СПОСОБ ПОЛУЧЕНИЯ НИКЕЛЬ-АЛМАЗНОГО ПОКРЫТИЯ

Изобретение относится к области получения композиционных покрытий, в частности никель-алмазного покрытия, и может быть использовано при обработке металлических поверхностей из алюминия, стали, меди, титана и др. Способ включает подготовку металлической поверхности, приготовление раствора с ультрадисперсными алмазами и осаждение покрытия. В способе используют водную суспензию ультрадисперсных алмазов, которую предварительно подвергают ультразвуковому диспергированию в течение 30-60 мин, а при приготовлении раствора в дистиллированной воде растворяют никель сернокислый, натрий уксуснокислый и кислоту уксусную, нагревают раствор до температуры 87-90°С. В полученный раствор вводят водную суспензию ультрадисперсных алмазов в количестве 1-5 г/л, проводят ультразвуковое диспергирование раствора в течение 5 мин, затем вводят гипофосфит натрия и тиомочевину, проводят ультразвуковое диспергирование раствора в течение 5 мин; после чего из полученного раствора, содержащего, г/л: никель сернокислый ...

ГЕРМЕТИЗАЦИЯ МИКРООТВЕРСТИЙ В МЕТАЛЛИЧЕСКИХ ПОКРЫТИЯХ, ПОЛУЧЕННЫХ ХИМИЧЕСКИМ ВОССТАНОВЛЕНИЕМ

Изобретение относится к способу герметизации микроотверстий в металлическом покрытии, полученном химическим восстановлением, включающему нанесение на подложку путем химического восстановления слоя металлического покрытия, содержащего дефекты в виде микроотверстий, допускающих гидравлическое сообщение между подложкой и окружающей средой, нанесение поверх упомянутого слоя металлического покрытия слоя отверждаемого эпоксидного герметика посредством распыления и заполнение дефектов в виде микроотверстий, причем указанный отверждаемый эпоксидный герметик имеет вязкость от 20 до 1200 сПз при температуре окружающей среды, отверждение нанесенного эпоксидного герметика для обеспечения отвержденного эпоксидного покровного слоя и удаление значительной части отвержденного эпоксидного покровного слоя для обеспечения изделия, включающего металлическое покрытие, полученное химическим восстановлением, по существу не содержащее дефектов в виде микроотверстий, допускающих гидравлическое сообщение между подложкой ...

СПОСОБ И УСТРОЙСТВО ДЛЯ ПРОИЗВОДСТВА ОПТИЧЕСКОГО ВОЛОКНА С МЕТАЛЛИЧЕСКИМ ПОКРЫТИЕМ И ПОЛУЧЕННОЕ ОПТИЧЕСКОЕ ВОЛОКНО

Группа изобретений относится к способам получения оптического волокна с металлическим покрытием. Техническим результатом является сохранение пластичности оптического волокна после термической обработки. Способ получения оптического волокна с металлическим покрытием включает подачу отрезка стекловолокна через ванну с первым раствором для нанесения на него металла посредством осаждения методом химического восстановления. После этого пропускают отрезок стекловолокна непрерывно из ванны с первым раствором в ванну со вторым раствором для нанесения на него второго металла посредством электролитического покрытия. Оптическое волокно контактирует с электродом после нанесения части второго металла. При этом в способе дополнительно каждая из ванн с первым и вторым растворами содержит емкость с впускным отверстием и выпускным отверстием, через которые проходит отрезок стекловолокна в указанную емкость и из нее. При этом соответствующий раствор вытекает из указанных впускного и выпускного отверстий.

Способ приготовления раствора для химического никелирования

Изобретение относится к области гальванотехники и может быть использовано в машиностроении, приборостроении, авиастроении и других отраслях промышленности для нанесения защитно-декоративных покрытий на металлы и сплавы. Способ приготовления раствора для химического никелирования включает растворение в воде компонентов раствора, при этом последовательно растворяют глицин и затем следующие неорганические компоненты: соль никеля в виде сульфата никеля, сульфат меди, нитрат свинца, гипофосфит натрия и аммиак. Соль никеля вводят в виде концентрированного раствора, полученного добавлением в водный раствор никелевой соли карбоната никеля из расчета 7 г/л, выдержкой в течение 18-24 часов, фильтрованием полученного концентрата через плотный бумажный или тканевый фильтр и электрохимической обработкой при катодной плотности тока 0,07-0,12 А/дм2с гофрированным металлическим катодом и никелевым анодом до прохождения 8-12 А⋅ч/л. Техническим результатом является повышение скорости осаждения покрытий и ...

СПОСОБ И УСТРОЙСТВО ДЛЯ ПРОИЗВОДСТВА ОПТИЧЕСКОГО ВОЛОКНА С МЕТАЛЛИЧЕСКИМ ПОКРЫТИЕМ И ПОЛУЧЕННОЕ ОПТИЧЕСКОЕ ВОЛОКНО

КОМПОЗИЦИЯ ДЛЯ НАНЕСЕНИЯ МЕТАЛЛИЧЕСКОГО ПОКРЫТИЯ, СОДЕРЖАЩАЯ ПОДАВЛЯЮЩИЙ АГЕНТ, ДЛЯ БЕСПУСТОТНОГО ЗАПОЛНЕНИЯ СУБМИКРОННЫХ ЭЛЕМЕНТОВ ПОВЕРХНОСТИ

... 1. Композиция, содержащая источник металлических ионов и по меньшей мере один подавляющий агент, который получают путем реакции:a) аминного соединения, содержащего активные функциональные аминогруппы,соb) смесью этиленоксида и по меньшей мере одного соединения, выбранного из С3 и С4 алкиленоксидов,где указанный подавляющий агент имеет молекулярную массу (M) 6000 г/моль или более, и где содержание этиленоксида в сополимере этиленоксида и С3-С4 алкиленоксида составляет от 30 до 70%.2. Композиция по п.1, отличающаяся тем, что молекулярная масса (M) подавляющего агента составляет от 7000 до 19000 г/моль.3. Композиция по п.2, отличающаяся тем, что молекулярная масса (M) подавляющего агента составляет от 9000 до 18000 г/моль.4. Композиция по п.1, отличающаяся тем, что металлические ионы содержат ионы меди.5. Композиция по п.1, отличающаяся тем, что аминное соединение, содержащие активные функциональные аминогруппы, содержит по меньшей мере 3 активные аминогруппы.6. Композиция по п.1, отличающаяся ...

КОМПОЗИЦИИ ДЛЯ НАНЕСЕНИЯ МЕТАЛЛИЧЕСКОГО ПОКРЫТИЯ, СОДЕРЖАЩАЯ ПОДАВЛЯЮЩИЙ АГЕНТ, ДЛЯ БЕСПУСТОТНОГО ЗАПОЛНЕНИЯ СУБМИКРОННЫХ ЭЛЕМЕНТОВ ПОВЕРХНОСТИ

... 1. Способ электролитического осаждения меди на подложку, содержащую элементы поверхности субмикрометрового размера, имеющие размер отверстия 30 нанометров или менее, где способ содержит:а) контакт электролитической ванны для осаждения меди, содержащей источник ионов меди, один или более ускоряющих агентов и один или более подавляющих агентов, выбранных из соединений формулы Iгде каждый радикал Rнезависимо выбирается из сополимера этиленоксида и по меньшей мере еще одного С3-С4 алкиленоксида, причем указанный сополимер представляет собой случайный сополимер,каждый радикал Rнезависимо выбирается из Rили алкила,Х и Y независимо представляют собой спейсерные группы, причем Х имеет независимые значения для каждой повторяющейся единицы, выбранные из С1-С6 алкилена и Z-(O-Z), где каждый радикал Z независимо выбирается из С2-С6 алкилена,n представляет собой целое число, больше или равное 0,m представляет собой целое число, больше или равное 1, в частности m равно 1-10,- содержание этиленоксида ...

Kunststoffprodukt, Verwendung des Kunststoffprodukts und Verfahren zum teilweisen Beschichten eines Kunststoffes

Vorrichtung mit einem wasserhaltigen Fluid ausgesetzten Komponenten

Vorrichtung mit mindestens zwei Komponenten (2, 4, 6, 8), von denen mindestens eine Komponente (2, 4, 6, 8) zumindest teilweise einem wasserhaltigen Fluid, wie einem HFC-Fluid, ausgesetzt ist und in einem Gehäuse (2) als einer weiteren Komponente festlegbar ist, wobei aus Stahlmaterialien gebildete- Komponenten (4, 6, 8), die sowohl mit dem Fluid als auch mit der Umgebungsluft oder Stickstoff in Kontakt sind (Fig. 1), chemisch vernickelt sind;- Komponenten (2, 4, 6, 8), die vollständig mit dem Fluid in Kontakt sind, insbesondere statisch verbaut sind und Spalte (7) von insbesondere- < 0,5 mm oder Abdichtungen (5) zum benachbarten Bauteil (4, 6) aufweisen (Fig. 2 und 2a), zinkphosphatiert sind;- Komponenten (4, 6), die vollständig mit dem Fluid in Kontakt und zumindest in einem Betriebszustand von dem Fluid vollständig umspült sind (Fig. 3), blank belassen sind; und- Komponenten (2), die aus Aluminiummaterialien bestehen, eloxiert sind.

Textile Materials having Durable Antistatic Properties

... 1,196,078. Metallizing textiles. TEIJIN Ltd. May 17, 1968, No 23739/68. Heading C7F. [Also in Division D1] A textile material having anti-static properties comprises organic textile fibres and a minor amount of electrically-conductive fibres, each electricallyconductive fibre comprising a substrate of organic synthetic fibre and a metallic coating chemically deposited thereon, and possessing the functional properties of a textile fibre. The proportion of coated fibres may vary from 0À01 to 10 per cent by weight. The thickness of the metallic coating may vary from 0À01 to 1À5 microns. The metallic coating may be protected by a coating of organic polymeric material. Said substrate is preferebly one acrylic polymer having an acoylonitrile content of at least 80 Mol per cent, but may be a polyester having an ethylene terephthalate content of at least 80 mol per cent. The substrate fibre can have a textile denier of from 1 to 50 deniers. The material may be in the form of yarn, string, cord, ...

METAL SURFACE TREATMENT

Zinc-base plated steel is treated with an aqueous composition containing 200ppm Ni<2+> and NH3 in a molar amount of at least 6 times the amount of Ni<2+> and having a pH of less than 11.0 to provide a coating of Ni or Ni compound, prior to phosphating to improve the corrosion resistance. The Ni<2+> is preferably present in an amount of less than 100g/l and the NH3 is preferably present in an amount of less than 300g/l. Particularly preferred amounts of Ni<2+> and NH3 are 5-50g/l and 10-100g/l respectively. The composition may be applied by dipping or spraying, or alternatively the composition may be applied by an electrolytic treatment method. The coated surface may be subsequently conversion coated, preferably by phosphating, or painted.

IMPROVEMENTS RELATED TO COATINGS

Improvements in or relating to Electroless Metal Plating

... 1,193,823. Thiourea complexes. SILVERCROWN Ltd. 21 July, 1967 [1 Aug., 1966], No. 34468/66. Heading C2C. [Also in Division C7] An electroless plating bath for depositing a metal, e.g. Cu, Ag, Au, Pd, Pt, Rh, Ni, Sn, Cd, Pb or Hg, on a substrate, e.g. a copper printed circuit, comprises a complex compound of the metal with thiourea formed prior to adding to the bath. Citrates, acetates, tartrates, and phosphates of potassium, sodium, lithium or ammonium may be added to the bath. Examples of the complex compounds are (1) tris-thiourea-aurous chloride formed by reacting three moles of thiourea with one of a gold salt, (2) bis-thiourea-aurous chloride prepared from aqueous sodium gold chloride and thiourea, (3) thiourea-aurous oxide and hydroxide (4) bis-thiourea-aurous nitrate, (5) bis-thiourea-aurous bromide, (6) trithiourea copper chloride, (7) thiourea copper sulphate, (8) thiourea copper nitrate, (9) tetrathiourea argentous nitrate (10)trithiourea argentous chloride, (11) thiourea argentous ...

VERFAHREN UND VORRICHTUNG ZUR OBERFLAECHENBEHANDLUNG VON FLAECHIGEN WERKSTUECKEN

SURFACE TREATMENTS FOR SPIRAL AND TAPERED GEAR UNITS

LEAD FREE CHEMICAL NICKEL ALLOY

SOLUTION TO THE DEAD NICKEL PLATING

ELECTROLESS-PLATING SOLUTION, METHOD OF ELECTROLESS PLATING WITH THE SAME, AND OBJECT PLATED BY ELECTROLESS PLATING

Low friction coatings for use in dental and medical devices

The present invention provides an article, at least part of it being coated by inorganic fullerene-like (IF) nanoparticles or composite containing such nanoparticles. Preferably, the invention provides an article made of metal, for use in dentistry or medicine e.g. archwire, needle or catheter, having a friction-reducing film, and methods for coating such articles with a friction-reducing film.

Processing method of creating rainbow color, method of manufacturing article which presents rainbow-coloured reflective luster, and article which presents rainbow-coloured reflective luster

PROCESS FOR PROVIDING METALLIC ARTICLES AND THE LIKE WITH WEAR-RESISTANT COATINGS, AND IMPROVED COATED METALLIC ARTICLES AND THE LIKE

THIN FILM COATING LAYER COMPOSITION AND COATING METHOD

Provided is a coating layer composition used for coating a polyester fibre thin film, a polyimide thin film, a polyvinyl chloride thin film, a semi-embossed thin film and a polyvinyl chloride thin film analogue, said composition comprising: poly(4-vinylpyridine), SU-8, and a solvent such as isopropyl alcohol or 1,4-dioxane. Also provided is a solution-based coating method, said method rapidly performing surface modification on various types of materials, fixing transition metal ions by providing a sufficient amount of pyridine ligands, forming an adhesion promoting layer located between a substrate and a deposited metal, and thereby catalysing chemically plated copper and other metals for surface metallisation.

PROCESS FOR THE DIRECT METAL-PLATING OF A PLASTIC SUBSTRATE

A process for direct metal-plating of a plastic substrate (14). The process comprises the steps of: (i) activating a surface of modified polyolefin substrate to produce an active surface (16), the active surface (16) having at least about 7 % of carbon atoms in the form of carbonyl; (ii) electrochemically depositing metal layer (18) on the active surface (16).

SUBMERSIBLE PUMP COMPONENT, SUBMERSIBLE PUMP AND METHOD OF COATING A COMPONENT

A submersible pump component is provided. The component includes a substrate including an outer surface in a plurality of orientations, wherein a first portion of the outer surface is configured to be worn by a first wear mechanism, and a second portion of said outer surface is configured to be worn by a second wear mechanism. The component also includes at least one layer of a first coating applied to the outer surface, and at least one layer of a second coating applied over said first coating at said second portion of said outer surface. The first coating is configured to inhibit the first wear mechanism at the first portion of the outer surface, and the second coating is configured to inhibit the second wear mechanism at the second portion of the outer surface.

GAS PERMEABLE ELECTRODES AND ELECTROCHEMICAL CELLS

An electrode for a water splitting device, the electrode comprising a gas permeable material, a second material, for example a further gas permeable material, a spacer layer positioned between the gas permeable material and the second material, the spacer layer providing a gas collection layer and a conducting layer. The conducting layer can be provided adjacent to or at least partially within the gas permeable material. The gas collection layer is able to transport gas internally in the electrode. The gas permeable materials can be gas permeable membranes. Also disclosed are electrochemical cells using such an electrode as the cathode and/or anode, and methods for bringing about gas-to- liquid or liquid-to-gas transformations, for example for producing hydrogen.

METHOD FOR PRODUCING A CHROMIUM COATING ON A METAL SUBSTRATE

In the method for producing a trivalent chromium based coating on a metal substrate,a layer of nickel phosphorus alloy is deposited on a metal substrateanda trivalent chromium layer is electroplated on the Ni-P layer. The coated metal substrate is subjected to one or more heat treatments to harden the coating and to produce multiphase layers including at least one layer containing crystalline Ni and crystalline Ni 3 P, and at least one layer containing crystalline Cr and crystal- line CrNi.By using this method it is possible to pro- duce coatings having a Vickers microhardness value higher than 2000 HV.

OPTICAL FIBER CABLE COATED WITH CONDUCTIVE METAL COATING AND PROCESS THEREFOR

... 24 Disclosed is an optical fiber cable free from a generation of a microbent during manufacturing, and in which an impregnation of hydrogen and/or water to a cladding is prevented, and having an electrical conduction, a tolerance to heat and a mechanical strength, and a process for making same. The optical fiber cable includes a silica based glass optical fiber including a core and a cladding, a thin carbon coating formed on an outer surface of the optical fiber, and an electrically conductive coating formed on an outer surface of the carbon coating. The carbon coating functions as a layer for preventing the impregnation of hydrogen and/or water to the optical fiber, and the conductive coating functions as a heat tolerance member, a conductive member, and a mechanical support member. The carbon coating is preferably formed as an amorphous carbon layer. Preferably, the conductive coating can be materials having a good contact with the carbon coating, a high conductivity, a high heat tolerance ...

METHOD FOR METALLIZING DIELECTRIC SURFACES CONTAINING A METAL

... "Method for metallizing dielectric surfaces containing a metal" The method for metallizing a dielectric surface according to the invention is carried out in two successive steps. The first step consists of irradiating the surface of the dielectric material by a previously adjusted laser beam (wave length, energy, energy density, irradiation time). The second step consists of immersing the piece of dielectric material after the irradiation into an autocatalytic bath containing the metal that one wishes to deposit. This deposit is formed by electroless plating only in the irradiated zones and follows exactly the geometrical profile of these zones. The remaining part of the surface, which has not been irradiated, is not coated by metal during the immersion into the bath. The characteristics of the metal deposit (thickness, profile, structure) are completely controlled by the irradiation characteristics and by the characteristics of the dielectric material and of the autocatalytic bath.

Verfahren zur Herstellung von Metallpulver.

Verfahren zum Überziehen einer Glasfläche mit einer Grundschicht aus Palladium

Spin rotor for an open lp spin machine and procedure for its coating.

PROCEDURE FOR THE METALLIZATION OF SURFACES OF FLAT ARTICLES AND DEVICE FOR THE EXECUTION OF THIS PROCEDURE.

Diamond-coated blade.

Eine Rakel (200), insbesondere zum Abrakeln von Druckfarbe von einer Oberfläche einer Druckform und/oder zur Verwendung als Papierstreichmesser, umfasst einen flachen und länglichen Grundkörper (211) mit einem in einer longitudinalen Richtung ausgebildeten Arbeitskantenbereich (213), wobei wenigstens der Arbeitskantenbereich (213) mit einer ersten Beschichtung (220) auf der Basis einer Nickel-Phosphor-Legierung überzogen ist. Die Rakel (200) zeichnet sich dadurch aus, dass in der ersten Beschichtung (220) monokristalline und/oder polykristalline Diamantpartikel (220.1) dispergiert sind, wobei eine Partikelgrösse der Diamantpartikel (220.1) wenigstens 5 nm und weniger als 50 nm misst.

Process for coat treatment of the gripping surface of a gripping tool and gripping tool

Ein Verfahren zur Überzugsbehandlung einer Greiffläche eines Greifwerkzeugs enthält: das provisorische und gleichmässige Fixieren mehrerer erster Diamantkörner (4) mit gleichförmigem ersten Korndurchmesser derart, dass Spitzen der ersten Diamantkörner (4) ausgerichtet werden können; Befestigen der ersten Diamantkörner (4) durch Aufbringen von nickelhaltigem Metall an einer Greiffläche in gleichmässiger Dicke, die den ersten Korndurchmesser nicht übersteigt, nachdem die ersten Diamantkörner (4) provisorisch fixiert wurden; Platzieren mehrerer zweiter Diamantkörner (11) mit einem zweiten Korndurchmesser kleiner als der erste Korndurchmesser an einer Metallfläche der Greiffläche, an der sich keine ersten Diamantkörner (4) befinden, und die gebildet ist durch Aufbringen eines nickelhaltigen Metalls, nachdem die ersten Diamantkörner (4) fixiert wurden; und Befestigen der zweiten Diamantkörner durch weiteres Aufbringen eines nickelhaltigen Metalls in einer zweiten Überzugslösung auf der Metallfläche ...

Method for coating the gripping surface of a gripping tool and gripping tool

Ein Verfahren zur Überzugsbehandlung einer Greiffläche eines Greifwerkzeugs enthält: das provisorische und gleichmäßige Fixieren mehrerer erster Diamantkörner (4) mit gleichfrörmigem ersten Korndurchmesser derart, dass Spitzen der ersten Diamantkörne (4) ausgerichtet werden können; Befestigen der ersten Diamantkörner (4) durch Aufbringen von nickelhaltigem Metall an einer Greiffläche in gleichmäßiger Dicke, die dan ersten Korndurchmesser nicht übersteigt, nachdem die ersten Diamantkörner (4) provisorisch fixiert wurden; Platzieren mehrere zweiter Diamantkörner (11) mit einem zweiten Korndurchmesser kleiner als der erste Korndurchmesser an einer Metallfläche der Greiffläche, an der sich keine ersten Diamantkörner (4) befinden, und die gebildet ist durch Aufbringen eines nickelhaltigen Metalls, nachdem die ersten Diamantkörner (4) fixiert wurden; und Befestigen der zweiten Diamantkörner durch weiteres Aufbringen eines nickelhaltigen Metalls in einer zweiten Überzugstösung auf der Metallfläche ...

SUPPORT FOR TUBULAR COMPONENT, COVERED WITH DEPOSITED LAYER OF COMPOSITE MATERIAL BASED ON METAL, AND METHOD OF ITS MANUFACTURING

ABUTMENT FOR A TUBULAR COMPONENT OVERLAID WITH A METALLIC COMPOSITE DEPOSIT AND METHOD FOR MAKING IT

METHOD OF PRODUCING CHROMIUM COATING ON METAL SUBSTRATE

Plating method

Predrying polyimide film for accepting metallic coatings - for mfr. of double sided memory circuit components

PROCEDE ET APPAREIL POUR LA COMMANDE DE BAINS UTILISES POUR LES REVETEMENTS PAR VOIE NON ELECTROLYTIQUE

PROCEDE ET APPAREIL POUR LA COMMANDE DE BAINS UTILISES POUR LES REVETEMENTS PAR VOIE NON-ELECTROLYTIQUE. LE PROCEDE DE LA PRESENTE INVENTION CONSISTE A MESURER AVEC LE SYSTEME 3 LA CONCENTRATION D'AU MOINS UN INGREDIENT CONSOMMABLE D'UN BAIN 2 POUR REVETEMENTS PAR VOIE NON-ELECTROLYTIQUE, A AJOUTER AUTOMATIQUEMENT A CE BAIN UNE PREMIERE COMPOSITION DE RECHARGE DU RESERVOIR 21 CONTENANT UN INGREDIENT CONSOMMABLE APRES AVOIR DETERMINE AVEC LE SYSTEME 4 LE DEGRE DE VIEILLISSEMENT DU BAIN PRECITE, ON DECHARGE PAR LE TUYAU 69 AUTOMATIQUEMENT UN VOLUME PREDETERMINE DU BAIN 2 ET ON AJOUTE AUTOMATIQUEMENT A CE BAIN UNE SECONDE COMPOSITION DE RECHARGE DU RESERVOIR 64, CONTENANT LES INGREDIENTS NON CONSOMMABLES, A LA QUANTITE PERDUE. LA PRESENTE INVENTION DECRIT EGALEMENT L'APPAREIL UTILISABLE DANS CE PROCEDE. APPLICATION DU PROCEDE ET DE L'APPAREIL A LA COMMANDE D'UN BAIN DE NICKELAGE PAR VOIE NON-ELECTROLYTIQUE.

Application of protective metal coatings on refractory metals

Application of a chemical nickel coating on an aluminum alloy substrate used in the production of motor vehicle engine parts includes acid etching and pre-deposition of nickel to form a nickel underlayer on the substrate

Procédé d'application d'un revêtement chimique de nickel sur un substrat en alliage, à concentration majoritaire en aluminium, comprenant une phase de préparation du substrat, suivie d'une étape de nickelage proprement dite. Au cours des étapes de préparation du substrat : - on procède à un décapage du substrat en le plongeant dans une solution de décapage comprenant un mélange d'acide fluorhydrique et d'acide chlorhydrique, à température ambiante, durant 20 à 45 secondes, - on procède à un pré-dépôt de nickel sur le substrat, afin d'obtenir une sous-couche étanche de nickel.

ELECTRIC IRONS OR IRONING MACHINES

SOLUTION AND PROCEEDED Of ACTIVATION OF the SURFACE Of a SEMICONDUCTOR SUBSTRATE

La présente invention a pour objet une solution et un procédé d'activation de la surface d'un substrat comportant au moins une zone constituée d'un polymère, en vue de son recouvrement ultérieur par une couche métallique déposée par voie electroless. Selon l'invention, cette composition contient : A) un activateur constitué d'un ou plusieurs complexes de palladium ; B) un liant constitué d'un ou plusieurs composés organiques choisis parmi les composés comportant au moins deux fonctions glycidyle et au moins deux fonctions isocyanate ; C) un système solvant constitué d'un ou plusieurs solvants aptes à solubiliser ledit activateur et ledit liant. Application : Fabrication de dispositifs électroniques tels, qu'en particulier, des circuits intégrés notamment en trois dimensions.

ELECTROLESS NICKEL PLATING ON A NONCONDUCTIVE SUBSTRATE

도금 처리 장치, 도금 처리 방법 및 기억 매체

... 도금액 중의 암모니아 성분의 농도를 일정하게 유지하여 도금액을 순환하여 사용할 수 있는 도금 처리 장치를 제공한다. 도금 처리 장치(20)는, 기판(2)을 회전 보지하는 기판 회전 보지 기구(110)와, 기판(2)으로 도금액(35)을 공급하는 도금액 공급 기구(30)를 구비하고 있다. 이 중 도금액 공급 기구(30)는, 기판(2)으로 공급되는 도금액(35)을 저류하는 공급 탱크(31)와, 도금액(35)을 기판(2)에 토출하는 토출 노즐(32)과, 공급 탱크(31)의 도금액(35)을 토출 노즐(32)로 공급하는 도금액 공급관(33)을 가지고 있다. 또한 공급 탱크(31)에는, 암모니아 가스 저류부(170)가 접속되고, 공급 탱크(31)에 저류된 도금액(35) 중의 암모니아 성분의 농도를 목적의 농도 범위로 유지한다.

method for nickel-gold plating and printed circuit board

METAL-COATED CUBIC BORON NITRIDE ABRASIVE GRAINS AND METHOD FOR PRODUCING THEREOF, AND RESIN-BONDED GRINDSTONE

알루미늄판

... 양호한 도포성과 프리도프 특성을 갖는 알루미늄판을 제공하는 것을 과제로 한다. 두께 방향으로 관통하는 복수의 관통 구멍을 갖는 알루미늄판에 있어서, 관통 구멍의 평균 개구 직경이 1μm~100μm이고, 관통 구멍의 밀도가 50개/mm2~2000개/mm2이며, 인접하는 관통 구멍의 구멍 간 거리가 300μm 이하이다.

RECOVERY METHOD OF NICKEL FROM SPENT ELECTROLESS NICKEL PLATING SOLUTIONS BY ELECTROLYSIS

LIGHT-ABSORBING MEMBER AND METHOD FOR PRODUCING THE SAME

Disclosed is a light-absorbing member wherein a black lower layer containing nickel and/or cobalt and an upper layer containing an oxide of at least one element selected from aluminum, magnesium and zinc are formed on a surface containing zinc and/or aluminum. Also disclosed is a method for producing such a light-absorbing member. In this light-absorbing member, a coating film exhibiting high light absorption and excellent wear resistance is formed on a metal material surface which is composed of zinc or an aluminum alloy. COPYRIGHT KIPO & WIPO 2010 ...

TUNGSTEN CARBIDE COATED METAL COMPONENT OF A PLASMA REACTOR CHAMBER AND METHOD OF COATING

집적 회로 패키지 기판

... 본 개시 내용의 실시예는 이중 표면 마감 패키지 기판 어셈블리를 위한 기술 및 구성에 관한 것이다. 일 실시예에서, 방법은 패키지 기판의 제1 측부 상에 제1 라미네이션층을 증착 및 패키지 기판의 제2 측부 상에 배치된 하나 이상의 전기 콘택트 상에 제1 표면 마감재를 증착하고, 패키지 기판의 제1 측부로부터 제1 라미네이션층을 제거하고, 패키지 기판의 제2 측부 상에 제2 라미네이션층을 증착 및 패키지 기판의 제1 측부 상에 배치된 하나 이상의 전기 콘택트 상에 제2 표면 마감재를 증착하고, 패키지 기판의 제2 측부로부터 제2 라미네이션층을 제거하는 것을 포함한다. 다른 실시예들이 기술되고/되거나 청구될 수 있다.

Method of electroless plating

formulation for use nip polymeric materials prior to coating thereof

Plated lead frame including doped silver layer

A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.

Electroless deposition of cobalt alloys

Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt (II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.

Metal duplex and method

Forming method of soldering metal layer for optical fiber array base

The present invention is related to a forming method of the soldering metal layer for optical fiber array base. At first, plural optical fiber array bases having v-shaped grooves are formed on the surface of the substrate (such as silicon substrate or pyrex glass) as shown in figure 1. Then, a soldering metal layer is formed on the entire surface of substrate through the use of chemical deposition method. After that, a dicing process is conducted to form plural optical fiber bases having the soldering metal layer. The method for chemically depositing the metal layer contains the following steps: forming plural grooves on one surface of the substrate; depositing a layer of nickel/chrome (Ni/Cr) or aluminum metal through vapor deposition or sputtering deposition method in the environment containing inert gas; processing the substrate surface, which has plural grooves, through the use of the sensitization solution containing deionized (DI) water and SnCl2; processing the sensitized substrate ...

DIAMOND-COATED DOCTOR BLADE

A doctor blade (100, 200), particularly for wiping printing ink off a surface of a printing plate and/or for use as a paper doctor knife, has a flat and elongated main body (111, 211) including a working edge region (113, 213) configured in a longitudinal direction, wherein at least the working edge region (113, 213) is covered with a first coating (120, 220) on the basis of a nickel-phosphorus alloy. The doctor blade (100, 200) is characterized in that monocrystalline and/or polycrystalline diamond particles (120.1, 220.1) are dispersed in the first coating (120, 220), wherein a particle sizes of the diamond particles (120.1, 220.1) measure at least 5 nm and less than 50 nm.

METHOD FOR FORMING CORROSION RESISTANT PLATING LAYER AND ROTATING MACHINE

Provided is a method for forming a plating layer having excellent corrosion resistance by sealing a penetrating pinhole formed on an electroless plating layer. The method is provided with a first plating step of performing electroless Ni-P plating on a base material (1); an etching step of etching the surface of a first plating layer (3) formed in the first plating step; and a second plating step of forming a second plating layer (5) by performing electroless Ni-P plating on the first plating layer (3) processed by the etching step.

METHOD AND APPARATUS FOR DOWNHOLE PIPE OR CASING REPAIR

A downhole pipe or casing repair method and apparatus (10) includes a corrosion monitoring tool adapted for examining an interior of a pipe or tubing or casing (16) to create a record of the condition of said interior of said pipe, a surface treatment apparatus for cleaning said interior of said pipe, a plating apparatus for plating a new surface over the interior of said pipe after the surface treatment apparatus cleans the interior of said pipe, a packer sealing apparatus for sealing the surface treatment apparatus from the corrosion monitoring tool (14), and another packer sealing apparatus for sealing the plating apparatus from the surface treatment apparatus (18). The corrosion monitoring tool will examine the interior of the pipe, the surface treatment apparatus will clean the interior of the pipe, the plating apparatus (20) will plate a new surface over the newly cleaned interior of the pipe, and the corrosion monitoring tool will re-examine the interior of the pipe after the plating ...

DECORATIVE BEVERAGE CAN BODIES

A process of producing an aluminum beverage can body having a decorative surface exhibiting a dichroic effect when observed in white light. In the process, a can body is formed from a sheet of metal selected from the group consisting of aluminum and aluminum alloy by drawing and ironing, surfaces of the can body are cleaned to produce a cleaned can body, a decorative structure exhibiting a dichroic effect is applied to a surface of the cleaned can body, and the can body is subjected to finishing operations, wherein the decorative structure is applied by the steps of: applying a layer of dielectric material directly onto the metal of the cleaned can body without pre-treatment of the metal with a metal brightener, and forming a semi-transparent metal layer on or within said dielectric layer, the thickness of said dielectric material beneath said semi-transparent metal layer, and the thickness of said semi-transparent metal layer being made effective to produce a visible dichroic pattern when ...

METHOD AND PROCESS OF MANUFACTURING ROBUST HIGH TEMPERATURE SOLDER JOINTS

The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180°C and 220°C and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.

TRANSISTOR MANUFACTURING METHOD AND TRANSISTOR

A transistor manufacturing method includes: forming a first insulator layer of which formation material is a fluorine-containing resin, on a substrate having a source electrode, a drain electrode, and a semiconductor layer so as to cover the semiconductor layer; forming a second insulator layer to cover the first insulator layer; forming a base film on at least part of a surface of the second insulator layer; and after depositing a metal which is an electroless plating catalyst on a surface of the base film, forming a gate electrode on the surface of the base film by electroless plating, wherein the forming of the base film is performed by applying a liquid substance which is a formation material of the base film to the surface of the second insulator layer, and the second insulator layer has a higher lyophilic property with respect to the liquid substance than the first insulator layer.

Metal duplex method

Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.

Process for the preparation of the surface of a uranium and titanium alloy member, particularly with a view to chemical nickel plating

This invention relates to a process for the preparation of a surface of a uranium and titanium alloy, and more specifically to etching the surface of said alloy for purposes of preparing said surface for nickel plating. More specifically, the process comprises chemically etching the surface of the uranium and titanium alloy with a solution comprising lithium chloride and hydrochloric acid. The process of this invention further provides for recovering the uranium dissolved in the etching solution and recycling said solution. The uranium is recovered from the etching solution by means of an ion exchange resin with the etching solution being recycled to the etching process.

USING STABILIZERS IN ELECTROLESS SOLUTIONS TO INHIBIT PLATING OF FUSES

The present invention relates to a method of forming a metal feature on an intermediate structure of a semiconductor device that comprises a first exposed metal structure and a second exposed metal structure. The metal feature is selectively formed on the first exposed metal structure without forming on the second exposed metal structure. By adjusting a concentration of stabilizer in an electroless plating solution, the metal feature is electrolessly plated on the first exposed metal structure without plating metal on the second exposed metal structure.

Probe card assembly and kit, and methods of using same

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly thereto (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's ...

PLATING CATALYST AND METHOD

Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Methods of bonding pure rhenium to a substrate

Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.

Pretreatment of plastic surfaces for metallization to improve adhesion

The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methods and may be used in those industrial fields where decorative or functional metallic coatings on top of the plastic surfaces are needed. The purpose of the proposed invention is a high-quality adhesional pretreatment of plastic surface prior to metallization. The purpose is achieved by treating the plastic before to etch it 5-15 min at 50-70° C. in the alcaline permanganic solution containing 1-3M NaOH and 0.1-0.5 M permanganate ions and acidic permanganic etching solution additionally contains 0.5-8.0 M of copper nitrate and the etching is performed at room temperature during 5-60 min.

Corrosion resistant barrier formed by vapor phase tin reflow

A copper substrate for use as a contact having Sn plating, nickel plating and Au plating overlying the substrate. A combination of Sn plating is applied over a copper substrate; nickel plating is applied over the Sn plating; and Au plating is applied over the nickel plating to form a stack. The stack is then processed by a vapor phase Sn reflow step that results in the formation of intermetallics and eliminates stannous oxide layers that may otherwise form on the tin layer. The intermetallic layers provide excellent corrosion resistance, and serve as diffusion barriers to prevent the further migration of either Ni atoms or Cu atoms into the Sn, and Sn atoms outwardly into either the Ni or the Cu. Regardless of the thickness, the interfaces are substantially free of oxides, in particular tin oxide, and not prone to delamination.

COATED SUBSTRATE SUPPORT ASSEMBLY FOR SUBSTRATE PROCESSING

Embodiments of the present disclosure generally relate to a substrate support having a two-part surface coating which reduces defect formation and back side metal contamination during substrate processing. A support body includes a body having an upper surface and a two-part coating disposed over the upper surface of the body. The two-part coating includes a first coating layer extending a first radial distance from a center of the body. The first coating layer includes at least one of a metal-containing material or alloy. The two-part coating includes a second coating layer disposed over the first coating layer. The second coating layer extends a second radial distance from the center of the body. The first radial distance is greater than the second radial distance. The second coating layer is non-metal.

SOLUTION AND PROCESS FOR ACTIVATING THE SURFACE OF A SEMICONDUCTIVE SUBSTRATE

PROCESS FOR ELECTROLESS DEPOSITION OF METALS USING HIGHLY ALKALINE PLATING BATH

ОБРАБОТОЧНАЯ ПЛАСТИНА ДЛЯ УСТРОЙСТВА ОБРАБОТКИ ОДЕЖДЫ

Настоящее изобретение обеспечивает обработочную пластину (10) для устройства (100) обработки одежды, причем обработочная пластина (10) имеет контактную поверхность (13), которая при использовании скользит по обрабатываемой одежде (200), причем контактная поверхность (13) содержит покрытие (20), содержащее металлооксидное покрытие (21), причем металлооксидное покрытие (21) содержит: первые ионы металла, выбираемые из группы, состоящей из титана (Ti), циркония (Zr), гафния (Hf), скандия (Sc) и иттрия (Y); и вторые ионы металла, выбираемые из группы, состоящей из церия (Ce), марганца (Mn) и кобальта (Co). Настоящее изобретение обеспечивает полезное свойство скольжения. 3 н. и 10 з.п. ф-лы, 4 ил., 4 табл.

КОМПОЗИЦИЯ ДЛЯ НАНЕСЕНИЯ МЕТАЛЛИЧЕСКОГО ПОКРЫТИЯ, СОДЕРЖАЩАЯ ПОДАВЛЯЮЩИЙ АГЕНТ, ДЛЯ БЕСПУСТОТНОГО ЗАПОЛНЕНИЯ СУБМИКРОННЫХ ЭЛЕМЕНТОВ

Изобретение относится к области гальванотехники и может быть использовано для изготовления полупроводников. Способ электролитического осаждения меди на подложку, содержащую элементы поверхности субмикрометрового размера, имеющие размер отверстия 30 нанометров или менее, включает: а) контактирование с подложкой электролитической ванны для осаждения меди, содержащей источник ионов меди, один или более ускоряющих агентов и один или более подавляющих агентов, выбранных из соединений формулы Iгде каждый радикал Rнезависимо выбирается из сополимера этиленоксида и по меньшей мере еще одного С3-С4 алкиленоксида, причем указанный сополимер представляет собой случайный сополимер, каждый радикал Rнезависимо выбирается из Rили алкила, Х и Y независимо представляют собой спейсерные группы, причем Х имеет независимые значения для каждой повторяющейся единицы, выбранные из С1-С6 алкилена и Z-(O-Z)m, где каждый радикал Z независимо выбирается из С2-С6 алкилена, n представляет собой целое число, больше ...

Способ химического никелирования заготовок стоматологических боров

Изобретение относится к области химического нанесения металлических покрытий и может быть использовано при изготовлении стоматологических боров из инструментальных углеродистых и высоколегированных коррозионно-стойких нержавеющих сталей. Способ включает приготовление раствора для химического осаждения никель-фосфорного покрытия, подготовку поверхности заготовок путем химического обезжиривания, промывку водой, травление, вторую промывку, химическое осаждение никель-фосфорного покрытия при температуре 85-90°С при постоянном перемешивании, третью промывку и сушку. Далее заготовки извлекают из раствора, промывают водой, ацетоном, сушат теплым воздухом при температуре 80±5°С и после помещают на 60 мин в сушильный шкаф при температуре 335°С для уплотнения никель-фосфорного покрытия. Затем проводят электрохимическое нанесение и закрепление алмазного порошка на рабочей поверхности заготовок бора. После повторяют указанную подготовку поверхности и проводят повторное химическое осаждение никель-фосфорного ...

Способ химико-каталитического нанесения кобальт-фосфорного покрытия на деталь из стали, меди или латуни

Изобретение относится к способу химико-каталитического нанесения кобальт-фосфорного покрытия на деталь из стали, меди или латуни. Проводят осаждение указанного покрытия из кобальт-фосфорного раствора для химико-каталитической обработки, содержащего CoCl2⋅6H2O и NaH2PO2. Соединяют обрабатываемую деталь с пластиной из магниевого сплава с помощью медного стержня и погружают в указанный раствор, в котором осуществляется осаждение кобальт-фосфорного покрытия при температуре 15-30°С. Обеспечивается повышение скорости нанесения покрытия при пониженных температурах и расширение диапазона составов для химического нанесения Co-P при комнатной температуре. 1 з.п. ф-лы, 1 пр.

Способ химико-каталитического нанесения никель-фосфорного покрытия на деталь из стали, меди или латуни

Изобретение относится к способу химико-каталитического нанесения никель-фосфорного покрытия на деталь из стали, меди или латуни. Соединяют обрабатываемую деталь с пластиной из магниевого сплава с помощью медного стержня и погружают в никель-фосфорный раствор для химико-каталитической обработки, содержащий NiSO4⋅7H2O и NaH2PO2. В упомянутом растворе осуществляется осаждение никель-фосфорного покрытия при температуре 15-30°С. Обеспечивается снижение температуры процесса химического никелирования и расширение диапазона составов для химического нанесения никель-фосфорного покрытия при одновременном повышении скорости и равномерности нанесения покрытия на детали больших размеров. 1 з.п. ф-лы, 2 ил., 3 пр.

ОБРАБОТОЧНАЯ ПЛАСТИНА ДЛЯ УСТРОЙСТВА ОБРАБОТКИ ОДЕЖДЫ

Bleifreie Nickellegierung

Auf einer metallischen Substratoberfläche befindliche, bleifreie Nickellegierung, enthaltend • Nickel, • Phosphor, • Bismut mit einem Anteil zwischen 0,01 Gew.-% und 0,4 Gew.-%, und • Antimon mit einem Anteil zwischen 1 Gew.-% und 4 Gew.-%, bezogen auf alle Bestandteile der Nickellegierung.

OBERFLÄCHENBEHANDLUNGEN FÜR SPIRALFÖRMIGE UND ABGESCHRÄGTE GETRIEBEEINHEITEN

WÄRMEÜBERTRÄGER MIT VERRINGERTER NEIGUNG, ABLAGERUNGEN ZU BILDEN UND VERFAHREN ZU DEREN HERSTELLUNG

Aluminide coating for a metal or metal alloy

CORROSION RESISTANT MULTILAYER PLATING.

A multilayer plating showing high corrosion resistance even at elevated temperatures includes a first or undercoat layer formed from cobalt, nickel or a cobalt or nickel alloy on the surface to be protected, and a second or overcoat layer formed on the first layer from zinc or a zinc alloy. The second layer may further be chromated.

COMPOSITION AND METHOD OF METAL SURFACE TREATMENT

PLATING ONTO ARTICLES

Process for selective metallization on insulating surfaces

Surface Microfilter

A surface microfilter membrane comprises a lamina substrate possessing through pores having a filtering dimension of no more than 10 microns; the surface of the pores being formed by a metallic plating. The metallic plating may be of nickel or nickel alloy and formed on a metal or plastic substrate. Preferably, the substrate is in the form of a net, the membrane is formed by bending and the pore openings are non-circular (e.g. slotted) in shape. A method of making the surface microfilter includes reducing the pore size of the substrate by coating it with a metal; this method forms non-tortuous pores in a seive type microfilter. Electroless plating is preferred wherein a solution is passed though the substrate under a pressure difference; ultrasonic energy may also be applied to remove gas bubbles from the pores.

Composition for forming a seed layer

PROCESS AND APPARATUS FOR PLATING ONTO ARTICLES

PROTECTION OF RAM-RODS FROM CORROSION

... 1514487 Nickel-copper ramrod coated with electroless nickel HAWKER SIDDELEY DYNAMICS Ltd 19 Sept 1975 [20 Sept 1974] 41048/74 Heading C7F The corrosion resistance of a Ni-Cu alloy ramrod is improved by an electroless coating of Ni. The coated ramrod may be heat-treated to improve the hardness and the hard strength of the coating.

Composition for metal plating comprising suppressing agent for void free submicron feature filling

A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein the R1 radicals are each independently selected from a copolymer of ethylene oxide and at least one further C3 to C4 alkylene oxide, said copolymer being a random copolymer. the R2 radicals are each independently selected from R1 or alkyl. X and Y are spacer groups independently, and X for each repeating unit independently, selected from C1 to C6 alkylen and Z—(O—Z)m wherein the Z radicals are each independently selected from C2 to C6 alkylen, n is an integer equal to or greater than 0. m is an integer equal to or greater than 1.

Composition for metal plating comprising suppressing agent for void free submicron feature filling

A composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides, said suppressing agent having a molecular weight M w of 6000 g/mol or more.

Method of manufacturing fuel system part and fuel system part

Disclosed in the present application is a method of manufacturing a fuel delivery pipe. The fuel delivery pipe includes a crude metal made of forged iron, a nickel-phosphorus plating layer formed on an inner surface of the crude metal, and a nonmetal paint film formed on an outer surface of the crude metal. The method includes the steps of: coating the outer surface of the crude metal with paint to form the paint film; machining the crude metal with the paint film formed thereon to form a machined surface inside the crude metal; and electroless plating the machined crude metal in nickel-phosphorus plating solution to form the nickel-phosphorus plating layer on the machined surface.

Metalized plastic articles and methods thereof

Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe 2 O 4-δ , Ca 0.25 Cu 0.75 TiO 3-β , and TiO 2-σ , wherein δ, β, σ denotes oxygen vacancies in corresponding accelerators and 0.05≦δ≦0.8, 0.05≦β≦0.5, and 0.05≦σ≦1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Solution and process for activating the surface of a semiconductor substrate

The present invention relates to a solution and a process for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. According to the invention, this composition contains: A) an activator formed from one or more palladium complexes; B) a binder formed from one or more organic compounds chosen from compounds comprising at least two glycidyl functions and at least two isocyanate functions; C) a solvent system formed from one or more solvents capable of dissolving said activator and said binder. Application: Manufacture of electronic devices such as, in particular, integrated circuits, especially in three dimensions.

Nano-seeding via dual surface modification of alkyl monolayer for site-controlled electroless metallization

Self-assembled-monolayer grafted seeding and electroless plating processes for patterning of metal-alloy thin films, comprising the steps of treating the surface of the substrate by organic species, covering the organic species-SAM coated surface of dielectric substrate with a template, treating the surface by vacuum plasma, immersing the substrate into an aqueous solution, removing the hydrogen from the surface of the substrate, immersing the negatively charged dielectric surface into an aqueous metal salt solutions for adsorbing metal ions, reducing the positively charged metallic cations into neutral metal particles which act as catalysts by a reducing agent, and immersing the dielectric substrate into an electroless-plating solution for deposition of metal and metal-alloy thin film patterns.

Method for forming interconnection pattern and semiconductor device

According to one embodiment, a method for forming an interconnection pattern includes forming an insulating pattern, forming a self-assembled film, and forming a conductive layer. The insulating pattern has a side surface on a major surface of a matrix. The self-assembled film has an affinity with a material of the insulating pattern on the side surface of the insulating pattern. The forming the conductive layer includes depositing a conductive material on a side surface of the self-assembled film.

Method of coating a part of a heat exchanger and heat exchanger

A method of coating an internal surface of an assembled heat exchanger is provided. The heat exchanger comprising a first passage for a first heat exchange fluid, and a second passage for a second heat exchange fluid. The first and second passages are separated by at least one heat transfer element. The heat transfer element has a first surface facing the first passage. The method comprises; pre-treating the first surface by circulating at least one pre-treatment liquid through the first passage of the heat exchanger and a pre-treatment liquid storage separate from the heat exchanger, and electroless nickel plating the first surface by circulating a solution comprising nickel ions through the first passage of the heat exchanger and a solution container separate from the heat exchanger. A heat exchanger comprising a nickel plating is also disclosed.

Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method

The present invention relates to a kit intended for the deposition of nickel or cobalt in the cavities of a semiconductor substrate intended to form through-silicon vias (TSV) for making interconnections in integrated circuits in three dimensions. The invention also relates to a method of metallization of the insulating surface of such a substrate which comprises contacting the surface with a liquid aqueous solution containing: at least one metal salt of nickel or cobalt; at least one reducing agent; at least one polymer bearing amine functions, and at least one agent stabilizing the metal ions. The step coverage of the layer of nickel or cobalt obtained can be greater than 80%, which facilitates subsequent filling of the vias with copper by electrodeposition.

Recovery method of nickel from spent electroless nickel plating solutions by electrolysis

A recovery method of nickel according to the present invention comprises pretreatment step to prepare a solution for electrolysis by adding hexanesulfonate salt to a treatment solution including nickel, and nickel recovery step to recover nickel in a metal form by electrolysis of the above solution for electrolysis. The present invention can produce nickel in high purity with simple process with low cost, and can recover and reproduce nickel in a metal form with at least 99.5% of high purity and at least 90% of recovery rate.

Decorative plated product, fitting structure, production method and fitting method

A decorative plated product includes: a base comprising contact parts having shapes that are engageable with metal fitting members; a plating layer that covers the base; and a synthetic resin layer that covers at least portions of the plating layer over the contact parts.

METHOD FOR NO-SILANE ELECTROLESS METAL DEPOSITION USING HIGH ADHESIVE CATALYST AND PRODUCT THEREFROM

A method for electroless metal deposition and an electroless metal layer included substrate are provided. The method for electroless metal deposition includes steps as follows. a) cleaning a substrate, applying a hydrofluoric acid onto the substrate; and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate; b) a catalyst layer is formed on the chemical oxide layer, wherein, the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, and c) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer. 1. A method for electroless metal deposition , comprising:a) cleaning a substrate, applying a hydrofluoric acid onto the substrate, and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate;b) forming a catalyst layer on the chemical oxide layer, wherein the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, andc) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer.2. The method for electroless metal deposition as claimed in claim 1 , wherein in the step a) claim 1 , the modifying agent is selected from the group consisting of: ozone claim 1 , nitrate claim 1 , hydrofluoric acid claim 1 , mixture of sulfuric acid and hydrogen peroxide claim 1 , and mixture of nitrate and hydrofluoric acid.3. The method for electroless metal deposition as claimed in claim 1 , wherein the step b) further includes using a protective agent and a precursor to form the catalyst layer on the chemical oxide layer claim 1 , and the protective agent and the precursor have a ...

DEVICES TO DETECT A SUBSTANCE AND METHODS OF PRODUCING SUCH A DEVICE

Devices to detect a substance and methods of producing such a device are disclosed. An example device to detect a substance includes an orifice plate defining a first chamber. A substrate is coupled to the orifice plate. The substrate includes nanostructures positioned within the first chamber. The nanostructures are to react to the substance when exposed thereto. A seal is to enclose at least a portion of the first chamber to protect the nanostructures from premature exposure. 1. A device to detect a substance , comprising:an orifice plate defining a first chamber;a substrate coupled to the orifice plate, the substrate comprising nanostructures positioned within the first chamber, the nanostructures to react to the substance when exposed thereto; anda seal to enclose at least a portion of the first chamber to protect the nanostructures from premature exposure.2. The device of claim 1 , wherein the orifice plate comprises at least one of nickel claim 1 , gold claim 1 , platinum claim 1 , palladium claim 1 , or rhodium.3. The device of claim 1 , wherein the nanostructures comprise at least one of pillar structures or conical structures.4. The device of claim 1 , wherein the orifice plate is electroplated with at least one of gold claim 1 , palladium claim 1 , or rhodium.5. The device of claim 1 , wherein the seal comprises at least one of a polymer material claim 1 , a flexible material claim 1 , or a removable material.6. The device of claim 1 , wherein the seal comprises a hermetic seal.7. The device of claim 1 , wherein the seal comprises at least one of polymer tape claim 1 , plastic claim 1 , foil claim 1 , a membrane claim 1 , wax claim 1 , or Polydimethylsiloxane.8. The device of claim 1 , wherein the substrate comprises at least one of a Surface Enhanced Raman spectroscopy substrate claim 1 , a self actuating Surface Enhanced Raman spectroscopy substrate claim 1 , an Enhanced Fluorescence spectroscopy substrate claim 1 , or an Enhanced Luminescence ...

PRETREATMENT OF PLASTIC SURFACES FOR METALLIZATION TO IMPROVE ADHESION

The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methods and may be used in those industrial fields where decorative or functional metalic coatings on top of the plastic surfaces are needed. The purpose of the proposed invention is a high-quality adhesional pretreatment of plastic surface prior to metallization. The purpose is achieved by treating the plastic before to etch it 5-15 min at 50-70° C. in the alcaline permanganic solution containing 1-3M NaOH and 0.1-0.5 M permanganate ions and acidic permanganic etching solution additionally contains 0.5-8.0 M of copper nitrate and the etching is performed at room temperature during 5-60 min. 1. A method for adhesional pretreatment of plastic surfaces prior to their metallization comprising its etching with acidic permanganic solution, characterized in that the plastic before etching is maintained 5-15 minutes at 50-70° C. in an alcaline permanganic solution containing 1-3 M NaOH and 0.1-0.5 permanganate ions while 0.5-8.0 M of copper nitrate are additionally introduced into acidic permanganic etching solution and the etching is performed at room temperature for 5-60 minutes. The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methodes and may be used in those industrial fields where decorative or functional metalic coatings on top of the plastic surfaces are needed.A conventional method of plastic surface pretreatment prior to metallization consist of etching the surface with solution containing permanganate or other Mn ions which are the etchants-oxydizers. Permanganate as oxidizing agent is commonly proposed to be used in the acidic media, because only in this case the surfaces of acrylo-nitryl-butadien-styrene copolymere (ABS), ABS mixed with polycarbonate (PC/ABS), polyetherimides (PEI) and polyetheretherketones (PEEK) are able to be ...

METHOD OF DEPOSITING A METAL LAYER ON AN ELECTRICALLY NON-CONDUCTIVE PLASTIC MEMBER, AND HOUSING FOR A MOBILE DEVICE

A method of depositing a metal layer on an electrically non-conductive plastic member includes: mixing a plastic material and a laser-sensitive additive to form a mixture, followed by injection molding the mixture to form an electrically non-conductive plastic member; irradiating a part of a surface of the electrically non-conductive plastic member with laser to engrave the electrically non-conductive plastic member so as to form a roughened region; forming an activating layer on the roughened region; and forming a metal layer on the activating layer on the roughened region of the electrically non-conductive plastic member. This method is suitable for making a housing for a mobile device. 1. A method of depositing a metal layer on an electrically non-conductive plastic member , comprising the steps of:(a) mixing a plastic material and a laser-sensitive additive to form a mixture, followed by injection molding the mixture to form an electrically non-conductive plastic member that has a surface;(b) irradiating a part of the surface of the electrically non-conductive plastic member with laser to engrave the electrically non-conductive plastic member so as to form a roughened region in the electrically non-conductive plastic member;(a) forming an activating layer on the roughened region of the electrically non-conductive plastic member for metalizing the roughened region in the electrically non-conductive plastic member; and(d) forming a metal layer on the activating layer on the roughened region of the electrically non-conductive plastic member.2. The method as claimed in claim 1 , wherein in step (c) claim 1 , the activating layer is made of palladium.3. The method as claimed in claim 2 , wherein in step (c) claim 2 , a tin-palladium alloy layer is formed on the roughened region of the electrically non-conductive plastic member by deposition claim 2 , followed by removing tin ion from the tin-palladium alloy layer by acid pickling so that palladium remains on the ...

Conductive Fine Particles and Method for Producing Conductive Fine Particles

The conductive fine particles according to the present invention each have: a core particle containing an acrylic resin; and a silver layer provided directly on the surface of the core particle directly or provided on the surface of the core particle via a nickel layer, wherein the surface coverage rate of the silver layer is 70% or higher. 1. A conductive fine particle comprising:a core particle containing an acrylic resin; anda silver layer provided on a surface of the core particle, directly or via a nickel layer, whereina surface coverage of the silver layer is 70% or more.2. The conductive fine particle according to claim 1 , wherein a number average particle diameter is 1 μm to 100 μm.3. A method for producing a conductive fine particle claim 1 , comprising:treating a core particle containing an acrylic resin with a solution containing a surfactant; andforming a silver layer on the core particle treated with the surfactant, using an electroless silver plating solution.4. The method for producing a conductive fine particle according to claim 3 , further comprising:forming a nickel layer on the core particle treated with the surfactant using an electroless nickel plating solution, before said forming silver layer.5. The method for producing a conductive fine particle according to or wherein a concentration of the surfactant is 0.5 g/L to 20 g/L.6. The method for producing a conductive fine particle according to claim 3 , wherein the surfactant is aminocarboxylate.7. The method for producing a conductive fine particle according to claim 3 , wherein the electroless silver plating solution is a non-cyan electroless silver plating solution.8. The conductive fine particle according to claim 1 , wherein there is no tin layer on the core particle.9. The conductive fine particle according to claim 1 , wherein the core particle carries a catalyst.10. The conductive fine particle according to claim 1 , wherein the catalyst comprises palladium.11. The conductive fine ...

Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more. 114.-. (canceled)15. A solder material characterized in that the solder material comprises:a spherical core that provides space between a joint object and another object to be joined to the joint object; anda solder coated layer that has a melting point at which a core layer of the core is not melted, contains Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core, whereinthe solder coated layer has an average grain diameter of crystal grains of 3 μm or less, and the solder material has a spherical diameter of 1 to 230 μm and a sphericity of 0.95 or more.16. The solder material according to claim 15 , wherein the solder coated layer contains brightener.17. The solder material according to claim 15 , wherein the core is a spherical material made of an elemental metal claim 15 , an alloy claim 15 , a metal oxide claim 15 , or a mixed metal oxide of Cu claim 15 , Ni claim 15 , Ag claim 15 , Bi claim 15 , Pb claim 15 , Al claim 15 , Sn claim 15 , Fe claim 15 , Zn claim 15 , In claim 15 , Ge claim 15 , Sb claim 15 , Co claim 15 , Mn claim 15 , Au claim 15 , Si claim 15 , Pt claim 15 , Cr claim 15 , La claim 15 , Mo claim 15 , Nb claim 15 , Pd claim 15 , Ti claim 15 , Zr claim 15 , or Mg claim 15 , or a resin.18. The solder material according to claim 15 , wherein the solder coated layer contains at least one selected from a group consisting of Cu claim 15 , Bi claim 15 , In claim 15 , Zn claim 15 , Ni claim 15 , Co ...

FUEL TANK FOR USE WITH SPACECRAFT AND MANUFACTURING METHOD THEREOF

A fuel tank for use with a spacecraft, the fuel tank being configured to store therein fuel for driving the spacecraft, includes a carbon fiber reinforced plastic layer and a metallic plating layer, the carbon fiber reinforced plastic layer has a polished surface having been subjected to polishing processing, the polished surface being on an inner side of the fuel tank, and the metallic plating layer is provided on the polished surface. 1. A fuel tank for use with a spacecraft , the fuel tank being configured to store therein fuel for driving the spacecraft , the fuel tank comprising:a carbon fiber reinforced plastic layer and a metallic plating layer,wherein the carbon fiber reinforced plastic layer has a polished surface having been subjected to polishing processing, the polished surface being on an inner side of the fuel tank, andwherein the metallic plating layer is provided on the polished surface.2. A fuel tank for use with a spacecraft , the fuel tank being configured to store therein fuel for driving the spacecraft , the fuel tank comprising:a carbon fiber reinforced plastic layer and a metallic plating layer,wherein the carbon fiber reinforced plastic layer has a polished surface having been subjected to polishing processing, the polished surface being on an inner side of the fuel tank, andwherein the metallic plating layer is provided on an outer side of the fuel tank.3. The fuel tank for use with the spacecraft claim 1 , according to claim 1 ,wherein the polishing processing is processing performed by use of a polishing instrument with a count of 200 to 2000.4. The fuel tank for use with the spacecraft claim 1 , according to claim 1 ,wherein the metallic plating layer has a thickness of 100 μm or less.5. The fuel tank for use with the spacecraft claim 1 , according to claim 1 ,wherein the metallic plating layer is formed by performing non-electrolytic nickel plating and then performing copper plating.6. A fuel tank for use with a spacecraft claim 1 , the ...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer.

ELECTROCHEMICAL STRIP AND MANUFACTURING METHOD THEREOF

An electrochemical strip is disclosed. The electrochemical strip includes a substrate and an electrode deposited on the substrate. The electrode includes a conductive paste layer, a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer. The conductive paste is made of a material selected from the group consisting of copper paste, nickel paste, silver paste, and silver-carbon paste. The first metal layer is made of a group VIII metal. The second metal layer is made of nickel. The third metal layer is made of a group VIII metal. The fourth metal layer is made of a material selected from the group consisting of palladium, gold, and platinum. 1. A manufacturing method of an electrochemical strip , comprising steps of:providing a substrate; and printing a conductive paste layer on the substrate;', 'printing a carbon layer on a first region of the conductive paste layer;', 'etching a second region excluding the first region of the conductive paste layer;', 'chemically plating a first metal layer on the second region of the conductive paste layer;', 'chemically plating a second metal layer on the first metal layer;', 'chemically plating a third metal layer on the second metal layer; and', 'chemically plating a fourth metal layer on the third metal layer;', 'wherein the first metal layer is made of a group VIII metal, the second metal layer is made of nickel (Ni), the third metal layer is made of a group VIII metal, and the fourth metal layer is made of a metal selected from the group consisting of palladium (Pd), gold (Au) and platinum (Pt)., 'disposing an electrode layer on the substrate, which comprising steps of2. The manufacturing method of the electrochemical strip as recited in claim 1 , wherein the step of providing the substrate is providing a material selected from the group consisting of polyethylene terephthalate (PET) claim 1 , polycarbonate (PC) claim 1 , polyimide claim 1 , glass fiber and phenolic resin.3. The manufacturing ...

CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH

The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 μm or less.

ENHANCED RELEASE COMPRESSION SHOE FOR USE WITH CONCRETE PRODUCT FORMING MACHINES

A compression shoe for use on a concrete products forming machine comprises a main body and a plated layer overlaid on the main body. The main body is configured to be slidingly received within a mold cavity of a concrete products mold. The plated layer overlaid on the main body of the compression shoe comprises a uniform electroless nickel (Ni), phosphorus (P), and polytetrafluoroethylene (PTFE) nano dispersion coating to effect enhanced material release characteristics by preventing the build-up of material on the compression shoes and enhancing their wear characteristics. 1. A method for forming a compression shoe for a concrete products machine comprising the steps of:providing a compression shoe having a main body configured to be slidingly received within a mold cavity of a concrete products mold; andutilizing a plated layer overlaid on the main body of the compression shoe comprising an electroless nickel (Ni), and polytetrafluoroethylene (PTFE) nano dispersion coating.2. The method of claim 1 , wherein the step of utilizing a plating layer includes forming the plated layer by co-depositing the electroless nickel simultaneously with the PTFE so that the PTFE is uniformly distributed throughout a depth of the plated layer.3. The method of claim 2 , wherein a rate of deposit on the main body is constant throughout the forming step.4. The method of claim 1 , further including the step of co-depositing a phosphorus (P) material together with the NI and PFTE materials.5. The method of claim 2 , wherein the P is co-deposited with the Ni and PTFE at an approximate 2%-13% infusion rate.6. The method of claim 2 , wherein the P is co-deposited with the Ni and PTFE at an approximate 10% infusion rate throughout the forming step.7. The method of claim 2 , further including the step of applying a heat treatment to the plating layer after the co-depositing step.8. The method of claim 7 , wherein the heat treatment is approximately 400° C.9. The method of claim 1 , wherein ...

METHOD AND APPARATUS FOR FABRICATION OF METAL-COATED OPTICAL FIBER, AND THE RESULTING OPTICAL FIBER

Method and apparatus for producing metal-coated optical fiber involves providing a length of optical fiber having a glass fiber with or without a carbon layer surrounded by a liquid-soluble polymeric coating. The optical fiber is passed through a series of solution baths such that the fiber will contact the solution in each bath for a predetermined dwell time, the series of solution baths effecting removal of the polymer coating and subsequent electroless plating of metal on the glass fiber. The optical fiber is collected after metal plating so that a selected quantity of the metal-coated optical fiber is gathered, Preferably, the glass fiber passes through the series of solution baths without contacting anything except for the respective solution in each. 1. A method for producing metal-coated optical fiber , said method comprising:(a) providing a length of optical fiber having a glass fiber surrounded by a liquid soluble polymeric coating;(b) passing said optical fiber through a series of solution baths such that the glass fiber will contact the solution in each bath for a predetermined dwell time, the series of solution baths effecting removal of said polymer coating and subsequent plating of metal on the glass fiber; and(c) collecting the optical fiber after metal plating so that a selected quantity of said metal-coated optical fiber is gathered.2. A method as set forth in claim 1 , wherein said glass fiber has a carbon layer.3. A method as set forth in claim 1 , wherein said liquid soluble polymeric coating comprises a polymeric material that is removed by a chemical solvent.4. A method as set forth in claim 3 , wherein said polymeric material that is removed by a chemical solvent comprises acrylate.5. A method as set forth in claim 1 , wherein said liquid soluble polymeric coating comprises a water soluble polymer.6. A method as set forth in claim 5 , wherein said water soluble polymer is selected from the group consisting of sodium polyacrylater claim 5 , ...

METAL AND/OR CERAMIC MICROLATTICE STRUCTURE AND ITS MANUFACTURING METHOD

A metal and/or ceramic microlattice structure, comprising an alternation of first layers and of second layers formed by tubes, and interlocking with each other in order to form open loops cooperating two by two in order to form nodes of an articulated/ball-joint nature. 11121. Metal and/or ceramic microlattice structure () , comprising an alternation of first layers (C) and of second layers (C) in a first direction (D) of the structure;{'b': 1', '2', '1', '1', '1', '2, 'each first layer (C) comprising a plurality of first tubes (.) each extending in a plane parallel to a first reference plane (P) defined by said first direction (D) of the structure as well as by a second direction (D) orthogonal to the first;'}{'b': 2', '2', '2', '2', '1', '3, 'each second layer (C) comprising a plurality of second tubes (.) each extending in a plane parallel to a second reference plane (P) defined by said first direction (D) of the structure as well as by a third direction (D) orthogonal to the first and distinct from the second;'}{'b': 2', '1', '2', '4', '4', '1', '2, 'i': a', 'b, 'each first tube (.) defining, in said second direction (D), an alternation of first and second loops (, ) open, respectively, in a first heading (S) of the first direction, and in a second heading (S) of the first direction opposite to the first;'}{'b': 2', '2', '3', '4', '4', '1', '2, 'i': c', 'd, 'each second tube (.) defining, in said third direction (D), an alternation of third and fourth loops (, ) open, respectively, in the first heading (S) of the first direction, and in the second heading (S) of the first direction;'}{'b': 4', '2', '1', '1', '4', '2', '2', '2', '2', '4', '4', '8', '1, 'i': a', 'd', 'a', 'd, 'the first and second layers being interlocking with each other in such a way that through each first open loop () of each first tube (.) of any given first layer (C), one of the fourth open loops () of one of the second tubes (.) of the second layer (C) directly consecutive to said first ...

COBALT SUBSTRATE PROCESSING SYSTEMS, APPARATUS, AND METHODS

Electronic device processing systems including cobalt deposition are described. One system includes a mainframe having a transfer chamber and at least two facets, and one or more process chambers adapted to carry out a metal reduction or metal oxide reduction process and possibly an annealing processes on substrates, and one or more deposition process chambers adapted to carry out a cobalt deposition process. Other systems includes a transfer chamber, one or more load lock process chambers coupled to the transfer chamber that are adapted to carry out a metal reduction or metal oxide reduction process. Additional methods and systems for cobalt deposition processing of substrates are described, as are numerous other aspects. 1. An electronic device processing system , comprising:a mainframe having at least one transfer chamber, and at least two facets;a first process chamber coupled to at least one of the at least two facets and adapted to carry out a metal reduction process or metal oxide reduction process on substrates; andat least one deposition process chamber coupled to another one of the at least two facets and adapted to carry out a cobalt chemical vapor deposition process on substrates.2. The electronic device processing system of claim 1 , wherein the at least one deposition process chamber comprises at least one deposition process chamber set adapted to carry out the cobalt chemical vapor deposition process.3. The electronic device processing system of claim 1 , comprising a second process chamber coupled to another facet and adapted to carry out an annealing process on the substrates.4. The electronic device processing system of claim 1 , comprising:a first mainframe having a first transfer chamber and a first plurality of facets;the first process chamber coupled to one of the plurality of facets and adapted to carry out the metal reduction process or a metal oxide reduction process on substrates;a load lock apparatus coupled to one of the first plurality ...

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD

A substrate liquid processing apparatus includes a substrate holder configured to hold a substrate; a processing liquid supply configured to supply a processing liquid to an upper surface of the substrate held by the substrate holder; a cover body configured to cover the upper surface of the substrate held by the substrate holder; and a gas supply configured to supply an inert gas to a space between the substrate held by the substrate holder and the cover body, the gas supply having a gas supply opening through which the inert gas is discharged. An opening direction of the gas supply opening is directed to a direction other than the upper surface of the substrate held by the substrate holder. 1. A substrate liquid processing apparatus , comprising:a substrate holder configured to hold a substrate;a processing liquid supply configured to supply a processing liquid to an upper surface of the substrate held by the substrate holder;a cover body configured to cover the upper surface of the substrate held by the substrate holder; anda gas supply configured to supply an inert gas to a space between the substrate held by the substrate holder and the cover body, the gas supply having a gas supply opening through which the inert gas is discharged,wherein an opening direction of the gas supply opening is directed to a direction other than the upper surface of the substrate held by the substrate holder.2. The substrate liquid processing apparatus of claim 1 ,wherein the cover body has a ceiling member extended horizontally; a sidewall member extended downwards from the ceiling member; and a heater provided in the ceiling member and configured to generate heat.3. The substrate liquid processing apparatus of claim 2 ,wherein the gas supply is provided at the sidewall member.4. The substrate liquid processing apparatus of claim 2 ,wherein the gas supply is provided at the ceiling member.5. The substrate liquid processing apparatus of claim 2 ,wherein the opening direction is ...

SHEET MATERIAL, METAL MESH, WIRING SUBSTRATE, DISPLAY DEVICE AND MANUFACTURING METHODS THEREFOR

A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer. 1. A sheet material comprising a resin layer comprising a binder and a plurality of catalyst particles; an electroless plating film provided on the side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film; and a base material provided on the side of the other main surface of the resin layer , whereinat least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the plurality of exposure surfaces are scattered on the one main surface of the resin layer,the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the plurality of exposure surfaces of the catalyst particles, andthe second electroless plating film is provided to cover the first electroless plating films, and a main surface, on the side of the first electroless plating films, of the second electroless plating film forms concave portions, respectively, along surfaces of the first electroless plating films.2. The sheet material according to claim 1 , wherein an average value of respective longest diameters of the first electroless plating films is 18 to 90 nm when the one main surface of the resin layer is viewed in a planar view from the side of the electroless plating film.3. The sheet material according to claim 1 , wherein an area ratio of the first electroless plating films to the one main surface of the resin layer is 80 to 99% when the one main surface is viewed in a planar view from the side of the electroless plating film.4. The sheet material according to claim 1 , ...

SHAFT MEMBER AND MANUFACTURING METHOD OF SHAFT MEMBER

A shaft member of an embodiment includes: a base material having a shaft shape and made of steel; a low phosphorus plating layer that is laminated on the base material, that includes phosphorus, and in which the phosphorus content is 4.5 mass % or less; and a base plating layer that is formed as an electrolytic nickel phosphorus plating layer or a high phosphorus plating layer laminated between the base material and the low phosphorus plating layer. It is thus possible to increase the strength of the shaft member and decrease the size of the shaft member. 1. A shaft member comprising:a base material having a shaft shape and made of steel;a low phosphorus plating layer that is laminated on the base material, that includes phosphorus, and in which a phosphorus content is 4.5 mass % or less; anda base plating layer that is formed as an electrolytic nickel phosphorus plating layer or a high phosphorus plating layer laminated between the base material and the low phosphorus plating layer.2. The shaft member according to claim 1 , wherein the base material is high carbon steel or high carbon alloy steel.3. The shaft member according claim 2 , wherein a carbon content of the high carbon steel or high carbon alloy steel is set to be 0.85 to 1.10 mass %.4. The shaft member according to claim 1 , wherein a thickness of the base plating layer is set to be smaller than a thickness of the low phosphorus plating layer.5. The shaft member according to claim 1 , wherein the phosphorus content of the low phosphorus plating layer is set to be 1.0 to 1.5 mass %.6. The shaft member according to claim 1 , wherein a surface of the shaft member is the low phosphorus plating layer.7. A manufacturing method of a shaft member comprising:a degreasing step of performing electroless degreasing or anodic electrolytic degreasing for a predetermined time on a base material made of steel that configures a shaft member; anda plating step of performing low phosphorus-type plating in which a ...

THREE-DIMENSIONAL COPPER NANOSTRUCTURE AND FABRICATION METHOD THEREOF

This invention relates to a method of fabricating a three-dimensional copper nanostructure, including manufacturing a specimen configured to include a SiOmask; performing multi-directional slanted plasma etching to form a three-dimensional etching structure layer on the specimen; performing plating so that a multi-directional slanted plasma etched portion of the specimen is filled with a metal; removing an over-plated portion and the SiOmask from the metal layer; and removing a portion of a surface of the specimen other than the metal which is the three-dimensional etching structure layer. In this invention, a uniform copper nanostructure array can be obtained by subjecting a large-area specimen disposed in a Faraday cage to multi-directional slanted plasma etching using high-density plasma, forming a copper film on the etched portion of the specimen, and removing an over-plated copper film and the SiOmask, and the diameter of the copper nanostructure can be arbitrarily adjusted, thus attaining high applicability. 1. A method of fabricating a three-dimensional copper nano structure , comprising:{'sub': '2', 'manufacturing a specimen configured to include a SiOmask;'}performing multi-directional slanted plasma etching to form a three-dimensional etching structure layer on the specimen;performing plating so that a multi-directional slanted plasma etched portion of the specimen is filled with a metal to form a metal layer;{'sub': '2', 'removing an over-plated portion and the SiOmask from the metal layer; and'}removing a portion of a surface of the specimen other than the metal which is the three-dimensional etching structure layer.2. The method of claim 1 , wherein the multi-directional slanted plasma etching is performed by subjecting the specimen to multi-directional slanted plasma etching using a Faraday cage.3. The method of claim 2 , wherein the multi-directional slanted plasma etching is carried out by changing an ion irradiation direction or by changing an ion ...

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH LOW DISSOLVED OXYGEN CONTENT

A roll-to-roll electroless plating system including a sump containing a first volume of a plating solution, and a pan containing a second volume of the plating solution, the second volume being less than the first volume. A web advance system advances a web of media though the plating solution in the pan, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of media. A pan-replenishing pump moves plating solution from the sump to the pan through a pipe. A distribution system injects an inert gas into the plating solution to reduce the amount of dissolved oxygen. 1. A roll-to-roll electroless plating system , comprising:a sump containing a first volume of a plating solution;a pan containing a second volume of the plating solution, the second volume being less than the first volume;a web advance system for advancing a web of media from an input roll though the plating solution in the pan along a web advance direction and to a take-up-roll, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of media as it is advanced through the plating solution in the pan;a pan-replenishing pump for moving plating solution from the sump to the pan through a pipe connected to an outlet of the pan-replenishing pump; anda distribution system for injecting an inert gas into the plating solution.2. The roll-to-roll electroless plating system of claim 1 , wherein the distribution system is configured to inject micro-bubbles of the inert gas into the plating solution claim 1 , wherein the micro-bubbles have a diameter between about one micron and one millimeter.3. The roll-to-roll electroless plating system of claim 1 , wherein the plating substance is copper claim 1 , silver claim 1 , nickel or palladium.4. The roll-to-roll electroless plating system of claim 1 , wherein the inert gas is nitrogen or argon.5. The roll-to-roll electroless plating system of claim 1 , ...

Composite plating film

An object is to provide a composite plating film excellent in the water-repellent property and oil-repellent property using a material that is less likely to accumulate in the environment, as substitute for a fluorine resin. A composite plating film is provided which includes an alloy matrix phase and a silicone dispersed in the alloy matrix phase. In the composite plating film, the silicone preferably has Hansen solubility parameters comprising a dispersion term δof 15 MPaor less, a polar term δof 3 MPaor less, and a hydrogen bonding term δof 3 MPaor less. The silicone preferably has an interaction radius of a Hansen solubility sphere of 5.0 MPaor less. 1. A composite plating film comprising:an alloy matrix phase; anda silicone dispersed in the alloy matrix phase.2. The composite plating film as recited in claim 1 , wherein the silicone has a siloxane skeleton of which a side chain group is an alkyl group.3. The composite plating film as recited in claim 1 , wherein the silicone has Hansen. solubility parameters comprising a dispersion term δof 15 MPaor less claim 1 , a polar term δof 3 MPaor less claim 1 , and a hydrogen bonding term δof 3 MPaor less.4. The composite plating film as recited in claim 1 , wherein the silicone has an interaction radius of a Hansen solubility sphere of 5.0 MPaor less.5. The composite plating film as recited in claim 1 , wherein the silicone comprises particles having a particle size of 20 micrometers or less.6. The composite plating film as recited in claim 1 , wherein the silicone is octamethylsilsesquioxane.7. The composite plating film as recited in claim 1 , wherein the silicone contained in the composite plating film has a content ratio of 3.5 mass % or more to the composite plating film as a whole as a mass percentage of Si atoms that constitute the silicone claim 1 ,8. The composite plating film as recited in claim 1 , wherein a static contact angle of water on the composite plating film is 100 degrees or more.9. The composite ...

Chemically Amplified Positive Resist Composition and Pattern Forming Process

A chemically amplified positive resist composition is provided comprising (A) a polymer adapted to tarn soluble in alkaline aqueous solution under the action, of acid, (B) a photoacid generator, (C) a car boxy lie acid, and (D) a benzotriazole compound and/or an imidazole compound. When the resist composition is coated on a copper substrate as a thick film of 5-250 μm thick and lithographically processed into a pattern, a high resolution is available and the pattern is of rectangular profile. 2. The resist composition of wherein the carboxylic acid is at least one C-Ccarboxylic acid selected from the group consisting of a saturated or unsaturated aliphatic carboxylic acid claim 1 , alicyclic carboxylic acid claim 1 , oxy carboxylic acid claim 1 , alkoxy carboxylic acid claim 1 , keto carboxylic acid claim 1 , and aromatic carboxylic acid.3. The resist composition of wherein the carboxylic acid is a dicarboxylic acid.4. The resist composition of wherein the dicarboxylic acid is a dicarboxylic acid having a saturated aliphatic alkyl chain.6. The resist composition of claim 1 , further comprising (E) an organic solvent.7. A dry film comprising a support film and a layer formed thereon from the chemically amplified positive resist composition of .8. A pattern forming process comprising the steps of forming a coating of the chemically amplified positive resist composition of or the layer of the chemically amplified positive resist composition of on a substrate claim 1 , optionally prebaking claim 1 , exposing the coating or layer to radiation or electron beam through a photomask claim 1 , optionally baking claim 1 , and developing in a developer.9. The process of wherein the step of exposing the coating or layer to radiation uses radiation with a wavelength of longer than 300 nm.10. The process of claim 8 , further comprising the step of forming a metal plating on the substrate by electroplating or electroless plating claim 8 , subsequent to the developing step. This non ...

PATTERN PLATE FOR PLATING AND METHOD FOR MANUFACTURING WIRING BOARD

A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by plating. The plating-pattern plate includes a base body and transfer parts disposed on the base body. Each of the transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating. The transfer parts are disposed electrically independent of one another on the base body. The plating-pattern plate provides a fine conductive pattern with stable quality. 1. A plating-pattern plate configured to transfer , to a substrate , a transfer pattern formed by plating , the plating-pattern plate comprising:a base body; anda plurality of transfer parts disposed on the base body, whereineach of the plurality of transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating, andthe plurality of transfer parts are disposed electrically independent of one another on the base body.2. The plating-pattern plate of claim 1 , wherein the base body is light-transmissive.3. The plating-pattern plate of claim 1 , wherein the transfer surfaces of the each of the plurality of transfer parts contain iron and nickel.4. The plating-pattern plate of claim 3 , wherein the plurality of transfer parts are formed by electroplating.5. The plating-pattern plate of claim 3 , wherein the plurality of transfer parts is made of alloy in which a percentage content of a total of iron and nickel is not less than 80%.6. The plating-pattern plate of claim 5 , wherein a ratio of the iron of the plurality of transfer parts to the total of the iron and the nickel the plurality of transfer parts is not less than 20%.7. The plating-pattern plate of claim 1 , wherein claim 1 , the plurality of transfer parts have thicknesses equal to or larger than 0.1 μm.8. The plating-pattern plate claim 1 , wherein the each of the plurality of transfer parts includes:a first metal layer having the transfer surface and ...

METAL COATING METHOD FOR PLASTIC OUTER SHAPE REQUIRING ROBUSTNESS

This application relates to a metal coating method for plastic outer part requiring robustness. In the metal coating method, first, provide a plastic outer part as a motion assistance tool. Thereafter, a cold plasma treatment is performed to introduce a polar functional group to a surface of the plastic outer part by treating the plastic outer part with cold plasma. Next, a metal coating layer is formed on the surface of the plastic outer part treated with the cold plasma by an electroless plating method. Thereafter, an adhesive strength improvement process of improving an adhesive strength between the metal coating layer and the plastic outer part to 1,000 g/cmor more by heat treatment of the plastic outer part with the metal coating layer thereon is performed. 1. A metal coating method for plastic outer part requiring robustness , the metal coating method comprising:providing a plastic outer part as a motion assistance tool;performing a cold plasma treatment by treating the plastic outer part with cold plasma to introduce a polar functional group to a surface of the plastic outer part;forming a metal coating layer, by an electroless plating method, on the surface of the plastic outer part which has been treated with the cold plasma; and{'sup': '2', 'increasing an adhesive strength between the metal coating layer and the plastic outer part to 1,000 g/cmor more by heat-treating the plastic outer part with the metal coating layer thereon.'}2. The metal coating method of claim 1 , wherein claim 1 , in the increasing of the adhesive strength claim 1 , a heat treatment is performed by heating the plastic outer part with the metal coating layer thereon claim 1 , at a temperature equal to or lower than the softening point of the plastic outer part for 5 minutes to 200 minutes.3. The metal coating method of claim 1 , wherein claim 1 , due to the increasing of adhesive strength claim 1 , the adhesive strength between the metal coating layer and the plastic outer part is ...

Inhibitor Composition for Racks When Using Chrome Free Etches in a Plating on Plastics Process

The invention relates to an aqueous inhibition composition for the inhibition of electrochemical metal plating on polymer surfaces, said inhibition composition comprising an inhibition agent selected from the group of compounds having at least one sulfur and at least one nitrogen atom as well as to a method for the inhibition of an insulated surface of a rack area. The inventive inhibition composition is capable to provide a solution for prohibiting unintended metallization on insulated areas of the racks when non-chromic etching is utilized for plating on plastics processes. 1. An aqueous inhibition composition for the inhibition of electrochemical metal plating on polymer surfaces , said inhibition composition comprising an inhibition agent selected from the group of compounds having at least one sulfur and at least one nitrogen atom.3. The inhibition composition according to claim 1 , wherein said inhibition agent is selected from the group consisting of thioureas claim 1 , thiocarbamates claim 1 , and thiosemicarbazides.4. The inhibition composition according to claim 3 , wherein said inhibition agent is a thiourea.5. The inhibition composition according to claim 1 , said composition having a pH-value between 2 and 13.6. The inhibition composition according to claim 1 , wherein said inhibition agent is comprised in a concentration range of between ≧0.1 g/l and ≦100 g/l.7. The inhibition composition according to claim 1 , additionally comprising at least one buffering agent.8. The inhibition composition according to claim 1 , additionally comprising agents to increase the solubility of the inhibitor compound in the composition.9. The inhibition composition according to claim 1 , additionally comprising one or more swelling agents for the polymer of the rack insulation.10. A method for the inhibition of an insulated surface of a rack area claim 1 , said method comprising the step of contacting the surface with an aqueous inhibition composition comprising an ...

PROPPANT HAVING NON-UNIFORM ELECTRICALLY CONDUCTIVE COATINGS AND METHODS FOR MAKING AND USING SAME

Electrically conductive proppant particles having non-uniform electrically conductive coatings are disclosed. The non-uniform electrically conductive coatings can have a thickness of at least about 10 nm formed on an outer surface of a sintered, substantially round and spherical particle, wherein less than 95% of the outer surface of the sintered, substantially round and spherical particle is coated with the electrically conductive material. Methods for making and using such electrically conductive proppant particles having non-uniform electrically conductive coatings are also disclosed. 1. An electrically conductive proppant pack , comprising:{'sup': '3', 'a plurality of particles having less than about 30% crush at 4,000 psi and a specific gravity of about 4 g/cmor less; and'}a non-uniform coating of an electrically conductive material having a thickness of at least about 10 nm disposed on an outer surface of one or more of the plurality of particles, wherein the electrically conductive proppant pack has an electrical conductivity of at least 10 S/m.2. The electrically conductive proppant pack of claim 1 , wherein the non-uniform coating of the electrically conductive material has a thickness of from about 100 nm to about 5 claim 1 ,000 nm.3. The electrically conductive proppant pack of claim 1 , wherein the electrically conductive material is selected from the group consisting of aluminum claim 1 , copper claim 1 , nickel claim 1 , and phosphorous and any alloy or mixture thereof.4. The electrically conductive proppant pack of claim 1 , wherein the electrically conductive material is selected from the group consisting of pyrolytic carbon claim 1 , carbon black claim 1 , graphite claim 1 , coke breeze claim 1 , carbon fiber; and carbon nanotubes and combination thereof.5. The electrically conductive proppant pack of claim 1 , wherein the electrically conductive material is in the form of particles; nanoparticles claim 1 , metal clusters claim 1 , metal flake claim ...

METHOD FOR TREATING PLASTIC SURFACE

Treatment equipment has a treatment tank provided with a thermostatic heater on its outer periphery and a supply tank connected through a pipe and a pump. The treatment tank and the supply tank are filled with persulfate solutions S and S having predetermined sulfuric acid concentrations and persulfuric acid concentrations respectively. In the treatment tank, a plastic plate is vertically hung as plastic to be treated. The sulfuric acid concentrations of the persulfate solutions S and S are each 50 to 92 wt %. The persulfuric acid concentrations of the solutions S and S are each 3 to 20 g/L after the persulfate is dissolved. According to a Cr-free method for treating a plastic surface using such treatment equipment, it becomes possible to form a plating film that sufficiently adheres to the plastic surface. 1. A method for treating a plastic surface comprising treating plastic with a solution containing a persulfate dissolved therein , the solution having a sulfuric acid concentration of 50 to 92 wt % and a persulfuric acid concentration of 3 to 20 g/L.2. The method for treating a plastic surface according to claim 1 , wherein a mixed solution containing an inorganic salt dissolved therein is used as the solution containing a persulfate dissolved therein.3. The method for treating a plastic surface according to claim 1 , wherein the treatment temperature is 50 to 140° C.4. The method for treating a plastic surface according to comprising claim 1 , by using a treatment equipment comprising a treatment tank for storing the solution containing a persulfate dissolved therein and a persulfate solution storage tank for supplying the solution containing a persulfate dissolved therein to the treatment tank claim 1 , immersing plastic in the treatment tank to thereby treat a surface of the plastic. The present invention relates to a method for treating a plastic surface that is carried out prior to metallization of a plastic (resin molded article) surface.At parts where ...

Electroless Silver Plating Bath and Method of Using the Same

An electroless silver plating bath and method of use is presented within. The electroless silver plating bath is designed to plate only on the desired metal substrate while preventing plating on areas other than those which are to be plated. The invention uses heavy metal based stabilizers in the electroless silver plating bath to prevent extraneous plating. The ability to control the amount of stabilizer present in the plating bath allows for elimination of extraneous plating and allows for a stable bath. The electroless silver plating bath is very stable and yet plates at an acceptable rate. The electroless silver plating bath prevents corrosion on the underlying metal that is plated on by using the stabilizers as described herein. The silver plating bath presented herein is useful for a wide variety of applications including those in electronic packaging, integrated circuits (IC) and in manufacturing of light emitting diodes (LEDs).

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.

WIRING BOARD AND PRODUCTION METHOD FOR SAME

A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

METHODS FOR MANUFACTURING A HEAT EXCHANGER

A method for manufacturing a heat exchanger including forming a heat exchanger with walls using direct metal laser melting. The walls include defects formed during the direct metal laser melting process. The defects can cause leaking within the heat exchanger. The method includes healing the defects. 1. A method for manufacturing a heat exchanger , comprising the steps of:forming, via a direct metal laser melting process, a heat exchanger comprising a set of walls forming fluid passages; anddepositing, via a direct metal laser melting process a layer on at least a portion of the set of walls;wherein the set of walls include at least one surface connected defect that spans a width of at least one of the set of walls and the layer and the layer seals the defect.2. The method of wherein the surface connected defects comprise one of a large void claim 1 , interconnected small voids claim 1 , or a deep crack.3. The method of wherein the set of walls comprise outside manifold walls and separation walls.4. The method of wherein the layer is deposited nickel.5. The method of wherein the layer is on an order of microns to hundreds of microns.6. The method of wherein the electroless plating process includes pumping electrolyte through the heat exchanger.7. The method of wherein the electroless plating process includes applying an activation agent to at least a portion of the heat exchanger before pumping electrolyte through the heat exchanger.8. The method of wherein the electroless plating process includes healing internal defects by hot isostatis processing.9. A method for manufacturing a heat exchanger claim 1 , comprising the steps of:forming a heat exchanger comprising a set of walls forming fluid passages with an additive manufacturing process; anddepositing a layer on surfaces of the set of walls;wherein the set of walls include at least one surface connected defect that span from a first surface of at least one of the set of walls to a second surface of the at least ...

MULTILAYER METAL MATRIX COMPOSITE AND FABRICATION THEREOF

A multilayer metal-matrix composite that includes a metal core sheet and a plurality of side sheets is disclosed in which the metal core sheet is reinforced with a reinforcement material selected from the group consisting of ceramic reinforcements. The reinforced metal core sheet is coated with an electroless coating. A method of fabricating a multilayer metal-matrix composite with reinforced particles and a coating using a combination of electroless coating method and accumulative roll bonding method is further described in this disclosure with the aim of reducing the number of required accumulative roll bonding cycles to obtain improved or desired properties. 1. A multilayer metal-matrix composite , comprising:at least two side sheets, including a first side sheet and a second side sheet; anda metal core sheet, the metal core sheet being disposed between the first side sheet and the second side sheet,wherein the metal core sheet is coated with an electroless coating selected from the group consisting of Nickel-Phosphorus electroless coating, Nickel-Boron electroless coating, and combinations thereof, andwherein the metal core sheet is reinforced with a reinforcement material selected from the group consisting of Tungsten carbide, Aluminum oxide, polymeric reinforcements, and combinations thereof.2. The multilayer metal matrix composite of claim 1 , wherein the metal core sheet is selected from the group consisting of aluminum claim 1 , iron claim 1 , nickel claim 1 , gold claim 1 , copper claim 1 , tin claim 1 , titanium claim 1 , cobalt claim 1 , magnesium claim 1 , platinum claim 1 , palladium claim 1 , zirconium claim 1 , silver claim 1 , beryllium claim 1 , aluminum alloy claim 1 , iron based alloy claim 1 , magnesium alloy claim 1 , platinum alloy claim 1 , palladium alloy claim 1 , zirconium alloy claim 1 , steel claim 1 , brass claim 1 , silver alloy claim 1 , beryllium alloy claim 1 , super alloy claim 1 , and combinations thereof.3. The multilayer metal ...

SEMICONDUCTOR DEVICE HAVING A Pd-CONTAINING ADHESION LAYER

According to present invention, a semiconductor device includes a semiconductor substrate formed of GaAs, an adhesion layer formed of Pd or an alloy containing Pd on the semiconductor substrate, a barrier layer formed of Co or an alloy containing Co on the adhesion layer, and a metal layer formed of Cu, Ag or Au on the barrier layer. 1. A method of manufacturing a semiconductor device , comprising:a step of forming an adhesion layer of Pd or an alloy containing Pd on a semiconductor substrate formed of GaAs;a step of forming a barrier layer of Co or an alloy containing Co on the adhesion layer; anda heat treatment step of increasing the temperature of the semiconductor substrate, the adhesion layer and the barrier layer to 25° C. to 250° C. to form Pd—Ga—As on the adhesion layer and to form an alloy layer containing Co and Pd between the adhesion layer and the barrier layer.2. The method of manufacturing a semiconductor device according to claim 1 , comprising a step of forming a metal layer of Cu claim 1 , Ag or Au on the barrier layer before the heat treatment step.3. A method of manufacturing a semiconductor device claim 1 , comprising: a step of performing electroless plating on the semiconductor substrate to form a barrier layer of Co—P or Co—W—P on the adhesion layer; and', 'a step of forming a metal layer of Cu, Ag or Au on the barrier layer., 'a step of forming an adhesion layer of Pd or an alloy containing Pd on a semiconductor substrate formed of GaAs;'}4. The method of manufacturing a semiconductor device according to claim 3 , wherein the metal layer is of a two-layer structure having Au in a lower layer and having Cu in an upper layer. The present invention relates to a semiconductor device having a metal layer used, for example, as an electrode and to a method of manufacturing the semiconductor device.PTL 1 discloses a technique to form a barrier layer, a seed layer and a wiring layer on a side wall of an insulating film by a wet process.PTL 1: ...

Aluminum alloy substrate for magnetic recording medium, substrate for magnetic recording medium, magnetic recording medium, and hard disk drive

An aluminum alloy substrate for a magnetic recording medium, the substrate including: Si in a range of 9.5 to 13.0% by mass or less and Cu in a range of 0.5 to 3.0% by mass or less, wherein a content of Fe is less than 0.01% by mass, the balance is Al, the substrate has a diameter in a range of 53 to 97 mm and a thickness in a range of 0.4 to 0.9 mm or less, and the substrate satisfies at least one of the following conditions (i) and (ii): (i) Sr is contained in the substrate in a range of 0.005% by mass or more and 0.1% by mass or less; and (ii) at least a part of the Si is present as Si particles, and an average particle diameter of particles having a longest diameter of 0.5 μm or more among the Si particles is 2 μm or less.

DEPOSITING A STRUCTURALLY HARD, WEAR RESISTANT METAL COATING ONTO A SUBSTRATE

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer. 1. A method of coating a substrate , the method comprising:cleaning the substrate;after cleaning the substrate, sensitizing the substrate using a sensitizing solution comprising tin chloride and hydrochloric acid;after sensitizing the substrate, activating the substrate in an activating solution comprising palladium chloride and hydrochloric acid;subsequently neutralizing the substrate using a neutralizing solution comprising ammonium hydroxide; andafter neutralizing the substrate, depositing an electroless nickel layer on the substrate.2. The method of claim 1 , wherein the substrate is non-conductive.3. The method of claim 2 , wherein the substrate comprises a fiber-reinforced plastic.4. The method of claim 2 , wherein the substrate comprises an engineering plastic.5. The method of claim 1 , wherein the sensitizing solution comprises between 5 g/l to 15 g/l of tin chloride and between 20 ml/l to 60 ml/l of hydrochloric acid.6. The method of claim 1 , wherein the activating solution comprises between 0.25 g/l to 1.5 g/l of palladium chloride and between 5 ml/l to 15 ml/l of hydrochloric ...

FUEL DISTRIBUTION PIPE

Provided is a fuel distribution pipe connected to a fuel pipe and distributes and supplies fuel to a plurality of fuel injection devices, comprising: a tubular base material forming a body of the fuel distribution pipe; and a plating layer formed on a surface of the base material, wherein the base material includes a sealing surface formed on an inner peripheral surface thereof and comes into press-contact with the fuel pipe, and wherein a thickness of the plating layer on the sealing surface is thinner than that of the plating layer on an outer peripheral surface of the fuel distribution pipe. 1. A fuel distribution pipe connected to a fuel pipe and distributes and supplies fuel to a plurality of fuel injection devices , comprising:a tubular base material forming a body of the fuel distribution pipe; anda plating layer formed on a surface of the base material,wherein the base material includes a sealing surface formed on an inner peripheral surface thereof and comes into press-contact with the fuel pipe, andwherein a thickness of the plating layer on the sealing surface is thinner than that of the plating layer on an outer peripheral surface of the fuel distribution pipe.2. The fuel distribution pipe according to claim 1 ,wherein the plating layer composed a plurality of layers, andwherein the number of layers of the plating layer on the sealing surface is smaller than the number of layers of the plating layer on the outer peripheral surface.3. The fuel distribution pipe according to claim 1 ,wherein the plating layer composed a plurality of layers, andwherein a thickness of a specific layer which is any one layer of the plating layers on the sealing surface is thinner than that of the specific layer on the outer peripheral surface.4. The fuel distribution pipe according to claim 3 ,wherein a thickness of the specific layer on the sealing surface is larger than 0% and equal to or smaller than 80% of the thickness of the specific layer on the outer peripheral ...

Preparation Method of Electrical Contact Material

A preparation method of an electrical contact material includes steps of: adopting chemical plating to cover nickel coating on aquadag or metallic oxide, then covering with silver coating, and forming Ag—Ni—C or Ag—Ni—MeO core-shell structure, which improves interface wettability of aquadag, metallic oxide and silver matrix, and removes the adverse effect on the electrical contact material mechanical property due to bad interface wettability in conventional powder metallurgy method. What is important is that the silver in intermediate composite particles is replaced by nickel coating, thus reduce the silver use level. The main function of silver coating is to improve inoxidizability of composite particles, sintering granulation property and the deformability during the manufacturing process of intermediate composite particles, thus improve the technological property. 110-. (canceled)11. A preparation method of an electrical contact material , comprising following steps of:{'sup': 'st', '1step, adopting chemical plating to cover a nickel coating on aquadag or metallic oxide particles;'}{'sup': nd', 'st, '2step, adopting chemical plating to further cover a silver coating on the aquadag or the metallic oxide particles with the nickel coating by the 1step;'}{'sup': d', 'nd, '3step, adopting nitrogen protection to conduct sintering granulation to powder of Ag—Ni—C or Ag—Ni—MeO core-shell structure which is formed by the 2step, and obtaining intermediate composite particle powder, then sieving;'}{'sup': th', 'rd, '4step, mixing the intermediate composite particles after sieving by the 3step with pure silver powder to reduce a content of aquadag or metallic oxide to a setting value; and'}{'sup': th', 'th, '5step, making well-mixed powder of the 4step pressed and nitrogen protection atmosphere sintered, then extruding and drawing to obtain the electrical contact material where the aquadag or the metallic oxide particles present fibrous arrangement in a local region; wherein ...

ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH SPREADER DUCT

A roll-to-roll electroless plating system including a sump and a pan containing a plating solution. A web advance system advances a web of substrate though the plating solution in the pan along a web advance direction, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of substrate. A pan-replenishing pump moves plating solution from the sump to an inlet of the pan through a pipe connected to an outlet of the pan-replenishing pump, the inlet of the pan being located below the web of substrate. A spreader duct includes a channel that is in fluidic communication with the inlet of the pan, wherein the channel is positioned below the web of substrate and includes at least one outlet disposed beyond the first edge or the second edge of the web of substrate. 1. A roll-to-roll electroless plating system , comprising:a sump containing a first volume of a plating solution;a pan containing a second volume of the plating solution, the second volume being less than the first volume;a web advance system for advancing a web of substrate from an input roll though the plating solution in the pan along a web advance direction and to a take-up-roll, the web of substrate including a first edge and a second edge that is separated from the first edge along a cross-track direction perpendicular to the web advance direction, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of substrate as it is advanced through the plating solution in the pan;a pan-replenishing pump for moving plating solution from the sump to an inlet of the pan through a pipe connected to an outlet of the pan-replenishing pump, the inlet of the pan being located in proximity to a bottom of the pan below the web of substrate; anda spreader duct including a channel that is in fluidic communication with the inlet of the pan, wherein the channel is positioned below the web of substrate and ...

ADDITIVELY MANUFACTURED THERMOSET POLYMERS FOR METAL PLATING AND METAL PLATED PARTS FORMED THEREFROM

A thermoset resin for forming parts to be metal plated includes a vat photopolymerization (VPP) thermoset resin and an etchable phase disposed in the VPP thermoset resin. The etchable phase is etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part. The etchable phase is at least one of organic particles, organic resins, inorganic particles, and copolymers of the VPP thermoset resin. For example, the etchable phase can be a polybutadiene phase and/or a mineral such as calcium carbonate. 1. A thermoset resin for forming parts to be metal plated , the thermoset resin comprising:a vat photopolymerization (VPP) thermoset resin; andan etchable phase disposed in the VPP thermoset resin, wherein the etchable phase is configured to be etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part.2. The thermoset resin according to claim 1 , wherein the VPP thermoset resin comprises a mixture of at least one monomer claim 1 , at least one oligomer claim 1 , and at least one photoinitiator.3. The thermoset resin according to claim 1 , wherein the VPP thermoset resin comprises at least one monomer selected from the group consisting of an (meth)acrylate monomer and a vinyl ether.4. The thermoset resin according to claim 3 , wherein the (meth)acrylate monomer is at least one of a monofunctional monomer claim 3 , a difunctional monomer claim 3 , and a multifunctional monomer.5. The thermoset resin according to claim 3 , wherein the (meth)acrylate monomer is at least one of 2-Ethyl hexyl acrylate (EHA) claim 3 , n-butyl acrylates (BA) claim 3 , 1 claim 3 ,4-butanediol diacrylate (BDDA) claim 3 , diethyleneglycoldiacrylate (DEGDA) claim 3 , bisphenol A-glycidyl methacrylate (Bis-GMA) claim 3 , bisphenol A ethoxylate diacrylate (Bis-EDA) claim 3 , trimethylolpropane triacrylate (TTA ...

CHAIN HAVING AN ELECTROLESS NICKEL COATING CONTAINING HARD PARTICLES

A method of applying a wear resistant surface to chain links and pins of a chain by the application of an electroless nickel coating containing hard particles. The coating reduces the friction on the chain links and associated chain components, such as pins, bushings, rockers and other components. The hard particles contained in the coating may be a carbide or nitride formed using the following elements: silicon, boron, chromium or vanadium. The coating may contain a combination of carbide or nitrides. The hard particles may additional include natural diamond and/or synthetic diamond like carbon (DLC) particles. 1. A method of improving the wear characteristics of chain links and/or chain components comprising the steps of:a) cleaning the chain links and/or chain components with an alkaline agent to remove any foreign contaminants;b) rinsing the chain links and/or chain components to remove the alkaline agent from the chain links and/or chain components;c) cleaning of the chain links and/or chain components;d) rinsing the chain links and/or chain components at least once;e) subjecting the chain links and/or chain components to acid activation by immersing the chain links and/or chain components in an acid bath;f) rinsing the chain links and/or chain components with tap water at least once to remove acid from the acid bath on the chain links/and or chain components;g) applying an electroless nickel coating containing hard particles of a carbide or nitride formed using elements chosen from a group consisting of silicon, boron, chromium and vanadium to the chain links and/or chain components by immersing the chain links and/or chain components in a bath at a temperature of 180-190° F. with a pH of 4.8 to 5.2; andh) rinsing the coated chain links and/or chain components at least once;wherein the chain components comprise bushings, pins, rockers and rollers.2. The method of claim 1 , wherein prior to step (a) of cleaning the chain links and/or chain components with the ...

Drill Tool and Method for Producing Same

A drill tool capable of coping with a rock drill having high output power and a method for producing the drill tool are described. The drill tool is produced by employing, as a drill tool material, an alloy steel composed of the following chemical components: 0.22 to 0.26 wt % of C, 0.15 to 0.35 wt % of Si, 0.55 to 0.80 wt % of Mn, 2.60 to 3.00 wt % of Ni, 1.00 to 1.50 wt % of Cr, 0.20 to 0.30 wt % of Mo, and Fe and inevitable impurities as the balance. Heat treatment with quenching is performed after carburizing performed by means of oil cooling with cold oil and a tempering temperature set at 400 to 440° C. 1. A production method for a drill tool , the production method being a method for producing a drill tool used for a rock drill , whereinthe drill tool is produced by employing, as a material of the drill tool, alloy steel composed of following chemical components: 0.22 to 0.26 wt % of C, 0.15 to 0.35 wt % of Si, 0.55 to 0.80 wt % of Mn, 2.60 to 3.00 wt % of Ni, 1.00 to 1.50 wt % of Cr, 0.20 to 0.30 wt % of Mo, and Fe and inevitable impurities as the balance and, when carburizing-quenching and tempering are performed on the material as heat treatment, performing quenching after carburizing by means of oil cooling with cold oil and setting a tempering temperature at 400 to 440° C.2. The production method for the drill tool according to claim 1 , whereinsub-zero treatment is performed between the carburizing-quenching and the tempering.3. The production method for the drill tool according to claim 2 , whereinelectroless nickel plating treatment is performed after the tempering and, subsequently, heating is performed at a temperature equal to or less than the tempering temperature.4. A drill tool claim 2 , whereinthe drill tool is made of alloy steel the constituent materials of which are composed of following chemical components: 0.22 to 0.26 wt % of C, 0.15 to 0.35 wt % of Si, 0.55 to 0.80 wt % of Mn, 2.60 to 3.00 wt % of Ni, 1.00 to 1.50 wt % of Cr, 0.20 to 0. ...

DEVICE AND METHOD FOR III-V LIGHT EMITTING MICROPIXEL ARRAY DEVICE HAVING HYDROGEN DIFFUSION BARRIER LAYER

Solid state light emitting micropixels array structures having hydrogen barrier layers to minimize or eliminate undesirable passivation of doped GaN structures due to hydrogen diffusion. 1. A multi-layer semiconductor light emitting structure comprising:a first region having a first composition;a second region having a second composition;at least one multiple quantum well active region between the first and second regions;at least one hydrogen barrier layer on the first region;a sidewall pixel contact cap that extends into the first region; and;a plurality of contact vias that electrically couple the sidewall pixel contact cap to a contact metal rail;wherein the first region is completely enveloped or encapsulated by either (i) the at least one hydrogen barrier layer, or (ii) by the sidewall pixel contact cap and the contact vias, thereby preventing or minimizing a hydrogen penetration into the first region of the multi-layer semiconductor light emitting structure.2. The multi-layer semiconductor light emitting structure of claim 1 , wherein the at least one hydrogen barrier layer is an undoped GaN capping barrier layer.3. The multi-layer semiconductor light emitting structure of claim 1 , wherein the at least one hydrogen barrier layer is of III-nitride material.4. The multi-layer semiconductor light emitting structure of claim 1 , further comprising:a metal ring wrapped around corners of the topside of the multi-layer semiconductor light emitting structure to create a base for the contact vias;whereby the topside of the multi-layer semiconductor light emitting structure comprises an optically transparent aperture area unobstructed by the contact vias in order to achieve maximum light output while achieving a large contact area along a sidewall of the first region.5. The multi-layer semiconductor light emitting structure of claim 1 , wherein doping of the first region is graduated claim 1 , either continuously or stepped claim 1 , from an undoped GaN portion ...

ELECTRICALLY CONDUCTIVE TEXTILE ELEMENT AND METHOD OF PRODUCING SAME

A method of producing an electrically conductive textile element that includes the steps of modifying a surface of a textile element with a negatively-charged polyelectrolyte; and coating the modified surface of the textile element with metal particles. 1. A method of producing an electrically conductive textile including the steps of:silanising a surface of the textile to provide a silanised surface;grafting a negatively-charged polyelectrolyte onto the silanised surface by in-situ free radical polymerisation;adding metal ions into the polyelectrolyte by ion exchange;reducing the metal ions to elemental metal; andcoating the textile with metal particles.2. The method of claim 1 , wherein the negatively-charged polyelectrolyte includes poly(methacrylic acid) or a salt thereof claim 1 , or poly(acrylic acid) or a salt thereof.3. The method of claim 2 , wherein the negatively-charged polyelectrolyte includes poly(methacrylic acid) sodium salt claim 2 , or poly(acrylic acid) sodium salt.4. The method of claim 1 , wherein the metal ions are copper ions.5. The method of claim 1 , wherein coating the textile with metal particles is performed by electroless metal deposition.6. The method of claim 1 , wherein the metal particles are nickel or copper.7. The method of claim 1 , wherein the textile includes yarn or fibers made of cotton claim 1 , nylon claim 1 , silk or polyester.8. The method of claim 7 , wherein the textile includes cotton yarn or fibers. This application is a continuation of U.S. patent application Ser. No. 15/554,695, filed Aug. 30, 2017, which is incorporated herein by reference in its entirety for all purposes.The present invention relates to the field of electrically conductive textile elements and methods of producing same.With the rapid advancement of flexible and wearable electronic devices there has been a demand for conductors as interconnects, contacts, electrodes and metal wires which can be integrated into conductive textiles/garments. ...

SOLDER BOND SITE INCLUDING AN OPENING WITH DISCONTINUOUS PROFILE

Apparatuses and methods for formation of a bond site including an opening with a discontinuous profile are disclosed herein. An example apparatus may at least include a substrate, a contact on the substrate, and a mask layer formed on the substrate and at least a portion of the contact. The mask layer may also include an opening formed therein, with the opening having a discontinuous profile from a top surface of the mask layer to the contact. 1. A method , comprising:forming a masking layer defined by a discontinuous profile of the masking layer on a substrate including a contact;forming a first metal layer on a contact of the substrate; andforming a second metal layer on the first metal layer.2. The method of claim 1 , wherein forming the masking layer defined by a discontinuous profile on the substrate comprises:etching a first opening defined by a first sidewall extending from a top surface of the masking layer to a step; andetching a second opening defined by a second sidewall extending from the step and terminating at the contact.3. The method of claim 2 , wherein a “leaky chrome” process is used to etch the first opening and to etch the second opening.4. The method of claim 2 , wherein the first opening has a larger diameter than a diameter of the second opening.5. The method of claim 4 , wherein the first sidewall extends at an angle from the top surface of the masking layer to a first edge of the step claim 4 , and the second sidewall extends from a second edge of the step to the contact.6. The method of claim 4 , wherein the second opening exposes a portion of the contact.7. The method of claim 2 , wherein the first metal layer is formed in the second opening of the masking layer.8. The method of claim 1 , wherein forming the first metal layer on the contact comprises an electroless plating process claim 1 , and wherein forming the second metal layer on the first metal layer comprises a gold immersion plating process.9. The method of claim 1 , wherein the ...

Carbon Nanomaterial Composite Sheet and Method for Making the Same

A carbon nanomaterial composite sheet and a method for making a carbon nanomaterial composite sheet may include a layer of a carbon nanomaterial structure being bonded to a carrier layer, the carrier layer being fabricated from a porous metalized nonwoven material.

ELECTRICALLY CONDUCTIVE TEXTILE ELEMENT AND METHOD OF PRODUCING SAME

A method of producing an electrically conductive textile element that includes the steps of modifying a surface of a textile element with a negatively-charged polyelectrolyte; and coating the modified surface of the textile element with metal particles. 1. A method of producing an electrically conductive textile element including the steps of:(i) modifying a surface of a textile element with a negatively-charged polyelectrolyte; and(ii) coating the modified surface of the textile element with metal particles.2. A method as claimed in wherein the step (i) includes modifying the surface of the textile element with a negatively-charged polyelectrolyte by in-situ free radical polymerisation.3. A method as claimed in wherein the negatively-charged polyelectrolyte includes at least one of poly(methacrylic acid sodium salt) and poly(acrylic acid sodium salt).4. A method as claimed in wherein step (i) includes modifying a silanized surface of a textile element with a negatively-charged polyelectrolyte.5. A method as claimed in wherein the step (ii) includes coating the modified surface of the textile element with metal particles by electroless metal deposition.6. A method as claimed in wherein the metal particles include at least one of copper and nickel particles.7. A method as claimed in wherein the textile element includes at least one of a yarn and a fiber configured for being formed in to a fabric.8. A method as claimed in wherein the textile element includes at least one of a polyester claim 1 , nylon claim 1 , cotton and silk yarn or fiber.9. An apparatus for producing an electrically conductive textile element including:an apparatus for modifying a surface of a textile element with a negatively-charged polyelectrolyte; anda coating apparatus for coating the modified surface of the textile element with metal particles.10. An apparatus as claimed in wherein the apparatus for modifying the surface of the textile element with the negatively-charged polyelectrolyte is ...

METHODS OF COATING SUBSTRATES WITH COMPOSITE COATINGS OF DIAMOND NANOPARTICLES AND METAL

A method of coating a substrate includes dispersing functionalized diamond nanoparticles in a fluid comprising metal ions to form a deposition composition; disposing a portion of the deposition composition over at least a portion of a substrate; and electrochemically depositing a coating over the substrate. The coating comprises the diamond nanoparticles and a metal formed by reduction of the metal ions in the deposition composition. 1. A method of coating a substrate , comprising:dispersing functionalized diamond nanoparticles in a fluid comprising metal ions to form a deposition composition;disposing a portion of the deposition composition over at least a portion of a substrate; andelectrochemically depositing a coating over the substrate, the coating comprising the diamond nanoparticles and a metal formed by reduction of the metal ions in the deposition composition.2. The method of claim 1 , wherein electrochemically depositing a coating over the substrate comprises forming a coating having a thickness of at least about 10 μm.3. The method of claim 2 , wherein electrochemically depositing a coating over the substrate comprises forming a coating having a thickness in a range from about 50 μm to about 100 μm.4. The method of claim 1 , wherein electrochemically depositing a coating over the substrate comprises continuously forming the coating over the surface of the substrate.5. The method of claim 1 , wherein dispersing functionalized diamond nanoparticles in a fluid comprising metal ions comprises dispersing functionalized diamond nanoparticles having a particle size in a range from about 20 nm to about 1 μm.6. The method of claim 1 , wherein electrochemically depositing a coating over the substrate comprises electroless deposition of the metal onto a surface of the substrate.7. The method of claim 1 , wherein electrochemically depositing a coating over the substrate comprises electroplating the coating over the substrate.8. The method of claim 1 , wherein ...

METHOD FOR MANUFACTURING POROUS METAL BODY

An object of the present invention is to inexpensively provide a porous metal body which is usable for an electrode of a fuel cell or the like and which has excellent corrosion resistance. There is provided a porous metal body for a fuel cell, which is a sheet-shaped porous metal body, including at least nickel, tin, and chromium, in which the chromium concentration of at least one surface of the porous metal body is 3% to 50% by mass. In the porous metal body, preferably, the chromium concentration of one surface is higher than the chromium concentration of another surface. 13-. (canceled)4. A method for manufacturing a porous metal body for a fuel cell comprising:a step of forming a tin plating layer by tin plating on a sheet-shaped porous metal body which includes at least nickel; anda step of forming a chromium plating layer by chromium plating on at least one surface of the porous metal body which has been provided with the tin plating layer.5. (canceled)6. The method for manufacturing a porous metal body according to claim 4 , further comprising a step of heat-treating the porous metal body after the chromium plating layer has been formed thereon or the porous metal body including nickel and tin before the chromium plating layer is formed thereon.7. (canceled) The present invention relates to a porous metal body which can be used, for example, as a current collector for various batteries, capacitors, fuel cells, and the like, a method for manufacturing a porous metal body, and a fuel cell that uses the porous metal body.As a method for manufacturing a porous metal body having a high porosity and a large surface area, a method is known in which a metal layer is formed on the surface of a resin porous body, such as a resin foam. For example, Japanese Unexamined Patent Application Publication No. 11-154517 (Patent Literature 1) describes a method for manufacturing a porous metal body in which a resin porous body is subjected to electrical conduction treatment, an ...

SHEET MATERIAL, METAL MESH, WIRING SUBSTRATE, DISPLAY DEVICE AND MANUFACTURING METHODS THEREFOR

A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer. 1. A sheet material comprising:a resin layer comprising a binder and a plurality of catalyst particles;an electroless plating film provided on a side of one main surface of the resin layer and comprising first electroless plating films and a second electroless plating film; anda base material provided on a side of an other main surface of the resin layer, wherein:at least some of the plurality of catalyst particles respectively have exposure surfaces exposed from the one main surface of the resin layer, and the exposure surfaces are scattered on the one main surface of the resin layer,the first electroless plating films are provided on the one main surface of the resin layer to respectively surround the exposure surfaces of the catalyst particles, andthe second electroless plating film is in direct contact with the resin layer and covers the first electroless plating films such that a main surface of the second electroless plating film on a side of the first electroless plating films forms concave portions, respectively, along surfaces of the first electroless plating films.2. The sheet material according to claim 1 , wherein an average value of respective longest diameters of the first electroless plating films is 18 to 90 nm when the one main surface of the resin layer is viewed in a planar view from the side of the electroless plating film.3. The sheet material according to claim 1 , wherein an area ratio of the first electroless plating films to the one main surface of the resin layer is 80 to 99% when the one main surface is viewed in a planar view from the side of the electroless plating film.4. The sheet material according to claim 1 , ...

MULTI-STAGE RESIN SURFACE ETCHING METHOD, AND PLATING METHOD ON RESIN USING SAME

A novel technique that is a resin etching technique without using chromic acid and can be operated at an industrial level is provided by a resin surface etching method characterized in that, in etching a resin surface, one set of the following steps (a) and (b) is performed two or more times without performing a resin swelling step: (a) a step of treating the resin surface with a solution containing an oxidizing agent and adsorbing the oxidizing agent on the resin surface, and (b) a step of activating the oxidizing agent adsorbed on the resin surface in the step (a). 1: A resin surface etching method , wherein , in etching a resin surface , one of steps (a) and (b) is performed two or more times without performing a resin swelling step:(a) a step of treating the resin surface with a solution comprising an oxidizing agent and adsorbing the oxidizing agent on the resin surface; and(b) a step of activating the oxidizing agent adsorbed on the resin surface in the step (a).2: The resin surface etching method according to claim 1 , wherein each of the steps (a) and (b) is performed for 30 seconds or more.3: The resin surface etching method according to claim 1 , wherein the oxidizing agent used in the step (a) is permanganic acid or a salt thereof.4: The resin surface etching method according to claim 1 , wherein the activation of the oxidizing agent in the step (b) is performed by a treatment with a solution comprising one or more types of activating agents selected from the group consisting of an inorganic acid claim 1 , an organic acid claim 1 , hydrogen peroxide claim 1 , a halogen oxoacid claim 1 , a halogen oxoacid salt claim 1 , and a persulfate.5: The resin surface etching method according to claim 1 , wherein the activation of the oxidizing agent in the step (b) is performed by a treatment with a solution comprising one or more types of activating agents selected from the group consisting of sulfuric acid claim 1 , phosphoric acid claim 1 , hydrochloric acid ...

PREPARATION METHOD OF CONDUCTIVE SPONGE HAVING EFFECT OF SHIELDING ELECTROMAGNETIC WAVE

A preparation method of a conductive sponge includes the following steps. First, a sponge substrate is dipped in a metal solution and then taken out. A first drying process is performed. Next, the sponge substrate plated with metal particles is dipped in a carbon nanomaterial suspension and then taken out. Then, a second drying process is performed. 1. A preparation method of a conductive sponge , comprising:dipping a sponge substrate in a metal solution and then taking out the sponge substrate;performing a first drying process on the sponge substrate dipped in the metal solution;dipping the sponge substrate in a carbon nanomaterial suspension after the first drying process and then taking out the sponge substrate; andperforming a second drying process on the sponge substrate dipped in the carbon nanomaterial suspension.2. The preparation method of a conductive sponge of claim 1 , wherein a material of the sponge substrate comprises melamine or polyurethane.3. The preparation method of a conductive sponge of claim 1 , wherein the metal solution comprises a silver ion solution claim 1 , a nickel ion solution claim 1 , an iron ion solution claim 1 , or a cobalt ion solution.4. The preparation method of a conductive sponge of claim 1 , wherein the metal solution comprises a silver nitrate solution claim 1 , a nickel nitrate solution claim 1 , or a copper nitrate solution.5. The preparation method of a conductive sponge of claim 1 , wherein a solute of the carbon nanomaterial suspension comprises carbon black claim 1 , carbon nanotube claim 1 , graphene claim 1 , or carbon aerogel.6. The preparation method of a conductive sponge of claim 1 , further comprising claim 1 , before the sponge substrate is dipped in the metal solution claim 1 , performing a sensitizing treatment.7. The preparation method of a conductive sponge of claim 6 , further comprising claim 6 , after the sensitizing treatment is performed and before the sponge substrate is dipped in the metal solution ...

ELECTROLESS NICKEL COATINGS AND COMPOSITIONS AND METHODS FOR FORMING THE COATINGS

An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound. 150-. (canceled)51. A method of forming a multilayer electroless metal coating on a substrate , the method comprising:i. contacting the substrate with a first electroless nickel plating bath to form a first eletroless nickel coating on the substrate, the first electroless nickel coating having a phosphorus content of 7% to 13% by weightii. contacting the substrate coated with the first electroless coating with a second aqueous electroless nickel plating bath to form a second electroless nickel coating over the first electroless coating, the second electroless coating having a phosphorous content of 8% to 11%, the second bath including nickel, a hypophosphorous reducing agent, 40 ppm to 100 ppm zinc, at least one of a complexing agent, chelating agent, and/or pH buffer, and 5 ppm to 30 ppm bismuth stabilizer, wherein the bath is free of an organic sulfur compound;iii. etching the second electroless nickel coating with an etchant agent to provide the coated substrate with a black surface or contacting the substrate coated with the first and second electroless nickel coatings with an electroless copper plating bath to provide a copper top coat.52. The method of claim 51 , wherein hypophosphorous reducing agent is selected from the group consisting of sodium hypophosphite claim 51 , potassium hypophosphite claim 51 , ammonium hypophosphite claim 51 , and combinations thereof.53. The method of claim 51 , wherein the second electroless nickel plating bath includes at least one pH buffer claim 51 , complexing agent claim 51 , or chelating agent is selected from the group consisting of acetic acid claim 51 , formic acid claim 51 , succinic acid claim 51 , malonic acid claim 51 , an ammonium salt claim 51 , ...

BLACK PLATED RESIN PART AND METHOD FOR MANUFACTURING THE SAME

A black plated resin part includes a resin base material, an underlying plating layer including a copper plating layer and a nickel plating layer formed in this order on the resin base material, a black chromium plating layer formed on the nickel plating layer, formed of trivalent chromium, and having a film thickness of not less than 015 μm, and a corrosion resistant film formed on the black chromium plating layer, formed of chromic phosphate or molybdenum phosphate, and having a film thickness of not less than 7 nm. A brightness of the black chromium plating layer seen through the corrosion resistant film is expressed by an L* value of not more than 54 based on the L*a*b* color system. 1. A black plated resin part comprising:a resin base material;an underlying plating layer including a copper plating layer and a nickel plating layer formed in this order on the resin base material;a black chromium plating layer formed on the nickel plating layer, formed of trivalent chromium, and having a film thickness of not less than 015μm; anda corrosion resistant film formed on the black chromium plating layer, formed of chromic phosphate or molybdenum phosphate, and having a film thickness of not less than 7 nm, whereina brightness of the black chromium plating layer seen through the corrosion resistant film is expressed by an L* value of not more than 54 based on the L*a*b* color system.2. The black plated resin part according to claim 1 , wherein a color of the black chromium plating layer seen through the corrosion resistant film is expressed by the L* value in the range of 44 to 50 claim 1 , an a* value in the range of 1.5 to −1.5 claim 1 , and a b* value in the range of 8 to −8 based on the L*a*b* color system.3. The black plated resin part according to claim 1 , being a decorative part for a vehicle.4. A method for manufacturing a black plated resin part claim 1 , the method comprising:forming an underlying plating layer, including a copper plating layer and a nickel ...

COMPOSITE MEMBER AND HEAT RADIATION MEMBER

A composite member excellent in corrosion resistance of a substrate and excellent in heat radiation property is provided. A composite member includes a substrate composed of a composite material containing magnesium or a magnesium alloy and SiC and a coating layer provided on a surface of the substrate. The coating layer includes an outermost layer provided as an outermost surface and an intermediate layer provided directly under the outermost layer. The outermost layer contains nickel and phosphorus. The intermediate layer is mainly composed of copper. The intermediate layer has a thickness not smaller than 30 μm. 1. A composite member comprising:a substrate composed of a composite material containing pure magnesium or a magnesium alloy and SiC; anda coating layer provided on a surface of the substrate, wherein an outermost layer provided as an outermost surface, and', 'an intermediate layer provided directly under the outermost layer,, 'the coating layer includes'}the outermost layer contains nickel and phosphorus,the intermediate layer is mainly composed of copper, andthe intermediate layer has a thickness not smaller than 30 μm.2. The composite member according to claim 1 , whereinthe coating layer includes an inner layer provided directly under the intermediate layer, andthe inner layer contains nickel and phosphorus.3. The composite member according to claim 1 , whereinthe intermediate layer has a thickness not larger than 200 μm.4. A heat radiation member comprising the composite member according to . The present disclosure relates to a composite member and a heat radiation member. The present application claims priority to Japanese Patent Application No. 2019-070853 filed on Apr. 2, 2019, the entire contents of which are herein incorporated by reference.A composite member in Japanese Patent Laying-Open No. 2012-144767 (PTL 1) includes a substrate composed of a composite material and a metal coating layer that covers a surface of the substrate. The composite ...

CHEMICAL PLATING PRODUCT AND METHOD FORMING THEREOF

The invention discloses a chemical plating product and method forming thereof, the chemical plating product includes an insulating member () and a metal coating covering the insulating member (), the metal coating includes a pre-plating scope () formed by a coating catalyst and a chemical copper layer () covering the pre-plating scope (). 1. A chemical plating product formed by chemical method , comprising:an insulating member; anda metal coating covering the insulative housing, the metal coating including a pre-plating scope formed by a coating catalyst and a chemical copper layer covering the pre-plating scope.2. The chemical plating product as claimed in claim 1 , wherein at least the pre-plating scope of the insulating member is chemical demoulded and is made coarse.3. The chemical plating product as claimed in claim 2 , wherein chemical plating nickel and gold on the chemical copper layer.4. The chemical plating product as claimed in claim 2 , wherein electro plating copper claim 2 , nickel and gold on the chemical copper layer.5. The chemical plating product as claimed in claim 2 , wherein electro plating copper and nickel on the chemical copper layer.6. The chemical plating product as claimed in claim 5 , wherein electro plating black nickel on the electro plating nickel.7. The chemical plating product as claimed in claim 1 , wherein the coating catalyst is a planar shaped organic nanopalladium metal conductive layer.8. The chemical plating product as claimed in claim 1 , wherein the coating catalyst is a stereo shaped nanopalladium metal conductive layer.9. A method for forming a chemical plating product claim 1 , including:(a). providing an insulating member;(b). putting the insulating member into chemical solution to make it being chemical demoulded, and then make the surface of the insulating member coarse;(c). plating the insulating member to confirm the pre-plating scope by coating catalyst;(d). chemical-plating copper on the pre-plating scope.10. The ...

TECHNIQUES FOR METALLIC MATERIAL DEPOSITION IN ADDITIVE FABRICATION AND RELATED SYSTEMS AND METHODS

According to some aspects, a method is provided of forming a metallic object via additive fabrication, the method comprising obtaining a geometric description of a first object with an exterior surface, generating a geometric description of a second object, the second object bounded by the exterior surface of the first object and having one or more voids, fabricating said second object via additive fabrication based on said geometric description of the second object, and depositing a metallic material onto said second object, wherein the metallic material is deposited into said voids of second object. 1. A method of forming a metallic object via additive fabrication , the method comprising:obtaining a geometric description of a first object with an exterior surface;generating a geometric description of a second object, the second object bounded by the exterior surface of the first object and having one or more voids;fabricating said second object via additive fabrication based on said geometric description of the second object; anddepositing a metallic material onto said second object, wherein the metallic material is deposited into said voids of the second object.2. The method of claim 1 , wherein said depositing step comprises an electroless plating process.3. The method of claim 1 , wherein said depositing step deposits the metallic material over the entire surface of the second object at a constant rate.4. The method of claim 1 , wherein the geometric description of the second object is arranged to be offset from the exterior surface of the first object by a distance based on an amount of deposition expected during the step of depositing the material onto the second object.5. The method of claim 1 , wherein the second object comprises a lattice of repeating cell units claim 1 , the cell units each comprising at least one void within.6. The method of claim 5 , further comprising determining sizes of the cell units of the lattice based on the geometric description ...

COATINGS FOR REDUCING WEAR ON ROD PUMP COMPONENTS

A pump for an oil and gas well includes a barrel with a surface configured to contact oil and gas well fluid. The pump further includes a first coating formed on at least a portion of the barrel surface. The first coating includes a combination of diamond particles and a composition including nickel and phosphorous. The pump also includes a plunger with a surface configured to contact oil and gas well fluid. The pump additionally includes a second coating formed on at least a portion of the plunger surface. The second coating includes a combination of tungsten carbide particles and a composition including cobalt and chromium. 115-. (canceled)16. A pump for an oil and gas well , said pump comprising:a barrel comprising a surface configured to contact oil and gas well fluid;a first coating formed on at least a portion of said barrel surface, said first coating including a combination of diamond particles and a composition comprising nickel and phosphorous;a plunger comprising a surface configured to contact oil and gas well fluid; anda second coating formed on at least a portion of said plunger surface, said second coating including a combination of tungsten carbide particles and a composition comprising cobalt and chromium.17. The pump in accordance with claim 16 , wherein said diamond particles have a diameter within a range from approximately 0.5 micrometers (μm) to approximately 4 μm.18. The pump in accordance with claim 16 , wherein said first coating is formed by an electroless nickel plating process.19. The pump in accordance with claim 16 , wherein said tungsten carbide particles have a diameter less than or equal to approximately 5 micrometers (μm).20. The pump in accordance with claim 16 , wherein said second coating is formed from high velocity air-fuel spray. The field of the invention relates generally to oil and gas well assemblies and, more specifically, to coatings applied to surfaces of plunger and barrel components for rod pump systems.At least some ...

PLATED FIBER-REINFORCED MEMBER AND PLATING METHOD FOR FIBER-REINFORCED MEMBER

A plated plated fiber-reinforced member includes: a fiber-reinforced member formed of a composite fiber material in which multiple reinforcing fibers dispersed in a resin, some of the multiple reinforcing fibers being allowed so that portions thereof protruding from a surface of the resin; and an electroless-plated layer formed on the fiber-reinforced member to cover the surface of the resin and the portions of the reinforcing fibers protruded from the surface of the resin. 1. A plated fiber-reinforced member , comprising:a fiber-reinforced member formed of a composite fiber material in which multiple reinforcing fibers are dispersed in a resin, wherein some of the multiple reinforcing fibers are allowed so that portions thereof protruding from a surface of the resin; andan electroless-plated layer formed on the fiber-reinforced member to cover the surface of the resin and the portions of the reinforcing fibers protruding from the surface of the resin.2. The plated fiber-reinforced member according to claim 1 , wherein multiple recessed portions are formed on the surface of the resin.3. The plated fiber-reinforced member according to claim 2 , wherein multiple fine irregularities are formed on the surface of the resin.4. The plated fiber-reinforced member according to claim 1 , wherein the plated fiber-reinforced member is an impeller.5. A plating method for a fiber-reinforced member comprising:an etching step of etching a surface of a fiber-reinforced member formed of a composite fiber material in which multiple reinforcing fibers are dispersed in a resin using an etching solution to selectively-dissolve the resin, thereby exposing portions of some of multiple reinforcing fibers from a surface of the resin;a vibration step of vibrating the fiber-reinforced member, thereby removing the reinforcing fibers fully exposed from the etched resin from the resin;a catalyst adsorption step of adsorbing catalysts on a surface of the resin on which multiple recessed portions ...

METALLIZING POLYMERS, CERAMICS AND COMPOSITES FOR ATTACHMENT STRUCTURES

A method of manufacture includes forming a metallized tie layer on a surface of a non-metallic component, positioning the surface of the non-metallic component to mate with a metallic surface of a second component, and joining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques. 1. A method of manufacture comprising:forming a metallized tie layer on a surface of a non-metallic component;positioning the surface of the non-metallic component to mate with a metallic surface of a second component; andjoining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.2. The method of claim 1 , wherein the non-metallic component is one of a group consisting of:a polymeric component;a ceramic component;a ceramic-polymer composite component; anda resin plastic injection molded component.3. The method of claim 1 , wherein the metal to metal joining techniques include compression fusion welding.4. The method of claim 3 , wherein the surfaces of the non-metallic component and the metallic surface of the second component are gold plated claim 3 , wherein the compression fusion welding is made by contacting the two gold plated surfaces and applying an energy source.5. The method of claim 4 , wherein the energy source is ultrasonic or megasonic in nature.6. The method of claim 4 , wherein the gold is held to the surface of the non-metallic component by another metal forming the metallized tie layer.7. The method of claim 1 , wherein forming a metallized tie layer includes at least one of:electroplating;electroless plating;vacuum deposition;sputtering of a metal including one or more of Ti, Cr, Ta, Ru, NiChrome and NiV; andvapor deposition.8. The method of further comprising modifying the surface of the non-metallic component by at least one of:an ion source containing oxygen, or argon or both prior to forming the metallized tie layer on the surface of ...

SOLDER JOINT

The present invention provides a highly reliable solder joint, the solder joint including a solder joint layer having a melted solder material containing Sn as a main component and further containing Ag and/or Sb and/or Cu; and a joined body including a Ni—P—Cu plating layer on a surface in contact with the solder joint layer, wherein the Ni—P—Cu plating layer contains Ni as a main component and contains 0.5% by mass or greater and 8% by mass or less of Cu and 3% by mass or greater and 10% by mass or less of P, the Ni—P—Cu plating layer has a microcrystalline layer at an interface with the solder joint layer, and the microcrystalline layer includes a phase containing microcrystals of a NiCuP ternary alloy, a phase containing microcrystals of (Ni,Cu)P, and a phase containing microcrystals of NiP. 1. A solder joint comprising:a solder joint layer having a melted solder material containing Sn as a main component and further containing Ag and/or Sb and/or Cu; anda joined body including a Ni—P—Cu plating layer on a surface in contact with the solder joint layer, whereinthe Ni—P—Cu plating layer contains Ni as a main component and contains 0.5% by mass or greater and 8% by mass or less of Cu and 3% by mass or greater and 10% by mass or less of P,{'sub': 3', '3, 'the Ni—P—Cu plating layer has a microcrystalline layer at an interface with the solder joint layer, and the microcrystalline layer includes a phase containing microcrystals of a NiCuP ternary alloy, a phase containing microcrystals of (Ni,Cu)P, and a phase containing microcrystals of NiP.'}2. The solder joint according to claim 1 , wherein the microcrystals of the NiCuP ternary alloy include microcrystals having an average particle diameter of about 10 nm or less.3. The solder joint according to claim 1 , wherein the microcrystalline layer is free of columnar crystals or particles having a major axis of 75 nm or greater.4. The solder joint according to claim 1 , wherein the solder material contains Sn claim 1 , Ag ...

ADDITIVE MANUFACTURING OF ARTICLES COMPRISING BERYLLIUM

A method of making an article includes depositing a plurality of layers to form a three-dimensional preform, sintering the preform to form a sintered preform, and infiltrating the preform with at least one metal to form the article. At least one layer of the plurality of layers is formed from a beryllium-containing composition including beryllium powder. The infiltrating metal can be selected from aluminum and magnesium. 1. A method of making an article , comprising:depositing a plurality of layers to form a three-dimensional preform;sintering the preform to form a sintered preform; andinfiltrating the sintered preform with at least one metal to form the article;wherein at least one layer of the plurality of layers is formed from a beryllium-containing composition comprising beryllium powder.2. The method of claim 1 , wherein the at least one metal is selected from the group consisting of aluminum claim 1 , magnesium claim 1 , and lithium.3. The method of claim 1 , wherein the beryllium-containing composition further comprises a binder.4. The method of claim 3 , wherein the binder is selected from the group consisting of polyethylene claim 3 , polypropylene claim 3 , polyvinyl alcohol claim 3 , collodion claim 3 , and silicates.5. The method of claim 3 , wherein the beryllium-containing composition comprises from 0.1 wt % to 99.9 wt % of the binder and from 0.1 wt % to 99.9 wt % of the beryllium powder.6. The method of claim 1 , wherein the beryllium powder comprises beryllium particles coated with nickel.7. The method of claim 6 , wherein the beryllium powder comprises from about 92 wt % to less than 100 wt % beryllium and from greater than zero wt % to about 8 wt % nickel.8. The method of claim 1 , wherein the article comprises from 0 to about 5 wt % nickel claim 1 , from about 58 to about 65 wt % beryllium claim 1 , and from about 30 to about 42 wt % aluminum.9. The method of claim 1 , wherein the depositing is performed at about room temperature.10. The method ...

Compressively Stressed Medium Phosphorus Electroless Nickel

A method of producing compressive stressed, medium phosphorus nickel deposits from an electroless nickel plating solution is disclosed herein. It was previously believed that a compressively stressed nickel deposit could only be produced with nickel deposits having a high phosphorus nickel content. The inventors have surprisingly discovered that, through selection and concentration of the additives of an electroless nickel plating solution, a medium phosphorus nickel deposit may be produced exhibiting compressive stress. 1. A method of producing a compressively-stressed medium-phosphorus electroless nickel deposit on a substrate , the method comprising the step of contacting the substrate with an electroless nickel plating solution , the electroless nickel plating solution comprising:i) nickel ions;ii) hypophosphite ions;iii) at least one chelator; andiv) a molecule comprising divalent sulfur;wherein the electroless nickel plating solution deposits on the substrate a compressively-stressed layer of nickel comprising between 4% and 9% phosphorus.2. The method according to wherein nickel ions are present in the electroless nickel plating solution at a concentration between 1 gram per liter and 5 grams per liter.3. The method according to wherein nickel ions are present in the electroless nickel plating solution at a concentration between 2 gram per liter and 3 grams per liter.4. The method according to wherein sodium hypophosphite is the source of hypophosphite ions and sodium hypophosphite is present in the electroless nickel plating solution at a concentration between 10 grams per liter and 25 grams per liter.5. The method according to wherein sodium hypophosphite is the source of hypophosphite ions and sodium hypophosphite is present in the electroless nickel plating solution at a concentration between 15 grams per liter and 20 grams per liter.6. The method according to wherein the molecule comprising divalent sulfur is selected from the group consisting of 2- ...

METHOD FOR PRODUCING HARD DISK SUBSTRATE

An object of the present invention is to obtain a hard disk substrate that can have a smooth surface of a plating film through electroless NiP plating and does not have deteriorated corrosion resistance against acid solutions. A method for producing a hard disk substrate of the present invention is a method for producing a hard disk substrate with an electroless NiP plating film, the method including immersing a substrate in a first electroless NiP plating bath containing an additive with leveling action, thereby forming a lower layer of the electroless NiP plating film on a surface of the substrate, the lower layer having smaller average surface roughness than the surface; and immersing the substrate that has the lower layer of the electroless NiP plating film formed thereon through the first plating step in a second electroless NiP plating bath, thereby forming an upper layer of the electroless NiP plating film, the upper layer having corrosion resistance against acid solutions and having a thickness of greater than or equal to 4 μm. 1a first plating step of immersing a substrate in a first electroless NiP plating bath containing an additive with leveling action, thereby forming a lower layer of the electroless NiP plating film on a surface of the substrate, the lower layer having smaller average surface roughness than the surface; anda second plating step of immersing the substrate that has the lower layer of the electroless NiP plating film formed thereon through the first plating step in a second electroless NiP plating bath, thereby forming an upper layer of the electroless NiP plating film, the upper layer having corrosion resistance against acid solutions and having a thickness of greater than or equal to 4 μm.. A method for producing a hard disk substrate with an electroless NiP plating film, comprising: The present invention relates to a method for producing a hard disk substrate.As a method for producing a hard disk substrate, there has been performed a ...

METHOD FOR PRODUCING A CONTACT SPACING CONVERTER AND CONTACT SPACING CONVERTER

A method for producing a contact spacing converter space transformer) which has electrical contacts that form electrical paths and in which a first contact spacing of the contacts is converted into a comparatively different, second contact spacing of the electrical contacts including producing at least one base part from each of at least some of the electrical contacts. At least a section of the base part is produced from plastic. The method subsequently includes metallization of at least the section of the base part that is produced from plastic. 122.-. (canceled)239. A method for producing a contact spacing converter in the form of a space transformer having electrical contacts that form electrical paths and in which a first contact spacing of the contacts is converted into a comparatively different , second contact spacing of the electrical contacts () , with the following steps:{'b': '20', 'creation of at least one respective base part from at least several of the electrical contacts, with at least a portion of the base part () being made of plastic, and'}subsequent metallization of at least the portion of the base part that is made of plastic, wherein the production of the at least one portion of the base part that is made of plastic is performed through an additive production process.24. The method of claim 23 , wherein the additive production process is selected from a group consisting of a stereolithography process (SLA) claim 23 , a digital light process rapid prototyping method (DLP) claim 23 , a dip-in laser lithography process (DILL) claim 23 , and combinations thereof.25. The method of claim 23 , wherein the metallization is performed using at least one galvanic and/or chemical process.26. The method of claim 23 , wherein an entirety of the base part is made of plastic claim 23 , by the additive production process claim 23 , as a one-piece base part.27. The method of claim 23 , further comprising metallizing an entirety of the base part.28. The method ...

OIL AND GAS WELL PUMP COMPONENTS AND METHOD OF COATING SUCH COMPONENTS

A centrifugal pump component for an oil and gas well pump includes a substrate with an outer surface configured to contact oil and gas well fluid. The component further includes a coating formed on at least a portion of the outer surface. The coating includes a combination of hard particles and a metal matrix. 1. A centrifugal pump component for an oil and gas well pump , said component comprising:a substrate comprising an outer surface configured to contact oil and gas well fluid; anda coating formed on at least a portion of said outer surface, wherein said coating includes a combination of hard particles and a metal matrix.2. The component in accordance with claim 1 , wherein said hard particles comprises diamond particles and said metal matrix comprises nickel and phosphorous.3. The component in accordance with claim 2 , wherein said diamond particles have a diameter within a range from approximately 0.5 micrometers (μm) to approximately 4 μm.4. The component in accordance with claim 2 , wherein said coating comprises a diamond particle concentration within a range from approximately 25 volume percent to approximately 50 volume percent.5. The component in accordance with claim 2 , wherein said coating comprises a phosphorous concentration within a range from approximately 6 volume percent to approximately 12 volume percent.6. The component in accordance with claim 1 , wherein said metal matrix comprises nickel and boron.7. The component in accordance with claim 1 , wherein said coating has a thickness within a range from approximately 10 μm to approximately 152 μm.8. The component in accordance with claim 1 , wherein said coating is formed by an electroless nickel plating process.9. The component in accordance with claim 8 , wherein said coating is post-heat treated.10. A centrifugal pump for an oil and gas well comprising:at least one diffuser comprising a diffuser outer surface, wherein said diffuser outer surface is configured to contact oil and gas well fluid ...

METHOD OF OPERATING AN ELECTROLESS PLATING APPARATUS

A method of operating an electroless plating apparatus is disclosed. The operating method includes: storing in the electroless plating apparatus an order of priority of the plurality of processes which has been predetermined based on a stability of a processed substrate with respect to pure water; supplying pure water into the holder storage bath when any of the plurality of processing baths malfunctions; determining whether or not a relieving process can be performed, the relieving process being a process of performing a higher-priority process on a substrate; if the relieving process can be performed, performing the relieving process and then immersing the substrate holder holding the substrate in the pure water in the holder storage bath; and if the relieving process cannot be performed, immersing the substrate holder, holding the substrate, in the pure water held in the holder storage bath without performing the relieving process. 1. A method of operating an electroless plating apparatus having a substrate holder for holding a substrate , a plurality of processing baths for performing a plurality of processes including electroless plating , and a holder storage bath for storing the substrate holder when holding no substrate , comprising:storing in the electroless plating apparatus an order of priority of the plurality of processes which has been predetermined based on a stability of a processed substrate with respect to pure water;supplying pure water into the holder storage bath when any of the plurality of processing baths malfunctions;determining whether or not a relieving process can be performed, the relieving process being a process of performing a higher-priority process on a substrate;if the relieving process can be performed, performing the relieving process and then immersing the substrate holder holding the substrate in the pure water in the holder storage bath; andif the relieving process cannot be performed, immersing the substrate holder, holding ...

SURFACE IMPROVEMENT OF ADDITIVELY MANUFACTURED ARTICLES PRODUCED WITH ALUMINUM ALLOYS

A method for improving the surface of an aluminum alloy article includes manufacturing the aluminum alloy article using an additive manufacturing technique, wherein the article as-manufactured includes one or more of cracks, roughness, or porosity at a surface of the article; coating the surface of the aluminum alloy article with a diffusion element, the diffusion element being capable of diffusing at least 0.2 mils into the article; heating the aluminum alloy article coated with the diffusion element to cause the diffusion element to diffuse the at least 0.2 mils into the article, thereby forming a diffusion layer of at least 0.2 mils in thickness comprising both aluminum alloy and diffusion element; and removing the diffusion layer from the aluminum alloy article, whereby upon the removing, a resulting improved surface of the article comprises fewer or smaller cracks, reduced roughness, or reduced porosity. 1. A method for improving the surface of an aluminum alloy article comprising:manufacturing the aluminum alloy article using an additive manufacturing technique, wherein the article as-manufactured comprises one or more of cracks, roughness, or porosity at a surface of the article;coating the surface of the aluminum alloy article with an encapsulating element, which may or may not also be a diffusion element, to facilitate HIP response;coating the surface of the aluminum alloy article with a diffusion element, the diffusion element being capable of diffusing at least 0.2 mils into the article;heating the aluminum alloy article coated with the diffusion element to cause the diffusion element to diffuse the at least 0.2 mils into the article, thereby forming a diffusion layer of at least 0.2 mils in thickness comprising both aluminum alloy and diffusion element;removing the diffusion layer from the aluminum alloy article, whereby upon the removing, a resulting improved surface of the article comprises fewer or smaller cracks, reduced roughness, or reduced ...

METHOD FOR PREVENTING THE CORROSION OF AN IMPELLER-SHAFT ASSEMBLY OF A TURBOMACHINE

A method for preventing corrosion of an impeller-shaft assembly of a turbomachine comprises the steps of assembling an impeller on a shaft in order to define an impeller-shaft assembly; plating the assembly by inserting the assembly into a plating bath; and coating at least a first predefined surface on the impeller and a second predefined surface on the shaft wherein the coating step is performed by spraying the predefined surfaces. 1. A method for preventing corrosion of an impeller-shaft assembly of a turbomachine , the method comprising:assembling an impeller on a shaft in order to define an impeller-shaft assembly;plating the assembly by inserting the assembly into a plating bath; andcoating at least a first predefined surface on the impeller and a second predefined surface on the shaft,wherein the coating step is performed before the assembling step.2. The method according to claim 1 , wherein the first predefined surface is a surface of a key slot on the impeller for attaching the impeller to the shaft.3. The method according to claim 1 , wherein the second predefined surface is the surface of a key seat on the shaft.4. The method according to claim 1 , wherein the assembling step comprises the sub-step of attaching a sleeve onto the shaft adjacent to the impeller; and the step of coating also comprises the step of coating a third predefined surface on the impeller and a fourth predefined surface on the shaft.5. The method according to claim 4 , wherein the third predefined surface is a portion of surface of the impeller designed to face the sleeve.6. The method according to claim 4 , wherein the fourth predefined surface is a portion of a lateral surface of the shaft designed to be arranged between the impeller and the sleeve.7. The method according to claim 1 , wherein the step of plating is performed by electroless nickel plating.8. The method according to claim 1 , wherein the coating step is performed by spraying the predefined surfaces.9. The method ...

ANODE CAN SACRIFICIAL MANDRELS AND FABRICATION METHODS

An anode can fabrication method including the steps of depositing metal onto an anode can sacrificial mandrel formed from a polymer that dissolves in the presence of an organic solvent and dissolving the sacrificial mandrel with the organic solvent. 1. An anode can fabrication method , the method comprising:depositing a base layer of tin or indium onto an anode can sacrificial mandrel formed from a polymer that dissolves in the presence of an organic solvent and adding a support layer of metal, that is a different metal than the base layer, to the base layer; andafter the depositing step, dissolving the sacrificial mandrel with the organic solvent.2. The method of claim 1 , wherein the anode can sacrificial mandrel includes an anode portion claim 1 , a cathode portion claim 1 , and an inwardly contoured region between the anode portion and the cathode portion.3. A The method of claim 1 , wherein the anode can sacrificial mandrel is formed from a thermoplastic polymer.4. The method of claim 1 , whereinthe anode can sacrificial mandrel is part of a sacrificial mandrel assembly that includes a base having a top surface and a plurality of anode can sacrificial mandrels extending from the top surface of the base; anda portion of the top surface of the base is masked and another portion of the top surface of the base, that extends from one sacrificial mandrel to another sacrificial mandrel, is not masked.5. (canceled)6. A method as claimed in claim 1 , wherein: depositing a base layer comprises depositing a base layer by a physical vapor deposition or chemical coating process onto an anode can sacrificial mandrel formed from a polymer that dissolves in the presence of an organic solvent.7. The method of claim 1 , further comprising: adding more of the selected metal to the base layer of metal by galvanic deposition to form a thicker base layer of metal.8. (canceled)9. The method in claim 8 , wherein the support layer of metal comprises nickel.10. The method of claim 1 , ...

Bump Structure for Yield Improvement

A bump structure for electrically coupling semiconductor components is provided. The bump structure includes a first bump on a first semiconductor component and a second bump on a second semiconductor component. The first bump has a first non-flat portion (e.g., a convex projection) and the second bump has a second non-flat portion (e.g., a concave recess). The bump structure also includes a solder joint formed between the first and second non-flat portions to electrically couple the semiconductor components. 1. A method of forming a device , the method comprising:forming a first non-flat portion on a first bump;covering the first bump with a first material;forming a second non-flat portion on a second bump, the first non-flat portion having a same number of recesses as the second non-flat portion has projections;covering the second non-flat portion with a second material;aligning the recesses of the first non-flat portion with the projections of the second non-flat portion; andreflowing the first material and the second material, thereby forming a bond between the first non-flat portion and the second non-flat portion.2. The method of claim 1 , wherein the first material is solder and the second material is electroless nickel electroless palladium immersion gold.3. The method of claim 1 , wherein the second non-flat portion comprises a flat shoulder along a periphery.4. The method of claim 1 , wherein forming the second non-flat portion on the second bump comprises:forming a first patterned mask over a passivation layer, the passivation layer having a first opening, the first opening exposing a contact pad, the first patterned mask having a second opening, the contact pad being exposed in the second opening;forming a first conductive element in the second opening, the first conductive element extending above an upper surface of the passivation layer;removing the first patterned mask;forming a second patterned mask over the passivation layer, the second patterned ...

Substrate treatment apparatus and substrate treatment method

In one embodiment, a substrate treatment apparatus includes a mixer configured to mix a first liquid including a metal element and a second liquid being basicity to generate a third liquid including the metal element and being basicity. The apparatus further includes a supplier configured to supply the third liquid to a substrate. The apparatus further includes a first flow path configured to convey the third liquid from the mixer to the supplier not through a filter that removes particles from the third liquid.

Integrated circuit package substrate

Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first lamination layer on a first side of a package substrate and a first surface finish on one or more electrical contacts disposed on a second side of the package substrate; removing the first lamination layer from the first side of the package substrate; depositing a second lamination layer on the second side of the package substrate and a second surface finish on the one or more electrical contacts disposed on the first side of the package substrate; and removing the second lamination layer from the second side of the package substrate. Other embodiments may be described and/or claimed.

Semiconductor element and production method thereof

In a semiconductor element of the present invention, an electroless nickel-phosphorus plating layer and an electroless gold plating layer are formed on both a front-side electrode and a back-side electrode of a front-back conduction-type substrate. The front-side electrode and the back-side electrode are formed of aluminum or an aluminum alloy. The proportion of the thickness of the electroless nickel-phosphorus plating layer formed on the front-side electrode with respect to the thickness of the electroless nickel-phosphorus plating layer formed on the back-side electrode is in a range of 1.0 to 3.5. The semiconductor element of the present invention allows the occurrence of voids inside solder during mounting by soldering to be prevented.

Method for the Production of ZNS Particles Having a Metal Oxide Coating and a Cobalt Content, Products Obtained Thereby, and Use of Said Products

Co/metal oxide/ZnS composite particles include a ZnS core and a metal oxide coating surrounding the core, the coating having a content of cobalt from 1 to 150 ppm, based on the total weight of the composite particles, wherein the metal oxide SiO, TiO, AlOor mixtures thereof. 1. Co/metal oxide/ZnS composite particles , comprising:a ZnS core; and{'sub': 2', '2', '2', '3, 'a metal oxide coating surrounding the core, said coating having a content of cobalt from 1 to 150 ppm, based on the total weight of the composite particles, wherein the metal oxide is selected from the group consisting of SiO, TiO, AlOand mixtures thereof.'}2. The composite particles according to claim 1 , having a ZnS core and the metal oxide coating surrounding the core claim 1 , wherein the core is cobalt-free.3. The composite particles according to claim 1 , having a content of cobalt from 5 to 120 ppm claim 1 , based on the total weight of the composite particles.4. The composite particles according to claim 1 , having the metal oxide coating in a mass from 0.1 to 10% by weight metal oxide claim 1 , based on the total weight of the composite particles.5. The composite particles according to claim 4 , having the metal oxide coating in a mass from 0.5 to 5% by weight AlO claim 4 , based on the total weight of the composite particles.6. The composite particles according to claim 4 , having the metal oxide coating in a mass from 0.5 to 3% by weight SiO claim 4 , based on the total weight of the composite particles.7. The composite particles according to claim 4 , having the metal oxide coating in a mass from 0.5 to 3% by weight TiO claim 4 , based on the total weight of the composite particles.8. The composite particles according to claim 1 , having a particle size from 10 nm to 5 μm.9. A method for producing the Co/metal oxide/ZnS composite particles according to claim 1 , said method comprising the following steps:{'sup': '2+', 'a. applying a Co-containing layer to ZnS particles by treating the ...

RACK PLATING

A method of plating the connector frames includes, in part, placing the frames in a vibrating bowl to enable the bowl's vibrations load the frames in a predefined orientation onto the vibrating bowl's channel. The properly oriented frames are delivered from this channel to a track. Subsequently, a multitude of sub-racks securely engage and lift the frames from the track. The sub-racks are afterwards aggregated to form a larger rack which transports the frames to a plating tank in which the plating operation is performed. Optionally, the spacing between adjacent frames in the track is such that no contact between adjacent frames can occur. Each sub-rack has a multitude of hooks or springs adapted to engage the frames. The sub-racks may be aggregated in a horizontal direction or a vertical direction to form the larger rack. 1. A method of plating a plurality of frames each associated with a different one of a plurality of connectors , the method comprising:placing the plurality of frames in a vibrating bowl;loading each of said plurality of frames onto a channel of the vibrating bowl and in a predefined orientation in response to vibrations of the vibrating bowl;transferring said plurality of frames from the vibrating bowl's channel to at least one track;using a plurality of sub-racks to engage and lift the plurality of frames from the at least one track;aggregating the plurality of sub-racks to form a rack; andtransporting the rack to a plating tank to plate the plurality of frames.2. The method of wherein adjacent frames in the at least one track are spaced apart so as to inhibit contact therebetween.3. The method of wherein a distance between adjacent frames in the track is defined by a height and a width of the plurality of frames.4. The method wherein each of the plurality of sub-racks has a plurality of hooks each adapted to engage an opening of at least one of the plurality of frames.5. The method wherein each of the plurality of sub-racks has at least one ...

HIGH TEMPERATURE ADDITIVE MANUFACTURING FOR ORGANIC MATRIX COMPOSITES

A method for fabricating a metal part with additive manufacturing includes additive manufacturing a resin into a desired shape having an outer surface, followed by preparing the outer surface to receive a catalyst, activating the outer surface with the catalyst; and then plating a first metal onto the outer surface and the catalyst to form a first layer to form a structure. The resin is selected from imidized polyimide, bismaleimide and combinations thereof. 1. A method for fabricating a metal part , the method comprising:additive manufacturing a resin into a desired shape having an outer surface;preparing the outer surface to receive a catalyst;activating the outer surface with the catalyst; andplating a first metal onto the outer surface and the catalyst to form a first layer to form a structure.2. The method of wherein the resin is selected from the group consisting of imidized polyimide claim 1 , bismaleimide and combinations thereof.3. The method of wherein the imidized polyimide is solid at room temperature and is the appropriate size for powder bed processing (SLS).4. The method of wherein the imidized polyimide is solid at room temperature and is melted for liquid bed processing (SLA).5. The method of wherein the bismaleimide is solid at room temperature and is the appropriate size for powder bed processing (SLS).6. The method of wherein the bismaleimide is solid at room temperature and is melted for liquid bed processing (SLA).7. The method of further including depositing a second metal onto the structure.8. The method of further including depositing a third metal onto the structure.9. The method of further including the alloying of the first and second metals.10. The method of further including the alloying of the first claim 9 , second and third metals.11. The method of wherein the alloying is a process selected from the group consisting of transient liquid phase (TLP) bonding claim 9 , brazing claim 9 , diffusion bonding claim 9 , heat treating claim 9 , ...

Continuous process for manufacturing graphene-mediated metal-plated polymer article

A continuous process for producing a surface-metalized polymer article, comprising: (a) continuously immersing a polymer article into a graphene dispersion comprising multiple graphene sheets dispersed in a liquid medium for a period of immersion time and then retreating the polymer article from the dispersion, enabling deposition of graphene sheets onto a surface of the polymer article to form a graphene-attached polymer article; (b) continuously moving the graphene-attached polymer article into a drying or heating zone to enable bonding of graphene sheets to said surface to form a graphene-covered polymer article; and (c) continuously moving the graphene-covered polymer article into a metallization zone where a layer of a metal is chemically, physically, electrochemically or electrolytically deposited onto a surface of the graphene-covered polymer article to form the surface-metalized polymer article. Step (a) may be preceded by a surface treatment of the polymer article. 1. A continuous process for producing a surface-metalized polymer article , said process comprising:a) continuously immersing a polymer article into a graphene dispersion comprising multiple graphene sheets dispersed in a liquid medium for a period of immersion time and then retreating said polymer article from said dispersion, enabling deposition of graphene sheets onto a surface of said polymer article to form a graphene-attached polymer article;b) continuously moving the graphene-attached polymer article into a drying or heating zone to enable bonding of graphene sheets to said surface to form a graphene-covered polymer article; andc) continuously moving said graphene-covered polymer article into a metallization zone where a layer of a metal is chemically, physically, electrochemically or electrolytically deposited onto a surface of said graphene-covered polymer article to form said surface-metalized polymer article.2. The process of claim 1 , further comprising claim 1 , prior to step (a) ...

PROCESS FOR GRAPHENE-MEDIATED METALLIZATION OF POLYMER ARTICLE

Provided is a process for producing a surface-metalized polymer article, comprising: (a) preparing a graphene dispersion comprising multiple graphene sheets and an optional conductive filler dispersed in a first liquid medium, which is an adhesive monomer or contains a liquid adhesive monomer, oligomer or polymer dissolved in a solvent; (b) bringing a polymer article into a graphene deposition zone, wherein the graphene dispersion is sprayed, painted, coated, cast, or printed to deposit graphene sheets and optional conductive filler to a surface of the polymer article; and (c) moving the graphene-coated polymer article into a metallization chamber which accommodates a plating solution therein for plating a layer of a desired metal onto the graphene-coated polymer article to obtain a surface-metalized polymer article and retreating the surface-metalized polymer article from the metallization chamber. 1. A process for producing a surface-metalized polymer article , said process comprising:(A)preparing a graphene dispersion comprising multiple graphene sheets and an optional conductive filler dispersed in a first liquid medium, which is an adhesive resin monomer or contains a liquid adhesive monomer, oligomer or polymer dissolved in a solvent;(B) bringing a polymer article into a graphene deposition zone, wherein said graphene dispersion is sprayed, painted, coated, cast, or printed to deposit said graphene sheets and optional conductive filler to a surface of the polymer article for forming a graphene-coated polymer article; and(C) moving said graphene-coated polymer article into a metallization chamber which accommodates a plating solution therein for plating a layer of a desired metal onto said graphene-coated polymer article to obtain a surface-metalized polymer article and retreating said surface-metalized polymer article from said metallization chamber;wherein said multiple graphene sheets contain single-layer or few-layer graphene sheets selected from a pristine ...

Radiation Curable Composition for Plating Applications

A radiation curable composition comprising: a) at least one monofunctional (meth)acrylate containing a carboxylic acid group, a phosphoric acid group or a phosphonic acid group; b) an acrylamide; c) at least one polyfunctional (meth)acrylate; characterized in that the radiation curable composition further comprises at least 0.1 wt % of a liquid penetrating controlling monomer selected from the group consisting of a C6-C20 alkyl (meth)acrylate, a fluorinated (meth)acrylate and a silicone (meth)acrylate. 115-. (canceled)16. A radiation curable composition comprising:a) at least one monofunctional (meth)acrylate containing a carboxylic acid group, a phosphoric acid group, or a phosphonic acid group;b) an acrylamide; andc) at least one polyfunctional (meth)acrylate,wherein the radiation curable composition further comprises at least 0.1 wt % of a liquid penetrating controlling monomer selected from the group consisting of a C6-C20 alkyl (meth)acrylate, a fluorinated (meth)acrylate, and a silicone (meth)acrylate.17. The radiation curable composition of claim 16 , wherein the amount of liquid penetrating controlling monomer is at least 1 wt % relative to the total weight of the composition.18. The radiation curable composition of claim 16 , wherein the liquid penetrating controlling monomer is selected from a fluorinated acrylate and a silicone acrylate.19. The radiation curable composition of claim 16 , wherein the acrylamide is acryloyl morpholine.20. The radiation curable composition of claim 16 , wherein the monofunctional (meth)acrylate containing a carboxylic acid group claim 16 , a phosphoric acid group or a phosphonic acid group is selected from the group consisting of acrylic acid claim 16 , 2-carboxyethyl acrylate claim 16 , 2-acryloyl ethyl succinate claim 16 , and 2-hydroxyethyl methacrylate phosphate.21. The radiation curable composition of claim 16 , wherein the polyfunctional (meth)acrylate is selected from the group consisting of dipropylene glycol ...

Functionalized Graphene-Mediated Metallization of Polymer Article

Provided is a surface-metalized polymer article comprising a polymer component having a surface, a first layer of multiple functionalized graphene sheets having a first chemical functional group, multiple functionalized carbon nanotubes having a second chemical group functional group, or a combination of both, which are coated on the polymer component surface, and a second layer of a plated metal deposited on the first layer, wherein the multiple functionalized graphene sheets contain single-layer or few-layer graphene sheets and/or the multiple functionalized carbon nanotubes contain single-walled or multiwalled carbon nanotubes, and wherein the multiple functionalized graphene sheets or functionalized carbon nanotubes are bonded to the polymer component surface with or without an adhesive resin. 1. A surface-metalized polymer article comprising a polymer component having a surface , a first layer of multiple functionalized graphene sheets having a first chemical functional group , multiple functionalized carbon nanotubes having a second chemical group functional group , or a combination of both that are coated on said polymer component surface , and further comprising a second layer of a plated metal deposited on said first layer , wherein said multiple functionalized graphene sheets contain single-layer or few-layer graphene sheets and said multiple functionalized carbon nanotubes contain single-walled or multiwalled carbon nanotubes , and wherein said multiple functionalized graphene sheets or functionalized carbon nanotubes are bonded to said polymer component surface with or without an adhesive resin and said first layer has a thickness from 0.34 nm to 30 μm.2. The surface-metalized polymer article of claim 1 , wherein said first chemical functional group or said second chemical functional group is selected from alkyl or aryl silane claim 1 , alkyl or aralkyl group claim 1 , hydroxyl group claim 1 , carboxyl group claim 1 , amine group claim 1 , sulfonate ...

Thermoplastic resin composition, method of preparing the same, and molded part manufactured using the same

Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 μm or more and less than 0.2 μm; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 μm; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer.

ARTICLES FOR MANIPULATING IMPINGING LIQUIDS AND METHODS OF MANUFACTURING SAME

This invention relates generally to an article that includes a non-wetting surface having a dynamic contact angle of at least about 90°. The surface is patterned with macro-scale features configured to induce controlled asymmetry in a liquid film produced by impingement of a droplet onto the surface, thereby reducing time of contact between the droplet and the surface. 1. An article comprising a non-wetting surface having a dynamic contact angle of at least about 90° , said surface patterned with macro-scale features configured to induce controlled asymmetry in a liquid film produced by impingement of a droplet onto the surface , thereby reducing time of contact between the droplet and the surface.2. The article of claim 1 , wherein the non-wetting surface is superhydrophobic.3. The article of claim 1 , wherein the non-wetting surface is superoleophobic.4. The article of claim 1 , wherein the non-wetting surface is supermetallophobic.5. The article of claim 1 , wherein the surface comprises a non-wetting material.6. The article of claim 1 , wherein the surface comprises non-wetting features.7. The article of claim 6 , wherein the non-wetting features are nanoscale pores.8. The article of claim 1 , wherein the surface is heated above its Leidenfrost temperature.9. The article of claim 1 , wherein the macro-scale features comprise ridges having height Aand spacing λ claim 1 , with A/h greater than about 0.01 and λ/Agreater than or equal to about 1 claim 1 , wherein h is lamella thickness upon droplet impingement onto the surface.1019-.20. The article of claim 1 , wherein the macro-scale features are hemispherical protrusions.2125-. (canceled)26. The article of claim 1 , wherein the macro-scale features comprise a sinusoidal profile having amplitude Aand period λ claim 1 , with A/h>0.01 and λ/A≧2 claim 1 , wherein h is lamella thickness upon droplet impingement onto the surface.2733-. (canceled)34. The article of claim 1 , wherein the surface comprises an alkane.35. ...

ELECTROLESS NICKEL COATINGS AND COMPOSITIONS AND METHODS FOR FORMING THE COATINGS

An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound. 1. An aqueous electroless nickel plating bath for forming a black electroless nickel coating , the bath comprising:nickel,a hypophosphorous reducing agent,zinc,a bismuth stabilizer, andat least one of a complexing agent, a chelating agent, or a pH buffer, andwherein the bath is free of a sulfur compound.2. The bath of claim 1 , wherein hypophosphorous reducing agent is selected from the group consisting of sodium hypophosphite claim 1 , potassium hypophosphite claim 1 , ammonium hypophosphite claim 1 , and combinations thereof.3. The bath of claim 1 , wherein the at least one pH buffer claim 1 , complexing agent claim 1 , or chelating agent is selected from the group consisting of acetic acid claim 1 , formic acid claim 1 , succinic acid claim 1 , malonic acid claim 1 , an ammonium salt claim 1 , lactic acid claim 1 , malic acid claim 1 , citric acid claim 1 , glycine claim 1 , alanine claim 1 , glycolic acid claim 1 , lysine claim 1 , aspartic acid claim 1 , ethylene diamine tetraacetic acid (EDTA) claim 1 , and combinations thereof.4. (canceled)5. The bath of claim 1 , wherein the nickel is provided in the solution in the form of a water soluble nickel salt.6. The bath of claim 5 , the nickel salt being selected from the group consisting of nickel chloride claim 5 , nickel bromide claim 5 , nickel iodide claim 5 , nickel acetate claim 5 , nickel malate claim 5 , and nickel hypophosphite.7. (canceled)8. The bath of claim 1 , having a pH of about 4.5 to about 5.0.9. The bath of claim 1 , comprising about 2 g/l to about 10 g/l nickel claim 1 , about 20 g/l to about 35 g/l of the hypophosphorous reducing agent claim 1 , about 1 g/l to about 75 g/l each of the complexing agent claim 1 , chelating agent ...

Ni-cu plated high-carbon steel wire for springs and method of manufacturing the same

Provided is a nickel (Ni)-copper (Cu) plated high-carbon steel wire for springs. The Ni—Cu plated high-carbon steel wire includes a core wire that includes a high-carbon steel wire; and a Ni-plating layer and a Cu player which are sequentially plated on a surface of the core wire and then are drawn.

SHIELDED CABLES

The present invention relates to a cable, suitable for both electrical and data transmission, comprising at least one shield layer, comprising a metal layer directly adhering onto the polymeric layer. 1. A cable (C) comprising at least one cable core and at least one shield layer (S) surrounding said cable core , [{'sub': 'P', 'is made from a composition (C) comprising at least one melt-processable polymer (P) and'}, {'sub': i', 'o', 'o', 'M, 'has an inner surface (S) and an outer surface (S) with respect to the position of the cable core, said surface (S) comprising at least one layer (L) comprising at least one metal compound (M).'}], 'characterized in that said at least one shield layer (S)'}2. The cable according to claim 1 , wherein said compound (M) comprises at least one metal selected from the group consisting of: Rh claim 1 , Ir claim 1 , Ru claim 1 , Ti claim 1 , Re claim 1 , Os claim 1 , Cd claim 1 , Tl claim 1 , Pb claim 1 , Bi claim 1 , In claim 1 , Sb claim 1 , Al claim 1 , Ti claim 1 , Cu claim 1 , Ni claim 1 , Pd claim 1 , V claim 1 , Fe claim 1 , Cr claim 1 , Mn claim 1 , Co claim 1 , Zn claim 1 , Mo claim 1 , W claim 1 , Ag claim 1 , Au claim 1 , Pt claim 1 , Ir claim 1 , Ru claim 1 , Pd claim 1 , Sn claim 1 , Ge claim 1 , Ga and alloys thereof.3. The cable according to claim 1 , wherein said surface (S) further comprises at least one nitrogen-containing group.4. The cable according to claim 1 , wherein said polymer (P) is selected from the group comprising: polyolefins; polyamides; and (per)fluorinated polymers.5. The cable according to claim 4 , wherein said polymer (P) is a semi-crystalline perfluoro-polymer [polymer (P)] claim 4 , said polymer (P) being a copolymer comprising recurring units derived from TFE and recurring units derived from at least one perfluorinated monomer different from TFE [co-monomer (F)].6. The cable according to claim 4 , wherein said polymer (P) is a (per)fluoroelastomer [polymer (P)] comprising recurring units derived ...

Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts

Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.

Silicon steel composite for low denomination coin

An alloy includes: steel; manganese; aluminum; and silicon in an amount such that the alloy has an electrical conductivity from 2% IACS to 6% IACS measured in accordance with ASTM E1004-09 (2009).

RESIN PLATING METHOD

The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less. 1. A resin plating method comprisingan etching step in which an article comprising a resin material is used as an object to be treated and is subjected to etching using an acidic etching bath containing manganese;a catalyst application step using palladium as a catalyst metal; and an electroless plating step, the method further comprising a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.2. The resin plating method according to claim 1 , wherein the step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less is performed by one or more methods selected from the group consisting of: a method for removing palladium adsorbed on a jig; a method for reducing the palladium concentration in an etching bath by cathodic electrolysis; and a method for reducing the palladium concentration by iodide addition to an etching bath.3. The resin plating method according to claim 2 , wherein the method for removing palladium adsorbed on a jig is a method of immersing a jig in a palladium-removing treatment solution comprising an aqueous solution containing at least one compound selected from the group consisting of nitric acid claim 2 , persulfates claim 2 , hydrogen peroxide claim 2 , and compounds having a stability constant with palladium of 2.0 or more.4. The ...

METALLIZATION OF LOW TEMPERATURE FIBERS AND POROUS SUBSTRATES

Devices and methods for metalizing temperature sensitive materials including fabrics are provided. Contemplated method begins with a step of applying a catalyst solution on the temperature-sensitive material to form an at least partially catalyst-coated substrate. Then the catalyst-coated substrate is incubated at a relatively low temperature. Optionally, in some embodiments, the low temperature incubated substrate is incubated at a relatively high temperature. Then, a layer of an electroless metal is deposited on the at least partially catalyst-coated substrate using an electroless metal deposition technique. 1. A method of metalizing a temperature-sensitive material , comprising steps of:applying a catalyst solution on the temperature-sensitive material to form an at least partially catalyst-coated substrate;incubating the at least partially catalyst-coated substrate at a temperature less than 100 degree Celsius; anddepositing a layer of a metal on the at least partially catalyst-coated substrate using an electroless metal deposition technique.2. The method of claim 1 , wherein the metal comprises at least one of the following: copper and nickel.3. The method of claim 1 , wherein the temperature-sensitive material comprises at least one of the following: paper claim 1 , polyethylene claim 1 , clear olefininc polymers claim 1 , acrylonitrile butadiene styrene claim 1 , nylon claim 1 , cotton based material claim 1 , plant leaves claim 1 , protein claim 1 , and keratin-based material.4. The method of claim 1 , wherein the catalyst comprises at least one of the following: palladium claim 1 , silver claim 1 , gold claim 1 , tin claim 1 , and platinum.5. The method of claim 4 , wherein the catalyst is water insoluble.6. The method of claim 1 , further comprising a step of treating the temperature-sensitive material with a first acidic solution at a temperature less than 100 degree Celsius before applying the catalyst solution.7. The method of claim 6 , wherein the ...

Treated polymer production method, polymer, metal-plated polymer, and adhesion laminate

To provide a treated polymer production method which can be performed in a simplified manner and at low cost. In order to achieve the object, the treated polymer production method according to the present invention includes: reacting a surface of a polymer with a halogen oxide radical to surface-treat the polymer. The treated polymer is a metal-plated polymer, and the method further includes plating, with a metal, the surface of the polymer after the surface-treating, or the treated polymer is an adhesion laminate of the polymer and an adherend, and the method further includes adhering the adherend to the surface of the polymer after the surface-treating.