УСТРОЙСТВО ДЛЯ ИЗМЕРЕНИЯ ДАВЛЕНИЯ

Изобретение применяется для измерения давления, прежде всего для измерения высокого давления. Техническим результатом изобретения является возможность измерять высокое давление, превышающее 70 бар, при как можно меньшей передаче термомеханических напряжений на уязвимый к растрескиванию полупроводниковый датчик давления. Устройство имеет установленный в корпусе датчик давления, с первой стороны которого расположены чувствительные элементы и воспринимающая давление мембрана и со второй стороны которого, обратной первой его стороне, имеется углубление, проходящее от этой второй его стороны до воспринимающей давление мембраны. Датчик давления выполнен в виде полупроводникового датчика давления, который своим окружающим углубление краевым участком со второй стороны непосредственно припаян слоем припоя к несущей детали, в которой выполнен первый участок канала подвода давления, таким образом, что этот первый участок канала подвода давления и углубление сообщаются между собой. С наружной стороны ...

ДАТЧИК СО СРЕДСТВАМИ ЗАЩИТЫ ОТ ЖИДКОСТИ

... 1. Капсула датчика, содержащая: - блок, снабженный каналом для установки датчика, причем длина канала для установки датчика проходит от первой наружной поверхности блока до напорной камеры в блоке, блок дополнительно содержит канал для впуска жидкости, проходящий от второй наружной поверхности блока до напорной камеры, причем блок содержит два полублока, соединенных вдоль сопрягаемых поверхностей, проходящих в продольном направлении через канал для установки датчика, - датчик, содержащий шейку датчика, проходящую через канал для установки датчика, поверхность, чувствительную к жидкости, располагаемую в напорной камере, и электрические присоединительные выводы датчика, расположенные снаружи напорной камеры, причем шейка датчика отделена от канала для установки датчика зазором, который проходит непрерывно вокруг шейки датчика; - паяное соединение датчика для заполнения зазора для соединения шейки датчика с каналом для установки датчика. 2. Капсула датчика по п.1, в которой паяное соединение ...

ДАТЧИК ДАВЛЕНИЯ С КАБЕЛЕМ С МИНЕРАЛЬНОЙ ИЗОЛЯЦИЕЙ

Тиристорный выпрямитель для статического преобразователя высокого напряжения

Eine Schaltung für einen Sensor, fähig, Hochfrequenzrauschen zu verhindern

Drucksensor-Bauelement und Verfahren zur Herstellung

HOCHDRUCK-SENSOR-GEHAEUSE MIT VERBINDUNGSTEIL (EMV-ABSCHIRMUNG)

Konstruktion einer Einschnappassung für eine billige druckempfindliche Maschine.

GESCHÜTZTER DRUCKSENSOR.

Manometer has silicon membrane in disc - with resistance depending on curvature, for use in power stations, chemical plant and medicine

Manometer has a Si membrane with an electric resistance path having a resistance which is a measure of the curvature of the membrane. It has a Si disc with plane parallel surfaces made thin in the area of the membrane, so that the disc has an indentation on its upper and lower surfaces. Overload parts are connected to the disc and there are pressure channels leading from the edge of the disc to the membrane and pressure chambers between the membrane and each of the overload parts. Used in pipeline systems, e.g. in power stations and chemical plants, and also for measuring blood pressure in blood vessels. The manometer is extremely sensitive, e.g. for the 0-100 mbar range, but can be used with pressures up to 100 bar. The disc is ca. 5 mm in dia. and 25 mu m thick and the membrane 1-3 mm in dia. and 15 mu m thick, whilst the channels are 5 mu m deep and 10 mu m wide.

MESSZELLE, INSBESONDERE FUER RELATIV- UND DIFFERENZDRUCKMESSUNGEN.

Semiconductor sensor, e.g. for pressure measurement etc.

A semiconductor sensor is claimed, with a sensor element (1) consisting of semiconductors and enclosed in a resin housing (5, 6). The housing is connected with another part (2) of the sensor, and a section (5a, 6a) of the housing in contact with part (2) is irradiated with UV to improve its adhesion. Also claimed are (i) a sensor as above, with a connector frame (2) which is electrically connected to element (1), the contact sections (2a, 2b) of the frame and (5a, 6a) of the housing being irradiated with UV as above; (ii) a sensor with an element (1) on a substrate (9), with a housing (5) enclosing the element and stuck to the substrate, the contact section of (5) being irradiated as above; (iii) a sensor with an element on a substrate stuck to the inner wall of a hollow housing, one end of which is open but sealed with a casting resin so that both substrate and element are surrounded by a closed cavity, the inner wall being irradiated with UV at the contact points with the substrate; ( ...

Semiconductor pressure measuring sensor

The pressure measuring sensor (100) has a semiconductor pressure measuring chip (1) with a pressure-sensitive bottom surface and a vacuum chamber (2) above its top surface, defined by a glass cap (3) attached to the top surface of the pressure measuring chip. An IC chip (4) for processing the pressure measuring signals is mounted on the glass cap.

Drucksensor

Pressure detection unit has a housing section of injection molded plastics with glass fibers fitted to a second housing section to form a pressure detection chamber with a sensor and a sealed fit for the O-ring seal

To produce a pressure detection unit, such as at an O-ring seal, an initial housing (3) is formed by injection molding of a plastics into a mold with the required inner contour shape. The housing (3) is fitted to a second housing (7) to give a pressure detection chamber (10) to contain a sensor (1). An O-ring (12) is between the housing sections (3,7) as a hermetic seal, which is compressed between the housing sealing surfaces of the seal groove (13) and a press unit (9). The mold has an upper surface which matches the seal, to shape the sealing surface of the first housing section (3), and an inlet opening is at a suitable point for the injected plastics to flow into the hollow zone of the mold on a path which is generally parallel to the surface matching the seal. The first housing section (3) has a cylindrical shape, fitted to the second housing section (7) with a joint at its axial end side. The sealing surface of the first housing section (3) is arranged at the axial end side of the ...

UEBERZUGSMITTEL AUF DER BASIS VON WAESSRIGEN KALIUMSILIKATLOESUNGEN UND FEINTEILIGEM ZINK

Drucksensormodul

The invention relates to a pressure sensor module for measuring the pressure of a corrosive medium. Conventional pressure sensor cells are modified by way of a pressure sensor chip for the purpose of corrosion protection, which requires a large volume of the liquid that transmits the pressure. This is disadvantageous for calibration and for a high measuring accuracy. The inventive pressure sensor module (1) uses a conventional sensor cell (5) that is connected to an adapter (21) that has a very small volume for a pressure-transmitting medium.

Pressure measurement, especially differential pressure measurement between two fluids, in which gluing of support and pressure sensor is used

Pressure gauge comprises a pressure sensor (108) with a membrane (110) and a sensor-connecting surface. The latter contacts a support substrate (104) surface and the two are glued together using electrically conducting isotropic glue so that contacts (116, 120) of each surface are connected. Anisotropic conducting glue ensures that the membrane is arranged over the pressure opening (106) and that a pressure-tight seal is made between the pressure sensor and the support substrate.

Feldgerät und Verfahren zum Betrieb des Feldgerätes

The invention relates to a field device (1) comprising a field device housing (2.1) with field device electronics (2.1), and a sensor unit (4) for process measuring techniques. The sensor unit (4) is mechanically connected to the field device housing (2). According to the invention, the sensor unit (4) and the field device housing (2) are constructed as modules and the connection (6) between the sensor unit (4) and the field device housing (2) is carried out in a detachable manner from the outside of the field device housing (2).

Transducer assembly and method

Semiconductor Physical Quality Sensor

A semiconductor physical quantity sensor which is inexpensive, accurate, and has improved resistance to noise. The sensor comprises several digital input/output pads, 1 to 7, connected to a semiconductor chip. These pads are used to digitally trim the sensed signal in order to obtain a predetermined output. Trimming pads 3, 4 and 5 and ground pad 1 are connected to a ground terminal outside the chip and trimming pads 6 and 7 and power supply pad 2 are connected to a power supply terminal outside the chip.

DIFFERENTIAL PRESSURE/STATIC PRESSURE UNIT

A method and apparatus for handling sacks, in particular paper sacks

In the handling of sacks the stretched out mouth (11) of the filled sack (10) is rolled at least one and a half turns about a rigidifying strip (12) and is fixed in the rolled-up state about this strip eg by stapling. The rolled-up mouth is passed down into an upwardly- open groove (17) in a lifting device (15) preferably a U-profile. The groove (17) is of but slightly greater width than the thickness of the rolled-up mouth (11) so that this is locked in the groove (17) on lifting of the sack by means of the lifting device. ...

STRAIN GAUGE TRANSDUCER AND PROCESS FOR FABRICATING SAME

PRESSURE SENSOR.

PROTECTED PRESSURE SENSOR.

Pressure-sensitive electrical drag element for printing and power measurement

CELL HOLDING A PRESSURE PICK-OFF PARTICULARLY MADE OF CERAMIC

DISPOSABLE TRANSDUCER APPARATUS FOR AN ELECTROMANOMETRY SYSTEM

DISPOSABLE TRANSDUCER APPARATUS FOR AN ELECTROMANOMETRY SYSTEM of the Invention The disposable transducer includes a small housing constructed of lightweight plastic material. The housing is shaped so as to form a transparent chamber within which is situated a very small piezoresistive strain gauge in the form of a resistive bridge network diffused onto a semiconductor substrate. The semiconductor substrate is electrically isolated by means of a nonconductive gel which partially fills the transparent chamber in which the semiconductor substrate is positioned. The resistive bridge network of the semiconductor substrate is also electrically connected to a plurality of calibration resistors which are separately formed on the semiconductor substrate, making the entire apparatus economically disposable after a single use.

PRESSURE TRANSDUCER FOR LIQUIDS OR GASES

ELECTROSTATIC DISCHARGE RESISTANT PRESSURE SENSOR

A pressure sensor includes a housing, a pressure chamber defined within the housing, and a pressure transducer. The pressure sensor also includes a header that seals the pressure chamber and supports the pressure transducer in the pressure chamber. A plurality of pins extend through respective openings in the header. The sensor pins have first ends electrically connected to the pressure transducer in the pressure chamber and second ends electrically connected to sensor electronics outside the pressure chamber. The pins are electrically insulated from the header. The header is configured so that the electrical insulation of at least one pin from the header is less than the electrical insulation of the remaining pins from the header.

PRESSURE SENSOR WITH MINERAL INSULATED CABLE

A pressure measurement system (10) is provided. The system (10) includes a pressure sensing probe (16) extendable into a process fluid and having a pressure sensor (50) with an electrical characteristic that varies with process fluid pressure. A mineral insulated cable (18) has a metallic sheath (30) with a distal end attached to the pressure sensing probe and a proximal end. The mineral insulated cable (18) includes a plurality of conductors (34, 36) extending within the metallic sheath (30) and being spaced from one another by an electrically insulative dry mineral (58). The proximal end of the metallic sheath is configured to be sealingly attached to a process fluid vessel (14).

PROCESS FLUID PRESSURE SENSING ASSEMBLY FOR PRESSURE TRANSMITTERS SUBJECTED TO HIGH WORKING PRESSURE

A pressure measurement assembly (20) is provided. The assembly includes a pressure sensor mount (40) having an aperture (36) therethrough. A pressure sensor (52) passes through and is mounted to the aperture (36). The pressure sensor (52) has an electrical characteristic that varies with applied pressure. An isolator plug (50) is configured to be exposed to a process fluid. The isolator plug has an isolation diaphragm (64) disposed to contact the process fluid. A passageway (66) is fluidically coupled to the isolation diaphragm (64) to convey process fluid pressure from the isolation diaphragm (64) to the pressure sensor (52) through an incompressible fluid. The pressure sensor mount (40) is coupled to the isolator plug (50) and has a non-circular shape when viewed along an axis of the aperture.

VALVE ASSEMBLY WITH INTEGRAL SENSORS

A valve assembly includes an electronics housing (14) and a valve housing assembly (12) engaged to the electronics housing. The valve housing assembly includes a valve body (16) defining a plurality of fluid ports (39) in fluid communication with the valve bore (24). A plurality of fluid dampeners (40) is disposed in the fluid ports. A sensor plate (52) is engaged to the valve body. The sensor plate defines a plurality of sensor ports (76) that are generally aligned with the fluid ports (39) of the valve body. At least four fluid sensors (50) are disposed in the plurality of fluid ports (39) of the valve body. A cover (84) is engaged to the sensor plate (52). The cover defines a cavity. A circuit board (82) is disposed in the cavity of the cover. The circuit board is in electrical communication with the fluid sensors (50).

PIEZORESISTIVE PRESSURE TRANSDUCER

... 2082419 9117418 PCTABS00008 A piezoresistive pressure transducer (80) employing a sapphire force collector diaphragm (1) having piezoresistive films of silicon epitaxially formed on a major surface thereof, preferably in a Wheatstone bridge pattern. The piezoresistive elements (7, 22) of the Wheatstone bridge are oriented so that the pressure sensitivity is maximized, while the linearity errors of the output voltage of the bridge in relationship to the applied pressure are minimized. The silicon film is preferably of a thickness of from 1000 to 60,000 angströms and is doped with boron in the range of from 5x1017 to 9x1020 atoms/cc. Electrical arms (24) and contact pads (19) are also formed on the major surface of the diaphragm. The diaphragm (1) is mounted on a ceramic body (3) having a cavity (15) in the upper surface thereof, the diaphragm (1) enclosing the cavity (15) to form a protective chamber with the films within the chamber. The diaphragm is hermetically bonded by the ceramic glass ...

PRESSURE TRANSMITTER WITH HIGH PRESSURE ISOLATOR MOUNTING ASSEMBLY

A pressure transmitter (10) includes an isolator mounting assembly (12, 150) for isolating process fluid from an interior cavity (22) of the pressure transmitter (10). The isolator mounting assembly (12, 150) includes an isolator plug (66, 152) for receiving the process fluid line pressure and coupling the line pressure to a sensor cavity (32) formed by a header (68, 154) joined to a distal end of the plug (66, 152). A ring member (70) is attached to the header (68, 154) and the distal end of the plug (66, 152) to reinforce the joint formed between the isolator plug (66, 152) and the header (68, 154). In another embodiment, the isolator mounting assembly (150) includes a base (154) and a support (181) having first and second opposed ends (190, 202). The first end (190) is rigidly bonded to the pressure sensor (184) while an epoxy joint (200) joins the second end (202) of the support (181) to the base (154).

Composition pour protéger des métaux

DRUCKAUFNEHMER FUER FLUESSIGKEITEN ODER GASE.

Verfahren zur Herstellung einer Halbleitervorrichtung mit nebeneinanderliegenden Bereichen unterschiedlicher Dicke, nach dem Verfahren hergestellte Halbleitervorrichtung und Verwendung derselben zur Umwandlung mechanischer Kräfte in Elektrische Signale

Piezoresistives Druck- und Kraftmesselement

Piezoresistive pressure element subassembly

PROCEDURE AND DEVICE FOR THE HANDLING OF SAE, IN PARTICULAR PAPER BAGS.

ДИФФЕРЕНЦИАЛЬНЫЙ ДАТЧИК ДАВЛЕНИЯ

Дифференциальный датчик давления с малым гистерезисным объемом, содержащий сенсор (1), две смежные с ним камеры (2, 3) для измерения давления, две воспринимающие давление камеры (22, 32), закрытые разделительными мембранами (21, 31), и две камеры (23, 33) перегрузки, разобщенные между собой мембраной (6) перегрузки, в котором мембрана (6) перегрузки содержит замкнутые наружную и внутреннюю кромки и прочно закреплена вдоль этих наружной и внутренней кромок.

Pressure sensor

Pressure sensor and its manufacturing method

Transducer assembly and method

PRESSURE PICK-UP

Together of connection of a semiconductor pastille

L'invention concerne un ensemble de connexion d'une pastille semi-conductrice. Elle se rapporte à un ensemble qui comprend une pastille semi-conductrice (12) ayant plusieurs plages conductrices (18) de pastille afin qu'elles permettent la formation d'une connexion électrique avec la pastille, un substrat (26) ayant des dispositifs conducteurs (30) et plusieurs plages conductrices (28), une garniture (22) disposée entre les faces de la pastille et du substrat et ayant des ouvertures (36), et des dispositifs (40) conducteurs de l'électricité, séparés de la garniture et placés dans les ouvertures (36) de celle-ci en contact électrique avec les plages conductrices (18, 28) du substrat et de la pastille. Application aux capteurs de pression de carburant.

Improved screened electrical sensor

DETECTING DEVICE OF SEMICONDUCTOR TYPE

DEVICE OF DETECTION OF PRESSURE

CAPTEUR DE PRESSION A FONCTIONS MULTIPLES

Capteur de pression à fonctions multiples. Capteur de pression comprenant un premier capteur engendrant un premier signal de pression et possédant un premier organe sensible et un moyen appliquant une première pression à un côté du premier organe sensible, un second capteur engendrant un second signal de pression et possédant un second organe sensible et un moyen appliquant une seconde pression à un côté du second organe sensible; un boîtier ayant une chambre et supportant le premier et le second capteur avec les côtés opposés du premier et du second organe sensible exposés à la chambre, et cette dernière appliquant une troisième pression aux côtés opposés du premier et du second organe sensible, et un circuit combinant le premier et le second signal de pression afin d'engendrer un troisième signal de pression fonction du premier et du second signal de pression. Capteur applicable aux systèmes électroniques de commande d'injection de combustible pour moteurs à explosion.

Electrical pressure transducer with monitored reference chamber

Device for measuring pressure and/or traction exerted at different points of textile material that is used as e.g. garment, has snap fastener, where female part and/or male part of snap fastener is arranged interdependent of circuit board

La présente invention concerne un dispositif de mesure de la pression et/ou de la traction exercée en différents points d'une matière textile souple (1), pliable et/ou extensible, apte à être utilisée comme vêtement, parement ou similaire, et comprenant au moins un capteur (2) ; ledit dispositif est remarquable en ce qu'il comporte des moyens de connexion dudit capteur (2) à des moyens de traitement (4) du signal transmis par ledit capteur (2), lesdits moyens de connexion consistant dans au moins une partie femelle (5a) et/ou mâle (5b) d'un bouton pression (5) obtenu dans un matériau électriquement conducteur, solidaire de la matière textile et connecté audit capteur (2) et dans au moins une partie mâle (5b) et/ou respectivement femelle (5a) du bouton pression (5) solidaire d'un circuit électronique (4).

PRESSURE SENSOR DEVICE

PRESSURE SWITCH

A pressure switch having less error of a switch operation point, is small sized, and having resistance to dust, water, and chemical liquid. The pressure switch has a housing (2) made of resin with resistance to chemical liquid, a pressure sensor (3) for detecting the pressure of fluid, a partition member (4) made of resin with resistance to chemical liquid and preventing contact between the fluid and the pressure sensor (3), and a circuit section (5) for outputting ON and OFF signals based on an output from the pressure sensor (3). At least the pressure sensor (3) and the circuit section (5) are arranged in an enclosed space (S) constructed from the housing (2) and the partition member (4). © KIPO & WIPO 2008 ...

압력 센서

... 실시 예에 따르면 압력 센서는, 내부에 형성되는 통로부로 유입되는 기체의 압력을 측정하기 위한 스트레인 게이지를 포함하는 센서 모듈; 상기 스트레인 게이지와 전기적으로 연결되는 기판; 상기 센서 모듈의 적어도 일부를 감싸며, 상기 기판을 지지하기 위한 프레임; 상기 기판과 전기적으로 연결되며 외부 기기의 접점에 접촉되는 단자; 상기 단자를 지지하기 위한 단자 홀더; 및 일측이 상기 하우징 또는 프레임에 연결되고, 타측은 상기 단자 홀더의 적어도 일부를 감싸는 하우징을 포함할 수 있다.

PRESSURE SENSOR AND ITS MANUFACTURE

PURPOSE: To obtain an inexpensive high-quality pressure sensor by constituting the sensor in such a way that the sensor can be manufactured through a less number of bonding steps than the conventional example and, at the same time, eliminating the need of a jig and a glass-made buffer member for positing electrode pins. CONSTITUTION: A pedestal package is provided with a metallic cylindrical member (metallic connector 6), positioning glass 4 which is provided in the cylindrical member and made of a nonconductive material, and hermetically sealing glass 5 which is laid on the glass 4 in the cylindrical member and made of such a nonconductive material that softens at a lower temperature than the glass 4 does. The package is also provided metallic electrode pins 3 which are passed through the glass 4 and 5. The contacting sections between the cylindrical member and glass 4 and between the pins 3 and glass 4 are hermetically sealed. COPYRIGHT 2001 KIPO ...

PRESSURE SENSOR FOR MOUNTING ON THE COMPONENTS SIDE OF A PRINTED CIRCUIT BOARD

PURPOSE: A pressure sensor is provided to measure the precise pressure of the media which will be provided to sensors and mount on the components side of a printed circuit board. CONSTITUTION: A pressure sensor consists of a chip carrier made of electro insulating material and having an approximately flat chip carrying surface(4) and electrode terminals(7) which extend through the chip carrier (5) and are electrically connected to the semiconductor chip (6). The semiconductor chip (6) with the pressure sensor and electro circuit assigned to this sensor is fastened to chip carrying surface(4). The chip carrier (5) is open at the side (22) opposite to the components side (2) of the printed circuit board and has at its edges (24, 25) that delimit the opening (23) supporting means (26) that form positively and mechanically engage, without play, holding means (27) for an adapter (28) that can be set on the chip carrier (5), so that when the adapter (28) is set on the chip carrier (5) the holding ...

ADAPTER OF CIRCUIT OF INSTRUMENT AMBIENTLY FORBIDDEN, AND, PROCESS TRANSMITTER

Disposição de sensor para um servofreio a vácuo, e, servofreio a vácuo

SURFACE MOUNT PACKAGE AND METHOD FOR FORMING MULTI-CHIP MICROSENSOR DEVICE

A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and leadouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.

PRESSURE SENSOR

Proposed is a pressure sensor in which the measuring element (1) is separated from the fluid (6) whose pressure is being measured by a porous panel (5). In addition, the measuring element can be covered by a thin film (7) of elastomeric material. The porous panel (5) protects the measuring element (1) from direct contact with liquids. The film (7) of elastomeric material protects the measuring element in addition from attack by corrosive gases. These features ensure particularly simple and inexpensive protection of the measuring element (1).

Pressure sensor and manufacturing method of the same

A pressure sensor includes: a main body case including a housing (1) and a joint (2); an electronic circuit (3) housed inside the main body case to convert detected pressure into electrical signals to send out; a connecting metal piece (5), one end (51)of which abuts on an electrode (31) of the electronic circuit (3); a terminal (4), one end (41) of which is joined to the other end (52) of the connecting metal piece (5) and the other end (42) of which is disposed outside the main body case; and a cushion (7) biasing the one end (51) to the electrode (31). The one end (51) and the electrode (31) are electrically connected by biasing force of the cushion (7), which eliminates welding, enabling manufacturing at low cost.

Semiconductor pressure sensor

A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a resin and having a concave portion (1a), a lead (2) formed integral with the package (1) by insert molding, with its one end exposed into the concave portion (1a) and its other end extended from the package (1) to the outside, a sensor chip (3) arranged in the concave portion (1a) for detecting pressure, and a bonding wire (4) electrically connecting the sensor chip (3) and the lead (2) with each other. An interface between the lead (2) and the package (1) on the side of the concave portion (1a) is covered with a first protective resin portion (6) of electrically insulating property, and the bonding wire (4) is covered with a second protective resin portion (7) that is softer than the first protective resin portion (6).

Pressure sensor

A pressure sensor has a metal housing. The housing has a closed-off and fluid-filled pressure space. A diaphragm partitions the pressure space off from the environment and transmits pressures derived therefrom to the fluid. A pressure-sensitive chip of semiconducting material is exposed to the pressure of the fluid and has a piezoresistant and anisotropic effect. Connectors, metal rods for instance, extend pressure-tight and electrically insulated from the metal housing into the pressure space. The connectors can be connected to an electric processing circuit. The pressure-sensitive chip is connected by bonds. To provide a pressure sensor that will be cheaper to manufacture, less sensitive to malfunction, and more precise, the pressure sensor is provided with a base plate of aluminum nitride. At least some areas of its surface are metallized. The pressure-sensitive chip is soldered to the base plate within a metallized area.

Photo-electric coupling device

A photo-electric coupling device has a semiconductor light-emitting element and light-responsive element, the latter element receiving directly and approximately perpendicularly light emitted from the light-emitting element through its active edge including an edge of a P-N junction thereof. The light-responsive element and the light-emitting element are mounted on free-end portions of respective leads bent about 45° out of a planar lead frame whereby a plane defined by the free-end portion carrying the light-responsive element is approximately perpendicular to a plane defined by the other free-end portion.

Pressure sensor and method for manufacturing the same

In a pressure sensor, a sensor element is mounted on a side of a first surface of a first case, and a second case having a cylindrical hollow portion is bonded to the first case to cover a part of a second surface of the first case, opposite to the first surface. Terminals are embedded in the first case to protrude from the second surface, and branch portions are branched from the terminals from an embedded portion in the first case to have exposed portions exposed to the second surface. A chip capacitor is mounted on the exposed portions on the second surface to be electrically connected to the exposed portions. In the pressure sensor, a diameter (D1) of the second surface of the first case is larger than an inner diameter (D2) of the hollow portion at a position where protrusion top ends of the terminals are positioned.

Pressure sensor intergrated into an electro-hydraulic control unit

A pressure sensor is mounted upon a hydraulic valve body. The sensor has a base which extends into a bore formed in the valve body. The valve body bore is in communication with a pressurized hydraulic fluid. A cover that is removably attached to the valve body encloses the pressure sensor. A circuit substrate is disposed within the cover and electrically connected to the pressure sensor.

Pressure sensor with stress isolation platform hermetically sealed to protect sensor die

An electronic pressure sensor (10) is enhanced by attaching a sensor die (18) to a stress isolation platform (12) using an adhesive (42) having a similar thermal coefficient of expansion. The adhesive provides a hermetic seal between the stress isolation platform and the pressure sensor die. A via (20) in the stress isolation platform provides an opening for pressure to be applied to the sensor die. The stress isolation platform is attached to a plastic package body (16) via a semi-rigid adhesive (40) for providing stress isolation and a hermetic seal between the package body and the stress isolation platform. Any hostile chemical entering the via contacts an exposed diaphragm (50) of the sensor die to assert pressure against its piezoelectric network (52) to generate the electrical signals representative of the applied pressure but are kept away from the sensitive interconnects by the hermetic seals.

Hermetically sealed pressure sensor

A pressure sensor includes a base unit, a cap-like metal container, and a flexible barrier diaphragm. A sensor chip is mounted on the base unit. The metal container is fixed to the base unit so as to seal the sensor chip. Oil is sealed in the metal container. The barrier diaphragm forms part of the metal container to transmit an external pressure by its displacement to the sensor chip through the oil. The base unit has a metal connector, a positioning glass member, an electrode pin, and a hermetic seal glass member. The positioning glass member is fitted in the metal connector and made of an insulating material. The electrode pin is supported to extend through the positioning glass member and electrically connected to the sensor chip through a bonding wire. The hermetic seal glass member is formed on the positioning glass member fitted in the metal container to hermetically seal a portion between the metal container and positioning glass member, and a portion between the electrode pin and ...

Semiconductor pressure sensor assembly having an improved package structure

Resistive strain gauge pressure sensor

A resistive strain gauge sensor of the type including a circuit board carrying circuitry, a diaphragm bonded to the circuit board, and strain gauge circuitry on the diaphragm. The strain gauge circuitry includes a plurality of leads defining free ends and the circuitry on the circuit board defines a plurality of leads defining free ends. The diaphragm is bonded to the circuit board by a frit layer and the frit layer includes voids which are in respective alignment with the free ends of the strain gauge leads and the free ends of the circuit board leads. A conductive epoxy is positioned in the voids in the frit layer to establish electrical communication between the strain gauge circuitry leads and the circuit board leads without the use of solder joints.

Fluid pressure transmitter assembly

A fluid differential pressure transmitter assembly includes a pressure sensor housing having a spacer within the housing to minimize the internal fill fluid used to conduct fluid pressure from a fluid inlet port to a pressure sensor located within the housing in the form of a pressure responsive diaphragm. Input pressures are applied to respective sides of the diaphragm to produce an electrical signal output representative of the differential pressure from piezoresistive elements deposited on the diaphragm. The sensor is electrically connected by flexible wires to electrically conductive paths supported on an end surface of the spacer. The conductive paths are, in turn, electrically connected to electrode wires at electrically conductive support junctions between the spacer and the electrode wires. However, the spacer is supported on the electrode wires at the support junctions in a free floating arrangement without any other physical contact to either adjacent elements within the housing ...

Intracranial pressure transducer

An intracranial pressure transducer includes a casing comprising an annular member having a screwed part on an outer wall thereof for fitting and securing a skull of a body. A pressure-electric transducing portion including a supporting member which is inserted within an inner wall of the casing and is tightly fixed to the predetermined upper portion from a tip portion of the casing, an indicating circuit for indicating the intracranial pressure in response to an output of strain sensitive elements, and indicating means. The intracranial pressure transducer converts intracranial pressure of a cerebrospinal fluid to the internal pressure of a pressure receiving layer of the transducer by the copanar Coplanar method which maintains the dura to be coplanar by the depression of the pressure receiving layer of the transducer against the dura, applies internal pressure of the pressure receiving layer to a strain sensing member, supplies an electrical signal by a strain sensitive element in response ...

Hermetic pressure sensor having a bending part

A hermetic pressure sensor for measuring a fluid pressure includes a hermetic housing, formed of a first housing structure with a membrane section, a second housing structure hermetically connected to the first structure, and one or more strain sensing elements attached to the membrane section. The second housing structure includes openings for one or more electrical pins while a non-conductive hermetic seal holds the electrical pins in place. The pressure sensor measures the pressure of fluid entering the housing while also providing a hermetic seal.

HOUSING FOR AN ELECTRICAL CIRCUIT

A housing for an electrical circuit, in particular for a sensor, pins projecting from the housing for the electrical contacting of the circuit, additional pins being provided which are not connected electrically to the circuit but instead are used as mechanical arrangement for fastening the housing to a printed circuit board in particular. The present invention further relates to a housing having an electrical circuit, in particular a sensor, pins projecting from the housing for the electrical contacting of the circuit, at least two pins being connected to one another mechanically via a connecting piece.

Semiconductor pressure sensor and die for molding the one

A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.

Sensor assembly and liquid level detection device

A sensor assembly comprises a housing, a pressure interface, a piezoelectric sensor, a mechanical interface, and an electrical interface. The pressure interface is disposed on the housing and communicates with a pressure transmission tube. The piezoelectric sensor is disposed in the housing and senses a pressure input at the pressure interface. The mechanical interface is disposed at a first side of the housing and detachably engages a mounting mechanism. The electrical interface is disposed at a second side of the housing opposite to the first side.

Vertical pressure sensor

A vertical pressure sensor having a fluid deforming pressure application unit, a sensor housing, a socket, a circuit board, a plurality of electrode terminals, and a plurality of electrical signal transmitting electrode rods. The pressure application unit includes a diaphragm to which strain gauges are attached. The socket surrounds a circumference of the diaphragm of the pressure application unit and includes a receiving passageway. The plurality of electrode terminals are provided at the upper end of the socket in a Wheatstone bridge circuit pattern. The plurality of electrode terminals protrude from the upper end of the socket to constitute an electrode tip. The circuit board connects to the plurality of electrode terminals to convert a pressure value into an electrical signal, and the plurality of electrode rods are connected to the circuit board to transmit the electrical signal outside.

METAL MEMBER WITH INSULATING FILM, PHYSICAL QUANTITY SENSOR, AND PRESSURE SENSOR

A metal member with insulating film includes a metal member, an insulating film, and a reinforcement portion. The metal member includes a film formation surface and a connection surface facing in a different direction from the film formation surface and connecting to the film formation surface. The insulating film covers at least a part of the film formation surface and the connection surface over a connection position between the film formation surface and the connection surface. The reinforcement portion is formed along a periphery of the insulating film at the connection position and covers at least a part of the periphery of the insulating film from an opposite side to the metal member.

Pressure sensor with low cost packaging

A pressure sensor (10, 110) is disclosed that may include a minimum amount of fluid coupling packaging. In one illustrative embodiment, a pressure sensor assembly (10, 110) may include a pressure sensor die (12, 112) having a front side (14, 114) and a back side (16, 116), and a pressure sensing diaphragm (18, 118). The pressure sensor assembly (10, 110) may further include a housing (20, 120) having a mounting side (22, 122) and a sensing side (24, 124). The sensing side may define a pressure port (26, 126). The pressure sensor die (12, 112) may be secured to the housing (20, 120) such that the pressure sensing diaphragm (18, 118) is exposed to the pressure port (26, 126), and such that front side (14, 114) of the pressure sense die (12, 112) is accessible from outside of the housing (20, 120).

PRESSURE SENSOR INTEGRATED INTO AN ELECTRO-HYDRAULIC CONTROL UNIT

PRESSURE SENSOR AND ROCKET ENGINE INCORPORATING SAME

... .The invention concerns a pressure sensor (2) comprising a pressure detecting element (21) designed to receive a pressure to be measured and to detect same, and a printed circuit (22) connected to the pressure detecting element (21) for electrical connection. The invention is characterised in that the electric connection comprises at least a flexible conductive blade (29) whereof one first end (290) is connected, directly or indirectly, to the printed circuit (22) and a second end (291) is simply supported on a corresponding contact (213) of the pressure detecting element (21). In order to ensure proper electric contact, the support surface (294) of the second end of the or each flexible conductive blade (29) on the corresponding electric contact (213a) is smooth.

圧力センサ装置および圧力センサ装置の製造方法

PRESSURE DETECTOR

PROBLEM TO BE SOLVED: To eliminate the possibility of lowering the quality of product even a pressure detector is applied to a semiconductor production process, by forming a passive film on the gas-contact face of a stainless steel diaphragm having specified dimensions provided on a diaphraqm base. SOLUTION: A diaphragm 3 of about 50μm thick having an inside diameter of about 10mm is made of stainless steel and has a gas-contact face 3a on which a passive film 3b of chromium oxide, a fluorinated passive film 3b or a mixed oxide passive film 3b of aluminum oxide and chromium oxide is formed. After forming the diaphragm 3 integrally with a diaphragm base 4, the diaphragm base 4 formed with the passive film 3b and a sensor base 1 are abutted against the gas contact face 3a of the diaphragm 3 and the entire circumference of the side wall face is welded 8. Subsequently, an oil injection hole 1b is filled with a pressure transmission medium (silicon oil) 5 and a sealing body (ball) 6 is welded ...

SEMICONDUCTOR PRESSURE SENSOR

PURPOSE: To obtain an inexpensive semiconductor pressure sensor having high sensitivity and temp. characteristics, by supporting a chip or a pedestal by an attachment plate through a thin walled tubular support member having coefficient of thermal expansion near to that of the constitutional material of the chip or the pedestal. CONSTITUTION: A semiconductor pressure sensor consists of a hollow cell 1, a semiconductor chip 2, a pedestal 3C made of a semiconductor, a lead wire 4, an external lead 5, a pressure introducing pipe 6, a seal ring 7, a tubular support member 8 and an attachment plate 1A. The thin walled tubular support member 8 for supporting the pedestal 3C is constituted of a material having coefficient of thermal expansion near to that of the pedestal (Si) (e.g., a 39% Ni-Fe alloy). Therefore, heat influence received from the attachment plate 1A by the pedestal 3C is small and the pedestal 3C can be made thin. As a result, a high sensitivity sensor is obtained. COPYRIGHT: ( ...

УСТРОЙСТВО ДЛЯ ИЗМЕРЕНИЯ ДАВЛЕНИЯ И ТЕМПЕРАТУРЫ ВО ВПУСКНОМ ГАЗОПРОВОДЕ ДВИГАТЕЛЯ ВНУТРЕННЕГО СГОРАНИЯ И СПОСОБ ИЗГОТОВЛЕНИЯ ТАКОГО УСТРОЙСТВА

Изобретение относится к измерительной техники и может быть использовано для измерения температуры и давления во впускном газопроводе двигателя внутреннего сгорания. Технический результат выражается в повышении точности измерений и упрощении конструкции устройства. Устройство для измерения давления и температуры во впускном газопроводе двигателя внутреннего сгорания содержит датчик температуры, размещенный в одном корпусе с датчиком давления, который вместе со схемой обработки закреплен, практически не деформируясь, на одном основании. Согласно изобретению корпус состоит по меньшей мере из двух отделенных друг от друга камер, одна из которых образует сообщающуюся через патрубок со впускным газопроводом и изолированную от окружающей среды камеру измеряемого давления, в которой расположена та часть основания, на которой закреплен датчик давления, а другая служит под размещение и крепление остальной части основания с контактными выводами, при этом для крепления основания и для герметизации ...

УСОВЕРШЕНСТВОВАННЫЙ ПРЕОБРАЗОВАТЕЛЬ ДАВЛЕНИЯ

Настоящая группа изобретений относится к области медико-биологических наук, к системе для мониторинга давления внутри одноразового сосуда. Система измерения давления содержит одноразовый контейнер (51), одноразовый технологический соединитель (220) и преобразователь (210) давления. Одноразовый технологический соединитель (220) выполнен с возможностью соединения непосредственно с одноразовым контейнером (51). Одноразовый технологический соединитель (220) имеет отклоняющуюся диафрагму (224). Преобразователь (21) давления разъемно соединен с одноразовым технологическим соединителем (220). Преобразователь (110) давления содержит изолирующую диафрагму (226), расположенную рядом с отклоняющейся диафрагмой (224), модуль (104) датчика давления оперативно соединен с изолирующей диафрагмой (226) и контроллер соединен с датчиком (104) давления. Контроллер выполнен с возможностью передавать измеренную величину давления в одноразовом контейнере (51). Технический результат - обеспечение высокой точности ...

ПРИБОР ДЛЯ ЯДЕРНОЙ ЭНЕРГЕТИЧЕСКОЙ УСТАНОВКИ

Изобретение относится к средствам контроля ядерных энергетических установок. Прибор (100) включает модуль (110) датчика, соединенный с рабочими фланцами (104, 106). Модуль (110) датчика включает в себя опорный трубопровод (120) с резьбами (122) опорного трубопровода. Электронная схема (126) соединяется с соединителем (128), который включает в себя ключ (133), который выравнивается с контактами схемы возбуждения соединителя (128). Экран (134) для защиты от теплового и ядерного излучения содержит электронную схему (126) и кольцо (136) противоударной защиты. Соединитель (128) крепится внутри кольца противоударной защиты. Экран (134) для защиты от теплового и ядерного излучения имеет резьбы (237) для выравнивания вращением ключа (133) относительно рабочего фланца. Технический результат - упрощение монтажа прибора в установке. 16 з.п. ф-лы, 18 ил.

ИЗМЕРИТЕЛЬНЫЙ ПРЕОБРАЗОВАТЕЛЬ РАЗНОСТИ ДАВЛЕНИЙ

Изобретение относится к измерительному преобразователю разности давлений с разделенным на две части поперек его продольной оси внутренним корпусом, между двумя частями корпуса которого закреплена несущая датчик давления 6 центральная мембрана 7. Одна часть корпуса содержит в отверстии электрический ввод, который внешней насадкой лежит в расширении отверстия и соединен ленточной проводящей пленкой 11 с электрическими выводами датчика давления 6. Для упрощения изготовления такого измерительного преобразователя относительно электрического ввода отверстие 31 расположено параллельно продольной оси 32 измерительного преобразователя. Отверстие 31 имеет на своем обращенном к другой части корпуса 3 конце расширение 33 и переходит на своем обращенном от другой части корпуса 3 конце в ведущее наружу поперечное отверстие 44. 1 з.п. ф-лы, 2 ил.

PIEZORESESTIVE DRUCKMESSZELLE

Integrierter Druck- und Temperatursensor

Eine kombinierte Druck- und Temperaturerfassungsvorrichtung umfasst eine Sensoranschlussgeometrie, die einen verbesserten Kontakt zwischen einem zu messenden Fluidmedium und einem Thermistorhohlraum des Sensoranschlusses bereitstellt. Die vergrößerte Kontaktfläche stellt eine verbesserte Antwortzeit und Genauigkeit verglichen mit zuvor bekannten integrierten Druck-Temperatursensoren bereit. Ein Temperatursensorelement ist von einem Drucksensorelement relativ zu einer Mittelachse des Temperatur-Drucksensorkörpers/Gehäuses versetzt, um eine wesentliche Vergrößerung eines Drucksensor-Hohlraumvolumens ohne Vergrößerung des Gesamtsensoranschlusssdurchmessers zu erleichtern. Ein drahtbondbarer Thermistorträgerabschnitt erleichtert eine automatisierte Fertigungsstraße. Das Temperaturerfassungselement kann mit dem Thermistorträgerabschnitt in einem parallelen Herstellungsprozess widerstandsgeschweißt werden.

AUF DER BESTÜCKUNGSOBERFLÄCHE EINER LEITERPLATTE MONTIERBARES DRUCKSENSOR-BAUELEMENT

Piezo-resistive pressure-measurement cell

A piezo-resistive pressure-measurement cell (1) normally has a measurement membrane (11) which is provided with resistors and has supply leads which originate from the connecting points of the resistor on the measurement membrane. In order to create a pressure-measurement cell which, with a very simple construction, can be used universally, and can be used as desired in accordance with the requirements, primarily by initial fitters, with pressure-measurement sensors, and which additionally permits a super-small, especially super-flat configuration, it is provided that the supply leads (19) be constructed on a plastic-film-material section (17) at whose one end the connecting points (15) of the resistor (3) make contact, via contact humps (21), with the supply leads (19) on the film-material section (17). In a special application case for producing a super-flat pressure-measurement cell, it is provided that said cell be arranged in a floating manner in the pressure cavity (79) and be held ...

Drucksensoreinheit, insbesondere für die Kraftfahrzeugtechnik

The invention relates to a pressure sensor unit, especially for automotive engineering applications, comprising a housing (3) in which a pressure-measuring cell (5) is located. It is possible to guide a pressure medium to said pressure-measuring cell via an inlet (15) of said housing. The housing also has connecting contacts (35) leading from the inside of said housing outwards. The pressure-measuring cell (5) comprises a measuring cell housing (9), in or on which a pressure sensor (19) is situated. It is possible to apply a pressure medium to said pressure sensor. The electrical connections of the pressure sensor (19) are connected to the outer connecting contacts (35) or connections (23) of an electronic circuit (25) or switching circuit. The measuring cell housing (9) is a moulded plastic part into which at least two electric conductors (21) are injected, said electric conductors (21) each extending with at least one first contact end into an area for receiving the pressure sensor (19 ...

Pressure sensor for measuring gas or fluid pressure

The pressure sensor (1) has a housing (2) defining a measuring space (6), supplied with the pressure to be measured, in cooperation with a measuring cell (4), supported by a holder (9) which is secured within the housing by inwards deformation of the housing wall. An Independent claim for a manufacturing method for a pressure sensor is also provided.

Protective cover for pressure sensor assemblies

The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.

Process fluid pressure transmitter with separated sensor and sensor electronics

A process fluid pressure transmitter has a remote pressure sensor. The transmitter includes an electronics housing and a loop communicator disposed in the electronics housing and being configured to communicate in accordance with a process communication protocol. A controller is disposed within the electronics housing and is coupled to the loop communicator. Sensor measurement circuitry is disposed within the electronics housing and is coupled to the controller. A remote pressure sensor housing is configured to couple directly to a process and is spaced from the electronics housing. A pressure sensor is disposed within the remote pressure sensor housing. The pressure sensor forms at least one electrical component having an electrical characteristic that varies with process fluid pressure. Portions of the electrical component are coupled directly to a multiconductor cable that operably connects the pressure sensor to the sensor measurement circuitry.

Arrangement for the Direct Contacting of Contact Mechanism and Associated Connection Unit for a Pressure Measurement Cell

An arrangement for the direct contacting of contact mechanism has a first contact mechanism arranged on a contact carrier and a second contact mechanism. The second contact mechanism acts with a predetermined contact force on the first contact mechanism. The contact carrier includes a plastic injection premolding of galvanizable plastic and a nongalvanizable plastic. The galvanizable plastic has a predetermined resilient behavior and the first contact mechanism is formed by a metal layer having predetermined dimensions. The first contact mechanism can be applied onto the galvanizable plastic in a galvanic process. The resilient behavior of the galvanizable plastic and the dimensions of the metal layer form, under the predetermined contact force, a microdepression configured to guide the second contact mechanism in the first contact mechanism. A corresponding connection device for a pressure measurement cell includes such a direct contacting arrangement.

Housing part for an electrical sensor as well as a method for manufacturing the housing part

A housing part for a strain sensor is described. The strain sensor includes at least one sensor element. The housing part includes an interior space for receiving the sensor element. The housing part includes a contract layer of electrically conducting material produced by way of thick film technology, the contact layer being intended for realization of an electrical feedthrough from the interior space to the outside.

PHYSICAL QUANTITY MEASURING DEVICE

A physical-quantity-measuring device includes: an outer-case including a bottom and a cylindrical body; a synthetic-resin-made inner-case provided inside the outer-case; a detector that detects a physical quantity; a terminal base including a terminal for transmitting a signal from the detector outward; a cover covering an opening of the outer-case and being different in hardness from the inner-case; a cable whose first end is connected to the terminal; and a cylindrical-cable-drawing portion drawing a second end of the cable and projecting from a circumferential surface of the outer-case. The inner case includes: a case threaded-portion; and a terminal-base-setting portion on which the terminal base is set. The detector includes: a bottom connector connected to the bottom; and a joint attachable to a target. The cover includes: a cover body covering the terminal-base-setting portion; and a cover threaded-portion provided to the cover body and screwable with the case threaded-portion. 1. A physical quantity measuring device comprising:an outer case comprising a bottom and a cylindrical body provided to a peripheral portion of the bottom;an inner case that is made of a synthetic resin and is provided inside the outer case;a detector that is provided to the bottom and configured to detect a physical quantity;a terminal base comprising a terminal configured to transmit a signal from the detector to an outside;a cover configured to cover an opening of the outer case and having a different hardness from that of the inner case;a cable having a first end connected to the terminal and a second end; anda cylindrical cable drawing portion drawing out the second end of the cable and projecting from a circumferential surface of the outer case,the inner case comprising: a case threaded portion; and a terminal base setting portion on which the terminal base is set,the detector comprising: a bottom connector connected to the bottom; and a joint attachable to an attachment target, ...

FLUID CIRCUIT MONITORING SYSTEM

A fluid circuit monitoring system for monitoring a fluid circuit includes a pressure sensor for sensing a pressure of fluid flowing in the fluid circuit and an interface member fluidly communicating the fluid circuit to the pressure sensor. The pressure sensor includes a sensing port configured to receive fluid therein. The interface member includes a channel having: a channel inlet in fluid communication with the fluid circuit and configured to be coupled thereto via tubing, and a channel outlet connected to the sensing port of the pressure sensor. The fluid circuit monitoring system also includes a control unit operatively connected to the pressure sensor for receiving, from the pressure sensor, a signal representative of the pressure measured by the pressure sensor. 1. A fluid circuit monitoring system for monitoring a fluid circuit , comprising:a pressure sensor for sensing a pressure of fluid flowing in the fluid circuit, the pressure sensor comprising a sensing port configured to receive fluid therein; a channel inlet in fluid communication with the fluid circuit and configured to be coupled thereto via tubing; and', 'a channel outlet connected to the sensing port of the pressure sensor,, 'an interface member fluidly communicating the fluid circuit to the pressure sensor, the interface member extending from a first end to a second end, the interface member comprising a channel havinga control unit operatively connected to the pressure sensor for receiving, from the pressure sensor, a signal representative of the pressure measured by the pressure sensor; the interface member is supported by the PCB;', 'the pressure sensor is mounted to and in communication with the PCB; and', 'the control unit is in communication with the PCB;, 'a printed circuit board (PCB), whereina housing supporting the PCB and at least partly enclosing the PCB, the pressure sensor and the interface member therein; andwherein the first end of the interface member is abutted by the pressure ...

PRESSURE SENSING DEVICE

A pressure sensing device includes: a body assembly having a main body with a sensor housing defined by an inner bottom wall and a side wall of the main body extending upwardly from the bottom wall into which a pressure sensor is disposed; the pressure sensor provided with a lower surface to be exposed to an applied pressure and having an upper contact portion disposed at an upper surface of the pressure sensor; a fluid inlet channel formed on the main body and a fluid pressure port formed in the sensor housing in communication with the fluid inlet channel and a connector assembly being at least partly placed into the body assembly having a connector body with an electrical circuit for providing an electrical output signal corresponding to the applied pressure; the electronic circuit having a connection member housing portion. 1. A pressure sensing device comprising:a body assembly having a main body with a sensor housing, wherein the sensor housing is defined by an inner bottom wall and a side wall extending upwardly from the inner bottom wall; a pressure sensor is disposed into the inner bottom wall; the pressure sensor provided with a lower surface to be exposed to an applied pressure and having an upper contact portion being on an upper surface of the pressure sensor;a fluid inlet channel formed on the main body and a fluid pressure port formed in the sensor housing in communication with the fluid inlet channels; anda connector assembly, wherein the connector assembly is at least partly placed into the body assembly having a connector body with an electrical circuit for providing an electrical output signal corresponding to the applied pressure; the electrical circuit has a connection member housing portion and at least two connection members attached to the connection member housing portion; the connector assembly is arranged to be aligned in the body assembly and the at least two connection members of the electrical circuit are brought into a position to ...

Sensor header assembly for increased reliability in high-pressure environments

Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. The depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation.

APHERESIS SYSTEM

A therapeutic apheresis system including a tube set and a panel is presented. The tube set includes an in-line pressure sensor in fluid connection with tubing. The panel includes apertures that are aligned with electrical connectors through which a rigid plug portion of an in-line pressure sensors extends and makes electrical connection with at least one electrical connector. 1. A tube set including tubing and at least one in-line pressure sensor , the in-line pressure sensor comprising: a fluid flow passage;', 'a window open to the fluid flow passage; and', 'a rigid plug portion fixed in relation to the housing and extending in a direction transverse to the fluid flow passage, the rigid plug portion including at least one electrical contact for mating with an external component; and, 'a housing includinga pressure transducer including a sensing region in pressure communication with the passage and a wiring contact in electrical connection with the at least one electrical contact;wherein the at least one in-line pressure sensor is fluidly connected with a portion of the tubing.2. (canceled)3. An apheresis system comprising: [ a fluid flow passage;', 'a window open to the fluid flow passage; and', 'a rigid plug portion fixed in relation to the housing and extending in a direction transverse to the fluid flow passage, the rigid plug portion including at least one electrical contact for mating with an external component; and, 'a housing including, 'a pressure transducer including a sensing region in pressure communication with the passage and a wiring contact in electrical connection with the at least one electrical contact;, 'an in-line pressure sensor comprisinga panel;a printed circuit board (PCB) mounted adjacent a back side of the panel and including at least one electrical connector, wherein the panel has an aperture that is aligned with the electrical connector and through which the rigid plug portion of the in-line pressure sensor extends and makes electrical ...

SYSTEM AND METHOD FOR OVER UNDER SENSOR PACKAGING

An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect. 1. A device , comprising:a body structure having an interior cavity;a control chip disposed on a first interior surface of the interior cavity;a landing pad disposed on the first interior surface and electrically connected to the control chip;a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface, the sensor having a mounting pad on a second side of the sensor that faces the first interior surface, wherein the sensor is vertically spaced apart from the control chip by an air gap, and wherein the sensor is aligned at least partially over the control chip; andan interconnect having a first end mounted on, and in direct contact with, the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, wherein all side surfaces of the interconnect are spaced apart from the interior surfaces of the interior cavity, wherein the side surfaces of the interconnect extend contiguously from the first end of the interconnect to a second end of the interconnect and are exposed to the interior cavity, and wherein the second end of the interconnect is connected to the landing pad by a ...

Sensor package

A sensor package includes a pressure sensor, a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor, a lead frame through which a result of computation performed by the computation unit is output to an outside, a main housing that is formed of resin and that holds the lead frame, and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed. The pressure sensor is disposed in the main housing using the sensor housing.

PRESSURE METER FOR FLUID CIRCUITS

The invention relates to a pressure meter for fluid circuits which has a pressure-sensitive cell that is arranged connected to an electronic circuit, connected to which, in turn, are terminals of a connector for connecting the meter in the application thereof, wherein the pressure-sensitive cell is housed in a metal body, wherein it rests by means of a seal, while a plastic disc is arranged resting against the surface of the upper face of the pressure-sensitive cell, whereon an electronic circuit is incorporated. 1. A pressure meter for fluid circuits comprising a pressure-sensitive cell that is arranged connected to an electronic circuit , connected to which , in turn , are terminals of a connector for connecting the meter in the application thereof , wherein the pressure-sensitive cell is housed in a metal body , against which it rests by means of a seal , while a plastic disc is arranged resting against the surface of the upper face of the pressure-sensitive cell , whereon an electronic circuit is incorporated.2. The pressure meterforfluid circuits claim 1 , according to claim 1 , wherein the electronic circuit is joined to the pressure-sensitive cell by means of rigid terminals.3. The pressure meter for fluid circuits claim 1 , according to claim 1 , wherein the electronic circuit is secured onto the plastic disc by means of a fastening terminal.4. The pressure meter for fluid circuits claim 1 , according to claim 1 , wherein the terminals of the connector connect to the electronic circuit by means of springs.5. The pressure meterforfluid circuits claim 1 , according to claim 1 , wherein the electronic circuit is joined to the pressure-sensitive cell by means of springs that make contact with clips soldered to the pressure-sensitive cell.6. The pressure meterforfluid circuits claim 1 , according to claim 1 , wherein the terminals of the connector connect to the electronic circuit in a direct connection by means of a soldered joint.7. The pressure meterforfluid ...

UNIVERSAL HERMETICALLY SEALED BUTTON PRESSURE SENSOR

A hermetically-sealed universal pressure sensor comprises a MEMS disk, a compensate disk, and an optional interconnect ring. The MEMS disk has one or more MEMS dies that can convert ambient pressures to electrical signals, which is processed and compensated at an integrated circuit on the compensate disk. The interconnect ring can optionally provide electrical connections and hermetic seal properties between the MEMS disk and the compensate disk. 1. A pressure sensing system , comprising: receiving one or more input electrical voltages,', 'sensing one or more pressures exerted on the MEMS die, and', 'converting the pressures to one or more output electrical voltages; and, 'a MEMS disk, comprising a base structure having one or more port openings, and one or more MEMS dies, attached to the base structure, wherein the MEMSs dies are capable ofa compensate disk comprising one or more integrated circuits, which are electrically connected to said MEMS dies and capable of receiving electrical signals from said MEMS dies.2. The system of claim 1 , further comprising an interconnect structure having one or more electrical connections claim 1 , a first surface claim 1 , and a second surface claim 1 , whereinthe electrical connections are exposed at the first surface and the second surface,the MEMS dies are connected to the first surface, andthe integrated circuit is electrically connected to the second surface.3. The system of claim 1 , wherein the base structure of the MEMS disk includes one or more protrusions claim 1 , wherein said protrusions contain exposed one or more electrical connections that are electrically connected to said MEMS dies.4. The system of claim 1 , wherein the MEMS dies are exposed to one or more pressures claim 1 , which are constantly monitored and updated.5. The system of claim 1 , wherein instructions are stored on the one more integrated circuits claim 1 , and wherein when the instructions claim 1 , when executed claim 1 , corrects for one or ...

Hermetic pressure sensor

A hermetic pressure sensor for measuring a fluid pressure includes a hermetic housing, formed of a first housing structure with a membrane section, a second housing structure hermetically connected to the first structure, and one or more strain sensing elements attached to the membrane section. The second housing structure includes openings for one or more electrical pins while a non-conductive hermetic seal holds the electrical pins in place. The pressure sensor measures the pressure of fluid entering the housing while also providing a hermetic seal.

Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip

An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect. 1. A method , comprising:attaching a first side of a sensor to a first side of a lid, the sensor having a contact pad disposed on a second side of the sensor opposite the first side;providing an interconnect on the contact pad, wherein a first end of the interconnect is attached to the contact pad, and wherein the interconnect extends away from the contact pad;attaching a control chip to a first side of a substrate and electrically connecting the control chip to a landing pad disposed at the first side of the substrate; andaffixing the lid over the substrate, wherein the affixing forms an interior cavity between the lid and the substrate;wherein, after the affixing, the sensor and the control chip each extend into the interior cavity and an air gap is provided between the sensor and the control chip, and wherein, after the affixing, the interconnect extends through the interior cavity, and a second end of the interconnect makes electrical contact with the landing pad.2. The method of claim 1 , wherein claim 1 , after the affixing claim 1 , the sensor is at least partly laterally aligned over the control chip.3. The method of claim 2 , wherein the providing the interconnect ...

Media isolated pressure sensor

A pressure sensor includes a pressure sensing element and a top cap. The pressure sensing element includes a bonded wafer substrate having a buried sealed cavity. A wall of the buried sealed cavity forms a sensing diaphragm. One or more sense elements may be supported by the sensing diaphragm and one or more bond pads are supported by the upper side of the bonded wafer substrate. Each of the bond pads may be positioned adjacent to the sensing diaphragm and electrically connected to one or more of the sense elements. The top cap may be secured to the upper side of the bonded wafer substrate such that an aperture in the top cap facilitates passage of a media in a downward direction to the sensing diaphragm. The top cap may be configured to isolate the bond pads from the media.

PRESSURE SENSORS AND METHODS OF MAKING PRESSURE SENSORS

A pressure sensor includes a MEMS pressure transducer with a pressure sensing diaphragm and sensor elements, an isolator diaphragm spaced apart from the pressure sensing diaphragm, and a ceramic header body. The ceramic header body has an electrical conductor and transducer aperture with the MEMS pressure transducer supported therein. The isolator diaphragm is coupled to the to the MEMS pressure transducer by a fluid and is sealably fixed to the ceramic body. The ceramic header body bounds the fluid and the electrical conductor electrically connects the MEMS pressure transducer with the external environment. Differential pressure sensors and methods of making pressure sensors are also described. 1. A pressure sensor , comprising:a MEMS pressure transducer with a pressure sensing diaphragm and sensor elements;an isolator diaphragm spaced apart from the pressure sensing diaphragm; anda ceramic header body having an electrical conductor and a transducer aperture with the MEMS pressure transducer supported therein, wherein the isolator diaphragm is sealably fixed to the ceramic body and coupled to the MEMS pressure transducer by a fluid disposed within the aperture, the ceramic header body bounds the fluid, and the electrical conductor insulated by the ceramic header body to electrically connect the MEMS pressure transducer with the external environment.2. The pressure sensor as recited in claim 1 , wherein the ceramic header body is formed from a high temperature co-fired ceramic material.3. The pressure sensor as recited in claim 1 , wherein the electrical conductor includes a trace electrically connected to the MEMS pressure transducer and located within the ceramic header body.4. The pressure sensor as recited in claim 1 , wherein the electrical conductor includes a via electrically connected to the MEMS pressure transducer and located within the ceramic header body.5. The pressure sensor as recited in claim 1 , wherein the electrical conductor includes an interior ...

PRESSURE DETECTING DEVICE

There is provided a pressure detecting device whose number of connection points and number of parts are small. 1. A pressure detecting device comprising:a sensor unit which includes a strain detecting element which detects a strain amount of a pressure receiving surface strained when receiving a pressure, and a processing circuit which processes a signal from the strain detecting element;a housing which houses the sensor unit; anda terminal which is connected to the sensor unit and part of which is exposed retractably from the housing,wherein the terminal includes a spring mechanism which is provided in the housing and can elastically deform.2. The pressure detecting device according to claim 1 , wherein claim 1 , in the housing claim 1 , an insertion hole in which the terminal is inserted has a tapered shape claim 1 , and a diameter of the insertion hole is formed to become larger toward an inside of the housing.3. The pressure detecting device according to claim 1 , wherein the terminal includes a connection portion which is connected to the sensor unit via a bonding wire.4. The pressure detecting device according to claim 3 , whereinthe housing includes a pressure port which is provided with an introduction hole to which a pressure medium having the pressure is introduced, andincludes a terminal base which is interposed between the pressure port and the connection portion, and fixes relative positions of the pressure port and the connection portion,the pressure receiving surface is provided on a wall surface of the introduction hole, anda recess portion is formed at a portion of the pressure port meeting the connection portion, and an adhesive which adheres the pressure port and the terminal base is applied to the recess portion.5. The pressure detecting device according to claim 3 , whereinthe terminal includes the connection portion, the spring mechanism, and a terminal portion in order toward an outside of the housing, and part of the terminal portion is ...

CRASH PRESSURE SENSOR

A pressure sensor for being mounted in a vehicle door includes a housing, a pressure transducer, an elastomeric connector, and electrical conductors for facilitating an electrical connection to the pressure sensor. The pressure transducer is mounted in the housing adjacent the elastomeric connector. The housing is configured to exert a force that presses the pressure transducer against the elastomeric connector. The elastomeric connector comprises electrically conductive regions configured to be pressed against electrical contacts of the pressure transducer and the electrical conductors to establish and maintain an electrical connection between the pressure transducer and the electrical conductors. 1. A pressure sensor for being mounted in a vehicle door , comprising:a housing;a pressure transducer;an elastomeric connector; andelectrical conductors for facilitating an electrical connection to the pressure sensor;wherein the pressure transducer is mounted in the housing adjacent the elastomeric connector, wherein the housing is configured to exert a force that presses the pressure transducer against the elastomeric connector, and wherein the elastomeric connector comprises electrically conductive regions configured to be pressed against electrical contacts of the pressure transducer and the electrical conductors to establish and maintain an electrical connection between the pressure transducer and the electrical conductors.2. The pressure sensor recited in claim 1 , wherein the elastomeric connector further comprises electrically insulating regions adjacent the electrically conductive regions claim 1 , the electrically insulating regions helping to electrically isolate the electrical contacts of the pressure transducer and the electrical conductors from each other and from any surrounding electrically conductive structures.3. The pressure sensor recited in claim 1 , further comprising a gasket claim 1 , wherein the pressure transducer is mounted in the housing ...

POLYSILICON ON SAPPHIRE OIL-LESS PRESSURE SENSOR

A pressure sensor assembly includes a pressure sensor having a support structure and a sapphire isolation member coupled to the support structure and forming a region between a first surface of the sapphire isolation member and the support structure. A second surface of the sapphire isolation member is positioned to interface with fluid from or coupled to a process. Electrical leads couple to a polysilicon strain gauge pattern positioned in the region on the first surface of the sapphire isolation member, and the polysilicon strain gauge pattern is configured to generate electrical signals indicative of the pressure of the fluid when the sapphire isolation member deflects responsive to the pressure. 1. A pressure sensor assembly comprising:a header forming a cavity, the pressure sensor assembly including a fluid pathway to the cavity;{'claim-text': ['a support structure;', 'a sapphire isolation member coupled to the support structure and forming a region between a first surface of the sapphire isolation member and the support structure, a second surface of the sapphire isolation member positioned to interface with fluid within the fluid pathway;', 'electrical leads; and', 'a polysilicon strain gauge pattern positioned in the region on the first surface of the sapphire isolation member and coupled to the electrical leads, wherein the polysilicon strain gauge pattern is configured to generate electrical signals indicative of the pressure of the fluid within the fluid pathway when the sapphire isolation member deflects responsive to the pressure.'], '#text': 'a pressure sensor positioned in the cavity and configured to sense a pressure of a fluid within the fluid pathway, the pressure sensor including:'}2. The pressure sensor assembly of claim 1 , wherein the sapphire isolation member is a single crystal sapphire element.3. The pressure sensor assembly of claim 1 , wherein the region formed between the first surface of the sapphire isolation member and the support ...

PRESSURE SENSOR DEVICE

A pressure sensor device including: an absolute pressure sensor unit; a sensor case to accommodate the absolute pressure sensor unit; and an adhesive provided between the absolute pressure sensor unit and the sensor case to fix the absolute pressure sensor unit and the sensor case together, is provided. The sensor case has protrusions on the bottom surface, the absolute pressure sensor unit is provided above the protrusions, and there is space free of the adhesive at a part of a region between the absolute pressure sensor unit and the sensor case, and under the absolute pressure sensor unit. 1. A pressure sensor device comprising:an absolute pressure sensor unit;a sensor case to accommodate the absolute pressure sensor unit; and the sensor case has at least one protrusion on a bottom surface;', 'the absolute pressure sensor unit is provided above the protrusion; and', 'there is space free of the adhesive at a part of a region between the absolute pressure sensor unit and the sensor case, and under the absolute pressure sensor unit., 'an adhesive provided between the absolute pressure sensor unit and the sensor case to fix the absolute pressure sensor unit and the sensor case, wherein2. The pressure sensor device according to claim 1 , wherein the sensor case is provided with at least three protrusions claim 1 , each of which is the protrusion.3. The pressure sensor device according to claim 1 , wherein the adhesive is provided outside the space when seen from above claim 1 , under the absolute pressure sensor unit.4. The pressure sensor device according to claim 3 , wherein the space is provided inside a region surrounded by a plurality of protrusions claim 3 , each of which is the protrusion.5. The pressure sensor device according to claim 1 , wherein the adhesive is provided inside the space when seen from above claim 1 , under the absolute pressure sensor unit.6. The pressure sensor device according to claim 5 , wherein the space is provided outside a region ...

ELECTRICAL INTERCONNECT FOR PRESSURE SENSOR IN A PROCESS VARIABLE TRANSMITTER

A process fluid pressure sensor assembly includes a pressure sensor configured to sense a pressure of a process fluid. The assembly includes a pressure sensor body formed of an insulating material. The pressure sensor includes a plurality of electrical contact pads which couple to a pressure sensing element of the body of the pressure sensor. An interconnect body is configured to fit over an end of the pressure sensor body. A plurality of electrical connectors carried in the interconnect body are in electrical contact with the plurality of electrical contact pads. A wiring harness attaches to the interconnect body and includes a plurality of wires which are electrically connected to the plurality of electrical connectors. 1. A process fluid pressure sensor assembly , comprising:a pressure sensor configured to sense a pressure of a process fluid comprising a pressure sensor body, the pressure sensor including a plurality of electrical contact pads which couple to a pressure sensing element of the pressure sensor;an interconnect body which fits over an end of the pressure sensor body;a plurality of electrical connectors carried in the interconnect body which are in electrical contact with the plurality of electrical contact pads; anda wiring harness attached to the interconnect body comprising a plurality of wires which are electrically connected to the plurality of electrical connectors.2. The process fluid pressure assembly of wherein at least one of the plurality of wires of the wiring harness comprises a coaxial cable.3. The process fluid pressure assembly of wherein the interconnect body includes an opening configured to receive a proximal end of the pressure sensor.4. The process fluid pressure assembly of wherein the plurality of electrical connectors include feet which are configured to electrically contact the electrical contact pads carried on the pressure sensor.5. The process fluid pressure assembly of wherein the feet are bonded to the electrical contact ...

OIL PRESSURE SENSOR ATTACHING STRUCTURE

According to an aspect of the present invention, there is provided an oil pressure sensor attaching structure in which a plurality of guide protrusion portions are disposed with a gap in a circumferential direction and surround an oil passage opening portion. The guide protrusion portions have an arc-shaped wall portion and a protrusion portion. An accommodation portion which has an accommodation opening portion opening upward is provided on an inside of the plurality of guide protrusion portions in a radial direction. The sensor case has a columnar portion, a plurality of flange portions, and an annular portion that surrounds the columnar portion. The flange portion is disposed between the upper surface and the protrusion portions in the vertical direction at a first position in the circumferential direction. The annular portion has a first portion and a second portion. 1. An oil pressure sensor attaching structure in which an oil pressure sensor which measures pressure of oil flowing in an oil passage through which oil flows is attached to an upper surface of an oil passage body having the oil passage therein ,wherein the oil passage body has an oil passage opening portion that is connected to the oil passage on the upper surface,wherein the oil pressure sensor has a sensor main body and a sensor case that covers the sensor main body,wherein the sensor case has a sensing hole that is connected to the oil passage opening portion on a lower surface of the sensor case in a state where the oil pressure sensor is attached to the upper surface, a plurality of guide protrusion portions which are disposed on the upper surface, and', 'the sensor case,, 'wherein the oil pressure sensor attaching structure includes'}wherein the plurality of guide protrusion portions are disposed with a gap in a circumferential direction of a central axis extending in a vertical direction and surround the oil passage opening portion, an arc-shaped wall portion that protrudes upward from the ...

METHOD OF DETERMINING A FILLING LEVEL

In a method of determining a filling level in a cartridge, pressure is applied to the medium present in the cartridge and a pressure drop in the cartridge is measured to draw a conclusion on the air volume present in the cartridge. 1. A method of determining the filling level of a cartridge , the cartridge being present in a metering system and the cartridge being filled with a liquid medium above which there is an air volume that is acted on by pressure , the method comprising the steps of:measuring the pressure applied;releasing the pressure of the air volume to atmosphere for a predetermined time duration;measuring the dropped pressure after reaching the predetermined time duration; anddrawing a conclusion on the air volume present in the cartridge from the measured pressure drop.2. The method in accordance with claim 1 ,wherein the pressure measurement is carried out as a differential pressure measurement to atmospheric pressure.3. The method in accordance with claim 1 ,wherein a conclusion is drawn on the air volume present in the cartridge from the measured pressure drop by using a look-up table.4. The method in accordance with claim 1 ,wherein the filling level of a completely filled cartridge and of a completely emptied cartridge is determined for the calibration of the filling level.5. The method in accordance with claim 1 ,wherein the filling level of a partially emptied cartridge is determined for the calibration; wherein a residual quantity of liquid medium present in the partially emptied cartridge is determined by weighing; and wherein the actual filling level used for the calibration is calculated from the result of the weighing procedure.6. The method in accordance with claim 1 ,wherein the result of the filling level measurement is verified by counting the individual doses dispensed from a cartridge whose volume in the metering system is fixed.7. The method in accordance with claim 1 ,wherein at least one pressure regulating valve and one ...

Pressure Sensor System

A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than % from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −° C. and less than or equal to ° C. 1. A pressure sensor system comprising:a pressure sensor chip mounted on a mounting receptacle of a housing body comprising a ceramic material, the housing body having a pressure fitting and a pressure feed guided to the pressure sensor chip, the pressure feed extending from the pressure fitting up to the pressure sensor chip,wherein the housing body comprises a non-planar three-dimensional surface topography on a mounting side on which the sensor chip is mounted,wherein the housing body is a monolithic structure, wherein a coefficient of thermal expansion of the housing body deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.,wherein the pressure fitting is cylindrical or conical, wherein, in a direction toward the pressure sensor chip, the pressure feed has a tapered cross-section, andwherein the pressure feed, leading toward the pressure sensor chip, is undercut-free.2. The pressure sensor system according to claim 1 , wherein the pressure fitting has a round cross-section.3. The pressure sensor system according to claim 1 , wherein the pressure fitting has a groove on a side facing the pressure sensor claim 1 , the groove surrounding the pressure feed.4. The pressure sensor system according to claim 1 , wherein the pressure sensor chip is based on silicon.5. The pressure sensor system ...

Polymer Composite Vacuum Components

A gauge having a housing formed of a polymer material and one or more electrical feedthrough pins disposed in the housing. The electrical feedthrough pins can be oriented substantially perpendicular to each other and have complex shapes. 1. A method of making a gauge , the method comprising:a) positioning a gauge assembly within a mold, the gauge assembly comprising an electrical feedthrough pin disposed through an opening of a base;b) flowing molten polymer into the mold; andc) allowing the molten polymer to solidify to form a polymer vacuum housing around the electrical feedthrough pin such that the electrical feedthrough pin is disposed directly through the polymer vacuum housing.2. The method of claim 1 , further comprising another electrical feedthrough pin that is disposed through a side of the polymer vacuum housing.3. The method of claim 1 , wherein the electrical feedthrough pin has a nonlinear portion.4. The method of claim 3 , wherein the nonlinear portion is disposed through the polymer vacuum housing.5. The method of claim 1 , wherein the electrical feedthrough pin has a threaded portion disposed through the polymer vacuum housing.6. The method of claim 1 , wherein the electrical feedthrough pin is further coupled to the polymer vacuum housing with an O-ring. The method of claim 1 , wherein the electrical feedthrough pin has an extended disc portion disposed within the polymer vacuum housing.8. The method of claim 1 , wherein the mold forms a flange to couple the gauge to a process chamber.9. The method of claim 1 , wherein:the electrical feedthrough pin is an anode disposed through the opening of the base; andthe gauge assembly further comprises a cathode feedthrough pin that is electrically coupled to a cylindrical cathode cage, wherein the cylindrical cathode cage comprises the base.10. The method of claim 9 , wherein the gauge assembly further comprises a sputter shield disposed within the cylindrical cathode cage that is coaxial with the anode.11. ...

Physical quantity measuring device

A physical quantity measuring device includes a cylindrical case provided with a through hole, a sensor module, a joint, a cap member, a circuit board including an electronic circuit and an electronic adjuster, a sealing member attached to the through hole, and an adjuster member capable of adjusting the electronic adjuster. The electronic adjuster includes an engaged portion disposed to face the through hole. The sealing member is provided with a housing recess opened to an outside of the cylindrical case, and a communication hole for bringing the housing recess into communication with an interior of the cylindrical case. The adjuster member includes a shaft that is hermetically attached in the communication hole, an engagement portion provided at a first end of the shaft to be engageable with the engaged portion, and an operable portion provided at a second end of the shaft and housed in the housing recess.

PRESSURE TRANSDUCER ASSEMBLY WITH ATMOSPHERIC REFERENCE

A pressure transducer assembly comprises a pressure transducer, a cable, an expandable member, and a vented connector. The cable includes a proximal end, a distal end, and a vent tube. The proximal end is operatively connected to the pressure transducer. The expandable member is operatively connected to the vent tube proximate the distal end. The vented connector is operatively connected to the distal end, and the vented connector is configured and arranged to allow exposure of the vent tube to atmospheric conditions when in a disconnected configuration and to prevent exposure of the vent tube to atmospheric conditions when in a connected configuration. The expandable member accommodates changes in air pressure within the vent tube when the vented connector is in the connected configuration. 1. A pressure transducer assembly , comprising:a pressure transducer;a cable including a proximal end, a distal end, and a vent tube, the proximal end being operatively connected to the pressure transducer;an expandable member operatively connected to the vent tube proximate the distal end; anda vented connector operatively connected to the distal end, the vented connector configured and arranged to allow exposure of the vent tube to atmospheric conditions when in a disconnected configuration and to prevent exposure of the vent tube to atmospheric conditions when in a connected configuration, wherein the expandable member accommodates changes in air pressure within the vent tube when the vented connector is in the connected configuration.2. The pressure transducer assembly of claim 1 , wherein the cable includes electrical wire and a sleeve claim 1 , the vent tube and the electrical wire being routed through the sleeve.3. The pressure transducer assembly of claim 1 , wherein the vent tube includes a first portion and a second portion proximate the distal end.4. The pressure transducer assembly of claim 3 , wherein the expandable member includes a vent tube connector and an ...

Pressure Sensor

Provided is a pressure sensor that uses a sensor chip as a pressure measurement element and can suppress condensation around the sensor chip of water vapor permeating a protective member from a gas to be measured. The pressure sensor includes a pressure measurement chamber into which a gas to be measured is introduced; a sensor chip that faces the pressure measurement chamber; a sensor support that has a support surface supporting the sensor chip; and a protective member that covers the sensor chip. The pressure sensor also includes a heat insulation chamber that faces a back surface opposite to the support surface of the sensor support; and a gas passage that communicates the heat insulation chamber and the pressure measurement chamber. 1. A pressure sensor including a pressure measurement chamber into which a gas to be measured is introduced , a sensor chip which faces the pressure measurement chamber , a sensor support which has a support surface supporting the sensor chip , and a protective member which covers the sensor chip , the pressure sensor comprising:a heat insulation chamber which faces a back surface opposite to the support surface of the sensor support; and a gas passage which communicates the heat insulation chamber and the pressure measurement chamber.2. The pressure sensor according to claim 1 , wherein the gas passage is provided in the sensor support.The pressure sensor according to claim 1 , further comprisingan exterior case which supports the sensor support, whereinthe gas passage is provided in the exterior case.4. The pressure sensor according to claim 1 , further comprisinga pressure introduction pipe which introduces the gas to be measured, whereinthe pressure introduction pipe is connected to the pressure measurement chamber.5. The pressure sensor according to claim 1 , further comprisinga pressure introduction pipe which introduces the gas to be measured, whereinthe pressure introduction pipe is connected to the heat insulation chamber.6 ...

PRESSURE SENSOR

The embodiments relate to a pressure sensor comprising: a sensor module which is sensing pressure; a first supporter coupled to an upper portion of the sensor module, having a substrate , lengthily disposed therein in an axial direction, and thus electrically connected to the sensor module; and a second supporter to which the substrate is couple while brought into contact with a spring electrode, the second supporter being coupled to an upper portion of the first supporter and having a spring groove in which a lower end portion of spring electrode lengthily disposed in an axial direction is stably placed. 1. A pressure sensor comprising:a sensor module configured to sense pressure;a first supporter coupled to an upper portion of the sensor module and having a substrate disposed therein, the substrate being lengthily disposed in an axial direction to be electrically connected to the sensor module; anda second supporter to which the substrate is couple while being brought into contact with a spring electrode, the second supporter being coupled to an upper portion of the first supporter and having a spring groove formed therein such that a lower end portion of the spring electrode lengthily disposed in an axial direction is stably placed in the spring groove.2. The pressure sensor of claim 1 , wherein the substrate is coupled to the second supporter while pressing an outer circumferential surface of the spring electrode and is brought into contact with the outer circumferential surface of the spring electrode to be electrically connected thereto.3. The pressure sensor of claim 2 , wherein the spring electrode comprises a diameter-increased portion convexly formed at a portion thereof contacting the substrate by increasing the outer diameter of the spring electrode.4. The pressure sensor of claim 3 , wherein contact grooves are formed to be recessed in a round shape on both side surfaces of the substrate claim 3 , and the diameter-increased portion of the spring ...

PRESSURE SENSOR

A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion. 1. A pressure sensor , comprisinga first substrate,a cap attached to the first substrate wherein the cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor, andsensing means for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit,wherein the cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port,wherein the first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.2. The sensor of claim 1 ,wherein the first substrate has a plane extension and wherein the support portion encircles the contact portion in the plane of the first substrate,wherein the support ...

VEHICLE GUIDANCE SYSTEM AND METHOD THAT USES AIR DATA FROM SURFACE-MOUNTED PRESSURE SENSORS FOR VEHICLE ORIENTATION CONTROL

A vehicle guidance system, including: sensors to detect a surface pressure distribution for a respective location of the corresponding sensor on a vehicle, respectively; and a controller to receive an initial value for a Mach number; and calculate a converged value for an angle of attack based on first surface pressure data from a first set of the sensors, and a converged sideslip angle value based on second surface pressure data from a second set of the sensors. The controller calculates a freestream dynamic pressure based on the initial Mach number, the converged angle of attack, and the converged sideslip angle value, and calculates a freestream pressure, and calculates a converged value for Mach number based on the freestream pressure and the freestream dynamic pressure. A flight control processor provides an output for adjusting an orientation of the vehicle based on the converged Mach number and the freestream pressure. 1. A vehicle guidance system , comprising:a plurality of surface-mounted pressure sensors configured to be mounted on a vehicle, each sensor being configured to detect a surface pressure distribution for a respective location of the corresponding sensor on a vehicle, respectively; receive an initial value for a Mach number of the vehicle,', 'calculate a converged value for an angle of attack of the vehicle based on first surface pressure data from a first set of the surface-mounted pressure sensors, and a converged sideslip angle value of the vehicle based on second surface pressure data from a second set of the surface-mounted pressure sensors,', 'calculate a freestream dynamic pressure based on the initial value for Mach number, the calculated converged value for angle of attack, and the calculated converged sideslip angle value,', 'calculate a freestream pressure, and', 'calculate a converged value for Mach number based on the calculated freestream pressure and the calculated freestream dynamic pressure; and, 'an air data estimation ...

PRESSURE SENSOR

Provided is a pressure sensor that is compact, ensures insulation, and is highly reliable. A pressure sensor () comprises: a sensor body (); a pressure sensor element () provided on one surface side of the sensor body (); a through hole () which is formed from the one surface side of the sensor body () toward another surface side of the sensor body, and through which a lead wire () electrically connected to the pressure sensor element () is passed; and an insulation layer () formed in the inner wall of the through hole (). Passed through the through hole () is a conducting body core part (), which is a part of the lead wire () from which an insulation coating has been removed. 1. A pressure sensor , comprising:a sensor body;a pressure sensor element arranged on one surface side of the sensor body;a through hole which is formed from the one surface side toward the other surface side of the sensor body, and through which a lead wire electrically connected to the pressure sensor element passes; andan insulation layer formed on an inner wall of the through hole.2. The pressure sensor according to claim 1 , wherein at least two through holes are formed.3. The pressure sensor according to claim 1 , wherein a conducting body core part claim 1 , which is a part of the lead wire electrically connected to the pressure sensor element and from which an insulation coating has been removed claim 1 , passes through the through hole.4. The pressure sensor according to claim 3 , wherein the lead wire electrically connected to the pressure sensor element is connected by an electrode made of a brazing material.5. The pressure sensor according to claim 4 , wherein the electrode is a metal having a low melting point.6. The pressure sensor according to claim 4 , wherein the electrode enters the inside of the through hole to form an intrusion part.7. The pressure sensor according to claim 3 , wherein a front end portion of the conducting body core part passing through the through hole has ...

Transducer assembly with header using side pins

The invention includes differential pressure transducer assembly systems and methods in which headers are configured with header pins that extend perpendicular with respect to an axis of the assembly and through header sidewalls, enabling a compact configuration, ease of assembly, enhanced reliability and/or redundancy. Channels and ports defined in a housing portion of the assembly are configured to enable the use of substantially straight tubing sections for routing main and/or reference pressures to one or more differential sensing elements mounted on the headers. Two or more headers with associated sensing elements can be stacked to provide redundant differential pressure sensing.

SENSOR ARRANGEMENT FOR MEASURING THE PRESSURE AND TEMPERATURE OF A FLUID

The invention relates to a sensor arrangement () for measuring the pressure and temperature of a fluid, the sensor arrangement () including a housing (), a pressure sensor element (), and a temperature sensor case (), wherein the housing () includes a passage () and a fluid opening (), the passage () and the fluid opening () being in fluid communication, wherein the pressure sensor element () is connected to the housing (), the pressure sensor element () being in fluid communication with the passage (), wherein the temperature sensor case () includes at least one temperature sensor element (), the temperature sensor case () being at least partially arranged in the passage (), wherein the sensor arrangement () further includes an attachment element (), wherein the attachment element () attaches the temperature sensor case () to the passage (), wherein the sensor arrangement () further includes a fluid channel () extending at least in part between the housing () and the temperature sensor case (), the fluid channel () passing the attachment element () and being in fluid communication with the fluid opening () and the pressure sensor element (). The invention provides an improved sensor arrangement () for measuring the pressure and temperature of a fluid that includes a reduced size and is cost-efficient. 1. A sensor arrangement for measuring the pressure and temperature of a fluid , the sensor arrangement comprising a housing , a pressure sensor element , and a temperature sensor case , wherein the housing comprises a passage and a fluid opening , the passage and the fluid opening being in fluid communication , wherein the pressure sensor element is connected to the housing , the pressure sensor element being in fluid communication with the passage , wherein the temperature sensor case comprises at least one temperature sensor element , the temperature sensor case being at least partially arranged in the passage , wherein the sensor arrangement further comprises an ...

Pressure Sensor

A pressure sensor is disclosed. The pressure sensor has a sensor module having a strain gauge measuring a pressure of a gas flowing into a passage of the sensor module, a substrate electrically connected to the strain gauge, a frame covering a portion of the sensor module and supporting the substrate, a terminal electrically connected to the substrate and contacting a contact point of an external device, a terminal holder supporting the terminal, and a housing having an end connected to the sensor module and covering a portion of the terminal holder.

Piezoelectric transducer

A piezoelectric transducer includes a transducer unit disposed within a watertight and gas-tight housing and having at least one piezoelectric element contacted by at least two electrodes. A signal lead-through is electrically connected to the electrodes and configured conducting polarization charges as signals from the piezoelectric element through the housing to an environment outside of the housing. A signal cable arranged outside of the housing includes at least two signal conductors. The signal lead-through includes a support element having at least two conducting paths in electrical contact with one of the signal conductors.

Capacitive pressure sensor

Provided is a capacitive pressure sensor that prevents the position of an electrode face in the direction parallel to a diaphragm from deviating from the position of the diaphragm, and accurately measures pressure. The capacitive pressure sensor includes: the diaphragm that deforms under pressure; an electrode member having the electrode face opposed to the diaphragm with a gap between the diaphragm and the electrode face; a body having one end to which the diaphragm is joined, and accommodating at least a portion of the electrode member; an insulating positioning member that is provided in the body and positions at least the portion of the electrode member in the body; and a pressing mechanism that holds and presses the insulating positioning member or the electrode member in the direction parallel to the diaphragm.

PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WITHIN A HOUSING

A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing. 1. A pressure sensor module comprising:a housing;a pressure sensor chip; andone or more of an integrated passive device (IDP) chip and discrete passive devices; whereinthe pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.2. The pressure sensor module according to claim 1 , whereinthe pressure sensor chip and one or more of the IPD chip and the discrete passive devices are electrically connected with each other.3. The pressure sensor module according to claim 1 , whereinthe IPD chip comprises exclusively passive electronic devices.4. The pressure sensor module according to claim 1 , whereinthe pressure sensor chip comprises a pressure sensor and an electronic circuit configured to readout the pressure sensor.5. The pressure sensor module according to claim 1 , further comprising:a leadframe, wherein the pressure sensor chip and one or more of the IPD chip and the discrete passive devices are connected to different portions of the leadframe.6. The pressure sensor module according to claim 1 , further comprising:an encapsulation material encapsulating the pressure sensor chip and one or more of the IPD chip and the discrete passive devices.7. The pressure sensor module according to claim 1 , further comprising:external contact elements configured to be attached to a printed circuit board and to form electrical connections with contact elements of the printed circuit board.8. The pressure sensor module according to claim 7 , whereinthe external contact elements extend outwardly beyond an outer wall of the housing.9. The pressure sensor module according to claim 7 , whereinthe external contact elements are ...

PRESSURE SENSOR

A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion. 1. A pressure sensor comprising:a first substrate comprising a cavity, a deformable membrane, a first electrode, and a second electrode, wherein the deformable membrane is formed at one side of the cavity and wherein the first electrode is formed at an opposite side of the cavity facing the deformable membrane, wherein the first electrode is separated from the deformable membrane through the cavity, and wherein the second electrode is formed on the deformable membrane; anda second substrate attached to the first substrate and forming a gap therein, wherein the deformable membrane is positioned in the gap, wherein the deformable membrane deforms responsive to pressure and wherein the first and the second electrodes generate a signal in response to deformation by the deformable membrane.2. The pressure sensor of claim 1 , wherein the second substrate comprises a support portion and contact portion claim 1 , wherein the support portion is configured to attach to the second substrate claim 1 , and wherein the contact portion is configured to provide electrical connection to a device external ...

Driven-shield capacitive pressure sensor

A capacitive pressure transducer includes a shielded spacer positioned between the capacitor electrodes and driven with a separate voltage source.

Sensor module and method of making the same

The present invention provides a sensor module for preventing the corrosion of electrode pads and a method of manufacturing the same. The sensor module A 1 includes: an electronic component 2 , having a mounting surface 2 a and an installation surface 2 b facing opposite sides, wherein the mounting surface 2 a is disposed with electrode pads 21 ; an atmospheric pressure sensor 3 , having a main surface 3 a and an installation surface 3 b facing opposite sides, and a side surface 3 c connecting the main surface 3 a to the installation surface 3 b , and mounted on the mounting surface 2 a of the electronic component 2 with the installation surface 3 b facing the electronic component 2 ; a bonding wire 4 , connected to the electrode pads 21 ; and a protective member 5 , covering the electrode pads 21 . The protective member 5 exposes a portion of the bonding wire 4 and is in contact with the side surface 3 c of the atmospheric pressure sensor 3.

PRESSURE DIFFERENCE SENSOR FOR DETERMINING A PRESSURE MEASUREMENT SIGNAL

A pressure difference sensor for determining a pressure measurement signal includes a measuring cell made from a semiconductor material. The measuring cell is suppliable with first and second pressures and, using an electrical transducer element, outputs the pressure measurement signal as a function of a difference between the first and second pressures. First and second stiffening elements of a ceramic or semiconductor material are each joined with the pressure difference measuring cell by a respective first or second joining layer and have a respective first or second duct, via which the respective first or second pressure is suppliable to the pressure difference measuring cell. The first and/or the second joining layer comprise(s) an electrically conductive material and serve(s) for the mechanical connecting of the pressure difference measuring cell with the first and second stiffening elements and for implementing an electrical functionality. 113-. (canceled)14. A pressure difference sensor for determining a pressure measurement signal , comprising:a pressure difference measuring cell including a semiconductor material, wherein the pressure difference measuring cell is suppliable with first and second pressures and, with the use of an electrical transducer element, outputs the pressure measurement signal as a function of a difference between the first and second pressures;a first stiffening element joined with the pressure difference measuring cell by a first joining layer and having a first duct via which the first pressure is suppliable to the pressure difference measuring cell; anda second stiffening element joined with the pressure difference measuring cell by a second joining layer and having a second duct via which the second pressure is suppliable to the pressure difference measuring cell;wherein the first and/or the second joining layer include(s) an electrically conductive material and the first and/or second joining layer provide(s) a mechanical ...

LEADLESS OIL FILLED PRESSURE TRANSDUCER

An oil-filled pressure transducer having reduced back pressure, comprising an alignment plate having a sensor accommodating aperture, a sensor module inserted into the sensor accommodating aperture, a header surrounding the alignment plate, the header having a protruding top surface, and a diaphragm disposed on the protruding top surface to create a relatively small oil accommodating region between the diaphragm and the sensor. This configuration reduces the oil volume required for operation, which ultimately reduces the back pressure applied against the diaphragm. 1. A method of making an oil-filled pressure transducer , comprising:mounting a glass pre-form within a header shell, wherein the glass pre-form defines a plurality of header pin accommodating apertures and an oil tube accommodating aperture, the glass pre-form having a top and bottom surface, with the header pin accommodating apertures and the oil tube accommodating aperture extending between said surfaces;placing respective header pins within the header pin accommodating apertures and an oil tube within the oil tube accommodating aperture, wherein the header pins and the oil tube extend from the top to the bottom surface of the glass pre-form;mounting an alignment plate, having a sensor accommodating aperture and an oil tube alignment aperture, to the glass pre-form such that the oil tube alignment aperture accommodates the oil tube;inserting a sensor module into the sensor accommodating aperture of the alignment plate, the sensor module having contacts that are configured to be aligned with and in electrical contact with the header pins upon inserting the sensor module into the sensor accommodating aperture; andmounting a diaphragm onto extending protrusions of the header shell such that an oil accommodating region is defined above the sensor module and between the diaphragm and the alignment plate.2. The method of claim 1 , further comprising hermetically sealing the header pins and the oil tube to ...

Pressure Sensor Module With Electrical Contacts

An apparatus for measuring a hydraulic pressure of a hydraulic component, comprising a pressure sensor module and a mounting plate, that is either an outer contour of the hydraulic component or is connectable with the hydraulic component in a substance-to-substance, form-locking and/or force-locking manner, wherein the pressure sensor module comprises a housing, at least one pressure sensor for determining the pressure of a fluid, at least one fluid connector for hydraulic connection of the hydraulic component, at least one electrical connector comprising a conductive mating surface; the mounting plate has a basic area and at least one electrical connecting pin, whereby the connecting pin spring loaded and is essentially perpendicular to the basic area of the mounting plate, the first end of the connecting pin is oriented towards the basic area, the second end of the connecting pin is oriented away from the basic area, and the second end of the connecting pin is pressed, by means of an elastic element, away from the basic area and towards the electrical connector when the mounting plate and the pressure sensor module are assembled and the pressure sensor module and/or the mounting plate have at least one guiding element. The pressure sensor, the fluid connector and the electrical connector are arranged within the housing, the mounting plate is connectable with the pressure sensor module in a force-locking manner and when the mounting plate and the pressure sensor module are assembled, the electrical connecting pin is connected with the electrical connector via its second end. 1. An apparatus for measuring a hydraulic pressure of a hydraulic component , comprising:a pressure sensor module; anda mounting plate that is at least one of (i) an outer contour of the hydraulic component (ii) connectable with the hydraulic component in a substance-to-substance manner (ii) connectable with the hydraulic component in a form-locking manner and (iv) connectable with the ...

SENSOR HEADER ASSEMBLY FOR INCREASED RELIABILITY IN HIGH-PRESSURE ENVIRONMENTS

Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins. The depressions form support surfaces for supporting at least the corresponding upper header pins during high-pressure operation. 1. A header assembly , comprising: 'two or more upper through holes arranged in a first configuration and extending through the upper header layer from a top surface to a bottom surface of the upper header layer;', 'an upper header layer including two or more lower through holes arranged in a second configuration axially offset relative to the first configuration and extending through the lower header layer from a top surface to a bottom surface of the lower header layer;', 'two or more depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer;, 'a lower header layer includingtwo or more upper header pins extending through the corresponding two or more upper through holes and at least partially into the corresponding two or more ...

PRESSURE SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

In aspects of the invention, a sensor unit is stored in a recessed sensor mount portion formed in a resin case. The sensor unit can be formed so that a semiconductor pressure sensor chip is joined to one side of a glass pedestal, and the other side of the glass pedestal is die-bonded to the bottom of the sensor mount portion through an adhesive. An electrode pad on the semiconductor pressure sensor chip is electrically connected through a bonding wire to a lead terminal for leading externally that pierces through the resin case and is integrally insert-molded therein. An entire surface of the sensor unit, an exposed part of the lead terminal internally-located in the resin case, the bonding wire, and an exposed part of an inner wall of the resin case can be coated with the protective film composed of a poly(p-xylylene)-family polymer including fluorine. 1. A pressure sensor device , comprising:a sensor chip for converting pressure into an electric signal;a resin case for storing the sensor chip;a signal terminal for taking out externally the electric signal output from the sensor chip, wherein one end of the signal terminal is exposed internally in the resin case and connected to the sensor chip through a wire; anda protective film composed of a poly(p-xylylene)-family polymer including fluorine, wherein the protective film coats an electrode pad of the sensor chip, an exposed part of the signal terminal internally-located in the resin case, the wire, and an inner wall of the resin case.2. The pressure sensor device according to claim 1 , wherein the protective film coats an entire surface of the sensor chip claim 1 , the exposed part of the signal terminal internally-located in the resin case claim 1 , the wire claim 1 , and an exposed part of the inner wall of the resin case.3. The pressure sensor device according to claim 1 , wherein the protective film is coated with a protective member composed of a fluorinated gel.4. The pressure sensor device according to ...

CAPACITIVE PRESSURE SENSOR AND METHOD FOR ITS MANUFACTURE

A simply composed, cost effectively manufacturable, pressure sensor is described, comprising a platform, an electrically conductive measuring membrane connected with the platform to enclose a pressure chamber and contactable with a pressure to be measured, and an electrode spaced from the measuring membrane and electrically insulated from the measuring membrane to form together with the measuring membrane a capacitor with a capacitance variable as a function of a deflection of the measuring membrane dependent on the pressure acting on the measuring membrane, wherein the platform has an inner surface bounding the pressure chamber and lying opposite the measuring membrane, wherein an insulating layer is provided on the inner surface, especially an insulating layer of silicon dioxide, and the electrode is a conductive coating, especially a coating of doped polysilicon, applied on the inner surface on the insulating layer. 115-. (canceled)16. A pressure sensor , comprising:a first platform;an electrically conductive measuring membrane connected with the first platform to define a first pressure chamber and contactable with a pressure to be measured; anda first electrode spaced and electrically insulated from the measuring membrane, thereby forming with the measuring membrane a capacitor, the capacitor having a capacitance variable as a function of a deflection of the measuring membrane, the deflection dependent on the pressure to be measured,wherein the first platform includes an inner surface bounding the first pressure chamber and opposite the measuring membrane, the inner surface including an insulating layer applied thereon, and wherein the first electrode is a conductive coating applied on the insulating layer on the inner surface.17. The pressure sensor of claim 16 , wherein the insulating layer is silicon dioxide and the conductive coating is doped polysilicon.18. The pressure sensor of claim 16 , wherein:the first platform includes a first passageway extending ...

PRESSURE SENSOR MODULE

The present invention provides a pressure sensor module capable of improving work efficiency during assembly. 111. A pressure sensor module () that detects a fluid pressure on the basis of a differential pressure between a reference pressure and the fluid pressure , the pressure sensor module () comprising:{'b': '10', 'a housing ();'}{'b': '30', 'a sensor element () configured to contact each of the reference pressure and the fluid pressure;'}{'b': 70', '30', '10, 'a support member () that supports the sensor element () and is held in the housing ();'}{'b': 50', '31', '30, 'a first pressure passage () that guides the fluid pressure to a first contact surface () of the sensor element (); and'}{'b': 60', '50', '33', '30, 'a second pressure passage () that is sealed from the first pressure passage () and guides the reference pressure to a second contact surface () of the sensor element (), wherein'}{'b': 70', '81', '75', '81', '50', '60', '75', '81, 'the support member () is a structure that is formed by integrating an elastic material section () and a hard material section (), the elastic material section () exerting sealing performance on the first pressure passage () and the second pressure passage () and being configured to be elastically deformed, and the hard material section () having a rigidity higher than a rigidity of the elastic material section ().'}218170838571307371. The pressure sensor module () according to claim 1 , wherein the elastic material section () of the support member () includes seal sections ( claim 1 , ) that are formed on a first surface () for supporting the sensor element () and on a second surface () located on a back surface of the first surface ().31. The pressure sensor module () according to claim 2 , wherein{'b': 70', '78', '71', '73, 'the support member () includes a through-hole () that communicates between the first surface () and the second surface (), and'}{'b': 83', '85', '78, 'the seal sections (, ) are each formed in a ring ...

CAPACITIVE PRESSURE SENSOR

A base plate has pressure introducing holes at positions facing a diaphragm support portion. A thickness portion (thick portion) of the diaphragm support portion and a sensor base joined to the diaphragm support portion thus serves as a heat dissipating or absorbing portion and hinders the transfer of thermal energy of a measured medium to a sensor diaphragm. 1. A capacitive pressure sensor comprising:a diaphragm unit including a diaphragm displaced in response to pressure of a measured medium and a diaphragm support portion configured to support a periphery of the diaphragm;a sensor base joined to one side of the diaphragm support portion and configured to define a reference vacuum chamber together with the diaphragm;a base plate joined to the other side of the diaphragm support portion opposite the sensor base and configured to define a pressure introducing chamber together with the diaphragm;a fixed electrode formed on a surface of the sensor base adjacent to the reference vacuum chamber; anda movable electrode formed on a surface of the diaphragm adjacent to the reference vacuum chamber in such a manner as to face the fixed electrode,wherein the base plate has, at a position facing the diaphragm support portion, a pressure introducing hole for introducing the measured medium into the pressure introducing chamber.2. The capacitive pressure sensor according to claim 1 , wherein a plurality of pressure introducing holes are formed at positions facing the diaphragm support portion.3. The capacitive pressure sensor according to claim 2 , wherein openings of the respective pressure introducing holes facing the diaphragm support portion are arranged on circumference of a circle around the diaphragm at regular intervals in a circumferential direction. The present application is based on and claims priority to Japanese Application No. 2017-027957, filed Feb. 17, 2017, the entire contents of which are incorporated therein by reference.The present disclosure relates to a ...

PRESSURE MONITORING SYSTEM AND HOUSING THEREFOR

Example aspects of an outer housing for a pressure monitoring system and a pressure monitoring system for a wet barrel hydrant are disclosed. The outer housing for a pressure monitoring system can comprise a sidewall shell defining an axis extending centrally therethrough and comprising an annular inner sidewall projection extending from a top end thereof; and a cap mounted to the sidewall shell, the cap defining an annular cap recess, wherein the annular inner sidewall projection is configured to engage the annular cap recess. 1. An outer housing for a pressuring monitoring system comprising:a sidewall shell defining an axis extending centrally therethrough and comprising an annular inner sidewall projection extending from a top end thereof; anda cap mounted to the sidewall shell, the cap defining an annular cap recess, wherein the annular inner sidewall projection is configured to engage the annular cap recess.2. The outer housing of claim 1 , wherein;the sidewall shell defines a top end;the annular inner sidewall projection extends away from the sidewall shell at the top end thereof;the cap defines a bottom end; andthe annular cap recess extends into the cap from the bottom end thereof.3. The outer housing of claim 1 , further comprising an annular outer sidewall projection claim 1 , the annular outer sidewall projection positioned radially outward from the annular inner sidewall projection.4. The outer housing of claim 3 , wherein the annular inner sidewall projection defines a height that is greater than the annular outer sidewall projection.5. The outer housing of claim 3 , wherein an inner surface of the annular outer sidewall projection abuts an outer surface of the cap.6. The outer housing of claim 5 , wherein;the cap defines an annular outer cap projection between the annular cap recess and the outer surface;the sidewall shell defines an annular sidewall recess between the annular inner sidewall projection and the annular outer sidewall projection; andthe ...

SYSTEM AND METHOD FOR CONTROLLING A PRESSURE FIELD AROUND AN AIRCRAFT IN FLIGHT

A system for controlling a pressure field around an aircraft in flight is disclosed herein. In a non-limiting embodiment, the system includes, but is not limited to, a plurality of pressure sensors that are arranged on the aircraft to measure the pressure field. The system further includes, but is not limited to, a controller that is communicatively coupled with the plurality of pressure sensors. The controller is configured to receive information that is indicative of the pressure field from the plurality of pressure sensors. The controller is also configured to determine when the pressure field deviates from a desired pressure field based on the information. The controller is also configured to transmit an instruction to a movable component onboard the aircraft that will cause the movable component to move in a manner that reduces the deviation. 1. A system for controlling a pressure field around an aircraft in flight , the system comprising:a plurality of pressure sensors arranged on the aircraft to measure the pressure field; anda controller communicatively coupled with the plurality of pressure sensors, the controller configured to receive information indicative of the pressure field from the plurality of pressure sensors, to determine when the pressure field deviates from a desired pressure field based on the information, and to transmit an instruction to a movable component onboard the aircraft that will cause the movable component to move in a manner that reduces the deviation.2. The system of claim 1 , wherein the controller is configured to transmit the instruction to a primary controller configured to control the movable component.3. The system of claim 1 , wherein the movable component comprises a propulsion system component.4. The system of claim 1 , wherein the movable component comprises a flight control surface.5. The system of claim 1 , wherein the pressure field deviates from the desired pressure field when a pressure gradient of the pressure field ...

Mems pressure sensor with multiple sensitivity and small dimensions

A MEMS pressure sensor includes a monolithic body of semiconductor material having a first face and a second face and housing a first buried cavity and a second buried cavity, arranged under the first buried cavity and projecting laterally therefrom. A first sensitive region is formed between the first buried cavity and the first face at a first depth, and a second sensitive region is formed between the second buried cavity and the first face at a second depth greater than the first depth. The monolithic body also houses a first piezoresistive sensing element and a second piezoresistive sensing element, integrated in the first and second sensitive regions, respectively.

DEVICE FOR FEEDING FUEL GAS TO AN APPLICATION

Device for feeding fuel gas to an application (), the device comprising at least one fuel gas bottle () furnished with a tap (), and a bleed-off apparatus () comprising an electronic logic unit () and a bleed-off outlet () selectively connectable to the tap (), the bleed-off outlet () being linked () fluidically to an application () receiving the fuel gas originating from the bottle (), the tap () comprising an electronic manometer () for measuring the pressure in the bottle (), the electronic manometer () being devoid of battery and comprising an inductive member () for wirelessly transmitting to the electronic logic unit () information relating to the measured pressure, characterized in that the bleed-off apparatus () also comprises an inductive member () powered electrically by the electronic logic unit () and in that, when the bleed-off outlet () is connected up to the tap (), the inductive member () of the bleed-off outlet () is situated in a manner adjacent to the inductive member () of the manometer () so as to ensure electrical power supply of the manometer () by inductive 113-. (canceled)15: The device as claimed in claim 14 , wherein the electronic logic unit is configured to cause the pressure gauge to be switched on when an inductive coupling is present between the inductive element of the draw-off outlet and the inductive element of the pressure gauge claim 14 , and claim 14 , in response to the switching on of the pressure gauge claim 14 , the inductive element of the pressure gauge sends an electrical signal to the electronic logic unit via the inductive element of the draw-off outlet claim 14 , thereby forming a system for detecting the state of connection of the draw-off outlet to the tap.16: The device as claimed in claim 14 , wherein the electronic logic unit is configured to receive from claim 14 , and/or transmit to claim 14 , the pressure gauge data relating to the physical or identification characteristics of the cylinder via the coupling of ...

PRESSURE SENSOR FOR MEASURING A PRESSURE OF A FLUID AND METHOD FOR PRODUCING A PRESSURE SENSOR FOR MEASURING A PRESSURE OF A FLUID

A pressure sensor for measuring a pressure of a fluid, the pressure sensor including: a sensor element for measuring the pressure of the fluid; a control and/or evaluation circuit for controlling and/or evaluating a measuring signal of the sensor element; a circuit carrier, the control and/or evaluation circuit being disposed on the circuit carrier; a carrier element, the circuit carrier being fastened on the carrier element; and a housing element, the carrier element together with the circuit carrier being fastened in the housing element in a form-locking and/or force-locking manner, wherein the carrier element is configured in one piece from an electrically non-conducting material. 110-. (canceled)11. A pressure sensor for measuring a pressure of a fluid , comprising:a sensor element for measuring the pressure of the fluid;a control and/or evaluation circuit for controlling and/or evaluating a measuring signal of the sensor element;a circuit carrier, wherein the control and/or evaluation circuit is situated on the circuit carrier;a carrier element, wherein the circuit carrier is fastened on the carrier element; anda housing element, wherein the carrier element together with the circuit carrier is fastened in the housing element in a form-locking and/or force-locking manner;wherein the carrier element is configured in one piece from an electrically non-conducting material.12. The pressure sensor of claim 11 , wherein the control and/or evaluation circuit is situated on two opposite sides of the circuit carrier.13. The pressure sensor of claim 11 , further comprising:a grounding spring for connecting the control and/or evaluation circuit to ground.14. The pressure sensor of claim 13 , wherein the carrier element has a recess for accommodating the grounding spring.15. The pressure sensor of claim 11 , further comprising:at least one connecting spring for electrically connecting the control and/or evaluation circuit to further elements.16. The pressure sensor of claim ...

PRESSURE SENSOR DEVICE AND ELECTRICALLY POWERED PUMP

A sensor case of pressure sensor device includes a sensor housing portion, a first terminal housing portion that extends from the sensor housing portion in a first direction, and a second terminal housing portion that extends from the sensor housing portion in a second direction. The first terminal housing portion includes a first upper-side opening that opens upward, and a first lower-side opening that opens downward. The second terminal housing portion includes a second upper-side opening that opens upward, and a second lower-side opening that opens downward. A first terminal part includes a first exposed portion including an upper surface exposed to outside of the first terminal housing portion through the first upper-side opening and a lower surface exposed to outside of the first terminal housing portion through the first lower-side opening. A second terminal includes a second exposed portion including an upper surface exposed to outside of the second terminal housing portion through the second upper-side opening and a lower surface exposed to outside of the second terminal housing portion through the second lower-side opening. The first exposed portion includes a first lead wire connection portion to which a first lead wire is connected. The second exposed portion includes a second lead wire connection portion to which a second lead wire is connected. 112-. (canceled)13. A pressure sensor device for an electrically powered pump , the pressure sensor device comprising:a pressure sensor to measure a pressure of a fluid inside the electrically powered pump;a first terminal that projects from the pressure sensor in a first direction that extends to one side in a horizontal direction;a second terminal that projects from the pressure sensor in a second direction that extends to the other side in the horizontal direction;a sensor case that houses the pressure sensor;a first lead wire that is electrically connected to the first terminal; anda second lead wire that is ...

Pressure sensor

In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.

DEVICE FOR MEASURING AND SYSTEM FOR MEASURING A PRESSURE COMPRISING A PRESSURE SENSOR

The invention relates to a pressure measurement device () comprising: 1. A pressure measurement device comprising:a pressure sensor subjected to be secured to an element having a pressure that is to be measured; anda stationary portion facing a path of the sensor so as to be in resonant high frequency AC electrical relationship with the sensor in order to power the sensor and in order to receive measurements acquired by the sensor.2. The device according to claim 1 , wherein the measurement device has wireless power supply means for powering the sensor from the stationary portion claim 1 , said means comprising at least one transformer having a primary carried by the stationary portion and the secondary is carried by the sensor.3. The device according to claim 1 , wherein the measurement device includes wireless communication means between the sensor and the stationary portion for communicating measurements acquired by the sensor claim 1 , said means comprising at least one capacitor having a first plate carried by the stationary portion and a second plate carried by the sensor claim 1 , the air between the sensor and the stationary portion directly forming the insulating portion between the two capacitor plates.4. The device according to claim 1 , wherein the stationary portion and the sensor are configured so as to be in resonant AC electrical relationship at a high frequency lying in the range 50 MHz to 300 MHz.5. The device according to claim 1 , including means for measuring the temperature of strain detectors of the sensor.6. The device according to claim 5 , wherein the means for measuring temperature comprise means for measuring the power supply of the strain detectors.7. The device according to claim 1 , wherein the stationary portion includes wired connection means to remote processor means of the device claim 1 , said wired connection means comprising a cable suitable for providing differential transmission of various signals between the device and the ...

Polymer Composite Vacuum Components

A gauge having a housing formed of a polymer material and one or more electrical feedthrough pins disposed in the housing. The electrical feedthrough pins can be oriented substantially perpendicular to each other and have complex shapes.

IMMERSION DEPTH MEASUREMENT DEVICE

Immersion depth measurement device comprising a first absolute pressure sensor and a second differential pressure sensor, wherein the first and the second pressure sensor are arranged to measure ambient pressures, and wherein the second differential pressure sensor connects to the ambient through two separate channels, at least one of which is closable. 1. An immersion depth measurement device comprising hydrostatic measurement means with a first absolute pressure sensor and a second differential pressure sensor , wherein the first and the second pressure sensor are arranged to measure ambient water pressures , and wherein the second differential pressure sensor connects to the ambient through two separate channels , at least one of which is closable.2. The immersion depth measurement device according to claim 1 , wherein at least one of the two separate channels is provided with a valve.3. The immersion depth measurement device according to claim 1 , wherein a line is connected or connectable to the device to arrange that the device is submersible in deep-sea with said line connected to a point above water level.4. The immersion depth measurement device according to claim 3 , wherein the line provides for guiding measurement signals from the first and second pressure sensors to above water level claim 3 , where the line is connectable or connected to recording and control means to monitor and record the pressures measured by the first and second pressure sensors.5. The immersion depth measurement device according to claim 3 , wherein said line enables manually or automatically switching the closable channel to a closed position depending on a pressure sensed with the first absolute pressure sensor.6. The immersion depth measurement device according to claim 1 , wherein the device is provided with recording and control means to monitor and record the pressures measured by the first and second pressure sensors claim 1 , and to automatically switch the closable ...

Pressure sensor

In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.

Sensor connector

A sensor connector compatible with various sensor unit repertoires and capable of improving production efficiency is provided. The sensor connector includes terminal modules to be inserted into a module inserted portion, and commonized pogo pin type terminal module is brought into contact with a connection terminal via slide contact segments capable of sliding relative to the connection terminal exposed to a region closer to the module inserted portion. Thus, the sensor connector can be compatible with the sensor unit 1 having various repertoires by changing, for example, the arrangement and the number of poles of the module inserted portions of the connector housing.

DEVICE FOR MEASURING A PHYSICAL PARAMETER OF A FLUID OF A MOTOR VEHICLE CIRCUIT

The device includes a distal connector portion with a connector for electrical connection to an external electrical circuit, a proximal measuring portion including a detector of the physical parameter configured to be in fluid contact, the detector has a general shape of a wafer delimiting a first electrical contact face and a second opposite measuring face, a member for electrically joining the detector and the connector. The detector is configured in the device such that both faces of the detector are immersed and in direct fluid contact. 1. A device for measuring at least one physical parameter of a fluid , comprising a casing having a main axis , said casing comprising:a distal connector portion comprising a connector for electrical connection to an external electrical circuit;a proximal measuring portion comprising a detector of the physical parameter configured to be in fluid contact, the detector has a general shape of a wafer delimiting a first electrical contact face and a second opposite measuring face,a member for electrically joining the detector and the connector;wherein the device comprises a fluid sealing body configured to intimately cover at least the first electrical contact face of the detector by ensuring a sealing continuity with a junction area of the detector with the electrical junction member and in that the detector is configured in the device such that both faces of the detector are immersed and in direct fluid contact.2. The device according to claim 1 , wherein the measuring portion delimits a housing configured to vertically receive and retain the detector such that the faces of the detector extend substantially parallel to the main axis.3. The device according to claim 1 , wherein the detector extends transversely and is retained to the measuring portion via the junction member.4. The device according to claim 1 , wherein the first face carries at least one electronic component and/or an electronic circuit and the second face is ...

SENSOR ASSEMBLY WITH LINEAR CONTACTS

An apparatus including a first linear contact, a second linear contact and a support contact. The first linear contact and the second linear contact may each be connected to corresponding electrical terminals. The support contact may be connected to a housing. The first linear contact and the second linear contact may each provide an electrical connection between corresponding sensor contacts and the corresponding electrical terminals. The first linear contact, the second linear contact and the support contact may be arranged to create a support plane for a sensor package. The first linear contact and the second linear contact may each provide support for the sensor package along a linear peak. The apparatus may enable a secure compression fit of the sensor package within the housing. 1. An apparatus comprising:a first linear contact and a second linear contact each connected to corresponding electrical terminals; anda support contact connected to a housing, wherein (a) said first linear contact and said second linear contact each provide an electrical connection between corresponding sensor contacts and said corresponding electrical terminals, (b) said first linear contact, said second linear contact and said support contact are arranged to create a support plane for a sensor package, (c) said first linear contact and said second linear contact each provide support for said sensor package along a linear peak and (d) said apparatus enables a secure compression fit of said sensor package within said housing.2. The apparatus according to claim 1 , wherein said first linear contact and said second linear contact each have a domed shape and said linear peak of said first linear contact and said second linear contact is at an apex of said domed shape.3. The apparatus according to claim 1 , wherein said first linear contact claim 1 , said second linear contact and said support contact are configured to ensure a reliable electrical connection between said electrical ...

VEHICLE GUIDANCE SYSTEM AND METHOD THAT USES AIR DATA FROM SURFACE-MOUNTED PRESSURE SENSORS FOR VEHICLE ORIENTATION CONTROL

A vehicle guidance system, including: surface-mounted pressure sensors mounted on a vehicle; an air data estimation controller including: a preprocessor that sets initial values for angle of attack and sideslip angle, determines a converged value for the angle of attack using the initial values and values of one or more first sets of three sensors, each first set of sensors are located among three different planes that are parallel to the ground, and provides a converged sideslip angle value based on the converged value and values of one or more second sets of three sensors, each second set of sensors located among three different planes that are perpendicular to the ground; a processor that estimates air data based on the converged value for the angle of attack and the converged sideslip angle value; and processor that provides an output for adjusting orientation of a vehicle based on the air data. 1. A vehicle guidance system , comprising:at least four surface-mounted pressure sensors configured to be mounted on a vehicle, each sensor being configured to detect a surface pressure distribution for a location of each such sensor when placed on a vehicle; a preprocessor configured to set an initial value for angle of attack and set an initial value for sideslip angle, and determine a converged value for the angle of attack using the initial value for angle of attack, the initial value for sideslip angle, and surface pressure distribution values of one or more first sets of three surface-mounted pressure sensors, each first set of three-surface mounted pressure sensors are located among three different geometric planes that are parallel to the ground, the preprocessor being configured to provide a converged sideslip angle value based on the converged value for the angle of attack and surface pressure distribution values of one or more second sets of three surface-mounted pressure sensors, each second set of three-surface mounted pressure sensors are located among ...

Pressure Sensor

The present invention aims to provide a pressure sensor capable of improving waterproofness and airtightness by using a sealing adhesive without the use of an atmosphere-side O-ring or packing and improving workability by filling the sealing adhesive in one direction. In the pressure sensor, a protective cover is formed by any combination of a joint, a lower cover, a pressure detection unit, and a case portion. The protective cover includes a side wall forming an outer periphery and a bottom on the pressure chamber side of the side wall. An opening on a side of the protective cover opposite to the bottom is filled with the sealing adhesive to maintain waterproofness and airtightness of a signal transmission unit.

SENSOR DEVICE, IN PARTICULAR FOR USE IN A MOTOR VEHICLE

The invention relates to a sensor device (), in particular for use in a motor vehicle, comprising a housing () for receiving a sensor element (), wherein the sensor element () has contact surfaces ( to ) that are electrically conductively connected with electrical plug connections () arranged in the housing (), in the region of contacts ( to ), wherein the sensor element () is applied with force by a housing element (), in particular formed as a housing cover, in the direction of the contacts ( to ) for the purposes of electrical contacting, and wherein a support in the form of a 3-point contact is formed between the sensor element () and the housing (). According to the invention, the sensor element () has at least two measuring devices (), and the at least two measuring devices () have three contact surfaces ( to ) that form the 3-point contact. 1112123271124261132426111. A sensor device comprising a housing accommodating a sensor element () , wherein the sensor element () has contact areas ( to ) which are electrically conductively connected to electrical plug connections () , which are arranged in the housing () , in a region of abutment contacts ( to ) , wherein the sensor element () , in order to make electrical contact with the abutment contacts , is subjected by a housing element () to the action of force in the direction of the abutment contacts ( to ) , and wherein a support in the form of a 3-point abutment is formed between the sensor element () and the housing () ,characterized{'b': 1', '5', '6', '5', '6', '21', '23, 'in that the sensor element () has at least two measuring devices (, ), and in that the at least two measuring devices (, ) have three contact areas ( to ) which form the 3-point abutment.'}2. The sensor device as claimed in claim 1 ,characterized{'b': 24', '26', '21', '23', '24', '26', '21', '23, 'in that the abutment contacts ( to ) are of substantially point- or cup-like design, and in that the size of the contact areas ( to ) is in each ...

Pressure Sensors Having Low Cost, Small, Universal Packaging

Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support. 1. A pressure sensor package comprises:a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein:a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support;compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support;connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; anda pressure port is disposed in the pressure sensor support.2. The pressure sensor package of wherein a pressure vent is disposed in the compensation support.3. The pressure sensor package of wherein the pressure sensor support includes a cavity and the pressure sensor device is disposed in the cavity.4. The pressure sensor package of wherein the compensation support includes a cavity and at least a portion of the compensation circuitry is disposed in the cavity.5. The pressure sensor package of wherein the pressure sensor device comprises a MEMS sensor die.6. The pressure sensor package of wherein the compensation circuitry comprises an ASIC.7. The ...

High integrity process fluid pressure probe

A process fluid pressure measurement probe includes a pressure sensor formed of a single-crystal material and mounted to a first metallic process fluid barrier and disposed for direct contact with a process fluid. The pressure sensor has an electrical characteristic that varies with process fluid pressure. A feedthrough is formed of a single-crystal material and has a plurality of conductors extending from a first end to a second end. The feedthrough is mounted to a second metallic process fluid barrier and is spaced from, but electrically coupled to, the pressure sensor. The pressure sensor and the feedthrough are mounted such that the secondary metallic process fluid barrier is isolated from process fluid by the first metallic process fluid barrier.

SEMICONDUCTOR SENSOR ASSEMBLY FOR HARSH MEDIA APPLICATION

A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad. 1. A semiconductor sensor assembly for use in a corrosive environment , the sensor assembly comprising:a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in the corrosive environment;a sensor device comprising at least one second bondpad, the second bondpad consisting of and/or being covered by a first corrosion resistant material;at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the at least one second bondpad of the sensor device;wherein the processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, the sensor device being present in the cavity; andwherein a redistribution layer is provided to enable signal connection between the processing device and the sensor device to be physically made in the cavity while the second corrosion resistant material covers the at least one first bondpad.2 ...

SUBMERSIBLE TRANSDUCER CONFIGURED TO IMPEDE FLUID PENETRATION

Submersible transducer includes a transducer housing configured to be submerged within an aqueous liquid and a pressure sensor operable to obtain data for determining a pressure of the aqueous liquid. The pressure sensor may be disposed within the transducer housing. The submersible transducer also includes a submersible cable having an electrical conductor and a venting tube operably coupled to the pressure sensor. The pressure sensor uses an atmospheric pressure of an external environment that is detected through the venting tube to determine the pressure of the aqueous liquid. The submersible cable also includes a cable jacket and an inner layer that is surrounded by the cable jacket. The inner layer surrounds the electrical conductor and the venting tube. The inner layer includes a non-hygroscopic polymer that is more resistant to absorbing the aqueous liquid than the cable jacket. 1. A submersible transducer comprising:a transducer housing configured to be submerged within an aqueous liquid;a pressure sensor operable to obtain data for determining a pressure of the aqueous liquid; anda submersible cable having an electrical conductor and a venting tube operably coupled to the pressure sensor, the pressure sensor using an atmospheric pressure of an external environment that is detected through the venting tube to determine the pressure of the aqueous liquid, the submersible cable also including a cable jacket and an inner layer that is surrounded by the cable jacket, the inner layer surrounding the electrical conductor and the venting tube, wherein the inner layer comprises a non-hygroscopic polymer that is more resistant to absorbing the aqueous liquid than the cable jacket.2. The submersible transducer of claim 1 , wherein a water-absorption percentage of the non-hygroscopic polymer is at most 0.01% and a water-absorption percentage of the cable jacket is at least 0.1% claim 1 , the water-absorption percentages being determined in accordance with ASTM D570-98( ...

Snubber For Pressure Sensor And Pressure Sensor Comprising The Same

A pressure sensor comprises a sensor housing, a diaphragm provided in the sensor housing, and a snubber insertable into the sensor housing. The sensor housing includes a coupler coupling with a pressure measurement target and a housing passage passing through the coupler and guiding a fluid that flows into the sensor housing from the pressure measurement target. The diaphragm is deformable by a pressure of the fluid that flows into the sensor housing from the pressure measurement target. The snubber is inserted into the sensor housing through the housing passage and fastens to the sensor housing in a state in which at least a portion of the sensor housing forming the housing passage is deformed. The snubber guides flow of the fluid and transmits the pressure of the fluid to the diaphragm. 1. A pressure sensor comprising:a sensor housing including a coupler configured to couple with a pressure measurement target and a housing passage configured to pass through the coupler and to guide a fluid that flows into the sensor housing from the pressure measurement target;a diaphragm provided in the sensor housing and configured to be deformable by a pressure of the fluid that flows into the sensor housing from the pressure measurement target; anda snubber configured to be inserted into the sensor housing through the housing passage and to fasten to the sensor housing in a state in which at least a portion of the sensor housing forming the housing passage is deformed, the snubber guiding flow of the fluid and transmitting the pressure of the fluid to the diaphragm.2. The pressure sensor of claim 1 , wherein the housing passage has an outer passage formed to penetrate from a bottom surface of the coupler and an inner passage provided to be closer to the diaphragm than the outer passage and having a diameter less than a diameter of the outer passage.3. The pressure sensor of claim 2 , wherein a step is formed between the outer passage and the inner passage.4. The pressure ...

Pressure sensor module having a sensor chip and passive devices within a housing

A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

Pressure sensor module having a sensor chip and passive devices within a housing

A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

Overmolded lead frame assembly for pressure sensing applications

A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas.

ELECTROSTATIC DISCHARGE RESISTANT PRESSURE SENSOR

A pressure sensor includes a housing, a pressure chamber defined within the housing, and a pressure transducer. The pressure sensor also includes a header that seals the pressure chamber and supports the pressure transducer in the pressure chamber. A plurality of pins extend through respective openings in the header. The sensor pins have first ends electrically connected to the pressure transducer in the pressure chamber and second ends electrically connected to sensor electronics outside the pressure chamber. The pins are electrically insulated from the header. The header is configured so that the electrical insulation of at least one pin from the header is less than the electrical insulation of the remaining pins from the header.

Shield Structure for Pressure Sensor, and Pressure Sensor Provided with Same

In a pressure sensor, a cap-shaped shielding member () to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip () is supported by an end surface of a disk conductive plate () between one end surface of the sensor chip () in a liquid sealing chamber () and a diaphragm (). The conductive plate () is electrically connected via a group of input-output terminals () and bonding wires (Wi), for example, and the sensor chip is supported by one end portion of a chip mounting member () which is electrically connected via the group of input and output terminals () and the bonding wires (Wi). 1. A shield structure for a pressure sensor comprising:a sensor unit including a sensor chip for detecting a pressure and sending a detection output signal, a chip mounting member supporting the sensor chip, a diaphragm for partitioning a liquid sealing chamber which the sensor chip and the chip mounting member are placed into a pressure chamber facing the liquid sealing chamber, and a group of input-output terminals supported by a hermetic glass and electrically connected to the sensor chip; andan electric field blocking member placed between one end surface of the sensor chip in the liquid sealing chamber and the diaphragm by being supported from one end surface of a flat-shaped conductive plate having one end surface formed of a conductive layer which is opposed to the diaphragm and the other end surface formed of an insulating layer supported on the hermetic glass, the electric field blocking member electrically connected to the group of input-output terminals, and for blocking an electric field acting on a signal processing electronic circuit unit of the sensor chip.2. The shield structure for a pressure sensor according to claim 1 , wherein the conductive plate is placed on an end surface of the hermetic glass and is electrically connected to the group of input-output terminals.3. The shield structure for a pressure sensor according to ...

Differential pressure measuring transducer assembly

A differential pressure measuring transducer assembly including a measuring diaphragm formed of semiconductor material having gauge resistance elements on one surface thereof and a central boss area of large thickness and a peripheral support flange on the other surface thereof defining therebetween an annular portion of small thickness. The measuring diaphragm is attached at the peripheral support flange to a glass support member and a metallic support member formed with pressure conducting bores respectively communicating with each other. The metallic support member is formed of material having a Young's modulus substantially equal to that of the measuring diaphragm.

Stress sensitive semiconductor unit and housing means therefor

A stress sensitive semiconductor die and housing means therefore comprising a ceramic base member having a recessed portion and a shoulder portion around the periphery. A washer-like support member is positioned within the recess, one face of which is bonded to the base member, said support member having a central aperture. A stress sensitive semiconductor die is bonded to the other face of the support member with the center of the die being in substantial register with the aperture in the support member. Finally, cover means are attached to the shoulder portion.

Integral hermetic impantable pressure transducer

A hermetically sealed pressure transducer suitable for implantation in a human body. A pressure sensitive circuit is fabricated using contemporary silicon technology. The pressure sensitive circuit is sealed in an oil-filled chamber formed within a titanium cylinder having a glass substrate bottom and a thin titanium top. According to one embodiment, the pressure sensitive circuit contains a sealed inner chamber at a known pressure, thereby measuring pressure relative to a known value. A second embodiment vents the pressure sensitive circuit to produce a relative pressure measurement. A grill protects the assembly and aids insertion into the desired area. A lead connects the transducer to an implantable sensing circuit.

Disposable transducer apparatus for an electromanometry system

The disposable transducer includes a small housing constructed of lightweight plastic material. The housing is shaped so as to form a transparent chamber within which is situated a very small piezoresistive strain gauge in the form of a resistive bridge network diffused onto a semiconductor substrate. The semiconductor substrate is electrically isolated by means of a nonconductive gel which partially fills the transparent chamber in which the semiconductor substrate is positioned. The resistive bridge network of the semiconductor substrate is also electrically connected to a plurality of calibration resistors which are separately formed on the semiconductor substrate, making the entire apparatus economically disposable after a single use.

Pressure transducer

A pressure transducer which includes a novel apparatus and method for calibrating a pressure transducer to a monitor used in connection with an indwelling catheter to monitor a patient's blood pressure. The pressure transducer includes a transducer diaphragm disposed within a housing cavity. A manometer and a syringe are connected so as to be in communication with the transducer cavity. By partially withdrawing the plunger of the syringe, the pressure in the transducer cavity is reduced, thereby establishing a pressure drop equal to that measured by the manometer across the transducer diaphragm, thus facilitating calibration of the pressure measurement system. Inasmuch as the indwelling catheter is isolated from the pressure calibration apparatus, the methods and apparatus of the present invention avoid any risk of introducing air bubbles or microorganisms into the indwelling catheter.

Piezoresistive pressure measuring cell

A piezoresistive pressure measuring cell having a measuring membrane or diaphragm provided with resistance elements and with conductors extending from contact points on the resistance element to the measuring membrane, and wherein the connections between the pressure measuring cell and external components is accomplished through utilization of flexible circuitry.

Device for chronic measurement of internal body pressure

Measurement of a physiological pressure is accomplished by placement of a pressure transmitting catheter within a blood vessel or other structure within which pressure is to be measured. The catheter is blood-compatible, capable of withstanding handling during distribution and implantation, and provides adequate pressure transmission frequency response in a variety of applications. The catheter, which includes a hollow flexible tube filled with a low viscosity fluid and having a plug of a gel-like material at its distal end, transmits the pressure signal to a solid-state transducer which is typically connected to amplifying electronics and an implantable radio-transmitter capable of relaying the pressure information from within the body to a radio receiver located external to the body.

Catheter having pressure detecting ability

A catheter having a sensor for detecting forces acting on its distal end includes a catheter tube, a chamber defined in the catheter tube. The chamber is filled with silicon gel. The catheter also has a sensor chip and a cap. The sensor has a pressure sensing surface and a backside. The cap transmits the forces acting on the distal end of the catheter tube to the pressure sensing surface of the sensor chip. Further, the catheter has a pressure introducing hole. The pressure introducing hole transmits the forces acting on the periphery of the catheter tube to the backside of the sensor chip. The sensor chip issues signals externally in accordance with the pressures transmitted to its pressure sensing surface and its backside.

Catheter having a sensor

A catheter that is guided into an intra-corporeal passageway is set forth. A catheter tube accommodates an element having a piston for detecting a pressure in the intra-corporeal passageway. Silicone gel is accommodated in the catheter tube to transmit the detected pressure in the catheter tube. A strain gage is disposed on a semiconductor chip to output an electric signal based on an amount of a deformation thereof indicative of the pressure in the catheter tube.

压差测量变送器

本发明涉及一种压差测量变送器，其带有与其纵轴横向分开成两部分的内箱，在两个箱体之间固定了一个带有压力传感器的中隔膜，其中一个箱体在一个孔内装有一根电引线，该引线有外部接头位于孔的延伸处。考虑到电引线，为在制造本压差测量变送器简化电引线，孔31与测量变送器的纵轴32平行。孔31在其与另一箱体部件的相向端有一扩大部分33，在与另一箱体部件3的相对端变成一个通向外部的横孔44。

Patent US4610256B1

Device for chronic measurement of internal body pressure

ABSTRACT OF THE DISCLOSURE Measurement of a physiological pressure is accomplished by placement of a pressure transmitting catheter within a blood vessel or other structure within which pressure is to be measured The catheter is blood-compatible, capable of withstanding handling during distribution and implantation, and provides adequate pressure transmission frequency response in a variety of applications The catheter, which includes a hollow flexible tube filled with a low viscosity fluid and having a plug of a gel-like material at its distal end, transmits the pressure signal to a solid-state transducer which is typically connected to amplifying electronics and an implantable radio-transmitter capable of relaying the pressure information from within the body to a radio receiver located external to the body

A device for chronic measurement of internal body pressure

Measurement of a physiological pressure is accomplished by placement of a pressure transmitting catheter (20) within a blood vessel or other structure within which pressure is to be measured. The catheter (20) is blood-compatible, capable of withstanding handling during distribution and implantation, and provides adequate pressure transmission frequency response in a variety of applications. The catheter (20), which includes a hollow tube filled with a low viscosity fluid (29) and having a plug (30) of a gel-like material at its distal end (22), transmits the pressure signal to a solid-state transducer (16) which is typically connected to amplifying electronics and an implantable radio-transmitter (18) capable of relaying the pressure information from within the body to a radio receiver external to the body.

Patent JPS641733B2

Druckdifferenz-Meßumformer

Catheter with sensor function

Catheter with sensor function

Measuring device for medical applications with an intracorporeally usable sensor element and method for its production

A device for chronic measurement of internal body pressure

Measurement of a physiological pressure is accomplished by placement of a pressure transmitting catheter (20) within a blood vessel or other structure within which pressure is to be measured. The catheter (20) is blood-compatible, capable of withstanding handling during distribution and implantation, and provides adequate pressure transmission frequency response in a variety of applications. The catheter (20), which includes a hollow tube filled with a low viscosity fluid (29) and having a plug (30) of a gel-like material at its distal end (22), transmits the pressure signal to a solid-state transducer (16) which is typically connected to amplifying electronics and an implantable radio-transmitter (18) capable of relaying the pressure information from within the body to a radio receiver external to the body.

Pressure-measuring device for measuring the pressure of a fluid

The invention relates to a pressure-measuring device (10) for measuring the pressure of a fluid, the pressure-measuring device (10) having a pressure measurement sensor (20) and a pressure measurement element (30), the pressure measurement element (30) being filled with a liquid (50), in particular oil, the pressure measurement element (30) being in contact with the pressure measurement sensor (20) in such a way that pressure changes in the liquid (50) are transmitted to the pressure measurement sensor (20), characterized in that the pressure measurement element (30) has a flexible sheath (40), the pressure measurement element (30) being arranged on an inner body (60) in such a way that the pressure measurement element (30) extends at least partly, in particular substantially completely, around the inner body (60).

PRESSURE SENSOR APPARATUS

Provided is a pressure sensor apparatus, including: a pressure sensor unit; a case configured to house the pressure sensor unit; and a plurality of lead terminals configured to be exposed toward outside of of the case, wherein the plurality of lead terminals include a first terminal, a second terminal, and a ground terminal; and the ground terminal, the first terminal and the second terminal are arranged in an order of the ground terminal, the first terminal, and the second terminal outside the case. The pressure sensor apparatus includes a capacitor for a second terminal arranged across the ground terminal and the second terminal in between in interior of the case.

Pressure sensors and methods of manufacturing a pressure sensor

A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.