Elektronische Baueinheit

Elektronische Baueinheit mit einer Leiterplatte und einem in Abstand darüber angeordnetem Elektronikmodul, welches mittels seiner elektrischen Anschlüsse in die Leiterplatte eingreift und mit dieser verbunden ist, wobei das Elektronikmodul (2) von einem Rahmen (1) umgeben ist, welcher aus Seitenteilen aufgebaut ist und der einen Mittelsteg aufweist ist, wobei das Modul (2) auf dem Mittelsteg aufliegt, wobei der Rahmen (1) in der Leiterplatte (3) verankert ist und der Rahmen (1) das Elektronikmodul (2) in den Bereichen der elektrischen Anschlüsse (12) umschließt.

Elektrisch leitende Durchverbindung fuer gedruckte Schaltungen

Single in=line circuit module, esp. for telephone coder - has all conductors on two faces of plastics support plate

An uncased circuit module (single-in-line-circuit module) is intended esp. for carrying conductors and electrical components, i.e. integrated, uncased semiconductors. A single line of circuit pins is arranged along one edge of the support, which has a length at least three times its width. The electrical components are one or more integrated, uncased semiconductors (H1, H2), opt. also one or more separate electrical components such as capacitors. The support (T) itself is a punched-out piece of sheet of organic plastics or plastics mixture having conductors in at most two planes, i.e. the front and rear faces. Pref. materials for the plate are polyimide, epoxy resin or PTFE. The material may contain paper or glass fibres as filler.

EMV-Filter zur Unterdrückung von Störsignalen

Der Erfindung, welche einen EMV-Filter (1) zur Unterdrückung von Störsignalen betrifft, liegt die Aufgabe zugrunde, eine Lösung anzugeben, womit ein Überarbeitungsaufwand einer Inverterplatine reduziert wird und außerdem eine Bauraumbeschränkung sowie eine Reduzierung der Entwicklungs- und Herstellungskosten erreicht wird. Diese Aufgabe wird dadurch gelöst, dass in einem EMV-Filter-Modul (10) mindestens ein Kern (11) einer Drossel (4, 5) mit einer Windung (16) auf einer ersten Trägerplatine (14) angeordnet ist, dass mindestens einer der Kondensatoren (6, 7, 8, 9) auf der ersten Trägerplatine (14) angeordnet ist, dass die erste Trägerplatine (14) mindestens zwei Kontaktmittel (17) aufweist und das die erste Trägerplatine (14) des EMV-Filter-Moduls (10) mit ihren Kontaktmitteln (17) an einer Hauptplatine (12) eines Umrichters (2) und mit dieser elektrisch verbunden angeordnet ist.

Power rail connections to wrapped joint pins - in electronic systems uses trough shaped rail and soldered connections

A trough-shaped tin plated power rail is for use in electronic systems using wrapped wire pins. The power rail, which is of U-shaped section fits tightly over the required row of pins, and is so shaped that the U is slightly opened out when full connection with the row of pins is made. Each joint is then soldered to give a high quality connection. The precise cross-section of the power rail is described together with the mounting technique. In the case of columns and rows of pins, in which some columns only require to be connected to a common rail, a technique of bending the pins and applying the appropriate rail is described.

VORRICHTUNG ZUR ELEKTRISCHEN VERBINDUNG VON STIFTEN MIT HILFE WENIGSTENS EINER STROMSCHIENE

SCHUTZEINRICHTUNG FUER EINE ELEKTRONISCHE SCHALTUNG

TRANSISTOR MOUNTING APPARATUS

METALLIC LEADS FOR ELECTRONIC DEVICES

... 1331901 Component assemblies; semi-conductor devices E I DU PONT DE NEMOURS & CO 4 Feb 1972 [5 Feb 1971] 5408/72 Headings H1K and H1R [Also in Division H2] In a semi-conductor device package, the thick film material substrate 8 is connected to metallic leads 2, by means of a clamp portion 3. Bifurcated fingers 4 and 5 clamp the lead to the terminal 9, and are soldered thereto, and laterally disposed offset tab 7 is adapted to abut the clamp 3 at a predetermined distance from the substrate. In Fig. 3, an adaptation with only two of the described leads 11 is shown. The nature of the clamp is to maintain a rigid bond at the high temperatures required for the use of thick film materials in the insulating dielectric, 13, substrate 8, metallurgical seal ring 12, conducting fingers 14 semi-conductor die attachment region 15, and terminal pads 9, the assembly may then be hermetically sealed. An elongated shorting or tie bar 1 is provided to maintain the leads 2 in proper relationship to each other ...

Electrical soldered contact assembly

A contact assembly (1) to be soldered to at least one electrical circuit comprises a bifurcated element (5) with a projecting tab between the parts of the element. The tab has soldered to it a ball (12) of solder metal or alloy and when a circuit element is placed between the tab and the bifurcated parts, application of heat will melt the solder and thus secure the connection. ...

LIGHTWEIGHTY AUDIO SYSTEM FOR APPLICATIONS OF AUTOMOBILES AND EQUIVALENT PROCEDURE

WITH PLUMB BOB MISTAKE CONTACT ELEMENT.

HYBRID INTEGRATED CIRCUIT WITH A SYSTEM FOR HEAT DISSIPATION

GEHAÜSE FOR A PRINTED CIRCUIT BOARD TO HORIZONTALS OR VERTICAL ASSEMBLY

ELECTRICAL CONTACT RECEPTACLE

SOLDER-BEARING LEADS

CARRIER STRIP FOR ROUND LEAD PINS AND METHOD FOR MAKING SAME

SOLDER BONDING PROCESS

PLOT DE REPORT DE CONNEXION POUR LA FIXATION D'UNE BROCHE A GRIFFES SUR LA TRANCHE D'UN SUBSTRAT DE CIRCUIT HYBRIDE

: Plot de report de connexion pour la fixation d'une broche à griffes sur la tranche d'un substrat de circuit hybride. Ce plot de report de connexion de bord est destiné à la fixation d'une broche de connexion (30). Il présente deux plages étamables (17, 18) placées en vis à vis sur les côtés opposés d'un bord de substrat (10), aux endroits de préhension des griffes (33, 34, 35) de la broche (30) qui forment les mâchoires d'une pince élastique. Ces plages étamables (17, 18) sont entaillées de rainures (19, 20) aux emplacements des chemins de coulissement suivis par les griffes (33, 34, 35) lors de la mise emplace de la broche (30). Elles ont, dans le cas d'une broche (30) à trois griffes de même largeur totale qu'elles, l'une (17) la forme générale d'un U et l'autre (18) celle d'un T. Leur intérêt est de restreindre l'amplitude de l'ouverture de la pince de la broche et de lui assurer un centrage automatique sur le plot lorsque les plages (17, 18) sont déjà étamées. FIGURE A PUBLIER : Figure 1

LEAD FRAME CONNECTOR AND ELECTRONIC PACKAGES CONTAINING SAME

CONDUCTIVE LEAD ARRANGEMENT

A conductive lead for connection to a first conductive area of a device having two opposed surfaces with a conductive area comprises an elongated conductive body formed from a substantially flat strip of a resilient material. The conductive body has a pair of opposite arms adapted to engage the opposed device surfaces resiliently. A non-conductive element is held by one arm and is adapted to engage the other surface of the device to insulate the lead from the other surface. The conductive area of the other surface is insulated by the lead and the non-conductive element from the conductive are of the first surface.

Halbleiteranordnung

Terminal mounting for rectangular circuit substrate

Terminal mounting for rectangular circuit substrate has upstanding tulip shaped clips gripping edge of substrate ...

AMPLIFIER ARRANGEMENT.

CIRCUIT MODULE WITH A PLATTENFOERMIGEN CIRCUIT CARRIER FROM GLASS OR CERAMIC(S).

AN ELECTRO-OPTIC CELL.

Arrangement with substrate and at least one chip.

CONTINUABLE HYBRID CIRCUIT ON a SUPPORT COMPRISING an INTERCONNECTED NETWORK HAS HIGH DENSITY

AN ELECTRO-OPTIC CELL IMPROVED

ELECTRONIC CHART COMPRISING A CIRCUIT BOARD PRINTS AND EQUIPMENT CARRIES BY THIS PLATE.

Apparatus and method for establishing a thermal link between a semiconductor package and the cooling plate and an electrical link between the conductors of the package, and a printed circuit board.

The dissipation of the heat is provided for by a dissipator 30 placed beneath a printed circuit board 15. The package 10 containing a component and having conductors 11 which emerge on several sides is positioned on the dissipator 20 so that the conductors 11 can be connected electrically to conductors 16 of the printed circuit, same surrounding two and preferably three sides of the package 10. The package is fixed to the dissipator by an elastic clip. Conduction between the package and the dissipator can be increased by a compressible, heat-conducting material.

Continuous/continuous converter unit having cards with converter sections first/second complementary units mounting holding cards/input/output connections forming/paralleling.

The converter mechanism has several circuit cards (2a,2b) each with a converter section (3). There are input and output connection sections connected to the converter sections. Several first and second complementary units (4) maintain and hold the cards in position, and also connect the input and output connections, connecting the output power wire in parallel.

Modular micro-electronic circuit base - has components on substrates with regularly spaced flexible contacts inserted into racks cooperating with flat contacts on chassis

Solder contact for hybrid circuit - has flexible three pronged fork at end of wire wrap to connect with circuit contact pad

Shielding device for electric component

A shielding device for an electric component mainly includes a first lead, a second lead and a shaped cover constituted of a metallic insert piece. The first and second leads are inserted into two side areas of the electric component respectively, and electrically connected to a ground of a circuit board. The shaped cover contacts with the top of a metallic casing of the electric component and clips onto the two sides of the metallic casing. In effect, the metallic insert piece can reduce noise from the electromagnetic interference, and fix on the metallic casing without electrical welding so that the reliability of assembly will be enhanced.

KAPSLINGSENHET FOR ELEKTRONISKA ANORDNINGAR

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface moun configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Flexible printed circuit board and liquid crystal display device including the same

A flexible printed circuit board includes a base film made of an insulating material, a power application wiring disposed on a first surface of the base film, a bypass wiring disposed on a second surface, opposite the first surface, of the base film, a first connection wiring which electrically connects the power application wiring to the bypass wiring, a second connection wiring spaced apart from the first connection wiring and which electrically connects the power application wiring to the bypass wiring, and a first cover film disposed on the first surface of the base film to cover at least a first portion of the second connection wiring. At least a first portion of the first connection wiring is exposed through the first cover film.

Integrated circuit lead structure

The semiconductor device comprises an insulating foil on which a pattern of conductor tracks is present and a semiconductor body with contact places which are connected to facing ends of the conductor tracks. External conductors are connected to the other ends of the conductor tracks and consist of flat strips which project from an envelope on oppositely located envelope sides, the conductors being provided with a holding element on their end facing the foil, the distance of holding elements of oppositely located conductors being smaller than the foil width at that area. A cooling plate against which the semiconductor body bears with its side remote from the contact places is present near a wall of the envelope.

Solderable lead

A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.

Lightweight audio system for automotive applications and method

A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies ...

LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD

A lightweight radio/CD player for vehicular application is virtually fastenerless and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are ...

Converter device

A plurality of converter circuits is connected in parallel while reducing conduction loss. A converter circuit is formed on each of a plurality of circuit boards, and a plurality of types of terminal connection patterns containing power input terminal connection patterns and power output terminal connection patterns are formed on the end portions of each of the circuit boards with the disposition positions substantially matching each other. The terminal connection patterns at the same position of each circuit board are sandwiched by each of clips of a common terminal member, each of the circuit boards is laminated and fixed, and the converter circuits of each of the circuit boards are connected in parallel. The conduction path for electrically connecting the converter circuit of each circuit board becomes short, making it possible to reduce conduction loss. Also, it is possible to mount a plurality of converter circuits without increasing the occupied area of a motherboard to be mated therewith ...

Contact assemblies for soldering

Solderable electric contact element for PCB or hybrid circuit The contacts are formed as a row in a long strip, e.g. by blanking or stamping. The longitudinal axis of each contact is aligned transversely w.r.t. the longitudinal axis of the strip. The blanking operation leaves a thin edge zone along each side of the strip. The thin edge zones provide a method of holding the contacts until they are separated prior to use. The contacts are stamped in a head to foot pattern, i.e. the head on one contact is next to the spade on the next contact. The result is a reduction in the mfg. cost of the contacts, which are used to connect electronic components, esp. on hybrid circuits or on printed circuits. The strips are provided with holes aligned with the axis of the contacts. These holes provide a method by which the strip may be advanced both during the mfr. of the contacts and during positioning on a substrate forming a support for a hybrid circuit, or alternatively, a pcb.

SHIELDING DEVICE FOR ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a shielding device for electronic apparatus for reducing noise due to electromagnetic field interference and maintaining high transmission quality. SOLUTION: A first lead and a second lead of a metallic inserting member is inserted into both sides of an electronic apparatus, respectively, and then electrically connected with the grounding terminals of a circuit board. Moreover, the inverted U-shaped cover of the metallic inserting member contacts with the upper part of the metallic shell of the electronic apparatus to pinch both sides of the metallic shell. COPYRIGHT: (C)2005,JPO&NCIPI ...

Bauteilanordnung

Es wird eine Bauteilanordnung mit einem elektronischen Bauteil (10) mit wenigstens einem elektrischen Anschlusspin (16); einer Leiterplatte (12) mit wenigstens einer elektrischen Kontaktfläche (14), mit welcher der Anschlusspin (16) des Bauteils (10) in elektrisch leitendem Kontakt steht; und einer Befestigungsvorrichtung zum Sichern des elektrisch leitenden Kontakts zwischen dem Anschlusspin (16) und der Kontaktfläche (14) vorgesehen, bei welchem der Anschlusspin (16) in seinem Endbereich (18) im Wesentlichen parallel zur Leiterplatte (12) verlaufend ausgebildet ist; die Kontaktfläche (14) im Randbereich der Leiterplatte (12) angeordnet ist und die Befestigungsvorrichtung eine auf den Rand der Leiterplatte (12) aufschiebbare Klemme (20) aufweist, die einen ersten Abschnitt (22) auf der der Kontaktfläche (14) abgewandten Seite der Leiterplatte (12) und einen zweiten Abschnitt (24) auf der der Kontaktfläche (14) zugewandten Seite der Leiterplatte aufweist, welche die Leiterplatte (12), die ...

VERFAHREN ZUM VERBINDEN MINDESTENS EINES ANSCHLUSSDRAHTES MIT EINER MIKROSCHALTUNG

Lottragende Artikel und Verfahren zum Zurückhalten einer Lotmasse darauf

Lottragender Artikel umfassen: einen Körper mit einer ersten Fläche, einer zweiten Fläche und einer Vielzahl von darin ausgebildeten Öffnungen; und einer Lotmasse, die sicher durch den Körper gehalten wird, wobei die Lotmasse einen ersten Abschnitt aufweist, der entlang der ersten Fläche angeordnet ist, sodass die Lotmasse über mindestens einige der Vielzahl von Öffnungen angeordnet ist, wobei die Lotmasse einen zweiten Abschnitt aufweist, der entlang der zweiten Fläche und in der Form von mindestens einem Nietkopf angeordnet ist, der einen Teil einer Lötniete bildet, die sich durch eine Öffnung von der ersten Fläche erstreckt und dazu dient, die Lotmasse auf dem Körper sicher zu halten.

Compound component for connection to circuit board - has contact leads on one side of integrated circuit bent twice and their ends soldered to metallised areas on film circuit substrate

The circuit component has two rows of parallel leads to be inserted into the module holes of the printed circuit board. The leads (4a) of one row consist of one row of contact wirres (4) projecting from one long side (3) of the plate-like case (1) of an IC. The leads of the other row consist of contact wires (9) attached to the rectangular, plate-shaped substrate (8) of a film circuit. The row of leads (46) of the IC opposite to those inserted into the circuit board is bent twice at right angles and the ends of the leads soldered to metallised areas of one edge (7) of the substrate (8).

Verbindungseinrichtung fuer gedruckte Leiterplatten

ELEKTRISCHER ANSCHLUSS FÜR OBERFLÄCHENMONTAGE AUF SUBSTRATEN

Holder for hybrid boards having electronic components

A holder (16) is proposed for hybrid boards (10) which are fitted with electronic components and are made contact with on a connection side via connecting pins (13) to conductors on a supporting board, preferably a printed circuit board (12). In order to accommodate such an arrangement in a flat housing it is provided that a lower part (16b), which is seated on the supporting board (12), of the holder (16) holds the connecting pins (13) of the hybrid board (10), and that a part (16a), which is located above it and spaced apart by a distance (A), of the holder (16) holds the lower region (10a) of the hybrid board (10), which makes contact with the connecting pins (13). The upper and lower parts (16b, 16a) of the holder (16) are connected to one another via a film hinge (19), in such a manner that the upper part (16a), together with the hybrid board (10), can be bent around via the film hinge (19), towards supporting board (13), in the region of the connecting pins (13) (Figure 1). <IMAGE>

Transistor mounting apparatus

TERMINALS AND IN THE FORMATION OF ELECTRICAL CONNECTIONS BETWEEN TERMINALS AND CIRCUIT MEMBERS

... 1429031 Soldering E I DU PONT DE NEMOURS & CO 30 April 1973 [1 May 1972] 20439/73 Heading B3R Terminals are soldered to contacts by means of a continuous solder wire in engagement with the terminals, which wire is melted to form individual solder connections between the terminals and the contacts. A terminal strip 10, Fig. 1, comprises a carrier strip 12 with legs 16 extending therefrom, each leg being formed at its end with a pair of spring arms 20, 22 bent to provide smooth contact surfaces 24, 26. The free end of each arm 20 is bent to form a clip 28 and a continuous solder wire 32, possibly including a flux, is clipped into all the clips 28. The terminal strip is mounted, with the aid of pilot holes 18 in the carrier strip, on to the edge of a circuit board and the arms 20 resting against contact pads 38. The terminals and pads are heated to melt the solder wire 32 and the solder coalesces on the individual pads to form spaced connections 40, Fig. 6. After soldering is complete the ...

COMPACT FILTERED ELECTRICAL CONNECTOR

A condensed profile electrical connector to be used in electrically coupling a flexible conductor connector plug to a primary printed circuit board. The electrical connector includes a support unit (11) having a secondary printed circuit board (17) and a connector housing (18), a first plurality of conductors (12) for electrical connection to the flexible conductors, a second plurality of conductors (13) for connecting the first plurality of conductors (12) to the primary printed circuit board, a third conductor (14) comprising a conductive material disposed over a substantial portion of one side of the secondary printed circuit board (17) for providing a ground plane, and a plurality of capacitors (16) for capacitively coupling each of the first conductors (12) to the third conductor (14) for providing EMI filtering. The electrical connector may be connected to the primary printed circuit board in a minimum of profile area (32) and, once connected, provides beneficial EMI filtering and ...

ELECTRICAL CONNECTING DEVICES

... 1369995 Electric couplings INTERNATIONAL COMPUTERS Ltd 25 Aug 1972 [25 Aug 1971] 39870/71 Heading H2E A ceramic i.c. substrate 10 is supported on and connected to a circuit board 11 by connecting devices 1 which also make connection between wiring on opposite faces of the substrate 10. Each device 1 may be formed from a single piece of metal and comprises a central portion from one edge of which extends a leg 17 connected to the board 11 and from the other edge of which extend a leg 18 and two legs 19, bonded, soldered or spot welded to pads 20, 14 on opposite faces of the substrate 10. The bends in the legs 18, 19 are made not too sharp, to prevent solder from lodging in the bends and stiffening the legs 18, 19. The substrate 11 is encapsulated after the devices 1 are connected to it. Another form of connecting device (2, Fig. 4, not shown) may be connected to the substrate 10 at an earlier processing stage.

KLIPS ZUM VERBINDEN ZWEIER PLATTENFÖRMIGER ELEMENTE

BRAIDS WITH PLUMB BOB.

KLIPS FOR CONNECTING TWO OF PLATTENFOERMIGER ELEMENTS

LEAD FRAME CONNECTOR AND ELECTRONIC PACKAGES CONTAINING SAME

SOLDER BONDING PROCESS

TITLE SOLDER BONDING PROCESS Process for locating solder on a precalculated position on an electrical terminal. Metal strip stock coated with a thin layer of solder is fed through a strip guide for precisely positioning the metal strip stock between a pair of rollers. A solder wire is cold bonded to the metal strip stock and the strip stock is subsequently stamped into a terminal.

SOLDER-BEARING TERMINAL

SOLDER BEARING TERMINAL A solderable lead is provided for connecting an electrically conductive element (such as a terminal clip, or a connector contact, or a semiconductor chip holder terminal) to a metallic area on a substrate or the like, the solderable lead having a discrete slug of solder mechanically engaged in a special way in a position to be melted for bonding the lead to the metallic area. In one form of solderable lead, a terminal clip portion adapted to be secured to a metallic area on a second substrate is also provided, the terminal clip portion having one or two additional discrete masses of solder mechanically engaged with the clip portion in position to be melted for bonding the clip to one or two metallic areas on the second substrate. - - - - - - - - - - ...

SOLDER-BEARING LEADS

Lightweight audio system for automotive applications and method

Process allowing to connect a microcircuit to external electric devices

Electrical connection device and manufacturing method thereof.

TAPE CARRIER FOR CONDUCTOR PINS ROUND AND METHOD OF MANUFACTURING

Procédé pour braser des composants électriques avec une carte de circuit imprimé et cadre de brasage pour la mise en oeuvre du procédé

Procédé caractérisé en ce que des composants SMD (éléments en saillie) sont fixés par adhérence sur le côté brasage de la carte de circuit imprimé, le cadre de brasage 10 est déplacé, de sorte que la carte de circuit imprimé est mouillée par la brasure et cadre de brasage pour la mise en oeuvre du procédé comportant un cadre rectangulaire et une fixation 13 constituée d'un matériau refusant le brasage et recevant les cartes de circuits imprimés équipées, cette fixation 13 étant muni sur un de ses côtés longitudinaux d'une rainure s'étendant entre les poutres longitudinales 12 du cadre de brasage 10. L'invention s'applique au procédé pour braser des composants électriques avec une carte de circuit imprimé et cadre de brasage pour la mise en oeuvre du procédé.

PERFECTIONNEMENTS APPORTES AUX CONTACTS A SOUDER

LA PRESENTE INVENTION A POUR OBJET UN ENSEMBLE DE CONTACTS A SOUDER POUR CIRCUIT HYBRIDE RELIES PAR DEUX BANDES LATERALES, DANS LEQUEL LES CONTACTS COMPORTENT CHACUN, A L'UNE DE LEURS EXTREMITES, UNE PINCE PROPRE A S'ENGAGER SUR UN CIRCUIT HYBRYDE, ET SONT INITIALEMENT RELIES L'UN A L'AUTRE A CHACUNE DE LEURS EXTREMITES.

FINAL GRIP CARRYING OF THE WELDING

PROCEDE DE MISE EN PLACE DE QUEUES DE CONNEXION SUR LES BORDS DES SUBSTRATS DE CIRCUITS

LA PRESENTE INVENTION A POUR OBJET UN PROCEDE DE FABRICATION DE SUBSTRATS A USAGE ELECTRONIQUE, DE FORME RECTANGULAIRE, GARNIS DE QUEUES DE CONNEXION SUR LES QUATRE COTES, PINCEES PUIS SOUDEES SUR LES BORDS DU SUBSTRAT ET S'ETENDANT PERPENDICULAIREMENT AU PLAN DE CELUI-CI, LES QUEUES DE CONNEXION SE PRESENTANT INITIALEMENT SOUS FORME D'ENSEMBLES FORMANT DES BANDES, LES QUEUES ETANT SOLIDAIRES, PAR L'EXTREMITE OPPOSEE A CELLE DE LA CONNEXION D'UN BORD NON DECOUPE DE LA BANDE, DANS LEQUEL ON PLACE UNE SERIE DE SUBSTRATS 21, 22, 23, ETC. ENTRE DEUX PREMIERES BANDES 5, 5 DE QUEUES DE CONNEXION, PUIS ON COUPE LES BANDES 5, 5 ENTRE LES SUBSTRATS, ET L'ON INTRODUIT LES SUBSTRATS LATERALEMENT DANS UNE MACHINE POUR LES MONTER ET LES FIXER ENTRE DEUX SECONDES BANDES 8, 8 DE QUEUES DE CONNEXION. SELON L'INVENTION, LES PREMIERES BANDES 5, 5 SONT MOINS LARGES QUE LES SECONDES BANDES 8, 8.

Method of placing connection leads on the edges of circuit substrates

TAPE CARRIER FOR CONDUCTOR PINS ROUND AND METHOD OF MANUFACTURING

Plasma display device having structures for coupling and grounding of circuit board

Switching power-supply module

A switching power-supply module includes a coil pattern of a transformer or an inductor disposed on a substrate. A portion of the coil pattern projects into an edge portion of the substrate. A plurality of terminals are arranged in the substrate edge portion so that they do not touch the coil pattern. The substrate edge portion is soaked in molten solder in the production procedure in order to fix the terminals onto the substrate with solder after components are solder-connected on the substrate. For this reason, the components were previously prohibited from being mounted in the substrate edge portion, and this region has been previously considered to be a dead space. However, in the present invention, since a portion of the coil pattern projects into the substrate edge portion, dead space is minimized, and the size of the substrate, that is, of the switching power supply module is greatly reduced.

Lead, method of assembling an integrated circuit device, integrated circuit device, lead for providing a conductive path and method of providing a conductive path

A lead for achieving solder joining with great vibration strength includes an upper lead portion having a clip and a lower lead portion having a thin tip for insertion into an electrode in a lower substrate and an oblong through hole in the body of the lower lead portion for inducing capillarity of soldering flux.

Support assembly for an integrated circuit package having solder columns

A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.

Flexible connection substrate and folding electronic apparatus

A flexible connection substrate includes a first flexible substrate and a second flexible substrate. The first flexible substrate electrically connects first signal lines that are formed on a first circuit substrate to second signal lines that are formed on a second circuit substrate. The second flexible substrate is a flexible substrate for grounding, has a planar shape that is substantially the same as the first flexible substrate, and contains a conductive material throughout. The second flexible substrate connects to any of a plurality of grounding points that are formed on the first circuit substrate and any of a plurality of grounding points that are formed on the second circuit substrate. The first flexible substrate and the second flexible substrate are bonded to each other on one surface.

Arrangement for mounting a component upstanding on a carrier with surface mounted leads

There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a "Single-In-Line" technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.

Flexible connection substrate and folding electronic apparatus

A flexible connection substrate includes a first flexible substrate (102) and a second flexible substrate. The first flexible substrate electrically connects first signal lines that are formed on a first circuit substrate (100) to second signal lines that are formed on a second circuit substrate (101). The second flexible substrate is a flexible substrate for grounding, has a planar shape that is substantially the same as the first flexible substrate (102), and contains a conductive material throughout. The second flexible substrate connects to any of a plurality of grounding points that are formed on the first circuit substrate (100) and any of a plurality of grounding points that are formed on the second circuit substrate (101). The first flexible substrate (102) and the second flexible substrate are bonded to each other on one surface.

SEMICONDUCTOR MODULE AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a semiconductor module, whose density can be increased and on which other electronic components, such as motherboard and the like can be arranged and installed with satisfactory efficiency in terms of area. SOLUTION: The semiconductor module is provided with a mounting board 1, on which solder balls 2 used to connect interconnections on the motherboard 50, are provided on the rear side, and a plurality of semiconductor packages 4a, 4b, 4c, 4d which are mounted in a multistage manner on the surface of the mounting board and which are connected to electrodes installed on the surface. COPYRIGHT: (C)2002,JPO ...

Randklemme.

Mounting structure for module substrates

Semiconductor hybrid device

A semiconductor hybrid device comprising a ceramic substrate body 2 in the shape of a plane, which body 2 on a first side carries a thick film resistor arrangement 3 and on a second side supports a TTL logic device together with a capacitor, the device having a first set 7 of connection leads which are located in a plane parallel to the body plane and a second set 8 which are offset from said first set.

TERMINALS

SOLDER BEARING TERMINAL CLIP

METHOD OF SOLDERING CONNECTION PINS ON CARRIER STRIPS TO PRINTED CIRCUIT BOARDS AND A DIP SOLDERING BATH FOR PERFORMING THIS METHOD

ELECTRONIC PARTS AND ELECTRONIC DEVICE INCORPORATING THE SAME

AUS TRAEGERPLATTE UND SCHICHTSCHALTUNG BESTEHENDE BAUGRUPPE

KLIPS FOR CONNECTING TWO OF PLATTENFÖRMIGER ELEMENTS.

PLUG CONNECTOR CONTACT FOR HYBRIDS OF ELECTRIC CIRCUITS OF MICROELECTRONICS FOR THE CONNECTION OF A SUBSTRATE TO THE CARRIER

ANSCHLUSSELEMENT FUR EINE TRAGERPLATTE

CONNECTION PORT FUR A TRAGERPLATTE

BAUTEIL MIT LÖTPIN

The arrangement has soldering pins (1) fixed at a component (2) e.g. cooling body, having a front side (3) and a rear side (4). The pins have an end section that projects over a component edge for soldering in a printed circuit board. The component has an opening (5) from the front to the rear sides, where the pins have a middle section and another end section. The pins are inserted into the opening and formed as a bent, strip-shaped sheet metal piece. The end sections are fed through the opening and supported on the rear side, where the middle section is supported on the front side. An independent claim is also included for a method for installing an arrangement for fixing a soldering pin at a component.

Lightweight electronic system for automotive applications and method

A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.

Lightweight audio system for automotive applications and method

A lightweight radio/Audio player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Lightweight audio system for automotive applications and method

A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

INTEGRATED ASSEMBLY PACKAGE MOUNTING CLIP

A mounting clip can be placed and secured over the exterior surfaces of a package of an integrated optical assembly. The mounting clip includes a top panel, end clips that curl and extend down from end edges of the top panel, an interference tab that extends up from the top panel, and cap clips that curl and extend up from the top panel. The mounting clip is dimensioned such that bends in the end clips press and secure against exterior side surfaces of the package of the integrated assembly. Thus, the mounting clip can be secured to the package of the integrated assembly using an interference or friction fit. A cap on a fiber optic cable that extends from the package can be curled around and secured between the interference tab and cap clips of the mounting clip to secure it during surface mounting. 1. A mounting clip for use with a package for a device , comprising:a top panel;at least one package clip that extends at least in part in a first direction from a periphery of the top panel, the at least one package clip including an interference segment to secure the mounting clip on the package; andat least one auxiliary clip that extends at least in part in a second direction from the top panel to secure at least one item over the top panel.2. The mounting clip of claim 1 , wherein:the at least one package clip extends down from an edge of the top panel; andthe at least one package clip comprises an interference segment, a bend at an end of the interference segment, and a clip catch at an end of the bend.3. The mounting clip of claim 1 , wherein the at least one package clip comprises:a first end package clip that extends down from a first end edge of the top panel; anda second end package clip that extends down from a second end edge of the top panel.4. The mounting clip of claim 1 , wherein: an interference tab that extends up from the top panel; and', 'a plurality of clips that extend up from the top panel; and, 'the at least one auxiliary clip comprisessurfaces ...

MECHANICAL CLIP LOCK FOR AN INFORMATION HANDLING SYSTEM

Systems and methods are disclosed for a mechanical clip lock that may include a rigid substrate; a clip lock pin extending vertically from a surface of the rigid substrate; a semi-rigid arm having a first end coupled to the rigid substrate, the semi-rigid arm extending orthogonally from the rigid substrate; a clip lock socket disposed at a second end of the semi-rigid arm opposite the first end, the clip lock socket configured to releasably engage the clip lock pin; and a plurality of clipping pegs extending vertically from the surface of the rigid substrate, each of the plurality of clipping pegs disposed on an exterior portion of the clip lock pin, the plurality of clipping pegs configured to apply a compression force on a device when the clip lock socket and clip lock pin are releasably engaged, the compression force removably coupling the device to a printed circuit board. 1. A mechanical clip lock for removably coupling a device to a printed circuit board (PCB) , the mechanical clip lock comprising:a rigid substrate;a clip lock pin extending vertically from a surface of the rigid substrate;a semi-rigid arm having a first end coupled to the rigid substrate, the semi-rigid arm extending orthogonally from the rigid substrate;a clip lock socket disposed at a second end of the semi-rigid arm opposite the first end, the clip lock socket configured to releasably engage the clip lock pin; anda plurality of clipping pegs extending vertically from the surface of the rigid substrate, each of the plurality of clipping pegs disposed on an exterior portion of the clip lock pin, the plurality of clipping pegs configured to apply a compression force on the device when the clip lock socket and clip lock pin are releasably engaged, the compression force removably coupling the device to the PCB.2. The mechanical clip lock of claim 1 , wherein the mechanical clip lock further comprises:a plurality of fastening wedges disposed on exterior portions of the clip lock socket, the ...

STACKED PACKAGE OF VOLTAGE REGULATOR AND METHOD FOR FABRICATING THE SAME

The present disclosure relates to a stacked package of a voltage regulator and a method for fabricating the same. The method comprises: providing a first chip and a second chip which are integrated with each other, the first chip and the second chip each having a front surface provided with a plurality of bumps; forming a non-conductive layer and a conductive layer side by side on the back surface of the second chip; providing a first leadframe and a second leadframe each having at least a group of leads, the plurality of bumps on the first chip being electrically coupled to the first leadframe, the plurality of bumps on the second chip being electrically coupled to the second leadframe, and the back surface of the second chip being electrically coupled to a back surface of the first leadframe; the first leadframe being electrically coupled to the second leadframe; the first chip, the second chip, the conductive layer, the non-conductive layer, the bumps, the first leadframe, and the second leadframe forms a stacked package to reduce the footprint of a chip and reducing manufacture cost. 1. A method for fabricating a stacked package of a voltage regulator , comprising:forming a first chip by integrating a gate driving circuit with a first power switch, forming a second chip having a second power switch, arranging a plurality of terminals on a front surface of said first chip and on a front surface of said second chip, and arranging a plurality of terminals on a back surface of said second chip;forming a group of bumps corresponding to said plurality of terminals on said front surface of said first chip and on said front surface of said second chip;forming a non-conductive layer and conductive layer side by side on said back surface of said second chip, for electrically insulating said first chip from said second chip and electrically coupling said first chip to said second chip respectively;providing a first leadframe and a second leadframe each having at least a ...

Method for manufacturing a printed circuit board, printed circuit board and rear view device

A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

Emc-filter for suppressing noise signals

The invention which relates to an EMC filter for the suppression of interference signals addresses the problem of specifying a solution with which reworking expenditures of an inverter board are reduced and, additionally, installation space restriction as well as reduction of development and production costs are attained. This problem is resolved thereby that in an EMC filter module at least one core of a choke with a winding is disposed on a first mounting board, that at least one of the capacitors is disposed on the first mounting board, that the first mounting board comprises at least two contact means and that the first mounting board of the EMC filter module is disposed with its contact means on a main board of an inverter and is electrically connected thereto.

Printed circuit board with heat sink

Printed circuit boards (PCBs) may include a heat sink configured to draw heat from a surface-mounted component through the PCB toward a side of the PCB opposite a side having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors that interface between the PCB and a heat sink, or possibly other components.

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate. 1. A package substrate , comprising:a processing device interface;a memory device electrical interface disposed on the package substrate;a removable memory mechanical interface disposed proximately to the memory device electrical interface, the removable memory mechanical interface to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.2. The package substrate of claim 1 , wherein the memory device electrical interface comprises a land grid array.3. The package substrate of claim 1 , wherein the memory device electrical interface comprises an array of pins.4. The package substrate of claim 1 , wherein the removable memory mechanical interface has electrical contacts that are in contact with the memory device electrical interface and has exposed electrical contacts for electrical contact to a mechanical counterpart that is to mate with the removable memory mechanical interface and that is integrated with the memory device.5. The package substrate of claim 1 , wherein the removable memory mechanical interface is a sliding rail socket.6. The package substrate of claim 5 , wherein the sliding rail socket that comprises an array of angled pins claim 5 , sliding grooves on two opposing sides of the socket claim 5 , and a stopping wall.7. The package substrate of claim 6 , wherein the angled pins are slanted toward the ...

PRINTED CIRCUIT BOARD WITH SIDE ACCESS TERMINATION PADS

A printed circuit board provides lateral notches for receiving wire conductors in a lateral direction to be joined with printed circuit board traces by solder or an insulation displacement connector eliminating the need for laborious sequential insertion of conductors through printed circuit board holes. 1. A printed circuit board assembly comprising:a printed circuit board having an insulating, substantially planar and rigid substrate defining opposed laterally extending faces bounded at a periphery by edges, at least one face including adhered, laterally-extending conductive traces; andelectrical components attached to the conductive traces to provide at least a portion of an electrical circuit;wherein at least one edge of the printed circuit board substrate provides a set of notches extending laterally from the edge to a termination point within the periphery;wherein each termination point is partially surrounded by electrically conductive material covering a surface of the face outside the notch about the termination point, the conductive material electrically connected with at least one trace electrically communicating with at least one of the electrical components;whereby electrical wire conductors may be attached to at least one trace of each notch by orienting the electrical wire conductor to extend perpendicularly to the faces and sliding the electrical conductors laterally into the notches to electrically connect with the electrically conductive material.2. The printed circuit board assembly of wherein the electrically conductive material is trace material physically continuous with at least one trace and positioned to be attached to the electrical wire conductor by soldering thereto.3. The printed circuit board assembly of wherein the notches are tapered to have an opening width measured perpendicularly to the extent of the notch between the edge and the termination point greater than a dimension at the termination point measured perpendicularly to an ...

Liquid crystal display device

본 발명은 2개의 데이터 인쇄회로기판의 조립성을 향상시킴과 동시에 접지시킬 수 있도록 한 액정표시장치에 관한 것이다. The present invention relates to a liquid crystal display device capable of improving the assemblability of two data printed circuit boards and simultaneously grounding them. 본 발명의 실시 예에 따른 액정표시장치는 액정패널과, 상기 액정패널에 데이터를 공급하기 위한 구동회로가 실장된 다수의 필름과, 상기 다수의 필름의 일부에 접속된 제 1 데이터 인쇄회로기판과, 상기 다수의 필름의 나머지에 접속된 제 2 데이터 인쇄회로기판과, 상기 제 1 및 제 2 데이터 인쇄회로기판간에 삽입되어 상기 제 1 및 제 2 데이터 인쇄회로기판을 고정하는 클립을 구비하는 것을 특징으로 한다. According to an exemplary embodiment of the present invention, a liquid crystal display device includes a liquid crystal panel, a plurality of films mounted with a driving circuit for supplying data to the liquid crystal panel, a first data printed circuit board connected to a part of the plurality of films, And a second data printed circuit board connected to the remainder of the plurality of films, and a clip inserted between the first and second data printed circuit boards to fix the first and second data printed circuit boards. It is done. 이러한, 본 발명은 클립을 제 1 및 제 2 데이터 인쇄회로기판에 끼움으로써 제 1 및 제 2 데이터 인쇄회로기판을 보텀 커버의 배면에 손쉽게 고정시킴과 동시에 보텀 커버의 배면에 접지시킬 수 있다. 따라서, 본 발명은 클립을 이용하여 제 1 및 제 2 데이터 인쇄회로기판의 조립성 및 접지력을 향상시켜 액정표시장치의 생산성을 향상시킬 수 있다. The present invention can easily fix the first and second data printed circuit boards to the bottom of the bottom cover and ground them to the bottom of the bottom cover by inserting clips into the first and second data printed circuit boards. Accordingly, the present invention can improve the assemblability and the grounding force of the first and second data printed circuit boards using the clip, thereby improving the productivity of the liquid crystal display device.

Thermally decoupling fuse holder and assembly

In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.

Thermally decoupling fuse holder and assembly

In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insultive fuse body is provided to further decouple the fuse element from its surroundings.

Thermally decoupling fuse holder and assembly

In one aspect of the present invention, subminiature fuses are soldered to a PCB via clips attached to the fuse end caps. The clips are physically attached to the PCB pads, enabling the fuse to be replaced if needed and providing thermal decoupling between the fuse and the heating sinking solder/PCB pads. The fuse and clips can also be picked and placed in one operation. In another aspect, improved fuse clips are provided that include tabs that separate the housing portions of the clips from the heating sinking solder/PCB pads. Such improved clips further enhance thermal decoupling. In a further aspect, an improved fuse is provided, in which the thermal decoupling tabs just described are provided directly with the fuse. In yet a further aspect, a thermally insulative fuse body is provided to further decouple the fuse element from its surroundings.

Solder-bearing terminal

A solderable lead is provided for connecting an electrically conductive element (such as a terminal clip, or a connector contact, or a semiconductor chip holder terminal) to a metallic area on a substrate or the like, the solderable lead having a discrete slug of solder mechanically engaged in a special way in a position to be melted for bonding the lead to the metallic area. In one form of solderable lead, a terminal clip portion adapted to be secured to a metallic area on a second substrate is also provided, the terminal clip portion having one or two additional discrete masses of solder mechanically engaged with the clip portion in position to be melted for bonding the clip to one or two metallic areas on the second substrate.

Liquid crystal display and back plate component thereof

本发明公开了一种液晶显示器，包括：背板；液晶显示面板，设置于背板的内侧；电路板，设置于背板的外侧，所述电路板上形成有开孔；其中，液晶显示器进一步包括设置在背板上的夹持件，夹持件包括与背板连接的连接部以及与连接部连接的接触部，接触部上设有凸包，电路板被接触部弹性固定至背板上，且凸包的至少一部分凸伸至所述开孔中。采用上述设计，保证电路板与背板之间连接可靠的前提下可提高电路板组装至背板的效率。

Printed circuit board with side access termination pads

一种印制电路板(10)提供横向凹槽(22)，所述凹槽(22)用于沿横向方向接纳导线(30)以使导线(30)通过焊料或绝缘位移连接器与印刷电路板迹线连接，由此省去将导线通过印刷电路板孔的费力的顺序插入的需要。

Solderless electronic device assembly and manufacturing method thereof

本発明は、電子機器組立体４００およびその製造方法８００、９００、１０００、１２００、１４００、１５００、１６００、１７００を提供する。組立体４００は、はんだを使用しない。部品４０６、またはＩ／Ｏリード４１２を有する部品パッケージ４０２、８０２、８０４、８０６は、８００で、平面基板８０８上に配置される。組立体は、１０００で、成形またはドリリングされて基板８０８を貫通し部品のリード４１２まで至るバイア４２０、１００２と共に、電気的絶縁材料９０８を用いて、９００で、包み込まれる。次いで組立体は、１２００でメッキされ、包み込みおよびドリリングの工程が１５００で繰り返されて、所望の層４２２、１５０２、１７０２が構築される。組立体は、１８００で結合されうる。結合された組立体の中に、ピン２２０２ａ、２２０２ｂ、および２２０２ｃ、メザニン相互接続デバイス２２０４、ヒートスプレッダ２４０２、ならびにヒートスプレッダとヒートシンクの組合せ２６０２を含む品目が、挿入されうる。エッジカードコネクタ２８０２は、結合された組立体に取り付けられうる。

Electro-optical liquid crystal cell

내용 없음 No content

Electrical connection device and associated manufacturing process

Electronic component module

Electronic assemblies without solder and methods for their manufacture

本发明提供电子组件400及其制造方法800、900、1000、1200、1400、1500、1700。组件400不使用焊料。具有I/O引线412的部件406或部件封装体402、802、804、806设置800在平面基板808上。该组件用电绝缘材料908封装900，电绝缘材料908具有形成或钻成1000的通过基板808到达部件引线412的通孔420、1002。然后，该组件被镀覆1200，重复1500封装和钻孔工艺以构建出希望的层422、1502、1702。各组件可以匹配1800。在匹配的组件内，可以插设包括销钉2202a、2202b和2202c、夹层互连装置2204、散热器2402以及散热器和热沉的组合2602的各项。边缘卡连接器2802可以结合到匹配的组件。

Configurations and methods for embedding electronics or light emitters in manufactured materials

Methods and means for embedding electronic components, such as LED-based light sources and associated control circuitry, into molded or continuously cast surface materials (e.g., material manufactured under the trademark CORIAN®). During the manufacture of the surface material, the components can be held in position using a scaffold or frame constructed of a sacrificial material, the same material as the finished surface material and/or another material used in the manufacture of the finished product. The embedded components can include control circuitry, e.g., printed circuit boards, for separately controlling each component, power conductors and data busses. Conductors and/or busses can be in the form of conductive rails, wire mesh or sheets. Access to the conductors in the finished product can be made by a number of methods, including but not limited to sanding, grinding, drilling into, screwing into, and/or inserting pins into the finished material.

Electronic circuit

An electronic circuit for a motor vehicle, in particular in a combination instrument, is disclosed. The electronic circuit comprises a computer unit having at least one microcomputer and application-specific integrated circuits and is arranged in a shielding housing in order to dampen electromagnetic interference. In order to provide improved heat dissipation and RF decoupling, planar areas of the outer shielding are closely electrically and mechanically coupled to corresponding planar areas on the conductor track and, furthermore, the incoming and outgoing lines which may be subject to interference are protected by means of suitable filter measures. <IMAGE>

Electrical switching and control apparatus

The electronic components of an electrical switching and control apparatus (10) are arranged on a hybrid board (11) which is connected with plug contacts (14). To achieve a compact, extremely simple design in which the heat losses at the output components (13) of the hybrid circuit (11) are dissipated, the flat areas (14b) of the plug contacts (14) inside the housing of the device lie against the rear face of the hybrid board (11) to which the output components (13) are contiguously secured. The ends (14c) of the contact parts (14) are in direct contact with the connectors (12) of the hybrid board (11). An apparatus of this type is suitable for switching and control applications and is particularly advantageous when used in motor vehicles.

WELDED ELECTRIC TERMINAL

SUPPORT FOR HYBRID PLATE COVERED WITH ELECTRONIC COMPONENTS

a) Support pour plaque hybride garnie de composants électroniques. b) Support caractérisé en ce qu'il comprend une partie 16b s'appuyant sur la plaque de support 12, et comportant les broches de raccordement 13 de la plaque hybride 10, et à une certaine distance au-dessus de cette partie se trouve une partie 16a du support 16 recevant la zone inférieure 10a de la plaque hybride 10 en contact avec les broches de raccordement 13 et en ce que la partie inférieure et la partie supérieure du support 16 sont reliées l'une à l'autre par une charnière 19 en forme de voile pour que la partie supérieure 16a avec la plaque hybride 10 soient recourbées au niveau des broches de raccordement 13 par-dessus la charnière 19 vers la plaque de support 12.

OLED DIODE SUPPORT WITH ELASTIC CONNECTION SLABS

L'invention a trait à un support de source(s) lumineuse(s) pour module lumineux, notamment pour véhicule automobile, comprenant un substrat (4), au moins une source lumineuse surfacique (8) du type diode à électroluminescence organique supportée par le substrat (4), ladite source ou chacune desdites sources comprend à un ou plusieurs bords au moins deux zones (81, 82, 83) de contact électrique, des pistes électriques (20) déposées sur le substrat (4), et des contacts électriques entre les zones de contact électrique (81, 82, 83) de la ou des sources lumineuses (8) et les pistes électriques. Les contacts électriques comprennent des lamelles élastiques (221, 222, 223) en contact sous pression avec la ou les zones de contact (81, 82, 83) de la ou des sources lumineuses surfaciques (8) et avec les pistes électriques (20) sur le substrat (4). The invention relates to a light source carrier (s) for a light module, particularly for a motor vehicle, comprising a substrate (4), at least one surface light source (8) of the organic electroluminescence diode type supported by the substrate (4), said source or each of said sources comprises at one or more edges at least two areas (81, 82, 83) of electrical contact, electrical tracks (20) deposited on the substrate (4), and contacts between the electrical contact areas (81, 82, 83) of the light source (s) (8) and the electrical tracks. The electrical contacts comprise resilient lamellae (221, 222, 223) in pressure contact with the contact zone or zones (81, 82, 83) of the at least one surface light source (8) and with the electrical tracks (20). on the substrate (4).

Patent FR2328307B1

SUPPORT FOR HYBRID PLATE COVERED WITH ELECTRONIC COMPONENTS

Structure of terminal for print wiring substrate

종래의 프린트배선기판에 대한 단자의 설치구조에서는, 조립에 있어서, 기판(2)의 측단면(2a)쪽으로부터 단자(5)의 대략 ㄷ자형의 유지부(5b)를 기판에 끼워넣을 때에, 기판쪽 또는 단자쪽 중 어느 쪽에도 조립작업을 위한 기준으로 되는 부재(부위)가 형성되어 있지 않아, 단자를 기판에 대해 조립할 때 눈으로 보면서 끼워넣어야 하기 때문에, 단자의 기판에 대한 위치결정을 하기가 어렵고, 수고가 들며, 조립하기 어렵다는 문제가 있다. In the conventional mounting structure of the terminal for the printed wiring board, in assembling, when the substantially U-shaped holding portion 5b of the terminal 5 is inserted from the side end surface 2a of the substrate 2 onto the substrate, Since neither the board side nor the terminal side is provided with a member (part) as a reference for assembly work, it is necessary to visually insert the terminal when assembling the terminal with respect to the board. There is a problem that it is difficult, laborious, and difficult to assemble. 본 발명에 있어서는, 배선패턴(3)과, 측단면에 설치된 슬릿(2b)을 가지는 프린트배선기판(1)과, 상기 프린트배선기판의 배선패턴에 접속된 단자(6)를 구비하고, 상기 단자는, 대향하는 제 1, 제 2 끼워 지지하는 부재(6d, 6e)와 상기한 제 1, 제 2 끼워 지지하는 부재를 연결하는 접속부재(6f)를 가지는 유지부(6a)를 구비하며, 프린트배선기판의 슬릿에 단자의 접속부재를 끼워넣어 단자를 프린트배선기판에 위치결정하고, 제 1 또는 제 2 끼워 지지하는 부재가 배선패턴에 접속되어 있게 하는 것이다. In the present invention, there is provided a printed wiring board (1) having a wiring pattern (3), a slit (2b) provided on the side end surface, and a terminal (6) connected to the wiring pattern of the printed wiring board. Has a holding part 6a having opposing first and second clamping members 6d and 6e and a connecting member 6f for connecting the first and second clamping members, and printing The connecting member of the terminal is inserted into the slit of the wiring board to position the terminal on the printed wiring board so that the first or second sandwiching member is connected to the wiring pattern.

COMBINED RADIATOR AND TERMINAL STRUCTURE FOR A HYBRID INTEGRATED CIRCUIT, AND METHOD FOR MANUFACTURING THE SAME.

Une structure combinée de radiateur et de bornes de connexion pour un circuit intégré hybride comprend une plaque de dissipation de chaleur (2) devant être fixée par un adhésif sur un substrat (1) du circuit intégré hybride, et des bornes (4) à connecter au substrat. La plaque de dissipation de chaleur et les bornes sont formées en une seule pièce avec un cadre commun (5), dans une relation de position mutuelle prédéterminée qui est la même que celle qu'elles prendront par rapport au substrat lorsqu'elles seront connectées à ce dernier. Lorsqu'on utilise cette structure dans la fabrication d'un circuit intégré hybride, on commence par faire adhérer la plaque de dissipation de chaleur (2) au substrat (1), et on connecte ensuite les bornes (4) au substrat (1). A combined heat sink and connection terminal structure for a hybrid integrated circuit comprises a heat dissipating plate (2) to be affixed by adhesive to a substrate (1) of the hybrid integrated circuit, and terminals (4) to be connected. to the substrate. The heat dissipating plate and the terminals are formed in one piece with a common frame (5), in a predetermined mutual positional relation which is the same as that they will take with respect to the substrate when connected to it. this last. When using this structure in the manufacture of a hybrid integrated circuit, the heat dissipating plate (2) is first adhered to the substrate (1), and the terminals (4) are then connected to the substrate (1). .

Solder contact for hybrid circuit - has flexible three pronged fork at end of wire wrap to connect with circuit contact pad

IMPROVEMENTS IN SOLDER CONTACTS SETS

LA PRESENTE INVENTION CONCERNE UN ENSEMBLE DE CONTACTS A SOUDER CONSTITUE PAR UNE BANDE DANS LAQUELLE LES CONTACTS SONT FORMES ET RELIES ENTRE EUX PAR DES BANDELETTES A LEUR EXTREMITE. SELON L'INVENTION, LES CONTACTS 2A ET 2B SONT ALTERNES ET DISPOSES TETE-BECHE. THE PRESENT INVENTION CONCERNS A SET OF CONTACTS TO BE WELDED CONSISTING OF A TAPE IN WHICH THE CONTACTS ARE FORMED AND CONNECTED WITH ONE TO ONE BY STRIPS AT THEIR END. ACCORDING TO THE INVENTION, CONTACTS 2A AND 2B ARE ALTERNATE AND ARRANGED HEAD-SPOUCH.

Patent FR2511549B1

Hybrid circuit which can be transferred to a support containing a high-density interconnection network

The invention relates to a hybrid circuit, regarded as a macro-component which can be transferred to an accepting circuit whose interconnection network, single-layer or multi-layer, is of high density and does not allow holes 5, 7 to be drilled in order to fix the hybrid circuit 9 through the support of the accepting circuit 17. According to the invention, the hybrid circuit 9, which carries an electrical function 13 on a first face 11 of its substrate 10, is provided, on the second face 12 side of the substrate 10, with metal protuberances 14, the free end of which has a bent back shape 15. These protuberances enable the hybrid circuit 9 to be transferred flat to the accepting circuit 17, by soldering to the tracks 16 of the interconnection network. The protuberances consist of metal connections 14 with clip, which are bent once 15, 23 or twice 24, 25, metal beads 26, and thickenings 31 of metal on a transfer contact 28. Application to hybrid circuits connected with large and very large scale integrated circuits, such as microprocessors, having 100 outputs and more, at 250 micron intervals.

METHOD OF MANUFACTURING A CONTACT LEG FOR A COMPONENT TO BE FIXED ON A PRINTED CIRCUIT BOARD

Le procédé de fabrication d’une patte de contact (64) de composant électronique (44 ; 46) destiné à être fixé sur une carte à circuit imprimé (42), comprend les étapes consistant à fournir une plaque métallique (70) présentant sur au moins deux faces principales (701, 702), une couche d’étain (68) ; à réaliser au moins une nervure (74) bordée de deux rainures (76) sur la plaque métallique (70) ; et à découper la au moins une nervure (74) des deux rainures (76) de la plaque métallique (70). Figure pour l’abrégé : Fig. 12 The method of manufacturing an electronic component (44; 46) contact tab (64) for attachment to a printed circuit board (42), comprises the steps of providing a metal plate (70) having on to the at least two main faces (701, 702), a layer of tin (68); in producing at least one rib (74) bordered by two grooves (76) on the metal plate (70); and cutting the at least one rib (74) of the two grooves (76) of the metal plate (70). Figure for the abstract: Fig. 12

ELECTRO-OPTICAL DISPLAY DEVICE

Assembly fixture for connecting printed circuit board at right angles - has two attachment sections with clips which slot into channels on PCBs

La présente invention concerne un ensemble électrique comprenant au moins deux circuits imprimés (200, 250), caractérisé par le fait que l'un au moins comprend au moins une rainure (210, 260) rectiligne s'étendant sur toute son épaisseur et qui débouche sur sa tranche (202, 252) et au moins une pièce de liaison (100) en matériau électriquement conducteur comprenant des structures (113, 133) de liaison électrique et mécanique avec respectivement chacun des deux circuits imprimés (200, 250), lesquelles structures comprennent au moins une fourchette (113, 133) à deux branches (114, 115, 134, 135) adaptées pour être engagées sur un circuit imprimé (200, 250) en regard de la rainure associée (210, 260).

Modular micro-electronic circuit base - has components on substrates with regularly spaced flexible contacts inserted into racks cooperating with flat contacts on chassis

The device consists of at least one rectangular plate constituting a module, which has a rigid ceramic substrate (11) supporting a network of conducting tracks. Integrated components (12), some of which are active, are mounted on the substrate and may be self-protected, or bare, in which case metallic or ceramic covers (13) over one or several components provide protection. Flexible electrical contacts (16) are distributed at regular intervals along one longer edge of the substrate. They are connected to the network tracks and come to rest on the fixed plate contacts of the reception rack when the module is inserted. Curved elastic thin strips (14) are fixed to the centre of each shorter edge of the substrate. These hold the module in the slots of the receiving rack preventing vibration, and are extended at the lower end (15) to limit deformation of the flexible contacts (16). The arrangement provides a reduction in weight and volume, and is partic. intended for aeronautical applications.

IMPROVEMENTS TO WELDING CONTACTS

LA PRESENTE INVENTION A POUR OBJET UN CONTACT A SOUDER DONT L'UNE DES EXTREMITES A LA FORME D'UNE PINCE COMPRENANT UNE FOURCHE ET UNE LAMELLE ELASTIQUE QUI EST DISPOSEE ENTRE LES BRANCHES DE LA FOURCHE, EN SAILLIE PAR RAPPORT AU PLAN DE CES BRANCHES. SELON L'INVENTION UNE BILLE12 EN UN METAL OU ALLIAGE DE SOUDURE EST FIXEE SUR LA LAMELLE ELASTIQUE DE LA PINCE.

INTERCONNECTION DEVICE BETWEEN A MOTHERBOARD AND A MODULE

Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals

본 발명은 모듈의 기판에 리이드 단자를 용이하게 접속할 수 있는 기술을 제공한다. The present invention provides a technique capable of easily connecting a lead terminal to a substrate of a module. 복수의 클립 리이드 단자(20) 각각은 모듈(10)의 기판(12)의 단부(12c) 및 그곳에 형성된 접속단자(14)를 상기 클립부의 클립부재 사이에 삽입함으로써 접속단자(14)와 전기적으로 접속되는 클립부(22)를 그것의 일단에 구비하고, 그것의 다른 단에 리이드부(24)를 구비한다. Each of the plurality of clip lead terminals 20 is electrically connected to the connection terminal 14 by inserting an end portion 12c of the substrate 12 of the module 10 and a connection terminal 14 formed therebetween between the clip members of the clip portion. A clip portion 22 to be connected is provided at one end thereof and a lead portion 24 is provided at the other end thereof. 클립 리이드 단자(20)는 각각의 클립부(22)의 선단이 직선(28) 상에 정렬되면서 서로 평행하게 서로 이격되도록 배치되어 있다. The clip lead terminals 20 are arranged such that the leading ends of the respective clip portions 22 are spaced apart from each other in parallel with each other while being aligned on a straight line 28. 이 클립 리이드 단자(20)는, 연결부(26)로서의 타이 바(26a) 및 안내부재(26b)를 통해 서로 연결되기 때문에, 접속용 클립 리이드 단자(18)를 일체로서 형성한다. Since the clip lead terminal 20 is connected to each other via the tie bar 26a and the guide member 26b as the connection part 26, the clip lead terminal 18 for a connection is integrally formed. 리이드부(24)는 하나 걸러서 굴곡되어 있고, 굴곡된 리이드부(24a)의 선단과 굴곡되지 않은 리이드부(24b)의 선단은 기판(12)의 측면에서 볼 때 서로 평행하다. The lead portion 24 is bent every other, and the tip of the curved lead portion 24a and the tip of the uncurved lead portion 24b are parallel to each other when viewed from the side of the substrate 12.

Electronic component and mounting structure thereof

An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.

Solder-bearing lead

A solder-bearing lead (10) for attachment to the surface of a substrate (39), wherein a discrete mass of solder (24) is mechanically held firmly by the lead (10) in a position permitting close proximity to the substrate surface to connect the lead (10) to the substrate (39) with an electrical and mechanical bond upon melting of the solder (24), the lead body having a pair of fingers (22) partially encircling the solder mass (24) with a gap (32) between the fingers (22) providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate (39) to a second substrate (44), forming a bond between conductive areas (45, 46) on both substrates.

CONNECTION DELAY PLOT FOR FIXING A CLAW SPINDLE ON THE WAFER OF A HYBRID CIRCUIT SUBSTRATE

Oled diode mounting with resilient connection strips

L'invention a trait à un support de source(s) lumineuse(s) pour module lumineux, notamment pour véhicule automobile, comprenant un substrat (4), au moins une source lumineuse surfacique (8) du type diode à électroluminescence organique supportée par le substrat (4), ladite source ou chacune desdites sources comprend à un ou plusieurs bords au moins deux zones (8 1 , 8 2 , 8 3 ) de contact électrique, des pistes électriques (20) déposées sur le substrat (4), et des contacts électriques entre les zones de contact électrique (8 1 , 8 2 8 3 ) de la ou des sources lumineuses (8) et les pistes électriques. Les contacts électriques comprennent des lamelles élastiques (22 1 , 22 2 , 22 3 ) en contact sous pression avec la ou les zones de contact (8 1 , 8 2 , 8 3 ) de la ou des sources lumineuses surfaciques (8) et avec les pistes électriques (20) sur le substrat (4). The invention relates to a light source carrier (s) for a light module, particularly for a motor vehicle, comprising a substrate (4), at least one surface light source (8) of the organic electroluminescence diode type supported by the substrate (4), said source or each of said sources comprises at one or more edges at least two areas (8 1, 8 2, 8 3) of electrical contact, electrical tracks (20) deposited on the substrate (4), and electrical contacts between the electrical contact areas (8 1, 8 2 8 3) of the at least one light source (8) and the electrical tracks. The electrical contacts comprise resilient lamellae (22 1, 22 2, 22 3) in pressure contact with the contact zone or zones (8 1, 8 2, 8 3) of the surface light source or sources (8) and with the electrical tracks (20) on the substrate (4).

Phase shifter, antenna and base station

Printed circuit board for activating and deactivating alarm systems

A printed circuit board including a dielectric material having first and second major surfaces, a predetermined number of electrical conductors attached to the major surfaces, a plurality of slots in the board, the slots beginning at the free edge of the board and continuing inwardly for a predetermined length, a portion of the electrical conductors lying parallel and adjacent to a portion of the longitudinal axis of the slots on both of the major surfaces, and a "U" shaped current carrying connector inserted into one of the slots the terminal free edges thereof in mechanical engagement with a preselected conductor of the first surface and a preselected conductor of the second surface forming an electrical path there between.

Liquid crystal display device

본 발명은 2개의 데이터 인쇄회로기판의 조립성을 향상시킴과 동시에 접지시킬 수 있도록 한 액정표시장치에 관한 것이다. 본 발명의 실시 예에 따른 액정표시장치는 액정패널과, 상기 액정패널에 데이터를 공급하기 위한 구동회로가 실장된 다수의 필름과, 상기 다수의 필름의 일부에 접속된 제 1 데이터 인쇄회로기판과, 상기 다수의 필름의 나머지에 접속된 제 2 데이터 인쇄회로기판과, 상기 제 1 및 제 2 데이터 인쇄회로기판간에 삽입되어 상기 제 1 및 제 2 데이터 인쇄회로기판을 고정하는 클립을 구비하는 것을 특징으로 한다. 이러한, 본 발명은 클립을 제 1 및 제 2 데이터 인쇄회로기판에 끼움으로써 제 1 및 제 2 데이터 인쇄회로기판을 보텀 커버의 배면에 손쉽게 고정시킴과 동시에 보텀 커버의 배면에 접지시킬 수 있다. 따라서, 본 발명은 클립을 이용하여 제 1 및 제 2 데이터 인쇄회로기판의 조립성 및 접지력을 향상시켜 액정표시장치의 생산성을 향상시킬 수 있다.

Electrical assembly comprising at least two printed circuits.

Soldering support terminals

내용 없음. No content.

Electrical resistor having adjustable resistance values

In an electrical resistor (12, 13), the resistance values can be set by means of stamped impressions (17). The electrical resistance tracks (12, 13) are constructed as a film circuit and are arranged on a metal film as a substrate. The substrate is permanently deformed by means of the stamped impressions (17), and the resistance value of the resistance tracks (12, 13) is varied by expansion. The resistance tracks (12, 13) are provided with supply leads (14), and connecting clips (16) are arranged on contact surfaces (15). <IMAGE>

Method of soldering lead terminal to substrate

A METHOD OF PREPARING A SUBSTRATE (1) HAVING TERMINAL ELECTRODES (2.3) WHICH ARE PROVIDED ON ITS BOTH SURFACES AND A THROUGH HOLE (4). HAVING A CONDUCTIVE FILM (5) FORMED ON ITS INNER PERIPHERAL SURFACE. PROVIDED BETWEEN THE TERMINAL ELECTRODES (2.3) MOUNTING A LEAD TERMINAL (9) HAVING A PAIR OF BRANCH PORTIONS (9A. 9B) FOR ELASTICALLY HOLDING SAID TERMINAL ELECTRODES (2, 3) THEREBETWEEN TO THE SUBSTRATE (1), DIPPING THE SUBSTRATE (1) IN MOLTEN SOLDER FROM ITS LOWER SURFACE (1B), DRAWING OUT THE SUBSTRATE (1) AND SOLIDIFYING THE MOLTEN SOLDER, THEREBY SOLDERING THE LEAD TERMINAL (9) TO THE TERMINAL ELECTRODES (2, 3). FIGURE 3

Lightweight audio system for automotive applications and method

A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

Patent JPS5744230B2

A solder substrate clip having a contact arm, a mass of solder secured to the arm on a side away from a contact surface and a solder globule integral with the mass of solder at an edge of the arm extending from the mass across the edge of the arm to the contact surface for engagement with a contact pad on the substrate.

CHAIR FOR A HITCH FOR HORIZONTAL OR VERTICAL MOUNTING

SEMICONDUCTOR DEVICE

Mounting structure for module substrates

A plurality of module substrates have circuit boards, respectively. The circuit boards are stacked with a space therebetween, and are connected to first end portions of connecting members. The second end portions of the connecting members are connected to connecting pads disposed on a motherboard. The module substrates are thus stacked and mounted on the motherboard so as to increase the mounting density. By causing the connecting members for the upper circuit board to project further than the connecting members for the lower circuit board, the connecting members for the upper and lower circuit boards are prevented from touching each other.

Lightweight audio system for automotive applications and method

A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

Fluorescent lamp support

Apparatus and methods for supporting a fluorescent lamp. The apparatus may include a ballast and one or more lamp holders. The lamp holders may be in electrical communication with the ballast via a conductor. One or more lamp holders may be removably attachable to the ballast. When a lamp holder is attached to the ballast, it may be attached in a manner that places the lamp holder in electrical communication with the conductor. The apparatus may include a lamp holder module that may support one or more lamp holders. When a lamp holder is attached to the lamp holder module, it may be attached in a manner that places the lamp holder in electrical communication with a conductor that is configured to distribute power to lamp holders that are attached to the lamp holder module.

APPARATUS AND METHOD FOR ESTABLISHING A THERMAL CONNECTION BETWEEN A SEMICONDUCTOR PACKAGE AND THE COOLING PLATE AND AN ELECTRICAL CONNECTION BETWEEN THE CONDUCTORS OF THE PACKAGE, AND A PRINTED CIRCUIT PANEL

Apparatus and method for incorporating surface mount components into connectors

An apparatus and method for incorporating surface mount components into connectors. In an embodiment, an apparatus that houses a printed circuit board having a surface mount component is provided. The apparatus includes a body. A plurality of leads are fixed to the body so that an external electrical device is enabled to electrically communicate with the leads. A clip extends from each lead and receives an end of a printed circuit board.

Phase shifter, antenna and base station

Embodiments of this application provide a phase shifter, an antenna, and a base station. The phase shifter includes a cavity, a built-in PCB thereof, and a stress relief portion; and the stress relief portion is connected to the PCB, and the stress relief portion is configured to reduce a stress generated due to different coefficients of thermal expansion of the cavity and the PCB. Because the stress relief portion can be configured to reduce the stress generated due to the different coefficients of thermal expansion of the cavity and the PCB, adding the stress relief portion in the phase shifter can avoid tearing a solder joint on the phase shifter, thereby ensuring electrical performance stability of the phase shifter.

Printed circuit board with side access termination pads

A printed circuit board (10) provides lateral notches (22) for receiving wire conductors (30) in a lateral direction to be joined with printed circuit board traces by solder or an insulation displacement connector eliminating the need for laborious sequential insertion of conductors through printed circuit board holes.

Lightweight audio system for automotive applications and method

A lightweight radio/CD player for vehicular application is virtually 'fastenerless' and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Printed circuit board with side access termination pads

인쇄 회로 기판(10)은 인쇄 회로 기판 홀들을 통한 도체의 수고로운 순차적인 삽입에 대한 필요성을 제거하기 위해 솔더 또는 절연 변위 커넥터에 의해 인쇄 회로 기판 트레이스와 결합되도록 와이어 도체(30)를 측방향으로 수용하기 위한 측방향 노치(22)를 제공한다. The printed circuit board 10 laterally couples the wire conductors 30 to the printed circuit board traces by solder or insulation displacement connectors to eliminate the need for laborious sequential insertion of the conductors through the printed circuit board holes. A lateral notch 22 for receiving is provided.

A line interface module

A line circuit module is disclosed which comprises effectively all of the required circuitry for a line card apart from mechanical components such as relays and edge card connectors. The module includes a small ceramic substrate 2.0 inches by 0.825 inches on to which surface mount components which include a heat sensitive integrated circuit and a field effect transistor are mounted to one side and thick film components which include two battery feed resistors are printed on an opposite side. Various innovative techniques are disclosed which significantly reduce compromising component thermal interactions. Heat concerns from using a small thermally conductive substrate have been managed through advantageous use of printed battery feed resistor layouts which provide for larger portions of heat to be dissipated in resistor portions removed from a heat sensitive integrated circuit than resistor portions adjacent to the heat sensitive integrated circuit. Advantageous placement of feed resistor trim links to further manage heat dissipation are also disclosed. A line card which advantageously includes the line module is disclosed.

Solderable terminal for hybrid circuit PCBs - is supplied as band of terminals and mounted on PCB edges

The solderable terminal is for PCB's used in hybrid circuits. The terminals are made in strip form and separated as required and fitted onto the PCB edges. The terminal (2) has an approximately thin rectangular form and has two sprung grips (3, 4) pressed out towards one end mating with the PCB edges. (12). One such grip cna be formed by folding the strip through two 90 deg. angles. The terminals are mounted at 90 deg. to the PCB surface and can be fitted automatically by advancing the strip of terminals using regularly spaced holes (8) in the bands at each end.

Plasma display device with improved circuit board coupling structure and grounding structure

Assembly for foolproof mechanical and electrical connectivitiy between conductors

Assembly for foolproof mechanical and electrical connectivitiy between conductors

An assembly comprising: - a first conductor (3) and a second conductor (4); - a clip (1) for positioning the first conductor (3) and/or the second conductor (4), and for maintaining the conductors (3; 4) in position; and - a connector (2) that engages with the clip (1) to thereby provide mechanical and electrical connectivity between the conductors (3; 4), wherein at least one of the clip (1), the connector (2) and the conductors (3, 4) have an asymmetric structure adapted to foolproof position and connect the first conductor (3) and the second conductor (4).

Unit type clip lead terminal, connecting method of clip lead terminal, board for connecting lead terminal and manufacturing method of board with lead terminal

본 발명은 모듈의 기판에 리이드 단자를 용이하게 접속할 수 있는 기술을 제공한다. 복수의 클립 리이드 단자(20) 각각은 모듈(10)의 기판(12)의 단부(12c) 및 그곳에 형성된 접속단자(14)를 상기 클립부의 클립부재 사이에 삽입함으로써 접속단자(14)와 전기적으로 접속되는 클립부(22)를 그것의 일단에 구비하고, 그것의 다른 단에 리이드부(24)를 구비한다. 클립 리이드 단자(20)는 각각의 클립부(22)의 선단이 직선(28) 상에 정렬되면서 서로 평행하게 서로 이격되도록 배치되어 있다. 이 클립 리이드 단자(20)는, 연결부(26)로서의 타이 바(26a) 및 안내 부재(26b)를 통해 서로 연결되기 때문에, 접속용 클립 리이드 단자(18)를 일체로서 형성한다. 리이드부(24)는 하나 걸러서 굴곡되어 있고, 굴곡된 리이드부(24a)의 선단과 굴곡되지 않은 리이드부(24b)의 선단은 기판(12)의 측면에서 볼 때 서로 평행하다.

Electrical component layout method for printed circuit board and printed circuit board structure thereof

Perpendicular Board connection for Printed Circuit mother Boards

The perpendicular board connection has a bridge section (1) with two end parts (5,6) which mount on the mother board. The bridge section has a swinging arm on either side (11,12) which can be lifted up. The perpendicular board is placed between the two arms and the arms closed to make perpendicular board connection.

Patent DE3743841C2

Adapter board for stacking Ball-Grid-Array (BGA) chips

Electronic devices packaged with arrayed solder balls, leads, or pads, such as Ball Grid Array (BGA) devices, are stacked together. Each stack has a bottom adapter card with metal contacts on a top surface in an array to match the array of solder balls of a lower BGA package, and final bonding pads on a bottom surface that are soldered to an underlying motherboard or printed-circuit board (PCB). An upper BGA package has its solder balls connected to a matching array of metal contacts on a top surface of an intermediate adapter card. Metal traces on the intermediate adapter card connect to lead frame pins that wrap around the edge of the intermediate adapter card and make contact with peripheral pads on the top surface of the bottom adapter card. Lead frame pins and peripheral pads can connect several intermediate adapter cards together with one bottom adapter card.

The nothing of inexpensive excellent performance buries block RF power amplifiers

公开了功率放大器组件和构件。根据一些实施例，提供了一种功率放大器组件(10)，其包括功率放大器(12)，功率放大器具有带有栅极接触表面的栅极引线(14)、带有漏极接触表面的漏极引线(13)，以及具有长度和宽度的源极接触表面(15)。延伸散热片(11)相靠源极接触表面安装，以将热传导离开(18)表面且延伸源极的电路径。延伸散热片至少具有大于源极接触表面的长度的长度。

Flexible wiring board and folding electronic device

Hybrid printed circuit board

ABSTRACT OF THE DISCLOSURE A hybrid printed circuit board that has at least one circuit device thereon and has leads mounted on at least one outside edge of the board. The hybrid printed circuit board also has a lead-free area within the lead disposing outside edge of the board that reduces the mounting space necessary for the board.

Semiconductor hybrid device

A semiconductor hybrid device comprising a ceramic substrate body 2 in the shape of a plane, which body 2 on a first side carries a thick film resistor arrangement 3 and on a second side supports a TTL logic device together with a capacitor, the device having a first set 7 of connection leads which are located in a plane parallel to the body plane and a second set 8 which are offset from said first set.

SOLDERABLE CABLE.

Patent JPS4847275A

Method and holding fixture for soldering lead frames to hybrid substrates

A fixture is provided for holding a hybrid substrate having a plurality of components already soldered to conductive patterns and/or lands on the front side thereof and having fingers of a lead frame pressed over one edge thereof for dip soldering lead frame fingers to lands. The fixture comprises a flat plate having a plurality of titanium clips or hook elements extending below the bottom edge of the plate, assembled hybrid substrates being loaded into the fixture with the base of the lead frame resting on the hooks. Slots cut in the front of the plate define a rib that extends over the length of the plate near the bottom edge. The rib contacts the backside of a substrate to form an air gap that prevents flux and solder wicking up it. A hinged cover rests against components on a substrate to hold the latter in place. Only the hook ends of the titanium clips, the lead frame, and a portion of the substrate adjacent the one edge are dipped into molten solder to solder lead fingers to associated lands. A two-piece mounting assembly on one side of the plate provides adjustment for making the one edge of the substrate and base of the lead frame parallel to the surface of the solder.

Terminal pad for fixing a clawed pin to the edge of a hybrid circuit substrate and a connection formed thereby

The edge terminal pad is intended to receive a connection pin (30). It has two tinnable area solder blobs (17, 18) placed overlying each other on opposite faces of a margin of a substrate (10) at locations which are grasped by the claws (33, 34, 35) of the pin (30), with said claws forming the jaws of a resilient clamp. The tinnable area solder blob (17, 18) are notched by grooves (19, 20) at the locations of slide paths followed by the claws (33, 34, 35) while the pin (30) is being put into place. For a pin (30) having three claws with the combined width of all three claws being the same as the width of a terminal pad, one of the pad's tinnable area solder blobs (17) is generally U-shaped, while the other (18) is generally T-shaped. The advantage of the grooves is to restrict the amounts by which the clamp of the pin needs to open and to automatically center the pin on the pad, providing the pin is put into place after the tinnable areas (17, 18) have already been tinned.

Solder terminal

A solder terminal (10) includes a clip (16) adapted to be positioned on one edge of a substrate (42) for forming soldered connections with substrate pads (44). A leg (12) extends from the clip for forming an electrical connection with a circuit component.

APPARATUS AND METHOD FOR THE PERFECTED THERMAL COUPLING OF A SEMICONDUCTOR CONTAINER TO A COOLING PLATE AND THE INCREASED ELECTRICAL COUPLING OF CONTAINER CONDUCTORS ON MORE THAN ONE SIDE OF THE CONTAINER ON A CIRCUIT BOARD.

Case for circuit board for horizontal or vertical mounting

A case (10) for an auxiliary circuit board (12) to be mounted on a main circuit board (16) includes a copper formed into a U-shape in which the auxiliary circuit board is mounted. Mounting pins (32) extend from two edges of the case for positioning the auxiliary circuit board perpendicularly to o r parallel to the main circuit board.

Patent FR2124508A1

Lead frame for semi-conductor device

A lead frame for orienting and then mounting a plurality of clip leads on a semi-conductor device or substrate and method.

Removable electrical contact between one rigid circuit, e.g. electronic module and another rigid circuit, e.g. motherboard

La tête de broche 7 comporte une languette élastique 9 dont l'élasticité assure d'une part une insertion à faible force dans le trou métallisé 2, d'autre part une pression dans le trou métallisé 2 susceptible d'assurer une connexion électrique et une tenue mécanique satisfaisantes.