Compound component for connection to circuit board - has contact leads on one side of integrated circuit bent twice and their ends soldered to metallised areas on film circuit substrate

The circuit component has two rows of parallel leads to be inserted into the module holes of the printed circuit board. The leads (4a) of one row consist of one row of contact wirres (4) projecting from one long side (3) of the plate-like case (1) of an IC. The leads of the other row consist of contact wires (9) attached to the rectangular, plate-shaped substrate (8) of a film circuit. The row of leads (46) of the IC opposite to those inserted into the circuit board is bent twice at right angles and the ends of the leads soldered to metallised areas of one edge (7) of the substrate (8).