БЕССВИНЦОВЫЙ ПРИПОЙ

Изобретение может быть использовано для получения соединений низкотемпературной пайкой, в частности в микроэлектронике. Припой содержит ингредиенты в следующем соотношении, мас.%: Sn 76-96, Cu 0,2-0,5, Ag 2,5-4,5, In>0-12, Bi 0,5-5,0, Sb 0,01-2. Припой имеет удовлетворительный для производства электронных устройств диапазон температуры плавления 175-210°С, высокий предел прочности и высокую усталостную прочность, легко смачивает металлические подложки. 1 ил.

МЕТАЛЛОМАТРИЧНЫЙ КОМПОЗИТ

Изобретение относится к композиционным материалам, в частности к металломатричным композитам, и может быть использовано при производстве подшипников скольжения. Металломатричный композит содержит, мас.%: сурьма - 10,0-12,0; медь - 0,5-1,5; карбид кремния - 1,0-15,0; углеродные нанотрубки - 0,5-10,0; олово - остальное. Материал обладает высокими антифрикционными и механическими свойствами и повышенной температурной стойкостью в условиях, при которых пара трения работает в условиях ограниченной смазки или кратковременного сухого трения. 2 табл.

СПЛАВ НА ОСНОВЕ ОЛОВА

Изобретение относится к металлургии и может быть использовано в машиностроении, в частности, для получения антифрикционных сплавов для заливки подшипников. Для повышения износостойкости сплав имеет следующий состав, мас.%: медь 6,0-8,0; сурьма 10,0-12,0; цинк 18,0-22,0; кремний 0,5-1,0; бор 0, 03-0,05; олово - остальное. Сплав дополнительно содержит серебро в количестве 0,3-0,5 мас.%. 1 з.п. ф-лы, 1 табл.

СПЛАВ НА ОСНОВЕ ОЛОВА

... 1. Сплав на основе олова, содержащий медь, сурьму, цинк, отличающийся тем, что дополнительно содержит бор и кремний при следующем соотношении компонентов, мас.%: медь 6,0-8,0; сурьма 10,0-12,0; цинк 18,0-22,0; бор 0,03-0,05; кремний 0,5-1,0; олово - остальное. 2. Сплав на основе олова по п.1, отличающийся тем, что содержит серебро 0,3-0,5.

Многослойный материал дл подшипников скольжени

... 1. Многослойный материал для подшипников скольжения с несущим слоем, слоем подшипникового сплава, первым промежуточным слоем из никеля, вторым промежуточным слоем из олова и никеля, а также слоем скольжения из меди и олова, отличающийся тем, что слой скольжения (4) имеет матрицу (5) из олова, включающую медно-оловянные частицы (6), состоящие на 39-55 вес.% из меди и остальное олово. 2. Многослойный материал по п.1, отличающийся тем, что доля поверхности частиц (6), в пересчете на любую площадь сечения, составляет от 5 до 48%. 3. Многослойный материал по одному из пп.1 или 2, отличающийся тем, что диаметр частиц (6) составляет от 0,5 до 3 μм. 4. Многослойный материал по одному из пп.1-3, отличающийся тем, что второй промежуточный слой (3) как по толщине слоя, так и доле олова является таким, что он принимает олово, переходящее из слоя скольжения (4). 5. Многослойный материал по одному из пп.1-4, отличающийся тем, что второй промежуточный слой (3) содержит от 30 до 40 об.% никеля. 6. Многослойный ...

МЕТАЛЛОМАТРИЧНЫЙ КОМПОЗИТ

Металломатричный композит, содержаний олово, сурьму, медь, отличающийся тем, что он дополнительно содержит частицы карбида кремния при следующем соотношении компонентов, мас.%: ! сурьма 10,0-12,0медь 0,5-1,5карбид кремния 1,0-15,0олово остальное ...

Токопроводящая паста

Припой для пайки меди и ее сплавов

Припой для пайки силицированного графита со сталью

Термокомпенсационный сплав

Антифрикционный сплав

Изобретение относится к антифрикционным сплавам. Целью изобретения является повышение износостойкости покрытий и уменьшение коэффициента трения. Сплав содержит, мас.%: олово 60-75, алюминий 20-25, сурьму 3-9 и медь 2-6, причем пористость сплава составляет 7-20 об.%. Покрытия из антифрикционного сплава на стальных образцах испытывали в условиях ограниченной смазки и давления 10 МПа. Предлагаемый антифрикционный сплав обладает относительной износостойкостью 1,22-1,30 (по отношению к литому баббиту 83) и коэффициентом трения пары покрытие - сталь 45, равным 0,056-0,061. 1 табл.

Припой

Lead-free, tin-based solder alloy for electrical and electronic components, is doped with specified quantity of phosphorus

The solder is doped with 5-250 ppm of phosphorus. 0.1-10.5 wt% of copper is also included, with 0.1-1.0 wt% of nickel, 0.1 wt% bismuth and further specified quantities of antimony, indium and silver. Various other constituents may be present.

Zinn-Silber-Beschichtungen

LOT FÜR OXIDSCHICHTBILDENDES METALL UND LEGIERUNGEN

Halbleitereinheit und Verfahren zur Herstellung einer Halbleitereinheit

Eine Halbleitereinheit weist Folgendes auf: ein isolierendes Substrat (1), das durch Integrieren einer keramischen Basisplatte (1b) und einer Kühlrippe (1a) gebildet wird; mehrere Plattenzwischenverbindungselemente (5); sowie eine Mehrzahl von Halbleiterelementen (3a). Die einen Seiten der Halbleiterelemente (3a) sind mit einem Lot (4) an der Chip-Unterseite an die keramische Basisplatte (lb) des isolierenden Substrats (1) gebondet, und die anderen Seiten derselben sind mit einem Lot (6) an der Chip-Oberseite so an die Plattenzwischenverbindungselemente (5) gebondet, dass die Plattenzwischenverbindungselemente (5) jeweils den Halbleiterelementen (3a) entsprechen. Das Lot (4) an der Chip-Unterseite und das Lot (6) an der Chip-Oberseite enthalten beide vorwiegend Sn und 0,3 Gew.% bis 3 Gew.% Ag sowie 0,5 Gew.% bis 1 Gew.% Cu. Dadurch wird eine Reduzierung der Abmessungen der Halbleitereinheit ermöglicht, ohne die Wärmeabführung zu beeinträchtigen.

Lotlegierung, Verwendung der Lotlegierung und Verfahren zum Verbinden von Werkstücken durch Löten

Composite material layer for sliding bearings has a sliding layer made of a tin matrix in which tin-copper particles are embedded

Composite material layer has a support layer, a bearing metal layer, a first intermediate layer made of nickel, a second intermediate layer made of tin and preferably 30-40 volume % nickel, and a sliding layer made of a tin matrix in which tin-copper particles are embedded. The sliding layer contains 39-55 wt.% copper and a balance of tin.

Metall-Lager für Großmotoren

Solder paste for chip components

BEARING ALLOYS

GRAIN REFINING A SOLDER ALLOY

A solder alloy which comprises lead and tin (e.g. one comprising 8 to 90 mass % tin, 0.5 to 3.3 mass % antimony, balance lead and incidental impurities) may be grain refined by incorporating selenium and/or tellurium into the alloy when in a molten condition prior to solidifying it, the selenium and/or tellurium being incorporated in such a way that it is at least partly chemically combined with lead to form nucleant particles. The selenium and/or tellurium may be added by means of a master alloy, e.g. one comprising antimony and selenium (preferably comprising 2 to 50 mass % selenium, balance antimony and incidental impurities), or one comprising antimony and tellurium (preferably comprising 40 to 70 mass % tellurium, balance antimony and incidental impurities).

A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy

A solder sphere formed from a solder comprising: 3.0% to 4.5% silver, 0.3% to 0.7% copper, 3.4% to 7.5% indium and the balance tin. Also solder paste comprising a paste flux and an alloy comprising: 3.0% to 4.5% silver, 0.3% to 0.7% copper, 3.4% to 7.5% indium and the balance tin. Also a method of coating a target by sputtering an alloy comprising 3.0% to 4.5% silver, 0.3% to 0.7% copper, 3.4% to 7.5% indium and the balance tin onto the target.

Bearings.

A bearing material suitable for large internal combustion engines is disclosed which has either a three-layered structure consisting of a steel backing metal 1, an aluminium or aluminium alloy adhesive layer 2 and a bearing alloy layer 3, or a four-layered structure having a surface layer 4 in addition to the three layers which is lead, tin or an alloy thereof. The bearing alloy layer comprises from 35 to 65% by weight tin, 0.5 to 10% by weight bismuth, 0.1 to 1.5% by weight copper, and optionally 5% by weight or less of one or more of the elements manganese, nickel, silicon, silver, magnesium, antimony and/or zinc, the balance being aluminium and any incidental impurities. Such bearing materials may possess superior anti-seizure properties and display a high fatigue resistance. ...

Improvement in alloys

... 182,098. Meyer, S. M., and James, W. June 23, 1921, [Convention date]. Alloys.-An alloy comprises about 50 per cent of tin, 25 per cent of lead, 17 per cent of zinc, and 8 per cent of antimony. It may be made by melting the lead, tin and antimony under charcoal, and finally adding the zinc.

Improvements in or relating to thermoelectric devices

A thermoelectric element comprises an alloy which, in broad terms consists (in atomic per cent) of (1) Te (23.75 to 56.3%) and (2) (a) Pb (up to 52.49%) and Mn (up to 10%) or (b) Sn (up to 52.49%) and Mn (up to 10%) or (c) Pb + Sn (each up to 52.49%) also, if the atomic per cent of Pb + Sn = Te, with Mn (up to 10%) and (3) possibly other elements such as Se (0-28.15%). S, (0-11.26%) or up to 2% of promoters such as As, Ag, Au, Bi, Br, Cu, Ga, I, K, Na, Ni, Sb, Ta, Ti, Tl, U or Zr. Reference is also made to the incorporation of up to 0.2 atomic per cent of antimony selenide as a promoter. The permissible quantities of sulphur, selenium and manganese in the alloy are specified in further detail, the relationship being complicated. The quantities necessary for various SnTe/ Pb Te systems are described (weight ratios varying from 90/10 to 10/90) to provide (a) metal excess and (b) tellurium excess alloys reference also being made to examples having up to 10% weight ratio of Mn Te added to lead ...

Process for the production of Coloured Coatings

... 1,195,904. Coating with metals; modifying metallic surfaces; alloys. COMINCO Ltd. June 26, 1967 [July 11, 1966; Aug. 24, 1966], No. 29404/67. Headings C7A; C7F. and C7U To produce a coloured surface or a coloured foil an alloy melt comprising a major amount of Zn or Sn and a minor amount of Ti, Mn, V, Nb, Zr, Th, Cd, As, Cn, Pb, or Cr, e.g. in the form of mischmetal, is exposed to a gaseous medium containing free oxygen. An article may be coated by spraying or hot-dipping, and a foil may be formed by either removing a coating from a graphite substrate or removing it from an alloy bath. The article coated may be of Fe, steel, Cu, Ni, Zn, graphite or Zn-coated material such as galvanized steel. In each case an oxide layer forms and displays interference colours when illuminated.

Improvements in and relating to processes for the coating of metals

... 546,179. Tinning; alloys. LOWINGER, V. A., and HEDGES, E. S. Jan. 10, 1941, No. 389. [Classes 82 (i) and 82 (ii)] Metals such as iron, steel or copper are coated by cleaning them and immersing them in a molten bath comprising tin as its main constituent alloyed with one or more of the metals, cobalt, nickel, bismuth or zinc. These metals are present in proportions not greater than, cobalt 0.2 per cent., nickel 0.5, bismuth 10.0 and zinc 9:0; and when used singly the proportions are cobalt 0.1 per cent., nickel 0.2, bismuth 5 and zinc 8.2. The sheet, strip or article may be passed continuously through a suitable flux bath, then through the molten metal and finally through an oil bath, or may be subjected to the various operations in different baths and any residual grease removed by alkali washing or other means. The Provisional Specification also states that copper, antimony and cadmium may be included in the list of metals to be alloyed with the tin, preferably in amounts up to 1.5 per ...

MATERIALS

IMPROVEMENTS WITH OR IN CONNECTION WITH SOLDER

LEAD FREE TIN ZINC PLUMB BOB, ITS MIXTURE AND SOLDERING PART

ALLOY COMPOSITIONS FOR LITHIUM ION BATTERIES

LEGIERUNGEN

GLEITLAGERSCHALE AND PROCEDURE FOR YOUR PRODUCTION

COMPOSITIONS; PROCEDURE AND DEVICES FOR LEAD FREE HIGH TEMPERATURE SOLDER

GLEITLAGERSCHALE UND VERFAHREN ZU IHRER HERSTELLUNG

Mehrschichtgleitlager

Die Erfindung betrifft ein Mehrschichtgleitlager (1) umfassend in der angegebenen Reihenfolge eine Stützschicht (2), eine Lagermetallschicht (3), eine Diffusionssperrschicht (4) und eine Gleitschicht (5), wobei die Gleitschicht (5) aus einer Zinnbasislegierung gebildet ist und die Diffusionssperrschicht (4) aus einer Legierung, insbesondere einer Kupferlegierung, besteht, die einen Kupfergehalt von mindestens 30 Gew.-% aufweist. Die Diffusionssperrschicht (4) ist nicht durchgängig über die gesamte Oberfläche der Lagermetallschicht (3) ausgebildet, sie erstreckt sich jedoch über zumindest 85 % dieser Oberfläche. Die Diffusionssperrschicht weist eine durchschnittliche Schichtdicke (7) von mindestens 0,5µm auf. Zwischen der Lagermetallschicht (3) und der Diffusionssperrschicht (4) kann eine Nickelschicht angeordnet sein. Die Diffusionssperrschicht (4) enthält maximal 10 Gew.-% Nickel und zwischen 3 und 30 Gew.-% Antimon. Die Zinnbasislegierung der Gleitschicht (5) enthält zwischen 0 und 25 ...

ELECTRICAL PAIR OF PLUG CONNECTORS.

Procedure for the production of reproduction of the picture screens for cathode ray tubes

ADDITIVE FOR THE SOLVENT OF A FLUX

ELECTRICALLY CONDUCTIVE METAL BAND AND PLUG CONNECTOR FROM THIS

USE OF A LEAD FREE PLUMB BOB ALLOY PASTE FOR MANUFACTURING PRINTED CIRCUIT BOARDS

LAYER COMPOSITE MATERIAL FOR SLIDING BEARINGS

COPPER DOPED LOW MELT SOLDER FOR COMPONENT ASSEMBLY AND REWORK

Improvements in or relating to solders

Metal material for electronic components and method for producing same

Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal material (10) for electronic components, which is provided with: a base (11); a layer A (14) that constitutes the outermost layer of the base (11) and is formed of Sn, In or an alloy of these elements; and a layer B (13) that is arranged between the base (11) and the layer A (14) so as to constitute an intermediate layer and is formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy of these elements. The outermost layer (the layer A (14)) has a thickness of 0.002-0.2 m, and the intermediate layer (the layer B (13)) has a thickness of 0.001-0.3 m.

Lead-free, high tin ternary solder alloy of tin, silver, and indium

Method for plugging a hole and a cooling element manufactured by said method

TIN ALLOY WHEEL BALANCING WEIGHTS

A wheel weight suitable for balancing the wheels of automobiles which comprises an alloy of tin having a melting range with an upper limit of below approximately 320 ~C and a hardness of at least approximately 6Hv.

FLUX FOR SOLDER PASTE AND SOLDER PASTE

Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C6-C15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

PRODUCTS AND COMPOSITIONS OF LAYERED MATERIAL SYSTEMS FOR FLUXLESS BRAZING OF ALUMINUM OR DISSIMILAR METALS

A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer comprising one or more metals from the group comprising nickel, cobalt and iron is applied on the eutectic-forming layer. The eutectic-forming layer is preferably Si deposited by physical vapor deposition. The brazing product may be brazed to another aluminum shape or to a shape comprised of a dissimilar metal.

TERNARY ALLOYS

Bright, tarnish resistant and color stable ternary alloys of about 40-90% of tin, about 10-50 % cobalt and about 1-28% of a third metal of Periodic Group IIIA or VIB. Typical third metals are zinc or antimony. The alloys are electrodeposited from aqueous acidic baths at a temperature of about 50-85.degree.C. and current density of about 5-45A/ft2.

MERCURY RELEASING METHOD

It is described a method for releasing mercury in devices requiring it, i n particular fluorescent lamps, based on the use of manganese-mercury compos itions.

SOLDER ALLOY, SOLDER COMPOSITION, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD

A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass% or more and 5 mass% or less; the content ratio of the copper is 0.1 mass% or more and 1 mass% or less; the content ratio of the bismuth is 0.5 mass% or more and 4.8 mass% or less; the content ratio of the nickel is 0.01 mass% or more and 0.15 mass% or less; the content ratio of the cobalt is 0.001 mass% or more and 0.008 mass% or less; the content ratio of the indium is above 6.2 mass% and 10 mass% or less; and the content ratio of the tin is the remaining ratio.

Lead-Free Alloy Containing Tin, Zinc, Indium and Bismuth

LEAD-FREE ALLOY CONTAINING TIN, SILVER AND INDIUM

A low melting point solder alloy comprising effective amounts of tin, silver and indium.

FRICTION BEARING ALLOY

The invention relates to a plain bearing alloy on a tin basis with antimony and copper, the alloy consisting of 6 to 15% by weight of antimony, 3 to 10% by weight of copper, 0.05 to 1% by weight of silver and 0.1 to 2% by weight of zinc, the remainder being tin.

Metall-Legierung.

Transistor

Kontaktwerkstoff

Verwendung von Aluminiumlegierungen als Gleitlagerlegierungen

Verfahren zur Herstellung einer Halbleiteranordnung mit einem Siliciumkörper und mit mindestens einem pn-Übergang

Durch Bestrahlen härtbarer Lack, insbesondere zur Herstellung von Bildwiedergabeschirmen für Kathodenstrahlröhren

DENTALLEGIERUNG.

DENTAL ALLOY.

Tin alloy, especially for bearings

МЕТАЛЛ-УГЛЕРОДНАЯ КОМПОЗИЦИЯ

Металл-углеродная композиция, включающая металл и углерод, причем металл и углерод образуют единую фазу, отличающуюся тем, что при нагревании этой фазы до температуры плавления углерод не образует фазы, отдельной от металла, причем металл выбирают из группы, состоящей из золота, серебра, олова, свинца и цинка.

МАТЕРИАЛ ДЛЯ ТЕРМОПАР

Материал для термопар содержит никель и олово, тулий и цирконий.

ТЕРМОЭЛЕКТРИЧЕСКИЙ СПЛАВ

Термоэлектрический сплав содержит цирконий, никель и олово. Дополнительно вводят висмут при таком соотношении компонентов (мас.%): цирконий 33,85-32,86 никель 21,78-21,14 висмут 0,78-7,53 олово остальное ...

ТЕРМОЭЛЕКТРИЧЕСКИЙ СПЛАВ

Термоэлектрический сплав содержит никель, цирконий и олово и дополнительно содержит тулий.

МАТЕРИАЛ ДЛЯ ТЕРМОПАР И ТЕРМОЭЛЕМЕНТОВ

Материал для термопар та термоэлементов включает никель и олово. Кроме того, дополнительно содержит цирконий и гольмий при таком соотношении компонентов, масс. %: никель 21,38÷21,82 олово 43,24÷44,13 гольмий 0,31÷4,81 цирконий остальное.

МАТЕРІАЛ ДЛЯ ТЕРМОПАР ТА ТЕРМОЕЛЕМЕНТІВ

Матеріал для термопар та термоелементів містить нікель, кобальт і олово. Додатково містить титан.

БАББИТОВЫЙ СПЛАВ

Изобретение относится к области металлургии, а именно, материалам, работающим в подшипниках скольжения ответственного назначения в условиях больших и ударных нагрузок при больших скоростях скольжения. Задачей является повышение износостойкости и увеличение срока службы подшипников скольжения. Задача решается путем применения предлагаемого баббитного сплава, для изготовления и ремонта вкладышей подшипников скольжения, содержащего медь, кремний, сурьму, железо, алюминий и олово при следующем соотношении компонентов, мас.%: ...

METHOD OF CAPPING HOLES AND COOLING ELEMENT, MADE USING THIS METHOD

МАТЕРИАЛ ДЛЯ ТЕРМОПАР

Материал для термопар, содержащий никель и олово, и дополнительно – титан и ванадий.

ТЕРМОЭЛЕКТРИЧЕСКИй СПЛАВ

Термоэлектрический сплав содержит никель, диспрозий и олово, дополнительно содержит титан.

COATED SOLDER WIRE AND METHOD FOR MANUFACTURING SAME

Lead-free tin-silver-copper alloy solder composition

Solder alloy, solder paste, and electronic circuit board

Ultrasonic casting method for preparing hypereutectic high-temperature lead-free Sn-Cu alloy solder ingots

Solder paste and brazed joint

锡锌铜无铅钎料合金

A low-smelting-point lead-free alloy solder contains Zn, Cu, RE chosen from La, Ce, Pr and Nd, Bi and Sn. Its advantages are high wetting power and mechanical performance, no poison and pollution, and low cost.

High-performance copper-oxide-resistant conductor material for special cable and preparation method thereof

Guide wire

Corrosion-resistant green alloy of positive grid for lead-acid storage battery

A Ti-tin alloy preparation method

Soft solder alloy, cored solder, cored wire, cored wire, coated flux soft solder, brazing joint and soft brazing method

FLUX AND SOLDER PASTE

Environment-friendly type high temperature oxidation-resistance stannum alloy

Self-lubricating solid bodies

NOVEL COMPOSITE MATERIAL ENRICHED IN SILICON, ITS MANUFACTURING METHOD AND ITS USE AS ELECTRODE

Amalgams for dental leading

ELECTRODEPOSITION OF BRIGHT TIN-NICKEL ALLOY

Composition for stages

Alloy intended for the surface coating and applications

Solder adhesive and a production method for the same, and an electronic device comprising the same

The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.

Solder, soldering method, and semiconductor device

A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

Disk with an electrical connection element

The present invention relates to a disk with an electrical connection element, having a substrate with a first coefficient of thermal expansion, an electrically conductive structure on a region of the substrate, and a connection element with a second coefficient of thermal expansion.

Conductive bonding material, conductor bonding method, and semiconductor device production method

A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.

Lead-free solder paste

As electronic equipment has become smaller in size, printed circuit boards which cannot be subjected to cleaning have been developed, and a no-clean lead-free solder paste is becoming necessary. In order for a solder paste not to require cleaning, it is necessary that the color of the residue be transparent and that the residue be non-tacky. A maleated rosin, which is a rosin suited for no-clean paste, has a high acid value so it is not suitable for a flux for lead-free solder. As a means of suppressing a reaction between a flux containing a maleated rosin and a Sn—Ag—Cu based solder alloy powder, a Sn—Ag—Cu—Sb based solder alloy powder is used which adds 1-8 mass % of Sb to a Sn—Ag—Cu based solder alloy. As a result, it is possible to provide a solder paste which has the excellent effect that the solder paste does not easily undergo changes over time and

Bonding Material for Semiconductor Devices

A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy. 110-. (canceled)11. A solder bonding material comprising an electrically conductive porous metal body having a mesh-like structure with pores , and Sn or an Sn-based lead-free solder alloy which fills the pores of the porous metal body and covers a surface of the porous metal body , wherein the porous metal body forms metal compounds with the Sn or Sn-based lead-free solder alloy and has a porosity expressed as a proportion of the cross-sectional area of the pores with respect to a cross-sectional area of the porous metal body of 20-30%.12. A solder bonding material as claimed in wherein the porous metal body is made of at least one material which is selected from Cu claim 11 , Ni claim 11 , Ag claim 11 , and Cu alloys having a Cu content of at least 90 mass % and which forms intermetallic compounds by a reaction with Sn.13. A solder bonding material as claimed in wherein 20-30% by area of the porous metal body is occupied by the Sn or Sn-based lead-free solder alloy.14. A solder bonding material as claimed in wherein the thickness of the porous metal body is at least 0.1 mm and at most 0.2 mm and the overall thickness including the Sn or Sn-based lead-free solder alloy layer is 0.15-0.3 mm.15. A method of manufacturing a solder bonding material as claimed in comprising immersing a porous metal body having a pore structure which communicates from an interior to a surface of the porous metal body in a molten bath of molten Sn or a molten Sn-based lead-free solder alloy claim 11 , filling the interior of the pore structure of the porous metal body and coating the surface of the porous metal body with the ...

Tin-based solder ball and semiconductor package including the same

A tin(Sn)-based solder ball and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.2 to 4 wt. % silver(Ag), about 0.1 to 1 wt. % copper(Cu), about 0.001 to 0.3 wt. % aluminum(Al), about 0.001% to 0.1 wt. % germanium(Ge), and balance of tin and unavoidable impurities. The tin-based solder ball has a high oxidation resistance.

Soldering paste and flux

The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained.

Low heat capacity composite for thermal cycler

Provided is a low heat capacity composite for a thermal cycler . The low heat capacity composite of the present invention is a low heat capacity composite for a thermal cycler capable of overcoming difficulty in manufacture and reproducibility due to uniqueness of the existing PCR thermal cycler only. The low heat capacity composite of the present invention can reduce the cost of raw material and retain excellent heat property due to the improvement in low heat capacity and physical and mechanical properties, thereby remarkably shortening PCR reaction time and saving energy when used as a thermal block for a thermal cycler.

Low Melting Temperature Solder Alloy

A solder composition is provided. The solder composition consists essentially of from about 6.0 to 7.5 percent by weight of bismuth, from about 0.5 to 0.7 percent by weight of copper, and the remainder of the composition being tin.

Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part

A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.

Active solder

An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.

SOLDER ALLOY

A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%. 19-. (canceled)10. A solder alloy consisting essentially of , in mass percent , Ag: 1.0-5.0% , Cu: 0.1-1.0% , Sb: 0.005-0.025% , Fe: 0.005-0.015% , and a remainder of Sn.11. A solder alloy as claimed in containing 2.0-4.0 mass % of Ag.12. A solder alloy as claimed in containing 0.2-0.7 mass % of Cu.13. A solder alloy as claimed in containing 0.007-0.023 mass % of Sb.14. A solder alloy as claimed in wherein Fe:Sb as a mass ratio is 20:80-60:40.15. A solder alloy as claimed in containing 0.006-0.014 mass % of Fe.16. A solder ball made from a solder alloy as claimed in .17. A solder joint made from a solder alloy as claimed in .18. A bonding method comprising soldering two members to each other using a solder alloy as claimed in . This invention relates to a Sn—Ag—Cu based solder alloy and particularly to a Sn—Ag—Cu based solder alloy which can provide solder connections (solder joints) with connection reliability even when used for long periods at a high temperature.Sn—Ag—Cu solder alloys have been widely used as lead-free solders. The range of application of lead-free solder alloys is continuing to expand. As the use of the alloys has expanded, a desire has developed to use them in more severe environments. At the same time, a desire has also developed for high connection reliability such that a solder joint does not fracture or deteriorate even if used for long periods in such environments.The environments of use of solder joints envisioned in ...

Solder alloy

A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al 2 O 3 , or a combination thereof.

LEAD-FREE SOLDER ALLOY

The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities. 17-. (canceled)8. A lead-free solder alloy comprising:0.5 to 1.5 wt % of Ag;0.3 to 1.5 wt % of Cu;0.01 to 0.2 wt % of Ni;1.0 wt % or less of Ga; andthe balance being Sn and impurities.9. The lead-free solder alloy according to claim 8 , wherein the amount of Ag ranges from 1.0 to 1.2 wt %.10. The lead-free solder alloy according to claim 8 , wherein the amount of Ga ranges from 0.0001 to 0.1 wt %.11. The lead-free solder alloy according to claim 9 , wherein the amount of Ga ranges from 0.0001 to 0.1 wt %.12. The lead-free solder alloy according to claim 8 , wherein the amount of Ga ranges from 0.0001 to 0.03 wt %.13. The lead-free solder alloy according to claim 9 , wherein the amount of Ga ranges from 0.0001 to 0.03 wt %.14. The lead-free solder alloy according to claim 10 , wherein the amount of Ga ranges from 0.0001 to 0.03 wt %.15. The lead-free solder alloy according to claim 11 , wherein the amount of Ga ranges from 0.0001 to 0.03 wt %.16. The lead-free solder alloy according to claim 8 , wherein the amount of Ni ranges from 0.03 to 0.07 wt %.17. The lead-free solder alloy according to claim 9 , wherein the amount of Ni ranges from 0.03 to 0.07 wt %.18. The lead-free solder alloy according to claim 8 , wherein the amount of Cu ranges 0.5 to 1.0 wt %.19. The lead-free solder alloy according to claim 9 , wherein the amount of Cu ranges 0.5 to 1.0 wt %.20. A solder joint soldered a lead-free solder alloy according to .21. The solder joint according to claim 20 , wherein the amount of Ag in the lead-free solder alloy ranges from 1.0 to 1 ...

Method of producing tin emitted low alpha radiation by using vacuum refining

A method of producing a purified tin, which emits low alpha radiation by using a vacuum refining has developed: the steps are comprising: preparing a crude tin; containing the crude tin in a crucible and placing it in a vacuum furnace; and removing the impurities, which have higher vapor pressures and low boiling points than that of the tin from the vacuum furnace. The impurities, such as a lead and bismuth can be removed as much as possible by utilizing the difference of the vapor pressure of the elements in the tin. It is possible to minimize the emission of alpha radiation, so that it can be prevented the occurrence of the software errors.

Lead-Free Solder Ball

A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %. 1. A lead-free solder ball which is used for electrodes by mounting on a module substrate for a BGA or CSP and which has a solder composition comprising 0.5-1.1 mass % of Ag , 0.7-0.8 mass % of Cu , 0.05-0.08 mass % of Ni , and a remainder of Sn.2. The lead-free solder ball according to claim 1 , wherein the solder composition comprises 0.9-1.1 mass % of Ag claim 1 , 0.7-0.8 mass % of Cu claim 1 , 0.05-0.08 mass % of Ni claim 1 , and a remainder of Sn.3. The lead-free solder ball according to claim 1 , wherein the solder composition comprises 1.0 mass % of Ag claim 1 , 0.75 mass % of Cu claim 1 , 0.07 mass % of Ni claim 1 , and a remainder of Sn.4. The lead-free solder ball according to claim 1 , wherein the solder composition further contains at least one element selected from Fe claim 1 , Co claim 1 , and Pt in a total amount of 0.003-0.1 mass %.5. The lead-free solder ball according to claim 1 , wherein the solder composition further contains at least one element selected from Bi claim 1 , In claim 1 , Sb claim 1 , P claim 1 , and Ge in a total amount of 0.003-0.1 mass %.6. The lead-free solder ball according to claim 1 , wherein the solder ball has a diameter of at least 0.1 mm.7. The lead-free solder ball according to claim 1 , wherein the solder ball has a diameter of at least 0.3 mm.8. The lead-free solder ball according to claim 1 , wherein the solder ball has a diameter of at least 0.5 mm.9. A method of ...

Bonding method and production method

A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after the bonding, an Au—Sn solder (S′) has weight percent of Sn which is not less than 38.0 wt % but not more than 82.3 wt %.

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, RESIN FLUX-CORED SOLDER AND SOLDER JOINT

A solder alloy includes an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder paste includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder ball includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. 1. A solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi , 0.5 to 3.0 mass % of In , 0.01 to 0.10 mass % of Pd , and a balance of Sn.2. The solder alloy according to claim 1 , wherein the alloy composition contains 1.0 to 2.0 mass % of In.3. The solder alloy according to claim 1 , wherein the alloy composition contains 0.01 to 0.03 mass % of Pd.4. The solder alloy according to claim 1 , wherein the alloy composition further contains at least one of Co claim 1 , Ti claim 1 , Al and Mn in total amount of 0.1 mass % or less.5. The solder alloy according to claim 1 , wherein the alloy composition further contains at least one of P claim 1 , Ge claim 1 , and Ga in total amount of 0.1 mass % or less.6. A solder paste comprising a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi claim 1 , 0.5 to 3.0 mass % of In claim 1 , 0.01 to 0.10 mass % of Pd claim 1 , and a balance of Sn.7. A solder ball comprising a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi claim 1 , 0.5 to 3.0 mass % of In claim 1 , 0.01 to 0.10 mass % of Pd claim 1 , and a balance of Sn.8. A resin flux-cored solder comprising the solder alloy according to .9. A solder joint comprising the solder alloy according to . This application is a national stage application of International Application PCT/JP2018/047180, filed on Dec. 21, 2018 and designated the U.S., which claims priority to Japanese Patent Application ...

METHOD OF PRODUCING A VEHICLE GLASS ASSEMBLY

A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg. 1. A method of producing a vehicle glass assembly , comprising:(A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, said flat portions respectively having first and second surfaces for soldering,(B) soldering lead-free solder onto said surfaces to form first and second blocks of lead-free solder on the first and second surfaces, respectively,(C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and(D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form lead-free solder layers by solder connections between the connector and the busbar;wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg,wherein each block on the first and second surfaces is away from all edges of the first and the second flat portions,wherein all lead-free solders are disposed between the first and the ...

Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device

A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.

LEAD-FREE SOLDER ALLOY

Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn. 1. A lead-free solder alloy having an alloy composition comprising:1.0 to 6.5 wt % of In, more than 3.0 wt % but not more than 4.0 wt % of Bi, 1.0 to 3.0 wt % of Ag, 0.02 to 0.08 wt % of Ni, 0.03 to 0.09 wt % of Sb, and a balance of Sn.2. A solder paste comprising the lead-free solder alloy according to .3. A preform material comprising the lead-free solder alloy according to .4. A solder joint comprising the lead-free solder alloy according to .5. A lead-free solder alloy having an alloy composition comprising:1.0 to 6.0 wt % of In, more than 3.0 wt % but not more than 4.0 wt % of Bi, 2.0 to 3.0 wt % of Ag, 0.03 to 0.07 wt % of Ni, 0.05 to 0.08 wt % of Sb, and a balance of Sn.6. A solder paste comprising the lead-free solder alloy according to .7. A preform material comprising the lead-free solder alloy according to .8. A solder joint comprising the lead-free solder alloy according to .9. A lead-free solder alloy having an alloy composition comprising:1.0 to 7.0 wt % of In, 3.0 to 5.5 wt % of Bi, 1.0 to 4.0 wt % of Ag, 0.01 to 0.2 wt % of Ni, 0.01 to 0.09 wt % of Sb, and a balance of Sn.10. A solder paste comprising the lead-free solder alloy according to .11. A preform material comprising the lead-free solder alloy according to .12. A solder joint comprising the lead-free solder alloy according to . The present invention relates to a lead-free solder alloy.Electronic circuits (hereinafter referred to as “in-vehicle electronic circuits”) obtained by soldering electronic parts to printed circuit boards are mounted on a vehicle. Such in-vehicle ...

MICRO/NANO PARTICLE REINFORCED COMPOSITE SOLDER AND PREPARATION METHOD THEREFOR

A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C., tin atoms in the molten micro/nanoparticle-reinforced tin-based alloy form an intermetallic compound on a soldering pan in preference to the low-melting-point SnBi-based alloy, and the micro/nanoparticles are dispersed in soldered joints to form a “separator effect”, which blocks atoms in the SnBi-based alloy from being precipitated and bonded with the soldering pan, thereby inhibiting the growth of a Bi-rich layer, and solving the problem of brittle and unreliable soldered joints in lead-free low-temperature soldering. 1. A micro/nanoparticle-reinforced composite solder for low-temperature soldering , comprising the following components by mass percentage:50-80% of low-melting-point SnBi-based alloy solder powder;10-40% of micro/nanoparticle-reinforced tin-based alloy solder powder, the micro/nanoparticle-reinforced tin-based alloy solder powder being an alloy powder formed by diffusely mixing one or two of micro/nano-sized Cu, Ag and Sb particles with a molten metal Sn and atomizing the mixture; anda balance amount of a flux.2. The micro/nanoparticle-reinforced composite solder according to claim 1 , whereinthe micro/nanoparticle-reinforced composite solder comprises the following components by mass percentage: 60-70% of low-melting-point SnBi-based alloy solder powder, 10-30% of micro/nanoparticle-reinforced tin-based alloy solder powder, and a balance amount of a flux;the low-melting-point SnBi- ...

SOLDER ALLOY FOR PREVENTING FE EROSION, RESIN FLUX CORED SOLDER, WIRE SOLDER, RESIN FLUX CORED WIRE SOLDER, FLUX COATED SOLDER, SOLDER JOINT AND SOLDERING METHOD

Provided are a solder alloy for preventing Fe erosion, a resin flux cored solder, a wire solder, a resin flux cored wire solder, a flux coated solder, a solder joint, and a soldering method which, in order to prolong the life of a soldering iron tip, suppress erosion of the soldering iron tip and by which adhesion of carbide to the soldering iron tip is suppressed. The present invention has an alloy composition comprising, by mass %, 0.02-0.1% Fe, more than 0% and equal to or less than 0.2% Zr, with the remainder being Sn, and is used to prevent Fe erosion. 1. A solder alloy for preventing Fe leaching , in which adhesion of a carbide to an iron tip is controlled , the solder alloy consisting of , in mass %:Fe in an amount of 0.02 to 0.1%;Zr in an amount of more than 0% and 0.2% or less;Cu in an amount of 4% or less;at least one of Sb in an amount of 20% or less, Ag in an amount of 4% or less and Bi in an amount of 3% or less;at least one of Ni in an amount of 0.3% or less and Co in an amount of 0.2% or less;at least one of P in an amount of 0.1% or less, Ge in an amount of 0.1% or less and Ga in an amount of 0.1% or less; anda balance being Sn.2. The solder alloy according to claim 1 , wherein the amount of Cu is 0.1 to 4%.3. The solder alloy according to claim 1 , whereinthe amount of Sb is 5 to 20%.45-. (canceled)6. A flux-cored solder comprising the solder alloy according to .7. A wire solder comprising the solder alloy according to .8. A flux-cored wire solder comprising the solder alloy according to .9. A flux-coated solder comprising:{'claim-ref': {'@idref': 'CLM-00006', 'claim 6'}, 'the flux-cored solder according to ; and'}a flux, whereina surface of the flux-cored solder is coated with the flux.10. A solder joint comprising the solder alloy according to .11. A soldering method comprising the step of:soldering using a flux-cored solder and a soldering iron, whereinthe flux-cored solder consists of a flux and a solder alloy containing, in mass %, Fe: 0.02 to ...

JOINING MATERIAL AND METHOD FOR MANUFACTURING JOINED BODY

The joining material of the present invention is a joining material which contains a first metal powder and a second metal powder having a higher melting point than the first metal powder, in which the first metal powder is formed of Sn or an alloy containing Sn, the second metal powder is formed of a Cu—Ni alloy in which a proportion of Ni is 5 wt % or more and 30 wt % or less, a Cu—Ni—Co alloy in which a total of a proportion of Ni and a proportion of Co is 5 wt % or more and 30 wt % or less, or a Cu—Ni—Fe alloy in which a total of a proportion of Ni and a proportion of Fe is 5 wt % or more and 30 wt % or less, and a 90% volume grain size D90 of the second metal powder is 0.1 μm or more. 1. A joining material comprising:a first metal powder including Sn or an alloy containing Sn; and a Cu—Ni alloy in which a proportion of Ni is 5 wt % to 30 wt %,', 'a Cu—Ni—Co alloy in which a total of a proportion of Ni and a proportion of Co is 5 wt % to 30 wt %, or', 'a Cu—Ni—Fe alloy in which a total of a proportion of Ni and a proportion of Fe is 5 wt % to 30 wt %, and, 'a second metal powder having a higher melting point than the first metal powder, the second metal powder including'}a 90% volume grain size D90 of the second metal powder is 0.1 μm or greater.2. The joining material according to claim 1 , wherein a proportion of a weight the second metal powder to a weight of the first metal powder is 5 wt % or less.3. The joining material according to claim 1 , wherein a proportion of a weight the second metal powder to a weight of the first metal powder is 0.5 wt % to 5 wt %.4. The joining material according to claim 1 , wherein a proportion of a weight the second metal powder to a weight of the first metal powder is 1 wt % to 4 wt %.5. The joining material according to claim 1 , wherein D90 of the second metal powder is 0.1 μm to 4 μm.6. The joining material according to claim 1 , wherein the alloy containing Sn includes at least of Cu claim 1 , Ni claim 1 , Ag claim 1 , ...

INTERMETALLIC M-Sn5 (M=Fe, Cu, Co, Ni) COMPOUND AND A METHOD OF SYNTHESIS THEREOF

Novel intermetallic materials are provided that are composed of tin and one or more additional metal(s) having a formula M-Sn, where −0.1≦x≦0.5, with 0.01≦x≦0.4 being more preferred and the second metallic element (M) is selected from iron (Fe), copper (Cu), cobalt(Co), nickel (Ni), and a combination of two or more of those metals. Due to low concentration of the second metallic element, the intermetallic compound affords an enhanced capacity applicable for electrochemical cells and may serve as an intermediate phase between Sn and MSn. A method of synthesizing these intermetallic materials is also disclosed. 1. An intermetallic material comprising: {'br': None, 'sub': (1-x)', '5, 'M-Sn,\u2003\u2003(1)'}, 'a tin (Sn)-based intermetallic compound having a formula (1)'}wherein a second metallic element (M) is selected from the group consisting of iron (Fe), copper (Cu), cobalt (Co), and nickel (Ni) and x ranges between about −0.1 and about 0.5.2. The intermetallic material of claim 1 , wherein x ranges between about 0.01 and about 0.4.3. The intermetallic material of claim 1 , wherein the tin (Sn)-based intermetallic compound forms a single crystal having a tetragonal lattice in the P4/mcc space group.4. (canceled)5. The intermetallic material of claim 1 , wherein the tin (Sn)-based intermetallic compound has a formula FeSnor CoSn.6. The intermetallic material of claim 3 , wherein the lattice parameters of the crystal are a=b=6.91369 Å claim 3 , c=5.88967 Å claim 3 , and α=β=γ=90°.7. (canceled)8. The intermetallic material of claim 3 , wherein the lattice parameters of the crystal tire a=b=6.90567 Å claim 3 , c=5.85077 Å claim 3 , and α=β=γ=90°.9. The intermetallic material of claim 5 , wherein the tin (Sn)-based intermetallic compound is a canted antiferromagnet.10. The intermetallic material of claim 1 , wherein the intermetallic material is a nanomaterial having a size at its shortest cross-section that ranges between about 10 and about 500 nm in size and selected ...

ELECTROCONDUCTIVE MICROPARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, AND ELECTROCONDUCTIVE CONNECTION STRUCTURE

The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5% by weight relative to tin contained in the solder layer. 1. Electroconductive microparticles used for conductive connection of electronic circuit substrates having copper electrodes each comprising at least an electroconductive metal layer , a barrier layer , a copper layer , and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin ,the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5% by weight relative to tin contained in the solder layer.2. The electroconductive microparticles according to claim 1 ,wherein the concentration of the copper at any given point in the solder layer is 0.5 to 40% by weight after heating at 150° C. for 12 hours.3. The electroconductive microparticles according to claim 1 ,wherein at least one of nickel and cobalt is adhered to the surface of the solder layer.4. An anisotropic electroconductive material ...

Lead-Free Solder Ball

A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment.

ADAPTIVE INTERPOSER AND ELECTRONIC APPARATUS

An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials. 1. An adaptive interposer operably disposable between first and second solder materials of first and second electronic devices , respectively , the adaptive interposer comprising:a plate element formed to define cavities; andthird solder material disposable in the cavities to be electrically communicative with the first and second solder materials;the third solder material being more compliant and having a higher melting temperature than at least the second solder materials.2. The adaptive interposer according to claim 1 , wherein the plate element comprises:ceramic materials; andmetallic plating on cavity walls.3. The adaptive interposer according to claim 1 , wherein the plate element has a footprint of similar or lesser size than a footprint of the first electronic device and is formed to define cavities of varying sizes.4. The adaptive interposer according to claim 1 , wherein the first solder materials comprise one of eutectic solder and high lead content solder claim 1 , the second solder materials comprise eutectic solder and the third solder material comprises high lead content solder.5. The adaptive interposer according to claim 1 , wherein the first solder materials comprise one of 63Sn/37Pb solder and 90Pb/10Sn solder claim 1 , the second solder materials comprise 63 Sn/37Pb solder and the third solder material comprises 90Pb/10Sn solder.6. An adaptive interposer assembly operably disposable between first and second electronic devices claim 1 , the adaptive interposer assembly ...

LEAD-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE

First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy. 1. Lead-free solder comprising:a first metal that contains at least Sn;a second metal that contains at least a Ni—Fe alloy and contains no greater than 16% of Fe by mass; anda paste material, wherein the first metal and the second metal are in the form of separated particles and are dispersed in the paste material.2. Lead-free solder comprising:a first metal containing at least Sn; anda second columnar core metal cylindrically coated by the first metal in a lengthwise direction of the second columnar core metal, containing at least a Ni—Fe alloy, and contains no greater than 16% of Fe by mass. This application is a continuation application of U.S. application Ser. No. 13/005,838, filed Jan. 13, 2011, the contents of which are incorporated herein by reference.This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2010-017145, filed Jan. 28, 2010, the entire contents of which are incorporated herein by reference.1. Field of the InventionThe present invention relates to lead-free solder that contains no lead (Pb).2. Description of the Related ArtElectronic component built-in modules each include a substrate and a plurality of electronic components, such as passive components and active components, which are mounted on the substrate by using solder so as to have integrated functions. To mount such electronic components on a substrate of an electronic device, a terminal electrode of the electronic component built-in module and a terminal electrode of the substrate are joined together by solder.Conventionally, Sn—Pb solder has been used to join electronic components together; however, lead-free manufacturing has been promoted with environmental issues as a backdrop, so that lead-free solder is popularly used except in fields related to ...

Solder Alloy for Power Devices and Solder Joint Having a High Current Density

A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe. 16-. (canceled)7. A process for preventing electromigration in a solder joint in which a current with a current density of 5-100 kA/cmflows through at least a portion thereof , comprising:providing a solder joint between an electronic part and a Cu land or Ni land of a printed circuit board; and{'sup': '2', 'applying the current having the current density of 5-100 kA/cmthrough at least the portion of the solder joint,'}wherein the solder joint is formed of a solder alloy consisting of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, optionally at least one element selected from 0.05-0.3 mass % of Ni and 0.1-0.32 mass % of Co, and a remainder of Sn, and{'sub': 6', '5', '6', '5, 'sup': '2', 'wherein a reaction layer comprised of an intermetallic compound of (CuNi)(SnIn)or (CuCo)(SnIn)is formed between the solder alloy and the land, so that electromigration is prevented under a current density of 5-100 kA/cm.'}8. The process for preventing electromigration in a solder joint according to claim 7 , wherein a content of Ag in the solder alloy is 2.5-4 mass %.9. The process for preventing electromigration in a solder joint according to claim 7 , wherein a content of Bi in the solder alloy is 2-3 mass %.10. The process for preventing electromigration in a solder joint according to claim 7 , wherein a content of In in the solder alloy is 3-4 mass %.11. The process for preventing electromigration in a solder joint according to claim 7 , wherein the solder alloy consists of 2-4 mass % of Ag claim 7 , 2-4 mass % of Bi claim 7 , 2-5 mass % of In claim 7 , 0.05-0.3 mass % of Ni claim ...

SOLDER PASTE FOR REDUCTION GAS, AND METHOD FOR PRODUCING SOLDERED PRODUCT

The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility. 1. A solder paste for a reducing gas used together with a reducing gas , essentially consisting of:a solder powder;a thixotropic agent that is solid at normal temperature; anda solvent;wherein the solder paste is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility,wherein the solder powder and the thixotropic agent melt at a temperature higher than the temperature for reduction with the reducing gas,wherein the reducing gas is formic acid or hydrogen, andwherein the solvent shows a weight loss of 25% or more at a rate of temperature increase of 10° C./min in thermogravimetry (TG) under normal pressure at 180° C.2. A solder paste for a reducing gas used together with a reducing gas , essentially consisting of:a solder powder;a thixotropic agent that is solid at normal temperature; anda solvent;wherein the solder paste is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility,wherein the thixotropic agent is a thixotropic agent that satisfies a wet-spreading area rate of 0 to 50% in the following procedures (1) to (5),(1) Applying a paste obtained by removing the solder powder from a solder paste consisting of a solder powder, a thixotropic agent and a solvent to a thickness of 100 μm (metal mask thickness) in a 5×5 mm sized region on a nickel-plated copper substrate (20×20 mm, thickness 2 mm);(2) Measuring the area of the paste ...

METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, WIRE, SOLDERED PRODUCT, FLEXIBLE PRINTED BOARD, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING TIN ARTICLE, METHOD FOR MANUFACTURING TIN INTERMEDIATE PRODUCT, TIN INTERMEDIATE PRODUCT, AND CONDUCTIVE MEMBER

A solder product includes: a lead-free solder part containing tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid having 10 to 20 carbons, the carboxylic acid being mainly distributed over the surface of the solder product to form a surface layer . The carboxylic acid is preferably a fatty acid having 12 to 16 carbons, and more preferably a palmitic acid. 1. A method for manufacturing a solder product , the method comprising:a heating step of heating and melting a raw material to obtain a molten metal, the raw material containing tin as a main component, a metal element other than lead as a secondary component, and a carboxylic acid having 10 to 20 carbons;a filtration step of filtering the molten metal set to a temperature from 230° C. to 260° C. with a filter having an aperture size of not more than 10 μm; anda cooling step of cooling and solidifying the filtered molten metal and depositing the carboxylic acid at a surface of the solder product.2. The method for manufacturing a solder product according to claim 1 , whereinin the filtration step, the filter is heated.3. The method for manufacturing a solder product according to claim 1 , whereinin the filtration step, wire mesh made of stainless steel is used as the filter.4. The method for manufacturing a solder product according to claim 1 , whereinin the heating step, the raw material contains copper as the metal element serving as the secondary component.5. A method for manufacturing a solder product claim 1 , the method comprising:a heating step of heating and melting a raw material to obtain a molten metal, the raw material containing tin as a main component, a metal element other than lead as a secondary component, and a carboxylic acid having 10 to 20 carbons;a removing step of removing, from the molten metal set to a temperature from 230° C. to 260° C., solids having a diameter of more than 10 μm and present within the molten metal; anda cooling step ...

Electroconductive Bonding Material

An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1-15%, In: 2-16%, Sb: greater than 0% to at most 2%, optionally one or both of Ag: at most 2% and Cu: at most 1%, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01-0.15%, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused. 1. An electroconductive bonding material , wherein the electroconductive bonding material comprises an alloy composition consisting , in mass % , of Zn: 0.1-15% , In: 2-16% , Sb: greater than 0% to at most 2% , Ag: 0-2% , Cu: 0-1% , at least one element selected from a group consisting of Ba , Ti , and Ca in a total amount of 0-0.15% , and a remainder of Sn.2. The electroconductive bonding material as set forth in claim 1 , wherein the electroconductive bonding material comprises claim 1 , in mass % claim 1 , at least one of Ag: 0.1-2% and Cu: 0.1-1%.3. The electroconductive bonding material as set forth in claim 1 , wherein the electroconductive bonding material comprises claim 1 , in mass % claim 1 , at least one element selected from a group consisting of Y claim 1 , Ba claim 1 , Ti claim 1 , and Ca in a total amount of 0.01-0.15%.4. The electroconductive bonding material as set forth in claim 1 , configured for connection to an inorganic nonmetal.5. A film formed from an electroconductive bonding material as set forth in .6. The film as set forth in claim 5 , wherein the film is adhered to the surface of an inorganic nonmetal.7. A bonding method claim 1 , wherein the bonding method comprises using an electroconductive bonding material as set forth in .8. The bonding method as set forth in claim 7 , wherein ...

LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE

In a soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member, void generation is prevented and solder wettability is improved. The soldering method for Ag-containing lead-free solders of the present invention is a soldering method for Ag-containing lead-free solders includes a first step of bringing a lead-free solder having a composition that contains Ag that a relation between a concentration C (mass %) of Ag contained in an Sn—Ag-based lead-free solder before soldering of a mass M(g) and an elution amount B(g) of Ag contained in the Ag-containing member becomes 1.0 mass %≦(M×C+B)×100/(M+B)≦4.6 mass % and that the balance consists of Sn and unavoidable impurities into contact with the Ag-containing member, a second step of heating and melting the lead-free solder, and a third step of cooling the lead-free solder. 1. A soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member comprising: {'br': None, '1.0 mass %≦(M×C+B)×100/(M+B)≦4.6 mass %'}, 'a first step of bringing a lead-free solder into contact with the Ag-containing member, the lead-free solder having a composition consisting of Ag and the balance of Sn and unavoidable impurities, which satisfies a relation between a concentration C (mass %) of Ag contained in an Sn—Ag based lead-free solder before soldering of a mass M(g) and an elution amount B(g) of Ag contained in the Ag-containing member being as followsa second step of heating and melting the lead-free solder; anda third step of cooling the lead-free solder.2. The soldering method for Ag-containing lead-free solders according to claim 1 , whereinthe composition of the lead-free solder in the first step is configured by a multiple eutectic system that a precipitation strengthening element that is not more than 0.1 mass % in solubility limit concentration has been added to a Sn—Ag eutectic system, andthe lead-free solder in the third step has a composition that a total mass of Ag ...

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE

A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn-Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump. 1. A method of producing a solder bump joint , the method comprising:heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn—Bi compound is free of Ag;stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°; andcooling down the solder bump.2. The method of claim 1 , wherein heating the solder bump comprises heating the solder bump further comprising copper.3. The method of claim 1 , wherein stretching the solder bump comprises stretching the solder bump to have a ratio of an average center width spacing to an average top contact width spacing is between 0.5 and 1.0.4. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure being predominantly orthogonal to an axis of stretching claim 1 , after the stretching.5. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure being predominantly parallel to an axis of stretching claim 1 , after the stretching.6. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure having a first portion and a second portion claim 1 , the first portion being predominantly parallel to an axis of stretching and the second portion being predominantly orthogonal to the axis of stretching claim 1 , after the ...

SOLDER ALLOY

A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn. 1. A solder alloy having an alloy composition consisting of , in mass % , Ag: 0 to 4% , Cu: 0.1 to 1.0% , Ni: 0.01 to 0.3% , Sb: 5.1 to 7.5% , Bi: 0.1 to 4.5% , Co: 0.001 to 0.3% , P: 0.001 to 0.2% , and a balance being Sn.2. The solder alloy according to claim 1 , wherein the alloy composition satisfies the following relationships (1) and (2):{'br': None, '0.50≤(Ag+Cu)×(Sb+Bi)×(Ni+Co+P)<7.0 \u2003\u2003(1)'}{'br': None, '0.17≤Co/P≤65 \u2003\u2003(2)'}wherein, Ag, Cu, Sb, Bi, Ni, Co, and P each represent a content (mass %) thereof in the alloy composition.3. A preform comprising the solder alloy according to .4. A paste comprising the solder alloy according to .5. A solder joint comprising the solder alloy according to .6. A preform comprising the solder alloy according to .7. A paste comprising the solder alloy according to .8. A solder joint comprising the solder alloy according to . This application claims the benefit of Japanese Priority Patent Application JP 2020-130472 filed on Jul. 31, 2020, the entire contents of which are incorporated herein by reference.The present technology relates to a solder alloy, in particular, a lead-free solder alloy.In recent years, car electronics has been improved for motor vehicles, and motor vehicles are shifting from gasoline vehicles to hybrid vehicles and electric vehicles. Hybrid vehicles and electric vehicles are equipped with an in-vehicle electronic circuit that has electronic components soldered to a printed circuit board. The in-vehicle electronic circuit used to be disposed in a vehicle interior in a relatively gentle vibration environment, but with the expansion in application, has been mounted directly in an engine room, in an oil chamber of a transmission, or even on a mechanical device.As described above, ...

Solder Alloy for LED, and LED Module

Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-40 of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge. 1. A solder alloy for use in a module in which a component and an Al substrate are bonded , the component having a main body made of ceramic and having a side-surface electrode with an area of not more than 30% of an entire area of a side surface , the solder alloy comprising , by mass %: 0 to 4% of Ag; 0.3 to 1.2% of Cu; 3 to 10% of Sb , and a balance of Sn.2. The solder alloy according to claim 1 , further comprising claim 1 , by mass % claim 1 , not more than 0.15% in total of at least one element selected from Ni and Co.3. The solder alloy according to claim 1 , further comprising claim 1 , by mass % claim 1 , not more than 0.1% in total of at least one element selected from P and Ge.4. The solder alloy according to claim 1 , wherein an average shear stress is 25 MPa or higher.5. The solder alloy according to claim 1 , wherein a minimum shear stress is 15 MPa or higher.6. The solder alloy according to claim 1 , wherein the component is an LED component.7. An LED module in which an LED component having the solder alloy according to is mounted.8. An LED module in which an LED component and an Al substrate are bonded with the solder alloy according to claim 1 , the LED component having a ceramic substrate and a light emitting device disposed on the ceramic substrate claim 1 , being cut at a ...

Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more. 114.-. (canceled)15. A solder material characterized in that the solder material comprises:a spherical core that provides space between a joint object and another object to be joined to the joint object; anda solder coated layer that has a melting point at which a core layer of the core is not melted, contains Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core, whereinthe solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.16. The solder material according to claim 15 , wherein the solder coated layer contains brightener.17. The solder material according to claim 15 , wherein the core is a spherical material made of an elemental metal claim 15 , an alloy claim 15 , a metal oxide claim 15 , or a mixed metal oxide of Cu claim 15 , Ni claim 15 , Ag claim 15 , Bi claim 15 , Pb claim 15 , Al claim 15 , Sn claim 15 , Fe claim 15 , Zn claim 15 , In claim 15 , Ge claim 15 , Sb claim 15 , Co claim 15 , Mn claim 15 , Au claim 15 , Si claim 15 , Pt claim 15 , Cr claim 15 , La claim 15 , Mo claim 15 , Nb claim 15 , Pd claim 15 , Ti claim 15 , Zr claim 15 , or Mg claim 15 , or a resin.18. The solder material according to claim 15 , wherein the solder coated layer contains at least one selected from a group consisting of Cu claim 15 , Bi claim 15 , In claim 15 , Zn claim 15 , Ni claim 15 , Co ...

Flux Activator, Flux, and Solder

Provided is a flux activator containing a halogen compound represented by formula 1 below: 2. The flux activator according to claim 1 , wherein{'sup': '1', 'Xis Br or I, and'}{'sup': '2', 'Xis Br or I.'}3. A flux comprising the flux activator according to .4. A solder comprising the flux according to .5. A flux comprising the flux activator according to .6. A solder comprising the flux according to . This application claims priority to Japanese Patent Application No. 2015-021528, the disclosure of which is incorporated herein by reference in its entirety.The present invention relates to a flux activator, and a flux and a solder containing the activator.A solder used for joining electronic parts generally contains a solder alloy and a flux. The flux contains a modified rosin, a resin component composed of a synthetic resin or the like, and an activator, and further a solvent component and other additives, as needed. As the activator, halogen activators containing organic halogen compounds are known. For example, Patent Literature 1 discloses a flux containing, as an activator, a halogen compound in which halogen atoms such as bromine and chlorine are introduced into an organic compound by covalent bonds. Further, Patent Literature 2 discloses a flux containing an iodine-containing carboxyl compound as an activator. It is known that such a halogen compound can improve solder wettability by removing the oxide film on the surface of the solder or preventing reoxidation, and further reducing the surface tension of the solder.However, it is difficult for the flux containing such a halogen compound activator to exert the aforementioned effects immediately after soldering, and it is also difficult to maintain the effects. Therefore, it is difficult to sufficiently improve the solder wettability in a general soldering step, which has been a problem.The present invention has been devised in view of the problems of the conventional arts described above, and an object thereof ...

Tungsten Target

There is provided a tungsten sputtering target that can provide a film deposition rate with less fluctuation over the target life, A tungsten sputtering target, wherein an area ratio of crystal grains having any of {100}, {110} and {111} planes oriented to a sputtering surface is 30% or less for any of the orientation planes, and an area ratio in total of crystal grains having orientation planes oriented to the sputtering surface other than {100}, {110} and {111} planes is 46% or more, the area ratio being obtained by an analysis of a cross section perpendicular to the sputtering surface with an inverse pole figure mapping using electron backscatter diffraction.

METHOD FOR PRODUCING MICROPARTICLES

The present invention addresses the problem of providing a method for producing microparticles. Composite microparticles are separated by mixing at least two kinds of fluids to be processed in a thin film fluid that is formed between approachable and separable opposing processing surfaces that relatively rotate, wherein the fluids to be processed are a metal fluid comprising at least two kinds of metal elements that are dissolved in a solvent in the form of metal and/or metal compound and a fluid for separation containing at least one kind of separating substance for separating a composite substance comprising the at least two kinds of metal elements. The molar ratio between the at least two kinds of metal elements contained in the resulting microparticles is controlled by controlling the circumferential speed of the rotation at a confluence where the metal fluid and the fluid for separation merge at this time. 1. A method for producing a microparticle , whereinat least two fluids to be processed are used,of these at least one fluid to be processed is a metal fluid having a metal and/or a metal compound dissolved in a solvent, andcontaining at least two metal elements in the metal fluid,at least one fluid to be processed other than the one fluid to be processed is a separating fluid which contains at least one separating substance to separate a composite substance that contains the at least two metal elements,the said fluids to be processed are mixed in a thin film fluid formed between at least two processing surfaces which are disposed in a position they are faced with each other so as to be able to approach to and separate from each other, at least one of which rotates relative substance to the other, whereby separating microparticle of the said composite substance, wherein in this method for producing the said microparticle;circumferential speed of the rotation at a converging point of the metal fluid and the separating fluid is controlled, thereby controlling ...

SURFACE FINISHES FOR INTERCONNECTION PADS IN MICROELECTRONIC STRUCTURES

A surface finish may be formed in a microelectronic structure, wherein the surface finish may include a multilayer interlayer structure. Thus, needed characteristics, such as compliance and electro-migration resistance, of the interlayer structure may be satisfied by different material layers, rather attempting to achieve these characteristics with a single layer. In one embodiment, the multilayer interlayer structure may comprises a two-layer structure, wherein a first layer is formed proximate a solder interconnect and comprises a material which forms a ductile joint with the solder interconnect, and a second layer comprising a material having strong electro-migration resistance formed between the first layer and an interconnection pad. In a further embodiment, third layer may be formed adjacent the interconnection pad comprising a material which forms a ductile joint with the interconnection pad. 125.-. (canceled)26. A microelectronic structure , comprising:an interconnection pad;a surface finish on the interconnection pad, wherein the surface finish comprises a multilayer interlayer structure including at least one ductile layer and at least one electro-migration resistant layer; anda solder interconnect on the surface finish.27. The microelectronic structure of claim 26 , wherein the at least one ductile layer comprises a nickel material having phosphorus content of between about 2% and 10% by weight.28. The microelectronic structure of claim 26 , wherein the at least one electro-migration resistant layer comprises a nickel material having phosphorus content of between about 11% and 20% by weight.29. The microelectronic structure of claim 26 , wherein the at least one electro-migration resistant layer comprises a high atomic weight metal.30. The microelectronic structure of claim 29 , wherein the high atomic weight metal is selected from the group consisting of nickel claim 29 , cobalt claim 29 , and iron.31. The microelectronic structure of claim 26 , wherein ...

METAL FINE PARTICLE-CONTAINING COMPOSITION

A particle composition includes metal fine particles composed of a metal element having a bulk melting point of greater than 420° C. with a primary particle diameter of primary particles of the metal fine particles being 1 nm to 500 nm, a part of or an entire surface of the metal fine particles being coated with a coating material; a low melting point metal powder composed of a metal or alloy having a bulk melting point of 420° C. or less; and an activating agent that decomposes and removes the coating material from the surface of the metal fine particles after the low melting point metal powder is melted, wherein a content of the metal fine particles containing the coating material is 0.5 mass % to 50 mass %, and a ratio ([inorganic compound/metal fine particles]×100 (mass %)) of the inorganic compound in the metal fine particles is 0.1 mass % to 50 mass %. 118-. (canceled)1911212. A metal fine particle-containing composition comprising , metal fine particles (P) composed of a metal element (M) having a bulk melting point of greater than 420° C. with a primary particle diameter of primary particles of the metal fine particles (P) being 1 nm to 500 nm , a part of or an entire surface of the metal fine particles being coated with a coating material (C); a low melting point metal powder (P) composed of a metal or an alloy having a bulk melting point of 420° C. or less; and an activating agent (A) that decomposes and removes the coating material (C) from the surface of the metal fine particles (P) after the low melting point metal powder (P) is melted , wherein{'b': '1', 'a content of the metal fine particles (P) containing the coating material (C) is 0.5 mass % to 50 mass %, and'}{'b': 1', '1', '1', '1, 'a ratio ([inorganic compound (C)/metal fine particles (P)]×100 (mass %)) of the inorganic compound (C) in the metal fine particles (P) is 0.1 mass % to 50 mass %.'}20. The metal fine particle-containing composition according to claim 19 , wherein the metal element (M) ...

Solder Preforms and Solder Alloy Assembly Methods

A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

Lead-free and antimony-free tin solder reliable at high temperatures

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.

LEAD-FREE SOLDER COMPOSITION

A lead-free solder composition includes tin, titanium and zinc. Based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight. 1. A lead-free solder composition comprising tin , titanium and zinc ,wherein, based on 100 parts by weight of the total weight of tin, titanium and zinc, tin is present in an amount ranging from 20 to 40 parts by weight, and titanium is present in an amount ranging from 0.01 to 0.15 parts by weight.2. The lead-free solder composition of claim 1 , wherein titanium is present in an amount ranging from 0.01 to 0.05 parts by weight based on 100 parts by weight of the total weight of tin claim 1 , titanium and zinc.3. The lead-free solder composition of claim 1 , wherein titanium is present in an amount ranging from 0.01 to 0.03 parts by weight based on 100 parts by weight of the total weight of tin claim 1 , titanium and zinc.4. The lead-free solder composition of claim 1 , wherein tin is present in 25 parts by weight based on 100 parts by weight of the total weight of tin claim 1 , titanium and zinc. This application claims priority of Taiwanese Application Number 105123411, filed on Jul. 25, 2016.The disclosure relates to a lead-free solder composition, and more particularly to a lead-free solder composition including tin, titanium and zinc.Conventional high-temperature lead-free solders that are well-known in the industry include gold-tin solder, bismuth-silver solder, zinc-aluminum solder and zinc-tin solder. Since gold and silver are considered more precious metals, gold-tin solder and bismuth-silver solder are more costly than zinc-aluminum solder and zinc-tin solder. Zinc-tin solder has the best mechanical strength and development potential of the above four solder compositions. Conventionally, the zinc-tin solder includes tin in an amount ranging from 20 to 40 wt %, where the ...

Solder Alloy, Solder Paste, Solder Preform and Solder Joint

Provided is a solder alloy, a solder paste, a solder preform, and a solder joint which suppress chip cracking during cooling, improve the heat dissipation characteristics of the solder joint, and exhibit high joint strength at high temperatures. 115-. (canceled)16. A solder alloy having an alloy composition consisting of , by mass:Sb: 9.0 to 33.0%;Ag: more than 4.0% and less than 11.0%;Cu: more than 2.0% and less than 6.0%; andthe balance being Sn.17. The solder alloy according to claim 16 , wherein said alloy composition further comprises by mass at least one group of:a group consisting of at least one of Al: 0.003 to 0.1%, Fe: 0.01 to 0.2%, and Ti: 0.005 to 0.4%;a group in which the total content of at least one of P, Ge, and Ga is 0.002 to 0.1%;a group in which the total content of at least one of Ni, Co, and Mn is 0.01 to 0.5%;a group in which the total content of at least one of Au, Ce, In, Mo, Nb, Pd, Pt, V, Ca, Mg, Si, Zn, Bi, and Zr is 0.0005 to 1%.18. The solder alloy according to claim 16 , wherein said solder alloy has an alloy structure comprising at least one of: an AgSn compound claim 16 , a CuSn compound claim 16 , a CuSncompound claim 16 , and a SnSb compound claim 16 , and the balance being a Sn phase.19. The solder alloy according to claim 18 , wherein said alloy structure includes the Sn phase in an amount of 5.6 to 70.2% by at %.20. The solder alloy according to claim 18 , wherein said alloy structure includes by at % the AgSn compound: 5.8 to 15.4% claim 18 , the CuSncompound: 5.6 to 15.3% claim 18 , the CuSn compound: 1.0 to 2.8% claim 18 , and the SnSb compound:16.8 to 62.1%.22. A solder alloy consisting of Ag claim 18 , Cu claim 18 , and Sb claim 18 , the balance being Sn claim 18 , wherein the solder alloy has an alloy structure comprising at least one of: an AgSn compound claim 18 , a CuSn compound claim 18 , a CuSncompound claim 18 , and a SnSb compound claim 18 , and the balance being a Sn phase.23. The solder alloy according to claim 22 ...

SOLDERING ALLOY, SOLDERING PASTE, PREFORM SOLDER, SOLDERING BALL, WIRE SOLDER, RESIN FLUX CORED SOLDER, SOLDER JOINT, ELECTRONIC CIRCUIT BOARD, AND MULTI-LAYER ELECTRONIC CIRCUIT BOARD

A soldering alloy includes an alloy composition consisting of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni, and a balance Sn. A soldering alloy, a soldering paste, a preform solder, a soldering ball, a wire solder, a resin flux cored solder and a solder joint, each of which is composed of the soldering alloy. An electronic circuit board and a multi-layer electronic circuit board joined by using the solder joint. 1. A soldering alloy comprising an alloy composition consisting of 13-22 mass % of In , 0.5-2.8 mass % of Ag , 0.5-5.0 mass % of Bi , 0.002-0.05 mass % of Ni , and a balance Sn.2. The soldering alloy according to claim 1 , wherein the alloy composition further contains at least one selected from P claim 1 , Ge and Ga in total of 0.09 mass % or less.3. The soldering alloy according to claim 1 , wherein the alloy composition further contains 0.005-0.1 mass % of Sb.4. The soldering alloy according to claim 1 , wherein the content of In is 15-20%.5. The soldering alloy according to claim 4 , wherein an upper limit of the content of In is 17%.6. The soldering alloy according to claim 1 , wherein the content of Ag is 1.0-2.5%.7. The soldering alloy according to claim 1 , wherein the content of Bi is 1.0-2.5%.8. The soldering alloy according to claim 1 , wherein the content of Ni is 0.003-0.04%.9. The soldering alloy according too claim 1 , wherein the content of In claim 1 , Ag claim 1 , Bi claim 1 , and Ni satisfies the following equation (1) claim 1 ,{'br': None, '0.9≤(In×Ni)×(Ag+Bi)≤3.4\u2003\u2003(1)'}wherein, in the relationship (1), In, Ni, Ag, and Bi represent each content of the respective elements.10. The soldering alloy according to claim 1 , wherein a solidus temperature is 160° C. or more and a liquidus temperature is 210° C. or less.11. The soldering alloy according to claim 10 , wherein the solidus temperature is 165° C. or higher and the liquidus temperature is 200° C. or lower.12. A soldering paste ...

WEAR-RESISTANT SLEEVE FOR A GAS NOZZLE FOR ENCAPSULATING A CUTTING GAS JET

In a sleeve for a gas nozzle, a sleeve main body and a sleeve end face is formed at least in part by a wear protection element which is fastened to the sleeve main body and which is composed of a more wear-resistant material than the sleeve main body adjoining the sleeve end face, an inner and/or an outer beveled portion of the sleeve end face are formed at least in part by the wear protection element. 1. A sleeve for a gas nozzle , comprising:a sleeve main body; anda sleeve end face, wherein the sleeve end face is formed at least in part by a wear protection element composed of a more wear-resistant material than that of the sleeve main body, wherein one or both of an inner or an outer beveled portion of the sleeve end face is formed at least in part by the wear protection element.2. The sleeve of claim 1 , wherein one or both of the inner or the outer beveled portion of the sleeve end face are formed solely by the wear protection element.3. The sleeve of claim 1 , wherein a wall thickness of the wear protection element in an inner portion of the sleeve main body adjoining the sleeve end face is less than half a wall thickness of the sleeve.4. The sleeve of claim 1 , wherein a wall thickness of the wear protection element in an inner portion of the sleeve main body adjoining the sleeve end face is less than 2 mm.5. The sleeve of claim 4 , wherein the wall thickness of the wear protection element in an inner portion of the sleeve main body adjoining the sleeve end face is less than 1.5 mm.6. The sleeve of claim 1 , wherein an axial length of an overlap region between the wear protection element and the sleeve main body is between 1 mm and 3 mm.7. The sleeve of claim 1 , wherein the wear protection element is formed at least in part of a material with a melting temperature higher than 400° C. claim 1 , a hardness and modulus of elasticity at least as great as those of aluminum claim 1 , a thermal conductivity and reflectivity with respect to infrared radiation at ...

SOLDERING MATERIAL BASED ON SN AG AND CU

The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents. 1. (canceled)2. Soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that , in addition to Sn (tin) as the major constituent , comprises 10 wt. % or less Ag (silver) , 10 wt. % or less Bi (bismuth) , 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper) , wherein at least one of the soldering components further comprises Ni (nickel) in such an amount that the alloy comprises 1.0 wt. % or less Ni.3. Soldering material according to wherein the alloy comprises 2 to 5 wt. % Ag claim 2 , 1 to 3 wt. % Bi claim 2 , 1 to 3 wt. % Sb claim 2 , 0.5 to 1.5 wt. % Cu and 0.05 to 0.3 wt. % Ni.41212. Soldering material according to wherein a soldering component M and a further soldering component M are provided in which the soldering component M claim 2 , in addition to Sn as the major constituent claim 2 , comprises 2 to 5 wt. % Ag claim 2 , 3 to 12 wt. % Bi claim 2 , 0.5 to 1.5 wt. % Cu and 0.1 to 0.3 wt. % Ni and the further soldering component M claim 2 , in addition to Sn as the major constituent claim 2 , comprises 2 to 5 wt. % Ag claim 2 , 0.5 to 1.5 wt. % Cu claim 2 , 1 to 5 wt. % Sb and 1.0 wt. % Ni.51212. Soldering material according to wherein a soldering component M and a further soldering component M are provided in which the soldering component M claim 2 , in addition ...

Interconnector for solar cells, and solar cell module

The purpose of the present invention is to provide an interconnector for solar cells, which reduces the stress acting on a solar cell and suppresses warping and cracking of the solar cell. An interconnector for solar cells of the present invention is characterized by comprising an electrically conductive wire part and a surface layer that is formed on at least one wide surface of the electrically conductive wire part. The interconnector for solar cells is also characterized in that the surface layer has a function of reducing the stress that is caused by the difference between the thermal expansion coefficient of the electrically conductive part and the thermal expansion coefficient of a solar cell, said stress being generated when the interconnector is joined to the solar cell.

SN-CU-BASED LEAD-FREE SOLDER ALLOY

Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.

Solder Alloy for Power Devices and Solder Joint Having a High Current Density

A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe. 16-. (canceled)7. A solder alloy for an electronic device having a joint carrying a current with a current density of 5-100 kA/cm′ consisting of 2-4 mass % of Ag , 2-4 mass % of Bi , 2-5 mass % of In , and a remainder of Sn.8. A solder alloy as set forth in claim 7 , consisting of 2.5-3.5 mass % of Ag claim 7 , 2-3 mass % of Bi claim 7 , 3-4 mass % of In claim 7 , and a remainder of Sn.9. A solder alloy as set forth in claim 7 , further containing at least one element selected from 0.01-0.3 mass % of Ni claim 7 , 0.01-0.32 mass % of Co claim 7 , and 0.01-0.1 mass % of Fe.10. A solder joint characterized by being made of a solder alloy consisting of 2-4 mass % of Ag claim 7 , 2-4 mass % of Bi claim 7 , 2-5 mass % of In claim 7 , and a remainder of Sn claim 7 , wherein the solder joint is a solder joint inside an electronic device or a solder joint which is connected to an electronic device claim 7 , and wherein a current with a current density of 5-1 00 kA/cmflows through at least a portion of the solder joint.11. A solder joint as set forth in claim 10 , wherein the solder joint is made from a solder alloy consisting of 2-4 mass % of Ag claim 10 , 2-4 mass % of Bi claim 10 , 2-5 mass % of In claim 10 , and a remainder of Sn and further containing at least one of 0.01-0.3 mass % of Ni claim 10 , 0.01-0.32 mass % of Co claim 10 , and 0.01-0.1 mass % of Fe.12. A power device characterized by having a solder joint inside the device made from a solder alloy consisting of 2-4 mass % of Ag claim 10 , 2-4 mass % of Bi claim 10 , 2-5 mass % of In claim 10 , and a remainder of Sn ...

LEAD-FREE SOLDER ALLOY, SOLDER JOINT, SOLDER PASTE COMPOSITION, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC DEVICE

According to one aspect of the present invention, a lead-free solder alloy includes 2% by mass or more and 3.1% by mass or less of Ag, more than 0% by mass and 1% by mass or less of Cu, 1% by mass or more and 5% by mass or less of Sb, 3.1% by mass or more and 4.5% by mass or less of Bi, 0.01% by mass or more and 0.25% by mass or less of Ni, and Sn. 1. A lead-free solder alloy comprising:2% by mass or more and 3.1% by mass or less of Ag;more than 0% by mass and 1% by mass or less of Cu;1% by mass or more and 5% by mass or less of Sb;3.1% by mass or more and 4.5% by mass or less of Bi;0.01% by mass or more and 0.25% by mass or less of Ni; andSn.2. The lead-free solder alloy according to claim 1 , further comprising 0.001% by mass or more and 0.25% by mass or less of Co.3. The lead-free solder alloy according to claim 2 ,wherein an amount of Sb is 2% by mass to 4% by mass, and the amount of Bi is 3.1% by mass to 3.2% by mass.4. The lead-free solder alloy according to claim 2 ,wherein an amount of Cu is 0.7% by mass to 1% by mass.5. The lead-free solder alloy according to claim 2 ,wherein an amount of Cu is 0.7% by mass.6. A lead-free solder alloy comprising:2% by mass or more and 3.1% by mass or less of Ag;more than 0% by mass and 1% by mass or less of Cu;1% by mass or more and 5% by mass or less of Sb;3.1% by mass or more and 4.5% by mass or less of Bi;0.01% by mass or more and 0.25% by mass or less of Ni;0.001% by mass or more and 0.25% by mass or less of Co; andSn, [{'br': None, '1.6≦an amount of Ag+(an amount of Cu/0.5)≦5.9\u2003\u2003(A)'}, {'br': None, '0.85≦(an amount of Ag/3)+(an amount of Bi/4.5)≦2.10\u2003\u2003(B)'}, {'br': None, '3.6≦an amount of Ag+an amount of Sb≦8.9\u2003\u2003(C)'}, {'br': None, '0<(an amount of Ni/0.25)+(an amount of Co/0.25)≦1.19\u2003\u2003(D).'}], 'wherein inequalities (A) to (D) in terms of % by weight are satisfied,'}7. The lead-free solder alloy according to claim 1 , further comprising more than 0% by mass and 6% by mass or less ...

SOLDER ALLOY AND JOINT THEREOF

A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 μm or less. 1. A solder joint , comprising:a joint in which at least a surface layer is silver is joined by a solder alloy composed of 2 to 9 weight % of zinc, 0.0001 to 0.1 weight % of manganese, and a remainder of tin, wherein the solder joint has a joint boundary in which a a silver-zinc intermetallic compound formed of Ag silver of the surface layer of the joint and zinc in the solder alloy has a grain size of 5 μm or less.2. The solder joint according to claim 1 , wherein a solder plating with the solder alloy is applied in advance to a first joint surface and a second joint surface of the joint claim 1 , and the first solder plating and the second solder plating are heated to be molten while the first solder plating and the second solder plating are brought into contact with each other claim 1 , and then solidified.3. The solder joint according to claim 2 , wherein a heating/melting temperature is 230° C.-300° C.4. A solder joining method claim 2 , comprising:plating a first joint surface and a second joint surface of a joint to have a solder plating in which at least a surface layer is silver and is plated in advance with a solder alloy composed of 2 to 9 weight % of zinc, 0.0001 to 0.1 weight % of manganese, and a remainder of tin; andheating the solder platings on the first joint surface and the second joint surface to be molten while ...

MULTI-LAYER SLIDING BEARING

The invention relates to a multi-layer sliding bearing () comprising a sliding layer () having a surface for contacting a component which is to be mounted. Said sliding layer () is made from a tin-based alloy with tin as the main alloy element and the sliding layer () has on the surface, at least in sections, an oxidic subcoating () in which the proportion of tin oxide(s) is at least 50% in wt. 113336: A multi-layer sliding bearing () comprising a sliding layer () having a surface for contacting a component to be supported , wherein the sliding layer () is made from a tin-based alloy with tin as the main alloy element , wherein the sliding layer () has on the surface , at least in some sections , an oxidic subcoating () , in which the proportion of tin oxide(s) is at least 50 wt. %.216: The multi-layer sliding bearing () as claimed in claim 1 , wherein the oxidic subcoating () extends over at least 80% of the surface.3167: The multi-layer sliding bearing () as claimed in claim 1 , wherein at least 50% of the area of the oxidic subcoating () has a layer thickness () which is at least 0.1 μm.467: The multi-layer sliding bearing (!) as claimed in claim 1 , wherein at least 50% of the area of the oxidic subcoating () has a layer thickness () which is maximum of 2 μm.51386: The multi-layer sliding bearing () as claimed in claim 1 , wherein the sliding layer () has oxidic areas () underneath the oxidic subcoating ().61: The multi-layer sliding bearing () as claimed in claim 1 , wherein there is more than 40 wt. % tin oxide in the modification romarchite.71: The multi-layer sliding bearing () as claimed in claim 6 , wherein in addition to romarchite there is also tetravalent tin oxide in the oxidic subcoating.816: The multi-layer sliding bearing () as claimed in claim 1 , wherein the oxidic subcoating () contains at least one alloy element and/or an alloy component claim 1 , which is selected from a group comprising: carbon claim 1 , hydrogen and sulfur.916: The multi- ...

SOLDER MATERIAL

A solder material including 2.5-3.3 wt % Ag, 0.3-0.5 wt % Cu 5.5-6.4 wt % In, and 0.5-1.4 wt % Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb. 1. A solder material including 2.5 to 3.3 wt % Ag , 0.3 to 0.5 wt % Cu , 5.5 to 6.4 wt % In , and 0.5 to 1A wt % Sb , a remainder thereof being unavoidable impurities and Sn , wherein the solder material does not substantively include Bi.24-. (canceled) The present invention relates to a solder material that is used as a joining material when joining objects together.An electronic component such as a transistor, a diode, a thyristor, and so on, is joined to a circuit board via a solder material. A solder material mainly composed of lead (Pb) has conventionally been employed as the solder material. However, due to the rise in environmental protection awareness of recent years, the solder material is being substituted by a so-called Pb-free solder material that does not include Pb.The Pb-free solder material has tin (Sn) as its main component, and contains as sub-components silver (Ag) and copper (Cu) that encourage precipitation strengthening. Furthermore, solid solution strengthening is known to be achieved by adding indium (In) and antimony (Sb). For example, Japanese Laid-Open Patent Publication No. 2002-120085 discloses a solder material including 2.5 to 4.5 wt % Ag, 0.2 to 2.5 wt % Cu, not more than 12 wt % In, and not more than 2 wt % Sb, a remainder being Sn. International Publication No. WO 1997/009455 discloses a solder material including 1.4 to 7.1 wt % Ag, 0.5 to 1.3 wt % Cu, 0.2 to 9.0 wt % In, and 0.4 to 2.7 wt % Sb, a remainder being Sn. In some cases, bismuth (Bi) may be further added.The circuit board with the above-described kind of electronic component being joined configures an on-board engine control unit installed in an automobile and which controls an engine, for example. Now, the automobile is sometimes used in an intensely ...

Bonding body, power module substrate, and heat-sink-attached power module substrate

A bonding body includes: an aluminum member composed of aluminum; and a metal member composed of any one of copper, nickel, and silver, wherein the aluminum member and the metal member are bonded together. In a bonding interface between the aluminum member and the metal member, a Ti layer and an Al—Ti—Si layer are formed, the Ti layer being disposed at the metal member side in the bonding interface, and the Al—Ti—Si layer being disposed between the Ti layer the aluminum member and containing Si which is solid-solubilized into Al 3 Ti. The Al—Ti—Si layer includes: a first Al—Ti—Si layer formed at the Ti layer side; and a second Al—Ti—Si layer formed at the aluminum member side and a Si concentration of which is lower than a Si concentration of the first Al—Ti—Si layer.

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

A solder joint layer has a structure in which plural fine-grained second crystal sections () precipitate at crystal grain boundaries between first crystal sections () dispersed in a matrix. The first crystal sections () are Sn crystal grains containing tin and antimony in a predetermined proportion. The second crystal sections () are made up of a first portion containing a predetermined proportion of Ag atoms with respect to Sn atoms, or a second portion containing a predetermined proportion of Cu atoms with respect to Sn atoms, or both. The solder joint layer may have third crystal sections () which are crystal grains that contain a predetermined proportion of Sb atoms with respect to Sn atoms. As a result, solder joining is enabled at a low melting point, and a highly reliable solder joint layer having a substantially uniform metal structure can be formed. 1. A semiconductor device in which constituent parts in one set thereof are joined by a solder joint layer , the solder joint layer comprising:first crystal sections containing tin and antimony at a ratio of tin atoms:antimony atoms=1:p (0 Подробнее

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

To provide a lead-free solder the heat resistance temperature of which is high and thermal conductive property of which are not changed in a high temperature range. A semiconductor device of the present invention includes a solder material containing more than 5.0% by mass and 10.0% by mass or less of Sb and 2.0 to 4.0% by mass of Ag, and the remainder consisting of Sn and inevitable impurities, and a bonding layer including the solder material, which is formed between a semiconductor element and a substrate electrode or a lead frame. 1. A solder material comprising more than 5.0% by mass and 10.0% by mass or less of Sb and 2.0 to 4.0% by mass of Ag , and the remainder consisting of Sn and inevitable impurities.2. The solder material according to claim 1 , further comprising more than 0 and 1.0% by mass or less of Ni.3. The solder material according to claim 1 , further comprising more than 0 and 1.0% by mass or less of Si.4. The solder material according to claim 2 , further comprising more than 0 and 1.0% by mass or less of Si.5. The solder material according to claim 1 , further comprising more than 0 and 0.1% by mass or less of V.6. The solder material according to claim 1 , further comprising more than 0 and 1.2% by mass or less of Cu.7. The solder material according to claim 1 , further comprising 0.001 to 0.1% by mass of P.8. The solder material according to claim 2 , further comprising 0.001 to 0.1% by mass of P.9. The solder material according to claim 3 , further comprising 0.001 to 0.1% by mass of P.10. The solder material according to claim 1 , further comprising 0.001 to 0.1% by mass of Ge.11. The solder material according to claim 2 , further comprising 0.001 to 0.1% by mass of Ge.12. The solder material according to claim 3 , further comprising 0.001 to 0.1% by mass of Ge.13. The solder material according to claim 4 , further comprising 0.001 to 0.1% by mass of Ge.14. The solder material according to claim 6 , further comprising 0.001 to 0.1% by mass ...

Lead-Free Solder Alloy

A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. It can form solder joints with high reliability even when used for soldering to electrodes having a Ni coating which contains P, since the growth of a P-rich layer is suppressed so that the shear strength of the joints is improved and the alloy has a high ductility and a high tensile strength.

Lead-Free Solder Alloy

A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors. 1. A lead-free solder alloy having an alloy composition consisting essentially of , in mass percent , In: 1.0-13.0% , Ag: 0.1-4.0% , Cu: 0.3-1.0% , and a remainder of Sn.2. A lead-free solder alloy as set forth in wherein the alloy composition contains claim 1 , in mass percent claim 1 , Ag: 0.3-3.0%.3. A lead-free solder alloy as set forth in wherein the alloy composition contains claim 1 , in mass percent claim 1 , In: 2.0-13.0% claim 1 , Ag: 0.3-3.0% claim 1 , and Cu: 0.5-0.7%.4. A lead-free solder alloy as set forth in wherein the alloy composition contains claim 1 , in mass percent claim 1 , In: 5.0-10.0% claim 1 , Ag: 0.1-1.5% claim 1 , and Cu: 0.3-1.0%.5. A solder joint made from a lead-free solder alloy as set forth in .6. A solder joint as set forth in wherein when the solder joint is conducting a current with a current density of 0.12 mA/μmin air at 165° C. claim 5 , the percent increase in resistance at 2500 hours after the start of conduction is at most 30% of the resistance before the start of conduction and is at most 5% of the 25 resistance at 500 hours after the start of conduction.7. A method for suppressing electromigration of a solder joint during electrical conduction comprising forming a solder joint using a lead-free solder alloy as set forth in . This invention relates to a lead-free Sn—Ag—Cu based solder alloy which can be used in a high temperature, high current density environment.In recent years, due to reductions in the size and increases in the performance of ...

SOLDER MATERIAL AND BONDED STRUCTURE

Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0<[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0<[Cu]<0.5, In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]≦6.8 when [Cu] falls within a range of 0.5≦[Cu]≦1.0, In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2. A balance includes only not less than 87 mass % of Sn. 1. Solder material comprising:Ag (silver) satisfying 0.3≦[Ag]<4.0;where 0.5 mass % and 1.0 mass % of Ag are excluded,Bi (bismuth) satisfying 0≦[Bi]≦1.0; andCu (copper) satisfying 0.2≦[Cu]≦1.2; andfurther comprising:In (indium) in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0.2≦[Cu]<0.5;In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]≦6.8 when [Cu] falls within a range of 0.5≦[Cu]≦1.0;In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2,with a balance including 87≦[Sn],where contents (mass %) of Ag, Bi, Cu, In, and Sn (tin) in the solder material are denoted by [Ag], [Bi], [Cu], [In] and [Sn], respectively.2. The solder material of claim 1 , whereinAg satisfies 0.5≦[Ag]≦3.8,Bi satisfies 0.2≦[Bi]≦1.0,In satisfies 6.0≦[In]≦6.8,Cu satisfies 0.2≦[Cu]≦1.2, anda balance includes only not less than 87.2 mass % of Sn.3. The solder material of claim 1 , whereinAg satisfies 1.8≦[Ag]≦3.8,Bi satisfies 0.2≦[Bi]≦1.0,In satisfies 6.0≦[In]≦6.7,Cu satisfies 0.8≦[Cu]≦1.2, anda balance includes only not less than 87.3 mass % of Sn.4. The solder material of claim 1 , whereinAg satisfies 3.5≦[Ag]≦3.8,Bi satisfies 0.6≦[Bi]≦1.0,In satisfies 6.0≦[In]≦6.1,Cu satisfies 1.1≦[Cu]≦1.2, anda balance includes only not less than 87.9 mass % of Sn.5. The solder material of claim 1 , whereinBi satisfies [Bi]=0,Ag satisfies 0.5≦[Ag]≦3 ...

Bonding member and bonding method

A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

Flux for resin cored solder and resin cored solder

A flux for resin cored solder containing a thermosetting resin is disclosed which is excellent in storage stability and productivity, and a resin cored solder having the flux built in. The flux for resin cored solder comprises a solid-state first flux containing a thermosetting resin, and a solid-state second flux containing a curing agent having redox activity, the first flux and the second flux being present in a non-contact state. A resin cored solder comprises the flux for resin cored solder and a lead-free solder alloy having a melting point ranging from 130° C. to 250° C. The resin cored solder is made up of a first resin cored solder in which the first flux is built into the lead-free solder alloy, and a second resin cored solder in which the second flux is built into the lead-free solder alloy.

Synthesis of N-Type Thermoelectric Materials, Including Mg-Sn-Ge Materials, and Methods for Fabrication Thereof

Discussed herein are systems and methods for fabrication of MgSnGe-based thermoelectric materials for applications from room temperature and near room temperature to high temperature applications. The TE materials may be fabricated by hand or ball milling a powder to a predetermined particle size and hot-pressing the milled powder to form a thermoelectric component with desired properties including a figure of merit (ZT) over a temperature range. The TE materials fabricated may be disposed in thermoelectric devices for varying applications. 1. A method of manufacturing a thermoelectric material comprising:hot-pressing a powder comprising a first component (W) and a second component (X) into a pressed component, wherein the pressed component comprises a ZT value of at least 1.0 at about 450° C.2. The method of claim 1 , wherein claim 1 , prior to hot-pressing claim 1 , the powder is formed using ball-milling.3. The method of claim 2 , wherein the powder is ball-milled for a period from about 10 minutes to about 50 hours.4. The method of claim 2 , wherein the powder is hot-pressed between about 600° C. and about 800° C. from about 1 second to about 30 minutes.5. The method of claim 1 , wherein the powder further comprises a third component (Y).6. The method of claim 1 , wherein the powder has a formula of WX.7. The method of claim 1 , wherein the ZT value is about 1.4 at about 450° C.8. The method of claim 1 , wherein a power factor of the pressed component is from about 45 μW cmKto about 55 μW cmKfrom about 350° C. to about 450° C.9. The method of claim 5 , wherein the powder has a formula of WXY.10. The method of claim 5 , wherein the powder further comprises a fourth component (Z) claim 5 , and wherein the powder is according to the formula WXYZ.11. The method of claim 10 , wherein A/(B+C+D) is from about 1.4 to about 2.4.12. The method of claim 10 , wherein A/(B+C+D) is from about 1.9 to about 2.1.13. The method of claim 1 , wherein the first component is one of ...

IMPROVED CO-PRODUCTION OF LEAD AND TIN PRODUCTS

Metal compositions and production processes are described. A process for the production of a metal composition includes a first distillation step separating off by evaporation primarily lead from a solder mixture of lead, tin, and antimony, thereby producing as a first concentrated lead stream. The process includes a second distillation step separating primarily lead and antimony from the metal composition, thereby producing a second concentrated lead stream and a second bottom product. The method also includes a third distillation step separating primarily lead and antimony from the second concentrated lead stream, thereby producing a third concentrated lead stream and a third bottom product. 1. A metal composition comprising , on a dry weight basis:at least 0.08%wt and at most 6.90%wt of lead (Pb);at least 0.50%wt and at most 3.80%wt of antimony (Sb);at least 92.00%wt and at most 98.90%wt of tin (Sn);at least 96.00%wt of tin, lead,. and antimony together;at least 1 ppm wt and at most 500 ppm wt of copper (Cu);at least 10 ppm wt and at most 0.0500%wt of silver (Ag);at most 0.40%wt of arsenic (As);at most 0.1% of the total of chromium (Cr), manganese (Mn), vanadium (V), titanium (Ti), and tungsten (W);at most 0.1% of aluminium (Al);at most 0.1% of nickel (Ni);at most 0.1% of iron (Fe); andat most 0.1% of zinc (Zn).2. The metal composition according to being a molten liquid.34-. (canceled)5. A process for the production of a soft lead product claim 1 , a hard lead product and a tin product claim 1 , the process comprising:a) providing a solder mixture comprising primarily major amounts of lead and tin, together with a minor amount of antimony;b) a first distillation step separating off by evaporation primarily lead from the solder mixture from step a), thereby producing as overhead product a first concentrated lead stream and a first bottom product enriched in tin, the first concentrated lead stream forming the basis for obtaining the soft lead product;{'claim-ref': ...

Solder joint with a multilayer intermetallic compound structure

A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu 3 Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu 1-x1-y1 Ni x1 Pd y1 ) 6 Sn 5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu 1-x2-y2 Ni x2 Pd y2 ) 6 Sn 5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.

BRAZING METHOD FOR ASSEMBLING TWO ELEMENTS VIA AN INTERMETALLIC COMPOUND

A brazing method for assembling two elements includes selecting two brazing materials that can generate, when they are heated and melted, an intermetallic compound having a melting temperature which is higher than the melting temperature of each of the selected brazing materials taken individually, positioning the two selected brazing materials between the two elements, heating and melting the two selected brazing materials in order to substantially reach the melting temperature of each of the selected brazing materials so as to achieve the precipitation of an intermetallic compound having a melting temperature which is higher than the melting temperature of each of the selected brazing materials taken individually. 1. A brazing method for assembling two elements , said method comprising:selecting two brazing materials that can generate, when the two brazing materials are heated and melted, an intermetallic compound having a melting temperature which is higher than the melting temperature of each of the two selected brazing materials taken individually,positioning the two selected brazing materials between the two elements,heating and melting the two selected brazing materials to substantially reach the melting temperature of each of the two selected brazing materials so as to achieve the precipitation of an intermetallic compound having a melting temperature which is higher than the melting temperature of each of the two selected brazing materials taken individually.2. The brazing method according to claim 1 , wherein each of the two selected brazing materials is an alloy or a pure metal.3. The brazing method according to claim 1 , wherein one of the two selected brazing materials is Au80Sn20 alloy and the other of the two selected brazing materials is pure tin.4. The brazing method according to claim 1 , wherein each of the two selected brazing materials is in the form of:a strip, ora powder mixed with a high viscosity organic material.5. The brazing method ...

Ecological ammunition

The present invention relates to a composite material for the production of ecological ammunition characterized in that it comprises a) a metal matrix formed by a zinc and bismuth alloy, zinc and aluminum alloy, tin and bismuth alloy or zinc and tin alloy and a metal selected from aluminum, bismuth and the combination thereof and b) reinforcing metal particles distributed therein selected from wolframium, ferro-wolframium, ferro-wolframium carbides, wolframium carbides, wolframium oxides and ferro-wolframium oxides, subjected to oxidation before being added to the metal matrix.

LEAD-FREE SOLDER ALLOY AND IN-VEHICLE ELECTRONIC CIRCUIT

With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass % Ag, 0.6-0.8 mass % Cu, 1-5 mass % Sb, 0.01-0.2 mass % Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of −40° C. to high temperatures of 125° C. but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using the solder alloy can thereby be obtained. 1. A lead-free solder alloy comprising: 3.2 to 3.8 wt % of Ag; 0.6 to 0.8 wt % of Cu; 1 to 5 wt % of Sb; 0.01 to 0.2 wt % of Ni; 1.5 to 5.5 wt % of Bi; and a balance of Sn.2. (canceled)3. The lead-free solder alloy according to claim 1 , further comprising Co in an amount of 0.001 to 0.1 wt %.4. The lead-free solder alloy according to claim 1 , wherein a rate of residual shear strength after 3 claim 1 ,000 cycles of a temperature cycle test with respect to an initial value is 30% or more.5. The lead-free solder alloy according to claim 1 , wherein the solder alloy is joined to a board having undergone a Cu-OSP process.6. An in-vehicle electronic circuit comprising a solder joint portion comprising the lead-free solder alloy according to .7. An ECU electronic circuit comprising a solder joint portion comprising the lead-free solder alloy according to .8. An in-vehicle electronic circuit unit comprising the electronic circuit according to .9. An ECU electronic circuit unit comprising the ECU electronic circuit according to .10. A lead-free solder alloy comprising: 1 to 4 wt % of Ag; 0.6 to 0.8 wt % of Cu; ...

SUBSTRATE ON SUBSTRATE PACKAGE

Embodiments herein may relate to a patch on interposer (PoINT) architecture. In embodiments, the PoINT architecture may include a plurality of solder joints between a patch and an interposer. The solder joints may include a relatively high temperature solder ball and a relatively low temperature solder paste that at least partially surrounds the solder ball. Other embodiments may be described and/or claimed. 1. A package comprising:a first substrate with a first side and a second side opposite the first side;a second substrate with a first side and a second side opposite the first side, wherein the first substrate and second substrate define a space between the first side of the first substrate and the first side of the second substrate;a solder ball disposed within the space and physically coupled with the first side of the first substrate and the first side of the second substrate; anda solder paste positioned within the space and physically coupled with the solder ball, the first side of the first substrate, and the first side of the second substrate, wherein the solder paste partially surrounds the solder ball while the solder ball is partially exposed.2. (canceled)3. The package of claim 1 , wherein the solder ball includes an alloy of tin claim 1 , silver and copper claim 1 , or an alloy of tin and bismuth.4. The package of claim 1 , wherein the solder paste includes epoxy.5. The package of claim 1 , wherein the first substrate has approximately 20 inptut/output connections or more per millimeter claim 1 , or has a line/space measurement of less than approximately 20/20 micrometers.6. The package of claim 1 , wherein the second substrate has approximately 10 input/output connections or less per millimeter claim 1 , or has a line/space measurement of greater than approximately 20/20 micrometers.7. The package of claim 1 , wherein the first substrate includes a die coupled with the second side of the first substrate by a solder joint without being in contact ...

LEAD-FREE SOLDER COMPOSITIONS

A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities. 1. A lead-free solder alloy comprising:{'claim-text': ['from greater than 0 to 1 wt. % nickel,', 'from greater than 0 to 10 wt. % germanium,', 'from greater than 0 to 1 wt. % manganese,', 'from greater than 0 to 10 wt. % aluminium,', 'from greater than 0 to 10 wt. % silicon,', 'from greater than 0 to 9 wt. % bismuth,', 'from greater than 0 to 5 wt. % indium,', 'from greater than 0 to 1 wt. % titanium,', 'from greater than 0 to 2 wt. % lanthanum,', 'from greater than 0 to 2 wt. % neodymium,'], '#text': 'from 1 to 9 wt. % copper, at least one of:'}{'claim-text': ['up to 1 wt. % chromium,', 'up to 1 wt. % gallium,', 'up to 1 wt. % cobalt,', 'up to 1 wt. % iron,', 'up to 1 wt. % phosphorous,', 'up to 1 wt. % gold,', 'up to 1 wt. % tellurium,', 'up to 1 wt. % selenium,', 'up to 1 wt. % calcium,', 'up to 1 wt. % vanadium,', 'up to 1 wt. % molybdenum,', 'up to 1 wt. % platinum,', 'up to 1 wt. % magnesium,', 'up to 5 wt. % silver,', 'up to 1 wt. % zinc,', 'up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and'], '#text': 'optionally one or more of:'}the balance tin together with any unavoidable impurities.2. The solder alloy of claim 1 , ...

SILVER-FREE AND LEAD-FREE SOLDER COMPOSITION

A silver-free and lead-free solder composition includes: 2 wt % to 8 wt % of Bi, 0.1 wt % to 1.0 wt % of Cu, 0.01 wt % to 0.2 wt % of at least one of Ni, Fe, and Co, and the balance of Sn based on 100 wt % of the silver-free and lead-free solder composition. 1. A silver-free and lead-free solder composition , comprising: 2 wt % to 8 wt % of Bi , 0.1 wt % to 1.0 wt % of Cu , 0.01 wt % to 0.2 wt % of at least one of Ni , Fe , and Co , and the balance of Sn based on 100 wt % of said silver-free and lead-free solder composition.2. The silver-free and lead-free solder composition as claimed in claim 1 , further comprising 0.003 wt % to 0.03 wt % of at least one of Ge claim 1 , Ga claim 1 , and p based on 100 wt % of said silver-free and lead-free solder composition. This application claims priority of Taiwanese Application No. 101142019, filed on Nov. 12, 2012.1. Field of the InventionThis invention relates to a solder composition, more particularly to a silver-free and lead-free solder composition adapted to be used in soldering electronic components.2. Description of the Related ArtIn the prior art, a Sn—Pb alloy is usually used as a solder for electronic components. Owing to severe environmental pollution caused by lead and its compounds and increased environmental protection awareness, use of lead solders has been gradually forbidden in recent years. Hence, the lead solders are gradually being replaced by lead-free solders.Among the lead-free solders, a Sn—Ag—Cu (SAC305) lead free solder and a Sn—Cu lead-free solder are used most widely, especially, the Sn—Ag—Cu (SAC305) solder. Due to an increase in the price of silver, the price of Sn—Ag—Cu alloy solder has become higher, thereby increasing the cost of an electronic component package using the same.Accordingly, low-silver-content Sn—Ag—Cu solder or silver-free Sn—Cu solder is commonly used in the electronic packaging industry so as to reduce packaging costs. However, a tensile strength of the aforementioned low- ...

INTERMETALLIC NANOPARTICLES

A process for preparing intermetallic nanoparticles of two or more metals is provided. In particular, the process includes the steps: a) dispersing nanoparticles of a first metal in a solvent to prepare a first metal solution, b) forming a reaction mixture with the first metal solution and a reducing agent, c) heating the reaction mixture to a reaction temperature; and d) adding a second metal solution containing a salt of a second metal to the reaction mixture. During this process, intermetallic nanoparticles, which contain a compound with the first and second metals are formed. The intermetallic nanoparticles with uniform size and a narrow size distribution is also provided. An electrochemical device such as a battery with the intermetallic nanoparticles is also provided. 1. Intermetallic nanoparticles comprising:a first metal selected from the group consisting of: Sn, Pb, Sb, In, Ga, Bi, Ge, Zn, Ni; anda second metal selected from the group consisting of: Cu, Ag, Au, Pt, Pd, Ru, Ir, Fe, Co, Ni, wherein the intermetallic nanoparticles comprise a compound comprising the first metal and the second metal, and the average diameter of the intermetallic nanoparticles is from about 100 nm to about 400 nm.2. The intermetallic nanoparticles of claim 1 , wherein the first metal is Sn.3. The intermetallic nanoparticles of wherein the second metal is Cu.4. The intermetallic nanoparticles of further comprising a substituted metal selected from the group consisting of Ni claim 1 , Zn claim 1 , Fe.5. The intermetallic nanoparticles of wherein the first metal is Sn and the second metal is Cu and wherein a third metal is selected from the group consisting of: Ag claim 1 , Ag claim 1 , Au claim 1 , Pt claim 1 , Pd claim 1 , Ru claim 1 , Ir.6. The intermetallic nanoparticles of claim 1 , wherein crystal structure of the intermetallic nanoparticles differs from crystal structure of the first metal and crystal structure of the second metal.7. The intermetallic nanoparticles of wherein ...

IMPROVED TIN PRODUCTION, WHICH INCLUDES A COMPOSITION COMPRISING TIN, LEAD, SILVER AND ANTIMONY

Metal compositions and processes for fractional crystallization of a molten crude tin mixture containing lead and silver are described. A process includes separating the molten crude tin mixture into a first silver-enriched liquid drain product at the liquid end of a crystallization step and a first tin-enriched product at the crystal end of the crystallization step whereby the first silver-enriched liquid drain product comprises on a dry weight basis 6.0-30.0% wt of lead, 70.0-91% wt of tin, 95.0-99.0% wt of lead and tin together, 0.75-5.00% wt of silver, and ≥0.24% wt of antimony. The first silver enriched liquid drain product also includes at least one of: 0.05-0.5% wt of arsenic; 0.05-0.6% wt of copper, 0.0030-0.0500% wt of nickel, at least 0.0010-0.40% wt of bismuth, at most 1.0% wt of iron, or at least 0.0005% wt of gold, the balance being impurities. 1. A process for the separation by fractional crystallization of a molten crude tin mixture containing lead and silver , into a first silver-enriched liquid drain product at the liquid end of the crystallization step and a first tin-enriched product at the crystal end of the crystallization step , whereby the first silver-enriched liquid drain product comprises , on a dry weight basis;at least 6.0% wt and at most 30.0% wt of lead;at least 70.0% wt and at most 91% wt of tin;at least 95.0% wt and at most 99.0% wt of lead and tin together;at least 0.75% wt and at most 5.00% wt of silver;at least 0.24% wt of antimony; and{'claim-text': ['at least 0.05% wt and at most 0.5% wt of arsenic;', 'at least 0.05% wt and at most 0.6% wt of copper;', 'at least 0.0030% wt and at most 0.0500% wt of nickel;', 'at least 0.0010% wt and at most 0.40% wt of bismuth;', 'at most 1.0% wt of iron; or', 'at least 0.0005% wt of gold;', 'the balance being impurities.'], '#text': 'further comprising, on the dry weight basis, at least one of:'}2. The process according to claim 1 , wherein the crude tin mixture comprises at least 0.1% wt and at ...

LIQUID DISPERSION OF METAL NANOPARTICLES FOR SOLDER PASTE, METHOD FOR PRODUCING THE LIQUID DISPERSION, SOLDER PASTE, METHOD FOR PRODUCING THE SOLDER PASTE

A liquid dispersion of metal nanoparticles for solder paste comprises metal nanoparticles made of an alloy and a reducing dispersion medium, wherein the metal nanoparticles have an average particle diameter of 1.0 to 200 nm, the metal nanoparticles have a sintering initiation temperature of less than 50° C., and the liquid dispersion comprises substantially no surfactant or surface modifier. 1. A liquid dispersion of metal nanoparticles for solder paste , comprising metal nanoparticles made of an alloy and a reducing dispersion medium , whereinthe metal nanoparticles have an average particle diameter of 1.0 to 200 nm,the metal nanoparticles have a sintering initiation temperature of less than 50° C., andthe liquid dispersion comprises substantially no surfactant or surface modifier.2. The liquid dispersion of metal nanoparticles for solder paste according to claim 1 , which has a peak position in a particle size distribution curve within a range of 10 to 300 nm claim 1 , wherein the curve is obtained by measuring a particle size distribution after the liquid dispersion is left standing at 25° C. for 24 hours and irradiated with ultrasound at a frequency of 20 Hz at 40° C. for 3 minutes.3. The liquid dispersion of metal nanoparticles for solder paste according to claim 1 , wherein the alloy is at least one selected from the group consisting of Sn—Bi alloys claim 1 , Sn—Sb alloys claim 1 , Sn—Ag alloys claim 1 , Sn—Cu alloys claim 1 , Zn—Al alloys claim 1 , Bi—Cu alloys claim 1 , Au—Sn alloys claim 1 , Au—Ge alloys claim 1 , and Ag—Cu alloys.4. The liquid dispersion of metal nanoparticles for solder paste according to claim 1 , wherein the reducing dispersion medium is at least one selected from the group consisting of hydrocarbons and alcohols.5. The liquid dispersion of metal nanoparticles for solder paste according to claim 1 , wherein a total of the surfactant content and the surface modifier content is less than 0.1 parts by mass of relative to 100 parts by mass ...

LEAD-FREE SOLDER COMPOSITION

A lead-free solder composition includes, with respect to 100 wt % of a total weight of the lead-free solder composition, silver (Ag) at 0.3 to 3.0 wt %, antimony (Sb) at 0.5 to 3.0 wt %, indium (In) at 0.3 to 3.0 wt %, and tin (Sn) as the remaining portion. 1. A lead-free solder composition comprising ,with respect to 100 wt % of a total weight of the lead-free solder composition,silver (Ag) at 0.3 to 3.0 wt %,antimony (Sb) at 0.5 to 3.0 wt %,indium (In) at 0.3 to 3.0 wt %, andtin (Sn) as the remaining portion.2. The lead-free solder composition of claim 1 , further comprisingat least one of scandium (Sc), nickel (Ni), chromium (Cr), and cobalt (Co).3. The lead-free solder composition of claim 2 , whereinthe scandium (Sc) at 0.001 to 0.5 wt % is additionally included.4. The lead-free solder composition of claim 2 , whereinthe nickel (Ni) at 0.001 to 0.05 wt % is additionally included.5. The lead-free solder composition of claim 2 , whereinthe chromium (Cr) at 0.001 to 0.05 wt % is additionally included.6. The lead-free solder composition of claim 2 , whereinthe cobalt (Co) at 0.001 to 0.05 wt % is additionally included.7. The lead-free solder composition of claim 1 , whereinthe silver (Ag) is at 0.5 to 2.0 wt %.8. The lead-free solder composition of claim 1 , whereinthe antimony (Sb) is at 0.7 to 2.5 wt %.9. The lead-free solder composition of claim 1 , whereinthe indium (In) is at 0.4 to 1.5 wt %.10. The lead-free solder composition of claim 1 , whereinwhen tensile strength is evaluated with the ASTM A370 standard, the lead-free solder composition has tensile strength of 55 MPa or more.11. The lead-free solder composition of claim 1 , whereina thickness increase ratio of an intermetallic compound layer after soldering the lead-free solder composition is 40% or less after repeating 2000 cycles of a thermal fatigue test in which one cycle is 125° C./30 minutes to −40° C./30 minutes.12. A lead-free solder alloy manufactured with the lead-free solder composition of .13 ...

Resin Composition and Soldering Flux

Provided are a resin composition and a soldering flux. The resin composition includes at least one acid and rosin. The acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by hydrogenating a trimer acid which is a reaction product of oleic acid and linoleic acid. A weight ratio of the at least one acid to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin. The soldering flux is obtained by diluting the resin composition with a solvent. 16.-. (canceled)7. A resin composition , comprising:at least one acid selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by hydrogenating a trimer acid which is a reaction product of oleic acid and linoleic acid; androsin,wherein a weight ratio of the at least one acid to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin, andwherein, if the at least one acid comprises two or more acids selected from the dimer acid, the trimer acid, the hydrogenated dimer acid, and the hydrogenated trimer acid, a weight ratio of the two or more acids to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin.8. A soldering flux comprising:at least one acid selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and ...

Flux and solder paste

Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

Liquid Metal Thermal Interface Material Having Anti-melt Characteristic and Preparation Method Thereof

The present invention discloses a liquid metal thermal interface material having an anti-melt characteristic and a preparation method thereof. The liquid metal thermal interface material is characterized by comprising, in percentage by weight, 20-40 wt % of indium, 0-6 wt % of bismuth, 0-2 wt % of antimony, 0-3 wt % of zinc, 0-0.6 wt % silver, 0-0.3 wt % of nickel, 0-0.8 wt % of cerium, 0-0.6 wt % of europium and the balance of tin. The liquid metal thermal interface material has excellent thermal conductivity and chemical stability in an operating environment of an insulated gate bipolar transistor (IGBT), and thus is very suitable for IGBT devices in large-scale industrial production and practical applications. 1. A liquid metal thermal interface material having an anti-melt feature , the material comprising , in percentage by weight , the following constituents in proportions: 20-40 wt % of indium , 0-6 wt % of bismuth , 0-2 wt % of antimony , 0-3 wt % of zinc , 0-0.6 wt % of silver , 0-0.3 wt % of nickel , 0-0.8 wt % of cerium , 0-0.6 wt % of europium and the balance of tin.2. The liquid metal thermal interface material according to claim 1 , wherein the material comprises claim 1 , in percentage by weight claim 1 , the following constituents in proportions: 22 wt % of indium claim 1 , 1.4 wt % of bismuth claim 1 , 0.3 wt % of antimony claim 1 , 1.6 wt % of zinc claim 1 , 0.05 wt % of silver claim 1 , 0.02 wt % of nickel claim 1 , 0.02 wt % of cerium claim 1 , 0.01 wt % of europium and the balance of tin.3. The liquid metal thermal interface material according to claim 1 , wherein the material comprises claim 1 , in percentage by weight claim 1 , the following constituents in proportions: 28 wt % of indium claim 1 , 1.9 wt % of bismuth claim 1 , 0.4 wt % of antimony claim 1 , 1.8 wt % of zinc claim 1 , 0.03 wt % of silver claim 1 , 0.01 wt % of nickel claim 1 , 0.01 wt % of cerium claim 1 , 0.02 wt % of europium and the balance of tin.4. The liquid metal thermal ...

GLAZING WITH A SOLDERED CONNECTOR

A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing. 124-. (canceled)25. A glazing comprising at least one ply of glass having an electrically conductive component on at least one surface , and an electrical connector electrically connected to the electrically conductive component through a soldered joint , the solder of the joint having a composition comprising 0.5 wt % or more indium , wherein the electrical connector comprises a nickel plated contact for contacting the solder.26. The glazing as claimed in claim 25 , wherein the solder has a composition comprising 0.01 wt % or more Ni.27. The glazing as claimed in claim 25 , wherein the solder has a composition comprising 0.01 wt % to 5 wt % Ni.28. The glazing as claimed in claim 25 , wherein the solder has a composition comprising 0.05 wt % to 5 wt % Ni.29. The glazing as claimed in claim 25 , wherein the solder has a composition comprising 0.08 to 0.2 wt % Ni.30. The glazing as claimed in claim 25 , wherein the solder has a composition comprising less than 0.1 wt % Pb.31. The glazing as claimed in claim 25 , wherein the solder has a composition comprising 0.5 wt % or more tin and/or 0.5 wt % or more silver. ...

Lead-Free Solder Alloy

By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather. 1. A lead-free solder alloy characterized by consisting essentially of 0.2-1.2 mass % of Ag , 0.6-0.9 mass % of Cu , 1.2-3.0 mass % of Bi , 0.02-1.0 mass % of Sb , 0.01-2.0 mass % of In , and a remainder of Sn.2. The lead-free solder alloy according to claim 1 , characterized by consisting essentially of 0.2-1.0 mass % of Ag claim 1 , 0.6-0.9 mass % of Cu claim 1 , 1.2-2.0 mass % of Bi claim 1 , 0.1-0.5 mass % of Sb claim 1 , 0.01-0.3 mass % of In claim 1 , and a remainder of Sn.3. A lead-free solder paste in which a solder powder of a lead-free solder alloy according to is missed with a flux claim 1 , wherein the flux contains a total of at least 0.5 mass % and less than 5.0 mass % of at least one organic acid selected from succinic acid claim 1 , adipic acid claim 1 , and azelaic acid.4. A flux-cored solder comprising a solder wire of a lead-free solder alloy according to claim 1 , having its center filled with a flux claim 1 , wherein the flux contains at least one organic acid selected from succinic acid claim 1 , adipic acid claim 1 , and azelaic acid.5. A solder ball made from a lead-free solder alloy according to .6. A solder preform made from a lead-free solder alloy according to . This invention relates to a solder alloy which does not contain lead and particularly a lead-free solder alloy which is suitable for a solder paste used for substrates for surface mounting and for flux-cored solder used for repairs.Methods of soldering electronic parts include soldering ...

Solder paste and electronic part

A solder paste includes: solder particles containing Sn and Bi; an epoxy resin having two or more epoxy groups; an epoxy compound having one epoxy group; and a curing agent. And an electronic part includes: a wiring board provided with an electrode pad; a part mounted on the wiring board and provided with a plurality of electrodes; and a cured product of a solder paste configured to connect the plurality of electrodes and the electrode pad, wherein the solder paste includes: solder particles containing Sn and Bi; an epoxy resin having two or more epoxy groups; an epoxy compound having one epoxy group; and a curing agent.

Forming a solder joint between metal layers

Forming a solder joint between metal layers by preparing a structure having solder material placed between two metal layers and heating the structure to grow an intermetallic compound in a space between the two metal layers. Growing the intermetallic compound includes setting a first surface, in contact with the solder material between the two metal layers, to a first temperature, thereby enabling growth of the intermetallic compound; setting a second surface, in contact with the solder material between the two metal layers, to a second temperature, wherein the second temperature is higher than the first temperature; and maintaining a temperature gradient (temperature/unit thickness) between the two metal layers at a predetermined value or higher until the intermetallic compound substantially fills the space between the two metal layers.

COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS

A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin. 120.-. (canceled)21. A lead-free , silver-free solder alloy comprising:0.5 to 0.9 wt % copper;1.0 to 3.5 wt % bismuth;0.02 to 0.08 wt % cobalt;0.02 to 0.09 wt % antimony;0.001 to 0.01 wt % germanium and/or 0.01 to 0.2 wt % nickel; andbalance tin, together with any unavoidable impurities.22. The lead-free claim 21 , silver-free solder alloy of consisting of:0.5 to 0.9 wt % copper;1.0 to 3.5 wt % bismuth;0.02 to 0.08 wt % cobalt;0.02 to 0.09 wt % antimony;0.001 to 0.01 wt % germanium; andbalance tin, together with any unavoidable impurities.23. The lead-free claim 21 , silver-free solder alloy of consisting of:0.5 to 0.9 wt % copper;1.0 to 3.5 wt % bismuth;0.02 to 0.08 wt % cobalt;0.02 to 0.09 wt % antimony;0.01 to 0.2 wt % nickel; andbalance tin, together with any unavoidable impurities.24. The lead-free claim 21 , silver-free solder alloy of consisting of:0.5 to 0.9 wt % copper;1.0 to 3.5 wt % bismuth;0.02 to 0.08 wt % cobalt;0.02 to 0.09 wt % antimony;0.001 to 0.01 wt % germanium;0.01 to 0.2 wt % nickel; andbalance tin, together with any unavoidable impurities.25. The lead-free claim 21 , silver-free alloy of claim 21 , wherein:the copper is present at a concentration of about 0.7 wt %;the bismuth is present at a ...

Interconnections Formed with Conductive Traces Applied onto Substrates Having Low Softening Temperatures

A method of connecting a wire to a conductive trace formed on a substrate having a predetermined softening point and the functional layered composite formed therefrom. The method comprises applying a conductive ink onto the substrate; curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad; applying an activated rosin-type flux and solder to the connection pad and to one end of a metallic wire; placing the end of the wire in contact with the connection pad; applying a source of heat to the wire; melting the solder material to form an interconnection between the wire and the connection pad; removing the source of heat; and allowing the interconnection to cool before moving the wire. The melting point of the solder is either below the softening point of the substrate or above the softening point by about 20° C. or less. 1. A method of connecting a wire to a conductive trace , the method comprising:applying a conductive ink onto a substrate having a predetermined heat deflection temperature, softening point, or melting point;curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad provided at a predetermined location;applying a flux to the connection pad and to one end of a metallic wire;applying a solder material to the connection pad and to one end of the metallic wire; the solder material having a melting point that is either below the heat deflection temperature, softening point, or melting point of the substrate or above the softening point by about 20° C. or less;placing the end of the wire in a location where it makes contact with the connection pad;applying a source of heat to the wire proximate to the location at which the wire contacts the connection pad;melting the solder material to form an interconnection between the wire and the connection pad;removing the source of heat from the interconnection; andallowing the interconnection to cool before moving ...

SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT

A solder material capable of suppressing the occurrence of electromigration is provided. 1. A solder material comprising:a core of a metal and,a solder layer coating the core,wherein the solder layer has:a Cu content of 0.1 mass % or more and 3.0 mass % or less,a Bi content of 0.5 mass % or more and 5.0 mass % or less,a Ag content of 0 mass % or more and 4.5 mass % or less, anda Ni content of 0 mass % or more and 0.1 mass % or less,with Sn being the balance.2. The solder material according to claim 1 ,wherein the solder layer hasthe Bi content of more than 1.0 mass % and 5.0 mass % or less, andcontains no Ag.3. The solder material according to claim 1 , wherein the Ag content is more than 1.5 mass % and 4.5 mass % or less.4. The solder material according to claim 1 , wherein the core is a metal of Cu claim 1 , Ni claim 1 , Ag claim 1 , Au claim 1 , Al claim 1 , Mo claim 1 , Mg claim 1 , Zn claim 1 , or Co claim 1 , or an alloy of any combination of the metal.5. The solder material according to claim 1 , wherein the core is a spherical core ball.6. The solder material according to claim 1 , wherein the core is a columnar core column.7. The solder material according to claim 1 , wherein the core coated with a layer consisting of one or more elements selected from Ni and Co is coated with the solder layer.8. A solder paste using the solder material according to .9. A formed solder using the solder material according to .10. A solder joint using the solder material according to .11. The solder material according to claim 1 , wherein the core is a spherical core ball and wherein the core coated with a layer consisting of one or more elements selected from Ni and Co is coated with the solder layer.12. The solder material according to claim 1 , wherein the core is a columnar core column and wherein the core coated with a layer consisting of one or more elements selected from Ni and Co is coated with the solder layer.13. A solder joint using the solder material according to ...

BALL GRID ARRAY (BGA) APPARATUS AND METHODS

Embodiments herein may relate to an apparatus with a ball grid array (BGA) package that includes a plurality of solder balls of an off-eutectic material. In embodiments, the respective solder balls of the plurality of solder balls may form solder joints between a substrate of the BGA and a second substrate. In some embodiments the joints may be less than approximately micrometers from one another. Other embodiments may be described and/or claimed. 1. An apparatus comprising:a first substrate; anda ball grid array (BGA) package that includes a second substrate soldered to the first substrate via a plurality of solder balls comprising an off-eutectic material such that respective solder balls of the plurality of solder balls form respective joints between the first substrate and the second substrate, wherein a first joint of the respective joints is less than 0.6 micrometers from a second joint of the respective joints.2. The apparatus of claim 1 , wherein the off-eutectic material includes tin (Sn) and bismuth (Bi).3. The apparatus of claim 1 , wherein the first joint is an interior joint and a third joint of the respective joints is an edge joint claim 1 , and the first joint and third joint have an approximately equal height as measured from the first substrate to the second substrate.4. The apparatus of claim 3 , wherein the height of the first joint is greater than or equal to a height of one of the plurality of solder balls prior to a soldering process.5. The apparatus of claim 1 , wherein the off-eutectic material has a solidus temperature and a liquidus temperature that is higher than the solidus temperature.6. The apparatus of claim 5 , wherein the solidus temperature is a temperature at which the off-eutectic material transitions from a liquid to a solid while cooling.7. The apparatus of claim 6 , wherein the solidus temperature is between approximately 135 degrees Celsius and approximately 145 degrees Celsius.8. The apparatus of claim 5 , wherein the ...

LEAD-FREE HIGH RELIABILITY SOLDER ALLOYS

A lead-free, tin-based solder alloy contains about 0.6 to about 0.8 wt % copper, about 2.8 to about 3.2 wt % silver, about 2.8 to about 3.2 wt % bismuth, about 0.5 to about 0.7 wt % antimony, about 0.04 to about 0.07 wt % nickel, and about 0.007 to about 0.015 wt % titanium, exhibits low melting temperature, narrow solidification range and undercooling, high hardness and ultimate tensile strength at room temperature and high temperature, good formability, superior reliability performance such as creep resistance at high temperature, improved thermal cycle fatigue resistance on leadless (BGA and QFN) surface mount devices, stable microstructure at high temperature, very good solderability performance, low voiding in bottom terminated components, and mitigated tin whisker growth as compared with other lead-free solder alloys 1. A lead-free , Sn-based solder alloy , comprising:about 0.6 to about 0.8 wt % Cu;about 2.8 to about 3.2 wt % Ag;about 2.8 to about 3.2 wt % Bi;about 0.5 to about 0.7 wt % Sb;about 0.04 to about 0.07 wt % Ni; andabout 0.007 to about 0.015 wt % Ti.2. The solder alloy of claim 1 , wherein there is about 3 wt % Bi.3. The solder alloy of claim 1 , wherein there is about 3 wt % Ag.4. The solder alloy of claim 1 , wherein there is about 0.7 wt % Cu.5. The solder alloy of claim 1 , wherein there is about 0.6 wt % Sb.6. The solder alloy of claim 1 , wherein there is about 0.05 wt % Ni.7. The solder alloy of claim 1 , wherein there is about 0.01 wt % Ti.8. A lead-free solder alloy claim 1 , consisting essentially ofabout 0.6 to about 0.8 wt % Cu;about 2.8 to about 3.2 wt % Ag;about 2.8 to about 3.2 wt % Bi;about 0.5 to about 0.7 wt % Sb;about 0.04 to about 0.07 wt % Ni;about 0.007 to about 0.015 wt % Ti; andbalance Sn.7. The solder alloy of claim 8 , wherein there is about 3 wt % Bi.8. The solder alloy of claim 8 , wherein there is about 3 wt % Ag.9. The solder alloy of claim 8 , wherein there is about 0.7 wt % Cu.10. The solder alloy of claim 8 , wherein ...

BONDING MEMBER

A bonding member that includes a plating film containing a Cu—Ni alloy as its main constituent. In this plating film, the Cu mass ratio Cu/(Cu+Ni) is increased and decreased between 0.7 and 0.97 in the film thickness direction. In addition, the amplitude between the increase and decrease in the Cu mass ratio is larger than 0.1. Therefore, when the plating film containing the Cu—Ni alloy as its main constituent and Sn-based solder material or the like are joined by soldering, an intermetallic compound layer with a high melting point is formed. In addition, the plating film has a layer with a slow reaction rate, and thus can slow the reaction rate of alloying reaction between the Cu—Ni alloy and a Sn-based metal. 1. A bonding member comprising:a plating film containing a Cu—Ni alloy as a main constituent,wherein a Cu mass ratio Cu/(Cu+Ni) of the plating film is increased and decreased between 0.7 and 0.97 in a film thickness direction of the plating film, and an amplitude between the increase and decrease in the Cu mass ratio is larger than 0.1.2. The bonding member according to claim 1 , further comprising a Sn-based solder layer adjacent the plating film.3. The bonding member according to claim 2 , further comprising an intermetallic compound layer between the plating film and the Sn-based solder layer.4. The bonding member according to claim 3 , wherein the intermetallic compound layer contains Cu claim 3 , Ni and Sn as main constituents thereof.5. The bonding member according to claim 3 , wherein the Cu mass ratio is within a range of 0.85 to 0.95.6. The bonding member according to claim 1 , wherein the Cu mass ratio is within a range of 0.85 to 0.95.7. A method of forming a bonding member claim 1 , the method comprising:forming a plating film containing a Cu—Ni alloy as a main constituent on a surface of a base such that a Cu mass ratio Cu/(Cu+Ni) of the plating film is increased and decreased between 0.7 and 0.97 in a film thickness direction of the plating film ...

SECONDARY BATTERY

A secondary battery includes a bare cell and a protective circuit module. The protective circuit module includes a protective circuit board, a first terminal, and a second terminal. The first and second terminals are electrically connected to positive and negative electrode tabs of the bare cell. The positive electrode tab and the negative electrode tab are respectively soldered to the first terminal and the second terminal, solder layers are on respective surfaces of the positive electrode tab soldered to the first terminal, and a solder layer is on one or more of the second terminal or the negative electrode tab. 1. A secondary battery , comprising:a bare cell including an electrode assembly, electrode tabs, and a case accommodating the electrode assembly, the electrode assembly including a separator between a positive electrode plate and a negative electrode plate, the electrode tabs including positive and negative electrode tabs respectively extending from the positive and negative electrode plates; anda protective circuit module outside the case and including a protective circuit board, a first terminal, and a second terminal, the first and second terminals on the protective circuit board and electrically connected to the positive and negative electrode tabs, respectively, wherein:the positive electrode tab and the negative electrode tab are respectively soldered to the first terminal and the second terminal,solder layers are on respective surfaces of the positive electrode tab soldered to the first terminal, anda solder layer is on one or more of the second terminal or the negative electrode tab.2. The secondary battery as claimed in claim 1 , wherein:the positive electrode tab includes a first surface facing the first terminal and a second surface opposite the first surface, anda first solder layer is on the first surface and a second solder layer is on the second surface.3. The secondary battery as claimed in claim 2 , wherein:the positive electrode tab ...

Lead-Free Solder Alloy

Disclosed is a Sn—Bi—Cu—Ni series lead-free solder alloy which has a low melting point, good ductility and high tensile strength, suppresses strain in the substrate by suppressing generation of P-rich layer on a joining interface to have high shear strength and is superior in joining reliability. In order to suppress diffusion of Cu and Ni in an electrode and to maintain elongation and wettability of the solder alloy, a solder alloy has an alloy composition containing 31 to 59 mass % of Bi, 0.3 to 1.0 mass % of Cu, 0.01 to 0.06 mass % of Ni and balance of Sn. 1. A lead-free solder alloy having an alloy composition which contains 31 to 59 mass % of Bi , 0.3 to 1.0 mass % of Cu , 0.01 to 0.06 mass % of Ni and balance of Sn wherein the solder alloy has a melting point of 185 degrees C. or less , a tensile strength of 70 MPa or more and elongation of 65% or more.2. The lead-free solder alloy according to claim 1 , further containing at least one element selected from a group consisting of P and Ge in a total of 0.003 to 0.05 mass %.3. A solder joint formed on a Cu electrode having a Ni plating layer by using the lead-free solder alloy according to .4. The solder joint according to wherein the Ni plating layer includes an electroless plating layer containing P.5. A substrate having a thickness of 5 mm or less and plural Cu electrodes each having Ni plating layer wherein each of the Cu electrodes includes a solder joint formed by using the lead-free solder alloy according to .6. The substrate according to wherein the Ni plating layer contains P.7. A solder joint formed on a Cu electrode having a Ni plating layer by using the lead-free solder alloy according to .8. The solder joint according to wherein the Ni plating layer includes an electroless plating layer containing P.9. A substrate having a thickness of 5 mm or less and plural Cu electrodes each having Ni plating layer wherein each of the Cu electrodes includes a solder joint formed by using the lead-free solder ...

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, AND SOLDER JOINT

Provided are a solder alloy which has excellent temperature cycle characteristics and in which yellowish discoloration is suppressed, excellent wettability is maintained, and an increase in viscosity of a solder paste over time can be suppressed, and a solder paste, a solder ball, and a solder joint in which the solder alloy is used. 1. A solder alloy consisting of , by mass % , 1.0% to 5.0% of Ag , 0.5% to 3.0% of Cu , 0.5% to 7.0% of Sb , 0.0040% to 0.025% of As , and a balance of Sn , the solder alloy comprising:an As-concentrated layer,wherein the presence of the As-concentrated layer is confirmed by determination criteria below,{'sub': '2', '#text': 'wherein the As-concentrated layer is a region from an outermost surface of the solder alloy to a depth of 2×D1 (nm) in terms of SiO, and'}{'sub': '2', '#text': 'wherein a thickness of the As-concentrated layer in terms of SiOis 0.5 to 8.0 nm,'}the determination criteria being:in a sample having a size of 5.0 mm×5.0 mm, an arbitrary area of 700 μm×300 μm is selected, and XPS analysis is performed in combination with ion sputtering, one area is selected for each sample, and each of three samples is analyzed once, for a total of three analyses; andin a case where S1>S2 in all of the three analyses, it is determined that an As-concentrated layer has been formed;{'sub': '2', '#text': 'wherein S1 is an integrated value of a detection intensity of As in a region from a depth of 0 to 2×D1 (nm) in terms of SiOin a chart of XPS analysis;'}{'sub': '2', '#text': 'S2 is an integrated value of a detection intensity of As in a region from a depth of 2×D1 to 4×D1 (nm) in terms of SiOin a chart of XPS analysis;'}{'sub': ['2', '2'], '#text': 'D1 is an initial depth (nm) in terms of SiOat which a detection intensity of O atoms is ½ a maximum detection intensity (intensity at Do·max) in portion deeper than the depth (Do·max (nm)) in terms of SiOat which a detection intensity of O atoms is a maximum in a chart of XPS analysis.'}2. A ...

SOLDER ALLOY, SOLDER POWER, AND SOLDER JOINT

A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2). 1. A solder alloy including an alloy constitution comprising: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn , wherein both a formula (1) and a formula (2) are satisfied:{'br': None, '300≤3As+Sb+Bi+Pb\u2003\u2003(1)'}{'br': None, '0.1≤{(3As+Sb)/(Bi+Pb)}×100≤200\u2003\u2003(2)'}in the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.2. A solder alloy including an alloy constitution comprising: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of more than 0 ppm by mass and no more than 10000 ppm by mass of Bi and more than 0 ppm by mass and no more than 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn , wherein both a formula (1) and a formula (2) are satisfied:{'br': None, '300≤3As+Sb+Bi+Pb\u2003\u2003(1)'}{'br': None, '0.1≤{(3As+Sb)/(Bi+Pb)}×100≤200\u2003\u2003(2)'}in the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.3. A solder alloy ...

SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, AND SUBSTRATE

An object of the present invention is to provide an Sn—Bi—Cu—Ni solder alloy or the like which has a low melting point, excellent ductility, and high tensile strength, and in which if soldering is performed on a Cu electrode subjected to electroless Ni plating treatment, a solder joint formed through this soldering exhibits high shear strength. In addition, another object of the present invention is to provide an Sn—Bi—Cu—Ni solder alloy in which a solder joint formed through soldering exhibits high shear strength even for a Cu electrode which has not been subjected to plating treatment. Furthermore, still another object of the present invention is to provide, in addition to the above-described objects, a solder alloy or the like of which yellowish discoloration can be suppressed and in which change in viscosity of a solder paste over time can be suppressed. The solder alloy has an alloy composition consisting of, by mass %, 31% to 59% of Bi, 0.3% to 1.0% of Cu, 0.01% to 0.06% of Ni, 0.0040% to 0.025% of As, and a balance of Sn. 1. A solder alloy having an alloy composition consisting of , by mass % , 31% to 59% of Bi , 0.3% to 1.0% of Cu , 0.01% to 0.06% of Ni , 0.0040% to 0.025% of As , and a balance of Sn , the solder alloy comprising:an As-concentrated layer,wherein the presence of the As-concentrated layer is confirmed by determination criteria as below,{'sub': '2', 'wherein the As-concentrated layer is a region from an outermost surface of the solder alloy to a depth of 2×D1 (nm) in terms of SiO, and'}{'sub': '2', 'claim-text': [ selecting an arbitrary area of 700 μm×300 μm in three samples, each sample having a size 5.0 mm×5.0 mm;', 'performing an XPS analysis in combination with ion sputtering for each of three samples for a total of three analyses,, 'wherein the Determination Criteria comprises, [{'sub': '2', 'S1 is Integrated value of a detection intensity of As in a region from a depth of 0 to 2×D1 (nm) in terms of SiOin a chart of XPS analysis; and'}, {' ...

Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint

Provided is a solder alloy, a solder ball, a chip solder, a solder paste and a solder joint in which discoloration is suppressed and a growth of an oxide film is suppressed under a high temperature and high humidity environment. The solder alloy contains 0.005% by mass or more and 0.1% by mass or less of Mn, 0.001% by mass or more and 0.1% by mass or less of Ge and more than 0% by mass and 4% by mass or less of Ag, and a principal ingredient of remainder is Sn. 1. A solder alloy , comprising:0.005% by mass or more and 0.1% by mass or less of Mn;0.001% by mass or more and 0.1% by mass or less of Ge;more than 0% by mass and 4% by mass or less of Ag; andremainder of Sn.2. The solder alloy according to claim 1 , wherein the amount of Mn is equal to or less than the amount of Ge.3. The solder alloy according to claim 1 , wherein the solder alloy further comprises a total amount of 0.002% by mass or more and 0.1% by mass or less of at least one element selected from the group consisting of P and Ga.4. The solder alloy according to claim 1 , wherein the solder alloy further comprises a total amount of 0.005% by mass or more and 0.3% by mass or less of at least one element selected from the group consisting of Ni claim 1 , Co and Fe.5. The solder ally according to claim 1 , wherein the solder alloy further comprises a total amount of 0.1% by mass or more and 10% by mass or less of at least one element selected from a group consisting of Bi claim 1 , In and Sb.6. A solder ball claim 1 , wherein the solder ball comprises the solder alloy according to .7. A chip solder claim 1 , wherein the chip solder comprises the solder alloy according to .8. A solder paste claim 1 , wherein the solder paste comprises the solder alloy according to .9. A solder joint claim 1 , wherein the solder joint comprises the solder alloy according to .10. A solder joint claim 6 , wherein the solder joint comprises the solder ball according to .11. A solder joint claim 7 , wherein the solder joint ...

Method for producing a monofilament for an Nb3Sn superconductor wire

A monofilament () for the production of a superconducting wire () has a powder core () that contains at least Sn and Cu, an inner tube (), made of Nb or an alloy containing Nb, that encloses the powder core (), and an outer tube () in which the inner tube () is arranged. The outer side of the inner tube () is in contact with the inner side of the outer tube () and the outer tube () is produced from Nb or from an alloy containing Nb. The outer tube is disposed in a cladding tube. The superconducting current carrying capacity of the superconducting wire is thereby improved. 2. The method of claim 1 , wherein the cladding tube has a hexagonal outer cross-section and a round inner cross-section.3. The method of claim 1 , wherein{'sub': outertube', 'innertube', 'outertube', 'innertube, 'sup': outside', 'outside', 'outside', 'outside, '1.2≦D/D≦2.0 with D:outer diameter of the outer tube and D:outer diameter of the inner tube.'}4. The method of claim 1 , wherein the powder core has a content of 2 weight % to 12 weight % of Cu claim 1 , 3 to 9 weight % of Cu or the powder core contains elementary Cu powder.5. The method of claim 1 , wherein the powder core is compacted in the inner tube or has a density of at least 40% or of at least 50% of a theoretical density.6. The method of claim 1 , wherein the powder core contains NbSnand/or NbSnand/or elementary Sn.7. The method of claim 1 , wherein the inner tube and/or the outer tube are produced from an alloy containing Nb and containing Ta and/or Ti claim 1 , have a summed content of at least 0.5 weight % of Ta and/or Ti or have with a summed content of maximally 10 weight % of Ta and/or Ti.8. The method of claim 1 , wherein the inner tube and the outer tube are produced from different materials.9. The method of claim 1 , wherein the cladding tube is made of Cu.10. The method of claim 1 , wherein the cladding tube already has a hexagonal outer cross-section prior to step c).11. A method for producing a precursor of a ...

SOLDER PREFORMS AND SOLDER ALLOY ASSEMBLY METHODS

A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed. 1. A method of assembly , comprising:applying solder paste to an electronic substrate to form a solder paste deposit;placing a low temperature preform in the solder paste deposit;processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint; andprocessing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste.2. The method of claim 1 , wherein the low temperature preform is a composition consisting of tin and bismuth.3. The method of claim 2 , wherein the composition consists of 42% by weight tin and 58% by weight bismuth.4. The method of claim 2 , wherein the composition further consists of silver.5. The method of claim 1 , wherein the solder joint consists of tin claim 1 , silver claim 1 , copper claim 1 , and bismuth.6. The method of claim 5 , wherein the solder joint consists of 49-53% by weight tin claim 5 , 0-1.0% by weight silver claim 5 , 0-0.1% by weight copper claim 5 , and 46-50% by weight bismuth.7. The method of claim 1 , wherein the reflow temperature of the solder joint is between 138-170° C.8. The method of claim 1 , further comprising a second solder process at a temperature between the lower reflow temperature and the reflow temperature.9. The method of claim 1 , wherein the composition consists of 55% by weight tin and ...