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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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05-01-2012 дата публикации

Method for manufacturing conductive adhesive containing one-dimensional conductive nanomaterial

Номер: US20120001130A1

Автор: Bao-Yann Lin, Chen-Chi M. Ma, Gou-Hong Yiin, Lea-Hwung Leu, Ming-Hsiung Wei, Yi-Hsiuan Yu

Принадлежит: National Chung Shan Institute of Science and Technology NCSIST

A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.

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Номер записи: 1

05-01-2012 дата публикации

Semiconductor package having a stacked structure

Номер: US20120001347A1

Автор: Chan-Min Han, Jin-yang Lee, Kil-Soo Kim

Принадлежит: SAMSUNG ELECTRONICS CO LTD

A semiconductor package includes a substrate, a first semiconductor chip stacked on the substrate and a second semiconductor chip stacked on the first semiconductor chip. In the semiconductor package, the second semiconductor chip is rotated to be stacked on the first semiconductor chip. The semiconductor package is used in an electronic system.

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Номер записи: 2

20-12-2004 дата публикации

КОМПЛЕКТ ПЛАСТИЧНОГО КЛЕЯ

Номер: RU0000042822U1

Автор: Трусов Е.В.

Принадлежит: Трусов Евгений Вячеславович

Комплект пластичного клея, включающий отдельно сформированные для последующего смешения перед употреблением компоненты из полимерной смолы и отвердителя, отличающийся тем, что компонент из полимерной смолы выполнен в виде кольцевой в поперечном сечении, или квадратной в поперечном сечении, или треугольной в поперечном сечении, или произвольной формы в поперечном сечении внешней пластичной оболочки, охватывающей вплотную компонент из отвердителя, выполненный в виде внутреннего цилиндрического в поперечном сечении, или квадратного в поперечном сечении, или треугольного в поперечном сечении, или произвольной формы в поперечном сечении пластичного стержня ограниченной длины. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 42 822 (13) U1 (51) МПК C09J 9/00 (2000.01) F16L 13/10 (2000.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2004124729/22 , 17.08.2004 (24) Дата начала отсчета срока действия патента: 17.08.2004 (45) Опубликовано: 20.12.2004 (72) Автор(ы): Трусов Е.В. (RU) (73) Патентообладатель(и): Трусов Евгений Вячеславович (RU) U 1 4 2 8 2 2 R U Ñòðàíèöà: 1 U 1 Формула полезной модели Комплект пластичного клея, включающий отдельно сформированные для последующего смешения перед употреблением компоненты из полимерной смолы и отвердителя, отличающийся тем, что компонент из полимерной смолы выполнен в виде кольцевой в поперечном сечении, или квадратной в поперечном сечении, или треугольной в поперечном сечении, или произвольной формы в поперечном сечении внешней пластичной оболочки, охватывающей вплотную компонент из отвердителя, выполненный в виде внутреннего цилиндрического в поперечном сечении, или квадратного в поперечном сечении, или треугольного в поперечном сечении, или произвольной формы в поперечном сечении пластичного стержня ограниченной длины. 4 2 8 2 2 (54) КОМПЛЕКТ ПЛАСТИЧНОГО КЛЕЯ R U Адрес для переписки: 140100, Московская обл., г. Раменское, ул. Воровского, 5, комн.228, ...

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Номер записи: 3

10-01-2009 дата публикации

КОМПЛЕКТ ПЛАСТИЧНОГО КЛЕЯ

Номер: RU0000079558U1

Автор: Изюмкина Галина Юрьевна

Принадлежит: Изюмкина Галина Юрьевна

Комплект пластичного клея, включающий отдельно сформированные для последующего смешения перед употреблением компонент из полимерной смолы, выполненный в виде кольцевой в поперечном сечении, или квадратной в поперечном сечении, или треугольной в поперечном сечении, или произвольной формы в поперечном сечении внешней пластичной оболочки, и компонент из отвердителя, выполненный в виде внутреннего цилиндрического в поперечном сечении, или квадратного в поперечном сечении, или треугольного в поперечном сечении, или произвольной формы в поперечном сечении пластичного стержня ограниченной длины, причем компонент из полимерной смолы охватывает компонент из отвердителя, отличающийся тем, что между компонентом из полимерной смолы и компонентом из отвердителя установлена прокладка, выполненная из талька, а на поверхности компонента из полимерной смолы размещено съемное пленочное покрытие. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 79 558 U1 (51) МПК C09J 9/00 (2006.01) F16L 13/10 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2008132896/22, 11.08.2008 (24) Дата начала отсчета срока действия патента: 11.08.2008 (45) Опубликовано: 10.01.2009 (72) Автор(ы): Изюмкина Галина Юрьевна (RU) (73) Патентообладатель(и): Изюмкина Галина Юрьевна (RU) R U Адрес для переписки: 123458, Москва, а/я 49, Г.Г. Ивашневой 7 9 5 5 8 R U Ñòðàíèöà: 1 ru CL U 1 Формула полезной модели Комплект пластичного клея, включающий отдельно сформированные для последующего смешения перед употреблением компонент из полимерной смолы, выполненный в виде кольцевой в поперечном сечении, или квадратной в поперечном сечении, или треугольной в поперечном сечении, или произвольной формы в поперечном сечении внешней пластичной оболочки, и компонент из отвердителя, выполненный в виде внутреннего цилиндрического в поперечном сечении, или квадратного в поперечном сечении, или треугольного в поперечном сечении, или произвольной ...

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Номер записи: 4

16-02-2012 дата публикации

Structure for Multi-Row Leadframe and Semiconductor Package Thereof and Manufacture Method Thereof

Номер: US20120038036A1

Автор: Hyuk Soo Lee, Hyun A. Chun, Jae Bong Choi, Sai Ran Eom, Sung Won Lee, Sung Wuk Ryu

Принадлежит: LG Innotek Co Ltd

The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

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Номер записи: 5

01-03-2012 дата публикации

Electroconductive paste and method for fabricating the same

Номер: US20120049131A1

Автор: Dong Hoon Kim, Seong Jin Kim, Sung Eun Kim, Young Il Lee

Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are an electroconductive paste and a method for fabricating the same. The electroconductive paste includes: metal nano powders having an aspect ratio of 1 to 2; and metal nano bars having an aspect ratio 3 to 300.

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Номер записи: 6

08-03-2012 дата публикации

Semiconductor package

Номер: US20120056313A1

Автор: Jun Morimoto, Masashi AIZAWA, Masayuki Kato

Принадлежит: Individual

A semiconductor package includes a radiator plate including a stress alleviation section, a resin sheet arranged on the radiator plate, a pair of bus bars joined to the radiator plate through the resin sheet at positions at which the stress alleviation section is interposed between the bus bars, and a semiconductor device joined to the pair of bus bars by being sandwiched between the bus bars, and energized from outside through the pair of bus bars.

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Номер записи: 7

22-03-2012 дата публикации

Solder adhesive and a production method for the same, and an electronic device comprising the same

Номер: US20120067629A1

Автор: Seung Jun Jang, Sung Chul Kim, Yong Cheol Chu, Yong Un Jang, Yoon Sang Son

Принадлежит: Duksan Hi Metal Co Ltd

The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.

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Номер записи: 8

22-03-2012 дата публикации

Tsop with impedance control

Номер: US20120068317A1

Автор: Belgacem Haba, Brian Marcucci

Принадлежит: TESSERA RESEARCH LLC

A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial portion of one conductive element arranged in a plane positioned adjacent the lead frame and substantially parallel to the lead plane, the conductive element being capacitively coupled to the leads such that the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path, and an encapsulant which encapsulates the leads and the conductive element. The leads and, desirably, the conductive element have respective connection regions which are not covered by the encapsulant.

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Номер записи: 9

12-04-2012 дата публикации

Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device

Номер: US20120085580A1

Автор: Kyouichirou Nakatsugi, Masamichi Yamamoto, Yasuhiro Okuda

Принадлежит: Sumitomo Electric Industries Ltd

By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.

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Номер записи: 10

19-04-2012 дата публикации

Method of die bonding onto dispensed adhesives

Номер: US20120094440A1

Автор: Kui Kam Lam, Kwok Kee Chung, Kwok Kiu CHAN, Yen Hsi Tang

Принадлежит: ASM Assembly Automation Ltd

A method of bonding semiconductor dice onto a substrate first uses an optical assembly to perform pattern recognition of a die bonding section of the substrate in which multiple die pads are located so as to identify positions of the multiple die pads simultaneously during such pattern recognition step. After pattern recognition of the said die bonding section, an adhesive is dispensed with an adhesive dispenser onto at least one of the die pads located in the die bonding section. While the adhesive dispenser is dispensing the adhesive to further die pads located in the die bonding section, a pick-and-place arm concurrently bonds a die onto each die pad where the adhesive has already been dispensed.

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Номер записи: 11

03-05-2012 дата публикации

Chip-on-chip structure and manufacturing method therof

Номер: US20120104597A1

Автор: Junji Yoshikawa, Tatsuji Ishiduka, Tsutomu Kojima

Принадлежит: Toshiba Corp

According to an embodiment, a chip-on-chip structure includes a first chip, a second chip, the first chip and the second chip being opposite to each other, a first electrode terminal, a second electrode terminal, a bump and a protecting material. The first electrode terminal is provided on the surface of the first chip at the side of the second chip. The second electrode terminal is provided on the surface of the second chip at the side of the first chip. The bump electrically connects the first electrode terminal and the second electrode terminal. The protecting material is formed around the bump between the first chip and the second chip. The protecting material includes a layer made of a material having heat-sensitive adhesive property.

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Номер записи: 12

03-05-2012 дата публикации

Emi shielded thermoset article

Номер: US20120107538A1

Автор: Brian A. Beach, Thomas Atkins

Принадлежит: Individual

A conductive thermoset material is provided that provides shielding against electromagnetic radiation. The conductive thermoset material includes an intermixed conductive material dispersed essentially throughout. An antisettling additive is present in the conductive thermoset material to support dispersion, optionally, homogenous dispersion of the conductive material in the resin. The conductive thermoset material is formable into one or more articles. The articles may be transportable and resistant to significant conductivity changes by contact with other surfaces.

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Номер записи: 13

24-05-2012 дата публикации

Connecting and Bonding Adjacent Layers with Nanostructures

Номер: US20120125537A1

Автор: Andrzej Brud, Mohammad Shafiqul Kabir

Принадлежит: Smoltek AB

An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.

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Номер записи: 14

28-06-2012 дата публикации

Chip scale surface mounted semiconductor device package and process of manufacture

Номер: US20120161307A1

Автор: Tao Feng

Принадлежит: ALPHA AND OMEGA SEMICONDUCTOR INC

A semiconductor device package die and method of manufacture are disclosed. The device package die may comprise a device substrate having one or more front electrodes located on a front surface of the device substrate and electrically connected to one or more corresponding device regions formed within the device substrate proximate the front surface. A back conductive layer is formed on a back surface of the device substrate. The back conductive layer is electrically connected to a device region formed within the device substrate proximate a back surface of the device substrate. One or more conductive extensions are formed on one or more corresponding sidewalls of the device substrate in electrical contact with the back conductive layer, and extend to a portion of the front surface of the device substrate. A support substrate is bonded to the back surface of the device substrate.

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Номер записи: 15

05-07-2012 дата публикации

Polymer dispersed liquid crystal film and method for manufacturing the same

Номер: US20120169987A1

Автор: Chunyan Xie, Gang Wang, Wang Hu, Wenbo Li, Zhuo Zhang

Принадлежит: BOE Technology Group Co Ltd

The disclosed technology involves a polymer dispersed liquid crystal film comprising: a first base substrate, a second base substrate, and a polymer dispersed liquid crystal film between the first base substrate and the second base substrate, wherein a first transparent conductive layer is formed on the first base substrate, the first transparent conductive layer is contacted with the first light permeable pressure-sensitive adhesive layer, and the polymer dispersed liquid crystal is adhered to the first base substrate through the first light permeable pressure-sensitive adhesive layer; and a second transparent conductive layer is formed on the second base substrate, the second transparent conductive layer is contacted with the second light permeable pressure-sensitive adhesive layer, and the polymer dispersed liquid crystal is adhered to the second base substrate through the second light permeable pressure-sensitive adhesive layer.

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Номер записи: 16

12-07-2012 дата публикации

Methods for vacuum assisted underfilling

Номер: US20120178219A1

Автор: Alec J. Babiarz, Horatio Quinones, Thomas L. Ratledge

Принадлежит: Nordson Corp

Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.

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Номер записи: 17

30-08-2012 дата публикации

Multi-chip module package

Номер: US20120217657A1

Автор: Chih-Feng Huang, Chiu-Chih Chiang, Lih-Ming Doong, You-Kuo Wu

Принадлежит: Individual

A multi-chip module package is provided, which includes a first chip mounted on via a first conductive adhesive and electrically connected to a first chip carrier, a second chip mounted on via a second conductive adhesive and electrically connected to a second chip carrier which is spaced apart from the first chip carrier, wherein the second conductive adhesive is made of an adhesive material the same as that of the first conductive material, a plurality of conductive elements to electrically connect the first chip to the second chip and an encapsulant encapsulating the first chip, the first chip carrier, the second chip, the second chip carrier and the plurality of conductive elements, allowing a portion of both chip carriers to be exposed to the encapsulant, so that the first chip and second chip are able to be insulated by the separation of the first and second chip carriers.

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Номер записи: 18

13-09-2012 дата публикации

Conductive adhesive, method for manufacturing the same, and electronic device including the same

Номер: US20120228560A1

Автор: Seung Jun Jang, Soon Ho Joeng, Sung Chul Kim, Yong Cheol Chu, Yong Un Jang, Yoon Sang Son

Принадлежит: Duk San Tekopia Co Ltd

The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.

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Номер записи: 19

18-10-2012 дата публикации

Anisotropic conductive film, joined structure, and connecting method

Номер: US20120261171A1

Автор: Koichi Miyauchi, Yasunobu Yamada

Принадлежит: Sony Chemical and Information Device Corp

To provide an anisotropic conductive film, which contains: an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent; and an insulating layer containing a binder, a monofunctional polymerizable monomer, and a curing agent, wherein the metal-coated resin particles are resin particles each containing a resin core coated at least with Ni.

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Номер записи: 20

15-11-2012 дата публикации

Semiconductor device

Номер: US20120286426A1

Автор: Ki Young Kim

Принадлежит: Hynix Semiconductor Inc

A semiconductor device includes a first structural body having first electrode pads; a second structural body disposed in a face-up type over the first structural body in such a way as to expose the first electrode pads, and having first connection members with at least two protrusions; and a third structural body disposed in a face-down type over the second structural body, and having second connection members with at least two protrusions, on a surface thereof facing the second structural body, wherein some of the protrusions of the second connection members are electrically connected with the exposed first electrode pads, and at least one of remaining protrusions of the second connection members is electrically connected with the first connection members.

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Номер записи: 21

20-12-2012 дата публикации

Method for manufacturing semiconductor device and semiconductor manufacturing apparatus

Номер: US20120318431A1

Автор: Atsushi Yoshimura, Fumihiro Iwami, Yasuo Tane, Yukio KATAMURA

Принадлежит: Toshiba Corp

In one embodiment, a method for manufacturing a semiconductor device is disclosed. The method can include, upon attaching a bonding material containing a resin and a solvent to a second surface opposed to a first surface including a circuit pattern of a wafer, heating the bonding material to evaporate the solvent and decreasing vapor pressure of the solvent in an atmosphere faced with the bonding material and heating the attached bonding material to form a bonding layer.

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Номер записи: 22

27-12-2012 дата публикации

Heat dissipating structure and manufacture thereof

Номер: US20120325454A1

Автор: Daiyu Kondo, Masaki Norimatsu, Shinichi Hirose, Taisuke Iwai, Yohei Yagishita, Yoshitaka Yamaguchi, Yukie SAKITA

Принадлежит: Fujitsu Ltd

A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of opposing surfaces of the heat source and the heat dissipating part; and a heat conducting structure comprising a filler layer of thermoplastic material disposed between the heat source and the heat dissipating part and contacting with the opposing surfaces of the heat source and the heat dissipating part, and an assembly of carbon nanotubes that are distributed in the thermoplastic material, oriented perpendicularly to the surfaces of the filler layer, contacting, at both ends, with the opposing surfaces of the heat source and the heat dissipating part, and limited its distribution in the opposing surfaces by the concave portion.

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Номер записи: 23

17-01-2013 дата публикации

Method of Forming a Package Substrate

Номер: US20130015234A1

Автор: Chin-Sung Lin, Li-Hua Lin, Yu-Yu Lin

Принадлежит: Global Unichip Corp, Taiwan Semiconductor Manufacturing Co TSMC Ltd

In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.

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Номер записи: 24

28-03-2013 дата публикации

ADHESIVE COMPOSITION, USE THEREOF, CONNECTION STRUCTURE FOR CIRCUIT MEMBERS, AND METHOD FOR PRODUCING SAME

Номер: US20130075142A1

Автор: Izawa Hiroyuki, Katogi Shigeki

Принадлежит: HITACHI CHEMICAL CO., LTD.

An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass. 1. An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface , wherein:the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C.,the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, andthe adhesive composition includes a phosphate group-containing compound,the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.2. The adhesive composition according to claim 1 , which contains (a) a thermoplastic resin claim 1 , (b) a radical polymerizing compound and (c) a radical polymerization initiator claim 1 , and the (b) radical polymerizing compound includes the phosphate group-containing compound.3. The adhesive composition according to claim 2 , wherein the (b) radical polymerizing compound contains one or more of both a vinyl compound with a phosphate group claim 2 , as the phosphate group-containing compound claim 2 , and a radical polymerizing compound other than the vinyl compound with a phosphate group.4. The adhesive composition according to claim 1 , which ...

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Номер записи: 25

28-03-2013 дата публикации

ADHESIVE WITH ANISOTROPIC ELECTRICAL CONDUCTIVITY AND METHODS OF PRODUCING AND USING SAME

Номер: US20130076371A1

Автор: Buschhorn Samuel

Принадлежит: TuTech Innoovation GmbH

The invention relates to an electrically conductive adhesive, comprising an adhesively acting, curable and electrically non-conductive matrix material and a phase of electrically conductive carbon nanotubes distributed in the matrix material. According to the invention, the carbon nanotubes are present in a plurality of individual macrostructures, and each macrostructure consists of a plurality of agglomerated carbon nanotubes forming and electrical contact among each other. Another aspect of the invention concerns a method of producing such an electrically conductive adhesive, and a method for electrically conductive bonding of two components and for checking the quality of an adhesive bond formed in such a manner. 1. An electrically conductive adhesive , comprising{'b': 6', '41, 'an adhesively acting and electrically non-conductive or weakly conductive matrix material (; ), preferably of a polymer material or a polymerisable material, and'}{'b': '1', 'a phase of electrically conductive carbon nanotubes () distributed in the matrix material,'}{'b': 40', '140', '5, 'i': a', 'c', 'a', 'c, 'characterised in that the carbon nanotubes are present in a plurality of individual macrostructures (-; -; ), that each macrostructure consists of a plurality of agglomerated carbon nanotubes forming electrical contact among each other, and that the macrostructures are present in the matrix material in a concentration that is lower than the percolation threshold of the macrostructures within the matrix material.'}2. The adhesive according to claim 1 ,characterised in that the macrostructures are present with a substantially spherical geometry and that the values for the height, width and length of any macrostructure does not deviate in any of the values by more than 50% from any one of the other values.3. The adhesive according to claim 1 ,characterised in that the macrostructures are present in a form that is achieved by shearing a fluid comprising carbon nanotubes distributed ...

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Номер записи: 26

11-04-2013 дата публикации

ANISOTROPIC CONDUCTIVE ADHESIVE, METHOD OF PRODUCING THE SAME, CONNECTION STRUCTURE AND PRODUCING METHOD THEREOF

Номер: US20130087373A1

Автор: Konishi Misao, SAKAMOTO Jun

Принадлежит: DEXERIALS CORPORATION

In an anisotropic conductive adhesive including a magnetic powder such as nickel-coated resin particles used as conductive particles, the conductive particles are present in an insulating adhesive composition without being aggregated. The magnetic powder used as the conductive particles is at least partially composed of a magnetic material. In this case, demagnetization has been performed on the conductive particles in a powder form that have not been dispersed in the insulating adhesive composition, the conductive particles in a paste obtained by dispersing the conductive particles in the insulating adhesive composition, or the conductive particles in a film formed from the paste, before establishment of an anisotropic conductive connection using the anisotropic conductive adhesive. 1. An anisotropic conductive adhesive comprising: an insulating adhesive composition; and magnetic conductive particles dispersed therein , wherein the magnetic conductive particles have been subjected to demagnetization before establishment of an anisotropic conductive connection using the anisotropic conductive adhesive.2. The anisotropic conductive adhesive according to claim 1 , wherein the demagnetization has been performed on the magnetic conductive particles in a powder form that have not been dispersed in the insulating adhesive composition claim 1 , the magnetic conductive particles in a paste obtained by dispersing the magnetic conductive particles in the insulating adhesive composition claim 1 , or the magnetic conductive particles in a film formed using the paste.3. The anisotropic conductive adhesive according to claim 1 , wherein the conductive particles are nickel-coated resin particles or nickel metal particles.4. The anisotropic conductive adhesive according to claim 1 , wherein nickel in the nickel-coated resin particles contains elemental phosphorus.5. The anisotropic conductive adhesive according to claim 4 , wherein the nickel in the nickel-coated resin particles ...

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Номер записи: 27

25-04-2013 дата публикации

Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and Method

Номер: US20130099364A1

Автор: Francois Hebert, Kai Liu, Lei Shi

Принадлежит: ALPHA AND OMEGA SEMICONDUCTOR INC

A top-side cooled semiconductor package with stacked interconnection plate is disclosed. The semiconductor package includes a circuit substrate with terminal leads, a semiconductor die atop the circuit substrate, a low thermal resistance intimate interconnection plate for bonding and interconnecting a top contact area of the semiconductor die with the circuit substrate, a low thermal resistance stacked interconnection plate atop the intimate interconnection plate for top-side cooling, a molding encapsulant for encapsulating the package except for exposing a top surface of the stacked interconnection plate to maintain effective top-side cooling. The top portion of the stacked interconnection plate can include a peripheral overhang above the intimate interconnection plate. The peripheral overhang allows for a maximized exposed top surface area for heat dissipation independent of otherwise areal constraints applicable to the intimate interconnection plate. The stacked interconnection plate can be partially etched or three dimensionally formed to create the peripheral overhang.

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Номер записи: 28

09-05-2013 дата публикации

Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package

Номер: US20130113093A9

Автор: Kyung-Moon Kim, Nazir Ahmad, Rajendra D. Pendse, Samuel Tam, Young-Do Kweon

Принадлежит: Stats Chippac Pte Ltd

A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on a bump side thereof and a substrate having a set of interconnect points on a metallization thereon, providing a measured quantity of a polymer adhesive in a middle region of the chip on the bump side, aligning the chip with the substrate so that the set of bumps aligns with the set of interconnect points, pressing the chip and the substrate toward one another so that a portion of the polymer adhesive contacts the substrate and the bumps contact the interconnect points, and heating the bumps to a temperature sufficiently high to form a metallurgical connection between the bumps and the interconnect points.

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Номер записи: 29

16-05-2013 дата публикации

Hydractive Recipe

Номер: US20130122249A1

Автор: Lykke Mads

Принадлежит: COLOPLAST A/S

A method for assembling an adhesive device comprising a first matrix-forming material with holes and a second material, including the following steps: (a) compose the first matrix-forming material with holes; (b) compose the second material with a Tm lower than the Tm of the first material, while enabling increase in the Tm of the second material; (c) assemble the adhesive device by filling the holes of the first matrix-forming material of step (a) with the deformable second material of step (b) at a temperature where the second material is deformable and the first material is non-deformable; (d) increase the Tm of the second material. 114.-. (canceled)15. An adhesive device wherein the adhesive device or part of the adhesive device is prepared by a method comprising:(a) providing a first matrix-forming material with holes;(b) providing a second material with a Tm lower than the Tm of the first matrix-forming material, while enabling increase in the Tm of the second material;(c) assembling the adhesive device by filling the holes of the first matrix-forming material of step (a) with the deformable second material of step (b) at a temperature where the second material is deformable and the first material is non-deformable; and(d) increasing the Tm of the second material.16. The adhesive device according to claim 15 , wherein the increase in the Tm of the second material is obtained by adding a melting point lowering substance to the second material.17. The adhesive device according to claim 16 , wherein the melting point lowering substance is a solvent.18. The adhesive device according to claim 16 , wherein the increase in Tm of the second material is obtained by evaporation of the melting point lowering substance.19. The adhesive device according to claim 16 , wherein the melting point lowering substance is a plasticiser.20. The adhesive device according to claim 16 , wherein the increase in Tm of the second material is obtained through migration of the melting ...

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Номер записи: 30

06-06-2013 дата публикации

CONDUCTIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME, COLLECTOR ELECTRODE, AND SOLAR CELL MODULE

Номер: US20130139874A1

Автор: Kameyama Kojiro, MATSUMURA Takeshi, Toyoda Eiji, YAMAZAKI Hiroshi

Принадлежит: NITTO DENKO CORPORATION

A conductive adhesive sheet includes a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction; a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; and an adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer. 1. A conductive adhesive sheet comprising:a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction;a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; andan adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer.2. The conductive adhesive sheet according to claim 1 , wherein the low-melting-point metal layer comprises tin and/or a tin-bismuth alloy.3. The conductive adhesive sheet according to claim 1 , wherein the conductor layer comprises copper.4. The conductive adhesive sheet according to claim 1 , wherein the projecting region comprises a plurality of projecting regions disposed in a direction perpendicular to the thickness direction in spaced-apart relation to each other.5. A collector electrode for collecting carriers generated in a solar cell claim 1 ,the collector electrode comprising a conductive adhesive sheet, and a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction;', 'a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; and', 'an adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer., 'the conductive adhesive sheet comprising6. A solar cell module comprising a solar cell and a collector electrode claim 1 ,the collector electrode comprising a conductive adhesive sheet, ...

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Номер записи: 31

06-06-2013 дата публикации

CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

Номер: US20130140069A1

Автор: ISHIKAWA Kuniko, KITAJIMA Masayuki, KUBOTA Takashi, YAMAKAMI Takatoyo

Принадлежит: FUJITSU LIMITED

A conductive bonding material includes: copper particles coated with either gallium or gallium alloy; and either tin particles or tin alloy particles. An electronic component includes: a wiring board having electrode pads; a component mounted on the wiring board and having a plurality of electrodes; a sealing resin covering the component; and a plurality of terminals coupled to a wiring line in the wiring board to an external substrate, wherein the plurality of electrodes being coupled to the electrode pads through a conductive bonding material containing copper particles coated with either gallium or gallium alloy particles and either tin particles or tin alloy particles. 1. A conductive bonding material , comprising:copper particles coated with either gallium or gallium alloy; andeither tin particles or tin alloy particles.2. The conductive bonding material according to claim 1 , whereinthe gallium alloy is any one of Ga—Ni alloy, Ga—Cu alloy, Ga—Sn alloy, and Ga—Au alloy.3. The conductive bonding material according to claim 1 , whereina volume average particle diameter of the copper particles is 0.5 μm or more and 30 μm or lower.4. The conductive bonding material according to claim 1 , whereinan average thickness of a coating film containing either the gallium or the gallium alloy is 0.5 μm or more and 10 μm or lower.5. The conductive bonding material according to claim 1 , whereinthe copper particles contain an alloy of gallium and copper.6. The conductive bonding material according to claim 1 , whereina mixed ratio of the copper particles coated with either the gallium or the gallium alloy and the tin particles or the tin alloy particles is 20:80 to 50:50 in terms of a mass ratio.7. The conductive bonding material according to claim 1 , whereinthe tin alloy particles are either Sn—Bi—X alloy particles or Sn—Cu—X alloy particles (X is any one of Ag, Ni, Zn, Pd, and In.).8. The conductive bonding material according to claim 7 , whereinthe tin alloy particles are ...

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Номер записи: 32

20-06-2013 дата публикации

Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same

Номер: US20130154093A1

Автор: Arum Yu, Dong Seon Uh, Hyun Min Choi, Joon Mo Seo, Kyoung Soo Park, Kyung Il SUL, Nam Ju Kim, Young Woo Park

Принадлежит: Individual

An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.

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Номер записи: 33

20-06-2013 дата публикации

SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMPRISING CONDUCTIVE MICROSPHERES

Номер: US20130154095A1

Автор: CHOI Hyun Min, KIM Nam Ju, PARK Kyoung Soo, Park Young Woo, SEO Joon Mo, TAKEICHI Motohide, UH Dong Seon, YU Arum

Принадлежит:

A semiconductor device includes an anisotropic conductive film for connecting the semiconductor device. The anisotropic conductive film includes a first conductive layer that has first conductive particles. The first conductive particles include cores containing silica or a silica composite, and have a 20% K-value ranging from about 7,000 N/mmto about 12,000 N/mm. 1. A semiconductor device , comprising:an anisotropic conductive film for connecting the semiconductor device, the anisotropic conductive film including:{'sup': 2', '2, 'a first conductive layer having first conductive particles, the first conductive particles including cores containing silica or a silica composite, and having a 20% K-value ranging from about 7,000 N/mmto about 12,000 N/mm.'}2. The semiconductor device as claimed in claim 1 , wherein the first conductive particles have a compressive strain ranging from about 5% to about 40% upon thermal compression of the anisotropic conductive film under conditions of 220° C. and 110 Mpa for 5 seconds.3. The semiconductor device as claimed in claim 1 , wherein the cores include the silica composite claim 1 , the silica composite including a polymer resin and silica claim 1 , the polymer resin being a polymer of at least one monomer selected from the group of a crosslinking polymerizable monomer and a mono-functional monomer.4. The semiconductor device as claimed in claim 3 , wherein the polymer resin includes the crosslinking polymerizable monomer claim 3 , the crosslinking polymerizable monomer including at least one selected from the group of a vinyl benzene monomer claim 3 , allyl compound monomer and an acrylate monomer.5. The semiconductor device as claimed in claim 3 , wherein the polymer resin includes the mono-functional monomer claim 3 , the mono-functional monomer including at least one selected from the group of a styrene monomer claim 3 , a (meth)acrylate monomer claim 3 , vinyl chloride claim 3 , vinyl acetate claim 3 , vinyl ether claim 3 , ...

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Номер записи: 34

27-06-2013 дата публикации

SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM

Номер: US20130161566A1

Автор: HAN Jae Sun, JUNG Kwang Jin, Kim Hyun Wook, NAMKUNG Hyun Hee, SEO Jin Young, SUL Kyung Il, UH Dong Seon

Принадлежит:

An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: 2. The electronic device as claimed in claim 1 , wherein the anisotropic conductive adhesive film is formed from a composition that includes:an ethylene-vinyl acetate copolymer,at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin,an isocyanurate acrylate, anda dicyclopentadiene (meth)acrylate.3. The electronic device as claimed in claim 2 , wherein a solid weight ratio of the ethylene-vinyl acetate copolymer to a total amount of the at least one resin selected from the group of the acrylate modified urethane resin and the ester type urethane resin is from about 1:3 to about 3:1.4. The electronic device as claimed in claim 2 , wherein:the isocyanurate acrylate includes an isocyanuric acid ethylene oxide-modified triacrylate, andthe dicyclopentadiene (meth)acrylate includes a tricyclodecanedimethanol diacrylate.5. An electronic device claim 2 , comprising: an ethylene-vinyl acetate copolymer,', 'at least one resin selected from the group of an acrylate modified urethane resin and an ester type urethane resin,', 'an isocyanurate acrylate, and', 'a dicyclopentadiene (meth)acrylate., 'an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film is formed from a composition that includes6. The electronic device as claimed in claim 5 , wherein the composition further includes a film-forming resin.7. The electronic device as claimed in claim 6 , wherein the anisotropic conductive adhesive composition includes:about 10 to about 40% by weight of the ethylene-vinyl ...

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Номер записи: 35

25-07-2013 дата публикации

POLYMER THICK FILM SOLDER ALLOY CONDUCTOR COMPOSITION

Номер: US20130187100A1

Автор: Dorfman Jay Robert

Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

The invention is directed to a polymer thick film composition comprising solder alloy powder and organic medium comprising organic polymeric binder and solvent. The composition may be processed at a time and temperature necessary to remove all solvent. The invention is further directed to method(s) of electrode formation on circuits using such compositions and to articles formed from such methods and/or compositions. 1. A polymer thick film solder alloy conductor composition comprising:{'sup': '2', '(a) 65 to 95 wt % solder alloy powder consisting of tin, silver, and copper and possessing an average particle size of 2 to 18 μm and a surface area/mass ratio in the range of 0.20 to 1.3 m/g; dispersed in'} (i) a vinyl co-polymer resin of vinylidene chloride and acrylonitrile, dissolved in', '(ii) organic solvent comprising a dibasic ester;, '(b) 5 to 35 wt % organic medium comprising'}wherein the wt % are based on the total weight of the polymer thick film solder alloy conductor composition.2. The composition of claim 1 , wherein the solder alloy powder possesses an average particle size of 8 to 12 μm.3. The composition of claim 1 , wherein the solder alloy powder contains at least 90% tin by weight and wherein the organic medium contains 16 to 25% vinyl co-polymer resin by weight.4. The composition of claim 1 , wherein the boiling point of he organic solvent is in the range of 180° C. to 250° C.5. The composition of claim 1 , the organic solvent further comprising solvent selected from the group consisting of glycol ethers claim 1 , ketones claim 1 , esters and mixtures thereof.6. A method of forming an electrode in an electrical circuit claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a) preparing the composition of ;'}b) applying the composition onto a substrate; andc) drying the composition to form the electrode.75. An electrical circuit comprising an electrode formed from the composition of any of - claims 1 , wherein the composition has ...

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Номер записи: 36

25-07-2013 дата публикации

Sinterable silver flake adhesive for use in electronics

Номер: US20130187102A1

Автор: Harry Richard Kuder, Juliet Grace SANCHEZ, Matthias Großmann, Xinpei Cao

Принадлежит: Henkel AG and Co KGaA, Henkel Corp

A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.

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Номер записи: 37

01-08-2013 дата публикации

CONDUCTIVE ADHESIVE

Номер: US20130193383A1

Автор: McGrath Paul

Принадлежит:

A conductive adhesive is provided useful for providing electrically conductive joints in joins between panels, particularly conductive carbon composite panels in a WESP, is prepared from a corrosion resistant resin and particulate carbon black which is uniformly dispersed in the resin. 1. An electrically-conductive adhesive composition comprising:a polyunsaturated resin which, following polymerization, exhibits resistance to corrosion and heat distortion, anda carbon black filler uniformly dispersed in the resin.2. The composition of wherein the polyunsaturated resin is a polyunsaturated vinyl ester resin.3. The composition of wherein said polyunsaturated vinyl ester resin is an epoxy novolac vinyl ester resin.4. The composition of wherein said carbon black filler is present in an amount of about 10 to about 30 wt %.5. The composition of further comprising at least one cross-linking agent for said polyunsaturated resin.6. The composition of wherein the cross-linking agent is cumyl hydroperoxide.7. The composition of further comprising at least one curing accelerator.8. The composition of wherein said curing accelerator is cobalt naphthalate.9. The composition of further comprising a solution of paraffin wax and styrene.10. A method of forming an electrically conductive adhesive composition claim 1 , comprising:mixing a paste of finely divided carbon black filler with a polyunsaturated resin which, following polymerization, exhibits resistance to corrosion and heat distortion, along with other optional additives other than a cross-linking agent for said resin under high shear to fully disperse the carbon black filler and optional additives in the resin to form a homogenous mixture.11. The use of the composition of for the assembly of conductive carbon composite panels in a WESP. In copending PCT Patent Application No. PCT/CA2010/001404 filed Sep. 9, 2010 (WO 2011/029186), assigned to the assignee hereof and the disclosure of which is incorporated herein by reference, ...

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Номер записи: 38

08-08-2013 дата публикации

Conductive Adhesive For A Floorcovering

Номер: US20130199699A1

Автор: Alfred Huf, Gunnar Ernst

Принадлежит: CONSTRUCTION RESEARCH AND TECHNOLOGY GmbH

The invention relates to an adhesive for a floorcovering, comprising, based on the entire adhesive, from 5 to 30% by weight of at least one component selected from graphite and carbon black and/or from 0.2 to 3% by weight of conductive carbon fibers, from 25 to 50% by weight of a polyurethane dispersion with solids content of from 25 to 65% by weight, where less than 5% by weight of an aqueous dispersion of polyhydroxyether polymer, grafted with at least one acrylic or methacrylic monomer, with solids content of from 25 to 40% by weight, is present.

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Номер записи: 39

15-08-2013 дата публикации

DESIGN CONTROL WATER BASED ADHESIVE

Номер: US20130206630A1

Автор: Burmeister Edward W.

Принадлежит: SteriPax, Inc.

The present invention includes compositions of matter, methods of making and using a sealable container using a design control water based adhesive composition for application using a printing press by providing a substrate comprising a first side and a second side each having a top edge, a bottom edge, a right edge, a left edge and a storage region positioned there between; applying a first composition to the top edge, the bottom edge, the right edge, the left edge; applying at least a second composition to the first composition; and placing a cover on the at least a second composition to be sealed by the second composition and the first composition. 1. A design control water based adhesive composition for application for use with a printing press comprising:a design control water based adhesive composition comprising one or more selected from acrylonitrile butadiene, polyamide, polybutadiene, ethylene vinyl acetate, polypropylene, polybutylene, acrylic, natural rubber, neoprene, polycholoroprene, polyester, polyester emulsion, polyisoprene, polypropylene emulsion, polyurethane, polyvinyl acetate, polyvinyl alcohol, polyvinyl butyral, polyvinyl chloride, polyvinylidene chloride, silicone emulsion, styrene isoprene, styrene acronitrile, styrene acrylic, styrene butadiene, vinyl acetate, vinyl acetate-ethylene, vinyl alcohol, and wax emulsion, wherein the design control water based adhesive composition is adapted for use with a printing press.2. The package of wherein the design control water based adhesive composition comprises about 1 to 99.9% of a polymer or combination of polymers claim 1 , selected from the group consisting of: styrene butadiene rubber (SBR) claim 1 , acrylic polymers and copolymers claim 1 , ethylene vinyl acetate (EVA) claim 1 , ethylene methacrylic (EMA) or acrylic acid (EAA) claim 1 , polyethyleneimine (PEI) claim 1 , polyurethane (PU) claim 1 , silanes and silanated polymers.3. The design control water based adhesive composition of further ...

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Номер записи: 40

29-08-2013 дата публикации

Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module

Номер: US20130220540A1

Автор: Isao Tsukagoshi, Naoki Fukushima, Takehiro Shimizu

Принадлежит: Hitachi Chemical Co Ltd

The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.

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Номер записи: 41

29-08-2013 дата публикации

METAL PARTICLE AND METHOD FOR PRODUCING THE SAME

Номер: US20130221287A1

Автор: Takahash Tomoyuki, Yoshii Akito

Принадлежит:

A metal particle which is a non-nucleated, spherical porous material having continuous open pores, and which is formed from dendritic crystals which have grown uniformly outward from the center without requiring a nucleating agent. A method for producing a metal particle which includes the steps of: mixing a metal salt and a polycarboxylic acid in a liquid phase; adding a reducing agent to the resultant mixture to deposit metal particles; and drying the deposited metal particles. The metal particle produced by the method, which is a non-nucleated, spherical porous material having continuous open pores, is unlikely to suffer bonding or aggregation of the metal particles and exhibits excellent dispersibility, and, when the metal particle is used in a conductive composition, such as a conductive paste, a cured product having satisfactory conduction properties can be obtained at a relatively low temperature, making it possible to easily control the specific gravity or resistance. 1. A metal particle which is a non-nucleated , spherical porous material having continuous open pores.2. The metal particle according to claim 1 , which has a volume cumulative particle diameter Dof 0.1 to 15 μm as measured by a particle size distribution measurement method using image analysis.3. The metal particle according to claim 1 , which has a tap density of 1 to 6 g/cm.4. The metal particle according to claim 1 , which has a specific surface area of 0.25 to 8 m/g as measured by a BET method.5. The metal particle according to claim 1 , wherein the value K determined from a specific surface area SS and a specific surface area BS and represented by the formula (2) below satisfies the relationship: 3≦K≦72 claim 1 , wherein the specific surface area SS is represented by the formula (1) below wherein particle diameter d is a volume cumulative particle diameter Das measured by a particle size distribution measurement method using image analysis and ρ is a theoretical density of the metal ...

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Номер записи: 42

29-08-2013 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVES COMPRISING AT LEAST ONE METAL PRECURSOR

Номер: US20130224474A1

Автор: Dreezen Gunther, Theunissen Liesbeth

Принадлежит: Henkel AG & Co. KGaa

The present invention relates to thermally curable adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The thermally curable adhesives comprise at least one thermosetting resin, electrically conductive particles having an average particle size of 1 μm to 50 μm, and at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive. 1. A thermally curable adhesive comprising:a) at least one thermosetting resin;b) electrically conductive particles having an average particle size of 1 to 50 μm; andc) at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive.2. The thermally curable adhesive according to claim 1 , wherein the thermosetting resin is selected from epoxy resins claim 1 , benzoxazine resins claim 1 , acrylate resins claim 1 , bismaleimide resins claim 1 , cyanate ester resins claim 1 , polyisobutylene resins and/or combinations thereof.3. The thermally curable adhesive according to claim 1 , wherein the thermosetting resin is selected from epoxy resins.4. The thermally curable adhesive according to claim 1 , wherein the total weight of all thermosetting resins in the thermally curable adhesive is in the range of 3 to 25 wt % claim 1 , preferably in the range of 5 to 18 wt % claim 1 , based on the total amount of the thermally curable adhesive.5. The thermally curable adhesive according to claim 1 , wherein the electrically conductive particles are selected from metal particles claim 1 , metal plated particles or metal alloy particles and/or combinations thereof.6. The thermally curable adhesive according to claim 1 , wherein the electrically conductive particles ...

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Номер записи: 43

12-09-2013 дата публикации

CONDUCTIVE TRANSPARENT ADHESIVE COMPOSITION AND ADHESIVE PREPARED BY USING THE SAME

Номер: US20130234076A1

Автор: Kim Byeong Gwan, Kim Eun Kyoung, KIM Jeong Hun, Kim Young Jung

Принадлежит: INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITY

An electroconductive transparent adhesive composition containing a transparent adhesive monomer, any one electroconductive mesoporous filler selected from the group consisting of porous carbon, an electroconductive polymer and combinations thereof, and a polymerization initiator, and an electroconductive transparent adhesive produced using the composition are provided. The electroconductive transparent adhesive composition is less expensive and highly economically efficient, and has excellent electrical conductivity and transparency, and has excellent mechanical strength. Thus, the electroconductive transparent adhesive composition can be used in a variety of electrical and electronic applications such as touch screens, displays, and electronic devices. 1. An electroconductive transparent adhesive composition comprising:a transparent adhesive monomer;any one electroconductive mesoporous filler selected from the group consisting of porous carbon, an electroconductive polymer and combinations thereof; anda polymerization initiator.2. The electroconductive transparent adhesive composition according to claim 1 , wherein the porous carbon has an average diameter of pores of 0.5 nm to 1 μm claim 1 , a specific surface area of 0.01 m/g or larger claim 1 , and a specific pore volume of 0.01 cm/g or larger.3. The electroconductive transparent adhesive composition according to claim 1 , wherein the electroconductive polymer is any one selected from the group consisting of polyacetylene claim 1 , polypyrrole claim 1 , polythiophene claim 1 , poly(3-alkylthiophene) claim 1 , polyphenylene sulfide claim 1 , poly-para-phenylene sulfide claim 1 , polyphenylenevinylene claim 1 , poly-para-phenylenevinylene claim 1 , polythienylenevinylene claim 1 , polyphenylene claim 1 , poly-para-phenylene claim 1 , polyazulene claim 1 , polyfuran claim 1 , polyaniline claim 1 , polyselenophene claim 1 , polytellurophene claim 1 , derivatives thereof claim 1 , and combinations thereof.4. The ...

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Номер записи: 44

26-09-2013 дата публикации

LOW SILVER CONTENT PASTE COMPOSITION AND METHOD OF MAKING A CONDUCTIVE FILM THEREFROM

Номер: US20130248777A1

Автор: CHALLINGSWORTH Mark Louis, HARGROVE, JR. Douglas R., MALANGA David J., SGRICCIA Matthew, TREDINNICK Margaret

Принадлежит: Heraeus Precious Metals North America Conshohocken LLC

An electroconductive paste composition is provided. The electroconductive paste composition includes electroconductive metal particles, glass powder, at least one metal oxide powder and an organic vehicle. The electroconductive metal particles include at least one of silver coated metal powder and silver coated metal flake and at least one of uncoated silver powder and uncoated silver flake. In use, the paste is deposited on a specified substrate and fired in an ambient air environment. 1. An electroconductive paste composition comprising:electroconductive metal particles including at least one of silver coated metal powder and silver coated metal flake and at least one of uncoated silver powder and uncoated silver flake;glass powder;at least one metal oxide powder; andan organic vehicle.2. The composition according to claim 1 , wherein the silver coated metal powder is silver coated copper powder and the silver coated metal flake is silver coated copper flake.3. The composition according to claim 1 , wherein the silver coated metal powder or silver coated metal flake comprises 10% to 70% by weight based on a total weight of the composition.4. The composition according to claim 3 , wherein the silver coated metal powder or silver coated metal flake comprises 15% to 40% by weight based on a total weight of the composition5. The composition according to claim 1 , wherein the at least one of silver powder and silver flake comprises 30% to 65% by weight based on a total weight of the composition.6. The composition according to claim 1 , wherein the organic vehicle comprises 10% to 30% by weight based on a total weight of the composition.7. The composition according to claim 1 , wherein a content of the glass powder is 2% to 10% by weight based on a total weight of the composition.8. The composition according to claim 1 , wherein a content of the at least one metal oxide powder is 1% to 5% by weight based on a total weight of the composition.9. The composition according ...

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Номер записи: 45

26-09-2013 дата публикации

NANOWIRE-POLYMER COMPOSITE ELECTRODES

Номер: US20130251943A1

Автор: Pei Qibing, YU Zhibin

Принадлежит: The Regents of the University of California

A method for producing flexible, nanoparticle-polymer composite electrodes is described. Conductive nanoparticles, preferably metal nanowires or nanotubes, are deposited on a smooth surface of a platform to produce a porous conductive layer. A second application of conductive nanoparticles or a mixture of nanoparticles can also be deposited to form a porous conductive layer. The conductive layer is then coated with at least one coating of monomers that is polymerized to form a conductive layer-polymer composite film. Optionally, a protective coating can be applied to the top of the composite film. In one embodiment, the monomer coating includes light transducing particles to reduce the total internal reflection of light through the composite film or pigments that absorb light at one wavelength and re-emit light at a longer wavelength. The resulting composite film has an active side that is smooth with surface height variations of 100 nm or less. 1. A method for producing flexible , nanoparticle-polymer composite electrodes , comprising:applying a plurality of conductive nanoparticles to a smooth surface of a platform to form a porous conductive layer;coating the conductive layer with at least one coating of monomers;curing the monomers in situ to form a conductive layer-polymer composite film; andremoving the composite film from the platform;wherein a conductive composite film is produced with a conductive smooth surface with surface height variations of 100 nm or less.2. A method as recited in claim 1 , wherein the composite film has a polymer layer that is greater than 100 micrometers thick and a conductive layer that is less than 100 micrometers thick.3. A method as recited in claim 1 , further comprising:depositing a releasing agent on the surface of the platform to facilitate the separation of the composite film from the platform.4. A method as recited in claim 1 , further comprising:applying a plurality of a second type of conductive nanoparticles to the first ...

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Номер записи: 46

26-09-2013 дата публикации

LOW TEMPERATURE SINTERING CONDUCTIVE METAL FILM AND PREPARATION METHOD THEREOF

Номер: US20130251966A1

Автор: KIM Yong-Jin, Yang Sangsun, Yu Ji-Hun

Принадлежит:

A low-temperature sintered conductive metal ink and a method for preparing the same are provided. To be specific, the preparation method includes the following steps of: preparing the conductive film or pattern by printing a conductive metal ink including metal nanocolloids, metal salts, and polymers reacted with the metal salts and preparing the metal nanocolloids (step ); preparing a mixture by mixing the metal salts and polymers (step ); preparing the metal ink by stirring the metal nanocolloids and the metal salt/polymer mixture prepared at steps and (step ); printing the metal ink prepared at step (step ); and drying and thermally treating a product printed at step (step ). 1. A conductive metal film or pattern prepared by printing a conductive metal ink , the conductive metal ink comprising metal nanocolloids , metal salts , and polymers reacted with the metal salts.2. The conductive metal film or pattern as set forth in claim 1 , wherein the metal nanocolloids comprise conductive metal particles of copper or aluminum.3. The conductive metal film or pattern as set forth in claim 2 , wherein a size of the conductive metal particles is in a range of 1 to 500 nm.4. The conductive metal film or pattern as set forth in claim 1 , wherein a metal content of the metal nanocolloids is in a range of 0.1 to 80 wt %.5. The conductive metal film or pattern as set forth in claim 1 , wherein the metal salts are selected from the group consisting of metal organics claim 1 , metal nitrides claim 1 , and metal chlorides.6. The conductive metal film or pattern as set forth in claim 1 , wherein the polymers reacted with the metal salts are selected from the group consisting of polyvinyl pyrrolidone claim 1 , ethylene diamine claim 1 , and diethyleneamine.7. The conductive metal film or pattern as set forth in claim 1 , wherein the conductive metal ink further comprises a viscosity controlling agent.8. The conductive metal film or pattern as set forth in claim 1 , wherein the ...

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Номер записи: 47

03-10-2013 дата публикации

Via plugs

Номер: US20130256841A1

Автор: Helmut Hagleitner, Van Mieczkowski, William T. Pulz

Принадлежит: Cree Inc

The present disclosure relates to providing via plugs in vias of a semiconductor material. The via plugs may be formed of a polymer, such as a polyimide, that can withstand subsequent soldering and operating temperatures. The via plugs effectively fill the vias to prevent the vias from being filled substantially with solder during a subsequent soldering processes.

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Номер записи: 48

03-10-2013 дата публикации

CHARGE COLLECTION TAPE

Номер: US20130260171A1

Автор: HARKINS Brian A.

Принадлежит: ADHESIVES RESEARCH, INC.

A charge collection tape is disclosed that includes a foil substrate and an adhesive layer laminated on the foil substrate. The foil substrate is constructed of an aluminum base foil having a conductive metal coating overlying and in direct contact with a non-oxidized surface of the aluminum base foil. A method of making the charge collection tape is also disclosed. 1. A charge collection tape comprising:a foil substrate; andan adhesive layer laminated on the foil substrate,wherein the foil substrate comprises an aluminum base foil having a conductive metal coating overlying and in direct contact with a non-oxidized surface of the aluminum base foil.2. The charge collection tape of claim 1 , wherein the aluminum base foil is a 1000 or 1100 series aluminum alloy.3. The charge collection tape of claim 1 , wherein the conductive metal coating comprises a metal selected from the group consisting of gold claim 1 , silver claim 1 , tin claim 1 , nickel claim 1 , copper claim 1 , platinum claim 1 , palladium claim 1 , zinc claim 1 , and alloys thereof.4. The charge collection tape of claim 1 , wherein the conductive metal coating comprises a layer of copper overlaid by tin.5. The charge collection tape of claim 1 , wherein the thickness of the foil substrate is in the range of 0.00024 inches to 0.005 inches.6. The charge collection tape of claim 1 , wherein the metal coating has a thickness in the range of 0.1 microns to 10 microns.7. The charge collection tape of claim 1 , wherein the metal coating comprises at least one layer of a conductive metal having a thickness in the range of 0.1 microns to 5 microns.8. The charge collection tape of claim 1 , wherein the adhesive is a conductive acrylic adhesive.9. The charge collection tape of claim 8 , wherein the adhesive contains in the range of 0.1% to 90% by weight of conductive fillers.10. A charge collection tape comprising:a foil substrate having a thickness in the range of about 0.0005 inches to about 0.005 inches ...

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Номер записи: 49

17-10-2013 дата публикации

HIGHLY CONDUCTIVE COMPOSITES

Номер: US20130269866A1

Автор: COOPER Gregory D., Gonen-Williams Zehra Serpil, Xu Jun, XU WEI

Принадлежит: PIXELLIGENT TECHNOLOGIES, LLC

Domain segregation of polymer blends or block copolymers in the presence of thermal conducting high aspect ratio nanocrystals leads to preferential placement of conductive filler either inside one domain, which promote the self-assembly of a thermal and/or electrical conducting pathway composed of high aspect ratio filler. The self-assembly of such thermal and/or electrical conducting pathway effectively enhances the thermal and/or electrical conductivity of the composite with significantly less amount of filler. 1. A process for assembling a system having enhanced thermal conductivity , comprising:Providing an integrated circuit and a heat sink; andForming a multi-component thermal conductor therebetween, wherein the multi-component thermal conductor comprises a matrix material with a second phase material comprising filler material dispersed therein.2. A transparent multi-component electrical conductor , comprising:a first component comprising a optically transparent matrix polymer;a second component comprising an optically transparent, low melting point material immiscible with the first component; anda third component comprising a filler material with higher electrical conductivity than the first and second components;wherein the third component is dispersed into the second component and the second component is dispersed within the polymer matrix and wherein the third component provides enhanced electrical conductivity to the multi-component electrical conductor.3. The optically transparent multi-component electrical conductor claim 2 , according to wherein the first and second component each have an index of refraction that are close enough to each other to avoid significant optical scattering.4. The optically transparent multi-component electrical conductor according to claim 2 , wherein the first claim 2 , second and third components each have an index of refraction and wherein the real part of the indices of refraction of the first claim 2 , second and third ...

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Номер записи: 50

24-10-2013 дата публикации

Structure for bonding metal plate and piezoelectric body and bonding method

Номер: US20130276977A1

Автор: Hideo Nakagoshi, Hiroki Kitayama, Kiyoshi Kurihara

Принадлежит: Murata Manufacturing Co Ltd

A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 μm to about 50 μm. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.

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Номер записи: 51

31-10-2013 дата публикации

COMPOSITION FOR ADHESIVE HYDROGEL AND USE THEREOF

Номер: US20130289157A1

Автор: Fujiwara Yasuhiro, HATORI Takaaki, SATO Kaori

Принадлежит: SEKISUI PLASTICS CO., LTD.

A composition for an adhesive hydrogel, comprising at least: a polymeric matrix former; water; and a polyhydric alcohol; the polymeric matrix former comprising at least: (a) (meth)acrylic acid, a (meth)acrylic acid derivative or a vinyl derivative having 2 carboxyl groups and 4 or 5 carbon atoms; (b) (meth)acrylamide or a (meth)acrylamide derivative; (c) N-vinyl-2-caprolactam and/or N-vinyl-2-valerolactam; and (d) a cross-linkable monomer, wherein the content percentage of the (b) in the composition for an adhesive hydrogel is 2 to 20% by weight. 1. A composition for an adhesive hydrogel , comprising at least: apolymeric matrix former; water; and a polyhydric alcohol;the polymeric matrix former comprising at least:(a) (meth)acrylic acid, a (meth)acrylic acid derivative or a vinyl derivative having 2 carboxyl groups and 4 or 5 carbon atoms;(b) (meth)acrylamide or a (meth)acrylamide derivative;(c) N-vinyl-2-caprolactam and/or N-vinyl-2-valerolactam; and(d) a cross-linkable monomer,wherein the content percentage of the (b) in the composition for an adhesive hydrogel is 2 to 20% by weight.2. The composition for an adhesive hydrogel of claim 1 , wherein the content percentage of the (a) is 2 to 20% by weight claim 1 , and the content percentage of the (c) is 0.1 to 25% by weight.3. The composition for an adhesive hydrogel of claim 1 , wherein the polymeric matrix former contains the (e) polyvinylpyrrolidone or a polyvinylpyrrolidone derivative.4. The composition for an adhesive hydrogel of claim 3 , wherein the content percentage of the (e) is 0.1 to 20% by weight.5. The composition for an adhesive hydrogel of claim 1 , wherein the polyhydric alcohol is at least one kind selected from group consisting of ethylene glycol claim 1 , propylene glycol claim 1 , butanediol claim 1 , glycerin claim 1 , pentaerythritol claim 1 , sorbitol claim 1 , polyethylene glycol claim 1 , polypropylene glycol claim 1 , polyglycerol and polyoxyethylene polyglyceryl ether.6. The composition ...

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Номер записи: 52

21-11-2013 дата публикации

Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film

Номер: US20130306916A1

Автор: Gao Junbo, Hoang Gina

Принадлежит: Henkel Corporation

A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater. 1. A conductive adhesive composition comprising:(i) a thermosetting resin,(ii) optionally, a film-forming resin,(iii) a conductive filler, and(iv) a chain extended epoxy prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy.2. The conductive adhesive composition according to in which the chain extended epoxy is present in the composition an amount of 1-20 wt % of the total composition.6. The conductive adhesive composition according to in which the stoichiometric ratio of the total epoxy functional groups to the phenolic functional groups in the chain extended epoxy ranges from 0.05 to 30.8. The conductive adhesive composition according to in which the thermosetting resin is a bismaleimide selected from the group consisting of 4 claim 1 ,4′-diphenylmethane bismaleimide claim 1 , 4 claim 1 ,4′diiphenylether bismaleimide claim 1 , 4 claim 1 ,4′diiphenylsulfone bismaleimide claim 1 , phenylmethane maleimide claim 1 , m-phenylene bismaleimide claim 1 , 2 claim 1 ,2′-bis[4-(4-maleimidophenoxy)phenyl]propane claim 1 , 3 claim 1 ,3′-dimethyl-5 claim 1 ,5′-diethyl-4 claim 1 ,4′-diphenylmethane bismaleimide claim 1 , 4-methyl-1 claim 1 ,3-phenylene bismaleimide claim 1 , 1 claim 1 ,6′-bismaleimide-(2 claim 1 ,2 claim 1 ,4-trimethyl)hexane claim 1 , 1 claim 1 ,3-bis(3-maleimidophenoxy)benzene claim 1 , and 1 claim 1 ,3-bis(4-maleimidophenoxy)-benzene.10. The ...

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Номер записи: 53

28-11-2013 дата публикации

SOLUBLE METAL SALTS FOR USE AS CONDUCTIVITY PROMOTERS

Номер: US20130313489A1

Автор: Dershem Stephen M.

Принадлежит: DESIGNER MOLECULES, INC.

The present invention provides conductivity promoters, and in particular soluble conductivity promoters that contain a hydrocarbon moiety or a siloxane moiety and a metal. The present invention also provides methods of making soluble conductivity promoters and adhesive compositions containing the conductivity promoters of the invention. 1. A soluble conductivity promoter comprising a metal salt , the soluble conductivity promoter including:a) a siloxane moiety, andb) a metal ion.2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. The soluble conductivity promoter of claim 1 , wherein the metal salt is a liquid at room temperature.9. The soluble conductivity promoter of claim 1 , wherein the metal salt decomposes at a temperature less than about 220° C.10. The soluble conductivity promoter of claim 1 , wherein the metal salt decomposes at a temperature less than about 200° C.11. The soluble conductivity promoter of claim 1 , wherein the metal ion is selected from the group consisting of Ag claim 1 , Pd claim 1 , Ni claim 1 , Pt claim 1 , and Au.12. The soluble conductivity promoter of claim 11 , wherein the metal ion is Pd.14. (canceled)15. (canceled)16. A method of increasing the conductivity of a thermoset resin comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a) incorporating a soluble conductivity promoter of into the resin; and'}b) heating the resin, wherein the conductivity promoter decomposes to generate at least one free metal.17. The method of claim 16 , wherein nano-disperse metal domains are formed within the thermoset resin during step b.18. An adhesive composition comprising: a silver flake filled adhesive and a conductivity promoter according to claim 1 , wherein the silver flake filled adhesive comprises an organic component and a silver flake component.19. The adhesive composition of claim 18 , wherein the organic component comprises about 15% of the total adhesive composition and the conductivity promoter is ...

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Номер записи: 54

05-12-2013 дата публикации

ISOTROPIC CONDUCTIVE ADHESIVE

Номер: US20130323501A1

Автор: Helland Tore, Kristiansen Helge, Redford Keith

Принадлежит: CONPART AS

An isotropic conductive adhesive having silver coated polymer beads within an adhesive matrix and a method of forming an isotropic conductive adhesive are disclosed. The mean average diameter of the polymer cores of the beads is less than 30 μm, and the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads. 1. An isotropic conductive adhesive comprising silver coated polymer beads within an adhesive matrix , wherein the mean average diameter of the polymer cores of the beads is less than 30 μm and wherein the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.2. The isotropic conductive adhesive of claim 1 , wherein the mean average diameter of the polymer cores of the beads is 25 μm or lower.3. The isotropic conductive adhesive of claim 1 , wherein the mean average diameter of the polymer cores of the beads is 20 μm or lower.4. The isotropic conductive adhesive of claim 1 , wherein the polymer cores of the beads have a coefficient of variation (CV) in diameter of less than 5% claim 1 ,5. The isotropic conductive adhesive of claim 1 , wherein the polymer cores of the beads have a coefficient of variation (CV) in diameter of less than 3%.6. The isotropic conductive adhesive of claim 1 , wherein the incidence of polymer cores of the beads with a diameter less than two thirds of the mean diameter or with a diameter greater than 1.5 times the mean diameter is less than 1 in 1000.7. The isotropic conductive adhesive of claim 1 , wherein the average thickness of the silver is 350 nm or less8. The isotropic conductive adhesive of claim 7 , wherein the average thickness of the silver is less than 3% of the diameter of the polymer core of the bead.9. The isotropic conductive adhesive of claim 1 , wherein the average thickness of the silver is less than 5% of the diameter of the polymer core of the bead.10. The ...

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Номер записи: 55

12-12-2013 дата публикации

METHOD OF MANUFACTURING REUSE PASTE, REUSE PASTE AND METHOD OF MANUFACTURING CIRCUIT BOARD USING REUSE PASTE

Номер: US20130327994A1

Автор: Himori Tsuyoshi, Katsumata Masaaki, Kondou Toshikazu

Принадлежит:

A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste. 1. A method of manufacturing a reuse paste , the method comprising:preparing a fiber piece housing paste that includes a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece dropping off from a prepreg used for manufacturing a circuit board;producing a filtered recovery paste by filtering the fiber piece housing paste, which remains in a paste state, by using a filter; andproducing a reuse paste by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.2. The method of manufacturing a reuse paste of claim 1 ,wherein the latent curing agent has a softening temperature of not less than 80° C. and not more than 180° C.3. The method of manufacturing a reuse paste of claim 1 ,wherein the latent curing agent has a particle diameter of not less than 0.5 μm and not more than 30 μm.4. The method of manufacturing a reuse paste of claim 1 ,wherein the latent curing agent is a solid from the preparing of the fiber piece housing paste to the producing of the reuse paste.5. The method of manufacturing a reuse ...

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Номер записи: 56

26-12-2013 дата публикации

Method of manufacturing a resistor paste

Номер: US20130344342A1

Автор: Yuko Ogata

Принадлежит: EI Du Pont de Nemours and Co

A method of manufacturing a resistor paste comprising steps of: (a) preparing a basic resistor paste comprising, (i) a conductive powder, (ii) a first glass frit, and (iii) a first organic medium; and (b) preparing a glass paste as a TCR driver comprising, (iv) a second glass frit comprising manganese oxide, and (v) a second organic medium, (c) adding the glass paste to the basic resistor paste to obtain a resistor paste with a desired TCR.

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Номер записи: 57

02-01-2014 дата публикации

HIGH PERFORMANCE DIE ATTACH ADHESIVES (DAAs) NANOMATERIALS FOR HIGH BRIGHTNESS LED

Номер: US20140001414A1

Автор: Lang Xianxin, Li Zhiying, Liu Chenmin, Lu Dong, Wang Bo

Принадлежит: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED

The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature. 1. A method of preparing a one-part and heat-curable DAA composition comprising:providing a thermally and electrically conductive filler;providing a polymer matrix;providing a solvent; andmixing the thermally and electrically conductive filler, polymer matrix and a solvent to form the composition,wherein said filler is an inorganic compound with 30-96% by weight of the composition, said inorganic filler being further modified prior to said mixing to form a modified filler formulation, said modified filler formulation comprising microparticles having a diameter of about 13-50 μm in about 20-100% by weight of said inorganic filler, microparticles having a diameter of about 6-12 μm in about 10-100% by weight of said inorganic filler, particles having a diameter of about 5-6 μm in about 10-90% by weight of said inorganic fillers, microparticles having a diameter of 1-5 μm in about 20-100% by weight of said inorganic filler, nanoparticles having a diameter of about 10-200 nm in about 1-10% by weight of said inorganic filler, and/or nanorods having a diameter of about 100 nm-1 μm and a length of about 1-10 μm in 1-10% by weight of said inorganic filler; andwherein said polymer matrix is 2-30% by weight of the composition; said solvent is 2-40% by weight of the composition; andwherein said composition is formed with thermal conductivity of at ...

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Номер записи: 58

02-01-2014 дата публикации

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

Номер: US20140001636A1

Автор: KINOSHITA Yoshito, NASHIDA Norihiro, NISHIZAWA Tatsuo, Saito Takashi

Принадлежит: FUJI ELECTRIC CO., LTD.

Plating pre-processing is carried out before carrying out a plating process on the surface of a conducting section provided on a semiconductor wafer. A first metal film is formed on the surface of the conducting section by NiP alloy plating process. A second metal film is formed on the surface of the first metal film by immersion Ag plating process. The semiconductor wafer is diced and cut into semiconductor chips. A conductive composition containing Ag particles is applied to the surface of the second metal film which is on the front surface of the semiconductor chip. A bonding layer containing Ag particles is formed by sintering the conductive composition through heating. A metal plate is then bonded to the surface of the second metal film via the bonding layer containing Ag particles. The electronic component has high bonding strength, excellent thermal resistance and heat radiation properties. 1. An electronic component , comprising:a conducting section provided on a surface of a semiconductor element;a first metal film provided on a surface of the conducting section;a second metal film provided on a surface of the first metal film; anda bonding layer provided on a surface of the second metal film and containing silver particles,wherein the thickness of the second metal film is greater than or equal to 0.03 μm and is less than 1.5 μm.2. The electronic component according to claim 1 , wherein the second metal film is composed of particles having a diameter greater than or equal to 15 nm and less than 600 nm.3. The electronic component according to claim 1 , wherein the second metal film is made from a material having at least silver or gold as a main component.4. The electronic component according to claim 1 , wherein the second metal film is an electroplating film or an electroless plating film.5. The electronic component according to claim 1 , wherein the conducting section is made from a material having at least copper or aluminum as a main component.6. The ...

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Номер записи: 59

09-01-2014 дата публикации

Submicron connection layer and method for using the same to connect wafers

Номер: US20140008801A1

Автор: Kuan-Neng Chen, Yao-Jen Chang

Принадлежит: Individual

A submicron connection layer and a method for using the same to connect wafers is disclosed. The connection layer comprises a bottom metal layer formed on a connection surface of a wafer, an intermediary diffusion-buffer metal layer formed on the bottom metal layer, and a top metal layer formed on the intermediary diffusion-buffer metal layer. The melting point of the intermediary diffusion-buffer metal layer is higher than the melting points of the top and bottom metal layers. The top and bottom metal layers may form a eutectic phase. During bonding wafers, two top metal layers are joined in a liquid state; next the intermediary diffusion-buffer metal layers are distributed uniformly in the molten top metal layers; then the top and bottom metal layers diffuse to each other to form a low-resistivity eutectic intermetallic compound until the top metal layers are completely exhausted by the bottom metal layers.

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Номер записи: 60

09-01-2014 дата публикации

DRY ADHESIVES AND METHODS FOR MAKING DRY ADHESIVES

Номер: US20140010988A1

Автор: KIM Seok, Sitti Metin

Принадлежит:

A dry adhesive and a method of forming a dry adhesive. The method includes forming an opening through an etch layer and to a barrier layer, expanding the opening in the etch layer at the barrier layer, filling the opening with a material, removing the barrier layer from the material in the opening, and removing the etch layer from the material in the opening. 1. An adhesive fiber array , comprising: a tip having with a cross-sectional area;', 'a stem having a cross-sectional area smaller than the tip cross-sectional area; and', 'wherein the stem is connected to the tip, and, 'a plurality of fibers, wherein each fiber of the plurality of fibers includesa backing layer, wherein the plurality of fibers are connected to the backing layer.2. The adhesive fiber array according to claim 1 , wherein the tip further comprises a flat surface.3. The adhesive fiber array according to claim 1 , wherein the stem further comprises a base at a proximal end of the stem claim 1 , and wherein the backing layer is connected to the base of the stem.4. The adhesive fiber array according to claim 1 , wherein the stem further comprises a distal end and a proximal end claim 1 , and wherein the backing layer is connected to the proximal end of the stem and the tip is connected to the distal end of the stem.5. The adhesive fiber array according to claim 1 , further comprising: a tip having a cross-sectional area;', 'a stem having a cross-sectional area smaller than the tip cross-sectional area; and', 'wherein the second plurality of fibers is connected to the tip of the plurality of fibers., 'a second plurality of fibers, wherein each fiber of the second plurality of fibers includes6. The adhesive fiber array according to claim 5 , wherein the tip of the each fiber of the second plurality of fibers further comprises a flat surface.7. The adhesive fiber array according to claim 5 , wherein the each fiber of the second plurality of fibers further comprises a base claim 5 , and wherein the tip ...

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Номер записи: 61

16-01-2014 дата публикации

POLYMER THICK FILM SOLDER ALLOY/METAL CONDUCTOR COMPOSITIONS

Номер: US20140018482A1

Автор: Dorfman Jay Robert

Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

This invention provides a polymer thick film conductor composition comprising (a) a solder alloy powder selected from the group consisting of (i) a tin, silver, and copper alloy powder, (ii) a fin and bismuth alloy powder, and (iii) mixtures thereof, (b) a metal selected from the group consisting of silver, copper, gold, aluminum and mixtures thereof, and (c) an organic medium comprising a thermoplastic resin dissolved in an organic solvent, wherein the solder alloy powder and the metal are dispersed in the organic medium. 2. The composition of claim 1 , wherein said metal is silver claim 1 , copper claim 1 , or a mixture thereof.3. The composition of claim 2 , wherein said metal is silver.4. The composition of claim 1 , wherein said solder alloy powder is a tin claim 1 , silver claim 1 , and copper alloy that contains at least 90% tin by weight and wherein said organic medium contains 16 to 30% vinyl co-polymer or phenoxy resin by weight.5. The composition of claim 1 , wherein said solder alloy powder is a tin and bismuth alloy that contains at least 40% tin by weight claim 1 , and wherein said organic medium contains 16 to 25% vinyl co-polymer resin by weight.6. The composition of claim 1 , wherein the boiling point of the organic solvent is in the range of 180° C. to 250° C.7. The composition of claim 1 , said composition comprising 60 to 75 wt % solder alloy powder and 15 to 30 wt % metal.8. The composition of claim 7 , wherein said metal is silver claim 7 , copper claim 7 , or a mixture thereof.9. The composition of claim 8 , wherein said metal is silver.10. The composition of claim 7 , wherein said solder alloy powder is a tin claim 7 , silver claim 7 , and copper alloy that contains at least 90% tin by weight and wherein said organic medium contains 16 to 30% vinyl co-polymer or phenoxy resin by weight claim 7 ,11. The composition of claim 7 , wherein said solder alloy powder is a tin and bismuth alloy that contains at least 40% tin by weight claim 7 , and ...

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Номер записи: 62

30-01-2014 дата публикации

SILVER SINTERING COMPOSITIONS WITH FLUXING OR REDUCING AGENTS FOR METAL ADHESION

Номер: US20140030509A1

Автор: Kuder Harry Richard, Sanchez Juliet Grace

Принадлежит: Henkel Corporation

A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ≦250° C. without the application of pressure. 1. A conductive composition comprising (i) micron- or submicron-sized silver flakes and (ii) a fluxing agent , or an oxygenated solvent , or a peroxide , in the absence of an organic resin.2. The conductive composition according to in which the fluxing agent is present and is selected from the group consisting of 2 claim 1 ,2 claim 1 ,6 claim 1 ,6-tetramethylpiperidinoxy claim 1 , 4 claim 1 ,4′-dithiodibutyric acid claim 1 , succinic acid claim 1 , 8-hydroxyquinoline claim 1 , nitrolotrimethylphosphonic acid claim 1 , triethanolamine claim 1 , glutaric acid claim 1 , malic acid claim 1 , tartaric acid claim 1 , acetylacetone claim 1 , glycerin claim 1 , dithiothreitol claim 1 , 1 claim 1 ,2 claim 1 ,3-trihydroxy-benzene.3. The conductive composition according to in which the fluxing agent is present in the composition in an amount of 0.1 to 10.0% by weight of the total composition.4. The conductive composition according to in which the oxygenated solvent is present and is selected from the group consisting of 2-(2-ethoxy-ethoxy)-ethyl acetate claim 1 , propylene glycol monoethyl ether claim 1 , diethylene glycol monobutyl ether acetate claim 1 , diethylene glycol claim 1 , dipropylene glycol claim 1 , monobutyl ether acetate claim 1 , and propylene carbonate.5. The conductive composition according to in which the oxygenated solvent is present in an amount of 0.1 to 15.0% by weight of the total composition.6. The conductive composition according to in which peroxide is present and is selected from the group consisting of tertiary-butyl peroxy-2-ethylhexanoate claim 1 , tertiary-butyl peroxyneo-decanoate ...

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Номер записи: 63

30-01-2014 дата публикации

Method of manufacturing copper electrode

Номер: US20140030658A1

Автор: Masakatsu Kuroki, Takeshi Kono

Принадлежит: EI Du Pont de Nemours and Co

A method for manufacturing an electrode comprising the steps of: applying onto a substrate a conductive paste to form a conductive paste layer comprising; (i) 100 parts by weight of a copper powder coated with a metal oxide selected from the group consisting of silicon oxide (SiO 2 ), zinc oxide (ZnO), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), magnesium oxide (MgO) and a mixture thereof; (ii) 5 to 30 parts by weight of a boron powder; and (iii) 0.1 to 10 parts by weight of a glass frit; dispersed in (iv) an organic vehicle; and firing the conductive paste in air.

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Номер записи: 64

06-02-2014 дата публикации

ADHESIVE MATERIAL WITH CARBON MATERIAL AND METHOD FOR ITS PRODUCTION AND USE

Номер: US20140034231A1

Автор: Meinen Thomas, Schubert Tim, Zenkel Christian

Принадлежит:

The present invention relates to an adhesive material, especially an electrically and/or thermally and/or radiation-curing or curable adhesive material, having at least one adhesive constituent and/or adhesive matrix, and moreover having at least one additive in the form of a carbon material, especially based on carbon nanomaterials and/or carbon micromaterials, present in the adhesive constituent and/or adhesive matrix. The invention further relates to a method for producing, activating and/or curing an adhesive material. Finally the invention also relates to a method for adhesively bonding two substrates. 114-. (canceled)15. An adhesive material comprising at least one adhesive constituent , adhesive matrix , or both and at least one additive in the form of a carbon material , wherein the adhesive material is cured or curable electrically , thermally , by radiation , or a combination thereof.16. The adhesive material of wherein the carbon material is a carbon nanomaterial claim 15 , carbon micromaterial claim 15 , or both.17. The adhesive material of wherein the carbon material is microwave-absorbing claim 15 , predispersed claim 15 , based on carbon nanotubes claim 15 , based on a carbon nanotube-containing mixture of various carbon materials claim 15 , or a combination of thereof.18. The adhesive material of wherein the carbon material has carbon nanotubes at a concentration above 0.2 wt %.19. The adhesive material of further comprising at least one hardener claim 15 , another carbon-containing material claim 15 , soluble carbon nanotube granules claim 15 , or a mixture thereof.20. The adhesive material of wherein the adhesive constituent or adhesive matrix is polyurethane-based.21. A method for producing an adhesive material claim 15 , comprising dispersing claim 15 , mixing claim 15 , or distributing at least one additive in the form of a carbon material in an adhesive material comprising an adhesive constituent claim 15 , an adhesive matrix claim 15 , or both ...

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Номер записи: 65

06-02-2014 дата публикации

THERMOFORMABLE POLYMER THICK FILM SILVER CONDUCTOR AND ITS USE IN CAPACITIVE SWITCH CIRCUITS

Номер: US20140037941A1

Автор: Arancio Vincenzo, Dorfman Jay Robert

Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process. 21. The capacitive switch circuit of , said polymer thick film conductive composition further comprising(d) 1-20 wt % of a third organic solvent, wherein the third organic solvent is diacetone alcohol and wherein the weight percent is based on the total weight of said polymer thick film conductive composition.3. The capacitive switch circuit of claim 1 , wherein said silver is in the form of silver flakes.4. The capacitive switch circuit of claim 1 , wherein said thermoplastic urethane resin is a urethane homopolymer or a polyester-based copolymer and said thermoplastic urethane resin is a polyester-based copolymer.6. The capacitive switch circuit of claim 5 , said polymer thick film conductive composition further comprising:(d) 1-20 wt % of a third organic solvent, wherein the third organic solvent is diacetone alcohol and wherein the weight percent is based on the total weight of said polymer thick film conductive composition.7. The capacitive switch circuit of claim 5 , wherein said silver is in the form of silver flakes.8. The capacitive switch circuit of claim 5 , wherein said thermoplastic urethane resin is a urethane homopolymer or a polyester-based copolymer and said thermoplastic urethane resin is a polyester-based copolymer.9. The capacitive switch circuit of claim 5 , wherein said capacitive switch circuit is thermoformed.10. The capacitive switch circuit of claim 6 , wherein said capacitive switch circuit ...

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Номер записи: 66

13-02-2014 дата публикации

ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME

Номер: US20140042374A1

Автор: BAE Sang Sik, CHO Jang Hyun, KIM Jin Kyu, KO Youn Jo, PARK Jin Seong, UH Dong Seon

Принадлежит:

An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the anisotropic conductive film has a halogen ion content of more than 0 ppm to about 100 ppm. 1. An anisotropic conductive film , comprising:a binder part;a curing part;an initiator; andconductive particles,wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, and the anisotropic conductive film has a halogen ion content of more than 0 ppm to about 100 ppm.2. The anisotropic conductive film as claimed in claim 1 , wherein the anisotropic conductive film has the halogen ion content of more than 0 ppm to about 50 ppm.3. The anisotropic conductive film as claimed in claim 1 , wherein the anisotropic conductive film has an electrical conductivity of more than 0 μS/cm to about 100 μS/cm.4. The anisotropic conductive film as claimed in claim 1 , wherein the binder part includes the NBR resin claim 1 , and the NBR resin has a halogen ion content of more than 0 ppm to about 100 ppm.5. The anisotropic conductive film as claimed in claim 1 , wherein the binder part includes the urethane resin claim 1 , and the urethane resin has a halogen ion content of more than 0 ppm to about 100 ppm.6. The anisotropic conductive film as claimed in claim 1 , wherein the binder part further includes an acrylic resin.7. The anisotropic conductive film as claimed in claim 6 , wherein the binder part includes about 20 to about 80% by weight (wt %) of the acrylic resin and about 20 to about 80 wt % of the NBR resin claim 6 , the NBR resin having a halogen ion content of more than 0 ppm to about 100 ppm.8. The anisotropic conductive film as claimed in claim 6 , wherein the binder part includes about 20 to about 80 wt % of the acrylic resin and about 20 to about 80 wt % of the urethane resin claim 6 , the urethane resin ...

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Номер записи: 67

13-02-2014 дата публикации

ADHESIVE LAYER FOR OPTICAL FILM AND METHOD FOR PRODUCING SAME, ADHESIVE OPTICAL FILM AND METHOD FOR PRODUCING SAME, IMAGE DISPLAY DEVICE, AND COATING LIQUID SUPPLY DEVICE

Номер: US20140044953A1

Автор: Ishii Takaaki, Makihata Yousuke, Masuda Tomoaki, Morohoshi Tsutomu, Ryu Sonjin, Tomoguchi Naoki

Принадлежит: NITTO DENKO CORPORATION

A method for manufacturing a pressure-sensitive adhesive layer for use on an optical film, the method includes a filtration step including filtering a pressure-sensitive adhesive coating liquid under a differential pressure of more than 0 kPa and not more than 150 kPa using a depth type filter having a filtration accuracy of 1 to 20 μm. The pressure-sensitive adhesive coating liquid contains an aqueous dispersion-type pressure-sensitive adhesive; and an application and drying step including applying the filtered pressure-sensitive adhesive coating liquid and then drying the coating liquid. 1. A method for manufacturing a pressure-sensitive adhesive layer for use on an optical film , the method comprising: a filtration step comprising filtering a pressure-sensitive adhesive coating liquid under a differential pressure of more than 0 kPa and not more than 150 kPa using a depth type filter having a filtration accuracy of 1 to 20 μm , wherein the pressure-sensitive adhesive coating liquid contains an aqueous dispersion-type pressure-sensitive adhesive; and an application and drying step comprising applying the filtered pressure-sensitive adhesive coating liquid and then drying the coating liquid.2. The method according to claim 1 , wherein the depth type filter has a filtration accuracy gradient.3. A pressure-sensitive adhesive layer for use on an optical film claim 1 , comprising a product manufactured by the method according to .4. The pressure-sensitive adhesive layer according to claim 3 , which contains no air bubble and/or contaminant with a maximum length of more than 100 μm and has a surface in which the number of air bubbles and/or contaminants with a maximum length of 20 μm or more is 10 per mor less.5. A method for manufacturing a pressure-sensitive adhesive-type optical film comprising an optical film and a pressure-sensitive adhesive layer placed on at least one side of the optical film claim 3 ,the method comprising the step of forming the pressure- ...

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Номер записи: 68

13-02-2014 дата публикации

Adhesive composition, film adhesive, and bonding method

Номер: US20140044962A1

Автор: Atsushi Kubo, Hirofumi Imai, Takahiro Yoshioka, Takuya Noguchi, Toshiyuki Ogata

Принадлежит: Tokyo Ohka Kogyo Co Ltd

An adhesive composition including an elastomer as a main component, an adhesive layer prepared from the adhesive composition having (i) a storage modulus (G′) of not less than 20,000 Pa at 220° C. and/or (ii) a loss modulus (G″) of not less than 20,000 Pa at 220° C.

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Номер записи: 69

20-02-2014 дата публикации

GRAPHENE NANORIBBON COMPOSITES AND METHODS OF MAKING THE SAME

Номер: US20140048748A1

Автор: Raji Abdul-Rahman O., Tour James M., Zhu Yu

Принадлежит: William Marsh Rice University

In some embodiments, the present invention provides graphene nanoribbon composites that include a polymer matrix and graphene nanoribbons that are dispersed in the polymer matrix. In more specific embodiments, the polymer matrix of the composite is an epoxy matrix, and the graphene nanoribbons of the composite include functionalized graphene nanoribbons. In further embodiments, the composites of the present invention further comprise metals, such as tin, copper, gold, silver, aluminum and combinations thereof. Additional embodiments of the present invention pertain to methods of making the graphene nanoribbon composites of the present invention. In some embodiments, such methods include mixing graphene nanoribbons with polymer precursors to form a mixture, and then curing the mixture to form the composite. 1. A composite , comprising:a polymer matrix; andgraphene nanoribbons dispersed in the polymer matrix.2. The composite of claim 1 , wherein the graphene nanoribbons are selected from the group consisting of functionalized graphene nanoribbons claim 1 , pristine graphene nanoribbons claim 1 , doped graphene nanoribbons claim 1 , graphene oxide nanoribbons claim 1 , reduced graphene oxide nanoribbons claim 1 , and combinations thereof.3. The composite of claim 1 , wherein the graphene nanoribbons comprise functionalized graphene nanoribbons.4. The composite of claim 3 , wherein the graphene nanoribbons are functionalized with functional groups selected from the group consisting of polyethylene glycols claim 3 , aryl groups claim 3 , hydroxyl groups claim 3 , carboxyl groups claim 3 , phenol groups claim 3 , phosphonic acids claim 3 , amine groups claim 3 , and combinations thereof.5. The composite of claim 1 , wherein the graphene nanoribbons comprise stacked graphene nanoribbons.6. The composite of claim 1 , wherein the graphene nanoribbons comprise graphene nanoribbons derived from split multi-walled carbon nanotubes.7. The composite of claim 1 , wherein the ...

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Номер записи: 70

27-02-2014 дата публикации

Method for transferring phases of nanoparticles

Номер: US20140054511A1

Автор: CHEN Yi-Chu, CHOU Kan-Sen

Принадлежит: National Tsing Hua University

The present invention provides a method for transferring phases of nanoparticles, which use a polymer with a molecular weight greater than 5,000 as a dispersant. The first step of the method of the present invention is to synthesize nanoparticles in the polymer aqueous solution. Next, an amphiphilic phase-transfer agent is added into the solution to coat the surface of nanoparticles with bipolar molecules, and then the mixture is added into an organic solvent to form a homogeneous solution. Finally, a salt and an alcohol are added into the homogeneous solution, and then an organic phase layer and an aqueous phase layer through a centrifugal method. The method of the present invention combines the advantages of aqueous process for preparing nanoparticles and transfers the same with a simple phase transferring process to obtain oil-phase nanoparticles, which can be applied to various fields. 1. A method for transferring phases of nanoparticles , which comprises the following steps:(A) synthesizing a plurality of nanoparticles in a polymer solution to form a nanoparticle aqueous solution, wherein a polymer contained in the polymer solution has a molecular weight of 5,000 or more;(B) adding a phase-transfer agent into the nanoparticle aqueous solution, wherein the phase-transfer agent is an amphiphilic molecule having a hydrophobic end and a hydrophilic end;(C) adding an oil phase solvent into the nanoparticle aqueous solution containing the phase-transfer agent to form a homogeneous solution; and(D) adding a salt and an alcohol into the homogeneous solution, and separating the homogeneous solution into an oil phase layer and an aqueous phase layer through a centrifugal method, wherein the nanoparticles are contained in the oil phase layer.2. The method as claimed in claim 1 , wherein the polymer solution is selected from a group consisting of polyvinyl pyrrolidone (PVP) and polyvinyl alcohol (PVA).3. The method as claimed in claim 1 , wherein the nanoparticles is ...

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Номер записи: 71

27-02-2014 дата публикации

Metallic Nanowire Ink Composition for a Substantially Transparent Conductor

Номер: US20140054515A1

Автор: Baldridge Jeffrey, Chesler David Michael, Lewandowski Mark, Lowenthal Mark David, Zheng Lixin

Принадлежит:

An exemplary printable composition comprises a liquid or gel suspension of a plurality of metallic nanofibers or nanowires; a first solvent; and a viscosity modifier, resin, or binder. In various embodiments, an exemplary metallic nanowire ink which can be printed to produce a substantially transparent conductor comprises a plurality of metallic nanowires at least partially coated with a first polymer comprising polyvinyl pyrrolidone having a molecular weight less than about 50,000; one or more solvents such as 1-butanol, ethanol, 1-pentanol, n-methylpyrrolidone, cyclohexanone, cyclopentanone, 1-hexanol, acetic acid, cyclohexanol, and mixtures thereof; and a second polymer or polymeric precursor such as polyvinyl pyrrolidone or a polyimide, having a molecular weight greater than about 500,000. 1. A composition for a substantially transparent conductor , the composition comprising:a plurality of metallic nanowires, substantially all of the metallic nanowires at least partially coated with a first polymer comprising polyvinyl pyrrolidone having a first molecular weight less than about 50,000;a first solvent comprising at least one solvent selected from the group consisting of: cyclohexanol, 2-methyl-2-propanol, 2,3-butanediol, 1-methylcyclohexanol, 1-ethynyl-1-cyclohexanol, 3,3,4-trimethyl-2-pentanol, benzene 1-chloro-4-(trifluoromethyl)-, 1,4-butanediol, triethanolamine, and mixtures thereof; anda second polymer, copolymer or polymeric precursor mixed with the first solvent, the second polymer, copolymer or polymeric precursor having a second molecular weight greater than about 500,000 and comprising at least one polymer, copolymer or polymeric precursor selected from the group consisting of: polyvinyl pyrrolidone, poly-2-vinylpyridine, poly-4-vinylpyridine, polyvinylimidazole, poly-4-vinylphenol, polyvinyl acetate, and mixtures thereof.2. The composition of claim 1 , wherein the second polymer claim 1 , copolymer or polymeric precursor comprises a polyvinyl ...

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Номер записи: 72

13-03-2014 дата публикации

CONDUCTIVE MEMBER, METHOD OF PRODUCING THE SAME, TOUCH PANEL, AND SOLAR CELL

Номер: US20140069488A1

Автор: ASAI Tomohito, MATSUNAMI Yuki, NAKAHIRA Shinichi, Tanaka Satoshi

Принадлежит: FUJIFILM Corporation

A conductive member including: a base material; and a conductive layer disposed on the base material, wherein the conductive layer includes: a metal nanowire including a metal element (a) and having an average minor axis length of 150 nm or less; and a sol-gel cured product obtained by hydrolyzing and polycondensing an alkoxide compound of an element (b) selected from the group consisting of Si, Ti, Zr, and Al; and a ratio of the substance amount of the element (b) contained in the conductive layer to the substance amount of the metal element (a) contained in the conductive layer is in a range of from 0.10/1 to 22/1. 1. A conductive member comprising a base material and a conductive layer disposed on the base material , wherein: a metal nanowire that comprises a metal element (a) and has an average minor axis length of 150 nm or less; and', 'a sol-gel cured product obtained by hydrolyzing and polycondensing an alkoxide compound of an element (b) selected from the group consisting of Si, Ti, Zr, and Al; and, 'the conductive layer comprisesa ratio of a substance amount of the element (b) contained in the conductive layer to a substance amount of the metal element (a) contained in the conductive layer is in a range of from 0.10/1 to 22/1.3. A conductive member , comprising a base material and a conductive layer disposed on the base material , wherein: a metal nanowire that comprises a metal element (a) and has an average minor axis length of 150 nm or less; and', 'a sol-gel cured product obtained by hydrolyzing and polycondensing an alkoxide compound of an element (b) selected from the group consisting of Si, Ti, Zr, and Al; and, 'the conductive layer comprisesa ratio of the mass of the alkoxide compound hydrolyzed and polycondensed to form the sol-gel cured product in the conductive layer to the mass of the metal nanowire contained in the conductive layer is in a range of from 0.25/1 to 30/1.5. The conductive member according to claim 1 , wherein the alkoxide compound ...

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Номер записи: 73

13-03-2014 дата публикации

ANTICORROSION AGENTS FOR TRANSPARENT CONDUCTIVE FILM

Номер: US20140072826A1

Автор: JR. James B., Philip, Zou Chaofeng

Принадлежит:

1,2-Diazine compounds have been found to provide anti-corrosion properties when incorporated into silver nanowire containing films. The effectiveness of such compounds may be enhanced by their introduction into a layer disposed adjacent to a silver nanowire containing layer. 2. The transparent conductive article according to claim 1 , having a transmittance of at least 80% across entire spectrum range of from about 350 nm to about 1100 nm and a surface resistivity of 500 ohm/sq or less.3. The transparent conductive article according to claim 1 , wherein the at least one polymer binder comprises an organic solvent soluble polymer.4. The transparent conductive article according to claim 3 , wherein the organic solvent soluble polymer binder comprises cellulose acetate claim 3 , cellulose acetate butyrate claim 3 , or cellulose acetate propionate claim 3 , or mixtures thereof.5. The transparent conductive article according to claim 1 , wherein{'sub': 1', '2', '3', '4, 'R, R, R, and Rare hydrogen, halogen, hydroxyl, alkyl groups comprising 1 to 6 carbon atoms, aryl groups comprising 6 carbon atoms, alkoxy groups comprising 1 to 6 carbon atoms,'}{'sub': 1', '2', '2', '3', '3', '4, 'or (Rand R) or (Rand R) or (Rand R) are joined together with 4 carbon atoms to form a fused benzo ring.'}7. The transparent conductive article according to claim 1 , further comprising at least one second layer disposed on the at least one first layer claim 1 , the at least one second layer comprising a network of silver nanowires dispersed within at least one polymer binder.9. The method according to claim 8 , wherein the applying the at least one first coating mixture and the applying the at least one second coating mixture occur simultaneously.10. The method according to claim 8 , further comprising applying at least one second coating mixture onto the at least one first coated layer claim 8 , the at least one second coating mixture comprising silver nanowires and at least one polymer ...

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Номер записи: 74

20-03-2014 дата публикации

PRESSURE SENSITIVE ADHESIVE COMPOSITION AND PRESSURE SENSITIVE ADHESIVE SHEET

Номер: US20140077139A1

Автор: Amino Yumiko, Ono Yoshitomo, Uemura Kazue

Принадлежит: LINTEC Corporation

A pressure-sensitive adhesive composition containing a pressure-sensitive adhesive that contains from 40 to 95% by mass of a rubber-based resin not containing a styrene-derived constituent unit, and a photochromic dye of a dithienylethene-based compound, wherein the content of the photochromic dye is from 0.40 to 8.00 parts by mass relative to 100 parts by mass of the pressure-sensitive adhesive, and a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition have excellent weather resistance that can withstand long-term use, a relatively rapid rate of color change from colored to colorless, and excellent peelability to release sheets. 1. A pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive that comprises:from 40 to 95% by mass of a rubber-based resin not containing comprising a styrene-derived constituent unit; anda photochromic dye of a dithienylethene-based compound,wherein a content of the photochromic dye is from 0.40 to 8.00 parts by mass relative to 100 parts by mass of the pressure-sensitive adhesive.2. The pressure-sensitive adhesive composition according to claim 1 , wherein the dithienylethene-based compound is a compound having two aryl groups claim 1 , a hexafluorocyclopentene group claim 1 , or both claim 1 , in a structure of one molecule.3. The pressure-sensitive adhesive composition according to claim 1 , wherein the rubber-based resin comprises a polyisobutylene-based resin in which a content of the polyisobutylene-based resin is from 60 to 100% by mass in the rubber-based resin.4. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive further comprises a tackifier and a content of the tackifier is from 5 to 60% by mass in all components of the pressure-sensitive adhesive.5. A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive ...

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Номер записи: 75

20-03-2014 дата публикации

Base Film and Pressure-Sensitive Adhesive Sheet Provided Therewith

Номер: US20140079947A1

Автор: Akutsu Takashi, Eto Yuki, Hukuzaki Tomohide, Tamura Kazuyuki

Принадлежит:

To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. 1. A base film of a pressure sensitive adhesive sheet to be adhered on a semiconductor wafer , comprising:(A) a layer of a cured product in which a composition including an urethane (meth)acrylate oligomer and a thiol group containing compound is cured by an energy ray irradiation, and(B) a thermoplastic resin layer.2. The base film as set forth in claim 1 , wherein a content of the thiol group containing compound of said composition is 2 mmol or more with respect to 100 g of urethane (meth)acrylate oligomer.3. A pressure sensitive adhesive sheet comprising a pressure sensitive adhesive layer on the base film according to the .4. A pressure sensitive adhesive sheet comprising a pressure sensitive adhesive layer on the base film according to the . The present invention relates to a base film used as a base of a surface protection pressure sensitive adhesive sheet which is preferably used to protect a circuit face of a semiconductor wafer formed with a circuit on a surface, and particularly relates to a base film preferably used for the surface protection pressure sensitive adhesive sheet of the semiconductor wafer formed on a surface with bumps having large height differences. Also, the present invention relates to a pressure sensitive adhesive sheet preferably used as the surface protection pressure sensitive adhesive sheet of the semiconductor wafer comprising a pressure sensitive adhesive agent layer on said base film.While an information terminal apparatus is rapidly becoming thinner, smaller and more multifunctional; a semiconductor which is mounted thereon is also demanded to become further thinner, and to have higher density. In order to make the device further thinner, it is demanded to ...

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Номер записи: 76

27-03-2014 дата публикации

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

Номер: US20140084468A1

Автор: CHOI Hyun Min, EUN Jong Hyuk, KIM Ji Yeon, PARK Kyoung Soo, Park Young Woo, SEO Joon Mo, YU Arum

Принадлежит:

A semiconductor device includes a first connecting member having a first electrode, a second connecting member having a second electrode, and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film electrically connecting the first and second electrodes to each other. The anisotropic conductive film includes a polymer binder resin, an epoxy resin, conductive particles, and a curing agent. The epoxy resin includes a naphthalene ring-containing epoxy resin and a dicyclopentadiene ring-containing epoxy resin. The naphthalene ring-containing epoxy resin is included in an amount of 100 parts by weight to 500 parts by weight based on 100 parts by weight of the dicyclopentadiene ring-containing epoxy resin. 1. A semiconductor device , comprising:a first connecting member having a first electrode;a second connecting member having a second electrode; andan anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film electrically connecting the first and second electrodes to each other, and the anisotropic conductive film including:a polymer binder resin;an epoxy resin;conductive particles; anda curing agent,wherein the epoxy resin includes a naphthalene ring-containing epoxy resin and a dicyclopentadiene ring-containing epoxy resin, andthe naphthalene ring-containing epoxy resin is present in an amount of 100 parts by weight to 500 parts by weight, based on 100 parts by weight of the dicyclopentadiene ring-containing epoxy resin.2. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film includes:5 wt % to 35 wt % of the polymer binder resin;5 wt % to 40 wt % of the epoxy resin;5 wt % to 30 wt % of the conductive particles; and5 wt % to 50 wt % of the curing agent, based on a total amount of the anisotropic conductive film in terms of solid content.3. The semiconductor device as claimed in claim 2 , ...

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Номер записи: 77

03-04-2014 дата публикации

SEMICONDUCTOR PACKAGE

Номер: US20140091481A1

Автор: GREGORICH Thomas Matthew, Huang Ching-Liou, LIN Tzu-Hung

Принадлежит: MEDIATEK INC.

The invention provides a semiconductor package. The semiconductor package includes a substrate. A first conductive trace is disposed on the substrate. A first conductive trace disposed on the substrate. A semiconductor die is disposed over the first conductive trace. A solder resist layer that extends across an edge of the semiconductor die is also included. Finally, an underfill material is provided that fills a gap between the substrate and the semiconductor die. 1. A semiconductor package , comprising:a substrate;a first conductive trace disposed on the substrate;a semiconductor die disposed over the first conductive trace;a solder resist layer, wherein a portion of the solder resist layer extends across an edge of the semiconductor die; andan underfill material filling a gap between the substrate and the semiconductor die.2. The semiconductor package as claimed in claim 1 , wherein the portion of the solder resist layer covers a portion of the first conductive trace claim 1 , and wherein a width of the portion of the solder resist layer is larger than that of the portion of the first conductive trace from a top view.3. The semiconductor package as claimed in claim 1 , wherein the portion of the solder resist layer is below the semiconductor die and within a projection area of the semiconductor die.4. The semiconductor package as claimed in claim 1 , wherein the portion of the solder resist layer has a vertical sidewall extruding over to an adjacent vertical sidewall of the portion of the first conductive trace from a top view.5. The semiconductor package as claimed in claim 1 , wherein the portion of the solder resist layer extends along the first conductive trace and over a bottom surface of the semiconductor die.6. The semiconductor package as claimed in claim 1 , wherein the portion of the solder resist layer extends from outside an edge of the semiconductor die to a region between the semiconductor die and the substrate.7. The semiconductor package as ...

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Номер записи: 78

10-04-2014 дата публикации

Anisotropic conductive adhesive

Номер: US20140097463A1

Автор: Genki Katayanagi, Hidetsugu Namiki, Shiyuki Kanisawa

Принадлежит: Dexerials Corp

An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM 35 , EM 55 , EM 95 , and EM 150 , respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM 55-95 and ΔEM 95-150 , respectively, the following expressions (1) to (5) are satisfied 700 Mpa≦EM 35 ≦3000 MPa (1) EM 150 <EM 95 <EM 55 <EM 35 (2) ΔEM 55-95 <ΔEM 95-150 (3) 20%≦ΔEM 55-95 (4) 40%≦ΔEM 95-150 (5).

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Номер записи: 79

10-04-2014 дата публикации

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM

Номер: US20140097548A1

Автор: KIM Kyu Bong, LIM Woo Jun, PARK Do Hyun, SEO Hyun Joo, Shin Kyoung Hun, Shin Young Ju

Принадлежит:

A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content. 1. A semiconductor device connected using an anisotropic conductive adhesive composition , the anisotropic conductive adhesive composition comprising:a thermosetting polymerization initiator; andtetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.2. The semiconductor device as claimed in claim 1 , wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is an alkoxylated tetrahydrofurfuryl (meth)acrylate or alkoxylated furfuryl (meth)acrylate.4. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive adhesive composition further includes a thermoplastic resin and conductive particles.5. The semiconductor device as claimed in claim 4 , wherein the anisotropic conductive adhesive composition further includes a radical polymerizable material claim 4 , the radical polymerizable material being different from the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate.6. The semiconductor device as claimed in claim 1 , wherein an anisotropic conductive adhesive film prepared from the anisotropic conductive adhesive composition has an adhesive strength reduction rate of greater than 0 to 25% or less as measured according to Equation 1:{'br': None, 'i': A−B', 'A×, 'Adhesive strength reduction rate (%)=()/100,\u2003\u2003[Equation 1]'} A is an adhesive ...

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Номер записи: 80

10-04-2014 дата публикации

PATTERNED FILMS AND METHODS

Номер: US20140099486A1

Автор: Granstrom Eric L., Ollmann Richard R.

Принадлежит:

Methods of patterning films that enable visual identification of patterned films and the patterned regions on them, while still achieving minimally discernible optical differences between the patterned and unpatterned regions in devices incorporating the patterned films. Such methods can exhibit wide successful manufacturing operating windows and the patterned films are useful in electronic applications. 1. A method comprising:forming on at least one transparent conductive film at least one patterned region and at least one unpatterned region, the at least one patterned region comprising at least one first optical property of at least one first optical property type and the at least one unpatterned region comprising at least one second optical property of the at least one first optical property type; anddisposing at least one overcoat layer on the at least one patterned region and the at least one unpatterned region to form at least one covered patterned region comprising at least one third optical property of the at least one first optical property type and at least one covered unpatterned region comprising at least one fourth optical property of the at least one first optical property type,wherein the at least one first optical property and the at least one second optical property are distinguishable by the unaided eye, and the at least one third optical property and the at least one fourth optical property are less distinguishable by the unaided eye.2. The method according to claim 1 , wherein the at least one first optical property type comprises haze claim 1 , total light transmission claim 1 , or total light reflectance.3. The method according to claim 1 , wherein the at least one first optical property comprises a first haze claim 1 , the at least one second optical property comprises a second haze claim 1 , and the absolute value of the difference between the first haze and the second haze is at least about 1% haze claim 1 , or at least about 2% haze claim 1 ...

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Номер записи: 81

03-01-2019 дата публикации

SENSOR FOR ELECTRODE AND PROCESSES FOR PRODUCTION

Номер: US20190000337A1

Автор: DERRY Cameron E.

Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

An electrode sensor involves a solid conductive polymeric substrate shaped as an electrode sensor or portion of an electrode sensor having a layer of silver-coated particles distributed on and embedded into a surface of the substrate. The electrode sensor is particularly useful for ECG electrodes and utilizes less silver without unduly sacrificing performance. A process for producing the electrode sensor involves distributing a layer of silver-coated particles on a surface of a solid conductive polymeric substrate shaped as an electrode sensor or portion of an electrode sensor and thermally embedding the silver-coated particles into the surface. The process is simpler and less costly than existing processes for producing electrode sensors. 1. An electrode sensor comprising: a solid conductive polymeric substrate shaped as an electrode sensor or portion of an electrode sensor , having a contact surface; and , a layer of silver-coated particles distributed on and embedded into only the contact surface of the substrate.2. The sensor according to claim 1 , wherein the silver-coated particles have an average size in a range of 1-300 μm.3. The sensor according to claim 1 , wherein the silver is distributed on the surface in an amount of 10 mg Ag/sq. in. or less.4. The sensor according to claim 1 , wherein the silver is distributed on the surface in an amount of 8 mg Ag/sq. in. or less.5. The sensor according to claim 1 , wherein the silver is distributed on the surface in an amount in a range of 1-6 mg Ag/sq. in.6. The sensor according to claim 2 , wherein the amount of silver provides the sensor with a pre-determined recovery time from charge accumulated by the sensor in a defibrillation event during heart fail.7. The sensor according to claim 1 , wherein surface roughness as measured by the arithmetic average of the absolute values (R) is in a range of 1-15 micron.8. The sensor according to claim 1 , wherein the particles comprise glass.9. The sensor according to claim ...

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Номер записи: 82

01-01-2015 дата публикации

Apparatus for temporary bonding of substrate on a carrier and method thereof

Номер: US20150000838A1

Автор: HAYK Khachatryan

Принадлежит: Samsung Display Co Ltd

An apparatus for temporarily bonding a substrate on a carrier includes an electrically conductive adhesion layer disposed between the carrier and the substrate, and a current supply source configured to apply a current to the electrically conductive adhesion layer.

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Номер записи: 83

01-01-2015 дата публикации

STACKED SEMICONDUCTOR DEVICE, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING STACKED SEMICONDUCTOR DEVICE

Номер: US20150003029A1

Автор: Okada Yuya

Принадлежит:

A stacked semiconductor device includes a first semiconductor package and a second semiconductor package stacked thereon, and further includes a plate member interposed between the first semiconductor package and the second semiconductor package. The plate member has a plate body, protruding strips protruding toward its edges from the plate body, and leg portions respectively provided on the protruding strips. Each of the leg portions is disposed on a surface, which opposes one surface of a wiring substrate, of the protruding strip, and contacts the one surface of the wiring substrate. Thus, defective connection of connecting terminals due to warping of the wiring substrate and loading inclination of the first semiconductor package is reduced, resulting in an improved yield. 1. A stacked semiconductor device comprising: 'a first wiring substrate having a pair of surfaces, on one of which the first semiconductor element is mounted, and the other of which a plurality of connecting conductor pads each connected to a connecting terminal are formed, wherein a plurality of first conductor pads are formed on one or the other surface of the wiring substrate;', 'a first semiconductor element, and'}, 'a first semiconductor package having'} a second semiconductor element, and', 'a second wiring substrate having a pair of surfaces, on one of which the second semiconductor element is mounted, wherein a plurality of second conductor pads are formed on one or the other surface of the wiring substrate;, 'a second semiconductor package being disposed at a side in opposition to the one surface of the first wiring substrate of the first semiconductor package, and having'} a plate body arranged between the first and second semiconductor packages, and fixed to the first and second semiconductor packages, and', 'a plurality of protruding strips protruding from a base end at the plate body to a position in opposition to an edge of the first wiring substrate;, 'a plate member having'}a ...

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Номер записи: 84

04-01-2018 дата публикации

A conductive elastomer, preparation method and use thereof

Номер: US20180002509A1

Автор: Huilin YANG, Lei Yang, XIAO LIN, Yanjie Bai

Принадлежит: SUZHOU UNIVERSITY

A preparation method of a conductive elastomer includes the following steps: (1) according to the mass percent of 20˜75%, dissolving the metallic salts into deionized water to form an electrolyte solution, wherein said metallic salts is either of magnesium nitrate, sodium nitrate, zinc nitrate, cesium nitrate, calcium nitrate, neodymium nitrate, aluminum nitrate, potassium nitrate, potassium chloride, magnesium chloride, calcium chloride, sodium chloride, zinc chloride, cesium chloride, aluminum chloride or their combinations; (2) according to the mass percent of 10˜40%, mixing starches into the electrolyte solution prepared in step (1), then at the temperature of 33˜120 ° C., stirring to gelatinize the starches, forming a viscous liquid; (3) standing the viscous liquid obtained in step (2) at 25˜90° C. for 10 min to 48 h to obtain the conductive elastomer.

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Номер записи: 85

04-01-2018 дата публикации

CURABLE SILICONE FORMULATIONS AND RELATED CURED PRODUCTS, METHODS, ARTICLES, AND DEVICES

Номер: US20180002569A1

Автор: JOHN RANJITH SAMUEL, MEYNEN HERMAN, SELDRUM Thomas, Yeakle Craig R.

Принадлежит:

The invention comprises a butyl acetate-silicone formulation comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and a coating effective amount of (D) butyl acetate. The invention also comprises related silicone formulations made by removing a portion, or all, of (D) butyl acetate therefrom, and related cured products, methods, articles and devices. 1. A butyl acetate-silicone formulation comprising (A) an organopolysiloxane containing an average , per molecule , of at least two silicon-bonded alkenyl groups; (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and a coating effective amount of (D) butyl acetate; with the proviso that the formulation lacks each of the following constituents: a thermally conductive filler; an organopolysiloxane having , on average , at least two silicon-bonded aryl groups and at least two silicon-bonded hydrogen atoms in the same molecule; a phenol; a fluoro-substituted acrylate; iron; and aluminum.2. A concentrated silicone formulation made by removing most claim 1 , but not all claim 1 , butyl acetate from the butyl acetate-silicone formulation of without curing same claim 1 , the formulation consisting essentially of (A) an organopolysiloxane containing an average claim 1 , per molecule claim 1 , of at least two alkenyl groups; (B) an organosilicon compound containing an average claim 1 , per molecule claim 1 , of at least two silicon-bonded hydrogen atoms in a concentration sufficient to cure the formulation; a catalytic amount of (C) a hydrosilylation catalyst; and a residual amount of (D) butyl acetate; with the proviso that the formulation lacks each of the following constituents: a thermally conductive filler; an ...

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Номер записи: 86

04-01-2018 дата публикации

ANISOTROPIC CONDUCTIVE FILM

Номер: US20180002575A1

Автор: AKUTSU Yasushi, ODAKA Ryousuke, SATO Daisuke, Tanaka Yusuke

Принадлежит: DEXERIALS CORPORATION

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter. 1. An anisotropic conductive film comprising an insulating adhesive layer and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view , wherein the conductive particle has a conductive particle diameter of 10 μm or more , the film has a thickness of 1 or more times and 3.5 or less times the conductive particle diameter , and positions of the conductive particles are varied in a thickness direction of the film within a variation range of less than 10% of the conductive particle diameter.2. The anisotropic conductive film according to claim 1 , wherein the thickness of the anisotropic conductive film is 1 or more times and 2.5 or less times the conductive particle diameter.3. The anisotropic conductive film according to claim 1 , wherein a distance between one surface of the anisotropic conductive film and each conductive particle is 10% or more of the conductive particle diameter.4. The anisotropic conductive film according to claim 1 , wherein a difference between maximum and minimum values of particle densities claim 1 , as viewed in a plan view claim 1 , measured at ten regions which each have an area of 1 mm×1 mm and are extracted in a longitudinal direction of the anisotropic conductive film is less than 20% of an average of the particle densities at the respective region.5. The anisotropic conductive film ...

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Номер записи: 87

04-01-2018 дата публикации

HEAT CONDUCTIVE PASTE AND METHOD FOR PRODUCING THE SAME

Номер: US20180002576A1

Автор: MARUYAMA Hiroki, SASAKI Koji

Принадлежит: NAMICS CORPORATION

A heat conductive paste including silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5, an aliphatic primary amine and a compound having at least one phosphoric acid group. The heat conductive paste includes 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group based on 100 parts by mass of the silver fine particles. The heat conductive paste has a high conductivity. 1. A heat conductive paste comprising:silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5,an aliphatic primary amine, anda compound having at least one phosphoric acid group.2. The heat conductive paste according to claim 1 , wherein the paste contains 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group claim 1 , based on 100 parts by mass of the silver fine particles.3. A heat conductive paste produced by:mixing a silver salt of a carboxylic acid and an aliphatic primary amine, then,adding a reducing agent thereto, andmixing a compound having at least one phosphoric acid group with a reaction mixture containing silver fine particles.4. The heat conductive paste according to claim 3 , wherein the reaction mixture contains 1 to 40 parts by mass of the aliphatic primary amine based on 100 parts by mass of the silver fine particles claim 3 , and produced by mixing 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group with the reaction mixture.5. The heat conductive paste according to claim 1 , wherein the compound having at least one phosphoric acid group is at least one substance ...

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Номер записи: 88

02-01-2020 дата публикации

Conductive Adhesive

Номер: US20200002582A1

Автор: AOYAGI Yoshihiko, ISOBE Osamu, KAMINO Kenji

Принадлежит:

The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×10Pa to 4.0×10Pa. 1. A conductive adhesive comprising:a thermosetting resin (A); anda conductive filler (B), wherein{'sup': 4', '5, 'the conductive adhesive has a loss modulus at 200° C. from 5.0×10Pa to 4.0×10Pa;'}{'b': 1', '2, 'the thermosetting resin (A) contains a first resin component (A) having a first functional group and a second resin component (A) having a second functional group that reacts with the first functional group; and'}{'b': '2', 'the second resin component (A) is a urethane-modified polyester resin.'}2. The conductive adhesive of claim 1 , wherein the conductive adhesive contains from 40 to 140 parts by mass of the loss modulus modifier (C) relative to 100 parts by mass of the thermosetting resin (A).32. The conductive adhesive of claim 1 , wherein the second resin component (A) has a glass transition temperature from 5° C. to 100° C. and a number average molecular weight from 10 claim 1 ,000 to 50 claim 1 ,000. The present disclosure relates to a conductive adhesive.A conductive adhesive is often used for a flexible printed wiring board. For example, a flexible printed wiring board has been known to include an electromagnetic-wave shielding film bonded thereto and including a shielding layer and a conductive adhesive layer. In this case, the conductive adhesive needs to firmly bond an insulating film (a cover lay) provided on the surface of the flexible printed wiring board and a metal reinforcing plate together, and to ensure good conduction with a ground circuit exposed from an opening of the insulating film.In recent years, as a result of reduced electrical device size, there has been a need to fill a small opening with a conductive adhesive to allow a ground circuit to be reliably conductive. For this reason, consideration has been made to improve the filling performance of the conductive adhesive (see, for ...

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Номер записи: 89

03-01-2019 дата публикации

NONAQUEOUS SOL-GEL FOR ADHESION ENHANCEMENT OF WATER-SENSITIVE MATERIALS

Номер: US20190002739A1

Автор: HUFF Daniel W., KENNEDY Dennis K., Moore James A.

Принадлежит:

The present disclosure provides sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation and comprises an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent. At least one vehicle component comprises a sol-gel coating system comprising a metal substrate and a sol-gel formulation disposed on the metal substrate. The sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation and comprises an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent. 1. A sol-gel formulation comprising:an organosilane;a metal alkoxide;an acid stabilizer; andan organic solvent, wherein the sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation.2. The sol-gel formulation of claim 1 , wherein the sol-gel formulation has from about 0.1 wt % to about 20 wt % organosilane claim 1 , from about 0.1 wt % to about 10 wt % metal alkoxide claim 1 , and from about 0.1 wt % to about 10 wt % acid stabilizer based on the total weight of the sol-gel formulation.3. The sol-gel formulation of claim 2 , wherein the sol-gel formulation has a water content from about 0.1 wt % to about 3 wt % based on the total weight of the sol-gel formulation.4. The sol-gel formulation of claim 3 , wherein the sol-gel formulation has a water content of about 0.5 wt % or less based on the total weight of the sol-gel formulation.5. The sol-gel formulation of claim 1 , wherein the organic solvent is one or more of alcohol claim 1 , ethylene glycol claim 1 , propylene glycol claim 1 , polyethylene glycol claim 1 , polypropylene glycol claim 1 , an ether claim 1 , tetrahydrofuran claim 1 , N-methyl-2-pyrrolidone claim 1 , and dimethyl sulfoxide.6. The sol-gel formulation of claim 5 , wherein the organic solvent is ...

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Номер записи: 90

03-01-2019 дата публикации

NONAQUEOUS SOL-GEL FOR ADHESION ENHANCEMENT OF WATER-SENSITIVE MATERIALS

Номер: US20190002740A1

Автор: HUFF Daniel W., KENNEDY Dennis K., Moore James A.

Принадлежит:

The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture. 1. A method of forming a sol-gel , comprising:mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture; andmixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.2. The method of claim 1 , wherein mixing to form the first mixture comprises dispersing claim 1 , emulsifying claim 1 , suspending claim 1 , or dissolving the metal alkoxide and acid stabilizer in the organic solvent.3. The method of claim 1 , further comprising incubating the second mixture at a temperature from about 10° C. to about 100° C.4. The method of claim 1 , further comprising curing the second mixture at a temperature from about 10° C. to about 150° C.5. The method of claim 1 , further comprising depositing the first mixture or the second mixture onto a metal substrate that comprises one or more of aluminum claim 1 , aluminum alloy claim 1 , nickel claim 1 , iron claim 1 , iron alloy claim 1 , steel claim 1 , titanium claim 1 , titanium alloy claim 1 , copper claim 1 , and copper alloy.6. The method of claim 5 , further comprising cleaning the metal substrate by degreasing claim 5 , alkaline washing claim 5 , chemical etching claim 5 , chemically deoxidizing claim 5 , and/or mechanically deoxidizing the ...

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Номер записи: 91

03-01-2019 дата публикации

METHOD FOR MANUFACTURING CONNECTION STRUCTURE

Номер: US20190002741A1

Автор: Ozeki Hiroki

Принадлежит: DEXERIALS CORPORATION

A method for manufacturing a connection structure capable of increasing the allowable range of a spacing between terminals of a component and mounting at a low temperature. The method for manufacturing a connection structure includes a disposition step of disposing, through an anisotropic conductive adhesive of a thermosetting type including conductive particles, a first electronic component including a first terminal row and a second electronic component including a second terminal row facing the first terminal row, a thermal pressurization step of thermally pressurizing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal row and the second terminal row, and a full curing step of irradiating with infrared laser light to fully cure the anisotropic conductive adhesive in a state where the conductive particles are sandwiched between the first terminal row and the second terminal row. 1. A method for manufacturing a connection structure comprising:a disposition step of disposing, through an anisotropic conductive adhesive of a thermosetting type including conductive particles, a first electronic component including a first terminal row and a second electronic component including a second terminal row facing the first terminal row;a thermal pressurization step of thermally pressurizing the first electronic component and the second electronic component to sandwich the conductive particles between the first terminal row and the second terminal row; anda full curing step of irradiating with infrared laser light to fully cure the anisotropic conductive adhesive in a state where the conductive particles are sandwiched between the first terminal row and the second terminal row.2. The method for manufacturing a connection structure according to claim 1 ,wherein in the thermal pressurization step, the thermal pressurization is performed at a temperature of not lower than 50° C. and not higher than ...

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Номер записи: 92

02-01-2020 дата публикации

LIQUID CRYSTAL DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20200004079A1

Автор: CHIEN CHUNG-KUANG

Принадлежит:

Provided is a method for manufacturing a liquid crystal display module, including: pre-baking a first substrate and a second substrate; disposing sealing glue at edges of the first substrate and edges of the second substrate; dropping liquid crystals on the second substrate, and coating frame glue on the first substrate and the second substrate; assembling the first substrate and the second substrate so as to form at least one liquid crystal display module, and irradiating the liquid crystal display module with a first light source. 1. A method for manufacturing a liquid crystal display module , comprising:pre-baking a first substrate and a second substrate;forming a sealing glue at edges of the first substrate and edges of the second substrate;dropping liquid crystals on the second substrate, and coating a frame glue on the first substrate and the second substrate;assembling the first substrate and the second substrate coated with frame glue, and forming the liquid crystals in a gap between the first substrate and the second substrate after the first substrate and the second substrate have been assembled so as to form at least one liquid crystal display module;irradiating the liquid crystal display module with a first light source; andirradiating the liquid crystal display module with a second light source.2. The method for manufacturing the liquid crystal display module according to claim 1 , wherein after irradiating the liquid crystal display module with the second light source claim 1 , the method further comprises: detecting flaws on the liquid crystal display module.3. The method for manufacturing the liquid crystal display module according to claim 1 , wherein a wavelength of an absorption spectrum of the sealing glue is 300 nm to 400 nm.4. The method for manufacturing the liquid crystal display module according to claim 1 , wherein the step of assembling the first substrate and the second substrate coated with the frame glue comprises:arranging an alignment ...

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Номер записи: 93

13-01-2022 дата публикации

Electrically conductive adhesive

Номер: US20220010180A1

Автор: Andreas Reisinger, Christian Neumann, Sebastian Vogt, Stefan Schibli

Принадлежит: Heraeus Deutschland GmbH and Co KG

One aspect refers to an electrically conductive adhesive including a) a (meth)acrylate monomer, b) a polymer being soluble in the (meth)acrylate monomer, c) a biocompatible metal having a median particle size d50 of below 50 μm, and d) a polymerization initiator. One aspect also refers to a kit for preparing an electrically conductive adhesive, to an implantable medical device including such an electrically conductive adhesive, or a cured form thereof, and to the use of such an electrically conductive adhesive.

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Номер записи: 94

05-01-2017 дата публикации

EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE

Номер: US20170005021A1

Автор: ABE Nobuyuki, KOHARA Kazuyuki, OKOSHI Kodai, YAMAZAWA Tomoya

Принадлежит:

An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 μm or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total. 1. An epoxy resin composition comprising:(A) epoxy resin;(B) a curing agent;(C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and(D) 40 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 5 μm or less, whereinthe component (C) and the component (D) are contained by 40.1 to 77 mass % in total.2. The epoxy resin composition according to claim 1 , wherein at least one of the component (C) and the component (D) is subjected to surface processing with a silane coupling agent.4. The epoxy resin composition according to claim 1 , wherein an equivalent ratio between the component (A) and the component (B) is 0.5 to 1.8.5. The epoxy resin composition according to claim 1 , wherein the component (B) is an amine curing agent.6. The epoxy resin composition according to claim 1 , wherein the component (A) includes at least one of bisphenol F epoxy resin claim 1 , bisphenol A epoxy resin claim 1 , naphthalene epoxy resin claim 1 , and aminophenol epoxy resin.7. The epoxy resin composition according to claim 1 , wherein a bleeding generated in a bleeding test for a cured product of the epoxy resin composition is 300 μm or more and less than 1900 μm.8. The epoxy resin composition according to claim 1 , wherein the epoxy resin composition is manufactured in a manner that a master batch is formed by mixing the component (C) in at least a part of the component (A) and another component is mixed in the master batch.9. A semiconductor sealing agent comprising the epoxy resin composition .10. A semiconductor device comprising the ...

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Номер записи: 95

05-01-2017 дата публикации

SEMICONDUCTOR DEVICE

Номер: US20170005024A1

Автор: Shimazaki Koichi

Принадлежит:

Provided is a semiconductor device that includes a passivation film thinner than a wiring layer and has a high resistance to a stress caused during bonding. In the semiconductor device, a wiring layer () is formed in the vicinity of a bonding pad () via a gap (), a passivation film () has a thickness smaller than that of the wiring layer () forming the bonding pad (), and the gap () has a width equal to or smaller than twice the passivation film thickness. 1. A semiconductor device , comprising:a semiconductor substrate;an insulating film formed on a surface of the semiconductor substrate;a bonding pad formed on the insulating film;a top wiring layer formed on the insulating film around the bonding pad via a gap; anda passivation covering the top wiring layer and a portion of the bonding pad, the passivation film having a thickness smaller than a thickness of the bonding pad;the gap having a width equal to or larger than the thickness of the passivation film covering the top wiring layer, and equal to or smaller than twice a side wall thickness of the passivation film covering a side wall of the top wiring layer.2. A semiconductor device according to claim 1 , wherein the top wiring layer is formed around the bonding pad as a rectangular ring.3. A semiconductor device according to claim 2 , wherein the top wiring layer is divided in part.4. A semiconductor device according to claim 2 , wherein the top wiring layer comprises top wiring layers formed around the bonding pad as at least two surrounding members.5. A semiconductor device according to claim 3 , wherein the top wiring layer comprises top wiring layers formed around the bonding pad as at least two surrounding members.6. A semiconductor device according to claim 1 , wherein a vertical thickness of a portion of the passivation film filled into the gap is larger than a vertical thickness of a portion of the passivation film formed on the bonding pad.7. A semiconductor device according to claim 1 , wherein the ...

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Номер записи: 96

13-01-2022 дата публикации

IMPROVED NOBLE-METAL PASTES FOR SCREEN-PRINTED ELECTRODE STRUCTURES

Номер: US20220013248A1

Автор: ASMUS Tim, DIETMANN Stefan, NICK Christoph

Принадлежит: Heraeus Nexensos GmbH

The present invention relates to a screen-printing paste composition for producing an electrical conductor arrangement, which screen-printing paste composition comprises particulate noble metal, comprising platinum and palladium, metal oxides, and organic binders and/or solvents, the proportion of the metal oxides in the screen-printing paste composition being 5 to 15 wt. %, based on the total amount of platinum and metal oxides. Suitable screen-printing paste compositions can be processed to form composite products by means of application to a substrate, subsequent drying and baking, which composite products can be used, for example, in particle sensors or heating devices. The particle sensors and heating devices thus produced are characterized by improved adhesion to the substrate at high temperatures and by conductivity, and demonstrated very good reproducibility of the electrical resistance in different production batches. 115-. (canceled)16. A screen-printing paste composition for producing an electrical conductor arrangement comprising:particulate noble metal, comprising platinum and/or palladium;metal oxides; andorganic binders and/or solvents;wherein the proportion of metal oxides in the screen-printing paste composition is from 5 to 15 wt. %, based on the total amount of platinum and metal oxides.17. The screen-printing paste composition according to claim 16 , wherein the particulate noble metal is present in the form of a platinum alloy.18. The screen-printing paste composition according to claim 16 , wherein the particulate noble metal is present in the form of platinum.19. The screen-printing paste composition according to claim 18 , wherein the particulate platinum is present in the screen-printing paste composition in the form of spherical platinum and is based on a Pt powder with the properties:platinum proportion: ≥99.7%{'sup': '2', 'specific surface area (BET): 0.8-1.2 m/g'} D10: 0.2-0.5 μm', 'D50: 0.4-1.0 μm', 'D90: ≤2.5 μm, 'particle size ...

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Номер записи: 97

07-01-2016 дата публикации

ULTRA-THIN POWER TRANSISTOR AND SYNCHRONOUS BUCK CONVERTER HAVING CUSTOMIZED FOOTPRINT

Номер: US20160005627A1

Автор: HERBSOMMER Juan A, LOPEZ Osvaldo J, NOQUIL Jonathan A

Принадлежит:

A power field-effect transistor package is fabricated. A leadframe including a flat plate and a coplanar flat strip spaced from the plate is provided. The plate has a first thickness and the strip has a second thickness smaller than the first thickness. A field-effect power transistor chip having a third thickness is provided. A first and second contact pad on one chip side and a third contact pad on the opposite chip side are created. The first pad is attached to the plate and the second pad to the strip. Terminals are concurrently attached to the plate and the strip so that the terminals are coplanar with the third contact pad. The thickness difference between plate and strip and spaces between chip and terminals is filled with an encapsulation compound having a surface coplanar with the plate and the opposite surface coplanar with the third pad and terminals. The chip, leadframe and terminals are integrated into a package having a thickness equal to the sum of the first and third thicknesses. 117-. (canceled)18. A method for fabricating a power field-effect transistor package , comprising the steps of:providing a leadframe including a flat plate and a coplanar flat strip spaced from the plate, the plate having a first thickness and the strip having a second thickness smaller than the first thickness;providing a field-effect power transistor chip having a third thickness, a first and a second contact pad on one chip side and a third contact pad on the opposite chip side;attaching the first pad to the plate and the second pad to the strip;concurrently attaching terminals to the plate and the strip so that the terminals are coplanar with the third contact pad; andfilling the thickness difference between plate and strip and spaces between chip and terminals with an encapsulation compound having a surface coplanar with the plate and the opposite surface coplanar with the third pad and terminals, whereby chip, leadframe and terminals are integrated into a package ...

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Номер записи: 98

07-01-2016 дата публикации

Adhesive Film for Organic Electronic Device and Encapsulant Comprising the Same

Номер: US20160005999A1

Автор: Bon Su Koo, Chung Gu Lee, Hwi Yong Lee, Jeong Min Park, Jin Hyuk Kim

Принадлежит: INNOX Corp

Disclosed are an adhesive film for an organic electronic device and an encapsulant including the same, wherein the adhesive film can function to remove or block defect causes such as moisture and impurities so that the defect causes do not approach the organic electronic device, and also to minimize problems due to separation of the organic electronic device and the film and/or interfacial film delamination upon moisture removal.

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Номер записи: 99

07-01-2021 дата публикации

SEMICONDUCTOR PACKAGE

Номер: US20210005532A1

Автор: KIM Hye Lee, KIM Hyung Kyu, Kwon Sang Hyun, Lee Choon Keun, PARK Seong Chan

Принадлежит:

A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member. 1. A semiconductor package , comprising:a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface;a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material;an adhesive member disposed between the semiconductor chip and the heat dissipation member;an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; andan interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad,wherein the encapsulant covers at least a portion of a side surface of the adhesive member.2. The semiconductor package of claim 1 , wherein the heat dissipation member includes a pyrolytic graphite sheet.3. The semiconductor package of claim 1 , wherein the adhesive member includes an epoxy resin and an (meth)acrylate-based resin.4. The semiconductor package of claim 3 , wherein the adhesive member includes one or more selected from the group consisting of cross-linking between the epoxy resin and the (meth)acrylate-based resin claim 3 , cross-linking between the epoxy resins claim 3 ...

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Номер записи: 100