherein the reactant mixture further comprises one or more catalysts; and wherein the one or more catalysts is substantially free of ...

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22-08-2013 дата публикации

Polyamine Polyamidoamine Epihaloohydrin Compositions and Processes for Preparing and Using the Same

Номер: US20130213593A1
Принадлежит: KEMIRA OYJ

Compositions of and processes for preparing a polyamine-polyamidoamine-epihalohydrin resin generally include reacting a first polyamine, a polyamidoamine, and an epihalohydrin to form the polyamine-polyamidoamine-epihalohydrin (PPAE) resin, wherein the polyamidoamine is prepared by reacting a polycarboxylic acid or a polycarboxylic acid derivative with a second polyamine to form the polyamidoamine, wherein a molar ratio of the polyamine to the polycarboxylic acid is 1.05 to 2.0. The PPAE resin can be used in an adhesive formulation for use in creping applications for forming paper products such as tissue products. 113-. (canceled)14. A process for forming a creped paper product comprising:applying an adhesive formulation comprising a polyamine-polyamidoamineepihalohydrin resin to a drying surface, wherein the polyamine-polyamidoamine-epihalohydrin resin has a rewettability ratio of 5 to 100, and an insolubility percentage of 5 to 100%, and wherein the polyamidoamine is prepared by a process comprising reacting a polycarboxylic acid and/or a polycarboxylic acid derivative with a second polyamine to form the polyamidoamine, wherein a molar ratio of the second polyamine to the polycarboxylic acid and/or polycarboxylic acid derivative is 1.05 to 2.0;pressing a paper web against the drying surface to effect adhesion of the paper web to the surface; anddislodging the paper web from the drying surface by contact with a doctor blade to form the creped paper product.15. The process of claim 14 , wherein the creped paper product is an article selected from the group consisting of facial tissue claim 14 , bath tissue claim 14 , wipes claim 14 , paper towels claim 14 , paper napkins claim 14 , filter papers claim 14 , and coffee filters.16. The process of claim 14 , wherein the epihalohydrin is epichlorohydrin.1730-. (canceled) The present disclosure generally relates to polymers that are useful in papermaking processes. More particularly, the present disclosure relates to ...

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22-08-2013 дата публикации

CURABLE AND CURED COMPOSITIONS

Номер: US20130217804A1
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The reactive liquid modifier is an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings. 1. A curable composition having a first part and a second part , the curable composition comprising:a) an epoxy resin, wherein the epoxy resin is in the first part of the curable composition;{'sup': 1', '1, 'b) a curing agent having at least two groups of formula —NRH where Ris selected from hydrogen, alkyl, aryl, or alkylaryl, wherein the curing agent is in the second part of the curable composition;'}c) a toughening agent, wherein the toughening agent is in the first part, in the second part, or in both the first part and the second part of the curable composition and wherein the toughening agent is a core-shell polymer, a butadiene-nitrile rubber, acrylic polymer or copolymer, an adduct of an amino-terminated material and an epoxy resin, or an adduct of a carboxy-terminated material and an epoxy resin; andd) a reactive liquid modifier that is in the first part of the curable composition, the reactive liquid modifier comprising an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof, wherein the polyol comprises a triglyceride having at least two hydroxyl groups and wherein the acetoacetate ester has at least two acetoacetoxy groups.2. (canceled)4. The curable composition of claim 1 , wherein the curable composition comprises 20 to 90 weight percent epoxy resin claim 1 , 3 to 30 weight percent curing agent claim 1 , 3 to 20 weight percent reactive liquid modifier claim 1 , and 5 to 55 weight percent ...

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29-08-2013 дата публикации

Water-Stable, Oil-Modified, Nonreactive Alkyd Resin Construction Adhesives, and Use Thereof

Номер: US20130220544A1
Принадлежит: The Procter & Gamble Company

Disclosed herein is a new use for water-stable, oil-modified, nonreactive alkyd resins. It has now been found that such resins can be used as the predominant component of a construction adhesive employed in the manufacture of disposable absorbent articles, for example. As such, the construction adhesive need not employ plasticizers, tackifiers, and conventional polymers required by hot-melt adhesives typically used as construction adhesives. Furthermore, in the manufacture of disposable absorbent articles, the construction adhesive containing a water-stable, oil-modified, nonreactive, alkyd resin does not need to be processed or applied at the high temperatures required of construction adhesives containing reactive alkyds. 1. A method of forming an adhesive bond between components of an article , the method comprising:(a) dispensing onto a first article component an adhesive composition comprising a water-stable, oil-modified, nonreactive alkyd resin at a temperature of about 80° C. to about 200° C.; and,(b) joining the first article component with a second article component to form an adhesive bond as the adhesive cools to room temperature.2. The method of claim 1 , wherein the adhesive bond experiences less than 20% loss of bond strength after exposure to water for at least 16 hours claim 1 , as measured according to the Bond Strength test.3. The method of claim 1 , wherein the adhesive bond experiences an increase in bond strength after exposure to water for at least 16 hours claim 1 , as measured according to the Bond Strength test.4. The method of claim 1 , wherein the adhesive composition comprises:(a) at least about 65 wt. % of a water-stable, oil-modified, nonreactive alkyd resin; and,(b) about 0.01 wt. % to about 35 wt. % of one of (i) a polymer selected from the group consisting of polyhydroxyalkanoates, polyvinyl alcohol, polyethylene, polypropylene, polyethylene terephthalate, maleated polyethylene, maleated polypropylene, polylactic acid, modified ...

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29-08-2013 дата публикации

Curable compositions

Номер: US20130225725A1
Принадлежит: 3M Innovative Properties Co

Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured compositions can be used as structural adhesives. The reactive liquid modifier is an acetoacetate ester of a dimer alcohol. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.

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29-08-2013 дата публикации

PRIMER COMPOSITION

Номер: US20130225726A1
Принадлежит: SUMITOMO METAL MINING CO., LTD.

Disclosed herein is a primer composition for metal materials, capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various metal materials such as common steel, stainless steel, aluminum, aluminum alloy, copper, and zinc plating to impart high bond strength and high bond durability when the metal materials are bonded with an epoxy-based adhesive. The primer composition is intended to be applied onto the surface of a metal material to be bonded with an epoxy-based adhesive and includes an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin containing at least a phenol novolac-type epoxy resin, a curing agent composed of cyandiamide, a curing catalyst composed of imidazole, and an inorganic oxide filler composed of silica and titanium oxide. 1. A primer composition for metal materials to be applied onto a surface of a metal material to be bonded with an epoxy-based adhesive , comprising: an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin , excluding a bifunctional epoxy resin , containing at least a phenol novolac-type epoxy resin; a curing agent composed of cyandiamide; a curing catalyst composed of imidazole; and an inorganic oxide filler composed of silica and titanium oxide , wherein a solvent is not contained.2. The primer composition for metal materials according to claim 1 , whereinthe bifunctional epoxy resin is a bisphenol A-type epoxy resin alone or a mixture of a bisphenol A-type epoxy resin and a bisphenol F-type epoxy resin, andthe multifunctional epoxy resin is a phenol novolac-type epoxy resin alone or a mixture of a phenol novolac-type epoxy resin and a p-aminophenol-type epoxy resin.3. The primer composition for metal materials according to claim 2 , wherein the epoxy resin containing both the bifunctional epoxy ...

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29-08-2013 дата публикации

Water-Stable, Oil-Modified, Nonreactive Alkyd Resin Construction Adhesives, and Use Thereof

Номер: US20130225730A1
Принадлежит: The Procter & Gamble Company

Disclosed herein is a new use for water-stable, oil-modified, nonreactive alkyd resins. It has now been found that such resins can be used as the predominant component of a construction adhesive employed in the manufacture of disposable absorbent articles, for example. As such, the construction adhesive need not employ plasticizers, tackifiers, and conventional polymers required by hot-melt adhesives typically used as construction adhesives. Furthermore, in the manufacture of disposable absorbent articles, the construction adhesive containing a water-stable, oil-modified, nonreactive, alkyd resin does not need to be processed or applied at the high temperatures required of construction adhesives containing reactive alkyds. 1. A construction adhesive composition comprising:(a) at least about 65 wt. % of a water-stable, oil-modified, nonreactive alkyd resin; and,(b) about 0.01 wt. % to about 35 wt. % of one of (i) a polymer selected from the group consisting of polyhydroxyalkanoates, polyvinyl alcohol, polyethylene, polypropylene, polyethylene terephthalate, maleated polyethylene, maleated polypropylene, polylactic acid, modified polypropylene, nylon, caprolactone, and combinations thereof; and, (ii) a processing aid selected from the group consisting of talc, clay, pulp, flour, walnut shells, cellulose, cotton, jute, raffia, rice chaff, animal bristles, chitin, granular starch, diatomaceous earth, carbon fibers, kenaf, magnesium stearate, fatty acid amides, metal salts of fatty acids, wax acid esters and their soaps, montan wax acids, esters and their soaps, polyolefin waxes, non polar polyolefin waxes, natural and synthetic paraffin waxes, fluoro polymers, silicon, diatomaceous earth, and combinations thereof.2. The construction adhesive composition of claim 1 , wherein the alkyd resin is present in the composition in an amount of at least about 80 wt. %.3. The construction adhesive composition of claim 1 , wherein the alkyd resin is present in the composition in an ...

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05-09-2013 дата публикации

Two-component structural adhesive which is impact resistant at room temperature

Номер: US20130230726A1
Принадлежит: SIKA TECHNOLOGY AG

The disclosure relates to the field of two-component epoxy resin compositions and to the use thereof as a repair adhesive, in particular in vehicle manufacturing. The two-component epoxy resin compositions according to the disclosure contain a curing component K2, which comprises between 1 and 10 wt. % of an amino group-terminated polyamide B, together with an epoxy resin component K1. The compositions show that the impact resistance is highly increased while an acceptable sheer strength is simultaneously retained.

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05-09-2013 дата публикации

THERMALLY STABLE POLYESTER (ALKYD) POLYMERS

Номер: US20130231442A1
Автор: DeRuiter Robert S.
Принадлежит: Reichhold, Inc.

A polyester (alkyd) for use in hot melt adhesive composition is provided. Unreacted carboxyl groups in the alkyd resin are reacted with a monofunctional epoxide to form functional groups that are unreactive with alcohols. 1. A polyester (alkyd) for use in hot melt adhesives wherein unreacted carboxyl groups in the alkyd have been reacted with at least one monofunctional epoxide to form one or more functional groups that are unreactive with alcohols.2. The polyester (alkyd) of claim 1 , wherein the alkyd has an acid value of 3.0 or less.3. The polyester (alkyd) of claim 1 , wherein the hot melt adhesive has a viscosity increase of less than 25% after 72 hours at 130° C.4. The polyester (alkyd) of claim 1 , wherein the at least one monofunctional epoxide comprises glycidyl neodecanoate claim 1 ,5. A process for heat stabilizing a hot melt adhesive that comprises a polyester (alkyd) claim 1 , wherein the process comprises reacting unreacted carboxyl groups in the alkyd with at least one monofunctional epoxide.6. The process of claim 5 , wherein after the unreacted carboxyl groups have reacted with the at least one monofunctional epoxide claim 5 , the acid value of the polyester (alkyd) is 3.0 or less.7. The process of claim 5 , wherein after the unreacted carboxyl groups have reacted with the at least one monofunctional epoxide claim 5 , the polyester (alkyd) is thermally stable such that the viscosity increase of the alkyd after 72 hours at 130° C. is less than 25%.8. The process of claim 5 , wherein the at least one monofunctional epoxide comprises glycidyl neodecanoate.9. A hot melt adhesive composition comprising 10 to 40 percent by weight of a polymer or copolymer to provide cohesive strength claim 5 , 50 to 80 percent by weight of a polyester (alkyd) wherein unreacted carboxyl groups in the alkyd have been reacted with at least one monofunctional epoxide to form one or more functional groups that are unreactive with alcohols.10. The hot melt adhesive composition ...

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05-09-2013 дата публикации

POLYESTER-BASED COMPOSITION AND ADHESIVE CONTAINING A HETEROBICYCLE

Номер: US20130231445A1
Принадлежит:

The present invention is directed to a polyester-based composition and adhesive containing a heterobicycle. The composition comprises 1. A composition comprising a1) a heterobicycle containing from 4 to 8 carbon atoms and from 1 to 3 oxygen atoms, wherein the heterobicycle is substituted by 2 to 4 hydroxyl groups, and', 'a2) a dimer of a fatty acid,, 'a) a polycondensate of'}andb) a cross-linking agent having at least 2 functional groups per molecule;wherein the polycondensate and the cross-linking agent are capable of reacting with each other.2. An adhesive obtainable by reacting a1) a heterobicycle containing from 4 to 8 carbon atoms and from 1 to 3 oxygen atoms, wherein the heterobicycle is substituted by 2 to 4 hydroxyl groups,', 'a2) a dimer of a fatty acid,, 'a) a polycondensate of'}andb) a cross-linking agent having at least 2 functional groups per molecule.3. The composition or adhesive of claim 1 , whereina1) further contains a diol monomer, a dimer of a fatty alcohol, glycerol, a diamine monomer, and/or a dimer of a fatty amine.4. The composition or adhesive of claim 1 , whereina2) further contains a diacid monomer and/or a trimer of a fatty acid.5. The composition or adhesive of claim 1 , wherein the heterobicycle is a dianhydrohexitol claim 1 , preferably selected from the group consisting of isosorbide claim 1 , isomannide and isoidide.6. The composition or adhesive of claim 1 , wherein the fatty alcohol has from 14 to 22 carbon atoms.7. The composition or adhesive of claim 1 , wherein the dimer of a fatty alcohol is obtainable by hydrogenation of a dimer of oleic acid claim 1 , linoleic acid claim 1 , palmitoleic acid claim 1 , linolenic acid claim 1 , eleostearic acid claim 1 , ricinoleic acid claim 1 , vernolic acid claim 1 , licanic acid claim 1 , myristoleic acid claim 1 , margaroleic acid claim 1 , gadoleic acid claim 1 , eicosadienoic acid claim 1 , and/or erucic acid.8. The composition or adhesive of claim 1 , wherein the fatty acid has from 18 ...

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12-09-2013 дата публикации

ADHESIVE AGENT, ADHESION METHOD AND MANUFACTURING METHOD OF ADHERED MATERIAL

Номер: US20130233486A1
Принадлежит: AKEBONO BRAKE INDUSTRY CO., LTD.

The purpose of the present invention is to improve adhesion failure associated with “a bubble formation phenomenon” that may occur in an adhesive layer when the thickness of an adhesive agent is increased and “Cratering” which may be caused in the adhesive layer by contaminants or the like present on a material to be adhered. 1. A powdery adhesive agent used for adhesion between a metal plate and a porous material , the powdery adhesive agent comprising:thermosetting adhesive particles; anda surface control agent,wherein a contained amount of the surface control agent is 0.1 to 5.0 parts by mass relative to 100 parts by mass of the thermosetting adhesive particles.2. The powdery adhesive agent according to claim 1 , wherein the surface control agent is a leveling agent.3. The powdery adhesive agent according to claim 1 , wherein the surface control agent is a defoaming agent.4. A method of adhering a porous material to a metal plate claim 1 , the method comprising:{'claim-ref': [{'@idref': 'CLM-00001', 'claims 1'}, {'@idref': 'CLM-00003', '3'}], 'electrostatically applying the powdery adhesive agent according to one of to to a metal plate, and pre-curing the powdery adhesive agent; and'}pressurizing and heating a porous material on the pre-cured powdery adhesive agent.5. A method of manufacturing an adhered material of a metal plate and a porous material claim 1 , the method comprising:{'claim-ref': [{'@idref': 'CLM-00001', 'claims 1'}, {'@idref': 'CLM-00003', '3'}], 'electrostatically applying the powdery adhesive agent according to one of to to a metal plate, and pre-curing the powdery adhesive agent; and'}pressurizing and heating a porous material on the pre-cured powdery adhesive agent. The invention relates to an adhesive agent. More particularly, the invention relates to a powdery adhesive agent containing thermosetting adhesive particles, and an adhesion method and a manufacturing method of an adhered material using the powdery adhesive agent.Regarding a ...

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12-09-2013 дата публикации

AQUEOUS EMULSION COATING COMPOSITION COMPRISING AN AUTOXIDISABLE FATTY ACID MODIFIED POLYESTER

Номер: US20130236694A1
Принадлежит: DSM IP ASSETS B.V.

An aqueous coating composition comprising an autoxidisable fatty acid modified polyester resin having 40 wt % of fatty acid residues; a Tg in the range of from −70 to +20° C.; an acid value less than 40 mg KOH/g; a Mw in the range of from 5,000 to 125,000 g/mol; >5 wt % of ring structures; and said composition having a co-solvent content less than 20 wt % by weight of solids; a solids content >38 wt %; and when in the form of the film having a telegraphing value of less than 35 gloss units. 1. An aqueous coating composition comprising an autoxidisable fatty acid modified polyester resin , said resin having:i) ≧40 wt % of fatty acid residues;ii) a Tg in the range of from −70 to +20° C.;iii) an acid value less than 40 mg KOH/g;iv) a Mw in the range of from 5,000 to 125,000 g/mol;v) >5 wt % of ring structures; andsaid composition havinga) a co-solvent content less than 20 wt % by weight of solids;b) a solids content >38 wt %;said composition when in the form of the film having a telegraphing value of less than 35 gloss units;where the telegraphing value is the difference between an initial smooth gloss value minus an initial rough gloss value of the film, where{'sub': 'z', 'the initial smooth gloss value is the gloss when the film is cast on smooth PVC (R=1 μm [±0.25 μm]);'}{'sub': 'z', 'the initial rough gloss value is the gloss when the film is cast on rough PVC (R=25 μm [±5 μm]); and where'}each film has a dry film thickness of 68 μm [±6 μm]; andeach initial gloss value is measured at a 20° angle, one day (24 h) after the film has been cast.2. An aqueous coating composition according to wherein the autoxidisable fatty acid modified polyester resin comprises at least 5 wt % of ring structures.3. An aqueous coating composition according wherein the autoxidisable fatty acid modified polyester resin comprises <5 wt % of TMA (trimellitic acid and or trimellitic anhydride).4. An aqueous coating composition according to wherein the autoxidisable fatty acid modified ...

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19-09-2013 дата публикации

ADHESIVE COMPOSITIONS HAVING A REDUCED CURE TIME AND METHODS FOR MAKING AND USING SAME

Номер: US20130240114A1
Принадлежит: GEORGIA-PACIFIC CHEMICALS LLC

Adhesive compositions having a reduced cure time and methods for making and using same are provided. In at least one specific embodiment, the adhesive composition can include a mixture of one or more phenolic-aldehyde resins and one or more cure accelerants. The one or more cure accelerants can be selected from the group consisting of: ammonia, ammonium hydroxide, one or more primary amines, one or more secondary amines, one or more tertiary amines, one or more alkanolamines, one or more aromatic amines, one or more polyamines, one or more amides, one or more polyamides, one or more compounds containing at least one amine functional group and at least one sulfur functional group, and any mixture thereof. In one or more embodiments, the adhesive composition can also include one or more hardeners. 1. An adhesive composition , comprising a mixture of one or more phenolic-aldehyde resins and one or more cure accelerants selected from the group consisting of: ammonia , ammonium hydroxide , one or more primary amines , one or more secondary amines , one or more tertiary amines , one or more alkanolamines , one or more aromatic amines , one or more polyamines , one or more amides , one or more polyamides , one or more compounds containing at least one amine functional group and at least one sulfur functional group , and any mixture thereof , wherein the one or more phenolic-aldehyde resins comprises at least two phenolic compounds selected from the group consisting of: phenol , resorcinol , hydroquinone , catechol , tannins , phloroglucinol , lignins , a bis-phenol , and humic acid.2. The adhesive composition of claim 1 , further comprising one or more hardeners comprising one or more alkylene group donors.3. The adhesive composition of claim 1 , further comprising one or more hardeners selected from the group consisting of: formaldehyde claim 1 , paraformaldehyde claim 1 , hexamethylenetetramine claim 1 , 5-hydroxymethyl-1-aza-3 claim 1 ,7-dioxabicyclo(3 claim 1 ,3 claim ...

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19-09-2013 дата публикации

ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION OR THE ADHESIVE SHEET

Номер: US20130245160A1
Принадлежит: Toray Industries, Inc.

The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).) 2. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and at least one filler has an average particle diameter of 6 μm or more.3. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and contains at least a filler with an average particle diameter of 6 μm or more and 15 μm or less and a filler with an average particle diameter of 30 μm or more.4. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes a filler that the pH of the liquid prepared when 10 g of the thermally conductive filler is added to 100 g of water is not more than 6.0.5. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes alumina.8. The adhesive sheet according to claim 7 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and at least one filler has an average particle diameter of 6 μm or more.9. The adhesive sheet according to claim 7 , wherein the thermally conductive filler ( ...

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26-09-2013 дата публикации

SEALING COMPOSITION AND METHOD FOR MANUFACTURING DISPLAY PANEL USING THE SAME

Номер: US20130248110A1
Принадлежит: Samsung Display Co., Ltd.

A sealing composition and a method of manufacturing a display panel using the sealing composition are disclosed. The sealing composition includes about 10% by weight to about 80% by weight of a denatured epoxy resin having a methacrylate group, about 5% by weight to about 40% by weight of a photo-curing acrylate monomer, about 1% by weight to about 10% by weight of a heat-curing agent, about 1% by weight to about 10% by weight of a photo-polymerization initiator, about 5% by weight to about 50% by weight of a filler, about 1% by weight to about 10% by weight of a flexibility improving agent and about 0.001% by weight to about 8% by weight of an additive. 1. A sealing composition comprising , based on a total weight of the sealing composition:about 10% by weight to about 40% by weight of a denatured epoxy resin comprising a methacrylate group;about 10% by weight to about 40% by weight of a photo-curing acrylate monomer;about 1% by weight to about 10% by weight of a heat-curing agent;about 1% by weight to about 10% by weight of a photo-polymerization initiator;about 10% by weight to about 50% by weight of a filler;about 1% by weight to about 10% by weight of a flexibility improving agent; andabout 10% by weight to about 30% by weight of a solvent.2. The sealing composition of claim 1 , wherein the denatured epoxy resin comprises at least one resin selected from the group consisting of a bisphenol A-based epoxy resin claim 1 , a bisphenol F-based epoxy resin claim 1 , a novolac-based epoxy resin claim 1 , a brominated epoxy resin claim 1 , a cycloaliphatic-based epoxy resin claim 1 , a rubber modified-based epoxy resin claim 1 , an aliphatic polyglycidyl-based epoxy resin claim 1 , a glycidyl amine-based epoxy resin claim 1 , a biphenyl-based epoxy resin claim 1 , a naphthalene-based epoxy resin and a tris-phenol methane-based epoxy resin.3. The sealing composition of claim 1 , wherein the a photo-curing acrylate monomer comprises at least one acrylate selected from ...

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26-09-2013 дата публикации

ADHESIVE FILM

Номер: US20130251989A1
Принадлежит: LG CHEM, LTD.

The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability. 1. An adhesive composition for encapsulating an organic electronic element , comprising: a curable adhesive resin that is in a solid or semi-solid phase at room temperature; a moisture absorbent that is comprised in an amount of 1 to 100 parts by weight , relative to 100 parts by weight of the adhesive resin; and a filler that is comprised in an amount of 1 to 50 parts by weight , relative to 100 parts by weight of the adhesive resin.2. The adhesive composition for encapsulating an organic electronic element of claim 1 , wherein the curable adhesive resin has a viscosity of at least 10poise at room temperature.3. The adhesive composition for encapsulating an organic electronic element of claim 1 , wherein the curable adhesive resin has a water vapor transmission rate in a thickness direction of 50 g/m·day or less under a state where the curable adhesive resin is cured to be in the shape of a film having a thickness of 80 μm.4. The adhesive composition for encapsulating an organic electronic element of claim 1 , wherein the curable adhesive resin is an epoxy resin.5. The adhesive composition for encapsulating an organic electronic element of claim 1 , wherein the curable adhesive resin is a silane modified epoxy resin.6. The adhesive composition for encapsulating an organic electronic element of claim 5 , wherein the silane modified epoxy resin is an aromatic epoxy resin to which a silane compound of the following Chemical Formula 1 is introduced ...

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26-09-2013 дата публикации

Adhesive composition and uses thereof

Номер: US20130253093A1

Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlotrohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.

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26-09-2013 дата публикации

USE OF 2-ISOPROPYL-2-ALKYL-1,3-PROPANEDIOLS FOR PREPARING POLYMERS

Номер: US20130253132A1
Принадлежит: BASF SE

Polymer obtainable by polycondensation or polyadduct formation from monomeric compounds, wherein accompanying use is made as monomeric compound of 2-isopropyl-2-alkyl-1,3-propanediols of the formula I 2. The polymer according to claim 1 , wherein use is made as monomeric compound or its alkoxylated derivatives of the formula I of those for which R is methyl and/or 3-methylbutyl.3. The polymer according to claim 2 , wherein the compounds of the formula I are obtainable by reacting 3-methyl-2-alkylbutanal with formaldehyde in an aldol- Cannizarro reaction or by aldol reaction and subsequent hydrogenation.4. The polymer according to claim 1 , which is a polyester.5. The polymer according to claim 1 , which is a polycarbonatediol (obtainable by reacting dialkyl carbonates or cyclic carbonates with diols claim 1 , with elimination of alcohol).6. The polymer according to claim 1 , which is a polyurethane.7. The polymer according to claim 1 , which is a polyadduct which is obtainable by ring-opening addition polymerization of lactones or lactams.8. The use of the polymer according to for preparing a thermoplastic composition.9. A thermoplastic composition comprising a polymer and/or repeat units of a polymer according to .10. The use of the thermoplastic composition according to for producing a shaped article.11. The use of the polymer according to for producing a coating material claim 1 , sealant or adhesive.12. A coating material claim 1 , sealant or adhesive comprising repeat units of a polymer according to .13. The coating material claim 12 , sealant or adhesive according to claim 12 , which is an aqueous material.14. The use of the polymer according to for producing a powder coating material.15. A powder coating material comprising repeat units of a polymer according to .16. The use of the polymer according to for producing a radiation-curable coating material.17. A radiation-curable coating material comprising repeat units of a polymer according to . The invention ...

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26-09-2013 дата публикации

Manufacture of polylactide-based articles by rotational molding

Номер: US20130253166A1
Принадлежит: Futerro S.A.

The present invention relates to a method for manufacturing polylactide-based articles by rotational moulding and also to the articles obtained by the method. 1. A process for the manufacture of a polylactide-based article by rotational molding , comprising the following stages:a) placing at least polylactide in a mold,b) subjecting the polylactide to a rotational molding which comprises heating to a temperature of between 150° C. and 230° C.,c) cooling the mold and/or the article obtained,d) removing the article from the mold.2. The process as claimed in claim 1 , characterized in that the cooling of the mold and/or of the article obtained in stage (c) is carried out in just one stage down to a temperature of between ambient temperature and a temperature of less than 100° C.3. The process as claimed in claim 1 , characterized in that the cooling of the mold and/or of the article obtained in stage (c) comprises the following stages:i) cooling down to a temperature of between 100° C. and 150° C.,ii) maintaining at this temperature for 1 to 60 minutes,iii) cooling down to a temperature of between ambient temperature and a temperature of less than 100° C.4. The process as claimed in claim 3 , characterized in that the cooling in stage (i) takes place down to a temperature of between 100° C. and 130° C.5. The process as claimed in or claim 3 , characterized in that stage (ii) takes place for 1 to 30 minutes.6. The process as claimed in to claim 3 , characterized in that the polylactide is in the form of particles having a size of between 20 μm and 2000 μm claim 3 , preferably between 50 μm and 1000 μm and more preferably between 100 μm and 800 μm.7. The process as claimed in claim 6 , characterized in that the polylactide is in the form of microgranules or in the form of powder or of a mixture of microgranules and powder.8. The process as claimed in to claim 6 , characterized in that the polylactide is PLLA claim 6 , PDLA and/or a mixture of PLLA and PDLA.9. The process ...

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03-10-2013 дата публикации

CURABLE ADHESIVE COMPOSITION

Номер: US20130255879A1
Принадлежит:

The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group. 117-. (canceled)18. A method for bonding at least two substrates together , the method comprising: i) the first part comprises at least one epoxy resin; and', 'ii) the second part comprises at least one curing agent in the form of an epoxy-amine adduct or an epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine, and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group;, 'a) providing a mixed adhesive composition by mixing a first part and a second part of a curable adhesive composition in an appropriate ratio, wherein'}b) covering one or both substrates at least partially with the mixed adhesive composition, wherein one or both substrates are covered with an oil layer, which is not removed before applying the mixed adhesive composition;c) bringing the substrates into contact in a section covered with the mixed adhesive composition; andd) curing the mixed adhesive composition.19. The method of claim 18 , wherein the polyol compound comprises a polyester polyol claim 18 , a polyether polyol claim 18 , polyurethane polyol claim 18 , polyurea polyol claim 18 , polycarbonate polyol claim 18 , polyol from a renewable source claim 18 , or a mixture thereof.20. The method of claim 18 , wherein the primary and secondary amine comprises a polyetheramine claim 18 , polyamidoamine claim 18 , polyamide claim 18 , Mannich base claim 18 , or a mixture thereof.21. The method of claim 18 , wherein the epoxy-amine adduct and/or the epoxy-thiol adduct has a Mw of ...

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03-10-2013 дата публикации

RESIN COMPOSITION, COMPOSITE CURED PRODUCT USING SAME, AND METHOD FOR PRODUCING THE COMPOSITE CURED PRODUCT

Номер: US20130261229A1
Принадлежит: Toray Industries, Inc.

A resin composition including 10 to 90% by mass of (A) a component to be polymerized containing a compound represented by Formula (1), and 90 to 10% by mass of (B) a thermosetting resin, the (A) and (B) each being capable of undergoing a reaction to increase molecular weight by itself when heated: 2. The resin composition according to claim 1 , wherein said compound represented by Formula (1) is one selected from the group consisting of a cyclic polyphenylene sulfide claim 1 , a cyclic polyphenylene ether ether ketone claim 1 , a cyclic polyphenylene ether ketone and a cyclic polyphenylene ether sulfone.3. The resin composition according to claim 1 , wherein said (B) is one selected from the group consisting of an epoxy resin claim 1 , a bismaleimide resin and a polyimide resin.4. The resin composition according to claim 1 , further comprising a zero-valent transition metal compound.5. The resin composition according to claim 4 , wherein said zero-valent transition metal compound comprises a metal belonging to Groups 8 to 11 and Periods 4 to 6 of the periodic table.6. The resin composition according to claim 1 , further comprising an alkali metal salt.7. The resin composition according to claim 1 , further comprising (C) a reinforcement fiber.8. The resin composition according to claim 7 , wherein said (C) reinforcement fiber is a carbon fiber.9. A method of producing a composite cured product comprising allowing the resin composition according to to react by heating to obtain a composite cured product.10. A method of producing a composite cured product comprising impregnating the resin composition according to into a reinforcement fiber and then allowing said resin composition to react by heating to obtain a composite cured product.12. The composite cured product according to claim 11 , further comprising (C) a reinforcement fiber.13. The resin composition according to claim 2 , wherein said (B) is one selected from the group consisting of an epoxy resin claim 2 , ...

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10-10-2013 дата публикации

STRUCTURAL EPOXY RESIN ADHESIVES CONTAINING CHAIN-EXTENDED ELASTOMERIC TOUGHENERS CAPPED WITH PHENOL, POLYPHENOL OR AMINOPHENOL COMPOUNDS

Номер: US20130263995A1
Принадлежит:

Structural adhesives are prepared from a chain extended elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with a phenol, a polyphenol or an aminophenol compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths. 1. A one-part structural adhesive comprising:A) at least one epoxy resin;B) a reactive elastomeric toughener containing capped isocyanate groups; andC) one or more epoxy curing agents; a) reacting an excess of a polyisocyanate with a 300-3000 equivalent weight polyol or with a mixture of a 300-3000 equivalent weight polyol and a branching agent, to form an isocyanate-terminated prepolymer;', 'b) reacting the isocyanate-terminated prepolymer with a chain extender to produce a chain extended, isocyanate-terminated prepolymer, and', 'c) capping at least 90% of the terminal isocyanate groups of the chain extended, isocyanate-terminated prepolymer with a capping agent selected from a monophenol, a polyphenol or an aminophenol., 'wherein the elastomeric toughener is formed by'}2. The structural adhesive of claim 1 , wherein the 300-3000 equivalent weight polyol is a polyether claim 1 , a hydroxyl-terminated polybutadiene or a mixture of a polyether and a hydroxyl-terminated polybutadiene.3. The structural adhesive of claim 1 , wherein the chain extender contains two phenolic hydroxyl groups.4. The structural adhesive of wherein the capping agent is a monophenol.5. The structural adhesive of wherein the capping agent is a polyphenol.6. The structural adhesive of wherein the capping agent is an aminophenol.7. The structural adhesive of claim 1 , wherein the epoxy resin includes at least one diglycidyl ether of a polyhydric phenol.8. The structural adhesive of claim 1 , which contains at least one epoxide-terminated liquid rubber.9. The structural adhesive of claim 1 , further comprising a latent catalyst which becomes ...

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10-10-2013 дата публикации

HIGH SHEAR APPLICATION IN PROCESSING OILS

Номер: US20130266703A1
Принадлежит: H R D Corporation

Herein disclosed is a method of processing oil, comprising providing a high shear device comprising at least one rotor and at least one complementarily-shaped stator configured to mix a gas with a liquid; contacting a gas with an oil in the high shear device, wherein the gas is an inert gas or a reactive gas; and forming a product, wherein the product is a solution, a dispersion, or combination thereof. Herein also disclosed is a high shear system for processing oil, comprising; at least one high shear device, having an inlet and at least one rotor and at least one complementarily-shaped stator configured to mix a gas with a liquid; a gas source fluidly connected to the inlet; an oil source fluidly connected to the inlet; and a pump positioned upstream of a high shear device, the pump in fluid connection with the inlet and the oil source. 1. A method of producing an oil comprising providing a high shear device comprising at least one rotor and at least one complementarily-shaped stator configured to mix a gas with a liquid;contacting a gas with an oil in said high shear device, wherein said gas is an inert gas or a reactive gas; andforming a product, wherein said product is a solution, a dispersion, or combination thereof2. The method of wherein the solution is saturated or supersaturated with the gas.3. The method of wherein the solution is no less than 5% supersaturated with the gas.4. The method of wherein the dispersion comprises gas bubbles with a mean diameter of less than 50 μm.5. The method of wherein said gas comprises nitrogen claim 1 , a noble gas claim 1 , carbon dioxide claim 1 , hydrogen claim 1 , or hydrogen sulfide.6. The method of wherein said oil comprises vegetable oil.7. The method of wherein said oil comprises edible oil or inedible oil.8. The method of wherein said oil comprises soybean oil.9. The method of wherein said oil comprises ostrich oil.10. The method of wherein said oil is selected from the group consisting of soybean oil claim 1 , ...

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10-10-2013 дата публикации

METHODS FOR MAKING LAMINATED, SATURATED, AND ABRASIVE PRODUCTS

Номер: US20130266731A1
Принадлежит: GEORGIA-PACIFIC CHEMICALS LLC

Methods for making and using phenol/formaldehyde/furfural-based resins and furfural alcohol-based resins and are provided. The method for making a phenol/formaldehyde/furfural-based resin can include combining a phenol/formaldehyde-based resin with furfural to produce a phenol/formaldehyde/furfural-based resin. The phenol/formaldehyde/furfural-based resin can have a viscosity of about 1 cP to about 1,000 cP at a temperature of about 25° C. 1. A method for making a phenol/formaldehyde/furfural-based resin , comprising:combining a phenol/formaldehyde-based resin with furfural to produce a phenol/formaldehyde/furfural-based resin, wherein the phenol/formaldehyde/furfural-based resin has a viscosity of about 1 cP to about 1,000 cP at a temperature of about 25° C.2. The method of claim 1 , wherein the phenol/formaldehyde/furfural-based resin contains less than 1 wt % free methanol.3. The method of claim 1 , wherein the phenol/formaldehyde/furfural-based resin contains less than 1 wt % free phenol.4. The method of claim 1 , wherein the phenol/formaldehyde/furfural-based resin has a viscosity of less than 700 cP.5. The method of claim 1 , wherein the phenol/formaldehyde/furfural-based resin has a solids concentration greater than about 60 wt %.6. The method of claim 1 , wherein the phenol/formaldehyde-based resin has a weight average molecular weight ranging from about 100 to about 2 claim 1 ,000 prior to combining with the furfural claim 1 , and wherein the phenol/formaldehyde-based resin has a molar ratio of formaldehyde to phenol ranging from about 1:1 to about 5:1 when combined with the furfural.7. The method of claim 1 , wherein the phenol/formaldehyde/furfural-based resin has a concentration of about 5 wt % to about 20 wt % furfural claim 1 , based on the combined weight of the phenol/formaldehyde-based resin and the furfural.8. The method of claim 1 , wherein the phenol/formaldehyde-based resin has a weight average molecular weight ranging from about 100 to about 2 ...

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10-10-2013 дата публикации

ADHESIVE RESIN COMPOSITION CONTAINING AMINE ACCELERATOR AND DECORATIVE FILM INCLUDING THE SAME

Номер: US20130266804A1
Принадлежит: LG HAUSYS, LTD.

The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react with active hydrogen is used for increasing the reaction rate of an adhesive resin which is required for the preparation of a decorative film having a metallic effect, thereby ensuring coating stability and increasing the reaction rate. Thus, according to the present invention, an adhesive resin which has little deviation in quality (boil resistance) between and within rolls can be provided in a short time. 1. An adhesive resin composition for a decorative film , comprising: an adhesive resin; and an amine accelerator.2. The adhesive resin composition according to claim 1 , wherein the amine accelerator comprises a functional group reacting with active hydrogen.3. The adhesive resin composition according to claim 2 , wherein the active hydrogen comprises at least one selected from an OH group claim 2 , a COOH group claim 2 , and an NH group4. The adhesive resin composition according to claim 2 , wherein the functional group comprises at least one of a glycidyl group and an aziridine group.5. The adhesive resin composition according to claim 1 , wherein the amine accelerator comprises an aziridine compound.7. The adhesive resin composition according to claim 1 , wherein the amine accelerator comprises a glycidyl amine compound.9. A decorative film comprising:a base layer;a metal-treated layer formed on a lower surface of the base layer; andan adhesive resin layer formed on a lower surface of the metal-treated layer and comprising an adhesive resin and an amine accelerator.10. The decorative film according to claim 9 , wherein the amine accelerator comprises at least one selected from aziridine compounds and glycidyl amine compounds.11. The decorative film according to claim 9 , further comprising: a coating film layer formed on a lower ...

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10-10-2013 дата публикации

COMPOSITIONS FOR PRODUCTION OF ABHESIVE COATINGS

Номер: US20130266811A1
Принадлежит: HINTERWALDNER CONSULTING & PARTNER

The present invention relates to compositions which comprise an olefinic component and a compound reactive or curable with the olefinic component, and which are suitable for production of release layers 2. A composition as claimed in claim 1 , wherein A and B together contain at least 12 carbon atoms.3. A composition as claimed in claim 1 , wherein A and B independently of one another stand for an alkyl group having 6 to 24 carbon atoms.4. A composition as claimed in claim 1 , wherein A and B are different.5. A composition as claimed in claim 3 , wherein A is an unbranched alkyl group having 10 carbon atoms and B is an unbranched alkyl group having 8 carbon atoms.6. A composition as claimed in claim 1 , wherein component b) is selected from organosilicon compounds claim 1 , unsaturated polyester resins claim 1 , acrylate- or methacrylate-functionalized or allyl-functionalized polyalkylenediols claim 1 , and acrylic or methacrylic esters.7. A composition as claimed in claim 6 , wherein the organosilicon compound is radiation-curable.8. A composition as claimed in claim 7 , wherein the radiation-curable organosilicon compound is an organopolysiloxane containing epoxy groups claim 7 , an SiH-functional organosilicon compound or an organopolysiloxane containing acryloyloxy or methacryloyloxy groups.9. A composition as claimed in claim 8 , wherein the silicone containing epoxy groups are obtained by reacting a silane or siloxane having SiH groups with an olefinic epoxide claim 8 , in the presence of a tertiary amine and of a hydrosilylation catalyst.12. A composition as claimed in claim 1 , wherein the weight ratio of component (a) to component (b) is in the range from 1:5 to 2:1 claim 1 , more particularly in the range from 1:3 to 1:1.13. A composition as claimed in claim 1 , further comprising a photoinitiator claim 1 , a radical initiator or an initiator of cationic curing.14. (canceled)15. A method for producing an abhesive release layer claim 1 , wherein a ...

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17-10-2013 дата публикации

Joint Member and Method for Producing the Same, and Method for Producing Metal Composite Molded Product

Номер: US20130272780A1
Принадлежит:

A method for producing a joint member between a carbon fiber composite material containing a thermoplastic resin as a matrix and a metal, includes: forming a layer containing a triazine thiol derivative on a surface of the metal; providing a thermoplastic resin layer between the layer containing a triazine thiol derivative and the carbon fiber composite material; and melting the thermoplastic resin layer to join the metal to the carbon fiber composite material. 1. A method for producing a joint member between a carbon fiber composite material containing a thermoplastic resin as a matrix and a metal , the method comprising:forming a layer containing a triazine thiol derivative on a surface of the metal;providing a thermoplastic resin layer between the layer containing the triazine thiol derivative and the carbon fiber composite material; andmelting the thermoplastic resin layer to join the metal to the carbon fiber composite material.2. The method for producing a joint member according to claim 1 , wherein the metal is heated by means of electromagnetic induction to perform the melting of the thermoplastic resin layer.3. The method for producing a joint member according to claim 1 , wherein the thermoplastic resin layer has a thickness of from 5 μm to 5 mm.4. The method for producing a joint member according to claim 1 , wherein an element constituting the metal mainly comprises iron or aluminum.5. The method for producing a joint member according to claim 1 , wherein an amount of the thermoplastic resin present in the carbon fiber composite material is from 50 to 1 claim 1 ,000 parts by weight per 100 parts by weight of a carbon fiber.6. The method for producing a joint member according to claim 1 , wherein in the providing of the thermoplastic resin layer between the layer containing the triazine thiol derivative and the carbon fiber composite material claim 1 , the thermoplastic resin layer is provided on the layer containing the triazine thiol derivative formed ...

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17-10-2013 дата публикации

Biodegradable resin composition

Номер: US20130274373A1
Принадлежит: Toyo Seikan Group Holdings Ltd

The present invention is a biodegradable resin composition comprising a sparingly hydrolyzing biodegradable resin (A) and an ester decomposition promoter (B), the ester decomposition promoter (B) being a copolymerized polyester that contains a segment (X) of a sparingly hydrolyzing polyester and a segment (Y) of an easily hydrolyzing polyester at a weight ratio of 10/90<X/Y<75/25. The biodegradable resin composition of the present invention features excellent biodegradability as well as excellent transparency.

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24-10-2013 дата публикации

JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF

Номер: US20130277092A1
Принадлежит: NITTO DENKO CORPORATION

A joining sheet contains solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid. 1. A joining sheet comprising:solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid.2. The joining sheet according to claim 1 , whereinthe blocked carboxylic acid is a reacting product of vinyl ether and a carboxylic acid.3. The joining sheet according to claim 2 , whereinthe vinyl ether is alkyl vinyl ether and the carboxylic acid is a bifunctional carboxylic acid.4. The joining sheet according to claim 1 , whereinthe dissociation temperature of the blocked carboxylic acid is 150° C. or more.5. The joining sheet according to claim 1 , whereinthe volume ratio of the thermosetting resin to the thermoplastic resin is 25:75 to 75:25.6. The joining sheet according to claim 1 , whereinthe thermosetting resin is an epoxy resin.7. The joining sheet according to claim 1 , whereinthe thermoplastic resin is an acrylic resin.8. The joining sheet according to claim 1 , whereinthe solder particles are made of a tin-bismuth alloy.9. The joining sheet according to claim 1 , whereinthe joining sheet further contains a curing agent.10. A method for producing a joining sheet comprising:preparing a mixture by mixing solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid to heat the mixture at a temperature that is below the dissociation temperature of the blocked carboxylic acid and below the melting point of the solder particles, and not less than the softening temperature of the thermoplastic resin to be formed into a sheet shape.11. A method for producing an electronic component comprising the steps of:preparing a laminate in which a joining sheet is disposed between two pieces of wired circuit boards arranged so that corresponding terminals thereof are spaced in opposed relation to each other, whereinthe joining sheet comprisessolder particles, a thermosetting resin, a thermoplastic ...

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24-10-2013 дата публикации

Thermally conductive adhesive

Номер: US20130279118A1
Принадлежит: Dexerials Corp

A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.

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24-10-2013 дата публикации

HEAT-CURING SEALING COMPOUND COMPOSITIONS HAVING FAST SKIN FORMATION AND GOOD STORAGE STABILITY

Номер: US20130280526A1
Принадлежит: SIKA TECHNOLOGY AG

The invention relates to heat-curing sealing compound compositions comprising at least epoxy resin, a heat-activatable hardening agent or accelerators (B) for epoxy resins, isocyanate group-containing polyurethane polymer (PUP) and a special polyaldimine. Said single-component sealing compound compositions are characterized by a good skin formation time and extraordinarily good storage stability and low blistering. Due to these properties, said sealing compound compositions are optimally suitable for use as sealants in autobody work because they can be excellently coated with a KTL paint. 2. The heat-curing sealing compound composition according to claim 1 , wherein Rand R 'each, independently of one another, stands for methyl, ethyl, propyl, isopropyl, butyl, 2-ethylhexyl, cyclohexyl or benzyl,', 'either'} 'together—including the nitrogen atom—they form a ring, in particular a pyrrolidine, piperidine, morpholine or N-alkyl piperazine ring, wherein this ring is optionally substituted.', 'or'}3. The heat-curing sealing compound composition according to claim 1 , wherein the weight ratio of epoxy resin (A) to polyurethane polymer (PUP) containing isocyanate groups is between 0.1 and 0.5.4. The heat-curing sealing compound composition according to claim 1 , Wherein the polyaldimine (PA) is present in an amount in the sealing compound composition claim 1 , such that the ratio of the number of aldimino groups to the number of isocyanate groups has a value of 0.2 to 0.8.5. The heat-curing sealing compound composition according to claim 1 , wherein the heat-activatable curing agent or accelerator (B) for epoxy resins is solid at room temperature and has a melting point of more than 80° C.6. The heat-curing sealing compound composition according to claim 1 , wherein the heat-activatable curing agent or accelerator (B) for epoxy resins is selected from the group consisting of dicyanodiamide claim 1 , guanamines claim 1 , guanidines claim 1 , aminoguanidines and their ...

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24-10-2013 дата публикации

TWO-COMPONENT CURABLE COMPOSITION

Номер: US20130280530A1
Принадлежит:

In the context of a curable agent based on at least one silyl-terminated polymer, the adhesion spectrum for bonding plastics, and the speed at which adhesion builds up, are to be improved. This is achieved by making available a curable agent containing two components (1) and (2) that are not in mutual contact, where component (1) contains at least one polymer having at least one terminal group of formula (I) -A-CH—SiXYZ (I), in which A is a divalent bonding group, X, Y, Z are, mutually independently, are Cto Calkyl, Cto Calkoxy, or Cto Cacyloxy groups, where at least one of the substituents is a Cto Calkoxy or Cto Cacyloxy group, and n is 0 or 1; and component (2) contains at least water and at least one silanol condensation catalyst. A further subject of the present invention is the use of the agent according to the present invention as an adhesive and/or sealant. 1. A curable agent containing two components (1) and (2) that are not in mutual contact , wherein {'br': None, 'sub': n', '2, '-A-CH—SiXYZ\u2003\u2003(I),'}, 'component (1) contains at least one polymer having at least one terminal group of the general formula (I)'}in whichA is a divalent bonding group containing at least one heteroatom,{'sub': 1', '8', '1', '8', '1', '8', '1', '8', '1', '8, 'X, Y, Z are substituents on the Si atom and, mutually independently, are Cto Calkyl, Cto Calkoxy, or Cto Cacyloxy residues, where at least one of the substituents is a Cto Calkoxy or Cto Cacyloxy residue, and'} 'component (2) contains at least water and at least one silanol condensation catalyst.', 'n is 0 or 1; and'}2. The curable agent according to claim 1 , wherein the divalent bonding group A in formula (I) is a carbamate group or urea group.3. The curable agent according to claim 1 , wherein X claim 1 , Y claim 1 , Z in formula (I) are claim 1 , mutually independently in each case claim 1 , a methyl claim 1 , an ethyl claim 1 , a methoxy claim 1 , or an ethoxy residue.4. The curable agent according to claim 1 , ...

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24-10-2013 дата публикации

Two-part curable Oxygen-absorbable Resin Composition, and Oxygen-absorbable Adhesive Agent

Номер: US20130280537A1
Принадлежит: TOYO SEIKAN GROUP HOLDINGS, LTD.

The purpose of the present invention is to provide a two-part curable oxygen-absorbable resin composition which has all of oxygen absorbability, adhesion properties and a cohesive force. The present invention provides a two-part curable oxygen-absorbable resin composition comprising: a main component which comprises a polyester polyol containing tetrahydrophthalic acid or a derivative thereof or tetrahydrophthalic acid anhydride or a derivative thereof as a raw material; and an aliphatic and/or alicyclic isocyanate curing agent component. 1. A two-part curable oxygen-absorbable resin composition comprising:a main agent consisting of a polyester polyol comprising a tetrahydrophthalic acid, a derivative thereof, a tetrahydrophthalic anhydride, or a derivative thereof as a raw material; andan aliphatic and/or alicyclic isocyanate-based curing agent component.2. The two-part curable oxygen-absorbable resin composition according to claim 1 , whereinthe polyester polyol comprising the tetrahydrophthalic acid, the derivative thereof, the tetrahydrophthalic anhydride, or the derivative thereof as the raw material has a glass transition temperature of −20° C. to 10° C.3. The two-part curable oxygen-absorbable resin composition according to claim 1 , whereinthe tetrahydrophthalic acid, the derivative thereof, the tetrahydrophthalic anhydride, or the derivative thereof is a methyltetrahydrophthalic acid, a derivative thereof, a methyltetrahydrophthalic anhydride, or a derivative thereof.4. The two-part curable oxygen-absorbable resin composition according to claim 1 , whereinthe tetrahydrophthalic acid, the derivative thereof, the tetrahydrophthalic anhydride, or the derivative thereof comprises 50% by mole or more of an acid component having a structure selected from the group consisting of (i) and (ii): (a) a carbon-carbon double bond group; and', '(b) a hetero atom-containing functional group or a linking group derived from the functional group; and, '(i) a dicarboxylic ...

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24-10-2013 дата публикации

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME

Номер: US20130281559A1
Принадлежит:

An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C. 1. An adhesive composition for a semiconductor , the adhesive composition having two exothermic peaks between 65° C. and 350° C. and having an area ratio of voids (Vm) of less than 10% , measured after 1-cycle curing at 150° C. for 30 minutes and then molding at 175° C. for 60 seconds ,wherein a first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C. with the proviso that the second exothermic peak appears at a higher temperature than the first exothermic peak.2. The adhesive composition as claimed in claim 1 , wherein the adhesive composition includes:a thermoplastic resin;an epoxy resin;a curing agent; anda curing accelerator.3. The adhesive composition as claimed in claim 2 , wherein the curing agent includes two different kinds of curing agents each having a different reaction temperature range.4. The adhesive composition as claimed in claim 2 , wherein the curing agent includes a phenolic curing agent and an amine curing agent.7. The adhesive composition as claimed in claim 4 , wherein a ratio of the phenolic curing agent to the amine curing agent is 3:1 to 1:11.8. The adhesive composition as claimed in claim 2 , wherein the curing accelerator has a melting point of 100° C. to 160° C.9. The adhesive composition as claimed in claim 2 , wherein the adhesive composition includes 15 to 70 wt % of the thermoplastic resin claim 2 , 5 to 35 wt % of the epoxy resin claim 2 , 0.5 to 15 wt % of a phenolic curing agent claim 2 , 1 to 15 wt % of an amine curing agent claim 2 , 0.01 to 10 wt % of the curing accelerator ...

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24-10-2013 дата публикации

TRICYCLO COMPOUND-POLYMER CONJUGATE

Номер: US20130281638A1
Принадлежит: SUCAMPO AG

A tricycle compound-polymer conjugate including a conjugate comprising a tricyclo compound and an alkyl substituted polylactide compound is provided. A pharmaceutical composition comprising the conjugate is also provided. 1. A conjugate comprising a tricyclo compound and an alkyl substituted polylactide compound.5. The conjugate of claim 4 , wherein n is 1 to 75.6. The conjugate of claim 4 , wherein n is 1 to 50.7. The conjugate of claim 4 , wherein Rand Rare hydrogen; and Rand Rare lower alkyl.8. The conjugate of claim 4 , wherein Rand Rare —(CH)—CH claim 4 , wherein m is from 0 to 20.9. The conjugate of claim 8 , wherein m is from 0 to 12.10. The conjugate of claim 4 , wherein Zis —CH; Rand Rare hydrogen; Rand Rare —(CH)—CH claim 4 , wherein m is from 0 to 20; and X is hydrogen.11. The conjugate of claim 4 , wherein Zis —CH; Rand Rare hydrogen; Rand Rare —(CH)—CH claim 4 , wherein m is from 0 to 12; and X is —C(O)—CH═CH.12. The conjugate of claim 4 , wherein Zis —CH—O—Z; Rand Rare hydrogen; Rand Rare —(CH)—CH claim 4 , wherein m=0 or m=5; and X is hydrogen.13. The conjugate of claim 4 , wherein Zis —CH—O—Z; Rand Rare hydrogen; Rand Rare —(CH)—CH claim 4 , wherein m=0 or m=5; and X is —C(O)—CH═CH.15. The conjugate of claim 14 , wherein n is 1 to 75.16. The conjugate of claim 14 , wherein n is 1 to 50.17. The conjugate of claim 14 , wherein p is 1 to 250.18. The conjugate of claim 14 , wherein Rand Rare hydrogen; and Rand Rare lower alkyl.19. The conjugate of claim 14 , wherein Y is —O—(CH—CH—O)—CH.20. The conjugate of claim 14 , wherein Rand Rare —(CH)—CH claim 14 , wherein m is from 0 to 20.21. The conjugate of claim 20 , wherein m is from 0 to 12.22. The conjugate of claim 1 , wherein the conjugate is injectable.23. The conjugate of claim 1 , wherein the conjugate is formulated for parenteral administration.24. The conjugate of claim 1 , wherein the conjugate is formulated for eye local administration.25. A pharmaceutical composition comprising a conjugate ...

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31-10-2013 дата публикации

METHOD FOR THERMOPLASTIC WELDING AND WELDED COMPOSITE STRUCTURES

Номер: US20130287481A1
Автор: HARDY RICHARD
Принадлежит:

A composite structure fabricated by thermoplastic welding, and a method for producing such structures. First and second composite parts are provided, having first and second surfaces, respectively, that define an interface where the parts are to be joined. The parts include a thermoplastic matrix. An insert is provided, which includes a film portion, which may include the same thermoplastic matrix. The insert is provided with an electric resistance heating element. The first and second parts are urged together using low fusion pressure while the insert is heated using the electric resistance heating element. After a selected period of time, the electrical supply to the resistance heating element is turned off. A high fusion pressure is then applied to urge the parts together. The weldment joint is allowed to cool. After cooling, excess material may be removed, to form a composite structure. 1. A composite structure , made by a method comprising:(a) providing a first composite part having a first surface and a second composite part having a second surface, said first composite part and said second composite part having a common thermoplastic matrix component;(b) juxtaposing the first surface and the second surface to define a weldment area therebetween, at which the first composite part and the second composite part are to be joined;(c) providing an insert, the insert comprising (1) a film portion comprising said common thermoplastic matrix component, and (2) an electrical resistance heating element;(d) placing the insert between the first surface and the second surface;(e) applying a selected electric current for a selected time to said resistance heating element, to heat said insert to at least a glass transition temperature;(f) during at least a portion of said selected time, applying a low fusion pressure to the first composite part and the second composite part to urge said first surface toward said second surface, and wherein said thermoplastic matrix in said ...

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07-11-2013 дата публикации

RESIN SYSTEMS FOR MAKING COMPOSITE PRODUCTS

Номер: US20130295319A1
Принадлежит: GEORGIA-PACIFIC CHEMICALS LLC

Resin systems and methods for making and using same are provided. The resin system can include a first aqueous resin comprising at least two polymerized monomers and a second aqueous resin comprising at least two polymerized monomers. The first aqueous resin can be present in an amount of about 5 wt % to about 95 wt %, based on the total weight the resin system. The second aqueous resin can be present in an amount of about 5 wt % to about 95 wt %, based on the total weight the resin system. The at least two polymerized monomers of the first and second aqueous resins can be the same monomers. 1. A resin system , comprising: the first aqueous resin is present in an amount of about 5 wt % to about 95 wt %, based on the total weight the resin system,', 'the second aqueous resin is present in an amount of about 5 wt % to about 95 wt %, based on the total weight the resin system, and', 'the at least two polymerized monomers of the first and second aqueous resins are the same monomers., 'a first aqueous resin comprising at least two polymerized monomers and a second aqueous resin comprising at least two polymerized monomers, wherein2. The resin system of claim 1 , wherein the first aqueous resin is selected from the group consisting of: a phenol-formaldehyde resin having a molar ratio of formaldehyde to phenol of about 1.5 to about 2.2 claim 1 , a urea-formaldehyde resin having a molar ratio formaldehyde to urea of about 0.25 to about 1.5 claim 1 , a melamine-formaldehyde resin having a molar ratio of formaldehyde to melamine of about 0.25 to about 1.5 claim 1 , a resorcinol-formaldehyde resin having a molar ratio of formaldehyde to resorcinol of about 0.4 to about 2.0 claim 1 , a melamine-urea-formaldehyde resin with a molar ratio of F:(M+U) claim 1 , wherein F is the moles of formaldehyde claim 1 , M is the moles of melamine claim 1 , and U is the moles of urea claim 1 , and the first molar ratio is about 0.25 to about 1.5 claim 1 , a melamine-urea-formaldehyde resin ...

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