Patent RU2018126397A3

`7ВУ’” 2018126397” АЗ Дата публикации: 20.10.2021 Форма № 18 ИЗ,ПМ-2011 Федеральная служба по интеллектуальной собственности Федеральное государственное бюджетное учреждение 5 «Федеральный институт промышленной собственности» (ФИПС) ОТЧЕТ О ПОИСКЕ 1. . ИДЕНТИФИКАЦИЯ ЗАЯВКИ Регистрационный номер Дата подачи 2018126397/03(041820) 17.07.2018 Приоритет установлен по дате: [ ] подачи заявки [ ] поступления дополнительных материалов от к ранее поданной заявке № [ ] приоритета по первоначальной заявке № из которой данная заявка выделена [ ] подачи первоначальной заявки № из которой данная заявка выделена [ ] подачи ранее поданной заявки № [Х] подачи первой(ых) заявки(ок) в государстве-участнике Парижской конвенции (31) Номер первой(ых) заявки(ок) (32) Дата подачи первой(ых) заявки(ок) (33) Код страны 1. 17181836.2 18.07.2017 ЕР* Название изобретения (полезной модели): [Х] - как заявлено; [ ] - уточненное (см. Примечания) СПОСОБ РЕЗКИ БУЛЕЙ КРИСТАЛЛОВ АЛМАЗНОЙ ПРОВОЛОКОЙ Заявитель: КОМАДЮР СА, СН 2. ЕДИНСТВО ИЗОБРЕТЕНИЯ [Х] соблюдено [ ] не соблюдено. Пояснения: см. Примечания 3. ФОРМУЛА ИЗОБРЕТЕНИЯ: [Х] приняты во внимание все пункты (см. П см. Примечания [ ] приняты во внимание следующие пункты: [ ] принята во внимание измененная формула изобретения (см. Примечания) 4. КЛАССИФИКАЦИЯ ОБЪЕКТА ИЗОБРЕТЕНИЯ (ПОЛЕЗНОЙ МОДЕЛИ) (Указываются индексы МПК и индикатор текущей версии) В280 5/04 (2006.01) СОЗВ 33/00 (2006.01) 5. ОБЛАСТЬ ПОИСКА 5.1 Проверенный минимум документации РСТ (указывается индексами МПК) В28Р 1/00, 1/02, 5/00-5/04, СЗОВ 33/00, 33/06, СОЗВ 33/00, 33/02, А44С 27/00 5.2 Другая проверенная документация в той мере, в какой она включена в поисковые подборки: 5.3 Электронные базы данных, использованные при поиске (название базы, и если, возможно, поисковые термины): ЕАРАТГУ, Езрасепе, РабеагсВ, Оцез{е]-Отфи, КОРТО 6. ДОКУМЕНТЫ, ОТНОСЯЩИЕСЯ К ПРЕДМЕТУ ПОИСКА Кате- Наименование документа с указанием (где необходимо) частей, Относится к гория* относящихся к предмету ...

Gemstone processing

DECREASE OF ATTRACTION BETWEEN SILICON WAFERS

DEVICE AND PROCEDURE FOR THE SORT

DEVICE AND PROCEDURE FOR THE SORT OF DISK-SHAPED SUBSTRATES UNDER USE OF ADHESIVE POWERS

Method and apparatus for cleaving a substrate

Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire

Verfahren zum Herstellen von Halbleiterscheiben

A BOOK BINDING PLATES.

Wire sawing device.

Device of sawing by wire.

Device for storage element wafer obtained by slicing a block.

Wire saw has successive wire guide cylinders to define multiple wire cross points for cutting work

The wire saw has (n) wire guide cylinders (4) in succession. The wire (2) is wrapped around the cylinders to generate nets of wires which cross at a non-zero angle. The saw has (n-1) wire crossing points to engage (n-1) workpieces fixed to cutting tables (3) which are moved by actuators.

Wire sawing device.

Le dispositif de sciage par fil comprend un bâti (10), au moins une nappe de fils (15) tendue entre au moins deux cylindres guide-fils et une table support (18) sur laquelle est montée au moins une pièce à scier (17) collée sur un support (29) par l'intermédiaire d'un support temporaire (28). Des moyens sont prévus pour effectuer un mouvement vertical d'avance relatif entre la pièce à scier (17) et la nappe de fils (15). Le dispositif comprend des moyens (32, 34) pour effectuer un déplacement relatif transversal entre l'ensemble des tranches sciées (30) et la nappe de fils (15) suivant une direction de découpe (Y) de façon que les fils de la nappe de fils (15) servent d'outils pour découper et séparer les tranches sciées les unes des autres dans le dispositif de sciage. Les tranches sciées et découpées sont directement introduites dans un bac de réception (41) muni d'éléments de séparation (43). On obtient ainsi un démontage rapide des pièces sciées du dispositif de sciage, un découpage ...

Drahtsäge.

Eine Drahtsäge umfasst: einen Draht (54), der verwendet wird, um ein Werkstuck (W) zu schneiden; eine Mehrzahl von Bearbeitungswalzen (51, 52) um die der Draht (54) gewickelt ist; einen Werkstückvorschubmechanismus der das Werkstück in einer Schneidrichtung zum Draht (54) vorschiebt, um das Werkstück (W) zu schneiden; und einen Balancer (8), der (8) den Werkstuckvorschubmechanismus (7) hält, wobei der Balancer (8) auf den Werkstückvorschubmechanismus (7) eine Kraft in Richtung eines Ausgleichs, einer Reaktionskraft, die erzeugt wird, wenn das Werkstück (W) mit dem Draht (54) geschnitten wird, eines Gewichts eines beweglichen Teils des Werkstückvorschubmechanismus (7) und eines Gewichts des Werkstücks (W) ausübt.

Drahtsäge.

Eine Drahtsäge (1) umfasst: einen Schlitten (4), der so angeordnet ist, dass er in einer vertikalen Richtung beweglich ist; eine Säule (3), die eine Führungsfläche (3a,3b,3c,3d) aufweist, die entlang einer Schneidrichtung für die Werkstückzufuhr eines Werkstückvorschubmechanismus (7) vorgesehen ist; einen hydrostatischen Führungsmechanismus (9), der den Schlitten (4) in einer Richtung orthogonal zur Schneidrichtung bewegt, indem er ein Fluid in eine Tasche (4a,4b,4c,4d) inspeist, die so angeordnet ist, dass sie der Führungsfläche (3a,3b,3c,3d) gegenüberliegt; ein Steuerventil, das einen Druck des der Führungsfläche (3a,3b,3c,3d) zuzuführenden Fluids variiert; und eine Steuerung, die in der Lage ist, den Druck des der Führungsfläche (3a,3b,3c,3d) zuzuführenden Fluids wie gewünscht in Abhängigkeit von einer Schneidposition eines Werkstücks (W) einzustellen.

Automatic inserting device used after sapphire substrate slicing

Used for sawing apparatus and method for electronic element

Workpiece cutting device and method

SACRIFICIAL SUPPORT OF BIODEGRADABLE POLYMERIC MATERIAL FOR CUTTING A WORKPIECE TO AN ABRASIVE WIRE

Dispositif pour le repérage de l'orientation cristalline et la rectification d'un barreau

Dispositif pour le repérage de l'orientation cristalline et la rectification d'un barreau comprenant : une pièce de guidage 30 possédant un premier logement 32 apte à recevoir ledit barreau 18 et présentant une face plane 34 coupant le premier logement 32 de manière à ménager une ouverture 36 de largeur déterminée le long du premier logement 32; un moyen de fixation apte à fixer le barreau 18 à l'intérieur du logement 32 de la pièce de guidage 30. Application à la réalisation des méplats de repérage sur des barreaux de matériau semi-conducteur et monocristallin destinés à la production de tranches (wafers).

METHOD FOR PRODUCING A MECHANICAL PROCESS IN A STRUCTURE HAVING TWO LAYERS OF DIFFERENT RIGIDITY

DEVICE FOR the LOCATION OF the CRYSTALLINE ORIENTATION AND the CORRECTION Of a BAR

Constant temperature baths for wire sawing apparatus and wire sawing apparatus including the same

크리스탈 불들을 위한 다이아몬드 와이어 커팅 방법

... 커팅 다이아몬드 와이어 (2) 를 사용하여 크리스탈 불들 (1) 을 커팅하는 방법으로서, 이러한 불 (1) 은 메인 축선 (DP) 주위로 구동되고, 커팅 와이어 (2) 는팽팽하게 홀딩되고 전체 커팅 작업에 걸쳐 메인 축선 (DP) 에 대해 제위치에 각각의 불 (1) 을 고정하는 임시 드럼 (3) 을 통해 구동되고, 이러한 임시 드럼 (3) 은 희생 코어 (4) 에 본딩된 적어도 하나의 불 (1) 에서 코팅 재료 (7) 를 오버몰딩함으로써 제조되고, 커팅 후에 커팅된 링들 (9) 의 슬라이싱이 이어지고 상기 커팅된 링들로부터 특히 평행한 면들을 갖는 크리스탈형 플레이트들 (10) 이 특히 열을 사용하여 분리된다.

TABLE USED TO RECEIVE A WORKPIECE AND METHOD FOR TREATING A WORKPIECE ON SAID TYPE OF TABLE

The invention relates to a device which is used to treat a workpiece, in particular an essentially flat substrate. Said device comprises a table (2) which is used to support the workpiece (5). A flow generating device (6, 11) produces a gas flow (22) on a top side (17.1, 17.2) of the table (2) in the region between the workpiece (5) and the top side (17.1, 17.2) of the table (2), whereon the workpiece (5) is arranged during treatment. © KIPO & WIPO 2007 ...

Substrate processing apparatus including a scribe line forming apparatus, breaking devices and a transport device

An object of the present invention is to improve the ability of a substrate processing apparatus for cutting a substrate. In a substrate processing apparatus 1, a scribe line forming apparatus 3 forms a plurality of first scribe lines S1 and a plurality of second scribe lines S2 which are orthogonal to each other on a substrate 100. A first breaking device 7 divides the substrate 100 along the plurality of first scribe lines S1 into a plurality of short strip substrates 111. An adsorption rotating device 8 rotates the plurality of short strip substrates 111 by 90 degrees in a perspective view. A second breaking device 9 is disposed on the downstream side in a conveying direction of the first breaking device 7. The second breaking device 9 divides the plurality of short strip substrates 111 along the plurality of second scribe lines S2 into a plurality of unit substrates 113. A transport device 29 transports the plurality of short strip substrates 111 from the first breaking device 7 to ...

Cutting device pausing the detection operation until the amount of received light that has been reduced under the influence of the mist becomes within an appropriate range

An object of the present invention is to provide a cutting device capable of accurately detecting the position of a cutting edge of a cutting blade. A solution is a tool-detector device that has a blade intruding part that intercepts a cutting blade intruding therein and a light-emitting part and a light-receiving part that are opposite to each other. The control device includes a threshold registration part and a determination part. This threshold registration part registers the threshold that rules the suitable range of the amount of received light of the light-receiving part of light receiving from the light-emitting part receives in the retracted state in which the cutting blade has moved away from the blade intruding part. When the amount of received light in the retracted state is within a suitable range, the determination part may perform the detection operation of detecting the position of the front end of the cutting blade by intruding the cutting blade into the intruding portion ...

Processing device can be used for carrying out high-precision machining on an object to be processed

The invention aims to provide a miniaturization of a processing device, which can be used for carrying out high-precision machining on the object to be processed. The processing device comprises a chuck table having a holding surface for holding a work piece to be processed, and a processing method for processing the object to be processed held in the chuck table, and is characterized in that the processing method comprises a main shaft; a motor that rotationally drives the main shaft; a wheel support connected to one end of the main shaft, and facing the holding surface of the chuck table; a first tool detachably mounted to the mounting surface of the wheel bracket, and having a first diameter; a second tool support, which is located at the back side of the opposite side of the installation surface of the wheel support, and cannot be rotated to the main shaft, but can be movably mounted in the axial direction of the main shaft, comprising an accommodating part for accommodating the wheel ...

METHOD AND APPARATUS FOR CUTTING SUBSTRATE

This aims to reduce the size of a substrate cutting apparatus (9) (a package cutting unit (B)) having two cutting tables (17) [two individualizing lines (26) (26a and 26b)] for cutting a shaped substrate (1), and to collect the cutting chips efficiently in a container at the time of cutting the shaped substrate (1). Each of the two individualizing lines (26) (26a and 26b) in the substrate cutting apparatus (9) (the package cutting unit (B)) is constituted of cutting means for cutting the shaped substrate (1), cutting tables (17) for placing the shaped substrate (1), and reciprocating means (16) for reciprocating the cutting tables (17). The center positions of rotations of the cutting tables (17) at an angle of 90 degrees are set at the eccentric positions (21) of the placing faces (20) of the cutting tables (17). These two cutting tables (17) are arranged at near positions. On the two sides of the moving direction of the reciprocating means (16), bellows members (31) of vertical wall shapes ...

ROCKING APPARATUS AND METHOD FOR SLICING A WORK PIECE UTILIZING A DIAMOND IMPREGNATED WIRE

L'invention concerne un appareil de découpe d'une pièce à travailler sensiblement cylindrique dans un sens généralement perpendiculaire à un axe longitudinal de ladite pièce. L'appareil comporte un fil auquel sont fixés plusieurs éléments de coupe et un dispositif guide-fil qui guide le fil à travers ladite pièce. Ledit dispositif comprend un galet entraîneur qui permet de déplacer le fil de manière orthogonale par rapport à un axe longitudinal de la pièce à travailler, un entraînement rotatif pour faire osciller le fil perpendiculairement par rapport à l'axe longitudinal de ladite pièce. Dans un mode de réalisation particulier, l'appareil consiste à imprimer au dispositif guide-fil un mouvement sensiblement oscillant autour de l'axe longitudinal de la pièce à travailler et les éléments de coupe du fil sont diamantés.

System and method for processing ingots

An apparatus for connecting a cylindrical ingot to a support plate includes means for measuring a crystal orientation of the ingot based on a diffraction of x-rays, means for rotating the ingot about a center axis based on the crystal orientation so that a center axis of the ingot is held parallel to a first plane and an orientation axis based on the crystal orientation is placed in a plane parallel to the first plane, means for adhering an intermediate plate to the ingot, means for adjusting a position of one of the support plate and the ingot in a plane parallel to the first plane based on the crystal orientation so that a mounting axis of the support plate is in a specific relationship with the orientation axis, and means for attaching the support plate to the intermediate plate.

Vertical wafer sawing apparatus

A vertical wafer sawing apparatus for separating semiconductor devices formed on a semiconductor wafer includes a chuck table disposed vertically to a supporting surface of the chuck table and a scribing member moving perpendicular to the wafer surface to dice the wafer. The chuck table or a scribing member moves in one specific direction at least among the directions of the x, y and z-axis. The direction of the x-axis runs perpendicular to a wafer stage, on which a wafer is loaded, and parallel to the ground or the support surface for the chuck table. As a result, the set-up dimensions of the apparatus can be decreased even as wafer size increases. Further, contaminants such as silicon scraps and dust on the wafer can be efficiently removed during the wafer sawing process.

A dicing tape and a method of dicing a semiconductor wafer

Removal of semiconductor wafers from dicing film

Semiconductor chips, which have been diced, can be removed from the conductive adhesive/polymer support film holding them, without leaving residual adhesive on the film if the wafer/adhesive/support film laminate is heated prior to the dicing step. The heating step increases the release characteristics between the adhesive and film.

SCRIBING APPARATUS AND SCRIBING METHOD

PROBLEM TO BE SOLVED: To scribe small-sized brittle material substrates in good work properties. SOLUTION: On a table 106, a plurality of the brittle material substrates 107a-107i are positioned each by a positioning pin 109 and arranged. A recipe data table is held in advance in each brittle material substrate. The brittle material substrate and a scribe head are moved relatively on the basis of the recipe data table, and an inner cutting scribe or an outer cutting scribe is carries out in each substrate. In this way, scribing work of a plurality of sheets can be carried out all together by automatic operation. COPYRIGHT: (C)2010,JPO&INPIT ...

УСТРОЙСТВО И СПОСОБ ДЛЯ АВТОМАТИЧЕСКОЙ ОРИЕНТАЦИИ ДРАГОЦЕННОГО КАМНЯ

... 1. Устройство для ориентации отдельных объектов, содержащее:подвижную поверхность, обеспечивающую путь перемещения для этих объектов;пару противостоящих стенок, проходящих, по существу, вдоль указанного пути перемещения;и вибратор, выполненный с возможностью генерирования соответствующего колебательного движения между указанной парой стенок и подвижной поверхностью в направлении, по существу, перпендикулярном указанному пути перемещения, так что при использовании указанная пара стенок сообщает объектам поперечную силу и тем самым вынуждает их ориентироваться в наиболее устойчивое положение по мере их продвижения по пути перемещения.2. Устройство по п.1, также содержащее прибор для проверки ориентации объектов после того, как они прошли между парой стенок.3. Устройство по п.1 или 2, в котором указанная подвижная поверхность является поступательно перемещающейся или поворачивающейся.4. Устройство по п.3, в котором указанная подвижная поверхность представляет собой вращающийся диск.5. Устройство ...

cutting crystal blank with wire saw of roller type

The crystal blank (9) is cut using a wire saw. The wire is wrapped over a number of grooved rollers (1-4) at a specified distance. The blank is fixed onto a holder and is pressed onto a wire which is guided along a given direction or reciprocated by a number of grooved rollers. The holder is pushed along a direction parallel to an axis of the rollers until a half of the cross-section of the blank has been cut. The holder is then pushed along an opposite direction during the cutting of the remaining half of the blank. A wafer cut from this crystal blank has a bent shape corresponding to a movement location or a movement path of the holder.

Verfahren zum Lösen von Wafern von einem Waferträger und Vorrichtung dafür

Bei einem Verfahren zum Lösen von Wafern von einer Trägereinrichtung, wobei die Wafer durch Zersägen eines an der Trägereinrichtung durch Kleben befestigten Waferblocks gebildet sind und wobei die Wafer selber an einer Seite noch verklebt sind, wird die Trägereinrichtung mit den Wafern entlang einer gleich bleibenden Bewegungsebene in eine Entklebeeinrichtung eingefahren. Sie verbleibt darin und wird in einem Entklebebecken durch bewegbare Wandungsteile umschlossen. Nach dem Bilden bzw. Schließen des Entklebebeckens wird Lösungsmittel zum Entkleben in das Entklebebecken bzw. auf die Wafer aufgebracht zum Auflösen der Verklebung und nachfolgendem Lösen der Wafer von der Trägereinrichtung.

Verfahren zum Schneiden eines Werkstücks mittels einer Drahtsäge sowie Drahtsäge

Verfahren zum Aufschneiden eines Werkstücks mittels einer Drahtsäge, umfassend: Wickeln eines zum Aufschneiden dienenden Drahts um mehrere Rollen, um eine Drahtreihe zu bilden; Bewegen des zum Aufschneiden dienenden Drahts axial in einer hin- und hergehenden Richtung; Aufschneiden des Werkstücks gleichzeitig an mehreren Stellen, die in axialer Richtung angeordnet sind, indem das Werkstück in Richtung auf die Drahtreihe vorgeschoben wird, wobei in das Werkstück hineingeschnitten wird, während zum Aufschneiden dem Draht ein Schlamm zugeführt wird; wobei das Werkstück abgezogen wird, während sich der Draht mit einer Geschwindigkeit von 2 m/min oder weniger bewegen gelassen wird, wenn nach dem Aufschneiden des Werkstücks das Werkstück von der Drahtreihe abgezogen wird.

Wafer collecting method and system

A linear voltage stabiliser associated with silicon wafer cutting apparatus

Improvements in methods of producing germanium crystalline bodies

At least three "flats" related to the same crystal axis are located on a drawn hexagonal crystal of germanium, e.g. by etching, the crystal axis is identified therefrom by optical means, and a seed crystal or wafer is cut from the crystal by making at least one cut at an appropriate angle to the crystal axis. A seed crystal is cut so that it has sufficient reference surfaces to identify a particular crystal axis.

METHOD AND APPARATUS FOR WAX MOUNTING OF THIN WAFERS FOR POLISHING

PANEL TREATMENT SYSTEM

PROCEDURE AND MECHANISM FOR ISOLATING DISK-SHAPED SUBSTRATES

MECHANISM FOR POSITIONING AND POSITION RECEIVING FROM THIN SUBSTRATES AT THE CUT SUBSTRATE BLOCK

Clamping device for clamping to a glass sheet

Bei einem Verfahren zum Festlegen eines plattenförmigen Gegenstandes (5), beispielsweise einer Glasscheibe, in einer Auflageebene (4) wird der plattenförmige Gegenstand (5) mit einer Klemmvorrichtung (1) festgelegt, indem wenigstens ein Druckelement (2) und wenigstens ein Gegenelement (3) der Klemmvorrichtung (1) an gegenüberliegende Seiten des plattenförmigen Gegenstandes (5) angelegt werden. Der plattenförmige Gegenstand (5) wird dadurch zwischen dem Druckelement (2) und dem Gegenelement (3) eingeklemmt. Ein Belag (11a, 11b, 11c) von wenigstens zwei voneinander unterschiedlichen Belägen (11a, 11b, 11c) des Druckelementes (2) wird in einer dem Gegenelement (3) zugeordneten Wirkstellung positioniert, und der in Wirkstellung positionierte Belag (11a, 11b, 11c) wird beim Festklemmen des plattenförmigen Gegenstandes (5) an den plattenförmigen Gegenstand (5) angelegt.

TABLE FOR THE ADMISSION OF A WORKPIECE AS WELL AS PROCEDURE FOR THE TREATMENT OF A WORKPIECE ON SUCH

MECHANISM FOR POSITIONING AND POSITION RECEIVING FROM THIN SUBSTRATES AT THE CUT SUBSTRATE BLOCK

WIRE AEG DEVICE

Apparatus and process for the slicing of monocrystalline silicon ingots

Method and device for isolating plate-like substrates

METHOD OF, AND APPARATUS FOR, SEPARATING WAFERS FROM A WAFER STACK

In a method of separating wafers (12) from a vertical wafer stack (16), the wafers (12) are transported away individually from above via movement means (23) which act from above. The movement means (23) are designed as circulating belts (24), with a suction surface (25) against which the uppermost wafer (12) is made to abut, wherein the abutment of the wafer (12) against the suction surface (25) is enhanced by negative pressure or suction. In order to separate a plurality of wafers (12) located one upon the other, the movement means (23) are subjected to at least one of the following two steps: a) water (30) is jetted with force against the leading edge of the uppermost wafer (12), the water being directed obliquely from beneath the latter b) the movement means (23) guide the wafer (12) over a stripping device (32) which butts against the underside of the moving wafer (12) from beneath and both forces the wafer (12) against the suction surface (25) and generates a braking action thereon ...

Semiconductor material equipment

Linear voltage regulator

APPARATUS FOR GLUING AN ADHESIVE FILM TO A SUPPORT RING AND A THIN OBJECT

Cutting-and-Transferring System and Pellet Transferring Apparatus

SAWING AND SORTING APPARATUS TO GREATLY SHORTEN INTERVAL OF WORK TIME

PURPOSE: A sawing and sorting apparatus is provided to greatly shorten an interval of work time by reducing an interval of time necessary for an operation except sawing and sorting processes. CONSTITUTION: A strip(1) placed on a mounting unit is picked up and fixed by a rotational chuck table. The rotational chuck table is fixed to a lower part of a picker unit(31,41) which rotates the rotational chuck table at a predetermined angle. A plurality of transferring/sawing robots(30,40) transfers the picker unit in the X-axis direction and Z-axis direction. A blade is installed under the picker unit in a predetermined position of a transfer path of the picker unit in the transferring/sawing robot, capable of rotating. A plurality of sawing spindle units(61,62) transfer the blade in the X-axis direction. Unit semiconductor chip packages sawn by the sawing spindle are cleaned in a cleaning unit(71,72) in the transfer path of the picker unit in the transferring/sawing robot. A visual inspection ...

CUTTING APPARATUS

APPARATUS AND METHOD OF CUTTING SUBSTRATE FOR PREVENTING SCRIBING ERROR

PURPOSE: An apparatus for cutting a substrate and a method of cutting a substrate using the apparatus are provided to improve productivity by preventing generation of error in a scribing process due to vibration of a belt conveyor or a conveyor support beam. CONSTITUTION: An apparatus for cutting a substrate(200) includes first and second belt conveyors(300,400), a scribing unit(600), and a substrate support(700). The first and second belt conveyors move the substrate placed thereon. The scribing unit is located between the first and second conveyors and performs scribing on the substrate along a predetermined cutting line when the substrate arrives at the scribing unit. The substrate support is located in the same direction as the substrate scribing direction between the first and second belt conveyors to support the substrate when scribing is carried out on the substrate. © KIPO 2006 ...

table for receiving a part to be worked, as well as a process for processing a piece to be imaged on a table of this genus

WERKWIJZE IN INRICHTING VOOR HET VERVAARDIGEN VAN UIT DIAMANTLICHAAM BESTAANDE WARMTEGELEIDERS, ALSMEDE WARMTEGELEIDERS VERKREGEN PUTS WERKWIJZE

Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device

The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

Fret bar for slicing ingot, ingot with fret bar bonded thereto, and method of slicing ingot using fret bar

To minimize variability in the thickness of obtained wafers, improve the utilization efficiency of materials by reducing the material loss incurred during slicing, and improve work efficiency by reducing the time required for slicing, when slicing ingots using a multi-wire saw. When slicing ingots using a multi-wire saw, a fret bar for slicing ingots that exists in the form of a columnar body is bonded to part of the ingot surface, along the lengthwise direction of the ingot, on the side of the ingot where the multi-wire cutter begins its cut, so as to form a kerf when the cutting process begins.

SiC WAFER PRODUCING METHOD

SiC WAFER PRODUCING METHOD Disclosed herein is an SiC wafer producing method for producing a wafer from an ingot of single crystal SiC. The SiC wafer producing method includes an end surface planarizing step of planarizing an end surface of the ingot, a separation layer forming step of setting a focal point of a laser beam having a transmission wavelength to single crystal SiC inside the ingot at a predetermined depth from the end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the laser beam to the ingot to thereby form a separation layer for separating the wafer from the ingot, a hard plate providing step of providing a hard plate through an adhesive on the end surface of the ingot in which the separation layer has been formed, and a separating step of separating the wafer with the hard plate from the ingot along the separation layer. (Figure 6A) ...

Removal of semiconductor wafers from dicing film

Semiconductor chips, which have been diced, can be removed from the conductive adhesive/polymer support film holding them, without leaving residual adhesive on the film if the wafer/adhesive support film laminate is heated prior to the dicing step. The heating step increases the release characteristics between the adhesive and film.

Ingot support device for slicing silicon

An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminium hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica. According to the present invention, there is provided an ingot support device for slicing silicon which can be produced easily at a low cost, which has enough strength to cope with the upsizing of the ingot block, has high adhesive properties with the ingot block, and has other further improved properties which are required of the ingot support device for slicing silicon.

Cutting method by wire saw and cut workpiece receiving member in wire saw

In a cutting method by a wire saw, in which a wire A at a wire array wound around work rollers 10 is made to reciprocate or travel in one direction at a high speed and numerous pieces of wafers are cut out in abutment of a workpiece B against the wire array, a receiving member 27 of a cassette type having numerous support wires 34 arranged at the same pitch as that of the wire at the wire array is disposed at a position immediately under the wire array for cutting the workpiece B; and wafers b cut out of the workpiece B by the wire A are contained in separation one from another between the support wires 34 in the receiving member 27 . Thus, the wafers can be prevented from adhering to each other during a cutting operation, thus to be accurately cut, and further, the wafers can be prevented from being cracked during the cutting operation, thus to be efficiently separated one from another, so as to enhance wafer cleansing performance.

Holding unit for semiconductor wafer sawing

A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The holding unit includes a top surface for receiving an ingot, a bottom surface, a pair of side walls, and a cavity formed in the holding unit. The cavity forms a plurality of break points in the holding unit. When contacted by the blade, the holding unit fractures at the break points to minimize the chipping of the wafer.

CUTTING BLADE SUPPLYING APPARATUS

A cutting blade supplying apparatus includes a cutting blade stocker that stocks a plurality of cutting blades, a carrying unit that carries out the cutting blade from the cutting blade stocker and carries the cutting blade to a cutting apparatus, a transferring unit that transfers the cutting blade carried by the carrying unit to a blade replacing unit of the cutting apparatus, and a control unit. The control unit selects the cutting blade needed by the cutting apparatus and causes the cutting blade to be carried by the carrying unit to the cutting apparatus.

METHOD AND DEVICE FOR SEPARATION OF SILICON WAFERS

TABLE USED TO RECEIVE A WORKPIECE AND METHOD FOR TREATING A WORKPIECE ON SAID TYPE OF TABLE

MOUNTING PLATE FOR A WIRE SAWING DEVICE, WIRE SAWING DEVICE COMPRISING THE SAME, AND WIRE SAWING PROCESS CARRIED OUT BY THE DEVICE

Race track configuration and method for wafering silicon solar substrates

A system for manufacturing free-standing films from work pieces. The system includes a racetrack structure (1000) being configured to transfer at least one work piece and one or more accelerator-based ion implanters (1001,1002,1003,100N) coupled to the racetrack structure (1000) via an end station (1011,1012,1013,101N). Each of the accelerator-based ion implanters (1001,1002,1003,100N) is configured to introduce particles having an energy of greater than 1 MeV to implant into a surface of the work piece loaded in the end station (1011,1012,1013,101N) to form a cleave region in the work piece. The system includes one or more cleave modules (1211,1212,121N) coupled to the racetrack structure (1000) configured to perform a cleave process to release a free-standing film from the work piece along the cleave region. Additionally, the system includes an output port (1311,1312) coupled to each cleave module (1211,1212,121N) to output the free standing film detached from the work piece and one or ...

Bar for mounting crystal for sawing and method of wire sawing wafers from crystal

METHOD FOR SIMULTANEOUSLY SEPARATING A PLURALITY OF SLICES FROM A WORKPIECE USING A WIRE SAW

Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben (34) von einem Werkstück (1) mittels einer Drahtsäge, umfassend einen Trennschleifvorgang, wobei ein Werkstück (1) senkrecht zu einer Längsachse (26) des Werkstücks gegen ein zwischen zwei Drahtführungsrollen (5, 6) gespanntes Drahtgatter (24) eines Sägedrahts (4), der in Längsrichtung des Sägedrahts bewegt wird, zugestellt wird, wobei ein Kühlschmiermittel dem Drahtgatter (24) zugeführt wird, und wobei zwischen Drahtabschnitten des Drahtgatters (24) Scheiben (34) entstehen, die an einer Leiste (2) befestigt sind und zwischen denen Trennspalte (22) bestehen, und das Herausziehen der Leiste (2) und der Scheiben (34) aus dem Drahtgatter (24), wobei während des Herausziehens der Leiste (2) und der Scheiben (34) das Besprühen der Trennspalte (22) mit einer Flüssigkeit (21) mittels einer Sprühvorrichtung, bis die Drahtabschnitte die Trennspalte (22) verlassen haben, wobei die Flüssigkeit (21) unter hohem Druck durch Düsen (14) ...

WORKPIECE TO BE PROCESSED DIVIDING SYSTEM, AND PELLET- SHIFTING APPARATUS

PROBLEM TO BE SOLVED: To eliminate the need for troublesome works and increase productivity, in steps of from cutting one of various workpieces to be processed such as CSP(chip size package) substrate to accommodating pellets into a pellet transfer tray. SOLUTION: This workpiece to be processed dividing apparatus includes a cutting device 11, at least, having a holder table 16 for holding a workpiece to be processed held by a holding member and a cutting means 19 for cutting the workpiece held in the table 16 into pellets, a shifter device 12 at least, having a shifter means for picking up the divided pellets from the holding member and shifting them into a transfer tray, and a link transfer means for transferring the divided pellets of the workpiece from the cutting device 11 to the shifter device 12. COPYRIGHT: (C)2000,JPO ...

DICING APPARATUS

PURPOSE: To provide a dicing apparatus which can improve productivity. CONSTITUTION: When a setup segment 86 is moved upward and downward with an air cylinder 94, the lower end thereof takes the lower and upper positions for a blade 58. When a spindle motor 60 moves downward and the setup segment 86 is placed in contact with the upper surface of a chuck table, the setup segment 86 moves and movement thereof is measured with a measuring instrument 102. On the basis of the measured value of this measuring instrument 102, the upper surface position of the chck table for the setup segment 86 can be obtained. COPYRIGHT: (C)1996,JPO ...

УСТРОЙСТВО И СПОСОБ РАЗЪЕДИНЕНИЯ И ТРАНСПОРТИРОВКИ ПОДЛОЖЕК

Изобретение относится, в частности, к разъединению и транспортировке пластинчатых подложек (102), например солнечных пластин. Согласно изобретению разъединение происходит в текучей среде, и между захватом (108) и отделяемой подложкой (102) за счет тонкой жидкостной пленки возникают адгезионные силы, обеспечивающие сцепление с захватом (108). Устройство содержит расположенное в текучей среде несущее устройство (104), в котором отдельные подложки (102) расположены в направлении (105) подачи последовательно друг за другом, стоя, в виде штабеля (103), извлекающее устройство (107) для отделения и транспортировки, по меньшей мере, одной подложки (102), которое содержит упомянутый захват (108) со средствами для приема подложки (102) и отведения от несущего устройства (104), струйное устройство (117) для веерообразного раскрытия, по меньшей мере, части штабеля подложек, а также прижимной элемент (122), выполненный с возможностью противодействия веерообразно раскрытым подложкам (102). Изобретение ...

Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture

The mechanism detaches, separates, and stores the thin, fragile substrates from a sawing block in a liquid stream, such that the block is held in a liquid container for detaching the substrates. In the process the top substrate of the block can be brought to the surface by a lifting gear. An inclined, groove-shaped member discharges the liquid, continuously supplied to the container, thus washing the substrates into a cassette. The liquid stream is amplified by nozzles in inlet and bottom of the groove-shaped member.

N ZUR BEARBEITUNG EINES WERKSTÜCKS AUF EINEM SOLCHEN

Arbeitsfläche geringer Verunreinigung zur Herstellung von Silicium der Halbleitergeräte.

Cutting method for rare earth metal alloy involves cutting object with tensioned cutting wire whilst feeding slurry between wire and object, using organic polymer wire drive device surface

The method involves cutting an object with a cutting wire (32) whilst feeding a slurry containing a dispersed grinding medium granulate between the wire and the object. The cutting wire is driven by a drive device with at least one wire contact surface made of an organic polymer material. Cutting is performed with a tension of between 14.7 and 39.2 N applied to the wire. The slurry temperature is controlled within a defined range. Independent claims are also included for an arrangement for cutting a rare earth metal alloy.

Drahtsäge und Schneidverfahren

Wafer collecting method and system

A wafer collecting method comprises the steps of; cleaning a wafer (W) formed by slicing an ingot which has a slice base mounting member (64), in a one-by-one manner, cleaning the wafer having the slice based mounting member, removing the slice base mounting member (64) from the cleaned wafer (W) in a one-by-one manner, and putting the wafer (W) from which the slice base mounting member was removed, into a container (50).

APPARATUS FOR STICKING ADHESIVE FILM ON A RING AND A THIN ARTICLE

Dicing machine

WIRE SAW WITH MEANS TO PRODUCING A BETWEEN WORKPIECE AND WIRE RELATIVE OSCILLATING MOVEMENT

JET ARRANGEMENT FOR A SAW FOR A SEMICONDUCTOR COMPONENT

METHOD AND APPARATUS FOR CUTTING WORKPIECES

A cutting machine has a blade (58) mounted for reciprocating movement. A workpiece (50) is rotated while the blade (58) is reciprocated, and then the workpiece (50) is rotated through smaller angles to complete the cut. A holder is attached to partially cut slices of the workpiece (50).

Semiconductor diode forming system

Efficient jewelry drilling device

SUPPORT HAS NU RELATED LOAD PORT COMPRISING AN ASSEMBLY OF DISSIMILAR MATERIALS

Crystallographic orientation of germanium

METHOD AND MEANS OF MAKING DIAMOND HEAT SINKS AND HEAT SINKS OBTAINED BY THIS METHOD

Method and device for cleaning substrates on a carrier

In the case of a device and a method for cleaning substrates on a carrier, to the underside of which the substrates are fastened so as to be parallel to and slightly apart from one another, the carrier has in its interior a plurality of longitudinal channels, which run parallel to one another. As a result of the sawing of the wafers, they merge, via openings, into interstices between the substrates. As a result of a relative movement, an elongate tube, from which cleaning fluid is let out, is introduced into one of the longitudinal channels, the relative movement being achieved substantially through moving of the carrier.

CARRIER FOR A SILICON BLOCK, CARRIER ARRANGEMENT HAVING SUCH A CARRIER AND PROCESS FOR PRODUCING SUCH A CARRIER ARRANGEMENT

A carrier () for a silicon block () is designed to be firmly connected as part of a carrier arrangement (), together with a lower carrier part (), to the silicon block (), and to be moved together therewith for machining by sawing, cleaning or the like. The underside of the carrier (), which points towards the silicon block (), has a plurality of channels (), as does the lower carrier part () bonded thereto, the channels () in each case lying one above another. Water is introduced into the channels () in the carrier () from above and can run through sawing slots in the lower carrier part () between the wafers of the sawn-up silicon block () for cleaning purposes. 1. A carrier for a silicon block , the carrier forming part of a carrier arrangement and being designed to be connected fixedly to the silicon block and to be moved , together with the silicon block , for machining , wherein the carrier comprises a plurality of depressions , channels or indentations on its underside to point towards the silicon block.2. The carrier according to claim 1 , wherein the plurality of channels comprise parallel grooves provided in the underside of the carrier.3. The carrier according to claim 1 , wherein the underside is even claim 1 , with the exception of the depressions claim 1 , channels or indentions claim 1 , such that the carrier has an essentially uniform thickness.4. The carrier according to claim 1 , comprising fastening means on a top side of the carrier for fastening to a movement device.5. The carrier according to claim 1 , it wherein the carrier consists of metal.6. The carrier according to claim 1 , wherein the carrier consists essentially of a rectangular carrier plate which is formed in one piece.7. The carrier according to claim 1 , wherein the depressions claim 1 , channels or indentations or grooves are closed by perforated grids or plates so as to be liquid-permeable.8. The carrier according to claim 1 , wherein the depressions claim 1 , channels or ...

CUTTING BLADE MOUNTING METHOD

A cutting blade mounting method of sandwiching both side surfaces of an annular cutting blade by a first flange and a second flange, the first flange being mounted on an end of a spindle and having a suction hole sucking and holding a side surface of the cutting blade to a sandwiching surface of the first flange, includes: a cutting blade provisional holding step of sucking and holding the cutting blade to the first flange by making the cutting blade abut against the sandwiching surface of the first flange at a perfect circle position at which a center of the cutting blade coincides with an axis of the spindle, and making a suction force act on the suction hole; and a fixing step of fixing the cutting blade maintaining the perfect circle position in the cutting blade provisional holding step to the first flange by the second flange. 1a cutting blade provisional holding step of sucking and holding the cutting blade to the first flange by making the cutting blade abut against the sandwiching surface of the first flange at a perfect circle position at which a center of the cutting blade coincides with an axis of the spindle, and making a suction force act on the suction hole; anda fixing step of fixing the cutting blade maintaining the perfect circle position to the first flange by the second flange after the cutting blade provisional holding step is performed.. A cutting blade mounting method of sandwiching both side surfaces of a cutting blade formed by an annular cutting edge by sandwiching surfaces of a first flange and a second flange, and mounting the cutting blade onto a spindle, the first flange being mounted on an end of the spindle and having a suction hole sucking and holding a side surface of the cutting blade to the sandwiching surface, the cutting blade mounting method comprising: The present invention relates to a method of mounting a cutting blade in a cutting apparatus.In manufacture of semiconductor devices or the like, a plurality of sections are set ...

WAFER SEPARATION METHOD, WAFER SEPARATION AND TRANSFER METHOD, AND SOLAR CELL WAFER SEPARATION AND TRANSFER METHOD

A wafer separation apparatus improves wafer separation performance in separation and transfer and suppresses the occurrence of wafer breakage in separation and transfer, while remaining inexpensive and small. The apparatus includes: a cassette that vertically accommodates a large number of single wafers in intimate contact with each other, the cassette being at least vertically opened; a cassette support that removably supports the cassette, the cassette support being at least vertically opened; a hoisting unit that hoists and lowers the cassette support integrally with the cassette; a liquid bath that accommodates a liquid into which the cassette support is immersed integrally with the cassette when the hoisting unit descends; a nozzle in the inside of the liquid bath to issue micro bubbles from the underside of the cassette support toward a large number of the wafers; and a micro bubble generator that generates micro bubbles to be issued from the nozzle. 1. A wafer separation method comprising the steps of:an accommodating step of vertically accommodating a large number of single wafers in a cassette in intimate contact with each other, the cassette being at least vertically opened;a mounting and supporting step of mounting and supporting the cassette on a cassette support at least vertically opened;a lowering step of lowering the cassette support integrally with the cassette using a hoisting unit and immersing the wafers vertically arranged in a liquid in an inside of the liquid bath; anda micro bubble issuing step of issuing micro bubbles generated in a micro bubble generator from an underside of the cassette support toward the wafers vertically arranged and causing the micro bubbles to enter and stay in a large number of the individual wafers.2. A wafer separation and transfer method comprising:an accommodating step of vertically accommodating a large number of single wafers in a cassette in intimate contact with each other, the cassette being at least ...

METHOD FOR SLICING WORKPIECE AND WIRE SAW

A method for slicing a workpiece includes feeding and slicing a workpiece held by a workpiece holder with a bonding member therebetween, while reciprocatively traveling a fixed abrasive grain wire wound around multiple grooved rollers to form a wire row, so that the workpiece is sliced at multiple positions simultaneously. The bonding member has a grindstone part. The method includes, after the workpiece is sliced and before it is drawn out from the wire row, a fixed-abrasive-grain removal step of pressing the wire against the grindstone to remove fixed abrasive grains from the wire while reciprocatively traveling. In the fixed-abrasive-grain removal step, the wire rate is 100 m/min. or less, and the load on each line of the wire is 30 g or more. The method prevents a sliced workpiece from catching a wire and from causing saw mark and wire break in drawing out the wire after slicing. 16.-. (canceled)7. A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around a plurality of grooved rollers , the method comprising feeding a workpiece to the wire row for slicing the workpiece held by a workpiece holder with a bonding member bonded to the workpiece , while allowing the fixed abrasive grain wire to reciprocatively travel in an axial direction thereof , thereby slicing the workpiece at a plurality of positions aligned in an axial direction of the workpiece simultaneously ,wherein the bonding member has a grindstone as a part,the method comprises, after the workpiece is sliced and before the workpiece is drawn out from the wire row, a fixed-abrasive-grain removal step of pressing the wire row against the grindstone to remove the fixed abrasive grains from the fixed abrasive grain wire while the fixed abrasive grain wire is reciprocatively traveling, andin the fixed-abrasive-grain removal step, the fixed abrasive grain wire is traveled at a wire rate of ...

Cutting apparatus

A cutting unit includes a spindle, a spindle housing, a support flange on the front of the spindle, a cutting blade detachably supported to the support flange, and a fixing flange for fixing the cutting blade to the support flange. The support flange includes a boss portion adapted to be inserted through a central opening of the cutting blade, a flange portion for supporting one side surface of the cutting blade, and a cylindrical portion for engaging the front of the spindle. The flange portion has a suction hole opening toward the fixing flange, and the cylindrical portion has a communication hole communicating with the suction hole. The communication hole is connected to a vacuum source through a rotary joint fixed to the spindle housing so that communication between the communication hole and the vacuum source is selectively made by an on-off valve.

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SAW, AND SEMICONDUCTOR WAFERS MADE OF MONOCRYSTALLINE SILICON

Semiconductor wafers are produced from a workpiece by means of a wire saw, by feeding the workpiece through an arrangement of wires tensioned between wire guide rollers and divided into wire groups, the wires moving in a running direction producing kerfs as wires engage the workpiece. For each of the wire groups, a placement error of the kerfs of the wire groups determined, and for each of the wire groups compensating movements of the wires of the wire group are induced as a function of the placement error, in a direction perpendicular to the running direction of the wires during feeding of the workpiece through the arrangement of wires, by activating at least one drive element. 112.-. (canceled)13. A method for producing semiconductor wafers from a workpiece by processing the workpiece by means of a wire saw , comprising:feeding the workpiece through an arrangement of wires which are tensioned between wire guide rollers while being divided into wire groups and move in a running direction,producing kerfs when the wires engage the workpiece;for each of the wire groups, determining a placement error of the kerfs of the wire group; andfor each of the wire groups, inducing a compensating movement of the wires of the wire group as a function of the determined placement error of the kerfs of the wire group, in a direction perpendicular to a running direction of the wires of the wire group during the feeding of the workpiece through the arrangement of wires, by activating at least one wire group drive element.14. The method of claim 13 , further comprising dividing the wires into no fewer than three wire groups and at most a number of wire groups which corresponds to the number of wires of the arrangement.15. The method of claim 13 , wherein comprising determining the placement error of the kerfs is determined during the feeding of the workpiece through the arrangement of wires.16. The method of claim 13 , wherein the placement error of the kerfs of the wire group is ...

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS BY MEANS OF A WIRE SAW

Semiconductor wafers with improved geometry are produced from a workpiece by processing the workpiece by means of a wire saw, by 15.-. (canceled)6. A method for producing semiconductor wafers from a workpiece by processing the workpiece by means of a wire saw , comprisingfeeding the workpiece through an arrangement of wires which are tensioned between wire guide rollers and move in a running direction;producing kerfs when the wires engage into the workpiece;determining at last one placement error of the kerfs; andinducing a compensating movement of the workpiece as a function of the determined placement error(s) along a longitudinal axis of the workpiece during the feeding of the workpiece through the arrangement of wires.7. The method of claim 6 , comprising determining a placement error of the kerfs during the feeding of the workpiece through the arrangement of wires.8. The method of claim 6 , comprising determining a placement error of the kerfs by measuring the position of the kerfs by means of irradiating the kerfs with optical radiation claim 6 , IR radiation claim 6 , X-radiation or γ radiation claim 6 , by mechanical sensing of the kerfs or by inductive or capacitive measurement of the kerfs claim 6 , and comparing the measured position with a setpoint position of the kerfs.9. The method of claim 7 , comprising determining a placement error of the kerfs by measuring the position of the kerfs by means of irradiating the kerfs with optical radiation claim 7 , IR radiation claim 7 , X-radiation or γ radiation claim 7 , by mechanical sensing of the kerfs or by inductive or capacitive measurement of the kerfs claim 7 , and comparing the measured position with a setpoint position of the kerfs.10. The method of claim 6 , further comprising tracking changes in a wire saw-specific correction profile in the course of the processing of a plurality of workpieces claim 6 , and initiating a predictive maintenance measure if the changes have exceeded an established ...

DIAMOND WIRE CUTTING METHOD FOR CRYSTAL BOULES

Method for cutting crystal boules using diamond wire, wherein this boule is driven about a main axis, a cutting wire is held taut and driven through a temporary drum immobilising each boule in position with respect to the main axis throughout the entire cutting operation, this temporary drum being made by overmoulding a coating material on at least one boule bonded onto a sacrificial core, the cutting being followed by the slicing of cut rings from which are detached, particularly using heat, crystalline plates with parallel faces. 1. A method for cutting at least one crystal boule using diamond wire , wherein there is determined a boule axis , perpendicularly to which it is chosen to cut said at least one boule with a boule radius , and said boule is driven about a main axis parallel to said boule axis , and a cutting wire is held taut and driven along a straight segment in a plane perpendicular to said main axis , wherein there is made a temporary drum which immobilises said at least one boule in position with respect to said main axis throughout the entire cutting operation , during which said boule axis is made to pass on either side of said straight segment during the cutting of said at least one boule inside said temporary drum , and wherein said temporary drum is based on a sacrificial core formed by an axial tube or cylinder , whose axis of revolution coincides with said main axis , and whose radius is equal to the difference between said eccentricity and said boule radius , on which sacrificial core is bonded , after preparation , each said boule oriented with its boule axis parallel to said main axis , to form a bonded assembly , and wherein , once said boules are bonded onto said sacrificial core , said bonded assembly is inserted into an envelope inside which said bonded assembly is overmoulded with a coating material , which is left to cure to form an overmoulded assembly , characterized in that , after curing of said coating material , said overmoulded ...

Incident radiation induced subsurface damage for controlled crack propagation in material cleavage

A cleaving system employs a shaper, a positioner, an internal preparation system, an external preparation system, a cleaver, and a cropper to cleave a workpiece into cleaved pieces. The shaper shapes a workpiece into a defined geometric shape. The positioner then positions the workpiece such that the internal preparation system can generate a separation layer at the cleaving plane. The internal preparation system focuses a laser beam internal to the workpiece at a focal point and scans the focal point across the cleaving plane to create the separation layer. The external preparation system scores the external surface of the workpiece at a location coincident with the separation layer. The cleaver cleaves the workpiece by propagating the crack on the external surface along the separation layer. The cropper shapes the cleaved piece into a geometric shape as needed.

HOLDING APPARATUS, HOLDING METHOD THEREOF, WIRE ELECTRICAL DISCHARGE MACHINING APPARATUS, AND MACHINING METHOD THEREOF

A holding apparatus, which is used in electrical discharge machining for cutting a workpiece into slices at intervals of wires arranged in parallel to each other, includes: a holding unit for holding the workpiece so as to prevent the workpiece from falling from the holding apparatus; and an energization unit for energizing the workpiece so as to pass current through the workpiece. The holding unit is disposed outside a place at which the wires and the holding unit interfere with each other. The energization unit is disposed at a place at which the cutting of the workpiece into slices by the wires ends. A portion of the energization unit, which is brought into contact with the workpiece at the place at which the cutting of the workpiece into slices ends, has a surface shape that is prevented from conforming to a machining surface of the workpiece. 1. A holding apparatus , which is used in electrical discharge machining for cutting a workpiece into slices at intervals of wires arranged in parallel to each other , the holding apparatus comprising:a holding unit arranged to hold the workpiece so as to prevent the workpiece from falling from the holding apparatus; andan energization unit arranged to energize the workpiece so as to pass current through the workpiece, wherein:the holding unit is disposed outside a place at which the wires and the holding unit interfere with each other;the energization unit is disposed at a place at which the cutting of the workpiece into slices by the wires ends; anda portion of the energization unit, which is brought into contact with the workpiece at the place at which the cutting of the workpiece into slices ends, has a surface shape that is prevented from conforming to a machining surface of the workpiece which is cut into slices.2. A holding apparatus according to claim 1 , wherein claim 1 , when the holding unit is absent in the holding apparatus claim 1 , the energization unit itself is incapable of solely holding the workpiece so ...

PROTECTIVE MEMBER FORMING APPARATUS

A protective member forming apparatus includes an integrating unit that integrates a resin sheet held by a chuck table with a wafer by a resin, a conveying unit that conveys the wafer, and a cutting unit that holds, by a cutting table, the wafer integrated with the resin sheet conveyed by the conveying unit and cuts the resin sheet by a cutting section along the wafer. The cutting unit includes a detection unit that images the wafer by a camera and detects a position of a periphery of the wafer, and a control unit that causes cutting of the resin sheet by the cutting section to be performed only in the case where a peripheral edge of the wafer detected coincides with a track of a cutter blade of the cutting section when the preset resin sheet is cut. 1. A protective member forming apparatus for forming a protective member on one surface of a wafer , the protective member forming apparatus comprising:an integrating unit that supplies a liquid resin curable by an external stimulus to a sheet larger than the wafer held by a chuck table, spreads the resin on the one surface of the wafer, and cures the resin by an external stimulus, to integrate the sheet with the wafer by the resin;a conveying unit that conveys the wafer integrated with the sheet; anda cutting unit that holds, by a cutting table, the wafer integrated with the sheet conveyed by the conveying unit and cuts the sheet by a cutting section along a periphery of the wafer,{'claim-text': ['a detection unit that images the wafer by a camera and detects a position of a peripheral edge of the wafer, and', 'a control unit that causes cutting of the sheet by the cutting section to be performed only in a case where the peripheral edge of the wafer detected coincides with a track of the cutting section when the preset sheet is cut.'], '#text': 'wherein the cutting unit includes'}2. The protective member forming apparatus according to claim 1 ,{'claim-text': ['a main body section smaller in diameter than the wafer, and ...

Cutting apparatus and wafer processing method

A cutting apparatus includes a line sensor unit that applies a laser beam in a band shape elongated in a radial direction of a wafer to a region inclusive of a peripheral portion of the wafer held on a chuck table, and detects reflected light, and an information calculation section that calculates the position of the wafer and the height of the front surface of the wafer from the reflected light of the laser beam detected by the line sensor unit in a state in which the chuck table is rotated before the wafer is cut to form a stepped portion, and that calculates the width and the height of the stepped portion from the reflected light of the laser beam detected by the line sensor unit after the wafer is cut to form the stepped portion.

METHOD FOR CUTTING SUBSTRATE WAFER FROM INDIUM PHOSPHIDE CRYSTAL BAR

The invention discloses a method for cutting a substrate wafer from an indium phosphide crystal, and belongs to the field of semiconductor substrate preparation, comprises the following steps of: 1) orientating, cutting the head and the tail of a crystal bar, adjusting the orientation and trying to cut the crystal bar until a wafer with a required crystal orientation cut, wherein the cutting end face is an orientation end face; 2) multi-wire cutting, on a multi-wire cutting apparatus, dividing a crystal bar parallel to an orientation end face into wafers; 3) cleaning, cleaning the wafer until no residue and no dirt existing on the surface; 4) circle cutting, performing circle cutting on the wafer to cut the desired crystal orientation area. According to the technical scheme, for the indium phosphide crystal bar which is difficult to control in diameter and easy to twinning/ poly in the growth process, a barreling process which may grind and remove a large amount of InP materials is abandoned, the crystal bar is multi-wire cut into a wafer, and then the substrate wafer which is available in the crystal direction close to the standard size is cut from the wafer to the maximum extent, so that the wafer output can be greatly increased, and the material loss and the waste can be reduced. 1. A method for cutting a substrate crystal wafer from an indium phosphide crystal characterized by comprising following steps of:1) orientating: cutting a head and a tail of a crystal bar, adjusting the orientation and trying to cut the crystal bar until a wafer with a required crystal orientation cut, wherein the cutting end face is an orientation end face;2) multi-wire cutting: on a multi-wire cutting apparatus, dividing the crystal bar parallel to an orientation end face into wafers;3) cleaning: cleaning the wafer until no residue and no dirt existing on the surface;4) circle cutting: performing circle cutting on the wafer to cut the desired crystal orientation area.2. The method for ...

SLICING METHOD AND A SLICING APPARATUS FOR AN INGOT

A slicing method and a slicing apparatus for an ingot are provided. The slicing method for the ingot comprises: setting an ingot on an ingot-feeding device; descending the ingot by the ingot-feeding device and loosening a diamond wire synchronously such that the ingot is surrounded with the diamond wire; and tightening the diamond wire to begin to slice after the ingot is descended to a cooling tank. The slicing method and the slicing apparatus for the ingot of the present disclosure could raise the slicing speed and reduce the temperature difference from a slicing area to a non-slicing area so that the wrap of a silicon chip is improved. 1. A slicing method for an ingot , comprising the steps of:setting an ingot on an ingot-feeding device;descending the ingot by the ingot-feeding device and loosening a diamond wire synchronously such that the ingot is surrounded with the diamond wire; andtightening the diamond wire after the ingot is descended to a cooling tank to begin to slice the ingot.2. The method according to claim 1 , wherein loosening or tightening the diamond wire is controlled by a movement of a movable roller.3. The method according to claim 1 , further comprising the step of wrapping a resin layer around the ingot.4. The method according to claim 3 , wherein in the process of slicing the resin layer claim 3 , the slicing speed is increased gradually.5. The method according to claim 3 , wherein at the beginning of slicing the resin layer claim 3 , an intake port and a delivery port of the cooling tank are opened such that the cooling fluid is circulated in the cooling tank.6. The method according to claim 5 , wherein the circulated speed of the cooling fluid in the cooling tank is increased at the beginning of slicing the ingot.7. A slicing apparatus for an ingot claim 5 , comprising:an ingot-feeding device operable to control an ingot to move in a vertical direction;a diamond wire disposed below the ingot-feeding device and provided with a movable ...

CUTTING SYSTEM AND METHOD FOR A CUTTING SYSTEM

The invention relates to a cutting system. The cutting system () is designed to extend in the direction of a first system axis () which extends horizontally along a width (B) of the cutting system (), in the direction of a second system axis () which extends vertically relative to the first system axis (), and in the direction of a third system axis () which extends along the depth (T) of the cutting system orthogonally to the first system axis () and the second system axis (). The cutting system has a support (), a tool () which is received on the support () in the form of a saw with a spindle shaft (), the operating direction of the tool following the direction of the first system axis (), and an additional tool () which is received on the support () in the form of a chop saw with a third spindle shaft (), the operating direction of the additional tool following the direction of the first system axis (). The tools () are used to machine a blank, and the tools () are arranged in series in the direction of the first system axis (). The cutting system () has a support element () which is received on the support () in a movable manner along the first system axis () and the second system axis (), and the support element () is provided for supporting the blank. The support element () can be rotated about the second system axis (), and according to the invention, the spindle shaft () is orthogonal to the third spindle shaft (). 1. Cutting apparatus , the cutting apparatus being designed to extend in the direction of a first apparatus axis that extends horizontally along a width (B) of the cutting apparatus , a second apparatus axis that extends vertically with respect to the first apparatus axis , and a third apparatus axis that extends orthogonally to the first apparatus axis and second apparatus axis , along a depth (T) of the cutting apparatus , comprising a support , a tool that is received on the support and is in the form of a saw comprising a spindle shaft , the ...

APPARATUS FOR DIVIDING WORKPIECE

A dividing apparatus divides a workpiece along projected dicing lines into chips, the workpiece being stuck to an upper surface of a protective tape mounted on an annular frame. The dividing apparatus includes a frame holding unit for holding the annular frame and a dividing unit for pressing the workpiece in the vicinity of one at a time of the projected dicing lines and dividing the workpiece into chips along the projected dicing line. The dividing unit includes a holder for holding a portion of the workpiece in the vicinity of the projected dicing line where the workpiece is to be broken, from both upper and lower surfaces of the workpiece, and a presser for pressing chips next to chips held by the holder across the projected dicing line where the workpiece is to be broken, thereby to divide the workpiece along the projected dicing line. 1. A dividing apparatus for dividing a plate-shaped workpiece along projected dicing lines thereon , the workpiece being stuck to an upper surface of a protective tape mounted on an annular frame and having a strength reduced along the projected dicing lines , comprising:a frame holding unit having a holding surface for holding the annular frame, the frame holding unit being rotatable about its own axis;a detecting unit configured to detect the projected dicing lines on the workpiece stuck to the protective tape;a dividing unit configured to divide the workpiece into chips along a projected dicing line among the plurality of the projected dicing lines detected by the detecting unit; anda moving mechanism configured to move the frame holding unit and the dividing unit with respect to each other; whereinthe dividing unit includes:a holder configured to hold one of two regions of the workpiece which are next to each other across the detected projected dicing line where the workpiece is to be broken, from both upper and lower surfaces of the workpiece; anda presser configured to press an other of the two regions of the workpiece ...

Method for cutting watch crystals

Method for cutting a watch crystal along a contour in a plate of transparent material, with the following steps: making, on a first side of the plate, a first cut line or kerf to form a first chamfer, for each crystal of the plate; turning the plate over and marking the position of the first chamfers or of a previously made machined marking; making, on a second side, a second cut line or kerf to form a second chamfer, for each crystal; separating the crystals by machining through the plate at each contour to form an edge of the crystal.

Wafer processing method

A wafer processing method divides a wafer into individual device chips along division lines. The method includes attaching an adhesive tape to the front side of the wafer and attaching a peripheral portion of the adhesive tape to an annular frame having an inside opening for receiving the wafer, thereby supporting the wafer through the adhesive tape to the annular frame; grinding the back side of the wafer to reduce the thickness of the wafer; cutting the back side of the wafer along each division line by using a cutting blade to form a cut groove having a depth not reaching the front side of the wafer; and applying a laser beam to the bottom of the cut groove from the back side of the wafer along each division line to divide the wafer to obtain the individual device chips.

CUTTING APPARATUS

A cutting apparatus includes a width measuring unit for measuring the width of a grooving groove formed in a wafer by laser grooving and the width of a cut groove formed by a cutting blade. The width measuring unit includes an imaging camera for imaging the grooving groove and the cut groove, and an illuminating unit for illuminating an area to be imaged by the imaging camera with light supplied in a predetermined light quantity. Therefore, when first light is radiated from the illuminating unit, a first image in which the grooving groove is sharply imaged can be imaged by the imaging camera, whereas when second light is radiated from the illuminating unit, a second image in which the cut groove is clearly imaged can be imaged by the imaging camera. Consequently, the grooving groove and the cut groove can be easily distinguished from each other. 1a chuck table adapted to hold the wafer thereon;cutting means for cutting the wafer held on the chuck table along each of the grooving grooves by a cutting blade;indexing means for indexing the cutting means and the chuck table relative to each other in an indexing direction; andwidth measuring means for measuring a width of the grooving groove and a width of a cut groove,wherein the width measuring means includes an imaging camera for imaging the grooving groove and the cut groove, and illuminating means for illuminating an area to be imaged by the imaging camera,the illuminating means includes a light quantity switching section by which first light having a first light quantity when the imaging camera images the grooving groove and second light having a second light quantity when the imaging camera images the cut groove are switched over, andthe cutting apparatus further comprises:a detection unit for detecting a positional deviation of the cut groove from the grooving groove, on the basis of a first image picked up by the imaging camera using the first light and a second image picked up by the imaging camera using the ...

INGOT PRESSING APPARATUS AND INGOT SLICING APPARATUS INCLUDING THE SAME

A pressing head of the ingot slicing apparatus includes: a head main body in which a plurality of pneumatic supply ports configured to supply compressed air are formed so that pressure on each portion of the pressing head is separately controlled; pressing units installed on a lower end of the head main body, located to correspond to the pneumatic supply ports, and each configured to apply pressure to a side surface of an ingot by the compressed air supplied through each of the pneumatic supply ports; pneumatic correction units each installed on a lower surface of each of the pressing units and configured to control a pressure deviation between the plurality of pressing units; an adhesive plate installed to be in contact with lower side surfaces of the pneumatic correction units so that a lower surface of the adhesive plate is in direct contact with and presses the side surface of the ingot; and a coupling support unit configured to couple and support the head main body, the pressing units, the pneumatic correction units, and the adhesive plate. 1. A pressing head of an ingot slicing apparatus , comprising:a head main body in which a plurality of pneumatic supply ports configured to supply compressed air are formed so that pressure on each portion of the pressing head is separately controlled;pressing units installed on a lower end of the head main body,located to correspond to the pneumatic supply ports, and each configured to apply pressure to a side surface of an ingot by the compressed air supplied through each of the pneumatic supply ports;pneumatic correction units each installed on a lower surfaceof each of the pressing units and configured to control a pressure deviation between the plurality of pressing units;an adhesive plate installed to be in contact with lower sidesurfaces of the pneumatic correction units so that a lower surface of the adhesive plate is in direct contact with and presses the side surface of the ingot; anda coupling support unit ...

GEMSTONE PROCESSING

An indexing unit of a gemstone processing machine and a method for processing gemstones is described herein. In an embodiment, the indexing unit of the gemstone processing machine includes a base plate having a plurality of axially extending holes. The base plate is mounted on a mounting shaft, and the mounting shaft is coupled to an indexing mechanism for actuating the base plate. Further, the indexing unit includes a plurality of holders. A holder is disposed in each of the plurality of axially extending holes of the base plate, and each holder is configured to hold a gemstone for processing on the gemstone processing machine. 1100100. An indexing unit () of a gemstone processing machine , the indexing unit () comprising:{'b': 115', '200', '115', '125, 'a base plate () having a plurality of axially extending holes (), the base plate () being mounted on a mounting shaft ();'}{'b': 130', '125', '115, 'an indexing mechanism () coupled to the mounting shaft () for actuating the base plate (); and'}{'b': 120', '120', '200', '115', '120', '105, 'a plurality of holders (), wherein a holder () is disposed in each of the plurality of axially extending holes () of the base plate (), each of the plurality of holders () being configured to hold a gemstone () for processing on the gemstone processing machine.'}2100120202120200. The indexing unit () as claimed in claim 1 , wherein the plurality of holders () are coupled to an actuating mechanism () for providing actuation of each of the plurality of holders () in the respective axially extending hole ().3100120202204204. The indexing unit () as claimed in claim 2 , wherein the plurality of holders () are coupled to the actuating mechanism () through an operating member () claim 2 , the operating member () being one of a gear box claim 2 , a chain drive claim 2 , a belt drive claim 2 , and a pinch roller system.4100202. The indexing unit () as claimed in claim 2 , wherein the actuating mechanism () is one of a stepper motor ...

METHOD FOR SLICING INGOT AND WIRE SAW

A method is disclosed for slicing an ingot by which wire rows are formed by using a wire that is spirally wound between a plurality of wire guides and travels in an axial direction. An ingot is pressed against the wire rows while supplying a working fluid to a contact portion of the ingot and the wire, thereby slicing the ingot into wafers, and a ratio of a wire new line feed amount per unit time in slicing of a slicing start portion of a first ingot to that in slicing of a centration portion of the same at the time of slicing the ingot after replacement of the wire is controlled to be ½ or less of the ratio at the time of slicing second and subsequent ingots after the replacement of the wire. 1. A method for slicing an ingot by which wire rows are formed by using a wire that is spirally wound between a plurality of wire guides and travels in an axial direction , and an ingot is pressed against the wire rows while supplying a working fluid to a contact portion of the ingot and the wire , thereby slicing the ingot into wafers ,wherein a ratio of a wire new line feed amount per unit time in slicing of a slicing start portion of a first ingot to that in slicing of a centration portion of the same at the time of slicing the ingot after replacement of the wire is controlled to be ½ or less of the ratio at the time of slicing second and subsequent ingots after the replacement of the wire.2. A wire saw comprising: wire rows formed of a wire that is spirally wound between wire guides and travels in an axial direction; ingot feeding means for pressing an ingot against the wire rows while holding the ingot; and a nozzle that supplies a working fluid to a contact portion of the ingot and the wire , the ingot being sliced into wafers by pressing the ingot against the wire rows by the ingot feeding means while supplying the working fluid to the contact portion of the ingot and the wire from the nozzle ,wherein a ratio of a wire new line feed amount per unit time in slicing of a ...

WIRE SAW DEVICE AND WORKPIECE CUTTING METHOD

The wire saw device includes at least one wire, which is provided tightly to be capable of travelling in a direction crossing a workpiece to be cut, a workpiece holder, which is configured to hold the workpiece and to move the workpiece relative to the wire, slurry suppliers, which are configured to supply slurry to cut the workpiece from an upstream side in a travelling direction of the wire, and slurry collectors, which are configured to collect the slurry scattered due to contact with the workpiece. The slurry collector is configured to be movable in conjunction with the workpiece in the state where the slurry collector is disposed adjacent to the workpiece and also configured to be retractable with respect to the workpiece to be prevented from contacting the wire. 1. A wire saw device comprising at least one wire provided tightly to be capable of travelling in a direction crossing a workpiece to be cut , a workpiece holder configured to hold the workpiece and to move the workpiece relative to the wire , slurry suppliers configured to supply slurry to cut the workpiece from an upstream side in a travelling direction of the wire , and slurry collectors configured to collect the slurry scattered due to contact with the workpiece , whereinthe slurry collector is configured to be movable in conjunction with the workpiece in a state where the slurry collector is disposed adjacent to the workpiece and also configured to be retractable with respect to the workpiece to be prevented from contacting the wire.2. The wire saw device of claim 1 , wherein a minimum gap between an innermost and lowermost end of the slurry collector and a surface of the workpiece is at least 10 mm and not more than 50 mm.3. The wire saw device of claim 1 , wherein a minimum value of a vertical distance between the slurry collector and the wire is at least 5 mm and not more than 60 mm.4. The wire saw device of claim 1 , wherein the slurry collector is attached to the work holder in a manner such ...

WAFER DIVIDING APPARATUS

A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line is provided. The wafer dividing apparatus includes a cassette table movable upwardly and downwardly in a Z axis direction, a first carry-out/in unit that carries out the frame from the cassette placed on the cassette table or carry in the frame to the cassette, a first temporary receiving unit including a pair of first guide rails extending in the X axis direction and a guide rail opening/closing portion that increases the distance between the pair of first guide rails, a reversing unit including a holding portion that holds the frame and rotates by 180 degrees to reverse the front and back of the frame, and a transport unit that moves the reversed frame. 1. A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line , comprising:a cassette table on which a cassette that accommodates a plurality of wafers each stuck to an adhesive tape and supported at an opening of a frame is placed and which is movable upwardly and downwardly in a Z axis direction;a first carry-out/in unit configured to grasp the frame and move the frame in an X axis direction orthogonal to the Z axis direction to carry out the frame from the cassette placed on the cassette table or carry in the frame to the cassette;a first temporary receiving unit including a pair of first guide rails that extend in the X axis direction and configured to support the frame carried in by the first carry-out/in unit and a guide rail opening/closing portion configured to increase a distance between the pair of first guide rails in a Y axis direction orthogonal to the Z axis direction and the X axis direction so as to permit passage of the frame in the Z axis direction;a reversing unit including a holding portion configured to hold the frame ...

Ingot clamping device and wire sawing apparatus for slicing ingot having the same

According to the present invention, there is provided an ingot clamp including: a clamp body configured to have a holder mounting groove and a cavity; a fixing part configured to support and fix one side of an ingot holder inserted in the holder mounting groove; a movable fixing part disposed in the cavity and the holder mounting groove and configured to press and fix the other side of the ingot holder; a cover assembly coupled with the clamp body and configured to cover the cavity; and an air supply part coupled with the cover assembly and configured to supply air into the cavity.

METHOD AND APPARATUS FOR SIMULATING PRODUCTION TIME OF WAFER SLICER

A method and device for simulating a production duration of a silicon-wafer slicer, including: constructing a slicer simulating model, wherein the slicer simulating model includes process-step data of the slicer, and the process-step data include: a loading process step, a cutting process step, a discharging process step, a rinsing process step, a waiting process step, a broken-line replacing process step, a guide-pulley replacing process step, a home-roll replacing process step and a paying-off-wheel replacing process step; in the slicer simulating model, according to a predetermined rule, obtaining a process-step-to-be-executed datum; according to historical data, for the process-step-to-be-executed datum, assigning duration data that individually correspond to the process-step-to-be-executed data, wherein the historical data include: historical duration data that individually correspond to the process-step data of the slicer; and executing sequentially the process steps in the process-step-to-be-executed data, and obtaining a sum of the duration data of the process steps. 1. A method for simulating a production duration of a silicon-wafer slicer , wherein the method comprises:constructing a slicer simulating model, wherein the slicer simulating model comprises process-step data of the slicer, and the process-step data include: a loading process step, a cutting process step, a discharging process step, a rinsing process step, a waiting process step, a broken-line replacing process step, a guide-pulley replacing process step, a home-roll replacing process step and a paying-off-wheel replacing process step;in the slicer simulating model, according to a predetermined rule, obtaining a process-step-to-be-executed datum;according to historical data, for the process-step-to-be-executed datum, assigning duration data that individually correspond to the process-step-to-be-executed data, wherein the historical data include: historical duration data that individually ...

Wire saw and workpiece machining method employing same

Provided is a wire saw where a wire ( 47 ) extends and is wound around a plurality of machining rollers ( 45 ), the wire ( 47 ) is moved in a circulating manner around the machining rollers ( 45 ) due to rotation of the machining rollers ( 45 ), and a workpiece ( 49 ) is cut by the wire ( 47 ) at a workpiece cutting position. The wire saw includes a supply pallet ( 67 ) which guides the workpiece ( 49 ) to move toward the wire ( 47 ) at the workpiece cutting position in an upright state. The wire saw also includes a receiving pallet ( 100 ) which is arranged at a workpiece receiving position located downstream of the workpiece cutting position in the workpiece conveying direction, and receives the cut workpiece ( 49 ) with the workpiece ( 49 ) being kept in an upright state.

Cutting machine

A cutting machine includes a monitoring unit that monitors a cutting edge of a cutting blade. The monitoring unit includes an imaging unit that images the cutting edge of the cutting blade, a pulse light source that emits a pulse light to illuminate an imaging zone imaged by the imaging unit, and a camera that captures an image outputted from the imaging unit. The imaging unit includes a first imaging unit that images one side surface of the cutting edge of the cutting blade, a second imaging unit that images an opposite side surface of the cutting edge, and a third imaging unit that images an outer peripheral edge portion of the cutting edge.

METHOD FOR SLICING SEMICONDUCTOR SINGLE CRYSTAL INGOT

An amount of warp of a wafer is not only reduced, but the amount of warp of the wafer is also accurately controlled to a desired amount. The present invention relates to a method for slicing a semiconductor single crystal ingot, by which a cylindrical semiconductor single crystal ingot is bonded to and held by a holder in a state where the ingot is rotated at a predetermined rotation angle around a crystal axis of the ingot different from a center axis of a cylinder of this ingot and the ingot is sliced by a cutting apparatus in this state. The predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder in such a manner that an amount of warp of a wafer sliced out by the cutting apparatus becomes a predetermined amount. 1. A method for slicing a semiconductor single crystal ingot , by which a cylindrical semiconductor single crystal ingot is bonded to and held by a holder in a state that the ingot is rotated at a predetermined rotation angle around a crystal axis of the ingot different from a center axis of the cylinder of the ingot , and the ingot is sliced by a cutting apparatus in this state ,wherein the predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder is determined in such a manner that an amount of warp of a wafer sliced out by the cutting apparatus becomes a predetermined amount.2. The method for slicing a semiconductor single crystal ingot according to claim 1 ,wherein a correlation of a change in the amount of warp of the wafer relative to a change in the predetermined rotation angle is obtained by an experiment in advance, and the predetermined rotation angle is determined from the correlation.3. The method for slicing a semiconductor single crystal ingot according to claim 1 ,wherein the predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder is determined in such a manner that an amount of warp of a wafer sliced out by ...

CHUCK TABLE CORRECTION METHOD AND CUTTING APPARATUS

A chuck table correction method includes the step of: positioning a lower end of a cutting blade, relative to a chuck table, at a predetermined height for cutting into a holding surface; and relatively moving the chuck table and a cutting unit in a processing feeding direction, to cut the holding surface side of the chuck table, thereby forming the chuck table with a corrected surface that functions as a new holding surface. 1. A chuck table correction method for correcting a chuck table provided in a cutting apparatus , the chuck table adapted to hold a workpiece by a holding surface;', 'a cutting unit adapted to cut the workpiece held by the chuck table by a cutting blade mounted to a spindle;', 'a processing feeding unit adapted to relatively move the chuck table and the cutting unit in a processing feeding direction perpendicular to an axis of the spindle;', 'an indexing feeding unit adapted to relatively move the chuck table and the cutting unit in an indexing feeding direction parallel to the axis; and', 'a cutting-in feeding unit adapted to relatively move the chuck table and the cutting unit in a cutting-in feeding direction perpendicular to the processing feeding direction and the indexing feeding direction,, 'the cutting apparatus includingwherein a lower end of the cutting blade is positioned, relative to the chuck table, at a predetermined height for cutting into the holding surface, and the chuck table and the cutting unit are relatively moved in the processing feeding direction, to cut the holding surface side of the chuck table by the cutting blade, thereby forming the chuck table with a corrected surface that functions as a new one of the holding surface.2. The chuck table correction method according to claim 1 , comprising:a processing feeding step of relatively moving the chuck table and the cutting unit in the processing feeding direction in a state in which the lower end of the cutting blade is positioned at the predetermined height; andan ...

CUTTING BLADE MOUNTING METHOD

A cutting blade mounting method of sandwiching both side surfaces of an annular cutting blade by a first flange and a second flange, the first flange being mounted on an end of a spindle and having a suction hole sucking and holding a side surface of the cutting blade to a sandwiching surface of the first flange, includes: a cutting blade provisional holding step of sucking and holding the cutting blade to the first flange by making the cutting blade abut against the sandwiching surface of the first flange at a perfect circle position at which a center of the cutting blade coincides with an axis of the spindle, and making a suction force act on the suction hole; and a fixing step of fixing the cutting blade maintaining the perfect circle position in the cutting blade provisional holding step to the first flange by the second flange. 1a cutting blade provisional holding step of sucking and holding the cutting blade to the first flange by making the cutting blade abut against the sandwiching surface of the first flange at a perfect circle position at which a center of the cutting blade coincides with an axis of the spindle, and making a suction force act on the suction hole; anda fixing step of fixing the cutting blade maintaining the perfect circle position to the first flange by the second flange after the cutting blade provisional holding step is performed.. A cutting blade mounting method of sandwiching both side surfaces of a cutting blade formed by an annular cutting edge by sandwiching surfaces of a first flange and a second flange, and mounting the cutting blade onto a spindle, the first flange being mounted on an end of the spindle and having a suction hole sucking and holding a side surface of the cutting blade to the sandwiching surface, the cutting blade mounting method comprising: The present invention relates to a method of mounting a cutting blade in a cutting apparatus.In manufacture of semiconductor devices or the like, a plurality of sections are set ...

Cutting blade position detecting method

A cutting blade position detecting method using a cutting apparatus including a holding table that holds a workpiece, and a cutting unit in which a cutting blade for cutting the workpiece held by the holding table is mounted in a rotatable state, includes a groove forming step of causing the cutting blade to further cut into the workpiece including a first groove formed by causing the cutting blade to cut into the workpiece, to form the workpiece with a second groove of which one end portion in a width direction does not overlap with the first groove whereas another end portion in the width direction overlaps with the first groove, and a calculating step of calculating the lower end position of the cutting blade based on a length of the one end portion in the width direction of the second groove formed in the workpiece.

WORKPIECE PROCESSING METHOD

A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step of cleaning a back surface of the workpiece with cleaning water, after the cutting step is carried out. 1a workpiece preparation step of adhering a tape transparent to visible light to the front surface of the workpiece;a holding step of holding the front surface side of the workpiece through the tape by a holding table having a holding member of which at least a part is transparent;a street position detection step of imaging the front surface of the workpiece held by the holding table through the holding member and the tape by an imaging camera to detect a position of the street, after the holding step is carried out;a cutting step of cutting a back surface of the workpiece along the streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, after the street position detection step is carried out; anda cleaning step of cleaning the back surface of the workpiece with a cleaning liquid, after the cutting step is carried out.. A processing method for a workpiece having a front surface formed with devices respectively in regions partitioned by a plurality of intersecting streets, the processing method comprising: The present invention relates to a processing method for a workpiece having on a front surface thereof devices formed respectively in regions partitioned by a plurality of intersecting streets.Conventionally, there has been known a cutting apparatus for cutting a workpiece, which is a semiconductor wafer having a front surface formed with devices respectively in regions partitioned by a plurality of intersecting streets, along the streets by a cutting blade rotated at high speed.For example, Japanese Patent Laid-open No. 2016-46485 discloses a cutting apparatus ...

SYSTEM AND METHOD OF CLEAVING OF BURIED DEFECTS

A method for exposing a buried defect, the method may include illuminating, by a radiation source, an object that comprises the buried defect, with illuminating radiation that passes through radiation transparent part of a chuck, while the object is supported by the chuck; detecting, by a sensor, a detected radiation that passed through the object, to provide a visual indication about the buried defect, wherein the visual indication is indicative of a location of the buried defect; setting, based on the location of the buried object and a spatial relationship between a cleaving element and the sensor, a cleaving axis of a cleaving element to virtually cross the buried defect; and cleaving, by the cleaving element, the object to expose the buried object. 1. A method for exposing a buried defect , the method comprises:illuminating, by a radiation source, an object that comprises the buried defect, with illuminating radiation that passes through a radiation transparent part of the chuck, while the object is supported by the chuck;detecting, by a sensor, a detected radiation that passed through the object, to provide a visual indication about the buried defect, wherein the visual indication is indicative of a location of the buried defect;setting, based on the location of the buried object and a spatial relationship between a cleaving element and the sensor, a cleaving axis of a cleaving element to virtually cross the buried defect; andcleaving, by the cleaving element, the object to expose the buried object.2. The method according to wherein the radiation transparent part of the chuck is an aperture or slot.3. The method according to claim 1 , wherein the setting claim 1 , of the cleaving axis of the cleaving element to virtually cross the buried defect claim 1 , comprises introducing a movement between the cleaving element and the object.4. The method according to claim 1 , wherein the setting claim 1 , of the cleaving axis of the cleaving element to virtually cross ...

Cutting apparatus, cutting blade replacement method, and board replacement method

A cutting apparatus cuts a workpiece by a cutting blade. The cutting apparatus includes a mount flange on which the cutting blade is mounted and a replacement apparatus that replaces the cutting blade mounted on the mount flange with the cutting blade for replacement. The replacement apparatus includes a rotating part, a first holding part that holds the cutting blade mounted on the mount flange on a front surface side, a second holding part that holds the cutting blade for replacement on a front surface side, and a nut rotation part that has a nut holding part that holds a nut for fixing the cutting blade to the mount flange and rotates the nut held by the nut holding part. The rotating part is coupled to the first holding part, the second holding part, and the nut rotation part.

METHOD FOR SLICING WORKPIECE AND WIRE SAW

A method for slicing a workpiece using a wire saw which includes wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface around a plurality of grooved rollers, the method including feeding a columnar workpiece to wire row for slicing while allowing fixed abrasive grain wire to reciprocate and travel in an axial direction, thereby slicing the workpiece at a plurality of positions aligned in axial direction at same time. After end of slicing the workpiece, the fixed abrasive grain wire is rewound from position at the end of slicing the workpiece by length of ⅓ or more and ⅔ or less of the fixed abrasive grain wire fed's length from start of slicing when the workpiece and wire row begin to contact with each other to the end of slicing the workpiece, and then the workpiece is drawn out of wire row. 1. A method for slicing a workpiece with the use of a wire saw which comprises a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around a plurality of grooved rollers , the method comprising feeding a columnar workpiece to the wire row for slicing while allowing the fixed abrasive grain wire to reciprocate and travel in an axial direction , thereby slicing the workpiece at a plurality of positions aligned in the axial direction at the same time ,wherein, after end of slicing the workpiece, the fixed abrasive grain wire is rewound from a position at the end of slicing the workpiece by a length which is ⅓ or more and ⅔ or less of a length of the fixed abrasive grain wire fed from start of slicing when the workpiece and the wire row begin to contact with each other to the end of slicing the workpiece, and then the workpiece is drawn out of the wire row.2. The method for slicing a workpiece according to claim 1 ,wherein, as the columnar workpiece, a workpiece having a diameter of 300 mm or more is sliced.3. A wire saw comprising: a wire row formed by winding a fixed abrasive ...

AUTOMATED GEMSTONE FEEDING

Examples of automated gemstone feeding are described. According to an example, a gemstone feeding machine includes a conveyor belt assembly to feed holders carrying gemstones. The conveyor belt assembly can include a plurality of conveyor belts in two sets positioned parallel to each other and the two sets can move in opposite directions. Each belt in one set can be positioned alternately with respect to each belt in the other set. The assembly can include a fixed guiding plate at a first end of the conveyor belts and a detachable guiding plate adjacent to the loading assembly at a second end of the conveyor belts. The fixed guiding plate and the detachable guiding plate each comprises a plurality of transition profiles in alignment with immediately adjacent conveyor belts. 1. A gemstone feeding machine comprising: a loading tray having a plurality of channels; and', 'a slider,', 'wherein the loading tray and the slider are adapted to exhibit relative motion with respect to each other; and, 'a loading assembly comprising a plurality of conveyor belts positioned parallel to each other, the plurality of conveyor belts including at least a first conveyor belt to move in a first direction and at least a second conveyor belt to move in a second direction, wherein each of the at least first conveyor belt and the at least second conveyor belt is aligned with a channel from amongst the plurality of channels of the loading assembly;', 'a fixed guiding plate positioned at a first end of the plurality of conveyor belts; and', 'a detachable guiding plate positioned adjacent to the loading assembly at a second end of the plurality of conveyor belts., 'a conveyor belt assembly positioned adjacent to the loading assembly, the conveyor belt assembly comprising2. The gemstone feeding machine as claimed in claim 1 , wherein the fixed guiding plate comprises at least one transition profile claim 1 , the at least one transition profile positioned in alignment with immediately adjacent ...

METHOD FOR SLICING WORKPIECE AND WORKPIECE HOLDER

Method for slicing a workpiece, including measuring a crystal axis orientation while holding a workpiece with a workpiece holder, setting the workpiece holder to a wire saw in such a manner that the measured crystal axis orientation is maintained, then adjusting a sliced plane orientation, pressing the workpiece against a wire row to slice the workpiece; the workpiece holder includes a portion slidable while holding the workpiece and a portion for fixing the slide portion, after measuring the crystal axis orientation, sliding the slide portion to move to the workpiece holder center in a manner that the measured crystal axis orientation is maintained, fixing the slide portion, setting the workpiece holder to the wire saw, then adjusting the sliced plane orientation, and slicing the workpiece. This enables an orientation measurement without limitation of distance between an orientation measuring instrument and plane to be measured can inhibit warpage deterioration and workpiece breakage. 17-. (canceled)8. A method for slicing a workpiece , comprising: measuring a crystal axis orientation while holding a cylindrical workpiece with a workpiece holder; setting the workpiece holder holding the workpiece to a wire saw in such a manner that the measured crystal axis orientation is maintained; then adjusting a sliced plane orientation; and pressing the workpiece held with the workpiece holder against a wire row to slice the workpiece , the wire row being formed by winding a wire axially reciprocating around a plurality of grooved rollers , whereinthe workpiece holder includes a slide portion being slidable while holding the workpiece and a fix portion for fixing the slide portion, and the method includes, after measuring the crystal axis orientation, sliding the slide portion so as to move the workpiece to a center of the workpiece holder in such a manner that the measured crystal axis orientation is maintained, fixing the slide portion with the fix portion, setting the ...

Method and Device for Monitoring Dicing Tape Tension

A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.

INGOT CUTTING METHOD CAPABLE OF REDUCING WAFER DAMAGE PERCENTAGE

An ingot cutting method capable of reducing wafer damage percentage, comprising: forming a layer of nanostructures on at least one surface of an ingot; depositing a buffer layer on the layer of nanostructures; fixing the ingot to a mounting plate by applying a layer of epoxy between the buffer layer and the mounting plate; performing a dicing process on the ingot to get a plurality of wafers; and performing an epoxy removal process on the plurality of wafers. 1. An ingot cutting method capable of reducing wafer damage percentage , comprising: the layer of nanostructures being formed by an electrochemical process, an etching process, or a deposition process;', 'the layer having a depth ranging from 1 micro meter to 10 micro meters;', 'the electrochemical process including placing the ingot in a container;', 'the layer of nanostructures being is-formed on at least one side wall of the ingot;', 'the depth being adjustable by varying a process time;', 'the ingot being a single-crystal ingot or a polycrystalline ingot; and', 'material of the ingot being selected from a group consisting of glass (SiO2), silicon (Si), germanium (Ge), carbon (C), aluminum (Al), gallium nitride (GaN), gallium arsenide (GaAs), gallium phosphide (GaP), aluminum nitride (AlN), sapphire, spinel, aluminum oxide (Al2O3), silicon carbide (SiC), zinc oxide (ZnO), magnesium oxide (MgO), lithium aluminum dioxide (LiAlO2), and lithium gallium dioxide (LiGaO2);, 'forming a layer of nanostructures on at least one surface of an ingot, comprising 'fixing said ingot onto a mounting plate by applying a layer of epoxy between said buffer layer and said mounting plate;', 'depositing a buffer layer on said layer of nanostructures;'} the dicing process being a wire sawing process;', 'during the wire sawing process, the layer of nanostructures absorbing the force resulting thereof to avoid damaging the wafers; and, 'performing a dicing process on said ingot to get a plurality of wafers, comprising 'placing the ...

Slicing SiC Material by Wire Electrical Discharge Machining

A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

Wire sawing apparatus

A wire sawing apparatus of one embodiment comprises: a wire for cutting an ingot; an ingot conveyor unit for conveying the ingot to the wire; a nozzle for supplying slurry to the wire; and a dispersed slurry blocking unit disposed above the ingot sawed by the wire, so as to absorb at least a part of the slurry dispersed from the lateral sides of the ingot cut by the wire.

PROCESSING APPARATUS

A processing apparatus includes a chuck table having a holding surface for holding a workpiece thereon, and a processing unit. The processing unit includes a spindle, a wheel mount coupled to an end of the spindle and facing the holding surface, a first tool detachably mounted on a mount surface of the wheel mount, the first tool having a first diameter, a second tool mount nonrotatably and axially movably mounted on the spindle over a rear surface of the wheel mount which is opposite the mount surface, the second tool mount having a storage region for the wheel mount and the first tool, a second tool mount member surrounding the storage region and having an inside diameter larger than the first diameter, and a second tool detachably mounted on the second tool mount and having an inside diameter larger than the first diameter. 1. A processing apparatus comprising:a chuck table having a holding surface for holding a workpiece thereon; andprocessing means for processing the workpiece held on the holding surface of said chuck table;wherein said processing means includes a spindle,a motor for rotating said spindle about its own axis,a wheel mount coupled to an end of said spindle and facing the holding surface of said chuck table,a first tool detachably mounted on a mount surface of said wheel mount, said first tool having a first diameter,a second tool mount nonrotatably and axially movably mounted on said spindle over a rear surface of said wheel mount which is opposite the mount surface of said wheel mount, said second tool mount having a storage region for storing therein said wheel mount and the first tool mounted on said wheel mount, and a second tool mount member surrounding said storage region and having an inside diameter larger than said first diameter,a second tool detachably mounted on said second tool mount and having an inside diameter larger than said first diameter, andmoving means for moving said second tool mount in axial directions of said spindle, ...

TRANSFER JIG AND CUTTING BLADE CHANGING METHOD

A transfer jig for use in transferring a new cutting blade as a replacement component to the processing unit, in a cutting apparatus including a chuck table holding a workpiece, a processing unit having a spindle and a cutting blade detachably mounted on the spindle, a cutting blade changing unit changing the cutting blade, and a transfer mechanism supplying the workpiece to the processing unit. The transfer jig has a plurality of receiving portions each adapted to receive the new cutting blade and the cutting blade changed by the cutting blade changing unit. The transfer jig is adapted to be transferred by the transfer mechanism transferring the workpiece. 1. In a cutting apparatus includinga chuck table holding a workpiece,a processing unit having a spindle and a cutting blade detachably mounted on said spindle,transfer means supplying said workpiece to said processing unit, andcutting blade changing means changing said cutting blade;a transfer jig for use in transferring a new cutting blade as a replacement component to said processing unit;said transfer jig having a plurality of receiving portions each adapted to receive said new cutting blade and said cutting blade changed by said cutting blade changing means;said transfer jig being adapted to be transferred by said transfer means transferring said workpiece.2. In a cutting apparatus including a chuck table holding a workpiece , a processing unit having a spindle and a cutting blade detachably mounted on said spindle , transfer means supplying said workpiece to said processing unit , and cutting blade changing means changing said cutting blade;a cutting blade changing method using a transfer jig having a plurality of receiving portions each adapted to receive a new cutting blade as a replacement component and said cutting blade changed by said cutting blade changing means, said cutting blade changing method comprising:a transfer step of transferring said transfer jig previously stored in a cassette to said ...

Semiconductor Sawing Method and System

In one instance, a method of manufacturing an integrated circuit includes a method for dicing a semiconductor wafer that includes disposing the semiconductor wafer on a moveable cutting table, cutting the semiconductor wafer, and ejecting a clearing fluid across an exposed side of the semiconductor wafer, with full coverage across the semiconductor wafer, at least during the cutting of the semiconductor wafer. The ejecting clearing fluid is ejected to form a layer or membrane of fluid that clears or reduces other fluids from the exposed side or surface of the semiconductor wafer. Other aspects are presented. 1. A method of manufacturing an integrated circuit , the method comprising: providing a cutting table,', 'securing the semiconductor wafer in a sawing position,', 'applying a spinning saw blade to the wafer secured in the sawing position to cut the wafer into a plurality of separated die,', 'applying a first fluid for cooling to the semiconductor wafer proximate where the spinning saw blade touches the semiconductor wafer,', 'applying a second fluid to substantially all of an exposed side of the semiconductor wafer; and', 'wherein applying a second fluid comprises using a fluid ejector element proximate the cutting table and coupled to the cutting table and wherein the fluid ejector element is positioned proximate an edge of the semiconductor wafer when mounted in the sawing position to eject the second fluid across substantially all of the exposed side of the semiconductor wafer and substantially parallel to the exposed side;, 'sawing a semiconductor wafer comprisingattaching the plurality of die to a plurality of leadframes;interconnecting each of the plurality of die to a corresponding leadframe of the plurality of leadframes; andapplying to each leadframe a mold compound over at least a portion of any die on the leadframe and at least a portion of the leadframe.2. The method of manufacturing an integrated circuit of claim 1 , wherein applying a second fluid ...

Method and device for cleaning substrates on a support

Bei einer Vorrichtung und einem Verfahren zur Reinigung von Substraten an einem Träger, an dessen Unterseite die Substrate parallel zueinander mit geringem Abstand zueinander befestigt sind, weist der Träger in seinem Inneren mehrere parallel zueinander verlaufende Längskanäle auf. Durch das Zersägen der Wafer gehen sie mit Öffnungen in Zwischenräume zwischen den Substraten über. Durch eine Relativbewegung wird ein längliches Rohr in mindestens einen der Längskanäle eingebracht, wobei aus dem Rohr Reinigungsflüssigkeit ausgebracht wird, wobei die Relativbewegung im Wesentlichen durch Bewegen des Trägers erreicht wird. In the case of a device and a method for cleaning substrates on a carrier, on the underside of which the substrates are fastened parallel to one another with a small spacing from one another, the carrier has a plurality of longitudinal channels running parallel to one another in its interior. By sawing the wafers, they pass through openings between the substrates. By means of a relative movement, an elongated tube is introduced into at least one of the longitudinal channels, cleaning liquid being dispensed from the tube, the relative movement being achieved essentially by moving the carrier.

Träger für einen Siliziumblock

Ein Träger für einen Siliziumblock, der mit dem Träger fest verbunden ist und zusammen mit diesem bewegt wird zur Bearbeitung durch Sägen, Reinigen odgl., weist in seinem Inneren mehrere durchgängige Längskanäle auf sowie eine Oberseite zur Befestigung an einer Haltevorrichtung für den Träger und ei Die Längskanäle weisen einen Querschnitt auf mit einem größeren Querschnittsbereich und einem sich daran anschließenden kleineren Querschnittsbereich, wobei der kleinere Querschnittsbereich von dem größeren Querschnittsbereich aus in Richtung zur Unterseite abgeht und in einem überwiegenden Teil seiner Länge gleichbleibende Breite aufweist.

DEVICE FOR CUTTING LAYER OF SUBSTRATE, AND ASSOCIATED METHOD

Apparatus for adjusting a center of an ingot block and method for adjusting a center of an ingot block using it

본 발명은 잉곳 블럭의 센터 조정장치 및 이를 이용한 잉곳 블럭의 센터 조정방법에 관한 것이다. 더욱 상세하게는 잉곳 블럭의 선반 장착시 편심을 방지하기 위해 잉곳 블럭의 복수 부위에서의 각 이격거리를 자동으로 측정한다. 또한, 측정된 복수의 이격거리를 이용하여 잉곳 블럭의 복수 부위에서의 수직 단면의 각 중심점이 지면에 동일한 위치에 위치하도록 잉곳 블럭을 승강시키는 잉곳 블럭의 센터 조정장치 및 이를 이용한 잉곳 블럭의 센터 조정방법에 관한 것이다. The present invention relates to an apparatus for adjusting the center of an ingot block and a method for adjusting the center of an ingot block using the same. More specifically, in order to prevent eccentricity when the shelf is mounted on the ingot block, the respective separation distances of the ingot blocks are automatically measured. In addition, the center adjusting device of the ingot block for raising and lowering the ingot block so that each center point of the vertical section in the plurality of parts of the ingot block is located at the same position on the ground using the measured plurality of separation distances, and the center adjustment of the ingot block using the same It is about a method. 본 발명의 일실시예에 따른 잉곳 블럭의 센터 조정장치는 잉곳 블럭을 안착시키는 작업대와, 상기 잉곳 블럭의 연장되는 길이 방향을 따라 상기 잉곳 블럭의 복수의 부위에서 상측으로 이격되는 각 이격거리를 측정하는 거리측정부와, 상기 측정된 복수의 이격거리를 이용하여 상기 작업대의 상부면에 형성되는 기준선을 기준으로 상기 잉곳 블럭의 복수의 부위에서의 수직 단면의 각 중심점 위치에 의한 보정값을 산출하는 연산제어부 및 상기 산출된 보정값을 이용하여 상기 잉곳 블럭의 복수의 부위에서의 상기 복수의 중심점이 지면으로부터 동일한 위치에 위치하도록 상기 잉곳 블럭을 승하강시키는 센터조정부를 포함한다. An apparatus for adjusting the center of an ingot block according to an embodiment of the present invention measures a worktable for seating an ingot block and each separation distance spaced upward from a plurality of portions of the ingot block along a lengthwise direction of the ingot block. Computing a correction value by the position of the center point of the vertical cross-section at the plurality of portions of the ingot block on the basis of the reference line formed on the upper surface of the work table using the distance measuring unit and the measured plurality of separation distances And a center adjusting unit for raising and lowering the ingot block such that the ...

一种3d电子产品的蓝宝石视窗保护屏的加工方法

本发明提供了一种3D电子产品的蓝宝石视窗保护屏的加工方法，属于视窗保护屏加工技术领域。它解决了现有蓝宝石视窗保护屏的加工方法采用砂轮或金刚石刀具切割，速度慢，长时间加工发热高容易影响精度等技术问题。本蓝宝石视窗保护屏的加工方法，先将蓝宝石晶块切割成具有3D凹凸形状的蓝宝石基板，再将蓝宝石基板装入框体状的夹具内并使两者定位，然后通过第一抛光刷和第二抛光刷分别对蓝宝石基板的上表面和下表面进行抛光，最后将夹具从工作转盘上取下，清洗并烘干。本发明使得第一抛光刷和第二抛光刷在竖直面内对蓝宝石基板进行同步抛光，能够一次性加工到位，提高抛光的效率。

반도체재료의 보호방법

본 발명은 반도체재료를 초순수(ultrapure water)로 형성시킨 얼음(ice)표면상에 처리시킴을 특징으로 하는 반도체재료의 보호방법에 관한 것이다.

加工装置的搬送机构

提供加工装置的搬送机构，该加工装置(2)具有卡盘工作台(10)、加工单元(12)、使卡盘工作台在加工被加工物(11)的加工区域与搬出搬入被加工物的搬出搬入区域之间沿加工进给方向移动的加工进给单元以及使加工单元沿与加工进给方向垂直的分度进给方向移动的分度进给单元(16)，搬送机构将被加工物搬出搬入卡盘工作台，其具有：装载工作台(42)，其在与搬出搬入区域相邻的加工进给单元的一侧的区域内支承加工前的被加工物；卸载工作台(44)，其在与搬出搬入区域相邻的加工进给单元的另一侧的区域内支承加工后的被加工物；以及搬送单元(46、48、52)，其在卡盘工作台与装载工作台或卸载工作台之间搬送被加工物。

Method and device for cleaning substrates on a carrier

本发明涉及一种用于清洁载体处的基质的装置和方法，基质彼此平行地相互以小的间距固定在载体的下侧处，载体在其内部中具有多个彼此平行地伸延的纵向通道。通过锯碎晶片，纵向通道利用开口过渡到基质之间的间隙中。通过相对运动将从中施加清洁液的长形的管引入纵向通道中的一个中，其中，基本上通过载体的运动实现相对运动。

一种用于硅片线切割的切割设备

本发明公开了一种用于硅片线切割的切割设备，包括机身，所述机身内设有加工腔，所述加工腔下侧壁体设有切割腔，所述加工腔左右侧的所述机身内设有用于硅棒切割的硅棒切割装置，所述硅棒切割装置包括设置于所述机身下侧的带轮腔一；本发明设有硅棒切割装置，能够通过放线轮和收线轮进行金刚丝的收放线，其中，通过导线轮转轴进行传导，然后通过导轮进行金刚线的转动缠绕，从而实现对向下运输的硅棒进行线切割，且金刚线的收放和硅棒的运输能够同步进行，从而使切割效率大大提高；本发明设有散热装置，能够通过喷头送出冷却液，然后通过导流槽倒流进行切割散热，然后通过过滤网进行冷却液的回收，从而实现冷却液的回收利用。

cutting equipment of substrate and method for cutting of substrate using the same

본 발명은 생산성을 향상시키도록 한 기판의 절단장치 및 이를 이용한 기판의 절단방법에 관한 것으로서, 기판을 재치하여 이동시키는 제 1, 제 2 벨트 컨베이너와, 상기 제 1, 제 2 벨트 컨베이너 사이에 일정한 간격을 갖고 구성되어 상기 기판이 도달하면 절단 예정선을 따라 스크라이빙을 실시하는 스크라이브 수단과, 상기 기판에 스크라이빙을 할 때 상기 제 1, 제 2 벨트 컨베이너의 사이에 상기 기판의 스크라이빙 방향과 동일한 방향으로 구성되어 상기 기판을 지지하는 기판 지지수단을 포함하여 구성됨을 특징으로 한다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cutting apparatus for improving productivity and a method for cutting a substrate using the same, wherein the first and second belt conveyors for placing and moving the substrates, and the first and second belt conveyors Scribing means for scribing along a cutting schedule line when the substrate arrives at a predetermined interval, and between the first and second belt conveyors when scribing the substrate. It is configured in the same direction as the criving direction, characterized in that it comprises a substrate support means for supporting the substrate. 벨트 컨베이너, 모 기판, 스크라이브, 기판 지지수단 Belt Conveyor, Mother Board, Scribe, Board Support Means

Grinding machine for jewelery

본 고안은 보석 및 악세사리의 연마와 광택작업을 빠른 시간내에 정밀하고 능률적으로 가공처리 할 수 있는 보석연마가공기에 관한 것이다 본 고안은 이를 위해 상하이동수단이 구비된 지지축의 외주면에 끼워지는 보석가공장치와, 상기 이동수단에 결합되어 고정되는 연마손잡이부와 연마숫돌이 구비된 연마부로 이루어진 보석연마가공기 있어서, 상기 지지축에 고정설치되는 제 1동력부가 구비된 높낮이조절장치와; 상기 연마손잡이부에 제 2동력부가 구비되며 손잡이와 스틱 사이에는 보석모양 형성용 형성판이 결합되고 상기 형성판을 가이드하는 가이드부를 포함하여 이루어진 보석연마가공기는 손잡이가 흔들림 없이 정확한 높이 및 각도로 작동되도록 하여 보석의 품질을 향상시킬 수 있으며 조작이 편리하여 작업능률을 향상시켜 생산성을 높일 수 있도록 함은 물론 제품의 규격과 품질을 대폭 향상시킬 수 있는 효과가 있다.

An apparatus for cutting the original artificial jewel

본 고안은 원석을 다수의 평판들로 동시에 커팅함은 물론 이 평판들을 다수의 각편들로 동시에 커팅할 수 있는 인조보석의 원석 커팅장치에 관한 것으로, 프레임의 상면에 형성되며 커터뭉치가 장착된 가공부와, 이 가공부의 양측에 고정되는 제1,2 가이드부와, 이 제1,2 가이드부의 상측에 Z축 방향으로 장착되어 원석을 고정하는 원석장착부, 및 이 원석장착부를 X축으로 이송시켜 커팅을 진행시키는 이송부로 구성됨을 특징으로 하는 것이다. The present invention relates to an artificial gemstone cutting device capable of simultaneously cutting raw stones into a plurality of plates as well as cutting these plates into a plurality of pieces at the same time, which is formed on the upper surface of a frame and is equipped with cutter bundles. And the first and second guide parts fixed to both sides of the machined part, the gemstone mounting part mounted on the upper side of the first and second guide parts in the Z-axis direction to fix the gemstone, and the gemstone mounting part on the X axis. It is characterized by consisting of a conveying portion to advance the cutting.

Cutting apparatus

提供切削装置，在切削加工中对被加工物上作为检测对象的崩边或裂纹进行检测。该切削装置利用切削刀具(43)对保持工作台所保持的被加工物进行切削，该切削装置构成为具有：弹性波检测传感器(71)，其检测切削刀具对被加工物进行切削时所产生的弹性波；以及分析单元(76)，其按照采样时间的间隔对由弹性波检测传感器所检测的弹性波的连续的时间轴波形进行切取而进行频率分析，采样时间被设定成比切削刀具通过检查对象的崩边尺寸或裂纹尺寸所需的时间短。

SUPPLY PLATE FOR THE WIRE CUTTING DEVICE, DEVICE FOR THE WIRE CUTTING CONTAINING THE SPECIFIED SUPPORT PLATE AND THE WIRE CUTTING METHOD CARRIED OUT BY THE APPLICABLE DEVICE

1. Устройство для установки заготовки в устройство для проволочной резки, включающее: ! плиту, имеющую поверхность для присоединения заготовки и, по меньшей мере, одну выемку, сформированную, по меньшей мере, частично в плите. ! 2. Устройство по п.1, отличающееся тем, что, по меньшей мере, одна выемка имеет трапециевидный профиль и расположена на стороне плиты, противоположной поверхности для присоединения заготовки. ! 3. Устройство по п.2, отличающееся тем, что плита выполнена из керамического материала. ! 4. Устройство по п.1, отличающееся тем, что, плита и, по меньшей мере, одна выемка сформированы путем экструзии керамического материала. ! 5. Устройство для установки заготовки в устройство для проволочной резки, включающее: ! керамическую плиту, имеющую поверхность для присоединения заготовки и опорную поверхность и, ! по меньшей мере, один канал, по меньшей мере, частично сформированный в плите. ! 6. Устройство по п.5, отличающееся тем, что керамическая плита имеет, по меньшей мере, одну выемку, расположенную на стороне плиты, противоположной поверхности для присоединения заготовки. ! 7. Устройство по п.5, отличающееся тем, что, по меньшей мере, один канал расположен параллельно поверхности для присоединения заготовки. ! 8. Устройство по п.5, отличающееся тем, что керамическая плита получена путем экструзии керамического материала. ! 9. Опорная плита и заготовка для обработки в устройстве для проволочной резки, содержащая: ! керамическую плиту, содержащую: ! первую поверхность; ! по меньшей мере, одну выемку, расположенную на поверхности керамической плиты, противоположной первой поверхности, и !по меньшей мере, один канал, � РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 2010 147 710 (13) A (51) МПК B28D 5/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (71) Заявитель(и): АППЛАЙД МАТИРИАЛС СВИТСЭРЛЭНД СА (CH) (21)(22) Заявка: 2010147710/03, 23.02.2009 Приоритет(ы): (30) Конвенционный приоритет: 23.04.2008 EP 08007834.8 (87) ...

Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film

칩 크랙이나 버의 발생을 충분히 억제하면서, 반도체 웨이퍼로부터 반도체 칩을 수율 좋게 얻는 것을 가능하게 하기 위한 방법을 제공한다. A method for enabling a high yield of a semiconductor chip from a semiconductor wafer while sufficiently suppressing the occurrence of chip cracks and burrs is provided. 반도체 웨이퍼, 반도체용 접착 필름 및 다이싱 테이프가 이 순서로 적층되고, 반도체 웨이퍼가 복수의 반도체 칩으로 분할됨과 동시에 반도체용 접착 필름의 두께 방향의 일부가 절단되지 않고 남도록 절삭이 형성되어 있는 적층체를 준비하는 공정과, 다이싱 테이프를 복수의 반도체 칩을 서로 분리되는 방향으로 잡아늘이는 것에 의해, 반도체용 접착 필름을 절삭에 따라서 분할하는 공정을 구비하는 반도체 칩의 제조방법. 반도체용 접착 필름은, 5% 미만의 인장파단신도를 가지며, 그 인장파단신도가 최대 하중시의 신도의 110% 미만이다. The laminated body in which a semiconductor wafer, the adhesive film for semiconductors, and a dicing tape are laminated | stacked in this order, and a cutting is formed so that a part of the thickness direction of the adhesive film for semiconductors may remain without being cut | disconnected while a semiconductor wafer is divided into several semiconductor chips. And dividing the dicing tape in a direction in which the plurality of semiconductor chips are separated from each other, thereby dividing the adhesive film for semiconductors according to cutting. The adhesive film for semiconductors has a tensile breaking elongation of less than 5%, and the tensile breaking elongation is less than 110% of the elongation at the maximum load.

Method of, and apparatus for, separating wafers from a wafer stack

在用于将晶片(12)从竖直晶片堆(16)分离的方法中，晶片(12)从上方经由从上面作用的运动装置(23)被单独地从上方传送离开。运动装置(23)设计为循环带(24)并具有抽吸表面(25)，最上方晶片(12)邻接并抵靠抽吸表面，其中，负压抽吸增强了晶片(12)抵靠抽吸表面的邻接。为了使多个位于彼此之上的晶片(12)分离，运动装置(23)经历下面两个步骤中的至少一个：a)对着顶部晶片的前导缘喷射水(30)，水从顶部晶片下面被倾斜地引导；b)运动装置(23)在剥离装置(32)上引导晶片(12)，剥离装置从下面接合到运动晶片(12)的下侧并且挤压晶片(12)抵靠抽吸表面(25)并且在其上产生制动作用；而后，晶片(12)被带到传输路径(35、37)上以便在上面传输而用于进一步处理。

Scribing method

本发明的目的在于提供一种能够使用标准轮在基板形成良好的刻划线的刻划方法。一种刻划方法，所述刻划方法通过一边将标准轮(40)按压于基板(15)一边使该标准轮(40)行进从而在基板(15)形成刻划线，使标准轮(40)下降到比基板(15)的端部靠内侧的开始位置(S11)，在从开始位置到规定位置位置的第一区间中，以第一载荷将标准轮(40)按压于基板(15)并执行刻划动作(S12)，在与第一区间连续的第二区间中，将标准轮(40)对基板(15)的载荷以比第一载荷高的第二载荷(S13)执行刻划动作(S14)。

Mounting plate for a wire sawing device, wire sawing device comprising the same, and wire sawing process carried out by the device

装置(1)用钢丝锯切安装在支承台(20)上的要被锯开的物件(10)，该装置包括用来将所述要被锯开的物件(10)固定到滑架(18)上的固定装置(15、26、40)，滑架适于与所述支承台(20)上的导轨合作，所述固定装置(15、26、40)包括安装板(15)和锚固装置(26、40)，安装板(15)适于被制造成让所述要被锯开的物件(10)粘结上，而锚固装置(26、40)用于将所述安装板(15)直接锚固到所述滑架(18)上。

Method for cutting crystal boules with diamond wire

FIELD: material processing. SUBSTANCE: proposed group of inventions relates to a method for cutting at least one crystal boule using cutting wire, in particular diamond wire, to obtain crystal plates. It can be used in the field of manufacture of crystal components for watchmaking and jewelry. In particular, it relates to components installed between two parallel sides, such as watch glasses, etc. The method for cutting at least one crystal boule using diamond wire includes the determination of a boule axis, perpendicular to which cutting of at least one boule with a boule radius (RB) is performed, while the boule is moved around the main axis (DP), parallel to the boule axis (DB), wherein cutting wire is maintained in a tightly stretched state and is moved along a straight segment in a plane perpendicular to the main axis (DP). A temporary reel is manufactured that ensures the fixation of at least one boule in a required position relatively to the main axis (DP) during the entire cutting process, during which the boule axis (DB) is made with the possibility of passing along both sides of the straight segment during the cutting of at least one boule inside the temporary reel. The temporary reel is located on a consumable core formed by a longitudinal tube or cylinder, the axis of rotation of which coincides with the main axis (DP), and the radius of which is equal to the difference between eccentricity (E) and the boule radius (RB). After the preparation, each boule is attached to the consumable core, after which a connected unit is inserted in a shell, inside which the connected unit is covered by molding with coating material, which is left to harden to form a molded unit. After coating material is hardened, the molded unit is removed from the shell and held to obtain a temporary reel. The temporary reel is cut in layers, moving diamond wire radially to the specified main axis (DP), at least until a separation position in order to form billets in the form of cut ...

Cutting device

提供切削装置，在切削加工中对被加工物上作为检测对象的崩边或裂纹进行检测。该切削装置利用切削刀具(43)对保持工作台所保持的被加工物进行切削，该切削装置构成为具有：弹性波检测传感器(71)，其检测切削刀具对被加工物进行切削时所产生的弹性波；以及分析单元(76)，其按照采样时间的间隔对由弹性波检测传感器所检测的弹性波的连续的时间轴波形进行切取而进行频率分析，采样时间被设定成比切削刀具通过检查对象的崩边尺寸或裂纹尺寸所需的时间短。

Jewelry processing device with integrated polishing disc

The present invention relates to a jewelry processing apparatus with an integrated polishing disc. To this end, according to the present invention, the jewelry processing apparatus with the integrated polishing disc comprises: a post; an elevation member slidably engaged with the post to be able to rise/fall and serve as a fan, which has two horizontal holders parallel to each other; a jewelry processing tool tiltably held on holders of the elevation member; and a polishing unit which processes the jewelry engaged with a stick of a jewelry processing tool by friction. One of the holders of the elevation member additionally includes a fan-shaped angle unit which is able to identify the tilting angle of the jewelry processing tool. The polishing unit includes a polishing disc, a glow disc placed in the central area of the polishing disc to rotate along with the polishing disc, and a save disc placed on an outer edge of the glow disc to prevent the polished jewelry from invading into the polishing disc, which are integrated with each other. The present invention aims to provide a jewelry processing apparatus with an integrated polishing disc, which is able to increase processing efficiency.

Loop wire cutting machine

本发明公开了一种环线切割机，包括安装板、设置于所述安装板上的支撑架，还包括设置于所述支撑架上且用于对硬脆材料进行切割的切割装置，设置于所述安装板上且用于将硬脆材料的待切割处移动至切割位置的移动装置；本发明的有益效果是，一种环线切割机结构相对简单、更加小巧，减少了设备的占用空间；采用环线的切割线相对于长线来说，可以提高线的速度，从而提供对硬脆材料的切割效率；在切割过程中根据实际的需要进行摆动切割和转动切割，使得切割面平整，从而提高了硬脆材料切割面的质量；自动化的设备提高了切割的精准性，也提高了工作效率。

Device and method for stacking or transporting a plurality of flat substrates

一种用于堆叠大量硅晶片的装置具有直立的用于容纳大量硅晶片的机械载体，其中，硅晶片在机械载体中设置在水平的位置中。该装置具有三个相同的用于在其中引入一些硅晶片的装载箱。机械载体也具有用于装载箱的容纳装置，其中，装载箱具有用于将硅晶片堆叠式地放于其上的下部的承载面，以及大致垂直于此伸延的背侧。装载箱这样构造，使得与背侧相对的侧面以及上侧是可自由接近的。

Method for extending wafer supporting sheet

요약 없음 No summary

Supporting plate for silicon ingot slicing and manufacturing method thereof

本申请公开了一种用于硅锭切片的支撑板及其制作方法，支撑板的组成材料包括ABS塑料和SAN塑料，ABS塑料的重量份数为50～100份，SAN塑料的重量份数为0～50份。本申请中的支撑板由热塑性的ABS塑料和SAN塑料制成，支撑板的抗拉强度与弯曲强度提高，减少切割过程中崩边的情况发生，良率提高，且可以降低金刚线的断线几率；在硅片切割过程中无需降低台速，缩短切割时间，提升切割效率且降低切割能耗；并且，不掺任何无机物，可以对切割完毕后的支撑板进行回收得到回料，回料可以制成支撑板的底面回料层，避免固废垃圾的产生，绿色环保，并且本申请中的支撑板的密度低于现有的支撑板密度，支撑板的质量更轻，易于回收操作。

Cutting device

提供切削装置，能够通过一台切削装置进行晶片的完全切断和不完全切断。该切削装置包含：盒工作台，其选择性地载置收纳有环状框架与晶片为一体的框架单元的第一盒和收纳有单体的晶片的第二盒；第一搬送单元，其具有对从第一盒取出的框架单元的环状框架进行保持并搬送到卡盘工作台上的第一框架保持部和对从第二盒取出的单体的晶片进行保持并搬送到卡盘工作台上的第一晶片保持部；切削单元，其对保持在卡盘工作台上的晶片进行切削；以及第二搬送单元，其具有对切削后的框架单元的环状框架进行保持并从卡盘工作台搬送至清洗单元的第二框架保持部和对切削后的单体的晶片进行保持并从卡盘工作台搬送至清洗单元的第二晶片保持部。

Substrate layer cutting device and method

本发明涉及一种用于自动高精度切割一种材料层的设备(50)，该材料层通过脆化区域而结合在源基片上，该源基片和被切割材料层形成被切割工件，所述设备包括切割装置(531，532)和用于保持被切割工件的位置的装置(510)，其特征在于，所述切割装置包括一个刀片，其用于作用在被切割工件上。本发明还涉及用于使用该设备的方法。

Workpiece holder and method for wire sawing

The invention relates to a method and to a device for separating a workpiece (1, 21) by means of a wire saw, wherein a workpiece (1, 21) is fixed to the wire saw by means of a sawing strip (2, 22). According to the inventive method, the formation of a groove or an indentation on the separating surface, along the separating gap on the crossing of the workpiece (l, 21) on the sawing strip (2, 22) is displaced towards the edge of the separating surface or completely prevented. The workpiece (1, 21) is maintained in the wire saw during the separating process by means of a sawing strip (2, 22) in such a manner that one of the two piercing points (9; 29) is arranged on the surface of the workpiece (1; 21) and also the other (10; 30) of the two piercing points (9, 10; 29, 30) is arranged on the surface of the sawing bar (2; 22), and the piercing point which is arranged on the surface of the workpiece is the inlet side piercing point.

Wire saw and workpiece machining method employing same

와이어 절단기는 가공 롤러(45)들에 권취된 순환하는 와이어(47)를 포함한다. 와이어(47)는 가공 롤러(45)들의 회전에 의해서 가공 롤러(45)들을 따라 순환하여 소재 절단 위치에서 소재(47)를 절단한다. 와이어 절단기는 소재(49)를 세워진 상태로 소재 절단 위치에서 와이어(47) 방향으로 안내하는 공급 팔레트(67)를 포함한다. 와이어 절단기는 수용 팔레트(100)를 더 포함한다. 수용 팔레트(100)는 소재 이송 방향을 따라 소재 절단 위치의 하류측에 배치된 소재 수용 위치에 배치되어, 절단된 소재(49)를 세워진 상태로 수용한다.

Method and apparatus for the production of thin disks or films from semiconductor bodies

본 발명은 반도체 바디(1)로부터 얇은 디스크 또는 필름(3)을 제조하기 위한 방법 및 장치에 관한 것이다. 바람직하게, 레이저는 절삭 공구(2)로서 이용된다. 점 형태의 강도 프로파일보다는 선형 강도 프로파일이 생성되어 반도체 필름(3)을 절삭할 수 있도록, 상기 레이저 빔이, 적합한 광학 수단(예를 들어, 원통형 렌즈, 또는 회절성 광학 소자)을 이용하여 포커싱된다. 게다가, 파팅 라인이 반도체 바디(1)의 전체 폭을 가로질러 형성되도록 한 줄로 몇몇의 선형 강도 프로파일을 배치하는 것이 선호되며, 이에 따라 전체 절삭 선은 어느 정도 일정하게 제거될 수 있다(레이저의 반복률로). 이상적으로, 반도체 바디(1)를 대향하는 초점 레이저 빔의 주변 빔들은 반도체 바디(1)의 변부에 대해 평행하게 연장되어야 한다. 반도체 필름(3)을 대향한 측면 상에서, 절삭 공구(2)의 팁(9) 근처에서 주변 빔은 반도체 필름(3)의 곡률 반경을 따르며, 초점(절삭 공구(2)의 팁)으로부터의 거리가 증가됨에 따라 간격이 증가된다.

In-situ wafer processing system and method

An integrated wafer processing system and a method thereof is disclosed. In one embodiment, a wafer stack of sliced wafers includes a base, and a plurality of sliced wafers extending outwardly from the base, where the plurality of sliced wafers are obtained by slicing a portion of a work piece, where the base is an uncut portion which is the remaining portion of the work piece or a plate attached by welding to the plurality of sliced wafers and where the work piece is mono-crystalline or multi-crystalline silicon. Further, the wafer stack of sliced wafers are treated in-situ in cleaning and wet chemical tanks for processes such as damage etching, texturization and oxide etching and also treated in-situ in high temperature furnaces for processes such as diffusion and anti-reflection coating.

Multi axis Manufacturing Machine of Silicon

본 발명은 어느 하나의 실리콘 기재가 탑재되는 고정스테이지 및 상기 고정스테이지의 일측에 병렬 설치되며 U/V축 구동장치에 의해 평면 상의 좌표가 가변되도록 설치되어 다른 하나의 실리콘 기재가 탑재되는 서보스테이지로 구성된 작업대; 상기 작업대를 가공기 본체 정면의 전후방향으로 이송 제어하는 Y축 구동부; 상기 작업대 상부에서 2개의 실리콘 기재를 각각 동시 가공하는 2개의 스핀들이 병렬 설치되는 주축대; 상기 주축대를 가공기 본체 정면의 상하방향으로 이송 제어하는 Z축구동부; 및 상기 Z축구동부를 포함하는 주축대를 가공기 본체 정면의 좌우방향으로 이송 제어하는 X축 구동부;를 포함하며, 상기 Y축 구동부 및 X축 구동부를 이용하여 상기 고정스테이지의 가공 중심을 셋팅한 후, 상기 Y축 구동부 및 X축 구동부를 고정시킨 상태에서 상기 U/V축 구동장치를 이용하여 서보스테이지만을 상대이동함으로써, 상기 서보스테이지의 가공 중심의 미세좌표를 셋팅하는 것을 특징으로 한다.

Dicing method

본 발명은 경질소재의 다이싱방법에 관한 것으로서, 다이싱에 의한 경질소재 작업물의 절단면에 칩핑크랙파손의 발생이 생기기 어렵고, 버어의 발생이 생기기 어렵게하는 다이싱방법을 제공하며, 다이싱에 의한 경질소재 작업물의 절단후에 생성된 칩을 탄력소재 작업물고정수단에서 용이하게 분리할 수 있는 다이싱방법을 제공하고, 웨이퍼 마운트 프레임의 한면에 수지점착테이프(4)를 붙이고 웨이퍼 마운트 프레임 개구부측에서 고무판을 붙이며 고무판을 늘인후 고무판에 스프레이 고무풀을 세게 불어서 웨이퍼를 붙이고 그 위에서 분동으로 더 늘이고 웨이퍼를 고착시키고 이와같이 마운트된 웨이퍼에 다이싱을 행하며 또 웨이퍼 마운트 프레임의 한면에 수지 점착테이프를 붙이고 경질부재의 작업물을 스크린마스크 인쇄한 웨이퍼를 붙이며 이와같이 마운트된 웨이퍼로 깊게 넣어 잘라냄으로 다이싱을 행하고 작업물의 용제에 절단된 웨이퍼를 담그고, 점착제 부착고무판에서 분리하며, 웨이퍼에 스크린마스크 인쇄를 행하고 작업물을 도포하고 웨이퍼 마운트 프레임의 한면에 수지점착테이프를 붙이며 웨이퍼 마운트 프레임의 개구부측에서 두께가 있는 점착제 부착고무판을 붙이며 웨이퍼의 작업물측의 면을 점착제 부착고무판에 붙인다. 이와같이 마운트된 웨이퍼에 다이싱을 행한 후 작업물의 용제에 절단된 웨이퍼를 담그고 점착제 부착고무판에서 칩을 분리하는 것을 특징으로 한다. The present invention relates to a dicing method of a hard material, to provide a dicing method that is hard to occur chipping crack breakage on the cutting surface of the hard material workpiece by dicing, hard to generate a burr, by dicing Provides a dicing method that can be easily separated from the elastic material workpiece fixing means after the cutting of the hard material workpiece, attaching a resin adhesive tape (4) to one side of the wafer mount frame, and at the wafer mount frame opening side Apply rubber plate, stretch rubber plate, blow spray rubber paste on rubber plate and apply wafer on it, stretch it further with weights, fix wafer, dicing the mounted wafer, attach adhesive tape on one side of wafer mount frame, and hard member Attach the wafer screenmask printed on the workpiece Dicing by cutting deeply into the same mounted wafer and dipping, dipping the cut wafer in the solvent of the work piece, separating it from the pressure-sensitive adhesive rubber plate, performing screen mask printing on the wafer, applying the work piece, and resin on one side of the wafer mount frame The adhesive tape is attached and a thick adhesive adhesive rubber plate is attached at the opening side of the wafer mount frame, and the surface of the workpiece side of the wafer is attached to the ...

The generation method of wafer

提供晶片的生成方法，经济性地生成晶片。晶片的生成方法从c面露出于上表面且具有与c面垂直的c轴的六方晶单晶锭生成具有α的偏离角的晶片，具有如下的步骤：支承步骤，隔着楔角度为α的楔状部件利用支承工作台对六方晶单晶锭进行支承而使上表面相对于水平面倾斜偏离角α；改质层形成步骤，将对于六方晶单晶锭具有透过性的波长的激光束的聚光点定位在距上表面的第1深度，在与形成有偏离角α的第2方向垂直的第1方向上使聚光点和六方晶单晶锭相对地移动而对上表面照射激光束，在六方晶单晶锭的内部形成直线状的第1改质层和从第1改质层沿着c面延伸的第1裂纹；和转位步骤，使聚光点在第2方向上相对地移动而转位进给规定的量。

Workpiece cutting device and method

一种工件切削装置,包括具有一其中完全分布有超硬磨粒的镀金属表面的多个切削刀片。使切削刀片以不低于8000rpm的高速转动并且使刀片相对工件垂直或沿刀片与工件之间的一切点的法线移动来切削浸没在冷却液中的工件。冷却液可从一软管供应到切削区域。切削时,工件平行于刀片主表面且垂直于切削方向地振动。较佳地,切削刀片的一末端形成有一切口,在切削刀片之间插有隔离件,隔离件的两个主表面外圆周部形成有环状台阶部。

Wafer cutting machine

本发明公开了一种晶圆切割机，属于晶圆加工领域。一种晶圆切割机，包括：机座、切割刀具、夹具与载物台；所述夹具固定安装在所述机座上，用于夹紧固定硅棒；所述载物台设置于所述夹具的正下方，所述载物台包括外环部与中心部，所述中心部的上端面水平布置，且所述硅棒抵靠在所述中心部的上端面上，且所述硅棒沿竖直方向的投影落在所述中心部外；所述环形部围绕在所述中心部外侧且所述硅棒沿竖直方向的投影落在所述环形部上，所述环形部沿其外缘形成凸缘，所述凸缘贴合在所述硅棒的外壁，且围绕所述硅棒布置。与现有技术相比，本申请的晶圆切割机能够进行稳固的夹持，避免晶片发生破片与卷边。

apparatus for laminating tape film on the substrate and equipment for manufacturing semiconductor device including the same

본 발명은 테이프 필름 라미네이션 장치 및 그를 포함하는 반도체 소자의 제조 설비를 개시한다. 그의 장치는, 하우징과, 하우징 내에 배치되고, 기판을 수납하는 기판 홀더와, 하우징 상에 배치되고, 기판 홀더 상에 테이프 필름을 고정하는 필름 홀더와, 필름 홀더 아래의 하우징에 연결되고, 하우징 내의 공기를 배기하여 테이프 필름을 기판에 접합시키는 배기 부를 포함한다. The present invention discloses a tape film lamination apparatus and a semiconductor device manufacturing facility including the same. The apparatus includes a housing, a substrate holder disposed in the housing and accommodating a substrate, a film holder disposed on the housing and fixing a tape film on the substrate holder, and connected to the housing below the film holder, and in the housing. and an exhaust unit for evacuating air to bond the tape film to the substrate.

Silicon wafer peeling method and silicon wafer peeling apparatus

Wire drawing type cutting machine suitable for semiconductor material

本申请公开了一种适用于半导体材料的拉丝式切割机，包括：工作台；转动台，以第一轴线为轴转动连接在工作台的上方；夹装组件，包含一个夹装座和一个夹装块以用于夹装待切割的半导体材料；龙门架，固定安装在工作台的上方；滑动块，滑动连接至龙门架以使其能沿第一方向往复运动；切割丝，安装至滑动块以使其随着滑动块往沿第一方向往复滑动；驱动电机，固定安装至龙门架以驱动滑动块的往复运动；其中，转动台包括：台座和滑台，它们构成滑动连接；夹装座固定连接至滑台，夹装块与夹装座构成活动连接。本申请的有益之处在于提供了一种结构简洁可靠且能够根据具体需求进行个性化加工的适用于半导体材料的拉丝式切割机。

Apparatus of ingot slicing and method of ingot slicing

상기 와이어들을 감아서 회전시키는 롤러(roller)부; 및 상기 와이어들로 슬러리를 공급하기 위한 다수의 슬러리 홀들이 형성되는 슬러리 노즐을 포함하고, 상기 롤러부가 다수 개로 구비된다. 실시예에 따른 잉곳 절단 방법은, 잉곳을 회전시키는 단계; 및 상기 잉곳을 절단하는 단계를 포함한다.

Localization method

提供定位方法，进行被加工物的定位时的操作容易。该定位方法包含如下的步骤：拍摄步骤，对被加工物(20)上的包含目标(25)或间隔道(21)在内的区域(EA、EB)进行拍摄；直线存储步骤，对该区域内的规定的所有的直线的坐标位置进行检测并进行存储；直线登记步骤，由操作者从该所有的直线中指定登记目标内或间隔道上的特定的直线；以及定位步骤，根据通过直线登记步骤而被指定登记的直线的坐标数据，将加工单元(12)定位于间隔道上。

Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film

本发明提供既能够充分抑制芯片裂纹及毛刺的发生又能够从半导体晶片获得高合格率的半导体芯片的方法。该半导体芯片的制造方法具有以下工序：准备层叠体的工序，该层叠体顺次层叠半导体晶片、半导体用粘接膜以及切割胶带，从上述半导体晶片侧形成切槽，以使上述半导体晶片被分割为多个半导体芯片、并且上述半导体用粘接膜在厚度方向上的至少一部分不被切断而保留；以及将上述切割胶带在上述多个半导体芯片相互分离的方向上进行拉伸，由此沿着上述切槽来分割上述半导体用粘接膜的工序。上述半导体用粘接膜具有小于5％的拉伸断裂伸度，该拉伸断裂伸度小于最大负荷时的伸度的110％。

Method for cutting workpiece and workpiece holder

Die vorliegende Erfindung ist ein Verfahren zum Schneiden eines Werkstücks, das Folgendes einschließt: Messen einer Kristallachsausrichtung, während ein Werkstück mit einem Werkstückhalter gehalten wird, Einstellen des Werkstückhalters, der das Werkstück hält, auf eine Drahtsäge, so dass die gemessene Kristallachsausrichtung erhalten bleibt, anschließend Anpassen einer Ausrichtung einer geschnittenen Ebene und Drücken des Werkstücks gegen eine Drahtreihe zum Schneiden des Werkstücks, wobei der Werkstückhalter einen Gleitabschnitt, der verschiebbar ist, während das Werkstück gehalten wird, und einen Befestigungsabschnitt zum Befestigen des Gleitabschnitts einschließt, und wobei das Verfahren nach dem Messen der Kristallachsausrichtung ein Verschieben des Gleitabschnitts, so dass er zu einem Zentrum des Werkstückhalters auf eine derartige Weise bewegt wird, dass die gemessene Kristallachsausrichtung erhalten bleibt, ein Befestigen des Gleitabschnitts durch den Befestigungsabschnitt, ein Einstellen des Werkstückhalters auf die Drahtsäge, anschließend ein Anpassen der Ausrichtung der geschnittenen Ebene und ein Schneiden des Werkstücks einschließt. Infolgedessen ist ein Verfahren zum Schneiden eines Werkstücks und ein Werkstückhalter bereitgestellt, die eine Ausrichtungsmessung ermöglichen, unabhängig von der Begrenzung eines Abstands zwischen einem Ausrichtungsmessgerät und einer zu messenden Ebene, und eine Schädigung aufgrund von Verzug und ein Brechen des Werkstücks hemmen können. The present invention is a method of cutting a workpiece, including: measuring a crystal axis orientation while holding a workpiece with a workpiece holder; adjusting the workpiece holder holding the workpiece to a wire saw so that the measured crystal axis orientation is maintained; Adjusting an orientation of a cut plane and pressing the workpiece against a wire row to cut the workpiece, the workpiece holder including a sliding portion that is slidable while the workpiece is held, and a ...

Automatic wafer cutting machine

本发明公开了一种晶圆自动裁切机，包含机架，以及设置在机架上的上料机构、搬运机构、裁切机构、下料机构和排废机构；所述上料机构用于晶圆堆叠上料，搬运机构将上料机构上的晶圆送至裁切机构，裁切机构对晶圆进行裁切，裁切后的晶圆由下料机构送出，废料由排废机构送出；本方案提供了一套自动化的晶圆裁切设备，包括自动上料、搬运、裁切、下料以及排废功能；整个机器运行不需要人工干预，提高了加工效率，减少了人力，并避免了人工操作受伤的风险。

Wire sawing apparatus

실시 예의 와이어 쏘잉 장치는 잉곳을 절단하는 와이어와, 잉곳을 와이어로 운송하는 잉곳 운송부와, 와이어에 슬러리를 공급하는 노즐 및 와이어에 의해 쏘잉되는 잉곳의 상측부에 배치되어, 와이어에 의해 절단되는 잉곳의 측면으로부터 비산하는 슬러리 중 적어도 일부를 흡수하는 비산 슬러리 차단부를 포함한다.

Solar crystal bar bottom plate glue, preparation method thereof and solar crystal bar cutting method

本发明属于太阳能电池技术领域，提供了一种太阳能晶棒底板胶、其制备方法及太阳能晶棒切割方法。本发明所提供的太阳能晶棒底板胶包含主剂和固化剂，所述主剂包含环氧树脂E‑44、环氧树脂E‑51、色精、钛白粉、白炭黑和碳酸钙；所述固化剂包含低温快速固化剂FS‑5B、低温快速固化剂FS‑2B、聚硫醇、聚硫醇固化剂GPM888、环氧促进剂DMP‑30、硅烷偶联剂、邻苯二甲酸二辛酯、碳酸钙和硫脲。本发明通过改进太阳能晶棒底板胶的主剂和固化剂的组份及含量，获得了一种固化后具有高固化硬度、低脱胶温度的太阳能晶棒底板胶。

Solar-grade silicon wafer and production method thereof

本发明涉及一种太阳能级硅片及其生产方法。所述太阳能级硅片的至少一个表面上设有多个沟槽(1)。本发明通过对硅片切割工艺中回线率等参数进行改进和控制，得到了一种新的太阳能级硅片，其表面具有一定尺寸和形状的沟槽；且硅片表面无损伤、无划痕、无污点、无水渍、无污渍，尺寸均一性在一定的范围内；硅片的机械强度优良；以该硅片为基础制作的电池片光电转换效率优良；与现有的太阳能级硅片相比，该新的太阳能级硅片比表面积增大，电池片单位面积发电量也得到了显著提高。综上所述，本发明具有硅料利用率高、太阳能利用率高、工艺能耗低且环保等优点。

Ingot cutting method and wire saw

본 발명은, 복수의 와이어 가이드 사이에 나선상으로 권회된 축방향으로 주행하는 와이어로 와이어 열을 형성하고, 잉곳과 와이어의 접촉부에 가공액을 공급하면서, 와이어 열에 잉곳을 누름으로써, 잉곳을 웨이퍼상으로 절단하는 잉곳의 절단방법으로서, 와이어를 교환한 후의 1개째의 잉곳을 절단할 때의, 잉곳의 중앙부분의 절단시에 대한 절단개시부분의 절단시의 단위시간당 와이어 신선 공급량의 비율이, 와이어를 교환한 후의 2개째 이후의 잉곳을 절단할 때의 상기 비율의 1/2 이하가 되도록 제어하는 것을 특징으로 하는 잉곳의 절단방법이다. 이에 따라, 와이어를 교환한 후의 1개째와 2개째 이후의 잉곳으로부터 절출되는 웨이퍼 간의 두께편차의 불균일을 억제하는 잉곳의 절단방법 및 와이어 쏘가 제공된다. In the present invention, a wire row is formed of a wire traveling in an axial direction wound in a spiral shape between a plurality of wire guides, and the ingot is pressed into the wafer row by pressing the ingot into the wire row while supplying the processing liquid to the contact portion between the ingot and the wire. As a method of cutting an ingot to be cut, when the first ingot is cut after exchanging the wire, the ratio of the wire fresh feed amount per unit time at the time of cutting of the cutting start portion to the time of cutting the central portion of the ingot is wire. It is a method of cutting an ingot, characterized in that it is controlled to be equal to or less than 1/2 of the above ratio when cutting the second and subsequent ingots after exchanging. Accordingly, there is provided a method for cutting an ingot and a wire saw for suppressing unevenness in thickness deviation between wafers cut out from the first and second ingots after exchanging the wires.

Wire saw and method for feeding workpiece into and out of wire saw

本发明提供一种能够使生产率提高的线锯。线锯(1)是通过金属丝(53)对工件(W)进行切断的切断装置。线锯(1)具有：运送装置(4)，其包含支承工件(W)的滑块(48)，将工件(W)向加工室(R)送入以及从加工室(R)送出；加工装置(5)，其配置在加工室(R)，对工件(W)进行加工；卡紧装置(2)，其配置在加工室(R)，对工件(W)进行卡紧；升降装置(3)，其使卡紧装置(2)升降。运送装置(4)具有进行摆动的臂(46)，通过臂(46)运送工件(W)。

Jewelry processing device

The present invention relates to a jewelry processing apparatus which comprises: a first post and a second post which are engaged with a base by different heights; elevation/lowering members which are respectively and slidably engaged with each of the posts to be able to elevate and operate a fan, and which has two holders parallelly formed in a horizontal direction; a jewelry processing tool held in one of the elevation/lowering members selected in accordance with the processed surface of the jewelry to be tilted up and down; a polishing glowing unit which processes the jewelry engaged with a stick of the jewelry processing tool by friction; and a tool support assembly which supports the fan operation and the tilting operation of the jewelry processing tool held horizontally on the elevation/lowering member of the second post when processing a circumferential surface of the jewelry. The polishing glowing unit includes: a polishing disc; and a glowing disc placed in the central area of the polishing disc to rotate along with the polishing disc. The present invention aims to provide a jewelry processing apparatus which is able to increase processing efficiency.

Flange mechanism

(과제) 절삭 부스러기의 흡인과, 이른바 스커핑 현상의 발생을 억제한다. (해결 수단) 중앙에 장착공을 갖는 원반상의 기대와, 그 기대의 외주 가장자리에 형성된 절삭날을 갖는 절삭 블레이드를, 회전축이 되는 스핀들에 장착하기 위한 플랜지 기구로서, 전후 방향으로 신장되는 원기둥상의 형상이고, O 링이 장착되는 O 링 장착 홈을 전방측의 외주면에 갖는 보스부와, 그 보스부의 후방측으로부터 직경 방향 바깥쪽으로 돌출되고, 그 절삭 블레이드의 그 기대를 지지하고 전방측을 향한 지지면을 갖는 플랜지부와, 그 플랜지부의 내측에 형성되고, 스핀들의 선단부가 삽입되는 스핀들 장착공을 구비하고, 그 기대의 장착공의 직경보다 큰 외경의 O 링이 그 O 링 장착 홈에 장착된 그 보스부를 그 기대의 그 장착공에 삽입하고, 기대의 내주면에 그 O 링을 접촉시킴으로써, 그 절삭 블레이드를 지지한다. (Task) Suppression of cutting debris and the occurrence of so-called scuffing phenomenon are suppressed. (Solution means) A flange mechanism for attaching a disk-shaped base having a mounting hole in the center and a cutting blade having a cutting edge formed at the outer circumferential edge of the base to a spindle serving as a rotating shaft, and a cylindrical shape extending in the front-rear direction. And a boss portion having an O-ring mounting groove on the front side of the outer circumferential surface on which the O-ring is mounted, and a support surface protruding radially outward from the rear side of the boss portion, supporting the base of the cutting blade and facing the front side A flange portion having a, and a spindle mounting hole formed inside the flange portion and into which the tip end of the spindle is inserted, and an O-ring having an outer diameter larger than the diameter of the mounting hole of the base is mounted in the O-ring mounting groove. The boss part is inserted into the mounting hole of the base, and the O-ring is brought into contact with the inner circumferential surface of the base to support the cutting blade.

Diamond wire cutting method for crystal boules

커팅 다이아몬드 와이어 (2) 를 사용하여 크리스탈 불들 (1) 을 커팅하는 방법으로서, 이러한 불 (1) 은 메인 축선 (DP) 주위로 구동되고, 커팅 와이어 (2) 는팽팽하게 홀딩되고 전체 커팅 작업에 걸쳐 메인 축선 (DP) 에 대해 제위치에 각각의 불 (1) 을 고정하는 임시 드럼 (3) 을 통해 구동되고, 이러한 임시 드럼 (3) 은 희생 코어 (4) 에 본딩된 적어도 하나의 불 (1) 에서 코팅 재료 (7) 를 오버몰딩함으로써 제조되고, 커팅 후에 커팅된 링들 (9) 의 슬라이싱이 이어지고 상기 커팅된 링들로부터 특히 평행한 면들을 갖는 크리스탈형 플레이트들 (10) 이 특히 열을 사용하여 분리된다. A method of cutting the crystal bulls 1 using the cutting diamond wire 2, which is driven around the main axis DP, the cutting wires 2 being held tight and the entire cutting operation. Driven through a temporary drum 3 which holds each fire 1 in place over the main axis DP, which temporary drum 3 is at least one fire (bonded to the sacrificial core 4); Crystallized plates 10, produced by overmolding the coating material 7 in 1), are followed by slicing of the rings 9 cut after cutting and in particular with parallel sides from the cut rings. Are separated.

Multi-line cutting fixing device, multi-line cutting system and multi-line cutting method for small-size lens products

本申请涉及光学零件加工技术领域，具体涉及一种小尺寸透镜产品多线切割固定装置、切割系统及切割方法。本切割固定装置包括与多线切割机连接的工装板以及用于固定长条形待切割产品的靠体；工装板包括底板以及间隔固定设置在底板同一侧板面上的立柱；每个靠体的一侧表面与立柱横向一侧的侧壁固定连接，另一侧表面用于固定待切割产品，靠体的底部边缘与底板的板面平行且固定连接，且每个靠体的顶部边缘高于立柱的顶部边缘，待切割产品与靠体的固定连接位置位于靠体的顶部边缘和立柱的顶部边缘之间。本申请的小尺寸透镜产品多线切割固定装置及切割方法，可对小尺寸光洁度要求较高且含有镀膜外观的半成品进行多线切割并提高产品利用率和成品率。