Release film, compression molding method, and compression molding apparatus
Номер патента: EP2841245A1
Опубликовано: 04-03-2015
Автор(ы): Shin Yoshida, Syuji Endo, Yoshitsugu Morita
Принадлежит: Dow Corning Toray Co Ltd
Опубликовано: 04-03-2015
Автор(ы): Shin Yoshida, Syuji Endo, Yoshitsugu Morita
Принадлежит: Dow Corning Toray Co Ltd
Реферат: The present invention relates to a release film used by being interposed between a molding material and a mold when the molding material is compression molded using the mold in order to form a sealing material or reflective frame material for an optical semiconductor element, or a lens, wherein the release film comprises a silicone-based cured product layer (2) on at least a surface in contact with the molding material; as well as a compression molding method that uses the film; and a compression molding apparatus that uses the film. The release film for the compression molding of molding materials has good workability and has good releasability, and thereby, a compression molding method with which compression molding with good efficiency is possible and a compression molding apparatus with which molding with good efficiency is possible.
Release film, compression molding method, and compression molding apparatus
Номер патента: WO2013162051A1. Автор: Shin Yoshida,Yoshitsugu Morita,Syuji Endo. Владелец: Dow Corning Toray Co., Ltd. Дата публикации: 2013-10-31.