Heat softening thermally conductive compositions and methods for their preparation
Номер патента: EP1559114A1
Опубликовано: 03-08-2005
Автор(ы): Dorab Edul Bhagwagar
Принадлежит: Dow Corning Corp
Опубликовано: 03-08-2005
Автор(ы): Dorab Edul Bhagwagar
Принадлежит: Dow Corning Corp
Реферат: A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.
Heat softening thermally conductive compositions and methods for their preparation
Номер патента: MY133214A. Автор: Edul Bhagwagar Dorab. Владелец: Dow Corning. Дата публикации: 2007-10-31.