Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication

19-12-2002 дата публикации

Номер:

WO2002100771A2

Автор: Khalil Najafi, Luis P. Bernal, Peter D. Washabaugh, Tsung-Kuan A. Chou

Принадлежит: THE REGENTS OF THE UNIVERSITY OF MICHIGAN

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

B B8 B81 B81B B81B2 B81B22 B81B220 B81B2203 B81B2203/B81B2203/0 B81B2203/03 B81B2203/032 B81B2203/0323 B81B7 B81B7/B81B7/0 B81B7/00 B81B7/005 B81B7/0051 B81C B81C2 B81C22 B81C220 B81C2203 B81C2203/B81C2203/0 B81C2203/01 B81C2203/011 B81C2203/0118 B81C2203/019 B81C2203/03 B81C2203/032 B81C3 B81C3/B81C3/0 B81C3/00 B81C3/001

IPC - классификация

B B8 B81 B81C B81C3 B81C3/B81C3/0 B81C3/00 B81C3/001

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