07-01-2021 дата публикации
Номер: US20210002127A1
Принадлежит:
The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures. 1. An arrangement comprising:a microelectromechanical, MEMS, structure including at least one active element, the MEMS structure comprising a substrate, at least one layer formed on the substrate forming at least part of the at least one active element, mechanical contact areas through which the MEMS structure is connectable to other structures, and trench weakenings included around the mechanical contact areas for eliminating thermal mismatch between the at least one active element of the MEMS structure and the other structures, andan integrated circuit, whereinthe MEMS structure comprises an encapsulation, the MEMS structure being assembled directly on the integrated circuit, the integrated circuit forming part of the encapsulation.2. The micromechanical structure of claim 1 , wherein the integrated circuit comprises a read-out application specific integrated circuit claim 1 , ASIC.3. The micromechanical structure of claim 2 , wherein the MEMS structure comprises one of the following: a resonator claim 2 , a gyroscope claim 2 , an accelerometer claim 2 , an acoustic or ultrasonic microphone claim 2 , a capacitive micromechanical ultrasonic transducer claim 2 , a piezo micromechanical ultrasonic transducer claim 2 , a micromechanical mirror structure claim 2 , a magnetometer claim 2 , a Fabry-Perot interferometer ...
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