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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 1790. Отображено 198.
31-07-1979 дата публикации

HOT MELT PRESSURE-SENSITIVE ADHESIVE POLYMERS

Номер: CA0001059695A
Принадлежит: KENDALL & CO, KENDALL COMPANY (THE)

Hot melt pressure-sensitive adhesive polymers are made by copolymerizing certain alkyl acrylates with polar monomers, the homopolymers of which have a glass transition temperature(Tg) greater than -5.degree.C.

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24-07-2020 дата публикации

Thermosetting type material with heat-conducting property and conductive property and manufacturing method thereof

Номер: CN0111440564A
Автор:
Принадлежит:

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17-09-2019 дата публикации

Adhesive film

Номер: CN0107634148B
Автор:
Принадлежит:

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18-07-2023 дата публикации

High-temperature-shedding-resistant hot melt adhesive for waterproof coiled material and preparation method of high-temperature-shedding-resistant hot melt adhesive

Номер: CN116445112A
Автор: LU SEN, PAN BINYI, WU JIAQI
Принадлежит:

The invention discloses a high temperature shedding resistant hot melt adhesive for waterproof coiled materials and a preparation method thereof, the hot melt adhesive comprises SEBS rubber, SIS rubber, naphthenic oil, polyisobutene, tackifying resin and an auxiliary agent, and the hot melt adhesive has good cohesiveness, high peel strength and high temperature stability, and excellent high temperature shedding resistance. According to the preparation method of the high-temperature-shedding-resistant hot melt adhesive for the waterproof coiled material, the tackifying resin is added in batches to be mixed with other components, the ultraviolet aging resistance of the hot melt adhesive is improved, the terpene-phenolic resin and the coupling agent are added together to achieve a synergistic effect, and the peel strength after ultraviolet treatment can be obviously improved.

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16-11-2018 дата публикации

SELF-ADHESIVE COMPOSITION FOR BONDING LOW SURFACE ENERGY SUBSTRATES

Номер: FR0003058152B1
Принадлежит: BOSTIK SA

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03-05-2019 дата публикации

COMPOSITION AND STRUCTURE OF A MULTIPHASE CROSSLINKABLE ADHESIVE

Номер: FR0003072965A1
Принадлежит:

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20-08-2020 дата публикации

Film-wrapped type hot melt adhesive

Номер: KR1020200098652A
Автор:
Принадлежит:

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10-12-2020 дата публикации

RESIN COMPOSITION, SEALING SHEET, AND SEALING BODY

Номер: KR1020200138711A
Автор:
Принадлежит:

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20-10-2020 дата публикации

ADHESIVE MATERIAL/SEALANT TO INDUCTION HEATING

Номер: BR0PI2008287A2
Автор:
Принадлежит:

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01-08-2021 дата публикации

Multilayer body

Номер: TW202128919A
Принадлежит:

The present invention provides a multilayer body which exhibits excellent adhesion to a metal member with low polarity in the presence of hot water. A multilayer body which comprises a resin base material, a highly adhesive layer that is provided on at least one surface of the resin base material, and an adhesive resin layer that is provided on a surface of the highly adhesive layer, said surface being on the reverse side from the resin base material, wherein the adhesive resin layer contains a polyolefin that has at least one group that is selected from the group consisting of acidic groups and acid anhydride groups, while having an acid value of from 0.01 mgKOH/g to 6.5 mgKOH/g. This multilayer body is used for the purpose of bonding a metal member wherein the proportion of the dipole component in the surface free energy is from 0.01% to 5.0%.

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02-12-2021 дата публикации

ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE PRODUCTION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME

Номер: WO2021241359A1
Принадлежит:

The present invention provides: an adhesive sheet which sufficiently and stably adheres to the back surface of a lead frame and the back surface of a sealing resin, and is not separated therefrom before a separation step even if subjected to a thermal history associated with QFN assembly, and which is free from leakage of the sealing resin, while being able to be easily separated in the separation step without the occurrence of adhesive residue, namely without leaving some adhesive behind, or without the occurrence of breakage; and a method for producing a semiconductor device, said method using this adhesive sheet. An adhesive sheet for semiconductor device production according to the present invention comprises a base material and a thermosetting adhesive layer that is provided on one surface of the base material; and this adhesive sheet for semiconductor device production is bonded to a lead frame or a wiring board of a semiconductor device in a removable manner. The adhesive layer of ...

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19-12-2019 дата публикации

RESIN COMPOSITION, SEALING SHEET AND SEALED BODY

Номер: WO2019240259A1
Принадлежит:

The present invention includes: a resin composition comprising an (A) component, which is a modified polyolefin-based resin, a (B) component, which is a compound having an annular ether group, a (C) component, which is a tackifier having a softening point of at least 80°C, and a (D) component, which is a heat cationic polymerization initiator; a sealing sheeting having an adhesive layer which was formed using said resin composition; and a sealed body obtained by an object for sealing being sealed using the sealing sheet. The present invention provides: the aforementioned resin composition having excellent film forming properties and sheet workability in a room temperature environment; the aforementioned sealing sheet comprising an adhesive layer formed using said resin composition, and having a high storage modulus after curing and excellent sealing properties; and the aforementioned sealed body obtained by the object for sealing being sealed using the sealing sheet.

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08-10-2020 дата публикации

CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND METHOD FOR MANUFACTURING SAME

Номер: WO2020203304A1
Принадлежит:

... [Problem] TO provide a curable silicone composition which has hot-melt properties and excellent curing characteristics and handling workability in overmold molding or the like, and which yields a cured product in which hardness increase or embrittlement does not occur even when the cured product is left for a long time at a temperature of 150°C or above. [Solution] A curable silicone composition and an application for the same, the curable silicone composition having hot-melt properties in the composition as a whole, and containing: an organopolysiloxane resin or resin mixture containing at least 20 mol% of siloxane units which are represented by SiO4/2 and do not have hot-melt properties in the molecule thereof as a whole with respect to the total quantity of siloxane units, the organopolysiloxane resin having a mass loss ratio of 2.0 mass% or less when exposed for one hour at a temperature of 200°C or less; a liquid straight-chain or branched-chain organopolysiloxane; and a curing agent ...

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03-10-2019 дата публикации

ELECTRONIC DEVICE-SEALED BODY, SHEET-SHAPED ADHESIVE, ADHESIVE FILM FOR SEALING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE-SEALED BODY

Номер: WO2019189618A1
Принадлежит:

The present invention pertains to an electronic device-sealed body comprising an electronic device and an adhesive-cured layer that seals between a UV-impermeable functional film and the electronic device; a sheet-shaped adhesive that is used for forming the adhesive-cured layer; an adhesive film for sealing electronic device, the adhesive film having an adhesive layer made of the functional film and the sheet-shaped adhesive; and a method for manufacturing the electronic device-sealed body.

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08-11-2018 дата публикации

ADHESIVE FILM, TAPE FOR PROCESSING SEMICONDUCTOR WAFER, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD THEREFOR

Номер: WO2018203527A1
Принадлежит:

Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more and is contained in an amount of 30-50 vol% in the adhesive agent layer, the thermoplastic resin contains at least one type of phenoxy resin, and the cured adhesive agent layer has a reliability coefficient S1 of 50-220 (× 10-6 GPa) as calculated according to mathematical formula (1), a reliability coefficient S2 of 10-120 (× 10-8 GPa) as calculated according to mathematical formula (2), and a thermal conductivity of 0.5 W/m·K or more; a tape for processing a semiconductor wafer; a semiconductor package; and a production method therefor. In mathematical formulas (1) and (2), S1, S2, Tg, CTEα1, a storage modulus E', and the saturated water absorption rate WA are of the adhesive agent layer after being cured. Tg represents a glass transition temperature, CTEα1 ...

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01-07-2021 дата публикации

HOT MELT COMPOSITION AND LAYERED BODY FOR HYGIENIC MATERIAL

Номер: WO2021132625A1
Принадлежит:

The present invention provides a hot melt composition that has excellent adhesiveness in a dry state and also has excellent adhesiveness in a wet state. The present invention provides a hot melt composition characterized by containing a polyvinyl alcohol polymer and a crosslinking agent.

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15-11-2018 дата публикации

SHEET, METHOD FOR PRODUCING SHEET AND BONDING METHOD

Номер: WO2018207845A1
Принадлежит:

The present invention addresses the problem of providing a cellulose sheet which has excellent transparency and excellent bondability by means of thermal compression bonding. A sheet which is composed of a laminate comprising a layer that is formed of a cellulose material and a layer that is formed of a thermoplastic elastomer, and wherein the thermoplastic elastomer has both a rubber component having entropic elasticity and a molecule-constraining component for preventing plastic deformation in each molecule that constitutes the thermoplastic elastomer.

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06-08-2020 дата публикации

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Номер: WO2020157805A1
Принадлежит:

The present invention discloses an adhesive composition which contains a thermosetting resin, a curing agent and an elastomer, and which is configured such that: the thermosetting resin contains an epoxy resin that has an alicyclic ring; and the elastomer contains an elastomer that has a carboxy group. The present invention also discloses a film-like adhesive which uses this adhesive composition. The present invention additionally discloses: an adhesive sheet which uses this film-like adhesive; and a method for producing a semiconductor device.

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12-03-2020 дата публикации

METHOD FOR PRODUCING CONNECTED STRUCTURE AND CONNECTION FILM

Номер: WO2020050188A1
Автор: INASE, Keisuke
Принадлежит:

The present invention provides: a novel and improved method for producing a connected structure, said method enabling provisional bonding without the application of heat; and a connection film. The above are achieved by means of a method for producing a connected structure according to one aspect of the present invention, which connects a first component and a second component with use of a connection film, and which comprises: a step wherein a release film is provided on one surface of the connection film, and the connection film is mounted on the first component in such a manner that the other surface of the connection film is in contact with the first component; a step wherein the connection film is provisionally bonded to the first component by irradiating the connection film with light; a step wherein the release film is removed from the connection film; a step wherein the second component is mounted on the connection film; and a step wherein the first component and the second component ...

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07-04-2022 дата публикации

TRANSPARENT ADHESIVE COMPOSITION, FILM-LIKE TRANSPARENT ADHESIVE, METHOD FOR MANUFACTURING TRANSPARENT ADHESIVE CURED LAYER-PROVIDED MEMBER, AND ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

Номер: WO2022070503A1
Принадлежит:

The present invention pertains to: a transparent adhesive composition which contains an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), and in which the epoxy resin curing agent (B) satisfies (1) and (2); a film-like transparent adhesive obtained by processing said composition; and a method for manufacturing a transparent adhesive cured layer-provided member, a method for manufacturing an electronic component, and an electronic component, all of which using said film-like transparent adhesive. (1) Being a powder and having a particle diameter (d90) at a cumulative distribution frequency of 90% of 2.0 μm or less. (2) Having a solubility of 0.1 g or less with respect to 100 g of methyl ethyl ketone at 25°C.

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13-01-2022 дата публикации

POLYMER COMPOUND, AND RESIN COMPOSITION CONTAINING SAID COMPOUND

Номер: WO2022009744A1
Принадлежит:

This polymer compound is represented by formula (1) (in the formula, R1 and R2 each independently denote a hydrogen atom or a methyl group. m and n are average numbers of repeating units, and each independently denote a real number within the range of 1 to 2000). The polymer compound has sufficient flexibility to be able to form a film, exhibits high adhesion to a low roughness copper foil, and has a low dielectric constant and dielectric loss tangent.

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10-02-2022 дата публикации

IMPROVED CORROSION RESISTANCE OF RUBBER-BASED ADHESIVES AND SEALANTS

Номер: WO2022028865A1
Принадлежит:

The present invention relates to a hot-curing reactive composition on the basis of natural and/or synthetic elastomers containing olefinic double bonds, and containing at least one vulcanization system, and its use as a one-component adhesive, sealant, as sealing compound or coating compound in the automotive industry, in particular in body shell construction. The present invention further relates to the use of corrosion protection pigments to improve the corrosion protection effect of compositions of this type.

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28-08-2018 дата публикации

Adhesive and method of encapsulating organic electronic device using the same

Номер: US0010062855B2
Принадлежит: LG Chem, Ltd., LG CHEMICAL LTD, LG CHEM, LTD.

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

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18-01-2022 дата публикации

Method for producing a single-sided adhesive film and single-sided adhesive film

Номер: US0011225591B2

The invention relates to a method for producing a single-sided adhesive film (1). Said method consists of providing a support layer (2) and coating a first side of the support layer (2) with an adhesive film (3), a lubricant coating (4) is applied to a second side of the support layer (2), the support layer (2) being in the form of a polyester film. Said method is characterised in that the polyester film, prior to bonding to the adhesive layer (3), and the lubricant coating (4) is treated with trichloroacetic acid, sodium persulphate, iron chloride or copper chloride in order to increase the surface energy of the polyester film. The invention also relates to a one-sided adhesive film (1) produced according to the above-mentioned method.

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16-01-2020 дата публикации

ADHESIVE HAVING ANTI-INSECT EFFCIENCY

Номер: US20200017733A1
Принадлежит:

The present invention relates to an adhesive comprising an anti-insect ingredient comprising a plant extract, wherein the plant extract comprises an extract of , an extract of and an extract of and an adhesive ingredient comprising a binder. The adhesive is environment friendly and does not have any toxic ingredient on a human body and exhibit excellent and synergic anti-insect efficiency by using three plant extracts. Therefore, it is possible to control pests that may have an adverse effect on foods by applying the adhesive to a food package box. 1. An adhesive comprising;{'i': Cinnamomum cassia', 'Syzygium aromaticum', 'Artemisia capillaris, 'an anti-insect ingredient comprising a plant extract, wherein the plant extract comprises an extract of , an extract of and an extract of ; and'}an adhesive ingredient comprising a binder.2Cinnamomum cassiaSyzygium aromaticumArtemisia capillaris. The adhesive according to claim 1 , wherein the extract of claim 1 , the extract of and the extract of are mixed in the plant extract with a weight ratio of about 1 to about 10:about 1 to 1 bout 10:about 1 to about 10.3Cinnamomum cassiaSyzygium aromaticumArtemisia capillaris. The adhesive according to claim 1 , wherein the extract of claim 1 , the extract of and the extract of are mixed in the plant extract with weight ratio of about 1 to about 5:about 1 to about 5:about 1 to about 5.4. The adhesive according to claim 1 , wherein the binder is selected from the group consisting of a rubber-based resin claim 1 , an acryl-based resin claim 1 , a silicone-based resin claim 1 , an urethane-based resin claim 1 , an epoxy-based resin claim 1 , a polyamide-based resin claim 1 , an olefin-based resin claim 1 , an ether-based resin and combination thereof.5. The adhesive according to claim 1 , wherein the binder comprises a rubber-based resin that is selected from the group consisting of a reclaimed rubber-based resin claim 1 , a butyl rubber-based resin claim 1 , styrene-isobutylene-styrene ...

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23-04-2020 дата публикации

HOT MELT ADHESIVE

Номер: US20200123418A1
Принадлежит:

Disclosed is a hot melt adhesive comprising: (A) a metallocene based propylene homopolymer, (B) a metallocene based ethylene/α-olefin copolymer, (C) a tackifier resin, and (D) a plasticizer, wherein the plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene. This hot melt adhesive has an initial adhesive strength enough to enable a pressure sensitive adhesion body to stick easily on a member, thus making it possible to firmly hold the pressure sensitive adhesion body on the member. The hot melt adhesive is also excellent in releasability, thus causing no adhesive residue on the member when the pressure sensitive adhesion body is peeled from the member. 1: A hot melt adhesive comprising: (A) a metallocene based propylene homopolymer , (B) a metallocene based ethylene/α-olefin copolymer , (C) a tackifier resin , and (D) a plasticizer , whereinthe plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene.2: The hot melt adhesive according to claim 1 , wherein the oil (D1) comprises a naphthene oil.3: The hot melt adhesive according to claim 1 , wherein the polymer (D2) comprises polybutene.4: The hot melt adhesive according to claim 1 , which comprises the polymer (D2) in an amount of 5 to 90 parts by weight based on 100 parts by weight of the total weight of the oil (D1) and the polymer (D2).5: The hot melt adhesive according to claim 1 , wherein the metallocene based propylene homopolymer (A) has a melting point of 100° C. or lower. The present invention relates to a hot melt adhesive, and more particularly to a hot melt adhesive which is useful as a pressure sensitive adhesive.As used herein, the “pressure sensitive” is a specific concept of “adhesive”, and the “adhesive” comprises both “pressure sensitive adhesive” and “non-pressure sensitive adhesive”.A hot melt adhesive can be used without a ...

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16-09-2021 дата публикации

FLAME RESISTANT HOTMELT ADHESIVE

Номер: US20210284872A1
Автор: Joaquim Serra
Принадлежит:

A hotmelt adhesive composition comprising 15 to 45% by weight of at least one tackifying resin, and 20 to 60% by weight of a mixture of at least one single-site catalyzed propylene homopolymer (A) and at least one propylene copolymer (B), wherein the propylene homopolymer (A) has a weight average molecular weight of 20,000 to 145,000, the propylene copolymer (B) has an ethylene comonomer content of 5 to 25% by weight, and the weight ratio of propylene homopolymer (A) to propylene copolymer (B) is from 1:3 to 3:1, wherein the hotmelt adhesive further comprises at least one of the following two components (a) and (b): (a) a particulate phosphorous based compound in an amount of 15 to 40% by weight, or (b) a room temperature liquid phosphorous based compound in an amount of 4 to 15% by weight.

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18-05-2021 дата публикации

Non-reactive hot-melt adhesive with specific resin

Номер: US0011008489B2
Принадлежит: PURAC BIOCHEM BV

The invention pertains to a non-reactive hot-melt adhesive comprising 10-90 wt. %, calculated on the weight of the adhesive, of amorphous thermoplastic resin which is compatible with polylactic acid, wherein the amorphous thermoplastic resin is a random copolymer of lactic acid and further reactive monomer, 10-90 wt. %, calculated on the weight of the adhesive, of a polylactic acid polymer unit (PLAU) selected from poly-L-lactic acid (PLLAU) and poly-D-lactic acid (PDLAU), the unit having a number average molecular weight of at least 0.75 kg/mol.

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27-10-2022 дата публикации

HOT MELT ADHESIVE

Номер: US20220340791A1
Автор: William L. Bunnelle
Принадлежит:

An absorbent article having a liquid permeable interior layer, a liquid impervious exterior layer, an absorbent layer therebetween, and a hot melt adhesive composition having an amorphous polyolefin composition and a heterophase polyolefin copolymer composition with a first set of comonomer units and a second set of comonomer units, wherein the first set of comonomer units are propene.

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13-04-2023 дата публикации

METHOD FOR MANUFACTURING COMPONENTS ON BOTH FACES OF A SUBSTRATE

Номер: US20230110410A1

Method comprising the following steps: i) manufacturing components on a face of a substrate fastened to a first temporary substrate, ii) fastening a second temporary substrate onto the substrate, iii) removing the first temporary substrate, iv) manufacturing components on another face of the substrate, the first and second temporary substrates having surface areas greater than the surface area of the substrate of interest, during step ii), an adhesive film is disposed between the substrate and the first temporary substrate or between the substrate and the second temporary substrate, the adhesive film forming a lateral band around the substrate and adhering to the temporary substrates, the adhesion energy E1between the substrate of interest and the first temporary substrate being greater than the adhesion energy E2between the substrate of interest and the second temporary substrate, the adhesion energy E31between the first temporary substrate and the adhesive film being lower than the adhesion ...

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07-07-2022 дата публикации

HOT MELT ADHESIVE COMPOSITIONS COMPRISING BIOBASED EVA, METHODS AND ARTICLES THEREOF

Номер: US20220213357A1
Автор: Giancarlos Delevati
Принадлежит: Braskem S.A.

A hot melt adhesive composition may include a biobased ethylene vinyl acetate (EVA) copolymer comprising a biobased carbon content as determined by ASTM D6866-18 Method B of 5% to 95%. A hot melt adhesive composition may also include a biobased ethylene vinyl acetate (EVA) copolymer at an amount ranging from 10 to 80 wt % of the hot melt adhesive composition, wherein the biobased EVA comprises a melt index (I2) as determined by ASTM D1238 in the range of 1.5 to 50 g/10 min measured with a load of 2.16 kg at 190° C.; and a tackfier at an amount ranging from 30 to 70 wt % of the hot melt adhesive composition.

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03-05-2022 дата публикации

Wafer processing method including applying a polyester sheet to a wafer

Номер: US0011322407B2
Принадлежит: DISCO CORPORATION

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

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14-04-2022 дата публикации

REACTIVE HOT-MELT ADHESIVE COMPOSITION, AND BONDED BODY AND METHOD FOR PRODUCING SAME

Номер: US20220112405A1
Принадлежит:

Disclosed is a reactive hot-melt adhesive composition, containing: a urethane prepolymer having a polymer chain including a structural unit derived from polyol and a structural unit derived from polyisocyanate, and an isocyanate group as a terminal group of the polymer chain; and a functional group protection type silane coupling agent.

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30-01-2024 дата публикации

Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method

Номер: US0011884850B2
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslinked (meth)acrylate matrix; wherein the thermally curable, one-part epoxy/thiol resin composition comprises: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; and an organic acid.

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22-02-2024 дата публикации

ADHESIVE DELIVERY SYSTEM

Номер: US20240059937A1
Принадлежит:

The present invention is an adhesive delivery system including a conformable film having top and bottom faces, an adhesive releasably coated on at least a portion of the top face of the conformable film, and a light release liner adhered to the adhesive side opposite the conformable film.

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23-01-2024 дата публикации

Hot melt adhesive

Номер: US0011879080B2
Принадлежит: HENKEL AG & CO. KGaA, HENKEL AG & CO. KGAA

Disclosed is a hot melt adhesive comprising: (A) a metallocene based propylene homopolymer, (B) a metallocene based ethylene/α-olefin copolymer, (C) a tackifier resin, and (D) a plasticizer, wherein the plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene. This hot melt adhesive has an initial adhesive strength enough to enable a pressure sensitive adhesion body to stick easily on a member, thus making it possible to firmly hold the pressure sensitive adhesion body on the member. The hot melt adhesive is also excellent in releasability, thus causing no adhesive residue on the member when the pressure sensitive adhesion body is peeled from the member.

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25-07-2018 дата публикации

HOT-TRANSFER ADHESIVE ELEMENTS APPLIED BY THERMAL TRANSFER PROCESS FOR GLUING AND SEALING OF TEXTILE MATERIALS

Номер: EP3351607A1
Принадлежит:

The present invention relates to hot-transfer adhesive elements applied by thermal transfer processes for gluing and sealing textile materials, which promote the elimination of seams. The elements used in the present invention are fabricated using screen printing techniques and are fully customizable in shape and appearance, comprising: a film (1) doped with a substance which promotes their release or the release of objects (4) during their application; an adhesive layer (3) and a carrier adhesive (5), and may further contain a paint layer (2) on which the adhesive layer (3) is printed. The process of alignment and application of these elements is facilitated by the inclusion of areas with cold adhesive that act as temporary adhesion means between the substrate carrying the element and the final part, however this adhesive does not remains in the final part after application.

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06-01-2021 дата публикации

THERMOSETTING ADHESIVE AND ADHESIVE TAPE MADE FROM SAME

Номер: EP3760686A1
Принадлежит:

Ein - insbesondere thermisch härtbarer, schmelzbarer, vorzugsweise haftklebriger - Klebstoff, der thermisch ab einer Temperatur von 110 °C härtbar, bei 60 °C ungefäher einen Monat und bei 23 °C länger als ein Jahr lagerstabil ist und ein daraus hergestelltes Klebeband, umfassend ein epoxidfunktionalisiertes Acrylnitril/Butadien-Copolymer mit durchschnittlich mehr als 1,5 Epoxidgruppen pro Molekül und das gemahlene Reaktionsprodukt aus Phthalsäureanhydrid und Diethylentriamin, zur Verwendung in der Automobilindustrie sowohl im Rohbau auf geölten Blechen als auch in der Lackierstraße auf KTL-beschichteten oder anderweitig lackierten Blechen, zum Kleben und/oder Dichten, zum Beispiel zur Bördelfalzklebung, zur Bördelfalzabdichtung, zur Nahtabdichtung, zur Unterfütterungsklebung, zum Lochverschluss und vieles mehr.

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27-06-2019 дата публикации

FILM-WRAPPED TYPE HOT MELT ADHESIVE

Номер: CA0003085145A1

Disclosed is a film-wrapped type hot melt adhesive, comprising: a film made from a thermoplastic resin composition and a hot melt adhesive wrapped by the film, wherein the thermoplastic resin composition comprises an ethylene homopolymer, and a concavo-convex is formed on a surface of the film. The film-wrapped type hot melt adhesive has blocking resistance and thermal stability which are improved in a balanced manner.

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22-03-2019 дата публикации

Thermal conductive silicone rubber with multilayer structure and application of thermal conductive silicone rubber

Номер: CN0109504295A
Автор: JIN TIANHUI, XU JIN, LIU WEIDE
Принадлежит:

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22-10-2019 дата публикации

A 3 D curved surface screen hot melt optical film and its preparation method

Номер: CN0110358458A
Автор:
Принадлежит:

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07-04-2023 дата публикации

Single-component heat-conducting hot-melt polyurethane adhesive as well as preparation method and application thereof

Номер: CN115926713A
Принадлежит:

The single-component heat-conducting hot-melt polyurethane adhesive is prepared from the following raw materials in parts by weight: 20 to 60 parts of polyester polyol, 0 to 20 parts of polyether polyol, 20 to 70 parts of a heat-conducting medium, 5 to 30 parts of a flame-retardant medium, 5 to 15 parts of isocyanate and 2 to 10 parts of an additive. According to the invention, 20-50% by mass of crystalline copolymerized polyester polyol and 0-20 parts by weight of polyether polyol are adopted, so that the obtained polyurethane adhesive cannot be heated to bubble and lose a protection effect in a use environment of 80-100 DEG C; 70 parts by weight of aluminum oxide with the particle size of 40 microns is adopted as a heat-conducting medium, so that the heat conductivity coefficient between 0.7 and 1.5 can be realized, the heat dissipation and heat transfer protection requirements of electronic products are met, and the polyurethane adhesive has proper viscosity and flowability.

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01-04-2019 дата публикации

Номер: KR1020190034189A
Автор:
Принадлежит:

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12-11-2018 дата публикации

ADHESIVE COMPOSITION, ADHESIVE FILM INCLUDING SAME, ORGANIC ELECTRONIC DEVICE INCLUDING SAME, AND METHOD FOR PRODUCING ORGANIC ELECTRONIC DEVICE

Номер: KR1020180122309A
Принадлежит:

The present invention relates to an adhesive composition, an adhesive film including the same, an organic electronic device including the same. More specifically, provided is an adhesive composition which forms a structure capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, enables production of front light-emitting type organic electronic devices, and exhibits excellent handleability and processability. Moreover, provided are an adhesive film and an organic electronic device including the same. COPYRIGHT KIPO 2018 ...

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01-01-2020 дата публикации

Thermal bonding film capable of being dying-proof having an isolating layer to prevent any leakage of dyes from penetrating into the bonding film layer

Номер: TW0202000818A
Принадлежит:

Disclosed is a thermal bonding film capable of being dying-proof, which comprises: a positioning release layer, which is a heat-resistant and releasable thin film; a bonding film layer, which is removably attached onto one side surface of the positioning release layer; an isolating layer, which is arranged on the bonding film layer for producing an isolation function; a heat combing layer, which is arranged on the isolating layer and generates adhesiveness when the heat combining layer is heated. With the isolation function produced by the isolating layer, the bonding film layer is able to maintain its color when the heat combining layer is adhered onto a surface of an object that contains dyes, since colors of the dyes are isolated by the isolating layer and thereby preventing any leakage of dyes from penetrating.

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28-11-2019 дата публикации

MOISTURE-CURABLE URETHANE HOT MELT RESIN COMPOSITION AND MULTILAYER BODY

Номер: WO2019225148A1
Принадлежит:

The present invention provides: a moisture-curable polyurethane hot melt resin composition which is characterized by containing (i) a urethane prepolymer having an isocyanate group, which uses, as essential starting materials, (A) a polyol, (B) a polyisocyanate and (C) a compound that has one or more polymerizable unsaturated groups and two or more hydroxyl groups, (ii) a photopolymerization initiator and (iii) a light stabilizer; and a multilayer body which comprises a layer of a cured product of this moisture-curable polyurethane hot melt resin composition. The present invention also provides a multilayer body which is characterized by comprising a base material and a layer of a cured product of the above-described moisture-curable urethane hot melt resin composition. It is preferable that the light stabilizer (iii) contains a hindered amine compound (iii-X) and/or a nitrogen-containing heterocyclic compound (iii-Y).

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08-08-2019 дата публикации

THERMOSETTING RESIN COMPOSITION, FILM-FORM ADHESIVE, ADHESIVE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Номер: WO2019150995A1
Принадлежит:

Disclosed is a thermosetting resin composition comprising: an epoxy resin; a hardening agent; a first elastomer having a weight-average molecular weight of 200,000 to 1,300,000, and having at least one type of functional group selected from the group consisting of a carboxy group and a hydroxy group; and a second elastomer having a weight-average molecular weight of 200,000 to 1,300,000 and having neither a carboxy group or a hydroxy group. The total content of the first elastomer and the second elastomer is less than 40% by mass with respect to the total quantity of the thermosetting resin composition.

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09-01-2020 дата публикации

ADHESION AGENT COMPOSITION, ADHESIVE FILM, AND METHOD FOR PRODUCING CONNECTING BODY

Номер: WO2020009122A1
Принадлежит:

The adhesion agent composition according to one aspect of the present invention is used for bonding a semiconductor chip to a flexible printed circuit board, and has a melt viscosity of 3,500-20,000 Pa·s at 130°C. The adhesive film according to one aspect of the present invention is provided with a belt-like carrier film having a width of at most 100 mm and a plurality of adhesive agent pieces arranged on the carrier film in the longitudinal direction thereof, wherein the adhesive agent pieces are composed of the adhesion agent composition.

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06-12-2018 дата публикации

SHEET-SHAPED ADHESIVE, GAS-BARRIER LAMINATE, AND SEALANT

Номер: WO2018221510A1
Принадлежит:

The sheet-shaped adhesive according to the present invention is formed from an adhesive composition containing (A) a modified polyolefin resin and (B) a thermosetting component, and satisfies the following conditions (I) and (II). Condition (I): when the sheet-shaped adhesive is allowed to stand for 20 minutes in a 120°C environment, the amount of outgas generation per 1 cm3 is not more than 20 mg/cm3. Condition (II): when a laminate of the sheet-shaped adhesive applied on a 50 μm-thick polyethylene terephthalate film is pressed onto a glass plate using a roller and conditions of a temperature of 60°C, a pressure of 0.2 MPa, and a speed of 0.2 m/min, in order to bond the sheet-shaped adhesive side face of the laminate to the glass plate, and the sheet-shaped adhesive is then cured for 2 hours at 100°C followed by holding for 24 hours in a 23°C/50% relative humidity environment, the adhesive strength of the laminate for the glass plate, as measured in accordance with JIS Z 0237 : 2000 using ...

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08-04-2021 дата публикации

ADHESIVE FOR SEMICONDUCTOR, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

Номер: WO2021065518A1
Принадлежит:

Disclosed is an adhesive for semiconductors which comprises a thermoplastic resin, a thermosetting resin, a hardener having a reactive group, and a flux compound having an acid group. The adhesive for semiconductors, when examined by differential scanning calorimetry in which the adhesive is heated at a rate of 10 °C/min, gives a DSC curve which has a calorific value within the range of 60-155°C of 20 J/g or less.

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08-10-2020 дата публикации

ADHESIVE MULTICOMPONENT COMPOSITION AND USES THEREOF

Номер: US20200317962A1
Принадлежит:

The present invention relates to a multicomponent adhesive composition comprising: a composition A comprising: at least one silyl polymer comprising at least one hydrolyzable alkoxysilane group; at least one tackifying resin; a composition B comprising: at least one catalyst; at least one compound C chosen from: a compound C1 with a number-average molecular mass ranging from 300 g/mol to 500 000 g/mol; and a compound C2 with a vapor pressure at 20° C. of greater than or equal to 0.08 kPa; and mixtures thereof; the composition A:composition B mass ratio ranging from 99.98:0.02 to 60:40, the total content of catalyst ranging from 0.01% to 10% relative to the total weight of said adhesive composition.

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13-07-2023 дата публикации

USE OF HYDROTREATED SYNTHETIC FISCHER-TROPSCH-WAXES IN POLYOLEFIN-BASED HOT MELT ADHESIVES

Номер: US20230220246A1
Принадлежит: SASOL SOUTH AFRICA LIMITED

The present invention is concerned with the use of hydrotreated synthetic Fischer-Tropsch waxes in polyolefin-based hot melt adhesive compositions, wherein the hydrotreated synthetic Fischer-Tropsch waxes modify the color degradation in the polyolefin-based hot melt adhesive compositions and are characterized by a polydispersity between 1.02 and 1.06.

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20-02-2024 дата публикации

Hot-melt adhesive resin film and production method thereof

Номер: US0011904577B2
Принадлежит: FUJIMORI KOGYO CO., LTD.

A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.

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09-05-2024 дата публикации

HEAT SEALABLE RESIN COMPOSITION, HEAT SEALABLE MATERIAL, PACKAGING MATERIAL, LID MATERIAL AND PACKAGING CONTAINER

Номер: US20240150621A1
Принадлежит:

A heat sealable resin composition includes an ethylene-vinyl ester copolymer (A), and a tackifier resin (B), a content ratio of a constituent unit derived from a vinyl ester included in the ethylene-vinyl ester copolymer (A) is 8% by mass or more with respect to total copolymer constituent units constituting the ethylene-vinyl ester copolymer (A), and the tackifier resin (B) includes an alicyclic hydrocarbon resin (B1) and an aromatic hydrocarbon resin (B2).

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06-09-2019 дата публикации

АРМИРОВАННЫЙ ТЕРМОКЛЕЙ

Номер: RU2699626C1

Изобретение относится к клеевой промышленности и может быть использовано в авиационной, автомобильной, судостроительной и других отраслях машиностроения. Армированный термоклей получают путем нанесения расплава клеящего состава на армирующий элемент. Клеящий состав включает компоненты при следующем соотношении, мас.%: сополимер этилена с винилацетатом Сэвилен 11808-340 (17-27), смола Hikotat-90S (58-72) и мел гидрофобный (7-20). В качестве армирующего элемента используется полипропиленовая сетка с размером ячейки не более 3×3 мм. Обеспечивается равномерный клеящий слой с высокими адгезионными свойствами при повышенной влажности, высокая прочность при разрыве. 1 табл.

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20-02-2020 дата публикации

Verfahren zur Herstellung einer versiegelten Falzverbindung

Номер: DE102018213824A1
Принадлежит:

Verfahren zur Herstellung einer mittels einer Klebemasse versiegelten Falzverbindung zwischen einem ersten Flächenelement (1), das im Falz außen zu liegen kommt, und einem zweiten Flächenelement (2), das im Falz innen zu liegen kommt, wobei ein Flansch (10) des ersten Flächenelementes (1) über einen Flansch (20) des zweiten Flächenelementes (2) zurückgeschlagen wird und wobei der Flansch (10) des ersten Flächenelements eine erste Fläche (11) und eine zweite Fläche (12) und wobei der Flansch (20) des zweiten Flächenelements (2) eine erste Fläche (21) und eine zweite Fläche (22) aufweist, umfassend die Schritte:(I) Verkleben des Flansches (20) des zweiten Flächenelements mit zumindest einer Schicht einer Klebemasse (30) auf dem Flansch (10) des ersten Flächenelementes (1), derart, dass das Ende (23) des Flansches (20) des zweiten Flächenelements (2) um einen Abstand (A) gegenüber dem Ende (13) des Flansches (10) des ersten Flächenelements (1) eingerückt ist;(II) Bördeln des Flansches (10) ...

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03-02-2022 дата публикации

Thermisch härtbares Klebeband, Verwendung zum Ummanteln von langgestrecktem Gut insbesondere Leitungen und Kabelstrang

Номер: DE102019103124B4
Принадлежит: tesa SE

Klebeband zum Ummanteln von langgestrecktem Gut vorgeschlagen, umfassend einen bandförmigen Träger, der auf mindestens einer Seite mit einer selbstklebenden Klebeschicht versehen ist, die aus einem Haftklebestoff besteht, wobei der bandförmige Träger auf mindestens der einen Seite zusätzlich mit einem bei einer Temperatur von bis zu 110°C thermisch härtbaren Bindemittel versehen ist, dadurch gekennzeichnet, dass das bei einer Temperatur von bis zu 110°C thermisch härtbare Bindemittel ein Polymerisat umfasst, welches zu mindestens 5 Gew.-% aus einer ethylenisch ungesättigten Monocarbonsäure, einer ethylenisch ungesättigten Dicarbonsäure oder einem ethylenisch ungesättigten Dicarbonsäureanhydrid sowie aus mono- oder multifunktionellen Epoxidverbindungen als Härter und zusätzlich einem Polyol oder einem Alkanolamin mit mindestens zwei Hydroxylgruppen aufgebaut ist.

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06-08-2016 дата публикации

CARPET SEAM TAPE

Номер: CA0002918202A1
Принадлежит:

Carpet seam tape for joining two carpet segments comprises an elongated base layer being resilient in a transverse direction, an intervening layer applied to the base layer, and an adhesive applied to the intervening layer.

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21-01-2020 дата публикации

Номер: CN0209974679U
Автор:
Принадлежит:

Подробнее
04-12-2018 дата публикации

Bilateral structure sticky tape

Номер: CN0208182910U
Автор: XIA XINYUE
Принадлежит:

Подробнее
11-10-2019 дата публикации

High-performance hot melt adhesive and use thereof

Номер: CN0110325610A
Автор:
Принадлежит:

Подробнее
28-09-2018 дата публикации

Aluminum plastic film and lithium battery comprising the same

Номер: CN0108598295A
Принадлежит:

Подробнее
18-05-2018 дата публикации

EVA low-melting-point label

Номер: CN0108047976A
Автор: ZHENG HUA
Принадлежит:

Подробнее
11-04-2023 дата публикации

TPU (Thermoplastic Polyurethane) hot melt adhesive film for attaching soles as well as preparation method and application of TPU hot melt adhesive film

Номер: CN115948141A
Принадлежит:

The invention discloses a TPU (thermoplastic polyurethane) hot melt adhesive film for shoe sole attachment and a preparation method and application of the TPU hot melt adhesive film, and the TPU hot melt adhesive film comprises the following raw materials in parts by weight: 30-80 parts of thermoplastic polyester polyurethane; 3 to 50 parts of thermoplastic polycaprolactone type polyurethane; 0.05 to 10 parts of fumed silica; 0.01 to 5 parts of other auxiliary agents; the melt index of the thermoplastic polyester type polyurethane is 10-40g/10min (150 DEG C, 5kg); the melt index of the thermoplastic polycaprolactone type polyurethane is 10 to 100g/10min (170 DEG C, 2.16 kg); and the specific surface area of the fumed silica is 50-400m < 2 >/g. The TPU hot melt adhesive film disclosed by the invention has remarkable advantages in high temperature resistance, and particularly has an excellent effect on bonding shoe material rubber outsoles and TPU foaming insoles.

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04-11-2020 дата публикации

Thermoplastic adhesive sheet and use thereof

Номер: KR1020200125657A
Автор:
Принадлежит:

Подробнее
09-12-2020 дата публикации

RESIN COMPOSITION, SEALING SHEET, AND SEALING BODY

Номер: KR1020200138172A
Автор:
Принадлежит:

Подробнее
13-12-2018 дата публикации

FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE

Номер: WO2018225323A1
Принадлежит:

This film-like adhesive for semiconductors is provided with a first adhesive layer and a second adhesive layer provided upon the first adhesive layer, and the modulus of elasticity at 35°C of the film-like adhesive after curing is 3.0–5.0 GPa.

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07-10-2021 дата публикации

STRUCTURE

Номер: WO2021200429A1
Принадлежит:

... [Problem] To provide a structure of a multilayer structure that facilitates recognition of front and rear sides thereof and prevents a film track from being left on a resin layer when a second film is separated. [Solution] A structure according to the present invention is provided with a first film, a resin layer, and a second film in this order, the structure being characterized in that a difference between a Trouser tear force of the first film and a Trouser tear force of the second film is -0.05 N or less or +0.05 N or more, a difference in haze between the first film and the second film is -5% or less or +5% or more, or a difference between an L* value, an a* value, and a b* value in a Lab color space measured on the side of the first film of the structure and an L* value, an a* value, and a b* value in the Lab color space measured on the side of the second film of the structure satisfies a specific condition.

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15-10-2020 дата публикации

TAPE FOR ELECTRONIC COMPONENT AND METHOD OF PROCESSING ELECTRONIC COMPONENT

Номер: WO2020209044A1
Автор: OKURA, Masato
Принадлежит:

Provided are a tape for an electronic component and a method of processing an electronic component, which can sufficiently follow a semiconductor wafer having a bump with a large height and can prevent a dimple from occurring on the ground surface of the semiconductor wafer. The tape 1 for an electronic component according to the present invention is characterized in that the tape 1 has at least one resin layer 3, the resin layer 3 has a storage modulus of 10000 to 200000 Pa at any temperature of 60℃ to 80℃, and the melt flow rate is 10 g/10 min to 200 g/10 min.

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25-10-2018 дата публикации

RESIN COMPOSITION

Номер: WO2018194100A1
Принадлежит:

This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; (D) a magnetic filler; and (E) an inorganic filler other than the magnetic filler, wherein, when a content mass of component (D) is d1 and a content mass of component (E) is e1, e1/d1 is 0.02-0.19.

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03-03-2022 дата публикации

ADHESIVE SHEET, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING ADHESIVE SHEET

Номер: WO2022044543A1
Принадлежит:

The adhesive sheet according to the present invention is provided with different material sheets that are flush with each other.

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19-03-2020 дата публикации

STRETCHABLE CONDUCTIVE FILM FOR TEXTILES

Номер: US20200086606A1
Принадлежит:

A stretchable conductive film for textiles 1 includes a stretchable conductive layer 3, and a hot-melt adhesive agent layer 4 formed on one surface of the stretchable conductive layer 3. The stretchable conductive film for textiles 1 may also include a first peel film 2 formed on a surface of the stretchable conductive layer 3 on the opposite side from the hot-melt adhesive agent layer 4 side, and a second peel film 5 formed on a surface of the hot-melt adhesive agent layer 4 on the opposite side from the stretchable conductive layer 3 side.

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17-09-2020 дата публикации

STRETCHABLE CONDUCTOR SHEET, STRETCHABLE CONDUCTOR SHEET HAVING ADHESIVENESS, AND METHOD FOR FORMING ELECTRICAL WIRING COMPRISING STRETCHABLE CONDUCTOR ON FABRIC

Номер: US20200291273A1
Принадлежит: TOYOBO CO., LTD.

An objective is to provide a stretchable conductor sheet which is useful as a material for electrical wiring and electrodes for garment-type electronic devices, the material having excellent durability in terms of washing and durability in terms of perspiration. A fabric provided with an electrode and an electrical wiring, which are formed from a stretchable conductor sheet, is obtained by: providing a film having releasability with a first stretchable conductor layer which is formed from a paste material that uses carbon-based particles as a conductive filler, while using a flexible resin as a binder resin; subsequently forming a second stretchable conductor layer, while using metal-based particles as a conductive filler; laminating a hot melt adhesive layer thereon; superposing the resulting laminate on a fabric after removing unnecessary parts from the laminate by means of partial slits; and subjecting the resulting fabric to hot pressing. Since the carbon-based particles adsorb a contamination ...

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29-04-2021 дата публикации

COLOR MIGRATION BLOCKING COMPOSITION, COLOR MIGRATION BLOCKING FILM, COLOR MIGRATION BLOCKING LAMINATE AND COMPOSITE FABRIC COMPRISING THE SAME, AND APPLICATIONS THEREOF

Номер: US20210122917A1
Принадлежит:

The present invention provides a color migration blocking composition, comprising: 15 parts to 45 parts by weight of a phenoxy resin; 5 parts to 40 parts by weight of an elastomer-modified epoxy resin; 1.5 parts to 7.0 parts by weight of a curing agent; and 30 parts to 65 parts by weight of a solvent, based on the total weight of the color migration blocking composition. The color migration blocking film formed by the color migration blocking composition has a good effect on blocking color migration and a good adhesion strength; therefore, when a color migration blocking laminate comprising the color migration blocking film is applied to a fabric, not only the unnecessary discoloration can be avoided and the softness of the fabric can be maintained, but also the processing cost is reduced, thereby promoting the value of the product.

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11-06-2024 дата публикации

Paper article comprising a paper component and a heat-sealable coating

Номер: US0012006454B2
Принадлежит: OMYA INTERNATIONAL AG

The present invention refers to a paper article comprising a paper component having a first side and a second side, wherein the first side and/or the second side of the paper component is at least partially coated with a heat-sealable coating, wherein the heat-sealable coating comprises a first polymer comprising units derived from a (meth)acrylate and/or (meth)acrylic acid and/or a salt thereof, and a second polymer, being different from the first polymer, comprising units derived from a) a (meth)acrylate and/or (meth)acrylic acid and/or a salt thereof, and b) an alkene, wherein the first polymer and the second polymer are present in the heat-sealable coating in a weight ratio of 90:10 to 35:65, and wherein the first polymer and the second polymer are present in the heat-sealable coating in an overall amount of at least 50 wt. %, based on the total weight of the coating. Furthermore, the present invention refers to a laminate comprising a paper component, a substrate and a heat-seal layer ...

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30-09-2020 дата публикации

ADHESIVE TAPES BASED ON EPOXY RESIN REACTIVE ADHESIVES

Номер: EP3713984A1
Принадлежит:

Подробнее
31-08-2022 дата публикации

IMPROVEMENTS RELATING TO THE MANUFACTURE OF WIND TURBINE BLADES

Номер: EP4048509A1
Принадлежит:

Подробнее
24-05-2021 дата публикации

НЕПОСРЕДСТВЕННО ПРИКЛЕИВАЮЩЕЕСЯ, ПРОЗРАЧНОЕ ТЕРМОСКЛЕИВАЕМОЕ СВЯЗУЮЩЕЕ ДЛЯ ПОКРЫТИЯ И СКЛЕИВАНИЯ ПРОЗРАЧНЫХ ПОЛИМЕРНЫХ ПЛЕНОК

Номер: RU2748348C2

Изобретение относится к термосклеиваемой системе для нанесения покрытия, подходящей для склеивания основ и содержащей пленкообразующую дисперсию. При этом дисперсия содержит всего от 35 до 60% по весу смеси компонентов A, B и C, а смесь состоит из: от 30 до 40% по весу смеси сложных полиэфиров в качестве полимера типа A, от 30 до 40% по весу поли(мет)акрилата или смеси двух или более поли(мет)акрилатов в качестве полимера типа B и от 20 до 35% по весу одной или более разновидностей каучука, содержащих повторяющиеся стирольные звенья, в качестве полимера типа C. Причем в каждом случае в пересчете на общий вес композиции полимеров типов A, B и C, при этом компоненты A, B и/или C также могут присутствовать полностью или до некоторой степени в виде привитых сополимеров AB или CB. При этом полимер типа C представляет собой SEBS-каучук, привитой на малеиновый ангидрид сополимер SEBS-каучука с содержанием малеиновой кислоты от 1,4 до 2,0% по весу или сополимер, преимущественно состоящий из стирола ...

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19-03-2020 дата публикации

HOT-MELT ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE RESIN LAMINATE

Номер: CA3112466A1
Принадлежит:

The present invention provides a hot-melt adhesive resin composition which can adhere upon short-time heating to exhibit high adhesion force and which is easy to store. More specifically, the present invention relates to a hot-melt adhesive resin composition characterized by comprising a modified polyolefin (A) obtained by introducing a functional group into a polyolefin, a solid phenolic resin (B), and a crosslinking agent (C), the content of the modified polyolefin (A) being 10-40 parts by mass per 100 parts by mass of the sum of the modified polyolefin (A) and the solid phenolic resin (B). The hot-melt adhesive resin composition is further characterized in that the modified polyolefin (A) and the crosslinking agent (C) are contained so that the amount of the functional group of the crosslinking agent (C) is larger than 1.0 equivalents but not larger than 5.0 equivalents per 1.0 equivalents of the functional group of the modified polyolefin (A).

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16-12-1980 дата публикации

BONDING METHOD

Номер: CA0001091844A

A method is disclosed for forming a strong bond between a substrate and a solid thermoplastic polymer which comprises melting a thermoplastic polymer having an effective open time (a period after melting the polymer during which it remains aggressively tacky and bondable below the melting temperature),cooling it below the melting temperature, contacting the open polymer with a substrate and allowing the polymer to revert to its non-bondable, solid state. Also disclosed are a class of polyesters suitable for use in the method and certain novel articles adapted for carrying out the method.

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28-12-1971 дата публикации

WEFTLESS TAPE STRUCTURE

Номер: CA0000889261A

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09-03-2021 дата публикации

CARPET SEAM TAPE AND METHOD FOR JOINING CARPET

Номер: CA2824684C
Принадлежит: BENNETT DANIEL PAUL, BENNETT, DANIEL PAUL

A carpet seam tape is provided for joining two carpet segments which will resist lifting of the seam off the floor known as peaking or profiling of the carpet seam when the carpet segments are positioned to cover the entire floor and the carpet is stretched at the outer edges and secured to the floor using tack strips. The seam tape comprises an elongated base layer that is resilient in a transverse direction, and may comprise a resilient textile such as cotton and elastane. An adhesive is applied to the base layer. A method for joining two carpet segments comprises abutting one edge of one carpet segment with one edge of the other carpet segment; positioning a length of seam tape under the abutting edges, and activating the adhesive to secure the seam tape to the undersides of both carpet segments.

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06-11-2020 дата публикации

Adhesive laminate, method for using adhesive laminate, and method for producing cured sealing body with cured resin film

Номер: CN0111902508A
Автор:
Принадлежит:

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09-07-2019 дата публикации

Manufacturing process BOPP hot-melt adhesive tape

Номер: CN0109988516A
Автор:
Принадлежит:

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13-08-2019 дата публикации

Firm camera gum subassembly for panel computer

Номер: CN0209242986U
Автор:
Принадлежит:

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25-08-2023 дата публикации

3LPP pipeline joint anticorrosion mastic adhesive, heat-shrinkable tape and preparation method of 3LPP pipeline joint anticorrosion mastic adhesive and heat-shrinkable tape

Номер: CN116640540A
Принадлежит:

The invention provides a 3LPP pipeline joint anticorrosion mastic adhesive, a heat-shrinkable tape and a preparation method thereof, and the mastic adhesive comprises the following components in percentage by mass: 15-25% of maleic anhydride grafted hydrogenated thermoplastic elastomer, 3-7% of high-melt-index ethylene methyl methacrylate, 15-20% of low-melt-index ethylene methyl methacrylate, 3-7% of polyhedral oligomeric silsesquioxane, 3-7% of polyhedral oligomeric silsesquioxane, 5-10% of polyhedral oligomeric silsesquioxane, 5-10% of polyhedral oligomeric silsesquioxane, 5-10% of polyhedral oligomeric silsesquioxane and the balance of water. The adhesive is prepared from 8-15% of medium molecular weight polyisobutene, 3-5% of low molecular weight polyisobutene, 15-25% of tackifying resin, 10-20% of nano active filler, 0.5-1% of antioxidant, 0.5-1% of anti-aging agent and 1.0-1.5% of color master batch. By adopting the technical scheme of the invention, the highest use temperature of ...

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18-04-2023 дата публикации

Hot melt adhesive film as well as preparation method and application thereof

Номер: CN115975519A
Принадлежит:

The invention provides a hot melt adhesive film. The hot melt adhesive film comprises the following components in parts by weight: 30-70 parts of high-density polyethylene, 10-15 parts of low-density polyethylene, 8-20 parts of ultra-high molecular weight polyethylene, 5-10 parts of hydrogenated petroleum resin, 5-15 parts of an acrylic copolymer and 0.2-1 part of an antioxidant. The ultra-high molecular weight polyethylene component is added, so that the hot melt adhesive film can still keep higher cohesion strength at high temperature; meanwhile, the ultra-high molecular weight polyethylene is similar to the high-density polyethylene in structure and good in compatibility in a molten state, and uniform dispersion of the ultra-high molecular weight polyethylene is facilitated; by introducing the ultra-high molecular weight polyethylene, the molecular weight distribution range of the polyethylene is widened, continuous cooling and heat release of the adhesive film are facilitated, the bonding ...

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23-07-2019 дата публикации

Номер: KR0102002940B1
Автор:
Принадлежит:

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09-12-2020 дата публикации

WARPAGE PREVENTION LAMINATE FOR CURED SEALING BODY AND METHOD FOR PRODUCING CURED SEALING BODY

Номер: KR1020200138150A
Автор:
Принадлежит:

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16-06-2019 дата публикации

Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding device

Номер: TW0201922996A
Принадлежит:

Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and the rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to the temperature of the NCF at various rates of temperature increase and a heating start temperature map that indicates changes in viscosity with respect to the temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.

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17-01-2019 дата публикации

THERMALLY CROSSLINKABLE COMPOSITION

Номер: WO2019013185A1
Автор: ZHANG, Yanmei
Принадлежит:

The present invention relates to a thermally crosslinkable composition including an acid-modified polymer A having a melting point of 110-150oC and a crystallization temperature of 50-90oC, an acid-modified polymer B having a melting point of 30-110oC and a crystallization temperature of less than 50oC, an adhesiveness-imparting resin, and a curing agent, wherein the crystallization temperature of the thermally crosslinkable composition is 30-70oC.

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25-07-2019 дата публикации

PRODUCTION METHOD FOR ARTICLE WITH TRANSFERRED PRINTED IMAGE AND TECHNOLOGY RELATED THERETO

Номер: WO2019142657A1
Принадлежит:

Provided are: an article such as clothing made of a fabric-like fiber product on which a desired printed image has been transferred while maintaining as much as possible the original characteristics of the article such as texture; a production method for said article; a transfer material for said transfer; and a material-for-transfer for obtaining said transfer material. The transfer material is produced by forming a post-printed image layer by plateless printing on an adhesive layer of a material-for-transfer, in which a hot-meltable adhesive layer is formed on a specified area for post-printing on a specified surface of a base material so as to be peelable from the base material. By heating the adhesive layer and post-printed image layer of the transfer material with the post-printed image layer in contact with the article and pressure bonding the same with the article, the adhesive layer is fused with the article, after which the adhesive layer and post-printed image layer are fixed ...

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06-05-2021 дата публикации

FIXATION STRUCTURE OF WIRING MEMBER, AND WIRING MEMBER WITH HEAT GENERATION LAYER

Номер: WO2021084861A1
Принадлежит:

The purpose of the present invention is to provide a technology that makes it possible to achieve easy fixation between a wiring member and an adherend. A fixation structure of a wiring member according to the present invention comprises: a wiring member that comprises at least one linear transmission member; a heat generation layer that is provided so as to surround the periphery of the wiring member; an adherend to which the wiring member is affixed; and a bonding layer that is provided between the heat generation layer and the adherend and/or between the heat generation layer and the wiring member. With respect to this fixation structure of a wiring member, the heat generation layer is capable of generating heat by means of induction heating; and the bonding layer develops bondability by means of the heat from the heat generation layer during the induction heating, while being bonded to at least one of the adherend and the wiring member.

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12-12-2019 дата публикации

HOT-MELT COMPOSITION

Номер: WO2019235454A1
Автор: SOMEYA, Yu
Принадлежит:

Provided is a hot-melt composition in which a reduction in stretch recovery properties and rupturing are suppressed even after heating and holding in a stretched state, and which can be applied with an ordinary hot-melt coating device due to having excellent coating properties. This hot-melt composition comprises a thermoplastic resin (A) and a plasticizer (B) and when, in order to obtain a master curve, the dynamic viscoelasticity is measured under conditions where the temperature is -20 to 120°C and the frequency (f) is -0.2 to 2.0 Hz, and the logarithm (log(G')) of the measured storage elastic modulus (G') and the logarithm (log(G'')) of the measured loss elastic modulus (G'') are plotted against the logarithm (log(f)) of the frequency (f), with 40°C serving as the reference temperature, the hot melt composition is characterized in that (1) the value of log(f) is -2.5 or lower at a point in the range of -6.0 < log(f) < -1.0, where log(G'') is maximum, and (2) the value of the logarithm ...

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05-08-2010 дата публикации

DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM

Номер: US20100193969A1
Принадлежит: NITTO DENKO CORPORATION

The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored with a dye contained therein. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

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24-10-2019 дата публикации

ORGANIC ELECTRONIC DEVICE

Номер: US20190322907A1
Принадлежит:

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

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09-08-2012 дата публикации

Method for manufacturing adhesion body, method for manufacturing substrate with adhesive pattern, and substrate with adhesive pattern

Номер: US20120202015A1
Принадлежит: Hitachi Chemical Co Ltd

The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed.

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30-08-2012 дата публикации

Process for producing pressure-sensitive adhesive sheet

Номер: US20120216948A1
Принадлежит: Nitto Denko Corp

Provided is a process for producing a pressure-sensitive adhesive sheet by laminating layers of active-energy-ray-curable compositions and irradiating the laminate with an active energy ray. The processes gives a pressure-sensitive adhesive sheet with less defects at low production cost and is applicable to the production of pressure-sensitive adhesive sheets of various kinds. The process includes: Steps A 1 and A 2 of applying an active-energy-ray-curable composition to one surface of a first carrier and to one surface of a second carrier using a die coater to form coated layers thereon; Step B of placing the resulting first and second carriers so that the coating-layer-side surfaces of the carriers face each other, and introducing an active-energy-ray-curable composition into between the first and second carriers; and Step C of irradiating a multilayer assemblage with an active energy ray, the multilayer assemblage obtained in Step B and including the active-energy-ray-curable compositions between the first and second carriers.

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17-01-2013 дата публикации

Adhesive film for semiconductor device, film for backside of flip-chip semiconductor, and dicing tape-integrated film for backside of semiconductor

Номер: US20130017396A1
Принадлежит: Nitto Denko Corp

Provided is an adhesive film for a semiconductor device that is capable of having the same physical properties as these at the time of manufacture even after it is stored for a long time. The adhesive film for a semiconductor device of the present invention contains a thermosetting resin, and in which the amount of reaction heat generated in a temperature range of ±80° C. of a reaction heat peak temperature measured by a differential scanning calorimeter after the adhesive film is stored at 25° C. for 4 weeks is 0.8 to 1 time the amount of reaction heat generated before storage.

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02-01-2020 дата публикации

THERMALLY CROSSLINKABLE COMPOSITION

Номер: US20200002584A1
Автор: ZHANG Yanmei
Принадлежит:

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C. 1. A thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C. , an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C. , a tackifier resin , and a curing agent , wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.2. The thermally crosslinkable composition according to comprising 30 to 200 parts by mass of the acid-modified polymer B based on 100 parts by mass of the acid-modified polymer A claim 1 , and 20 to 200 parts by mass of the tackifier resin and 0.2 to 3 parts by mass of the curing agent based on 100 parts by mass of a total amount of the acid-modified polymers A and B.3. The thermally crosslinkable composition according to claim 1 , wherein a content of the tackifier resin having an acid value of 5 or less is 20 to 100% by mass based on 100% by mass of a whole tackifier resin.4. The thermally crosslinkable composition according to claim 3 , wherein the tackifier resin having an acid value of 5 or less is selected from the group consisting of rosin types claim 3 , terpene types and petroleum resin types.5. The thermally crosslinkable composition according to claim 1 , wherein the curing agent is a solid polyamine compound having a melting point of 150° C. or higher.6. The thermally crosslinkable composition according to claim 5 , wherein the solid polyamine compound having a melting point ...

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21-01-2021 дата публикации

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATIONMOLDING, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATED MOLDED BODY PROVIDED WITH TEMPORARY PROTECTIVEFILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Номер: US20210020460A1
Принадлежит:

Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin. 1. A temporary protective film for semiconductor sealing molding to temporarily protect a lead frame during sealing molding of forming a sealing layer that seals a semiconductor element mounted on the lead frame , comprising:a support film; andan adhesive layer provided on one surface or both surfaces of the support film and containing a resin,wherein when the temporary protective film is attached to a lead frame having a die pad and an inner lead such that the adhesive layer comes into contact with the lead frame, a 90-degree peel strength between the adhesive layer and the lead frame is 5 N/m or higher at 25° C., andwhen the temporary protective film is attached to the lead frame such that the adhesive layer comes into contact with the lead frame, a semiconductor element is mounted on a surface of the die pad, the surface being on the opposite side of the temporary protective film, subsequently the semiconductor element, the lead frame, and the temporary protective film are heated, and then a sealing layer for sealing the semiconductor element while being in contact with the adhesive layer is formed, a 90-degree peel strength between the adhesive layer and the lead frame as well as the sealing layer is 600 N/m or less at 180° C.2. The temporary protective film for semiconductor sealing molding according to claim 1 ,wherein the adhesive layer further contains a silane coupling agent, anda content of the silane coupling agent is more than 5% by mass and less than or equal to 35% by mass with respect to the total amount of the resin.3. A temporary ...

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10-02-2022 дата публикации

HMPSA INCORPORATING A PLASTICISER MADE FROM A RENEWABLE RAW MATERIAL

Номер: US20220041899A1
Принадлежит:

1) An HMPSA composition comprising: 115-. (canceled)16. An HMPSA composition which comprises , on the basis of the total weight of said composition:from 20% to 50% by weight of a composition (a1) of styrene block copolymers which comprise at least one elastomer block;from 35% to 65% by weight of one or more tackifying resins (a2); andfrom 7% to 25% by weight of a plasticizer (a3);wherein the plasticizer (a3) has a composition (a3) comprising a stand oil (a3-1) of a vegetable oil.17. The HMPSA composition as claimed in claim 16 , wherein the composition (a1) of styrene block copolymers comprises claim 16 , on the basis of its total weight:from 30% to 90% by weight of at least one diblock copolymer selected from the group consisting of SI, SIB, SB, SEB and SEP, andfrom 10% to 70% by weight of at least one triblock copolymer selected from the group consisting of SIS, SIBS, SBS, SEBS and SEPS;wherein the total content of styrene units of said composition (a1) ranges from 10% to 40% by weight on the basis of the total weight of (a1).18. The HMPSA composition as claimed in claim 16 , wherein the tackifying resin (a2) comprises:(i) rosins of natural origin or modified rosins and derivatives thereof which are hydrogenated, dehydrogenated, dimerized, polymerized or esterified with monoalcohols or polyols;(ii) resins obtained by hydrogenation, polymerization or copolymerization (with an aromatic hydrocarbon) of mixtures of unsaturated hydrocarbons having around 5, 9 or 10 carbon atoms derived from petroleum cuts;(iii) terpene resins resulting from the polymerization of terpene hydrocarbons in the presence of Friedel-Crafts catalysts, which are optionally modified by the action of phenols; or(iv) copolymers based on natural terpenes.19. The HMPSA composition as claimed in claim 16 , wherein the vegetable oil stand oil (a3-1) is obtained by a process comprising a step of heating said vegetable oil in the absence of dioxygen at a temperature above 200° C.20. The HMPSA ...

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24-01-2019 дата публикации

REMOVABLE PRESSURE SENSITIVE ADHESIVE COMPOSITIONS

Номер: US20190023949A1
Автор: Dalley Paul William
Принадлежит:

This invention relates to styrene-isoprene-styrene block copolymer based on hot melt adhesive compositions. The adhesive compositions are useful for making removable pressure sensitive adhesives. The adhesives have a peel value of no greater than 4 lbs/in. Additionally, the tack value can be equal to or greater than the peel value. The compositions use a minimal amount of liquid plasticizer and/or tackifying resin. Additionally, the adhesives have workable viscosity despite a high loading of polymer. 1. A removable hot melt pressure sensitive adhesive comprising:at least one styrene-isoprene-styrene block copolymer being greater than 25% and no more than 50% by weight of the adhesive and having a diblock content of less than or equal to 45%;at least one tackifying resin being from 5% to 50% by weight of the adhesive;at least one liquid plasticizer being from 0% to 45% by weight of the adhesive of; anda stabilizer;wherein a 180° initial peel value to stainless steel of the adhesive is no greater than 4.0 pounds per linear inch.2. The adhesive of claim 1 , wherein the block copolymer is greater than 40% and no more than 50% by weight of the adhesive.3. The adhesive of claim 1 , wherein the tackifying resin is from 25% to 50% by weight of the adhesive.4. The adhesive of claim 1 , wherein the tackifying resin is from 40% to 50% by weight of the adhesive.5. The adhesive of claim 1 , wherein the liquid plasticizer is from 0% to 35% by weight of the adhesive.6. The adhesive of claim 1 , wherein the liquid plasticizer is from 5% to 30% by weight of the adhesive.7. The adhesive of claim 1 , wherein the liquid plasticizer is from 20% to 45% by weight of the adhesive.8. The adhesive of claim 1 , wherein a melt flow index of the block copolymer is at least 15 g/10 minutes (190° C./2.16 kg) or 10 g/10 minutes (200° C./5 kg).9. The adhesive of claim 1 , wherein a styrene content of the block copolymer is at least 14% by weight of the block copolymer.10. The adhesive of claim 1 , ...

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23-01-2020 дата публикации

ADHESIVE FILM ACTIVATABLE AT LOW TEMPERATURE

Номер: US20200024495A1
Принадлежит:

The invention relates to an adhesive composition that can be activated at a low temperature (from 110° C., preferably from 100° C.) and is available in the form of a film, and to the method for the production thereof. The invention also relates to a composition comprising at least one specific polyester polyol and at least one specific polyisocyanate dispersible in said polyester polyol in the presence of at least one specific organic solvent, and to the use of said composition for producing an adhesive composition that can be activated at a low temperature and is available in the form of a film. 115-. (canceled)16. A composition comprising:at least one saturated polyester polyol (A), including at least one saturated polyester polyol having a number-average molar mass (denoted Mn1) of greater than or equal to 15,000 g/mol (denoted A1), andat least one polyisocyanate of uretdione type (B) having at least two NCO groups,optionally at least one organic solvent (C) capable of dissolving the polyester polyol(s) (A) without dissolving the polyisocyanate(s) of uretdione type (B).17. The composition as claimed in claim 16 , comprising:from 75% to 95% by dry weight of at least one saturated polyester polyol (A), including at least one saturated polyester polyol (A1) having a number-average molar mass (denoted Mn1) of greater than or equal to 15,000 g/mol, with respect to the total dry weight of the composition, andfrom 5% to 25% by dry weight of at least one polyisocyanate (B) of uretdione type having at least two NCO groups, with respect to the total dry weight of the composition.18. The composition as claimed in claim 16 , wherein the polyester polyol(s) (A) is (are) amorphous or semicrystalline.19. The composition as claimed in claim 16 , wherein the saturated polyester polyol(s) (A1) is (are) semicrystalline and exhibit(s) a Tg of less than or equal to 0° C.20. The composition as claimed in claim 16 , wherein the saturated polyester polyol (A) is a mixture of saturated ...

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17-02-2022 дата публикации

HOT-MELT ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE RESIN LAMINATE

Номер: US20220049131A1
Принадлежит:

A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin. 1. A hot-melt adhesive resin composition comprising a modified polyolefin (A) in which a functional group is introduced into a polyolefin (A) , a solid phenol resin (B) , and a crosslinking agent (C) ,wherein the content of said modified polyolefin (A) is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of said modified polyolefin (A) and said solid phenol resin (B), andsaid modified polyolefin (A) and said crosslinking agent (C) are mixed so that a functional group possessed by said crosslinking agent (C) is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by said modified polyolefin (A).2. The hot-melt adhesive resin composition according to claim 1 , wherein said modified polyolefin (A) is a modified polyolefin modified with a carboxylic acid or a carboxylic anhydride.3. The hot-melt adhesive resin composition according to claim 1 , wherein said solid phenol resin (B) is a thermally melting type phenol resin.4. The hot-melt adhesive resin composition according to claim 1 , wherein said crosslinking agent (C) is one or more selected from the group consisting of an epoxy resin claim 1 , a phenoxy resin claim 1 , an isocyanate resin claim 1 , an oxazoline group-containing resin claim 1 , an amino group-containing resin claim 1 ...

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24-02-2022 дата публикации

AIR-PERMEABLE ADHESIVE SHEET AND BREATHABLE PRODUCT

Номер: US20220056310A1
Принадлежит: NITTO DENKO CORPORATION

An air-permeable adhesive sheet has air permeability in a thickness direction thereof and including an adhesive agent layer having first through holes extending in the thickness direction, wherein at least one surface of the adhesive agent layer forms an adhesive surface, the through holes have an average opening diameter of 1.0 to 50 μm and an average interval of 5 to 400 μm, and a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm. The air-permeable adhesive sheet is a sheet capable of obtaining good characteristics such as air permeability even when being made into a sheet having a small area. 1. An air-permeable adhesive sheet having air permeability in a thickness direction thereof , the air-permeable adhesive sheet comprising:an adhesive agent layer having first through holes extending in the thickness direction, whereinat least one surface of the adhesive agent layer forms an adhesive surface,the through holes have an average opening diameter of 1.0 to 50 μm,the through holes have an average interval of 5 to 400 μm, and{'sup': '2', '#text': 'a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm.'}2. The air-permeable adhesive sheet according to claim 1 , wherein the air-permeable adhesive sheet is a doubled-sided adhesive sheet that is unprovided with a substrate and in which each of both surfaces of the adhesive agent layer forms an adhesive surface.3. The air-permeable adhesive sheet according ...

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24-02-2022 дата публикации

LAMINATES HAVING PERFORATED STRUCTURAL BODY

Номер: US20220056316A1
Принадлежит: KURARAY CO., LTD.

A laminate is provided which includes a structural body including a base portion and a through hole and which can concurrently satisfy operability and stickiness during processes such as fitting, can be released with no or little adhesive residue, and also exhibits excellent adhesion to various adherends, especially metals. The laminate includes a substrate and a structural body disposed on the surface of at least one side of the substrate, the structural body including a base portion and a through hole. The base portion of the structural body includes an acrylic triblock copolymer (I) that includes two polymer blocks (A1) and (A2) each including methacrylic acid ester units and one polymer block (B) including acrylic acid ester units represented by the general formula CH═CH—COOR(1) (wherein Rdenotes a C1-C3 organic group). The acrylic triblock copolymer (I) has an (A1)-(B)-(A2) block structure and a weight average molecular weight of 50,000 to 250,000. The total content of the polymer blocks (A1) and (A2) is not more than 35 mass % of the acrylic triblock copolymer (I). 1. A laminate comprising a substrate and a structural body disposed on the surface of at least one side of the substrate , the structural body comprising a base portion and a through hole , wherein{'sub': '2', 'sup': ['1', '1'], '#text': 'the base portion of the structural body comprises an acrylic triblock copolymer (I) comprising two polymer blocks (A1) and (A2) each including methacrylic acid ester units and one polymer block (B) including acrylic acid ester units represented by the general formula CH═CH—COOR(1) (wherein Rdenotes a C1-C3 organic group), the acrylic triblock copolymer (I) having an (A1)-(B)-(A2) block structure and a weight average molecular weight of 50,000 to 250,000, the total content of the polymer blocks (A1) and (A2) being not more than 35 mass % of the acrylic triblock copolymer (I).'}2. A hot-melt adhesive member comprising the laminate described in . The present invention ...

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03-03-2022 дата публикации

CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME

Номер: US20220064491A1
Автор: Yamazaki Ryosuke
Принадлежит:

Provided is a curable silicone composition and applications thereof. The composition has hot-melt properties as a whole, superior workability and curing characteristics such as overmolding, as well as superior flexibility and stress relief properties of a cured product thereof, even when a relatively large amount of filler is blended. Also provided is a cured product with a relatively small coefficient of thermal expansion. A curable silicone composition, comprising: an organopolysiloxane resin where 20 mol % or more of the total siloxane units of the organopolysiloxane resin is siloxane units represented by SiO; and one or more functional fillers. A vinyl (CH—CH—) group content of curing reactive functional groups containing carbon-carbon double bonds is 0.05 to 1.50 mol % per 100 g of silicone component(s) in the composition. 1. A curable silicone composition that has hot-melt properties as a whole , comprising:{'sub': '4/2', 'an organopolysiloxane resin where 20 mol % or more of the total siloxane units of the organopolysiloxane resin is siloxane units represented by SiO; and'}one or more functional fillers;wherein a vinyl (CH2=CH—) group content of curing reactive functional groups containing carbon-carbon double bonds is 0.05 to 1.50 mol % per 100 g of silicone component(s) in the composition.2. The curable silicone composition according to claim 1 , comprising:{'sub': '4/2', '(A) 100 mass parts of an organopolysiloxane resin particulate having no hot-melt properties as a whole molecule, having at least one curing reactive functional group containing a at least one carbon-carbon double bond in the molecule, and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin particulate is siloxane units represented by SiO; making up at least 20 mol % or more of the total siloxane units;'}{'sub': '4/2', '(B) 300 to 600 mass parts of an organopolysiloxane resin particulate having no hot-melt properties as a whole molecule, not having a curing ...

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25-02-2021 дата публикации

ADHESIVE ELEMENT, OPENING CLOSED OFF WITH THE ADHESIVE ELEMENT, SUCH AS A CONSTRUCTION HOLE, A BODY HOLE, A PAINT DRAIN HOLE AND/OR A PAINT DRAIN OPENING, AND SYSTEM CONSISTING OF THE ADHESIVE ELEMENT AND A CARRIER ELEMENT

Номер: US20210054241A1
Принадлежит: SIKA TECHNOLOGY AG

An adhesive element including a cover layer and a self-adhering sealant, wherein the self-adhering sealant is a thermoactive or thermoactivated rubber compound. 1. An adhesive element comprisinga covering layer anda self-adhesive sealing composition,wherein the self-adhesive sealing composition is a thermoactive or thermoactivated rubber composition.2. The adhesive element as claimed in claim 1 , wherein the covering layer comprises a metal layer.3. The adhesive element as claimed in claim 1 , wherein the rubber composition is configured so that it is converted into a thermoactivated state by means of heating above a temperature threshold for a residence time.4. The adhesive element as claimed in claim 1 , wherein a thermoactive rubber composition comprises a first type of rubber claim 1 , a second type of rubber claim 1 , a hydrocarbon resin claim 1 , an organic crosslinker claim 1 , a catalyst claim 1 , a dye claim 1 , a thermal stabilizer and/or a moisture remover.5. The adhesive element as claimed in claim 1 , wherein the thermoactive rubber composition comprises a filler.6. The adhesive element as claimed in claim 1 , wherein a ratio of a proportion of rubber to the proportion of the fillers assumes a value in the range from 0.3 to 0.8.7. The adhesive element as claimed in claim 4 , whereina proportion of the first type of rubber assumes a value in the range from 5 to 25%,a proportion of the second type of rubber assumes a value in the range from 10 to 45%, and/ora proportion of the filler assumes a value in the range from 40% to 70%.8. The adhesive element as claimed in claim 1 , wherein the adhesive element displays a penetration force of from 300 to 1200 N.9. The adhesive element as claimed in claim 1 , wherein the rubber composition is sulfur-free.10. A process for producing an adhesive element claim 1 , as claimed in claim 1 , comprising the steps:provision of an adhesive element comprising a covering layer and a self-adhesive sealing composition ...

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13-02-2020 дата публикации

ADHESIVE FILM AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS

Номер: US20200048501A1
Принадлежит: Mitsui Chemicals Tohcello, Inc.

An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer. 1. An adhesive film used when sealing an electronic component with a sealing material in a step of manufacturing an electronic apparatus to temporarily fix the electronic component , the adhesive film comprising:a base material layer;an adhesive resin layer (A) which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component; andan adhesive resin layer (B) which is provided on a second surface side of the base material layer and of which adhesive strength decreases according to an external stimulus,wherein the adhesive resin layer (A) includes a polyvalent carboxylic acid ester-based plasticizer (X) and an adhesive resin (Y), anda content of the polyvalent carboxylic acid ester-based plasticizer (X) in the adhesive resin layer (A) is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin (Y) included in the adhesive resin layer (A).2. The adhesive film according to claim 1 ,wherein the polyvalent carboxylic acid ester-based plasticizer (X) includes ...

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10-03-2022 дата публикации

RADIATION STERILIZATION RESISTANT ADHESIVE

Номер: US20220072194A1
Автор: Ito Takeshi
Принадлежит:

Provided is a radiation sterilization resistant adhesive agent layer capable of reducing or preventing a decrease in wettability of an adhesive after radiation sterilization treatment. The adhesive can be used with a medical implement, for example medical implements that are sterilized. The adhesive agent layer includes a (meth)acrylic polymer and a wettability stabilizer, and the wettability stabilizer is at least one selected from a rosin ester resin, a terpene phenol resin, and hydrides thereof. 1. A medical member for skin application comprising:an adhesive agent layer resistant to radiation sterilization, the adhesive agent layer comprising:a (meth)acrylic polymer; anda wettability stabilizer, wherein the wettability stabilizer is selected from a rosin ester resin, a terpene phenol resin, and hydrides thereof.2. The medical member of claim 1 , further comprising:a medical implement.3. The medical member of claim 2 , wherein the medical implement is at least one selected from a backing claim 2 , dosing equipment claim 2 , communication equipment claim 2 , testing equipment claim 2 , and protective equipment.4. The medical member of claim 1 , wherein the wettability stabilizer is selected from a terpene phenol resin and a hydride thereof.5. The medical member of claim 1 , wherein a content of the wettability stabilizer in the adhesive agent layer is from 15 to 60 mass %.6. The medical member of claim 1 , wherein the adhesive agent layer is a hot melt type adhesive.7. The medical member of claim 1 , wherein a thickness of the adhesive agent layer is from 10 to 300 μm. The present disclosure relates to a radiation sterilization resistant adhesive. In particular, the adhesive can be used with medical member for skin application.In recent years, various adhesives have been used in the medical field. The adhesives used in such a field may be subjected to sterilization treatment with radiation such as gamma rays and electron beams.Patent Document 1 (JP 2002-114960 A; U ...

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10-03-2022 дата публикации

Olefin Block Copolymer-based Hot Melt Adhesive Composition

Номер: US20220073790A1
Автор: Chen Minrui, Li Weiyi
Принадлежит:

The present invention provides a hotmelt adhesive composition, comprising: (A) an olefin block copolymer of ethylene and octene, having a melt index of 10 to 35 g/10 min @ 190° C., 2.16 kg, preferably 15 to 30 g/10 min @ 190° C., 2.16 kg, and (B) a wax modified with carboxylic acid and/or carboxylic acid anhydride. 1) A hot melt adhesive composition , comprising:a) an olefin block copolymer of ethylene and octene, having a melt index of 10 to 35 g/10 min @ 190° C., 2.16 kg, preferably 15 to 30 g/10 min @ 190° C., 2.16 kg, andb) a wax modified with carboxylic acid and/or carboxylic acid anhydride.2) The composition of claim 1 , wherein the wax (B) is a polyolefin wax modified with maleic acid and/or maleic acid anhydride.3) The composition of claim 1 , wherein the wax (B) is a polypropylene wax modified with maleic acid and/or maleic acid anhydride claim 1 , or a polyethylene wax modified with maleic acid and/or maleic acid anhydride.4) The composition of claim 1 , wherein the wax (B) has an acid number of no less than 10 mg KOH/g claim 1 , preferably no less than 15 mg KOH/g.5) The composition of claim 1 , wherein the composition further comprises (C) a tackifier claim 1 , preferably selected from the group consisting of natural rosin claim 1 , a modified rosin claim 1 , a hydrogenated rosin claim 1 , a glycerol ester of a natural rosin claim 1 , a glycerol ester of a modified rosin claim 1 , a pentaerythritol ester of a natural rosin claim 1 , a pentaerythritol ester of a modified rosin claim 1 , a pentaerythritol ester of a hydrogenated rosin claim 1 , a copolymer of a natural terpene claim 1 , hydrogenated derivatives of a copolymer of a hydrogenated terpene claim 1 , a polyterpene resin claim 1 , hydrogenated derivatives of a phenol-based modified terpene resin claim 1 , an aliphatic petroleum hydrocarbon resin claim 1 , hydrogenated derivatives of an aliphatic petroleum hydrocarbon resin claim 1 , an aromatic petroleum hydrocarbon resin claim 1 , hydrogenated ...

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04-03-2021 дата публикации

CURABLE ADHESIVE COMPOSITION FOR DIE ATTACH

Номер: US20210062047A1
Принадлежит:

This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured. 1. A curable adhesive composition , comprising ,(1) a thermosetting or thermoplastic resin component,{'sub': '50', '(2) a plurality of particles of a first metal or alloy having a melting point no higher than 300° C. and a Dparticle size of from 10 μm to 100 μm,'}{'sub': '50', '(3) a plurality of particles of a second metal or alloy having a melting point higher than 300° C., and a Dparticle size of from 0.1 μm to less than 10 μm, and'}(4) optionally a curing agent.2. The curable adhesive composition according to claim 1 , wherein the thermosetting or thermoplastic resin component is selected from epoxy monomer claim 1 , epoxy oligomer claim 1 , epoxy polymer claim 1 , (meth)acrylic monomer claim 1 , (meth)acrylic oligomer claim 1 , (meth)acrylic polymer claim 1 , phenol-formaldehyde resin claim 1 , polyurethane claim 1 , cyanate ester claim 1 , polyvinyl alcohol claim 1 , a polyester claim 1 , polyurea claim 1 , polyvinyl acetal resin claim 1 , phenoxy resin claim 1 , maleimide claim 1 , bismaleimide claim 1 , nadimide claim 1 , itaconamide claim 1 , polyimide claim 1 , and mixture thereof.3. The curable adhesive composition according to claim 1 , wherein the particles of the first metal or alloy has a melting point from 50° C. to 300° C.4. The curable adhesive composition according to claim 1 , wherein the particles of the first metal or alloy comprise at least one of indium (In) claim 1 , germanium (Ga) claim 1 , bismuth (Bi) claim 1 , or tin (Sn).5. The curable adhesive composition according to claim 1 , wherein the particles of the first metal or alloy comprise essentially no lead (Pb) and cadmium (Cd) claim 1 , preferably comprise no Pb and Cd.6. The curable adhesive composition according to ...

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04-03-2021 дата публикации

DISPLAY SCREEN, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

Номер: US20210063789A1
Автор: LI Shaokun
Принадлежит:

The present disclosure provides a display screen, a manufacturing method thereof, and a display device. The display screen comprises a backlight module, a display panel, and an adhesive layer. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel, and corresponds to the non-display area. Material of the adhesive layer is a hot melt adhesive. 1. A display screen having a display area and a non-display area surrounding the display area , comprising:a backlight module;a display panel disposed on the backlight module;an adhesive layer disposed between the backlight module and the display panel, and corresponding to the non-display area;wherein material of the adhesive layer is a hot melt adhesive.2. The display screen according to claim 1 , wherein a curing temperature of the hot melt adhesive ranges from 40° C. to 60° C. claim 1 , and a melting temperature of the hot melt adhesive ranges from 80° C. to 100° C.3. The display screen according to claim 1 , wherein a width of the adhesive layer is less than 0.5 mm.4. The display screen according to claim 3 , wherein the width of the adhesive layer ranges from 0.2 mm to 0.3 mm.5. The display screen according to claim 1 , wherein a color of the adhesive layer is black.6. A manufacturing method of a display screen claim 1 , comprising:providing a backlight module and a display panel;forming an adhesive layer on the display panel;attaching the backlight module to a surface of the adhesive layer away from the display panel, wherein material of the adhesive layer is a hot melt adhesive.7. The manufacturing method of the display screen according to claim 6 , wherein the step of forming the adhesive layer on the display panel comprises: forming the adhesive layer on edges of one surface of the display panel by time pressure dispensing method.8. The manufacturing method of the display screen according to claim 6 , wherein the step of attaching the ...

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28-02-2019 дата публикации

ADHESIVE COMPOSITIONS

Номер: US20190062600A1
Принадлежит:

The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer and/or silicone polyurea block copolymer and a silicate tackifying resin. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer and a silicate tackifying resin in an amount of between about 0.1 wt % and about 20 wt %; or a silicone polyurea block copolymer and a silicate tackifying resin in an amount of between about 0.1 wt % and about 30 wt %. 1. An adhesive composition comprising:(a) a polydiorganosiloxane polyoxamide copolymer and a silicate tackifying resin in an amount of between about 0.1 wt % and about 20 wt %; or(b) a silicone polyurea block copolymer and a silicate tackifying resin in an amount of between about 0.1 wt % and about 30 wt %.2. The adhesive composition of claim 1 , wherein the adhesive composition is a pressure sensitive adhesive.4. The adhesive composition of claim 3 , wherein each Ris methyl and Ris hydrogen.5. The adhesive composition of claim 3 , wherein the copolymer has a first repeat unit where p is equal to 1 and a second repeat unit where p is at least 2.6. The adhesive composition of claim 3 , wherein G is an alkylene claim 3 , heteroalkylene claim 3 , arylene claim 3 , aralkylene claim 3 , polydiorganosiloxane claim 3 , or a combination thereof.7. The adhesive composition of claim 3 , wherein Y is an alkylene.8. The adhesive composition of claim 3 , wherein n is an integer of 40 to 500.9. The adhesive composition of claim 1 , wherein the silicate tackifying resin is an MQ silicate tackifying resin.10. The adhesive composition of claim 1 , wherein the tackifier is present in an amount of between about 5 weight percent and about 15 weight percent based on the weight of the adhesive composition.11. An article comprising:a substrate; and (a) a polydiorganosiloxane polyoxamide copolymer and a silicate tackifying resin in an amount of ...

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17-03-2022 дата публикации

HOT MELT PROCESSABLE (METH)ACRYLATE-BASED MEDICAL ADHESIVES

Номер: US20220081593A1
Принадлежит:

Adhesive articles include a substrate; and a hot melt processable pressure sensitive adhesive on the substrate. The hot melt processable pressure sensitive adhesive is a (meth)acrylate-based copolymer that is the reaction product of a reaction mixture that is free of acidic or basic monomers, and includes an alkyl (meth)acrylate, a hydroxyl-functional (meth)acrylate, and a photocrosslinker. The (meth)acrylate-based polymer is prepared in a thermoplastic package. 1. An article comprising:a substrate; and{'claim-text': [{'claim-text': [{'br': None, 'sub': '2', 'sup': ['1', '2'], '#text': 'CH═CR—(CO)—OR\u2003\u2003Formula I'}, {'sup': '1', '#text': 'wherein Ris hydrogen or a methyl group; and'}, {'sup': '2', '#text': 'Ris an alkyl, heteroalkyl, alkenyl, or aryl group; and'}], '#text': '70-96 parts by weight of a first (meth)acrylate monomer of general formula I:'}, {'claim-text': {'br': None, 'sub': '2', 'sup': ['1', '3'], '#text': 'CH═CR—(CO)—OR\u2003\u2003Formula II'}, '#text': '4-30 parts by weight of a second (meth)acrylate monomer of general formula II:'}, {'sup': '1', '#text': 'wherein Ris hydrogen or a methyl group; and'}, {'sup': '3', '#text': 'Ris a hydroxyl substituted alkyl group, a hydroxyl substituted heterocyclic group, a hydroxyl substituted aryl group, or'}, 'a hydroxyl substituted macromolecule; and', 'a co-polymerizable photocrosslinker.'], '#text': 'a hot melt processable pressure sensitive adhesive disposed on at least a portion of the substrate, the hot melt processable pressure sensitive adhesive comprising a (meth)acrylate-based copolymer that is the reaction product of a reaction mixture that is substantially free of acidic or basic monomers and comprising as the polymerizable components:'}2. The article of claim 1 , wherein the pressure sensitive adhesive further comprises particles of a thermoplastic polymer claim 1 , wherein the thermoplastic polymer comprises polyethylene claim 1 , ethylene vinyl acetate claim 1 , ethylene methyl acrylate ...

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24-03-2022 дата публикации

RE-WORKABLE ADHESIVES FOR ELECTRONIC DEVICES

Номер: US20220089913A1

The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about wt % to about wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about wt % to about wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature. 1. A re-workable adhesive for an electronic device comprising:a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive, wherein the holt-melt adhesive has a reduced bond strength at an elevated temperature; anda pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.2. The re-workable adhesive of claim 1 , wherein the hot-melt adhesive comprises an ethylene vinyl acetate adhesive claim 1 , a polypropylene adhesive claim 1 , a polyamide adhesive claim 1 , a polyurethane adhesive claim 1 , or a combination thereof.3. The re-workable adhesive of claim 1 , wherein the pressure-sensitive adhesive comprises an epoxy adhesive claim 1 , an acrylic adhesive claim 1 , a polyurethane acrylate adhesive claim 1 , a silicone-based adhesive claim 1 , acrylic-based adhesive claim 1 , natural rubber-based adhesive claim 1 , styrene-butadiene rubber-based adhesive claim 1 , styrenic block copolymer-based adhesive claim 1 , or a combination thereof.4. The re-workable adhesive of claim 1 , wherein the hot ...

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18-03-2021 дата публикации

JOINT SUPPORT INCLUDING ENCAPSULATED ADHESIVE

Номер: US20210079273A1
Принадлежит:

The present disclosure relates generally to building surface joint supports, for example, suitable for covering a seam between two building surface panels, such as drywall. The present disclosure relates more particularly to a joint support including an encapsulated adhesive for securing the joint support to the building surface panels. The joint support includes a support strip having a width, a length, a first end, a second end, a contact surface, and an outer surface. An adhesive is disposed on the contact surface of the support strip. The adhesive includes a first set of capsules and each capsule of the first set of capsules includes a membrane enclosing a first component of an adhesive composition. 1. A joint support comprising:a support strip including a width, a length, a first end, a second end, a contact surface and an outer surface; and 'a first set of capsules, each capsule of the first set of capsules including an outer membrane enclosing a first component of an adhesive composition.', 'an adhesive substance disposed on the contact surface of the support strip, the adhesive substance including2. The joint support according to claim 1 , wherein the adhesive substance includes a second component of the adhesive composition.3. The joint support according to claim 2 , wherein the second component is disposed outside of the capsules.4. The joint support according to claim 3 , wherein the first set of capsules is embedded in the second component.5. The joint support according to claim 2 , wherein the adhesive substance includes a second set of capsules claim 2 , and wherein the second component is disposed in the capsules of the second set of capsules.6. The joint support according to claim 1 , wherein the capsules of the first set of capsules are configured to release the first component upon the application of a stimulus.7. The joint support according to claim 6 , wherein the stimulus is the application of pressure.8. The joint support according to claim 7 , ...

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25-03-2021 дата публикации

METHODS OF SEALING OF MULTILAYER, MONOLITHIC LAYER AND COMPOSITES OF ETFE AND ITS ALTERNATIVES FOR ROOFING APPLICATIONS

Номер: US20210087012A1
Принадлежит:

A heat and/or UV/LED activated single or double-sided tape is configured to seal multiple sheets of single or multilayer composite film with the film including an outer fluoropolymer layer. A repair kit includes a single-sided and/or double-sided heat and UV/LED activated adhesive tape, portable surface treater, and portable heat/UV/LED generating device. The single-sided and/or double-sided heat and UV/LED activated adhesive tape is useful in the manufacturing of architectural applications and in repair of architectural applications. 1. A film assembly for use in architectural applications , the film assembly comprising:a first film having a first layer formed from a fluorinated polymer; anda tape including a backing layer formed from a fluorinated polymer and a first adhesive layer disposed on a first major surface of the backing layer, the first adhesive layer configured to adhere to the first layer of the first film.2. The film assembly of claim 1 , wherein the fluorinated polymer forming the backing layer is one of ETFE and ECTFE.3. The film assembly of claim 2 , wherein the first layer of the first film is formed from the same material as the backing layer.4. The film assembly of claim 1 , wherein the first adhesive layer is formed from a heat activated adhesive.5. The film assembly of claim 4 , wherein the heat activated adhesive comprises at least one of Bostik LADH 7060 TM claim 4 , Lumiflon® (Asahi Glass) claim 4 , Zeffle® (Daikin) claim 4 , Zendura® C100 (Honeywell) claim 4 , DESMODUR BL 3370 MPA (Covestro) claim 4 , DESMODUR BL 3475 BA/SN (Covestro) claim 4 , DESMODUR PL 350 MPA/SN (Covestro) claim 4 , DESMODUR PL340 BA/SN (Covestro) claim 4 , DESMODUR 3300 (Covestro) claim 4 , DESMODUR 3800 (Covestro) claim 4 , Impranil® ELH-A (Covestro) claim 4 , Silmer OHT (Siltech) claim 4 , Silmer NH (Siltech) claim 4 , Silmer NCO (Siltech) claim 4 , Silmer ACR (Siltech) claim 4 , Silmer OH ACR (Siltech) claim 4 , Silmer EP (Siltech) claim 4 , or Terathane ( ...

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05-05-2022 дата публикации

LOW THERMAL EXPANSION FILM ADHESIVES FOR MULTILAYER TRANSPARENT ARMOUR AND RELATED APPLICATIONS

Номер: US20220135846A1
Принадлежит:

The present disclosure is directed to a composite material comprising a thermoplastic adhesive and nanotubes oriented in the in-plane orientation. In additional aspects, the disclosure includes a laminated armor material comprising the composite and armor materials.

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05-05-2022 дата публикации

ADHESIVE RESIN COMPOSITION AND EASILY PEELABLE FILM

Номер: US20220135849A1
Принадлежит:

An adhesive resin composition contains an ethylene-vinyl acetate copolymer (A) in which a content of a structural unit derived from vinyl acetate is 3% by mass or more and 18% by mass or less, and a melt mass flow rate (MFR, JIS K 7210:1999, 190° C., 2160 g load) is 5 g/10 min or more and 40 g/10 min or less, a tackifier resin (B), and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000 mPa·s or more and 300,000 mPa·s or less measured at 18° C. using a Brookfield viscometer.

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12-05-2022 дата публикации

Resin sheet

Номер: US20220145151A1
Принадлежит: Lintec Corp

A resin sheet is made of a resin composition containing a (A) heat-curable component. The (A) heat-curable component contains a (A1) first maleimide resin. The (A1) first maleimide resin is a maleimide resin having two or more maleimide groups in one molecule, at least a pair of the maleimide groups being bonded by a binding group whose main chain includes four or more methylene groups.

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08-04-2021 дата публикации

PRIMER-INITIATED CURE OF STRUCTURAL ADHESIVE FILM

Номер: US20210102097A1
Принадлежит:

Curable adhesive films, primers for adhesion of curable adhesive films, and adhesive systems comprising adhesive films and primers are provided. In some embodiments, an adhesive system comprises: I) a curable adhesive free-standing film comprising a blend of: a) a first film-forming polymer or oligomer; b) a first species comprising first unsaturated free-radically polymerizable groups, which may be a) or a species other than a); and c) a first transition metal cation; and II) a primer for adhesion of a curable adhesive free-standing film to a first substrate comprising an oxidizing agent. In some embodiments, an adhesive system comprises: I) a curable adhesive free-standing film comprising an outer surface bearing embossed air bleed channels capable of aiding in escape of air during application of the outer surface to a primed substrate; and II) a primer comprising components that initiate cure of the curable adhesive free-standing film. 1. A curable adhesive free-standing film comprising a blend of:a) a second film-forming polymer or oligomer;b) a second species comprising second unsaturated free-radically polymerizable groups, which may be a) or may be a species other than a);c) a reducing agent which is not a) or b) and which does not comprise a transition metal, nitrogen or sulfur;wherein the curable adhesive free-standing film is a hot melt processable adhesive.2. The curable adhesive free-standing film according to wherein b) is a).3. The curable adhesive free-standing film according to wherein b) is a species other than a) claim 1 , wherein a) does not comprise unsaturated free-radically polymerizable groups.4. The curable adhesive free-standing film according to wherein the curable adhesive free-standing film comprises an outer surface bearing embossed air bleed channels capable of aiding in escape of air during application of the outer surface to a substrate.5. An adhesive system comprising: d) a first film-forming polymer or oligomer;', 'e) a species ...

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23-04-2015 дата публикации

Tape comprising multi-activation adhesives

Номер: US20150111010A1
Принадлежит: HB Fuller Co

An adhesive tape or string, comprising: a substrate having a first surface and an opposing second surface, and defining a longitudinal direction; and an adhesive system comprising at least a first adhesive section and a second adhesive section, wherein the first adhesive section and the second adhesive section each contact the first surface of the substrate, and wherein the first adhesive section comprises a first heat-activatable hot melt adhesive having a first activation temperature range and a first set time and the second adhesive section comprises a second heat-activatable hot melt adhesive having a second activation temperature range and a second set time, and wherein: the first activation temperature range is different than the second activation temperature range; or the first set time is different than the second set time; or the first activation temperature range is different than the second activation temperature range and the first set time is different than the second set time.

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11-04-2019 дата публикации

ADHESIVE AND DAMPING FILM

Номер: US20190106603A1
Принадлежит:

Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between −40° C. and −10° C., and the adhesive has a heat activation temperature between 20° C. and 100° C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent. 1. An adhesive comprising:a polyester at 20 to 50 weight percent, the polyester having a glass transition temperature between −40° C. and −10° C.;a first tackifier at 30 to 60 weight percent; anda first olefin-styrene block copolymer at 5 to 30 weight percent,wherein the adhesive has a heat activation temperature between 20° C. and 100° C.2. The adhesive of claim 1 , wherein the polyester comprises at least one crosslinkable moiety claim 1 , each crosslinkable moiety including at least one crosslinkable pendent group claim 1 , wherein a ratio of a total number of the at least one crosslinkable pendent groups to a total number of ester groups in the polyester is in a range of 0.0001 to 0.5.3. The adhesive of claim 1 , wherein the polyester comprises at least one crosslinkable moiety claim 1 , each crosslinkable moiety including at least one crosslinkable pendent group claim 1 , wherein a ratio of a total number of the at least one crosslinkable moiety to a total number of ester groups in the polyester is in a range of 0.0001 to 0.5.4. The adhesive of claim 1 , wherein the polyester comprises the reaction product of reactive precursors claim 1 , the reactive precursors comprising:at least one diacid or diester;at least one diol not containing a crosslinkable pendent group; andat least one monomer containing at least one crosslinkable pendent group;wherein a ratio of the number of ...

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09-06-2022 дата публикации

WEB LINER WITH PARTIALLY EMBEDDED FILAMENTS

Номер: US20220177744A1
Принадлежит:

A release liner having filaments contacted to a major side thereof, then pressed thereinto. The filaments may be a thermoplastic or thermoset type material. 1. A film-based article comprising:a release liner having first and second major sides; and,a plurality of filaments disposed on the first major side of the liner.2. The film-based article of claim 1 , wherein the filaments comprise thermoplastic extrusions having a high aspect ratio.3. The film-based article of claim 1 , wherein the filaments comprise hot melt adhesive material.4. The film-based article of claim 1 , wherein the filaments have an average cross section of less than 50 μm but greater than 5 μm.5. The film-based article of claim 4 , wherein the release liner comprises a polyester-based film.6. The film-based article of claim 4 , wherein the first major side of liner comprises a release coating.79-. (canceled)10. The film-based article of claim 4 , wherein some portions of the filaments are at least partially embedded into the liner claim 4 , and some portions of the filaments sit above the first major surface of the liner.11. The film-based article of claim 10 , wherein the release liner comprises a roll of release liner claim 10 , and wherein the roll of release liner has a down-web dimension and a cross-web dimension.1213-. (canceled)14. The film-based article of claim 11 , wherein filaments have a down-web orientation.15. The film-based article of claim 1 , wherein the filaments comprise filaments less than about 3 inches long.1617-. (canceled)18. The film-based article of claim 15 , wherein the filaments comprise filaments less than about ½ inch long.19. The film-based article of claim 1 , wherein the filaments comprise a first set of filaments oriented in a first direction claim 1 , and a second set of filaments oriented approximately orthogonal to the first direction.20. The film-based article of claim 1 , wherein the filaments comprise a plurality of repeating claim 1 , regularly spaced ...

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13-05-2021 дата публикации

ENCAPSULATED FOIL LEATHER TRANSFER

Номер: US20210138943A1
Принадлежит:

A leather product such as a leather covering for a vehicular part includes a segment of leather with a base coat applied to a hide side and a color coat applied to the base coat to create an intermediate stage leather segment. A foil transfer is embossed into and secured with an adhesive to the intermediate stage leather segment. A top coat is then applied to the foil transfer and a surrounding portion of the intermediate stage leather segment after the foil transfer is secured to complete the leather product. A system and method of making the leather product is also disclosed. 1. A leather covering for a vehicle part comprising:a segment of leather having a hide side and a flesh side;a base coat applied to the hide side;a color coat applied to the base coat to create a finished leather segment;a foil transfer embossed into and secured with an adhesive to the finished leather segment; anda top coat applied to the foil transfer and a surrounding portion of the finished leather segment after the foil transfer is secured to the finished leather segment.2. The leather covering of claim 1 , wherein the color coat comprises about 30-55 wt. % polyurethane claim 1 , about 0-20 wt. % acrylic claim 1 , and up to about 15 wt. % additives as a dispersion on an aqueous solution claim 1 , based on total weight of the color coat.3. The leather covering of claim 1 , wherein the color coat is free of isocyanates and silicones.4. The leather covering of claim 1 , wherein the adhesive is a heat-activated adhesive that is heated while the foil transfer is being embossed into the finished leather segment.5. The leather covering of claim 1 , wherein the top coat comprises about 5-10 wt. % silicon and up to about 10 wt. % isocyanate crosslinkers as a dispersion in an aqueous solution claim 1 , based on total weight of the top coat.6. The leather covering of claim 1 , wherein the top coat is free of any color pigmentation.7. A method of applying a foil transfer to a leather component ...

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25-08-2022 дата публикации

SUSPENDED PARTICLE DEVICES WITH IMPROVED ADHESION BETWEEN THE ACTIVE AND CONDUCTING LAYERS

Номер: US20220269141A1
Принадлежит:

A suspended-particle device with improved adhesion between the active and conductive layers is disclosed. The conductive layers are coated with an adhesion promoter that comprises at least one organosilane that covalently bonds to the surface of the conductive layer and comprises a cross-linkable moiety such as an acrylate. The active layer comprises a suspension of active particles in a polymer matrix that comprises a polymer having pendant cross-linkable moieties such as acrylates. Upon curing (e.g. by irradiation by ultraviolet light), the polymer matrix of the active layer cross-links with the cross-linkable moieties of the adhesion promoter, thereby binding the active and conductive layers. 124.-. (canceled)26. The SPD according to claim 25 , wherein at least one of said transparent layers comprises PET.27. The SPD according to claim 25 , wherein at least one of said conductive layers comprises ITO.28. The SPD according to claim 25 , wherein said active particles comprise polyhalide light polarizing materials comprising a complex obtained by reacting elemental iodine; a hydrohalide acid or an ammonium halide claim 25 , alkali metal halide or alkaline earth metal halide; a first compound comprising a pyrazine-2 claim 25 ,5-dicarboxylic acid; and a second compound comprising a mono-alkyl ester or a mono-amide of a pyrazine-2 claim 25 ,5-dicarboxylic acid.29. The SPD according to claim 25 , wherein said active particles are the product of a process that comprises reacting in a suitable liquid elemental iodine; an inorganic halide; and a substantially rigid polycyclic precursor compound that has two cyclic structures linked together via an aromatic or heteroaromatic group claim 25 , a three-dimensional structure that is defined by the two cyclic structures and has only one opening into the cavity claim 25 , at least one polar group on the outside of the polycyclic precursor compound claim 25 , and at least one chelating group for chelating hydrogen or metal ions ...

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27-05-2021 дата публикации

HOT MELT TAPE FOR HOOK-AND-LOOP FASTENERS WITHOUT SEWING AND METHOD FOR MANUFACTURING SEAT PADDING MATERIAL FOR VEHICLES USING THE SAME

Номер: US20210155828A1
Принадлежит:

Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C. 1. A hot melt tape for hook-and-loop fasteners without sewing used to adhere a hook-and-look fabric to a padding material for a vehicle seat , comprising:a release paper; anda hot melt resin layer coated on a surface of the release paper, wherein the hot melt resin layer is formed by coating on the surface of the release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting.2. The hot melt tape according to claim 1 , wherein the reactive hot melt resin comprises a base resin claim 1 ,wherein the base resin comprises polyol acquired by reacting polycaprolactone (PCL) having a melting point of 50-70° C. and polyester polyol with each other.3. The hot melt tape according to claim 2 , wherein the reactive hot melt resin comprises 0.5-2 wt % of montmorillonite (MMT) and a balance of the base resin.4. A method for manufacturing a seat padding material for vehicles claim 2 , comprising:preparing a padding material for a seat for the vehicles and a hook-and-loop fabric;preparing a hot melt tape having a hot melt resin layer formed by coating a surface of a release paper with a ...

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17-05-2018 дата публикации

SELF-FOAMING HOT MELT ADHESIVE COMPOSITIONS AND METHODS OF MAKING AND USING SAME

Номер: US20180133728A1
Принадлежит:

The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing. 1. A method for making a self-foaming hot melt adhesive composition comprising:dispersing a chemical blowing agent in a carrier to form a concentrate; andadmixing the concentrate into a base hot melt adhesive composition at a temperature above the melt temperature of the base hot melt adhesive composition but below a decomposition temperature of the chemical blowing agent to form an admixture; andcooling the admixture to obtain the self-foaming hot melt adhesive composition;wherein the chemical blowing agent is in the form of a powder with an average particle size within the range of 3 to 100 microns, and (1) a liquid that is compatible with the base hot melt adhesive composition, or', '(2) a molten low viscosity component of the base hot melt adhesive composition., 'wherein the carrier is either'}2. The method according to wherein the chemical blowing agent is selected from the group consisting of azodicarbonamide claim 1 , oxybis(benzenesulfonylhydrazide) claim 1 , toulenesulfonylhydrazide claim 1 , trihydrazinotriazine claim 1 , p-toulenesulfonyl semicarbazide claim 1 , sodium bicarbonate and potassium bicarbonate.3. The method according to claim 1 , wherein the chemical blowing agent is activated ...

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08-09-2022 дата публикации

THERMALLY SOFTENABLE STRIP AND METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES

Номер: US20220282126A1
Принадлежит: TESA SE

The invention relates to a strip for covering elongated articles, comprising a carrier in the form of a strip, characterized in that at least one side of the carrier in the form of a strip is provided with a plastic material that thermally softens at a temperature of preferably 100° C. to 135° C. and that comprises a thermoplastic material. 1. A tape for jacketing elongated articles , comprising a tapelike carrier , wherein the tapelike carrier is provided on at least one side with a plastic which comprises a thermoplastic and which is thermally softenable.2. The tape as claimed in claim 1 , wherein the thermally softenable plastic has a softening or melting temperature of >100° C.3. The tape as claimed in claim 2 , wherein the thermally softenable plastic is a polyolefin or a mixture of a polyolefin and another thermoplastic.4. The tape as claimed in claim 1 , wherein the carrier material comprises a polyester nonwoven.5. The tape as claimed in claim 1 , wherein the softenable plastic has sunk into the carrier to an extent of more than 10%.6. A method for jacketing elongated articles claim 1 , said method comprising softening a coated tape as claimed in by supplying heat at a temperature between 130° C. and 150° C. and subsequently guiding the tape in a helical line around the elongated article or wrapping the elongated article in an axial direction with the tape claim 1 , bringing the elongated article together with the tape into a desired disposition claim 1 , and holding the elongated article in this disposition until the tape has solidified again by cooling.7. The method as claimed in claim 6 , wherein the softenable plastic is softened by the supply of thermal energy at a temperature of 110° C. to 140° C.8. The method as claimed in claim 6 , wherein the thermal energy is supplied over a period of 0.5 sec to 2 min.9. A jacketed elongated article obtained according to .10. A vehicle comprising a jacketed elongated article as claimed in . This application is a ...

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08-09-2022 дата публикации

HOT MELT ADHESIVE SHEET

Номер: US20220282136A1
Принадлежит: NITTO SHINKO CORPORATION

The present invention is a hot melt adhesive sheet including an adhesive layer including a hot melt adhesive, in which the hot melt adhesive includes either a styrene-ethylene-ethylene-propylene-styrene block copolymer or a styrene-ethylene-propylene-styrene block copolymer, and a hydrogenated alicyclic hydrocarbon petroleum resin, and the hot melt adhesive sheet has a glass transition temperature falling within a range of −10° C. or more and 10° C. or less. 1. A hot melt adhesive sheet comprising an adhesive layer comprising a hot melt adhesive , whereinthe hot melt adhesive comprises either a styrene-ethylene-ethylene-propylene-styrene block copolymer or a styrene-ethylene-propylene-styrene block copolymer, and a hydrogenated alicyclic hydrocarbon petroleum resin, andthe hot melt adhesive sheet has a glass transition temperature falling within a range of −10° C. or more and 10° C. or less.2. The hot melt adhesive sheet according to claim 1 , wherein a styrene content in the styrene-ethylene-ethylene-propylene-styrene block copolymer is 15 mass % or more.3. The hot melt adhesive sheet according to claim 1 , wherein a styrene content in the styrene-ethylene-propylene-styrene block copolymer is 15 mass % or more.4. The hot melt adhesive sheet according to claim 1 , whereinthe hot melt adhesive comprises 20 mass parts or more and 80 mass parts or less of the hydrogenated alicyclic hydrocarbon petroleum resin based on 100 mass parts of either the styrene-ethylene-ethylene-propylene-styrene block copolymer or the styrene-ethylene-propylene-styrene block copolymer.5. The hot melt adhesive sheet according to claim 1 , wherein a softening point of the hydrogenated alicyclic hydrocarbon petroleum resin is 140° C. or less.6. The hot melt adhesive sheet according to claim 1 , wherein the hot melt adhesive further comprises a terpene modified phenol resin.7. The hot melt adhesive sheet according to claim 6 , wherein a softening point of the terpene modified phenol resin is 100 ...

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08-09-2022 дата публикации

TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY, TEMPORARY PROTECTIVE BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Номер: US20220285200A1
Принадлежит:

A temporary protective film including a support film and an adhesive layer provided on one surface or both surfaces of the support film. The support film is a polyimide film. The thickness of the adhesive layer is less than 8 μm. 1. A temporary protective film comprising:a support film; andan adhesive layer provided on one surface or both surfaces of the support film,wherein the support film is a polyimide film, anda thickness of the adhesive layer is less than 8 μm.2. The temporary protective film according to claim 1 , wherein the thickness of the adhesive layer is less than 5 μm.3. The temporary protective film according to claim 1 , wherein the adhesive layer comprises at least one organic polymer selected from an aromatic polyamide claim 1 , an aromatic polyester claim 1 , an aromatic polyimide claim 1 , an aromatic polyamideimide claim 1 , an aromatic polyether claim 1 , an aromatic polyetheramideimide claim 1 , an aromatic polyetherimide claim 1 , an aromatic polyesterimide claim 1 , and an aromatic polyetherimide.5. The temporary protective film according to claim 1 , wherein when the adhesive layer is heated for 10 minutes at 120° C. and then heated for 20 minutes at 240° C. claim 1 , a proportion of weight reduction caused by heating for 20 minutes at 240° C. is less than 0.5% with respect to the weight of the adhesive layer before heating for 20 minutes at 240° C.6. The temporary protective film according to claim 1 , wherein the adhesive layer is configured to have a 90-degree peel strength claim 1 , between the adhesive layer and a lead frame as well as a sealing layer claim 1 , of 600 N/m or less at 180° C. when the temporary protective film is attached to a lead frame having a die pad and an inner lead such that the adhesive layer comes into contact with the lead frame claim 1 , a semiconductor element is mounted on a surface of the die pad claim 1 , the surface being on the opposite side of the temporary protective film claim 1 , subsequently the ...

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07-05-2020 дата публикации

ADHESIVE LAYERS

Номер: US20200139673A1

An example device includes a first layer having a first layer surface and a second layer having a second layer surface. A pressure sensitive adhesive is applied to the first layer surface of the first layer, and a curable adhesive is applied to the second layer surface of the second layer. The curable adhesive and the pressure sensitive adhesive are joined to adhere the first layer to the second layer. 1. A device , comprising:a first layer having a first layer surface;a second layer having a second layer surface;a pressure sensitive adhesive applied to the first layer surface of the first layer; anda curable adhesive applied to the second layer surface of the second layer,wherein the curable adhesive and the pressure sensitive adhesive are joined to adhere the first layer to the second layer.2. The device of claim 1 , wherein the curable adhesive is at least one of a UV-curable adhesive or a heat-curable adhesive.3. The device of claim 1 , wherein the first layer is formed of glass and the second layer is formed of a molded plastic claim 1 , and wherein the first layer surface of the first layer is substantially flat and the second layer surface of the second layer is non-flat.4. The device of claim 1 , wherein the first layer and the second layer have substantially different thermal expansion coefficients.5. The device of claim 1 , wherein the pressure sensitive adhesive has a glass transition temperature of between about 0 degrees Celsius and about −50 degrees Celsius.6. The device of claim 1 , wherein the curable adhesive has a viscosity of between about 1000 centipoise and about 25000 centipoise.7. An apparatus claim 1 , comprising:a frame having a non-flat surface, the non-flat surface having a first thermal expansion coefficient;a cover layer having at least one substantially flat surface and having a second thermal expansion coefficient, the first thermal expansion coefficient and the second thermal expansion coefficient being different;a curable adhesive ...

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16-05-2019 дата публикации

ADHESIVE PRODUCT

Номер: US20190144715A1
Автор: IWASE Hiroki, Nagai Yutaka
Принадлежит:

An object of the present invention is to provide a thermoplastic adhesive product that can be automatically and continuously supplied to a hot melt tank and that can be produced easily. Provided is a thermoplastic adhesive product which is a long object in the form of a string or a sheet including a thermoplastic adhesive and which is rollable. 1. A thermoplastic adhesive product which is a long object in the form of a string or a sheet and which is rollable , the long object comprising a thermoplastic adhesive.2. The thermoplastic adhesive product according to claim 1 , wherein the thermoplastic adhesive constitutes a core part of the thermoplastic adhesive product claim 1 , the core part having a surface thereof partially or entirely coated with a non-adhesive material.3. The thermoplastic adhesive product according to claim 1 , wherein the thermoplastic adhesive product has a cross section whose inner diameter is 5 mm to 300 mm claim 1 , the cross section being perpendicular to a lengthwise direction of the long object.4. The thermoplastic adhesive product according to claim 1 , wherein the thermoplastic adhesive product has a storage modulus of not more than 5.0×106 Pa and an elongation at break of not less than 200%.5. A roll of the thermoplastic adhesive product recited in . The present invention relates to an adhesive product.Thermoplastic adhesives, which are heated to melt into liquid state prior to application, are in solid state at room temperature. Generally, thermoplastic adhesive products are provided in the form of blocks, and are heated to melt when used. However, such general thermoplastic adhesive products have an issue in that they may unite with each other because of heat or stress they have experienced during, for example, storage before use, and/or that a thermoplastic adhesive sticks to a packing container, and are therefore difficult to handle.Some techniques have been proposed to address the above issue. Known examples of such techniques ...

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16-05-2019 дата публикации

STRUCTURAL ADHESIVE FILM, METAL MEMBER ASSEMBLY, AND METHOD FOR MANUFACTURING THE SAME

Номер: US20190144718A1
Автор: AIZAWA Takuma
Принадлежит:

A structural adhesive film is provided whereby both adhesion and edge coverage can be achieved. The structural adhesive film () includes a first curable resin layer () containing a first thermosetting resin and a first foaming agent; and a second curable resin layer () containing a second thermosetting resin. A curing temperature of the first curable resin layer () is lower than a curing temperature of the second curable resin layer (); and a foaming starting temperature of the first foaming agent is lower than the curing temperature of the first curable resin layer (). 1. A structural adhesive film comprising:a first curable resin layer containing a first thermosetting resin and a first foaming agent; anda second curable resin layer containing a second thermosetting resin;a curing temperature of the first curable resin layer being lower than a curing temperature of the second curable resin layer; anda foaming starting temperature of the first foaming agent being lower than the curing temperature of the first curable resin layer.2. The structural adhesive film according to claim 1 , wherein a difference between the curing temperature of the first curable resin layer and the curing temperature of the second curable resin layer is 5° C. or greater.3. The structural adhesive film according to claim 1 , wherein the second curable resin layer further comprises a second foaming agent.4. The structural adhesive film according to claim 3 , wherein a foaming starting temperature of the second foaming agent is higher than the curing temperature of the first curable resin layer.5. The structural adhesive film according to claim 1 , to wherein the first thermosetting resin and the second thermosetting resin are epoxy resins.6. The structural adhesive film according to claim 1 , wherein the first curable resin layer and the second curable resin layer further comprises acrylic resins.7. A method for manufacturing a metal member assembly comprising:{'claim-ref': {'@idref': 'CLM- ...

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07-05-2020 дата публикации

SILICONE COMPOSITIONS AND ARTICLES FOR CONTROLLING LIGHT

Номер: US20200144459A1
Принадлежит:

Disclosed is a method of making an optoelectronic device that incorporates a crosslinked resin-linear polyorganosiloxane. 1. A method of manufacturing an optoelectronic device comprising:i) providing a substrate wherein the substrate comprises one or more electro-optic component arranged on at least one surface of the substrate;ii) contacting the surface of the electro-optic component parallel to the substrate with a lateral filler film comprising a filler and a curable silicone hot melt;iii) contacting the lateral filler film with a release liner; andiv) applying pressure to create the optoelectronic device.2. The method of wherein the electro-optic component is a light emitting diode.3. The method of wherein the curable silicone hot melt is a crosslinkable resin-linear polyorganosiloxane formulation.4. The method of wherein the lateral filler film is uncured prior to applying pressure.5. The method of wherein the filler comprises a compound selected from the group consisting of Ti0 claim 1 , BN claim 1 , Si0 claim 1 , Al0 claim 1 , ZnO claim 1 , BaS0 claim 1 , and mixtures thereof.6. The method of wherein after pressure is applied claim 1 , a residue is formed on the top surface of the electro-optic component and is further removed.7. The method of wherein the residue on the top surface of the electro-optic component is removed by wiping with a solvent.8. The method of wherein the solvent comprises isopropyl alcohol claim 7 , acetone claim 7 , heptane claim 7 , octane claim 7 , propylpropionate claim 7 , toluene claim 7 , and mixtures thereof.9. The method of further comprisingi) applying a wavelength conversion layer on top of the created optoelectronic device; andii) curing simultaneously.10. An optoelectronic device manufactured by the method of .11. (canceled)12. An optoelectronic device manufactured by the method of .13. The method of wherein the electro-optic component is an LED chip claim 1 , and wherein after pressure is applied claim 1 , a residue is ...

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22-09-2022 дата публикации

ALKALI-DISPERSIBLE HOT MELT PRESSURE-SENSITIVE ADHESIVE

Номер: US20220298392A1
Автор: Takamori Ai
Принадлежит:

The object of the present invention is to provide an alkali-dispersible hot melt pressure-sensitive adhesive which (i) has a high alkali-dispersibility, (ii) is excellent in strength to retain a label, (iii) hardly causes an adhesive residue problem and (iv) is capable of reducing stringing. The present invention relates to an alkali-dispersible hot melt pressure-sensitive adhesive comprising: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, (B) a tackifier resin and (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, wherein the component (C) comprises (C1) a fatty acid derivative having a melting point of 40° C. or more. 1. An alkali-dispersible hot melt pressure-sensitive adhesive comprising:(A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound,(B) a tackifier resin and(C) at least one selected from the group consisting of a fatty acid and a derivative thereof,wherein the fatty acid and the derivative thereof (C) comprises (C1) a fatty acid derivative having a melting point of 40° C. or more.2. The alkali-dispersible hot melt pressure-sensitive adhesive according to claim 1 , wherein the component (C1) comprises a hardened oil.3. The alkali-dispersible hot melt pressure-sensitive adhesive according to claim 2 , wherein the hardened oil comprises a hydrogenated castor oil.4. A label comprising the alkali-dispersible hot melt pressure-sensitive adhesive according to .5. A container comprising the label according to . The present invention relates to an alkali-dispersible hot melt pressure-sensitive adhesive suitable as a pressure-sensitive adhesive for label of glass bottles, PET (polyethylene terephthalate) bottles, or the like, and particularly relates to an alkali-dispersible hot melt pressure-sensitive adhesive effectively used for bonding a PET bottle for a carbonated ...

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22-09-2022 дата публикации

LAMINATE, PRODUCTION METHOD THEREFOR, AND AUTOMOTIVE EXTERIOR MATERIAL

Номер: US20220298397A1
Принадлежит: MITSUBISHI CHEMICAL CORPORATION

A laminate produced by laminating a plurality of materials having different linear expansion coefficients via an adhesive agent and is less liable to warp after the adhesive agent is heat-cured. The laminate has a structure including a first material, an adhesive agent layer, and a second material. The first material and the second material have different linear expansion coefficients, and the adhesive agent layer contains an adhesive agent having a warpage reduction index of not less than 30 as calculated from the following expression (1): 1. A laminate comprising a first material , an adhesive agent layer , and a second material provided in this order ,wherein the first material and the second material have different linear expansion coefficients, andwherein the adhesive agent layer comprises an adhesive agent having a warpage reduction index of not less than 30,the warpage reduction index of the adhesive agent being determined by: an aluminum plate having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm,', 'a cold-rolled steel plate having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm, and', 'a layer of the adhesive agent between the aluminum plate and the cold-rolled steel plate, the layer of the adhesive agent having a thickness of 0.7 mm;, 'preparing an analysis model laminate having an aluminum plate having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm, and', 'a cold-rolled steel plate having a width of 25 mm, a length of 100 mm, and a thickness of 1.6 mm,', 'wherein the reference model laminate does not have any adhesive agent between the aluminum plate and the cold-rolled steel plate;, 'preparing a reference model laminate havingdetermining a displacement amount WA at an end of the analysis model laminate by finite element structure analysis using Computer Aided Engineering (CAE) software while a middle portion of the cold-rolled steel plate is fixed in place and a temperature of the analysis model laminate ...

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23-05-2019 дата публикации

GUMMED PAPER

Номер: US20190153265A1
Принадлежит:

A gummed paper comprises a first substrate having an uncovered region on an upper surface thereof; and a second substrate, in which in a thickness direction, a projection of the second substrate partially covers a projection of the first substrate, a dyne value of an upper surface of the second substrate is greater than or equal to 40 dyn/cm, and a dyne value of the uncovered region is less than the dyne value of the upper surface of the second substrate. 1. A gummed paper , comprising:a first substrate, having an uncovered region on an upper surface thereof; anda second substrate,wherein in a thickness direction of the gummed paper, a projection of the second substrate partially covers a projection of the first substrate, a dyne value of an upper surface of the second substrate is greater than or equal to 40 dyn/cm, and a dyne value of the uncovered region is less than the dyne value of the upper surface of the second substrate.2. The gummed paper according to claim 1 , further comprising:a first adhesive layer, adhered to a lower surface of the first substrate; anda second adhesive layer, located between the first substrate and the second substrate, and configured to connect the first substrate with the second substrate.3. The gummed paper according to claim 2 , whereinin a width direction of the gummed paper, an edge of the second substrate is within an edge of the first substrate corresponding to the edge of the second substrate, an edge of the second adhesive layer is within an edge of the first substrate corresponding to the edge of the second adhesive layer; andin a length direction of the gummed paper, an edge of at least one side of the second substrate is within an edge of the first substrate corresponding to the edge of at least one side of the second substrate, an edge of at least one side of the second adhesive layer is within an edge of the first substrate corresponding to the edge of at least one side of the second adhesive layer.4. The gummed paper ...

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23-05-2019 дата публикации

GUMMED PAPER

Номер: US20190153266A1
Принадлежит:

A gummed paper includes: a first adhesive layer, configured to adhere to an object; a first substrate, adhered to a surface of the first adhesive layer opposite to the object; a second adhesive layer, adhered to a surface of the first substrate opposite to the first adhesive layer; a second substrate, adhered to a surface of the second adhesive layer opposite to the first substrate; and a plurality of foaming agent particles, distributed in the first adhesive layer. 1. A gummed paper , comprising:a first adhesive layer, configured to adhere to an object;a first substrate, the first adhesive layer disposed between the first substrate and the object;a second adhesive layer, adhered to a surface of the first substrate opposite to the first adhesive layer;a second substrate, the second adhesive layer disposed between the first substrate and the second substrate; anda plurality of foaming agent particles, distributed in the first adhesive layer.2. The gummed paper according to claim 1 , wherein the second substrate and the second adhesive layer extend outwards in a length direction of the gummed paper claim 1 , such that at least one of two ends of the second substrate and at least one of two ends of the second adhesive layer extend beyond an end of the first substrate corresponding to the at least one of the two ends of the second substrate in the length direction to form an extension part of the second substrate and an extension part of the second adhesive layer claim 1 , and the extension part of the second adhesive layer is capable of adhering to the object.3. The gummed paper according to claim 2 , wherein the second substrate and the second adhesive layer extend outwards in the length direction of the gummed paper claim 2 , such that the two ends of the second substrate and the two ends of the second adhesive layer extend beyond ends of the first substrate corresponding to the two ends of the second substrate in the length direction.4. The gummed paper according to ...

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14-05-2020 дата публикации

POLYMERIC FILMS AND DISPLAY DEVICES CONTAINING SUCH FILMS

Номер: US20200152715A1
Принадлежит:

Polymeric films, which may be adhesive films, and display devices including such polymeric films, wherein a polymeric film includes: a first polymeric layer having two major surfaces, wherein the first polymeric layer includes a first polymeric matrix and particles. The first polymeric layer includes: a first a polyolefin-based low WVTR adhesive polymeric matrix having a refractive index n; and particles having a refractive index nuniformly dispersed within the first polymeric matrix; wherein the particles are present in an amount of less than 30 vol-%, based on the volume of the first polymeric layer, and have a particle size range of 400 nanometers (nm) to 3000 nm; and wherein nis different than n. 1. A polymeric film comprising: [{'sub': '1', 'a first polyolefin-based low WVTR adhesive polymeric matrix having a refractive index n; and'}, {'sub': '2', 'particles having a refractive index nuniformly dispersed within the first polymeric matrix;'}, 'wherein the particles are present in an amount of less than 30 vol-%, based on the volume of the first polymeric layer, and have a particle size range of 400 nm to 3000 nm; and', {'sub': 1', '2, 'wherein nis different than n;'}], 'a first polymeric layer having two major surfaces, wherein the first polymeric layer comprises a clarity of at least 80%;', 'a visible light transmission of at least 85%; and', 'a bulk haze of 15% to 80%., 'wherein the polymeric film has2. The polymeric film of further comprising a second polymeric layer disposed on one major surface of the first polymeric layer; wherein the second polymeric layer comprises a second polymeric matrix having a refractive index n; wherein the first polymeric matrix and the second polymeric matrix are the same or different.3. The polymeric film of wherein the second polymeric matrix comprises an adhesive matrix.4. The polymeric film of wherein the first adhesive matrix is different than the second adhesive matrix.5. The polymeric film of wherein nis within 0.2 unit ...

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14-06-2018 дата публикации

CURABLE COMPOSITION

Номер: US20180163049A1
Принадлежит: Daicel Corporation

Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30. 4. The curable composition according to claim 2 ,{'sup': '2', 'wherein Ris substituted or unsubstituted aryl.'}5. The curable composition according to claim 1 , further comprisinga polymerization initiator.6. The curable composition according to claim 1 , further comprisinga polymerization stabilizer.7. The curable composition according to claim 1 , further comprisinga silane coupling agent.8. The curable composition according to claim 1 ,wherein the curable composition is an adhesive composition.9. A cured product of the curable composition according to .10. An adhesive sheet comprising:a substrate; andan adhesive sheet on or over the substrate,{'claim-ref': {'@idref': 'CLM-00008', 'claim 8'}, 'the adhesive layer being a layer of the curable composition according to .'}11. A stack comprising three or more layers claim 1 , two adherend layers; and', 'a bonding layer between the adherend layers,, 'the three or more layers including{'claim-ref': {'@idref': 'CLM-00008', 'claim 8'}, 'the bonding layer being a layer of a cured product of the curable composition according ...

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29-09-2022 дата публикации

HOT MELT ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PRODUCING ADHESIVE TAPE

Номер: US20220306904A1
Принадлежит: Denka Company Limited

A hot melt adhesive composition which can realize moderate adhesive strength with respect to the adherend when porous substrate is used, the composition, including: a styrene-based block copolymer; a tackifier; and a plasticizer; wherein: the styrene-based block copolymer is a styrene-butadiene block copolymer and a butadiene portion thereof is partially hydrogenated; the tackifier is contained by 65 to 190 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer; and the plasticizer is contained by 0.1 to 24 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer. 1. A hot melt adhesive composition , comprising:a styrene-based block copolymer;a tackifier; and the styrene-based block copolymer is a styrene-butadiene block copolymer and a butadiene portion thereof is partially hydrogenated;', 'the tackifier is contained by 65 to 190 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer; and', 'the plasticizer is contained by 0.1 to 24 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer., 'a plasticizer; wherein2. The hot melt adhesive composition of claim 1 , wherein the tackifier is a petroleum resin.3. The hot melt adhesive composition of claim 2 , wherein the petroleum resin is at least one selected from the group consisting of C5 petroleum resin claim 2 , C5C9 petroleum resin claim 2 , and hydrogenated C9 petroleum resin.4. The hot melt adhesive composition of claim 1 , wherein the plasticizer is DINA (diisononyl adipate).5. An adhesive tape claim 1 , comprising:a porous substrate; and {'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the adhesive layer comprises the hot melt adhesive composition of .'}, 'an adhesive layer provided on the porous substrate; wherein6. The adhesive tape of claim 5 , wherein:the adhesive tape has an adhesive strength according to JIS Z0237 “10. adhesive strength” of 1.5 N/cm or more; andthe adhesive tape has a ...

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21-06-2018 дата публикации

FLOCKED PRODUCTS HAVING A SILICONE ADHESIVE COMPOSITION AND METHODS OF MAKING AND USING THE SAME

Номер: US20180171192A1
Автор: Abrams Louis Brown
Принадлежит:

This invention relates generally to flocked articles and methods for making the same, more particularly to flocked products having a silicone adhesive and methods for making and using the same. 1. A flocked product , comprising:a flock layer having a plurality of flock fibers;a thermo-adhesive layer; and (a) a catalyst;', '(b) a siloxane;', '(c) a vinyl siloxane; and', '(c) a rheology modifier., 'a silicone adhesive layer positioned between the thermo-adhesive and the flock layer, wherein the silicone adhesive layer comprises2. The flocked product of claim 1 , wherein the catalyst comprises platinum.3. The flocked product of claim 1 , wherein the thermo-adhesive layer comprises one of a thermoplastic adhesive claim 1 , a thermoset adhesive claim 1 , or combination of a thermoplastic and thermoset adhesives.4. The flocked product of claim 1 , wherein the vinyl siloxane comprises one or more of vinyl functionality claim 1 , methylvinylsiloxane claim 1 , methylvinylsiloxane claim 1 , vinylsiloxane claim 1 , (dimethylvinyl-terminated)dimethylsiloxane claim 1 , (vinyldimethyl-terminated)siloxane claim 1 , octamethylcyclotetrasilocane claim 1 , (vinylphenylmethyl-terminated) dimethyl siloxane claim 1 , (divinylmethyl-terminated) dimethyl siloxane claim 1 , vinyldimethyl siloxane claim 1 , (cyclicvinylemethyl) dimethyl siloxane claim 1 , vinylmethylcyclosiloxane claim 1 , trifluoropropylmethylcyclosiloxane claim 1 , methyhyrdrocyclosiloxane claim 1 , hexamethyldisiloxane claim 1 , divinyltetramethylsiloxane claim 1 , and tetramethyldisiloxane.5. The flocked product of claim 1 , where the siloxane comprises one or more a polysiloxane claim 1 , a polyalkylsiloxane claim 1 , polydialkylsiloxane claim 1 , polydimethylsiloxane claim 1 , octamethylcyclotetrasiloxane claim 1 , methyloctadecyl siloxane claim 1 , dimethylsiloxane claim 1 , methyltetradecylsiloxane claim 1 , docdecylsiloxane claim 1 , tetradecylsiloxane claim 1 , methylhexadecylsiloxane claim 1 , hydrosiloxane claim ...

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08-07-2021 дата публикации

ADHESIVE SHEET

Номер: US20210207010A1
Принадлежит:

[Problem] To provide a thermally expandable adhesive sheet which is tack-free in the state prior to use and exhibits high workability using a different means than that of related art. [Solution] The present invention provides a thermally expandable adhesive sheet () including: a substrate (); two thermally expandable adhesive layers () each provided on either side of the substrate; and two adhesive permeable layers () each provided on a surface of the two adhesive layers, the adhesive permeable layers being permeable to the adhesive at the time of the thermal expansion of the adhesive. By heating the adhesive sheet, it is possible to expand the adhesive sheet while simultaneously allowing the adhesive to emerge on the outermost surface of the adhesive sheet. 1. A thermally expandable sheet comprising:a substrate;two thermally expandable adhesive layers each provided on either side of the substrate; andtwo adhesive permeable layers each provided on a surface of the two adhesive layers, the adhesive permeable layers being permeable to the adhesive at the time of thermal expansion of the adhesive,wherein the adhesive permeable layers are non-woven fabrics.2. The adhesive sheet according to claim 1 , wherein the adhesive permeable layers are formed from a material having a glass transition temperature higher than a curing starting temperature of the adhesive constituting the adhesive layers.3. (canceled)4. A thermally expandable sheet comprising:a substrate;two thermally expandable adhesive layers each provided on either side of the substrate; andtwo adhesive permeable layers each provided on a surface of the two adhesive layers, the adhesive permeable layers being permeable to the adhesive at the time of thermal expansion of the adhesive,wherein the adhesive permeable layers are non-woven papers.5. The adhesive sheet according claim 1 , wherein the adhesive constituting the adhesive layers is an insulating adhesive.6. The adhesive sheet according to claim 1 , wherein ...

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20-06-2019 дата публикации

METHOD FOR BOOSTING THE ANCHORAGE IN THE COATING OF A CARRIER WITH A SOLVENT-FREE ADHESIVE COMPOSITION BY SUPERFICIAL CARRIER HEATING BY MEANS OF CONTACT-AREA HEAT TRANSFER

Номер: US20190185719A1
Принадлежит: TESA SE

A method for producing an adhesive tape by coating a carrier material in web form with a solvent-free adhesive composition, wherein immediately prior to the coating of the carrier material with the adhesive composition, the surface of the adhesive composition or the surface of the carrier material or the surface both of the adhesive composition and of the carrier material is heated by introduction of heat to a temperature of at least 30° C. above the processing temperature, has the effect that the adhesive composition is significantly better anchored on the carrier. For an adhesive tape produced in this way, a boost in the anchorage by up to 60% can be achieved. The penetration of the composition into carriers, especially rough carriers, can take place very much more easily under the conditions of the high temperatures and is controllable by means of the temperature regime. 1. Method for producing an adhesive tape by coating a carrier material in web form with a solvent-free adhesive composition , wherein immediately before the coating of the carrier material with the adhesive composition , the surface of the adhesive composition or the surface of the carrier material or the surface both of the adhesive composition and of the carrier material is heated by introduction of heat to a temperature of at least 30° C. above the processing temperature.2. Method according to claim 1 , wherein the heating takes place by means of thermal conduction or convection.3. Method according to claim 1 , wherein the heating takes place by contact-area heat transfer.4. Method according to claim 1 , wherein the heating takes place by heating rolls.5. Method according to claim 1 , wherein the heating takes place by heating elements.6. Method according to claim 1 , wherein the heating takes place by a combination of contact-area heat transfer claim 1 , heating rolls claim 1 , and heating elements.7. Method according to claim 1 , wherein the coating takes place via extrusion dies or via a ...

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12-07-2018 дата публикации

THERMORESPONSIVE SMART ADHESIVE PAD

Номер: US20180194974A1
Автор: KO Hyun Hyub, LEE Ho Chan
Принадлежит:

At least one example embodiment relates to a thermoresponsive smart adhesive pad. Provided is a thermoresponsive smart adhesive pad that includes a polymer layer including a plurality of concave grooves; a hydrophilic surface layer formed on the polymer layer; and a coating layer including a hydrogel and formed on the hydrophilic surface layer. Also, provided is a method of manufacturing a thermoresponsive smart adhesive pad, including forming a plurality of convex structures on a substrate; forming a plurality of concave grooves in a polymer layer using the substrate on which the plurality of convex structures are formed; forming a hydrophilic surface layer by performing a hydrophilic treatment of a surface of the polymer layer in which the plurality of concave grooves are formed; forming, on the hydrophilic surface layer, a coating layer including a mixed solution containing a hydrogel monomer; and irradiating ultraviolet (UV) rays to the coating layer. 1. A thermoresponsive smart adhesive pad comprising:a polymer layer comprising a plurality of concave grooves;a hydrophilic surface layer formed on the polymer layer; anda coating layer comprising a hydrogel and formed on the hydrophilic surface layer.2. The thermoresponsive smart adhesive pad of claim 1 , wherein the polymer layer comprises at least one selected from the group consisting of polydimethylsiloxane claim 1 , polyethylene claim 1 , polypropylene claim 1 , polycarbonate claim 1 , polystyrene claim 1 , polymethyl methacrylate claim 1 , polychlorinated biphenyl claim 1 , hydrophobically-treated silicon claim 1 , polymethylphenylsiloxane and tetramethyldisiloxane.3. The thermoresponsive smart adhesive pad of claim 1 , wherein the plurality of concave grooves are consecutively arranged at regular intervals.4. The thermoresponsive smart adhesive pad of claim 1 , wherein a distance between centers of neighboring concave grooves among the plurality of concave grooves ranges from 4 micrometers (μm) to 12 μm.5. ...

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18-06-2020 дата публикации

LABEL WITH ADHESIVE AND SILICONE-FREE RELEASE COATING

Номер: US20200193875A1
Принадлежит:

A label having a silicone-free (water-based) release coating and compatible adhesive patch is provided. The label includes a thermally coated substrate having a silicone-free substrate overlaid thereon of a first surface. A second surface includes a microsphere adhesive layer. 1. A label comprising:a substrate; anda water-based release coating applied to a first surface of the substrate, wherein the water-based release coating comprising a fluorochemical component; anda low-tack microsphere adhesive applied to a second surface of the substrate.2. The label of claim 1 , wherein the water-based release coating comprising silicone in an amount of 5% weight based on a total weight of the water-based release coating.3. The label of claim 2 , wherein the water-based release coating further comprising a starch claim 2 , a defoamer claim 2 , a cross-linker claim 2 , a non-silicone release agent claim 2 , and a catalyst.4. The label of claim 1 , wherein the low-tack microsphere adhesive is applied in patches to the second surface.5. The label of claim 1 , wherein the first surface includes a thermal-print layer coated on the first surface with the water-based release coating applied on top of the thermal-print layer.6. The label of claim 5 , wherein the thermal-print layer is a terminal-transfer print layer claim 5 ,7. The label of claim 5 , wherein the thermal-print layer is a direct-terminal print layer.8. The label of claim 1 , wherein the low-tack microsphere adhesive is applied as a single straight-line adhesive patch on the second surface.9. The label of wherein the low-tack microsphere adhesive is applied as multiple placed adhesive patches on the second surface.10. The label of claim 1 , wherein the low-tack microsphere adhesive comprises a water-based adhesive.11. The label of claim 1 , wherein the label is a liner-less label.12. A web of labels claim 1 , comprising:a substrate;a first surface of the substrate comprising a water-based release coating, wherein the ...

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02-07-2020 дата публикации

CATION-CURABLE RESIN COMPOSITION

Номер: US20200208019A1
Автор: Matsuoka Hiroto
Принадлежит:

An object of the present invention is to provide a cation-curable resin composition having storage stability while maintaining photo-curability and low-temperature curability. Specifically, the present invention provides a cation-curable resin composition including: a component (A): a cation-polymerizable compound; a component (B): a photocationic polymerization initiator; and a component (C): a thermal cationic polymerization initiator containing an amine salt. 1. A cation-curable resin composition comprising:a component (A): a cation-polymerizable compound;a component (B): a photocationic polymerization initiator; anda component (C): a thermal cationic polymerization initiator containing an amine salt.2. The cation-curable resin composition according to wherein the component (C) is a thermal cationic polymerization initiator containing a salt including quaternary ammonium cations.3. The cation-curable resin composition according to wherein the component (C) is at least one selected from the group consisting of a salt made of quaternary ammonium cations and borate anions claim 1 , a salt made of quaternary ammonium cations and antimony anions claim 1 , and a salt made of quaternary ammonium cations and phosphate anions.4. The cation-curable resin composition according to wherein the component (C) is at least one selected from the group consisting of a salt made of quaternary ammonium cations and borate anions and a salt made of quaternary ammonium cations and antimony anions.5. The cation-curable resin composition according to wherein the component (A) is at least one selected from the group consisting of epoxy resins claim 1 , oxetane compounds claim 1 , and vinyl ether compounds.6. The cation-curable resin composition according to wherein the cation-curable resin composition contains the component (B) in an amount of 0.1 to 30 parts by mass and the component (C) in an amount of 0.1 to 30 parts by mass claim 1 , relative to 100 parts by mass of the component (A).7 ...

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02-07-2020 дата публикации

ADHESIVE FILM INCLUDING A (METH)ACRYLATE MATRIX INCLUDING A CURABLE EPOXY/THIOL RESIN COMPOSITION, TAPE, AND METHOD

Номер: US20200208020A1
Принадлежит:

A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslinked (meth)acrylate matrix; wherein the thermally curable, one-part epoxy/thiol resin composition comprises: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; and an organic acid.

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02-08-2018 дата публикации

FLEXIBLE PANELS AND THE MANUFACTURING METHODS THEREOF

Номер: US20180219164A1
Автор: Xu Chao

The present disclosure relates to a flexible panel and the manufacturing method thereof. The method includes: coating photosensitive adhesive on a substrate to form a photosensitive layer; forming a scattering layer and an ultraviolet (UV) blocking layer on the photosensitive layer in sequence; forming a flexible substrate layer on the UV blocking layer; forming electronic components, lighting components, and an encapsulation layer on the flexible substrate layer in sequence; and irradiating the photosensitive layer from one side of the substrate by UV rays such that a peeling strength of the photosensitive layer being reduced, and the scattering layer being separated from the substrate to form the flexible panel. By configuring the photosensitive layer, the scattering layer, and the UV blocking layer on the substrate, the scattering layer may be easily separated from the substrate. 1. A manufacturing method of flexible panels , comprising:coating photosensitive adhesive on a substrate to form a photosensitive layer, the photosensitive adhesive being epoxy-terminated polysiloxane or silicone material;forming a scattering layer and an ultraviolet (UV) blocking layer on the photosensitive layer in sequence, the scattering layer being made by titanium dioxide;forming a flexible substrate layer on the UV blocking layer;forming electronic components, lighting components, and an encapsulation layer on the flexible substrate layer in sequence; andirradiating the photosensitive layer from one side of the substrate by UV rays such that a peeling strength of the photosensitive layer being reduced, and the scattering layer being separated from the substrate to form the flexible panel.2. A manufacturing method of flexible panels , comprising:coating photosensitive adhesive on a substrate to form a photosensitive layer;forming a scattering layer and an ultraviolet (UV) blocking layer on the photosensitive layer in sequence;forming a flexible substrate layer on the UV blocking ...

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18-07-2019 дата публикации

POLYLACTIC ACID POLYMER BASED FILM COMPRISING AN ADHESIVE LAYER

Номер: US20190218423A1
Принадлежит:

An article is described such as a tape or sheet, comprising a PLA-based film and a layer of (e.g. pressure sensitive) adhesive disposed on the film. The PLA-based film comprises a semicrystalline polylactic acid polymer; a second polymer such as polyvinyl acetate polymer having a glass transition temperature (Tg) of at least 25° C.; and plasticizer. The tape or sheet may further comprises a low adhesion backsize or a release liner. The article can be suitable for various end-uses. In one embodiment, the tape is a paint masking tape. In another embodiment, the tape is a floor marking tape. 1. An article comprisinga film wherein the film comprisessemicrystalline polylactic acid polymer;polyvinyl acetate polymer having a Tg of at least 25° C.;plasticizer; anda layer of adhesive disposed on the film.2. The article of wherein the article is a tape or sheet.3. The article of or wherein the adhesive is a pressure sensitive adhesive.4. The article of - wherein the polyvinyl acetate polymer has a molecular weight ranging from 75 claim 1 ,000 g/mol to 750 claim 1 ,000 g/mol.5. The article of - wherein the polyvinyl acetate polymer has a viscosity ranging from 10 to 50 mPa*s when the polyvinyl acetate polymer is dissolved in a 10% ethyl acetate solution at 20° C.6. The article of - wherein the polyvinyl acetate polymer is present in an amount ranging from 10 to 50 wt.-% claim 1 , based on the total amount of polylactic acid polymer(s) claim 1 , polyvinyl acetate polymer and plasticizer.7. The article of - wherein the polyvinyl acetate polymer has a glass transition temperature no greater than 50 or 45° C.8. The article of - wherein the plasticizer is present in an amount ranging from 5 or 35 wt.-% claim 1 , based on the total amount of polylactic acid polymer(s) claim 1 , polyvinyl acetate polymer and plasticizer.9. The article of to further comprising a nucleating agent in an amount ranging from about 0.01 wt % to about 1 wt %.10. The article of - wherein the film is further ...

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09-07-2020 дата публикации

ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME

Номер: US20200220091A1
Принадлежит:

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive. 125-. (canceled)26. An adhesive for encapsulating an organic electronic device (OED) , comprising:a curable resin, anda moisture absorbent,wherein the adhesive comprises a first region coming in contact with the organic electronic device (OED); and a second region not coming in contact with the organic electronic device (OED),wherein the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive,wherein the second region has a thickness of 5 μm to 200 μm, andwherein the first region has a smaller thickness than the second region.27. The adhesive of claim 26 , wherein the adhesive has a viscosity at room temperature of 10dyne·s/cmor more.28. The adhesive of claim 26 , wherein the curable resin has a water vapor transmission rate (WVTR) of 50 g/m·day or less when measured in a cured state.29. The adhesive of claim 26 , wherein the curable resin is a thermosetting resin claim 26 , a photocurable resin or a dual curable resin.30. The adhesive of claim 26 , wherein the curable resin contains at least one curable functional group selected from the group consisting of a glycidyl group claim 26 , an isocyanate group claim 26 , a hydroxyl group claim 26 , a carboxyl group claim 26 , an amide group claim 26 , an epoxide group claim 26 , a cyclic ether group claim 26 , a ...

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01-08-2019 дата публикации

ACTIVATABLE ADHESIVE COMPOSITIONS AND LINERLESS LABELS AND TAPES COMPRISING SAME

Номер: US20190233689A1
Принадлежит:

Activatable adhesive compositions are disclosed. The activatable adhesive compositions comprise a two-stage polymer particle, comprising a first stage comprising a hydrophilic acrylic polymer having an acid content of less than 200 mg KOH/g, a second stage polymerized within the first stage and comprising a hydrophobic acrylic polymer, and a tackifier soluble in the first stage and the second stage. Further, linerless labels and tapes comprising activatable adhesive compositions are disclosed. Still further, methods for adhering a first substrate to a second substrate using an activatable adhesive composition are also disclosed. 1. An activatable adhesive composition , comprising: a first stage comprising a hydrophilic acrylic polymer having an acid content of less than 200 mg KOH/g;', 'a second stage polymerized within the first stage and comprising a hydrophobic acrylic polymer; and, 'a two-stage polymer particle, comprisinga tackifier soluble in the first stage and the second stage.2. The activatable adhesive composition of claim 1 , wherein the first stage has a glass transition temperature from 40 to 150° C.3. The activatable adhesive composition of claim 1 , wherein the first stage has a glass transition temperature from 50 to 100° C.4. The activatable adhesive composition of claim 1 , wherein the second stage has a glass transition temperature from −80 to −30° C.5. The activatable adhesive composition of claim 1 , wherein the second stage has a glass transition temperature from −55 to −45 C.6. The activatable adhesive composition of claim 1 , wherein the hydrophilic acrylic polymer has a molecular weight from 5 claim 1 ,000 to 10 claim 1 ,000 g/mol.7. The activatable adhesive composition of claim 1 , wherein the hydrophobic acrylic polymer has a molecular weight from 30 claim 1 ,000 to 100 claim 1 ,000 g/mol.8. The activatable adhesive composition of claim 1 , wherein the first stage comprises from 10 to 50 weight percent of the total weight of the first ...

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09-09-2021 дата публикации

PROPYLENE RANDOM COPOLYMER BASED HOT MELT ADHESIVE COMPOSITION

Номер: US20210277290A1
Принадлежит:

The present application relates to an adhesive composition comprising a polypropylene resin, a tackifying resin and a plasticizer resin having a superior balance of properties in regard of Brookfield viscosity and maximum probe tack. It further relates to an article comprising the adhesive composition and to a process for producing said article. The application also relates to the use of the adhesive composition in the preparation of an article. 115-. (canceled)16. An adhesive composition comprising:{'sub': 4', '10', '2, '(A) a polypropylene resin comprising a multimodal propylene random copolymer (R-PP), being a multimodal random copolymer of propylene and one or more comonomer(s) selected from ethylene and C-Calpha olefins, with a melt flow rate MFRof at least 50 g/10 min, determined according to ISO 1133 at a temperature of 230° C. and a load of 2.16 kg, and a propylene copolymer (PC) which is different from the multimodal propylene random copolymer, wherein the weight ratio of the multimodal propylene random copolymer (R-PP) and the propylene copolymer (PC) in the polypropylene resin is from 1:2 to 5:1,'}{'sub': 5', '10, '(B) a tackifying resin selected from polyterpene resins, C-Caliphatic hydrocarbon resins, aromatic modified aliphatic resins, or mixtures thereof, and'}(C) a plasticizer resin selected from microcrystalline waxes, paraffin waxes, ionomer waxes, Fischer-Tropsch waxes, montan-based waxes, and mineral or petroleum based oils and mixtures thereof,wherein the adhesive composition has a Brookfield viscosity at 160° C. of less than 60,000 mPa▪ as measured according to ASTM D-3236 and a maximum probe tack of at least 150 kPa as measured according to probe tack test protocol.17. The adhesive composition according to claim 16 , having a T-peel strength of at least 5 N/m claim 16 , when the adhesive composition is in direct contact with substrate that is an untreated polypropylene film.18. The adhesive composition according to claim 16 , having a T-peel ...

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30-08-2018 дата публикации

POLYPROPYLENE COMPOSITION WITH IMPROVED HOT-TACK FORCE

Номер: US20180244905A1
Принадлежит:

The invention relates to a polypropylene composition comprising a crystalline propylene random copolymer and an amorphous propylene copolymer having improved hot-tack force and adhesion properties, to a process for the manufacture thereof, to the use thereof in the manufacture of adhesives and hot tack films and to articles comprising the polypropylene composition, as well as to a process for producing such article. 2. The polypropylene composition according to wherein at least 50 wt % of the comonomers in the crystalline propylene random copolymer (C-PP) and in the amorphous propylene copolymer (AM-PP) are ethylene comonomers claim 1 , wherein the comonomers are only ethylene and butylene.3. The polypropylene composition according to having a matrix (M) of the crystalline propylene random copolymer (C-PP) and dispersed therein an amorphous phase of the amorphous propylene copolymer (AM-PP).4. The polypropylene composition according to having a xylene cold soluble (XCS) content claim 1 , determined according ISO 16152 at 25° C. claim 1 , in the range of 15.0 to 50.0 wt % claim 1 , wherein the XCS fraction has a comonomer content between 25 and 50 wt % claim 1 , the XCS fraction further has an intrinsic viscosity between 1.2 and 4 dl/g claim 1 , and wherein the XCS fraction further has a I(E) between 15 and 45.5. The polypropylene composition according to having a total comonomer content in the range of 7.0 to 25.0 wt % claim 1 , the total comonomer content being calculated based on the total amount of monomers comprised in the crystalline propylene random copolymer (C-PP) and the amorphous propylene copolymer (AM-PP) comprised in the polypropylene composition.8. The polypropylene composition according to having a tensile modulus (E) in the range of 300 to 700 MPa claim 1 , as measured at 23° C. according to ISO 527 on injection molded specimens.10. The polypropylene composition according to having a hot tack force in the range of 1.8 to 6.0 N.11. A process for the ...

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15-08-2019 дата публикации

HOT-MELT ADHESIVE AGENT

Номер: US20190249045A1
Автор: FUJITA Chiho
Принадлежит:

To provide a hot-melt adhesive agent which has excellent retention strength and anti-fragrance property, and shows little residual adhesive and unpleasant odor. A hot-melt adhesive agent having a thermoplastic block copolymer (A), the (A) being a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises an unhydrogenized triblock type styrene isoprene block copolymer (A1) and an unhydrogenized styrene butadiene block copolymer (A2), and the hot-melt adhesive agent does not comprise an α-methyistyrene class resin (B) in an amount of not less than 5 parts by weight based on 100 parts by weight of the total weight of (A) and (B). 1: A hot-melt adhesive agent having a thermoplastic block copolymer (A) , which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds , and an α-methylstyrene class resin (B);wherein the thermoplastic block copolymer (A) comprises an unhydrogenized triblock type styrene isoprene block copolymer (A1) and an unhydrogenized styrene butadiene block copolymer (A2), andwherein the α-methylstyrene class resin (B) is present in an amount of not less than 5 parts by weight based on 100 parts by weight of the total weight of (A) and (B).2: The hot-melt adhesive agent according to claim 1 , wherein the unhydrogenized triblock type styrene isoprene block copolymer (A1) has a styrene content of 10 to 60% by weight.3: The hot-melt adhesive agent according to claim 1 , comprising 15 to 50 parts by weight of the unhydrogenized triblock type styrene isoprene block copolymer (A1) based on 100 parts by weight of the total weight of hot-melt adhesive agent (A).4: The hot-melt adhesive agent according to claim 1 , wherein the α-methylstyrene class resin (B) is present in an amount of less than 4.5 parts by weight.5: The hot-melt adhesive agent according to claim 1 , wherein the hot-melt adhesive agent is a positioning adhesive for an absorbent article.6: An ...

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13-08-2020 дата публикации

FLEXIBLE ADHESIVE TAPE FOR HEATING BEVERAGES, PIPES AND OTHER ARTICLES

Номер: US20200254722A1
Автор: Fladoos Jason
Принадлежит:

A heating tape and heating pad. In a most general embodiment, the inventive tape includes a first layer of thermally conductive material; a second layer of thermal insulation; and a third layer of exothermic material, sandwiched between the first and second layers. The third layer is constructed with reactants effective to cause an exothermic chemical reaction. In a first embodiment, the invention provides a beverage heating device. In a second embodiment, the invention provides a pipe heating device. The heating pad is implemented with a first layer of thermally conductive material; a second layer of material providing a base; and a third layer of exothermic material, sandwiched between the first and second layers. In the illustrative embodiment, the third layer has a contour effective to create suction whereby the pad adheres to a surface to be heated. 1. A healing comprising:a first layer of adhesive thermally conductive material;a second layer of material providing thermal insulation; anda third layer of exothermic material sandwiched between the first and second layers,{'sub': '[WJB1]', 'whereby the tape is flexible in construction for activation upon a wrapping thereof around an object to be heated.'}2. The tape of wherein the third layer is constructed with reactants effective to cause an exothermic chemical reaction.3. The tape of further including a breakable barrier that separates the reactants so that heating can be initiated at any point by breaking the barrier.4. The tape of wherein the reactants are cellulose claim 2 , iron claim 2 , water claim 2 , activated carbon claim 2 , vermiculite and salt.5. The tape of wherein the healing material is adapted for activation by breaking a barrier separating water filled chambers and chambers with one or more of the dry compounds claim 4 , allowing them to mix to initiate the exothermic reaction.6. The tape of wherein the third layer includes multiple layers saturated or interwoven with reactants.7. The tape of ...

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13-08-2020 дата публикации

Thermally curable adhesive tape and method for jacketing elongated items, especially leads

Номер: US20200255698A1
Принадлежит:

An adhesive tape for jacketing elongated items may comprise a tape-like carrier provided on at least one side with a self-adhering adhesive layer which consists of a pressure-sensitive adhesive. The tape-like carrier may additionally be provided on at least one side with a binder that is thermally curable at a temperature of up to 110° C. 1. Adhesive tape for jacketing elongated items , comprising a tapelike carrier provided on at least one side with a self-adhering adhesive layer which consists of a pressure-sensitive adhesive , wherein the tapelike carrier is additionally provided on at least one side with a binder that is thermally curable at a temperature of up to 110° C.2. The adhesive tape of claim 1 , wherein the binder that is thermally curable at a temperature of up to 110° C. comprises a polymer which is composed to an extent of at least 5 wt % of an ethylenically unsaturated monocarboxylic acid claim 1 , an ethylenically unsaturated dicarboxylic acid or an ethylenically unsaturated dicarboxylic anhydride and also of mono- or polyfunctional epoxide compounds as curing agents claim 1 , and additionally of a polyol or an alkanolamine having at least two hydroxyl groups.3. The adhesive tape of claim 1 , wherein the binder is thermally curable at a temperature between 60° C. and 110° C.4. The adhesive tape of claim 1 , wherein the binder is a formaldehyde-free resin solution composed of modified polyacrylic acid and a polyhydric alcohol.5. The adhesive tape of claim 1 , wherein the carrier material comprises a polyester nonwoven.6. The adhesive tape of claim 1 , wherein the adhesive has been absorbed to an extent of more than 10% into the carrier.7. A method for jacketing an elongated item such as more particularly leads or cable sets claim 1 , where an adhesive tape comprising a tape-like carrier provided on at least one side with a self-adhering adhesive layer consisting of a pressure-sensitive adhesive is guided in a helical line around the elongated item ...

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04-11-2021 дата публикации

UV-CURABLE HOT MELT ADHESIVE COMPOSITIONS FOR FLOORING APPLICATIONS

Номер: US20210340408A1
Принадлежит: BASF SE

A floor covering includes a floor covering element having an obverse face and a reverse face; an adhesive layer applied to the reverse face; and a release liner in adherence to the adhesive layer; where the adhesive layer includes a UV-curable hot melt adhesive composition that includes a UV-curable acrylic co-polymer. 129.-. (canceled)31. The article of claim 30 , wherein:{'sup': 1', '6', '7', '6', '7', '6', '7, 'sub': n′', 'n′', 'x′', 'y', 'p, 'Ris arylene, cycloalkylenyl, —[C(R)(R)]—, or —{[C(R)(R)]C(O)}[O(C(R)(R))]—;'}{'sup': 6', '10, 'each Ris individually H, OR, alkyl, aryl, or C(O)OH;'}{'sup': 7', '10, 'each Ris individually H, OR, alkyl, or aryl;'}{'sup': '10', 'each Ris individually H or alkyl;'}n′ is 1-12;y is 1, 2, or 3;p is 1, 2, or 3; andx′ is 1-10.32. The article of claim 30 , wherein Ris —(CH)— claim 30 , cyclohexan-1 claim 30 ,4-yl claim 30 , phenylen-1 claim 30 ,4-yl claim 30 , —[(CH)C(O)]—O—(CH)— claim 30 , —C(CH)(C(O)OH)— claim 30 , —C(H)(phenyl)C(CH)(H)— claim 30 , or —CHC(CH)CH—.33. The article of claim 30 , wherein Ris —(CH)—; E is O; n is 0 claim 30 , x is 0 claim 30 , and Ris H or methyl.35. The article of claim 30 , wherein the compound of Formula (I) claim 30 , (II) claim 30 , or (III) is present from about 0.01 wt % to about 5 wt % claim 30 , based on the solids of the UV-curable hot melt adhesive composition.36. The article of claim 30 , wherein the (meth)acrylic co-polymer is derived from a (meth)acrylic monomer containing acrylic acid claim 30 , methacrylic acid claim 30 , methylmethacrylic acid claim 30 , methylmethacrylate claim 30 , ethylmethacrylate claim 30 , a hydroxy vinyl ether claim 30 , methyl acrylate claim 30 , ethyl acrylate claim 30 , n-propyl acrylate claim 30 , isopropyl acrylate claim 30 , n-butyl acrylate (BA) claim 30 , n-decyl acrylate claim 30 , isobutyl acrylate claim 30 , n-amyl acrylate claim 30 , n-hexyl acrylate claim 30 , isoamyl acrylate claim 30 , 2-hydroxyethyl acrylate claim 30 , 2-hydroxypropyl acrylate ...

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29-08-2019 дата публикации

Reactivatable Tile Bonding Mat

Номер: US20190264066A1
Автор: Buschman Bryant
Принадлежит:

Provided is a reactivatable tile bonding mat installable without cement-based thinset. The reactivatable tile bonding mat may include a top surface and a bottom surface. The top surface and the bottom surface include a polymer hot-melt material. The polymer hot-melt material can be reactivatable by heating. The polymer hot-melt material can be adhesive with regard to a surface of at least one of concrete, wood, stone, tile and vinyl. The polymer hot-melt material creates bonding to the surface upon being heated to a pre-determined temperature. The polymer hot-melt material can be heated by convection heating. The polymer hot-melt material comprises a polyethylene terephthalate (PET) and a filler. The filler can include at least one of calcium carbonate, aragonite, silica, metal flake, and glass. The PET and the filler are mixed in a pre-determined proportion to obtain a polymer hot-melt material having a pre-determined melting temperature. 1. A reactivatable tile bonding mat installable without cement-based thinset , the reactivatable tile bonding mat comprising:a top surface; anda bottom surface, wherein the top surface and the bottom surface include a polymer hot-melt material, the polymer hot-melt material having adhesive properties and being reactivatable by heating.2. The reactivatable tile bonding mat of claim 1 , wherein the polymer hot-melt material is adhesive with regard to a surface of at least one of concrete claim 1 , wood claim 1 , stone claim 1 , tile and vinyl.3. The reactivatable tile bonding mat of claim 2 , wherein the polymer hot-melt material creates bonding to the surface upon being heated to a pre-determined temperature.4. The reactivatable tile bonding mat of claim 3 , wherein a strength of the bonding satisfies one or more construction requirements for tile installation.5. The reactivatable tile bonding mat of claim 1 , wherein the top surface and the bottom surface include a heat receptor and the heating includes induction heating.6. The ...

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29-08-2019 дата публикации

Methods of Installing Tile Using a Reactivatable Tile Bonding Mat

Номер: US20190264450A1
Автор: Buschman Bryant
Принадлежит:

Exemplary methods for installing tile using a reactivatable tile bonding mat is disclosed. The reactivatable tile bonding mat is placed upon a substantially flat surface. Stone, porcelain or ceramic tile is placed and arranged on the reactivatable tile bonding mat in an aesthetically pleasing fashion, in some cases aided by the use of spacers in the joints between the sides of the tiles. Induction, or some other method of heat, is applied to the upper surfaces of the tiles, to quickly transfer through the tile, causing a polymer hot-melt material embedded in the reactivatable tile bonding mat to melt and adhere to a lower surface of the tiles, forming a strong bond. Upon the tiles fully bonding to the reactivatable tile bonding mat, spacers may be removed and a suitable grout may be applied in the joints between the sides of the tiles. 1. A method of installing tile or stone using a reactivatable tile bonding mat , the method comprising:placing the reactivatable tile bonding mat on a flat surface;placing the tile or stone on the reactivatable tile bonding mat;applying heat to the tile or stone on the reactivatable tile bonding mat; andapplying grout between sides of the tile or stone.2. The method of claim 1 , further comprising applying spacers between the sides of the tile or stone prior to the applying of the heat.3. The method of claim 2 , further comprising removing the spacers between the sides of the tile or stone prior to the applying of the grout.4. The method of claim 3 , further comprising not using cement-based thinset.5. The method of claim 4 , further comprising the heating the mat includes a heat receptor such as metal flake or fiber claim 4 , powdered steel or a steel screen mesh claim 4 , embedded in a hot melt.6. The method of claim 5 , further comprising the heating stirring up molecules involving a metal screen that causes an adhesive to melt and bond to a floor and the tile.7. The method of claim 6 , further comprising utilizing polyethylene ...

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27-08-2020 дата публикации

PROTECTIVE FILMS MADE OF POLYOLEFIN SUPPORT MATERIAL, PRIMER AND RADIATION-CROSSLINKABLE HOT MELT ADHESIVE

Номер: US20200270487A1
Принадлежит: BASF SE

Described herein is a protection film comprising a polyolefin carrier material, a precoating of the polyolefin carrier material with a primer selected from polyurethane dispersions and a pressure-sensitive adhesive layer of a radiation-crosslinked hotmelt adhesive. A process for producing such protection films is also described. 1. A protection film comprising:(a) a polyolefin carrier material whose surface to be coated has been pretreated,(b) a precoating of the polyolefin carrier material with at least one primer selected from aqueous polyurethane dispersions; and (i) at least 50% by weight of C1- to C18-alkyl (meth)acrylates and', '(ii) at least one ethylenically unsaturated monomer which comprises at least one polar group, wherein the polar group is selected from the group consisting of carboxylic acid groups, carboxylic anhydride groups, hydroxyl groups, amide groups, urethane groups, urea groups, piperidinyl groups, piperazinyl groups, morpholinyl groups, imidazoyl groups, ureido groups, pyrrolidone groups and combinations of two or more of the recited groups;, '(c) a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is formed by radiation crosslinking of a radiation-crosslinkable hotmelt adhesive and wherein the radiation-crosslinkable hotmelt adhesive comprises at least one poly(meth)acrylate formed from'}and wherein the radiation-crosslinkable hotmelt adhesive comprises at least one photoinitiator and the photoinitiator is in the form of an additive not bonded to the poly(meth)acrylate and/or the photoinitiator is incorporated into the poly(meth)acrylate by polymerization.2. The protection film according to claim 1 , wherein before crosslinking the radiation-crosslinkable poly(meth)acrylate has a glass transition temperature of not more than 10° C.3. The protection film according to claim 1 , wherein the poly(meth)acrylate of the hotmelt adhesive has a K value of at least 30.4. The protection film according to claim 1 , ...

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25-10-2018 дата публикации

MOLDED SILICONE ADHESIVE COMPOSITIONS AND METHODS OF MAKING AND USING THE SAME

Номер: US20180305582A1
Автор: Abrams Louis Brown
Принадлежит:

This invention relates generally to radio frequency molded articles and methods for making the same, more particularly to radio frequency molded products having a silicone adhesive layer and methods for making and using the same. 1. A method , comprising:providing a hot-melt adhesive; 'applying heat to the set of layers.', 'providing a silicone adhesive layer positioned between the hot-melt adhesive and a metalized layer to form a set of layers; and'}2. A product , comprising:a hot-melt adhesive;a silicone adhesive layer; anda metalized layer;wherein the silicone adhesive layer is positioned between the hot-melt adhesive and a metalized layer; andwherein the silicone adhesive layer is polymerized.3. A product , comprising:a substrate;a hot-melt adhesive;a silicone adhesive layer; anda metalized layer;wherein the silicone adhesive layer is positioned between the hot-melt adhesive and a metalized layer;wherein the silicone adhesive layer is polymerized; andwherein the silicone adhesive layer is adhered to the substrate by the polymerization. The present application claims the benefits of U.S. Provisional Application Ser. No. 62/657,523, filed Apr. 13, 2018, and U.S. Provisional Application Ser. No. 62/487,384, filed Apr. 19, 2017, each of which is incorporated herein in its entirety by this reference. In addition, the present application incorporates by reference U.S. patent application Ser. No. 15/847,589, filed Dec. 19, 2017, U.S. Provisional Application Ser. No. 62/552,178 filed Aug. 30, 2017, U.S. Provisional Application Ser. No. 62/527,322 filed Jun. 30, 2017, and U.S. Provisional Application Ser. No. 62/533,480 filed Jul. 17, 2017, each of which is incorporated herein in its entirety by this reference.The invention relates generally to radio frequency molded transfers and appliqués, and particularly to radio frequency molded transfers and appliqués and methods of making and using the same.Flock products of the prior art typically have three components: a ...

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10-10-2019 дата публикации

THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE

Номер: US20190311936A1
Принадлежит: NITTO DENKO CORPORATION

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer has sinterable metallic particles and an organic component, a 95% weight loss temperature of the organic component is 150° C. or more and 300° C. or less when thermogravimetry of the thermal bonding sheet is performed under an air atmosphere at a heating rate of 10° C./min. 1. A thermal bonding sheet , comprising a precursor layer that is to become a sintered layer by heating ,whereinthe precursor layer includes sinterable metallic particles and an organic component,a 95% weight loss temperature of the organic component is 150° C. or more and 300° C. or less when thermogravimetry of the thermal bonding sheet is performed under an air atmosphere at a heating rate of 10° C./min.2. The thermal bonding sheet according to claim 1 , wherein the organic component includes an organic binder and a basic substance.3. The thermal bonding sheet according to claim 2 , wherein a 95% weight loss temperature of the basic substance is 150° C. or more and 300° C. or less when thermogravimetry of the thermal bonding sheet is performed under an air atmosphere at a heating rate of 10° C./min.4. The thermal bonding sheet according to claim 2 , wherein the basic substance is a tertiary amine.5. A thermal bonding sheet with dicing tape claim 2 , comprising: {'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the thermal bonding sheet according to any one of laminated on the dicing tape.'}, 'a dicing tape, and'} The present invention relates to a thermal bonding sheet and a thermal bonding sheet with dicing tape.In production of semiconductor devices, the method of bonding a ...

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17-10-2019 дата публикации

FIBER MATRIX ADHESIVE TAPE

Номер: US20190316006A1
Автор: BRZESKI Markus
Принадлежит:

Adhesive tape for attaching, covering and mechanically reinforcing surfaces with a carrier layer and an adhesive layer adhering thereto, wherein the carrier layer is composed of a matrix material in which fibers are embedded. 1. An adhesive tape for attaching , covering and mechanically reinforcing surfaces , the adhesive tape having a carrier layer and an adhesive layer adhering to the carrier layer , wherein the carrier layer is of a matrix material in which fibers are embedded.2. The adhesive tape according to claim 1 , wherein the fibers are embedded in the matrix material such that on at least one lateral surface of the fibers are located entirely under the surface of the matrix material of the carrier layer.3. The adhesive tape according to claim 1 , wherein the fibers are arranged unidirectionally in the matrix material and wherein the fibers comprise continuous or discontinuous fibers.4. The adhesive tape according to claim 1 , wherein the fibers have a fiber volume content of 15% to 80% based on the volume of the carrier layer.5. The adhesive tape according to claim 1 , wherein the fibers are of a modulus of elasticity in the range of 10 GPa to 1000 GPa.6. The adhesive tape according to claim 1 , wherein the fibers are of a tensile strength in the range of 50 MPa to 10000 MPa.7. The adhesive tape according to claim 1 , wherein the matrix material comprises voids claim 1 , and wherein the volume fraction of the voids is 10% at a maximum.8. The adhesive tape according to claim 1 , wherein each fiber is of natural or synthetic polymers or inorganic materials.9. The adhesive tape according to claim 1 , wherein the matrix material comprises a thermoplastic claim 1 , a thermoset claim 1 , an elastomer or a thermoplastic elastomer.10. The adhesive tape according to claim 1 , wherein the carrier layer is of a thickness in the range of 0.1 mm to 7 mm.11. The adhesive tape according to claim 1 , wherein the carrier layer is of a width of 6 mm to 2000 mm.12. The ...

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08-10-2020 дата публикации

A FULLY BONDED WATERBAR

Номер: US20200317961A1
Принадлежит: SIKA TECHNOLOGY AG

A sealing element for sealing joints in concrete structures including a profile having a center portion and first and second side portions on opposite sides of, the center portion. The side portions of the profile are at least partially covered with a functional coating which is operative to bond with a fresh cementitious composition casted against it and allowed to harden. A method produces a sealing element, a method seals a joint between two sections of concrete, a sealed construction, and a use of a sealing element for sealing of a joint in a concrete construction. 1. A sealing element for sealing of joints in concrete structures , the sealing element comprising:a profile having a center portion and first and second side portions on opposite sides of the center portion, the side portions having a top and bottom major surfaces, whereinat least one of the top and bottom major surfaces of the first and/or second side portions is at least partially covered with a functional coating which is operative to bond with a fresh cementitious composition casted against it and allowed to harden, and whereinthe center portion is in a form of a planar element having top and bottom major surfaces orthe center portion is in a form of an expansion element.2. The sealing element according to claim 1 , wherein the extremities of the side portions are terminated by bulb-shaped protuberances.3. The sealing element according to claim 1 , wherein the first and second side portions are in form of planar elements.4. The sealing element according to claim 1 , wherein at least one of the top and bottom major surfaces of the first and second side portions is at least partially covered with the functional coating.5. The sealing element according to claim 1 , wherein the top and bottom major surfaces of the first and second side portions are at least partially covered with the functional coating.6. The sealing element according to claim 1 , wherein the center portion is in a form of a planar ...

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24-10-2019 дата публикации

ADHESIVE SHEETS FOR ABUTTING THE PERIPHERY OF ANGULARLY SHAPED CONDUITS

Номер: US20190322902A1
Автор: Quinland Alford M.
Принадлежит:

Adhesive sheets adapted and dimensioned to conform to angular shapes along a surface are provided. The adhesive sheets thereby provide clean, crisp edges along the surface from with the angular-shaped conduit protrudes. In the case of a surface surrounding a circular conduit the present invention provides adhesive sheets shaped in a semicircular piece/strip that fits in one piece to snugly circumscribe at least a portion of the circular conduit. 1. An adhesive sheet dimensioned and adapted to be applied along a supporting surface circumscribing an angularly shaped conduit so that the adhesive sheet abuts against a periphery of said angularly shaped conduits , protecting the surrounding surface from debris and paint , comprising:a first surface; andan opposing adhesive surface.2. The adhesive sheet of claim 1 , wherein the first surface provides only a rounded-C shape.3. The adhesive sheet of claim 1 , wherein the first surface provides only a squared-C shape.4. The adhesive sheet of claim 1 , wherein the first surface provides only a squared-L shape.5. The adhesive sheet of claim 1 , further comprising a peel-away backer removably attached to the adhesive surface.6. The adhesive sheet of claim 5 , wherein said peel-away backer is generally coextensive with the respective adhesive surface.7. The adhesive sheet of claim 5 , wherein said peel-away backer is generally coextensive with a plurality of adhesive surfaces claim 5 , said adhesive surface being one of said plurality of adhesive services.8. An adhesive sheet dimensioned and adapted to be applied along a supporting surface circumscribing an angularly shaped conduit so that the adhesive sheet abuts against a periphery of said angularly shaped conduits claim 5 , protecting the surrounding surface from debris and paint claim 5 , comprising:a first surface providing only one of a rounded-C, a square-D or a square L shape;an opposing adhesive surface; anda peel-away backer removably attached to the adhesive surface.9 ...

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22-11-2018 дата публикации

ADHESIVE COMPOSITION, SEALING SHEET, AND SEALED BODY

Номер: US20180334594A1
Принадлежит: LINTEC Corporation

The invention is an adhesive composition comprising the following components (A), (B) and (C): 1. An adhesive composition comprising the following components (A) , (B) and (C):Component (A): modified polyolefin-based resin,Component (B): polyfunctional epoxy compound, andComponent (C): imidazole-based curing catalyst.2. The adhesive composition according to claim 1 , wherein the component (A) is an acid-modified polyolefin-based resin.3. The adhesive composition according to claim 1 , wherein a content of the component (A) is 45 to 95 mass % based on a total solid content of the adhesive composition.4. The adhesive composition according to claim 1 , wherein a content of the component (B) is 5 to 110 parts by mass based on 100 parts by mass of the component (A).5. The adhesive composition according to claim 1 , wherein a content of the component (C) is 0.1 to 10 parts by mass based on 100 parts by mass of the component (B).6. The adhesive composition according to claim 1 , further comprising the following component (D):Component (D): silane coupling agent.7. A sealing sheet composed of two release films and an adhesive layer sandwiched between the release films claim 1 , wherein{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the adhesive layer is made by using the adhesive composition according to and has thermosetting property.'}8. A sealing sheet composed of a release film claim 1 , a gas barrier film claim 1 , and an adhesive layer sandwiched between the release film and the gas barrier film claim 1 , wherein{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the adhesive layer is made by using the adhesive composition according to and has thermosetting property.'}9. The sealing sheet according to claim 8 , wherein the gas barrier film is a metal foil claim 8 , a resin film or a thin film glass.10. A sealed body obtained by sealing a seal subject with the sealing sheet according to .11. The sealed body according to claim 10 , wherein the seal subject is an ...

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29-11-2018 дата публикации

ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME

Номер: US20180342687A1
Принадлежит:

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive. 125-. (canceled)26. An adhesive for encapsulating an organic electronic device (OED) , comprising:a curable resin, anda moisture absorbent,wherein the adhesive comprises a first region coming in contact with the organic electronic device (OED); and a second region not coming in contact with the organic electronic device (OED),wherein the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive, andwherein the second region has a thickness of 5 μm to 200 μm.27. The adhesive of claim 26 , wherein the adhesive has a viscosity at room temperature of 10dyne·s/cmor more.28. The adhesive of claim 26 , wherein the curable resin has a water vapor transmission rate (WVTR) of 50 g/m·day or less when measured in a cured state.29. The adhesive of claim 26 , wherein the curable resin is a thermosetting resin claim 26 , a photocurable resin or a dual curable resin.30. The adhesive of claim 26 , wherein the curable resin contains at least one curable functional group selected from the group consisting of a glycidyl group claim 26 , an isocyanate group claim 26 , a hydroxyl group claim 26 , a carboxyl group claim 26 , an amide group claim 26 , an epoxide group claim 26 , a cyclic ether group claim 26 , a sulfide group claim 26 , an acetal group and a lactone group.31. The adhesive ...

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07-11-2019 дата публикации

Biobased hot-melt adhesive including lignin as a component

Номер: US20190338168A1
Принадлежит:

The present invention relates to an adhesive mixture, containing one or more cohesive polymers, one or more tackifiers and optionally one or more separate plasticizer, wherein at least one tackifier is selected from lignin or derivatized lignin. The invention also relates to the use of lignin or derivatized lignin as adhesion promoting components in particularly hot-melt or pressure-sensitive adhesives 1. An adhesive mixture comprising one or more cohesive polymers , one or more tackifiers , and optionally one or more external plasticizers , wherein at least the one or more tackifiers comprise lignin or derivatized lignin , and wherein the one or more tackifiers are present in an amount of 10% or more by weight of the adhesive mixture.2. The adhesive mixture of claim 1 , wherein the one or more tackifiers comprise an unmodified lignin selected from the group consisting of kraft lignin claim 1 , soda lignin claim 1 , hydrolysis lignin claim 1 , oxidized AlkOx lignin claim 1 , organosolv lignin claim 1 , and lignosulphonate; or a derivatized lignin selected from the group consisting of an oxidized lignin claim 1 , esterified lignin claim 1 , or etherified lignin claim 1 , and a combination thereof.3. The adhesive mixture of claim 1 , wherein the lignin or derivatized lignin is obtained from kraft claim 1 , soda claim 1 , sulfite claim 1 , an organosolv or other pulping process claim 1 , or after enzymatic hydrolysis of lignocellulosic biomass.4. The adhesive mixture of claim 2 , wherein the one or more tackifiers comprise an esterified lignin claim 2 , wherein the esterified lignin includes a lignin component and an acid component claim 2 , the acid component selected from a C1-C11 carboxylic acid or from a fatty acid or fatty acid mixture.5. The adhesive mixture of claim 4 , wherein the fatty acid comprises a tall oil fatty acid (TOFA).6. The adhesive mixture of claim 1 , wherein the one or more tackifiers are present in an amount of from 20% to 70% by weight of the ...

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21-11-2019 дата публикации

DIELECTRIC HEATING ADHESIVE FILM AND ADHESION METHOD USING DIELECTRIC HEATING ADHESIVE FILM

Номер: US20190352546A1
Принадлежит:

A dielectric welding configured to weld a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including a polyolefin resin having a polar part, a content of the B component in the dielectric welding film ranging from 3 volume % to 40 volume %. 1. A dielectric welding film configured to weld a plurality of adherends of the same material or different materials though dielectric heating , the dielectric welding film comprising:a thermoplastic resin as an A component; anda dielectric filler as a B component, whereinthe A component comprises a polyolefin resin having a polar part,a content of the B component in the dielectric welding film ranges from 3 volume % to 40 volume %, anda dielectric property (tan δ/ϵ′), which is calculated based on a dissipation factor tan δ and permittivity ϵ′ of the dielectric welding film measured at 23 degrees C. and 40 MHz frequency, is 0.005 or more.2. The dielectric welding film according to claim 1 , whereinthe B component is at least one compound selected from the group consisting of zinc oxide, silicon carbide (SiC), and anatase-type titanium oxide.3. The dielectric welding film according to claim 1 , whereinthe B component generates heat when applied with a high-frequency wave ranging from 1 kHz to 300 MHz.4. The dielectric welding film according to claim 1 , whereina mean particle size of the dielectric filler as the B component measured according to JIS Z 8819-2 (2001) is in a range from 0.1 μm to 30 μm.5. The dielectric welding film according to claim 1 , whereina constituent unit derived from olefin in the A component is derived from ethylene or propylene.6. The dielectric welding film according to claim 1 , whereinthe polar part is a carboxy group, or an acid anhydride moiety.7. A welding method using a dielectric welding ...

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12-12-2019 дата публикации

AQUEOUS DISPERSION AND LAMINATE

Номер: US20190375965A1
Автор: Nakagawa Junichi
Принадлежит: Mitsui Chemicals, Inc.

An aqueous dispersion contains a resin component and water, wherein the resin component contains composite particles (D) having the ethylene-unsaturated carboxylic acid copolymer (A) and the polymer having an acrylic acid ester unit as a polymerization unit (B), and composite particles (E) having the ethylene-unsaturated carboxylic acid copolymer (A) and the ethylene-vinyl acetate copolymer (C). 1. An aqueous dispersion containing a resin component and water ,wherein the resin component contains ethylene-unsaturated carboxylic acid copolymer (A), polymer having an acrylic acid ester unit as a polymerization unit (B), and ethylene-vinyl acetate copolymer (C), andcontains composite particles (D) having the ethylene-unsaturated carboxylic acid copolymer (A) and the polymer having an acrylic acid ester unit as a polymerization unit (B), andcomposite particles (E) having the ethylene-unsaturated carboxylic acid copolymer (A) and the ethylene-vinyl acetate copolymer (C).2. The aqueous dispersion of claim 1 , whereinrelative to 100 mass % of the resin component,35 to 70% of the ethylene-unsaturated carboxylic acid copolymer (A) is contained,25 to 64.5% of the polymer having an acrylic acid ester unit as a polymerization unit (B) is contained, and0.5 to 20% of the ethylene-vinyl acetate copolymer (C) is contained (where a total of (A), (B), and (C) is 100%).3. A method for producing the aqueous dispersion according to claim 1 , the method including the steps of:{'b': '1', 'a step of producing a dispersion liquid containing resin particles (I) composed of ethylene-unsaturated carboxylic acid copolymer (A) by emulsifying the ethylene-unsaturated carboxylic acid copolymer (A) in the presence of water;'}{'b': 2', '1, 'a step of producing a dispersion liquid containing composite particles (D) having the copolymer (A) and the polymer (B) by adding (meth)acrylic acid ester monomer in the dispersion liquid to form the polymer having an acrylic acid ester unit as a polymerization ...

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19-12-2019 дата публикации

HEAT-APPLIED GAP FINISHING TAPE

Номер: US20190382621A1
Принадлежит:

A gap finishing tape for use with drywall applications includes a trim strip body extending along a central body axis, a hot melt adhesive extending along the central body axis, and a backing paper. The trim strip body includes a first surface, a second surface opposite the first surface, a first side, and a second side opposite the first side, and is at least partially constructed from a metallic material. The backing paper is at least partially secured to the second surface of the trim strip body. The trim strip body is at least partially embedded in the hot melt adhesive. 1. A gap-finishing tape for use in connection with drywall applications , the gap finishing tape comprising:a trim strip body extending along the central body axis, the trim strip body having a first surface and a second surface opposite the first surface, the trim strip body being constructed from a metallic material;a hot melt adhesive extending along the central body axis and having a first surface, a second surface opposite the first surface, a first side, and a second side opposite the first side; anda backing paper at least partially secured to the second surface of the hot-melt adhesive;wherein the trim strip body is at least partially embedded into the first surface of the hot melt adhesive.2. The gap-finishing tape of claim 1 , wherein the trim strip body has a first width and the hot melt adhesive has a second width claim 1 , wherein the first width is less than the second width such that the hot melt adhesive extends beyond the width of the trim strip body.3. The gap-finishing tape of claim 1 , wherein the trim strip body has a first thickness and the hot melt adhesive has a second thickness claim 1 , wherein the first thickness is less than the second thickness.4. The gap-finishing tape of claim 1 , wherein the backing paper is at least partially secured to the second surface of the hot melt adhesive via lamination.5. The gap-finishing tape of claim 1 , wherein the hot melt adhesive ...

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26-12-2019 дата публикации

ORGANOSILICON SYNTHETIC LEATHER AND PREPARATION METHOD THEREOF

Номер: US20190390084A1
Автор: FAN Dewen, LI Jiangqun

The present invention relates to an organosilicon synthetic leather and a preparation method thereof. The organosilicon synthetic leather comprises a surface glue layer, a bottom glue layer, and a base layer which are overlapped sequentially. The preparation method comprises the steps of: mixing the main raw materials of the surface glue layer in a proper proportion to obtain a surface glue; mixing the main raw materials of the bottom glue layer in a proper proportion to obtain a bottom glue; coating and curing the surface glue on a release paper, coating the bottom glue on the cured surface glue to form the bottom glue layer, then compositing the bottom glue layer with the base layer and curing composited bottom glue layer, and striping the release paper to obtain the organosilicon synthetic leather. The inventive organosilicon synthetic leather has excellent safety, wear resistance, antifouling property and flame retardancy. 1. An organosilicon synthetic leather , wherein the organosilicon synthetic leather comprises a base layer , a bottom glue layer , and a surface glue layer which are stacked sequentially ,the surface glue layer is prepared from the following main raw materials in parts by mass:an organopolysiloxane, 100 parts,an organic hydrogenated polysiloxane, 0.1 to 10 parts,a vinyl MTQ silicon resin, 1 to 60 parts,a spherical vinyl MQ silicon resin, 10 to 100 parts,a platinum catalyst, 0.01 to 5 parts,an inhibitor, 0.01 to 2 parts,a filler, 1 to 60 parts, anda dye paste, 0 to 10 parts;the bottom glue layer is prepared from the following main raw materials in parts by mass:an organopolysiloxane, 100 parts,an organic hydrogenated polysiloxane, 0.1 to 10 parts,a vinyl MTQ silicon resin, 1 to 60 parts,a platinum catalyst, 0.01 to 5 parts,an inhibitor, 0.01 to 2 parts,a filler, 1 to 60 parts, anda dye paste, 1 to 10 parts; {'br': None, 'sup': 1', '2', '3, 'sub': 3', '1/2', 'a', '2', '2', '1/2', 'b', '3/2', 'c', '4/2', 'd, '(RSiO)[(CH═CH)RSiO](RSiO)(SiO)\u2003\ ...

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19-04-2006 дата публикации

粘合剂段分度方法和设备及其所用的粘合剂段的带卷

Номер: CN1760299A
Принадлежит: Glue Dots International LLC

一种将热塑粘合剂从一个粘合剂段的带卷上涂敷到工件上的自动系统和方法,其中粘合剂段已被涂敷到一个载有粘合剂段的载体分离带上。本发明可以在一个系统中实施,该系统自动地将载有粘合剂段的载体分离带向前推进以便将该装置中载体分离带上的一个粘合剂段定位,用以将粘合剂段涂敷到工件上。优选地,通过载体分离带的光学分度,比如,通过对被印刷或以其它方式设置在粘合剂段载体分离带上的横向线或者其它分度标志连同被沉积于其上的粘合剂段一起进行光学检测,对载有粘合剂段的载体分离带提供精确的分度和向前推进。

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05-08-1999 дата публикации

Selbsttragende schmelzklebefolie, verfahren zu ihrer herstellung sowie ihre verwendung

Номер: WO1999038927A1
Принадлежит: Wolff Walsrode Ag

Die vorliegende Erfindung betrifft eine selbsttragende mindestens zweischichtige Schmelzklebefolie, deren Schichten aus Copolyamiden, Copolyestern oder thermoplastischen Polyurethanen, aufgebaut aus analogen Monomeren und mit analogen Schmelzpunkten, jedoch mit unterschiedlichen Schmelzeviskositäten bestehen und so einerseits ein hohes Mass an Warmklebrigkeit und auf der anderen Seite weitestgehende Dimensionsstabilität unter Verarbeitungsbedingungen aufweisen.

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03-11-2022 дата публикации

ADHESIVE TAPE FOR WRAPPING CABLES

Номер: US20220348794A1
Принадлежит:

The invention relates to an adhesive tape, in particular wrapping tape, for sheathing automotive cables, having a textile support and at least one adhesive coating layer applied to one side or both sides of the textile support, and the textile support being manufactured entirely or partially from bio-based polymer fibers and/or polymer yarns, characterized in that the textile support is constituted of multi-weft yarns and/or multi-warp yarns. 1. An adhesive tape for wrapping cables in automobiles , the tape comprising:a textile substrate band made entirely or partially of bio-based polymer fibers and/or polymer filaments and composed of multicomponent weft yarns and/or multicomponent warp yarns; andan adhesive coating covering one or both faces of the textile substrate band.2. The adhesive tape according to claim 1 , wherein the textile substrate band consists of monocomponent warp filaments and multicomponent weft yarns.3. The adhesive tape according to claim 1 , wherein the monocomponent warp filaments have a filament thickness of at least 100 dtex.4. The adhesive tape according to claim 1 , wherein the multicomponent weft yarns each have a filament thickness of at least 100 dtex.5. The adhesive tape according to claim 1 , wherein the multicomponent warp yarns and/or the multicomponent weft yarns consist of filaments on a biopolyamide or bio-polyester base.6. The adhesive tape according to claim 5 , wherein monomers of the biopolyamide are completely or partially made from castor oil.7. The adhesive tape according to claim 1 , wherein 10 to 80 weft yarns/cm are provided in the textile substrate band.8. The adhesive tape according to claim 1 , wherein 10 to 50 warp yarns/cm are provided in the textile substrate band.9. The adhesive tape according to claim 1 , wherein the multicomponent weft yarns are at least double weft yarns.10. The adhesive tape according to claim 1 , wherein the weight per unit area of the textile substrate band is between 50 g/mand 500 g/m.11. ...

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03-11-2022 дата публикации

UV CURABLE RESIN COMPOSITION AND UV CURABLE SHEET

Номер: US20220348798A1
Автор: SHIMAGUCHI Ryusuke
Принадлежит:

The present invention provides a UV curable resin composition that can be cured without going through a high-temperature heating process and has excellent adhesiveness, and a sheet using the same. 1. A UV curable resin composition , comprising:a rubber component with a diene skeleton, a photopolymerization initiator, a crosslinker, and a tackifierwherein the rubber component with the diene skeleton contains a solid rubber component and a liquid rubber component at 25° C.2. The UV curable resin composition according to claim 1 , wherein at least one of the solid rubber component or the liquid rubber component contains at least one selected from a butadiene rubber claim 1 , a styrene-butadiene rubber and an isoprene rubber.3. The UV curable resin composition according to claim 1 , wherein the solid rubber component and the liquid rubber component contain substantially no rubber component with functional group introduced thereto.4. The UV curable resin composition according to claim 1 , wherein a blending amount of the liquid rubber is 3-40 mass % relative to a total amount of the rubber component.5. A UV curable sheet comprising an adhesive layer claim 1 , which is formed by the UV curable resin composition according to .6. The UV curable sheet according to claim 5 , wherein a thickness of the adhesive layer is 5-200 μm.7. A cured product of the UV curable resin composition according to .8. A cured product of the UV curable sheet according to .9. The cured product according to claim 7 , wherein a gel fraction of the cured product is 40% or more.10. The UV curable sheet according to claim 5 , wherein a 90-degree peel strength based on JISK-6854 after irradiation of UV with a cumulative light amount of 1600 mJ/cmby a high-pressure mercury lamp at room temperature is 7 N/inch or more.11. The UV curable resin composition according to claim 2 , wherein the solid rubber component and the liquid rubber component contain substantially no rubber component with functional group ...

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17-11-2022 дата публикации

RESIN COMPOSITION FOR PROVISIONAL FIXATION, SUPPORT TAPE FOR SUBSTRATE CONVEYANCE AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Номер: US20220363954A1
Принадлежит:

A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.

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24-11-2022 дата публикации

METHOD FOR PRODUCING HOT MELT ADHESIVE AND HOT MELT ADHESIVE

Номер: US20220372340A1
Принадлежит: MORESCO CORPORATION

One aspect of the present invention relates to a method for producing a hot-melt adhesive, comprising: introducing a fluid into a heating kneader while or after kneading a hot-melt adhesive material in a liquid state, at an amount of 0.3 parts by mass or more with respect to 100 parts by mass of the hot-melt adhesive material; and performing vacuuming while heating stirring or dispersing the hot-melt adhesive material and the fluid so as to come into contact with each other. 1. A method for producing a hot-melt adhesive , comprising:introducing a fluid into a heating kneader while or after kneading a hot-melt adhesive material in a liquid state, at an amount of 0.3 parts by mass or more with respect to 100 parts by mass of the hot-melt adhesive material; andperforming vacuuming while heating stirring or dispersing the hot-melt adhesive material and the fluid so as to come into contact with each other.2. The method for producing a hot-melt adhesive according to claim 1 , wherein the vacuuming is performed at an exhaust rate in a volume 0.4 or more times larger than a volume of the heating kneader per minute.3. The method for producing a hot-melt adhesive according to claim 1 , wherein the vacuuming is performed at a degree of vacuum higher than a gauge pressure of −60 kPa.4. The method for producing a hot-melt adhesive according to claim 1 , further comprising recovering a fluid containing volatile organic compounds by cooling and condensing an exhaust gas exhausted from the heating kneader.5. The method for producing a hot-melt adhesive according to claim 1 , wherein a recovery rate of the fluid is 60% or higher.6. The method for producing a hot-melt adhesive according to claim 1 , wherein the obtained hot-melt adhesive has 10 ppm or less of residual volatile organic compounds.7. A hot-melt adhesive obtained by the method according to claim 1 , wherein the hot-melt adhesive has 10 ppm or less of residual volatile organic compounds. The present invention relates to a ...

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24-11-2022 дата публикации

ALKALI-DISPERSIBLE HOT MELT PRESSURE-SENSITIVE ADHESIVE

Номер: US20220372343A1
Автор: Takamori Ai
Принадлежит:

The object of the present invention is to provide an alkali-dispersible hot melt pressure-sensitive adhesive which (i) has a high alkali-dispersibility, (ii) is excellent in strength to retain the label, (iii) hardly causes an adhesive residue problem and (iv) is capable of reducing stringing. The present invention relates to an alkali-dispersible hot melt pressure-sensitive adhesive comprising: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound, (B) a tackifier resin and (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, wherein the thermoplastic block copolymer (A) comprises (A1) a styrene-based block copolymer having a styrene content of less than 40 mass % and the tackifier resin (B) comprises an α-methylstyrene-based resin. 1. An alkali-dispersible hot melt pressure-sensitive adhesive comprising:(A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon and a conjugated diene compound,(B) a tackifier resin and(C) at least one selected from the group consisting of a fatty acid and a derivative thereof,wherein the thermoplastic block copolymer (A) comprises (A1) a styrene-based block copolymer having a styrene content of less than 40 mass % andthe tackifier resin (B) comprises an α-methylstyrene-based resin.2. The alkali-dispersible hot melt pressure-sensitive adhesive according to claim 1 , a content of the α-methylstyrene-based resin is 1 to 20 parts by mass based on 100 parts by mass of the total mass of the components (A) to (C).3. The alkali-dispersible hot melt pressure-sensitive adhesive according to claim 1 , further comprising a Fischer-Tropsch wax.4. A label comprising the alkali-dispersible hot melt pressure-sensitive adhesive according to .5. A container comprising the label according to . The present invention relates to an alkali-dispersible hot melt pressure-sensitive adhesive suitable as a ...

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19-04-2011 дата публикации

Adhesive blends, articles, and methods

Номер: US7927703B2
Принадлежит: 3M Innovative Properties Co

Described are adhesive compositions containing a mixture of a pressure sensitive adhesive, a high Tg polymer, and a crosslinker to form a compatibilized blend that is optically clear. Methods of using the adhesive compositions, and multilayer assemblies such as optical elements prepared using the adhesives, are also provided.

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21-08-1973 дата публикации

Sheet material coated with heat hardenable tacky adhesive

Номер: US3753755A
Автор: M Olson
Принадлежит: Minnesota Mining and Manufacturing Co

Sheet material coated with heat-hardenable, tacky adhesive to form adhesive tapes, bonding films and simiar products. The tacky adhesive layer provides for temporarily adhering one structure to another at ordinary temperatures and can be subsequently heathardened to a strong, permanent bond. Another aspect of the invention relates to the tacky, heat-hardenable adhesive compositions themselves.

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20-03-2003 дата публикации

Flame-retardant heat-resistant resin composition and adhesive film comprising the same

Номер: WO2003022929A1
Принадлежит: HITACHI CHEMICAL CO., LTD.

A flame-retardant heat-resistant resin composition which comprises (A) a modified polyamide-imide resin, (B) a thermosetting resin, and (C) an organophosphorus compound and which upon curing gives a film having a storage modulus of 700 MPa or lower, a coefficient of thermal expansion of 5x10-3 /K or lower, and an internal stress of 20 MPa or lower as measured in the temperature range of 25 to 250°C.

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09-04-1991 дата публикации

Moisture proof thermally actuated binding tape for books

Номер: US5006396A
Принадлежит: Xerox Corp

A moisture proof binding tape for edge binding pages to form a book consisting of a non-permeable temperature resistant foil layer covering one side of the backing strip forming a moisture barrier, a high temperature steam resistance adhesive between the foil layer and the backing strip to secure the foil layer to the backing strip, and a relatively thick central stripe of low tack heat activated adhesive flanked by relatively thin side stripes of high tack heat activated adhesive on the foil layer.

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24-07-2001 дата публикации

Pressure sensitive adhesive

Номер: SG82087A1
Принадлежит: Sumitomo Chemical Co

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15-05-2007 дата публикации

Weatherstrip tape and method for producing the same

Номер: US7217455B2
Автор: Benito Valdez
Принадлежит: 3M Innovative Properties Co

The present invention relates to an adhesive tape and to a method for its manufacture, the tape comprising: (A) a heat-activatable adhesive resin layer, wherein the resin is a polymer of one or more monomers selected from the group consisting of olefins, and (B) a pressure-sensitive adhesive layer, comprising an acrylic-type pressure sensitive adhesive, wherein said pressure sensitive adhesive layer is permanently and directly bonded to a first major surface of said heat-activatable adhesive layer. The present invention also relates to an intermediate article comprising the heat-activatable adhesive resin layer (A) releasably bonded to a support layer, to a composite article comprising the adhesive tape and a rubber article bonded to the second major surface of the heat-activatable layer (A), and to a vehicle comprising the composite article.

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21-05-2002 дата публикации

Pressure sensitive adhesive

Номер: US6391974B1
Принадлежит: Sumitomo Chemical Co Ltd

A pressure-sensitive adhesive comprising an olefin-based copolymer wherein (1) the olefin-based copolymer has a tensile strength at break measured according to JIS K 6251 of 2.0 MPa or less, and (2) the elongation at break EB(%) of a resin composition obtained in blending the olefin-based copolymer with a polypropylene-based resin having a 20° C. xylene-soluble component content of 20 wt % or less satisfies the following formula 1: S[2/6]≧−800, wherein S[2/6] represents the gradient of a primary straight line, and Pa represents the weight content proportion of the olefin-based copolymer contained in the resin composition.

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04-12-1986 дата публикации

Corrosion protection film

Номер: DE3403407C2
Принадлежит: Ruetgerswerke AG

Die Erfindung betrifft eine Korrosionsschutzfolie zum Aufschmelzen auf Stahlbleche aus mit Elastomeren und Naturharzen modifiziertem Bitumen, das bis zu 10% organische und/oder anorganische Fasern enthält. Die Folie ist auf der Unterseite mit einem Schmelzkleber und auf der Oberseite mit einem bitumenverträglichen Antiblockmittel beschichtet, die unterhalb 90°C eine feste Schicht bilden. Durch diese Maßnahme werden Trennfolien überflüssig, die Haftung der Folie auf dem Stahlblech wird verbessert und ihre Oberfläche wird trittfest. The invention relates to a corrosion protection film for melting on steel sheets made of bitumen modified with elastomers and natural resins, which contains up to 10% organic and / or inorganic fibers. The film is coated on the underside with a hotmelt adhesive and on the upper side with a bitumen-compatible antiblocking agent, which forms a solid layer below 90 ° C. This measure makes separating foils superfluous, the adhesion of the foil to the steel sheet is improved and its surface becomes tread-resistant.

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21-10-1986 дата публикации

Corrosion protection sheet

Номер: US4618521A
Принадлежит: Ruetgerswerke AG

A corrosion protective sheet for adhesion to steel sheets which is made from elastomers and natural resin modified bitumen and which contains up to about 10% organic and or inorganic fibrous material. The sheet is coated on the underside with a melt adhesive and on the upper side with a bitumen resistant anti-block material which provides a solid sheet at a temperature under 90° C. No separation sheets are needed and the adherence of the sheet on the steel surface to be protected is improved and the upper surface is rendered resistant to penetration.

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08-02-1988 дата публикации

Patent JPS636118B2

Номер: JPS636118B2
Принадлежит: UBE Industries Ltd

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