МНОГОСЛОЙНЫЙ НАНОКОМПОЗИТ ДЛЯ ДВУХОБКЛАДОЧНЫХ КОНДЕНСАТОРОВ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ

Заявленное изобретение относится к области электротехники, а именно к многослойному нанокомпозиту для двухобкладочных конденсаторов. Нанокомпозит содержит подложку из электропроводящего материала с расположенным на ее лицевой поверхности и являющимся нижней обкладкой конденсатора наноструктурированным покрытием, которое выполнено в виде слоя из углеродной ткани, нити основы и утка которой образованы активированными углеродными волокнами, скрученными в продольном направлении. Нити основы и утка указанной ткани механически и электрически посредством электропроводящего клея соединены с электропроводящей подложкой в местах примыкания к электропроводящей подложке их выпукло изогнутых в сторону электропроводящей подложки участков, при этом в каждом клеевом соединении нитей основы и утка с электропроводящей подложкой максимальная глубина проникновения электропроводящего клея в структуру упомянутых нитей составляет от 0,3 до 0,5 поперечного размера нитей. На поверхности волокон нитей основы и утка ...

Конденсатор для измерения и регулирования влажности на машинах с непрерывно двигающимся листовым материалом

Микросхема

Автомат для сухой сборки пакетов фольговых слюдяных конденсаторов

Способ изготовления толстопленочных конденсаторов

Тонкопленочный конденсатор

Устройство для автоматической сортировки пластин диэлектрика по отношению диэлектрической постоянной к толщине

Способ подгонки величины емкости керамических конденсаторов под номинал

Способ изготовления электрических конденсаторов

Электрический конденсатор

CAPACITOR ELEMENT

KONDENSATOR UND VERFAHREN ZU SEINER HERSTELLUNG

UEberspannungssicherung in Form eines Kondensators

VERWENDUNG VON KUNSTSTOFFFOLIEN ALS DIELEKTRIKUM IN KONDENSATOREN

Kondensatoranordnung mit geringer Eigeninduktivitaet zur Elektroden-entkopplung von Elektronenroehren in Hochfrequenz-Stufen

Elektrischer kondensator mit festem, vorgeformtem Dielektrikum

Capacitor i.e. nano structure capacitor, for storing energy in e.g. product, has inner structure whose inner surface is multiple times larger than outer boundary surface, where inner structure is partially made of silicon and/or aluminum

The capacitor has a base comprising an outer boundary surface and an inner structure (2). An electrically conductive capacitor portion is electrically insulated with respect to another electrically conductive capacitor portion by the base. The inner surface is multiple times larger than the outer boundary surface, where the inner surface is formed in the inner structure. The inner structure is partially formed as porous and partially made of silicon and/or aluminum, where the inner surface is greater than or equal to 5 meter square per centimeter cube. An independent claim is also included for a method for manufacturing a capacitor.

Improvements in or relating to disc-shaped ceramic capacitors

... 716,094. Electric capacitors. PHILIPS ELECTRICAL INDUSTRIES, Ltd. Nov. 14, 1952, [Nov: 17, 1951.] No. 28771 /52. Class 37. A lead-through discshaped ceramic capacitor with a conducting coating on each side, comprises a fastening member 4 secured to one coating, the disc 1 and the member 4 both being provided with a central aperture. A soldering tag 3 may be secured to the other coating, and the diameters of the three apertures increase successively to facilitate introduction of the lead. The member 4 may be a threaded nut or bolt.

electrolytic surface mounting capacitor manufacturing method using epoxy resin

A surface mounting capacitor with a external anode and cathode terminals on the base, where a cathode plate is temporarily adhered. A prepreg coating impregnated with epoxy resin is applied to the top surface and a reinforcement plate mounted atop. Heat and pressure are applied to both the reinforcement plate and the cathode plate, thus causing the epoxy resin to extrude from the prepreg and encapsulate the sides of the capacitor, thus sealing them off, whilst also curing the cathode adhesive. The invention claims to achieve a capacitor smaller than those using an injection moulded encapsulation method.

Electrical components and methods of manufacturing the same

Laminated solid electrolytic capacitor and laminated transmission-line device

THIN-FILM CAPACITORS

PROCEDURE FOR THE DOPING OF SINTERED TANTALUM AND NIOBIUM PELLETS FOR CONDENSERS

ELECTRONIC POLYARYLENSULFID ELEMENT.

FIBRILKOMPOSITELEKTRODE FOR ELECTRO-CHEMICAL CONDENSERS

Energy pathway arrangement

METHOD OF MANUFACTURING SOLID-STATE CAPACITORS

CERMET FIXED RESISTOR WITH SOLDERED LEADS

RESONANCE SUPPRESSION IN INTERDIGITAL CAPACITORS USEFUL AS DC BIAS BREAKS IN DIODE OSCILLATOR CIRCUITS

CAPACITIVE CIRCUITBOARD

Three-Terminal Capacitor and Assembly

Verfahren zur Herstellung dünner Häutchen, insbesondere für Isolierzwecke.

Verfahren zur Herstellung von Isolierkörpern, beispielsweise von Isolierschichten für Hochspannungskondensatoren.

Durchführung einer Leitung durch eine gegen Hochfrequenzwellen abschirmende Abschirmwand.

Zwischen zwei Leiterstabenden angeordnetes kapazitives Schaltelement der Ultrakurzwellentechnik.

Elektrischer Kondensator an einem Hochfrequenzgerät.

Dünnschichtkondensator und Verfahren zu seiner Herstellung

Flaches, elektrisches Bauelement und Verfahren zur Herstellung desselben

Hochspannungskondensator

Condensateur, notamment pour tensions et fréquences élevées

PROCEDURE FOR THE PRODUCTION OF ELECTRICAL RESONANT CIRCUITS, IN PARTICULAR RESONANCE LABELS.

СПОСОБ ИЗГОТОВЛЕНИЯ ИНТЕРКАЛЯЦИОННОГО ФИЛЬТРОВОГО КОНДЕНСАТОРА

Изобретение относится к средствам электроники для конденсаторостроения. Способ изготовления интеркаляционного фильтрового конденсатора включает интеркалирование слоистого полупроводника селенида галлия (GaSe) сегнетоэлектрическим материалом. Интеркалирование слоистого полупроводника GaSe проводят путем внедрения в двумерные (2D) межслойные Ван-дер-Ваальсовые щели трехмерных (3D) наноразмерных включений из расплава сегнетоэлектрического материала KNO3 при температуре от 329 до 339 °C в течение 5-10 мин. Изобретение обеспечивает увеличение удельной емкости и уменьшение геометрических размеров конденсаторов.

СПОСОБ ИЗГОТОВЛЕНИЯ МОНОКРИСТАЛЛИЧЕСКИХ ПЛЕНОК КАДМИЯ ГЕКСАГОНАЛЬНОЙ СТРУКТУРЫ НА ПОДКЛАДКАХ СЛОИСТЫХ КРИСТАЛЛОВ GaSe

Способ изготовления монокристаллических пленок селенида кадмия гексагональной структуры на подложках слоистых кристаллов GaSe включает их отжиг в парах кадмия. В качестве подложки используются слоистые кристаллы моноселенида галлия.

SYSTEMS AND METHODS FOR PRESERVATION OF ELECTRIC ENERGY

Solid capacitor and its producing method

Capacitor film

Message fragmenting in time diversity radio system

A time diversity communication system comprises a messaging terminal, a queue for queuing incoming message, an encoder for encoding a first fragment of a message and the remaining fragments of a massage, a transmitter repeatedly transmitting first fragment in a plurality of time slots to at least one selective call receiver operating in a first mode, the number of time slots equaling desired number of repeat transmission, and wherein the first fragment contains instructions for decoding the remaining fragment in second mode by selective call selective call receiver, the transmitter also repeatedly transmits the remaining portions of the massage in subsequent time slots and at least on selective call receiver that decodes the first fragment and remaining fragments of the message in accordane with instructions in the deocoded first fragment.

Improvements with the electric condensers and mountings for those

Electric condenser

PASSIVE MICROCIRCUIT

CONDENSER PAVES FOR ASSEMBLY ON THE SURFACE

CONDENSER FOR LINE IN RIBBON IN A CIRCUIT OF MICROWAVES

CONDENSER FOR LINE IN RIBBON IN A CIRCUIT OF MICROWAVES

Capacitor with optimised voltage-holding

ELECTRIC CONDENSER HAS BODIES Of FOOD WHILE RUNNING CONNECT TO the REINFORCEMENTS

Electronic component and method for manufacturing the same

BLOCKING CAPACITOR FOR A THIN?FILM RF TRANSMISSION LINE

PROCESS FOR THE MANUFACTURE OF CONDENSERS IN SOLID SUBSTANCES

PROCEEDED FOR the MANUFACTURE Of a CONDENSER LAYER THIN OUT OF TANTALUM HAS

Film diélectrique métallisé et condensateur électrique obtenu avec celui-ci.

La présente invention concerne un film diélectrique métallisé du type composé d'un substrat en matériau diélectrique muni d'un revêtement (20) en matériau électriquement conducteur, dans lequel le revêtement (20) est divisé en une pluralité de plages, caractérisé par le fait que lesdites plages délimitées dans le revêtement électriquement conducteur (20) sont conformées en un réseau en mosaïque (24) et qu'il est prévu au moins un pont électriquement conducteur (26) entre chaque paire de plages adjacentes (24).

CERAMIC MULTILAYER PRINTED CIRCUIT BOARDS WITH EMBEDDED PASSIVE COMPONENTS

CYLINDRICAL CAPACITOR HAVING STRUCTURE WITH LEAD INSERTED INTO HOLLOW CORE

Disclosed is a cylindrical capacitor having a structure with a lead inserted into a hollow core, the cylindrical capacitor including: a cylindrical metal case (10) having a lower portion and a side wall which are closed and an upper portion which is opened; a capacitor element (20) accommodated in the metal case (10), wound by a dielectric film, and having a hollow core (15) longitudinally formed up and down; a circular deck (30) for fixing the upper portion of the metal case (10); first and second terminals (41, 42) mounted to be exposed to the deck (30), and electrically connected to the capacitor element (20); a lower insulating base (70) formed of a plastic material for insulating the bottom of the metal case (10) from a lower portion of the capacitor element (20); an insulating interposing part (80) formed of a flexible plastic material, and located inside the metal case (10) to insulate the element (20) from the inner wall of the metal case (10); an insulating filling resin (not shown ...

PASSIVE ELECTRICAL ARTICLE

APARELHO E PROCESSO PARA A FORMACAO DE CAPACITORES EM ATA VELOCIDADE,CAPACITOR PRODUZIDO PELOS DITOS APARELHO E PROCESSO E PRODUTO OBTIDO PELO DITO PROCESSO

FORFARANDE FOR FRAMSTELLNING AV SKIKT AV TANTAL FOR TUNNSKIKTSKONDENSATORER RESP.- MOTSTAND

KAPACITIV KONSTRUKTION

MITIGATING PCB VOLTAGE STRESSES IN HIGH-VOLTAGE DEVICES

Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure

Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

High voltage capacitors

A capacitor includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers and first and second external terminals attached to the ceramic capacitor body. The internal active electrodes within the ceramic capacitor body are configured in an alternating manner. Internal electrode shields within the ceramic capacitor body are used to assist in providing resistance to arc-over. The shields can include a top internal electrode shield and an opposite bottom internal electrode shield wherein the top internal electrode shield and the opposite bottom internal electrode shield are on opposite sides of the plurality of internal active electrodes and each internal electrode shield extends inwardly to or beyond a corresponding external terminal to thereby provide shielding. Side shields are used. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size.

Thin film capacitor and method of manufacturing the same

A semiconductor device having the thin film capacitor includes a first electrode formed on a substrate, a capacitor insulating film containing a laminated film, which is constructed by laminating an amorphous dielectric film and a polycrystalline dielectric film via a wave-like interface, on the first electrode, and a second electrode formed on the capacitor insulating film.

CAPACITOR HAVING A DIELECTRIC CERAMIC LAYER

The invention relates to a capacitor with two or more opposing pairs of electrode layers ( 1 ) with an intermediate dielectric layer ( 2 ), in which the dielectric layers ( 2 ) comprise a ceramic material that contains at least two different components existing in separate phases, in which each component exhibits a perovskite structure that contains silver in the A-positions and niobium and tantalum in the B-positions, and in which the composition of a component A and the composition of a component B are each chosen in such a way that Tkepsilon_A and Tkepsilon_B exhibit different signs within a temperature range. The suitable mixing ratio of the components can, for example, be realized by stacking green compacts of component A on green compacts of component B in a suitable quantity.

CAPACITORS USING PREFORMED DIELECTRIC

Devices for storing energy at a high density are described. The devices include an electrode preformed to present a high exposed area onto which a dielectric is formed. The dielectric material has a high dielectric constant (high relative permittivity) and a high breakdown voltage, allowing a high voltage difference between paired electrodes to effect a high stored energy density.

Multilayer electronic part, multilayer antenna duplexer, and communication apparatus

A laminated filter includes: a first dielectric layer 2101a having a first shield electrode on one principal plane; a second dielectric layer 2101b having resonator electrodes on one principal plane; a third dielectric layer 2101c having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer 2101d having a second shield electrode on one principal plane; a fifth dielectric layer 2101d whose at least one principal plane is exposed outside; and a grounding electrode 2108 provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole 2109 provided in the above-described first dielectric layer.

Process for manufacture of ceramic capacitors using ink jet printing

A process for forming a multilayer ceramic device. The device includes forming a ceramic precursor layer followed by ink jet printing in alternating order an electrode precursor in a predetermined pattern on the ceramic precursor layer to form an electrode and a ceramic ink on the electrode. The ceramic precursor is then sintered.

Low tunneling current MIM structure and method of manufacturing same

Disclosed herein are new MIM structures having increased capacitance with little or no tunneling current, and related methods of manufacturing the same. In one embodiment, the new MIM structure comprises a first electrode comprising a magnetic metal and having a magnetic moment aligned in a first direction, and a second electrode comprising a magnetic metal and having a magnetic moment aligned in a second direction antiparallel to the first direction. In addition, such an MIM structure comprises a dielectric layer formed between the first and second electrodes and contacting the first and second magnetic metals.

MULTILAYER CHIP CAPACITOR, CIRCUIT BOARD APPARATUS HAVING THE CAPACITOR, AND CIRCUIT BOARD

Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pair of first and second internal electrodes disposed alternately in an inner part of the capacitor body, the second capacitor unit includes a plurality of third and fourth internal electrodes disposed alternately in an inner part of the capacitor body, and the first to fourth internal electrodes are coupled to the first to fourth external electrodes. The first capacitor unit has a lower equivalent series inductance (ESL) than the second capacitor unit, and the first capacitor unit has a higher equivalent series resistance (ESR) than the second capacitor unit.

Passive microcircuit

A passive microcircuit is made, according to the invention, on a metal substrate, a dielectric layer being coated on at least one of its sides, whereon all components of the passive microcircuit, current-carrying tracks, pads, capacitor electrodes and resistors, are arranged. All the components and a dielectric layer of the passive microcircuit are based on the material of the metal substrate. The proposed passive microcircuit ensures dense wiring, directed heat removal, high reliability and shock- and vibration-proof properties, formation of RC-structures with distributed elements.

BLOCKING CAPACITOR FOR A THIN-FILM RF TRANSMISSION LINE

Titanium oxide powder, methods of manufacturing the same and barium titanate powder, dielectric ceramic, and multilayer ceramic capacitor

A titanium oxide powder holding a barium compound on the surface of the particles thereof is used for manufacturing a highly crystalline fine barium titanate powder by solid-phase reaction. When the titanium oxide powder and a barium-containing powder material are mixed and calcined to prepare the barium titanate powder, the barium compound on the surfaces of the titanium oxide powder particles inhibits the sintering, or the growth, of the titanium oxide during the calcination. Consequently, the resulting barium titanate powder is highly crystalline and fine.

Firing setters and process for producing these setters

A firing setter, which is useful for a heat treatment or firing step upon production of ceramic-based electronic device components or production of metal-based components obtained by injection molding, is provided with plural trough-holes and has an alumina content of at least 70 wt. %. Each of the through-holes is linear with substantially the same inner diameter along a length thereof and has an inner diameter of from 0.3 to 1 mm. A process for producing the firing setter is also disclosed.

Nanofiber surface based capacitors

This invention provides novel capacitors comprising nanofiber enhanced surface area substrates and structures comprising such capacitors, as well as methods and uses for such capacitors.

Fixed by-pass condenser

Plated terminations

A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device. Selected of the conductive elements may be formed by a finite volume percentage of ceramic material ...

Multilayer ceramic electronic component

There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer having an average thickness of 0.6 mum or less; and first and second inner electrode layers within the ceramic body, disposed to face each other with the dielectric layer interposed therebetween, wherein the dielectric layer includes contact dielectric grains in contact with the first or second inner electrode layer and non-contact dielectric grains not in contact with the first or second inner electrode layer, and, when an average thickness of the dielectric layer is defined as td and an average diameter of the contact dielectric grains is defined as De, De/td@0.35 is satisfied. The multilayer ceramic electronic component has improved continuity of the inner electrode layer, large capacitance, extended accelerated lifespan and excellent reliability.

Dielectric ceramic composition and electronic device

The invention aims at providing a dielectric ceramic composition including BamTiO2+m where "m" satisfies 0.99<=m<=1.01 and BanZrO2+n where "n" satisfies 0.99<=n<=1.01, an oxide of Mg, an oxide of R where R is at least one selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, an oxide of at least one element selected from Mn, Cr, Co and Fe, and an oxide of at least one element selected from Si, Li, Al, Ge and B. 35 to 65 moles of BanZrO2+n, 4 to 12 moles of an oxide of Mg, 4 to 15 moles of an oxide of R, 0.5 to 3 moles of an oxide of Mn, Cr, Co and Fe, and 3 to 9 moles of an oxide of Si, Li, Al, Ge and B are included therein per 100 moles of the BamTiO2+m.

ELECTRONIC DEVICE INCLUDING A CAPACITOR

An electronic device includes a capacitor and a passivation layer covering the capacitor. The capacitor includes a first electrode, a dielectric layer disposed over the first electrode and a second electrode disposed over the dielectric layer. An area of the first electrode is greater than an area of the dielectric layer, and the area of the dielectric layer is greater than an area of the second electrode so that a side of the capacitor has a multi-step structure.

Multilayer ceramic capacitor and circuit board for mounting the same

A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and forming capacitance. An upper cover layer is formed on an upper portion of the active layer; a lower cover layer is formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer. First and second external electrodes cover both end surfaces of the ceramic body. Specific sizing of ceramic body and electrodes is defined.

Capacitor

A capacitor includes: a substrate including a plurality of trenches and a capacitance formation portion, and a margin portion disposed around the capacitance formation portion; dielectric layers disposed on one surface of the substrate and filling the trenches; a plurality of first electrode layers each disposed on one surface of the dielectric layer and each including a first lead portion led out from the capacitance formation portion to the margin portion; and a plurality of second electrode layers each disposed on one surface of the dielectric layer to face the first electrode layer with each of the dielectric layers interposed therebetween, and each including a second lead portion led out from the capacitance formation portion to the margin portion, wherein the first and second lead portions of the plurality of first and second electrode layers are stacked in a stepped shape inclined in a direction from the margin portion to the capacitance formation portion.

Multilayer capacitor and mold capacitor

A multilayer capacitor including a base body, which is a dielectric substance; and a plurality of electrode layers, which is laminated in the base body and has a plurality of divided electrodes, in which there are at least three or more kinds of electrode layers having different number of electrodes, and the electrode layer having the most electrodes is interposed between the other electrode layers. The multilayer capacitor achieves high withstand voltage and high reliability with no damage to the size reduction and high capacitance of the capacitor and a mold capacitor having the multilayer capacitor built-in.

CAPACITOR UNIT

In a capacitor unit including a pair or a plurality of pairs of capacitors having a dielectric, a first electrode formed on the dielectric, and a second electrode formed on the dielectric, wherein voltages in reverse directions are applied between the first electrodes and the second electrodes of respective two capacitors forming a pair.

ELECTRONIC COMPONENT

An interposer includes a plurality of first connection electrodes each of which is arranged on either of first- and second-side-surface sides of a first principal surface of a substrate; a plurality of second connection electrodes each of which is arranged on either of first- and second-side-surface sides of a second principal surface of the substrate; and a plurality of third connection electrodes each of which is arranged on either of first and second side surfaces. Each of the first connection electrodes has a first portion located away from an edge of the first principal surface, and a second portion extending from the first portion to the edge and connected to the third connection electrode. Each of the second portion of each first connection electrode and the plurality of third connection electrodes has a width smaller than a width of the first portion of each first connection electrode.

DIELECTRIC CERAMIC AND CAPACITOR

Disclosed is a dielectric ceramic comprising crystal grains mainly composed of barium titanate. This dielectric ceramic contains 0.01-0.06 mole of magnesium in terms of MgO, 0.0007-0.03 mole of yttrium in terms of Y2O3 and 0.0002-0.03 mole of manganese in terms of MnO per 1 mole of barium constituting the barium titanate, while containing 4.2-33.3 parts by mass of niobium in terms of Nb2O5 per 100 parts by mass of the barium titanate. The crystal grains have an average particle size of 0.05-0.25 m. Also disclosed is a capacitor composed of a laminate having a conductive layer and a dielectric layer made of such a dielectric ceramic.

Dielectric ceramic composition and ceramic electronic component

A dielectric ceramic composition includes, as a main component, a compound having perovskite type crystal structure shown by a general formula ABO3, as subcomponents, in terms of respective element with respect to 100 moles of the compound, and 0.6 to 2.0 moles of an oxide of Mg, 0.010 to 0.6 mole of oxide of Mn and/or Cr, 0.010 to 0.2 mole of an oxide of at least one selected from V, Mo and W, 0.10 to 1.0 mole of an oxide of R1 (R1 is at least one selected from Y, Yb, Er and Ho), 0.10 to 1.0 mole of an oxide of R2 (R2 is at least one selected from Dy, Gd and Tb) and 0.2 to 1.5 moles of a component consisting of an oxide of Ba and/or oxide of Ca and an oxide of Si. According to the present invention, even when a dielectric layer is made thinner, a dielectric ceramic composition having good characteristics can be provided.