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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 100038. Отображено 100.

05-01-2012 дата публикации

Led strip for small channel letters

Номер: US20120000104A1

Автор: Henricus Marie Peeters, Waltherus Emericus Johannes Van Gompel, Willibrordus Adrianus Johannes Antonius Van Der Poel

Принадлежит: KONINKLIJKE PHILIPS ELECTRONICS NV

A light emitting diode, LED, strip ( 301 ) for the illumination of channel signs is provided. The LED strip comprises a flexible circuit board, a plurality of LEDs mounted on the circuit board, and an electrical connector for connecting the LED strip to a power supply. The LED strip is at least in part encapsulated by a flexible resin such that the LED strip is foldable. The LED strip according to the present invention is advantageous in that its length can be adjusted by folding instead of cutting, thereby retaining the waterproof encapsulation of the LED strip. Further, a method for mounting a flexible LED strip ( 301 ) in a channel sign is provided. The method comprises the steps of attaching at least one clip ( 302 ) to an interior surface ( 303 ) of the channel sign, folding back an end ( 304 ) of the LED strip, and fixating the LED strip including the folded end using the clip. The method according to the present invention is advantageous in that it provides an easier and more reliable mounting of a LED strip as compared to standard prior art techniques.

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Номер записи: 1

05-01-2012 дата публикации

Method for manufacturing a liquid-tight electronic device, and liquid-tight electronic device

Номер: US20120002381A1

Автор: Umberto Zanoni

Принадлежит: STMICROELECTRONICS SRL

A method for manufacturing a liquid-tight electronic device includes: providing a first printed-circuit board having a first connector; providing a supporting structure having a first opening; forming a first assembly by coupling the supporting structure and the first printed-circuit board in such a way that the first connector extends through the first opening and delimits a bottom gap; and forming a second assembly having a protective shell. The method further includes: depositing a first layer of liquid resin within the bottom gap, and hardening the first layer of liquid resin; depositing a second layer of liquid resin within the second assembly; coupling the first and second assemblies in such a way that the second layer of liquid resin hermetically closes a first interstitial area between the protective shell and the supporting structure; and hardening the second layer of liquid resin.

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Номер записи: 2

05-01-2012 дата публикации

Printed circuit board unit and computer device having the same

Номер: US20120002389A1

Автор: Do-Kyun Lee

Принадлежит: SAMSUNG ELECTRONICS CO LTD

A printed circuit board unit usable with a computer device includes a main board on which a first component and a second component are mounted on an upper surface, and a routing unit mounted on at least one of the upper surface and a lower surface of the main board and including a sub-wire forming at least part of a wire to transmit a data between the first component and the second component.

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Номер записи: 3

05-01-2012 дата публикации

Waterproof flexible and rigid led lighting systems and devices

Номер: US20120002417A1

Автор: Qing (Charles) Li

Принадлежит: Li Qing Charles

The present invention relates to lighting strips and more particularly to flexible lighting systems and devices, which are waterproof. The lighting strips are modular and are capable of being physically and electrically connected with one another to provide lighting systems that are waterproof and adaptable to many situations. Included in embodiments of the invention are modular lighting strips comprising: a non-conductive substrate strip comprising an electrical circuit; a plurality of high brightness LEDs operably connected to the electrical circuit; a colloid layer comprising polyurethane resin providing a waterproof coating over the substrate, the circuit, and the LEDs; and a plug at one end and a socket at an opposing end of the substrate which is integrally formed with the strip to provide for waterproof electrical interconnection of two or more circuits or to a power supply. The lighting strips of the invention can be used in particular for back lighting, accent lighting, aisle or path lighting, contour lighting, elegant interior decoration, holiday decorations, or landscape lighting.

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Номер записи: 4

07-05-2021 дата публикации

Каркас печатного узла

Номер: RU0000204109U1

Автор: Вячеслав Юрьевич Пашкович, Евгений Юрьевич Кузнецов, Николай Николаевич Кокин, Роман Борисович Грибанов, Сергей Александрович Карамов

Принадлежит: Акционерное общество "Концерн "Созвездие"

Полезная модель относится к области электротехники, в частности к конструктивным элементам блоков радиоэлектронной аппаратуры. Технический результат заключается в повышении механической прочности печатного узла при упрощении компоновки радиоэлектронного блока и обеспечении качественного теплоотвода для размещаемых электрорадио изделий. Достигается тем, что в каркасе печатного узла, состоящего из соединенных в пакет металлических рамок с разъемными соединителями, каждая рамка снабжена одной теплоотводящей стороной, пересекающимися в центре продольным и поперечным ребрами жесткости, а также дополнительным ребром жесткости, проходящим по периметру рамки, при этом на стыке экрана и рамки, а так же на продольном и поперечном ребрах жесткости размещены крепежные отверстия и, сформированные в виде утолщения материала и предназначенные для дополнительной фиксации печатного узла, кроме того, в углах рамки и по середине каждой боковой стороны рамки расположены сквозные отверстия, предназначенные для конструктивного сопряжения нескольких печатных узлов; в теплоотводящей стороне, по крайней мере, одной рамки предусмотрено два крепежных отверстия блока радиоэлектронной аппаратуры для установки печатного узла на поверхности бортовой системы терморегуляции. 7 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 204 109 U1 (51) МПК H05K 1/14 (2006.01) H05K 5/00 (2006.01) H05K 7/18 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК H05K 1/144 (2020.08); H05K 5/00 (2020.08); H05K 7/18 (2020.08) (21)(22) Заявка: 2020127307, 14.08.2020 (24) Дата начала отсчета срока действия патента: Дата регистрации: 07.05.2021 (45) Опубликовано: 07.05.2021 Бюл. № 13 (56) Список документов, цитированных в отчете о поиске: RU 2513121 C2, 20.04.2014. RU 2606772 C2, 10.01.2017. EP 1575344 B1, 30.05.2007. KR 100659340 B1, 19.12.2006. US 7889508 B2, 15.02.2011. 2 0 4 1 0 9 R U (54) Каркас печатного узла (57) Реферат: Полезная модель относится к области ...

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Номер записи: 5

12-01-2012 дата публикации

System-in-a-package based flash memory card

Номер: US20120007226A1

Автор: Hem Takiar, Michael W. Patterson, Robert C. Miller, Shrikar Bhagath, Warren Middlekauff

Принадлежит: SanDisk Technologies LLC

A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

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Номер записи: 6

19-01-2012 дата публикации

Printed circuit board

Номер: US20120012377A1

Автор: Fa-Ping Fan

Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each of the two signal conductors is electrically connected to an edge of one of the weld pads of a respective pair of the at least two weld pad pairs. Thereby, the two signal conductors of the differential transmission line can extend in the same distance anywhere, particularly in the position where the two signal conductors pass the two weld pad pairs. As a result, the coupling performance and the capability of the differential transmission line to resist electromagnetic interference are both enhanced.

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Номер записи: 7

19-01-2012 дата публикации

Printed wiring board and a method of production thereof

Номер: US20120012464A1

Автор: Tomoyuki Ikeda

Принадлежит: Ibiden Co Ltd

A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

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Номер записи: 8

19-01-2012 дата публикации

Package structure

Номер: US20120013002A1

Автор: Shih-Ping Hsu

Принадлежит: Unimicron Technology Corp

Disclosed is a package structure including a semiconductor chip disposed in a core board having a first surface and an opposite second surface. The package structure further includes a plurality of first and second electrode pads disposed on an active surface and an opposite inactive surface of the semiconductor chip respectively, the semiconductor chip having a plurality of through-silicon vias for electrically connecting the first and second electrode pads. As a result, the semiconductor chip is electrically connected to the two sides of the package structure via the through-silicon vias instead of conductive through holes, so as to enhance electrical quality and prevent the inactive surface of the semiconductor chip from occupying wiring layout space of the second surface of the core board to thereby increase wiring layout density and enhance electrical performance.

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Номер записи: 9

19-01-2012 дата публикации

Control device

Номер: US20120014070A1

Автор: Yasuyuki Wakita

Принадлежит: JTEKT Corp

A circuit board unit of an ECU has an upper surface on which semiconductor elements are installed, a lower surface that is on the opposite side of the circuit board unit from the upper surface, and a cutout portion that is formed below the upper surface. A power module includes a conductive protruding and an electrically insulating main portion that holds the protruding piece. The conductive protruding piece is inserted in the cutout portion to support the circuit board unit, and is electrically connected to the semiconductor elements.

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Номер записи: 10

26-01-2012 дата публикации

Ceramic electronic component and wiring board

Номер: US20120018204A1

Автор: Koji Sato, Yasuhiro Nishisaka, Yukio Sanada

Принадлежит: Murata Manufacturing Co Ltd

A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

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Номер записи: 11

26-01-2012 дата публикации

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

Номер: US20120018205A1

Автор: Koji Sato, Yasuhiro Nishisaka, Yukio Sanada

Принадлежит: Murata Manufacturing Co Ltd

A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

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Номер записи: 12

26-01-2012 дата публикации

Modular led display structure with connecting edge banding to connect each other

Номер: US20120019490A1

Автор: Hsien-Jung Huang

Принадлежит: APA Electronic Co Ltd

A modular LED (Light Emitting Diode) display structure includes full-color LED units to be arranged in a matrix on a flexible PCB, and plurality of protective plates to protect connection between the full-color LED units and the transmission line of the flexible PCB. Also, the edge of the display has a connecting edge banding with a hook to form a track thereunder. The hook can clip the track of another LED module plate for connection to develop a lager LED display. Moreover, by a hanger connecting to the connecting edge banding to simplify the suspending of the LED display. Furthermore, each full-color LED units has a driving chip to enhance the resolution of the LED display.

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Номер записи: 13

26-01-2012 дата публикации

Electronic module with vertical connector between conductor patterns

Номер: US20120020044A1

Автор: Antti Iihola, Petteri Palm

Принадлежит: IMBERA ELECTRONICS OY

The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more.

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Номер записи: 14

26-01-2012 дата публикации

Method of forming a packaged semiconductor device

Номер: US20120021565A1

Автор: Douglas G. Mitchell, George R. Leal, Jason R. Wright, Jianwen Xu, Scott M. Hayes, Zhiwei Gong

Принадлежит: Individual

A method is used to form a packaged semiconductor device. A semiconductor device, which has an active surface, is placed in an opening of a circuit board. The circuit board has a first major surface and a second major surface having the opening, first vias that extend between the first major surface and the second major surface, first contact pads terminating the vias at the first major surface, and second contact pads terminating the vias at the second major surface. A dielectric layer is applied over the semiconductor device and the second major surface of the circuit board. An interconnect layer is formed over the dielectric layer. The interconnect layer has second vias electrically connected to the second contact pads, third vias that are electrically connected to the active surface of the semiconductor device, an exposed surface, and third contact pads at the exposed surface.

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Номер записи: 15

02-02-2012 дата публикации

Electical Panel for a Desktop Vacuum Chamber Assembly

Номер: US20120024562A1

Автор: Andrew E. Kalman

Принадлежит: Individual

A method for establishing a communication path between connectors on opposite sides of a PCB mounted to a vacuum chamber with an O-ring seal includes the steps (a) providing a plurality of vias through the PCB in the form of a connector pin pattern within the O-ring seal area to enable surface mounting of the type connector to the vacuum side of the PCB, (b) providing a plurality of vias through the PCB in the form of a pin pattern compatible to the pin pattern of step (a) outside of the O-ring seal area to enable plug in of the type connector to the pin pattern on the non-vacuum side of the PCB, and (c) on the non-vacuum side of the PCB, providing a conductive trace leading from each of the exposed vias of step (a) across the face of the PCB to each of the exposed vias of step (b).

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Номер записи: 16

02-02-2012 дата публикации

Semiconductor device comprising a passive component of capacitors and process for fabrication

Номер: US20120025348A1

Автор: Laurent Marechal, Romain Coffy, Yvon Imbs

Принадлежит: STMicroelectronics Grenoble 2 SAS

A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. A passive component including at least one conductive plate and a dielectric plate is positioned adjacent the integrated circuit chip. An encapsulation block embeds the integrated circuit chip and the passive component, the block having a frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. An electrical connection is made between the electrical connection frontside and the passive component. That electrical connection includes connection lines placed on the wafer frontside and wafer backside. The electrical connection further includes at least one via passing through the encapsulation block.

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Номер записи: 17

02-02-2012 дата публикации

Display driver circuit and board module including same

Номер: US20120026138A1

Автор: Masahiro Imai, Noriyuki Nakane

Принадлежит: Sharp Corp

In the case where input terminals of a display driver circuit are compatible with two or more types of interface specifications, an LSI chip, which is the display driver circuit, has some input terminals connected to parallel data lines and its output terminals connected to display lines, and these input terminals and output terminals are arranged along a long side located on the display portion side. In at least one example embodiment, the rest of the input terminals, which are intended for parallel interface, are arranged along a long side located on the FPC board side. With this configuration, the long sides of the LSI chip can be rendered shorter (than in the case where all input terminals are arranged in a row) without causing malfunction.

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Номер записи: 18

02-02-2012 дата публикации

Circuit board of portable electronic device

Номер: US20120026699A1

Автор: Ming-Yuan Hsu

Принадлежит: Hon Hai Precision Industry Co Ltd

A circuit board includes a main body and a connecting member mounted on the main body. The main body defines a separating groove and is divided into two segments by the separating groove, such that the main body is broken along the separating groove to separate the two segments from each other when a force is applied thereto. When the main body is broken along the separating groove to separate the two segments from each other, the connecting member electronically connects the two segments to each other.

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Номер записи: 19

02-02-2012 дата публикации

Riser card for power supply

Номер: US20120026710A1

Автор: Zhan-Yang Li

Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

A riser card is used for connecting at least one power supply to a motherboard in an electronic device. The riser card includes a first printed circuit board (PCB) and a second PCB. The first PCB includes at least one power connector for laterally receiving the at least one power supply. The second PCB is located parallel to the first PCB. The second PCB includes an insert terminal for connecting to the motherboard. The first PCB is spaced from the second PCB, and the first PCB and the second PCB are electrically connected.

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Номер записи: 20

09-02-2012 дата публикации

Electrical connectors and printed circuits having broadside-coupling regions

Номер: US20120034822A1

Автор: Neil Ktul Nay, Steven Richard Bopp

Принадлежит: Tyco Electronics Corp

An electrical connector that includes a circuit board having a board substrate that has opposite board surfaces and a thickness measured along an orientation axis that extends between the opposite board surfaces. The circuit board has associated pairs of input and output terminals and signal traces that electrically connect the associated pairs of input and output terminals. The input and output terminals being configured to communicatively coupled to mating and cable conductors, respectively. Each associated pair of input and output terminals is electrically connected through a corresponding signal trace that has a conductive path extending along the board substrate between the corresponding input and output terminals. At least two signal traces form a broadside-coupling region in which the conductive paths of the at least two signal traces are stacked along the orientation axis and spaced apart through the thickness and extend parallel to each other for a crosstalk-reducing distance.

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Номер записи: 21

16-02-2012 дата публикации

Method of manufacturing antenna using sintering of metal and antenna manufactured by the same

Номер: US20120038514A1

Автор: Kug Hyeon Bang

Принадлежит: Dynatron Co Ltd

A method of manufacturing an antenna includes forming a base including a synthetic resin, forming a conductive pattern on the base and forming a circuit pattern by sintering the conductive pattern by applying heat. The conductive pattern includes a conductive paste and a binding material binding the base and the conductive pattern. The conductive paste includes a metal.

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Номер записи: 22

16-02-2012 дата публикации

Method and apparatus for determining disposition of via hole on printed circuit board

Номер: US20120041710A1

Автор: Ming-Chin Tsai

Принадлежит: King Yuan Electronics Co Ltd

A method for determining disposition of via hole on printed circuit board (PCB), said method comprising the steps of: providing a PCB on which is disposed with a geometric layout and a via hole; providing a line on said PCB for intersecting said geometric layout to form a plurality of points of intersection; defining line segments by segmenting said line at each of said points of intersection to form a plurality of line segments; deleting some of said line segments having one end not being point of intersection for said geometric layout to form a plurality of segmented regions; searching a closed region by repeatedly searching region from any one of the points in said plurality of segmented regions; determining whether a closed region is a smallest closed region; determining whether a via hole is located within said smallest closed region.

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Номер записи: 23

23-02-2012 дата публикации

Flexible circuit structure with stretchability and method of manufacturing the same

Номер: US20120043115A1

Автор: Ying-Ching Shih, Yu-Hua Chen

Принадлежит: Industrial Technology Research Institute ITRI

In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.

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Номер записи: 24

23-02-2012 дата публикации

Printed circuit board and method of manufacturing the same

Номер: US20120043121A1

Автор: Jong Seok Bae

Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first circuit layer including a first metal layer and a first plating layer provided on an outer side of the first metal layer and embedded in one surface of the insulating layer; a second circuit layer including a second metal layer and a second plating layer provided on an outer side of the second metal layer and embedded in the other surface of the insulating layer; and a bump interconnecting the first circuit layer and the second circuit layer while penetrating through the insulating layer. The bump is used, such that there is no need to perform hole plating. Therefore, an increase in the surface plating thickness due to the hole plating is previously prevented.

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Номер записи: 25

23-02-2012 дата публикации

Board holder, electronic device, and display apparatus

Номер: US20120044668A1

Автор: Hideto Takeuchi

Принадлежит: Individual

A hole that penetrates each light emitting diode board in the thickness direction of the board is provided, on one end portion in the longitudinal direction of each of a plurality of light emitting diode boards which have a plurality of light emitting diodes mounted on one surface, respectively have substantially a strip shape, and are arranged in a plurality of rows. The board holder has: protruding sections which are inserted into the holes of the adjacent light emitting diode boards; and a coupling section which is disposed in the direction orthogonally intersecting the longitudinal direction of the light emitting diode board, has a strip-shape, and couples respective base ends of the protruding sections. The plurality of light emitting diode boards disposed in parallel are held by inserting the protruding sections into the holes.

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Номер записи: 26

23-02-2012 дата публикации

Flexibly configurable button panels for gaming machines

Номер: US20120046107A1

Автор: Brandon J. Bohling, Scott T. Gowin, Thomas D. Waxman

Принадлежит: INTERNATIONAL GAME TECHNOLOGY

Flexibly configurable button panels for electronic devices and dynamic display systems for wager based gaming machines are disclosed. Button panels include a flexible cable, surface mount or other cable connectors spaced along and coupled thereto, and button assemblies coupled thereto via the cable connectors to provide electrical access from buttons to circuit lines. Relative physical locations of buttons are then reconfigurable to form different button panel configurations while the buttons remain coupled to the flexible cable. A dedicated dynamic button panel controller for processing button functions and a button panel identification device having an identification code can also be provided. Buttons can be removably coupled to the cable connectors, and can also include dynamic displays thereupon. Other gaming machine dynamic displays can also be provided. Separate dynamic display controllers can be provided to control dynamic displays directly to alleviate processing burdens on the master gaming controller.

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Номер записи: 27

01-03-2012 дата публикации

Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same

Номер: US20120050940A1

Автор: Nachiket Raravikar, Rahul Panat

Принадлежит: Individual

A method of manufacturing an embedded passive device for a microelectronic application comprises steps of providing a substrate ( 110, 210, 310 ), nanolithographically forming a first section ( 121, 221, 321 ) of the embedded passive device over the substrate, and nanolithographically forming subsequent sections ( 122, 222, 322 ) the embedded passive device adjacent to the first section. The resulting embedded passive device may contain features less than approximately 100 nm in size.

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Номер записи: 28

08-03-2012 дата публикации

Low Profile Inductors For High Density Circuit Boards

Номер: US20120056703A1

Автор: Alexandr Ikriannikov

Принадлежит: Volterra Semiconductor LLC

An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.

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Номер записи: 29

15-03-2012 дата публикации

Method of fabricating circuit board structure

Номер: US20120060368A1

Автор: Cheng-Po Yu, Han-Pei Huang

Принадлежит: Unimicron Technology Corp

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

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Номер записи: 30

15-03-2012 дата публикации

Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages

Номер: US20120062346A1

Автор: William E. McKinzie, III

Принадлежит: WEMTEC Inc

A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS) formed from a resistive film. The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode, and to simultaneously create a multi-octave TM mode suppression band. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.

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Номер записи: 31

15-03-2012 дата публикации

Reducing thermal gradients to improve thermopile performance

Номер: US20120063093A1

Автор: Kalin V. Lazarov, Walter Meinel

Принадлежит: Texas Instruments Inc

With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB.

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Номер записи: 32

15-03-2012 дата публикации

Thermal interface material application for integrated circuit cooling

Номер: US20120063094A1

Автор: Dong G. Kam, Duixian Liu, Michael A. Gaynes, Scott K. Reynolds

Принадлежит: International Business Machines Corp

Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.

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Номер записи: 33

15-03-2012 дата публикации

Light source device and display device provided with same

Номер: US20120063150A1

Автор: Hideto Takeuchi

Принадлежит: Individual

A light source device includes a circuit board having a LED mounted on a surface, a lens attached to the surface so as to diffuse light emitted from the LED, a reflecting sheet having a through hole in the inside of which the lens is disposed and reflecting light emitted from the LED at an opposite side of the surface, and a restricting member which is disposed at one of an edge of the through hole in the reflecting sheet and the lens, and restricts a deviation of the reflecting sheet in a direction departing from the surface.

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Номер записи: 34

22-03-2012 дата публикации

Stacked structure and method of manufacturing the same

Номер: US20120069487A1

Автор: Hitoshi Noguchi, Naoki Tanaka, Tatsuya Nakamura

Принадлежит: Sanyo Electric Co Ltd

[Problem to be Solved] A problem to be solved is to provide a stacked structure and a method of manufacturing the same that make generation of insulation breakdown unlikely, while providing a high dielectric constant and a high quality. [Means for Solving Problem] A stacked structure according to the present invention is a stacked structure in which a dielectric layer 3 is provided between a first conductive layer 1 and a second conductive layer 2 . The dielectric layer 3 includes a dielectric film 31 formed on the first conductive layer 1 , and a dielectric particle film 32 formed by applying a dispersion solution containing dielectric particles onto the dielectric film 31 . A method of manufacturing the stacked structure according to the present invention includes a dielectric layer forming step of forming the dielectric layer 3 on the first conductive layer 1 , and a conductive layer forming step of forming the second conductive layer 2 on the dielectric layer 3 . The dielectric layer forming step includes a dielectric film forming step of forming the dielectric film 31 on the first conductive layer 1 , and a particle film forming step of forming the dielectric particle film 32 by applying a dispersion solution containing dielectric particles onto the dielectric film 31.

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Номер записи: 35

22-03-2012 дата публикации

System and method of forming a patterned conformal structure

Номер: US20120069523A1

Автор: Christopher James Kapusta, Donald Paul Cunningham

Принадлежит: General Electric Co

A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

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Номер записи: 36

29-03-2012 дата публикации

Source Driver, An Image Display Assembly And An Image Display Apparatus

Номер: US20120075268A1

Автор: Hee-Seok Lee, Keung-Beum Kim, Ye-Chung Chung, Yun-seok Choi

Принадлежит: SAMSUNG ELECTRONICS CO LTD

An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

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Номер записи: 37

05-04-2012 дата публикации

Circuit board including embedded decoupling capacitor and semiconductor package thereof

Номер: US20120080222A1

Автор: Hee-Seok Lee, Ji-hyun Lee, Yong-Hoon Kim

Принадлежит: SAMSUNG ELECTRONICS CO LTD

A circuit board including an embedded decoupling capacitor and a semiconductor package thereof are provided. The circuit board may include a core layer including an embedded decoupling capacitor, a first build-up layer at one side of the core layer, and a second build-up layer at the other side of the core layer, wherein the embedded decoupling capacitor includes a first electrode and a second electrode, the first build-up layer includes a first via contacting the first electrode, and the second build-up layer includes a second via contacting the first electrode.

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Номер записи: 38

05-04-2012 дата публикации

Chip Capacitor Precursors

Номер: US20120081832A1

Автор: Azuma Chikara

Принадлежит: Texas Instruments Inc

A capacitive precursor includes electrically conductive material layers stacked on a substrate. The electrically conductive layers provide first and second patterns. The patterns each include overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. Dielectric layers are interposed between neighboring electrically conductive material layers for electrical isolation. One or more capacitive precursors can be dropped onto or into a board and during assembly of a packaged semiconductor device and have electrically conducting layers associated with its respective plates connected together to form a capacitor during assembly using conventional assembly steps.

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Номер записи: 39

12-04-2012 дата публикации

Wiring board and method for manufacturing the same

Номер: US20120085572A1

Автор: Shunsuke Sakai

Принадлежит: Ibiden Co Ltd

A wiring board including a core substrate having an accommodation portion, an electronic component in the accommodation portion having a substrate, a resin layer on a surface of the substrate and an electrode on the resin layer, a first interlayer resin insulation layer on a surface of the core substrate and a surface of the substrate of the component, and a second interlayer resin insulation layer on the opposite surface of the core substrate and a surface of the substrate having the resin layer and electrode. The first insulation layer has resin in the amount greater than the amount of resin in the second insulation layer such that the total amount of resin component including the resin in the first insulation layer is adjusted to be substantially the same as the total amount of resin component including the resin in the second insulation layer and resin in the resin layer.

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Номер записи: 40

12-04-2012 дата публикации

Portable information processing device

Номер: US20120087057A1

Автор: Katsutoshi Tahara

Принадлежит: Sony Corp

A portable information processing device includes a circuit board portion that has a main body portion side board mounting an electronic circuit thereon and forming a main body portion, and a connector portion side board forming a connector portion for connection to electronic equipment, wherein the main body portion side board mounts an electronic circuit on at least one of a first surface and a second surface opposite to the first surface, and is provided with a main body portion side electro-static discharge line which functions as an electro-static discharge surge arrester at an edge portion of a surface on which at least an electronic circuit is mounted, and wherein the connector portion side board is provided with a connector portion side electro-static discharge line which is connected to the main body portion side electro-static discharge line and functions as an electro-static emission portion.

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Номер записи: 41

12-04-2012 дата публикации

Method and device of electromagnetics

Номер: US20120088377A1

Автор: Fredrik Ohlsson

Принадлежит: Huawei Technologies Co Ltd

A method and device for electromagnetic shielding is disclosed. An example arrangement includes a first and a second printed circuit board arranged adjacently and having an electromagnetic shield cover. An electrically conductive plug electrically provides an interconnection of the electromagnetic shielding.

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Номер записи: 42

26-04-2012 дата публикации

Display apparatus

Номер: US20120099281A1

Автор: Sam-Ju Choi, Seung-Jin Lee, Yeon-Tae Kim

Принадлежит: Samsung Mobile Display Co Ltd

A display apparatus that facilitates shielding of electromagnetic waves and heat dissipation is disclosed. The display apparatus may include: i) a substrate, ii) a sealing member disposed to face the substrate, iii) a display unit disposed between the substrate and the sealing member, iv) a driving chip disposed on the substrate and transmitting an electric signal to the display unit and v) a circuit board including a signal line that is electrically connected to the driving chip, and a conductive cover layer disposed to cover the driving chip. In one embodiment, the circuit board includes a heat sink for dissipating heat generated by the driving chip.

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Номер записи: 43

26-04-2012 дата публикации

Display device

Номер: US20120099283A1

Автор: Eiji Oohira

Принадлежит: Hitachi Displays Ltd, Panasonic Liquid Crystal Display Co Ltd

A display device includes: a display panel; a metal frame; and a flexible printed wiring board fixed to the display panel and having a portion positioned between a lower surface of the display panel and the metal frame, in which the flexible printed wiring board includes: a protruding piece portion having a protruding length larger than a width in plan view; an electrode arranged on the protruding piece portion; a connection terminal electrically connected to the display panel; an external terminal for electrically connecting to an outside; and a wiring pattern connected to the electrode, the connection terminal, and the external terminal, and in which the electrode is electrically and physically bonded to the metal frame in a manner opposed to the metal frame, and is arranged at a position overlapping with a center of a surface of the metal frame facing the display panel.

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Номер записи: 44

03-05-2012 дата публикации

Portable terminal

Номер: US20120106102A1

Автор: Hiroyasu Yamada, Junichi Nakao

Принадлежит: Individual

A portable terminal characterized by comprises: a first substrate; a double-sided tape adhered to a prescribed portion of said first substrate; a second substrate adhered to said double-sided tape on a side thereof that is opposite the side on which said first substrate is located and having an electronic part mounted on a side thereof that is opposite the side affixed to said double-sided tape; an upper case disposed on a side of said first substrate, opposite the side where said doubled-sided tape is located; a lower case disposed on a side of the electronic part, opposite the side where said second substrate is located, and combined with said upper case; and a frame placed between said second substrate and said lower case and having an opening at a position corresponding to said electronic part.

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Номер записи: 45

03-05-2012 дата публикации

Method for Producing an Electrical Circuit and Electrical Circuit

Номер: US20120106112A1

Автор: Ricardo Ehrenpfordt, Sonja Knies

Принадлежит: ROBERT BOSCH GMBH

A method for producing an electrical circuit includes providing a main printed circuit board having a plurality of metalized plated-through holes through the main printed circuit board along at least one separating line between adjacent printed circuit board regions of the main printed circuit board. Each printed circuit board region has electrical contact connection pads on at least the main surface of the printed circuit board region that is to be populated, electrical lines for connection between the plurality of plated-through holes and the contact connection pads, and at least one semiconductor chip electrically contact-connected by means of the contact connection pads. The main printed circuit board is covered with a potting compound across the printed circuit board regions with the semiconductor chips.

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Номер записи: 46

03-05-2012 дата публикации

Method for Producing Lamps

Номер: US20120107973A1

Автор: Klaus Müller, Stefan Grötsch

Принадлежит: OSRAM Opto Semiconductors GmbH

A method for producing luminous means proposes providing a carrier serving as a heat sink, said carrier comprising a planar chip mounting region. The planar chip mounting region is structured for the purpose of producing a first partial region and at least one second partial region. In this case, the first partial region has a solder-repellent property after structuring. Afterward, a solder is applied to the planar chip mounting region, such that said solder wets the at least one second partial region. At least one optoelectronic body is fixed into the at least one second partial region with the solder at the carrier. Finally, contact-connections are formed for the purpose of feeding electrical energy to the optoelectronic luminous body.

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Номер записи: 47

03-05-2012 дата публикации

Z-directed pass-through components for printed circuit boards

Номер: US20120108115A1

Автор: Brian Lee Nally, John Thomas Fessler, Keith Bryan Hardin, Paul Kevin Hall, Robert Aaron Oglesbee

Принадлежит: Lexmark International Inc

A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

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Номер записи: 48

10-05-2012 дата публикации

Printed circuit board with good performance on impedance

Номер: US20120111626A1

Автор: Feng-Jun Qi, Jun Chen, Ping-Sheng Su, Qing Wang

Принадлежит: Hon Hai Precision Industry Co Ltd

A printed circuit board, comprises an insulative substrate, a grounding layer located on a surface of the insulative substrate and defining a through slot, a plurality of conductive pins located on an outer surface of the printed circuit board; and a fence layer located between the conductive path and the grounding layer. Each conductive pin defines at least a soldering portion. The soldering portion is alignment to the through slot along a vertical direction.

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Номер записи: 49

10-05-2012 дата публикации

Suspension board with circuit and producing method thereof

Номер: US20120113547A1

Автор: Yuu Sugimoto

Принадлежит: Nitto Denko Corp

A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.

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Номер записи: 50

10-05-2012 дата публикации

Bendable Luminous Modules and Method for Producing Bendable Luminous Modules

Номер: US20120113606A1

Автор: Thomas Preuschl

Принадлежит: OSRAM GMBH

A light module ( 1; 14 ), comprising a carrier ( 8, 10 ) for mounting at least one semiconductor source ( 5 ), in particular a light emitting diode, wherein: the carrier ( 8, 10 ) has a flexible printed circuit board ( 10 ), the flexible printed circuit board ( 10 ) is bonded face-to face to at least one base plate, ( 8 ) and the carrier ( 8, 10 ) can be bent along at least one predetermined bending line ( 3; 3 a - 3 e ), the base plate ( 8 ) can be bent along the at least one bending line, ( 3; 3 a - 3 e ), the base plate ( 8 ) has at least one cutout ( 9 ) along the bending line ( 3; 3 a - 3 e ) and the flexible printed circuit board ( 10 ) has at least one strip ( 11; 15 ) which crosses at least one of the cutouts ( 9 ).

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Номер записи: 51

10-05-2012 дата публикации

Energy Storage Module

Номер: US20120114978A1

Автор: Claude Beauregard, JR.

Принадлежит: Individual

This invention comprise an energy storage module consisting of surface mounted solid state energy cells attached to a rigid circuit board with tabbed ends that act as positive and negative electrodes. The solid state energy cells are attached to each other by use of surface connection links on the rigid circuit board. The rigid circuit board is then inserted into a battery can with interior connection points that can accommodate the insertion of a tabbed end of the rigid circuit board so that positive voltage can be directed out to one external terminal end of the battery can and negative voltage can be directed out to another external terminal of the battery can.

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Номер записи: 52

17-05-2012 дата публикации

Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method

Номер: US20120117798A1

Автор: Tae-Kwon Na

Принадлежит: SAMSUNG ELECTRONICS CO LTD

A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit.

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Номер записи: 53

17-05-2012 дата публикации

Electronic textile, article and method

Номер: US20120118427A1

Автор: David Stuart Brookstein, Muthu Govindaraj

Принадлежит: Philadelphia University (PhilaU)

A woven article having plural weave layers comprises a plurality of electrically insulating and/or electrically conductive yarn in the warp and a plurality of electrically insulating and/or electrically conductive yarn in the weft interwoven with the yarn in the warp. An electrical function is provided by one or more circuit carriers disposed in cavities in the plural layer woven article and/or one or more functional yarn in the warp and/or the weft, wherein the circuit carrier and/or functional yarn include an electrical contact for connecting to the electrically conductive yarn in the warp and/or weft.

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Номер записи: 54

17-05-2012 дата публикации

Semiconductor package and semiconductor system including the same

Номер: US20120119370A1

Автор: Jae-Wook Yoo

Принадлежит: SAMSUNG ELECTRONICS CO LTD

Provided are a semiconductor package and a semiconductor system including the semiconductor package. The semiconductor package includes a semiconductor device and an interconnect structure electrically connected to the semiconductor device and delivering a signal from the semiconductor device, wherein the interconnect structure includes an anodized insulation region and an interconnect adjacent to and defined by the anodized insulation region.

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Номер записи: 55

17-05-2012 дата публикации

Electronic Device and Noise Current Measuring Method

Номер: US20120119757A1

Автор: Satoshi Nakamura, Takashi Suga, Yutaka Uetmatsu

Принадлежит: HITACHI LTD

A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate ( 103 ) on which an electronic component is mounted is secured to a housing ( 102 ) by a metal spacer ( 108 ) and a screw ( 104 ). A noise control member ( 100 ) mainly composed of an insulation substance is disposed between the metal spacer ( 108 ) and the substrate ( 103 ). A first conductive film is formed on the metal spacer-side of the noise control member ( 100 ), and a second conductive film is formed on the substrate-side of the noise control member ( 100 ). A resistance member ( 101 ) is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.

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Номер записи: 56

17-05-2012 дата публикации

Multistage capacitive crosstalk compensation arrangement

Номер: US20120122351A1

Автор: Bernard Harold Hammond, JR., David Patrick Murray

Принадлежит: ADC GmbH

Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

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Номер записи: 57

31-05-2012 дата публикации

Memory Modules and Devices Supporting Configurable Core Organizations

Номер: US20120134084A1

Автор: Craig E. Hampel, Donald C. Stark, Ely K. Tsern, Frederick A. Ware, Richard E. Perego

Принадлежит: RAMBUS INC

Described are memory apparatus organized in memory subsections and including configurable routing to support multiple data-width configurations. Relatively narrow width configurations load fewer sense amplifiers, resulting in reduced power usage for relatively narrow memory configurations. Also described are memory controllers that convey width selection information to configurable memory apparatus and support point-to-point data interfaces for multiple width configurations.

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Номер записи: 58

31-05-2012 дата публикации

Driver element and display device

Номер: US20120134120A1

Автор: Kenji Gondo

Принадлежит: Kyocera Display Corp

To broaden a substantial area for wiring between a display portion and a driver element, and to increase the number of wirings between the driver element and the display portion. In a driving IC 100, bumps 10, 12, 14, 16, 18, 22, 24, 26 and 28 are arrayed in a first row 110 and bumps 11, 13, 15, 17, 21, 23, 25, 27 are arrayed in a second row 120, wherein the respective bumps are disposed so that the shortest distances between forward ends of the respective bumps and a side along the array, become larger gradually from the center outward in the array.

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Номер записи: 59

07-06-2012 дата публикации

Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate

Номер: US20120138346A1

Автор: Hiroyuki Uematsu, Kenichi Kawabata

Принадлежит: TDK Corp

A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.

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Номер записи: 60

07-06-2012 дата публикации

Circuit board

Номер: US20120138351A1

Автор: I-Hsiu Lee

Принадлежит: Chi Mei Communication Systems Inc

The circuit board includes a base board and a pad array mounted on the base board. The pad array includes a plurality of spaced first pads, two second pads, and two third pads. The first pads, the second pads, and the third pads are all parallel to each other. The third pads are between the first pads and the second pads. The first pads electronically and physically connect to an electric element. The second pads and third pads physically connect to the electric element.

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Номер записи: 61

14-06-2012 дата публикации

Multilayer printed wiring boards with holes requiring copper wrap plate

Номер: US20120144667A1

Автор: Rajwant Singh Sidhu

Принадлежит: DDI Global Corp

Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

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Номер записи: 62

14-06-2012 дата публикации

Circuit board with double-sided universal circuit layout and layout method thereof

Номер: US20120145443A1

Автор: Ching-Feng Hsieh, Kuo-Chan Peng

Принадлежит: Askey Computer Corp

A circuit board with double-sided universal circuit layout for laying out electronic components has a first side with a first circuit layout thereon and an opposing second side with a second circuit layout thereon; hence, the first circuit layout and the second circuit layout are disposed on the opposing sides of the circuit board, respectively. The first circuit layout and the second circuit layout feature electronic circuits having the same function, thereby allowing users to selectively install the electronic components at one of the first circuit layout and the second circuit layout as needed and still have access to the electronic circuits having the same function. A layout method for use with the circuit board with double-sided universal circuit layout is further introduced.

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Номер записи: 63

14-06-2012 дата публикации

Printed circuit board with compound via

Номер: US20120145448A1

Автор: Cheng-Hsien Lee, Dan-Chen Wu, Jia-Chi Chen, Po-Chuan HSIEH, Shin-Ting Yen, Shou-Kuo Hsu, Yung-Chieh Chen

Принадлежит: Hon Hai Precision Industry Co Ltd

A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

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Номер записи: 64

14-06-2012 дата публикации

Method of manufacturing printed circuit board

Номер: US20120148960A1

Автор: Chang Sup Ryu, Eung Suek Lee, Je Gwang Yoo, Jee Soo Mok

Принадлежит: Samsung Electro Mechanics Co Ltd

A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

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Номер записи: 65

21-06-2012 дата публикации

Method of manufacturing substrate for capacitor-embedded printed circuit board and capacitor-embedded printed circuit board

Номер: US20120152886A1

Автор: Hwa-Sun Park, Jong-Woo Han, Sang-Chul Lee, Sung Yi, Woon-Chun KIM, Young-Do Kweon

Принадлежит: Samsung Electro Mechanics Co Ltd

A method of manufacturing a capacitor-embedded printed circuit board, the method including providing a substrate on which a first metal layer, a dielectric layer and an adhesive resin layer are stacked on the order thereof; etching a part of the first metal layer to form a first electrode and a first circuit pattern; compressing a surface of the substrate, on which the first electrode is formed, onto a core board by interposing an insulation resin layer; forming a second electrode and a second circuit pattern on the adhesive resin layer; stacking an insulation board on the substrate such that the second electrode and the second circuit pattern are covered; and forming a third circuit pattern on the insulation board.

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Номер записи: 66

21-06-2012 дата публикации

Reduced pth pad for enabling core routing and substrate layer count reduction

Номер: US20120153495A1

Автор: Debendra Mallik, Mihir K. Roy

Принадлежит: Intel Corp

Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

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Номер записи: 67

21-06-2012 дата публикации

Semiconductor package and manufacturing method therefor

Номер: US20120153509A1

Автор: Akihiko Tateiwa, Masahiro Kyozuka, Toru Hizume

Принадлежит: Shinko Electric Industries Co Ltd

According to one embodiment, there is provided a semiconductor package including: a semiconductor chip; a resin portion formed to cover the semiconductor chip; a wiring structure formed on the resin portion and electrically connected to the semiconductor chip; and a warpage preventing member provided above the resin portion to have a thermal expansion coefficient closer to that of the semiconductor chip than to that of the wiring structure.

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Номер записи: 68

21-06-2012 дата публикации

Systems and methods for interrogator multiple radio frequency identification enabled documents

Номер: US20120154121A1

Автор: John Azevedo, Jun Liu, Rodolfo Monsalvo

Принадлежит: Neology Inc

A multi-document read-write station provides the ability to read/write to a stack of Radio Frequency Identification (RFID) tags within a small area. Specifically, the station provides the ability to read from and write to a tall stack of RFID tagged sheets with the RFID tags stacked one on top of the other. The station and capability described herein is the result of and comprises several components including a closed chamber comprising a document slot, an antenna system, and a power management system.

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Номер записи: 69

21-06-2012 дата публикации

Flexible circuit board and manufacturing method thereof

Номер: US20120155038A1

Автор: Masaki Fujiwara, Steven Roy Droes, Yasumori Fukushima

Принадлежит: Sharp Corp

The present invention provides a high-performance flexible circuit board having excellent flexibility, a fine wiring pattern, and fine electric contacts, and a manufacturing method thereof. In a flexible circuit board ( 20 ), a second insulating layer ( 24 ) made of an inorganic material is positioned between a wiring layer ( 25 ) and a first insulating layer ( 23 ) made of an inorganic material.

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Номер записи: 70

21-06-2012 дата публикации

Clip for bios chip

Номер: US20120155045A1

Автор: Xing-Long Teng

Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

A clip for a basic input/output system (BIOS) chip includes a main body, two spindles, two clipping elements, and two torsion springs. The main body includes a number of connecting pins mounted on a bottom of the main body, and a number of signal pins mounted on a top of the main body and electrically and correspondingly connected to the number of the connecting pins. The clipping elements are rotatably mounted to opposite ends of the main body through the spindles. The torsion springs are mounted between the clipping members and the main body. The connecting pins of the main body respectively electrically contacts a number of chip pins of the BIOS chip in response to the clipping elements clipping the BIOS chip.

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Номер записи: 71

21-06-2012 дата публикации

Semiconductor chip assembly and method for making same

Номер: US20120155055A1

Автор: Belgacem Haba, Hiroaki Sato, Ilyas Mohammed, Kiyoaki Hashimoto, Norihito Masuda, Philip Damberg, Teck-Gyu Kang, Wei-Shun Wang, Yoshikuni Nakadaira

Принадлежит: Tessera LLC

A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

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Номер записи: 72

21-06-2012 дата публикации

Memory Module With Reduced Access Granularity

Номер: US20120159061A1

Автор: Craig E. Hampel, Frederick A. Ware

Принадлежит: RAMBUS INC

A memory module having reduced access granularity. The memory module includes a substrate having signal lines thereon that form a control path and first and second data paths, and further includes first and second memory devices coupled in common to the control path and coupled respectively to the first and second data paths. The first and second memory devices include control circuitry to receive respective first and second memory access commands via the control path and to effect concurrent data transfer on the first and second data paths in response to the first and second memory access commands.

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Номер записи: 73

28-06-2012 дата публикации

Coreless layer buildup structure

Номер: US20120160547A1

Автор: Frank D. Egitto, Rabindra N. Das, Timothy Antesberger, Voya R. Markovich, William E. Wilson

Принадлежит: Endicott Interconnect Technologies Inc

A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.

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Номер записи: 74

28-06-2012 дата публикации

Metalized pad to electrical contact interface

Номер: US20120164888A1

Автор: James Rathburn

Принадлежит: HSIO Technologies LLC

A surface mount electrical interconnect to provide an interface between a PCB and contacts on an integrated circuit device. The electrical interconnect includes a substrate with a plurality of recesses arranged along a first surface to correspond to the contacts on the integrated circuit device. Contact members are located in a plurality of the recess. The contact members include contact tips adapted to electrically couple with the contacts on the integrated circuit device. An electrical interface including at least one circuit trace electrically couples the contact member to metalized pads located along a second surface of the substrate at a location offset from a corresponding contact member. A solder ball is attached to a plurality of the metalized pads.

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Номер записи: 75

05-07-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120168212A1

Автор: Dong Kyu Lee, Hyung Gi HA, Ja Ho KOO, Jae Won Jung, Jong Jin Lee, Yong Hwan Kim, Young Hwan Shin

Принадлежит: KOREA E&S CO Ltd, Samsung Electro Mechanics Co Ltd

Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.

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Номер записи: 76

12-07-2012 дата публикации

Wiring board and method of producing the same

Номер: US20120175157A1

Автор: Kentaro Kaneko

Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral edge of the external connection pad is retracted from an outer peripheral edge of the surface plated layer toward a center of the external connection pad.

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Номер записи: 77

12-07-2012 дата публикации

Method and system for reducing trace length and capacitance in a large memory footprint

Номер: US20120175160A1

Автор: Rachid M. Kadri, Stephen F. Contreras

Принадлежит: Hewlett Packard Development Co LP

A method and system are disclosed to reduce trace length and capacitance in a large memory footprint. When more dual in-line memory module (DIMM) connectors are used per memory channel, the overall bus bandwidth may be affected by trace length and trace capacitance. In order to reduce the overall trace length and trace capacitance, the system and method use a palm tree topology placement, i.e., back-to-back DIMM placement, to place surface mount technology (SMT) DIMM connectors (instead of through-hole connectors) back-to-back in a mirror fashion on each side of a printed circuit board (PCB). The system and method may improve signal propagation time when compared to the commonly used traditional topology placements in which all DIMM connectors are placed on one side of the PCB.

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Номер записи: 78

12-07-2012 дата публикации

Led light disposed on a flexible substrate and connected with a printed 3d conductor

Номер: US20120175667A1

Автор: Aaron J. Golle, John Golle, Walter J. Paciorek

Принадлежит: Heilux LLC

An example includes subject matter (such as an apparatus) comprising a planar substrate including a first surface that is planar, at least one bare light emitting diode (“LED”) die coupled to the substrate and conductive ink electrically coupling the at least one bare LED die, wherein the conductive ink is disposed on the substrate and extends onto a surface of the LED that is out-of-plane from the first surface.

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Номер записи: 79

19-07-2012 дата публикации

Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods

Номер: US20120181073A1

Автор: Casey Philip Rodriguez, Louis Joseph Rendek, Jr., Steven R. Snyder

Принадлежит: HARRIS CORP

An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.

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Номер записи: 80

19-07-2012 дата публикации

Double-sided circuit board and manufacturing method thereof

Номер: US20120181076A1

Автор: Kota Noda, Satoru Kawai, Tsutomu Yamauchi

Принадлежит: Ibiden Co Ltd

A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R 1 on the first surface of the substrate, a second hole having a second opening with a diameter R 2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R 1 and R 2.

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Номер записи: 81

19-07-2012 дата публикации

Microwave filter

Номер: US20120182093A1

Автор: Hans-Olof Vickes, Simon Kristiansson

Принадлежит: SAAB AB

A filter unit and a corresponding printed circuit board. The filter unit and the printed circuit board have been equipped with modified end portions being matched such that a number of filter units can be used on the printed circuit board without changing the printed circuit board.

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Номер записи: 82

19-07-2012 дата публикации

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

Номер: US20120182701A1

Автор: David Nicol, Louis Joseph Rendek, Jr., Michael Weatherspoon

Принадлежит: HARRIS CORP

A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

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Номер записи: 83

19-07-2012 дата публикации

Plug connector and multi-layer circuit board

Номер: US20120184115A1

Автор: Juergen Lappoehn

Принадлежит: ERNI Electronics GmbH and Co KG

The invention relates to a multi-pole plug connector ( 90 ) for contacting a multi-layer circuit board ( 51 ), comprising a plurality of contact elements ( 50 a, 50 b - 50′ a, 50′ b ), as well as to a multi-layer circuit board for assembly with a multi-pole plug connector ( 90 ), comprising blind boreholes ( 60 a, 60 b - 60′ a, 60′ b ) for contacting terminal pins ( 53 a, 53 b - 53′ a, 53′ b ) of the contact elements ( 50 a, 50 b - 50′ a, 50′ b ) of the multi-pole plug connector ( 90 ). The invention further relates to a combination of a multi-pole plug connector ( 90 ) for contacting with a multi-layer circuit board ( 51 ) and to a multilayer circuit board for assembly with the multi-pole plug connector ( 90 ). The plug connector ( 90 ) according to the invention is characterized by terminal pins ( 53 a, 53 b - 53′ a, 53′ b ) that have different lengths for contacting the terminal pins ( 53 a, 53 b - 53′ a, 53′ b ) with conductors ( 52 a, 52 b; 72 a, 72 b - 72′ a, 72′ b ) of the multi-layer circuit board ( 51 ) provided in different conductor levels ( 71 - 71 ′). The multi-layer circuit board ( 51 ) according to the invention is characterized by blind boreholes ( 60 a, 60 b - 60′ a, 60′ b ) that terminate in different conductor levels ( 71 - 71 ′) of the multilayer circuit board ( 51 ) for deliberately contacting the terminal pins ( 53 a, 53 b - 53′ a, 53′ b ) with conductors ( 52 a, 52 b; 72 a, 72 b - 72′ a, 72′ b ) of the multilayer circuit board ( 51 ) provided in different conductor levels ( 71 - 71 ′).

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Номер записи: 84

19-07-2012 дата публикации

Mounting structure of connector for circuit board

Номер: US20120184117A1

Автор: Ryo Fujikawa

Принадлежит: Yazaki Corp

A mounting structure of a connector for a circuit board is provided. A circuit board is formed with a cutout, the cutout has a rectangular shape which is defined by three rectilinear side edges and one side edge is open, and one of the three side edge is a terminal arranging side edge part. Terminals are provided in the terminal arranging side edge part and are arranged along a longitudinal direction of the terminal arranging side edge part. A connector housing is formed with terminal containing grooves on a lower face thereof. The terminals are respectively contained in the terminal containing grooves when the connector housing is fitted into the cutout. By fitting the connector housing into the cutout, the terminals are contained in the terminal containing grooves, thereby to construct the connector for the circuit board in which the terminals are used as connector terminals.

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Номер записи: 85

26-07-2012 дата публикации

Flexible circuit board

Номер: US20120186858A1

Автор: Hiroharu UEHARA, Hiroki Shirato, Katsuhide NAKAI

Принадлежит: Canon Components Inc

A flexible circuit board includes a base film which is composed of an aluminum sheet and first protective films formed on the respective surfaces of the aluminum sheet and has a sprocket hole and a device hole, a predetermined conductor pattern which is formed on a surface of the base film, and a second protective film which is composed of aluminum and an electrically insulative film formed on a surface of the aluminum and is formed so as to cover the predetermined conductor pattern.

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Номер записи: 86

26-07-2012 дата публикации

Compliant insert for electronics assemblies

Номер: US20120188728A1

Автор: Nate B. Herse

Принадлежит: Raytheon Co

A compliant insert is provided to support electronic assemblies to mitigate the effects of external loading. The insert comprises a polymer material having a durometer of between 10 and 90 on the Shore A scale and a 3-D negative relief on the surface of the polymer material. The 3-D negative relief is the negative of the 3-D positive relief of a specified geometric design of an electronics assembly. The compliant insert is mated with an instance of the electronics assembly such that the 3-D negative relief of the polymer material engages the 3-D positive relief of the assembly's PCB and electronic components. The polymer material is compliant enough to absorb the vertical and lateral spacing tolerances of the electronic components and stiff enough to mitigate deflections under loading.

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Номер записи: 87

02-08-2012 дата публикации

Surge protector

Номер: US20120194956A1

Автор: Chi-Hsin Wang, Kun-Jung Chen

Принадлежит: Chi-Hsin Wang, Kun-Jung Chen

A surge protector includes a first surge suppression assembly comprising a first conductive layer comprising an arm, an extension distal to the arm and having toothed edges, and a substantially C-shaped member projecting out of the extension and having toothed edges, and a substantially circular member with toothed edges formed at an open end of the extension; a second conductive layer comprising an arm including a terminal, an extension being distal the arm, a first substantially C-shaped member having toothed edges, and a second substantially C-shaped member at an open end of the extension wherein the first substantially C-shaped member, the substantially C-shaped member, the second substantially C-shaped member, and the substantially circular member are arranged concentrically; and an overvoltage protection assembly interconnecting the arm and the terminal. The overvoltage protection assembly is electrically connected to the first surge suppression assembly.

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Номер записи: 88

09-08-2012 дата публикации

Filter Having Electrical Circuit Arrangement with Concentrated Elements in Multi-layer Substrates

Номер: US20120200372A1

Автор: Robert Ziegler

Принадлежит: Rohde and Schwarz GmbH and Co KG

An electrical circuit arrangement provides a substrate and at least two conductive surfaces. The substrate comprises at least one layer disposed between the conductive surfaces. The conductive surfaces form a capacitor and overlap in part and form an overlapping area. In the event of a displacement of the conductive surfaces relative to one another, the resulting overlapping area is largely constant up to a threshold value of the displacement.

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Номер записи: 89

09-08-2012 дата публикации

Modular connector for touch sensitive device

Номер: US20120200506A1

Автор: Gordon F. Taylor, Thomas J. Rebeschi

Принадлежит: 3M Innovative Properties Co

Apparatus for providing modular connection means to electrodes in a touch-sensitive device. The modular connections may include electronics allowing controlling electronics to individually address electrodes associated with driving electrodes and sensing signals occurring on electrodes.

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Номер записи: 90

09-08-2012 дата публикации

Electronic control device including interrupt wire

Номер: US20120200970A1

Автор: Hiroaki Nakamura, Ryoichi Shiraishi, Shigeki Nishiyama, Takahiko FURUTA, Toru Itabashi, Yuuki MIKAMI

Принадлежит: Denso Corp, Murata Manufacturing Co Ltd

An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

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Номер записи: 91

16-08-2012 дата публикации

Reprogrammable circuit board with alignment-insensitive support for multiple component contact types

Номер: US20120206889A1

Автор: Richard Norman

Принадлежит: Individual

The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to adapt to components with a wide variety of contact spacings and interconnection requirements, the use of releasable attachment means allows component placement to be modified as needed, the system identifies the contacts and the components to facilitate specifying the inter-component connections, and the system provides signal conditioning and retiming to minimize issues with signal integrity and signal skew.

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Номер записи: 92

16-08-2012 дата публикации

Circular interposers

Номер: US20120206892A1

Автор: Chris Ligtenberg, Erik James Shahoian

Принадлежит: Apple Inc

Non-rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment pin, wherein the pin aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

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Номер записи: 93

16-08-2012 дата публикации

Memory module and video camera

Номер: US20120210049A1

Автор: Isao Ozawa, Yasuyuki NAGAHARA

Принадлежит: Toshiba Corp

According to the embodiments, there are provided semiconductor memories that are mounted individually on two sides of a mounting board; a controller that is mounted either on an obverse side or a reverse side of the mounting board, and performs read and write control of the semiconductor memories; and a connector that is deviated in a lateral direction from the controller so as not to overlap the controller, is mounted either on the obverse side or the reverse side of the mounting board, and transfers a signal exchanged between the controller and outside.

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Номер записи: 94

23-08-2012 дата публикации

Wired circuit board and producing method thereof

Номер: US20120211263A1

Автор: Masaki Mizutani

Принадлежит: Nitto Denko Corp

A wired circuit board includes an insulating layer formed with an insulating opening extending through the insulating layer in a thickness direction, and a conductive pattern including a wire formed on the insulating layer and a terminal connected to the wire. The terminal includes a filling portion with which the insulating opening of the insulating layer is internally filled, a first projecting portion formed to continue to the filling portion and project from the filling portion on one side in the thickness direction, and a second projecting portion formed to continue to the filling portion and project from the filling portion on the other side in the thickness direction.

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Номер записи: 95

23-08-2012 дата публикации

Device mounting board and method of manufacturing the same, semiconductor module, and mobile device

Номер: US20120211269A1

Автор: Kouichi Saitou, Toshiya Shimizu

Принадлежит: Sanyo Electric Co Ltd

A device mounting board includes: an insulating resin layer; a wiring layer formed on one of the principal surfaces of the insulating resin layer; a protection layer covering the insulating resin layer and the wiring layer; a protruding electrode electrically connected to the wiring layer, the protruding electrode protruding from the wiring layer toward the insulating resin layer and penetrating through the insulating resin layer; a wiring-layer-side convex portion protruding from the wiring layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer; and a resin-layer-side convex portion protruding from the protection layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer.

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Номер записи: 96

23-08-2012 дата публикации

Microwave unit and method therefore

Номер: US20120211487A1

Автор: Bengt Madeberg, Leif Bergstedt

Принадлежит: Huawei Technologies Co Ltd

A microwave unit comprising a motherboard and a package adapted to be assembled automatically in, e.g., a Surface Mounted Device, SMD, machine is disclosed. The microwave unit preferably comprises a connecting component interconnecting the motherboard and the package, and operable to make the signal ways on a same level at both the motherboard and at the package. Furthermore, the microwave unit preferably comprises a micro-strip adapted soldering tag for soldering on two sides.

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Номер записи: 97

23-08-2012 дата публикации

Circuit card assemblies having connector-less perpendicular card-to-card interconnects

Номер: US20120212920A1

Автор: Gary Schreffler

Принадлежит: Lockheed Martin Corp

A coupled circuit card assemblies (CCCA) includes a first CCA (CCA1) having at least one board receiving side aperture including electrical conductor lined through-holes above and/or below the aperture. A second CCA (CCA 2 ) has surface electrical conductors proximate to one of its edges (“connectable edge”). The connectable edge of CCA2 penetrates into the board receiving side aperture of CCA1 to provide a perpendicular attachment including a plurality of reinforced joints including a low temperature flowable material that electrically connects respective surface conductors on at least one of the top side and bottom sides of CCA2 to respective electrical conductor lined through-holes on CCA1. The low temperature flowable material can be solder.

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Номер записи: 98

23-08-2012 дата публикации

Illumination device and display device

Номер: US20120212936A1

Автор: Shinnosuke Nozawa

Принадлежит: Sharp Corp

Provided is an illumination device in which it is possible to suppress a member mounted with a light source such as an LED from being displaced, and to make said member and the illumination device smaller. A backlight unit ( 49 ) is provided with a plurality of mounting substrates ( 11 ) having various shapes, wherein the shapes are formed in a manner such that if at least one mounting substrate ( 11 ) were to move in either of two intersecting directions in the plane of the substrate, the two neighboring mounting substrates would be shaped so as to come into contact with and restrict one of the other neighboring mounting substrates ( 11 ).

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Номер записи: 99

23-08-2012 дата публикации

Circuit board unit

Номер: US20120214321A1

Автор: Hiroshi Doumae, Sumio Kagimura

Принадлежит: Daikin Industries Ltd

A circuit board unit includes a printed circuit board and a terminal block mounted on the printed circuit board and connecting a power module and an electrical wire together. The terminal block includes a terminal connection part to be directly connected to the power module, and a wire connection part to be connected to the electrical wire. In the printed circuit board, a hole having an orthographic projection area larger than that of the terminal connection part as viewed in plane is formed. The terminal connection part is positioned below or above the hole of the printed circuit board.

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Номер записи: 100