ПЛАТА ПИТАНИЯ, ВСТРОЕННЫЙ СОЕДИНИТЕЛЬНЫЙ РАЗЪЕМ, УСТРОЙСТВО ОСВЕЩЕНИЯ, УСТРОЙСТВО ОТОБРАЖЕНИЯ И ТЕЛЕВИЗИОННЫЙ ПРИЕМНИК

... 1. Плата питания, содержащая схемную плату и встроенный соединительный разъем, обеспеченный на упомянутой схемной плате, на которой: ! упомянутый встроенный соединительный разъем располагается в непосредственной близости от краевого участка упомянутой схемной платы; ! упомянутый встроенный соединительный разъем включает в себя выходной контакт и корпус, который сделан из изоляционного материала, а также располагается таким образом, чтобы окружать, по меньшей мере, часть упомянутого выходного контакта; и ! упомянутый выходной контакт располагается в области упомянутого корпуса, дальше от краевого участка упомянутой схемной платы, обеспечивая таким образом секционированную схему расположения. ! 2. Плата питания по п.1, в которой часть упомянутого корпуса, которая находится ближе к краевому участку упомянутой схемной платы, и не включается в схему расположения упомянутого выходного контакта, имеет по существу блочную форму, обеспечиваемую непрерывно по существу по всей ширине упомянутого корпуса ...

ELEKTRISCHES, INSBESONDERE ELEKTRONISCHES, BERUEHRUNGSLOS ARBEITENDES SCHALTGERAET

ELEKTRISCHES GERÄT, INSBESONDERE SCHALT- UND STEUERGERÄT FÜR KRAFTFAHRZEUGE

Leiterplattenanordnung und Sensor

Leiterplattenanordnung mit mindestens zwei senkrecht zueinander stehenden Leiterplatten (2, 8), wobei eine erste Leiterplatte (2) an einer Seite (4) an einer Leiterplattenkante (3) erste Kontaktflächen (6) aufweist, wobei eine zweite Leiterplatte (8) auf einer Seite (4) zweite Kontaktflächen (10) aufweist, wobei die zweiten Kontaktflächen (10) der zweiten Leiterplatte (8) senkrecht liegend an den ersten Kontaktflächen (6) der ersten Leiterplatte (2) angeordnet sind und die ersten Kontaktflächen (6) der ersten Leiterplatte (2) mit den zweiten Kontaktflächen (10) der zweiten Leiterplatte (8) elektrisch mittels Lötmittel (5) verbunden sind, dadurch gekennzeichnet, dass die Kontaktflächen (6, 10) einer Leiterplatte (2, 8) entlang einer Verbindungsstelle (11) zur anderen Leiterplatte (8, 2) überstehend zu gegenüberliegenden Kontaktflächen (10, 6) der gegenüberliegenden Leiterplatte (8, 2) sind und mindestens die Kontaktflächen (6, 10) der gegenüberliegenden Leiterplatte (2, 8) sich in Richtung ...

ANORDNUNG UND VERFAHREN ZUM EINBAU EINER ELEKTRONISCHEN ANZEIGE

ANORDNUNG MIT GEDRUCKTER SCHALTUNGSPLATTE

Verfahren zum Befestigen eines Daumenradschalters auf einer Leiterplatte und elektronisches Handgerät mit einer solchen Anordnung

Verfahren zur Herstellung einer Leiterplattenbaugruppe für eine Steuereinheit

Ein Verfahren zur Herstellung einer Leiterplattenbaugruppe für eine Steuereinheit. Das Verfahren beinhaltet die Bereitstellung einer ersten und einer zweiten Leiterplatte, wobei die erste Leiterplatte eine Vielzahl von Kupferfüßen mit darin befindlichen Schlitzen aufweist, die zu einer Vielzahl von Stromlaschen der zweiten Leiterplatte korrespondieren. Die Stromlaschen werden sodann in die Schlitze geschoben und diese mit Kupfer überzogen. Zu diesem Zeitpunkt werden die Stromlaschen mit den Schlitzen verlötet, um eine elektrische Verbindung zwischen der ersten und der zweiten Leiterplatte herzustellen, welche die Übertragung von Strom zwischen Leiterplatten von mehr als 3 Ampere erlaubt.

TRANSISTOR MOUNTING APPARATUS

Printed polymer circuits and contacts

A conductive component for carrying electrical signals constructed from a molded polymer substrate and a conductive coating adhered to the substrate, the coating defining a continuous electrical pathway between at least two terminals. Preferably, molded plastic such as liquid crystal polymer is formed to make circuits having conductive ink adhered thereto in order to provide inexpensive and versatile printed circuit boards for carrying electrical traces and other components and to provide printed formed contacts. The conductive solderable inks can be adhered to the substrate, for example, via screen printing, brush spraying, dipping, masking, vacuum, plating or vacuum deposition with subsequent oven drying, reflowing in a vapor phase, post curing or plating.

Electronic machine with power electronics

ELECTRICAL LINK AND ELECTRICAL SYSTEM FOR A CONSTRUCTION UNIT IN ELECTRONIC EQUIPMENT

PROCEDURE FOR FASTENING A THUMB WHEEL SWITCH ON A PRINTED CIRCUIT BOARD AND ELECTRONIC HAND ATTACHMENT WITH SUCH AN ARRANGEMENT

ELECTRICAL FIELD EQUIPMENT AND EXTENSION MODULE FOR PUTTING INTO THAT ELECTRICAL FIELD EQUIPMENT

LIGHTWEIGHTY AUDIO SYSTEM FOR APPLICATIONS OF AUTOMOBILES AND EQUIVALENT PROCEDURE

Lighting device for an elongated lamp

Die Erfindung betrifft eine Leuchtenanordnung (1) für eine längliche Leuchte (100), wobei die Leuchtenanordnung (1) ein Leuchtmittel (2) zur Abstrahlung 5 von Licht, und ein Niedervolt-Betriebsgerät (3) zur Versorgung des Leuchtmittels (2) mit einer Versorgungsspannung aufweist, wobei das Betriebsgerät (3) eine Platine (4) aufweist, wobei die Platine (4) zwei flächige, sich im Wesentlichen parallel zu einer Erstreckungsebene der Platine (4) erstreckende Seiten (41, 42) und eine die zwei flächigen Seiten (41, 42) 10 verbindende umlaufende Stirnseite (43) aufweist, wobei das Leuchtmittel (2) auf Seiten der Stirnseite (43) der Platine (4) angeordnet ist.

TUNER UNIT, RECEIVER, ELECTRONIC APPARATUS

System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus

RECESSED CIRCUIT MODULE

Recessed Circuit Module A circuit module (10) having a row of connector pins (21) and being approximately 4mm. thick or less, and including and electrical circuit (22) connected to the connector pins (21). In prior art designs, it has not been possible to utilize a large substrate having good heat dissipation properties and, at the same time, include an attached electrical device, without exceeding the allowed maximum dimensions of the module. The present invention solves the problem by recessing and edge (17) of the substrate (11), depositing spaced-apart conductor films (26a and 26b) in the recess (16) that electrically connect with the electrical circuit (22), and soldering (31a and 31b) the electrical device (30) to the conductor films (26a and 26b). Principal uses for the invention include digital computers and similar complex electronic devices.

CONTROL AND SIGNALING DEVICE OR SIGNALING DEVICE WITH A LUMINOUS ELEMENT

The invention relates to a control and signaling device or a signaling device with a luminous element. Said device consists of a front element and a fastening adapter onto which functional elements can be snapped. The aim of the invention is to provide such a device at low costs and in a simple manner. To this end, only one electroluminescent diode (3) with a electroluminescent diode head (5) and connecting wires (4) is integrated in the functional element (2). Said electroluminescent diode head (5) is embedded and held in a receiver (6). Said electroluminescent diode (3) has an angle of reflection of 30-45 degree and a luminosity of at least 0.5 candela. An electronic circuit is arranged on strip conductors (11) that are located on the inner wall of one half (1) of a housing and that have been applied thereon by way of hot stamping.

RECESSED CIRCUIT MODULE

ELECTRICAL CONNECTOR AND SYSTEM FOR A COMPONENT IN AN ELECTRONIC DEVICE

The invention provides a printed circuit board (PCB) for use in an electronic device. The PCB comprises: a top side; a bottom side; an edge between the top side and the bottom side; a cavity from the top side to the bottom side; a region on the top side for mounting an electronic device; and a connector for receiving connections from the electronic device. In the PCB, the connector is located on either the bottom side or the edge of the side of the PCB. The electronic device can be a display module.

Electronic equipment and printed circuit board with contact strip.

Dargestellt und beschrieben ist ein elektronisches Gerät (1) mit einem Gehäuse (2, 3), mit einer Leiterplatte (4), mit einer in einer Öffnung (6) im Gehäuse (2, 3) angeordneten Buchse (7) zum Anschliessen eines korrespondierenden Steckers, wobei die Buchse (7) mindestens zwei Kontaktelemente (10) aufweist, deren erste Ende (11) zur Aufnahme je eines korrespondierenden Gegenkontaktelements des Steckers dienen und deren zweite Enden (12) mit der Leiterplatte (4) elektrisch leitend verbunden sind. Bei dem elektronischen Gerät ist dadurch mit geringem Aufwand eine sichere Befestigung der Buchse (7) im Gehäuse möglich, dass eine Steckerleiste (13) mit mindestens zwei Anschlussstiften (14) und einem die Anschlussstifte (14) haltenden Kontaktträger (15) an einer Stirnseite der Leiterplatte (4) angeordnet ist, dass die ersten Enden der Anschlussstifte (14) der Steckerleiste (13) jeweils mechanisch und elektrisch leitend mit den zweiten Enden (12) der Kontaktelemente (10) der Buchse (7) verbunden ...

Electronic equipment and printed circuit board with contact strip.

Dargestellt und beschrieben ist ein elektronisches Gerät (1) mit einem Gehäuse (2, 3), mit einer Leiterplatte (4), mit einer in einer Öffnung (6) im Gehäuse (2, 3) angeordneten Buchse (7) zum Anschliessen eines korrespondierenden Steckers, wobei die Buchse (7) mindestens zwei Kontaktelemente (10) aufweist, deren ersten Enden (11) zur Aufnahme je eines korrespondierenden Gegenkontaktelements des Steckers dienen und deren zweiten Enden (12) mit der Leiterplatte (4) elektrisch leitend verbunden sind,Bei dem elektronischen Gerät ist dadurch mit geringem Aufwand eine sichere Befestigung der Buchse (7) im Gehäuse möglich, dass eine Steckerleiste (13) mit mindestens zwei Anschlussstiften (14) und einem die Anschlussstifte (14) haltenden Kontaktträger (15) an einer Stirnseite der Leiterplatte (4) angeordnet ist, dass die ersten Enden der Anschlussstifte (14) der Steckerleiste (13) jeweils mechanisch und elektrisch leitend mit den zweiten Enden (12) der Kontaktelemente (10) der Buchse (7) verbunden ...

Active matrix display device with thin film transistors and picture indicator procedures.

Es werden eine Anzeigevorrichtung und ein Anzeigeverfahren bereitgestellt, mit welchen komprimierte Bilddaten, welche zu dekomprimieren sind, an eine Anzeigevorrichtung übertragen werden können, und zwar in einer Umgebung, in welcher die Übertragungskapazität nicht immer sichergestellt ist, wobei eine gute Bilddarstellung realisiert werden kann. Ein Beispiel der Anzeigevorrichtung ist eine aktive Matrixanzeigevorrichtung, welche unter Verwendung von Dünnfilmtransistoren (224) auf einem isolierenden Substrat (201) ausgebildet ist. Integriert auf dem isolierenden Substrat (201) der aktiven Matrixanzeigevorrichtung sind eine Schaltung, welche ein Bilddatensignal von einem externen System (230) über einen kabellosen Übertragungskanal empfängt und das Bilddatensignal verstärkt, eine Schaltung, welche die Bilddaten verarbeitet und eine Speicherschaltung (222), welche die verarbeiteten Bilddaten speichert.

CARTE A CIRCUITS IMPRIMES

L'INVENTION CONCERNE UNE CARTE A CIRCUITS IMPRIMES. DANS CETTE CARTE A CIRCUITS IMPRIMES COMPORTANT UNE CARACTERISATION VISIBLE, UTILISEE POUR SON IDENTIFICATION ET CONSTITUEE PAR DES CARACTERES NUMERIQUES ETOU ALPHANUMERIQUES DISPOSES LES UNS A LA SUITE DES AUTRES, IL EST PREVU UN DISPOSITIF D'AFFICHAGE 18 REGLABLE ELECTRIQUEMENT ET COMPORTANT UN PANNEAU D'AFFICHAGE A PLUSIEURS CHIFFRES 17, QUI EST INTEGRE DANS LA SUITE DE CARACTERES DE TELLE SORTE QUE LES EMPLACEMENTS D'AFFICHAGE DU PANNEAU D'AFFICHAGE CONSTITUENT AU MOINS UNE PARTIE DE LA CARACTERISATION 13. APPLICATION NOTAMMENT AUX CARTES A CIRCUITS IMPRIMES COMPORTANT UNE IDENTIFICATION LISIBLE.

Receiver or amplifier intended to be connected on the network

Light adapting device for automobile, has printed circuit with parts, where terminals in contact with fixation component are provided at one part and exuberance is provided at end of terminals to assure firm maintenance in component

Dispositif pour adapter un éclairage composé d'une ou plusieurs LED de quel que soit son type, grâce à un circuit imprimé en lieu et place de lampes à incandescence électrique sans culot tout en étant au moins aussi stable grâce aux exubérances qui se trouvent à l'extrémité de ces broches.

Apparatus and method for establishing a thermal link between a semiconductor package and the cooling plate and an electrical link between the conductors of the package, and a printed circuit board.

The dissipation of the heat is provided for by a dissipator 30 placed beneath a printed circuit board 15. The package 10 containing a component and having conductors 11 which emerge on several sides is positioned on the dissipator 20 so that the conductors 11 can be connected electrically to conductors 16 of the printed circuit, same surrounding two and preferably three sides of the package 10. The package is fixed to the dissipator by an elastic clip. Conduction between the package and the dissipator can be increased by a compressible, heat-conducting material.

BACKLIGHT UNIT HAVING AN IMPROVED ARRANGEMENT OF CONNECTORS AND CONNECTION LINES AND A PCB FOR THE SAME

A backlight unit and a PCB(Printed Circuit Board) for the same are provided to subdivide and downsize the PCB constituting the backlight unit, and achieve the individual driving of the subdivided PCB. A PCB(100) has LEDs(Light Emitting Diodes) mounted thereon, and connection pads electrically connected to the LEDs. A driving unit(300) is installed at one side surface of the PCB to drive the LEDs. Connectors(200) are joined to the connection pads of the PCB, wherein each of the connectors switches the connection direction into a direction of the driving unit. Connection lines(400) connect the connectors to the driving unit.

FLEXIBLE PRINTED CIRCUIT BOARD, AN ULTRASONIC PROBE, AND A METHOD FOR MANUFACTURING THE ULTRASONIC PROBE BY USING THE FLEXIBLE PRINTED CIRCUIT BOARD

PURPOSE: A flexible printed circuit board, an ultrasonic probe, and a method for manufacturing the ultrasonic probe are provided to suppress reflection of an ultrasonic wave due to a difference in an impedance between a DUT(Device Under Test) and an ultrasonic transducer by arranging a matching layer between the DUT and the ultrasonic transducer. CONSTITUTION: A flexible printed circuit board(10) includes plural wiring patterns(30). The wiring patterns are arranged to be elongated on a surface of an insulation substrate(20). The respective wiring patterns include a portion, where a distance between the wiring patterns becomes smaller along an elongation direction of the substrate. The distance between the wiring patterns is arranged to be decreased in a continuous or a step-wise manner. Marks are formed along the elongation direction of the substrate. The mark represents a length in the elongation direction of the substrate. © KIPO 2008 ...

POWER SUPPLY BOARD, BOARD CONNECTOR, LUMINAIRE, DISPLAY, AND TELEVISION RECEIVER

A board connector (18) is in the form which surrounds an output terminal (70) with a plastic housing (60). The output terminal (70) is disposed in a position biased to only the area away from an edge portion (17E) of a circuit board (17) in the housing (60). The output terminal (70) surrounded by the plastic housing (60) can suppress a leakage from the output terminal (70). In addition, the output terminal (70) is disposed in a position biased to only the area away from the edge portion (17E) of the circuit board (17) in the housing (60), and the distance between the edge portion (17E) of the circuit board (17) and the output terminal (70) is long, thereby resulting in a high anti-leakage effect. © KIPO & WIPO 2009 ...

METHOD TO IN THIS MANNER FIX AN ANTENNA IN A PANEL OF CIRCUIT AND PRODUCED ARTICLE

STRUCTURE FOR FIXING FLEXIBLE WIRING BOARD

A flexible wiring board (1) is provided with an insulating member (12) whereupon a conductor (11) is formed; a reinforcing plate (13) for reinforcing the insulating member (12) in the vicinity of a connecting terminal section (11a) of the flexible wiring board (1); and a locking member (14) for locking the flexible wiring board to a board (3) having a connector (2). The board (3) has an opening section (31) for having the locking member (14) fit in, in a state where the connecting terminal section (11a) is connected and fixed to the connector (2).

ILLUMINATION DEVICE AND PROJECTION DEVICE WITH SUCH AN ILLUMINATION DEVICE

The invention relates to an illumination device with a power electronic circuit module (13) und a light-emitting diode module (9) which is electrically connected via a flexible printed circuit board (1) to the power electronic circuit module (13). The invention also relates to a projection device with an illumination device.

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface moun configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

LIGHT SOURCE DEVICE AND DISPLAY DEVICE HAVING THE SAME

Disclosed are a light source device and a display device having the same. The light source device comprises light emitting modules comprising a light emitting device, a circuit termination module provided at a second end of the light emitting module, first and second connectors connected to a first end and the second end of the light emitting modules, respectively, and a fourth connector connected to the circuit termination module, and connected to the second connector of the light emitting module.

IMAGE PICKUP DEVICE INCORPORATING A POSITION DEFINING MEMBER

An image pickup device provided with an optical system for taking the image of an object, a photoelectric converting element for photoelectric conversion of the object image taken by the optical system, an electric signal outputting board for outputting an electrical signal from the photoelectric converting element, and a position defining member for defining the position of the optical system relative to the photoelectric converting element, wherein the electric signal outputting board is positioned between the photoelectric converting element and the position defining member.

Wiring substrate, droplet ejection head, printing apparatus, electronic device, and manufacturing method for wiring substrate

A wiring substrate includes a device substrate having a first surface, a sealing plate having a second surface superimposed on the first surface via an adhesive film and crossing the first surface, and wires set along the surfaces of the first surface, the adhesive film, and the second surface. The wiring substrate includes, between the wires adjacent to each other, a recessed section forming a recess with respect to a first bonding surface of the adhesive which is in contact with the first wire and a second bonding surface of the adhesive which is in contact with the second wire.

Image pickup apparatus

An image pickup apparatus includes: an image pickup device including a plurality of convex electrodes disposed on an opposing surface; and a wiring board including a plurality of first edge electrodes on a first main surface and a plurality of second edge electrodes on a second main surface, wherein the wiring board is disposed in an upright state on the opposing surface, the plurality of convex electrodes include first convex electrodes and second convex electrodes, the first convex electrodes are bonded to the first edge electrodes, the second convex electrodes are bonded to the second edge electrodes, and the wiring board is held between the first convex electrodes and the second convex electrodes.

Lightweight audio system for automotive applications and method

A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies ...

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

A lightweight radio/CD player for vehicular application is virtually fastenerless and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are ...

Electric power module and method for making same

An electric module comprising at least one conductive connecting bar supporting at least one electronic power component, the contacts of which are supported on a printed circuit board adjacent to the bar and on a portion of a power-conducting bar underneath the board, a heat-cured insulating material coating at least the adjacent edges of the board and the conductive bars in order to hold the top faces of the bar, the board and the portion of the bar in predetermined relative positions.

Substrate-level DC bus design to reduce module inductance

A DC bus for use in a power module includes a positive DC conductor bus plate parallel with a negative DC conductor bus plate. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

Connector coupled to board module

A board module ( 401 ) can include a board module surface ( 420 ) and a connector ( 403 ) coupled to the board module surface, wherein the connector is coupled to provide at least one signal ( 112, 114 ) to the board module. The connector can include a connector lead surface ( 419 ) substantially perpendicular to the board module surface ( 420 ); a first row of leads ( 430 ) substantially parallel to and a first distance ( 451 ) from the board module surface extending substantially perpendicular from the connector lead surface ( 419 ) and shaped to connect substantially perpendicular to the board module surface at a second distance ( 452 ) from the connector lead surface; and a second row of leads ( 440 ) substantially parallel to and a third distance ( 453 ) from the board module surface extending substantially perpendicular from the connector lead surface ( 419 ) and shaped to connect substantially perpendicular to the board module surface ( 420 ) at a fourth distance ( 454 ) from the ...

IC-tag-bearing wiring board and method of fabricating the same

To improve electronic part packaging efficiency without sacrificing the transmission distance of a radio IC tag, a recess is formed in the front side surface of a printed wiring board. An IC chip is placed in the recess so that the IC chip does not protrude from the front side surface, a first major surface 1 a and a second major surface of the printed wiring board. Antenna elements of an antenna are formed on the front side surface on the opposite sides, respectively, of the IC chip, and the antenna is connected to the IC chip. The antenna is a dipole antenna of a length equal to half the wavelength of radio waves to be radiated by the antenna.

Electrical connector and system for a component in an electronic device

The invention provides a connection system for use with a printed circuit board (PCB) in an electronic device. The PCB comprises: a top side; a bottom side; an edge between the top side and the bottom side; a cavity from the top side to the bottom side; a region on the top side for mounting an electronic device; and a connector for receiving connections from the electronic device. In the PCB, the connector is located on either the bottom side or the edge of the side of the PCB. The electronic device can be a display module.

Housing of LED light source comprising electrical connector

An electrical conductive covering structure of an illuminating device (8) includes a substrate (81) and a plurality of light-emitting elements (82). The electrical conductive covering structure includes an electrical conductive circuit (10), an electrical connector (20), a transparent body (30), and a lamp cover (40). The electrical conductive circuit (10) is arranged on a surface of the substrate (81) and electrically connected to the light-emitting elements (82). The electrical connector (20) is fixed to the substrate (81) and electrically connected to the electrical conductive circuit (10). The transparent body (30) is over-molded outside the electrical conductive circuit (10) and the electrical connector (20). The lamp cover (40) is over-molded outside the electrical connector (20) and the transparent body (30). With this structure, the influence of humidity and moisture on the illuminating device (8) can be minimized, thereby increasing its anti-oxidant property and lifetime.

METHOD, SYSTEM, AND APPARATUS FOR FINELY PITCHED HIGH SPEED CONNECTOR ATTACHMENT

プリント配線基板及びコネクタ、プリント配線基板の製造方法

ПЛАТА ПИТАНИЯ, ВСТРОЕННЫЙ СОЕДИНИТЕЛЬНЫЙ РАЗЪЕМ, УСТРОЙСТВО ОСВЕЩЕНИЯ, УСТРОЙСТВО ОТОБРАЖЕНИЯ И ТЕЛЕВИЗИОННЫЙ ПРИЕМНИК

Встроенный соединительный разъем (18) располагается в непосредственной близости от краевого участка схемной платы (17) и включает в себя выходной контакт (70), который окружен корпусом (60) из синтетической смолы. Выходной контакт (70) располагается в области корпуса (60) вдали от краевого участка (17Е) схемной платы (17) для того, чтобы обеспечивать секционированную схему расположения. Кроме того, выходной контакт (70) располагается в ограниченной области корпуса (60), дальше от краевого участка (17Е) схемной платы (17), что увеличивает расстояние между выходным контактом (70) и краевым участком (17Е) схемной платы (17). Технический результат - предотвращение возникновения утечки на выходном контакте, располагаемом в непосредственной близости от краевого участка схемной платы. 5 н. и 14 з.п. ф-лы, 39 ил.

КОМПОНОВОЧНЫЙ УЗЕЛ ГНЕЗДА ДЛЯ НАУШНИКОВ И ЭЛЕКТРОННОЕ ОБОРУДОВАНИЕ

... 1. Компоновочный узел гнезда для наушников, отличающийся тем, что содержит: гнездо для наушников и устройство электромагнитного экрана;при этом гнездо для наушников электрически соединено с монтажной платой в электронном оборудовании; ипричем устройство электромагнитного экрана располагается на внешней границе гнезда для наушников.2. Компоновочный узел гнезда для наушников по п. 1, отличающийся тем, что контакты гнезда для наушников электрически соединены с проводящей дорожкой на монтажной плате через точки пайки;при этом устройство электромагнитного экрана является электромагнитным экранирующим кожухом, который накрывает внешнюю границу гнезда для наушников и точек пайки гнезда для наушников на монтажной плате и который заземлен через монтажную плату.3. Компоновочный узел гнезда для наушников по п. 1, отличающийся тем, что дополнительно содержит соединитель;при этом контакты гнезда для наушников электрически соединены с проводящей дорожкой на монтажной плате через соединитель;причем устройство ...

Bauteilanordnung

Es wird eine Bauteilanordnung mit einem elektronischen Bauteil (10) mit wenigstens einem elektrischen Anschlusspin (16); einer Leiterplatte (12) mit wenigstens einer elektrischen Kontaktfläche (14), mit welcher der Anschlusspin (16) des Bauteils (10) in elektrisch leitendem Kontakt steht; und einer Befestigungsvorrichtung zum Sichern des elektrisch leitenden Kontakts zwischen dem Anschlusspin (16) und der Kontaktfläche (14) vorgesehen, bei welchem der Anschlusspin (16) in seinem Endbereich (18) im Wesentlichen parallel zur Leiterplatte (12) verlaufend ausgebildet ist; die Kontaktfläche (14) im Randbereich der Leiterplatte (12) angeordnet ist und die Befestigungsvorrichtung eine auf den Rand der Leiterplatte (12) aufschiebbare Klemme (20) aufweist, die einen ersten Abschnitt (22) auf der der Kontaktfläche (14) abgewandten Seite der Leiterplatte (12) und einen zweiten Abschnitt (24) auf der der Kontaktfläche (14) zugewandten Seite der Leiterplatte aufweist, welche die Leiterplatte (12), die ...

Overvoltage protection unit for use in switch box and power socket-insert, has circuit board with two thermal fuses and two varistors where circuit board has through-hole or recess at periphery

The overvoltage protection unit (1) has a circuit board (2) with two thermal fuses (3,4) and two varistors (5,6). The overvoltage protection unit has an acoustic warning element and a gas conductor (8). The circuit board has a through-hole or a recess at the periphery. The two varistors and the two thermal fuses are provided on the circuit board in contactable vicinity.

Compound component for connection to circuit board - has contact leads on one side of integrated circuit bent twice and their ends soldered to metallised areas on film circuit substrate

The circuit component has two rows of parallel leads to be inserted into the module holes of the printed circuit board. The leads (4a) of one row consist of one row of contact wirres (4) projecting from one long side (3) of the plate-like case (1) of an IC. The leads of the other row consist of contact wires (9) attached to the rectangular, plate-shaped substrate (8) of a film circuit. The row of leads (46) of the IC opposite to those inserted into the circuit board is bent twice at right angles and the ends of the leads soldered to metallised areas of one edge (7) of the substrate (8).

Printed circuit board composite, has coupling circuit boards passing through corresponding inserted openings and corresponding female connector, where printed circuit boards form planes parallel to each other

The composite (100) has coupling circuit boards (30a, 30b) that are arranged perpendicular to a printed circuit board (10). The coupling circuit boards are electrically coupled to pins of pin connectors (40) by corresponding female connectors (21) of another printed circuit board (20), respectively. The coupling circuit boards are passed through corresponding inserted openings in the latter printed circuit board and another female connector (32) of the coupling circuit boards. The printed circuit boards form planes parallel to each other. An independent claim is also included for a method for assembly of a printed circuit board composite.

Integrated circuit modules connection method involves connecting interlocking edge, by aligning teeth and recesses of edge of integrated circuit with adjacent edge

The method involves connecting the interlocking edge (106) of an integrated circuit module having teeth and recesses respectively, by aligning edge with adjacent circuit module (108), to allow communication between integrated circuit elements in modules.

Optical transceiver for optical communication system

The transceiver includes an optical transceiver unit, a terminal frame (103), and a cast or moulded package (105). The transceiver unit has an infrared light transmitting diode and an infrared converting photodiode receiver. The terminal frame (103) has a number of terminal leads to which the optical transceiver unit is fixed and coupled. The housing is transparent to the light emitted by the diode and is made of MG-18 Hysol. The connection points extend from the package and are dependent on the defined configuration of the terminal frame.

Türaußengriff, insbesondere für Fahrzeuge sowie Verfahren zu dessen Herstellung

Die Erfindung betrifft einen Türaußengriff insbesondere für Fahrzeuge sowie ein Verfahren zu dessen Herstellung. Der Türaußengriff weist eine bewegliche Handhabe in Form eines zumindest bereichsweise hohlen Gehäuses auf, in welchem elektronische Bauteile aufnehmbar sind. Des Weiteren ist eine Leiterplatte vorgesehen, welche zumindest teilweise zur Aufnahme der elektronischen Bauteile dient. Außerdem ist in der Handhabe ein Bauelement vorgesehen, welches an einer vordefinierten Stelle in der Handhabe anzuordnen ist. Die Erfindung schlägt nun vor, die Leiterplatte starr und plan auszubilden und einen separaten Halter vorzusehen. Dieser Halter trägt das Hallelement und haltert es im Inneren der Handhabe an seiner vordefinierten Position. Die Position ist dabei von der Leiterplatte beabstandet.

Signal filter using ceramic resonators - each held between sides of notch in circuit board at its neutral points

The filter uses ceramic resonators (1..4), each fitting into a rectangular notch (6) formed in one edge of a circuit board (5). The individual resonators (1..4) are held at their resonation neutral points between the opposing sides if the notch (6) either directly, or via V-shaped projections (7) extending into the notch (6) from each side. A number of circuit paths (8) are formed on the surface of the circuit board (5), with the electrode layers of each resonator (1..4) coupled to the ends of respective circuit paths (8) extending up to the side edges of the notches (6) where these contact the resonator (1..4). Pref. the other end of each circuit path (8) widens out to form a terminal connection point (9,9',9") and the conductor paths (8) may be formed by a thin-film or printed circuit technique.

Leuchten

Assembled printed circuit board and method for the manufacture thereof, as well as for desoldering components

Transistor mounting apparatus

Connector break-off locator tab

Cooling Power Electronics in an Electric Machine

An electric motor or generator assembly comprises an electric machine assembly 1 including a housing 2, an electric machine 6 housed within the housing, and a power electronics assembly 12 including one or more solid state power switching devices 18 for switching the electric current supplied to or drawn from the electric machine. The electric machine 6 is electrically connected to a plurality of electrical connections 24 that extend through the housing 2 for making external electrical connection to the electric machine, and the power electronics assembly 12 including a circuit board 14 on a first side 15 of which the solid state power switching devices 18 are mounted, the second side 16 of which is joined to an external portion 10 of the housing 2 so that the housing acts as a heat sink for the solid state power switching devices 18. The switching devices 18 are mounted in a peripheral portion of the circuit board 14 and the plurality of electrical connections 24 are electrically connected ...

PRINTED CIRCUITS AND METHODS THEIR MANUFACTURE

EDGE SOLDERING OF ELECTRONIC COMPONENTS

Arrangements of electrochemical cells

ELEKTRONISCHES GERÄT UND LEITERPLATTE MIT STECKERLEISTE

The electronic device (1) has a plug connector with two connector pins and a contact holder holding the connector pins. The plug connector is arranged at a front side of a printed circuit board (4). A connector pin is arranged above and below the printed circuit board so that a plug socket is arranged with the plug connector symmetric to the center plane of the printed circuit board. An independent claim is included for a printed circuit board with plug connector.

ELEKTRONISCHES GERÄT UND LEITERPLATTE MIT STECKERLEISTE

The electronic device (1) has a plug connector with two connector pins and a contact holder holding the connector pins. The plug connector is arranged at a front side of a printed circuit board (4). A connector pin is arranged above and below the printed circuit board so that a plug socket is arranged with the plug connector symmetric to the center plane of the printed circuit board. An independent claim is included for a printed circuit board with plug connector.

COMMAND AND MELDEGERÄT OR MELDEGERÄT WITH A LEUCHTELEMENT

Edge interface electrical connectors

METHODS AND APPARATUSES FOR THERMAL DISSIPATION

A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.

FLEXIBLE PRINTED CIRCUIT WIRING BOARD

ELECTRONIC CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME This is directed to an electronic circuit device using a flexible printed wiring board having a conductive foil formed on the surfaces of a flexible base material such as phenol resin or the like, wherein a peripheral edge strip is formed on the periphery of the flexible base material. An electronic part is mounted and connected to the circuit conductive foil. Since the flexible base material is extremely thin and flexible, the electronic circuit device can be constructed smaller and thinner.

PHOTOFLASH UNIT WITH CIRCUIT BOARD RADIATION SWITCHES FOR SELECTIVE PAIRING OF LAMPS

FLEXIBLE PRINTED CIRCUIT WIRING BOARD

RADIO PAGER

A radio pager of the present invention includes battery terminals each having an inductance component. The pager therefore reduces the fall of antenna efficiency as far as possible without resorting to any extra part. In addition, a coin type battery is located in the vicinity of short bars included in the pager so as to prevent the antenna efficiency from decreasing.

Tape adhesion device and tape adhesion method

Disclosed are a tape adhesion device and tape adhesion method that are able to increase productivity and efficiently perform a tape-peeling operation while eliminating wastage of conductive tape. In the tape adhesion method, which severs a tape member (4) into fragmented conductive tape (4b*) and adheres the fragmented conductive tape (4b*) to a plurality of adhesion portions formed at the side edges (20a) of a substrate (20), the following steps are repeatedly executed: an adhesion step wherein fragmented conductive tape (4b*) is adhered to adhesion portions of a first pressed position (P1); and a moving step wherein, while integrally moving a pressure bonding head (15) and a peeling unit (17) relatively with respect to the substrate (20), the pressure bonding head (15) is positioned at the adhesion portions of a second pressure bonding position (P2) by means of driving a tape feed mechanism and performing a feed operation of the tape member (4), and a separator (4a) is peeled from the ...

Lightweight audio system for automotive applications and method

Method for contacting lighting device, tool for performing the method and connection element for attachment on lighting device

The invention relates to a method serving to bond a lighting device, wherein the lighting device has a circuit board which is covered by a sealing compound layer and can be separated at a separating point into two lighting device sections and each of the lighting device sections each has at least one electrical contact adjacent to the separating point; wherein the method comprises at least the following steps: removing of at least the sealing compound layer on both sides of the separating point beyond the adjacent contacts of the lighting device sections so that the contacts remain covered by a thinner, remaining sealing compound layer; separating the lighting device on the separating point; ; fastening a connection element at least on the remaining sealing compound layer of at least one of the lighting device sections, wherein the connection element has at least one contacting element, which contacts a respective contact covered by the remaining sealing compound layer after separation ...

SUPPORT DE VOYANT LUMINEUX SUR CIRCUIT IMPRIME

SUPPORT DE VOYANT LUMINEUX COMPORTANT UN CORPS ISOLANT ALLONGE AYANT UNE FACE AVANT ET UNE FACE ARRIERE SENSIBLEMENT PERPENDICULAIRES A SA DIMENSION LONGITUDINALE ET FORMANT, AU NIVEAU DE SA FACE AVANT, DES MACHOIRES DESTINEES A L'INSERTION DU VOYANT, UNE SURFACE D'APPUI A L'INTERIEUR DUDIT CORPS COOPERANT AVEC LA SURFACE ARRIERE DU VOYANT, DES TROUS DE PASSAGE DES FILS DE CELUI-CI MENAGES A TRAVERS LEDIT CORPS ET DES MOYENS DE FIXATION A UNE CARTE DE CIRCUIT IMPRIME, CARACTERISE EN CE QUE LEDIT CORPS FORME UNE SURFACE DE REFERENCE 9 PERPENDICULAIRE A LA FACE ARRIERE 14 ET RACCORDEE A CELLE-CI PAR UNE SURFACE RENTRANTE 6, 7 AGENCEE POUR DEGAGER UNE PORTION DESDITS FILS ET CONFORMEE POUR QUE LE RABATTEMENT DUDIT CORPS D'UNE PREMIERE POSITION OU SA FACE ARRIERE 14 EST EN APPUI SUR LA CARTE ET JOUE LE ROLE D'ENTRETOISE DEFINISSANT UNE DISTANCE PREDETERMINEE ENTRE LA SURFACE ARRIERE DU VOYANT ET LA SURFACE DU CIRCUIT IMPRIME EN VUE DE LA SOUDURE DES FILS, A UNE SECONDE POSITION OU LADITE SURFACE ...

Together for electronic devices of order and manufactoring process for the setting in Óoeuvre of this unit.

Method for placing components within structures for energy conversion and application of said method for the production of power supplies and choppers.

MODULATE OPTICAL

BOITIER POUR COMPOSANT ELECTRONIQUE OU ELECTROMECANIQUE POUR CIRCUIT IMPRIME

COMPOSANT ET NOTAMMENT COMPTEUR ELECTROMECANIQUE CONCU POUR UN MONTAGE RAPIDE SUR CIRCUIT IMPRIME. SELON L'INVENTION, LE BOITIER13 COMPORTE DES GRIFFES20 SUSCEPTIBLES D'ETRE INTRODUITES DANS DES TROUS DU CIRCUIT IMPRIME, TANDIS QUE LES FILS D'ALIMENTATION16 PRESENTENT UNE RIGIDITE SUFFISANTE POUR ASSURER L'IMMOBILISATION DU COMPOSANT SUR LE CIRCUIT IMPRIME APRES ACCROCHAGE DE LA GRIFFE ET SOUDURE DU FIL AUDIT CIRCUIT IMPRIME. APPLICATION AU COMPTEUR ELECTROMECANIQUE D'UNE MACHINE A PHOTOCOPIER.

PROCEDE DE CONNEXION D'UN PREMIER CIRCUIT IMPRIME A UN DEUXIEME CIRCUIT IMPRIME ET CIRCUITS IMPRIMES PERMETTANT LA MISE EN OEUVRE D'UN TEL PROCEDE ET AINSI INTERCONNECTES

L'INVENTION CONCERNE UN PROCEDE DE CONNEXION D'UN PREMIER CIRCUIT IMPRIME A UN DEUXIEME CIRCUIT IMPRIME II. LES PREMIER I ET DEUXIEME II CIRCUITS IMPRIMES COMPORTENT RESPECTIVEMENT UNE PLURALITE DE ZONES DE CONNEXION ZCI ET DE BORNES DE CONNEXION BCI, DISTRIBUEES SELON DES PAS SEMBLABLES. CONFORMEMENT A L'INVENTION, LE PROCEDE CONSISTE A FORMER SUR LE DEUXIEME CIRCUIT IMPRIME II, AU NIVEAU D'UNE PLURALITE DE BORNES DE CONNEXION BCI AU MOINS UN BORD DE CONNEXION BCO. LES ZONES DE CONNEXION ZCI DU PREMIER CIRCUIT IMPRIME I SONT APPLIQUEES EN CORRESPONDANCE AVEC CERTAINES BORNES DE CONNEXION BCI DU CIRCUIT IMPRIME II ET LES ZONES DE CONNEXION ZCI ET LES BORNES DE CONNEXION BCI CORRESPONDANTES SONT ALORS SOUDEES. APPLICATION A LA REALISATION DE CIRCUITS ELECTRONIQUES, DANS LESQUELS UN OU PLUSIEURS CIRCUITS IMPRIMES CONSTITUANT LE PREMIER CIRCUIT IMPRIME I SONT CONNECTES A UN DEUXIEME CIRCUIT IMPRIME II CONSTITUANT LA CARTE MERE OU LA CARTE DE BASE DU CIRCUIT.

Package for an electronic or electromechanical component for printed circuit

Process for inserting components at heart of energy converter structure - using parallel controlled switching arrays, with associated capacitors and diode, connected between side tracks on either side of board

Procédé pour implanter des composants au sein d'une structure de conversion d'énergie comprenant un étage d'entrée relié à une source d'alimentation, un étage de sortie et un nombre prédéterminé de bras de commutation connectés en parallèle sur ladite source d'alimentation et comportant chacun plusieurs cellules de commutation (69a, 69b, 69c) reliées en parallèle et comprenant chacune une diode (Da, Db, Dc) et un interrupteur commandé (74a, 74b, 74c) reliés en série, chaque cellule de commutation (69a, 69b, 69c) étant en outre munie d'un condensateur (Ca, Cb, Cc) connecté en parallèle sur ladite cellule, caractérisé en ce que chaque cellule de commutation (69a, 69b, 69c) est reliée audit étage de sortie à partir d'un élément conducteur de liaison (75a, 75b, 75c) reliant chaque interrupteur commandé (74a, 74b, 74c) à la diode (Da, Db, Dc) qui lui est associée et de moyens de liaison indépendants (73a, 73b, 73c) pour relier ledit élément conducteur de liaison audit étage de sortie. Utilisation ...

METHOD OF MAKING MULTILAYER CIRCUIT SYSTEM

Device for coupling and connecting, to an electrical appliance, an electronic power module

Identification for PCB

Electro=optical digital display mounting - has circuit board carrying integrated control circuit at right angles to LED display board

Method for connecting a first printed circuit to a second printed circuit, and printed circuits which enable such a method to be implemented and which are interconnected in this way

Optical pickup actuator

PCB WITH COMPLEX-WAFER FOR REFRIGERATOR

MOBILE TERMINAL WHICH INSTALLS AN ANTENNA ON THE EDGE OF A CIRCUIT BOARD

PURPOSE: A mobile terminal is provided to efficiently prevent the increase of the thickness due to an antenna by contacting the antenna with the edge of a circuit board instead of component mounting sides. CONSTITUTION: A circuit board(401) is built in a terminal housing. A circuit board comprises component mounting sides(401a) and edge sides(401b). A contact pad(410,411) is formed on the edge side. A radiator(420) made of conductive metal is formed on an antenna(400). A feeder in contact with the contact pad is positioned on the rear of the antenna. COPYRIGHT KIPO 2011 ...

Connector

A connector includes a first connector and a second connector configured to engage with the first connector to establish electrical connection, wherein the first connector includes a first contact terminal, and the second connector includes: a second contact terminal configured to come in contact with the first contact terminal; a switch part connected to the second contact terminal and including a fixed part and a movable part; and a movable member capable of pushing the movable part toward the fixed part, wherein the movable member is pushed by the first connector when the first connector engages with the second connector, and the movable member pushes the movable part toward the fixed part to bring the movable part in contact with the fixed part.

Card edge connector

A card edge connector for mating to a flex circuit includes a housing having a front, a top and a bottom. The housing has a slot between the top and the bottom. The slot is open at the front. The slot is configured to receive a flex circuit therein. Upper contacts are held by the housing between the slot and the top. The upper contacts are exposed in the slot for mating with an upper surface of the flex circuit. Lower contacts are held by the housing between the slot and the bottom. The lower contacts are exposed in the slot for mating with a lower surface of the flex circuit.

Lightweight electronic system for automotive applications and method

A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.

Connector, PCB for LED Light Bar and LED Light Bar

The present invention discloses a connector, PCB for LED Light Bar and LED Light Bar. The connector comprises the weld legs and stitches fixed to the shell of the connector, and the weld legs are arranged on the side of the connector and are higher than the bottom surface. A PCB for LED light bar is provided with the installing groove for installing the connector. Because the present invention arranges the weld legs of the connector on positions which are higher than the bottom surface of the shell and arranges the installing groove corresponding to the bottom shape of the connector on the PCB, the bottom of the connector can be arranged in the installing groove, thus the protrusion height of the connector in the LED light bar is reduced. The LGP is not cut again when installing the LGP, thereby reducing the processing step. In addition, the depth that the connector sinks into the installing groove is rationally designed, so that the sufficient safe distance is remained when the LGP is heated and expended, thereby avoiding the LGP bumping into and damaging the connector.

Wiring board, manufacturing method for wiring board, and image pickup apparatus

A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.

Lightweight audio system for automotive applications and method

A lightweight radio/Audio player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Lightweight audio system for automotive applications and method

A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Structure of a fob key for increasing the operating force of a button (as amended)

A fob key for a vehicle. The fob key for a vehicle includes a housing accommodating a printed circuit board mounted with touch switches and electrical parts, buttons arranged on the housing and able to move toward touch switches, and a button-supporting structure elastically supporting buttons in a direction far away from touch switches.

Button Structure

A button structure applied in an electronic device includes at least a flexible connector connected to a circuit board of the electronic device and a pressing portion located at a terminal of the at least a flexible connector. When a user presses the pressing portion, the pressing portion applies an acting force on the at least a flexible connector and the at least a flexible connector generates an electrical signal to the circuit board.

Cable connector assembly

A cable connector assembly includes: an electrical connector; a circuit board electrically connected to the electrical connector and including a first row of pads and a second row of pads located behind the first row of pads and separated from the first row of pads; and a cable electrically connected to the circuit board and including plural coaxial wires each including a center conductor and a shielding layer and plural single core wires each comprising a conductor; wherein the center conductors of the coaxial wires are soldered to the first row of pads of the circuit board, and the conductors of the single core wires and the shielding layers of the coaxial wires are soldered to the second row of pads of the circuit board.

CIRCUIT BOARD AND OPTICAL MODULE HAVING SUCH CIRCUIT BOARD

A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board. 1. A circuit board , comprising:an upper surface;a lower surface;a first end surface connecting the upper surface and lower surface; anda heat dissipation block,whereinthe first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot,the heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board, andthe inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.2. The circuit board of claim 1 , wherein a protruding portion is arranged on at least one interior wall of the open slot claim 1 , the heat dissipation block has a groove that matches the protruding portion claim 1 , and the protruding portion forms the stop structure.3. The circuit board of claim 2 , wherein the protruding portion of the open slot and the groove of the heat dissipation block are located below the first surface of the heat dissipation block.4. The circuit board of claim 3 , wherein the protruding portion connects two side walls of the open slot.5. ...

PIN SIDE EDGE MOUNT CONNECTOR AND SYSTEMS AND METHODS THEREOF

A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole. 1. A printed circuit board (PCB) device , comprising:one or more insulating layers and one or more conducting layers arranged to form a layer stack, a plane of the one or more insulating layers being parallel to a plane of the one or more conducting layers;one or more conducting tracks; andone or more blind holes disposed in a side edge of the layer stack, each of the one or more blind holes having a depth that extends from the side edge into the layer stack in a direction parallel to the plane of the one or more insulating layers and the plane of the one or more conducting layers, the one or more blind holes being plated with a conducting material,wherein each of the one or more blind holes is configured to receive a pin.2. The device of claim 1 , wherein the conducting tracks electrically couple the one or more blind holes to components on the PCB.3. The device of claim 2 , wherein each of the one or more conducting tracks starts and terminates in an interior layer of the layer stack.4. The device of claim 1 , further comprising:the pin having a compliant portion, whereinthe one or more blind holes has a diameter and a depth,the pin has a length, and the compliant portion of the pin has a width,the length of the pin is no greater than the depth of the one or more blind holes,the diameter of the one or more blind holes is no greater than the width of the compliant portion of the pin,the compliant portion is configured to deform when the pin is inserted into the blind hole, andthe compliant portion is configured to retain the pin ...

Circuit board with wire conductive pads and method for fixing the wire conductive pads to the circuit board

A circuit board with wire conductive pads is provided for insertion of wires, and includes: a circuit board and a wire conductive pad. The wire conductive pad includes a main body in the form of a hollow column and an elastic locking piece extending from the main body. The main body includes a peripheral wall defining an insertion space. The elastic locking piece is inserted from the peripheral wall into the insertion space in an inclined manner to press towards the peripheral wall. Wires are inserted into the insertion space and clamped against the peripheral wall by the elastic piece, so that the wires can be prevented from falling off in a reverse direction, and thus can be connected to the circuit board in a more quick and stable manner.

Stack structure of high frequency printed circuit board

A stack structure of a high frequency printed circuit, mainly includes a transmission conductor pin group in a form of single row, where each signal pair and each transmission pair of the transmission conductor pin group respectively have a through hole portion thereon, and the inner layer of the circuit board has a trace portion in electric connection with the through hole portion, allowing each four terminals to be formed into one group. Utilizing the clever arrangement of the through hole portions and trace portions separates each terminal properly, thereby increasing the property of transmitted signals, and, at the same time, reducing noise interferences such as EMI and RFI.

Shunt Resistor Module

A shunt resistor module, which includes a shunt resistor having a resistor unit having a predetermined resistance, plate-shaped terminal units respectively configured to extend at both sides of the resistor unit, and a voltage measurement lead pin configured to protrude perpendicular to the terminal unit and having an end portion bent to be parallel to the terminal unit, and a PCB substrate having an assembly guide portion formed to be cut inward by a predetermined depth from an outermost side thereof. The voltage measurement lead pin is fit into the assembly guide portion so that the resistor unit and the terminal unit are placed on a front surface of the PCB substrate and the end portion of the voltage measurement lead pin is caught at a rear surface of the PCB substrate. 1. A shunt resistor module , comprising:a shunt resistor; anda printed circuit board (PCB) substrate, wherein the shunt resistor is configured to be directly fixed to the PCB substrate,wherein the shunt resistor includes:a resistor unit having a predetermined resistance;first and second plate-shaped terminal units extending from respective sides of the resistor unit; andfirst and second voltage measurement lead pins including respective perpendicular portions protruding perpendicular to the first and second terminal units, respectively, and respective first bent portions parallel to the first and second terminal units, respectively,wherein the PCB substrate includes an assembly guide portion including first and second cuts cut into the PCB substrate from an outermost side of the PCB substrate by a predetermined depth, each cut having a cut width corresponding to a thickness of a corresponding voltage measurement lead pin, andwherein the first and second voltage measurement lead pins are adapted to fit into the first and second cuts of the assembly guide portion so that the resistor unit and the first and second terminal units are positioned on a front surface of the PCB substrate and the end ...

SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant. 1. An electronic assembly , comprising:a structure including a substrate and a protection layer encapsulating a first surface of the substrate, the protection layer and the substrate defining an accommodating space; anda semiconductor device package partially inserted into the accommodating space.2. The electronic assembly of claim 1 , wherein the substrate further includes a second surface claim 1 , and an area of the first surface is larger than an area of the second surface.3. The electronic assembly of claim 2 , wherein the semiconductor device package includes a first surface and a second surface claim 2 , an area of second surface is greater than an area of the first surface claim 2 , and the first surface of the semiconductor device package is inserted into the accommodating space and faces the first surface of the substrate.4. The electronic assembly of claim 3 , wherein the second surface of the semiconductor device package is substantially vertical with respect to the first surface of the substrate.5. The electronic assembly of claim 3 , wherein the second surface of the semiconductor device package includes a first portion outside the accommodating space and a second portion within the accommodating space claim 3 , and an area of the first portion is larger than an area of the second portion.6. The electronic assembly of claim 3 , wherein the semiconductor device package includes a carrier and an electronic component disposed on the carrier claim 3 , the electronic component is electrically connected to the structure claim 3 , and ...

SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant. 1. A semiconductor device package , comprising:a carrier;an electronic component disposed on a surface of the carrier;a connection element disposed on the surface and adjacent to an edge of the carrier; andan encapsulant disposed on the surface of the carrier, wherein a portion of the connection element is exposed from an upper surface and an edge of the encapsulant.2. The semiconductor device package of claim 1 , wherein the encapsulant includes a thicker portion encapsulating the electronic component and adjacent to a first side of the connection element claim 1 , and a thinner portion between a second side of the connection element and the edge of the carrier.3. The semiconductor device package of claim 1 , wherein the portion of connection element protrudes out from the upper surface of the encapsulant.4. The semiconductor device package of claim 1 , wherein the portion of connection element protrudes out from the edge of the encapsulant.5. The semiconductor device package of claim 1 , wherein the connection element comprises a first connection structure adjacent to the surface of the carrier claim 1 , and a second connection structure disposed on the first connection structure.6. The semiconductor device package of claim 5 , wherein the first connection structure and the second connection structure each have a curve profile.7. The semiconductor device package of claim 6 , wherein the first connection structure and the second connection structure each have a maximum width measured along a direction parallel to the surface of the carrier ...

Connector end assemblies

Embodiments disclosed herein include modular electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first connector module having a notch on a first end and a plurality of surface mount technology (SMT) pads on a second end. In an embodiment, the electronics package further comprises a second connector module having a keyed connector on a first end and a plurality of SMT pads on a second end. In an embodiment, the electronics package further comprises a system in package (SIP) module between the first connector and the second connector, the component module electrically and mechanically coupled to the SMT pads of the first connector and the SMT pads of the second connector.

Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.

AUDIO AND VIDEO REPRODUCTION APPARATUS HAVING MAIN BOARD ON WHICH SURFACE MOUNT TYPE CONNECTORS ARE MOUNTED

Provided is a video and audio reproduction apparatus including a display unit; a speaker unit; a main board; and a power supply unit, and the main board includes a printed circuit board; a first connector area which is formed on a front side of the printed circuit board; a second connector area which is formed on the front side of the printed circuit board; and a main chip which is surface-mounted on a back side of the printed circuit board. 1. A video and audio reproduction apparatus , comprising:a single multi-layered connection board comprising a front surface and a rear surface disposed opposite from the front surface;a plurality of connectors divided into a plurality of groups; anda main processor; at least one external connector which is configured to connect to an external device and which is disposed on the front surface of the single multi-layered connection board; and', 'at least one internal connector configured to connect to an internal device, and which is disposed on the front surface of the single multi-layered connection board, and, 'wherein the plurality of connectors compriseswherein the main processor is disposed on the rear surface of the single multi-layered connection board.2. The video and audio reproduction apparatus as claimed in claim 1 , wherein the at least one external connector is contained within a first group of the plurality of groups and the at least one internal connector is contained within a second group of the plurality of groups.3. The video and audio reproduction apparatus as claimed in claim 2 , wherein the connection board comprises a first edge and a second edge claim 2 , and the first edge and second edge are disposed across from each other.4. The video and audio reproduction apparatus as claimed in claim 2 , wherein the connection board comprises a first edge and a second edge claim 2 , and the first edge and second edge are disposed adjacent to each other.5. The video and audio reproduction apparatus as claimed in claim ...

GLASS WAVEGUIDE ASSEMBLIES FOR OE-PCBs AND METHODS OF FORMING OE-PCBs

The glass waveguide assembly includes a substrate with glass optical waveguides formed in the body of the glass substrate without adding or removing any glass from the substrate body. The glass optical waveguides run generally from a front-end section to a back-end section. A protective coating is formed over at least a portion of the top surface of the glass substrate where the glass optical waveguides reside. Optical connectors are formed at or adjacent the back end at corresponding connector regions. Each connector includes an end portion of at least one of the glass optical waveguides. In some configurations, the glass waveguide assembly includes a bend section that facilitates forming an optical interconnection in a photonic system between an optical-electrical printed circuit board and photonic integrated circuit.

Printed circuit board assembly (pcba) with integrated mounting structure to align and couple to transmitter optical assembly (tosa) modules

The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.

Electrical connector

An electrical connector used to be electrically connected to a circuit board includes: an insulating body; a plurality of terminals, accommodated in the insulating body; a shielding shell, accommodating the insulating body and mounted to the circuit board; and at least one heat dissipation member, located on at least one side of the shielding shell and simultaneously abuts the circuit board and the shielding shell. The heat dissipation members are provided on one or more sides of the shielding shell, and simultaneously abut the shielding shell and the circuit board, so that the heat generated in the operation of the electrical connector is transferred to the heat dissipation members via the shielding shell, and the heat is further transferred to the outside and the circuit board by the heat dissipation members, thus improving the heat dissipation efficiency of the electrical connector, and ensuring the stable operation of the electrical connector.

Grounding structure for power socket

A grounding structure for power socket includes a grounding main body, which consists of a basic section, a first connecting section, a second connecting section, a grounding section and a contact section. The first and the second connecting section are separately downward extended from two opposite ends of the basic section, such that the basic section and the first and second connecting sections together define a receiving space in between them. The contact section is downward extended from a side edge of the basic section into the receiving space; and the first connecting section is outward bent at its lower end to form the grounding section. And, the grounding section is provided at an outer end with a grounding opening.

SEMICONDUCTOR PACKAGE MODULE

A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device. 1. A semiconductor package module comprising:a module substrate;at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT);a plurality of passive devices mounted on the module substrate; andat least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.2. The semiconductor package module of claim 1 , wherein the at least one second electric/electronic device includes a device pad or a lead bonded onto a solder paste on a substrate pad of the module substrate claim 1 , andwherein the second electric/electronic device is bonded onto the module substrate at an outer portion of the solder paste by using the resin film adhesive.3. The semiconductor package module of claim 2 , wherein the semiconductor package module further includes a solder resist arranged around the substrate pad of the module substrate claim 2 , andwherein the resin film adhesive covers at ...

Method, system, and apparatus for finely pitched high speed connector attachment

An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.

Cable receptacle connector for a communication system

A communication system includes a circuit board assembly including a mating circuit board having a mating edge and a plurality of mating pads at the mating edge, the circuit board assembly having an electrical component electrically coupled to the mating circuit board. The communication system includes a cable receptacle connector removably coupled to the mating edge of the mating circuit board. The cable receptacle connector includes a connector housing having a connector cavity and a card slot. A cable extends from the connector housing. The cable receptacle connector includes signal contacts each having a mating end mated with the corresponding mating pads and a terminating end electrically connected to a cable conductor of the cable.

OPTICAL SUBASSEMBLY AND OPTICAL MODULE

An optical subassembly and an optical module are provided. The optical subassembly includes an optical transmitter, an optical receiver, an optical splitter, and an optical fiber stub. The optical transmitter is configured to transmit light from the optical transmitter to the optical fiber stub through the optical splitter. The optical splitter is configured to reflect light from the optical fiber stub to the optical receiver. An optical axis of the optical receiver and an optical axis of the optical fiber stub form an acute angle. An optical axis of the optical transmitter and the optical axis of the optical fiber stub also form an acute angle. 1. An optical subassembly , comprising:an optical transmitter, an optical receiver, an optical splitter and an optical fiber stub, whereinthe optical transmitter is configured to transmit light from the optical transmitter to the optical fiber stub through the optical splitter,the optical splitter is configured to reflect light from the optical fiber stub to the optical receiver,an optical axis of the optical receiver and an optical axis of the optical fiber stub form an acute angle, andan optical axis of the optical transmitter and the optical axis of the optical fiber stub form an acute angle.2. The optical subassembly according to claim 1 , wherein a sum of a first distance from the optical receiver to the optical splitter and a second distance from the optical splitter to the optical fiber stub is equal to a focal length of the optical receiver.3. The optical subassembly according to claim 1 , further comprising:an optical isolator between the optical transmitter and the optical splitter, wherein the optical isolator is configured to transmit the light from the optical transmitter into the optical splitter.4. The optical subassembly according to claim 3 , further comprising:a tube housing the optical transmitter, the optical splitter, the optical isolator, and the optical receiver;a sleeve adjusting component on a first ...

SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER

Methods for mounting a power amplifier (PA) assembly having an extended heat slug () are disclosed. According to one aspect, a method includes manufacturing a left side PCB () and a right side PCB (). The method further includes sliding the left side PCB and the right side PCB inward () to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA () and so that the other of the left and right side PCB is in a position to contact a gate of the PA (). 1. A method for mounting a power amplifier , PA , assembly having a PA and an extended heat slug , the method comprising:sliding a first PCB inward toward the PA assembly from a first direction to contact a gate of the PA; andsliding a second PCB inward toward the PA assembly from a second direction opposite the first direction to contact a drain of the PA—wherein the first and second PCBs have a source contact area that mates with the extended heat slug of the PA assembly when the first and second PCBs are slid inward to encompass the PA assembly, the extended heat slug being in contact with a source of the PA.2. (canceled)3. The method of claim 1 , wherein:the first PCB includes a drain contact area on a side of the first PCB opposite a side of the first PCB having the source contact area;the second PCB includes a gate contact area on a side of the second PCB opposite a side of the second PCB having the source contact area;the gate of the PA contacts the gate contact area after the sliding; andthe drain of the PA contacts the drain contact area after the sliding.4. The method of claim 1 , further comprising mounting the PA onto the extended heat slug of the PA assembly before sliding the first and second PCBs inward to encompass the PA assembly.5. The method of claim 1 , further comprising pre-depositing solder on the first and second PCBs before sliding the first and second PCBs inward to encompass the PA assembly.6. The method of claim 5 , wherein the pre- ...

BOARDS WITH PLIABLE REGIONS

Examples disclosed herein relate to a rigid board with a pliable region. An example system can include a board including a cut to form a beam region of pliability in the board. An example system may include a component to be mounted on the beam region. In an example, the cut can increase flexibility of the beam region relative to the board allowing movement of the component to a target alignment for the component. 1. A system for a rigid board With a pliable region , comprising:a board comprising a cut to form a beam region of pliability in the board; anda component to be mounted on the beam region, wherein the cut increases flexibility of the beam region relative to the board allowing movement of the component to a target alignment for the component.2. The system of claim 1 , wherein the beam region is to flex and secure the board to a chassis.3. The system of claim 1 , wherein the target alignment is a center-line formed by a line passing through the center-line along an exposed plane of a plurality of components mounted to the board.4. The system of claim 1 , comprising a second cut to form a second beam region placed to increase pliability in an assembly region that deforms along the second cut to fit within a chassis.5. The system of claim 1 , comprising:a second component to be mounted on the board; anda cooling element, wherein the second component is located on a second beam region of the board separate from the beam region of the first component, the beam region and the second beam region to be independently flexed to align the component and the second component for exposure to the cooling element.6. The system of claim 1 , wherein the cut is internal to the board by avoiding an X axis edge and a Y axis edge of a board.7. The system of claim 1 , wherein the cut in the board creates the beam region comprising a geometry that is mirrored by a mating region of the board to allow interlocking between the beam region of the board and the mating region of the ...

Connecting Structure for Circuit Board and Output Terminal of Power Supply

The utility model discloses a the connecting structure for the circuit board and the output terminal of the power supply, comprises a casing, a tail cover, and the circuit board with a control circuit, wherein one end of the casing has an opening, at least part of the circuit board is installed in a cavity of the casing, the output terminal is arranged on the tail cover, and the output terminal at least comprises a conductive pin. The connecting structure further comprises a conductive insertion component, wherein the insertion component is fixed to an output end of the circuit board, and when the tail cover and the open end of the casing are closed, the end of the conductive pin is inserted into the insertion component to allow the circuit board and the output terminal to be electrically connected, which has the advantage of rapid assembly.

Portable data cable

The present invention relates to a portable data cable. The portable data cable includes a first terminal and a second terminal that are disposed on two ends of the portable data cable, and a body portion connected between the first terminal and the second terminal, wherein the first terminal includes a first interface, a first protruding portion, a first recess portion, and a first receiving portion, all of which are sequentially disposed along a connection direction; the second terminal includes a second interface, a second protruding portion, a second recess portion, and a second receiving portion, all of which are sequentially disposed along the connection direction, wherein the first recess portion is configured to facilitate insertion of the second interface into the first receiving portion, and the second recess portion is configured to facilitate insertion of the first interface into the second receiving portion, and wherein the first terminal and the second terminal are configured to be capable of being connected by using mortise-and-tenon structures and making the portable data cable become a closed loop, whereby the first interface is accommodated in the second receiving portion, and the second interface is accommodated in the first receiving portion. The portable data cable according to the present invention is convenient to connect and carry. People will have a good experience from using the portable cable.

Mainboard for POS Terminal

The present invention has advantages in that as a USB port unit and a hard disk port unit are formed on the edge of the substrate unit thereby allowing external USB and external disks to be directly connected to the main board, so that it prevents electrical malfunction caused by cable connection, and as the transmission speed of high-speed communication increases through direct connection, it is to provide a main board for POS terminal which may maintain stable system by reducing communication errors. 1100. A main board for POS terminal built in a POS terminal (not shown) , the main board for POS terminal comprising:{'b': '110', 'a substrate unit ; and'}{'b': 120', '110, 'a one-stage port module unit formed on a front side upper part of the substrate unit and having a plurality of ports for connecting peripheral devices in one-stage arrangement,'}2100130110. The main board for POS terminal of claim 1 , wherein a USB port unit installed in a vertical direction is further formed on a rear side upper part of the substrate unit .3100111110140111. The main board for POS terminal of claim 1 , wherein an extended substrate unit protruding outward is extended and formed on one side of the substrate unit claim 1 , and a hard disk port unit installed in a horizontal direction is further formed on a front side upper part of the extended substrate unit .4100150150200200200140111200140. The main board for POS terminal of claim 3 , wherein rail block units and ′ for guiding a horizontal movement of the hard disk and fixing the hard disk when the hard disk is coupled to the hard disk port unit are respectively formed on both sides of a front surface of the extended substrate unit in a process of connecting the hard disk to the hard disk port unit .5100150150151151200152152151151153153151151153153153153151151154154152152153153aabbaa′.. The main board for POS terminal of claim 4 , wherein in each of the rail block units and ′ claim 4 , moving paths and ′ in which parts of both ...

Connector and lighting device

Method and apparatus for edge connection between elements of an integrated circuit

An integrated circuit (IC) having a plurality of IC modules, each IC module having attachment surfaces to which elements of the IC are attached, and each IC module having interlocking edges adjacent to the attachment surface. The interlocking edges of adjacent IC modules are interlocked to form a structural connection between the IC modules. The interlocking edges are a plurality of teeth and recesses, which are arranged in rows. The teeth are securely received by a respective recess in an adjacent interlocking edge to create a structural connection between adjacent IC modules. In addition, the interlocking edges can be a ridge member or a ridge recess, where the ridge member or ridge recess is securely received by a respective ridge recess or ridge member of an adjacent IC module to create a structural connection between the IC modules. The interconnection edge can also be a combination of the ridge member, ridge recess, and/or the rows of teeth and recesses. The attachment surfaces of adjacent IC modules can be co-planar and non-planar, depending on the shape desired. The elements on the IC modules communicate using external pathways and/or internal pathways using conventional wire-bond techniques or using conductive layers within the IC module. The IC module is formed of conventional Si wafers. Using this configuration, an IC can be constructed that utilizes less real estate, fits in non-planar spaces in a housing, and has improved speed due to reduced pathway lengths.

Method and apparatus for edge connection between elements of an integrated circuit

Semiconductor device package, electronic assembly and method for manufacturing the same

A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

BOARD MOUNTED ACTIVE COMPONENT ASSEMBLY

The present disclosure is directed to a board mounted active component assembly that includes a printed circuit board to which a connector is mounted and electrically connected. In one aspect, the connector includes a housing defining an adapter port for receiving an optical plug. The connector also includes a fiber optic transceiver module secured within the housing such that the transceiver module is optically aligned with an optical plug received in the adapter port. The fiber optic transceiver module includes a transmitter optical sub-assembly (TOSA) and a receiver optical sub-assembly (ROSA) with leads connected to a circuit on the printed circuit board. 1. A board mounted active component assembly comprising:a) a printed circuit board;b) a connector including a housing defining an adapter port for receiving an optical plug and including an identification feature for enabling identification of the optical plug, the connector being mounted to the printed circuit board; andc) a fiber optic transceiver module secured within the housing such that the transceiver module is optically aligned with an optical plug received in the adapter port, wherein the fiber optic transceiver module includes a transmitter optical sub-assembly (TOSA) and a receiver optical sub-assembly (ROSA) with leads connected to a circuit on the printed circuit board.2. The board mounted active component assembly of claim 1 , wherein:a) the connector includes a plurality of connectors.3. The board mounted active component assembly of claim 1 , wherein the connector includes twelve connectors.4. The board mounted active component assembly of claim 1 , wherein the adapter port is an LC-type port.5. The board mounted active component assembly of claim 1 , wherein the connector includes a plurality of adapter ports.6. The board mounted active component assembly of claim 5 , wherein the connector includes six adapter ports.7. The board mounted active component assembly of claim 5 , wherein the adapter ...

Module connection structure

Backlight for liquid crystal display comprising light emitting diode

A backlight of an LCD(Liquid Crystal Display) using a light emitting diode is provided to form the lines for electrically connecting LEDs(Light Emitting Diodes) with a driving circuit connecting connector on the surface opposite to the arrangement surface of LEDs. A double-sided PCB(Printed Circuit Board) has plural division areas and conduction via holes. Plural light emitting diodes are arranged at the upper surface of the double-sided PCB. Plural driving circuit connection connectors(25) are arranged at a side of the double-sided PCB. Plural first lead patterns(26) are formed on the upper surface of the double-sided PCB and electrically connect plural light emitting diodes located at the division areas. Plural second lead patterns are formed on the lower surface of the double-sided PCB and electrically connect the first lead patterns and the connectors through the conduction via holes. The double-sided PCB also includes heat radiating via holes penetrated from the upper surface to the lower surface having LEDs arranged thereon. The first lead patterns adjacent to the connectors are directly connected with the connectors.

Integrated circuit element

Cable for connecting integrated circuit element and method of manufacturing the same

Condenser microphone for inserting in mainboard and potable communication device including the same

A condenser microphone mounted on a main board and a mobile communication terminal including the same are provided to reduce thickness of a mounting area by overlapping the thickness of the main board and the thickness of the condenser microphone. A loading part(110) is formed by performing an engraving operation from an edge to an inside on a main board(100). A case is inserted into the loading part. An open side is formed at the case. A signal change part is inserted into the case. A printed circuit board is used for supplying an electrical signal generated by the signal change part to the main board. The case includes a bottom part contacting a front side or a rear side of the main board and an extension part smaller than the bottom part.

Flexible circuit board for liquid crystal display having light absorbing layer

A flexible PCB(Printed Circuit Board) for an LCD is provided to use a triangle-shaped light absorbing layer disposed at one surface of the light source to prevent the light, which is emitted from a light source, from being induced to an undesired region, thereby improving the quality of screen. A flexible PCB for an LCD comprises a first insulation film, a plurality of conductive patterns(120) formed on the first insulation film, a second insulation film(130) formed on the first insulation film to cover the conductive patterns, at least one light source(140) electrically connected to the conductive patterns, and a light absorbing layer(162) formed at an outer circumference of the light source. The light absorbing layer is formed in a triangle shape at one surface of the light source.

Printed circuit board having high-speed signal connector

본 발명은 고속신호 커넥터를 구비한 인쇄회로기판에 관한 것으로서, 표면층과 제1그라운드층을 포함하는 적어도 2개의 층을 포함하는 기판; 상기 기판의 표면층에 형성된 고속신호 생성부; 상기 기판의 표면층에 형성된 적어도 한 개의 고속신호 커넥터 설치부; 상기 기판의 표면층에 형성되며, 상기 고속신호 생성부에서 적어도 한 개의 고속신호 커넥터 설치부까지 연장되는 적어도 한 개의 고속신호선; 및 상기 적어도 한 개의 고속신호 커넥터 설치부에 설치되며, 상기 고속신호선에 접속되는 단자를 포함하는 적어도 한 개의 고속신호 커넥터;를 포함한다. 상기 기판은 상기 적어도 한 개의 고속신호 커넥터 설치부의 아래에 위치하는 상기 제1그라운드층의 일단이 상기 기판의 측면으로 노출되며, 상기 적어도 한 개의 고속신호 커넥터를 상기 적어도 한 개의 고속신호 커넥터 설치부에 설치하면, 상기 적어도 한 개의 고속신호 커넥터의 그라운드가 상기 기판의 측면으로 노출된 상기 제1그라운드층의 일단과 접촉하도록 구성된다. The present invention relates to a printed circuit board having a high-speed signal connector, comprising: a substrate including at least two layers including a surface layer and a first ground layer; a high-speed signal generator formed on the surface layer of the substrate; at least one high-speed signal connector installation unit formed on the surface layer of the substrate; at least one high-speed signal line formed on the surface layer of the substrate and extending from the high-speed signal generating unit to the at least one high-speed signal connector installation unit; and at least one high-speed signal connector installed in the at least one high-speed signal connector installation unit and including a terminal connected to the high-speed signal line. In the board, one end of the first ground layer positioned under the at least one high-speed signal connector installation part is exposed to a side surface of the board, and the at least one high-speed signal connector is connected to the at least one high-speed signal connector installation part. When installed, the ground of the at least one high-speed signal connector is configured to contact one end of the first ground layer exposed to the side surface of the substrate.

Printed wiring board device

The circuit board of power supply and the attachment structure of output end and power supply

本实用新型公开了一种电源的电路板与输出端的连接结构以及电源，包括壳体、尾盖、具有控制电路的电路板，壳体的一端具有开口，所述电路板的至少一部分安装在壳体的腔体中，在尾盖上设有输出端子，该输出端子至少包括导电引脚，还包括导电的插接部件，插接部件固定在电路板的输出端，所述尾盖与壳体的开口端合盖时，导电引脚的端部与插接部件形成插接以使电路板与输出端子电连接。本实用新型具有便于快速装配的优点。

General connection adapter

本发明公开一种通用连接转接器。于某些配置中，连接转接器包括具有多组输入连接器的输入部、以第一方向从输入部延伸及包括第一组输出连接器的第一输出部以及以第二方向从输入部延伸及包括第二组输出连接器的第二输出部。于连接转接器中，该些组的输入连接器电性耦接于第一组输出连接器及第二组输出连接器的每一个。更甚者，第一方向及第二方向实质上彼此垂直，而输入部以实质上不垂直于第一方向或第二方向的第三方向延伸。

Lighting device and display apparatus using thereof

본 발명의 실시 예는 광원 장치 및 이를 이용한 디스플레이 장치에 관한 것이다. An embodiment of the present invention relates to a light source device and a display device using the same. 본 발명의 실시 예에 따른 광원 장치는, 하나 이상의 발광소자; 상기 발광소자가 탑재된 하나 이상의 발광소자기판; 상기 발광소자기판에 접속되는 제 1 및 제 2커넥터를 포함한다. A light source device according to an embodiment of the present invention, at least one light emitting device; At least one light emitting device substrate on which the light emitting device is mounted; And first and second connectors connected to the light emitting device substrate. 발광소자, LED, 기판, 커넥터, 라이트 유닛 Light emitting element, LED, board, connector, light unit

Miniature Housing and Support Arrangement Having at Least One Miniature Housing

A miniature housing, in whose housing body there is located an element emitting or receiving electromagnetic radiation, comprises at least two electrical terminal means projecting laterally beyond the housing body. The passage side of the miniature housing, through which the element emits or receives, is oriented substantially perpendicularly to the mounting plane of the miniature housing. The electrical terminal means of the miniature housing projecting laterally beyond the housing body are connected electrically conductively to conductors, which bring about direct contacting with the emitting or receiving element. The contacting faces of the terminal means are thus arranged substantially perpendicular to the passage side of the miniature housing. As a result of this arrangement the miniature housing may be embedded at least in part in a support, such that the miniature housing is no longer of any significance to the thickness of a lighting device.

Miniature housing and support arrangement having at least one miniature housing

A miniature housing, in whose housing body there is located an element emitting or receiving electromagnetic radiation, comprises at least two electrical terminal means projecting laterally beyond the housing body. The passage side of the miniature housing, through which the element emits or receives, is oriented substantially perpendicularly to the mounting plane of the miniature housing. The electrical terminal means of the miniature housing projecting laterally beyond the housing body are connected electrically conductively to conductors, which bring about direct contacting with the emitting or receiving element. The contacting faces of the terminal means are thus arranged substantially perpendicular to the passage side of the miniature housing. As a result of this arrangement the miniature housing may be embedded at least in part in a support, such that the miniature housing is no longer of any significance to the thickness of a lighting device.

Thermoelectric module with integrated printed circuit board

A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.

Modular plug, electrically driven and for manufacturing the method for modular plug

本发明涉及一种用于电气驱动装置的插头模块，所述插头模块包括：印刷电路板(2)；至少一个电气的或者说电子的构件(3)，所述构件布置在所述印刷电路板(2)上；以及具有壳体(5)和电气插接触点(6)的插头零件(4)，其中在所述构件(3)与所述印刷电路板之间的第一连接部以及在所述插头零件(4)和所示印刷电路板(2)之间的第二连接部分别构造为SMD焊接连接部(7)和／或THRS焊接连接部。此外，本发明还涉及一种电气驱动装置和一种用于制造所述插头模块的方法。

Portable terminal

이동 단말기의 안테나 구조가 개시된다. 제안된 안테나 구조는 회로기판의 에지면에 급전되는 형태로서, 단말기 하우징과 회로기판의 에지면 사이에 배치되기 용이하면서도 우수한 무선특성을 구현할 수 있게 되어 있다.

Low EMI electronics, low EMI circuit board and manufacturing method thereof

IC, LSI소자나 회로의 고속화, 고밀도화에서 점점 중요하게 되는 EMC대응의 전자기기에 관한 것으로서, 탑재하는 회로기판 레벨로 불필요 복사를 억제한 전자기기를 제공하기 위해, 다층회로기판의 전원층과 접지층에 대해서 저항체(저항체층)과 다른 하나의 접지층을 부가한 구조체를 형성하는 것에 의해 전원층과 접지층에서 본 고체층간 부유용량의 Q값을 등가적으로 갑소시키고 또한 정합종단한 평행판선로와 밀폐형의 실드구조로 하였다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an EMC-compliant electronic apparatus which is becoming increasingly important in high-speed and high-density IC and LSI elements and circuits, and in order to provide an electronic apparatus in which unnecessary radiation is suppressed at a mounted circuit board level, (Resistance layer) and another ground layer are added to the layer, so that the Q value of the solid-layer inter-layer stray capacitance seen from the power source layer and the ground layer is equivalent to the Q value of the power layer and the ground layer, And a sealed shield structure. 이렇게 하는 것에 의해 부유용량의 Q값을 등가적으로 감소시켜서 전원공급 루프에 발생하는 전위변동(공진)을 흡수하고 정합종단된 평행판선로에서 정재파를 흡수함과 동시에 밀폐 실드하는 것에 의해 불필요 복사를 대폭으로 억제한다는 효과가 있다. By doing so, the Q value of the stray capacitance is equivalently reduced to absorb the potential fluctuation (resonance) generated in the power supply loop, to absorb the standing wave in the matching terminated parallel plate line and to seal the shield, There is an effect that it is greatly suppressed.

Automotive door lock has plastic housing with electrical adaptor and connector to internal components

An automotive door lock has a housing with a number of electrical wires linked to components within the housing. The housing has an electrical adapter with a number of contacts to a conductor strip with parallel electrical strips that are detachable from the adapter.

Three-dimensional circuit module and method of manufacturing the same

本发明提供立体电路模块及其制造方法，可正确并且容易地实现被安装的电子部件的角度。作为立体电路模块(1)，具有第2基板(3)相对于第1基板(2)以规定的角度被接合的立体结构，第1基板(2)具有在作为接合面(S1)一侧的端面上形成的第1切口凹部(6)、以及在该第1切口凹部(6)的深度方向的端面上形成的第2切口凹部(7)，第2基板(3)具有在与第1基板(2)的接合面(S1)相对置一侧的面安装的电子部件(4z)，在电子部件(4z)被配置在第2切口凹部(7)内的状态下，将第2基板(3)结合在第1切口凹部(6)中。

Multilayer printed board

Printed circuit board

Electrical switching and control apparatus

The electronic components of an electrical switching and control apparatus (10) are arranged on a hybrid board (11) which is connected with plug contacts (14). To achieve a compact, extremely simple design in which the heat losses at the output components (13) of the hybrid circuit (11) are dissipated, the flat areas (14b) of the plug contacts (14) inside the housing of the device lie against the rear face of the hybrid board (11) to which the output components (13) are contiguously secured. The ends (14c) of the contact parts (14) are in direct contact with the connectors (12) of the hybrid board (11). An apparatus of this type is suitable for switching and control applications and is particularly advantageous when used in motor vehicles.

Additive Manufacturing Electronic (AME) Circuits with Side-Mounted Components

본 개시내용은 적층 제조(AM)를 사용하여 측면 장착된 컴포넌트 및 컨택트를 갖는 인쇄 회로를 제조하기 위한 시스템 및 방법에 관련된 것이다. 보다 구체적으로, 본 개시내용은 전자 컴포넌트(AME), 예를 들어, 인쇄 회로 보드(PCB), 연성 인쇄 회로(FPC) 및 고밀도 상호 연결 인쇄 회로 보드(HDIPCB)(PCB, FPC 및 HDIPCB는 함께 AME 또는 AME 회로라고 지칭됨)를 제조하기 위한 적층 제조 방법에 관련된 것으로, 이들 전자 컴포넌트는 프린팅된 AME 각각의 측벽 또는 패싯의 Z 축을 따라 전도성 컨택트 및/또는 컴포넌트를 갖는다.

Electric field device and expansion module for plugging into an electric field device

Dargestellt und beschrieben ist ein elektrisches Feldgerät zum Einsatz in der industriellen Steuerung, mit einem Gehäuse (2), mit mindestens einem Eingang, mindestens einem Ausgang und mit einer einen Mikrocontroller (3), einen Speicher (4) und eine Leiterplatte (5) aufweisenden elektronischen Schaltung. Das erfindungsgemäße elektrische Feldgerät (1) ist dadurch besonders einfach an unterschiedliche Funktionen und Einsatzbedingungen anpassbar, dass an einer Seite des Gehäuses (2) eine Öffnung (6) zum Einstecken eines zumindest eine Leiterplatte (7) aufweisenden elektronischen Erweiterungsmoduls (8) ausgebildet ist, dass die Leiterplatte (5) in einen Kontaktbereich (9) Kontakte zur mechanischen und elektrischen Kontaktierung von mit der Leiterplatte (7) des Erweiterungsmoduls (8) verbundenen Gegenkontakten aufweist, und dass in der Leiterplatte (5) eine Aussparung (10) derart ausgebildet ist, dass ein eingestecktes Erweiterungsmodul (8) außer im Kontaktbereich (9) keine leitende Verbindung mit dem Feldgerät (1) aufweist, so dass eine sichere Potentialtrennung zwischen dem Gerätinneren und einem Anwender gewährleistet ist. Shown and described is an electric field device for use in industrial control, with a housing (2), with at least one input, at least one output and with a microcontroller (3), a memory (4) and a printed circuit board (5) electronic circuit. The electric field device (1) according to the invention is thereby particularly easily adaptable to different functions and operating conditions, that an opening (6) for inserting an electronic expansion module (8) having at least one printed circuit board (7) is formed on one side of the housing (2), the printed circuit board (5) has contacts in a contact region (9) for the mechanical and electrical contacting of mating contacts connected to the printed circuit board (7) of the expansion module (8), and in that a cutout (10) is formed in the printed circuit board (5) in that an inserted expansion module (8) has ...

Manufacturing method of electronic device

Mounting arrangement for light emitting diodes

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Modular mounting arrangement and method for light emitting diodes

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. A heat conductive adhesive tape connects the LED module to the mount surface. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.

Tabbed circuit board and method for manufacturing same

A circuit board for receiving and operably connecting a plurality of electrical components generally comprises: a flexible substrate of a predetermined length and having a first lateral edge and a second lateral edge; a conductive trace applied to the flexible substrate; and a plurality of integral tabs arrayed along the first lateral edge, one or more electrical components being operably connected to the conductive trace at a respective tab, and wherein each tab can be manipulated from a first position in which the tab is aligned with the remainder of the substrate to a second position in which the tab is oriented at an angle relative to the remainder of the substrate.

Relay board and optical communication module

Modular mounting arrangement and method for light emitting diodes

A modular light emitting diode (LED) mounting configuration is provided including a light source module having at least one LED. The module includes a heat conductive body portion adapted to conduct heat generated by the LED away from the LED. As a result, the LED can be operated with a higher current than normally allowed. Thus, LED brightness and performance is increased without decreasing life expectancy. An adhesive connects the LED module to the mount surface. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.

Mounting structure, and electronic equipment provided therewith

【課題】フレキシブルプリント配線板とコネクタとの電気的な接続部に断線を生じてしまうことを防止する。 【解決手段】本発明の実装構造２２は、基板２９と、基板２９に固定されるコネクタ３０と、コネクタ３０に電気的に接続されるとともに基板２９と離れているフレキシブルプリント配線板３１と、を具備する。フレキシブルプリント配線板３１は、コネクタ３０に対して基板２９を間に挟んだ反対側の位置、および基板２９の厚さの範囲内の位置、のいずれか一方に配置される。 【選択図】図３

Plug module, in particular for window lift drives, and method for its production

Die vorliegende Erfindung betrifft ein Steckermodul für einen elektrischen Antrieb, umfassend eine Leiterplatte (2), wenigstens ein elektrisches oder elektronisches Bauelement (3), welches auf der Leiterplatte (2) angeordnet ist, und ein Steckerteil (4) mit einem Gehäuse (5) und einem elektrischen Steckkontakt (6), wobei eine erste Verbindung zwischen dem Bauelement (3) und der Leiterplatte und eine zweite Verbindung zwischen dem Steckerteil (4) und der Leiterplatte (2) jeweils als SMD-Lötverbindung (7) und/oder als THRS-Lötverbindung ausgeführt ist. Ferner betrifft die Erfindung einen elektrischen Antrieb sowie ein Verfahren zur Herstellung des Steckermoduls. The present invention relates to a plug-in module for an electric drive, comprising a printed circuit board (2), at least one electrical or electronic component (3), which is arranged on the printed circuit board (2), and a plug-in part (4) with a housing (5). and an electrical plug contact (6), wherein a first connection between the component (3) and the printed circuit board and a second connection between the plug part (4) and the printed circuit board (2) each as an SMD solder joint (7) and / or as THRS Solder is executed. Furthermore, the invention relates to an electric drive and a method for producing the plug-in module.

Ethernet transmission line

An Ethernet transmission line includes two RJ45 connectors and a thin connection line. Each RJ45 connector has a connection terminal group, and the connection terminal group includes a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, a sixth terminal, a seventh terminal, and an eighth terminal that are sequentially arranged. The thin connection line is connected between the two RJ45 connectors and the thin connection line includes a first flexible printed circuit board layer, a second flexible printed circuit board layer, and a spacing layer. The first flexible printed circuit board layer is provided with two first transmission lines respectively electrically connected to the third terminal and the sixth terminal. The second flexible printed circuit board layer is provided with two second transmission lines respectively electrically connected to the fourth terminal and the fifth terminal.

Printed circuit board, transport system and manufacturing system

본 발명은, 적어도 하나의 전자 컴포넌트의 수용을 위한 적어도 하나의 조립 영역(2)과, 인쇄회로기판들(1)의 처리를 위한 제조 시스템(20)의 내부에서 인쇄회로기판(1)을 이동시키기 위한 이송 시스템(10) 상에 인쇄회로기판(1)을 배치하기 위한 패널 에지(3)를 포함하는 인쇄회로기판(1)에 관한 것이다. 패널 에지(3)의 적어도 하나의 위치 상에는, 이송 시스템(10)의 근거리 검출기(13)로 적어도 하나의 인쇄회로기판 고유 정보를 전송하기 위한 근거리 트랜스폰더(4)가 배치된다. 또한, 본 발명은, 인쇄회로기판들(1)의 처리를 위한 제조 시스템(20)의 내부에서 인쇄회로기판들(1)을 이동시키기 위한 이송 시스템(10), 그리고 제조 시스템(20)에도 관한 것이다.

ELECTRICAL CONNECTOR AND COMBINED ASSEMBLY INCLUDING SUCH AN ELECTRICAL CONNECTOR AND A PRINTED CIRCUIT BOARD

Dans un tel connecteur, qui sert à établir une liaison électrique entre des conducteurs et une plaquette à circuits imprimés 20 et comporte un boîtier isolant 10 comportant une ou plusieurs cavités logeant des conducteurs et au moins une entrée 11 pour les conducteurs et une ou plusieurs ouvertures 12 logeant des contacts 13 et établissant une communication entre les cavités et l'extérieur du connecteur, le boîtier 10 comporte des moyens de fixation 14, 15 permettant sa fixation amovible à la plaquette 20 et agencés de manière qu'un déplacement rectiligne entre la plaquette 20 et le boîtier 10 provoque la fixation du boîtier à la plaquette ou le dégagement du boîtier par rapport à la plaquette. Application notamment aux connecteurs électriques pour le raccordement de plaquettes à circuits imprimés. In such a connector, which serves to establish an electrical connection between conductors and a printed circuit board 20 and comprises an insulating housing 10 comprising one or more cavities housing conductors and at least one inlet 11 for the conductors and one or more openings 12 housing contacts 13 and establishing communication between the cavities and the exterior of the connector, the housing 10 comprises fixing means 14, 15 allowing its removable fixing to the wafer 20 and arranged so that a rectilinear movement between the wafer 20 and housing 10 causes the housing to be attached to the wafer or the housing to be disengaged from the wafer. Application in particular to electrical connectors for the connection of printed circuit boards.

Electronic circuit unit

본 발명은 소형화에 적합하고, 생산성이 양호한 전자회로 유닛을 제공하는 것이다. The present invention is to provide an electronic circuit unit suitable for miniaturization and good productivity. 본 발명의 전자회로 유닛은, 프레임체(1) 내에 설치된 회로기판(3)과, 이 회로기판(3)에 탑재된 커버부착 전자부품(5)과, 회로기판(5)에 관통된 상태로 설치된 복수개의 선형상의 단자(9)를 구비하고, 단자(9)는 복수개가 서로 간격을 두고 적어도 일렬로 배치된 제 1, 제 2 단자군(7a, 7b)을 가지고, 제 1, 제 2 단자군(7a, 7b)은, 일렬상태로 회로기판(3)의 한 변의 근방에 설치됨과 동시에, 제 1, 제 2 단자군(7a, 7b) 사이에는 공극부(10)가 설치되고, 커버설치 전자부품(5)이 공극부(10)에 위치한 상태로 회로기판(3)에 설치되었기 때문에, 커버부착 전자부품(5)의 설치의 스페이스 팩터가 좋고, 따라서 회로기판(3)의 폭방향의 치수를 작게 할 수 있어 소형의 것이 얻어진다. The electronic circuit unit of the present invention is provided in a state where the circuit board 3 provided in the frame body 1, the cover-mounted electronic component 5 mounted on the circuit board 3, and the circuit board 5 are penetrated. A plurality of linear terminals 9 are provided, the terminals 9 each having a plurality of first and second terminal groups 7a and 7b arranged at least in a line at intervals from each other. The groups 7a and 7b are provided in the vicinity of one side of the circuit board 3 in a lined state, and the air gaps 10 are provided between the first and second terminal groups 7a and 7b, and cover installation. Since the electronic component 5 is installed on the circuit board 3 with the gap 10 being located, the space factor of the installation of the cover-mounted electronic component 5 is good, and therefore the width direction of the circuit board 3 The dimension can be made small and a small one can be obtained.

Electrical connector and system for a component in an electronic device

The invention provides a printed circuit board (PCB) for use in an electronic device. The PCB comprises: a top side; a bottom side; an edge between the top side and the bottom side; a cavity from the top side to the bottom side; a region on the top side for mounting an electronic device; and a connector for receiving connections from the electronic device. In the PCB, the connector is located on either the bottom side or the edge of the side of the PCB. The electronic device can be a display module.

DISCHARGE LAMP IGNITION DEVICE

ELECTRO-OPTICAL DISPLAY DEVICE

TEMPERATURE MEASURING DEVICE

Electrical connection module and automotive lighting device

L'invention fournit un module de connexion électrique pour un véhicule automobile (100), comprenant une carte de circuit imprimé (1) avec une partie de retenue (2) et un connecteur de bord configuré pour être connecté à la carte de circuit imprimé. La partie de retenue (2) comprend une connexion électrique (5) située dans un évidement (4) de la carte de circuit imprimé (1), et le connecteur de bord (3) comprend des mâchoires (6, 7) destinées à être couplées avec la connexion électrique lorsqu'elles pénètrent dans l'évidement (4). Le connecteur de bord (3) comprend en outre une partie arrière (8), d'où le bras électrique (6) et le bras de support (7) font saillie ; et la partie de retenue (2) comprend deux bras de retenue (9), chaque bras de retenue (9) faisant saillie de la carte de circuit imprimé (1) vers la connexion électrique (5) dans une direction en saillie qui forme entre 5 et 40 degrés par rapport à la direction de connexion (d), et laissant un espace entre eux qui est plus petit que la largeur de la partie arrière (8) du connecteur de bord (3).Figure pour l'abrégé : figure 1 The invention provides an electrical connection module for a motor vehicle (100), comprising a printed circuit board (1) with a retaining part (2) and an edge connector configured to be connected to the printed circuit board. The retaining part (2) comprises an electrical connection (5) located in a recess (4) of the printed circuit board (1), and the edge connector (3) comprises jaws (6, 7) intended to be coupled with the electrical connection when entering the recess (4). The edge connector (3) further comprises a rear part (8), from which the electric arm (6) and the support arm (7) protrude; and the retaining part (2) comprises two retaining arms (9), each retaining arm (9) protruding from the printed circuit board (1) towards the electrical connection (5) in a protruding direction which forms between 5 and 40 degrees with respect to the connection direction (d ...

Patent FR2409565B1

LIGHT INDICATOR SUPPORT ON PRINTED CIRCUIT

SUPPORT DE VOYANT LUMINEUX COMPORTANT UN CORPS ISOLANT ALLONGE AYANT UNE FACE AVANT ET UNE FACE ARRIERE SENSIBLEMENT PERPENDICULAIRES A SA DIMENSION LONGITUDINALE ET FORMANT, AU NIVEAU DE SA FACE AVANT, DES MACHOIRES DESTINEES A L'INSERTION DU VOYANT, UNE SURFACE D'APPUI A L'INTERIEUR DUDIT CORPS COOPERANT AVEC LA SURFACE ARRIERE DU VOYANT, DES TROUS DE PASSAGE DES FILS DE CELUI-CI MENAGES A TRAVERS LEDIT CORPS ET DES MOYENS DE FIXATION A UNE CARTE DE CIRCUIT IMPRIME, CARACTERISE EN CE QUE LEDIT CORPS FORME UNE SURFACE DE REFERENCE 9 PERPENDICULAIRE A LA FACE ARRIERE 14 ET RACCORDEE A CELLE-CI PAR UNE SURFACE RENTRANTE 6, 7 AGENCEE POUR DEGAGER UNE PORTION DESDITS FILS ET CONFORMEE POUR QUE LE RABATTEMENT DUDIT CORPS D'UNE PREMIERE POSITION OU SA FACE ARRIERE 14 EST EN APPUI SUR LA CARTE ET JOUE LE ROLE D'ENTRETOISE DEFINISSANT UNE DISTANCE PREDETERMINEE ENTRE LA SURFACE ARRIERE DU VOYANT ET LA SURFACE DU CIRCUIT IMPRIME EN VUE DE LA SOUDURE DES FILS, A UNE SECONDE POSITION OU LADITE SURFACE DE REFERENCE 9 EST EN APPUI SUR LA CARTE, AIT POUR EFFET DE PROVOQUER LE CAMBRAGE PREDETERMINE DESDITS FILS.

Method for mounting components with bent terminals and device for implementing said method.

Circuit board with integrated RFID microchip

Connector and lighting apparatus

(과제) 커넥터의 끼워 맞춤 방향 치수를 작게 한다. (해결 수단) 커넥터 끼워 맞춤 방향과 직교하는 삽입 방향에서 삽입되어 하우징 (12) 에 유지되는 유지부 (111) 와, 유지부 (111) 에 연결되고, 커넥터 끼워 맞춤 방향으로 연장되는 접촉부 (112) 와, 유지부 (111) 에 연결되고, LED 실장 기판에 접속되는 접속부 (113) 를 컨택트 (11) 는 갖는다. 하우징 (12) 은, LED 실장 기판에 형성된 구멍에 삽입되는 하우징 본체 (121) 와, 하우징 본체 (121) 에 형성된 천판부 (122) 를 갖는다. 하우징 본체 (121) 에, 접촉부 (112) 를 수용함과 함께, 케이블 커넥터를 수용하는 커넥터 수용부 (121a, 121b) 를 형성한다. 천판부 (122) 에, 커넥터 수용부 (121a, 121b) 에 통함과 함께, 유지부 (111) 를 수용하는 컨택트 수용부 (122a) 를 형성한다. 하우징 본체 (121) 에, 커넥터 끼워 맞춤 방향과 직교하는 삽입 방향에서 커넥터 수용부 (121a, 121b) 및 컨택트 수용부 (122a) 에 컨택트 (11) 를 삽입하는 홈 (121c) 이 형성되어 있다. [PROBLEMS] To reduce the fitting direction dimension of the connector. A holding portion 111 inserted in the insertion direction orthogonal to the connector fitting direction and held in the housing 12; a contact portion 112 connected to the holding portion 111 and extending in the connector fitting direction; And the contact 11 connected to the holding part 111 and connected to the LED mounting board. The housing 12 has a housing main body 121 to be inserted into a hole formed in the LED mounting board and a top plate portion 122 formed on the housing main body 121. The housing main body 121 accommodates the contact portion 112 and forms the connector accommodating portions 121a and 121b for accommodating the cable connector. A contact receiving portion 122a for receiving the holding portion 111 is formed on the top plate portion 122 so as to communicate with the connector housing portions 121a and 121b. A groove 121c for inserting the contacts 11 into the connector accommodating portions 121a and 121b and the contact accommodating portion 122a is formed in the housing main body 121 in the inserting direction perpendicular to the connector fitting direction.

Lighting device, backlight unit, and printed circuit board thereof

公开了可以使用发光元件并且可以以细分的方式驱动的发光装置、背光单元及其印刷电路板。背光单元包括：电路板，其安装有发光二级管，并形成有与发光二级管电连接的连接焊盘；驱动器，其安装在该电路板的一个表面上，并且适用于驱动发光二极管；连接器，其接合到该电路板的连接焊盘，该连接器具有朝该驱动器改变的连接方向；以及连接线，其用于将该连接器连接到该驱动器。

Circuit board assembly

Pin extender strip for vertically mounting multi-pin electronic devices

A mounting arrangement is provided whereby an electronic display device with contact pins accessible on one side is mounted on a printed circuit board by means of a plurality of elongated pin extender elements connected between individual ones of the contact pins and points of contact on associated ones of the conductive leads on the printed circuit board, the elements having pin receiving means for receiving the pins and being oriented at an off-orthogonal angle with respect to said printed circuit board and the pin extender elements form a triangulated structural support for the display device.

Light source device and display device having the same

Patent DE8710161U1

Optical transceiver with an FPC board connecting an optical subassembly with a circuit board

The specification discloses an optical transceiver that provides a FPC board to electrically connect the OSA with the circuit board. The FPC board provides pads to be connected with corresponding pads formed on the circuit board and at least one opening in adjacent to the pads. In the present invention, the shape and the position of the opening fit with the outer shape and the position of a corresponding electrical component mounted on the circuit board. By mating the opening in the FPC board with the component on the circuit board, the pads on the FPC board may be aligned with pads on the circuit board.

Battery mounting device

Optical module

An optical module includes an optical connector on one end of a package for storing a carrier including an optical element, and a laminated ceramic feedthrough disposed on the other end of the package. The feedthrough includes on an outer surface an electrical terminal perpendicular to the optical axis of light incident on and exiting from the optical connector, and includes on its inner surface a chip carrier connection terminal connected to the electrical terminal. A flexible printed circuit board includes a connection pad acting as an electrical terminal at a position corresponding to the electrical terminal of the feedthrough and is fixed to the feedthrough with an anisotropic conductive adhesive.

CONSTRUCTION GROUP FOR ELECTRIC CONTROL DEVICES

Su una piastra circuitale (10) è disposto un circuito elettronico costituito da almeno un componente di potenza (11) cedente calore dissipato. Per la dispersione del calore questo componente di potenza (11) nello stato montato poggia sul lato interno (34) della parete laterale esterna (33) della custodia (30) di un apparecchio di comando. Per il montaggio sulla piastra circuitale (10) viene fissato un elemento di fissaggio (12) presentante un elemento di appoggio (23) ed un elemento elastico (27). Il componente di potenza (11) dall'alto può essere introdotto manualmente od automaticamente fra l'elemento di appoggio (23) e l'elemento elastico (27). Separando il gruppo costruttivo dall'elemento utile la parte di fissaggio (12) e la piastra circuitale (10) vengono concomitantemente asportate mediante fresatura, in misura tale che le estremità della parte di fissaggio (12) e la estremità della piastra circuitale (10) non possono più sporgere oltre una linea prolungata (28) del dorso del componente di potenza (11). Conseguentemente il gruppo costruttivo può essere montato in modo assai semplice nella custodia (30) di un apparecchio di comando. Il calore dissipato può essere disperso direttamente tramite la parete laterale (34).(Figura 1). An electronic circuit consisting of at least one power component (11) giving off dissipated heat is arranged on a circuit board (10). For heat dissipation, this power component (11) in the mounted state rests on the internal side (34) of the external side wall (33) of the enclosure (30) of a control device. For mounting on the circuit plate (10) a fixing element (12) is fixed having a support element (23) and an elastic element (27). The power component (11) from above can be introduced manually or automatically between the support element (23) and the elastic element (27). By separating the construction group from the useful element, the fixing part (12) and the circuit plate (10) are concomitantly removed by milling, ...

Telephone connector

Electronic circuit unit having small size and good productivity

The present invention provides an electronic circuit unit that is suitable for miniaturization and has a good manufacturing productivity. An electronic circuit unit of the present invention comprises a circuit board 3 mounted within a frame member 1, an electronic component 5 with a cover mounted on the circuit board 3, and a plurality of linear terminals 9 passing through and being mounted in the circuit board 3. The terminals 9 comprise at least first and second terminal groups 7a and 7b arranged at an interval between the respective terminals in a line. The first and the second terminal groups 7a and 7b are arranged in a line in the vicinity of one side of the circuit board 3. An opening portion 10 is provided between the first and second terminal groups 7a and 7b, and the electronic component 5 with the cover is mounted on the circuit board 3 while being disposed in the opening portion 10. As a result, a space factor for the arrangement of the electronic component 5 with the cover is very good, and thus it is possible to reduce a widthwise dimension of the circuit board 3, thereby obtaining a small-sized electronic circuit unit.