Vorrichtung zum Kuehlen von fluessigkeitsdichten und waermeempfind-lichen Bauteilen beim Anloeten ihrer Anschlussdraehte an die flaechigen Leiterzuege von isolierenden Platten

Thermische Schutzvorrichtung

LOETMASCHINE.

HEAT PROTECTIVE ARTICLES

A heat protective article 50 is a mat made of a heat resistant material. The mat has a through-hole 52 and an opening 54 extending from an edge 56 of the mat to the through-hole. A flap 60 is provided for selectively covering the opening 54. The heat protective article 50 can be fitted around a pipe by working the pipe along the opening 54 until it is received in the hole-hole. The heat protective article can then be orientated so that it provides suitable protection for adjacent surfaces during a process, such as soldering a joint, that requires the application of heat to the pipe.

COOLING SYSTEM TO REDUCE LIQUID METAL EMBRITTLEMENT IN METAL TUBE AND PIPE

A system and method for cooling a heat exchanger.

DEVICE FOR COOLING PRINTED CIRCUIT BOARDS.

Shock-absorbing heat shield

Shock-absorbing heat shield, esp. to insulate vehicle base parts, comprises a stable carrier layer carrying an insulating mat made of a porous structure and which is provided, on its side facing away from the carrier layer, with a protective coating. The carrier layer, insulating mat and protective coating are made of Al or Al alloy. The components of the porous structure are made of different Al materials together.Prodn. of the shield is also claimed.Thread-like or chip-like components of different Al materials are mixed to form a loosely bound structure. The insulating mat is then formed by soldering the components of the structure together.The components of the structure are coated with a soft solder. The components of the structure are made of Al-Si and connected to each other by hard soldering.

Procedure and device for laying on plumb bob on a substrate.

Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Auftragen von Lot auf Substratplätze eines Substrats (1). Das Verfahren umfasst: A) Bewegen des Dispenserkopfs (2) an eine vorbestimmte Position oberhalb des nächsten Substratplatzes, auf dem Lot aufzutragen ist, B) Absenken eines an einem Ultraschallkopf (4) des Dispenserkopfs (2) angebrachten Stempels (5), bis eine Arbeitsfläche (11) des Stempels (5) den Substratplatz berührt, C) Aufbringen von Lot auf den Substratplatz durch: C1) Vorschieben eines Lotdrahts (8), bis der Lotdraht (8) den Substratplatz berührt, C2) weiter Vorschieben von Lotdraht (8), um eine vorbestimmte Menge Lot zu schmelzen, und C3) Zurückziehen des Lotdrahts (8), D) Bewegen des Dispenserkopfs (2) entlang einer vorbestimmten Bahn, um das Lot auf dem Substratplatz zu verteilen, wobei der Stempel (5) mit Ultraschall beaufschlagt wird, und E) Abheben des Stempels (5) vom Substratplatz, wobei die Arbeitsfläche (11) des Dispenserkopfs (2) eine Ausnehmung (12) ...

Procedure and device for laying on fluxing agent-free plumb bob on a substrate.

Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Auftragen von flussmittelfreiem Lot auf Substratplätze eines Substrats (1). Die Vorrichtung weist einen Dispenserkopf (2) auf, der einen mit Ultraschall beaufschlagbaren Stempel (5) und eine Drahtzuführung (6) umfasst. Der Stempel (5) hat eine Arbeitsfläche (11) mit einer zu einer Seitenfläche (13) des Stempels (5) hin offenen Ausnehmung (12). Das Verfahren umfasst folgende Schritte: A) Bewegen des Dispenserkopfs (2) an eine vorbestimmte Position oberhalb des nächsten Substratplatzes, auf dem Lot aufzutragen ist, B) Absenken des Stempels (5), bis die Arbeitsfläche (11) des Stempels (5) den Substratplatz berührt, C) Aufbringen von flussmittelfreiem Lot auf den Substratplatz durch: C1) Vorschieben des Lotdrahts (8), bis der Lotdraht (8) den Substratplatz berührt, derart, dass die Spitze des Lotdrahts (8) den Substratplatz innerhalb der Ausnehmung (12) des Stempels (5) berührt, C2) weiter Vorschieben von Lotdraht (8), um eine vorbestimmte ...

Method and apparatus for applying flux free solder to a substrate.

Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Auftragen von flussmittelfreiem Lot auf Substratplätze eines Substrats (1). Die Vorrichtung weist einen Dispenserkopf (2) auf, der einen mit Ultraschall beaufschlagbaren Stempel (5), einen Antrieb (17) zum Auf- und Abbewegen des Stempels und eine Drahtzuführung (6) umfasst. Der Stempel (5) hat eine Arbeitsfläche (11) mit einer zu einer Seitenfläche (13) des Stempels (5) hin offenen Ausnehmung (12). Das Verfahren umfasst folgende Schritte: A) Bewegen des Dispenserkopfs (2) an eine vorbestimmte Position oberhalb des nächsten Substratplatzes, auf dem Lot aufzutragen ist, B) Absenken des Stempels (5), bis die Arbeitsfläche (11) des Stempels (5) den Substratplatz berührt, C) Aufbringen von flussmittelfreiem Lot auf den Substratplatz durch: C1) Vorschieben des Lotdrahts (8), bis der Lotdraht (8) den Substratplatz berührt, derart, dass die Spitze des Lotdrahts (8) den Substratplatz innerhalb der Ausnehmung (12) des Stempels (5) berührt ...

heizund coolable suction device with a tool.

Ein Werkzeug hat ein Saugorgan (2) und einen Heizer (3) mit einander gegenüberliegenden Kontaktflächen (9, 10). Die Kontaktfläche (10) des Saugorgans (2) und/oder die Kontaktfläche (9) des Heizers (3) weist mindestens eine Vertiefung (12) auf, um zwischen dem Saugorgan 2 und dem Heizer (3) mindestens eine Kammer (7) zu bilden. Der Heizer (3) weist mindestens eine Bohrung (15) auf, die in die mindestens eine Kammer (7) mündet. Der Heizer (3) ist beweglich und federnd am Saugorgan (2) gelagert. Der mindestens einen Bohrung (15) ist zum Kühlen des Saugorgans (2) ein unter Druck stehendes gasförmiges Medium zuführbar. Das gasförmige Medium bewirkt, dass der Heizer (3) vom Saugorgan (2) abhebt, so dass zwischen den Kontaktflächen (9, 10) des Heizers (3) und des Saugorgans (2) ein Spalt entsteht, durch den das gasförmige Medium strömt und in die Umgebung gelangt.

Tool for welding semiconductor chip used in semiconductor industry, has heater that is separated from inhaler and gas in pressurization state flow through gap

Ein Werkzeug hat ein Saugorgan (2) und einen Heizer (3) mit einander gegenüberliegenden Kontaktflächen (9, 10). Die Kontaktfläche (10) des Saugorgans (2) und/oder die Kontaktfläche (9) des Heizers (3) weist mindestens eine Vertiefung (12) auf, um zwischen dem Saugorgan 2 und dem Heizer (3) mindestens eine Kammer (7) zu bilden. Der Heizer (3) weist mindestens eine Bohrung (15) auf, die in die mindestens eine Kammer (7) mündet. Der Heizer (3) ist beweglich und federnd am Saugorgan (2) gelagert. Der mindestens einen Bohrung (15) ist zum Kühlen des Saugorgans (2) ein unter Druck stehendes gasförmiges Medium zuführbar. Das gasförmige Medium bewirkt, dass der Heizer (3) vom Saugorgan (2) abhebt, so dass zwischen den Kontaktflächen (9, 10) des Heizers (3) und des Saugorgans (2) ein Spalt (21) entsteht, durch den das gasförmige Medium strömt und in die Umgebung gelangt.

permutador de calor interno (ihex) para resfriamento interno de dois tubos soldados

Method and apparatus for forming solder bump

DEVICE FOR THERMAL MANAGEMENT OF SURFACE MOUNT DEVICES DURING REFLOW SOLDERING

An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device. 1. An apparatus comprising:a top plate sized to cover a plurality of components for a printed circuit board (“PCB”) in a reflow solder operation to attach the plurality of components to a top surface of the PCB; and one or more heat shielding devices, each heat shielding device reducing heat transfer to a component to be soldered to the PCB during the reflow solder operation and each heat shielding device positioned in the top plate to decrease heat to the component corresponding to the heat shielding device; and', 'one or more heat attracting devices, each heat attracting device increasing heat transfer to a component to be soldered to the PCB during the reflow solder operation and each heat attracting device positioned in the top plate to increase heat to the component corresponding to the heat attracting device,, 'one or more of'}wherein the top plate is coupled to the one or more heat shielding and heat attracting devices and the top plate comprises a recess for each component of the plurality of components configured with a heat shielding device or a heat attracting device.2. The apparatus of claim 1 , wherein each recess is sized with ...

Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering

A method of wave soldering a circuit board while avoiding reflow of a solder joint on the topside of the board from heat conducted from the solder wave through at least one via in the board in heat conducting relation with the topside solder joint, comprises subjecting the circuit board to a solder wave and absorbing heat being conducted from the solder wave through the at least one via with an endothermic material in the via hole which undergoes a heat absorbing reaction. The heat absorbing reaction of the endothermic material is preferably a phase change, such as melting. The melted endothermic material is retained in the via hole during wave soldering by capillary forces and a cap on the lower end of the via hole. A disclosed method of making the circuit board includes locating the endothermic material in the via hole by inserting a preform of the endothermic material into the via hole or hot dispensing the endothermic material into the via hole. An electronic board product for practicing ...

Methods and apparatus for installing a module on a circuit board using heating and cooling techniques

The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to temperature that is lower than that of the perimeter portion. Heating the perimeter portion of the module melts solder disposed between contact members of the module and corresponding contact members of the circuit board in order to form solder connections. Bringing the inner portion of the module to temperature that is lower than that of the perimeter portion reduces the likelihood of causing heat-related damage to the module itself. One arrangement of the invention is directed to a module installation system for installing a module on a circuit board. The module has a perimeter portion and an inner portion. The module installation system includes a heating source, a cooling source, and a nozzle coupled to the heating and cooling sources. The nozzle is configured to simultaneously heat the perimeter ...

Apparatus For Dispensing Flux-Free Solder On A Substrate

An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by: 116-. (canceled)17. An apparatus for dispensing flux-free solder onto substrate places of a substrate , comprisinga dispenser head, which is movable in two horizontal directions, and, optionally, in the vertical direction, comprisingan ultrasonic head,a stamp having a working surface, which has a recess open toward a lateral surface of the stamp, wherein the stamp is fastenable on the ultrasonic head,a wire feed having a nozzle having a longitudinal borehole configured to guide the solder wire, wherein the wire feed is mounted on the dispenser head such that an axis, which extends through the longitudinal borehole of the nozzle, enters at the lateral surface of the stamp into the recess and is incident on the substrate within a part of the working surface bounded by the recess, anda cooling device, which is configured to keep the working temperature of the stamp at a predetermined temperature.18. The apparatus according to claim 17 , further comprisinga further cooling device for cooling the nozzle of the wire feed.19. The apparatus according to claim 17 , further comprisinga drive fastened on the dispenser head, which is configured to move the ultrasonic head with the stamp up and down in the vertical direction.20. The apparatus according to claim 18 , further comprisinga drive fastened on the dispenser head, which is configured to move the ultrasonic head with the stamp up and down in the vertical direction.21. The apparatus according to claim 17 , wherein the recess of the stamp is coated with a material which is poorly wettable by flux-free solder.22. The apparatus according to claim 18 , wherein the recess of the stamp is coated with a material which is poorly wettable by flux-free solder.23. The apparatus according to claim 19 , wherein the recess of the stamp is coated with a material which is poorly wettable by flux ...

SOLDERING TOOL FOR INDUCTIVE SOLDERING

A soldering tool for inductive soldering, includes an induction loop and an induction generator that is electrically conductively connected to the induction loop, wherein the induction loop consists of a metal profiled element, has at least one U-shaped region or two U-shaped regions, and each U-shaped region has in each case two legs and an end region connecting the legs, the at least one U-shaped region has a length L of at least 3 mm to 500 mm and a width B of 2 mm to 30 mm. 1. Soldering tool for inductive soldering , comprisingan induction loop andan induction generator that is electrically conductively connected to the induction loop,wherein the induction loopconsists of a metal profiled element,has at least one U-shaped region or two U-shaped regions, and each U-shaped region has in each case two legs and an end region connecting the legs,the at least one U-shaped region has a length L of at least 3 mm.2. The soldering tool according to claim 1 , wherein the end region is rounded.3. The soldering tool according to claim 1 , wherein the end region has a first arcuate section claim 1 , a rectilinear section claim 1 , and a second arcuate section.4. The soldering tool according to claim 1 , wherein the induction loop has no soft magnetic material in its active area.5. The soldering tool according to claim 1 , wherein the induction loop contains or is substantially made of copper or silver-plated copper claim 1 , aluminum claim 1 , or metallic sintered materials.6. The soldering tool according to claim 1 , wherein the induction loop has claim 1 , at least in sections claim 1 , a non-magnetic enclosure.7. The soldering tool according to claim 1 , wherein the induction loop is a hollow profiled element.8. Device for inductive soldering of at least one contact element to at least one conductor structure on a nonmetallic plate claim 1 , comprisingmeans for fastening a plate during the soldering operation,{'b': '13', 'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'at ...

Apparatus for Thermal Melting Process and Method of Thermal Melting Process

Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate.

DEVICE FOR SOLDERING COMPONENT TO CIRCUIT BOARD

PROBLEM TO BE SOLVED: To obtain a soldering device which can efficiently cool a circuit board and components. SOLUTION: A soldering device has a conveyor 12 which carries substrates 15 through a preheating zone 16 and a cooling zone 22 through which a molten solder wave containing a turbulent flow wave 18 and a laminar flow wave 20 and the substrates 15 coming out of the laminar wave 20 flow in a tunnel 14. The soldering device also has at least one distribution manifold 24 provided with an inlet port for receiving a pressurized cooling gas and at least one outlet nozzle 28 which directs the cooling gas toward the substrates 15, quickly cools the substrates 15 and components, and is positioned in the tunnel. COPYRIGHT: (C)1997,JPO ...

System und Verfahren zum Anbringen elektronischer Komponenten auf flexiblen Substraten

Verfahren und Vorrichtung zum Aufschmeltzlöten

Improvements in heat protection or heat screen devices

... 751,910. Screens for intercepting heat. AKTIEBOLAGET M. SIEVERT. July 8, 1954 [July 8, 1953], No. 20047/54. Class 51(2). A screen for intercepting heat in brazing &c. operations comprises two metal sheets 2 formed with retaining flanges 4 for a lining of asbestos sheet, side reinforcing bars 6 secured to the sheets and pivotally connected by rivets 7, and arms 9 secured to the bars 6 by screws and wing nuts 10 so that the screen may be adjustably located on a tube 1 or other workpiece. One of the plates has a flange 8 which covers the gap between the said plates.

Soldering apparatus and a method thereof

PROCEDURE AND DEVICE FOR THE TEMPERATURE TREATMENT, IN PARTICULAR PLUMB BOB CONNECTION

PROCEDURE FOR THE WAVE SOLDERING OF PRINTED CIRCUIT BOARDS

Method and device for heat treatment, especially connection by soldering

HEAT TRANSFER DEVICE FOR PRODUCING A SOLDERED CONNECTION OF ELECTRICAL COMPONENTS

The invention relates to a heat transfer device (10, 110, 210) for thermal coupling of a component (28, 128) to be soldered, comprising a heat source and/or a heat sink (48) in a soldering machine (200), having at least one base plate (12, 112, 212) which is designed to be in thermal contact at least with the heat source and/or the heat sink (48). The base plate (12, 112, 212) has a plurality of contact units (14, 114, 124) having a respective contact surface (24, 124), wherein the contact surfaces (24, 124) are thermally contactable to the components (28, 128). The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component can be changed. The invention further relates to a soldering device (200), in particular a vacuumable soldering device having at least one such heat transfer device (10, 110, 210).

GAS KNIFE COOLING SYSTEM

A gas knife cooling system for reflow soldering cools soldered articles (12) by impinging a gas flow directly on the articles and as a result uses less cooling gas. A heater (32) is associated with the cooling system to remove flux deposits. The cooling system is installed in the cooling section (18) o f a reflow soldering apparatus and comprises at least one gas knife (24, 25) t o direct a gas stream at soldered products (12) passing through the cooling section (18) on a conveyor (14). A heater (32) is associated with the gas knife (24, 25) which is activated for predertermined cleaning cycles to heat the gas knife (24, 25) to a temperature above flux vaporization temperature of flux deposits from the soldered products (12).

HEAT TRANSFER DEVICE FOR FORMING OF SOLDERED JOINT ELECTRIC COMPONENTS

Accumulator welding process

Electric welding device for computer technology research

Welding equipment and welding method for micro thermoelectric devices

DEVICE FOR SUPPLYING AN INERT GAS TO A WAVE SOLDERING INSTALLATION

Method for preventing solder rise to electric contact and electric contact produced by the same

PLUMBER'S HEAT SHIELD

A plumber's heat shield comprises an arcuate metallic shell attached to a spring-clamp by means of an obedient shaft which enables the heat shield to be moved to any position relative to the spring-clamp. The arcuate shell is preferably formed from aluminum or other material having high infrared reflectivity. The obedient shaft is preferably formed from helically-wound steel spring outer sheath surrounding a ductile copper wire core. The spring steel outer sheath prevents the ductile copper wire core from being bent at too sharp of a radius (which would cause the ductile core to work-harden and fracture) while at the same time protecting the ductile copper wire core from the open-flame of the soldering torch.

Methods And Apparatuses For High Temperature Bonding Controlled Processing And Bonded Substrates Formed Therefrom

Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways. 1. A sinter fixture device for use in a controlled processing of high temperature bonding of substrates , the sinter fixture device comprising:a base body comprising a metal that is at least one of copper and aluminum;a plate surface that is shaped to contact and conform to a contacting surface of a substrate assembly, wherein the substrate assembly comprises a low melting point material and one or more high melting point materials between first and second substrates, the one or more high melting point materials having a melting temperature that is higher than a melting temperature of the low melting point material; and a first set of the plurality of channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another; and', 'a second set of the plurality of channels includes a plurality of heating element passageways., 'a plurality of channels below the plate surface within the base body of the sinter fixture device shaped to receive heating and cooling elements, wherein2. The sinter fixture device of claim 1 , ...

Device for cooling freshly-soldered circuit boards

Electrical circuit boards are cooled immediately after passing through a soldering work station wherein heat-sensitive electrical components are mechanical soldered into such circuit boards so as to minimize dangerous temperature peaks without disrupting the soldering process. The cooling device is positioned closely adjacent to the soldering work station and comprises a housing having a C-shaped passageway along the center thereof for receiving an elongated transport means carrying freshly-soldered circuit boards in a given direction from the solder soldering work station. Air flow means are provided at opposite wall portions of the passageway for directing a stream of cooling air against opposite sides of the circuit boards carried by the transport means and approximately at right angles to the travel directions of such boards.

Soldering method and apparatus

An component or connector lead (12) is soldered to a bare copper metallized area (14) on a circuit board (16) using core solder (26) by manually applying heat from a heated tip (24) to a separate one of the lead and metallized area. As the heat is being applied, a vacuum is drawn in the region where the solder is applied to the lead and/or metallized area to draw off any flux vapors created upon heating of the solder. At the same time, hot air is also directed into the region where the solder is being applied to maintain the flux vapors, created upon heating of the solder, in their vaporous state to facilitate such vapors being drawn off, thereby reducing the amount of flux residues resulting from the soldering operation.

Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow

An evaporative cooling vessel (100) for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The evaporative cooling vessel (100) includes a cavity (105) for holding a fugitive material (107) at the housing (111) of an electronic part to maintain the housing at or below a specified temperature. As heat is applied during solder reflow, the electronic part is subjected to a high temperature capable of allowing solder to melt. Thus, the part housing (111) of the electronic part can be controlled at a substantially lower temperature than the reflow temperature. This allows the evaporative cooling vessel (110) to use the evaporative cooling properties of the fugitive material to prevent damage to the electronic part.

GAS COOLING DEVICE AND REFLOW OVEN USING THEREOF

The present invention discloses a gas cooling device and a reflow oven using thereof. The gas cooling device comprises a liquid cooling machine, a plurality condensers and a plurality of outer sleeves. The condensers are disposed in parallel and connected to the liquid cooling machine, in which two ends of all the condensers are separately connected with valves. The outer sleeves are sleeved out of the condensers and communicatively connected in order, in which the outer sleeves disposed at two ends are provided, respectively, with a gas inlet and a gas outlet and each of the condensers is provided with a water outlet. Each of the condensers is formed a circulation with the cooling device. Even though any of the condensers is detached, other condensers are able to continue operating as long as the valves disposed at the two ends of the detached condenser are closed. 1. A gas cooling device , comprising:a liquid cooling machine;a plurality of condensers disposed in parallel and connected to the liquid cooling machine, wherein two ends of all the condensers are separately connected with valves; anda plurality of outer sleeves sleeved out of the condensers and communicatively connected in order, wherein the outer sleeves disposed at two ends are provided with a gas inlet and a gas outlet, respectively, and each of the outer sleeves is provided with a water outlet.2. The gas cooling device according to claim 1 , wherein the inlet and the outlet of the liquid cooling machine are connected with valves claim 1 , respectively.3. The gas cooling device according to claim 2 , wherein the water outlet of each of the outer sleeves is connected with a valve.4. The gas cooling device according to claim 3 , wherein the valves disposed at the two ends of each of the condensers are mechanical valves claim 3 , the valves disposed at the inlet and the outlet of the liquid cooling machine are mechanical valves claim 3 , and the valve disposed at the water outlet of each of the outer ...

Passive and active heat retention device for solder fountain rework

A method and apparatus for retaining heat at a pin-in-hole rework site on a printed circuit board during solder fountain rework of the board. A preheated heat retention plate is attached to the rework side of the printed circuit board. The heat retention plate covers a substantial portion of the board surface. During rework of the printed circuit board, the heat retention plate minimizes the temperature gradient between the rework site of the printed circuit board and the remainder of the printed circuit board. During the rework, the heat retention plate can be heated by an active heater in order to maintain a constant temperature gradient between the rework site of the board and the remainder of the board. By minimizing the escape of heat from the rework site, the number of solder cycles required to rework the board is decreased, resulting in reduced board rework times and increased board longevity.

METHOD AND DEVICE FOR HEAT TREATMENT, ESPECIALLY CONNECTION BY SOLDERING

ОХЛАЖДАЮЩЕЕ УСТРОЙСТВО ВНУТРЕННЕГО ТРУБОПРОВОДА

Bonden von Komponenten zur Herstellung von elektronischen Anordnungen und elektronische Anordnungen einschließlich gebondeter Komponenten

Es werden hierin Verfahren zum Bonden von Komponenten zur Herstellung von elektronischen Anordnungen und elektronischen Anordnungen einschließlich gebondeten Komponenten bereitgestellt. In einem Beispiel umfasst ein Verfahren zum Bonden von Komponenten zur Herstellung einer elektronischen Anordnung die Schritte des Anordnens einer ersten Schicht einer ersten Hochtemperatur-Metall-enthaltenden Paste, welche an eine erste Komponente angrenzt. Eine zweite Schicht einer zweiten Hochtemperatur-Metall-enthaltenden Paste wird angrenzend an eine zweite Komponente angeordnet. Eine nanostrukturierte vielschichtige reaktive Folie wird zwischen den ersten und zweiten Schichten angeordnet. Die nanostrukturierte vielschichtige reaktive Folie wird aktiviert, um die ersten und zweiten Schichten miteinander zu verschmelzen und die ersten und zweiten Komponenten miteinander zu bonden.

Cooling device useful for cooling a molten solder of a large solder connection to be produced, comprises an evacuable chamber, a holder arranged in the evacuable chamber, and a heat sink unit arranged in the evacuable chamber

Cooling device for cooling a molten solder (23) of at least one large solder connection to be produced, comprises an evacuable chamber (1), a holder (2) arranged in the evacuable chamber, and a heat sink unit arranged in the evacuable chamber, where the heat sink unit is controlled such that a flat copper plate (5) is accurately inserted in the holder including a planar lower main surface (5b), a planar upper main surface, and two rectangular surface portions lying next to each other. Cooling device for cooling a molten solder (23) of at least one large solder connection to be produced, comprises an evacuable chamber (1), a holder (2) arranged in the evacuable chamber, and a heat sink unit arranged in the evacuable chamber, where the heat sink unit is controlled such that a flat copper plate (5) is accurately inserted in the holder, which includes (i) a planar lower main surface (5b), (ii) a planar upper main surface, which is spaced in a vertical direction from the lower main surface, ...

Verfahren zum Wellenlöten von Leiterplatten

The invention relates to a process for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder beads, after the passage on the wave of solder (13), the printed circuit boards (1) are further artificially cooled at an approximately constant time-temperature gradient.

A heat resistant pad

A heat resistant pad suitable for use in pipe soldering, comprising at least two parallel layers of pliable heat resistant material, which are attached to one another (the attachment means may be heat resistant itself), each layer comprising a primary slit and a secondary slit which intersect one another, wherein the intersections of adjacent layers are substantially co-located, and the primary slit of each layer extends from an edge of that layer, and the secondary slit is shorter than the primary slit and does not extend to an edge of that layer. If the pad contains more than two layers then the intersections of adjacent layers may be substantially co-located. The pad may contain; i) flame resistant woven or non-woven fabric; ii) carbon felt, or, iii) polyacrylonitrile (PAN) fibres. The pad may be heat resistant to a temperature of approximately 1400oC. A second aspect is directed towards a method of manufacturing a heat resistant pad.

PLANT AND PROCEDURE FOR MANUFACTURING SOLDERED CONSTRUCTION UNITS WITH A RUN CHARCOAL BRAZIER AND A STATIC COOLING ZONE

SOLDERING MECHANISM FOR CONNECTING SOLAR CELLS

THERMAL SAFETY DIVICE

HEAT TREATING AND BRAZING OF AN OBJECT

One embodiment of the present invention is a unique method for brazing an assembly. Another embodiment is a unique method of heat treating an object. Other embodiments include apparatuses, systems, devices, hardware, methods, and combinations for heat treating and/or brazing. Further embodiments, forms, features, aspects, benefits, and advantages of the present application will become apparent from the description and figures provided herewith.

HEAT TREATING AND BRAZING OF AN OBJECT

One embodiment of the present invention is a unique method for brazing an assembly. Another embodiment is a unique method of heat treating an object. Other embodiments include apparatuses, systems, devices, hardware, methods, and combinations for heat treating and/or brazing. Further embodiments, forms, features, aspects, benefits, and advantages of the present application will become apparent from the description and figures provided herewith.

Soldering apparatus for connecting solar cells

A soldering apparatus for connecting solar cells (1, 2, 3) includes an induction heat source to connect cell conducting tracks (4), provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an inductor loop (21) in which the flow of a high-frequency current causes a high-frequency magnetic field to induce in the conducting track (4) and in the electric conductor arranged along the conducting track eddy currents that generate the heat that is necessary for the soldering operation. The U-shaped inductor loop (21) has narrowings (25) and widenings (26) that serve to optimize the heat development in the soldering zone and thus also save energy. Each widening affords access to the soldering point for a magnetic-field-neutral pressure foot thatpresses the conductor onto the conducting track. The inductor loop (21) extends the entire length of the conducting track of the cell upper and lower sides (5, 6) to solder to the conductor in one soldering ...

Soldering machine with cooled guide profiles

A soldering machine with two parallel guide profiles for revolving chains provided for with soldering fingers, include a succession of a fluxer, a preheater and a solder bath along with the guide profiles extend. One profile is mounted fixed laterally above the succession and the other is adjustable directly above the succession. Thereby the adjustable guide profile is heated up more, especially under the action of the preheater, whereby, due to elongations of the guide profile, problems arise in the conduction of printed circuit boards held at the revolving chains by means of soldering fingers. To eliminate this problem, the invention provides that each guide profile is provided with at least one longitudinally extending coolant duct and that each coolant duct is connected to a pump for a coolant. Thereby the temperature actions on the adjustable guide profile 5 are compensated.

Soldering machine

SOLDERING DEVICE

ОХЛАЖДАЮЩЕЕ УСТРОЙСТВО ВНУТРЕННЕГО ТРУБОПРОВОДА

Изобретение относится к внутреннему теплообменнику для сварки трубопровода, который содержит приводную систему, выполненную с возможностью перемещения внутреннего теплообменника в положение внутри по меньшей мере одного участка трубы рядом с местом сварного шва с другим участком трубы. Внутренний теплообменник дополнительно содержит секцию охлаждения, содержащую охлаждающую конструкцию, выполненную с возможностью избирательного охлаждения одной или более частей внутренней поверхности по меньшей мере одного участка трубы, и контроллер, выполненный с возможностью взаимодействия с охлаждающей конструкцией и выполненный с возможностью приведения в действие секции охлаждения при нахождении внутреннего теплообменника в положении внутри по меньшей мере одного участка трубы. 17 з.п. ф-лы, 12 ил.

Verfahren zum Wellenlöten von Leiterplatten

Heiz- und Kühlvorrichtung

Es wird eine Heiz- und Kühlvorrichtung vorgesehen, die in der Lage ist, Erwärmungs- und Kühlprozesse in einer luftdichten Bearbeitungskammer durchzuführen, und in der Lage ist, die Vorrichtungsgröße zu miniaturisieren, während die Effizienz im Hinblick auf das Erwärmen und das Kühlen gesteigert wird. Eine Heiz- und Kühlvorrichtung 100 enthält: eine luftdichte Bearbeitungskammer 4; eine Induktionsheizeinrichtung 2, die eine Induktionsheizspule 2a enthält, die ein zu bearbeitendes Element 1 erwärmt; eine Kühleinrichtung 3, die das zu bearbeitende Element 1 kühlt; einen Temperatursensor zum Ermitteln einer Temperatur in Bezug auf das zu bearbeitende Element 1; und eine Regeleinrichtung 6, die die Induktionsheizeinrichtung 2 und die Kühleinrichtung 3 regelt. Die Heiz- und Kühlvorrichtung 100 enthält ferner eine Verlagerungseinrichtung 15, die entweder das zu bearbeitende Element 1 oder eine Kühleinheit 3a der Kühleinrichtung 3 oder beide verlagert, um einen Abstand zwischen dem zu bearbeitenden ...

SOLDERING PROCEDURE AND - DEVICE FOR SNAPPING COOLING

DEVICE FOR SUPPLYING AN INERT GAS TO A WAVE SOLDERING INSTALLATION

The invention relates to a device (1) for supplying inert gas in order to protect the surface (13) of a solder bath (12) in a wave soldering installation (11) against oxidation. The device (1) is in the form of a cover (2) which can be arranged above at least one partial region (14) of the solder bath (12), wherein at least two heat exchangers (3a; 3b; 3c) which are immersed in the solder bath (12) are fitted underneath the cover (2), and each of these heat exchangers has an inlet (4a; 4b; 4c), through which the inert gas is fed in, and an outlet (5a; 5b; 5c) above the cover (2). Heat-resistant, releasable connecting elements (6) can be used to connect the outlets (5a; 5b; 5c) above the cover (2) to at least two inert gas connections (15) of the wave soldering installation (11). The heat exchangers (3a; 3b; 3c) are designed and dimensioned in such a manner that they can be immersed substantially completely in the solder bath (12) next to other components (16) of the wave soldering installation ...

GAS KNIFE COOLING SYSTEM

A gas knife cooling system for reflow soldering cools soldered articles (12) by impinging a gas flow directly on the articles and as a result uses less cooling gas. A heater (32) is associated with the cooling system to remove flux deposits. The cooling system is installed in the cooling section (18) of a reflow soldering apparatus and comprises at least one gas knife (24, 25) to direct a gas stream at soldered products (12) passing through the cooling section (18) on a conveyor (14). A heater (32) is associated with the gas knife (24, 25) which is activated for predertermined cleaning cycles to heat the gas knife (24, 25) to a temperature above flux vaporization temperature of flux deposits from the soldered products (12).

METHOD AND APPARATUS FOR DISPENSING SOLDER WITHOUT FLUX ON A SUBSTRATE

MACHINE A SOUDER DES ELEMENTS RECTILIGNES PARALLELES ENTRE EUX

Machine à souder des éléments rectilignes parallèles entre eux. Un dispositif d'entraînement 10, 11 fait avancer les éléments à souder avec une couche de brasure entre au moins un élément inférieur et au moins un élément supérieur. Des galets chauffants 41, 51 roulent respectivement sous le ou chaque élément inférieur et sur le ou chaque élément supérieur au niveau de l'emplacement de la brasure, et des galets de refroidissement 61, 71 solidifient la brasure pour maintenir lesdits éléments l'un contre l'autre pendant leur trajet Cette machine convient notamment pour souder des tubes sur une plaque afin de réaliser un collecteur d'énergie solaire.

Device for supplying an inert gas to a wave soldering installation

The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board.

Soldering Apparatus

A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle. 1. A soldering apparatus comprising:first transfer means for transferring a printed circuit board;second transfer means provided in parallel to a transfer direction of the printed circuit board transferred by the first transfer means;a first reflow furnace main body for heating the printed circuit board transferred by the first transfer means;a second reflow furnace main body for heating a printed circuit board transferred by the second transfer means; anda frame for housing the first reflow furnace main body and the second reflow furnace main body, wherein the frame contains first opening/closing means for opening/closing the first reflow furnace main body and second opening/closing means for opening/closing the second reflow furnace main body.2. The soldering apparatus according to claim 1 ,wherein each of the first and second reflow furnace main bodies is configured to have an upper main body and a lower main body,wherein the first opening/closing means includes first lifting/lowering means for lifting/lowering the upper main body of the first reflow furnace main body, andwherein the second opening/closing means includes second lifting/lowering means for lifting/lowering the upper main body of the ...

HEATING AND MELTING TREATMENT DEVICE AND HEATING AND MELTING TREATMENT METHOD

Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate. The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal meltingprocess that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.

СПОСОБ И УСТРОЙСТВО ДЛЯ ТЕРМИЧЕСКОЙ ОБРАБОТКИ ДЕТАЛЕЙ ПРИ ПОЛУЧЕНИИ СОЕДИНЕНИЯ МЕЖДУ ПРИПОЕМ И СЛУЖАЩЕЙ ПОДЛОЖКОЙ ДЛЯ ПРИПОЯ ДЕТАЛЬЮ

Изобретения могут быть использованы для термической обработки заготовок (19) или деталей, прежде всего, для получения паяного соединения между припоем и по меньшей мере одной служащей в качестве подложки для припоя деталью посредством его расплавления. Нагрев и охлаждение детали (19) происходит в двух выполненных с возможностью отделения друг от друга конденсационным устройством (15) секциях (13, 14) технологической камеры (12) устройства (10). Конденсационное устройство (15) охлаждают по меньшей мере во время нахождения в положении готовности. Перед нагревом детали (19) для отделения секций (13, 14) камеры конденсационное устройство (15), выполненное в виде защитного экрана, переводят из положения готовности в положение перегородки, отделяющее секции камеры друг от друга. Во время нагрева детали (19) создают вакуум в нагревательной секции (13) камеры с подачей защитного газа в охладительную секцию (14) и/или нагревательную секцию (13) камеры. Осаждение возникающих в процессе обработки ...

СПОСОБ И УСТРОЙСТВО ДЛЯ ТЕРМИЧЕСКОЙ ОБРАБОТКИ ПРЕЖДЕ ВСЕГО ПАЯНОГО СОЕДИНЕНИЯ

1. Способ термической обработки заготовок или деталей прежде всего для получения паяного соединения между припоем и по меньшей мере одной служащей в качестве подложки для припоя деталью или заготовкой посредством расплавления припоя, расположенного на подложке для припоя, в котором происходит нагрев, и на последующей стадии способа охлаждение по меньшей мере одной детали в изолированной от окружающей среды технологической камере, отличающийся тем, что нагрев и охлаждение детали (19) происходят в двух выполненных с возможностью отделения друг от друга конденсационным устройством (15) секциях (13, 14) технологической камеры (12). ! 2. Способ по п.1, отличающийся тем, что нагрев происходит посредством нагревательного устройства (20), а охлаждение - посредством охладительного устройства (25), каждое из которых работает при, по существу, постоянной температуре. ! 3. Способ по п.1, отличающийся тем, что перед нагревом подложки (19) для припоя для отделения секций (13, 14) камеры конденсационное устройство (15) переводится из положения готовности в отделяющее секции камеры друг от друга положение перегородки. ! 4. Способ по п.3, отличающийся тем, что конденсационное устройство (15) охлаждают по меньшей мере во время нахождения в положении готовности. ! 5. Способ по п.1, отличающийся тем, что во время нагрева подложки (19) для припоя в нагревательной секции (13) камеры, отделенной от охладительной секции (14) камеры конденсационным устройством (15), создают вакуум в нагревательной секции (13) камеры. ! 6. Способ по п.5, отличающийся тем, что во время создания вакуума в нагревательной секции (13) камеры происходит подача защитного газа в охладительную секц РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 2008 150 764 (13) A (51) МПК B23K 1/008 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (21), (22) Заявка: 2008150764/02, 27.04.2007 (71) Заявитель(и): ПИНК ГМБХ ВАКУУМТЕХНИК (DE) (30) Конвенционный приоритет: 29.05.2006 ...

System und Verfahren zum Anbringen elektronischer Komponenten auf flexiblen Substraten

System zum Aufschmelzlöten zum Verbinden mehrerer elektronischer Komponenten mit einem Substrat, wobei das System aufweist: Einen Ofen zum Vorheizen des Substrats und der mehreren darauf angeordneten elektronischen Komponenten, eine Zusatzheizquelle, die in dem Ofen angeordnet ist, um zusätzliche Heizenergie zum Aufschmelzen des Lötmittels bereit zu stellen, eine Palette zum Tragen des Substrats, wobei die Palette zumindest einen internen Hohlraum aufweist, und ein Phasenübergangsmaterial, das in dem Hohlraum zum Absorbieren von Wärme von der Palette angeordnet ist.

System and method for mounting electronic components onto flexible substrates

A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).

DEVICE FOR COOLING FRESHLY-SOLDERED CIRCUIT BOARDS

Electrical circuit boards are cooled immediately after passing through a soldering work station wherein heat-sensitive electrical components are mechanical soldered into such circuit boards so as to minimize dangerous temperature peaks without disrupting the soldering process. The cooling device is positioned closely adjacent to the soldering work station and comprises a housing having a C-shaped passageway along the center thereof for receiving an elongated transport means carrying freshly-soldered circuit boards in a given direction from the solder soldering work station. Air flow means are provided at opposite wall portions of the passageway for directing a stream of cooling air against opposite sides of the circuit boards carried by the transport means and approximately at right angles to the travel directions of such boards.

Device LED and method for removing tin from module-by-module (LED) module

MACHINE TO WELD PARALLEL RECTILINEAR ELEMENTS BETWEEN THEM

납땜 장치 및 납땜 제품의 제조방법

... 짧은 사이클 타임으로 효율 좋게 워크를 납땜할 수 있는 우수한 납땜 장치 및 납땜 제품의 제조방법을 제공한다. 납땜 장치는, 납땜할 워크를 열방사에 의해 가열하는 열방사 히터와, 납땜한 워크를 냉각하는, 열방사 히터를 사이에 끼워 배치되며, 대기 위치와 냉각 위치와의 사이를 이동하는 2개의 냉각기로서, 2개의 냉각기의 사이에 끼운 열방사 히터를 설치하는 오목부를 형성한 냉각기를 구비하며, 냉각기는, 열방사 히터가 워크를 가열하는 동안, 열방사 히터가 오목부로부터 돌출한 상태가 되도록 워크로부터 이간하여 대기하는 대기 위치로 이동 가능하게 구성되고, 냉각기가 워크를 냉각할 때에는, 대기 위치로부터 냉각 위치로 이동 가능하게 구성된다.

METHOD AND APPARATUS FOR DISPENSING FLUX-FREE SOLDER ON A SUBSTRATE

Heat conductive device, and hot melting method thereof

A heat conductive device useful for hot melting a solder between a circuit board and a soldering member. The heat conductive device includes a wind guide cover and a heat conduction fixture. The wind guide cover is connected to a hot wind supply source for transport of the hot wind. The wind guide cover includes an air vent for outflow of the hot wind. The heat conduction fixture is disposed in the air vent of the wind guide cover. The heat conduction fixture includes a contact wall spaced apart from a bottom of the air vent and contacting the soldering member, and a surrounding wall extending upward from a periphery of the contact wall and connecting the wind guide cover. The contact wall and the surrounding wall cooperatively define a guiding flow space for guiding the flow of the hot wind. The contact wall is used for conducting heat so as to hot melt the solder between the circuit board and the soldering member, thereby reducing the impact on electronic components and chips.

METHOD AND DEVICE FOR COOLING SOLDERED PRINTED CIRCUIT BOARDS

Method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, wherein at least one cooling gas comprising inert gas is introduced into the cooling zone, wherein the printed circuit boards are conveyed continuously from a soldering zone of the soldering system into the cooling zone, wherein the cooling gas is generated using liquid cooling gas. The method according to the invention and the device (1) according to the invention advantageously permit highly efficient cooling of printed circuit board modules after the soldering process. The cooling gas may advantageously be used for inerting the soldering system (2) after extraction from the cooling zone (15).

Soldering machine for soldering rectilinear and parallel elements

A soldering machine for soldering continuously metallic, rectilinear and parallel elements, comprising: a driving device to move forward the elements to be soldered, which elements are disposed in parallel to the forward direction with at least one lower element, at least one higher element disposed on top of the lower element, and one layer of brazing solder interposed between the said elements in the area provided for the welding, a heating station comprising upper and lower heating rollers with incorporated heating means, which rollers, as the elements move forward, respectively roll under the or each lower element and over the or each upper element in the welding area, and a cooling station located downstream of the heating station and comprising lower and upper cooling rollers, which rollers, as the elements move forward, roll respectively under the or each lower element or over the or each upper element, to solidify the solder and to hold the said elements in close contact one against ...

METHOD OF MANUFACTURING COMPONENTS MADE OF DISSIMILAR METALS

An article of manufacture comprises a first component having a first mating surface and a second component having a second mating surface. The first component may include an aperture having internal splines or gear teeth, and/or an outer perimeter having external splines or gear teeth. The first and second components are disposed such that a gap is provided between the first and second mating surfaces. Brazing material is disposed between the first and second mating surfaces so as to mechanically couple the first and second components. The first component may be made of a powdered metal or a non-powdered metal, and the second component may be made of the other of such two metals. In one embodiment, the first component may be a planetary carrier plate portion having internal splines and the second component may be a planetary carrier spider portion.

PROCESS CHAMBER WITH UV IRRADIANCE

A semiconductor processing apparatus includes a process chamber that defines an enclosure. The enclosure includes a substrate support configured to support a substrate and rotate the substrate about a central axis of the process chamber. The substrate support is also configured to move vertically along the central axis and position the substrate at multiple locations in the enclosure. The apparatus also includes one or more UV lamps configured to irradiate a top surface of the substrate supported on the substrate support.

Method of using processing oven

A method of using a solder reflow oven can include disposing at least one substrate including solder in a chamber of the oven. The method can include decreasing a pressure of the chamber to a first pressure between about 0.1-50 Torr. After decreasing the pressure of the chamber, the temperature of the at least one substrate can be increased to a first temperature. Formic acid vapor can be admitted into the chamber above the at least one substrate while nitrogen is discharged into the chamber below the at least one substrate. The method can also include removing at least a portion of the formic acid vapor from the enclosure. After the removing step, the temperature of the at least one substrate can be further increased to a second temperature higher than the first temperature. The at least one substrate can be maintained at the second temperature for a first time. And then, the at least one substrate can be cooled.

BRAZING PROBE

A brazing apparatus to join a first component and a second component includes a heating element configured to melt a ring located at a joint between the first component and the second component, and a probe configured to contact the ring. A position of the probe is biased toward the ring. The probe is installed at a probe support. The probe is movable along a probe central axis relative to the probe support. A sensor is operably connected to the probe and is configured to determine movement of the probe along the probe central axis. The movement of the probe is indicative of melting of the ring.

Curcuit board cooling apparatus with air guide plates

In a circuit board cooling apparatus, inclined rectifier plates 25 are disposed on a plane rectifier plate 21 with an inclination of about 45°, and an air guide plate 26 is disposed toward a distal end of the inclined rectifier plate 25 such that a distal end 26b of the air guide plate 26 is in contact with a soldering face 2 of a circuit board 1. Cooling air from openings 15 is rectified and guided upward due to a plane rectifier plate 21 and the inclined rectifier plates 25, and the cooling air also flows through between the soldering face 2 of the circuit board 1 and the air guide plate 26 so as to be converged on a soldered portion 3 on the circuit board 1. As a result, the soldered portion 3 is pinpointedly cooled and a cooling rate is improved, thereby improving cooling capability. The cooling rate can be set to 50°C/sec or higher, and the use of Pb-free solder is promoted replacing Sn-Pb eutectic solder which has been conventionally employed, thereby enhancing environmental protection ...

ОХЛАЖДАЮЩЕЕ УСТРОЙСТВО ВНУТРЕННЕГО ТРУБОПРОВОДА

Vorrichtung, Verfahren und Anlage zur der inhomogenen Abkühlung eines flächigen Gegenstandes

Die erfindungsgemäße Vorrichtung dient der inhomogenen Abkühlung eines flächigen Gegenstandes mit einer ersten Hauptfläche und einer dieser gegenüber liegenden zweiten Hauptfläche. Hierbei wird der flächige Gegenstand aus Richtung der ersten Hauptfläche von einer Kühleinrichtung gekühlt. Auf die zweite Hauptfläche wirkt eine Heizeinrichtung auf eine erste Teilfläche lokal derart ein, dass der flächige Gegenstand an dieser ersten Teilfläche relativ zu einer an diese erste Teilfläche anschließenden zweiten Teilfläche derart mit Wärme beaufschlagt wird, dass diese erste Teilfläche im Vergleich zur zweiten Teilfläche langsamer abgekühlt wird und somit die zweite Hauptfläche des flächigen Gegenstands während des Abkühlvorgangs zumindest in einem Teilzeitraum der Abkühlung eine inhomogene Temperaturverteilung aufweist.

Vorrichtung und Verfahren für ein gesteuertes Kühlen und Erwärmen metallischer Werkstücke im Temperaturfeld beim Schweißen, thermischen Trennen (Brenn-, Plasma- bzw. Laserschneiden) oder Löten (Lichtbogen- bzw. Laserlöten)

Die Erfindung betrifft eine Vorrichtung und ein Verfahren, welches mittels der Vorrichtung durchgeführt wird, für ein gesteuertes Kühlen und/oder Erwärmen metallischer Werkstücke I, II (8, 9) im Temperaturfeld (14) beim Schweißen, thermischen Trennen oder Löten. Hierbei gelingt es, durch die Ausbildung einer im Wesentlichen einem Brenner (1), einem thermischen Brenn-, Plasma- oder Laserschneideapparat oder einem Lötapparat in der äußeren Form nachfolgenden konstruierten Vorrichtung, die mit ihm fest verbunden ist und ringförmig angeordnete Kühlgaszuführungen (3) mit Kühlgasaustritten (4) enthält, dass im Bereich des Wirkens vom Temperaturfeld (14) auf ein oder auf mehrere Werkstücke I, II (8, 9) bereits während des aktiven Arbeitens und Vorschubes eines modifizierten Werkzeuges Areale des Temperaturfeldes (14) nacheinander oder auch zeitgleich gekühlt und/oder erwärmt werden können. Die Vorrichtung realisiert ein offenes Verfahren zur Kühlung, Erwärmung des bzw. der zu bearbeitenden Werkstücke ...

VERFAHREN ZUM WELLENLÖTEN VON LEITERPLATTEN

Loetmaschine

KÜHLSYSTEM MIT GASSTRAHLMESSER

System and method for mounting electronic components onto flexible substrates

"Means for cooling circuit boards following and soldering operation"

Electrical circuit boards are cooled immediately after passing through a soldering work station wherein heat-sensitive electrical components are mechanical soldered into such circuit boards so as to minimize dangerous temperature peaks without disrupting the soldering process. The cooling device is positioned closely adjacent to the soldering work station and comprises a housing having a C-shaped passageway along the center thereof for receiving an elongated transport means carrying freshly-soldered circuit boards in a given direction from the solder soldering work station. Air flow means are provided at opposite wall portions of the passageway for directing a stream of cooling air against opposite sides of the circuit boards carried by the transport means and approximately at right angles to the travel directions of such boards.

Method and device for heat treatment, especially connection by soldering

Gas knife cooling system

Vacuum high temperature brazing furnace with rapid cooling

Thermal Gradient Reflow for Forming Columnar Grain Structures for Solder Bumps

A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.

Device for supplying an inert gas to a wave soldering installation

The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board.

REFLOW FURNACE AND SOLDERING METHOD

A reflow furnace that can reduce both the flux clinging defect in a circuit board, and the thermal cracking defect in an electronic component has a heat zone in which a circuit board with a mounted electronic component is heated, and a cooling zone in which the heated circuit board is cooled, and includes: a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; and a tunnel-like cover physically coupled to the opening and extending along a transport direction of the circuit board. 1. A reflow furnace that has a heat zone in which a circuit board with a mounted electronic component is heated , and a cooling zone in which the heated circuit board is cooled ,the reflow furnace comprising:a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; anda tunnel-like cover coupled to the opening and extending along a transport direction of the circuit board.2. The reflow furnace according to claim 1 , further comprising an electrostatic-precipitation flux collection apparatus that includes a drawing unit that draws an atmosphere gas out of the reflow furnace in the heat zone claim 1 , and a flux collection unit that collects a flux contained in the atmosphere gas claim 1 , wherein the flux collection apparatus returns the gas to the cooling zone after collecting the flux.3. The reflow furnace according to claim 2 , wherein the drawing unit has a slit-like suction nozzle disposed over a width direction perpendicular to the transport direction of the circuit board in the reflow furnace.4. The reflow furnace according to claim 1 , which satisfies TP1>TP2>TP3>TP4 claim 1 , where TP1 is an ambient temperature of the heat zone claim 1 , TP2 is a temperature inside the tunnel-like cover on the heat zone side of the shield claim 1 , TP3 is a temperature inside the tunnel-like cover on the cooling zone side of the shield claim 1 , and TP4 is an ambient temperature ...

SOLDER BUMP FORMING METHOD AND APPARATUS

Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head for supplying molten solder has a nozzle brought into contact with a mask with openings that is disposed over a substrate . After completing a supply operation, the injection head is forcedly cooled by heat transfer from a cooling unit through a heater unit whose operation has been stopped. Molten solder in the cooled injection head does not drool from the nozzle when the injection head moves up. 1. A solder bump forming method comprising:loading, onto a work stage, a component to be formed with a solder bump on an upper surface thereof, a mask being disposed over the upper surface of the component, the mask having an opening at a position corresponding to a position where the bump is to be formed;preheating the component with a first heater unit;lowering an injection head into contact with an upper surface of the mask disposed over the component, the injection head being configured to hold molten solder therein and supply the molten solder from a nozzle at a bottom thereof;bringing an upper surface of a second heater unit and a lower surface of the component into contact with each other to heat the component, which has already been preheated, to a working temperature thereof;heating the solder in the injection head to a working temperature thereof with a third heater unit;allowing the injection head to slide over the mask while discharging the molten solder heated to the working temperature from the nozzle to flow into the opening in the mask and scraping surplus molten solder off the upper surface of the mask, thereby filling the molten solder into the opening in the mask, and thus supplying a predetermined amount of molten solder onto the component;stopping respective operations of the second heater unit and the third heater unit after completion of supply of molten solder by the ...

Electronic apparatus and method for fabricating the same

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

INTEGRATED COMPRESSED AIR COOLING FOR WELDING SYSTEMS

Systems and methods are disclosed for integrated compressed air cooling for welding systems. In particular, the disclosed systems and methods may employ compressed air to implement one or more welding processes (e.g., a gouging or cutting processes), with the compressed air being conveyed through such welding systems. In some examples, the compressed air is routed within the welding system to provide cooling for one or more components therein. For instance, components such as power conversion circuitry may heat up during the welding process. Routing compressed air to or near the components will introduce relatively cool air to the environment. As the passing compressed air heats in response to interaction with the heated components, heat is drawn from the components and/or the nearby environment. 1. A welding system comprising:one or more channels within the welding system to convey compressed air from a compressed air source;a compressed air outlet to provide compressed air through the one or more channels to a gouging torch; anda cooling pathway to route compressed air through the one or more channels to a component within the welding system, wherein conveyance of the compressed air draws heat from the component.2. The system as defined in claim 1 , wherein the one or more channels comprise a conductive material.3. The system as defined in claim 2 , wherein the conductive material is one of a metal or a semiconductor.4. The system as defined in claim 1 , wherein the one or more channels comprise one or more of a flexible conduit or a rigid conduit.5. The system as defined in claim 1 , further comprising one or more valves to selectively control conveyance of the compressed air to the one or more channels.6. The system as defined in claim 1 , further comprising one or more temperature sensors to monitor temperature of the component.7. The system as defined in claim 1 , wherein the component comprises one or more of a power conversion circuitry or a control ...

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COMPRESSION BONDING PROCESS

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block. 1. An assembly comprising:a cooling block comprising an array of vertical micro channels jets coupled to a heater surface, wherein an outlet micro channel jet of the array is coupled with an adjacent inlet micro channel jet of the array; andan inlet and outlet manifold coupled to the array of vertical micro channel jets, wherein the heater surface and the array of vertical micro channel jets are coupled in the same block material, wherein the heater surface comprises a plurality of micro fins, and wherein a tip of each micro fin is aligned in a center position between adjacent inlet and outlet micro channel jets.2. The assembly of claim 1 , wherein each outlet micro channel jet is coupled with two adjacent micro channel jets.3. The assembly of claim 1 , wherein inlet and outlet micro channel jets are disposed in a staggered configuration.4. The assembly of claim 1 , wherein a bottom portion of each inlet and outlet micro channel jet is chamfered.5. The assembly of claim 1 , wherein the vertical micro channel jets comprise vertical individual inlet and outlet nozzles attached to the heater surface.6. The assembly of claim 1 , further comprises a nozzle coupled to the heater claim 1 , and a die coupled to the nozzle claim 1 , wherein the die is on a substrate disposed on a pedestal.7. The assembly of claim 5 , wherein the assembly comprises a portion of a TCB bonding system.8. The assembly of claim 1 , wherein a TEC pad is disposed between the heater surface and the cooling block of the assembly.9. An assembly comprising:a ...

Brazed Heat Exchanger and Production Method

The invention relates to a heat exchanger which is brazed in a brazing furnace, comprising stacked heat exchanger parts which provide first channels and second channels, and with at least two brazing materials, the one brazing material in the first channels being different than the other brazing material in the second channels. According to one alternative, said heat exchanger is improved by virtue of the fact that there is the other or the one brazing material in one or in a few of the first channels or the second channels or in one or in a few of the first and the second channels, or the other and the one brazing material are present arranged in part regions.

DEVICE, METHOD, AND SYSTEM FOR COOLING A FLAT OBJECT IN A NONHOMOGENEOUS MANNER

The apparatus serves for inhomogeneous cooling of a flat object with a first main face and a second main face opposite the first main face. The flat object is cooled by a cooling device from the direction of the first main face. On the second main face, a heating device locally acts upon a first partial face in such a way that the flat object is subjected to heat at said first partial face relative to a second partial face adjoining said first partial face in such a way that said first partial face is cooled more slowly in comparison with the second partial face and, during the cooling process, the second main face of the flat object therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling. 12200202. An apparatus for inhomogeneous cooling of a flat object () with a first main face () and a second main face () opposite said first main face , wherein:{'b': 2', '1', '200', '202', '4', '204', '2', '204', '206', '204', '204', '206', '202', '2, 'the flat object () is cooled by a cooling device () from the direction of the first main face () and wherein, on the second main face (), a heating device () locally acts upon a first partial face () in such a way that the flat object () is subjected to heat at said first partial face () relative to a second partial face () adjoining said first partial face () in such a way that said first partial face () is cooled more slowly in comparison with the second partial face () and, during the cooling process, the second main face () of the flat object () therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling.'}2. The apparatus as claimed in claim 1 , wherein:{'b': 2', '20', '22', '26', '20', '22, 'the flat object () is a base plate () of a power semiconductor module with a plurality of power electronic substrates () arranged thereon and solder () is arranged between the base plate () and the respective substrate ().'}3. The apparatus as ...

VISCOUS FLUID COATING DEVICE

Solder housed in flow tank is ejected from nozzle by a pump provided inside flow tank . Jet motor that drives the pump is provided outside flow tank , and cooling device is provided between flow tank and jet motor . Cooling device includes cooling pipe that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe , flows along cooling pipe , and flows out of a lower end of cooling pipe so as to be supplied to flow tank . The temperature of the nitrogen gas increases due to heat dissipated from jet motor , thus lowering the temperature of jet motor . Heat is transferred from jet motor to the nitrogen gas, and jet motor is cooled satisfactorily. 1. A viscous fluid coating comprising:a flow tank that houses a viscous fluid in a molten state;a pump, operation of which ejects viscous fluid from the flow tank such that viscous fluid is coated on a circuit board;a jet motor, provided outside the flow tank, that drives the pump; anda cooling device, provided outside the flow tank and including a passage through which a fluid body is capable of flowing, that cools the jet motor using the fluid body.2. The viscous fluid coating device according to claim 1 , whereinat least a portion of the passage is provided between the flow tank and the jet motor.3. The viscous fluid coating device according to claim 1 , whereinthe passage includes multiple curved sections, andthe cooling device includes a heat exchange section provided with the passage formed from the multiple curved sections.4. The viscous fluid coating device according to claim 1 , whereinthe fluid body is an antioxidation gas for preventing oxidation of solder as the fluid body, anda downstream end of the passage is connected to the flow tank. The present invention relates to a viscous fluid coating device that is a configuration element of an electronic component mounter.Disclosed in patent literature 1 is a solder coating device that includes (i) a flow tank that houses solder in a ...

Atomization mechanism for cooling a bond head

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

APPARATUS FOR BONDING SEMICONDUCTOR CHIPS

A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position. 1. A semiconductor chip bonding apparatus , comprising:a bonding head to adsorptively pick up a semiconductor chip;a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage;a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip;a second camera to capture an image of the substrate and to obtain positional information regarding the substrate;a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip; anda bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.2. The apparatus as claimed in claim 1 , wherein the correction device structure further comprises:a fixing unit, the at least one correction chip and the correction substrate being positioned on and fixed to the fixing unit; anda body unit connected to one side of the bonding ...

Apparatus and method for manufacturing semiconductor device

A manufacturing apparatus of a semiconductor device includes a stage, a head unit configured to face the stage, a driving unit configured to move the head unit towards and away from the stage, a heating unit configured to heat the head unit, and a control unit configured to control the driving unit to move the head unit away from the stage when the heating unit heats the head unit.

Soldering Apparatus and Manufacturing Method of Soldered Product

An excellent soldering apparatus and manufacturing method of soldered product are provided where a workpiece can be efficiently soldered in a short cycle time. The soldering apparatus includes a thermal radiation heater and two coolers for cooling the workpiece which sandwich the heater therebetween. The coolers are movable between a standby position and a cooling position and form a recessed portion in which the heater is placed. The coolers move to the standby position where the coolers are separated from the workpiece and stand by such that the heater is in a state of protruding from the recessed portion while the heater heats the workpiece. The coolers can move from the standby position to the cooling position to cool the workpiece. 1. A soldering apparatus , comprising:a thermal radiation heater configured to heat a workpiece to be soldered by thermal radiation; andtwo coolers configured to cool the workpiece soldered, the coolers being arranged to sandwich the thermal radiation heater therebetween, movable between a standby position and a cooling position, and formed with a recessed portion, the recessed portion configured to dispose therein the thermal radiation heater sandwiched between the two coolers;wherein the coolers are configured to be moved to the standby position where the coolers are separated from the workpiece and stand by such that the thermal radiation heater is in a state of protruding from the recessed portion while the thermal radiation heater heats the workpiece, and the coolers are configured to be moved from the standby position to the cooling position to cool the workpiece.2. The soldering apparatus according to claim 1 , further comprising:thermal blocking means for blocking radiation heat from the thermal radiation heater, the thermal blocking means being formed between the thermal radiation heater and the coolers.3. The soldering apparatus according to claim 1 ,comprising a plurality of thermal radiation heaters, each of the thermal ...

INTEGRATED CIRCUIT ALIGNMENT TOOL

A solderability alignment tool for aligning conductive interface surfaces of an IC with predetermined interface surfaces on a test board. The solderability tool includes a platen having a support surface for supporting a test board and an IC displacement assembly including an elongate tubular member in selective fluid communication with a vacuum source for precisely locating an IC on said test board. The tool may also include a microscope positioned opposite the platen support surface for precisely observing the position and alignment of the IC on said test board. 1. A solderability alignment tool for aligning conductive interface surfaces of an IC with predetermined interface surfaces on a test board comprising:a platen having a support surface for supporting a test board;a IC displacement assembly including an elongate tubular member in selective fluid communication with a vacuum source for precisely locating an IC on said test board; anda microscope positioned opposite said platen support surface for precisely observing the position and alignment of said IC on said test board.2. The solderability alignment tool of further comprising a platen/microscope displacement tool for relatively displacing said platen with respect to said microscope.3. The solderability alignment tool of wherein said elongate tubular member is controllably displaceable in increments of less than about 1 micrometer.4. The solderability alignment tool of claim 1 , said IC displacement assembly comprising manually operable knobs for controlling displacement of said elongate tubular member about a plurality of displacement axes.5. The solderability alignment tool of said displacement tool comprising manually operable knobs for controlling displacement of said microscope relative said platen.6. A tool comprising:a platen having a support surface for supporting a substrate;an IC displacement assembly including an elongate conduit for precisely locating an IC on said substrate; anda microscope ...

WIRE SPLICING DEVICE, WIRE SPLICING METHOD, AND METHOD FOR MANUFACTURING SPLICE STRUCTURE

A wire connection device includes: a holding base which is provided with a wire accommodation groove having a width, the wire accommodation groove being configured to accommodate a plurality of wires; a pressing plate which is positioned above the holding base; a heating body which is positioned above the pressing plate and includes a heating member; a first driver which drives the holding base and the pressing plate away from or toward one another; and a second driver which drives the holding base and the heating body toward or away from one another, in which the pressing plate which is driven toward the holding base by the first driver presses together the plurality of wires accommodated in the wire accommodation groove with solder interposed therebetween. 1. A wire splicing device comprising:a holding base which is provided with a wire accommodation groove having a width, the wire accommodation groove being configured to accommodate a plurality of wires;a pressing plate which is positioned above the holding base;a heating body which is positioned above the pressing plate and includes a heating member;a first driver which drives the holding base and the pressing plate toward or away from one another; anda second driver which drives the holding base and the heating body toward or away from one another, whereinthe pressing plate which is driven toward the holding base by the first driver presses together the plurality of wires accommodated in the wire accommodation groove with solder interposed therebetween, andthe heating body which is driven toward the holding base by the second driver presses together and heats, via the pressing plate, the plurality of wires accommodated in the wire accommodation groove with solder therebetween.2. The wire splicing device according to claim 1 , whereinthe holding base is made of an insulating material.3. The wire splicing device according to claim 1 , further comprising:a cooling member which cools the pressing plate.4. The wire ...

METHOD FOR LOW HEAT INPUT WELDING ON OIL AND GAS TUBULARS

A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular. 1. A method comprising:applying a wire continuously to an oil and gas tubular using low heat input welding to create multiple bands.2. The method of claim 1 , further comprising:cooling the oil and gas tubular in ambient air after welding.3. The method of claim 1 , wherein the low heat input welding uses a direct current electrode positive voltage of between 12 and 24 volts and an electric current of between 150 and 300 amperes.4. The method of claim 3 , wherein the low heat input welding uses a direct current electrode positive voltage of between 12 and 24 volts and an electric current of between 150 and 260 amperes.5. The method of claim 3 , wherein the low heat input welding uses a direct current electrode positive voltage of between 12 and 20 volts and an electric current of between 150 and 300 amperes.6. The method of claim 1 , wherein a surface of the oil and gas tubular is at a temperature of 150° F. or less during the application of the wire.7. The method of claim 1 , wherein the wire is a hardbanding material.8. The method of claim 1 , wherein the wire is a buildup material.9. The method of claim 1 , wherein the tubular has an internal plastic coating.10. The method of claim 1 , wherein the hardness within a heat affected zone of the oil and gas tubular is greater than 20 HRC and less than 45 HRC after application of the wire.11. The method of claim 1 , wherein the oil and gas tubular is an upset connection claim 1 , and further comprising:grinding excess material from the applied weld material ...

SYSTEM AND METHOD FOR FLUX COAT, REFLOW AND CLEAN

The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion. 1. A system for performing a solder reflow process comprising a plurality of stations within one system frame comprising:a first station for coating flux on a substrate;a second station for reflowing the flux on the substrate;a third station for removing the flux and cleaning the substrate; andan automated transfer device for transferring the substrate from one station to another station.2. The system of claim 1 , wherein the first station includes one or more first devices for coating the flux; the second station includes one or more second devices for reflowing the flux and the third stations includes one or more third devices for removing the flux and cleaning the substrate; and the automated transfer device comprises a single robot.3. The system of claim 2 , wherein the first devices are arranged in a stacked manner at the first station claim 2 , the second devices are arranged in a stacked manner at the second station claim 2 , and the third devices are arranged in a stacked manner at the third station.4. The system of claim 1 , wherein the second station includes a reflow device that has multiple zones to provide an optimal temperature profile for reflowing the flux in a controlled low oxygen environment claim 1 , the reflow device being automated such that the substrate is advanced into each of the zones and is held thereat for a predetermined period of time to effectuate reflow of the flux.5. The system of ...

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided. 1. A method of manufacturing a printed circuit board assembly , the method comprising:providing a circuit board;positioning a plurality of components on the circuit board, at least one of the components being a thermally-sensitive component having a maximum temperature threshold;positioning a customized protective heat shield on the thermally-sensitive component;exposing the circuit board to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component; andremoving the customized protective heat shield from the thermally-sensitive component.2. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component prior to positioning of the thermally-sensitive component on the circuit board.3. The method according to claim 2 , wherein the thermally-sensitive component and the customized protective heat shield are together picked and placed on the circuit board with a surface mount technology machine.4. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component after positioning of the thermally- ...

ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed. 1. An electronic apparatus comprising:a first electronic part with a first terminal;a second electronic part with a second terminal opposite the first terminal; anda joining portion which joins the first terminal and the second terminal and which contains a first pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other.2. The electronic apparatus according to claim 1 , wherein the joining portion includes a portion which covers the first compound claim 1 , the portion containing a first element and a second element different from the first element claim 1 , the first compound being an intermetallic compound containing the first element and the second element.3. The electronic apparatus according to claim 1 , wherein the joining portion contains the first compound and a second pole-like compound extending in the direction in which the first terminal and the second terminal are opposite to each other.4. The electronic apparatus according to claim 3 , wherein the joining portion includes a portion which covers the first compound and the second compound claim 3 , the portion containing a first element and a second element different from ...

Reflow soldering machine for continuously soldering of soldering goods

The invention concerns a reflow soldering machine for continuously soldering of soldering goods in a process channel along a process direction, whereby the process channel comprises at least one pre-heating zone, at least one soldering zone, and at least one cooling zone, whereby the soldering zone comprises a pressure chamber comprising one base part and one cover part opposite the base part and that can be raised when the reflow soldering machine is operating, wherein the process channel can be covered by at least one covering hood that can be opened, and wherein the cover part is motion-coupled to the covering hood in such a way that when the covering hood is opened, the cover part is also taken along by the covering hood.

FLUX TRANSFER APPARATUS

This flux transfer apparatus () comprises: a stage () having a recessed portion () for collecting flux (); a flux pot () which is an annular member having a through hole () into which the flux () is introduced, which reciprocates along a top surface () of the stage () to supply the flux () that has been introduced into the through hole () into the recessed portion (), and which levels off the top surface of the flux using a bottom surface (); and a cooling mechanism () for cooling the stage (). By this means, a rise in the temperature of the stage in the flux collecting apparatus is suppressed. 1. A flux transfer apparatus , comprising:a stage having a recessed portion for collecting flux in a central portion of a top surface;a flux pot, which is an annular member having a through hole into which the flux is introduced, reciprocates along the top surface of the stage to supply the flux having been introduced into the through hole into the recessed portion, and levels off a top surface of the flux using a bottom surface; anda cooling mechanism for cooling the stage,wherein the flux transfer apparatus dips a tip of a protruding electrode of an electronic component into the flux collected in the recessed portion to transfer the flux to the tip of the protruding electrode,the flux pot returns to an initial position at a periphery of the recessed portion at a time of transfer of the flux, andthe cooling mechanism is installed to a lower side of the initial position of the stage.2. The flux transfer apparatus as claimed in claim 1 , wherein the cooling mechanism is a Peltier element. The present invention relates to a structure of a flux collecting apparatus. More specifically, the present invention relates to a structure of a flux collecting apparatus used in a flux transfer apparatus that transfers flux to a protruding electrode of an electronic component.In recent years, a flip chip bonding method in which a protruding electrode (e.g., a solder bump) is formed in an ...

Thermal compression bonding process cooling manifold

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

INJECTION-MOLDED SOLDER (IMS) TOOL ASSEMBLY AND METHOD OF USE THEREOF

An injection-molded solder (IMS) tool assembly apparatus, the apparatus including an IMS tool for dispensing a molten material via a round extrusion part to coat an inside or an outside wall of a pipe (and a chiller for providing cooling water to flow through an inside of the pipe.) 1. An injection-molded solder (IMS) tool assembly apparatus , the apparatus comprising:an IMS tool for dispensing a molten material via a round extrusion part to coat an outside wall of a pipe; anda chiller for providing cooling water to flow through an inside of the pipe.2. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein the IMS tool comprises:a tungsten head for dispensing the molten material into the round extrusion part;a heater for maintaining a molten state of the molten material in the tungsten head; anda pressure source for supplying pressure to the molten material causing the molten material to dispense from the tungsten head into the round extrusion part.3. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein an inner diameter of the round extrusion part is greater than an outer diameter of the pipe.4. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein the pipe comprises a carbon steel pipe.5. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a temperature of the cooling water is set such that the pipe is cooled to avoid melting of a material of the pipe while the molten material touches the outside wall of the pipe.6. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a melting temperature of the molten material is greater than a melting temperature of the pipe.7. The injection-molded solder (IMS) tool assembly apparatus of claim 4 , wherein the molten material includes a material to coat the pipe such that the pipe has a stainless steel property.8. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a melting ...

HEATER FOR BONDING APPARATUS AND METHOD OF COOLING THE SAME

Provided is a plate-like heater for a bonding apparatus () including: a lower surface () to which a bonding tool () is attached; and an upper surface () to which a heat insulator () is attached. The upper surface () is provided with a large number of capillary slits (), and the large number of capillary slits () and a matching surface () of the heat insulator () attached to the upper surface () form a large number of capillary coolant flow-paths () each extending from a cavity () to a lateral surface (). This allows effective cooling of the heater for a bonding apparatus. 1. A plate-like heater that is made of ceramics for a bonding apparatus , the heater comprising:a first surface to which a bonding tool is attached;a second surface on an opposite side of the first surface to which second surface a heat insulator is attached; anda large number of capillary slits provided in the second surface, the capillary slits having a width along the second surface smaller than a depth in the second surface in a vertical direction, whereinthe large number of capillary slits and a matching surface of the heat insulator attached to the second surface form a large number of capillary coolant flow-paths.2. (canceled)3. The heater for a bonding apparatus according to claim 1 , whereinthe second surface is provided with a depression near a center thereof,the depression and the matching surface of the heat insulator attached to the second surface form a cavity into which coolant air flows, andeach of the large number of capillary slits extends from the cavity to a lateral surface.4. (canceled)5. The heater for a bonding apparatus according to claim 1 , whereinthe heat insulator is provided with a second depression near a center of the matching surface, the second depression and the second surface form a cavity into which coolant air flows, andeach of the large number of capillary slits is communicated with the cavity, and extends between opposing lateral surfaces.6. (canceled)7. A ...

HEAT TRANSFER DEVICE FOR PRODUCING A SOLDERED CONNECTION OF ELECTRICAL COMPONENTS

A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. 1. A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine , comprising:a heat source or a heat sink,and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink,said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable,wherein the distance between the base plate and the component is changeable,wherein said contact units are designed in such a way that said relative distances between the contact surfaces and the surface of the base plate facing the component are changeable depending on a change in the contact pressure with which the base plate is pressed against the component caused by a change in the distance between the base plate and the component, andwherein the contact units are held repositionably in recesses that are provided in the base plate, said contact units can be repositioned into a retracted position in which the contact surfaces of the contact units are flush with the surface of the base plate facing the component.2. The ...

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided. 1. A method of manufacturing a printed circuit board assembly , the method comprising:providing a circuit board;positioning a plurality of components on the circuit board, at least one of the components being a thermally-sensitive component having a maximum temperature threshold;positioning a customized protective heat shield on the thermally-sensitive component;exposing the circuit board to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component; andremoving the customized protective heat shield from the thermally-sensitive component.2. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component prior to positioning of the thermally-sensitive component on the circuit board.3. The method according to claim 2 , wherein the thermally-sensitive component and the customized protective heat shield are together picked and placed on the circuit board with a surface mount technology machine.4. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component after positioning of the thermally- ...

SOLDERING JIG FOR DOUBLE-FACED COOLING POWER MODULE

A soldering jig for double-faced cooling power modules is provided. The soldering jig prevents thermal deformation of a substrate during a soldering process. The soldering jig is used to fix the position of an upper substrate and a lower substrate when a semiconductor chip is disposed and soldered between the upper and lower substrates. The soldering jig includes a lower jig plate that is disposed under the lower substrate and fixes the position of lower substrate, an upper jig plate that is disposed over the upper substrate and compresses the upper substrate toward the lower substrate. Additionally, a connector which couples the lower jig plate and the upper jig plate, and an insert is installed on the connector and is disposed between the upper substrate and the lower substrate to maintain a constant distance between the upper substrate and the lower substrate during a soldering process. 1. A soldering jig for double-faced cooling power modules to fix a position of an upper substate and a lower substrate when a semiconductor ship is disposed and soldered between the upper substrate and the lower substrate , the soldering jig comprising:a lower jig plate disposed under the lower substrate and configured to fix the position of the lower substrate;an upper jig plate disposed over the upper substrate and configured to compress the upper substrate toward the lower substrate;a connector configured to couple the lower jig plate and the upper jig plate; andan insert disposed on the connector and positioned between the upper substrate and the lower substrate, wherein the insert is configured to maintain a substantially constant distance between the upper substrate and the lower substrate during a soldering process,where the upper jig plate contacts an upper surface of the upper substrate and is formed in a shape in which the upper jig plate contacts a central portion of the upper substrate and is separated from a perimeter of the upper substrate.2. (canceled)3. The ...

SOLDERING METHOD, SOLDERING APPARATUS, AND METHOD FOR MAINTAINING SOLDER WETTING OF JET NOZZLE

A soldering method includes intermittently ejecting a solder jet to a workpiece from a jet nozzle, and spraying gas on an outer side surface of the jet nozzle when stopping ejection of the solder jet from the jet nozzle. And a soldering apparatus includes a first nozzle from which a solder jet is intermittently ejected to a workpiece, and a second nozzle from which gas is sprayed on an outer side surface of the first nozzle. 1. A soldering method comprising:intermittently ejecting a solder jet to a workpiece from a jet nozzle; andspraying gas on an outer side surface of the jet nozzle when stopping ejection of the solder jet from the jet nozzle.2. The soldering method according to claim 1 ,wherein solder from the solder jet is attached to the outer side surface of the jet nozzle by spraying gas on the outer side surface of the jet nozzle when stopping ejection of the solder jet from the jet nozzle.3. The soldering method according to claim 1 ,wherein solder from the solder jet and an alloy formed from the solder jet and the jet nozzle are attached to the outer side surface of the jet nozzle by spraying gas on the outer side surface of the jet nozzle when stopping ejection of the solder jet from the jet nozzle.4. The soldering method according to claim 3 ,wherein the alloy has a melting point lower than a temperature of the solder jet.5. The soldering method according to claim 1 ,wherein the spraying of gas is synchronized with the stopping of the solder jet.6. The soldering method according to claim 1 ,wherein the spraying of gas is performed from two or more positions.7. The soldering method according to claim 1 ,wherein the spraying of gas is performed from two positions opposite each other across the jet nozzle.8. The soldering method according to claim 1 ,wherein the spraying of gas lowers a temperature of the jet nozzle to a temperature equal to or lower than a melting point of solder of the solder jet.9. The soldering method according to claim 3 ,wherein the ...

INTEGRATED SOLDERING DEVICE

An integrated soldering device comprising a wire feed mechanism, a heater configured to heat the wire, and an air recirculation system. The heated wire is fed from the device functions as the soldering tip as the device is used. The air recirculation system collects fumes and smoke generated by the soldering process. 1. A hand-held soldering device , comprising:a wire feeder configured to advance a wire to a tip of the soldering device; anda heater configured to heat the wire as a soldering tip to attach the wire to a surface with solder during a soldering process.2. The soldering device of in which a tube,', 'a heating element in direct contact with the tube, and', 'a power supply connected to the heating element; and, 'the heater includesthe wire feeder is further configured to advance the wire to the tip of the soldering device through the tube.3. The soldering device of in which the heating element is a nickel chromium wire.4. The soldering device of in which the tube comprises a thermally conductive material.5. The soldering device of claim 1 , further comprising an air recirculation system configured to collect air generated during the soldering process.6. The soldering device of in which the air recirculation system includes:a filter,a bladder, anda vacuum configured to draw air from the tip of the soldering device through the filter into the bladder during the soldering process.7. The soldering device of in which the wire feeder includes a cartridge containing a spool of wire.8. The soldering device of in which the wire feeder includes:a wire feed drive system connected to the cartridge containing the spool of wire, anda controller configured to operate the wire feed drive system.9. The soldering device of in which the controller is a mechanical controller.10. The soldering device of in which the wire feed drive system includes a pneumatically driven plunger and pinch mechanism.11. The soldering device of in which the soldering device includes an indicator ...

COOLING SYSTEM TO REDUCE LIQUID METAL EMBRITTLEMENT IN METAL TUBE AND PIPE

A system and method for cooling a heat exchanger. 1. A braze furnace cooling system for brazing heat exchangers , the heat exchangers having a plurality of fins and a plurality of return bends , the system comprising:a brazing heat source;a conveyor configured to move heat exchangers in a direction of travel such that the return bends are proximate to the brazing heat source for a period of time;one or more fluid nozzles configured to direct a sheet of pressurized fluid along the plurality of fins.2. The system of claim 1 , wherein the fluid nozzles are configured to provide a laminar flow of fluid.3. The system of claim 1 , wherein the one or more fluid nozzles are oriented perpendicular to the fins of the heat exchanger claim 1 , such that the sheet of pressurized fluid is directed to more than two fins of the plurality of fins.4. The system of claim 3 , wherein the sheet of pressurized fluid is directed to more than five fins.5. The system of claim 1 , wherein the sheet of pressurized air is substantially parallel to the plurality of fins.6. The system of claim 1 , wherein the one or more fluid nozzles are positioned adjacent to the brazing heat source.7. The system of claim 1 , wherein the one or more fluid nozzles are positioned at a location past the brazing heat source claim 1 , with respect to the direction of travel of the conveyor.8. The system of claim 1 , wherein the one or more fluid nozzles are positioned at a distance from the conveyor which is less than the distance between the brazing heat source and the conveyor.9. The system of claim 1 , wherein the one or more fluid nozzles direct a flow of fluid sufficient to pass through the heat exchanger.10. The system of claim 1 , wherein the one or more fluid nozzles are two fluid nozzles.11. A method of cooling a heat changer claim 1 , comprising:moving an unbrazed heat exchanger through a brazing furnace;brazing a joint of the heat exchanger in the brazing furnace;moving the brazed heat exchanger past one ...

A COOLING SYSTEM FOR A REFLOW FURNACE

Disclosed in the present application is a cooling system for a reflow furnace, the reflow furnace comprising a heating zone, and the cooling system being used to regulate a temperature of the heating zone, the cooling system comprising: at least one gas inlet and at least one gas discharge port, the at least one gas inlet and the at least one gas discharge port being disposed on the heating zone; a blowing apparatus; at least one gas intake pipeline, an inlet of the at least one gas intake pipeline being connected to the blowing apparatus, an outlet of the at least one gas intake pipeline being connected to the at least one gas inlet, the at least one gas intake pipeline being able to controllably establish fluid communication between the blowing apparatus and the at least one gas inlet; and at least one gas discharge pipeline, an inlet of the at least one gas discharge pipeline being connected to the at least one gas discharge port, an outlet of the at least one gas discharge pipeline being connected to the outside, and the at least one gas discharge pipeline being able to controllably establish fluid communication between the at least one gas discharge port and the outside. The cooling system of the present application can shorten the time taken for the reflow furnace to change from a higher heating temperature to a lower heating temperature. 1. A cooling system for a reflow furnace , the reflow furnace comprising a heating zone , and the cooling system being used to regulate a temperature of the heating zone , wherein the cooling system comprises:a blowing apparatus;at least one gas inlet and at least one gas discharge port, the at least one gas inlet and the at least one gas discharge port being disposed on the heating zone;at least one gas intake pipeline, an inlet of the at least one gas intake pipeline being connected to the blowing apparatus, an outlet of the at least one gas intake pipeline being connected to the at least one gas inlet, the at least one gas ...

METHOD OF CREATING A BONDED STRUCTURE AND APPARATUSES FOR SAME

A method for creating a bonded zinc-coated structure is provided. In another aspect, a sheet metal joining system includes a heated roller contacting a sheet metal workpiece to braze together zinc-based coatings. A further aspect employs a zinc coated metal sandwich including a core having peaks and valleys. 121-. (canceled)22. A method for creating a metallic structure , the method comprising:(a) contacting a first workpiece to spaced apart and substantially flat peaks of a second workpiece, each of the workpieces including a sheet metal parent layer and at least one zinc-coated layer;(b) heating a portion of a roller;(c) rotating the heated roller against the first workpiece;(d) brazing the zinc-coated layers of the workpieces together in response to step (c), without the use of a separate brazing alloy or flux;(e) maintaining at least some of the zinc-coated layers around a brazed connection between the workpieces to preserve corrosion resistance at the connection;(f) cooling another portion of the roller such that different areas of the roller are heated and cooled substantially simultaneously;(g) cooling the first workpiece with the cooled portion of the roller after the brazing;(h) the roller heating the first workpiece in less than seven seconds; and(i) the roller cooling the first workpiece in less than one second.23. The method of claim 22 , further comprising conducting electrical current through at least one section of the roller which is isolated from adjacent sections of the roller.24. The method of claim 23 , further comprising deterring electrical current from transmitting from the roller to the workpieces by use of an insulator surrounding the sections of the roller.25. The method of claim 22 , further comprising flowing cooling fluid through the roller.26. The method of claim 22 , wherein the roller heating step further comprises inductively heating the roller from an electrical coil positioned adjacent an exterior surface of the roller.27. The ...

HEAT-BONDING APPARATUS AND METHOD OF MANUFACTURING HEAT-BONDED PRODUCTS

A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature suitable for heat-bonding, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part in contact with the object in the chamber, a cooler for discharging heat of the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object. 1. A heat-bonding apparatus comprising:a vacuum chamber for housing an object to be heat-bonded and a buffer part;a heater for applying heat to the buffer part placed into contact with the object housed in the vacuum chamber;a cooler for discharging heat of the buffer part heated by the heater;an object temperature sensor for detecting a temperature of the object heated through the buffer part; anda controller for controlling the temperature of the object to be a specified target temperature suitable for heat-bonding by adjusting heat discharge from the buffer part with the cooler in accordance with the detected temperature of the object.2. The heat-bonding apparatus according to claim 1 ,wherein the heater is provided as a thermal radiation heater for heating the buffer part through thermal radiation;the cooler includes a cooling block and a drive unit for relatively driving the cooling block to approach and move away from the buffer; andthe controller is configured to control the temperature of the object by adjusting approach and separation of the ...

BOND HEADS FOR THERMOCOMPRESSION BONDERS, THERMOCOMPRESSION BONDERS, AND METHODS OF OPERATING THE SAME

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater. 1. A thermocompression bonder comprising:a workpiece supply station including a plurality of workpieces;a bonding station;a placer tool for receiving a workpiece from the workpiece supply station, and for bonding the workpiece to a substrate at the bonding station; anda cooling station for cooling the placer tool after bonding the workpiece to the substrate.2. The thermocompression bonder of wherein the placer tool is carried by a bond head of the thermocompression bonder claim 1 , the bond head including a heater configured to heat the workpiece and a chamber proximate the heater claim 1 , the chamber configured to receive a cooling fluid for cooling the heater.3. The thermocompression bonder of wherein the placer tool is carried by a bond head of the thermocompression bonder claim 1 , the bond head including a heater configured to heat the workpiece and a chamber proximate the heater claim 1 , the chamber configured to receive a cooling fluid for cooling the heater claim 1 , the chamber adapted to move between a first position in contact with the heater and a second position out of contact with the heater.4. The thermocompression bonder of wherein the placer tool is carried by a bond head of the thermocompression bonder claim 1 , the bond head including a heater configured to heat the workpiece and a chamber proximate the heater claim 1 , the chamber configured to receive a cooling fluid during a first operational phase and a second fluid during a second operational phase.5. The thermocompression bonder of wherein the placer tool is carried by a bond head of the thermocompression bonder claim 1 , the bond head including a heater configured to heat the workpiece and a ...

HEAT TRANSFER DEVICE FOR PRODUCING A SOLDERED CONNECTION OF ELECTRICAL COMPONENTS

A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device. 114-. (canceled)15. A heat transfer device for thermal coupling of a component to be soldered , having a heat source and/or a heat sink in a soldering machine , in particular in a vacuum soldering machine , with a heat source and/or a heat sink and with at least one base plate which is in thermally conductive contact at least with the heat source and/or the heat sink , where the base plate comprises at least two , in particular a plurality , of contact units having a respective contact surface , where the contact surfaces are thermally contactable to the component , where the contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable , and where the distance between the base plate and the component is changeable , wherein the contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable depending on a change in the contact pressure with which the base plate is pressed against the component caused by a change in the distance between the base plate and the component.16. The heat transfer device according to claim 15 , wherein the contact units are held ...

FLUX COLLECTION METHOD AND FLUX COLLECTION APPARATUS

A method and an apparatus for collecting flux in a way that improves the cleanliness inside a furnace by improving flux collection efficiency, reduces flux viscosity to maintain a liquid state even at ordinary temperature, and makes the flux collection unit more easily serviceable includes a rosin particle contained in an atmosphere gas, and vapor of a solvent or an atomized solvent particle are mixed in a mixing section provided upstream of a flux collection unit-side inlet, and a gas containing a mixed particle is cleaned by means of electrostatic precipitation. The solvent particle adheres to the rosin particle, and forms an aggregate of large particle size that can be more easily charged by corona discharge. This improves the flux collection rate of electrostatic precipitation collection, and, because the rosin particle dissolves in the solvent particle, the collected flux can have reduced viscosity. 1. A method for collecting a flux in an atmosphere gas introduced into a flux collection unit from inside of a reflow furnace ,the method comprising the steps of:mixing a rosin particle contained in the atmosphere gas with vapor of a solvent or with an atomized solvent particle before the mixed particle enters a flux collection unit-side inlet; andcollecting the mixed particle by means of electrostatic precipitation from a gas containing the mixed particle.2. The method according to claim 1 , wherein claim 1 , in the collection step claim 1 , the rosin particle has a particle size distribution with a median smaller than a median of a particle size distribution of the mixed particle.3. The method according to claim 1 , wherein claim 1 , in the mixing step claim 1 , the solvent in the solvent vapor or in the atomized solvent particle is any one of a solvent that dissolves a rosin component claim 1 , a polar protic solvent claim 1 , and a solvent having a flash point higher than a temperature of the atmosphere gas containing the rosin particle.4. The method according ...

Löteinrichtung zum Verbinden von Solarzellen

Bei dieser Löteinrichtung zum Verbinden von Solarzellen (1,2,3) ist eine auf dem Induktionsprinzip arbeitende Wärmequelle vorgesehen, die mit Lötmittel versehene Leiterbahnen (4) der Solarzellen (1,2,3) mit elektrischen Leitern (7) verbindet, wobei die Wärmequelle einen Hochfrequenzgenerator und eine Induktorschleife (21) aufweist, in der ein hochfrequenter Strom des Hochfrequenzgenerators ein hochfrequentes Magnetfeld bewirkt und dieses in der Leiterbahn (4) und in dem entlang der Leiterbahn (4) angeordneten elektrischen Leiter (7) Wirbelströme induziert, die die für den Lötvorgang notwendige Wärme erzeugen. Die U-förmige Induktorschleife (21) weist Verengungen und Aufweitungen auf, die der Optimierung der Wärmeentwicklung in der Lötzone und somit auch der Energieeinsparung dienen. Jede Aufweitung bietet Zugang zur Lötstelle für einen magnetfeldneutralen Niederhalter (27), der den Leiter (7) auf die Leiterbahn (4) presst. Mit der Induktorschleife (21) kann die gesamte Länge der Leiterbahn (4) der Zellenoberseite (5) und der Zellenunterseite (6) einer Solarzelle (1,2,3) in einem Lötvorgang mit einem Leiter (7) verlötet werden.

WAVELENGTH CONVERSION MEMBER FOR SOLDERING, WAVELENGTH CONVERSION DEVICE, AND LIGHT SOURCE DEVICE

A wavelength conversion member for soldering includes a ceramic fluorescent body for converting a wavelength of light entering from an incident surface of the ceramic fluorescent body, a reflection layer disposed on a back surface of the ceramic fluorescent body on a side opposite the incident surface and partially or entirely covering the back surface, and a junction layer composed of one or more films and covering at least the reflection layer selected from the back surface of the ceramic fluorescent body and the reflection layer. The junction layer has a projecting portion which projects, in relation to an outer circumferential portion of the junction layer, in a center portion of a surface on a side opposite a surface on a side where the junction layer covers at least the reflection layer selected from the back surface and the reflection layer. 1. A wavelength conversion member for soldering comprising:a ceramic fluorescent body for converting a wavelength of light entering from an incident surface of the ceramic fluorescent body;a reflection layer disposed on a back surface of the ceramic fluorescent body on a side opposite the incident surface and partially or entirely covering the back surface; anda junction layer composed of one or more films and covering at least the reflection layer selected from the back surface of the ceramic fluorescent body and the reflection layer,wherein the junction layer has a projecting portion which projects, in relation to an outer circumferential portion of the junction layer, in a center portion of a surface on a side opposite a surface on a side where the junction layer covers at least the reflection layer selected from the back surface and the reflection layer.2. The wavelength conversion member for soldering according to claim 1 , whereinthe junction layer directly covers both the reflection layer and an exposed portion of the back surface of the ceramic fluorescent body; andthe projecting portion of the junction layer ...

TRANSPORT UNIT FOR TRANSPORTING PRINTED CIRCUIT BOARDS, AND SOLDERING SYSTEM

A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

Welding device for ball type welding flux

本发明涉及激光焊接技术领域，尤其涉及一种球类焊料的焊接装置。本发明公开了一种球类焊料的焊接装置，所述球类焊料的焊接装置包括：料仓部、传输部、焊料检测部、焊接部和底板；所述料仓部用于存储球类焊料；所述传输部与所述料仓部连接，用于从所述料仓部取球类焊料并传输至所述焊料检测部和所述焊接部；所述焊料检测部用于检测所述传输部是否传输有球类焊料；所述焊接部用于接收所述传输部传输的球类焊料，并执行焊接操作；所述底板用于固定所述料仓部、所述传输部、所述焊料检测部和所述焊接部。本发明实现了球类焊料的存储、传输、检测和焊接的一体化，实现了以自动的方式操作焊接装置。

Soldering apparatus for connecting solar cells

在这种连接太阳能电池(1、2、3)的焊接设备上具有一种按照感应定律工作的热源，所述热源与具有焊剂的所述太阳能电池(1、2、3)的印制电路(4)用电线(7)相连，其中，所述热源具有高频发电机和感应回路(21)，在所述热源中高频发电机发出的高频电流产生高频磁场并且所述高频磁场在印制电路(4)和在沿印制电路(4)上设置的电线(7)中引起涡流，所述涡流产生为焊接过程所必需的热量。所述U形感应回路(21)具有扩张处(26)和收缩处(25)，所述扩张处(26)和收缩处(25)有助于优化焊区的发热并且因此有助于节能。每一个所述扩张处都为磁场中性的压紧装置(27)提供焊接位置的入口，所述压紧装置将所述电导线(7)按压在所述印制电路板(4)上。在焊接过程中用所述感应回路(21)能够将电池上表面(5)和电池下表面(6)的印制电路(4)的整个长度用所述电线(7)焊接。

Bonding stage and bonding apparatus comprising the same

본딩 스테이지가 제공된다. 본딩 스테이지는, 복수의 반도체 칩이 배치된 기판의 제1 영역의 하부에 배치되는 제1 히터, 상기 기판의 상기 제1 영역과 다른 제2 영역의 하부에 배치되는 제2 히터, 상기 제1 히터와 상기 제2 히터의 하부에 배치되어, 상기 제1 히터의 열과 상기 제2 히터의 열이 상기 제1 히터와 상기 제2 히터의 하부로 전달되는 것을 차단하는 냉각기, 및 상기 제1 히터와 상기 제2 히터 상에 배치되어 상기 기판을 지지하고, 상기 제1 히터의 열과 상기 제2 히터의 열을 상기 기판에 전달하는 박판 플레이트를 포함하되, 상기 제1 히터와 상기 제2 히터는 서로 독립적으로 가동된다.

Soldering apparatus and soldering method

Welding and shaping integrated method for circular titanium target and back plate

本发明涉及一种圆形钛靶材和背板的焊接整形一体化方法，所述一体化方法包括：分别在圆形钛靶材的焊接面和背板的焊接面上浸润熔化的焊料，并将两者的焊接面相贴合，且所述圆形钛靶材位于所述背板的上方；在所述圆形钛靶材的上方放置垫块，并在所述垫块的上方进行加压操作；经冷却后撤去所述加压操作，得到圆形钛靶材组件。本发明所述一体化方法，可以在焊接的同时对圆形钛靶材的平面度进行校正，避免了后续额外的整形操作，同时达到圆形钛靶材组件的焊接结合度要求和平面度要求，使得焊接结合度≥99％且平面度≤0.3mm，同时提高了焊接合格率和整形合格率。

Reflow soldering apparatus

本发明涉及一种回流焊装置，其能够防止在回流焊装置的冷却区域中焊剂雾液化并滴下于被加热物而使被加热物的品质下降。该回流焊装置包括：加热区域，其具有对被加热物进行焊接的炉体；冷却区域，其将焊接完的被加热物冷却，利用输送装置使被加热物通过加热区域以及冷却区域，在加热区域以及冷却区域之间的连结部配置有向被加热物吹送气体的吹出部件，吹出部件相对于输送装置的输送方向吹出气体的角度是可变的。

Soldering Equipment and Soldering Method

전자부품의 납이 납땜되어야 할 위치의 지점에 크림땜납이 놓여지고 그 전자부품의 납이 그 지점에 제공되어 있는 프린트기판을 납땜위치로 공급하고, 공급된 프린트기판의 크림땜납을 국부적으로 가열하여 용융시켜서 전자부품의 납을 그 지점에 납땜하고, 용융된 땜납을 강제 냉각에 의해 고화시켜서 전자부품의 납을 그 지점에 고정시키며, 상기 전자부품의 납이 고학된 땜납에 의해 그 지점에 고정된 프린트기판을 상기 납땜위지로부터 배출하는 납땜방법 및 장치.

Jet solder bath and jet soldering equipment

Reflow furnace for the component mounting

본 발명은 부품 실장용 리플로우 로에 관한 것으로서, 특히 내측으로 열풍 및 냉각 공기가 공급되는 리플로우부재와, 상기 리플로우부재의 내측으로 부품이 실장된 실장 기판을 승강시키는 승강부재와, 상기 리플로우부재의 내측으로 열풍을 공급하는 열풍 공급수단과, 상기 리플로우부재의 내측에 위치된 실장 기판의 부품을 향하여 부분적으로 냉각 공기를 분사하는 토출관을 구비하는 것을 특징으로 한다. 따라서, 본 발명에서는 일반 부품 및 약열 부품이 혼재된 상태로 고온의 열풍 분위기 로내에서 납땜 등의 작업을 행하는 것이 가능하여 특히 약열 부품의 열충격을 최소화하여 불량율을 감소시킴과 동시에 더욱 향상된 납땜 품질을 얻을 수 있고, 더욱이 작업 공수 및 작업 시간을 단축하여 생산성을 향상시킴은 물론 제조 코스트를 현저하게 절감할 수 있는 등의 여러 가지 효과가 있다. The present invention relates to a reflow furnace for mounting parts, and in particular, a reflow member supplied with hot air and cooling air therein, an elevating member for elevating a mounting substrate on which a component is mounted inside the reflow member, and the reflow member. And hot air supply means for supplying hot air to the inside of the member, and a discharge pipe for partially injecting cooling air toward the component of the mounting substrate located inside the reflow member. Therefore, in the present invention, it is possible to perform operations such as soldering in a high temperature hot air atmosphere furnace in a state where general parts and weak heat parts are mixed, and in particular, minimize thermal shock of the weak heat parts to reduce the defective rate and at the same time obtain more improved solder quality. In addition, there are various effects, such as shortening work man-hours and working time, thereby improving productivity and significantly reducing manufacturing costs.

Bonding apparatus of semiconductor chip

본 발명의 기술적 사상에 의한 반도체 칩 본딩 장치는 반도체 칩을 흡착하여 파지하는 본딩 헤드; 상기 반도체 칩이 실장되는 기판이 배치되고, 상기 반도체 칩을 상기 기판에 실장하고 본딩하는 공정이 수행되는 본딩 스테이지; 상기 반도체 칩을 촬상하여 상기 반도체 칩의 위치 정보를 획득하는 제1 카메라; 상기 반도체 칩이 실장되는 기판을 촬상하여 상기 기판의 위치 정보를 획득하는 제2 카메라; 상기 본딩 스테이지의 측면부 일측에 형성되고, 보정용 칩과 보정용 기판을 구비하는 보정 장치 구조체; 및 상기 본딩 헤드로 상기 보정용 칩을 파지하고, 상기 보정용 기판에 실장하여 본딩 위치 보정을 제어하는 본딩 제어부를 포함한다. A semiconductor chip bonding apparatus according to the present invention includes: a bonding head for adsorbing and gripping a semiconductor chip; A bonding stage on which a substrate on which the semiconductor chip is mounted is disposed, and a process of mounting and bonding the semiconductor chip to the substrate is performed; A first camera that captures an image of the semiconductor chip and acquires location information of the semiconductor chip; A second camera for obtaining positional information of the substrate by photographing the substrate on which the semiconductor chip is mounted; A correction device structure formed on one side of a side surface of the bonding stage and including a correction chip and a correction substrate; And a bonding control unit that grips the correction chip by the bonding head and mounts it on the correction substrate to control bonding position correction.

Method and device for joining conductive parts in a soldering manner with the aid of a soldering tool comprising a non-wettable soldering zone

The invention relates to a method and a device for joining conductive parts (11, 12) in a soldering fashion by feeding solder material (5) to the connection zone (13) of the parts (11, 12), fusing off solder material (5) and introducing solder material (5) into the connection zone (13) by means of a soldering tool (2) which is located in the connection zone (13) and is provided with a non-wettable soldering zone (3).

Apparatus for supplying an inert gas to a wave soldering machine

Vorrichtung (1) zum Zuführen von Inertgas zum Schutz der Oberfläche (13) eines Lotbades (12) einer Wellenlötanlage (11) gegen Oxidation ausgebildet als Deckel (2), der oberhalb zumindest eines Teilbereichs (14) des Lotbades (12) angeordnet werden kann, dadurch gekennzeichnet, dass unterhalb des Deckels (2) mindestens zwei in das Lotbad (12) eintauchende Wärmetauscher (3a; 3b; 3c) angebracht sind, die jeweils oberhalb des Deckels (2) einen Einlass (4a; 4b; 4c), durch die das Inertgas eingeleitet wird, und einen Auslass (5a; 5b; 5c) aufweisen, wobei die Auslässe (5a; 5b; 5c) oberhalb des Deckels (2) mittels hitzebeständiger, lösbarer Verbindungselemente (6) an mindestens zwei Inertgasanschlüsse (15) der Wellenlötanlage (11) anschließbar sind. Device (1) for supplying inert gas for protecting the surface (13) of a solder bath (12) of a wave soldering system (11) against oxidation formed as a lid (2), which can be arranged above at least a portion (14) of the solder bath (12) , characterized in that below the lid (2) at least two immersed in the Lotbad (12) heat exchanger (3a, 3b, 3c) are mounted, each above the lid (2) has an inlet (4a, 4b, 4c), through the outlet (5a; 5b; 5c) above the lid (2) by means of heat-resistant, detachable connecting elements (6) to at least two inert gas ports (15) of the Wave soldering (11) can be connected.

Apparatus and method for providing an inerting gas during soldering

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus that is placed atop of a solder reservoir and comprises a plurality of porous tubes that are in fluid communication with an inerting gas. In another aspect, there is provided a method for providing an inerting gas to a wave soldering apparatus comprising the steps of, among other things, placing an apparatus atop at least one edge of the solder reservoir wherein the apparatus comprises a plurality of tubes comprising one or more openings in fluid communication with an inerting gas source. In a further aspect, at least one of the tubes comprises a non-stick coating or is comprised of a porous non-stick material such as a sleeve.

Inert gas soldering machine and soldering process with inert gas

Die Erfindung betrifft eine neue Lötmaschine 1 und ein entsprechendes Lötverfahren, bei denen der Schutzgasverbrauch reduziert wird durch Höhemdifferenzen zwischen der Eintrittsöffnung 20 bzw. der Austrittsöffnung 21 und einem inneren Bereich des Lötmaschinenkanals 5. The invention relates to a new soldering machine 1 and a corresponding soldering method in which the shielding gas consumption is reduced by height differences between the inlet opening 20 or the outlet opening 21 and an inner region of the soldering machine channel 5.

Device for supplying an inert gas to a wave soldering installation

The invention relates to a device (1) for supplying inert gas in order to protect the surface (13) of a solder bath (12) in a wave soldering installation (11) against oxidation. The device (1) is in the form of a cover (2) which can be arranged above at least one partial region (14) of the solder bath (12), wherein at least two heat exchangers (3a; 3b; 3c) which are immersed in the solder bath (12) are fitted underneath the cover (2), and each of these heat exchangers has an inlet (4a; 4b; 4c), through which the inert gas is fed in, and an outlet (5a; 5b; 5c) above the cover (2). Heat-resistant, releasable connecting elements (6) can be used to connect the outlets (5a; 5b; 5c) above the cover (2) to at least two inert gas connections (15) of the wave soldering installation (11). The heat exchangers (3a; 3b; 3c) are designed and dimensioned in such a manner that they can be immersed substantially completely in the solder bath (12) next to other components (16) of the wave soldering installation (11). The device (1) is distinguished in that it heats the inert gas virtually to the temperature of the solder bath (12) without additional external heating elements, and thus preheats regions to be soldered before a first solder wave (21) and prevents cooling from occurring between two solder waves (21). In addition, the solidification of solder splashes on components of the inert gas distribution system is prevented. The invention can display its advantages particularly when lead-free solder is used and when soldering printed circuit boards (18) which are equipped with components on both sides.

Reflow Farnae for the Comport mounting

본 발명은 부품 실장용 리플로우 로에 관한 것으로서, 특히 내측으로 열풍 및 냉각 공기가 공급되는 리플로우부재와, 상기 리플로우부재의 내측으로 부품이 실장된 실장 기판을 승강시키는 승강부재와, 상기 리플로우부재의 내측으로 열풍을 공급하는 열풍 공급수단과, 상기 리플로우부재의 내측에 위치된 실장 기판의 부품을 향하여 부분적으로 냉각 공기를 분사하는 토출관을 구비하는 것을 특징으로 한다. 따라서, 본 발명에서는 일반 부품 및 약열 부품이 혼재된 상태로 고온의 열풍 분위기 로내에서 납땜 등의 작업을 행하는 것이 가능하여 특히 약열 부품의 열충격을 최소화하여 불량율을 감소시킴과 동시에 더욱 향상된 납땜 품질을 얻을 수 있고, 더우기 작업 공수 및 작업 시간을 단축하여 생산성을 향상시킴은 물론 제조 코스트를 현저하게 절감할 수 있는 등의 여러 가지 효과가 있다.

Flux coating device

焊剂涂敷装置将焊剂涂敷到焊锡的表面上，其中，该焊剂涂敷装置包括：浸泡涂敷部件，其将焊锡浸泡到焊剂内而将焊剂涂敷到焊锡表面；负荷部件，在将投入焊锡的一侧设定为上游侧，将排出焊锡的一侧设定为下游侧时，该负荷部件设置在比浸泡涂敷部件靠上游侧的位置，对焊锡施加预定的负荷；定速输送部件，对于利用浸泡涂敷部件涂敷了焊剂并且与焊剂的液面垂直地被提拉的焊锡，在利用负荷部件对所述焊锡施加了负荷的状态下，该定速输送部件以预定的速度输送所述焊锡；干燥部件，其使涂敷了焊剂的焊锡干燥；冷却部件，其将干燥后的焊锡冷却；输送速度计量部件，其计量焊锡的输送速度；以及控制部件，其控制焊锡的输送速度。

Welding method based on Multifunctional rotating desk

本专利申请公开了基于多功能旋转台的焊接方法，包括以下步骤：步骤一，将接合套卡接到球形本体两侧的定位块上；步骤二，将其中一个接合套与电机的输出轴连接；步骤三，将电路板固定住；步骤四，顺时针转动电机，将工作台调整到适合焊接的位置；停止电机转动；步骤五，在步骤四进行的同时，吸盘吸住电路板；步骤六，用电烙铁焊接；步骤七，逆时针转动电机，向电路板吹风；步骤八，将接合套从电机的输出轴上拆卸下来；将接合套从定位块中取出；步骤九，将接合套中的插接块旋出，插进插接槽中，插接块将弧形封板推出滑槽并遮盖住球形本体上的竖孔；步骤十，滚动球形本体，将合拢的球形本体运送到下一个工位中。

Circuit board cooling module for reflow soldering

本发明公开了一种回流焊用电路板冷却模块，涉及回流焊领域，包括外壳以及传送带，所述外壳安装在回流焊的侧端，所述传送带的顶端放置有多组焊接板，且每组焊接板的顶端皆放置电路板，所述外壳的顶端安装有过滤机构，所述过滤机构包括吸气口以及收集口。能够在进行吸气的过程中，通过过滤板对进入到过滤机构的空气进行过滤，在负压下使套杆带动刮板移动，使刮板移动至过滤板边缘开设的开槽位置解除对过滤板的限位，此时叶片在气流的带动下转动，使带有烟尘的过滤板移动到与刮板相同的平面，在转杆转动的同时转杆两端L型管的位置也发生变化，从而改变对两组吸气管的接通情况，使两组套杆的接通情况同时反向改变，使刮板对过滤板进行刮除。

Gas Knife Cooling System

본 발명은 가스 흐름을 제품상에 직접 충돌시켜 냉각 가스를 적게 사용하므로써 납땜된 제품(12)을 리플로우 솔더링하기 위한 가스 나이프 냉각 시스템에 관한 것이다. 냉각 시스템은 리플로우 솔더링 장치의 냉각부(18)에 설치되며, 컨베이어(14)상의 냉각부(18)를 통과하는 납땜된 제품(12)에 가스 흐름을 향하게 하는 적어도 하나의 가스 나이프(24, 25)를 포함한다. 히터(32)는 가스 나이프(24, 25)와 연결되며, 상기 히터는 가스 나이프(24, 25)를 납땜 제품(12)으로부터의 플럭스 침착물의 플럭스 기화 온도 이상으로 가열하기 위해 설정된 세척 사이클동안 작동된다. The present invention relates to a gas knife cooling system for reflow soldering of a soldered product 12 by directly impinging the gas flow onto the product and using less cooling gas. The cooling system is installed in the cooling section 18 of the reflow soldering device, and at least one gas knife 24 for directing the gas flow to the soldered product 12 passing through the cooling section 18 on the conveyor 14. 25). The heater 32 is connected to the gas knives 24 and 25, which are operated for a set cleaning cycle to heat the gas knife 24 and 25 above the flux vaporization temperature of the flux deposits from the braze product 12. do.

A brazing automatic apparatus

본 고안은 두께가 상이한 피접합물을 브레이징하는 브레이징 자동화 장치에 관한 것이다. The present invention relates to a brazing automation device for brazing a joined object having a different thickness. 이러한 본 고안은, 용가재가 셋팅된 피접합물(M)을 공급하는 공급유닛(100); 상기 공급유닛(100)에서 공급된 피접합물(M)을 환원성분위기에서 브레이징하기 위해, 설정된 시간에 맞춰 일정한 온도로 가열하는 가열유닛(300); 상기 가열유닛(300)에서 이송된 피접합물(M)을 환원성분위기에서 냉각시키도록 기밀히 연결된 냉각유닛(400); 상기 냉각유닛(400)에서 배출된 피접합물(M)을 대기 중으로 이송시키는 이송유닛(600); 상기 공급유닛(100)과 가열유닛(300) 사이에 설치되어, 가열유닛(300)으로 피접합물(M)이 공급되면서 유입되는 대기를 차단하고 환원성분위기를 유지하는 입구측 분위기유닛(200); 상기 냉각유닛(400)과 이송유닛(600) 사이에 설치되어, 이송유닛(600)으로 피접합물(M)이 이송되면서 유입되는 대기를 차단하고 환원성분위기를 유지하는 출구측 분위기유닛(500);을 포함한다. The present invention, the supply unit 100 for supplying the to-be-joined material (M) is set; Heating unit 300 for heating to a constant temperature in accordance with a set time in order to braze the to-be-joined material (M) supplied from the supply unit 100 in a reducing component crisis; A cooling unit 400 hermetically connected to cool the joined object M transferred from the heating unit 300 in a reducing component crisis; A transfer unit 600 for transferring the joined object M discharged from the cooling unit 400 to the atmosphere; It is installed between the supply unit 100 and the heating unit 300, the inlet-side atmosphere unit 200 to block the atmosphere introduced while the to-be-joined material (M) is supplied to the heating unit 300 and to maintain a reducing component atmosphere ; It is installed between the cooling unit 400 and the transfer unit 600, the outlet side atmosphere unit 500 to block the atmosphere introduced while the to-be-joined material (M) is transferred to the transfer unit 600 and to maintain a reducing component atmosphere It includes; 따라서, 본 고안은 피접합물의 온도편차를 줄여 용가재의 웨팅이 좋은 상태에서 브레이징하여 접합력을 극대화할 수 있는 장점이 있다. Therefore, the present invention has the advantage of maximizing the bonding force by brazing in a good state of wetting the filler metal by reducing the temperature deviation of the workpiece. 브레이징, 모재, 피접합물, ...

METHOD AND APPARATUS FOR DISTRIBUTING SOLDER-FREE BRASURE ON A SUBSTRATE

Un appareil de distribution d'une brasure sans flux comprend une tête de distribution (2) munie d'un poinçon (5), sur lequel on peut appliquer des ultrasons. La brasure est distribuée par : A) déplacement de la tête de distribution (2) au dessus de l'emplacement sur le substrat suivant, B) abaissement du poinçon (5) jusqu'à ce que la surface de travail (11) du poinçon (5) touche l'emplacement sur le substrat, ou se situe à une hauteur prédéterminée au-dessus de l'emplacement sur le substrat, C) distribution de la brasure grâce à : C1) l'avance du fil de soudure (8) jusqu'à ce que le fil de soudure (8) touche l'emplacement sur le substrat, de telle manière que le bout du fil de soudure (8) touche l'emplacement sur le substrat à l'intérieur de l'évidement (12) du poinçon (5), C2) poursuite de l'avance du fil de soudure (8), afin de faire fondre une quantité prédéterminée de brasure, et C3) rétraction du fil de soudure (8), D) déplacement de la tête de distribution (2) afin de distribuer la brasure sur l'emplacement sur le substrat, et application simultanée d'ultrasons sur le poinçon (5), et E) relevage du poinçon (5). A non-flux solder dispensing apparatus comprises a dispensing head (2) with a punch (5), to which ultrasound can be applied. The solder is distributed by: A) moving the dispensing head (2) above the location on the next substrate, B) lowering the punch (5) until the work surface (11) of the punch (5) touching the location on the substrate, or is at a predetermined height above the location on the substrate, C) distributing the solder by: C1) advancing the solder wire (8) until the welding wire (8) touches the location on the substrate, such that the end of the welding wire (8) touches the location on the substrate inside the recess (12). ) of the punch (5), C2) continuing the advance of the welding wire (8), in order to melt a predetermined quantity of solder, and C3) retraction of the welding ...

Soldering method, soldering apparatus and cooling apparatus

종래의 납땜장치를 사용한 프린트 기판의 납땜에서 납땜 후의 냉각이 팬방식의 냉각장치로 실시되었다. 그러나 고온 땜납이나 무아연 땜납을 종래의 납땜장치로 납땜하면, 균열이 생기거나 박리되고 납땜 후의 열 사이클로 인하여 파괴되는 경우가 있었다. In the soldering of the printed circuit board using the conventional soldering apparatus, cooling after soldering was performed by the fan type cooling apparatus. However, when high-temperature solder or zinc-free solder is soldered with a conventional soldering apparatus, there are cases in which cracks or peelings occur and break due to thermal cycles after soldering. 본 발명은 용융 땜납조에서의 납땜 직후에 프린트 기판의 납땜부에 냉각액을 접촉시킴으로써 급냉시켜 납땜부의 균열이나 박리 또는 열 사이클에 의한 파괴 등을 방지하는 납땜방법과 납땜장치 및 냉각장치를 제공하는 것을 과제로 한다. SUMMARY OF THE INVENTION The present invention provides a soldering method, a soldering device, and a cooling device for quenching by contacting a coolant to a soldering portion of a printed board immediately after soldering in a molten soldering tank to prevent cracking, peeling, or destruction by thermal cycling of the soldering portion. It is a task.

Hot air solidifying and cooling furnace

本发明公开了一种热风固化及冷却炉，包括有炉体、匀速运输机构、加速运输机构、第一升降运输机构、静置冷却运输机构和吹风冷却运输机构；匀速运输机构安装于热风固化通道的左端，加速运输机构安装于热风固化通道的右端，匀速运输机构朝加速运输机构一端延伸布置；第一升降运输机构安装于炉体的右侧，并位于加速运输机构的侧旁；静置冷却运输机构安装于静置通道，吹风冷却运输机构安装于冷风吹风通道；PCB板依次输送于匀速运输机构输、加速运输机构、第一升降运输机构、静置冷却运输机构和吹风冷却运输机构完成热风固化、常温冷却和吹风冷却。

Pliers

Heat protective articles

A heat protective article 50 is a mat made of a heat resistant material. The mat has a through-hole 52 and an opening 54 extending from an edge 56 of the mat to the through-hole. A flap 60 is provided for selectively covering the opening 54. The heat protective article 50 can be fitted around a pipe by working the pipe along the opening 54 until it is received in the hole-hole. The heat protective article can then be orientated so that it provides suitable protection for adjacent surfaces during a process, such as soldering a joint, that requires the application of heat to the pipe.

Soldering Method, Semiconductor Module Manufacturing Method, and Soldering Apparatus

A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit and a rear surface to which the heat sink is fixed. The heat sink has a refrigerant passage. The electronic component is arranged on the metal circuit with solder in between. A heated heating medium is supplied to the refrigerant passage when heating and melting the solder.

Soldering device for connecting an electrically conductive ribbon to a solar cell

本发明涉及一种焊接设备(8)，用于沿直线焊接线(L)借助感应焊接将导电带(5)固定在太阳能电池(1)的直线的电流汇流排(3)上。特别是本发明的焊接设备(8)的电流通路(SP)被构造在导电固体(20)中，其中这个固体(20)包括至少一个基本上平行于焊接线(L)延伸的部分(FSP)，该部分通过气隙(LS)与焊接线(L)分离以及在该部分中构造有电流通路(SPA)的至少一个部段。基本上平行于焊接线(L)延伸的部分(FSP)具有数个凹孔(21)，这些凹孔沿焊接线(L)被相继地布置成一排。凹孔(21)沿焊接平面(LE)分别垂直于焊接线(L)如下地延伸，即各一个压紧装置元件(P)可移动地布置在凹孔(21)之一中。基本上平行于焊接线(L)延伸的部分(FSP)包括数个长形部段(LA)，这些部段中的每一个都具有平行于焊接线(L)延伸的纵轴线。在每两个被直接相继地布置成一排的凹孔(21)之间分别布置有长形部段(LA)之一。各一个被布置在两个凹孔(21)之间的长形部段(LA)直线性地以及与焊接线(L)平行地从这两个凹孔(21)之一延伸至这两个凹孔(21)的另一个。

Reflow soldering method for improving thermal expansion deformation of device

本发明公开了一种改善器件热膨胀变形的回流焊接方法，包括如下步骤：准备SMT钢网，通过SMT钢网对PCB板印刷锡膏，将印有锡膏的PCB板送入贴片机中进行SMT贴片；将贴片好的PCB板放入回流焊炉，向回流焊炉内通入加热后的氮气；进行一次升温，升温速度≤2℃/s；保温，并加大上风口的风扇转速，保持下风口风扇转速不变；进行二次升温，升温速度≤2℃/s；回流焊接；降温冷却，完成焊接；后续检测。本发明可降低回流焊的峰值温度，从而加宽PWI（工艺窗口指数），产生较好的焊接热熔效果，并使元器件与PCB板的温差减小，避免温差过大而导致的虚焊及变形问题。

Flux application device

Eliminating method of cu element in soldering flux

본 발명은 PCB 등의 자동납땜장치의 납조내에 과량으로 용해되어 있는 Cu 성분을 납조를 교체함이 없이 간단하게 제거하기 위한 방법에 관한 것으로, 본 발명에 따르면 납조의 용탕을 Sn의 융점이상의 온도로 승온한 다음 상기 용탕을 Pb-Sn의 공정온도와 Cu-Sn의 공정온도 사이로 하강유지함으로써 Cu를 Sn과 함께 고상으로 석출시키는 방법이 제공된다. The present invention relates to a method for simply removing a Cu component dissolved in an excess amount of a solder in an automatic soldering apparatus such as a PCB without replacing the lead, And then the molten metal is lowered between the process temperature of Pb-Sn and the process temperature of Cu-Sn to thereby precipitate Cu in solid phase together with Sn. 이러한 본 발명에 따르면, 납조의 용탕내 Cu의 함량이 0.3 중량% 이상일 경우에도 이를 폐기함이 없이 재사용이 가능하므로 원가절감의 차원에서 유리할 뿐만 아니라 환경오염의 방지에도 유용한 잇점이 있다. According to the present invention, even if the content of Cu in the molten metal of the lead bath is 0.3 wt% or more, it can be reused without disposing it, which is advantageous in terms of cost reduction as well as prevention of environmental pollution.

Integrated Soldering Device

一种集成焊接装置，包括：线材供给机构、配置成对所述线材加热的加热器以及空气再循环系统。当使用所述装置时，从所述装置供给被加热的线材当作烙铁头。空气再循环系统收集焊接过程产生的烟气和烟雾。

Gas tip cooling system

PCB welding table based on independent cooling technology

本发明公开了一种基于独立冷却技术的PCB板焊接台，包括台架，台架的顶端贯通连接翻转腔，翻转腔内设有焊接台板，焊接台板通过翻转轴转动连接在翻转腔的内腔壁上，台架的左右两侧端对称设有侧撑腔，侧撑腔内设有支撑柱，所述支撑柱通过转轴转动连接在侧撑腔上，风冷孔的内腔自下而上依次设有第一防护网、风冷扇和气压缸，气压缸上的气压杆的顶端固定连接有与焊接台板相配合的托板组件；本发明通过风冷扇牵引外界的空气进入风冷孔内，并沿着风冷孔上吹，上升的气流在导流腔的作用下流向焊接台板的底端，进而斜吹焊接台板上的PCB板，对PCB板进行快速降温，能大幅降低PCB板的降温时间，能大幅缩短非加工时间，能大幅提升加工效率。

Through-hole reflow soldering machine

本发明公开了一种结构改良的通孔回流焊机，其回流焊机台内部装设线路板输送轨道、八个加热温区及两个自然风冷却区；各加热温区分别包括一微循环吹风区、一微循环加热区，各微循环吹风区分别包括循环吹风内、外炉体及循环吹风变频风机，各微循环加热区分别包括有循环加热内炉体、循环加热外炉体、循环加热变频风机及电加热器；各自然风冷却区分别包括上、下冷却区，各上冷却区分别包括上冷却内、外炉体及上冷却变频风机，各下冷却区分别包括下冷却内、外炉体及下冷却变频风机；本发明通过PLC控制器进行控制。通过上述结构设计，本发明能够自动高效且高质量地完成PCB线路板通孔回流焊加工，结构设计新颖且自动化程度高。

Method for soldering dissimilar materials with assistance of carbon nanotube sponge intermediate layer

一种碳纳米管海绵中间层辅助钎焊异种材料的方法，涉及一种钎焊异种材料方法。为了解决现有金属材料与异种材料钎焊接头强度低的问题。方法：将碳纳米管与强酸溶液混合超声清洗，然后分散到去离子水中抽滤，滤饼超声分散到无水乙醇中离心得到上清液；再抽滤、干燥，最后对异种材料钎焊。或将碳纳米管与强酸溶液混合超声清洗，然后液分散到去离子水中并抽滤，滤饼超声分散到无水乙醇中离心得到上清液；上清液加入钎料粉末后再抽滤、干燥，最后对异种材料钎焊。本发明碳纳米管海绵制备方法简单成本低，能够避免碳纳米管在钎焊过程中发生团聚，有利于调控界面组织，增强钎缝性能，缓解接头残余应力，提高接头强度。本发明适用于钎焊异种材料。

Gas-tip cooling system

MID shouldering device using induction heat

The present invention relates to an MID soldering apparatus using induction heating and, specially, to an MID soldering apparatus comprising: an induction heating unit including a magnetic induction coil; and a jig including a coupling unit for fixing a molded interconnected device (MID) part disposed below the induction heating unit and heating a certain area in a non-contact manner. Accordingly, thermal damage to the MID part, which is vulnerable to the heat, is reduced.

Device, method and system for non-uniform cooling of a planar object

根据本发明的装置用于对平面物体(2)进行不均匀地冷却，该平面物体具有第一主面(200)和与其相对的第二主面(202)。在此，通过冷却装置(1)从第一主面的方向冷却平面物体。在第二主面上，加热机构(4)局部地作用在第一分面(204)上，使得平面物体在该第一分面上相对于与该第一分面相邻的第二分面(206)被加载热，使得该第一分面比第二分面更慢地冷却，并因此使得平面物体的第二主面在冷却过程期间至少在冷却的部分时段中具有不均匀的温度分布。

A kind of hot air circulation soldering oven

一种热风循环钎焊炉，包括炉体，炉体内设有加热腔和工作腔，所述加热腔和工作腔相连通；炉体的一侧设有主风机，通过主风机将经过加热腔的气体引至工作腔内，形成热风循环通道；气体引至工件的内腔，在工件的内腔中形成贯通的气道。本发明一方面将热循环加热方式与内腔中空的工件相结合，不仅能够缩短加热时间；而且热气体能够直接充满工件内腔，使工件各个位置温差接近，受热更均匀，大大提高工件的钎焊质量；钎焊效果十分显著；另一方面，能够适用于硬钎焊，即钎焊氛围高于450℃的场合。

A kind of reflow soldering method improving device thermal expansion deformation

本发明公开了一种改善器件热膨胀变形的回流焊接方法，包括如下步骤：准备SMT钢网，通过SMT钢网对PCB板印刷锡膏，将印有锡膏的PCB板送入贴片机中进行SMT贴片；将贴片好的PCB板放入回流焊炉，向回流焊炉内通入加热后的氮气；进行一次升温，升温速度≤2℃/s；保温，并加大上风口的风扇转速，保持下风口风扇转速不变；进行二次升温，升温速度≤2℃/s；回流焊接；降温冷却，完成焊接；后续检测。本发明可降低回流焊的峰值温度，从而加宽PWI（工艺窗口指数），产生较好的焊接热熔效果，并使元器件与PCB板的温差减小，避免温差过大而导致的虚焊及变形问题。

Automatic tin solder and its control method

本发明公开了一种自动焊锡设备，包括传动模块、助焊剂喷涂模块、预热模块、焊接模块、冷却模块、排气模块和主控制器；传动模块包括电机和皮带式输送带，皮带式输送带套在电机上，由电机带动皮带式输送带移动，电机与主控制器连接；助焊剂喷涂模块包括储液罐、压力泵、电磁阀、炉体和喷雾头，炉体上安装喷雾头，喷雾头的进口与压力泵的出口连接，压力泵的进口与储液罐连通；预热模块包括加热器和温度传感器；焊接模块为波峰焊机，波峰焊机设有锡槽、导流槽、锡液喷嘴和电机，锡槽底部设有电机，锡槽通过导流槽与锡液喷嘴连接；冷却模块为风扇；排气模块包括排气管和排气阀，排气管进口出装有排气阀。

Method and device for cooling soldered printed circuit boards

The method involves introducing cooling gas comprising inert gas such as nitrogen, argon, helium, and carbon dioxide into cooling zone (15). Printed circuit boards (PCBs) are conveyed continuously from soldering zone (14) of soldering system (12) into the cooling zone. The cooling gas is generated using liquid cooling gas. An independent claim is included for a device for cooling soldered printed circuit board modules.

Method for soldering dissimilar materials with assistance of carbon nanotube sponge intermediate layer

一种碳纳米管海绵中间层辅助钎焊异种材料的方法，涉及一种钎焊异种材料方法。为了解决现有金属材料与异种材料钎焊接头强度低的问题。方法：将碳纳米管与强酸溶液混合超声清洗，然后分散到去离子水中抽滤，滤饼超声分散到无水乙醇中离心得到上清液；再抽滤、干燥，最后对异种材料钎焊。或将碳纳米管与强酸溶液混合超声清洗，然后液分散到去离子水中并抽滤，滤饼超声分散到无水乙醇中离心得到上清液；上清液加入钎料粉末后再抽滤、干燥，最后对异种材料钎焊。本发明碳纳米管海绵制备方法简单成本低，能够避免碳纳米管在钎焊过程中发生团聚，有利于调控界面组织，增强钎缝性能，缓解接头残余应力，提高接头强度。本发明适用于钎焊异种材料。

The brazing method using vertical indexing table

The present invention relates to a brazing device using a vertical indexing table and a brazing method. More specifically, the brazing device includes: a vertical indexing table (20) installed at right angles to the ground; a mounting and removing part (30) for manually mounting compounds such as a linear pipe (14) and a connector (15) on a placement jig (23); a product sensing part (40) identifying whether there is a product mounted on the placement jig (23) through a sensor (41); an air-cooling part (80) primarily dropping the temperature; a water-cooling part (90) secondarily dropping the temperature; a blow-in type removal part (100) cleaning a joint of the product; and a control part (110) controlling the rotation of the vertical indexing table (20) and each device. Therefore, the present invention is capable of solving an existing problem that an extra horizontal indexing table has to be prepared.

Recirculated water cooling hot pressing soldering apparatus

本发明公开了一种循环水冷热压锡焊装置，包括一水冷部件、一焊片固定件、一第一焊片、一第二焊片，水冷部件包括第一水冷块和第二水冷块，焊片固定件具有向下延伸的安装部，焊片固定件包括第一焊片固定件和第二焊片固定件，第一焊片固定件固定于第一水冷块的底部，第二焊片固定件固定于第二水冷块的底部；第一焊片安装于安装部的一侧，第一焊片一端与第一焊片固定件接触，另一端与第二焊片固定件接触；第二焊片安装于安装部的另一侧，第一焊片和第二焊片对称间隔设置，第二焊片一端与第一焊片固定件接触，另一端与第二焊片固定件接触。本发明结构和形状设计合理，安装和操作方便，便于根据不同产品更换焊片，提高生产效率。

Electromagnetism telescopic electric iron falls apart warm frame

一种电磁伸缩式电烙铁散温架，由电磁阀、风扇、套筒、插头、控制模块、烙铁架、传感器、二极管、拉杆组成。其特征在于，控制模块的一号脚和二号脚与风扇连接，三号脚与传感器连接，四号脚和五号脚引出一个电源插头，同时在五号脚与插头的中间串接一个二极管，五号脚与电磁阀的正极连接，六号脚与电磁阀的负极连接。所述的传感器感应到电烙铁传递的空气温度在70°以上时，控制模块将导通风扇，使风扇旋转工作以达到对电烙铁的烙铁头的降温作用，同时具有根据烙铁头的不同温度，改变风扇与套筒的距离调节，以达到不同距离的散温作用。

A kind of soldering spray equipment

本发明涉及一种钎焊用喷淋装置，特别涉及一种钎焊用喷淋装置，包括进水板，所述进水板设为空腔板，进水板的上侧面、左侧面和右侧面开设通口，所述进水板的上侧面设置磁块，磁块上贯穿开设通孔，通孔与进水板上侧面的通口同轴，所述磁块的通孔内穿过进水管的下端，所述进水管的下端与进水管上侧面的通口连接，所述进水板的左侧和右侧连通设置斜板，斜板内部开设空腔，所述斜板的下侧面设有连通空腔的第一出水口，两条所述的斜板的下端活动连接调节板。本发明喷淋时，水流集中，水珠飞溅少，便于收集废水，同时上、下同时喷淋，降温效率高，喷淋的位置可以调节，装置固定方便，进水管能够拉伸和收缩，无需整理，使用便捷。

Solder and flux coating device

Este dispositivo de recubrimiento de fundente para recubrir la superficie de la soldadura con fundente está provisto de: un medio de recubrimiento por inmersión para sumergir la soldadura en fundente para recubrir la superficie de la soldadura con el fundente; unos medios de aplicación de carga previstos en el lado aguas arriba de los medios de recubrimiento por inmersión, suponiendo que el lado de entrada de la soldadura es el lado aguas arriba y el lado de salida de la soldadura es el lado aguas abajo, aplicando los medios de aplicación de carga una carga predeterminada a la soldadura; medios de transporte de velocidad constante para transportar, a una velocidad predeterminada mientras los medios de carga aplican la carga, la soldadura recubierta con el fundente por los medios de recubrimiento por inmersión y levantada verticalmente con respecto a la superficie líquida del fundente; medios de secado para secar la soldadura recubierta con el fundente; un medio de enfriamiento para enfriar la soldadura seca; unos medios de medición de la velocidad de transporte para medir la velocidad de transporte de la soldadura; y un medio de control para controlar la velocidad de transporte de la soldadura. (Traducción automática con Google Translate, sin valor legal) This flux coating device for coating the solder surface with flux is provided with: a dip coating means for immersing the solder in flux to coat the solder surface with the flux; a charge applying means provided on the upstream side of the dip coating means, assuming that the welding entry side is the upstream side and the welding exit side is the downstream side, applying the load applying means a predetermined load to the weld; constant speed conveying means for conveying, at a predetermined speed while the loading means applies the load, the solder coated with the flux by the dip coating means and lifted vertically with respect to the liquid surface of the flux; drying means for drying the flux-coated solder; a ...

Heating device and cooling device

Disclosed are a heating apparatus and a cooling apparatus, whereby a whole printed substrate can be uniformly and stably heated or cooled without minutely increasing or reducing the temperature of the printed substrate while the printed substrate is being heated or cooled. A plurality of blowing nozzles (2) are disposed in zigzag arrangement at a predetermined angle (?) (? is 15 degrees or less) with respect to the transfer direction (E) of the printed substrate by having the adjacent blowing nozzles (2) at same intervals (L), thereby making it possible to uniformly spray a gas to the whole printed substrate. A reflow apparatus (100) can stably heat or cool the whole printed substrate without minutely increasing or reducing the temperature of the printed substrate while the printed substrate is being heated or cooled. As a result, heating efficiency and cooling efficiency of the printed substrate can be improved, and a possibility of generating a soldering failure can be reduced.